CN115579446A - Light-emitting module and light-emitting device - Google Patents

Abstract

The application provides a light-emitting module and have its illuminator, this light-emitting module includes: the substrate is provided with a first surface and a second surface which are positioned on two opposite sides, the first surface is provided with the light-emitting chip and the first optical sensor, the light-transmitting protective layer is arranged on the first surface and covers the light-emitting chip and the first optical sensor, the light-transmitting protective layer is used for guiding part of light emitted by the light-emitting chip to the first optical sensor, the first optical sensor is used for detecting the light emitted by the light-emitting chip, and the light-emitting chip is adjusted to emit light according to the result detected by the first optical sensor. The application provides a light emitting module is through setting up the light that each luminescence chip of first optical sensor real-time supervision sent, and each luminescence chip will carry out differentiation adjustment in real time according to the light detection result to guarantee the homogeneity of luminous demonstration.

Description

Light-emitting module and light-emitting device

technical field

The present application belongs to the technical field of light emitting display, and more specifically relates to a light emitting module and a light emitting device.

Background technique

LED (light-emitting diode, LED) is a semiconductor light source, and the brightness of the LED will increase with the increase of the operating current. White light will be produced by mixing the light from the blue LED chip, the light from the red LED chip and the light from the green LED chip. However, after each LED chip is lit for a period of time, there will be a problem of light attenuation, and each LED chip The light attenuation range of the chip is also different, so there will be a color shift phenomenon for the white light generated in the way of light mixing.

The light emission control of the LED chip in the existing LED light board is to write a set of fixed color temperature compensation curves through the driver chip before leaving the factory. Due to the influence of the slope difference of the color temperature compensation curve, even on the same light board, there will be light. At the same time, because the light attenuation range of each LED chip on the light board is not the same after being lit for a period of time, it is difficult to effectively control the uniformity of the light output picture of the LED light board under the action of a set of fixed color temperature compensation curves .

Contents of the invention

The purpose of the present application is to provide a light-emitting module and a light-emitting device to solve the technical problem of poor uniformity of LED light emission and display in the prior art.

In order to achieve the above object, in the first aspect, the present application provides a light-emitting module, including: a substrate, at least one light-emitting chip, a first optical sensor and a light-transmitting protective layer, the substrate has a first surface on opposite sides and a On the second surface, the light-emitting chip and the first optical sensor are arranged on the first surface, and the light-transmitting protective layer is arranged on the first surface and covers the light-emitting chip and the first optical sensor. An optical sensor, the light-transmitting protective layer is used to guide part of the light emitted by the light-emitting chip to the first optical sensor, and the first optical sensor is used to detect the light emitted by the light-emitting chip. The light-emitting chip is used to adjust and emit light according to the result detected by the first optical sensor.

Optionally, the at least one light emitting chip includes a blue light chip, a red light chip and a green light chip, and the first optical sensor is a color sensor or an illumination sensor.

Optionally, a reflective layer is also included, the reflective layer covers the light-transmitting protective layer, the reflective layer is provided with a light exit hole, and the light-exit hole exposes the upper surface of the light-transmissive protective layer away from the first surface. A light-emitting area on the surface, where the light-emitting area exposes the light-emitting chip, and the reflective layer blocks the first optical sensor.

Optionally, a second optical sensor is also included, the second optical sensor is arranged on the first surface and covered by the light-transmitting protective layer, the second optical sensor is separated from the first optical sensor There is the reflective layer, the second optical sensor is used to detect the light intensity of the external environment, and the light-emitting chip is used to adjust light emission according to the result detected by the second optical sensor, and the thickness of the reflective layer is greater than or Equal to 0.15mm.

Optionally, the distance between the sensing surface of the first optical sensor away from the first surface and the upper surface of the light-transmitting protective layer away from the first surface is greater than or equal to 0.15mm.

Optionally, the light-emitting surface of the light-emitting chip with the highest height in the at least one light-emitting chip away from the first surface is not higher than the sensing surface of the first optical sensor away from the first surface.

Optionally, the light-emitting chip is a vertical-structure light-emitting diode chip or a horizontal-structure light-emitting diode chip, and the light-emitting surface of the light-emitting chip with the highest height among the at least one light-emitting chip is in contact with the light-emitting surface of the first optical sensor. The height difference of the sensing surface is greater than or equal to 0.05mm.

Optionally, the first surface is concavely provided with a groove, and the at least one light-emitting chip is disposed in the groove.

Optionally, the distance between the light emitting chip closest to the first optical sensor among the at least one light emitting chip and the first optical sensor is greater than or equal to 0.15 mm.

In the second aspect, the present application also provides a light-emitting device, the light-emitting device includes the light-emitting module and the driving chip provided in the first aspect of the present application, the driving chip and the first optical sensor and the light-emitting chip Electrically connected, the driving chip is used to adjust the light emission of the light-emitting chip according to the result detected by the first optical sensor; or the driving chip is connected with the first optical sensor, the second optical sensor and the The light emitting chip is electrically connected, and the driving chip is used for adjusting the light emission of the light emitting chip according to the result detected by the first optical sensor and the result detected by the second optical sensor.

Compared with the prior art, the light-emitting module provided in the first aspect of the present application monitors the light emitted by each light-emitting chip in real time by setting the first optical sensor, and each light-emitting chip will make differential adjustments in real time according to the light detection results, thereby ensuring the light-emitting display of uniformity.

The light-emitting device provided in the second aspect of the present application adopts the light-emitting module provided in the first aspect of the present application. The light-emitting module is equipped with a first optical sensor to monitor the light emitted by the light-emitting chip in real time, and the driving chip monitors the light-emitting chip in real time according to the light detection result. The luminescence of the luminescence is adjusted differentially, so that the luminescence display uniformity of the light-emitting device is better.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings that need to be used in the descriptions of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description are only for the present application For some embodiments, those of ordinary skill in the art can also obtain other drawings based on these drawings without paying creative efforts.

FIG. 1 is a schematic top view of a light emitting module provided by an embodiment of the present application;

Fig. 2 is a schematic diagram of the cross-sectional structure of A-A in Fig. 1;

Fig. 3 is a schematic cross-sectional structure diagram of a light emitting module provided by another embodiment of the present application;

Fig. 4 is a schematic cross-sectional structure diagram of a light emitting module provided in another embodiment of the present application;

Fig. 5 is a schematic cross-sectional structure diagram of a light-emitting module provided in yet another embodiment of the present application;

FIG. 6 is a schematic top view of a light emitting module provided in yet another embodiment of the present application.

Wherein, each reference sign in the figure:

1-substrate; 11-groove; 2-light emitting chip; 2a-light emitting surface; 21-blue light chip; 22-red light chip; 23-green light chip; 3-first optical sensor; 3a-sensing surface; 4 - light-transmitting protective layer; 41 - light exit area; 42 - light entrance area; 43 - raised portion; 5 - light shielding layer; 51 - light exit hole; 52 - light entrance hole, 6 - second optical sensor.

detailed description

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than indicating or implying No device or element must have a particular orientation, be constructed, and operate in a particular orientation, and thus should not be construed as limiting the application.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

Please refer to FIG. 1 to FIG. 6 together, and the light-emitting module and the light-emitting device provided in the first aspect of the embodiment of the present application are now described.

The light-emitting module provided in the first aspect of the embodiment of the present application includes: a substrate 1 , at least one light-emitting chip 2 , a first optical sensor 3 and a light-transmitting protective layer 4 . The substrate 1 has a first surface and a second surface, the first surface and the second surface are located on opposite sides of the substrate 1 respectively, wherein the light-emitting chip 2 and the first optical sensor 3 are arranged on the first surface, and the light-transmitting protective layer 4 is also It is arranged on the first surface and covers the light emitting chip 2 and the first optical sensor 3 . The light-emitting chip 2 is used to emit light after being powered on, and the light-transmitting protective layer 4 is used to guide part of the light emitted by the light-emitting chip 2 to the first optical sensor 3. The first optical sensor 3 is used to detect the light emitted by the light-emitting chip 2 and emit light. The chip 2 is used to adjust and emit light according to the result detected by the first optical sensor 3 .

Compared with the prior art, the light-emitting module provided in the first aspect of the present application monitors the light emitted by the light-emitting chip 2 in real time by setting the first optical sensor 3, and differentially adjusts the light emission of the light-emitting chip 2 in real time according to the light detection results. , so as to ensure the uniformity of the light display of the light-emitting module.

In an embodiment of the present application, please refer to FIG. 2 , the opposite sides of the substrate are upper and lower sides, and the first surface and the second surface correspond to the upper surface and the lower surface of the substrate 1 respectively. The substrate 1 is a PCB (Printed Circuit Board) board; understandably, in other embodiments, the substrate 1 may also be a ceramic substrate, a PLCC (Plastic Leaded Chip Carrier) substrate or an EMC (Epoxy Molding Compound) packaging substrate.

In an embodiment of the present application, please refer to FIG. 1 and FIG. 2, at least one light-emitting chip 2 includes a blue light chip 21, a red light chip 22 and a green light chip 23, that is, the blue light chip 21 is a light-emitting chip that emits blue light, and the red light chip 21 is a light-emitting chip that emits blue light. The chip 22 is a light emitting chip that emits red light, and the green light chip 23 is a light emitting chip that emits green light. The blue light chip 21, the red light chip 22 and the green light chip 23 form a light emitting unit, which realizes the mixing of three primary colors into white light. Understandably, there may be only one light emitting chip in other embodiments. Optionally, the light-emitting chip 2 is a light-emitting diode (light-emitting diode, LED). The light-emitting diode uses a solid semiconductor as a light-emitting material, and has the characteristics of energy saving, environmental protection, good color rendering and response speed. Optionally, the blue light chip 21 , the red light chip 22 and the green light chip 23 are arranged in parallel in a line. Please refer to FIG. 6 , in other embodiments, the blue light chips 21 , the red light chips 22 and the green light chips 23 may also be arranged in a character shape, which is not limited here.

In an embodiment of the present application, please refer to FIG. 2 , the first optical sensor 3 is arranged close to the light-emitting chip 2 so that the first optical sensor 3 can receive as much light as possible from the light-emitting chip 2 and reduce the volume of the light-emitting module. The first optical sensor 3 is a color sensor. The color sensor is used to detect the color ratio and actual light intensity of the light emitted by each light-emitting chip 2. When the color sensor detects that the color-light ratio and intensity of the light emitted by at least one light-emitting chip 2 do not meet the preset value The driving chip used to control the light emitting chip 2 to emit light will adjust the light emitting chip 2 according to the result detected by the first optical sensor 3 . It can be understood that, in other embodiments, the first optical sensor can also be other optical sensors, such as an illumination sensor, for detecting the intensity of illumination, and when the illumination sensor detects that the intensity of light emitted by the light-emitting chip 2 does not meet the preset value , the driver chip will adjust the light emission of the light emitting chip 2 according to the result detected by the first optical sensor 3 .

In an embodiment of the present application, please refer to FIG. 2 , the light-transmitting protective layer 4 is a potting silicone layer. The light-emitting module is coated with a light-transmitting protective layer 4 on the outer surface of the light-emitting chip 2 and the first optical sensor 3. The light-transmitting protective layer 4 can guide part of the light emitted by the light-emitting chip 2 to the first optical sensor 3. , the light-emitting chip 2 and the first optical sensor 3 can also be sealed and waterproofed. The potting silicone layer itself has good waterproof, moisture-proof and anti-aging properties, and is a good transparent protective layer. In other embodiments, the light-transmitting protective layer 4 may also be made of high-transparency materials such as epoxy resin and polyurethane, which will not be repeated here.

In an embodiment of the present application, please refer to FIG. 2, the light-emitting module further includes a reflective layer 5, the reflective layer 5 covers the light-transmitting protective layer 4, and the reflective layer 5 is used to reflect the light emitted by the light-emitting chip 2 to the first optical sensor 3 and avoid light leakage of the light-emitting module. The reflection layer 5 is provided with a light exit hole 51, corresponding to the light exit hole 51 forms a light exit area 41 on the upper surface of the light transmission protective layer 4, that is, the light exit hole 51 exposes the light exit area 41 on the upper surface of the light transmission protection layer 4, and the light transmission protection layer The upper surface of 4 is the side surface of the light-transmitting protective layer 4 away from the first surface, the light-emitting area 41 exposes the light-emitting chip 2 , and the reflective layer 5 blocks the first optical sensor 3 . Optionally, the light-emitting area 41 is set corresponding to the light-emitting chip 2, and the setting of the light-emitting hole 51 keeps the light-emitting area 41 exposed, that is, no other light-shielding components are arranged on the surface of the light-emitting area 41, so that the light emitted by the light-emitting chip 2 is emitted to the external environment . Different from the light exit area 41, the reflective layer 5 blocks the first optical sensor 3, that is, the upper surface of the light-transmitting protective layer 4 above the first optical sensor 3 is covered by the reflective layer 5, and the reflective layer 5 can transmit the light emitted by the light-emitting chip 2 The reflection to the outside of the first optical sensor 3 can also be used to block the light from the external environment from reaching the first optical sensor 3, so as to prevent the light from the external environment from entering the first optical sensor 3 and causing interference. In this embodiment, the top of the first optical sensor 3 is covered by the reflective layer 5 . It is found through experiments and tests that when the first optical sensor 3 is blocked by the reflective layer 5, when the incident luminous flux of external ambient light is 200% of the luminous flux of the light-emitting chip 2, the total reflection of the light-emitting chip 2 received by the first optical sensor 3 The luminous flux will be close to the incident luminous flux of the external ambient light received by the first optical sensor 3; when the reflective layer 5 is not covered above the first optical sensor 3, when the incident luminous flux of the external ambient light is 35% of the luminous flux of the light-emitting chip 2 , the total reflected luminous flux of the light-emitting chip 2 received by the first optical sensor 3 will be close to the incident luminous flux of the external ambient light received by the first optical sensor 3 . In addition, the reflective layer 5 is covered on the surface of the light-transmitting protective layer 4, and the reflective layer 5 is also provided with a light outlet hole 51. The setting of the light outlet hole 51 can effectively limit the range of the light outlet area 41, that is, the range of the light emitting surface of the light emitting module. The size of the light-emitting surface is positively related to the size of the secondary optical element, such as the secondary lens, so that a smaller secondary optical element can be designed on the terminal. It is found through experiments and tests that when the surface of the light-transmitting protective layer 4 is exposed and does not cover the reflective layer 5, the amount of light emitted from the center of the corresponding light-emitting chip 2 is only 90%, and there will be 10% of stray light in other positions, thus causing the overall light-emitting module The light output area is large; when the surface of the light-transmitting protective layer 4 is covered with the reflective layer 5, the light output from the center of the corresponding light-emitting chip 2 can approach 100%, and the light output area of the light-emitting module is only the light output area without the reflective layer 5 half of. It can be understood that, in other embodiments, the reflective layer 5 can also be set to partially block the first optical sensor 3, that is, a part above the first optical sensor 3 is blocked by the reflective layer 5, and the other part is exposed. In comparison, The way of partial occlusion is not as good as the way of complete occlusion to prevent interference.

In an embodiment of the present application, please refer to FIG. 3 to FIG. 5. Considering that when the light-emitting module is applied outdoors, the light-emitting chip 2 cannot effectively display color due to the high outdoor light intensity. Therefore, the light-emitting module in this embodiment The set also includes a second optical sensor 6, which is also disposed on the first surface of the substrate 1, and the second optical sensor 6 is also covered by the light-transmitting protective layer 4 to form a protection. Optionally, the surface of this part of the light-transmitting protective layer 4 covering the second optical sensor 6 is also covered by the reflective layer 5, and the reflective layer 5 is also provided with a light-incoming hole 52, corresponding to the light-incoming hole 52 in the light-transmitting protective layer 4 The upper surface of the upper surface forms the light incident region 42, that is, the light incident hole 52 exposes the light incident region 42 of the upper surface of the light-transmitting protective layer 4, and the light incident region 42 exposes the second optical sensor 6, and the second optical sensor 6 is used to detect The light intensity of the external environment is, for example, an ambient light sensor, and the light-emitting chip 2 is used to adjust and emit light according to the result detected by the second optical sensor 6 . In this embodiment, the light intensity of the external environment is sensed by the second optical sensor 6 to adjust the light-emitting chip 2 to achieve the function of displaying color under a certain light. Specifically, the light incident area 42 is set corresponding to the second optical sensor 6, and the setting of the light incident hole 52 makes the surface of the light incident area 42 remain bare, that is, the surface of the light incident area 42 is not provided with other light-blocking components for the external environment. Light, such as sunlight, passes through the light-transmitting protective layer 4 and is received by the second optical sensor 6 . Specifically, the light emitting chip 2 , the first optical sensor 3 and the second optical sensor 6 are arranged side by side on the first surface of the substrate 1 . Optionally, the light-emitting chip 2, the first optical sensor 3, and the second optical sensor 6 are arranged side by side in sequence, the first optical sensor 3 is arranged close to the light-emitting chip 2, and the second optical sensor 6 is arranged close to the first optical sensor 3 to reduce the light emission. The overall volume of the module. Understandably, in other embodiments, the second optical sensor 6, the light-emitting chip 2 and the first optical sensor 3 may also be arranged side by side in sequence, that is, the second optical sensor 6 and the first optical sensor 3 are respectively located on two sides of the light-emitting chip 2. side. In order to avoid interference caused by the light emitted by the light-emitting chip 2 being received by the second optical sensor 6, the reflective layer 5 further extends between the first optical sensor 3 and the second optical sensor 6 to separate the first optical sensor 3 and the second optical sensor 6. The optical sensor 6 and at the same time, the reflective layer 5 also passes through the light-transmitting protective layer 4 and divides the light-transmitting protective layer 4 . Generally, the greater the thickness of the reflective layer 5, the better the reflection effect and the effect of blocking ambient light. Optionally, in order to avoid light leakage of the light-emitting module, the thickness of the reflective layer 5 is greater than or equal to 0.15 mm, for example, it can be 0.15 mm or 0.2 mm. , 0.25mm or 0.3mm.

In an embodiment of the present application, referring to FIG. 4 , a raised portion 43 is also provided on the surface of the light incident area 42 of the light-transmitting protective layer 4 , and the raised portion 43 is a side of the light-transmitting protective layer 4 facing away from the first surface. The side protrusions are formed, and the formed raised portion 43 extends into the light entrance hole 52 . The raised portion 43 is used to receive external ambient light. Optionally, the raised portion 43 is hemispherical.

In an embodiment of the present application, please refer to FIG. 2 , the distance between the sensing surface 3 a of the first optical sensor 3 and the upper surface of the light-transmitting protective layer 4 is greater than or equal to 0.15 mm, and the sensing surface 3 a of the first optical sensor 3 It is the side surface of the first optical sensor 3 away from the first surface, and the upper surface of the light-transmitting protective layer 4 also refers to the side surface away from the first surface, for example, it can be 0.15mm, 0.2mm, 0.25mm, 0.3mm , 0.4mm or 0.5mm, to ensure enough light passage, so that part of the light from the light-emitting chip 2 can be smoothly reflected by the reflective layer 5 or totally reflected by the light-transmitting protective layer 4 to the sensing surface 3a of the first optical sensor 3 . By setting the distance between the sensing surface of the first optical sensor 3 and the upper surface of the light-transmitting protective layer 4 to be greater than or equal to 0.15 mm, it is beneficial to ensure that the light-transmitting protective layer 4 effectively guides part of the light emitted by the light-emitting chip 2 to the first light emitting chip 2. Sensing surface of an optical sensor 3 .

In an embodiment of the present application, referring to FIG. 2 , it is considered that in addition to a part of the light from the light-emitting chip 2 being emitted from the light exit region 41 to the external environment, there is also a part of the light to be reflected under the guidance of the light-transmitting protective layer 4 and total reflection to the first optical sensor 3 for identification and detection. Therefore, the light-emitting surface 2a of the highest light-emitting chip 2 in at least one light-emitting chip 2 is not higher than the sensing surface 3a of the first optical sensor 3, that is, when placed in a stable position In the vertical direction of the light-emitting module, the light-emitting surface 2a of the light-emitting chip 2 is lower than the sensing surface 3a of the first optical sensor 3 or the light-emitting surface 2a of the light-emitting chip 2 is flush with the sensing surface 3a of the first optical sensor 3 . Here, the light-emitting surface 2 a of the light-emitting chip 2 is the surface of the light-emitting chip 2 on the side away from the first surface. It can be foreseen that when the light emitting chip 2 and the first optical sensor 3 are located on the same plane, the thickness of the light emitting chip 2 cannot be higher than the thickness of the first optical sensor 3, for example, the thickness of the light emitting chip 2 is equal to the thickness of the first optical sensor 3 Or the thickness of the light emitting chip 2 is smaller than the thickness of the first optical sensor 3 . Optionally, at least one light emitting chip 2 includes a blue light chip 21, a red light chip 22 and a green light chip 23, wherein the blue light chip 21, the red light chip 22 and the green light chip 23 have the same thickness and are smaller than the thickness of the first optical chip. The thickness of the sensor 3. Certainly, in other embodiments, the thicknesses of the blue chip 21, the red chip 22 and the green chip 23 may also be unequal, for example, the thickness of the red chip 22 is greater than that of the blue chip 21 and also greater than that of the green chip 23. thickness, but the thickness of the red chip 22 is less than or equal to the thickness of the first optical sensor 3 . When the light-emitting surface 2a of the tallest light-emitting chip 2 in at least one light-emitting chip is lower than the sensing surface 3a of the first optical sensor 3, optionally, the light-emitting chip 2 is a horizontal structure light-emitting diode chip or a vertical structure light-emitting diode chip, The height difference between the light-emitting surface 2a of the highest light-emitting chip 2 among at least one light-emitting chip and the sensing surface 3a of the first optical sensor 3 is greater than or equal to 0.05mm, so that the light energy of part of the light-emitting chip 2 can be smoothly reflected by the reflective layer 5 or It is totally reflected by the light-transmitting protective layer 4 to the sensing surface 3 a of the first optical sensor 3 . Compared with horizontal light-emitting diode chips, vertical light-emitting diode chips have the advantages of high brightness, fast heat dissipation, small light decay and small light color drift.

In an embodiment of the present application, please refer to FIG. 5 , a groove 11 is provided on the substrate 1 , and the groove 11 is concavely formed on the first surface of the substrate 1 , and at least one light-emitting chip 2 is disposed in the groove 11 . By setting the groove 11, the light-emitting chip 2 is arranged on the bottom wall of the groove 11, and the first optical sensor 3 is arranged on the first surface, which further enlarges the sensitivity between the light-emitting surface 2a of the light-emitting chip 2 and the first optical sensor 3. Measure the height difference between the surfaces 3a. At the same time, another advantage of setting the groove 11 is that it reduces the limitation on the size of the light-emitting chip 2; for example, the thickness of the light-emitting chip 2 can be smaller than the thickness of the first optical sensor 3, or the thickness of the light-emitting chip 2 can be equal to the thickness of the first optical sensor 3. The thickness of the sensor 3, even the thickness of the light-emitting chip 2 is greater than the thickness of the first optical sensor 3, as long as the depth of the groove 11 is adjusted so that the light-emitting surface 2a of the light-emitting chip 2 is not higher than the sensing surface 3a of the first optical sensor 3 That's it. Therefore, the setting of the groove 11 can expand the selection range of the light emitting chip 2 .

In an embodiment of the present application, the distance from the light-emitting chip 2 closest to the first optical sensor 3 among at least one light-emitting chip 2 to the first optical sensor 3 is greater than or equal to 0.15mm, for example, it can be 0.15mm, 0.2mm, 0.25mm or 0.3mm. 2, at least one light-emitting chip 2 includes a blue chip 21, a red chip 22 and a green chip 23, wherein the green chip 23 is closest to the first optical sensor 3, that is, the green chip 23 to the first optical sensor 3 The distance is greater than or equal to 0.15 mm, so that part of the light energy of the light-emitting chip 2 can be smoothly reflected by the reflective layer 5 or totally reflected by the light-transmitting protective layer 4 to the sensing surface 3 a of the first optical sensor 3 .

In the second aspect, the embodiment of the present application further provides a light emitting device, the light emitting device includes the light emitting module and the driving chip (not shown in the figure) provided in the first aspect of the embodiment of the present application. The driving chip is electrically connected to the first optical sensor 3 and the light emitting chip 2 , and the driving chip is used to adjust the light emission of the light emitting chip 2 according to the result detected by the first optical sensor 3 .

The light-emitting device provided by the second aspect of the embodiment of the present application adopts the light-emitting module provided by the first aspect of the present application. The light-emitting module is equipped with a first optical sensor 3 to monitor the light emitted by the light-emitting chip 2 in real time, and the driving chip is based on the light detection result. Differential adjustments are made to the light emission of the light emitting chip 2 in real time, so that the light emission display uniformity of the light emitting device is better.

In an embodiment of the present application, the driving chip is located on the substrate 1 . Specifically, the driving chip is located on the first surface of the substrate 1 . When the driving chip is located on the first surface, the light-transmitting protective layer 4 covers the outer surface of the driving chip at the same time. Understandably, in other embodiments, the driving chip may also be located on the second surface of the substrate 1 .

In an embodiment of the present application, when the light-emitting module further includes a second optical sensor 6, the driving chip is electrically connected to the first optical sensor 3, the second optical sensor 6, and the light-emitting chip 2, and the driving chip is used to 3 and the result detected by the second optical sensor 6 adjust the light emission of the light emitting chip 2, so that the light emitting chip 2 can also adjust the light emission according to the light intensity of the external environment at the same time.

The above descriptions are only preferred embodiments of the application, and are not intended to limit the application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the application should be included in the protection of the application. within range.

Claims (10)

1. A light emitting module, comprising: the substrate is provided with a first surface and a second surface which are positioned on two opposite sides, the first surface is provided with the light emitting chip and the first optical sensor, the light transmitting protective layer is arranged on the first surface and covers the light emitting chip and the first optical sensor, the light transmitting protective layer is used for guiding part of light emitted by the light emitting chip to the first optical sensor, the first optical sensor is used for detecting the light emitted by the light emitting chip, and the light emitting chip is used for being adjusted to emit light according to a result detected by the first optical sensor.

2. The lighting module of claim 1, wherein: the at least one light emitting chip comprises a blue light chip, a red light chip and a green light chip, and the first optical sensor is a color sensor or an illumination sensor.

3. The lighting module of claim 1, wherein: the light-emitting chip further comprises a reflecting layer, the reflecting layer covers the light-transmitting protective layer, the reflecting layer is provided with a light outlet, the light outlet exposes a light outlet area of the upper surface, far away from the first surface, of the light-transmitting protective layer, the light outlet area exposes the light-emitting chip, and the reflecting layer shields the first optical sensor.

4. The lighting module of claim 3, wherein: the light-emitting chip is characterized by further comprising a second optical sensor, the second optical sensor is arranged on the first surface and covered by the light-transmitting protective layer, the reflecting layer is arranged between the second optical sensor and the first optical sensor in an interval mode, the second optical sensor is used for detecting the light intensity of the external environment, the light-emitting chip is used for being adjusted to emit light according to the result detected by the second optical sensor, and the thickness of the reflecting layer is larger than or equal to 0.15mm.

5. The lighting module of claim 1, wherein: the distance from the sensing surface, far away from the first surface, of the first optical sensor to the upper surface, far away from the first surface, of the light-transmitting protection layer is greater than or equal to 0.15mm.

6. The lighting module of claim 1, wherein: the light emitting surface, far away from the first surface, of the light emitting chip with the highest height in the at least one light emitting chip is not higher than the sensing surface, far away from the first surface, of the first optical sensor.

7. The lighting module of claim 6, wherein: the light emitting chips are vertical structure light emitting diode chips or horizontal structure light emitting diode chips, and the height difference between the light emitting surface of the light emitting chip with the highest height in the at least one light emitting chip and the sensing surface of the first optical sensor is greater than or equal to 0.05mm.

8. The lighting module of claim 7, wherein: the first surface is concavely provided with a groove, and the at least one light-emitting chip is arranged in the groove.

9. The lighting module of claim 1, wherein: the distance from the light-emitting chip, which is closest to the first optical sensor, of the at least one light-emitting chip to the first optical sensor is greater than or equal to 0.15mm.

10. A light emitting device, characterized in that: the optical module comprises the light-emitting module and a driving chip according to any one of claims 1 to 9, wherein the driving chip is electrically connected with the first optical sensor and the light-emitting chip, and the driving chip is used for adjusting the light emission of the light-emitting chip according to the result detected by the first optical sensor; or the driving chip is electrically connected with the first optical sensor, the second optical sensor and the light-emitting chip, and the driving chip is used for adjusting the light emission of the light-emitting chip according to the result detected by the first optical sensor and the result detected by the second optical sensor.

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