CN1581366B - 备有冷却系统的电子设备 - Google Patents
备有冷却系统的电子设备 Download PDFInfo
- Publication number
- CN1581366B CN1581366B CN200410028256XA CN200410028256A CN1581366B CN 1581366 B CN1581366 B CN 1581366B CN 200410028256X A CN200410028256X A CN 200410028256XA CN 200410028256 A CN200410028256 A CN 200410028256A CN 1581366 B CN1581366 B CN 1581366B
- Authority
- CN
- China
- Prior art keywords
- temperature
- voltage
- fan
- pump
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 90
- 239000007788 liquid Substances 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims description 10
- 230000002708 enhancing effect Effects 0.000 claims 2
- 238000005728 strengthening Methods 0.000 claims 1
- 230000020169 heat generation Effects 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 12
- 230000007423 decrease Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- 230000002528 anti-freeze Effects 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- YDLQKLWVKKFPII-UHFFFAOYSA-N timiperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCC(N2C(NC3=CC=CC=C32)=S)CC1 YDLQKLWVKKFPII-UHFFFAOYSA-N 0.000 description 1
- 229950000809 timiperone Drugs 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L55/00—Devices or appurtenances for use in, or in connection with, pipes or pipe systems
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003291511A JP2005064186A (ja) | 2003-08-11 | 2003-08-11 | 冷却システムを備えた電子機器 |
JP291511/2003 | 2003-08-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1581366A CN1581366A (zh) | 2005-02-16 |
CN1581366B true CN1581366B (zh) | 2010-05-26 |
Family
ID=33562767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200410028256XA Expired - Fee Related CN1581366B (zh) | 2003-08-11 | 2004-03-10 | 备有冷却系统的电子设备 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7455103B2 (zh) |
EP (1) | EP1507449A3 (zh) |
JP (1) | JP2005064186A (zh) |
KR (1) | KR100610292B1 (zh) |
CN (1) | CN1581366B (zh) |
TW (1) | TWI318557B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104081310A (zh) * | 2012-02-09 | 2014-10-01 | 惠普发展公司,有限责任合伙企业 | 散热系统 |
US12004320B2 (en) | 2019-06-18 | 2024-06-04 | Huawei Technologies Co., Ltd. | Thermal component and electronic device |
Families Citing this family (72)
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US7313815B2 (en) * | 2001-08-30 | 2007-12-25 | Cisco Technology, Inc. | Protecting against spoofed DNS messages |
US7806168B2 (en) | 2002-11-01 | 2010-10-05 | Cooligy Inc | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US20050211418A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US7836597B2 (en) | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US20040233639A1 (en) * | 2003-01-31 | 2004-11-25 | Cooligy, Inc. | Removeable heat spreader support mechanism and method of manufacturing thereof |
US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
DK1923771T3 (en) * | 2003-11-07 | 2015-06-01 | Asetek As | Cooling system for a computer system |
US7616444B2 (en) * | 2004-06-04 | 2009-11-10 | Cooligy Inc. | Gimballed attachment for multiple heat exchangers |
CN101228495B (zh) * | 2005-05-06 | 2013-03-13 | 阿塞泰克公司 | 用于计算机系统的冷却系统 |
DE102005030861A1 (de) * | 2005-07-01 | 2007-01-04 | Invendo Medical Gmbh | Kühleinrichtung für elektronische Bauteile vorzugsweise eines Endoskops |
JP2007148572A (ja) * | 2005-11-24 | 2007-06-14 | Toshiba Corp | 電子機器、温度制御装置および温度制御方法 |
JP4762699B2 (ja) * | 2005-11-30 | 2011-08-31 | 古河電気工業株式会社 | 電子部品用冷却装置、その温度制御方法及びその温度制御プログラム |
US20070133170A1 (en) * | 2005-12-08 | 2007-06-14 | Inventec Corporation | Self-protection device of water-cooled dissipation system for computer |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
TW200810676A (en) | 2006-03-30 | 2008-02-16 | Cooligy Inc | Multi device cooling |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US20070256815A1 (en) * | 2006-05-04 | 2007-11-08 | Cooligy, Inc. | Scalable liquid cooling system with modular radiators |
US20080013278A1 (en) * | 2006-06-30 | 2008-01-17 | Fredric Landry | Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles |
TWM307288U (en) * | 2006-09-01 | 2007-03-01 | Cooler Master Co Ltd | Temperature-controlling equipment of the machine case |
US7735331B2 (en) * | 2006-09-20 | 2010-06-15 | Ford Global Technologies, Llc | System and method for controlling temperature of an energy storage device in a vehicle |
US8272428B2 (en) | 2007-07-04 | 2012-09-25 | Denso Corporation | Cooling apparatus using brine |
US8250877B2 (en) | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
JP5160945B2 (ja) * | 2008-04-21 | 2013-03-13 | 日本モレックス株式会社 | ヒートパイプおよび電子機器 |
US7791882B2 (en) * | 2008-04-23 | 2010-09-07 | International Business Machines Corporation | Energy efficient apparatus and method for cooling an electronics rack |
JP4625851B2 (ja) | 2008-04-28 | 2011-02-02 | 株式会社日立製作所 | 冷却システム及びそれを備えた電子機器 |
US8302419B2 (en) * | 2008-05-02 | 2012-11-06 | Thermal Take Technology Co., Ltd. | Computer cooling apparatus |
US8782234B2 (en) * | 2008-05-05 | 2014-07-15 | Siemens Industry, Inc. | Arrangement for managing data center operations to increase cooling efficiency |
WO2010017327A1 (en) | 2008-08-05 | 2010-02-11 | Cooligy Inc. | A microheat exchanger for laser diode cooling |
US9238398B2 (en) * | 2008-09-25 | 2016-01-19 | B/E Aerospace, Inc. | Refrigeration systems and methods for connection with a vehicle's liquid cooling system |
CN101865864B (zh) * | 2010-06-08 | 2012-07-04 | 华东理工大学 | 电子元器件相变冷却效果的测试系统 |
JP2012007865A (ja) * | 2010-06-28 | 2012-01-12 | Hitachi Plant Technologies Ltd | 冷却システム |
JP5880998B2 (ja) * | 2010-09-16 | 2016-03-09 | 株式会社リコー | 冷却装置、画像形成装置 |
CN101977489B (zh) * | 2010-11-09 | 2013-01-30 | 廖维秀 | 用于发热元件的冷却装置及方法 |
BR112013015063A2 (pt) * | 2010-12-16 | 2019-09-24 | Smartcube Llc | alojamento de servidor de computador portátil |
KR101169713B1 (ko) | 2010-12-31 | 2012-07-30 | 한국항공우주연구원 | 액적을 이용한 전자 기기의 냉각 장치 |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
JP6061183B2 (ja) * | 2012-02-21 | 2017-01-18 | 株式会社リコー | 冷却装置、及び画像形成装置 |
EP2901828A4 (en) | 2012-09-28 | 2016-06-01 | Hewlett Packard Development Co | COOLING ASSEMBLY |
CN102914112A (zh) * | 2012-10-26 | 2013-02-06 | 江苏兆胜空调有限公司 | 一种油水冷却装置及其控制方法 |
EP2952076B1 (en) | 2013-01-31 | 2019-10-30 | Hewlett-Packard Enterprise Development LP | Liquid cooling |
US9052252B2 (en) | 2013-03-15 | 2015-06-09 | Coolit Systems, Inc. | Sensors, communication techniques, and related systems |
TWI531795B (zh) | 2013-03-15 | 2016-05-01 | 水冷系統公司 | 感測器、多工通信技術及相關系統 |
JP6096560B2 (ja) * | 2013-03-28 | 2017-03-15 | 株式会社Nttファシリティーズ | 装置冷却システム |
CN104102310B (zh) * | 2013-04-09 | 2018-01-19 | 北京百度网讯科技有限公司 | 用于服务器整机柜的冷却系统 |
CN104182013A (zh) * | 2013-05-20 | 2014-12-03 | 深圳先进技术研究院 | 计算机管道网络水冷装置 |
JP6171826B2 (ja) * | 2013-10-16 | 2017-08-02 | 富士通株式会社 | 電子装置、電子装置の制御方法及び電子装置の制御プログラム |
CN104717869B (zh) * | 2013-12-13 | 2017-06-23 | 赛恩倍吉科技顾问(深圳)有限公司 | 电子装置及其散热模组 |
CN103824826B (zh) * | 2014-02-21 | 2017-01-04 | 电子科技大学 | 一种微流道散热方法 |
TW201542079A (zh) * | 2014-04-24 | 2015-11-01 | Wistron Corp | 針對電子裝置中之電子元件的散熱系統與散熱方法 |
CN104713394B (zh) * | 2015-03-24 | 2017-03-08 | 华为技术有限公司 | 散热器及热管散热系统 |
CN205105503U (zh) * | 2015-10-12 | 2016-03-23 | 酷码科技股份有限公司 | 散热模块、散热系统以及电路模块 |
CN105783046A (zh) * | 2016-03-23 | 2016-07-20 | 浙江绍兴苏泊尔生活电器有限公司 | 家用电器液冷散热系统的控制方法 |
CN106051815B (zh) * | 2016-05-30 | 2018-02-27 | 大唐贵州发耳发电有限公司 | 一种锅炉火检冷却风系统联锁逻辑 |
CN106951043B (zh) * | 2017-03-15 | 2023-12-26 | 联想(北京)有限公司 | 电子设备、循环冷却系统 |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
CN109871096A (zh) * | 2017-11-17 | 2019-06-11 | 英业达科技有限公司 | 散热控制方法及其浸入式冷却系统 |
JP7077067B2 (ja) * | 2018-03-06 | 2022-05-30 | 株式会社Idcフロンティア | 冷却装置、データセンター、及び冷却方法 |
CN108397948A (zh) * | 2018-03-09 | 2018-08-14 | 桐乡市梧桐春秋机械维修部 | 一种新型工程冷却组件 |
US10325644B1 (en) * | 2018-04-30 | 2019-06-18 | Nanya Technology Corporation | Pump circuit in a DRAM, and method for generating a pump current |
CN108807313B (zh) * | 2018-07-05 | 2020-06-23 | 安康学院 | 一种微电子器件散热装置 |
CN109663214A (zh) * | 2018-12-19 | 2019-04-23 | 武汉奇致激光技术股份有限公司 | 一种准分子治疗仪冷却系统结构及其控制方法 |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
CN110045804A (zh) * | 2019-04-15 | 2019-07-23 | 山东超越数控电子股份有限公司 | 一种新型计算机散热机构 |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US12041396B2 (en) * | 2020-07-16 | 2024-07-16 | R9 Labs, Llc | Systems and methods for processing data proximate to the point of collection |
CN113342085B (zh) * | 2021-06-17 | 2022-11-08 | 南昌黑鲨科技有限公司 | 一种识别外置辅助散热设备的方法及系统 |
JP7108755B1 (ja) * | 2021-07-13 | 2022-07-28 | 浜松ホトニクス株式会社 | 光検出装置及び光検出装置の制御方法 |
US12200914B2 (en) | 2022-01-24 | 2025-01-14 | Coolit Systems, Inc. | Smart components, systems and methods for transferring heat |
KR102449125B1 (ko) * | 2022-04-07 | 2022-09-29 | 주식회사 글로벌탑넷 | Gpu 서버 냉각관리 시스템 |
CN118119158B (zh) * | 2024-03-05 | 2024-10-29 | 深圳中菱科技有限公司 | 一种高效能伺服驱动器热管理系统及其方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US6352055B1 (en) * | 1999-11-24 | 2002-03-05 | Caterpillar Inc. | Engine water pump control system |
US6414843B1 (en) * | 1999-08-18 | 2002-07-02 | Nec Corporation | Cooling system for a computer apparatus |
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JP3593287B2 (ja) * | 1999-10-07 | 2004-11-24 | 株式会社ケンウッド | スピーカ駆動装置用強制空冷装置 |
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JP2002099356A (ja) * | 2000-09-21 | 2002-04-05 | Toshiba Corp | 電子機器用冷却装置および電子機器 |
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JP2002257450A (ja) * | 2001-03-02 | 2002-09-11 | Sanyo Electric Co Ltd | 半導体素子の冷却装置 |
JP2002353668A (ja) | 2001-05-30 | 2002-12-06 | Showa Denko Kk | 電子部品冷却装置および電子部品冷却システム |
JP2003018861A (ja) * | 2001-06-27 | 2003-01-17 | Nissan Motor Co Ltd | インバータの冷却制御装置 |
JP2003314936A (ja) * | 2002-04-18 | 2003-11-06 | Matsushita Refrig Co Ltd | 冷却装置 |
-
2003
- 2003-08-11 JP JP2003291511A patent/JP2005064186A/ja active Pending
-
2004
- 2004-03-02 TW TW093105396A patent/TWI318557B/zh not_active IP Right Cessation
- 2004-03-08 EP EP04005438A patent/EP1507449A3/en not_active Withdrawn
- 2004-03-09 KR KR1020040015679A patent/KR100610292B1/ko active IP Right Grant
- 2004-03-10 CN CN200410028256XA patent/CN1581366B/zh not_active Expired - Fee Related
- 2004-03-10 US US10/796,049 patent/US7455103B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6414843B1 (en) * | 1999-08-18 | 2002-07-02 | Nec Corporation | Cooling system for a computer apparatus |
US6352055B1 (en) * | 1999-11-24 | 2002-03-05 | Caterpillar Inc. | Engine water pump control system |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104081310A (zh) * | 2012-02-09 | 2014-10-01 | 惠普发展公司,有限责任合伙企业 | 散热系统 |
US10123464B2 (en) | 2012-02-09 | 2018-11-06 | Hewlett Packard Enterprise Development Lp | Heat dissipating system |
CN104081310B (zh) * | 2012-02-09 | 2019-03-22 | 慧与发展有限责任合伙企业 | 散热系统 |
US12004320B2 (en) | 2019-06-18 | 2024-06-04 | Huawei Technologies Co., Ltd. | Thermal component and electronic device |
Also Published As
Publication number | Publication date |
---|---|
US20050034466A1 (en) | 2005-02-17 |
TWI318557B (en) | 2009-12-11 |
KR20050018567A (ko) | 2005-02-23 |
KR100610292B1 (ko) | 2006-08-09 |
CN1581366A (zh) | 2005-02-16 |
JP2005064186A (ja) | 2005-03-10 |
US7455103B2 (en) | 2008-11-25 |
TW200507735A (en) | 2005-02-16 |
EP1507449A3 (en) | 2011-11-16 |
EP1507449A2 (en) | 2005-02-16 |
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