CN118893721A - Anti-edge chipping ultrasonic wafer cutting system and wafer cutting method - Google Patents

Abstract

The invention relates to the technical field of wafer cutting, in particular to an edge breakage prevention ultrasonic wafer cutting system and a wafer cutting method, comprising a base; the base is provided with a Y-axis sliding table along the Y-axis direction; the Y-axis sliding table is provided with an X-axis sliding table; the X-axis sliding table is provided with a base; the base is provided with a sliding seat and a vibrating seat; the vibration seat is provided with a first vibration component; the base is provided with a fixed table; the fixed table is provided with a sucker; the fixed table is internally provided with a second vibration component. According to the invention, the first vibration component is arranged between the base and the cutting component, so that the blade is driven to vibrate slightly along the Z-axis direction in the cutting process; a second vibration assembly is arranged between the fixed table and the sucker, so that the wafer can be driven to vibrate slightly along the Y-axis direction in the cutting process; micro-vibration cutting of the blade in the depth direction and the width direction along the wafer cutting path is realized through micro-vibration in two directions, so that the stress of the blade on the wafer in the cutting process is reduced, and edge breakage and cracking in the wafer cutting process are prevented.

Description

Anti-edge chipping ultrasonic wafer cutting system and wafer cutting method

Technical Field

The present invention relates to the technical field of wafer cutting, and in particular to an anti-edge collapse ultrasonic wafer cutting system and a wafer cutting method.

Background Art

In the semiconductor chip manufacturing process, after the integrated circuit is produced on the wafer, it is necessary to cut the wafer into multiple wafer dies according to a predetermined path; currently, the wafer cutting machine mainly cuts the wafer by rotating the blade and using the diamond abrasives on the blade.

Since the blade is in continuous contact with the wafer, the diamond abrasives are easily blunted due to the chips wrapping around them, resulting in a decrease in cutting efficiency. In addition, the extrusion stress between the diamond abrasives and the cutting path is large, which can easily cause cracks or even edge collapse on the side walls of the wafer cutting path during the cutting process. In order to ensure the cutting quality, the cutting speed has to be reduced, which limits the improvement of wafer cutting quality and efficiency.

Summary of the invention

The purpose of the present invention is to provide an anti-chipping ultrasonic wafer cutting system and a wafer cutting method in view of the above-mentioned deficiencies in the prior art.

The object of the present invention is achieved through the following technical solutions: an anti-chipping ultrasonic wafer cutting system, comprising a base; the base is provided with a Y-axis slide along the Y-axis direction; the output end of the Y-axis slide is provided with an X-axis slide; the output end of the X-axis slide is provided with a base; the base is provided with a sliding seat and a vibration seat for lifting and lowering along the Z-axis direction; the sliding seat is provided with a cutting component; the vibration seat is provided with a first vibration component for driving the sliding seat to vibrate in the Z-axis direction;

The base is provided with a fixed platform; a suction cup is rotatably provided on the top of the fixed platform; a second vibration component for driving the suction cup to vibrate in the Y-axis direction is provided inside the fixed platform.

The present invention is further configured as follows: the base is provided with a screw that rotates along the Z-axis direction; the base is provided with a slide rail and a slide groove along the Z-axis direction; the base is provided with a motor; the output end of the motor is connected to the screw; the sliding seat is slidably arranged on the slide rail; the vibration seat is slidably arranged on the slide groove; the vibration seat is provided with a nut threadedly connected to the screw.

The present invention is further configured such that the first vibration component includes a first piezoelectric actuator and a first driving block disposed on the top of the first piezoelectric actuator; the output end of the first piezoelectric actuator is connected to the first driving block, and the first piezoelectric actuator is used to drive the first driving block to perform lifting activities;

The first piezoelectric actuator is arranged in the vibration seat; a channel is provided through the top of the first driving block of the vibration seat; a conductive member is provided on the top of the sliding seat; and the conductive member is mounted on the top of the channel.

The present invention is further configured as follows: a sliding block is provided inside the vibration seat and is movable along the Y-axis direction; the first driving block is provided with a first inclined surface; one end of the sliding block is provided with a second inclined surface that cooperates with the first inclined surface; the other end of the sliding block passes through the vibration seat and is provided with an elastic friction block for abutting against the base; a supporting spring is provided between the sliding block and the vibration seat; the supporting spring is used to drive the second inclined surface to abut against the first inclined surface.

The present invention is further configured such that a cavity is opened in the middle of the fixed platform; the second vibration component includes a bracket arranged in the cavity, a second piezoelectric actuator arranged on the top of the bracket, and a second driving block arranged at the output end of the second piezoelectric actuator; the second piezoelectric actuator is used to drive the second driving block to move along the Y-axis direction; and the middle part of the suction cup is rotatably connected to the second driving block.

The present invention is further configured such that the fixed platform is rotatably provided with a turntable; and the suction cup is arranged on the top of the turntable.

The present invention is further configured such that the fixed platform is provided with a cam ring; the cam ring is provided with a first protrusion and a second protrusion; the first protrusion, the second protrusion, the second piezoelectric actuator and the second driving block are all arranged on the same straight line arranged along the Y-axis direction; the top of the turntable is provided with four strip guide blocks distributed at equal angles along the circumferential direction around the center of the circle; the bottom of the suction cup is provided with four strip guide grooves matched with the strip guide blocks distributed at equal angles along the circumferential direction around the center of the circle;

A return spring is arranged between the strip guide block and the bottom of the suction cup; a driving shaft is arranged after the strip guide block passes through the rotating disk; and the driving shaft is movably arranged on the top of the cam ring.

The present invention is further configured such that the cutting assembly comprises a main shaft arranged on a sliding seat and a blade connected to the main shaft; the axis of the blade and the axis of the main shaft are both arranged along the Y-axis direction.

The present invention is further configured such that the Y-axis slide and the X-axis slide are both linear motors; and the base is provided with a detection camera at the top of the cutting assembly.

A wafer cutting method comprises the following steps:

Step S1, fixing the wafer at the center of the suction cup;

Step S2, moving the cutting assembly to a first height position;

Step S3, starting the first vibration component to make the cutting component vibrate up and down in the Z-axis direction, and then starting the X-axis slide to perform the first cutting on the wafer;

Step S4, stop the first vibration component, start the second vibration component, so that the suction cup vibrates back and forth in the Y-axis direction, and then start the X-axis slide to perform a second cut on the wafer;

Step S5, stop the first vibration assembly and the second vibration assembly, lower the cutting assembly to a second height position, and then start the X-axis slide to perform a third cutting on the wafer;

Step S6, start the Y-axis slide to drive the cutting assembly to move in the Y-axis direction, and then repeat steps S2 to S5 until all wafers are cut;

Step S7, rotating the suction cup 90 degrees;

Step S8, repeating steps S2 to S6 until all wafers have completed cutting in the X-axis direction and the Y-axis direction.

Beneficial effects of the present invention: The present invention sets a first vibration component between the base and the cutting component to drive the blade to perform micro-vibration along the Z-axis direction during the cutting process; sets a second vibration component between the fixed table and the suction cup to drive the wafer to perform micro-vibration along the Y-axis direction during the cutting process; through micro-vibration in two directions, micro-vibration cutting of the blade along the depth direction and width direction of the wafer cutting road is achieved, so as to reduce the stress generated by the blade on the wafer during the cutting process and prevent edge collapse and cracking during the wafer cutting process.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

Fig. 1 is a schematic structural diagram of the present invention;

Fig. 2 is a cross-sectional view of the present invention;

FIG3 is a partial enlarged view of the portion A in FIG2 ;

FIG4 is a partial enlarged view of the portion B in FIG2 ;

FIG5 is a schematic diagram of the structure of the base, the cutting assembly and the first vibration assembly of the present invention;

FIG6 is a cross-sectional view of a first vibration assembly of the present invention;

7 is a schematic diagram of the structure of the fixed table, the turntable and the suction cup of the present invention;

FIG8 is an exploded view of the structure of the fixed table, the turntable and the suction cup of the present invention;

FIG9 is an exploded view of the fixing table, the turntable and the suction cup according to the present invention from another perspective;

Among them: 1. base; 11. Y-axis slide; 12. X-axis slide; 2. base; 21. screw; 22. slide rail; 23. slide groove; 24. motor; 25. nut; 26. detection camera; 3. sliding seat; 31. conductive part; 32. main shaft; 33. blade; 4. vibration seat; 41. first piezoelectric actuator; 42. first drive block; 43. first inclined surface; 44. channel; 5. sliding block; 51. second inclined surface; 52. elastic friction block; 53. abutting spring; 6. fixed table; 61. cavity; 62. bracket; 63. second piezoelectric actuator; 64. second drive block; 7. suction cup; 71. strip guide groove; 8. turntable; 81. strip guide block; 82. reset spring; 83. drive shaft; 9. cam ring; 91. first protrusion; 92. second protrusion.

DETAILED DESCRIPTION

The present invention is further described in conjunction with the following examples.

As shown in Figures 1 to 9, the chipping-proof ultrasonic wafer cutting system described in this embodiment includes a base 1; the base 1 is provided with a Y-axis slide 11 along the Y-axis direction; the output end of the Y-axis slide 11 is provided with an X-axis slide 12; the output end of the X-axis slide 12 is provided with a base 2; the base 2 is provided with a sliding seat 3 and a vibration seat 4 for lifting and lowering along the Z-axis direction; the sliding seat 3 is provided with a cutting assembly; the vibration seat 4 is provided with a first vibration assembly for driving the sliding seat 3 to vibrate in the Z-axis direction; the base 1 is provided with a fixed table 6; the top of the fixed table 6 is provided with a suction cup 7 for rotation; the fixed table 6 is provided with a second vibration assembly for driving the suction cup 7 to vibrate in the Y-axis direction. The chipping-proof ultrasonic wafer cutting system described in this embodiment, the cutting assembly includes a main shaft 32 provided on the sliding seat 3 and a blade 33 connected to the main shaft 32; the axis of the blade 33 and the axis of the main shaft 32 are both provided along the Y-axis direction. In the anti-chipping ultrasonic wafer cutting system described in this embodiment, the Y-axis slide 11 and the X-axis slide 12 are both linear motors 24; the base 2 is provided with a detection camera 26 on the top of the cutting component.

Specifically, when using the anti-collapse ultrasonic wafer cutting system described in this embodiment, the wafer to be cut is first fixedly placed at the center position of the suction cup 7. After completion, the Y-axis slide 11 and the X-axis slide 12 move the detection camera 26 to the top of the wafer to be cut to detect whether the placement position and direction of the wafer to be cut are accurate, and whether there are scratches on the surface of the wafer; if the wafer is placed in the wrong position, it is adjusted manually; if there are scratches on the surface of the wafer, it is notified to replace it manually.

Then the blade 33 is moved to a first height position. When the blade 33 is at the first height position, it is unable to completely cut through the wafer. Then the first vibration component is started to make the blade 33 vibrate up and down in the Z-axis direction. Then the X-axis slide 12 is started to make the first cut on the cut wafer. The amplitude of the blade 33 can be controlled by controlling the pulse input voltage of the first vibration component. After the first cut is completed, the blade 33 can make the first cut on the wafer along a predetermined trajectory while vibrating in the Z-axis direction, so that the bottom of the cutting path is slightly wavy. During the cutting process, the reciprocating vibration of the blade 33 in the Z-axis direction can reduce the extrusion of the blade 33 on the cutting path in the Z-axis direction on the one hand, and can also separate the chips attached to the blade 33 from the blade 33 through micro-vibration on the other hand, thereby reducing the passivation of abrasive particles, preventing the wafer from collapsing, and improving the life of the blade 33.

Then, the first vibration component is stopped, and the second vibration component is started, so that the suction cup 7 performs reciprocating micro-vibration in the Y-axis direction, and then the X-axis slide 12 is started to drive the blade 33 to perform a second cut on the cutting path along the last cutting trajectory; the second cutting cuts the bottom of the cutting path flat, and forms a micro-wavy shape on the two side walls of the cutting path; because the bottom of the cutting path is wavy, the blade 33 performs intermittent cutting during the second cutting process, which improves the passivation of the abrasive particles and reduces the cutting pin stress in the Z-axis direction; at the same time, the micro-vibration in the Y-axis direction expands the width of the cutting path, making it easier for the cutting fluid to cool the cutting path and the blade 33 and flush the abrasive particles in the cutting path during the cutting process, further improving the passivation of the abrasive particles;

Then, the first vibration assembly and the second vibration assembly are stopped, and the cutting assembly is lowered to the second height position. When the blade 33 is at the second height position, the wafer can be completely cut through. Then, the X-axis slide table 12 is started to perform a third cut on the cut wafer, thereby cutting through the wafer and completing the cutting of the cutting path.

Then the cutter is moved by the Y-axis slide 11, and the above operation is repeated, so that all wafers are cut in the X-axis direction;

After all wafers are cut in the X-axis direction, the suction cup 7 is rotated 90 degrees and the above steps are repeated, so that all wafers are cut in the Y-axis direction, thereby obtaining square wafer dies.

In this embodiment, a first vibration component is set between the base 2 and the cutting component to drive the blade 33 to micro-vibrate along the Z-axis direction during the cutting process; a second vibration component is set between the fixed table 6 and the suction cup 7 to drive the wafer to micro-vibrate along the Y-axis direction during the cutting process; through micro-vibration in two directions, micro-vibration cutting of the blade 33 along the depth direction and width direction of the wafer cutting road is achieved, so as to reduce the stress generated by the blade 33 on the wafer during the cutting process, and prevent edge collapse and cracking during the wafer cutting process.

The present embodiment describes an anti-chipping ultrasonic wafer cutting system, wherein the base 2 is provided with a screw 21 that rotates along the Z-axis direction; the base 2 is provided with a slide rail 22 and a slide groove 23 along the Z-axis direction; the base 2 is provided with a motor 24; the output end of the motor 24 is connected to the screw 21; the sliding seat 3 is slidably arranged on the slide rail 22; the vibration seat 4 is slidably arranged on the slide groove 23; the vibration seat 4 is provided with a nut 25 threadedly connected to the screw 21.

Specifically, in this embodiment, by starting the motor 24, when the motor 24 drives the screw rod 21 to rotate, the nut 25 is threadedly connected to the screw rod 21, so that the vibration seat 4 is lifted and lowered along the slide groove 23, and since the sliding seat 3 is mounted on the top of the vibration seat 4 through the conductive member 31, the sliding seat 3 can follow the vibration seat 4 to be lifted and lowered along the slide rail 22, so that the height of the blade 33 can be adjusted.

The present embodiment describes an anti-chipping ultrasonic wafer cutting system, wherein the first vibration component includes a first piezoelectric actuator 41 and a first driving block 42 arranged on the top of the first piezoelectric actuator 41; the output end of the first piezoelectric actuator 41 is connected to the first driving block 42, and the first piezoelectric actuator 41 is used to drive the first driving block 42 to perform lifting activities; the first piezoelectric actuator 41 is arranged in a vibration seat 4; the vibration seat 4 is provided with a channel 44 at the top of the first driving block 42; the top of the sliding seat 3 is provided with a conductive member 31; the conductive member 31 is mounted on the top of the channel 44.

Specifically, when the blade 33 needs to vibrate up and down in the Z-axis direction, a pulse voltage is input to the first piezoelectric actuator 41, so that the first drive block 42 is continuously raised and lowered, and after the first drive block 42 protrudes out of the channel 44, the first drive block 42 abuts against the conductive member 31, thereby driving the blade 33 to continuously vibrate up and down.

In the present embodiment, an anti-collapse ultrasonic wafer cutting system is provided with a sliding block 5 that can move along the Y-axis direction in the vibration seat 4; the first driving block 42 is provided with a first inclined surface 43; one end of the sliding block 5 is provided with a second inclined surface 51 that cooperates with the first inclined surface 43; the other end of the sliding block 5 passes through the vibration seat 4 and is provided with an elastic friction block 52 for abutting against the base 2; a supporting spring 53 is provided between the sliding block 5 and the vibration seat 4; the supporting spring 53 is used to drive the second inclined surface 51 to abut against the first inclined surface 43.

Specifically, the anti-collapse ultrasonic wafer cutting system described in this embodiment provides voltage to the first piezoelectric actuator 41, thereby causing the first driving block 42 to rise. Under the action of the first inclined surface 43 and the second inclined surface 51, the rise of the first driving block 42 can push the elastic friction block 52 to move toward the base 2, thereby causing the elastic friction block 52 to abut against the base 2. The first piezoelectric actuator 41 drives the elastic friction block 52 to lock the vibration seat 4, so that the vibration load can be directly transmitted to the base 2. On the one hand, it can prevent the vibration load from being transmitted to the screw 21 and affecting the transmission accuracy of the screw 21; on the other hand, the cutter is in a locked state during the cutting process, which can improve the cutting stability.

In the embodiment of the present invention, a chipping-proof ultrasonic wafer cutting system is provided with a cavity 61 in the middle of the fixed platform 6; the second vibration assembly includes a bracket 62 arranged in the cavity 61, a second piezoelectric actuator 63 arranged on the top of the bracket 62, and a second driving block 64 arranged at the output end of the second piezoelectric actuator 63; the second piezoelectric actuator 63 is used to drive the second driving block 64 to move along the Y-axis direction; the middle of the suction cup 7 is rotatably connected to the second driving block 64. Specifically, through the above-mentioned configuration, by controlling the pulse input voltage of the second vibration assembly, the second piezoelectric actuator 63 drives the second driving block 64 to vibrate back and forth along the Y-axis direction.

In the present embodiment, a chipping-proof ultrasonic wafer cutting system is provided with a rotating turntable 8 on the fixed table 6; the suction cup 7 is arranged on the top of the turntable 8. In the present embodiment, a chipping-proof ultrasonic wafer cutting system is provided with a cam ring 9 on the fixed table 6; the cam ring 9 is provided with a first protrusion 91 and a second protrusion 92; the first protrusion 91, the second protrusion 92, the second piezoelectric actuator 63 and the second driving block 64 are all arranged on the same straight line arranged along the Y-axis direction; the top of the turntable 8 is provided with four strip guide blocks 81 distributed at equal angles along the circumference around the center of the circle; the bottom of the suction cup 7 is provided with four strip guide grooves 71 cooperating with the strip guide blocks 81 distributed at equal angles along the circumference around the center of the circle; a reset spring 82 is arranged between the strip guide block 81 and the bottom of the suction cup 7; the strip guide block 81 is provided with a driving shaft 83 after passing through the turntable 8; the driving shaft 83 is movably arranged on the top of the cam ring 9.

Specifically, through the above-mentioned arrangement, in this embodiment, when the turntable 8 is rotating, under the action of the return spring 82, the drive shaft 83 can move close to the top surface of the cam ring 9, and when the drive shaft 83 moves in the area outside the first protrusion 91 and the second protrusion 92, the height of the strip guide block 81 is too low to be clamped with the strip guide groove 71, until the turntable 8 completes a 90-degree rotation, and two of the drive shafts 83 move onto the first protrusion 91 and the second protrusion 92, so that the strip guide blocks 81 corresponding to the two drive shafts 83 rise and are clamped with two of the strip guide grooves 71, thereby keeping the turntable 8 vibrating back and forth in the Y-axis direction.

A wafer cutting method comprises the following steps:

Step S1, fix the wafer at the center of the suction cup 7;

Step S2, moving the cutting assembly to a first height position;

Step S3, start the first vibration component to make the cutting component vibrate up and down in the Z-axis direction, and then start the X-axis slide 12 to perform the first cutting on the wafer;

Step S4, stop the first vibration component, start the second vibration component, so that the suction cup 7 vibrates back and forth in the Y-axis direction, and then start the X-axis slide 12 to perform a second cutting on the wafer;

Step S5, stop the first vibration assembly and the second vibration assembly, lower the cutting assembly to a second height position, and then start the X-axis slide table 12 to perform a third cutting on the wafer;

Step S6, start the Y-axis slide 11 to drive the cutting assembly to move in the Y-axis direction, and then repeat steps S2 to S5 until all wafers are cut;

Step S7, rotating the suction cup 7 by 90 degrees;

Step S8, repeating steps S2 to S6 until all wafers have completed cutting in the X-axis direction and the Y-axis direction.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims (10)

1. An anti-edge breakage ultrasonic wafer cutting system is characterized in that: comprises a base; the base is provided with a Y-axis sliding table along the Y-axis direction; an X-axis sliding table is arranged at the output end of the Y-axis sliding table; the output end of the X-axis sliding table is provided with a base; the base is movably provided with a sliding seat and a vibrating seat in a lifting manner along the Z-axis direction; the sliding seat is provided with a cutting assembly; the vibration seat is provided with a first vibration component for driving the sliding seat to vibrate in the Z-axis direction;

The base is provided with a fixed table; the top of the fixed table is rotationally provided with a sucker; the fixed table is internally provided with a second vibration component for driving the sucker to vibrate in the Y-axis direction.

2. The edge chipping prevention ultrasonic wafer dicing system of claim 1, wherein: the base is provided with a screw rod in a rotating mode along the Z-axis direction; the base is provided with a sliding rail and a sliding groove along the Z-axis direction; the base is provided with a motor; the output end of the motor is connected with the screw; the sliding seat is arranged on the sliding rail in a sliding way; the vibration seat is arranged on the chute in a sliding manner; the vibration seat is provided with a nut in threaded connection with the screw rod.

3. The edge chipping prevention ultrasonic wafer dicing system of claim 1, wherein: the first vibration component comprises a first piezoelectric actuator and a first driving block arranged at the top of the first piezoelectric actuator; the output end of the first piezoelectric actuator is connected with the first driving block, and the first piezoelectric actuator is used for driving the first driving block to perform lifting movement;

The first piezoelectric actuator is arranged in the vibration seat; the vibration seat is provided with a channel in a penetrating way at the top of the first driving block; the top of the sliding seat is provided with a conducting piece; the conductive member is erected on top of the channel.

4. A shatter prevention ultrasonic wafer dicing system according to claim 3, wherein: a sliding block is movably arranged in the vibration seat along the Y-axis direction; the first driving block is provided with a first inclined plane; one end of the sliding block is provided with a second inclined plane matched with the first inclined plane; the other end of the sliding block penetrates through the vibration seat and is provided with an elastic friction block for abutting against the base; an abutting spring is arranged between the sliding block and the vibration seat; the abutting spring is used for driving the second inclined plane to abut against the first inclined plane.

5. The edge chipping prevention ultrasonic wafer dicing system of claim 1, wherein: a cavity is formed in the middle of the fixed table; the second vibration component comprises a bracket arranged in the cavity, a second piezoelectric actuator arranged at the top of the bracket and a second driving block arranged at the output end of the second piezoelectric actuator; the second piezoelectric actuator is used for driving the second driving block to move along the Y-axis direction; the middle part of sucking disc is connected with the second drive piece rotation.

6. The edge chipping prevention ultrasonic wafer cutting system of claim 5 wherein: the fixed table is rotationally provided with a turntable; the sucking disc is arranged at the top of the turntable.

7. The edge chipping prevention ultrasonic wafer cutting system of claim 6 wherein: the fixed table is provided with a cam ring; the cam ring is provided with a first protruding part and a second protruding part; the first bulge part, the second piezoelectric actuator and the second driving block are all arranged on the same straight line along the Y-axis direction; four strip-shaped guide blocks are distributed on the top of the turntable around the circle center at equal angles along the circumferential direction; four strip-shaped guide grooves matched with the strip-shaped guide blocks are distributed at equal angles around the circle center at the bottom of the sucker along the circumferential direction;

A reset spring is arranged between the strip-shaped guide block and the bottom of the sucker; the strip-shaped guide block penetrates through the turntable and is provided with a driving shaft; the driving shaft is movably arranged at the top of the cam ring.

8. The edge chipping prevention ultrasonic wafer dicing system of claim 1, wherein: the cutting assembly comprises a main shaft arranged on the sliding seat and a blade connected with the main shaft; the axis of the blade and the axis of the main shaft are arranged along the Y-axis direction.

9. The edge chipping prevention ultrasonic wafer dicing system of claim 1, wherein: the Y-axis sliding table and the X-axis sliding table are linear motors; the base is provided with a detection camera at the top of the cutting assembly.

10. A wafer dicing method based on the edge chipping prevention ultrasonic wafer dicing system according to claim 1, characterized in that: the method comprises the following steps:

s1, fixedly placing a wafer at the center of a sucker;

Step S2, moving the cutting assembly to a first height position;

S3, starting a first vibration assembly to enable the cutting assembly to vibrate up and down in the Z-axis direction, and then starting an X-axis sliding table to cut the wafer for the first time;

S4, stopping the first vibration assembly, starting the second vibration assembly to enable the sucker to vibrate back and forth in the Y-axis direction, and then starting the X-axis sliding table to cut the wafer for the second time;

s5, stopping the first vibration assembly and the second vibration assembly, descending the cutting assembly to a second height position, starting the X-axis sliding table, and performing third cutting on the wafer;

s6, starting a Y-axis sliding table, driving a cutting assembly to move in the Y-axis direction, and repeating the steps S2-S5 until all the wafers are cut;

S7, rotating the sucker by 90 degrees;

And S8, repeating the steps S2-S6 until all the wafers are cut in the X-axis direction and cut in the Y-axis direction.