CN118354529A - Method for producing sheet-like ceramic body and sheet-like ceramic body - Google Patents
Method for producing sheet-like ceramic body and sheet-like ceramic body Download PDFInfo
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- CN118354529A CN118354529A CN202410578902.7A CN202410578902A CN118354529A CN 118354529 A CN118354529 A CN 118354529A CN 202410578902 A CN202410578902 A CN 202410578902A CN 118354529 A CN118354529 A CN 118354529A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 158
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000010410 layer Substances 0.000 claims description 155
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 239000011241 protective layer Substances 0.000 claims description 27
- 239000004800 polyvinyl chloride Substances 0.000 claims description 9
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 10
- 230000009471 action Effects 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003666 anti-fingerprint Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000010409 ironing Methods 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The application discloses a preparation method of a flaky ceramic body and the flaky ceramic body. The preparation method of the flaky ceramic comprises the following steps: providing a substrate to be processed, wherein the substrate to be processed comprises a first base layer, a second base layer and an information carrier part, wherein the first base layer and the second base layer are arranged in a stacked mode, and the information carrier part is arranged on one side, away from the first base layer, of the second base layer; removing a part of the second base layer which is not covered by the information carrier part to form a laminated structure composed of the second base layer and the information carrier part correspondingly arranged on one side of the second base layer; separating the laminate structure from the first substrate; providing a flaky ceramic, wherein a first slot is formed in the surface of the flaky ceramic, and the laminated structure is fixed in the first slot. The substrate to be processed is processed to obtain the required laminated structure comprising the information carrier part, and the laminated structure is fixed in the first slot of the flaky ceramic to form the required flaky ceramic body, so that the situation that the information carrier part is too thin to be fixed in the first slot is effectively avoided, and the process is simple and easy to realize.
Description
Technical Field
The application relates to the technical field of ceramic manufacture, in particular to a preparation method of a flaky ceramic body and the flaky ceramic body.
Background
The sheet ceramic body may serve as a medium for identifying individuals and storing individual information.
Limited by the structural materials of the existing sheet ceramic body, the existing preparation process of the sheet ceramic body cannot meet the requirements.
Disclosure of Invention
The embodiment of the application provides a preparation method of a sheet ceramic body and the sheet ceramic body, which are characterized in that a substrate to be processed is processed to obtain a required laminated structure comprising an information carrier part, the laminated structure is fixed in a first slot of the sheet ceramic to form the required sheet ceramic body, a second base layer in the laminated structure can be used for bearing the information carrier part, the thickness of the second base layer can be adjusted according to actual needs to adjust the thickness of the laminated structure, the situation that the information carrier part is too thin to be fixed in the first slot is effectively avoided, and the technology is simple and easy to realize.
The embodiment of the application provides a preparation method of a flaky ceramic, which comprises the following steps: providing a substrate to be processed, wherein the substrate to be processed comprises a first base layer, a second base layer and an information carrier part, wherein the first base layer and the second base layer are arranged in a stacked mode, and the information carrier part is arranged on one side, away from the first base layer, of the second base layer; removing a part of the second base layer which is not covered by the information carrier part to form a laminated structure formed by the second base layer and the information carrier part correspondingly arranged on one side of the second base layer; separating the laminate structure from the first base layer; providing a sheet ceramic, wherein a first slot is formed in the surface of the sheet ceramic, and the laminated structure is fixed in the first slot.
According to an embodiment of the present application, in the step of processing the substrate: the substrate to be processed further comprises a thickness compensation layer formed on one side of the first base layer, which is away from the second base layer.
According to an embodiment of the present application, in the step of processing the substrate: an ink layer is formed on a side surface of the second base layer facing the first base layer.
According to an embodiment of the present application, in the step of processing the substrate: the substrate to be processed further includes a first protective layer formed between a second base layer and the information carrier portion; the step of removing a portion of the second base layer not covered by the information carrier section to form a laminated structure of the second base layer and the information carrier section covering the second base layer includes: and removing part of the first protective layer and the second base layer to form a laminated structure consisting of the second base layer, the first protective layer and the information carrier part arranged on one side of the first protective layer, which is away from the second base layer.
According to an embodiment of the present application, the color of the second base layer is the same as the color of the sheet ceramic.
According to an embodiment of the present application, the material of the second base layer includes polyvinyl chloride.
According to an embodiment of the present application, between the step of separating the laminated structure and the first base layer and the step of providing a sheet-like ceramic, further comprising: and adhering an adhesive layer on at least one side surface of the laminated structure.
According to an embodiment of the present application, the step of adhering the adhesive layer to the surface of one side of the laminated structure includes: the laminated structure comprises a first surface and a second surface which are opposite to each other, a first adhesive layer is formed on the first surface, a second adhesive layer and a second protective layer are formed on the second surface, and the first surface is far away from the second base layer relative to the second surface; and forming a release layer on one side of the first adhesive layer, which is away from the laminated structure.
According to an embodiment of the present application, between the step of adhering a glue layer to one side surface of the laminated structure and the step of providing a sheet ceramic, the method further includes: and removing the release layer to bond the first adhesive layer and the flaky ceramic.
According to an embodiment of the present application, in the step of providing a sheet ceramic, it includes: the method comprises the steps of providing sheet ceramics, wherein the sheet ceramics comprise a first sheet ceramic and a second sheet ceramic which are connected, a first slot is formed in one side surface of the first sheet ceramic, which faces away from the second sheet ceramic, a second slot is formed in one side surface of the first sheet ceramic, which faces towards the second sheet ceramic, an energy supply unit is arranged in the second slot, an electronic element is arranged on the second sheet ceramic, and the electronic element is electrically connected with the energy supply unit.
According to an embodiment of the present application, the orthographic projection shape of the electronic component and the energy supply unit on the second sheet ceramic is the same as the orthographic projection shape of the second slot on the second sheet ceramic.
According to an embodiment of the present application, a third glue layer is provided between the first and second sheet ceramics.
Another embodiment of the present application provides a sheet ceramic body, which is prepared by using the method for preparing a sheet ceramic body in any one of the above embodiments.
The method for preparing the flaky ceramic body provided by the embodiment of the invention is characterized in that the needed laminated structure comprising the information carrier part is obtained by processing the substrate to be processed, and the laminated structure is fixed in the first slot of the flaky ceramic body to form the needed flaky ceramic body, the second base layer in the laminated structure can be used for bearing the information carrier part, the thickness of the second base layer can be adjusted according to actual needs to adjust the thickness of the laminated structure, the situation that the information carrier part cannot be fixed in the first slot due to over-thinness is effectively avoided, and the method is simple in process and easy to realize.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a flow chart of a method of preparing a sheet ceramic body according to an embodiment of the application;
FIG. 2 is a schematic cross-sectional view of the structure obtained in step S110 in a method for producing a ceramic sheet according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of the structure obtained in step S120 in the method for producing a ceramic sheet according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of the structure obtained in step S130 in the method for producing a ceramic sheet according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view showing the structure obtained in step S140 in the method for producing a ceramic sheet according to an embodiment of the present invention;
FIG. 6 is a schematic view of a structure of a substrate to be processed according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of a structure obtained during a preparation process corresponding to a preparation method of a sheet ceramic according to an embodiment of the present invention;
fig. 8 is a diagram of the relative positions of a first slot and a second slot provided in an embodiment of the present invention.
Reference numerals:
10. a substrate to be processed;
1. A first base layer;
2. a second base layer;
3. An information carrier section;
4. a first sheet ceramic;
5. A second sheet ceramic;
6. an electronic component;
7. An energy supply unit;
8. a pattern layer;
B1, a first protective layer; b2, a second protective layer; k1, first slotting; k2, second slotting; j1, a first adhesive layer; j2, a second adhesive layer; j3, a third adhesive layer; t, flaky ceramic; l, release layer; H. a thickness compensation layer; y, ink layer.
Detailed Description
Features and exemplary embodiments of various aspects of the application are described in detail below. In the following detailed description; numerous specific details are set forth; in order to provide a thorough understanding of the present application. However; as will be apparent to those skilled in the art; the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.
It should be noted that; in the case of no collision; the embodiments of the present application and the features of the embodiments may be combined with each other. The embodiments will be described in detail below with reference to the accompanying drawings.
Relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action; and does not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the method comprises the steps of; the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion; such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements; but also includes other elements not explicitly listed; or also include elements inherent to such processes, methods, articles, or apparatus. Without further limitation; elements defined by the statement "include … …"; it does not exclude that an additional identical element is present in a process, method, article or apparatus that comprises the element.
It should be understood that; in describing the structure of the component; when a layer, an area is referred to as being "on" or "over" another layer, another area; may refer to being directly on top of another layer, another region; or further layers or regions between it and another layer or region. And, moreover; if the component is flipped; the one layer, one region, will be located "under" or "beneath" the other layer, another region.
In addition, the method comprises the steps of; the term "and/or" herein; only one type of association relationship describing the associated object; three relationships may exist for the representation; for example; a and/or B; it can be expressed that: a alone; both A and B are present; there are three cases B alone. In addition, the method comprises the steps of; the character "/" herein; generally, it is indicated that the context-dependent object is an or relationship.
It should be understood; in the embodiment of the application; "B corresponding to A" means that B is associated with A; from a, B can be determined. But it should also be understood; determining B from a does not mean determining B from a alone; b may also be determined from A and/or other information.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for preparing a sheet ceramic according to an embodiment of the application.
The embodiment of the application provides a preparation method of a flaky ceramic, which comprises the following steps:
S110: providing a substrate 10 to be processed, the substrate 10 to be processed comprising a first base layer 1, a second base layer 2, and an information carrier part 3 provided on a side of the second base layer 2 facing away from the first base layer 1, which are arranged in a stack, as shown in fig. 2;
S120: removing a portion of the second base layer 2 not covered by the information carrier section 3 to form a laminated structure of the second base layer 2 and the information carrier section 3 provided correspondingly to one side of the second base layer 2, as shown in fig. 3;
S130: separating the laminate structure from the first base layer 1 as shown in fig. 4;
s140: the sheet ceramic T is provided, and a first slot K1 is provided on the surface of the sheet ceramic T, and the laminated structure is fixed in the first slot K1, as shown in fig. 5.
According to the preparation method of the sheet ceramic body provided by the embodiment of the invention, the substrate 10 to be processed is processed to obtain the required laminated structure comprising the information carrier part 3, and the laminated structure is fixed in the first slot K1 of the sheet ceramic T to form the required sheet ceramic body, the second base layer 2 in the laminated structure can be used for bearing the information carrier part 3, the thickness of the second base layer 2 can be adjusted according to actual needs to adjust the thickness of the laminated structure, and the situation that the information carrier part 3 is too thin to be fixed in the first slot K1 is effectively avoided, so that the process is simple and easy to realize.
In step S110, the first base layer 1, the second base layer 2 and the information carrier portion 3 may be fixedly connected by a hot-sticking process, the second base layer 2 is used for supporting the information carrier portion 3, the information carrier portion 3 is a carrier of specific information content, and may be formed by a hot-sticking, magnetic mounting, flat ironing, or other process. The second base layer 2 can be made of various plastic-based materials such as PVC (polyvinyl chloride), ABS (acrylonitrile butadiene styrene), PC (polycarbonate), PG (polystyrene), PET (polyethylene terephthalate), rPVC (recycled polyvinyl chloride), PETG (polyethylene terephthalate), and the like.
Alternatively, the information carrier part 3 may comprise at least one of a security mark, a signature strip. The specific requirements are selected according to specific needs. The information carrier parts 3 with different functions, such as anti-counterfeit marks, signature strips, etc., can be arranged in different laminated structures respectively so as to avoid mutual interference.
In step S120, a portion of the second base layer 2 may be removed by an engraving process, and the second base layer 2 and the information carrier portion 3 corresponding to one side of the second base layer 2 may be understood as having the same or similar shape and size as the shape and size of the information carrier portion 3 located thereon, that is, the second base layer 2 may be engraved along the edge of the information carrier portion 3, and a portion of the second base layer 2 not covered by the information carrier portion 3 may be removed, and when a plurality of information carrier portions 3 are provided, a plurality of laminated structures may be correspondingly formed.
Alternatively, the engraving may be performed along the contour of the outer edge of the information carrier part 3 by means of an engraving machine with a depth slightly deeper than the thickness of the second base layer 2, which ensures that the engraved information carrier part 3 is completely peeled off from the first base layer 1.
In step S130, the laminate structure and the first base layer 1 may be peeled off by the principle that the specific interlayer is not firmly bonded under the action of hot pressing by the offset ink.
In step S140, a first slot K1 may be formed on the surface of the sheet ceramic T by using CNC (ENGRAVING AND MILLING MACHINE, CNC engraving and milling machine) or other engraving and milling equipment, and then the first slot K1 is etched by using a laser device, where the etching effect is equivalent to roughening the surface of the inner slot, so as to enhance the firmness of the adhesive layer bonding between the sheet ceramic T and the laminated structure.
In some alternative embodiments, in the step of treating the substrate 10: the substrate 10 to be processed further comprises a thickness compensation layer H formed on the side of the first base layer 1 facing away from the second base layer 2.
It will be appreciated that the thickness compensation layer H serves to compensate for the thickness of the substrate 10 to be processed, and if the substrate 10 to be processed is too thin, it will affect the processing of the equipment, including the cutting, hot-stamping, etc. of the substrate 10 to be processed, so that the thickness compensation layer H is used to compensate the thickness of the substrate 10 to be processed to the thickness of a conventional PVC product, for example, 0.8mm, reducing unnecessary equipment modification, and performing production processing using existing equipment as much as possible, so as to reduce production cost.
Referring to fig. 6, in some alternative embodiments, in the step of treating the substrate 10: the second base layer 2 is formed with an ink layer Y on a side surface facing the first base layer 1.
When the substrate 10 to be processed is formed by a hot pressing process, the adhesive force between the second base layer 2 and the first base layer 1, that is, the adhesive firmness of the second base layer 2 and the first base layer 1 is reduced by using the ink layer Y, so that the second base layer 2 and the first base layer 1 can be peeled off later.
Alternatively, the color of the ink layer Y is the same as that of the second base layer 2, and for example, black ink or white ink may be offset-printed.
The color of the second base layer 2 is the same as that of the flaky ceramic T so as to improve the integration effect of the two, for example, when the flaky ceramic T is black, a black PVC substrate is selected as the second base layer 2, and the ink layer Y correspondingly adopts black ink; when the white flaky ceramic T is used, a white PVC substrate is selected as the second base layer 2, and the ink layer Y correspondingly adopts white ink.
Referring to fig. 6, in some alternative embodiments, in the step of treating the substrate 10: the substrate 10 to be processed further comprises a first protective layer B1 formed between the second base layer 2 and the information carrier part 3.
The first protective layer B1 is used for carrying heat pasting, mounting magnetism, ironing and the like of the information carrier part 3, and the first protective layer B1 can be a PVC transparent film.
When the first protective layer B1 is provided, the first protective layer B1, the second base layer 2, and the information carrier portion 3 need to be etched in correspondence with each other, so that the first protective layer B1, the second base layer 2, and the information carrier portion 3 together form a laminated structure, and the shape and size of the first protective layer B1 and the shape and size of the information carrier portion 3 remain the same.
Specifically, in the step of removing a part of the second base layer 2 to form a laminated structure of the second base layer 2 and the information carrier section 3 covering the second base layer 2, it includes: part of the first protective layer B1 and part of the second base layer 2 are removed to form a laminated structure of the second base layer 2, the first protective layer B1 and the information carrier part 3 provided on the side of the first protective layer B1 facing away from the second base layer 2.
In the present embodiment, the laminated structure includes three parts of the second base layer 2, the first protective layer B1, and the information carrier portion 3.
In the prior art, the information carrier part 3 is processed on the plastic substrate by heat transfer (i.e., heat bonding, but the sheet ceramic T is fired in a 1300 ℃ blast furnace, and the surface thereof has strong heat resistance, so that the conventional heat bonding method cannot directly realize mass transfer on the surface of the sheet ceramic T, and the information carrier part 3 cannot be adhered on the sheet ceramic T by heat bonding.
In order to solve the above-mentioned problems, the embodiment of the present invention obtains a laminated structure including at least the second base layer 2 and the information carrier portion 3 by processing the substrate 10 to be processed, and the laminated structure can be directly bonded to the sheet-like ceramic T through the adhesive layer without using a thermal bonding method.
For example, in some alternative embodiments, between the steps of separating the laminated structure from the first base layer 1 and providing the sheet-like ceramic T, it further includes: and adhering an adhesive layer on at least one side surface of the laminated structure.
The adhesive layer may be disposed on only one side surface of the second base layer 2 facing away from the information carrier portion 3, so as to bond with the sheet-shaped ceramic T by using the adhesive layer, or the adhesive layer may be disposed on both one side surface of the second base layer 2 facing away from the information carrier portion 3 and one side surface of the information carrier portion 3 facing away from the second base layer 2, so that other film layers, such as a protective layer, may be bonded on one side surface of the information carrier portion 3 facing away from the second base layer 2 through the adhesive layer according to actual needs.
Referring to fig. 7, in some alternative embodiments, the step of adhering the adhesive layer to one side surface of the laminated structure includes: the laminated structure comprises a first surface and a second surface which are opposite, wherein a first adhesive layer J1 is formed on the first surface, a second adhesive layer J2 and a second protective layer B2 are formed on the second surface, and the first surface is far away from the second base layer 2 relative to the second surface.
In this embodiment the first surface is arranged away from the second base layer 2 with respect to the second surface, which is understood to correspond to a side surface of the information carrier part 3 facing away from the second base layer 2, and the second surface corresponds to a side surface of the second base layer 2 facing away from the information carrier part 3. The second protective layer B2 may be provided to protect the information carrier part 3 before being attached to the sheet ceramic T, to prevent the surface of the information carrier part 3 from being scratched, and the second protective layer B2 may be removed after being attached to the sheet ceramic T.
In order to avoid that the first adhesive layer J1 is adhered with impurities before being transferred to the flaky ceramic T and the viscosity of the flaky ceramic T is affected, a release layer L can be formed on one side of the first adhesive layer J1 deviating from the laminated structure, and when the flaky ceramic T is used, the release layer L can be taken off and adhered against a first groove K1 reserved on the flaky ceramic T.
For example, between the step of adhering the adhesive layer to one side surface of the laminated structure and the step of providing the sheet-like ceramic T, further comprising: the release layer L is removed to bond the first adhesive layer J1 and the sheet ceramic T.
Referring to fig. 5 and 8, in some alternative embodiments, in the step of providing the sheet ceramic T, it includes: the sheet ceramic T is provided and comprises a first sheet ceramic 4 and a second sheet ceramic 5 which are connected, a first slot K1 is formed on one side surface of the first sheet ceramic 4 facing away from the second sheet ceramic 5, a second slot K2 is formed on one side surface of the first sheet ceramic 4 facing towards the second sheet ceramic 5, an energy supply unit 7 is arranged in the second slot K2, an electronic element 6 is arranged on the second sheet ceramic 5, and the electronic element 6 is electrically connected with the energy supply unit 7.
In this embodiment, the energy supply unit 7 may supply energy to the electronic component 6 so that the electronic component 6 may communicate with the outside or other interaction.
Optionally, the electronic component 6 includes a chip module, the chip module includes a chip and a carrier tape, the front surface of the carrier tape is provided with a contact pad, the power is supplied to the chip during contact payment, the back surface of the carrier tape also includes a contact, the power supply unit 7 may include a coil, the contact is connected with the coil, and the coil supplies power to the chip during non-contact payment.
Optionally, a chip carrying area and a plurality of functional areas are arranged on the carrier tape, wherein the chip carrying area and the functional areas are isolated from each other, and the functional areas are an input/output functional area, a clock functional area, a power functional area, a grounding functional area, a reset functional area and an idle functional area in sequence.
The second sheet ceramic 5 may also be provided with a slot for receiving the stationary electronic component 6. The second slot K2 may reserve a space for accommodating part of the electronic component 6 in view of the need for the electronic component 6 to be electrically connected to the power supply unit 7.
In the prior art, after the energy supply unit 7 is embedded into the second sheet ceramic 5, the energy supply unit is electrically connected with the electronic component 6 through the leads, and the leads are fragile due to the sharp grooved edges of the sheet ceramic T, so that the leads on two sides are easily cut off by the grooved edges, and particularly, the leads need to be frequently bent in the welding packaging process, so that the leads on two sides are easily broken.
To solve the above-mentioned problems, in the present embodiment, the electronic component 6 and the power supply unit 7 may be connected by means of soldering or the like before the step of embedding the sheet ceramic T, after which the electronic component 6 and the power supply unit 7 are embedded as a whole into the second sheet ceramic 5, after which the first sheet ceramic 4 and the second sheet ceramic 5 are bonded, and at the same time, the packaging of the electronic component 6 is completed, which saves the flow of individually packaging the electronic component 6, and avoids the problem that the connecting leads between the electronic component 6 and the power supply unit 7 are cut by the sheet ceramic T.
Optionally, the orthographic projection shape of the electronic element 6 and the energy supply unit 7 on the second sheet ceramic 5 is the same as the orthographic projection shape of the second slot K2 on the second sheet ceramic 5, so as to improve the fixing firmness and reduce the interference friction of the sheet ceramic T on the lead after the preparation is completed.
Optionally, the power supply unit 7 includes a coil, where the coil includes a flexible material antenna or an enameled wire winding antenna, for example, the coil may use a PI (Polyimide) substrate, which has very high toughness and temperature resistance, and the PI substrate may be thin enough to be more beneficial to being embedded in the first sheet ceramic 4, so that the possibility of grinding a lead is substantially avoided due to the special property of the flexible material, and the possibility of breakage during the production process is reduced.
The ceramic material is a special material with high hardness and high temperature resistance, so that the conventional product graphic printing mode is not suitable for processing on the surface of the sheet ceramic T, and in some alternative embodiments, the sheet ceramic body further comprises a pattern layer 8, the pattern layer 8 is arranged on the side of the first sheet ceramic 4 away from the second sheet ceramic 5 and/or the side surface of the second sheet ceramic 5 away from the first sheet ceramic 4, and the pattern layer 8 is formed by one of silk screen printing, electroplating, color burning and photoetching modes.
The photoetching can be laser etching, and the laser etching is carried out on the surface of the flaky ceramic T by high-energy laser.
Optionally, the sheet ceramic body further comprises an anti-fingerprint layer, wherein the anti-fingerprint layer is arranged on the side of the first sheet ceramic 4 away from the second sheet ceramic 5 and/or on the surface of the side of the second sheet ceramic 5 away from the first sheet ceramic 4.
After the processing of the sheet ceramic body is finished, the fingerprint prevention layer can be prevented from being sprayed on the side, away from the second sheet ceramic 5, of the first sheet ceramic 4 and/or the side, away from the first sheet ceramic 4, of the second sheet ceramic 5, fingerprint aggregation can be prevented to a certain extent, the surface image and text of the sheet ceramic body can be protected, and the fingerprint prevention layer is generally a transparent coating and cannot influence the texture and the color of the existing pattern.
In some alternative embodiments, a third glue layer J3 is provided between the first 4 and second 5 sheet ceramics to achieve a connection fixation between the first 4 and second 5 sheet ceramics.
Referring to fig. 5, the embodiment of the present invention further provides a sheet ceramic body, which is formed by using the preparation method of the sheet ceramic body in any one of the above embodiments.
While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (13)
1. A method for producing a sheet-like ceramic, comprising:
providing a substrate to be processed, wherein the substrate to be processed comprises a first base layer, a second base layer and an information carrier part, wherein the first base layer and the second base layer are arranged in a stacked mode, and the information carrier part is arranged on one side, away from the first base layer, of the second base layer;
Removing a part of the second base layer which is not covered by the information carrier part to form a laminated structure formed by the second base layer and the information carrier part correspondingly arranged on one side of the second base layer;
Separating the laminate structure from the first base layer;
Providing a sheet ceramic, wherein a first slot is formed in the surface of the sheet ceramic, and the laminated structure is fixed in the first slot.
2. The method for producing a sheet ceramic body according to claim 1, wherein in the step of processing the substrate to be processed:
the substrate to be processed further comprises a thickness compensation layer formed on one side of the first base layer, which is away from the second base layer.
3. The method for producing a sheet ceramic body according to claim 1, wherein in the step of processing the substrate to be processed:
an ink layer is formed on a side surface of the second base layer facing the first base layer.
4. The method for producing a sheet ceramic body according to claim 1, wherein in the step of processing the substrate to be processed: the substrate to be processed further includes a first protective layer formed between a second base layer and the information carrier portion;
The step of removing a portion of the second base layer not covered by the information carrier section to form a laminated structure of the second base layer and the information carrier section covering the second base layer includes: and removing part of the first protective layer and the second base layer to form a laminated structure consisting of the second base layer, the first protective layer and the information carrier part arranged on one side of the first protective layer, which is away from the second base layer.
5. The method of producing a sheet ceramic according to claim 1, wherein the color of the second base layer is the same as the color of the sheet ceramic.
6. The method of preparing a sheet ceramic according to claim 1, wherein the material of the second base layer comprises polyvinyl chloride.
7. The method of producing a sheet ceramic according to claim 1, further comprising, between said step of separating said laminated structure from said first base layer and said step of providing a sheet ceramic:
and adhering an adhesive layer on at least one side surface of the laminated structure.
8. The method of producing a sheet ceramic body according to claim 7, wherein the step of adhering a glue layer to one side surface of the laminated structure comprises:
The laminated structure comprises a first surface and a second surface which are opposite to each other, a first adhesive layer is formed on the first surface, a second adhesive layer and a second protective layer are formed on the second surface, and the first surface is far away from the second base layer relative to the second surface;
And forming a release layer on one side of the first adhesive layer, which is away from the laminated structure.
9. The method of producing a sheet ceramic according to claim 8, wherein between the step of adhering a glue layer to one side surface of the laminated structure and the step of providing a sheet ceramic, further comprising:
and removing the release layer to bond the first adhesive layer and the flaky ceramic.
10. The method for producing a sheet ceramic according to claim 1, wherein in the step of providing a sheet ceramic, comprising:
The method comprises the steps of providing sheet ceramics, wherein the sheet ceramics comprise a first sheet ceramic and a second sheet ceramic which are connected, a first slot is formed in one side surface of the first sheet ceramic, which faces away from the second sheet ceramic, a second slot is formed in one side surface of the first sheet ceramic, which faces towards the second sheet ceramic, an energy supply unit is arranged in the second slot, an electronic element is arranged on the second sheet ceramic, and the electronic element is electrically connected with the energy supply unit.
11. The method of producing a sheet ceramic according to claim 10, wherein the orthographic projection shape of the electronic component and the power supply unit on the second sheet ceramic is the same as the orthographic projection shape of the second slot on the second sheet ceramic.
12. The method of producing a sheet ceramic according to claim 10, wherein a third adhesive layer is provided between the first sheet ceramic and the second sheet ceramic.
13. A sheet ceramic body, characterized by being produced by the production method of the sheet ceramic body according to any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410578902.7A CN118354529A (en) | 2024-05-10 | 2024-05-10 | Method for producing sheet-like ceramic body and sheet-like ceramic body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410578902.7A CN118354529A (en) | 2024-05-10 | 2024-05-10 | Method for producing sheet-like ceramic body and sheet-like ceramic body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118354529A true CN118354529A (en) | 2024-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410578902.7A Pending CN118354529A (en) | 2024-05-10 | 2024-05-10 | Method for producing sheet-like ceramic body and sheet-like ceramic body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118354529A (en) |
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2024
- 2024-05-10 CN CN202410578902.7A patent/CN118354529A/en active Pending
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