CN104501013A - Led lamp - Google Patents
Led lamp Download PDFInfo
- Publication number
- CN104501013A CN104501013A CN201410816533.7A CN201410816533A CN104501013A CN 104501013 A CN104501013 A CN 104501013A CN 201410816533 A CN201410816533 A CN 201410816533A CN 104501013 A CN104501013 A CN 104501013A
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- CN
- China
- Prior art keywords
- heat
- pad
- led chip
- conducting substrate
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED lamp which comprises an LED chip, a heat-conduction substrate and a heat sink, wherein the LED chip comprises a plurality of lamp beads and is mounted on the heat-conduction substrate, the heat-conduction substrate is connected with a first surface of the heat sink, radiating fins are arranged on a second surface of the heat sink, and the heat-conduction substrate adopts a ceramic substrate (made from a material, such as aluminum nitride and aluminum oxide). When the LED lamp works, heat generated by the LED chip is firstly transmitted to the heat-conduction substrate and then is transmitted to the heat sink from the heat-conduction substrate, and the heat sink transmits the heat to air by virtue of the radiating fins, so that the heat can be quickly dissipated, and a problem of heat dissipation of the LED lamp is solved. The LED clamp has the benefits that the heat-conduction substrate adopts a ceramic substrate (made from the material, such as the aluminum nitride and the aluminum oxide), and the ceramic substrate (made from the material, such as the aluminum nitride and the aluminum oxide) self is insulated and does not conduct electricity, so that a short circuit situation does not occur when the LED chip is mounted on the heat-conduction substrate; besides, a heat conductivity coefficient of the aluminum nitride can reach 200 W/(m.K), so that a bottleneck problem of heat conduction of a high-power LED lamp can be effectively solved.
Description
Technical field
The present invention relates to a kind of lighting device, particularly relate to a kind of LED lamp.
Background technology
Current, in order to advocate energy-saving and emission-reduction, a lot of local light ons, uses LED illumination, can reduce energy resource consumption greatly.Such as, in the middle of the headlight of automobile, just start extensively to promote the use of LED.Under normal circumstances, the service life of common LED can reach 100,000 hours, but in extreme circumstances, such as, when LED chip junction temperature reaches 95 DEG C, its service life drops to 30,000 hours exactly, when junction temperature reaches 105 DEG C time, then can be reduced to its service life and only have 10,000 hours.
If so can not solve LED lamp, the especially heat dissipation problem of high-power LED lamp, will badly influence the life-span of LED lamp.
The installation of high-power LED lamp usually all can be used glue (or elargol) and be fixed LED chip; And LED-baseplate to be connected with radiator (or metallic heat radiating plate) be also generally the mode adopting glue (or elargol) fixing, but the thermal conductivity factor of glue (or elargol) generally only has 5-6W/ (m.K), the highest also with regard to 15W/ (m.K) left and right, above two factors define a heat conducting bottleneck, the serious heat dispersion that have impact on LED lamp.
Summary of the invention
It is one or more that the present invention solves the problem, and provides the LED lamp that a kind of heat dispersion is good.
According to an aspect of the present invention, provide a kind of LED lamp, comprise LED chip, heat-conducting substrate and radiator, LED chip comprises many lamp pearls, LED chip is arranged on heat-conducting substrate, heat-conducting substrate is connected on the first surface of radiator, and second of radiator is provided with radiating fin, and the material of heat-conducting substrate is ceramic substrate (such as the material such as aluminium oxide and aluminium nitride).
When light fixture works, first the heat that LED chip produces can be delivered on heat-conducting substrate, and then be delivered on radiator from heat-conducting substrate, heat is delivered in the middle of air by radiating fin by radiator by heat again, thus heat can be distributed fast, solve the heat dissipation problem of LED.
Its beneficial effect is, heat-conducting substrate of the present invention adopts ceramic substrate.Wherein the material of ceramic substrate can be the material such as aluminium oxide or aluminium nitride, because ceramic substrate itself is that insulation is non-conductive, so LED chip is arranged on the phenomenon that heat-conducting substrate can not be short-circuited, the thermal conductivity factor of aluminium nitride can reach 200W/ (m.K) simultaneously.So the present invention effectively can solve the heat conducting bottleneck problem in the middle of high-power LED lamp.
In some embodiments, the material of radiator is any one in gold, silver, copper, alloyed copper, aluminium, aluminium alloy, pottery (material such as aluminium oxide and aluminium nitride).Its beneficial effect is, adopts the radiator of above-mentioned material all can realize good radiating effect.Certainly, except above-mentioned metal, the good metal material of other thermal conductivity factor or alloy material can also be adopted.
In some embodiments, the bottom surface of LED chip comprises the first pad and the second pad, it is the first insulation cut section between first pad and the second pad, heat-conducting substrate comprises the 3rd pad and the 4th pad, it is the second insulation cut section between 3rd pad and the 4th pad, first pad and the 3rd pad link together, and the second pad and the 4th pad link together.Its beneficial effect is, by first insulation cut section can be good the first pad and the second pad are separated, prevent the problem of short circuit, equally, second insulation cut section also can prevent the 3rd pad and the 4th pad from linking together, and prevents the problem of short circuit.Can good for LED chip be fixed on heat-conducting substrate by solder technology, realize high-power LED light fixture.Simultaneously the first pad and the 3rd pad and the connected mode between the second pad and the 4th pad preferentially adopt eutectic solder technology, without any interval or further feature between LED chip and heat-conducting substrate, the two is directly connected, because do not have other material to intercept, the mode fastened with glue is adopted relative to traditional, the mode good heat conduction effect of eutectic welding, heat distributes comparatively fast.Above-mentioned all pads all adopt ceramic metalizing process to generate.
In some embodiments, the area sum of the first pad and the second pad trends towards the base area of LED chip, and the area of the 3rd pad and the area of the first pad match, and the area of the 4th pad and the area of the second pad match.Its beneficial effect is, when the first pad and the second pad area and be equivalent to whole LED chip base area, namely whole LED chip is all connected with heat-conducting substrate, and the contact area of such LED chip and heat-conducting substrate is just very large, thus can ensure radiating effect.Usually, the first pad is the negative pole of LED chip, and the second pad is the positive pole of LED chip, and the area of usual negative pole is greater than the area of positive pole.
In some embodiments, heat-conducting substrate is provided with multiple LED chip altogether, heat-conducting substrate is generated by ceramic metalizing process metal contact wires, is coupled together between adjacent LED chip by metal contact wires.Its beneficial effect is, by arranging multiple LED chip, and the metal contact wires adopting ceramic metalizing process to generate connects, and can realize the object of high-power LED lighting fixture.
Certainly, except above-mentioned upside-down mounting, eutectic solder technology, the COB solder technology of other routine is also feasible, as thermocompression bonding, ultrasonic bond, spun gold weldering etc.
In some embodiments, the bottom surface sintering of heat-conducting substrate has the first metal layer, and the upper surface sintering of radiator has the second metal level.Its beneficial effect is, by arranging the first metal layer and the second metal level respectively, thus can facilitate the connection of heat-conducting substrate and radiator.
Certainly, if radiator inherently can weld metal material, then can without the need to arranging the second metal level.
In some embodiments, link together between the first metal layer and the second metal level, the mode of connection can be linked together by various metal solder mode, can directly weld also can adopt solder(ing) paste or solder stick etc. other can weld by welding material.Its beneficial effect is, relative to common glue, can realize better heat-conducting effect by metal solder, thermal conductivity factor is better.
In some embodiments, greatly can be improved by the various metal solder mode thermal conductivity factor that links together between the first metal layer and the second metal level, thus good radiating effect can be realized.
In some embodiments, the radiating fin on second of radiator for be provided with multi-disc altogether, multi-disc radiating fin parallel arrangement.Its beneficial effect is, arranges the radiating fin of multi-disc parallel arrangement, can increase the contact area of radiator and air on the one hand, thus improves radiating efficiency, and on the other hand, the radiating fin be arranged in parallel is more conducive to the flowing of air, thus more convenient heat radiation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED lamp of an embodiment of the present invention;
Fig. 2 is the explosive view of LED lamp shown in Fig. 1.
Detailed description of the invention
Below in conjunction with accompanying drawing 1 and Fig. 2 and detailed description of the invention, LED lamp of the present invention is described further.
As depicted in figs. 1 and 2, disclose a kind of LED lamp, comprise LED chip 1, heat-conducting substrate 2 and radiator 3, LED chip 1 comprises many lamp pearls, LED chip 1 is arranged on heat-conducting substrate 2, heat-conducting substrate 2 is connected on the first surface 31 of radiator 3, and the second face 32 of radiator 3 is provided with radiating fin 33, and the material of heat-conducting substrate 2 is ceramic substrate (material such as aluminium oxide and aluminium nitride).
In the middle of the process used, first the heat that LED chip 1 produces can be delivered on heat-conducting substrate 2, and then be delivered on radiator 3 from heat-conducting substrate 2, heat is delivered in the middle of air by radiating fin 33 by radiator 3 by heat again, thus heat can be distributed fast, solve the heat dissipation problem of LED.
Advantage of the present invention is: heat-conducting substrate 2 adopts ceramic substrate (material such as aluminium oxide and aluminium nitride), pottery (material such as aluminium oxide and aluminium nitride) itself is that insulation is non-conductive, so LED chip 1 is arranged on the phenomenon that heat-conducting substrate 2 can not be short-circuited, radiator 3 material is gold simultaneously, silver, copper, alloyed copper, aluminium, aluminium alloy, pottery (material such as aluminium oxide and aluminium nitride), other metals, various alloy, in these materials, thermal conductivity factor reaches as high as 400W/ (m.K), so the present invention effectively can solve the heat conducting bottleneck problem in the middle of high-power LED lamp.
Wherein, the material of radiator 3 be gold, silver, copper, alloyed copper, aluminium, aluminium alloy, pottery (material such as aluminium oxide and aluminium nitride) any one.Because adopt the radiator 3 of above-mentioned material all can realize good radiating effect.Certainly, except above-mentioned metal, the good metal material of other thermal conductivity factor or alloy material can also be adopted.
In order to realize the connection of LED chip 1 and heat-radiating substrate, the first pad 11 and the second pad 12 is comprised in the bottom surface of LED chip 1, the first insulation cut section 13 is provided with between first pad 11 and the second pad 12, heat-conducting substrate 2 comprises the 3rd pad 21 and the 4th pad 22, the second insulation cut section 24 is provided with between 3rd pad 21 and the 4th pad 22, first pad 11 and the 3rd pad 21 are linked together by eutectic welding manner, and the second pad 12 and the 4th pad 22 are linked together by eutectic welding manner.By first insulation cut section 13 can be good the first pad 11 and the second pad 12 are separated, prevent the problem of short circuit, equally, the second cut section also can prevent the 3rd pad 21 and the 4th pad 22 from linking together, and prevents the problem of short circuit.Good for LED chip 1 is fixed on heat-conducting substrate 2 preferably by eutectic solder technology by the present invention, realizes high-power LED light fixture.Adopt eutectic solder technology, without any interval or further feature between LED chip 1 and heat-conducting substrate 2, the two is directly connected simultaneously, because do not have other material to intercept, adopt relative to traditional the mode fastened with glue, the mode good heat conduction effect of eutectic welding, heat distributes comparatively fast.Certainly, except eutectic solder technology, other conventional soldering techniques is also feasible.
Usually, in order to ensure radiating effect, the area sum of the first pad 11 and the second pad 12 trends towards the base area of LED chip 1, and the area of the 3rd pad 21 and the area of the first pad 11 match, and the area of the 4th pad 22 and the area of the second pad 12 match.Its beneficial effect is, when the first pad 11 and the second pad 12 area and be equivalent to whole LED chip 1 base area, namely whole LED chip 1 is all connected with heat-conducting substrate 2, and such LED chip 1 is just very large with the contact area of heat-conducting substrate 2, thus can ensure radiating effect.
Usually, the first pad 11 is the negative pole of LED chip, and the second pad 12 is the positive pole of LED chip, and the area of usual negative pole is greater than the area of positive pole.Above-mentioned all pads all adopt ceramic metalizing process to generate.Certain LED chip of the present invention also can directly adopt glue to be bonded on heat-conducting substrate 2.
A slice heat-conducting substrate 2 can be provided with multiple LED chip 1 altogether, heat-conducting substrate 2 generates metal contact wires 4 by ceramic metalizing process, is coupled together by metal contact wires 4 between adjacent LED chip 1.By arranging multiple LED chip 1, and adopting the metal contact wires 4 generated by ceramic metalizing process to connect, the object of high-power LED lighting fixture can be realized.
Certainly, except above-mentioned upside-down mounting, eutectic solder technology, the COB solder technology of other routine is also feasible, as thermocompression bonding, ultrasonic bond, spun gold weldering etc.
In order to realize the connection of heat-conducting substrate 2 and radiator 3, generating have the first metal layer 23 at the underrun ceramic metalizing process of heat-conducting substrate 2, the upper surface of radiator 3 is generated by ceramic metalizing process the second metal level 34.By arranging the first metal layer 23 and the second metal level 34 respectively, thus the connection of heat-conducting substrate 2 and radiator 3 can be facilitated.
Certainly, if radiator inherently can weld metal material, then can without the need to arranging the second metal level.
Welded together by various metal solder mode between the first metal layer 23 and the second metal level 34, directly can weld and also can adopt solder(ing) paste or solder stick etc. other can weld by welding material.Its beneficial effect is, relative to common glue, can realize better heat-conducting effect by metal solder, thermal conductivity factor is better.
Wherein, if adopt solder stick or solder(ing) paste to weld.Because the thermal conductivity factor of solder stick or solder(ing) paste can reach about 60W/m.K, thus realize good radiating effect easily
Radiating fin 33 on second face 32 of the radiator 3 in the present embodiment for be provided with multi-disc altogether, multi-disc radiating fin 33 parallel arrangement.Arrange the radiating fin 33 of multi-disc parallel arrangement, can increase the contact area of radiator 3 and air on the one hand, thus improve radiating efficiency, on the other hand, the radiating fin 33 be arranged in parallel is more conducive to the flowing of air, thus more convenient heat radiation.
Above is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (8)
1.LED light fixture, it is characterized in that, comprise LED chip (1), heat-conducting substrate (2) and radiator (3), described LED chip (1) comprises many lamp pearls, described LED chip (1) is arranged on described heat-conducting substrate (2), described heat-conducting substrate (2) is connected on the first surface (31) of described radiator (3), second (32) of described radiator (3) are provided with radiating fin (33), and described heat-conducting substrate (2) is ceramic substrate.
2. LED lamp according to claim 1, is characterized in that, the material of described radiator (3) is any one in gold, silver, copper, copper alloy, aluminium, aluminium alloy, pottery.
3. LED lamp according to claim 1, it is characterized in that, the bottom surface of described LED chip (1) comprises the first pad (11) and the second pad (12), it is the first insulation cut section (13) between described first pad (11) and the second pad (12), described heat-conducting substrate (2) comprises the 3rd pad (21) and the 4th pad (22), be the second insulation cut section (24) between described 3rd pad (21) and the 4th pad (22), described first pad (11) and described 3rd pad (21) link together, described second pad (12) and described 4th pad (22) link together.
4. LED lamp according to claim 3, it is characterized in that, the area sum of described first pad (11) and described second pad (12) trends towards described LED chip (1) base area, the described area of the 3rd pad (21) and the area of described first pad (11) match, and the described area of the 4th pad (22) and the area of described second pad (12) match.
5. LED lamp according to claim 1, it is characterized in that, described heat-conducting substrate (2) is provided with altogether multiple LED chip (1), described heat-conducting substrate (2) is generated by ceramic metalizing process and has metal contact wires (4), coupled together by metal contact wires (4) between adjacent LED chip (1).
6. LED lamp according to claim 1, it is characterized in that, the underrun ceramic metalizing process of described heat-conducting substrate (2) generates the first metal layer (23), and the upper surface of described radiator (3) is generated by ceramic metalizing process the second metal level (34).
7. LED lamp according to claim 6, is characterized in that, described the first metal layer (23) and the second metal level (34) link together.
8. LED lamp according to any one of claim 1 to 7, it is characterized in that, radiating fin (33) on second (32) of described radiator (3) for be provided with multi-disc altogether, radiating fin described in multi-disc (33) parallel arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410816533.7A CN104501013A (en) | 2014-12-24 | 2014-12-24 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410816533.7A CN104501013A (en) | 2014-12-24 | 2014-12-24 | Led lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104501013A true CN104501013A (en) | 2015-04-08 |
Family
ID=52942445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410816533.7A Pending CN104501013A (en) | 2014-12-24 | 2014-12-24 | Led lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104501013A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017188237A1 (en) * | 2016-04-28 | 2017-11-02 | 株式会社光波 | Led light source device |
| CN108140706A (en) * | 2015-09-25 | 2018-06-08 | 三菱综合材料株式会社 | The manufacturing method of light emitting module with refrigerator and the light emitting module with refrigerator |
| CN112420636A (en) * | 2020-11-19 | 2021-02-26 | 四川长虹空调有限公司 | Chip heat radiation structure |
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| CN201141553Y (en) * | 2007-12-25 | 2008-10-29 | 珠海市寰宇之光能源科技有限公司 | LED lamp with reflecting film |
| CN101994929A (en) * | 2009-08-20 | 2011-03-30 | 启耀光电股份有限公司 | Light emitting module |
| CN201797655U (en) * | 2010-08-24 | 2011-04-13 | 张�林 | Double-side circuit board made of parallel flat leads |
| US20110291151A1 (en) * | 2010-05-26 | 2011-12-01 | Toshiba Lighting & Technology Corporation | Light emitting device and lighting apparatus |
| CN102479910A (en) * | 2010-11-26 | 2012-05-30 | 株式会社东芝 | Led module |
| US20140153238A1 (en) * | 2012-12-04 | 2014-06-05 | Toshiba Lighting & Technology Corporation | Light Emitting Device and Luminaire |
| CN204300770U (en) * | 2014-12-24 | 2015-04-29 | 付斌 | Led lamp |
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2014
- 2014-12-24 CN CN201410816533.7A patent/CN104501013A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201141553Y (en) * | 2007-12-25 | 2008-10-29 | 珠海市寰宇之光能源科技有限公司 | LED lamp with reflecting film |
| CN101994929A (en) * | 2009-08-20 | 2011-03-30 | 启耀光电股份有限公司 | Light emitting module |
| US20110291151A1 (en) * | 2010-05-26 | 2011-12-01 | Toshiba Lighting & Technology Corporation | Light emitting device and lighting apparatus |
| CN201797655U (en) * | 2010-08-24 | 2011-04-13 | 张�林 | Double-side circuit board made of parallel flat leads |
| CN102479910A (en) * | 2010-11-26 | 2012-05-30 | 株式会社东芝 | Led module |
| US20140153238A1 (en) * | 2012-12-04 | 2014-06-05 | Toshiba Lighting & Technology Corporation | Light Emitting Device and Luminaire |
| CN204300770U (en) * | 2014-12-24 | 2015-04-29 | 付斌 | Led lamp |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108140706A (en) * | 2015-09-25 | 2018-06-08 | 三菱综合材料株式会社 | The manufacturing method of light emitting module with refrigerator and the light emitting module with refrigerator |
| CN108140706B (en) * | 2015-09-25 | 2021-07-09 | 三菱综合材料株式会社 | Light-emitting module with refrigerator and manufacturing method of light-emitting module with refrigerator |
| WO2017188237A1 (en) * | 2016-04-28 | 2017-11-02 | 株式会社光波 | Led light source device |
| JP2017199842A (en) * | 2016-04-28 | 2017-11-02 | 株式会社光波 | LED light source device |
| CN112420636A (en) * | 2020-11-19 | 2021-02-26 | 四川长虹空调有限公司 | Chip heat radiation structure |
| CN112420636B (en) * | 2020-11-19 | 2022-09-06 | 四川长虹空调有限公司 | Chip heat radiation structure |
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Application publication date: 20150408 |
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