CN115279817B - 环氧树脂组合物 - Google Patents
环氧树脂组合物 Download PDFInfo
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- CN115279817B CN115279817B CN202180019447.1A CN202180019447A CN115279817B CN 115279817 B CN115279817 B CN 115279817B CN 202180019447 A CN202180019447 A CN 202180019447A CN 115279817 B CN115279817 B CN 115279817B
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- epoxy resin
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 66
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 62
- -1 oxetane compound Chemical class 0.000 claims abstract description 34
- 150000003573 thiols Chemical class 0.000 claims abstract description 16
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 claims abstract description 4
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 4
- 238000003860 storage Methods 0.000 claims description 20
- 239000003381 stabilizer Substances 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 4
- QSOFJLDXOMMNNK-UHFFFAOYSA-N 2-(hydroxymethyl)-2-methylpropane-1,3-diol 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.OCC(C)(CO)CO QSOFJLDXOMMNNK-UHFFFAOYSA-N 0.000 claims description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- NKMOLEYVYVWWJC-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis[2-(3-sulfanylbutanoyloxy)ethyl]-1,3,5-triazinan-1-yl]ethyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCN1C(=O)N(CCOC(=O)CC(C)S)C(=O)N(CCOC(=O)CC(C)S)C1=O NKMOLEYVYVWWJC-UHFFFAOYSA-N 0.000 claims description 2
- WBEKRAXYEBAHQF-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.CCC(CO)(CO)CO WBEKRAXYEBAHQF-UHFFFAOYSA-N 0.000 claims description 2
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 claims description 2
- 125000003566 oxetanyl group Chemical group 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims 1
- 238000001723 curing Methods 0.000 description 31
- 239000004593 Epoxy Substances 0.000 description 10
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- 239000012766 organic filler Substances 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- ZFMOJHVRFMOIGF-UHFFFAOYSA-N 2,4,6-trimethoxy-1,3,5,2,4,6-trioxatriborinane Chemical compound COB1OB(OC)OB(OC)O1 ZFMOJHVRFMOIGF-UHFFFAOYSA-N 0.000 description 2
- JUINTNKGYWNEDR-UHFFFAOYSA-N 3-[dimethyl(propoxy)silyl]propyl prop-2-enoate Chemical compound CCCO[Si](C)(C)CCCOC(=O)C=C JUINTNKGYWNEDR-UHFFFAOYSA-N 0.000 description 2
- DCOXQQBTTNZJBI-UHFFFAOYSA-N 3-ethyl-3-[[4-[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]phenyl]methoxymethyl]oxetane Chemical group C=1C=C(C=2C=CC(COCC3(CC)COC3)=CC=2)C=CC=1COCC1(CC)COC1 DCOXQQBTTNZJBI-UHFFFAOYSA-N 0.000 description 2
- RBMGGZPJAZDWNE-UHFFFAOYSA-N 4-[(3-ethyloxetan-3-yl)methoxy]butan-1-ol Chemical compound OCCCCOCC1(CC)COC1 RBMGGZPJAZDWNE-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- PYEYLPDXIYOCJK-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1(CC)COC1 PYEYLPDXIYOCJK-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- LJWZDTGRJUXOCE-UHFFFAOYSA-N 2-(2-ethylhexyl)oxetane Chemical compound CCCCC(CC)CC1CCO1 LJWZDTGRJUXOCE-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- HJEORQYOUWYAMR-UHFFFAOYSA-N 2-[(2-butylphenoxy)methyl]oxirane Chemical compound CCCCC1=CC=CC=C1OCC1OC1 HJEORQYOUWYAMR-UHFFFAOYSA-N 0.000 description 1
- RRXIBRLPSOBLIQ-UHFFFAOYSA-N 2-[(2-decylphenoxy)methyl]oxirane Chemical compound CCCCCCCCCCC1=CC=CC=C1OCC1OC1 RRXIBRLPSOBLIQ-UHFFFAOYSA-N 0.000 description 1
- KSIFCIGYWZLLRY-UHFFFAOYSA-N 2-[(2-ethylphenoxy)methyl]oxirane Chemical compound CCC1=CC=CC=C1OCC1OC1 KSIFCIGYWZLLRY-UHFFFAOYSA-N 0.000 description 1
- ABTAANTUIVCOTF-UHFFFAOYSA-N 2-[(2-heptylphenoxy)methyl]oxirane Chemical compound CCCCCCCC1=CC=CC=C1OCC1OC1 ABTAANTUIVCOTF-UHFFFAOYSA-N 0.000 description 1
- LEYWCVIABUVRSU-UHFFFAOYSA-N 2-[(2-hexylphenoxy)methyl]oxirane Chemical compound CCCCCCC1=CC=CC=C1OCC1OC1 LEYWCVIABUVRSU-UHFFFAOYSA-N 0.000 description 1
- KFUSXMDYOPXKKT-UHFFFAOYSA-N 2-[(2-methylphenoxy)methyl]oxirane Chemical compound CC1=CC=CC=C1OCC1OC1 KFUSXMDYOPXKKT-UHFFFAOYSA-N 0.000 description 1
- WNISWKAEAPQCJQ-UHFFFAOYSA-N 2-[(2-nonylphenoxy)methyl]oxirane Chemical compound CCCCCCCCCC1=CC=CC=C1OCC1OC1 WNISWKAEAPQCJQ-UHFFFAOYSA-N 0.000 description 1
- UYBCNHLHWUHLOF-UHFFFAOYSA-N 2-[(2-pentylphenoxy)methyl]oxirane Chemical compound CCCCCC1=CC=CC=C1OCC1OC1 UYBCNHLHWUHLOF-UHFFFAOYSA-N 0.000 description 1
- TWFDUASEWSCMRO-UHFFFAOYSA-N 2-[(2-propylphenoxy)methyl]oxirane Chemical compound CCCC1=CC=CC=C1OCC1OC1 TWFDUASEWSCMRO-UHFFFAOYSA-N 0.000 description 1
- BKESSRRJVLKHSR-UHFFFAOYSA-N 2-[(3-pentadeca-1,3-dienylphenoxy)methyl]oxirane Chemical compound CCCCCCCCCCCC=CC=CC1=CC=CC(OCC2OC2)=C1 BKESSRRJVLKHSR-UHFFFAOYSA-N 0.000 description 1
- GQTBMBMBWQJACJ-UHFFFAOYSA-N 2-[(4-butan-2-ylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)CC)=CC=C1OCC1OC1 GQTBMBMBWQJACJ-UHFFFAOYSA-N 0.000 description 1
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- DGBFOBNYTYHFPN-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(C)CCCOC(=O)C=C DGBFOBNYTYHFPN-UHFFFAOYSA-N 0.000 description 1
- JBDMKOVTOUIKFI-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(C)CCCOC(=O)C(C)=C JBDMKOVTOUIKFI-UHFFFAOYSA-N 0.000 description 1
- ZCRUJAKCJLCJCP-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(C)CCCOC(=O)C=C ZCRUJAKCJLCJCP-UHFFFAOYSA-N 0.000 description 1
- MYEFGHBUFAPKJO-UHFFFAOYSA-N 3-[methyl(dipropoxy)silyl]propyl prop-2-enoate Chemical compound CCCO[Si](C)(OCCC)CCCOC(=O)C=C MYEFGHBUFAPKJO-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 102100027123 55 kDa erythrocyte membrane protein Human genes 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- MPGAVOHINRZZQG-UHFFFAOYSA-N C(C(=C)C)(=O)OCCC[Si](CC)(C)C Chemical compound C(C(=C)C)(=O)OCCC[Si](CC)(C)C MPGAVOHINRZZQG-UHFFFAOYSA-N 0.000 description 1
- COBMKVPSRRUDBM-UHFFFAOYSA-N C(C)C1(COC1)COCC1=C(C=CC=C1)C1=CC=CC=C1 Chemical group C(C)C1(COC1)COCC1=C(C=CC=C1)C1=CC=CC=C1 COBMKVPSRRUDBM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001057956 Homo sapiens 55 kDa erythrocyte membrane protein Proteins 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- IHUNBGSDBOWDMA-AQFIFDHZSA-N all-trans-acitretin Chemical compound COC1=CC(C)=C(\C=C\C(\C)=C\C=C\C(\C)=C\C(O)=O)C(C)=C1C IHUNBGSDBOWDMA-AQFIFDHZSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- HECGKCOICWUUJU-UHFFFAOYSA-N bis(diphenylphosphanylmethyl)-phenylphosphane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 HECGKCOICWUUJU-UHFFFAOYSA-N 0.000 description 1
- FJBTZWJPRJMVLG-UHFFFAOYSA-N bis[(3-ethyloxetan-3-yl)methyl] benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OCC2(CC)COC2)=CC=1C(=O)OCC1(CC)COC1 FJBTZWJPRJMVLG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- KUGSJJNCCNSRMM-UHFFFAOYSA-N ethoxyboronic acid Chemical compound CCOB(O)O KUGSJJNCCNSRMM-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- VUQUOGPMUUJORT-UHFFFAOYSA-N methyl 4-methylbenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(C)C=C1 VUQUOGPMUUJORT-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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Abstract
本发明涉及一种柔软性优异且具有低固化收缩的环氧树脂组合物。所述环氧树脂组合物含有以下的(A)~(E)成分,(A)成分:具有2个以上环氧基的化合物,(B)成分:具有碳数为1~10的烷基的苯基单缩水甘油基醚,(C)成分:氧杂环丁烷化合物,(D)成分:硫醇固化剂,(E)成分:固化促进剂。
Description
技术领域
本发明涉及一种柔软且低固化收缩的环氧树脂组合物。
背景技术
一直以来,使用了环氧树脂的组合物由于耐热性、耐化学性优异而被广泛用于各种领域。另一方面,由于环氧树脂的刚性骨架而难以体现出柔软性,因此有时会使用具有柔软骨架的硫醇固化剂。通过使用该硫醇固化剂,能够大幅降低固化物的硬度、玻璃化转变温度,进而能够获得具有快速固化性的组合物,因此作为环氧树脂的固化技术而被用于广泛的领域(专利文献1)。
专利文献1:日本特开平6-211969
但是,使用了以往的硫醇固化剂的环氧树脂组合物,由于硫醇固化剂的柔软骨架、固化的快速性,固化时的收缩倾向于增大。如果将这样的环氧树脂组合物用于需要精密固定的小型部件、不耐热的部件,会在固化时发生部件的错位、形变。如此使用了以往的硫醇固化剂的环氧树脂组合物,难以在保持快速固化性的同时兼具柔软性和低固化收缩性。
发明内容
本发明人等为了解决上述课题进行了潜心研究,结果发明出具有快速固化性并柔软、且具有低固化收缩的环氧树脂组合物。
以下对本发明的要旨进行说明。
[1]一种环氧树脂组合物,其含有以下的(A)~(E)成分。
(A)成分:具有2个以上环氧基的化合物
(B)成分:具有碳数为1~10的烷基的苯基单缩水甘油基醚
(C)成分:氧杂环丁烷化合物
(D)成分:硫醇固化剂
(E)成分:固化促进剂
[2]就[1]所述的环氧树脂组合物而言,前述(C)成分是具有2个以上氧杂环丁基的化合物。
[3]就[1]或[2]所述的环氧树脂组合物而言,前述(C)成分的含量是相对于(A)成分100质量份为1~70质量份。
[4]就[1]~[3]中任意一项所述的环氧树脂组合物而言,前述(E)成分是胺加成潜伏性固化促进剂。
[5]就[1]~[4]中任意一项所述的环氧树脂组合物而言,前述(D)成分是二级硫醇。
[6]就[1]~[5]中任意一项所述的环氧树脂组合物而言,进而含有保存稳定剂。
[7]就[1]~[6]中任意一项所述的环氧树脂组合物而言,固化收缩率为5.3%以下。
[8]就[1]~[7]中任意一项所述的环氧树脂组合物而言,具有热固化性。
[9]一种固化物,其是[1]~[8]中任意一项所述的环氧树脂组合物的固化物。
[10]就[9]所述的环氧树脂组合物的固化物而言,25℃的储能弹性模量为1.0GPa以下。
发明效果
本发明的环氧树脂组合物,其快速固化且柔软,同时固化收缩率低,因此非常有用。
具体实施方式
以下对本发明的实施方式进行说明。需要说明的是,本发明不限于以下的实施方式。另外,在本说明书中,只要没有特别说明,操作以及物性等的测定在室温(20℃以上25℃以下)/相对湿度40%RH以上50%RH以下的条件下进行。
以下详细说明本发明。本发明中使用的前述(A)成分只要是1分子中具有2个以上环氧基的化合物,就没有特别限定。作为(A)成分,没有特别限定,但例如可以举出双酚A型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、双酚AD型环氧树脂、萘型环氧树脂、联苯型环氧树脂、苯酚酚醛型环氧树脂、溴化双酚A型环氧树脂、氢化双酚A型环氧树脂、缩水甘油基胺型环氧树脂、二环戊二烯型环氧树脂、邻甲酚酚醛型环氧树脂、脂环式环氧树脂等,但不限于这些。它们可以仅使用1种,也可以混合使用2种以上。在(A)成分中,从能够实现低粘度的观点出发,优选双酚A型环氧树脂、双酚F型环氧树脂,进一步优选双酚F型环氧树脂。
就前述(A)成分的环氧当量而言,从固化性的观点出发,优选50g/eq以上且低于400g/eq,更优选100g/eq以上且低于300g/eq,进一步优选120g/eq以上且低于250g/eq,特别优选130g/eq以上且低于200g/eq,最优选140g/eq以上且低于180g/eq。从实现低粘度的观点出发,(A)成分的粘度优选25℃下为0.1Pa·s以上且低于300Pa·s,更优选0.5Pa·s以上且低于250Pa·s,进一步优优选1Pa·s以上且低于200Pa·s,特别优选1Pa·s以上且低于50Pa·s。
作为前述(A)成分的市售品,例如可以举出jER828、1001、806、807、152、604、630、871、YX8000、YX8034、YX4000(三菱化学株式会社制),EPICLON 830、EXA-830LVP、EXA-850CRP、EXA-835LV、HP4032D、HP4700、HP820(DIC株式会社制),EP-4100、EP-4100G、EP-4100E、EP-4100TX、EP-4300E、EP-4000、EP-4000G、EP-4000E、EP-4000TX、EP-4005、EP-4400、EP-4520S、EP-4530、EP-4901、EP-4901EP-4080、EP-4085、EP-4088、EP-5100-75X、EP-7001、EP-4080E、EPU-6、EPU-7N、EPU-11F、EPU-15F、EPU-1395、EPU-73B、EPU-17、EPU-17、EPU-17T-6、EPU-80、EPR-1415-1、EPR-2000、EPR-2007、EPR-1630、EP-49-10N、EP-49-10P2、EPR4023、EPR2007(株式会社ADEKA制),DENACOL EX-211、EX-212、EX-252、EX-810、EX-810、EX-811、EX-850、EX-851、EX-821、EX-830、EX-832、EX-841、EX-861、EX-920、EX-931(Nagase ChemteX株式会社制),TEPIC、TEPIC-S、TEPIC-VL(日产化学工业株式会社制),SY-35M、SR-NPG、SR-TMP(坂本药品工业株式会社制)等,但不限于这些。它们可以分别单独使用,还可以混合使用2种以上。
本发明中使用的前述(B)成分是具有碳数为1~10的烷基的苯基单缩水甘油基醚。需要说明的是,碳数1~10的烷基与苯基直接键合。(B)成分通过与(C)成分并用,可以在低粘度的情况下抑制固化收缩。
就(B)成分而言,与苯基直接键合的碳数1~10的烷基可以是直链状或分支状的烷基的任一种。另外,对碳数1~10的烷基的具体例没有特别限制,但可以举出甲基、乙基、正丙基、异丙基、正丁基、异丁基、仲丁基、叔丁基、正戊基、异戊基、新戊基、2-乙基己基、正己基、正庚基、正辛基、正壬基、正癸基等。就(B)成分而言,从与其它成分的相容性的观点出发,与苯基直接键合的烷基优选碳数1~8的直链状烷基,更优选碳数1~6的直链状烷基,进一步优选碳数1~5的直链状烷基。
就(B)成分而言,与苯基直接键合的碳数1~10的烷基,可以是苯基中相对于缩水甘油基醚基为p(对)位、m(间)位、或o(邻)位的任意位置,但优选p位。
就(B)成分的环氧当量而言,从固化性和固化收缩的观点出发,优选100~300g/eq,更优选150~250g/eq,进一步优选160~230g/eq,特别优选180~220g/eq,最优选190~215g/eq。从固化性和固化收缩的观点出发,(B)成分的粘度优选25℃下为0.1mPa·s以上且低于300mPa·s,更优选0.5mPa·s以上且低于250mPa·s,进一步优选1mPa·s以上且低于200mPa·s,特别优选1mPa·s以上且低于100mPa·s,最优选5mPa·s以上且低于50mPa·s。
作为(B)成分的具体例,可以举出甲基苯基缩水甘油基醚、乙基苯基缩水甘油基醚、丙基苯基缩水甘油基醚、丁基苯基缩水甘油基醚、戊基苯基缩水甘油基醚、己基苯基缩水甘油基醚、庚基苯基缩水甘油基醚、辛基苯基缩水甘油基醚、壬基苯基缩水甘油基醚、癸基苯基缩水甘油基醚等,但从与其它成分的相容性的观点出发,优选具有碳数为1~6的烷基,更优选4-叔丁基苯基缩水甘油基醚、4-仲丁基苯基缩水甘油基醚,最优选4-叔丁基苯基缩水甘油基醚。
作为前述(B)成分的市售品,可以举出株式会社ADEKA制的ED-509E、ED-509S、Nagase ChemteX株式会社制的DENACOL EX-146等。
关于前述(B)成分的含量,相对于前述(A)成分100质量份优选为1~100质量份,更优选2~90质量份,进一步优选5~80质量份,特别优选10~70质量份,最优选15~50质量份。通过使(B)成分的含量为1~100质量份,可以得到柔软且低固化收缩的环氧树脂组合物。
前述(C)成分只要是氧杂环丁烷化合物,就没有特别限定,但从进一步减少固化收缩率的观点出发,优选含有2个以上的氧杂环丁基。通过含有氧杂环丁烷化合物,认为可以降低由硫醇的固化所致的收缩,发挥降低固化收缩率的作用。就优选的实施方式而言,(C)成分是具有芳香族环的氧杂环丁烷化合物。
作为(C)成分的具体例,可以举出3-乙基-3-羟基甲基氧杂环丁烷、2-乙基己基氧杂环丁烷、亚二甲苯基双氧杂环丁烷、3-乙基-3{[(3-乙基氧杂环丁烷-3-基)甲氧基]甲基}氧杂环丁烷、4,4’-双[(3-乙基-3-氧杂环丁基)甲氧基甲基]联苯、双[(3-乙基-3-氧杂环丁基)甲基]间苯二甲酸酯、((3-乙基-3-氧杂环丁基)甲氧基甲基(甲基)丙烯酸酯、3-乙基-3-(4-羟基丁氧基甲基)氧杂环丁烷、丙烯酸(3-乙基氧杂环丁烷-3-基)甲基酯等,但从进一步降低固化收缩的观点出发,优选3-乙基-3{[(3-乙基氧杂环丁烷-3-基)甲氧基]甲基}氧杂环丁烷、4,4’-双[(3-乙基-3-氧杂环丁基)甲氧基甲基]联苯。
前述(C)成分的粘度优选0.1mPa·s以上且低于100mPa·s,更优选0.5mPa·s以上且低于80mPa·s,进一步优选1mPa·s以上且低于50mPa·s,特别优选5mPa·s以上且低于45mPa·s,最优选15mPa·s以上且低于40mPa·s。在一个实施方式中,(C)成分的粘度为15mPa·s以上且低于40mPa·s。通过使(C)成分的粘度为0.1mPa·s以上且低于100mPa·s,与其它成分的相容性良好,可以抑制环氧树脂组合物的固化性的降低。
作为前述(C)成分的市售品,可以举出东亚合成株式会社制的Aron Oxetane OXT-101、OXT-212、OXT-121、OXT-221,宇部兴产株式会社制的Eternacoll EHO、OXMA、OXBP、HBOX、OXIPA,大阪有机化学工业株式会社制的OXE-10、OXE-30等。
关于前述(C)成分的含量,相对于(A)成分100质量份,优选为1~70质量份,更优选为3~60质量份,进一步优选为5~50质量份,特别优选为6~40质量份,最优选为7~30质量份。只要(C)成分的含量为1~70质量份,可以体现出良好的低固化收缩,维持作为环氧树脂组合物的固化性。
前述(D)成分是硫醇固化剂。作为硫醇固化剂,只要具有SH基就没有特别限定,但从固化性的观点出发,优选具有2个以上SH基的化合物,更优选具有3个以上SH基的化合物,最优选具有4个以上SH基的化合物。另外,从进一步降低固化收缩的观点出发,优选二级硫醇。
需要说明的是,二级硫醇是与硫黄原子键合的碳(巯基所键合的碳)为二级碳原子的硫醇化合物。
作为前述(D)成分的具体例,可以举出三羟甲基丙烷三(3-巯基丙酸酯)、三-[(3-巯基丙酰氧基)-乙基]-异氰脲酸酯、季戊四醇四(3-巯基丙酸酯)、四甘醇双(3-巯基丙酸酯)、二季戊四醇六(3-巯基丙酸酯)、季戊四醇四(3-巯基丁酸酯)、1,4-双(3-巯基丁酰氧基)丁烷、1,3,5-三(3-巯基丁酰氧基乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮、三羟甲基丙烷三(3-巯基丁酸酯)、三羟甲基乙烷三(3-巯基丁酸酯)、三羟甲基丙烷三(3-巯基丁酸酯)、三羟甲基乙烷三(3-巯基丁酸酯)等,但不限于这些。
作为前述(D)成分的市售品,可以举出SC有机化学株式会社制的TMMP、TEMPIC、PEMP、EGMP-4、DPMP,昭和电工株式会社制的Karenz MTPE1、BD1、NR1、TPMB等,但不限于这些。
关于前述(D)成分的含量,相对于(A)成分100质量份优选为10~350质量份,更优选50~300质量份,进一步优选70~200质量份,特别优选100~170质量份,最优选110~150质量份。通过含有(D)成分10~350质量份(更优选50~300质量份),可以得到柔软且固化性优异的环氧树脂组合物。
关于(D)成分的巯基当量,从固化性和固化收缩的观点出发,优选10~300g/eq,更优选50~250g/eq,进一步优选80~230g/eq,特别优选100~200g/eq。
前述(A)成分和前述(D)成分的官能团当量比(A)/(D),优选0.3~2.0,更优选0.3~1.5,进一步优选0.4~1.0,特别优选为0.4~0.9,最优选0.4~0.8。只要(A)成分和(D)成分的官能团当量比(A)/(D)为0.3~2.0,就不会使固化性降低。需要说明的是,(A)成分和(D)成分的官能团当量比(A)/(D)是考虑(A)成分以及(D)成分的配合量而被计算出。即,通过“(A)成分的配合量(g)/硫醇当量(g/eq)”计算出的数值是“(A)成分的配合中的官能团当量A1”,通过“(D)成分的配合量(g)/巯基当量(g/eq)”计算出的数值是“(D)成分的配合中的官能团当量D1”,(A)成分和(D)成分的官能团当量比(A)/(D)通过“(A)成分的配合中的官能团当量A1/(D)成分的配合中的官能团当量D1”计算出。
前述(E)成分只要使(D)成分的固化得以促进就没有特别限定,但为具有热固化性的化合物。从快速固化性和保存稳定性的观点出发,(E)成分优选在25℃下为固体,优选使用将具有咪唑骨架的化合物或对环氧树脂进行叔胺的加成并在中途停止反应的环氧加成化合物加以粉碎得到的微粉末等。其中,从低温固化性和低固化收缩的观点出发,优选胺加成潜伏性固化促进剂,更优选改性脂肪族多胺加成物。
作为前述固化促进剂的市售品,例如可以举出Amicure PN-23、PN-23J、PN-31、PN-31J、PN-40J、PN-H、PN-R、MY-24、MY-R(味之素Fine-Techno株式会社制),Fujicure FXE-1000、Fujicure FXR-1030、Fujicure FXR-1081(T&K TOKA株式会社制),Curezol SIZ、2MZ-H、C11Z、C17Z、2PZ、2PZ-PW、2P4MZ(四国化成工业株式会社制)等。
关于前述(E)成分的软化点,从固化性和保存稳定性的观点出发,优选70~300℃的范围,更优选80~250℃,进一步优选90~200℃,特别优选为95~150℃,最优选100~130℃。另外,在一个实施方式中,(E)成分的软化点可以为100~200℃、90~130℃。
前述(E)成分的平均粒径优选0.1~50μm,更优选0.5~40μm,进一步优选1~30μm,特别优选为2~20μm,最优选2.5~10μm。通过使平均粒径为0.1~50μm,可以制作在(A)成分和(B)成分中混合时的分散性优异、示出稳定的固化性的环氧树脂组合物。需要说明的是,作为平均粒径的确认方法,可以举出激光衍射散射式、微分选控制方式的粒度·形状分布测定器、光学显微镜、电子显微镜等的图像解析。
关于前述(E)成分的含量,相对于(D)成分100质量份优选为0.001~20质量份,最优选0.01~10质量份。只要为0.001~10质量份,可以在不使保存稳定性降低的情况下,维持稳定的固化性。
进而,在不损害本发明的特性的范围内,可以进一步适量含有无机填充剂、有机填充剂、颜料、染料、硅烷偶联剂、流平剂、流变调节剂、保存稳定剂等添加剂。
作为前述无机填充剂,可以举出氧化铝粉、碳酸钙粉、滑石粉、二氧化硅粉、气相二氧化硅粉、金、银、铜、镍、钯等金属粉,将这些金属粉组合多种而成的焊料等合金、有机聚合物粒子以及金属粒子上覆盖有其它金属薄膜的镀敷粒子、碳粉、钨粉等,但并不限于此。关于无机填充剂的配合量的适当范围,相对于(A)成分100质量份优选为1~500质量份,更优选3~100质量份,最优选5~30质量份。
作为前述有机填充剂,只要是由橡胶、弹性体、塑料、聚合物(或共聚物)等构成的有机物的粉体即可。另外,可以是核壳型等具有多层结构的有机填料。作为有机填料的平均粒径,优选0.05~50μm的范围。从所谓提高耐久试验中的特性的观点出发,优选含有包含丙烯酸酯和/或(甲基)丙烯酸酯的聚合物或共聚物的填料、或包含苯乙烯化合物的聚合物或共聚物的填料。关于有机填充剂的适当配合量,相对于(A)100质量份优选为1~50质量份,更优选5~30质量份。
作为前述硅烷偶联剂,例如可以举出3-丙烯酰氧基丙基三甲氧基硅烷、3-环氧丙氧基丙基甲基二甲氧基硅烷、3-环氧丙氧基丙基甲基二乙氧基硅烷、3-环氧丙氧基丙基甲基二丙基氧基硅烷、3-环氧丙氧基丙基二甲基单甲氧基硅烷、3-环氧丙氧基丙基二甲基单乙氧基硅烷、3-环氧丙氧基丙基二甲基单丙基氧基硅烷、2-(3,4-环氧环己基)乙基三甲氧基硅烷、3-环氧丙氧基丙基三乙氧基硅烷、3-环氧丙氧基丙基三甲氧基硅烷、3-环氧丙氧基丙基甲基二乙氧基硅烷等含有缩水甘油基的硅烷偶联剂,乙烯基三(β-甲氧基乙氧基)硅烷、乙烯基三乙氧基硅烷、乙烯基三甲氧基硅烷等含有乙烯基的硅烷偶联剂,3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、3-甲基丙烯酰氧基丙基甲基二乙氧基硅烷、3-甲基丙烯酰氧基丙基二甲基单甲氧基硅烷、3-甲基丙烯酰氧基丙基二甲基单乙氧基硅烷、3-丙烯酰氧基丙基甲基二丙基氧基硅烷、3-丙烯酰氧基丙基甲基二甲氧基硅烷、3-丙烯酰氧基丙基甲基二乙氧基硅烷、3-丙烯酰氧基丙基甲基二丙基氧基硅烷、3-丙烯酰氧基丙基二甲基单丙基氧基硅烷、3-丙烯酰氧基丙基二甲基单甲氧基硅烷、3-丙烯酰氧基丙基二甲基单乙氧基硅烷、3-丙烯酰氧基丙基二甲基单丙基氧基硅烷、γ-甲基丙烯酰氧基丙基三甲氧基硅烷等含有(甲基)丙烯酰基的硅烷偶联剂、N-β-(氨基乙基)-γ-氨基丙基三甲氧基硅烷、γ-氨基丙基三乙氧基硅烷、N-苯基-γ-氨基丙基三甲氧基硅烷等含有氨基的硅烷偶联剂,γ-巯基丙基三甲氧基硅烷、γ-氯丙基三甲氧基硅烷等。其中,从所谓粘接力优异的观点出发,更优选含有缩水甘油基的硅烷偶联剂。它们可以单独使用,还可以并用2种以上。关于硅烷偶联剂的配合量的适当范围,相对于本发明的(A)成分100质量份为0.1~20质量份。
作为前述保存稳定剂,可以使用硼酸酯、磷酸、磷酸烷基酯、对甲苯磺酸。作为硼酸酯,可以举出硼酸三丁酯、三甲氧基环硼氧烷、硼酸乙酯等,但不限于这些。作为磷酸烷基酯,可以使用磷酸三甲酯、磷酸三丁酯等,但不限于这些。保存稳定剂可以单独使用,还可以混合多种使用。如果考虑对固化收缩的影响,优选为从由磷酸、磷酸烷基酯、硼酸酯、三甲氧基环硼氧烷、以及对甲苯磺酸甲酯构成的组中选择的1种以上,最优选磷酸、硼酸酯。从维持固化性和固化收缩的观点出发,保存稳定剂的适当配合量是相对于(A)成分100质量份为0.1~10质量份。
<涂布方法>
作为向被粘物涂布本发明的环氧树脂组合物的方法,使用应用了公知的密封剂、粘接剂的方法。例如可以使用使用了自动涂布机的点胶(dispensing)、喷涂、喷墨、丝网印刷、凹版印刷、浸渍、旋涂等方法。从涂布性的观点出发,本发明的组合物的粘度(25℃)优选10Pa·s以下,更优选5Pa·s以下,进一步优选1Pa·s以下,进一步更优选850mPa·s以下,特别优选750mPa·s以下,最优选600mPa·s以下。本发明的组合物的粘度(25℃)的下限没有特别限制,但在实用上优选10mPa·s以上。需要说明的是,本发明的环氧树脂组合物通过含有上述(A)~(E)成分,可以成为上述粘度范围的低粘度的组合物。
<固化方法以及固化物>
本发明的环氧树脂组合物可以通过加热而固化。例如优选50℃以上且低于200℃的温度,更优选60℃以上且低于150℃。对固化时间没有特别限定,但在50℃以上且低于200℃的温度的情况下,优选1分钟以上且低于3小时,进一步优选2分钟以上且低于2小时。
就本发明的环氧树脂组合物而言,利用后述的实施例中所述的方法得到的固化收缩率优选为5.3%以下,更优选低于5.3%,进一步优选低于5.2%,特别优选低于5.0%。本发明的环氧树脂组合物的固化物优选通过后述的实施例中所述的方法得到的储能弹性模量为1.0GPa以下,更优选低于1.0GPa,进一步优选低于0.5GPa,特别优选低于0.3GPa。另外,换言之,在一个实施方式中,本发明的环氧树脂组合物是能够得到25℃下的储能弹性模量为1.0GPa以下的固化物的环氧树脂组合物。
<用途>
本发明的环氧树脂组合物能够用于各种用途。作为具体例,可以用于汽车用的开关部分、前照灯、发动机内部件、电气部件、驱动发动机、制动油箱、前车盖、挡泥板、车门等车身面板、车窗等的粘接、密封、浇铸、涂敷等;在电子材料领域,可以用于平板显示器(液晶显示器、有机EL显示器、发光二极管显示装置、场发射显示器)、视频光盘、CD、DVD、MD、拾取器镜头(pickup lens)、硬盘等的粘接、密封、浇铸、涂敷等;在电池领域,可以用于锂电池、锂离子电池、锰电池、碱性电池、燃料电池、硅基太阳能电池、色素敏化型电池、有机太阳能电池等的粘接、密封、涂敷等;在光学部件领域,可以用于光开关周边、光连接器周边的光纤材料、光无源器件、光电路器件、光电子集成电路周边的粘接、密封、涂敷等;在光学设备领域,可以用于相机模块、镜头用材料、取景器棱镜、目标棱镜、取景器罩、光接受传感器部、摄影镜头、投影电视的投影镜头等的粘接、密封、涂敷等;在基础设施领域,可以用于燃气管、水管等的粘接、衬里材料、密封、涂敷材料等。其中,本发明的环氧树脂组合物由于柔软性优异,低固化收缩,所以适合用于要求柔软性的用途、容易产生形变的微小部件。
实施例
接着举出实施例对本发明进行更详细的说明,但本发明并不限于这些实施例。
[实施例1~4、比较例1~8]
为了制备组合物,准备了下述成分。
(A):双酚A型、F型混合环氧树脂商品名:EPICLON EXA-835LV(DIC株式会社制)环氧当量:165g/eq粘度(25℃):2000mPa·s
(B):对叔丁基苯基缩水甘油基醚商品名:ADEKA Glycirol ED-509S环氧当量:206g/eq粘度(25℃):20mPa·s
(B’-1):烷基(C12~C13)单缩水甘油基醚商品名:ADEKA Glycirol ED-502(株式会社ADEKA制)环氧当量:320g/eq粘度(25℃):10mPa·s
(B’-2):3-十五碳二烯基苯酚缩水甘油基醚商品名:Epogosey CO(四日市合成株式会社制)环氧当量:450g/eq粘度(25℃):45mPa·s
(C-1):3-乙基-3[{(3-乙基氧杂环丁烷-3基)甲氧基}甲基]氧杂环丁烷商品名:Aron Oxetane OXT-221(东亚合成株式会社制)粘度:10mPa·s
(C-2):4,4’-双[(3-乙基-3-氧杂环丁基)甲氧基甲基]联苯商品名:EternacollOXBP(宇部兴产株式会社制)粘度(25℃):300mPa·s
(C-3):3-乙基-3-(4-羟基丁氧基甲基)氧杂环丁烷商品名:HBOX(宇部兴产株式会社制)粘度(25℃):30mPa·s
(C-4):(3-乙基-3-氧杂环丁基)甲氧基甲基甲基丙烯酸酯商品名:EternacollOXMA(宇部兴产株式会社制)粘度(25℃):4mPa·s
(C’-1):新戊二醇二缩水甘油基醚商品名:ADEKA Glycirol ED-523L(株式会社ADEKA制)环氧当量:140g/eq粘度(25℃):15mPa·s
(C’-2):1,4-己烷二甲醇二缩水甘油基醚商品名:Adeka Resin EP-4085S(株式会社ADEKA制)环氧当量:145g/eq粘度(25℃):50mPa·s
(C’-3):二环戊二烯型环氧树脂商品名:Adeka Resin EP-4088S(株式会社ADEKA制)环氧当量:170g/eq粘度(25℃):230mPa·s
(C’-4):1,6-己二醇二缩水甘油基醚商品名:ADEKA Glycirol ED-503G(株式会社ADEKA制)环氧当量:135g/eq粘度(25℃):15mPa·s
(D):季戊四醇四(3-巯基丁酸酯)商品名:Karenz MTPE1(昭和电工株式会社制)SH当量136g/eq
(E):改性脂肪族多胺加成物商品名:Fujicure FXR-1081胺值115软化点125℃平均粒径:6.0μm
其它成分:硼酸酯(试剂)
在搅拌容器中称量前述(A)成分和(B)成分,添加(C)成分,用混合器搅拌30分钟。进而添加(D)成分、(E),搅拌10分钟。详细的制备量按照表1以及表2,数值全部以质量份表示。任何试验都是在25℃下进行。
[固化收缩率]
向透明的圆筒形塑料容器中滴下组合物,使其厚度为6mm,在热风干燥炉中在80℃×60分钟的条件下使其固化并对固化物进行测定。通过比重杯法对未固化的组合物的比重(Sg1)进行了测定。另外,对该固化物的空气中的质量(WA)和水中(蒸馏水)的质量(WB)进行测定,通过Sg2=WA/(WA-WB)的计算式求出固化物的比重(Sg2)。进而,将由未固化的组合物的比重(Sg1)和固化物的比重(Sg2)通过ΔV=(Sg2-Sg1)/Sg2×100的计算式计算出的固化收缩率(ΔV)作为固化收缩率。
<合格基准>固化收缩率低于5.3%,更优选低于5.0%。
[DMA(储能弹性模量)测定]
按照组合物的厚度为1mm的方式向设定的夹具流入组合物之后,进行脱泡。随后,以80℃×60分钟使其固化而制作固化物,切成宽10mm的条状,制作试验片。安装于动态粘弹性测定装置(Seiko Instruments株式会社制DMS6100),对25℃下的储能弹性模量(1Hz、升温速度3℃/sec)进行测定。
<合格基准>储能弹性模量1.0GPa以下。
[表1]
[表2]
如表1所示,可知实施例1~4中尽管储能弹性模量与比较例相比大幅降低,但固化收缩率也低,柔软性和低固化收缩优异。在使用结构与(B)成分不同的反应性稀释剂的比较例1和2中,得到储能弹性模量非常高的结果。在不含(C)成分的比较例3~7中,均得到固化收缩率以及储能弹性模量比实施例1~4高的结果。由以上可知,通过含有(A)~(E)成分,可以兼具低储能弹性模量(柔软性)和低固化收缩。需要说明的是,用锥板型粘度计以剪切速率10s-1对实施例1的组合物的粘度(25℃)进行了测定,结果为500mPa·s。另外,用锥板型粘度计以剪切速率10s-1对实施例2~4的组合物的粘度(25℃)进行了测定,结果是确认到实施例2的组合物为522mPa·s,实施例3的组合物为412mPa·s,实施例4的组合物为581mPa·s。
本申请基于2020年3月23日申请的日本专利申请号第2020-051805号,其公开的全部内容通过参照而援引于本说明书。
产业上的可利用性
本发明的环氧树脂组合物具有柔软性且具有低固化收缩,因此可以作为易受部件的错位、外部应力的影响的部件所使用的粘接剂、涂敷剂、灌封剂而在各领域是有用的。
Claims (10)
1.一种环氧树脂组合物,其特征在于,
含有以下的(A)~(E)成分,
(A)成分:具有2个以上环氧基的化合物,
(B)成分:具有碳数为1~10的烷基的苯基单缩水甘油基醚,
(C)成分:氧杂环丁烷化合物,
(D)成分:二级硫醇固化剂,
(E)成分:固化促进剂。
2.如权利要求1所述的环氧树脂组合物,其特征在于,
所述(C)成分是具有2个以上氧杂环丁基的化合物。
3.如权利要求1或2所述的环氧树脂组合物,其特征在于,
所述(C)成分的含量是相对于(A)成分100质量份为1~70质量份。
4.如权利要求1或2所述的环氧树脂组合物,其特征在于,
所述(D)成分是选自季戊四醇四(3-巯基丁酸酯)、1,4-双(3-巯基丁酰氧基)丁烷、1,3,5-三(3-巯基丁酰氧基乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮、三羟甲基丙烷三(3-巯基丁酸酯)、三羟甲基乙烷三(3-巯基丁酸酯)中的1种以上。
5.如权利要求1或2所述的环氧树脂组合物,其特征在于,
所述(E)成分是胺加成潜伏性固化促进剂。
6.如权利要求1或2所述的环氧树脂组合物,其特征在于,
进而含有保存稳定剂。
7.如权利要求1或2所述的环氧树脂组合物,其特征在于,
固化收缩率低于5.3%。
8.如权利要求1或2所述的环氧树脂组合物,其特征在于,
具有热固化性。
9.一种固化物,其特征在于,
是权利要求1~8中任意一项所述的环氧树脂组合物的固化物。
10.如权利要求9所述的固化物,其特征在于,
25℃下的储能弹性模量为1.0GPa以下。
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