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JP2024110820A - Resin sealing method for LED chip and LED light source device - Google Patents

Resin sealing method for LED chip and LED light source device Download PDF

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JP2024110820A
JP2024110820A JP2023015648A JP2023015648A JP2024110820A JP 2024110820 A JP2024110820 A JP 2024110820A JP 2023015648 A JP2023015648 A JP 2023015648A JP 2023015648 A JP2023015648 A JP 2023015648A JP 2024110820 A JP2024110820 A JP 2024110820A
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led chip
substrate
led
chip mounting
sealing member
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雅章 木下
Masaaki Kinoshita
嶺 佐藤
Mine Sato
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Phoenix Electric Co Ltd
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Phoenix Electric Co Ltd
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Priority to CN202410057259.3A priority patent/CN118448404A/en
Priority to TW113101700A priority patent/TW202433618A/en
Publication of JP2024110820A publication Critical patent/JP2024110820A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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Abstract

【課題】基板をカットすることなく、複数の基板を互いに隣接して並べたときに基板同士の境目を間にして両側に配置された隣り合うＬＥＤチップ同士の距離が不所望に長くならないＬＥＤ光源装置を製造する方法を提供する。【解決手段】基板１２の互いに対向する一対の端辺ＡおよびＢにおける、ＬＥＤチップ１４が実装された基板１２のＬＥＤチップ実装領域１８を臨む位置にそれぞれ封止部材２０を配置するとともに、一対の封止部材２０と協働してＬＥＤチップ実装領域１８を囲むように、基板１２上に第２封止部材２２を配置し、ＬＥＤチップ実装領域１８に封止樹脂１６を充填し、封止部材２０を取り外す。【選択図】図１０[Problem] To provide a method for manufacturing an LED light source device in which, when multiple substrates are arranged adjacent to one another, the distance between adjacent LED chips arranged on both sides of the boundary between the substrates does not become undesirably long, without cutting the substrates. [Solution] Sealing members 20 are arranged at positions facing an LED chip mounting area 18 of the substrate 12 on which an LED chip 14 is mounted, on a pair of opposing end sides A and B of the substrate 12, and a second sealing member 22 is arranged on the substrate 12 so as to cooperate with the pair of sealing members 20 to surround the LED chip mounting area 18, sealing resin 16 is filled into the LED chip mounting area 18, and the sealing member 20 is removed. [Selected Figure] Figure 10

Description

本発明は、基板の上に実装されたＬＥＤチップの樹脂封止方法、および、ＬＥＤ光源装置に関する。 The present invention relates to a resin sealing method for an LED chip mounted on a substrate, and an LED light source device.

従前より、基板の上に実装されたＬＥＤチップや当該ＬＥＤチップに給電するためのワイヤ等（以下、「ＬＥＤチップ等」という。）に直接手が触れられないようにするため、ＬＥＤチップ等を樹脂で封止することが実施されている。 Conventionally, LED chips mounted on a substrate and wires for supplying power to the LED chips (hereinafter referred to as "LED chips, etc.") have been sealed with resin to prevent direct contact with hands.

例えば、特許文献１には、基板上の複数のＬＥＤチップ等を囲むようにして白色シリコーン製のダムを配置し、当該ダムで囲まれた領域に熔解させた樹脂を流し込むことでＬＥＤチップ等を封止する技術が開示されている。 For example, Patent Document 1 discloses a technology in which a dam made of white silicone is placed so as to surround multiple LED chips on a substrate, and molten resin is poured into the area surrounded by the dam to seal the LED chips.

さらに、特許文献１では、ＬＥＤチップ等を樹脂で封止した後、基板の長手方向両端部を、ダム（および、封止樹脂の一部）を含めてカットすることにより、複数の基板を互いに隣接して並べたときに基板同士の境目を間にして両側に配置された隣り合うＬＥＤチップ同士の距離が不所望に長くならないようにできる技術が開示されている。 Furthermore, Patent Document 1 discloses a technique in which, after sealing the LED chips etc. with resin, both longitudinal ends of the substrate are cut, including the dam (and part of the sealing resin), so that when multiple substrates are arranged adjacent to each other, the distance between adjacent LED chips arranged on both sides of the border between the substrates does not become undesirably long.

特許第７００９２０７号明細書Patent No. 7009207 specification

しかしながら、ダムや封止樹脂を含めて基板をカットするには高い切断精度が求められるだけでなく、切断の際に生じる振動や応力によってＬＥＤチップ等を損傷させてしまうおそれがあった。 However, cutting the board, including the dam and sealing resin, not only requires high cutting precision, but also poses the risk of damaging the LED chips and other components due to vibrations and stresses generated during cutting.

本発明は、このような課題に鑑みてなされたものであり、その目的は、基板をカットすることなく、複数の基板を互いに隣接して並べたときに基板同士の境目を間にして両側に配置された隣り合うＬＥＤチップ同士の距離が不所望に長くならないＬＥＤ光源装置を製造する方法を提供することにある。 The present invention was made in consideration of these problems, and its purpose is to provide a method for manufacturing an LED light source device in which, when multiple substrates are arranged adjacent to one another, the distance between adjacent LED chips arranged on both sides of the boundary between the substrates is not undesirably long, without cutting the substrates.

本発明の一局面によれば、
基板と、
前記基板上のＬＥＤチップ実装領域に実装されたＬＥＤチップと、
前記ＬＥＤチップを覆うように前記ＬＥＤチップ実装領域に充填された封止樹脂とを備えるＬＥＤ光源装置を製造する方法であって、
前記基板の互いに対向する一対の端辺における、前記ＬＥＤチップが実装された前記基板の前記ＬＥＤチップ実装領域を臨む位置にそれぞれ封止部材を配置するとともに、
一対の前記封止部材と協働して前記ＬＥＤチップ実装領域を囲むように、前記基板上に第２封止部材を配置し、
前記ＬＥＤチップ実装領域に前記封止樹脂を充填し、
前記封止部材を取り外す
ＬＥＤ光源装置の製造方法が提供される。 According to one aspect of the present invention,
A substrate;
an LED chip mounted in an LED chip mounting area on the substrate;
a sealing resin filled in the LED chip mounting area so as to cover the LED chip,
a sealing member is disposed on each of a pair of opposing end sides of the substrate at positions facing the LED chip mounting region of the substrate on which the LED chip is mounted;
a second sealing member is disposed on the substrate so as to cooperate with the pair of sealing members to surround the LED chip mounting region;
The sealing resin is filled into the LED chip mounting area,
The sealing member is removed.

好適には、
前記第２封止部材を取り外すステップを有している。 Preferably,
The step includes removing the second sealing member.

好適には、
前記封止部材は、前記基板の側面に当接する当接部と、前記基板上に突出する突出部とを有している。 Preferably,
The sealing member has a contact portion that contacts a side surface of the substrate and a protrusion that protrudes above the substrate.

本発明の他の局面によれば、
基板と、
前記基板上のＬＥＤチップ実装領域に実装されたＬＥＤチップと、
前記ＬＥＤチップを覆うように前記ＬＥＤチップ実装領域に充填された封止樹脂とを備えており、
前記ＬＥＤチップ実装領域の周縁は、前記基板の端辺よりも内側に設定されていることを特徴とする
ＬＥＤ光源装置が提供される。 According to another aspect of the present invention,
A substrate;
an LED chip mounted in an LED chip mounting area on the substrate;
a sealing resin filled in the LED chip mounting area so as to cover the LED chip,
The LED light source device is characterized in that the periphery of the LED chip mounting area is set inside the edge of the substrate.

本発明に係るＬＥＤ光源装置の製造方法によれば、基板の互いに対向する一対の端辺における、ＬＥＤチップ実装領域を臨む位置にそれぞれ封止部材を配置し、当該ＬＥＤチップ実装領域に封止樹脂を充填した後で当該封止部材を取り外すようにしているので、基板をカットすることなく、複数の基板を互いに隣接して並べたときに基板同士の境目を間にして両側に配置された隣り合うＬＥＤチップ同士の距離が不所望に長くならないＬＥＤ光源装置を製造することができる。 According to the manufacturing method of the LED light source device of the present invention, a sealing member is disposed at each of a pair of opposing end edges of the substrate at a position facing the LED chip mounting area, and the sealing member is removed after filling the LED chip mounting area with sealing resin. This makes it possible to manufacture an LED light source device in which the distance between adjacent LED chips arranged on both sides of the boundary between the substrates is not undesirably long when multiple substrates are arranged adjacent to each other without cutting the substrate.

実施形態に係るＬＥＤ光源装置１０を示す正面図である。1 is a front view showing an LED light source device 10 according to an embodiment. 実施形態に係るＬＥＤ光源装置１０を示す天面図である。FIG. 2 is a top view showing the LED light source device 10 according to the embodiment. 基板１２上のＬＥＤチップ実装領域１８にＬＥＤチップ１４を実装した状態を示す正面図である。2 is a front view showing a state in which an LED chip 14 is mounted in an LED chip mounting area 18 on a substrate 12. FIG. 基板１２上のＬＥＤチップ実装領域１８にＬＥＤチップ１４を実装した状態を示す天面図である。2 is a top view showing a state in which an LED chip 14 is mounted in an LED chip mounting area 18 on a substrate 12. FIG. 封止部材２０を配置した状態を示す正面図である。FIG. 2 is a front view showing a state in which the sealing member 20 is disposed. 封止部材２０を配置した状態を示す天面図である。FIG. 2 is a top view showing a state in which the sealing member 20 is disposed. 第２封止部材２２を配置した状態を示す正面図である。FIG. 4 is a front view showing a state in which a second sealing member 22 is arranged. 第２封止部材２２を配置した状態を示す天面図である。FIG. 11 is a top view showing the state in which the second sealing member 22 is arranged. ＬＥＤチップ実装領域１８に封止樹脂１６を封入した状態を示す正面図である。1 is a front view showing a state in which sealing resin 16 is filled in an LED chip mounting area 18. FIG. ＬＥＤチップ実装領域１８に封止樹脂１６を封入した状態を示す天面図である。1 is a top view showing a state in which the sealing resin 16 is filled in the LED chip mounting area 18. FIG. 変形例２に係る封止部材２０および第２封止部材２２を配置した状態を示す正面図である。FIG. 11 is a front view showing a state in which a sealing member 20 and a second sealing member 22 according to Modification 2 are arranged. 変形例２に係る封止部材２０および第２封止部材２２を配置した状態を示す天面図である。FIG. 11 is a top view showing a state in which a sealing member 20 and a second sealing member 22 according to Modification 2 are arranged. 変形例３に係る封止部材２０および第２封止部材２２を配置した状態を示す天面図である。FIG. 11 is a top view showing a state in which a sealing member 20 and a second sealing member 22 according to Modification 3 are arranged.

以下では、先ず本実施形態に係るＬＥＤ光源装置の製造方法で製造されるＬＥＤ光源装置１０について説明し、然る後、このＬＥＤ光源装置の製造方法について説明する。 Below, we will first explain the LED light source device 10 manufactured by the manufacturing method for the LED light source device according to this embodiment, and then we will explain the manufacturing method for this LED light source device.

（ＬＥＤ光源装置１０の構成）
本実施形態に係るＬＥＤ光源装置１０は、図１および図２に示すように、大略、基板１２と、複数のＬＥＤチップ１４と、封止樹脂１６とを備えている。 (Configuration of LED light source device 10)
As shown in FIGS. 1 and 2, an LED light source device 10 according to this embodiment generally includes a substrate 12, a plurality of LED chips 14, and a sealing resin 16.

基板１２は、アルミニウム等の熱伝導率が高い金属で形成された矩形状の板状材である。また、基板１２の表面には、ＬＥＤチップ１４が実装されるＬＥＤチップ実装領域１８が規定されている。なお、このＬＥＤチップ実装領域１８は、基板１２の表面を色分けする等といった明示的なものであってもよいし、特に明示等することなくＬＥＤチップ１４を実装する予定の領域を便宜的に「ＬＥＤチップ実装領域１８」としてもよい。 The substrate 12 is a rectangular plate-like material made of a metal with high thermal conductivity, such as aluminum. An LED chip mounting area 18 in which the LED chip 14 is mounted is defined on the surface of the substrate 12. Note that this LED chip mounting area 18 may be clearly indicated, such as by color-coding the surface of the substrate 12, or the area in which the LED chip 14 is to be mounted may be conveniently referred to as the "LED chip mounting area 18" without any particular indication.

ＬＥＤチップ１４は、上述した基板１２のＬＥＤチップ実装領域１８に実装された発光体であり、基板１２の表面に形成されたワイヤ等（図示せず）を介して供給された電力を受けて発光する。 The LED chip 14 is a light emitter mounted in the LED chip mounting area 18 of the substrate 12 described above, and emits light when it receives power supplied via a wire or the like (not shown) formed on the surface of the substrate 12.

複数のＬＥＤチップ１４は、図中横方向（長手方向）に一定の間隔Ｘで並べて実装されており、横方向両端にあるＬＥＤチップ１４のそれぞれから基板１２の端辺Ａあるいは端辺Ｂまでの距離は、それぞれ間隔Ｘの半分に設定されている。これにより、複数のＬＥＤ光源装置１０を用意して、それぞれを長手方向に沿って隣接して配置すると、あるＬＥＤ光源装置１０における端（例えば右端）に配置されたＬＥＤチップ１４と、これに隣接するＬＥＤ光源装置１０における反対側端（例えば左端）に配置されたＬＥＤチップ１４との間の距離が、ＬＥＤチップ１４が実装されている間隔Ｘと同じになるので、ＬＥＤ光源装置１０同士（基板１２同士）のつなぎ目でＬＥＤチップ１４の配置間隔を気にすることなく、複数のＬＥＤ光源装置１０を配置することができる。 The multiple LED chips 14 are mounted side by side at a fixed interval X in the horizontal direction (longitudinal direction) in the figure, and the distance from each of the LED chips 14 at both ends in the horizontal direction to the end side A or end side B of the substrate 12 is set to half the interval X. As a result, when multiple LED light source devices 10 are prepared and arranged adjacent to each other along the longitudinal direction, the distance between the LED chip 14 arranged at the end (e.g., the right end) of a certain LED light source device 10 and the LED chip 14 arranged at the opposite end (e.g., the left end) of the adjacent LED light source device 10 is the same as the interval X at which the LED chips 14 are mounted, so multiple LED light source devices 10 can be arranged without having to worry about the arrangement interval of the LED chips 14 at the joint between the LED light source devices 10 (substrates 12).

本実施形態では、上述のように、複数のＬＥＤチップ１４が図中横方向に並べて実装されているが、ＬＥＤチップ１４の数や配置態様はこれに限定されるものではなく、１つのＬＥＤチップ１４であってもよいし、複数のＬＥＤチップ１４を碁盤目状あるいは千鳥状に配置してもよい。また、複数のＬＥＤチップ１４の全部または一部を不等間隔にならべてもよい。 In this embodiment, as described above, multiple LED chips 14 are mounted side by side in the horizontal direction in the figure, but the number and arrangement of the LED chips 14 are not limited to this, and there may be one LED chip 14, or multiple LED chips 14 may be arranged in a checkerboard or staggered pattern. In addition, all or some of the multiple LED chips 14 may be arranged at uneven intervals.

封止樹脂１６は、上述したＬＥＤチップ１４を覆うようにして、ＬＥＤチップ実装領域１８に充填されている。封止樹脂１６の種類は特に限定されるものではないが、各ＬＥＤチップ１４から放射される光を透過させる、シリコーン樹脂、エポキシ系樹脂、あるいはフッ素系樹脂、ガラス等が考えられる。 The sealing resin 16 is filled in the LED chip mounting area 18 so as to cover the above-mentioned LED chips 14. The type of sealing resin 16 is not particularly limited, but possible resins include silicone resin, epoxy resin, fluorine resin, glass, etc., which transmit the light emitted from each LED chip 14.

（ＬＥＤ光源装置１０の製造方法）
次に、上述したＬＥＤ光源装置１０の製造方法について説明する。先ず、図３および図４に示すように、基板１２上のＬＥＤチップ実装領域１８にＬＥＤチップ１４を実装しておく。 (Manufacturing method of LED light source device 10)
Next, a description will be given of a method for manufacturing the above-mentioned LED light source device 10. First, the LED chip 14 is mounted in the LED chip mounting area 18 on the substrate 12 as shown in Figs.

次に、図５および図６に示すように、基板１２の互いに対向する一対の端辺ＡおよびＢにおける、ＬＥＤチップ１４が実装された基板１２のＬＥＤチップ実装領域１８を臨む位置にそれぞれ封止部材２０を配置する。 Next, as shown in Figures 5 and 6, sealing members 20 are placed on a pair of opposing ends A and B of the substrate 12 at positions facing the LED chip mounting area 18 of the substrate 12 on which the LED chip 14 is mounted.

ここで、封止部材２０は、断面が矩形状（四角形状）の棒状部材であり、例えば、フッ素樹脂（ＰＴＦＥ）で形成されるが、この材質に限定されるものではない。 Here, the sealing member 20 is a rod-shaped member with a rectangular (quadrangular) cross section, and is made of, for example, fluororesin (PTFE), but is not limited to this material.

次に、図７および図８に示すように、一対の封止部材２０と協働してＬＥＤチップ実装領域１８を囲むように、基板１２上に第２封止部材２２を配置する。このとき、第２封止部材２２の両端は、後述するように樹脂材を充填する際に当該樹脂材がＬＥＤチップ実装領域１８からはみ出ないように、封止部材２０に当接する位置、つまり、基板１２の端辺ＡおよびＢまで形成される。なお、第２封止部材２２を先に配置し、然る後、封止部材２０を配置する順番であってもよい。 7 and 8, a second sealing member 22 is placed on the substrate 12 so as to cooperate with the pair of sealing members 20 to surround the LED chip mounting area 18. At this time, both ends of the second sealing member 22 are formed to positions where they abut the sealing members 20, that is, to the edge sides A and B of the substrate 12, so that the resin material does not overflow from the LED chip mounting area 18 when the resin material is filled as described below. Note that the second sealing member 22 may be placed first, and then the sealing member 20 may be placed.

ここで、第２封止部材２２は、断面が半円形状で直線状に形成されており、例えば、シリコーン系樹脂で形成される。また、第２封止部材２２の断面形状は矩形状（四角形状）であってもよい。 Here, the second sealing member 22 is formed linearly with a semicircular cross section, and is formed, for example, from a silicone-based resin. The cross-sectional shape of the second sealing member 22 may also be rectangular (quadrilateral).

然る後、図９および図１０に示すように、ＬＥＤチップ実装領域１８に封止樹脂１６を充填する。 Then, as shown in Figures 9 and 10, the LED chip mounting area 18 is filled with sealing resin 16.

最後に、封止部材２０および第２封止部材２２を取り外して、ＬＥＤ光源装置１０の製造が完了する。 Finally, the sealing member 20 and the second sealing member 22 are removed to complete the manufacture of the LED light source device 10.

（ＬＥＤ光源装置１０の製造方法の特徴）
本実施形態に係るＬＥＤ光源装置１０の製造方法によれば、基板１２の互いに対向する一対の端辺ＡおよびＢにおける、ＬＥＤチップ実装領域１８を臨む位置にそれぞれ封止部材２０を配置し、当該ＬＥＤチップ実装領域１８に封止樹脂１６を充填した後で当該封止部材２０を取り外すようにしているので、基板１２をカットすることなく、複数の基板１２を互いに隣接して並べたときに基板１２同士の境目を間にして両側に配置された隣り合うＬＥＤチップ１４同士の距離が不所望に長くならないＬＥＤ光源装置１０を製造することができる。 (Features of the manufacturing method of the LED light source device 10)
According to the manufacturing method of the LED light source device 10 of this embodiment, the sealing members 20 are arranged at positions facing the LED chip mounting areas 18 on a pair of opposing end sides A and B of the substrate 12, and the sealing members 20 are removed after the LED chip mounting areas 18 are filled with sealing resin 16. Therefore, it is possible to manufacture an LED light source device 10 in which the distance between adjacent LED chips 14 arranged on both sides of the boundary between the substrates 12 is not undesirably long when a plurality of substrates 12 are arranged adjacent to each other, without cutting the substrates 12.

（変形例１）
上述した実施形態に係る製造方法では、基板１２の互いに対向する一対の端辺ＡおよびＢにおける、ＬＥＤチップ１４が実装された基板１２のＬＥＤチップ実装領域１８を臨む位置にそれぞれ配置された封止部材２０を取り外して完成とし、これら封止部材２０と協働してＬＥＤチップ実装領域１８を囲むように基板１２上に配置された第２封止部材２２は、ＬＥＤ光源装置１０に残ったままになっていた。 (Variation 1)
In the manufacturing method according to the embodiment described above, the sealing members 20 arranged at positions facing the LED chip mounting area 18 of the substrate 12 on which the LED chip 14 is mounted on a pair of opposing end edges A and B of the substrate 12 are removed to complete the process, and the second sealing members 22 arranged on the substrate 12 so as to cooperate with the sealing members 20 to surround the LED chip mounting area 18 are left on the LED light source device 10.

しかしながら、これら第２封止部材２２も取り外した状態のＬＥＤ光源装置１０としてもよい。 However, the LED light source device 10 may also be in a state where these second sealing members 22 are removed.

（変形例２）
また、上述した実施形態では、封止部材２０として断面が矩形状（四角形状）の棒状部材を使用していたが、これに変えて、図１１および図１２に示すように、基板１２の側面（端辺ＡあるいはＢを含む面）に当接する当接部２４と、基板１２上に突出する突出部２６とを有する封止部材２０を使用してもよい。 (Variation 2)
In addition, in the above-described embodiment, a rod-shaped member having a rectangular (quadrilateral) cross section was used as the sealing member 20. However, instead of this, as shown in Figures 11 and 12, a sealing member 20 having an abutment portion 24 that abuts against the side surface of the substrate 12 (the surface including end edge A or B) and a protrusion portion 26 that protrudes above the substrate 12 may be used.

この場合、基板１２の端辺ＡおよびＢから少し内側に入った部分までは封止部材２０の突出部２６でカバーされるので、第２封止部材２２の両端は、これら突出部２６に当接する長さでよいこととなり、上述した実施形態の場合に比べて変形例２における第２封止部材２２の長さは短くなる。 In this case, the protrusions 26 of the sealing member 20 cover the area from the edges A and B of the substrate 12 to a portion slightly inward, so both ends of the second sealing member 22 only need to be long enough to abut against these protrusions 26, and the length of the second sealing member 22 in the second modified example is shorter than in the above-described embodiment.

これにより、封止樹脂１６にカバーされている領域（つまり、ＬＥＤチップ実装領域１８）も封止部材２０の突出部２６の分だけ狭くなり、基板１２の端辺ＡおよびＢから少し内側に入った部分までは封止樹脂１６が存在しないことになる。このため、複数のＬＥＤ光源装置１０を並べて使用する際に、封止樹脂１６の公差や膨張等によって隣り合う基板１２上の封止樹脂１６同士が互いに押し合うことで生じる応力が軽減され、ＬＥＤチップ１４やボンディングワイヤ（図示せず）にダメージが生じるのを回避できる。 As a result, the area covered by the sealing resin 16 (i.e., the LED chip mounting area 18) is narrowed by the amount of the protrusion 26 of the sealing member 20, and no sealing resin 16 is present up to a portion slightly inward from the edges A and B of the substrate 12. Therefore, when multiple LED light source devices 10 are used side by side, the stress caused by the sealing resin 16 on adjacent substrates 12 pressing against each other due to the tolerance or expansion of the sealing resin 16 is reduced, and damage to the LED chips 14 and bonding wires (not shown) can be avoided.

（変形例３）
さらに、上述した実施形態では、ＬＥＤ光源装置１０の天面視において封止部材２０が矩形状（四角形状）になっていたが、これに変えて、図１３に示すように、ＬＥＤチップ１４に向かって一部が凸、あるいは一部が凹となる形状であってもよい。もちろん、これに合わせてＬＥＤチップ実装領域１８も一部が凹、あるいは一部が凸となる。 (Variation 3)
Furthermore, in the above-described embodiment, the sealing member 20 has a rectangular (quadrilateral) shape when viewed from the top of the LED light source device 10, but instead of this, as shown in Fig. 13, it may have a shape that is partly convex or partly concave toward the LED chip 14. Of course, in accordance with this, the LED chip mounting region 18 also has a partly concave or partly convex shape.

今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した説明ではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims.

１０…ＬＥＤ光源装置、１２…基板、１４…ＬＥＤチップ、１６…封止樹脂、１８…ＬＥＤチップ実装領域
２０…封止部材、２２…第２封止部材、２４…（封止部材２０の）当接部、２６…（封止部材２０の）突出部
Ａ…（基板１２の）端辺、Ｂ…（基板１２の）端辺
 Reference Signs List 10: LED light source device, 12: substrate, 14: LED chip, 16: sealing resin, 18: LED chip mounting area, 20: sealing member, 22: second sealing member, 24: abutment portion (of sealing member 20), 26: protrusion portion (of sealing member 20), A: edge (of substrate 12), B: edge (of substrate 12)

Claims (4)

基板と、
前記基板上のＬＥＤチップ実装領域に実装されたＬＥＤチップと、
前記ＬＥＤチップを覆うように前記ＬＥＤチップ実装領域に充填された封止樹脂とを備えるＬＥＤ光源装置を製造する方法であって、
前記基板の互いに対向する一対の端辺における、前記ＬＥＤチップが実装された前記基板の前記ＬＥＤチップ実装領域を臨む位置にそれぞれ封止部材を配置するとともに、
一対の前記封止部材と協働して前記ＬＥＤチップ実装領域を囲むように、前記基板上に第２封止部材を配置し、
前記ＬＥＤチップ実装領域に前記封止樹脂を充填し、
前記封止部材を取り外す
ＬＥＤ光源装置の製造方法。 A substrate;
an LED chip mounted in an LED chip mounting area on the substrate;
a sealing resin filled in the LED chip mounting area so as to cover the LED chip,
a sealing member is disposed on each of a pair of opposing end sides of the substrate at positions facing the LED chip mounting region of the substrate on which the LED chip is mounted;
a second sealing member is disposed on the substrate so as to cooperate with the pair of sealing members to surround the LED chip mounting region;
The sealing resin is filled into the LED chip mounting region,
The sealing member is removed. 前記第２封止部材を取り外すステップを有している
請求項１に記載の製造方法。 The method of claim 1 further comprising the step of removing the second sealing member. 前記封止部材は、前記基板の側面に当接する当接部と、前記基板上に突出する突出部とを有している
請求項１に記載の製造方法。 The manufacturing method according to claim 1 , wherein the sealing member has a contact portion that contacts a side surface of the substrate and a protrusion that protrudes above the substrate. 基板と、
前記基板上のＬＥＤチップ実装領域に実装されたＬＥＤチップと、
前記ＬＥＤチップを覆うように前記ＬＥＤチップ実装領域に充填された封止樹脂とを備えており、
前記ＬＥＤチップ実装領域の周縁は、前記基板の端辺よりも内側に設定されていることを特徴とする
ＬＥＤ光源装置。
 A substrate;
an LED chip mounted in an LED chip mounting area on the substrate;
a sealing resin filled in the LED chip mounting area so as to cover the LED chip,
The LED light source device, characterized in that a periphery of the LED chip mounting area is set inside an edge of the substrate.
JP2023015648A 2023-02-03 2023-02-03 Resin sealing method for LED chip and LED light source device Pending JP2024110820A (en)

Priority Applications (3)

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JP2023015648A JP2024110820A (en) 2023-02-03 2023-02-03 Resin sealing method for LED chip and LED light source device
CN202410057259.3A CN118448404A (en) 2023-02-03 2024-01-16 Resin packaging method for LED chip and LED light source device
TW113101700A TW202433618A (en) 2023-02-03 2024-01-16 Led chip resin sealing method and led light source device

Applications Claiming Priority (1)

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JP2024110820A true JP2024110820A (en) 2024-08-16

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