JP2012182357A - Lead frame substrate for led light emitting element, led light emitting element device, and lead frame for the led light emitting element - Google Patents

Abstract

To improve adhesion between a lead frame and a resin molded body.
A lead frame substrate (10) includes a resin molded body (11) having a concave portion (12), a pad portion (13) and a lead portion (14) exposed at the bottom of the concave portion (12). The lead frame 50 was formed by etching a conductive metal material into a predetermined shape. The lead frame 50 has a size larger than that of the bottom opening 12b of the recess 12, and an uneven portion 51 having a height of 20 to 30 μm is formed in a region S in contact with the resin molded body 11 on the outer peripheral side of the bottom opening 12b of the recess 12. .
[Selection] Figure 2

Description

  The present invention relates to an LED light-emitting element lead frame substrate, an LED light-emitting element device, and an LED light-emitting element lead frame.

As an LED light emitting device, there is one in which an LED light emitting device is mounted on a lead frame substrate for LED light emitting device (hereinafter simply referred to as “lead frame substrate”) (see, for example, Patent Document 1). In such a lead frame substrate, a concave portion is formed in the resin molded body, and a pad portion for mounting the LED light emitting element and a lead portion for electrically connecting the LED light emitting element are provided at the bottom of the concave portion. ing.
The LED light emitting element mounted on the pad portion is electrically connected to the lead portion by a wire or the like. The concave portion is filled with a resin having transparency and containing a phosphor (hereinafter referred to as a sealing resin) to seal the LED light emitting element and to transmit light emitted from the LED light emitting element to the outside. It is designed to be transparent.

JP 2004-172160 A

However, the pad portion and the lead portion are formed of a conductive material such as copper, and there is a problem that the adhesion with a resin molded body made of a different material is poor.
In particular, in the case where the pad portion and the lead portion are LED light emitting element lead frames (hereinafter simply referred to as “lead frames”) integrally formed from a plate-like conductive material, a resin is provided on one side thereof. Since a molded body is formed, the problem is remarkable.

  The present invention has been made in view of the above circumstances, and includes a lead frame substrate for an LED light emitting element, an LED light emitting element device, and a lead frame for an LED light emitting element capable of improving the adhesion between a lead frame and a resin molded body. The purpose is to provide.

The present invention employs the following means in order to solve the above problems.
A lead frame substrate for an LED light emitting element according to a first aspect of the present invention is provided with a resin molded body having one or more recesses on a first surface and at least one LED light emitting element provided on the bottom surface of the recesses. And a lead frame having a lead part for electrical connection with the LED light emitting element, the lead frame being larger than the bottom opening of the recess and on the outer peripheral side of the bottom opening of the recess Unevenness is formed at the interface with the resin molded body.
In the lead frame, by forming irregularities at the interface with the resin molded body on the outer peripheral side of the bottom opening of the recess, the adhesion between the lead frame and the resin molded body can be enhanced.
Such irregularities are preferably formed by half etching. Thereby, an unevenness | corrugation can have a level | step difference of 20-30 micrometers.

  An LED light-emitting element device according to a second aspect of the present invention electrically connects a lead frame substrate of the present invention, an LED light-emitting element housed in a recess and mounted on a pad portion, and the LED light-emitting element and the lead portion. And a sealing resin filled in the recess and having transparency.

  A lead frame for an LED light emitting element according to a third aspect of the present invention includes a pad portion for mounting at least one LED light emitting element, a lead portion for electrically connecting the LED light emitting element, and a plan view. A bonding region portion formed so as to surround the pad portion and the lead portion and bonded to the resin molded body, and formed in the bonding region portion by half etching to increase the bonding strength with the resin molded body. Unevenness is formed.

  According to the present invention, the adhesion between the lead frame and the resin molded body can be enhanced.

It is a figure which shows the whole structure of the lead frame board | substrate which concerns on this embodiment. It is sectional drawing of each recessed part. It is a figure which shows the etching process of a metal material.

DESCRIPTION OF EMBODIMENTS Hereinafter, an embodiment of a lead frame substrate for an LED light emitting element, an LED light emitting element device, and a lead frame for an LED light emitting element according to the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a diagram showing an overall configuration of the lead frame substrate 10.
As shown in FIG. 1, a lead frame substrate 10 includes a lead frame 50 in which a plurality of pads 13 and lead portions 14 to be described later are formed, and a plurality of recesses 12 formed in the lead frame 50 and arranged in a matrix. And a resin molded body 11 having.
As shown in FIG. 2, the lead frame substrate 10 can manufacture a plurality of LED light emitting element devices A by mounting the LED light emitting elements 20 in the respective recesses 12.

  The resin molded body 11 is formed from a resin material containing a pigment such as white, one or more inorganic fillers, a binder, and the like. For example, the resin material has a light transmittance of 90% or more at a wavelength near 360 nm.

  The recess 12 is, for example, circular in plan view, and the side surface 12a of the recess 12 is directed from the first surface 10b side of the lead frame substrate 10 where the recess 12 is open to the second surface 10c on the opposite side. The opening area of the lever gradually decreases.

  A pad portion 13 on which the LED light emitting element 20 is mounted and a lead portion 14 that is electrically connected to the LED light emitting element 20 via a wire 21, solder, or the like are exposed at the bottom of the recess 12. The lead frame 50 having the pad portion 13 and the lead portion 14 is formed by etching a plate-like metal material made of a conductive metal material such as copper into a predetermined shape. The pads 13 and the lead portions 14 of each set are formed with a gap 15 therebetween, and electrical insulation is achieved by interposing a resin material forming the resin molded body 11 therebetween. .

  The lead frame 50 has a size larger than the bottom opening 12 b of the recess 12. In the lead frame 50, unevenness 51 having a step of 20 to 30 μm, for example, is formed in a region (joining region portion) S in contact with the resin molded body 11 on the outer peripheral side of the bottom opening 12 b of the recess 12.

  The recess 12 is filled with a sealing resin 30 that seals the LED light emitting element 20 mounted on the pad portion 13 and electrically connected to the lead portion 14. This sealing resin 30 contains a phosphor and is formed of a resin material having transparency so as to transmit light emitted from the LED light emitting element 20.

  In such a lead frame substrate 10, when the LED light emitting element 20 in each recess 12 is energized through the lead portion 14, the LED light emitting element 20 emits light. The light is irradiated toward the outside through the sealing resin 30. Further, a part of the light emitted from the LED light emitting element 20 is reflected by the side surface 12a of the concave portion 12, passes through the sealing resin 30, and is irradiated outward.

The lead frame substrate 10 as described above is formed as follows, for example. (See Figure 3.)
First, the surface of the metal material 41 coated with the resist 41a is exposed to ultraviolet rays by a photolithography method to form a resist pattern 42 in a predetermined region. (FIGS. 3A to 3B)
At this time, the resist patterns 42 formed on both surfaces of the metal material 41 are as follows. That is, the resist pattern 42 formed in the bonding region portion S on the surface in contact with the resin molded body 11 is set as a pattern having minute holes. As the pattern of minute holes formed in the resist 41a, a pattern in which a large number of fine line-shaped hole parts are arranged in parallel, a pattern in which a large number of fine line-shaped hole parts are combined in a lattice pattern, a large number of dot-shaped hole parts Other suitable patterns can be used. In the region where the pad portion 13 and the lead portion 14 of the metal material 41 are formed, a resist pattern 42 without a minute hole is formed, and the portion of the gap portion 15 is a region where there is no resist.
On the surface of the lead frame 10 on the side that becomes the second surface 10c, there is no resist at the gap portion 15, and other portions (including the region where the pad portion 13 and the lead portion 14 are formed) are included. A resist pattern 42 without a minute hole is formed.

Next, a portion of the metal material 41 other than that covered with the resist pattern 42 is removed by etching, thereby forming a lead frame 50 having a plurality of sets of pad portions 13 and lead portions 14.
In the present embodiment, by using the half etching method as the etching method, the unevenness 51 having a step of 20 to 30 μm is formed in the bonding region S surrounding the pad portion 13 and the lead portion 14 in a plan view in the lead frame 50. That is, the resist pattern 42 having minute holes formed in the bonding region portion S is used to etch the minute hole portions to form recesses, and the portions covered with the resist are not etched. As a result, the irregularities 51 are formed (FIG. 3C).
After the etching is completed, the resist pattern 42 on both surfaces of the metal material 41 is removed.

  Next, the metal material 41 on which the irregularities 51 are formed is accommodated in a mold, and transfer molding is performed by filling the mold with resin from a molding machine, thereby forming the resin molded body 11. The pad portion 13 and the lead portion 14 of the lead frame 50 are exposed at the bottom opening 12 b of the recess 12 of the formed resin molded body 11.

  Thereafter, the resin molded body 11 is baked under a predetermined temperature condition to cure the resin, and then the resin molded body 11 remaining on the pad portion 13 and the lead portion 14 is deburred by a wet blast method or the like. As a result, the lead frame substrate 10 is completed.

  After that, as shown in FIG. 2, the LED light emitting element 20 is mounted on the pad portion 13, and the LED light emitting element 20 and the lead portion 14 are electrically connected by the wire bonding method using the wire 21. .

  Thereafter, the sealing resin 30 is filled in the recess 12 and cured, and then separated for each recess 12 to form a plurality of LED light emitting device A.

  In the above, the pad portion 13 and the lead portion 14 of the lead frame 50 may be plated with silver or the like before the resin molded body 11 is formed, or may be plated after the resin molded body 11 is formed. May be.

  According to the configuration described above, since the unevenness 51 is formed in the region S in contact with the resin molded body 11 in the lead frame 50, the lead frame 50 and the resin molded body in the lead frame substrate 10 and the LED light emitting device A. 11 can be improved. As a result, moisture and impurities can be prevented from entering from the interface between the resin molded body 11 and the lead frame 50, and the occurrence of defective products due to poor adhesion can be suppressed.

The present invention is not limited to the above-described embodiments described with reference to the drawings, and various modifications are conceivable within the technical scope thereof.
For example, the unevenness formed in the lead frame of the present invention may be formed so as to substantially surround at least the pad portion 13 and the lead portion 14 in a plan view, and does not necessarily have to be completely surrounded without a gap.
In addition, the configuration described in the above embodiment may be selected or changed to another configuration as long as it does not depart from the gist of the present invention, such as the shape and number of recesses, the arrangement of pads and leads, materials, etc. Is possible.

DESCRIPTION OF SYMBOLS 10 LED light emitting element lead frame board | substrate 10b 1st surface 10c 2nd surface 11 Resin molding 12 Recessed part 12a Side surface 12b Bottom opening 13 Pad part 14 Lead part 15 Gap part 20 LED light emitting element 21 Wire 30 Sealing resin 41 Metal Material 41a Resist 42 Resist pattern 50 LED light emitting element lead frame 51 Concavity and convexity A LED light emitting element device S area (bonding area)

Claims (5)

A resin molded body having one or more recesses on the first surface;
A pad frame provided on the bottom surface of the recess, for mounting at least one LED light emitting element, and a lead frame having a lead part for electrical connection with the LED light emitting element;
The lead frame for an LED light emitting element, wherein the lead frame is larger than a bottom opening of the concave portion, and has an unevenness at an interface with the resin molded body on an outer peripheral side of the bottom opening of the concave portion. substrate.   The lead frame substrate for an LED light-emitting element according to claim 1, wherein the unevenness is formed by half etching.   The lead frame substrate for an LED light-emitting element according to claim 1, wherein the unevenness has a step of 20 to 30 μm. A lead frame substrate for an LED light-emitting element according to any one of claims 1 to 3,
An LED light emitting element housed in the recess and mounted on the pad portion;
A wire for electrically connecting the LED light emitting element and the lead portion;
A sealing resin filled in the recess and having transparency;
An LED light-emitting element device comprising: A pad portion for mounting at least one LED light emitting element;
A lead portion for electrically connecting to the LED light emitting element;
A joining region part formed so as to surround the pad part and the lead part in plan view, and joined to the resin molded body;
With
A lead frame for an LED light emitting element, wherein the joining region portion is formed by half-etching, and irregularities are formed for increasing the joining strength with the resin molded body.

Images