CN102456814A - System circuit carrying board for light-emitting diode module - Google Patents
System circuit carrying board for light-emitting diode module Download PDFInfo
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- CN102456814A CN102456814A CN2010105254646A CN201010525464A CN102456814A CN 102456814 A CN102456814 A CN 102456814A CN 2010105254646 A CN2010105254646 A CN 2010105254646A CN 201010525464 A CN201010525464 A CN 201010525464A CN 102456814 A CN102456814 A CN 102456814A
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- Prior art keywords
- light
- support plate
- emitting diode
- heat conduction
- circuit system
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- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000003466 welding Methods 0.000 claims abstract description 21
- 230000000694 effects Effects 0.000 claims abstract description 5
- 230000005619 thermoelectricity Effects 0.000 claims abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 34
- 229910052718 tin Inorganic materials 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 25
- 238000009413 insulation Methods 0.000 claims description 19
- 239000006071 cream Substances 0.000 claims description 17
- 238000005516 engineering process Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 210000001364 upper extremity Anatomy 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 241000324343 Causa Species 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
A system circuit carrying board for a light-emitting diode module is disclosed, which comprises a substrate for the system circuit carrying board, as well as an electricity-conducting circuit, an electricity-conducting contact, a heat-conducting blind hole, a heat-conducting contact, an anti-welding layer and an electric insulating layer disposed on the substrate for the system circuit carrying board and used for disposing the light-emitting diode module on the substrate for the system circuit carrying board according to a corresponding position, wherein the substrate for the system circuit carrying board is corresponding to the position of the heat-conducting contact of the light-emitting diode module, and a hollow cylindrical hole is disposed between the upper edge of the electricity-conducting contact and the upper edge of the substrate for the system circuit carrying board to compose the heat-conducting blind hole, thereby coating a solder paste in the heat-conducting blind hole of the system circuit carrying board; the heat-conducting contact of the light-emitting diode module can be directly adhered with the substrate for the system circuit carrying board via the solder paste melted in the heat-conducting blind hole, thereby achieving an effect of direct heat conduction; additionally, the electricity-conducting contact of the corresponding light-emitting diode module is adhered via the solder paste melted on the electricity-conducting contact of the system circuit carrying board to separate electricity conduction from thermoelectricity.
Description
Technical field
The present invention relates to a kind of circuit system support plate of light-emitting diode (LED) module; Relate in particular to a kind of circuit system support plate with direct quick conductive characteristic; Make the hot-fluid in the light-emitting diode (LED) module directly get into circuit system support plate substrate through the heat conduction blind hole, reach the circuit system support plate of the direct quick conductive purpose of light-emitting diode (LED) module via the preferable scolding tin of heat conduction property.
Background technology
In the existing led lighting technology; Normal heat conduction contact with packaged light-emitting diode (LED) module; Be welded in one according on the corresponding heat conduction contact of system requirements designed system circuit support plate with surface mount technology (SMT), use on hot-fluid transporting to the circuit system support plate substrate in the light-emitting diode (LED) module.As shown in Figure 1; Generalized section for existing LED crystal particle (LED die) encapsulating structure; It comprises the solid brilliant material of LED crystal particle 11, light-emitting diode 12, light-emitting diodes pipe electrode 13, light-emitting diode lead 14, fluorescent material and sealing 15, non-conductive base plate for packaging 16 (like ceramic material), conductive junction point 17; And heat conduction contact (thermal pad) 18, constitute existing light-emitting diode (LED) module (LED chip).Fig. 2 is the another kind of existing embodiment of Fig. 1 (light-emitting diode (LED) module); Comprise the solid brilliant material of LED crystal particle 21, light-emitting diode 22, light-emitting diodes pipe electrode 23, light-emitting diode lead 24, fluorescent material and sealing 25, non-conductive base plate for packaging 26 (like pottery), lead frame conductive connecting pin 27, and heat conduction contact 28.
Fig. 3 is the profile of another kind of existing LED crystal particle encapsulating structure; Comprise the solid brilliant material of LED crystal particle 31, light-emitting diode 32, light-emitting diodes pipe electrode 33, light-emitting diode lead 34, fluorescent material and sealing 35, recessed glass 36 of conducting metal base material encapsulation, insulating barrier 37, conductive layer 38, conductive junction point 39, and heat conduction contact 310.
Fig. 4 A1-4A2 is the cell schematics and the existing embodiment of an existing light-emitting diode (LED) module circuit system support plate (system board); Wherein Fig. 4 A1 is the unit section sketch map of circuit system support plate; Comprise conducting wire 41, conductive junction point 42, heat conduction contact 43, electric insulation layer 44; Circuit system substrate 45, and welding resisting layer 46.Wherein the causa essendi of the conducting wire 41 of heat conduction contact 43 belows is to be convenient to heat conduction contact 43 spray tin manufacturing approaches capable of using implement, irrelevant conduction, and Fig. 4 A2 is the vertical view of Fig. 4 A1.
Fig. 4 B1-4B3 is the existing embodiment that sticks together between existing light-emitting diode (LED) module (Fig. 4 B1, Fig. 4 B2, Fig. 4 B3) and circuit system support plate with heat conduction.Existing technology is the heat conduction contact 18,28,310 with packaged light-emitting diode (LED) module; Utilize scolding tin 47 to be attached to one with surface mount technology (SMT), use the hot-fluid in the light-emitting diode (LED) module is derived via the heat conduction path of the heat conduction contact 18,28,310 of light-emitting diode (LED) module, scolding tin 47, circuit system support plate heat conduction contact 43, conducting wire 41, electric insulation layer 44 to circuit system support plate substrate 45 according on the corresponding heat conduction contact 43 of system requirements designed system circuit support plate.The heat conduction bottleneck of prior art is because employed insulating layer material 44 passes employed other material compared on the path with heat, has the lower shortcoming of heat conduction parameter.
Fig. 5 A-5B is a typical light-emitting diode (LED) module carries out the circuit system support plate of parallel connection and serial connection on the circuit system support plate embodiment; Wherein Fig. 5 A is a generalized section; Comprise conducting wire 51, conductive junction point 52, heat conduction contact 53, electric insulation layer 54; Circuit system substrate 55, and welding resisting layer 56.Fig. 5 B is the vertical view of Fig. 5 A.
Existing insulating layer material is compared owing to pass on the path employed other material with heat, has the lower shortcoming of heat conduction parameter, so that forms the heat conduction bottleneck that aforementioned hot passes the path.The applicant in view of this, after deliberation, the experiment, prior art is improved, so that light-emitting diode (LED) module is able to directly heat conduction fast.
Summary of the invention
Main purpose of the present invention; Promptly a kind of circuit system support plate of light-emitting diode (LED) module is being provided; Make the hot-fluid in the light-emitting diode (LED) module directly get into circuit system support plate substrate through the heat conduction blind hole, thereby reach the purpose of the direct quick conductive of light-emitting diode (LED) module via scolding tin.
The circuit system support plate of aforesaid light-emitting diode (LED) module comprises circuit system support plate substrate, is located at conducting wire, conductive junction point, heat conduction blind hole (thermal sinkblind via), heat conduction contact, welding resisting layer, the electric insulation layer of this circuit system support plate substrate; For the position of light-emitting diode (LED) module according to correspondence; Place on the circuit system support plate substrate, wherein, this circuit system support plate substrate is corresponding to the heat conduction connecting point position of light-emitting diode (LED) module; Between conductive junction point upper limb and circuit system support plate substrate upper limb; Be provided with the cavity of hollow out column,, thereby tin cream coated in the heat conduction blind hole of circuit system support plate with formation heat conduction blind hole; Tin cream through the fusing in the heat conduction blind hole; Directly the heat conduction contact of adhesive light-emitting diode module and circuit system support plate substrate, thus reach the effect of direct heat conduction, the tin cream through the fusing on the conductive junction point of circuit system support plate in addition; Stick together the conductive junction point of corresponding light-emitting diode (LED) module, so that conduction is separated with thermoelectricity.
The circuit system support plate of aforementioned light-emitting diode (LED) module, this circuit system support plate substrate wherein, refer to help the baseplate material that scolding tin can be adhered in heat conduction and surface, for example copper metal substrate and aluminum metal plating nickel on surface substrate etc.
Description of drawings
Fig. 1 is existing light-emitting diode (LED) module section of structure.
Fig. 2 is the existing illustration of implementing of the another kind of Fig. 1.
Fig. 3 is another kind of existing light-emitting diode (LED) module section of structure.
Fig. 4 A1 is existing light-emitting diode (LED) module circuit system support plate profile.
Fig. 4 A2 is the vertical view of Fig. 4 A1.
Fig. 4 B 1-4B3 is the embodiment of existing light-emitting diode (LED) module circuit system support plate.
Fig. 5 A carries out the embodiment profile of parallel connection and serial connection on the circuit system support plate for existing light-emitting diode (LED) module.
Fig. 5 B is the vertical view of Fig. 5 A.
Fig. 6 A is a profile of the present invention.
Fig. 6 B is a vertical view of the present invention.
Fig. 7 A1 is that illustration is implemented in making of the present invention.
Fig. 7 A2 is the vertical view of Fig. 7 A1.
Fig. 7 B1 is that illustration is implemented in making of the present invention.
Fig. 7 B2 is the vertical view of Fig. 7 B1.
Fig. 7 C1 is that illustration is implemented in making of the present invention.
Fig. 7 C2 is the vertical view of Fig. 7 C1.
Fig. 7 D1 is that illustration is implemented in making of the present invention.
Fig. 7 D2 is the vertical view of Fig. 7 D1.
Fig. 7 E1 is that illustration is implemented in making of the present invention.
Fig. 7 E2 is the vertical view of Fig. 7 E1.
Fig. 8 A, Fig. 8 B and Fig. 8 C are the enforcement illustration that circuit system support plate proposed by the invention utilizes surface mount technology adhesive light-emitting diode module.
[primary clustering symbol description]
The solid brilliant material of 11 LED crystal particles, 12 light-emitting diodes
13 light-emitting diodes pipe electrodes, 14 light-emitting diode leads
15 fluorescent material and sealing 16 non-conductive base plate for packaging
17 conductive junction points, 18 heat conduction contacts
The solid brilliant material of 21 LED crystal particles, 22 light-emitting diodes
23 light-emitting diodes pipe electrodes, 24 light-emitting diode leads
25 fluorescent material and sealing 26 non-conductive base plate for packaging
27 lead frame conductive connecting pins, 28 heat conduction contacts
The solid brilliant material of 31 LED crystal particles, 32 light-emitting diodes
33 light-emitting diodes pipe electrodes, 34 light-emitting diode leads
The recessed cup of 35 fluorescent material and the encapsulation of sealing 36 conducting metal base materials
37 insulating barriers, 38 conductive layers
39 conductive junction points, 310 heat conduction contacts
41 conducting wires, 42 conductive junction points
43 heat conduction contacts, 44 electric insulation layers
45 circuit system substrates, 46 welding resisting layers
47 scolding tin, 51 conducting wires
52 conductive junction points, 53 heat conduction contacts
54 electric insulation layers, 55 circuit system substrates
56 welding resisting layers, 61 conducting wires
62 conductive junction points, 63 heat conduction blind holes
64 heat conduction contacts, 65 welding resisting layers
66 electric insulation layers, 67 circuit system support plate substrates
71 conducting wire layers, 72 electric insulation layer
73 circuit system support plate substrates, 74 conducting wires
75 welding resisting layers, 76 conductive junction point positions
77 heat conduction connecting point positions, 78 secondary welding resisting layers
79 electric insulation layers, 710 electric insulation layers
711 heat conduction contacts, 712 conductive junction points
81 conductive junction points, 82 heat conduction contacts
83 conducting wires, 84 welding resisting layers
85 electric insulation layers, 86 circuit system support plate substrates
87 tin creams, 88 tin creams
89 light-emitting diode (LED) modules, 810 soldered joints
811 soldered joints
Embodiment
Please consult Fig. 6 A and Fig. 6 B simultaneously, be profile of the present invention and vertical view.In present embodiment, be the enforcement illustration of a unit, the present invention is also non-limiting to corresponding light-emitting diode (LED) module.The present invention mainly comprises conducting wire 61, conductive junction point 62, heat conduction blind hole 63, heat conduction contact 64, welding resisting layer 65, electric insulation layer 66, and circuit system support plate substrate 67.Wherein, this conducting wire 61, be by the line layer of spreading conductive materials (like shop copper) comprehensively according to the system requirements design circuit, carry out line layer wiring printing, etching forms.This conductive junction point 62 on conducting wire 61, is spread can conduct electricity and can eat tin material (like gold, silver, tin) corresponding to the conductive junction point position of light-emitting diode (LED) module and is formed conductive junction point 62, and conductive junction point 62 does not receive 65 coverings of welding resisting layer; This heat conduction blind hole 63 is a hollow out column cavity; This heat conduction contact 64, corresponding to the heat conduction connecting point position of light-emitting diode (LED) module, it can eat tin material (like gold, silver, tin) formation heat conduction contact 64 between heat conduction blind hole 63 lower edges and circuit system support plate substrate 67 upper limbs, spreading; This welding resisting layer 65 is for being covered in non-conductive in the circuit system support plate the superiors (conductive junction point 62, heat conduction blind hole 63 is except heat conduction contact 64) and can not eating the tin material; This electric insulation layer 66 between conducting wire 61 and circuit system support plate substrate 67, intercepts the electrically conducting of conducting wire 61 and circuit system support plate substrate 67; This circuit system support plate substrate 67, in present embodiment, for helping heat conduction and surface adhering to the baseplate material of scolding tin (eating tin), for example copper metal substrate and aluminum metal plating nickel on surface substrate etc.
Through aforesaid member, in assembling during light-emitting diode (LED) module, tin cream is coated in the heat conduction blind hole 63 of circuit system support plate proposed by the invention with conductive junction point 62 on after, light-emitting diode (LED) module is placed on the circuit system support plate proposed by the invention.The putting position of this light-emitting diode (LED) module is changed to its conductive junction point and heat conduction contact directly over the conductive junction point 62 of circuit system support plate and heat conduction contact 64.Through the tin cream of the melted by heat in the heat conduction blind hole 63, directly the heat conduction contact of adhesive light-emitting diode module and circuit system support plate substrate 67, thus reach the effect of direct heat conduction.In addition, through the tin cream of the fusing on the conductive junction point 62 of circuit system support plate, can the adhesive light-emitting diode module corresponding conductive junction point, reach the effect that conduction is separated with thermoelectricity.
Please consult Fig. 7 A1-7A2, Fig. 7 B1-7B2, Fig. 7 C1-7C2, Fig. 7 D1-7D2 and Fig. 7 E1-7E2 simultaneously, for illustration is implemented in making of the present invention.Manufacture method of the present invention is in regular turn:
1, pressing conducting wire layer 71 (comprehensively spreading copper), electric insulation layer 72 and circuit system support plate substrate 73 (shown in Fig. 7 A1-7A2).
2, according to circuit system electrical demands design system wiring, and according to this conducting wire layer 71 is carried out etching, layer 71 stays conducting wire 74 in the conducting wire.The heat conduction connecting point position of respective leds module zone does not stay corresponding line layer (shown in Fig. 7 B1-7B2) on the conducting wire layer 71.
3, welding resisting layer 75 is carried out on layer 71 upper strata in conducting wire and make, welding resisting layer 75 not masked areas is the conductive junction point band of position 76 of respective leds module and the heat conduction connecting point position zone 77 of respective leds module.Welding resisting layer 75 is made and can be made secondary generation welding resisting layer 78 to the specific region, to strengthen the consistency (shown in Fig. 7 C1-7C2) of welding resisting layer 75 height.
4, utilize the drilling blind hole technology to remove the electric insulation layer in the heat conduction connecting point position zone 79 of respective leds module.The electric insulation layer 710 that retains still makes conducting wire 74 and circuit support plate substrate 73 keep insulation to isolate (shown in Fig. 7 D1-7D2).
5, the tin manufacturing approach is sprayed on welding resisting layer 75 upper stratas, to form heat conduction contact 711 and conductive junction point 712 (shown in Fig. 7 E1-7E2).
Please consult Fig. 8 A, Fig. 8 B and Fig. 8 C simultaneously; For utilizing the reflow manufacturing approach in the surface mount technology, existing light-emitting diode (LED) module with the encapsulation of surface sticking assembly (SMD) pattern is attached to the enforcement illustration of circuit system support plate proposed by the invention with the soldering mode.Shown in Fig. 8 A, circuit system support plate proposed by the invention comprises conductive junction point 81, heat conduction contact 82, conducting wire 83, welding resisting layer 84, electric insulation layer 85 and circuit system support plate substrate 86.The program of this embodiment is:
1, tin cream 87 is coated in the heat conduction blind hole of heat conduction contact of the present invention 82 tops (heat conduction contact 82 tops), and tin cream 88 coated on the conductive junction point 81 of circuit system support plate of the present invention (shown in Fig. 8 A).
2, with the position of light-emitting diode (LED) module 89 according to correspondence; Place (shown in Fig. 8 B) (light-emitting diode (LED) module 89 that the embodiment of the invention is alleged on the circuit system support plate that is coated with tin cream 87 and tin cream 88; Do not limit any LED package mode, refer to that specially wherein heat conduction contact and circuit system support plate are the light-emitting diode (LED) modules 89 that utilizes surface mount technology (SMT) structure to connect).
3, with reflow manufacturing approach fusing tin cream 87 and tin cream 88; Use the conductive junction point of soldered joint 810 adhesive light-emitting diode modules 89 and the conductive junction point 81 of circuit system support plate of the present invention, and utilize the heat conduction contact of soldered joint 811 adhesive light-emitting diode modules 89 and the heat conduction contact 82 of circuit system support plate of the present invention.
Previous embodiment be merely explanation preferred implementation of the present invention, and unrestricted scope of the present invention is all via modifying slightly, changing, and does not still deviate from spirit of the present invention, does not also take off the scope that claims of the present invention are protected.
In sum; The present invention is to be provided with the circuit system support plate of heat conduction blind hole; Make the hot-fluid in the light-emitting diode (LED) module directly get into circuit system support plate substrate, thereby reach the purpose of the direct quick conductive of light-emitting diode (LED) module via the preferable scolding tin of heat conduction property.
Claims (3)
1. the circuit system support plate of a light-emitting diode (LED) module; Comprise circuit system support plate substrate; Be located at conducting wire, conductive junction point, heat conduction blind hole, heat conduction contact, welding resisting layer, the electric insulation layer of this circuit system support plate substrate;, place on the circuit system support plate substrate according to corresponding position for light-emitting diode (LED) module, it is characterized in that:
This circuit system support plate substrate between conductive junction point upper limb and circuit system support plate substrate upper limb, is provided with the cavity of hollow out column corresponding to the heat conduction connecting point position of light-emitting diode (LED) module; To constitute the heat conduction blind hole; Thereby tin cream is coated in the heat conduction blind hole of circuit system support plate, through the tin cream of the fusing in the heat conduction blind hole, directly the heat conduction contact of adhesive light-emitting diode module and circuit system support plate substrate; Thereby reach the effect of direct heat conduction; Through the tin cream of the fusing on the conductive junction point of circuit system support plate, stick together the conductive junction point of corresponding light-emitting diode (LED) module in addition, so that conduction is separated with thermoelectricity.
2. the circuit system support plate of light-emitting diode (LED) module according to claim 1; It is characterized in that; This circuit system support plate substrate, for helping heat conduction and the baseplate material of scolding tin can be adhered in the surface, for copper metal substrate and aluminum metal plating nickel on surface substrate one of them.
3. the circuit system support plate of light-emitting diode (LED) module according to claim 1; It is characterized in that; This heat conduction blind hole is utilized all materials between the corresponding thermal conductivity region of heat conduction connecting point position institute of light-emitting diode (LED) module on the drilling blind hole technology removal system circuit support plate substrate, with the space of formation hollow out column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105254646A CN102456814A (en) | 2010-10-27 | 2010-10-27 | System circuit carrying board for light-emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105254646A CN102456814A (en) | 2010-10-27 | 2010-10-27 | System circuit carrying board for light-emitting diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102456814A true CN102456814A (en) | 2012-05-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105254646A Pending CN102456814A (en) | 2010-10-27 | 2010-10-27 | System circuit carrying board for light-emitting diode module |
Country Status (1)
| Country | Link |
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| CN (1) | CN102456814A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat-conducting LED substrate and its processing technology |
| CN113394323A (en) * | 2021-05-25 | 2021-09-14 | 江西展耀微电子有限公司 | Display module and manufacturing method thereof |
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| CN1616172A (en) * | 2003-11-14 | 2005-05-18 | 华通电脑股份有限公司 | Method for making blind holes in multilayer substrate and automatic drilling machine for implementing the method |
| CN101118944A (en) * | 2007-01-30 | 2008-02-06 | 矽畿科技股份有限公司 | Optical diode package structure |
| CN201568934U (en) * | 2009-10-22 | 2010-09-01 | 上海彩煌光电科技有限公司 | Composite radiator structure of LED lamp |
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2010
- 2010-10-27 CN CN2010105254646A patent/CN102456814A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1616172A (en) * | 2003-11-14 | 2005-05-18 | 华通电脑股份有限公司 | Method for making blind holes in multilayer substrate and automatic drilling machine for implementing the method |
| CN101118944A (en) * | 2007-01-30 | 2008-02-06 | 矽畿科技股份有限公司 | Optical diode package structure |
| CN201568934U (en) * | 2009-10-22 | 2010-09-01 | 上海彩煌光电科技有限公司 | Composite radiator structure of LED lamp |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat-conducting LED substrate and its processing technology |
| CN102983249B (en) * | 2012-11-27 | 2015-10-21 | 东莞勤上光电股份有限公司 | Improved heat-conducting LED substrate and processing technology thereof |
| CN113394323A (en) * | 2021-05-25 | 2021-09-14 | 江西展耀微电子有限公司 | Display module and manufacturing method thereof |
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Application publication date: 20120516 |