CN201568934U - Composite radiator structure of LED lamp - Google Patents
Composite radiator structure of LED lamp Download PDFInfo
- Publication number
- CN201568934U CN201568934U CN200920211108XU CN200920211108U CN201568934U CN 201568934 U CN201568934 U CN 201568934U CN 200920211108X U CN200920211108X U CN 200920211108XU CN 200920211108 U CN200920211108 U CN 200920211108U CN 201568934 U CN201568934 U CN 201568934U
- Authority
- CN
- China
- Prior art keywords
- led chip
- layer
- heat sink
- heat
- heating radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000002131 composite material Substances 0.000 title claims abstract description 28
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 238000005476 soldering Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000007743 anodising Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000009977 dual effect Effects 0.000 abstract 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000002674 ointment Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
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- Led Device Packages (AREA)
Abstract
The utility model provides a composite radiator structure of an LED lamp, which comprises a compound of an LED chip, a metal base PCB and a radiator, wherein the composite radiator has the dual functions of the metal base PCB and the radiator; the bottom part of the LED chip is provided with a positive electrode, a negative electrode and a heat sink; corresponding to the heat sink of the LED chip, a copper foil layer and an insulating heat conduction layer are provided with corresponding through holes, thereby being convenient for directly contacting the heat sink of the LED chip with an aluminum alloy radiating layer, reducing a radiating passageway of the heat sink, and improving the radiating efficiency; the back surface of the aluminum alloy layer is provided with a plurality of radiating profiled ribs; the surface of the aluminum alloy layer performs black positive electrode oxidation treatment to increase the radiating capability of the ribs; and the LED chip is fixed with the composite radiator by means of reflow soldering. The silkscreen of the copper foil layer at the surface of the composite radiator has no lead-tin ointment, the LED chip is pasted, and the pasted LED chip is transmitted to reflow soldering equipment to conduct soldering, so that the positive pole and the cathode of the LED chip are stably soldered with the copper foil layer, and the heat sink of the LED chip is directly and stably soldered with the aluminum alloy layer, therefore, the heat energy of the LED chip is directly transmitted to the aluminum alloy layer without passing though the insulating heat conduction layer.
Description
Technical field
The utility model relates to a kind of heat dissipation technology of LED light fixture, especially relates to a kind of composite heating radiator structure of high heat dispersion LED light fixture.
Background technology
The heat sink conception that the high-power LED lamp of present most of enterprises adopts usually is: at first the mode of led chip by Reflow Soldering is welded on the pcb board of aluminium base or copper base, apply one deck heat conductive silica gel then in the pcb board bottom surface, pcb board is bonded on the aluminium alloy lamp body (radiator) at last.The heat of led chip at first is delivered to pcb board (aluminium base or copper base), is delivered to radiator by heat conductive silica gel again, and radiator is delivered to heat in the light fixture ambient air at last.Heat conductive silica gel between pcb board (aluminium base or copper base) and the aluminium alloy radiator is the bottleneck of LED light fixture heat radiation process.The thermal conductivity factor of heat conductive silica gel is very low, cause the heat of led chip can not in time be transmitted on the aluminium section bar radiator, thereby cause the gathering of led chip heat, promptly impel the raising of led chip junction temperature, greatly reduce the output light flux and the working life of led chip, cause the very big wasting of resources.Traditional heat sink conception heat dissipation path is longer, and heat eliminating medium is more, and radiating effect is not good.Pcb board (aluminium base or copper base) separates with radiator, and assembling procedure is more, troublesome poeration, assembly cost height.
The utility model content
Technical problem to be solved in the utility model is, at above-mentioned deficiency of the prior art, provides a kind of LED lamp radiator structure of simple and reliable high heat dispersion.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of high heat dispersion LED light fixture composite heating radiator structure, comprise led chip, be used to the Metal Substrate pcb board of led chip and the complex of radiator are installed that it is characterized in that: described composite heating radiator has the dual-use function of Metal Substrate pcb board and radiator concurrently.
Described led chip bottom has positive and negative electrode and heat sink part, heat sinkly carries out thermoelectric separating treatment.
Described composite heating radiator structure comprises protective layer, copper foil layer, insulating heat-conductive layer and aluminium alloy layer.
The heat sink part of described copper foil layer, the corresponding led chip of insulating heat-conductive layer has corresponding via hole, directly contacts with the aluminium alloy heat dissipating layer to make things convenient for the heat sink of led chip, reduces heat sink heat dissipation channel, improves radiating efficiency.
The described aluminium alloy layer back side has the special-shaped fin of a plurality of heat radiations.Special-shaped fin comprises rectangle fin, triangular fin, trapezoidal fin and other special-shaped fins.The fin surface has the ripple tooth, to increase area of dissipation.
The black anodizing processing is carried out on the special-shaped fin of described aluminium alloy surface, to strengthen the fin thermal radiation capability.
Described led chip adopts Reflow Soldering or other welding methods to fixedly connected with composite heating radiator.The copper foil layer silk-screen lead-free tin cream on composite heating radiator surface, then led chip is carried out the paster operation, sending into Reflow Soldering equipment at last welds, the firm welding of the positive and negative electrode of led chip and copper foil layer like this, and the heat sink direct and firm welding of aluminium alloy layer of led chip, thereby the heat of led chip by the insulating heat-conductive layer, is not directly delivered to aluminium alloy layer.
The beneficial effects of the utility model are: high heat dispersion LED light fixture composite heating radiator structure of the present utility model, solve the bottleneck problem of LED light fixture heat dissipation channel effectively, greatly improve the heat-sinking capability of LED light fixture, thereby improved the light efficiency of LED, effectively guaranteed the service life of LED light fixture; Simplify the packaging technology of LED light fixture simultaneously, reduced the assembly cost of the whole light fixture of LED.
Description of drawings
Further specify the utility model below in conjunction with accompanying drawing and case study on implementation.
Fig. 1 general structure schematic diagram of the present utility model;
Fig. 2 detailed structure schematic diagram of the present utility model.
Number in the figure:
1, led chip 2, composite heating radiator 3, copper foil layer 4, tin cream (the heat sink usefulness of LED)
5, led chip positive pole 6, LED is heat sink 7, the led chip negative pole
8, tin cream (the LED electrode is used) 9, copper foil layer via hole 10, insulating heat-conductive layer via hole
11, protective layer 12, insulating heat-conductive layer 13, aluminium alloy layer 14, fin
The specific embodiment
Below by a case study on implementation, further specify the utility model.
As shown in Figure 1, the utility model comprises led chip 1, is used to install the composite heating radiator 2 of led chip.Double aluminum base PCB plate, thermal component and the lamp body supporting part done of composite heating radiator.
Described led chip bottom comprises positive pole 5, negative pole 7 and heat sink 6.This three part will be welded with the composite heating radiator upper surface.Heat sink 6 carry out electrical separation with anodal 5, negative pole 7, and heat sink 6 only have the function of heat radiation.
Described aluminium alloy layer 13 back sides have the special-shaped fin 14 of a plurality of heat radiations.Special-shaped fin 14 comprises rectangle fin, triangular fin, trapezoidal fin and other special-shaped fins.Along the flow direction of air, the fin surface has the ripple tooth, to increase area of dissipation.The black anodizing processing is carried out on the fin surface, to strengthen the fin thermal radiation capability.
Described led chip 1 adopts Reflow Soldering or other welding methods to fixedly connected with composite heating radiator 2.The copper foil layer 3 silk-screen tin creams 4 on composite heating radiator surface, tin cream 8, then led chip 1 is carried out the paster operation, sending into Reflow Soldering equipment at last welds, the positive pole 5 of led chip 1, electrode 7 and copper foil layer 3 firm welding like this, and heat sink 6 direct and aluminium alloy layer 13 firm welding of led chip 1, thereby the heat of led chip 1 by insulating heat-conductive layer 12, is not directly delivered to aluminium alloy layer 13.
Claims (4)
1. the composite heating radiator structure of a LED light fixture comprises the complex of led chip, Metal Substrate pcb board and radiator, and it is characterized in that: described composite heating radiator has the dual-use function of Metal Substrate pcb board and radiator concurrently; Described led chip bottom has positive and negative electrode and heat sink part, heat sinkly carries out thermoelectric separating treatment; Described composite heating radiator structure comprises protective layer, copper foil layer, insulating heat-conductive layer and aluminium alloy layer; Described led chip is fixedlyed connected with composite heating radiator.
2. composite heating radiator structure according to claim 1 is characterized in that: the heat sink part of described copper foil layer, the corresponding led chip of insulating heat-conductive layer has corresponding via hole, and the heat sink and aluminium alloy heat dissipating layer of led chip directly contacts.
3. composite heating radiator structure according to claim 1 is characterized in that: the described aluminium alloy layer back side has the special-shaped fin of a plurality of heat radiations, and described special-shaped fin surface has the ripple tooth, and its surface is carried out black anodizing and handled.
4. composite heating radiator structure according to claim 1, it is characterized in that: the copper foil layer silk-screen lead-free tin cream on described composite heating radiator surface, then led chip is carried out the paster operation, weld with Reflow Soldering equipment, the firm welding of the positive and negative electrode of led chip and copper foil layer, and the heat sink direct and firm welding of aluminium alloy layer of led chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920211108XU CN201568934U (en) | 2009-10-22 | 2009-10-22 | Composite radiator structure of LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920211108XU CN201568934U (en) | 2009-10-22 | 2009-10-22 | Composite radiator structure of LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201568934U true CN201568934U (en) | 2010-09-01 |
Family
ID=42661226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920211108XU Expired - Fee Related CN201568934U (en) | 2009-10-22 | 2009-10-22 | Composite radiator structure of LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201568934U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278660A (en) * | 2011-04-25 | 2011-12-14 | 缪仙荣 | Headlamp of range hood |
| CN102456814A (en) * | 2010-10-27 | 2012-05-16 | 上海卓凯电子科技有限公司 | System circuit carrying board for light-emitting diode module |
| CN102537728A (en) * | 2011-12-16 | 2012-07-04 | 广东朗视光电技术有限公司 | Light-emitting diode lamp with direct welding and fixed aluminum substrate |
| CN103137614A (en) * | 2011-11-22 | 2013-06-05 | 佳邦科技股份有限公司 | Optical assembly packaging structure for enhancing heat dissipation and manufacturing method thereof |
| CN105163485A (en) * | 2015-09-25 | 2015-12-16 | 湖南三一电控科技有限公司 | Heat conducting substrate for heating device and heating device and manufacturing method thereof |
| CN106686877A (en) * | 2015-11-09 | 2017-05-17 | 江苏嘉钰新能源技术有限公司 | High-thermal conduction circuit board assembly |
| CN108200719A (en) * | 2018-02-28 | 2018-06-22 | 浙江联宜电机有限公司 | Actuator power device heat dissipation structure |
| CN112178473A (en) * | 2020-10-30 | 2021-01-05 | 上海卡尔玛实业有限公司 | Novel heat dissipation method and device combining LED light source packaging and metal application |
| CN112367450A (en) * | 2020-11-09 | 2021-02-12 | 重庆市天实精工科技有限公司 | DMS camera |
-
2009
- 2009-10-22 CN CN200920211108XU patent/CN201568934U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456814A (en) * | 2010-10-27 | 2012-05-16 | 上海卓凯电子科技有限公司 | System circuit carrying board for light-emitting diode module |
| CN102278660A (en) * | 2011-04-25 | 2011-12-14 | 缪仙荣 | Headlamp of range hood |
| CN103137614A (en) * | 2011-11-22 | 2013-06-05 | 佳邦科技股份有限公司 | Optical assembly packaging structure for enhancing heat dissipation and manufacturing method thereof |
| CN102537728A (en) * | 2011-12-16 | 2012-07-04 | 广东朗视光电技术有限公司 | Light-emitting diode lamp with direct welding and fixed aluminum substrate |
| CN105163485A (en) * | 2015-09-25 | 2015-12-16 | 湖南三一电控科技有限公司 | Heat conducting substrate for heating device and heating device and manufacturing method thereof |
| CN106686877A (en) * | 2015-11-09 | 2017-05-17 | 江苏嘉钰新能源技术有限公司 | High-thermal conduction circuit board assembly |
| CN108200719A (en) * | 2018-02-28 | 2018-06-22 | 浙江联宜电机有限公司 | Actuator power device heat dissipation structure |
| CN112178473A (en) * | 2020-10-30 | 2021-01-05 | 上海卡尔玛实业有限公司 | Novel heat dissipation method and device combining LED light source packaging and metal application |
| CN112367450A (en) * | 2020-11-09 | 2021-02-12 | 重庆市天实精工科技有限公司 | DMS camera |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100901 Termination date: 20121022 |