CN1388537A - Ion implantation process of preparing GaN-based diluted magnetic semiconductor material - Google Patents
Ion implantation process of preparing GaN-based diluted magnetic semiconductor material Download PDFInfo
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005468 ion implantation Methods 0.000 title claims abstract description 23
- 230000008569 process Effects 0.000 title claims description 3
- 239000000463 material Substances 0.000 title abstract description 32
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 12
- 229910052742 iron Inorganic materials 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- 238000000137 annealing Methods 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 6
- 238000002513 implantation Methods 0.000 claims description 5
- 238000010790 dilution Methods 0.000 claims 2
- 239000012895 dilution Substances 0.000 claims 2
- 150000002500 ions Chemical class 0.000 abstract description 29
- -1 Mn and Fe Chemical class 0.000 abstract 1
- 229910002601 GaN Inorganic materials 0.000 description 30
- 230000005294 ferromagnetic effect Effects 0.000 description 4
- 230000005307 ferromagnetism Effects 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000000927 vapour-phase epitaxy Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000005418 spin wave Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
离子注入法制备GaN基稀释磁性半导体薄膜的方法,将磁性离子如Mn及Fe、Co或Ni等注入GaN半导体薄膜中,即用离子注入的方法以150~250keV的能量注入磁性离子,然后在850-900℃、NH3气氛条件下退火处理。DMS离子注入法是通过离子注入,将Fe、Mn、Co或Ni等磁性离子注入GaN基半导体材料中来制备磁性半导体的方法。与其他直接生长方法相比,能够实现较高的离子掺杂浓度,因而可能制备出高居里温度的磁性半导体材料。The method of preparing GaN-based dilute magnetic semiconductor film by ion implantation method, injecting magnetic ions such as Mn and Fe, Co or Ni into the GaN semiconductor film, that is, implanting magnetic ions with an energy of 150-250 keV by ion implantation, and then injecting magnetic ions at 850 Annealing treatment under -900℃, NH 3 atmosphere. The DMS ion implantation method is a method of preparing magnetic semiconductors by implanting magnetic ions such as Fe, Mn, Co or Ni into GaN-based semiconductor materials by ion implantation. Compared with other direct growth methods, it can achieve higher ion doping concentration, so it is possible to prepare magnetic semiconductor materials with high Curie temperature.
Description
一、技术领域1. Technical field
本发明涉及一种利用离子注入制备GaN基稀释磁性半导体薄膜材料如GaN:Mn等的方The invention relates to a method for preparing GaN-based dilute magnetic semiconductor film materials such as GaN:Mn by ion implantation
法。Law.
二、技术背景2. Technical background
自从晶体管发明以后,半导体电子技术的所有应用都是基于电子电荷的探索。二十实际末期,大量的研究努力开始集中于电子自旋的应用。利用电子自旋波函数的量子性质(自旋电子学)的器件在光电转换,超敏感磁场传感器,特别是用于高速计算的基于量子效应的逻辑和记忆器件的研究方面获得了很大的进展。但是,由于材料的本质(如晶体结构,键,物理和化学性质)不同,直接将电子材料(半导体)和旋转材料(铁磁性金属)融合起来产生很多的问题。另一个解决办法是使用稀释磁性半导体(重掺杂磁性离子的半导体),可以直接与现有的半导体器件集成。Since the invention of the transistor, all applications of semiconductor electronics have been based on the exploration of electron charge. In the late twenties, a great deal of research effort began to focus on the application of electron spin. Devices exploiting the quantum nature of electron spin wave functions (spintronics) have made great strides in research into photoelectric conversion, ultrasensitive magnetic field sensors, and especially quantum-effect-based logic and memory devices for high-speed computing . However, the direct fusion of electronic materials (semiconductors) and spin materials (ferromagnetic metals) creates many problems due to the different nature of the materials (such as crystal structures, bonds, physical and chemical properties). Another solution is to use dilute magnetic semiconductors (semiconductors heavily doped with magnetic ions), which can be directly integrated with existing semiconductor devices.
稀释半导体材料(Diluted Magnetic Semiconductor,DMS)是在非磁性半导体(如IV-VI族、II-VI族或III-V族)中掺杂磁性离子,利用载流子控制技术产生磁性的新型功能材料。通过改变稀释半导体材料中载流子密度可以改变磁性的大小。由于磁性离子局域磁矩与能带电子自旋存在交换作用,因此通过改变磁性杂质浓度和外磁场强度可以有效控制他们的光电、磁光、光吸收和输运特性。它同时应用了电子电荷和电子自旋性质,因而DMS器件可以直接与现有的半导体器件集成,在光、电、磁功能集成等的新型器件方面具有重要的应用。Diluted Magnetic Semiconductor (DMS) is a new type of functional material that is doped with magnetic ions in non-magnetic semiconductors (such as IV-VI, II-VI or III-V) and uses carrier control technology to generate magnetism. . The magnitude of the magnetism can be altered by changing the carrier density in the dilute semiconductor material. Due to the exchange interaction between the local magnetic moments of magnetic ions and the energy-band electron spins, their photoelectric, magneto-optical, light absorption and transport properties can be effectively controlled by changing the concentration of magnetic impurities and the strength of the external magnetic field. It applies both electron charge and electron spin properties, so DMS devices can be directly integrated with existing semiconductor devices, and have important applications in new devices such as optical, electrical, and magnetic functional integration.
II-VI族稀释磁性半导体材料已经广泛地被研究了。但是基于III-V族的稀释半导体还没有进行详尽地研究。目前普遍研究的(In,Mn)As和(Ga,Mn)As的居里温度(Tc)都很低(35和110K)。从实际应用的角度考虑,寻找具有更高居里温度的材料是迫切需要的。理论工作表明,宽带隙半导体如GaN和ZnO可能是室温或更高温度下能够实现载流子引起铁磁生的合适的代表性材料。由于氮化镓极其相关材料在短波段蓝色光电子学方面是最有前景的材料;而MnxGa1-xN属于具有独特磁性性质的III-V族稀释磁性半导体材料。研究已经显示,相对较低的Mn浓度足够使相对应的MnxGa1-N产生铁磁性。因此,基于GaN基的DMS半导体材料研究在最近几年获得了足够的重视。II-VI dilute magnetic semiconductor materials have been extensively studied. However, dilute semiconductors based on III-V groups have not been studied exhaustively. The Curie temperature (Tc) of (In, Mn) As and (Ga, Mn) As commonly studied at present is very low (35 and 110K). From the point of view of practical application, it is urgent to find materials with higher Curie temperature. Theoretical work suggests that wide bandgap semiconductors such as GaN and ZnO may be suitable representative materials capable of carrier-induced ferromagnetism at room temperature or higher. Gallium nitride and its related materials are the most promising materials in short-wavelength blue optoelectronics; and Mn x Ga 1-x N belongs to the III-V diluted magnetic semiconductor materials with unique magnetic properties. Studies have shown that a relatively low Mn concentration is sufficient to make the corresponding Mn x Ga 1-N ferromagnetic. Therefore, research on GaN-based DMS semiconductor materials has received sufficient attention in recent years.
GaN基的DMS半导体材料面临的主要困难是,目前还没有合适的生长方法直接外延生长。由于磁性离子在GaN基DMS材料中较低的溶解度,很难获得不形成第二相的外延材料。离子注入过程是一个引入不同的磁性离子进入不同主材料中的很简便的方法,与其他直接生长方法相比,能够实现较高的离子掺杂浓度,很容易被用于制备自旋极化电流注入装置结构作为选区接触区。所以,在目前没有发现较好的直接外延生长GaN基的DMS半导体材料之前,离子注入是一个令人满意的替代方法。通过离子注入,将Fe、Mn、Co或Ni等磁性离子注入GaN基半导体材料中,可以用来研究DMS材料铁磁性的起源和本质,制备出高质量的磁性半导体材料。The main difficulty faced by GaN-based DMS semiconductor materials is that there is no suitable growth method for direct epitaxial growth. Due to the low solubility of magnetic ions in GaN-based DMS materials, it is difficult to obtain epitaxial materials that do not form a second phase. The ion implantation process is a very convenient method to introduce different magnetic ions into different host materials. Compared with other direct growth methods, it can achieve higher ion doping concentrations and is easily used to prepare spin-polarized currents. Inject the device structure as a selective contact area. Therefore, ion implantation is a satisfactory alternative until a better direct epitaxial growth of GaN-based DMS semiconductor materials has not been found. Through ion implantation, magnetic ions such as Fe, Mn, Co or Ni are implanted into GaN-based semiconductor materials, which can be used to study the origin and nature of the ferromagnetism of DMS materials and prepare high-quality magnetic semiconductor materials.
在本发明中,我们采用离子注入法,将磁性离子如Mn、Fe、Co或Ni等注入GaN半导体薄膜中,制备出GaN基室温铁磁性半导体薄膜材料如GaN:Mn等。In the present invention, we use the ion implantation method to inject magnetic ions such as Mn, Fe, Co or Ni into the GaN semiconductor thin film to prepare GaN-based room temperature ferromagnetic semiconductor thin film materials such as GaN:Mn and the like.
三、技术内容3. Technical content
DMS离子注入法是通过离子注入,将Fe、Mn、Co或Ni等磁性离子注入GaN基半导体材料中,可以用来研究DMS材料铁磁性的起源和本质,制备出高质量的磁性半导体材料。在本发明中,我们采用离子注入法,将磁性离子Mn、Fe、Co和Ni等注入GaN基半导体薄膜中,制备出具有较高居里温度的铁磁性半导体薄膜材料如GaN:Mn等。The DMS ion implantation method is to inject magnetic ions such as Fe, Mn, Co or Ni into GaN-based semiconductor materials through ion implantation, which can be used to study the origin and nature of the ferromagnetism of DMS materials and prepare high-quality magnetic semiconductor materials. In the present invention, we use the ion implantation method to implant magnetic ions Mn, Fe, Co and Ni into GaN-based semiconductor films to prepare ferromagnetic semiconductor film materials with higher Curie temperature such as GaN:Mn.
本发明离子注入法制备GaN基稀释磁性半导体薄膜的方法,其特征是将磁性离子如Mn及Fe、Co或Ni等注入GaN半导体薄膜中,即用离子注入的方法以150~250keV的能量注入磁性离子,然后在850-900℃、NH3气氛条件下退火处理。The method for preparing a GaN-based diluted magnetic semiconductor thin film by ion implantation of the present invention is characterized in that magnetic ions such as Mn, Fe, Co or Ni are implanted into the GaN semiconductor thin film, that is, the ion implantation method is used to inject magnetic ions with an energy of 150 to 250 keV. ions, and then annealed at 850-900°C under NH 3 atmosphere.
利用离子注入的方法,我们成功地获得了室温下的GaN基稀释磁性半导体材料。如GaN:Mn,其磁学性质如图1所示。X射线衍射结构分析表明,Mn离子被注入GaN并经过退火处理后,Mn离子基本取代了GaN晶格中Ga的位置,而不是N位或填隙式。因为Ga和Mn同属第四周期,其内层电子结构,电负性和原子半径的值相近,使得Mn占据Ga位后晶格常数没有太大变化。此外,Mn的引入导致了GaN中的深能级,并使得注入层为半绝缘材料。Using the method of ion implantation, we have successfully obtained GaN-based diluted magnetic semiconductor materials at room temperature. Such as GaN: Mn, its magnetic properties are shown in Figure 1. X-ray diffraction structure analysis shows that after Mn ions are implanted into GaN and annealed, Mn ions basically replace the Ga position in the GaN lattice, rather than the N-site or interstitial type. Because Ga and Mn both belong to the fourth period, their inner electron structure, electronegativity and atomic radius are similar, so that the lattice constant does not change much after Mn occupies the Ga site. In addition, the introduction of Mn leads to deep energy levels in GaN and makes the injection layer a semi-insulating material.
本发明的机理和技术特点是:Mechanism and technical characteristics of the present invention are:
DMS离子注入法是通过离子注入,将Fe、Mn、Co或Ni等磁性离子注入GaN基半导体材料中米制备磁性半导体的方法。与其他直接生长方法相比,能够实现较高的离子掺杂浓度,因而可能制备出高居里温度的磁性半导体材料。退火前高能离子的注入使表面GaN层的晶格被打乱,适当地退火处理以后,Mn已被激活,并取代了GaN晶格中Ga的位置,GaN:Mn表现出较好的质量。The DMS ion implantation method is a method for preparing magnetic semiconductors by implanting magnetic ions such as Fe, Mn, Co or Ni into GaN-based semiconductor materials through ion implantation. Compared with other direct growth methods, it can achieve higher ion doping concentration, so it is possible to prepare magnetic semiconductor materials with high Curie temperature. The implantation of high-energy ions before annealing disrupts the lattice of the GaN layer on the surface. After proper annealing, Mn has been activated and replaced the Ga position in the GaN lattice. GaN:Mn shows better quality.
四、附图说明 4. Description of drawings
图1是室温下GaN:Mn薄膜的M-H曲线Figure 1 is the M-H curve of GaN:Mn film at room temperature
五、具体实施方式5. Specific implementation
1、首先获得高质量GaN薄膜样品,可以采用金属有机物气相外延、分子束外延或1. First obtain high-quality GaN film samples, which can be obtained by metal-organic vapor phase epitaxy, molecular beam epitaxy or
氢化物气相外延等方法生长的GaN薄膜。本发明中所例举的GaN样品均是用金GaN thin films grown by hydride vapor phase epitaxy and other methods. The GaN samples cited in the present invention are all made of gold
属有机物气相外延(MOVPE)的方法在蓝宝石衬底上生长的,厚度大约1μm;It is grown on a sapphire substrate by the method of organic vapor phase epitaxy (MOVPE), with a thickness of about 1 μm;
2、以离子注入设备,用离子注入的方法以150~250keV的能量注入磁性离子Mn。2. Using ion implantation equipment, implant magnetic ions Mn with an energy of 150-250 keV by means of ion implantation.
用离子注入的方法以150~250keV的能量注入磁性离子Mn,其Mn的浓度分布 Using the method of ion implantation to implant magnetic ions Mn with energy of 150-250keV, the concentration distribution of Mn
峰值在2000处,Mn离子注入浓度每立方厘米为7×1020~2×1022。The peak is at 2000 Å, and the implantation concentration of Mn ions is 7×10 20 -2×10 22 per cubic centimeter.
3、在900℃,NH3气氛下退火处理,时间1小时。3. Annealing treatment at 900°C under NH 3 atmosphere for 1 hour.
4、同样地,按照上述步骤,也可以制备含Fe、Co或Ni等磁性离子的磁性半导体4. Similarly, according to the above steps, it is also possible to prepare magnetic semiconductors containing magnetic ions such as Fe, Co or Ni.
材料。Fe、Co和Ni等离子的注入浓度范围与Mn离子相同,注入条件相近。 Material. The implantation concentration ranges of Fe, Co and Ni ions are the same as those of Mn ions, and the implantation conditions are similar.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100412536C (en) * | 2005-02-04 | 2008-08-20 | 中国科学院半导体研究所 | Method for Measuring Ferromagnetic Transition Temperature of Diluted Magnetic Semiconductor GaMnAs Without Magnetic Field |
CN100435281C (en) * | 2006-01-17 | 2008-11-19 | 北京大学 | Method for preparing GaN-based dilute magnetic semiconductor material |
CN101894651A (en) * | 2010-06-09 | 2010-11-24 | 中国科学院半导体研究所 | Method for preparing non-polar GaN-based dilute magnetic semiconductor material by using ion implantation |
CN101404198B (en) * | 2008-05-30 | 2011-05-25 | 北方工业大学 | Diluted magnetic semiconductor material with high Curie temperature and preparation method thereof |
CN101319400B (en) * | 2008-05-19 | 2012-07-04 | 南京大学 | Method for Fe doped growing GaFeN dilution magnetic semiconductor and uses thereof |
CN102828240A (en) * | 2012-08-31 | 2012-12-19 | 南京大学 | Method for preparing GaN film material |
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2002
- 2002-05-31 CN CN02113082.5A patent/CN1388537A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100412536C (en) * | 2005-02-04 | 2008-08-20 | 中国科学院半导体研究所 | Method for Measuring Ferromagnetic Transition Temperature of Diluted Magnetic Semiconductor GaMnAs Without Magnetic Field |
CN100435281C (en) * | 2006-01-17 | 2008-11-19 | 北京大学 | Method for preparing GaN-based dilute magnetic semiconductor material |
CN101319400B (en) * | 2008-05-19 | 2012-07-04 | 南京大学 | Method for Fe doped growing GaFeN dilution magnetic semiconductor and uses thereof |
CN101404198B (en) * | 2008-05-30 | 2011-05-25 | 北方工业大学 | Diluted magnetic semiconductor material with high Curie temperature and preparation method thereof |
CN101894651A (en) * | 2010-06-09 | 2010-11-24 | 中国科学院半导体研究所 | Method for preparing non-polar GaN-based dilute magnetic semiconductor material by using ion implantation |
CN102828240A (en) * | 2012-08-31 | 2012-12-19 | 南京大学 | Method for preparing GaN film material |
WO2014032468A1 (en) * | 2012-08-31 | 2014-03-06 | 南京大学 | Method for preparing gan film material |
CN102828240B (en) * | 2012-08-31 | 2015-11-25 | 南京大学 | A kind of method preparing GaN film material |
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