CN118448404A - Resin packaging method for LED chip and LED light source device - Google Patents

Abstract

The present invention provides a method for manufacturing an LED light source device in which, when a plurality of substrates are arranged adjacent to each other without cutting the substrates, the boundaries between the substrates are located in the middle and the distance between adjacent LED chips arranged on both sides does not become undesirably long. A packaging component (20) is respectively arranged at a position of an LED chip mounting area (18) of the substrate (12) on which an LED chip (14) is mounted, in a pair of mutually opposing end sides (A) and (B) of the substrate (12), and a second packaging component (22) is arranged on the substrate (12) in a manner of cooperating with the pair of packaging components (20) to surround the LED chip mounting area (18), a packaging resin (16) is filled into the LED chip mounting area (18), and the packaging component (20) is removed.

Description

Resin packaging method for LED chip and LED light source device

Technical Field

The invention relates to a resin packaging method for an LED chip mounted on a substrate and an LED light source device.

Background technique

Conventionally, in order to prevent hands from directly touching LED chips mounted on a substrate and wires for supplying power to the LED chips (hereinafter referred to as "LED chips, etc."), LED chips, etc. are sealed with resin.

For example, Patent Document 1 discloses a technique in which a bank made of white silicone resin is arranged to surround a plurality of LED chips on a substrate, and the LED chips are sealed by flowing molten resin into a region surrounded by the bank.

Moreover, the following technology is disclosed in Patent Document 1: after encapsulating LED chips etc. with resin, the two ends of the substrate in the long side direction are cut including the dam portion (and a portion of the encapsulation resin), thereby enabling the boundary between the substrates to be located in the middle when a plurality of substrates are arranged adjacent to each other, and the distance between adjacent LED chips arranged on both sides will not be undesirably lengthened.

Prior art literature

Patent Literature

Patent Document 1: Japanese Patent No. 7009207

Summary of the invention

Problems to be solved by the invention

However, in order to cut the substrate including the bank portion and the sealing resin, not only high cutting accuracy is required, but also the LED chip may be damaged by vibration or stress generated during cutting.

The present invention is completed in view of such a problem, and its purpose is to provide a method for manufacturing an LED light source device in which, when a plurality of substrates are arranged adjacent to each other without cutting the substrates, the boundary between the substrates is located in the middle and the distance between adjacent LED chips arranged on both sides does not become undesirably long.

Means for solving problems

According to one aspect of the present invention, a method for manufacturing an LED light source device is provided, wherein the LED light source device comprises:

Substrate;

An LED chip is mounted on an LED chip mounting area on the substrate; and

The encapsulation resin is filled in the LED chip mounting area in a manner covering the LED chip,

A sealing member is disposed at a position of a pair of mutually opposing end sides of the substrate facing the LED chip mounting region of the substrate on which the LED chip is mounted, and

a second packaging member is disposed on the substrate so as to cooperate with the pair of packaging members to surround the LED chip mounting area;

filling the LED chip mounting area with the encapsulation resin,

The packaging member is removed.

Preferably,

The method comprises the step of removing the second packaging member.

Preferably,

The packaging member has a contact portion that contacts a side surface of the substrate and a protrusion that protrudes from the substrate.

According to another aspect of the present invention, there is provided an LED light source device comprising:

Substrate;

An LED chip is mounted on an LED chip mounting area on the substrate; and

The encapsulation resin is filled in the LED chip mounting area in a manner covering the LED chip,

The peripheral edge of the LED chip mounting area is set inside the edge of the substrate.

Effects of the Invention

According to the manufacturing method of the LED light source device involved in the present invention, packaging components are respectively arranged at positions facing the LED chip mounting area in a pair of end edges opposite to each other of the substrate, and the packaging components are removed after the LED chip mounting area is filled with packaging resin. Therefore, it is possible to manufacture an LED light source device in which, when a plurality of substrates are arranged adjacent to each other without cutting the substrates, the boundary between the substrates is located in the middle and the distance between adjacent LED chips arranged on both sides is not undesirably lengthened.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front view showing an LED light source device 10 according to the embodiment.

FIG. 2 is a plan view showing the LED light source device 10 according to the embodiment.

FIG. 3 is a front view showing a state where the LED chip 14 is mounted on the LED chip mounting region 18 on the substrate 12 .

FIG. 4 is a plan view showing a state where the LED chip 14 is mounted on the LED chip mounting region 18 on the substrate 12 .

FIG. 5 is a front view showing a state where the sealing member 20 is arranged.

FIG. 6 is a plan view showing a state where the sealing member 20 is arranged.

FIG. 7 is a front view showing a state where the second sealing member 22 is arranged.

FIG. 8 is a plan view showing a state where the second sealing member 22 is arranged.

FIG. 9 is a front view showing a state where the sealing resin 16 is sealed in the LED chip mounting region 18 .

FIG. 10 is a plan view showing a state where the sealing resin 16 is sealed in the LED chip mounting region 18 .

FIG. 11 is a front view showing a state where the sealing member 20 and the second sealing member 22 according to the second modification are arranged.

FIG. 12 is a plan view showing a state where the sealing member 20 and the second sealing member 22 according to the second modification are arranged.

FIG. 13 is a plan view showing a state where the sealing member 20 and the second sealing member 22 according to the third modification are arranged.

Detailed ways

Hereinafter, the LED light source device 10 manufactured by the method for manufacturing an LED light source device according to the present embodiment will be described first, and then the method for manufacturing the LED light source device will be described.

(Structure of LED Light Source Device 10)

As shown in FIGS. 1 and 2 , the LED light source device 10 according to the present embodiment generally includes a substrate 12 , a plurality of LED chips 14 , and a sealing resin 16 .

The substrate 12 is a rectangular plate-shaped member formed of a metal with high thermal conductivity such as aluminum. In addition, an LED chip mounting area 18 for mounting the LED chip 14 is defined on the surface of the substrate 12. It should be noted that the LED chip mounting area 18 may be an area explicitly indicated by color classification on the surface of the substrate 12, or the predetermined area for mounting the LED chip 14 may be set as the "LED chip mounting area 18" for convenience without being particularly indicated.

The LED chip 14 is a light-emitting body mounted on the LED chip mounting region 18 of the substrate 12 described above, and emits light by receiving power supplied via a wire or the like (not shown) formed on the surface of the substrate 12 .

The plurality of LED chips 14 are arranged and installed at a certain interval X along the horizontal direction (long side direction) in the figure, and the distance from each of the LED chips 14 located at the two ends of the horizontal direction to the end A or the end B of the substrate 12 is set to half of the interval X. Therefore, when a plurality of LED light source devices 10 are prepared and arranged adjacently along the long side direction, the distance between the LED chip 14 arranged at the end (for example, the right end) of a certain LED light source device 10 and the LED chip 14 arranged at the opposite end (for example, the left end) of the adjacent LED light source device 10 is the same as the interval X at which the LED chips 14 are installed, so that the plurality of LED light source devices 10 can be arranged without paying attention to the arrangement interval of the LED chips 14 at the connection between the LED light source devices 10 (the substrates 12).

In the present embodiment, as described above, a plurality of LED chips 14 are arranged horizontally in the figure, but the number and arrangement of the LED chips 14 are not limited thereto, and it may be one LED chip 14, or a plurality of LED chips 14 may be arranged in a checkerboard or zigzag pattern. In addition, all or part of the plurality of LED chips 14 may be arranged at unequal intervals.

The sealing resin 16 is filled in the LED chip mounting region 18 to cover the LED chips 14. The type of the sealing resin 16 is not particularly limited, and silicone resin, epoxy resin, fluorine resin, glass, etc. that transmit light emitted from each LED chip 14 are conceivable.

(Method of Manufacturing LED Light Source Device 10)

Next, a method for manufacturing the LED light source device 10 will be described. First, as shown in FIGS. 3 and 4 , the LED chip 14 is mounted on the LED chip mounting region 18 on the substrate 12 .

Next, as shown in FIGS. 5 and 6 , the sealing members 20 are disposed at positions of the pair of opposing end sides A and B of the substrate 12 facing the LED chip mounting region 18 of the substrate 12 where the LED chip 14 is mounted.

Here, the outer package member 20 is a rod-shaped member having a rectangular (quadrilateral) cross section and is formed of, for example, fluororesin (PTFE), but is not limited to this material.

Next, as shown in FIGS. 7 and 8, a second encapsulating member 22 is arranged on the substrate 12 in a manner that cooperates with a pair of encapsulating members 20 to surround the LED chip mounting area 18. At this time, both ends of the second encapsulating member 22 are formed to a position that abuts against the encapsulating member 20, that is, the end edges A and B of the substrate 12, so that when the resin material is filled as described later, the resin material does not overflow from the LED chip mounting area 18. It should be noted that the order may be to arrange the second encapsulating member 22 first and then arrange the encapsulating member 20.

Here, the second packaging member 22 has a semicircular and linear cross section and is made of, for example, silicone resin. Alternatively, the second packaging member 22 may have a rectangular (quadrilateral) cross section.

Then, as shown in FIGS. 9 and 10 , the LED chip mounting region 18 is filled with a sealing resin 16 .

Finally, the packaging member 20 and the second packaging member 22 are removed, and the manufacture of the LED light source device 10 is completed.

(Features of the Manufacturing Method of the LED Light Source Device 10)

According to the manufacturing method of the LED light source device 10 involved in the present embodiment, a packaging component 20 is respectively arranged at a position facing the LED chip mounting area 18 in a pair of end edges A and B of the substrate 12 that are opposite to each other, and the packaging component 20 is removed after the LED chip mounting area 18 is filled with the packaging resin 16. Therefore, it is possible to manufacture an LED light source device 10 in which, when a plurality of substrates 12 are arranged adjacent to each other without cutting the substrates 12, the boundary between the substrates 12 is located in the middle and the distance between adjacent LED chips 14 arranged on both sides is not undesirably lengthened.

(Variant 1)

In the manufacturing method involved in the above-mentioned embodiment, the packaging components 20 respectively arranged at a pair of opposite end edges A and B of the substrate 12 facing the LED chip mounting area 18 of the substrate 12 on which the LED chip 14 is mounted are removed and completed, and the second packaging component 22 arranged on the substrate 12 in a manner to cooperate with these packaging components 20 to surround the LED chip mounting area 18 remains in a state of remaining in the LED light source device 10.

However, the LED light source device 10 may also be in a state where the second sealing member 22 is removed.

(Variant 2)

In addition, in the above-mentioned embodiment, a rod-shaped member with a rectangular (quadrilateral) cross-section is used as the packaging member 20, but it is also possible to use, instead, as shown in Figures 11 and 12, a packaging member 20 having an abutting portion 24 that abuts against the side surface of the substrate 12 (including the surface of the end edge A or B) and a protrusion 26 that protrudes on the substrate 12.

In this case, since the portion from the end edges A and B of the substrate 12 to the slightly inner portion is covered by the protrusion 26 of the packaging component 20, the two ends of the second packaging component 22 only need to have a length that abuts against these protrusions 26. Compared with the above-mentioned embodiment, the length of the second packaging component 22 in variant example 2 is shorter.

As a result, the area covered by the encapsulating resin 16 (i.e., the LED chip mounting area 18) is also narrowed by the amount of the protruding portion 26 of the encapsulating member 20, and the encapsulating resin 16 does not exist from the end edges A and B of the substrate 12 to a portion slightly inside. Therefore, when a plurality of LED light source devices 10 are arranged and used, the stress caused by the encapsulating resins 16 on adjacent substrates 12 squeezing each other due to tolerance and expansion of the encapsulating resins 16 can be reduced, and damage to the LED chips 14 and bonding wires (not shown) can be avoided.

(Variant 3)

Furthermore, in the above-mentioned embodiment, the packaging member 20 is rectangular (quadrilateral) in a plan view of the LED light source device 10, but it may be substituted, as shown in FIG13 , in a shape that is partially convex or partially concave toward the LED chip 14. Of course, correspondingly, the LED chip mounting area 18 is also partially concave or partially convex.

The embodiments disclosed herein are illustrative in all aspects and should not be construed as restrictive. The scope of the present invention is indicated by the claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Symbol Description

10: LED light source device, 12: substrate, 14: LED chip, 16: packaging resin, 18: LED chip mounting area;

20: packaging member, 22: second packaging member, 24: abutment portion (of the packaging member 20), 26: protrusion (of the packaging member 20);

A: end side (of substrate 12 ), B: end side (of substrate 12 ).

Claims (4)

1. A method for manufacturing an LED light source device is characterized in that,

The LED light source device comprises:

A substrate;

an LED chip mounted on the substrate in an LED chip mounting region; and

An encapsulation resin filling the LED chip mounting region so as to cover the LED chip,

A package member is disposed at a position facing the LED chip mounting region of the substrate on which the LED chip is mounted, respectively, in a pair of opposite end edges of the substrate, and

A second package member is disposed on the substrate in such a manner as to surround the LED chip mounting region in cooperation with the pair of package members,

Filling the encapsulation resin into the LED chip mounting region,

And removing the packaging member.

2. The method of manufacturing an LED light source device according to claim 1, wherein,

The method for manufacturing the LED light source device comprises the step of removing the second packaging member.

3. The method of manufacturing an LED light source device according to claim 1, wherein,

The package member has an abutting portion abutting against a side surface of the substrate and a protruding portion protruding on the substrate.

4. An LED light source device is characterized in that,

The LED light source device comprises:

A substrate;

an LED chip mounted on the substrate in an LED chip mounting region; and

An encapsulation resin filling the LED chip mounting region so as to cover the LED chip,

The periphery of the LED chip mounting region is disposed further inward than the end edge of the substrate.