CN110682007A

CN110682007A - Cutting device for chip processing

Info

Publication number: CN110682007A
Application number: CN201910860297.1A
Authority: CN
Inventors: 嵇群群; 孙永武
Original assignee: Wuhu Derui Electronic Technology Co Ltd
Current assignee: Qianhai jingfangyun (Shenzhen) test equipment Co.,Ltd.
Priority date: 2019-09-11
Filing date: 2019-09-11
Publication date: 2020-01-14
Anticipated expiration: 2039-09-11
Also published as: CN110682007B

Abstract

The invention discloses a cutting device for chip processing, which comprises a frame, wherein a displacement adjusting assembly is arranged on the frame, a rotary driving assembly is arranged at the upper part of the displacement adjusting assembly, a placing table is arranged at the upper part of the rotary driving assembly, an adsorption assembly is arranged in the placing table, a lifting assembly is arranged at one side of the frame, a combined cutting assembly is arranged at the upper part of the lifting assembly, the combined cutting assembly comprises a laser cutting head and a grinding wheel cutting head, the laser cutting head and the grinding wheel cutting head are positioned at the upper part of the placing table, the chip is fixed during cutting through the arrangement of the adsorption assembly, the dislocation during chip cutting is avoided, the rotary driving assembly drives the placing table to rotate for 90 degrees, the cutting precision of the chip is ensured, and the laser cutting head and the grinding wheel cutting head on the combined cutting assembly are positioned at the same position when being switched, the deviation of the alignment of the grinding wheel cutting head and the wire groove is ensured.

Description

Cutting device for chip processing

Technical Field

The invention relates to the technical field of chip processing, in particular to a cutting device for chip processing.

Background

Wafer chips are the basic material for manufacturing semiconductor chips, and various circuit element structures can be manufactured on the wafer chips to become IC products with specific electrical functions.

At present, the cutting mode of the wafer chip is mainly divided into two types, one is cutting by adopting a diamond grinding wheel, and the other is cutting by adopting laser. However, when the diamond grinding wheel is used for cutting, the sharp and high-hardness diamond particles protruding from the surface of the diamond grinding wheel shovel and dig the cutting part of the wafer chip, and when the shoveling and digging type mechanical force is directly applied to the surface of the wafer chip, stress damage can be caused to the inside of the wafer chip, so that the surface and the back of the wafer chip are cracked in the cutting process, and the problem of low yield exists. The laser cutting is to irradiate the workpiece by using the focused high-power-density laser beam, so that the irradiated material is rapidly melted, vaporized and ablated or reaches a burning point, and the workpiece is cut off.

According to the characteristics of the two cutting modes, a cutting method combining laser and a grinding wheel sheet is developed, but the cutting operation mode of aligning the cutting knives with the linear grooves one by one is time-consuming, and when the cutting operation is carried out, if the deviation condition of the alignment precision exists between the cutting knives and the linear grooves, the loss condition of a large number of defective products can be relatively caused.

Disclosure of Invention

In view of the above, the present invention is directed to a cutting apparatus for chip processing, which solves one or all of the above problems.

Based on the above purpose, the cutting device for chip processing provided by the invention comprises a frame, wherein a displacement adjusting assembly is mounted on the frame, a rotary driving assembly is mounted on the upper portion of the displacement adjusting assembly, a placing table is mounted on the upper portion of the rotary driving assembly, the rotary driving assembly drives the placing table to rotate for 90 degrees, an adsorption assembly is arranged in the placing table, a lifting assembly is mounted on one side of the frame, a combined cutting assembly is mounted on the upper portion of the lifting assembly, the combined cutting assembly comprises a laser cutting head and a grinding wheel cutting head, and the laser cutting head and the grinding wheel cutting head are located on the upper portion of the placing table.

Optionally, the displacement adjustment assembly includes an X-axis moving stage, the X-axis moving stage is slidably mounted on the frame, a first lead screw is mounted in the X-axis moving stage in a threaded connection manner, the first lead screw penetrates through the X-axis moving stage and is rotatably mounted on the frame, a first motor is mounted at one end of the first lead screw, and the first motor drives the first lead screw to rotate; the upper portion slidable of X axle mobile station installs Y axle mobile station, the slip direction of Y axle mobile station with the slip direction of X axle mobile station is mutually perpendicular, install the second lead screw through threaded connection's mode in the Y axle mobile station, the second lead screw runs through Y axle mobile station, and rotatable the installing on the X axle mobile station, the second motor is installed to the one end of second lead screw, the second motor drives the second lead screw rotates.

Optionally, the rotation driving assembly includes driving motor, driving motor installs along vertical direction the upper portion of Y axle mobile station, the driving-disc is installed to driving motor's output, the cooperation chamber is installed on driving motor's upper portion, the driving-disc is in cooperation intracavity rotatable coupling, 4 mating holes have been seted up to the periphery equipartition of driving-disc, the slip hole has been seted up on the lateral wall in cooperation chamber, the slip hole with the mating hole is corresponding, sliding mounting has the ball in the slip hole, the slip hole is kept away from the end cover is installed to the one end of driving-disc, the ball with install the spring between the end cover.

Optionally, the diameter of the sliding hole is larger than the diameter of the fitting hole.

Optionally, the adsorption component comprises a plurality of suckers, the suckers are installed on the upper surface of the placement table and arranged in a rectangular array, and the suckers are communicated with an external vacuum source.

Optionally, the suction cups are slidably mounted on the placing table, and adjacent suction cups can move close to or away from each other along the X-axis direction and the Y-axis direction.

Optionally, the lifting assembly includes a sliding rod, the sliding rod is installed along the vertical direction in the rack, a sliding cavity has been seted up on the upper portion of sliding rod, the combination cutting assembly is slidably installed in the sliding cavity, a lifting electric cylinder is installed to one side of sliding rod, the output end of lifting electric cylinder with the combination cutting assembly is connected, drives the combination cutting assembly edge the sliding cavity slides.

Optionally, the combined cutting assembly includes a support frame, a third motor is installed on the upper portion of the support frame along the horizontal direction, a rotating block is installed at an output end of the third motor, and the laser cutting head and the grinding wheel cutting head are installed at two ends of the rotating block respectively along the vertical direction.

From the above, the cutting device for chip processing provided by the invention fixes the chip during cutting through the arrangement of the adsorption component, so that dislocation during chip cutting is avoided, the rotary driving component drives the placing table to rotate for 90 degrees, the chip cutting precision is ensured, the laser cutting head and the grinding wheel cutting head on the combined cutting component are positioned at the same position during switching, the deviation of alignment of the grinding wheel cutting head and a wire groove is ensured, and the chip cutting yield is further improved.

Drawings

Fig. 1 is a schematic view of a cutting apparatus for chip processing according to an embodiment of the present invention;

FIG. 2 is a schematic view of a connection between a displacement adjustment assembly and a rotation driving assembly according to an embodiment of the present invention;

FIG. 3 is a schematic view of a drive disk of an embodiment of the present invention;

fig. 4 is a schematic view of a sorption assembly according to an embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.

The invention provides a cutting device for chip processing, as an embodiment of the invention, as shown in fig. 1, the cutting device comprises a frame 1, a displacement adjusting assembly 2 is installed on the frame 1, a rotary driving assembly 3 is installed on the upper portion of the displacement adjusting assembly 2, a placing table 4 is installed on the upper portion of the rotary driving assembly 3, the rotary driving assembly 3 drives the placing table 4 to rotate for 90 degrees, an adsorption assembly 5 is arranged in the placing table 4, a lifting assembly 6 is installed on one side of the frame 1, a combined cutting assembly 7 is installed on the upper portion of the lifting assembly 6, the combined cutting assembly 7 comprises a laser cutting head 71 and a grinding wheel cutting head 72, and the laser cutting head 71 and the grinding wheel cutting head 72 are located on the upper portion of the placing table 4. Wherein, a chip to be cut is placed on a placing table 4, an adsorption component 5 carries out vacuum adsorption and fixation on the chip, a laser cutting head 71 of a combined cutting component 7 firstly faces the chip, a lifting component 6 drives the laser cutting head 71 to approach the chip, a displacement adjusting component 2 drives the chip to move along the X-axis or Y-axis direction, so that the laser cutting head 71 firstly marks a linear groove on the chip, a grinding wheel cutting head 72 then faces the chip, the grinding wheel cutting head 72 cuts the chip along the linear groove, when the chip is cut along the X-axis or Y-axis, a rotary driving component 3 drives the placing table 4 to rotate for 90 degrees, the combined cutting component 7 cuts the chip along the Y-axis or X-axis, the chip is fixed during cutting through the arrangement of the adsorption component 5, the dislocation during the cutting of the chip is avoided, the rotary driving component 3 drives the placing table 4 to rotate for 90 degrees, the precision of chip cutting is guaranteed, the laser cutting head 71 and the grinding wheel cutting head 72 on the combined cutting assembly 7 are located at the same position when switched, the deviation of the grinding wheel cutting head 72 aligned with a wire groove is guaranteed, and the yield of chip cutting is improved.

In one embodiment, as shown in fig. 1 and fig. 2, the displacement adjusting assembly 2 includes an X-axis moving stage 21, the X-axis moving stage 21 is slidably mounted on the frame 1, a first lead screw 22 is mounted in the X-axis moving stage 21 by means of a threaded connection, the first lead screw 22 penetrates through the X-axis moving stage 21 and is rotatably mounted on the frame 1, a first motor 23 is mounted at one end of the first lead screw 22, and the first motor 23 drives the first lead screw 22 to rotate; the upper portion slidable of X axle mobile station 21 installs Y axle mobile station 24, the slip direction of Y axle mobile station 24 with the slip direction of X axle mobile station 21 is mutually perpendicular, install second lead screw 25 through threaded connection's mode in the Y axle mobile station 24, second lead screw 25 runs through Y axle mobile station 24, and rotatable the installing on X axle mobile station 21, second motor 26 is installed to the one end of second lead screw 25, second motor 26 drives second lead screw 25 rotates. Wherein, the first motor 23 drives the first screw rod 22 to rotate, and the first screw rod 22 drives the X-axis moving platform 21 to slide on the frame 1 along the X-axis direction through the screw transmission; the second motor 26 drives the second screw rod 25 to rotate, the second screw rod 25 drives the Y-axis moving platform 24 to slide on the X-axis moving platform 21 along the Y-axis direction through screw transmission, and the arrangement can drive the placing platform 4 to move in parallel in the X-axis direction and the Y-axis direction, so that the precision of chip cutting is ensured.

In an embodiment, as shown in fig. 2 and 3, the rotation driving assembly 3 includes a driving motor 31, the driving motor 31 is installed on the upper portion of the Y-axis moving stage 24 along the vertical direction, a driving disc 32 is installed at an output end of the driving motor 31, a matching cavity 33 is installed on the upper portion of the driving motor 31, the driving disc 32 is rotatably connected in the

matching cavity

33, 4 matching holes 34 are evenly distributed on the circumferential surface of the driving disc 32, a sliding hole 35 is formed in a side wall of the matching cavity 33, the sliding hole 35 corresponds to the matching hole 34, a ball 36 is slidably installed in the sliding hole 35, an end cover 37 is installed at one end of the sliding hole 35, which is far away from the driving disc 32, and a spring 38 is installed between the ball 36 and the end cover 37. Wherein, driving motor 31 drives driving-disc 32 and rotates, 4 mating holes 34 have been seted up to the periphery equipartition of driving-disc 32, make every 90 rotatory mating holes 34 of driving-disc 32 just correspond with sliding hole 35, when mating holes 34 and sliding hole 35 correspond, ball 36 just blocks into mating holes 34 under the effect of spring 38 in, driving-disc 32 will block, and send the sound of block, can judge whether driving-disc 32 rotates 90 through this setting, guarantee the precision of chip cutting.

In one embodiment, the diameter of the sliding hole 35 is larger than the diameter of the mating hole 34. Wherein the arrangement is such that the diameter of the ball 36 is larger than the fitting hole 34, preventing the ball 36 from sliding into the slide hole 35.

In one embodiment, as shown in fig. 4, the suction assembly 5 includes a plurality of suction cups 51, the suction cups 51 are mounted on the upper surface of the placing table 4, the suction cups 51 are arranged in a rectangular array, and the suction cups 51 are all communicated with an external vacuum source. The number of the suckers 51 corresponds to the number of the chips to be cut, so that each cut chip can be fixed by the sucker 51, and the chips are prevented from being deviated during cutting.

In another embodiment, the suction cups 51 are slidably mounted on the placing table 4, and adjacent suction cups 51 can move toward or away from each other along the X-axis direction and the Y-axis direction. The position of the chip can be changed by changing the position between the suckers 51, so that the device can be suitable for cutting chips with various specifications.

Optionally, the lifting assembly 6 includes a sliding rod 61, the sliding rod 61 is installed along the vertical direction on the rack 1, a sliding cavity is opened on the upper portion of the sliding rod 61, the combined cutting assembly 7 is installed in the sliding cavity in a slidable manner, a lifting electric cylinder 62 is installed on one side of the sliding rod 61, and an output end of the lifting electric cylinder 62 is connected with the combined cutting assembly 7 to drive the combined cutting assembly 7 to slide along the sliding cavity.

Optionally, the combined cutting assembly 7 includes a supporting frame 73, a third motor 74 is installed on the upper portion of the supporting frame 73 along the horizontal direction, a rotating block 75 is installed at an output end of the third motor 74, and the laser cutting head 71 and the grinding wheel cutting head 72 are respectively installed at two ends of the rotating block 75 along the vertical direction. The output end of the lifting electric cylinder 62 is connected with the support frame 73, the lifting electric cylinder 62 drives the support frame 73 to slide along the sliding cavity, and then drives the laser cutting head 71 or the grinding wheel cutting head 72 to approach the chip, and drives the rotating block 75 to rotate through the third motor 74, so as to drive the laser cutting head 71 and the grinding wheel cutting head 72 to perform position switching.

When the cutting device is used, a chip to be cut is placed on the placing table 4, a vacuum source is connected externally for vacuumizing, so that the sucking disc 51 generates suction force, the sucking disc 51 performs vacuum adsorption and fixation on the chip, the third motor 74 drives the rotating block 75 to rotate, the rotating block 75 drives the laser cutting head 71 to face the chip firstly, the lifting electric cylinder 62 drives the laser cutting head 71 to approach the chip, and the displacement adjusting assembly 2 drives the chip to move along the X axis or the Y axis, so that a linear groove is firstly scribed on the chip by the laser cutting head 71; the third motor 74 drives the rotating block 75 to rotate, the rotating block 75 drives the grinding wheel cutting head 72 to face the chip, the grinding wheel cutting head 72 cuts the chip along a linear groove, when the chip is cut along an X axis or a Y axis, the driving motor 31 drives the driving disc 32 to rotate, 4 matching holes 34 are uniformly distributed on the circumferential surface of the driving disc 32, each 90-degree rotating matching hole 34 of the driving disc 32 corresponds to the sliding hole 35, when the matching hole 34 corresponds to the sliding hole 35, the ball 36 is clamped into the matching hole 34 under the action of the spring 38, the driving disc 32 is clamped and generates clamping sound, whether the driving disc 32 rotates 90 degrees or not can be judged through the arrangement, the placing table 4 is further ensured to rotate 90 degrees, and the combined cutting assembly 7 cuts the chip along the Y axis or the X axis; according to the chip cutting machine, the adsorption component 5 is arranged to fix a chip during cutting, dislocation during chip cutting is avoided, the rotary driving component 3 drives the placing table 4 to rotate for 90 degrees, the chip cutting precision is guaranteed, the laser cutting head 71 and the grinding wheel cutting head 72 on the combined cutting component 7 are located at the same position during switching, the deviation of alignment of the grinding wheel cutting head 72 and a wire groove is guaranteed, and the chip cutting yield is improved.

Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the invention, also features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.

The embodiments of the invention are intended to embrace all such alternatives, modifications and variances that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements and the like that may be made without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.

Claims

1. The cutting device for chip processing is characterized by comprising a rack, wherein a displacement adjusting assembly is mounted on the rack, a rotary driving assembly is mounted on the upper portion of the displacement adjusting assembly, a placing table is mounted on the upper portion of the rotary driving assembly, the rotary driving assembly drives the placing table to rotate 90 degrees, an adsorption assembly is arranged in the placing table, a lifting assembly is mounted on one side of the rack, a combined cutting assembly is mounted on the upper portion of the lifting assembly, the combined cutting assembly comprises a laser cutting head and a grinding wheel cutting head, and the laser cutting head and the grinding wheel cutting head are located on the upper portion of the placing table.

2. The cutting device for chip processing according to claim 1, wherein the displacement adjustment assembly comprises an X-axis moving table, the X-axis moving table is slidably mounted on the frame, a first lead screw is mounted in the X-axis moving table in a threaded connection manner, the first lead screw penetrates through the X-axis moving table and is rotatably mounted on the frame, a first motor is mounted at one end of the first lead screw, and the first motor drives the first lead screw to rotate; the upper portion slidable of X axle mobile station installs Y axle mobile station, the slip direction of Y axle mobile station with the slip direction of X axle mobile station is mutually perpendicular, install the second lead screw through threaded connection's mode in the Y axle mobile station, the second lead screw runs through Y axle mobile station, and rotatable the installing on the X axle mobile station, the second motor is installed to the one end of second lead screw, the second motor drives the second lead screw rotates.

3. The cutting device for chip processing according to claim 2, wherein the rotation driving assembly comprises a driving motor, the driving motor is installed on the upper portion of the Y-axis moving table along the vertical direction, a driving disc is installed at an output end of the driving motor, a matching cavity is installed on the upper portion of the driving motor, the driving disc is rotatably connected in the matching cavity, 4 matching holes are evenly distributed on the circumferential surface of the driving disc, sliding holes are formed in the side wall of the matching cavity and correspond to the matching holes, balls are installed in the sliding holes in a sliding mode, an end cover is installed at one end, away from the driving disc, of each sliding hole, and a spring is installed between each ball and the end cover.

4. The cutting device for chip processing according to claim 3, wherein a diameter of the slide hole is larger than a diameter of the fitting hole.

5. The cutting device for chip processing according to claim 1, wherein the suction assembly comprises a plurality of suction cups, the suction cups are mounted on the upper surface of the placing table, the suction cups are arranged in a rectangular array, and the suction cups are all communicated with an external vacuum source.

6. The cutting apparatus for chip processing according to claim 5, wherein the suction cups are slidably mounted on the mounting table, and adjacent suction cups are movable toward and away from each other in an X-axis direction and a Y-axis direction.

7. The cutting device for chip processing according to claim 1, wherein the lifting assembly comprises a sliding rod, the sliding rod is vertically installed on the frame, a sliding cavity is opened on an upper portion of the sliding rod, the combined cutting assembly is slidably installed in the sliding cavity, a lifting electric cylinder is installed on one side of the sliding rod, and an output end of the lifting electric cylinder is connected with the combined cutting assembly to drive the combined cutting assembly to slide along the sliding cavity.

8. The cutting device for chip processing according to claim 7, wherein the combined cutting assembly comprises a support frame, a third motor is installed on the upper portion of the support frame along the horizontal direction, a rotating block is installed at an output end of the third motor, and the laser cutting head and the grinding wheel cutting head are respectively installed at two ends of the rotating block along the vertical direction.