CN118893721B - Edge breakage prevention ultrasonic wafer cutting system and wafer cutting method - Google Patents
Edge breakage prevention ultrasonic wafer cutting system and wafer cutting method Download PDFInfo
- Publication number
- CN118893721B CN118893721B CN202411396606.1A CN202411396606A CN118893721B CN 118893721 B CN118893721 B CN 118893721B CN 202411396606 A CN202411396606 A CN 202411396606A CN 118893721 B CN118893721 B CN 118893721B
- Authority
- CN
- China
- Prior art keywords
- axis direction
- sliding
- axis
- wafer
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title claims abstract description 8
- 230000002265 prevention Effects 0.000 title claims description 17
- 235000012431 wafers Nutrition 0.000 claims description 82
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 238000005336 cracking Methods 0.000 abstract description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
本发明涉及晶圆切割技术领域，具体涉及一种防崩边超声波晶圆切割系统及晶圆切割方法，包括基座；基座沿Y轴方向设有Y轴滑台；Y轴滑台设有X轴滑台；X轴滑台设有底座；底座设有滑动座与振动座；振动座设有第一振动组件；基座设有固定台；固定台设有吸盘；固定台内设有第二振动组件。本发明通过在底座与切割组件之间设置第一振动组件，驱动刀片在切割过程中沿Z轴方向进行微振动；在固定台与吸盘之间设置第二振动组件，能够驱动晶圆在切割过程中沿Y轴方向进行微振动；通过两个方向的微振动，实现刀片在沿晶圆切割道深度方向和宽度方向的微振动切割，以降低切割过程中刀片对晶圆产生的应力，防止晶圆切割过程中产生崩边和开裂。
The present invention relates to the field of wafer cutting technology, and specifically to an anti-chipping ultrasonic wafer cutting system and a wafer cutting method, comprising a base; the base is provided with a Y-axis slide along the Y-axis direction; the Y-axis slide is provided with an X-axis slide; the X-axis slide is provided with a base; the base is provided with a sliding seat and a vibration seat; the vibration seat is provided with a first vibration component; the base is provided with a fixed table; the fixed table is provided with a suction cup; and a second vibration component is provided in the fixed table. The present invention drives the blade to perform micro-vibration along the Z-axis direction during the cutting process by arranging a first vibration component between the base and the cutting component; the second vibration component is arranged between the fixed table and the suction cup, which can drive the wafer to perform micro-vibration along the Y-axis direction during the cutting process; through micro-vibration in two directions, micro-vibration cutting of the blade along the depth direction and the width direction of the wafer cutting path is achieved, so as to reduce the stress generated by the blade on the wafer during the cutting process, and prevent chipping and cracking during the wafer cutting process.
Description
Technical Field
The invention relates to the technical field of wafer cutting, in particular to an edge breakage prevention ultrasonic wafer cutting system and a wafer cutting method.
Background
In the manufacturing process of semiconductor chips, after integrated circuits are manufactured on a wafer, the wafer is required to be cut into a plurality of wafers die according to a preset path, and currently, a wafer cutting machine mainly cuts the wafer by rotating a blade and utilizing diamond abrasive particles on the blade.
In addition, the extrusion stress between the diamond abrasive particles and the cutting path is larger, cracks and even broken edges are easy to occur on the side wall of the cutting path of the wafer in the cutting process, and in order to ensure the cutting quality, the cutting speed has to be reduced, so that the improvement of the cutting quality and the efficiency of the wafer is limited.
Disclosure of Invention
The invention aims at overcoming the defects in the prior art and provides an edge breakage prevention ultrasonic wafer cutting system and a wafer cutting method.
The invention discloses an edge breakage prevention ultrasonic wafer cutting system, which comprises a base, wherein the base is provided with a Y-axis sliding table along the Y-axis direction, the output end of the Y-axis sliding table is provided with an X-axis sliding table, the output end of the X-axis sliding table is provided with a base, the base is provided with a sliding seat and a vibrating seat in a lifting and moving mode along the Z-axis direction, the sliding seat is provided with a cutting assembly, and the vibrating seat is provided with a first vibrating assembly for driving the sliding seat to vibrate along the Z-axis direction;
the base is provided with a fixed table, the top of the fixed table is rotatably provided with a sucker, and a second vibration assembly for driving the sucker to vibrate in the Y-axis direction is arranged in the fixed table.
The invention further provides a screw rod which is arranged on the base in a rotating mode along the Z-axis direction, a sliding rail and a sliding groove are arranged on the base in the Z-axis direction, a motor is arranged on the base, the output end of the motor is connected with the screw rod, the sliding seat is arranged on the sliding rail in a sliding mode, the vibrating seat is arranged on the sliding groove in a sliding mode, and a nut in threaded connection with the screw rod is arranged on the vibrating seat.
The invention further provides that the first vibration component comprises a first piezoelectric actuator and a first driving block arranged at the top of the first piezoelectric actuator, wherein the output end of the first piezoelectric actuator is connected with the first driving block, and the first piezoelectric actuator is used for driving the first driving block to perform lifting movement;
the first piezoelectric actuator is arranged in the vibration seat, a channel is arranged on the top of the first driving block in a penetrating mode, a conducting piece is arranged on the top of the sliding seat, and the conducting piece is arranged on the top of the channel in a building mode.
The invention further provides that a sliding block is movably arranged in the vibration seat along the Y-axis direction, the first driving block is provided with a first inclined plane, one end of the sliding block is provided with a second inclined plane matched with the first inclined plane, the other end of the sliding block penetrates through the vibration seat and is provided with an elastic friction block used for abutting against the base, an abutting spring is arranged between the sliding block and the vibration seat, and the abutting spring is used for driving the second inclined plane to abut against the first inclined plane.
The invention further provides that a cavity is formed in the middle of the fixed table, the second vibration assembly comprises a bracket arranged in the cavity, a second piezoelectric actuator arranged at the top of the bracket and a second driving block arranged at the output end of the second piezoelectric actuator, the second piezoelectric actuator is used for driving the second driving block to move along the Y-axis direction, and the middle of the sucker is rotationally connected with the second driving block.
The invention further provides that the fixed table is rotatably provided with a turntable, and the sucker is arranged on the top of the turntable.
The invention further provides a fixing table, which is provided with a cam ring, wherein the cam ring is provided with a first protruding part and a second protruding part, the first protruding part, the second protruding part, a second piezoelectric actuator and a second driving block are all arranged on the same straight line along the Y-axis direction, four strip-shaped guide blocks are distributed at the top of the turntable along the circumferential equiangular direction around the circle center, and four strip-shaped guide grooves matched with the strip-shaped guide blocks are distributed at the bottom of the sucker along the circumferential equiangular direction around the circle center;
The strip-shaped guide block penetrates through the turntable and is provided with a driving shaft, and the driving shaft is movably arranged at the top of the cam ring.
The invention further provides that the cutting assembly comprises a main shaft arranged on the sliding seat and a blade connected with the main shaft, wherein the axis of the blade and the axis of the main shaft are arranged along the Y-axis direction.
The invention further provides that the Y-axis sliding table and the X-axis sliding table are both linear motors, and the base is provided with a detection camera at the top of the cutting assembly.
A wafer dicing method comprising the steps of:
S1, fixedly placing a wafer at the center of a sucker;
Step S2, moving the cutting assembly to a first height position;
s3, starting a first vibration assembly to enable the cutting assembly to vibrate up and down in the Z-axis direction, and then starting an X-axis sliding table to cut the wafer for the first time;
s4, stopping the first vibration assembly, starting the second vibration assembly to enable the sucker to vibrate back and forth in the Y-axis direction, and then starting the X-axis sliding table to cut the wafer for the second time;
S5, stopping the first vibration assembly and the second vibration assembly, descending the cutting assembly to a second height position, starting the X-axis sliding table, and performing third cutting on the wafer;
s6, starting a Y-axis sliding table, driving a cutting assembly to move in the Y-axis direction, and repeating the steps S2-S5 until all the wafers are cut;
s7, rotating the sucker by 90 degrees;
And S8, repeating the steps S2-S6 until all the wafers are cut in the X-axis direction and cut in the Y-axis direction.
The wafer cutting device has the beneficial effects that the first vibration component is arranged between the base and the cutting component to drive the blade to conduct micro vibration along the Z-axis direction in the cutting process, the second vibration component is arranged between the fixed table and the sucker to drive the wafer to conduct micro vibration along the Y-axis direction in the cutting process, and the micro vibration cutting of the blade along the depth direction and the width direction of the wafer cutting channel is achieved through the micro vibration of the two directions, so that the stress of the blade on the wafer in the cutting process is reduced, and edge breakage and cracking are prevented in the wafer cutting process.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an enlarged view of a portion of the portion A of FIG. 2;
FIG. 4 is an enlarged view of a portion B of FIG. 2;
FIG. 5 is a schematic view of the base, cutting assembly and first vibration assembly of the present invention mated;
FIG. 6 is a cross-sectional view of a first vibration assembly of the present invention;
FIG. 7 is a schematic view of the structure of the invention with the stationary table, turntable and suction cup engaged;
FIG. 8 is an exploded view of the mounting table, turntable and suction cup assembly of the present invention;
FIG. 9 is an exploded view of the stationary platen, turntable and suction cup of the present invention in combination with another view;
The device comprises a base, a Y-axis sliding table, a 12X-axis sliding table, a2, a base, a 21, a screw, a 22, a sliding rail, a 23, a sliding groove, a 24, a motor, a 25, a nut, a 26, a detection camera, a 3, a sliding seat, a 31, a conducting piece, a 32, a main shaft, a 33, a blade, a 4, a vibration seat, a 41, a first piezoelectric actuator, a 42, a first driving block, a 43, a first inclined surface, a 44, a channel, a 5, a sliding block, a 51, a second inclined surface, a 52, an elastic friction block, a 53, an abutting spring, a 6, a fixed table, a 61, a cavity, a 62, a bracket, a 63, a second piezoelectric actuator, a 64, a second driving block, a 7, a sucker, a 71, a strip guide groove, a 8, a turntable, a 81, a strip guide block, a 82, a reset spring, a 83, a driving shaft, a 9, a cam ring, a 91, a first protruding part, a 92 and a second protruding part.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 1 to 9, the edge breakage prevention ultrasonic wafer cutting system according to the present embodiment includes a base 1, a Y-axis sliding table 11 is provided on the base 1 along the Y-axis direction, an X-axis sliding table 12 is provided at an output end of the Y-axis sliding table 11, a base 2 is provided at an output end of the X-axis sliding table 12, a sliding seat 3 and a vibrating seat 4 are movably provided on the base 2 along the Z-axis direction, the sliding seat 3 is provided with a cutting assembly, the vibrating seat 4 is provided with a first vibrating assembly for driving the sliding seat 3 to vibrate in the Z-axis direction, the base 1 is provided with a fixing table 6, a suction cup 7 is rotatably provided on top of the fixing table 6, and a second vibrating assembly for driving the suction cup 7 to vibrate in the Y-axis direction is provided in the fixing table 6. The edge breakage prevention ultrasonic wafer cutting system comprises a main shaft 32 arranged on a sliding seat 3 and a blade 33 connected with the main shaft 32, wherein the axis of the blade 33 and the axis of the main shaft 32 are arranged along the Y-axis direction. According to the edge breakage prevention ultrasonic wafer cutting system, the Y-axis sliding table 11 and the X-axis sliding table 12 are both linear motors 24, and the base 2 is provided with a detection camera 26 at the top of a cutting assembly.
Specifically, in the system for cutting an edge-breakage-preventing ultrasonic wafer according to this embodiment, when in use, a wafer to be cut is first fixed at the center of the suction cup 7, and after the completion, the Y-axis sliding table 11 and the X-axis sliding table 12 move the inspection camera 26 above the wafer to be cut, detect whether the placement position and direction of the wafer to be cut are accurate, and detect whether the surface of the wafer has scratches, and if the placement position of the wafer is incorrect, the wafer is manually adjusted, and if the surface of the wafer has scratches, the wafer is notified of manual replacement.
Then moving the blade 33 to a first height position, when the blade 33 is at the first height position, the wafer cannot be completely cut through, then starting the first vibration assembly to enable the blade 33 to vibrate up and down in the Z-axis direction, then starting the X-axis sliding table 12 to cut the wafer for the first time, controlling the pulse input voltage of the first vibration assembly to control the amplitude of the blade 33, and enabling the blade 33 to cut the wafer for the first time along a preset track in a state of vibrating in the Z-axis direction after the first cutting is completed so as to enable the bottom of a cutting channel to be microwave-shaped;
the first vibration component is stopped, the second vibration component is started to enable the sucker 7 to conduct reciprocating micro-vibration in the Y-axis direction, then the X-axis sliding table 12 is started to drive the blade 33 to conduct secondary cutting on the cutting channel along the last cutting track, the bottom of the cutting channel is cut to be smooth in the secondary cutting, and microwave waves are formed on the two side walls of the cutting channel;
Then stopping the first vibration assembly and the second vibration assembly, descending the cutting assembly to a second height position, enabling the wafer to be completely cut through when the blade 33 is at the second height position, starting the X-axis sliding table 12, and performing tertiary cutting on the cut wafer, so that the wafer is completely cut through, and cutting a cutting channel is completed;
then, the cutter is moved through the Y-axis sliding table 11, and the operation is repeated, so that all wafers are cut in the X-axis direction;
after all the wafers are cut in the X-axis direction, the sucker 7 is rotated by 90 degrees, and the steps are repeated, so that all the wafers are cut in the Y-axis direction, and a square wafer die is obtained.
In the embodiment, the first vibration component is arranged between the base 2 and the cutting component to drive the blade 33 to conduct micro vibration along the Z-axis direction in the cutting process, the second vibration component is arranged between the fixed table 6 and the sucker 7 to drive the wafer to conduct micro vibration along the Y-axis direction in the cutting process, and micro vibration cutting of the blade 33 along the depth direction and the width direction of the wafer cutting channel is achieved through micro vibration in two directions, so that stress on the wafer generated by the blade 33 in the cutting process is reduced, and edge breakage and cracking of the wafer in the cutting process are prevented.
According to the edge breakage prevention ultrasonic wafer cutting system, a screw 21 is rotatably arranged on a base 2 along the Z-axis direction, a sliding rail 22 and a sliding groove 23 are arranged on the base 2 along the Z-axis direction, a motor 24 is arranged on the base 2, the output end of the motor 24 is connected with the screw 21, a sliding seat 3 is arranged on the sliding rail 22 in a sliding mode, a vibrating seat 4 is arranged on the sliding groove 23 in a sliding mode, and a nut 25 in threaded connection with the screw 21 is arranged on the vibrating seat 4.
Specifically, in this embodiment, when the motor 24 drives the screw 21 to rotate by starting the motor 24, the nut 25 is in threaded connection with the screw 21, so that the vibration seat 4 is lifted along the chute 23, and the sliding seat 3 is erected on the top of the vibration seat 4 by the conducting piece 31, so that the sliding seat 3 can lift along the slide rail 22 along with the vibration seat 4, so that the height of the blade 33 can be adjusted.
According to the edge breakage prevention ultrasonic wafer cutting system, the first vibration assembly comprises a first piezoelectric actuator 41 and a first driving block 42 arranged at the top of the first piezoelectric actuator 41, the output end of the first piezoelectric actuator 41 is connected with the first driving block 42, the first piezoelectric actuator 41 is used for driving the first driving block 42 to conduct lifting movement, the first piezoelectric actuator 41 is arranged in a vibration seat 4, a channel 44 is arranged on the top of the first driving block 42 in a penetrating mode, a conducting piece 31 is arranged on the top of the sliding seat 3, and the conducting piece 31 is arranged at the top of the channel 44 in a lap mode.
Specifically, when the blade 33 is required to vibrate vertically in the Z-axis direction, the first piezoelectric actuator 41 is supplied with a pulse voltage to continuously raise and lower the first driving block 42, and after the first driving block 42 protrudes out of the passage 44, the first driving block 42 abuts against the conductive member 31 to continuously vibrate vertically, thereby driving the blade 33.
According to the edge collapse prevention ultrasonic wafer cutting system, a sliding block 5 is movably arranged in a vibrating seat 4 along the Y-axis direction, a first inclined surface 43 is arranged on a first driving block 42, a second inclined surface 51 matched with the first inclined surface 43 is arranged at one end of the sliding block 5, an elastic friction block 52 used for abutting against a base 2 is arranged at the other end of the sliding block 5 after penetrating through the vibrating seat 4, an abutting spring 53 is arranged between the sliding block 5 and the vibrating seat 4, and the abutting spring 53 is used for driving the second inclined surface 51 to abut against the first inclined surface 43.
Specifically, in the edge collapse prevention ultrasonic wafer cutting system described in this embodiment, when voltage is provided to the first piezoelectric actuator 41, the first driving block 42 is lifted, under the action of the first inclined plane 43 and the second inclined plane 51, the first driving block 42 is lifted to push the elastic friction block 52 to move towards the base 2, so that the elastic friction block 52 abuts against the base 2, the elastic friction block 52 is driven by the first piezoelectric actuator 41 to lock the vibration seat 4, so that vibration load is directly transmitted to the base 2, on one hand, vibration load is prevented from being transmitted to the screw 21, and transmission precision of the screw 21 is prevented from being affected, and on the other hand, the cutter is in a locked state in the cutting process, so that cutting stability can be improved.
In the edge collapse prevention ultrasonic wafer cutting system, a cavity 61 is formed in the middle of the fixing table 6, the second vibration assembly comprises a support 62 arranged in the cavity 61, a second piezoelectric actuator 63 arranged at the top of the support 62, and a second driving block 64 arranged at the output end of the second piezoelectric actuator 63, the second piezoelectric actuator 63 is used for driving the second driving block 64 to move along the Y-axis direction, and the middle of the sucker 7 is rotationally connected with the second driving block 64. Specifically, with the above arrangement, by controlling the pulse input voltage of the second vibration assembly, the second piezoelectric actuator 63 is caused to drive the second driving block 64 to vibrate back and forth in the Y-axis direction.
According to the edge breakage prevention ultrasonic wafer cutting system, the fixed table 6 is rotatably provided with the rotary table 8, and the sucking disc 7 is erected on the top of the rotary table 8. According to the edge breakage prevention ultrasonic wafer cutting system, a cam ring 9 is arranged on a fixed table 6, a first protruding portion 91 and a second protruding portion 92 are arranged on the cam ring 9, the first protruding portion 91, the second protruding portion 92, the second piezoelectric actuator 63 and the second driving block 64 are all arranged on the same straight line arranged in the Y-axis direction, four strip-shaped guide blocks 81 are distributed on the top of a rotary table 8 in the circumferential equiangular direction around a circle center, four strip-shaped guide grooves 71 matched with the strip-shaped guide blocks 81 are distributed on the bottom of a suction disc 7 in the circumferential equiangular direction around the circle center, a reset spring 82 is arranged between the strip-shaped guide blocks 81 and the bottom of the suction disc 7, a driving shaft 83 is arranged behind the strip-shaped guide blocks 81 penetrating through the rotary table 8, and the driving shaft 83 is movably arranged on the top of the cam ring 9.
Specifically, with the above arrangement, when the turntable 8 is rotating, under the action of the return spring 82, the driving shaft 83 can be moved against the top surface of the cam ring 9, and when the driving shaft 83 moves in the area other than the first boss 91 and the second boss 92, the height of the bar-shaped guide block 81 is low and cannot be clamped with the bar-shaped guide groove 71 until the turntable 8 completes 90-degree rotation, wherein the two driving shafts 83 move onto the first boss 91 and the second boss 92, so that the bar-shaped guide blocks 81 corresponding to the two driving shafts 83 rise and are clamped with the two bar-shaped guide grooves 71, thereby being capable of keeping the turntable 8 vibrating back and forth in the Y-axis direction.
A wafer dicing method comprising the steps of:
s1, fixedly placing a wafer at the center of a sucker 7;
Step S2, moving the cutting assembly to a first height position;
step S3, starting a first vibration assembly to enable the cutting assembly to vibrate up and down in the Z-axis direction, and then starting an X-axis sliding table 12 to cut the wafer for the first time;
S4, stopping the first vibration assembly, starting the second vibration assembly to enable the sucker 7 to vibrate back and forth in the Y-axis direction, and then starting the X-axis sliding table 12 to cut the wafer for the second time;
S5, stopping the first vibration assembly and the second vibration assembly, descending the cutting assembly to a second height position, and then starting the X-axis sliding table 12 to cut the wafer for the third time;
Step S6, starting the Y-axis sliding table 11, driving the cutting assembly to move in the Y-axis direction, and repeating the steps S2-S5 until all the wafers are cut;
s7, rotating the sucker 7 by 90 degrees;
And S8, repeating the steps S2-S6 until all the wafers are cut in the X-axis direction and cut in the Y-axis direction.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (7)
1. The ultrasonic wafer cutting system capable of preventing edge breakage is characterized by comprising a base, wherein a Y-axis sliding table is arranged on the base along the Y-axis direction, an X-axis sliding table is arranged at the output end of the Y-axis sliding table, a base is arranged at the output end of the X-axis sliding table, a sliding seat and a vibrating seat are movably arranged on the base in a lifting manner along the Z-axis direction, a cutting assembly is arranged on the sliding seat, and a first vibrating assembly for driving the sliding seat to vibrate along the Z-axis direction is arranged on the vibrating seat;
the base is provided with a fixed table, the top of the fixed table is rotatably provided with a sucker, and a second vibration assembly for driving the sucker to vibrate in the Y-axis direction is arranged in the fixed table;
The second vibration assembly comprises a bracket arranged in the cavity, a second piezoelectric actuator arranged at the top of the bracket and a second driving block arranged at the output end of the second piezoelectric actuator, wherein the second piezoelectric actuator is used for driving the second driving block to move along the Y-axis direction;
The fixed table is rotationally provided with a turntable, and the sucker is arranged at the top of the turntable;
The fixed table is provided with a cam ring, the cam ring is provided with a first protruding part and a second protruding part, the first protruding part, the second piezoelectric actuator and the second driving block are all arranged on the same straight line arranged along the Y-axis direction, four strip-shaped guide blocks are distributed at equal angles around the circle center on the top of the turntable along the circumferential direction, and four strip-shaped guide grooves matched with the strip-shaped guide blocks are distributed at equal angles around the circle center on the bottom of the sucker along the circumferential direction;
The strip-shaped guide block penetrates through the turntable and is provided with a driving shaft, and the driving shaft is movably arranged at the top of the cam ring.
2. The ultrasonic wafer cutting system capable of preventing edge breakage is characterized in that a screw is arranged on a base in a rotating mode along the Z-axis direction, a sliding rail and a sliding groove are formed in the base in the Z-axis direction, a motor is arranged on the base, the output end of the motor is connected with the screw, the sliding seat is arranged on the sliding rail in a sliding mode, the vibrating seat is arranged on the sliding groove in a sliding mode, and a nut in threaded connection with the screw is arranged on the vibrating seat.
3. The ultrasonic wafer cutting system for preventing edge breakage of the wafer cutting system of claim 1, wherein the first vibration assembly comprises a first piezoelectric actuator and a first driving block arranged at the top of the first piezoelectric actuator, the output end of the first piezoelectric actuator is connected with the first driving block, and the first piezoelectric actuator is used for driving the first driving block to perform lifting movement;
the first piezoelectric actuator is arranged in the vibration seat, a channel is arranged on the top of the first driving block in a penetrating mode, a conducting piece is arranged on the top of the sliding seat, and the conducting piece is arranged on the top of the channel in a building mode.
4. The edge collapse prevention ultrasonic wafer cutting system is characterized in that a sliding block is movably arranged in a vibrating seat along the Y-axis direction, a first inclined surface is arranged on the first driving block, a second inclined surface matched with the first inclined surface is arranged at one end of the sliding block, an elastic friction block used for abutting against a base is arranged at the other end of the sliding block after the sliding block penetrates through the vibrating seat, an abutting spring is arranged between the sliding block and the vibrating seat, and the abutting spring is used for driving the second inclined surface to abut against the first inclined surface.
5. The ultrasonic wafer cutting system capable of preventing edge breakage as set forth in claim 1, wherein the cutting assembly comprises a main shaft arranged on the sliding seat and a blade connected with the main shaft, and the axis of the blade and the axis of the main shaft are arranged along the Y-axis direction.
6. The ultrasonic wafer cutting system capable of preventing edge breakage as claimed in claim 1 is characterized in that the Y-axis sliding table and the X-axis sliding table are both linear motors, and the base is provided with a detection camera at the top of the cutting assembly.
7. A wafer cutting method based on the edge breakage prevention ultrasonic wafer cutting system as set forth in claim 1 is characterized by comprising the following steps:
S1, fixedly placing a wafer at the center of a sucker;
Step S2, moving the cutting assembly to a first height position;
s3, starting a first vibration assembly to enable the cutting assembly to vibrate up and down in the Z-axis direction, and then starting an X-axis sliding table to cut the wafer for the first time;
s4, stopping the first vibration assembly, starting the second vibration assembly to enable the sucker to vibrate back and forth in the Y-axis direction, and then starting the X-axis sliding table to cut the wafer for the second time;
S5, stopping the first vibration assembly and the second vibration assembly, descending the cutting assembly to a second height position, starting the X-axis sliding table, and performing third cutting on the wafer;
s6, starting a Y-axis sliding table, driving a cutting assembly to move in the Y-axis direction, and repeating the steps S2-S5 until all the wafers are cut;
s7, rotating the sucker by 90 degrees;
And S8, repeating the steps S2-S6 until all the wafers are cut in the X-axis direction and cut in the Y-axis direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411396606.1A CN118893721B (en) | 2024-10-09 | 2024-10-09 | Edge breakage prevention ultrasonic wafer cutting system and wafer cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411396606.1A CN118893721B (en) | 2024-10-09 | 2024-10-09 | Edge breakage prevention ultrasonic wafer cutting system and wafer cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118893721A CN118893721A (en) | 2024-11-05 |
| CN118893721B true CN118893721B (en) | 2024-12-13 |
Family
ID=93265094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411396606.1A Active CN118893721B (en) | 2024-10-09 | 2024-10-09 | Edge breakage prevention ultrasonic wafer cutting system and wafer cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118893721B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6250188B1 (en) * | 1999-01-21 | 2001-06-26 | Ultex Corporation | Ultrasonic vibration cutting method and apparatus |
| CN112405125A (en) * | 2020-11-17 | 2021-02-26 | 武汉理工大学 | Ultrasonic auxiliary grinding device and grinding method for modified carbon fiber composite material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6223237B2 (en) * | 2014-03-07 | 2017-11-01 | 株式会社ディスコ | Cutting equipment |
| JP2022178122A (en) * | 2021-05-19 | 2022-12-02 | 株式会社荏原製作所 | Ultrasonic cutting device |
| CN118664477A (en) * | 2024-07-11 | 2024-09-20 | 吉林大学 | Dual auxiliary wafer cutting equipment combining laser and ultrasound |
-
2024
- 2024-10-09 CN CN202411396606.1A patent/CN118893721B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6250188B1 (en) * | 1999-01-21 | 2001-06-26 | Ultex Corporation | Ultrasonic vibration cutting method and apparatus |
| CN112405125A (en) * | 2020-11-17 | 2021-02-26 | 武汉理工大学 | Ultrasonic auxiliary grinding device and grinding method for modified carbon fiber composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118893721A (en) | 2024-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2011052267A1 (en) | Polishing device for polygonal column member, and method for polishing same | |
| CN109659253B (en) | Plate-like object dividing device | |
| JP5112703B2 (en) | Wafer chamfering method and apparatus | |
| JPH09216152A (en) | End face grinding device and end face grinding method | |
| JP5313018B2 (en) | Wafer processing method | |
| CN118893721B (en) | Edge breakage prevention ultrasonic wafer cutting system and wafer cutting method | |
| CN116072513A (en) | Substrate manufacturing method | |
| TW202317823A (en) | Method of manufacturing monocrystalline silicon substrate | |
| CN110682007A (en) | Cutting device for chip processing | |
| US20180366371A1 (en) | Method of cutting workpiece | |
| CN112208013B (en) | Dressing method | |
| JP2004148487A (en) | Polishing method, and polishing apparatus used in the same method | |
| JP6486785B2 (en) | End face correction jig and end face correction method | |
| CN109605168B (en) | Processing system of large-diameter optical element | |
| JP2010245253A (en) | Method of processing wafer | |
| JPH0423432A (en) | Method and apparatus for cutting single-crystal ingot by inner-peripheral edge slicer | |
| WO2021024501A1 (en) | Glass plate processing device | |
| US20230234169A1 (en) | Manufacturing method of single-crystal silicon substrate | |
| CN220880951U (en) | Laser cutting device for wafer | |
| JPH0679717A (en) | Method and apparatus for slicing semiconductor wafer | |
| US20230364716A1 (en) | Manufacturing method of substrate | |
| CN220358057U (en) | Wafer wax pasting mechanism | |
| JP2009023044A (en) | Chuck table mechanism | |
| CN221313620U (en) | Ceramic blank edging device | |
| JP4650678B2 (en) | Truing method of chamfering grindstone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |