JP3910739B2 - Contact IC card and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a contact type IC card and a manufacturing method thereof.
[0002]
[Prior art]
There are two types of IC cards: contact type and non-contact type. A non-contact type IC card is formed by forming a recess in an IC card substrate, embedding and fixing an IC module therein, and then laminating the entire IC card with an overlay film. On the other hand, since the external contact terminals of the IC module must be exposed on the surface of the IC card, the contact IC card cannot be laminated with an overlay film after the IC module is embedded. For this reason, in the contact type IC card, a recess for embedding the IC module is formed in the IC card substrate after being laminated with the overlay film, and then the IC module is mounted and fixed in the recess. .
[0003]
In a conventional contact type IC card, a printing layer is formed on a center core substrate, the printing layer is laminated with an overlay film, and the adhesive strength of the printing ink used for the printing layer is utilized to There is a configuration in which an overlay film is attached, and then a recess for embedding the IC module is drilled, and the IC module is embedded and fixed in the recess to expose the external contact terminal.
[0004]
In such an IC card, the recess for embedding the IC module is drilled using a small diameter drill or the like, but when performing the processing operation, the adhesive force between the center core substrate and the overlay film cannot be sufficiently maintained, As a result, the inconvenience often occurs that the overlay film peels around the perforated recess.
[0005]
Furthermore, in other examples of conventional contact type IC cards, by using an injection molding technique, necessary characters and designs are printed on an IC card substrate in which a recess for embedding an IC module is formed in advance, and the recess The IC module is embedded and fixed to expose the external contact terminal.
[0006]
In such an IC card, since the process of laminating with an overlay film is not performed, the printed layer is generally exposed to the top layer, and the surface strength is lowered as compared with the case of being laminated with the overlay film.
[0007]
[Problems to be solved by the invention]
The object of the present invention is to prevent the overlay film of the IC card substrate from being peeled when the recess for embedding the IC module is drilled in the IC card substrate, and to facilitate the mounting process of the IC module to the IC card. Is to make it.
[0008]
[Means for Solving the Problems]
In the present invention, a first adhesive layer is provided on the center core substrate surface, a printed layer representing characters and figures is formed on the first adhesive layer, and a second adhesive layer is further formed thereon. And then laminating with an overlay film, then drilling a recess for embedding the IC module, embedding the IC module in the recess, and pressing and heating from both sides with a flat finishing member, and so on It features an IC card configured as described above.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
In FIG. 1, a first adhesive layer 2 is provided on both surfaces of a center core substrate 1 that forms the base of an IC card. This adhesive layer is made of materials such as polyethylene, polypropylene, and vinyl chloride, and has a relatively smooth surface that can be printed before heat is applied. It is made of heat sensitive adhesive. Although a pressure-sensitive adhesive can be used as the adhesive, a heat-sensitive adhesive is preferable in that the adhesive strength is further strengthened when pressure is applied while heating in the final processing step of the IC card. On the surface of the heat-sensitive adhesive layer, a print layer 3 on which necessary characters and designs are printed is formed. On the printed layer 3, an overlay film 5 having a second adhesive layer 4 formed on the surface is laminated to constitute a substrate. This substrate is punched into a card shape by a conventionally known method to form an IC card substrate. The second adhesive layer is made of the same material as that of the first adhesive layer, and a transparent material is used so that the printed layer can be seen through. The center core substrate 1 and the overlay film 5 are made of materials such as polyvinyl chloride, polyethylene terephthalate, polypropylene, ABS resin, biodegradable resin, and the like. In particular, the overlay film 5 is made of a transparent material.
[0010]
In the above description, the method of forming the printing layer 3 on the adhesive layer 2 on the center core substrate 1 has been described. However, as a different method, the printing layer is applied to the adhesive layer 4 provided on the overlay film 5. after 3 was formed, it may be laminated to the laminated structure opposite the printing layer 3 on the adhesive layer 2 of the center core substrate 1. In the case of this method, since a printing layer can be formed on the flexible sheet-like overlay film 5, the printing process becomes easier as compared with printing on a hard center core substrate.
[0011]
The overlay film 5, the second adhesive layer 4, the printed layer 3, and the first adhesive layer 2 are formed at predetermined locations on the IC card substrate formed as described above using a processing device such as a small diameter drill. A recess 7 for embedding the IC module 6 through the center core substrate 1 is formed. Since the adhesive layer is provided on both sides of the printing layer 3 and the adhesive force is firmly maintained, the overlay film 5 can be prevented from being peeled off when the recess 7 is formed. Next, an IC module 6 having a heat-sensitive third adhesive layer applied to the bottom surface and the peripheral surface is mounted in the recess 7. The IC card constructed as described above is clamped at a moderate pressure while being heated at a required temperature by being sandwiched between two mirror surface members on both sides of the IC card, which is a conventionally known method. As a result, the first, second, and third adhesive layers are softened or melted by heating and then cured and bonded again, so that the bonding strength between the center core substrate 1, the overlay film 5, and the IC module 6 is increased. Is made stronger. The IC module 6 is firmly mounted on the IC card substrate with the surface exposed, and an IC card having a smooth surface is completed.
[0012]
【The invention's effect】
As described above, first, a substrate composed of a center core base material, an adhesive layer, a printing layer, and an overlay film is formed, and then an IC card substrate is formed by punching into a card shape. A durable IC card with a smooth surface and less prone to peeling can be manufactured with fewer steps than the conventional one by simply forming a recess in the IC, and mounting the IC module on the recess, followed by thermocompression bonding. Thus, in the present invention, the appearance of the IC card is improved and the productivity of the IC card is also improved.
[Brief description of the drawings]
FIG. 1 is a diagram showing a cross-sectional structure of an IC card according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Center core base material 2 1st adhesive layer 3 Print layer 4 2nd adhesive layer 5 Overlay film 6 IC module 7 Recess

Claims (4)

A center core base material provided with a first adhesive layer on at least one surface, a printed layer formed on the first adhesive layer, and a second adhesive layer on the printed layer Laminated overlay films, first and second adhesive layers, a printed layer, a recess formed through the center core substrate, and a third adhesive layer on the bottom and sides of the recess. And an IC module fixed to the recess, and the first, second and third adhesive layers are adhesives made of a heat-sensitive material and are formed by pressing from both sides and heating. Features a contact IC card. A first adhesive layer is provided on at least one surface of the center core substrate, a printed layer is formed on the first adhesive layer, and an overlay film is formed on the printed layer via the second adhesive layer. And forming a recess through the overlay film, the first and second adhesive layers, and the center core substrate, and the IC module is inserted through the third adhesive layer made of a heat-sensitive material into the recess. mounting, and the center core substrate, wherein the first, pressed together with the second and third adhesive layer, the printed layer is heated at a flat member a card containing the overlay film and the IC module from both sides A method for producing a contact type IC card, characterized in that: A first adhesive layer is provided on at least one surface of the center core base material, and a second adhesive layer is provided on the overlay film to be laminated on the center core base material and on the second adhesive layer forming a print layer, the center the adhesive layer of the core substrate so as to face the print layer formed on the overlay film laminated, they overlay film and the first and second adhesive layer and the print layer center core group A recess is formed through the material, and an IC module is mounted on the recess via a third adhesive layer made of a heat-sensitive material, and the center core substrate, the first, second and third adhesives A card including a layer, the overlay film, and the IC module is heated with a flat member from both sides and pressed to finish the card. Method.   4. The method according to claim 2, wherein the first and second adhesive layers are made of a heat sensitive material.

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