CN114937718A - Substrate manufacturing method, substrate, display panel and electronic device - Google Patents
Substrate manufacturing method, substrate, display panel and electronic device Download PDFInfo
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- CN114937718A CN114937718A CN202210446157.1A CN202210446157A CN114937718A CN 114937718 A CN114937718 A CN 114937718A CN 202210446157 A CN202210446157 A CN 202210446157A CN 114937718 A CN114937718 A CN 114937718A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
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Abstract
本申请涉及电子产品技术领域，尤其涉及一种基板的制造方法、基板、显示面板及电子设备。所述方法包括：在金属片的第一面形成第一网状孔；将绝缘胶填充在所述第一网状孔中；对所述绝缘胶进行固化，形成第一子绝缘件；在所述金属片的第二面对应所述第一网状孔形成与所述第一网状孔连通的第二网状孔，以使所述金属片形成多个互相独立的点状结构，所述第二网状孔与所述第一网状孔共同构成网状孔，所述第二面与所述第一面相背。本申请提供的基板的制造方法，制造得到的基板的成本低廉。
The present application relates to the technical field of electronic products, and in particular, to a method for manufacturing a substrate, a substrate, a display panel and an electronic device. The method includes: forming a first mesh hole on the first surface of the metal sheet; filling insulating glue in the first mesh hole; curing the insulating glue to form a first sub-insulation part; The second surface of the metal sheet corresponds to the first mesh hole to form a second mesh hole that communicates with the first mesh hole, so that the metal sheet forms a plurality of mutually independent point-like structures, so The second mesh hole and the first mesh hole together form a mesh hole, and the second surface is opposite to the first surface. With the method for manufacturing a substrate provided by the present application, the cost of the manufactured substrate is low.
Description
Technical Field
The present disclosure relates to the field of electronic product technologies, and in particular, to a method for manufacturing a substrate, a display panel, and an electronic device.
Background
In recent years, with the rapid spread of electronic devices, display panels applied to the electronic devices have been vigorously developed.
Generally, the display panel includes a substrate and a lamp bead electrically connected to the substrate. In the related art, the substrate is usually made of CCL (Copper Clad Laminate), and the CCL is expensive, which results in a high substrate cost.
Disclosure of Invention
The application discloses a manufacturing method of a substrate, the substrate, a display panel and an electronic device, which can solve the problem that the cost of the substrate is high.
In order to achieve the above object, in one aspect, the present application discloses a method of manufacturing a substrate, the method including:
forming a first mesh hole on a first surface of the metal sheet;
filling insulating glue in the first mesh holes;
curing the insulating glue to form a first sub-insulating part;
and forming second reticular holes communicated with the first reticular holes on the second surface of the metal sheet corresponding to the first reticular holes so as to enable the metal sheet to form a plurality of mutually independent point-shaped structures, wherein the second reticular holes and the first reticular holes jointly form the reticular holes, and the second surface is opposite to the first surface.
The first mesh holes are formed in the first surface of the metal sheet, then the insulating glue is filled in the first mesh holes, the insulating glue is solidified to form a first sub-insulating part, finally, the second surface, opposite to the first surface, of the metal sheet corresponds to the first mesh holes to form second mesh holes communicated with the first mesh holes, the second mesh holes and the first mesh holes jointly form mesh holes penetrating through the first surface and the second surface, so that the metal sheet forms a plurality of mutually independent point-like structures, and therefore the point-like structures are separated by the first sub-insulating part and are mutually insulated. Based on the above, when the substrate manufactured by the method is applied to a display panel, two contact pins of a lamp bead in the display panel can be respectively connected with the first surfaces of the two dot-shaped structures separated by the first sub-insulating member, and based on the above description, the dot-shaped structures are insulated from each other, so that when the second surface of the dot-shaped structure is connected into a circuit, current can be conducted to the first surfaces of the dot-shaped structures through the dot-shaped structures, and then the purpose of connecting the lamp bead into the circuit can be achieved.
Because the substrate is made of the metal sheet, compared with the substrate made of the CCL (Copper Clad Laminate), the substrate made of the metal sheet has lower cost, and the purpose of reducing the cost of the substrate can be achieved.
In addition, when the second surface of the dot structure is connected to the circuit, the current of the second surface of the dot structure may be conducted to the first surface of the dot structure through the dot structure, and thus the dot structure is a conductor for conducting the second surface and the first surface to each other.
Optionally, the forming a first mesh hole on the first surface of the metal sheet includes:
and etching the first mesh hole on the first surface of the metal sheet in a yellow etching mode.
The yellow light etching mode has mature technology and high manufacturing efficiency, so that the manufacturing efficiency of manufacturing the first reticular hole can be greatly improved while the manufacturing quality of the first reticular hole is ensured.
Optionally, the filling of the insulating glue in the first mesh holes includes:
providing insulating glue;
and adhering the insulating glue to the first surface of the metal sheet, and pressing to fill the insulating glue in the first mesh holes.
Because the mode of pasting and pressfitting the first face of insulating cement and sheetmetal can once only be with the filling of insulating cement in first netted hole, consequently, through pasting insulating cement and the first face of sheetmetal to each other, can improve the preparation efficiency of whole base plate.
Optionally, after the second surface of the metal sheet forms a second mesh hole corresponding to the first mesh hole and communicating with the first mesh hole, the method further comprises:
and polishing the first sub-insulating part covered on the first surface of the metal sheet until the dot-shaped structure is exposed.
The process is mature in a mode of exposing the dot-shaped structure through polishing, so that the manufacturing efficiency can be improved.
Optionally, after the forming a second mesh hole communicating with the first mesh hole on the second surface of the metal sheet corresponding to the first mesh hole, the polishing the first sub-insulator covering the first surface of the metal sheet until the dot structure is exposed further includes:
filling insulating glue in the second mesh holes;
and curing the insulating glue to form a second sub-insulating part, so that the second sub-insulating part and the first sub-insulating part jointly form an insulating part.
Through making second sub-insulator constitute the insulator with first sub-insulator jointly, on the one hand, can make the structural strength of base plate stronger, on the other hand, can make the better mutual insulation of punctiform structure.
Optionally, after the polishing of the first sub-insulator covering the first surface of the metal sheet is performed until the dot structures are exposed, the method further includes:
and polishing the second sub-insulating part covering the second surface of the metal sheet until the dot-shaped structure is exposed.
The process is mature in a mode of exposing the dot-shaped structure through polishing, so that the manufacturing efficiency can be improved.
Optionally, after the polishing of the second sub-insulator covering the second surface of the metal sheet until the dot structures are exposed, the method further includes:
plating the first face and/or the second face of the dot structure with a conductive reinforcing layer.
The thickness of the conductive enhancement layer manufactured in the electroplating mode is uniform, so that the conductive uniformity of the whole substrate can be improved.
On the other hand, the present application discloses a substrate manufactured by the method for manufacturing a substrate according to any one of the above aspects, the substrate is applied to a display panel, the display panel includes a lamp bead, and the substrate includes:
the metal sheet comprises a first surface and a second surface which are opposite, and reticular holes which penetrate through the first surface and the second surface are formed in the metal sheet and enable the metal sheet to form a plurality of mutually independent point-shaped structures;
the insulating part is filled in the mesh holes, the point-shaped structures are connected with the insulating part, and the point-shaped structures are used for being electrically connected with the lamp beads.
Because the substrate is made of the metal sheet, compared with the substrate made of the CCL (Copper Clad Laminate), the substrate made of the metal sheet has lower cost, and the purpose of reducing the cost of the substrate can be achieved.
In addition, when the second surface of the dot structure is connected to the circuit, since the current of the second surface of the dot structure may be conducted to the first surface of the dot structure through the dot structure, the dot structure is a conductor for conducting the second surface and the first surface to each other, it can be understood that the dot structure is a structure of the metal sheet itself without any processing, that is, the conductor for conducting the second surface and the first surface to each other is a structure of the metal sheet itself without any processing, and compared with a mode in which the two side surfaces of the CCL are conducted by implanting a conductor (such as a copper pillar) after the CCL is opened, the conductive performance of the dot structure is more stable than that of implanting a conductor, thereby further stabilizing the performance of the display panel and improving the reliability of the display panel.
Optionally, the mesh openings include a first mesh opening disposed on the first face and a second mesh opening disposed on the second face corresponding to the first mesh opening and in communication with the first mesh opening;
wherein the cross-sectional area of the first mesh openings decreases in a direction from the first face toward the second face; and/or the cross-sectional area of the second mesh-like hole is gradually reduced along the direction in which the second face is directed to the first face.
By making the cross-sectional area of the first mesh openings gradually decrease in a direction in which the first face is directed toward the second face, and making the cross-sectional area of the second mesh openings gradually decrease in a direction in which the second face is directed toward the first face, that is, the openings of the first mesh openings and the second mesh openings are larger, on the one hand, it is convenient to place the insulator in the first mesh openings and/or the second mesh openings, and on the other hand, when the insulator is a BT insulator, it can be understood that the BT insulator is liquid-like before being cured, and therefore, it is possible to avoid or reduce the occurrence of a situation in which the liquid-like BT insulator flows out of the first mesh openings and the second mesh openings.
Optionally, the insulating member includes a first sub-insulating member, and the first sub-insulating member is filled in the first mesh holes and connected to the dot structures; or,
the insulating part comprises a first sub-insulating part and a second sub-insulating part, the first sub-insulating part is filled in the first mesh-shaped hole, the second sub-insulating part is filled in the second mesh-shaped hole, and the first sub-insulating part and the second sub-insulating part are connected with each other and are respectively connected with the point-shaped structures.
When the insulating part comprises the first sub-insulating part, so that the first sub-insulating part is filled in the first mesh-shaped hole and connected with the point-shaped structures, the first sub-insulating part can realize the purpose of insulating the point-shaped structures from each other while connecting the point-shaped structures with each other to form an integral structure.
With the arrangement, the second mesh holes can be vacant, so that on one hand, the material consumption of the insulating part can be reduced, and on the other hand, the weight of the whole substrate can be reduced.
When the insulating member includes the first sub-insulating member and the second sub-insulating member, on one hand, the structural strength of the entire substrate can be made stronger, and on the other hand, the dot structures can be made better insulated from each other.
Optionally, a conductive reinforcing layer is stacked on the first surface and/or the second surface of the dot structure.
Through in point column structure first face and/or the range upon range of being provided with the electrically conductive enhancement layer on the second face, can be so that the electric conductive property of first face and second face is stronger, and then when this base plate was used in display panel, first face can be connected with the lamp pearl electricity through the electrically conductive enhancement layer, and the second face also can insert into the circuit through the electrically conductive enhancement layer, and then makes the lamp pearl can be more stable insert into the circuit.
Optionally, the metal sheet is a copper sheet.
The copper sheet has excellent conductivity and low cost, so the cost of the metal sheet can be reduced to a certain extent.
Optionally, the thickness of the copper sheet from the first surface to the second surface is d, and d is greater than or equal to 20 μm and less than or equal to 500 μm.
D is more than or equal to 20 mu m and less than or equal to 500 mu m, so that the structural strength of the copper sheet is stronger, and the problems of serious material waste and higher cost can be avoided.
Optionally, the insulator is a BT (bismalimide) insulator.
The BT insulating part has better insulating property and lower cost, so that the manufacturing cost of the substrate can be reduced to a certain extent while the point structures are mutually insulated.
In yet another aspect, the present application discloses a display panel, including:
a lamp bead;
in any of the above aspects, the lamp bead is electrically connected to the dot structure.
Since the substrate is made of the metal sheet, the substrate made of the metal sheet has a lower cost than the substrate made of the CCL, and the purpose of reducing the cost of the substrate can be achieved.
In addition, because the electric conductive property of sheetmetal compares in copper post stability more, consequently, when the lamp pearl electricity is connected on the position that does not set up netted hole in first face, can be so that the lamp pearl is more stable insert the circuit into.
Based on this, when the substrate is applied to a display panel, the cost of the display panel can be lower and the performance can be more stable.
In yet another aspect, the present application discloses an electronic device including the display panel of the above yet another aspect.
Since the display panel is cheaper in cost and more stable in performance, when the display panel is applied to an electronic device, the electronic device can be cheaper in cost and more stable in performance.
Compared with the prior art, the beneficial effect of this application lies in:
the first mesh holes are formed in the first surface of the metal sheet, then the insulating glue is filled in the first mesh holes, the insulating glue is solidified to form a first sub-insulating part, finally, the second surface, opposite to the first surface, of the metal sheet corresponds to the first mesh holes to form second mesh holes communicated with the first mesh holes, the second mesh holes and the first mesh holes jointly form mesh holes penetrating through the first surface and the second surface, so that the metal sheet forms a plurality of mutually independent point-like structures, and therefore the point-like structures are separated by the first sub-insulating part and are mutually insulated.
Based on the above, when the substrate manufactured by the method is applied to a display panel, two contact pins of a lamp bead in the display panel can be respectively connected with the first surfaces of the two dot-shaped structures separated by the first sub-insulating member, and based on the above description, the dot-shaped structures are insulated from each other, so that when the second surface of the dot-shaped structure is connected into a circuit, current can be conducted to the first surfaces of the dot-shaped structures through the dot-shaped structures, and then the purpose of connecting the lamp bead into the circuit can be achieved.
Because the substrate is made of the metal sheet, compared with the substrate made of the CCL (Copper Clad Laminate), the substrate made of the metal sheet has lower cost, and the purpose of reducing the cost of the substrate can be achieved.
In addition, when the second surface of the dot structure is connected to the circuit, the current of the second surface of the dot structure may be conducted to the first surface of the dot structure through the dot structure, and thus the dot structure is a conductor for conducting the second surface and the first surface to each other.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a substrate according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view of the substrate of FIG. 2 at location A-A;
fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
FIG. 5 is a cross-sectional view of the display panel of FIG. 4 at position B-B;
fig. 6 is a flowchart of another method for manufacturing a substrate according to an embodiment of the present disclosure;
FIG. 7 is a schematic cross-sectional view illustrating a structure of a method for manufacturing a substrate according to an embodiment of the present disclosure;
FIG. 8 is a cross-sectional view of another substrate at position A-A according to an embodiment of the present application;
FIG. 9 is a cross-sectional view of another substrate at a-A in accordance with an embodiment of the present application;
fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Description of the main reference numerals
1-a metal sheet; 10-point structure; 11-a first side; 12-a second face; 13-mesh holes; 131-first mesh holes; 132-a second mesh aperture;
2-an insulator; 21-a first sub-insulator; 22-a second sub-insulator;
3-a conductive reinforcement layer;
100-a display panel; 101-lamp beads; 200-substrate.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present application will be further described with reference to the following embodiments and accompanying drawings.
Fig. 1 is a flowchart of a method for manufacturing a substrate according to an embodiment of the present disclosure, fig. 2 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure, fig. 3 is a cross-sectional view of the substrate in fig. 2 at a position a-a, fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure, and fig. 5 is a cross-sectional view of the display panel in fig. 4 at a position B-B.
Referring to fig. 1, the method includes:
step 101: a first mesh hole 131 is formed in the first surface 11 of the metal sheet 1.
Step 102: the insulating paste is filled in the first mesh holes 131.
Step 103: the insulating paste is cured to form the first sub-insulator 21.
Step 104: second mesh holes 132 communicated with the first mesh holes 131 are formed on the second surface 12 of the metal sheet 1 corresponding to the first mesh holes 131, so that the metal sheet 1 forms a plurality of mutually independent dot-shaped structures 10, the second mesh holes 132 and the first mesh holes 131 together form mesh holes 13, and the second surface 12 is opposite to the first surface 11.
In the embodiment of the present application, referring to fig. 2 and fig. 3, first, a first mesh hole 131 is formed in a first surface 11 of a metal sheet 1, then, an insulating adhesive is filled in the first mesh hole 131, and the insulating adhesive is cured to form a first sub-insulator 21, and finally, a second mesh hole 132 communicated with the first mesh hole 131 is formed in a second surface 12 of the metal sheet 1 opposite to the first surface 11 corresponding to the first mesh hole 131, and the second mesh hole 132 and the first mesh hole 131 together form a mesh hole 13 penetrating through the first surface 11 and the second surface 12, so that the metal sheet 1 forms a plurality of independent dot structures 10, and therefore, the dot structures 10 are separated from each other by the first sub-insulator 21 and insulated from each other.
Based on this, referring to fig. 4 and fig. 5, when the substrate 200 manufactured by this method is applied in the display panel 100, two contact pins of the lamp bead 101 in the display panel 100 may be respectively connected to the first surfaces 11 of the two dot structures 10 separated by the first sub-insulator 21, and based on the above description, the plurality of dot structures 10 are insulated from each other, so that when the second surface 12 of the dot structure 10 is connected to the circuit, the current may be conducted to the first surfaces 11 of the dot structures 10 through the dot structures 10, and the purpose of connecting the lamp bead 101 to the circuit may be achieved, and after the lamp bead 101 is connected to the circuit, the purpose of displaying an image on the display panel 100 may be achieved by controlling the on-off change of the lamp bead 101.
Since the substrate 200 is made of the metal sheet 1, compared with the substrate 200 made of CCL (Copper Clad Laminate), the substrate 200 made of the metal sheet 1 has a lower cost, and the purpose of reducing the cost of the substrate 200 can be achieved.
In addition, when the second side 12 of the dot structure 10 is connected to the circuit, since the current of the second side 12 of the dot structure 10 can be conducted to the first side 11 of the dot structure 10 through the dot structure 10, the dot-like structure 10 will therefore be a conductor for realizing the conduction of the second face 12 and the first face 11 to each other, it being understood that, since the dot-like structure 10, without any processing, is the structure of the metal sheet 1 itself, that is, the conductors for conducting the second surface 12 and the first surface 11 to each other are not processed, and are the structures of the metal sheet 1 itself, compared with the method of conducting the two side surfaces of the CCL by implanting the conductors (such as copper pillars) after the holes are formed in the CCL in the related art, the electrical conductivity of the dot structure 10 is more stable than that of the implanted conductors, and further, the performance of the display panel 100 is more stable, thereby improving the reliability of the display panel 100.
Fig. 6 is a flowchart of another substrate manufacturing method according to an embodiment of the present disclosure, and fig. 7 is a schematic structural cross-sectional view of the substrate manufacturing method according to the embodiment of the present disclosure.
Referring to fig. 6 and 7, the method includes:
step 201: first mesh holes 131 are formed in the first surface 11 of the metal sheet 1.
The formation of the first mesh-like apertures 131 in the first side 11 of the metal sheet 1 can be achieved in various ways, and in one possible implementation, the first mesh-like apertures 131 can be formed by etching the first side 11 of the metal sheet 1 by means of photolithography.
Since the yellow light etching method has a mature technology and high manufacturing efficiency, the manufacturing efficiency of the first mesh holes 131 can be greatly improved while the manufacturing quality of the first mesh holes 131 is ensured.
Of course, the first mesh holes 131 may be formed on the first surface 11 of the metal sheet 1 by other methods, for example, by acid etching or other methods, which is not limited in this embodiment.
Step 202: the first mesh holes 131 are filled with an insulating paste.
The filling of the insulating paste in the first mesh-shaped holes 131 may be achieved in various ways. In one possible implementation, the filling of the insulation paste in the first mesh-shaped holes 131 may be achieved by dropping the insulation paste into the first mesh-shaped holes 131. In another possible implementation, the insulating paste may be filled in the first mesh holes 131 by coating or printing.
Alternatively, in yet another possible implementation, specifically, the filling of the insulating glue in the first mesh holes 131 may be achieved by the following steps 2021-2022.
Step 2021: and providing the insulating glue.
Step 2022: the insulating glue is attached to the first surface 11 of the metal sheet 1 and pressed, so that the insulating glue is filled in the first mesh holes 131.
Specifically, the insulating glue may be attached to the first surface 11 of the metal sheet 1 by vacuum hot-pressing and pressing, so that the insulating glue is filled in the first mesh-shaped holes 131.
Because the insulating glue can be filled in the first mesh-shaped holes 131 at one time in a mode of pasting the insulating glue and the first surface 11 of the metal sheet 1 oppositely and pressing, the manufacturing efficiency of the whole substrate can be improved by pasting the insulating glue and the first surface 11 of the metal sheet 1 oppositely.
Step 203: the insulating paste is cured to form the first sub-insulator 21.
The insulating paste may be cured by means of heat baking to form the first sub-insulator 21. The curing speed of the heating baking is high, so that the manufacturing efficiency of the substrate can be improved.
Step 204: second mesh holes 132 communicated with the first mesh holes 131 are formed on the second surface 12 of the metal sheet 1 corresponding to the first mesh holes 131, so that the metal sheet forms a plurality of mutually independent point-shaped structures, the second mesh holes and the first mesh holes form mesh holes together, and the first surface and the second surface are opposite.
The manufacturing method of the second mesh holes 132 may be the same as the manufacturing method of the first mesh holes 131, and specific reference may be made to the description of the manufacturing method of the first mesh holes 131 in step 201, which is not repeated herein.
Step 205: the insulating paste is filled in the second mesh holes 132.
The manner of filling the insulating glue in the second mesh holes 132 may be similar to the manner of filling the insulating glue in the first mesh holes 131 in step 202, and the description of the embodiments of the present application is omitted here.
Step 206: the insulating paste is cured to form the second sub-insulator 22, so that the second sub-insulator 22 and the first sub-insulator 21 together form the insulator 2.
The manner of curing the insulating glue to form the second sub-insulating member 22 may be similar to the manner of curing the insulating glue to form the first sub-insulating member 21 in step 203, and details of the embodiment of the present application are not repeated herein.
By making the second sub-insulator 22 and the first sub-insulator 21 together form the insulator 2, on the one hand, the structural strength of the substrate can be made stronger, and on the other hand, the dot-shaped structures 10 can be better insulated from each other.
Step 207: the first sub-insulator 21 covering the first face 11 of the metal sheet 1 is ground until the dot-like structure is exposed.
The first sub-insulator 21 covering the first side 11 of the metal sheet 1 may be ground by a grinding apparatus or a polishing apparatus until the dot-shaped structures are exposed.
The process is mature in a mode of exposing the dot-shaped structure through polishing, so that the manufacturing efficiency can be improved.
Step 208: and polishing the second sub-insulating part covered on the second surface of the metal sheet until the point-shaped structure is exposed.
The manner of polishing the second sub-insulator covering the second surface of the metal sheet until the dot-shaped structure is exposed may be similar to the manner of polishing the first sub-insulator 21 covering the first surface 11 of the metal sheet 1 in step 207 until the dot-shaped structure is exposed, which is not described herein again in this embodiment of the present application.
Step 209: the first side and/or the second side of the dot-shaped structures are plated with a conductive reinforcement layer 3.
The thickness of the conductive enhancement layer 3 manufactured in the electroplating mode is uniform, so that the conductive uniformity of the whole substrate can be improved.
To sum up, in the embodiment of the present application, first, the first mesh holes 131 are formed in the first surface 11 of the metal sheet 1, then, the insulating glue is filled in the first mesh holes 131, and the insulating glue is cured to form the first sub-insulator 21, and finally, the second mesh holes 132 communicated with the first mesh holes 131 are formed in the second surface 12 of the metal sheet 1 opposite to the first surface 11 corresponding to the first mesh holes 131, and the second mesh holes 132 and the first mesh holes 131 together form the mesh holes 13 penetrating through the first surface 11 and the second surface 12, so that the metal sheet 1 forms a plurality of mutually independent dot-shaped structures 10, and therefore, the dot-shaped structures 10 are separated from each other by the first sub-insulator 21 and insulated from each other. Based on this, when the substrate 200 manufactured by the method is applied to the display panel 100, the two contact pins of the lamp bead 101 in the display panel 100 may be respectively connected to the first surfaces 11 of the two dot structures 10 separated by the first sub-insulator 21, and as can be seen from the above description, the dot structures 10 are insulated from each other, so that when the second surface 12 of the dot structure 10 is connected to the circuit, the current may be conducted to the first surfaces 11 of the dot structures 10 through the dot structures 10, and the purpose of connecting the lamp bead 101 to the circuit may be achieved, and after the lamp bead 101 is connected to the circuit, the purpose of displaying an image by the display panel 100 may be achieved by controlling the on-off change of the lamp bead 101.
Since the substrate 200 is made of the metal sheet 1, compared with the substrate 200 made of CCL (Copper Clad Laminate), the substrate 200 made of the metal sheet 1 has a lower cost, and the purpose of reducing the cost of the substrate 200 can be achieved.
In addition, when the second side 12 of the dot structure 10 is connected to the circuit, since the current of the second side 12 of the dot structure 10 can be conducted to the first side 11 of the dot structure 10 through the dot structure 10, the dot-like structure 10 will therefore be a conductor for realizing the conduction of the second face 12 and the first face 11 to each other, it being understood that, since the dot-like structure 10 is not subjected to any processing, it is the structure of the metal sheet 1 itself, that is, the conductors for conducting the second surface 12 and the first surface 11 to each other are not processed, and are the structures of the metal sheet 1 itself, compared with the method of conducting the two side surfaces of the CCL by implanting the conductors (such as copper pillars) after the holes are formed in the CCL in the related art, the electrical conductivity of the dot structure 10 is more stable than that of the implanted conductors, and further, the performance of the display panel 100 is more stable, thereby improving the reliability of the display panel 100.
Moreover, since the first mesh holes 131 and the second mesh holes 132 can be formed by photolithography etching, and since the photolithography etching has a mature technology and a high manufacturing efficiency, the manufacturing efficiency of the first mesh holes 131 and the second mesh holes 132 can be greatly improved while the manufacturing quality of the first mesh holes 131 and the second mesh holes 132 is ensured, and further the manufacturing efficiency of the substrate can be greatly improved.
The present application also provides a substrate manufactured according to the method for manufacturing a substrate described in any one of the above embodiments.
Referring to fig. 2, 3, 4 and 5, the substrate 200 may be applied to the display panel 100, the display panel 100 includes a lamp bead 101, and the substrate 200 includes a metal sheet 1 and an insulating member 2. The metal sheet 1 includes a first surface 11 and a second surface 12 opposite to each other, mesh holes 13 penetrating through the first surface 11 and the second surface 12 are formed in the metal sheet 1, and the mesh holes 13 enable the metal sheet 1 to form a plurality of mutually independent point-like structures 10. The insulating part 2 is filled in the mesh holes 13, the dot structures 10 are connected with the insulating part 2, and the first surfaces 11 of the dot structures 10 are used for being electrically connected with the lamp beads 101.
In the embodiment of the present application, the mesh holes 13 form a plurality of independent dot structures 10 on the metal sheet 1. Then, since the insulation member 2 is filled in the mesh-shaped hole 13, and the dot-shaped structures 10 are connected to the insulation member 2, on one hand, the dot-shaped structures 10 are connected to each other under the action of the insulation member 2, so that the insulation member 2 and the dot-shaped structures 10 form an integral structure, and on the other hand, the dot-shaped structures 10 are insulated from each other under the action of the insulation member 2.
Based on this, referring to fig. 4 and fig. 5, when the substrate 200 is applied to the display panel 100, two contact pins of the lamp bead 101 in the display panel 100 may be respectively connected to the first surfaces 11 of the two dot structures 10 separated by the insulating member 2, and based on the above description, the dot structures 10 are insulated from each other, so that when the second surface 12 of the dot structure 10 is connected to the circuit, the current may be conducted to the first surfaces 11 of the dot structures 10 through the dot structures 10, and the purpose of connecting the lamp bead 101 to the circuit may be achieved, and after the lamp bead 101 is connected to the circuit, the purpose of displaying the image by the display panel 100 may be achieved by controlling the on-off change of the lamp bead 101.
Since the substrate 200 is made of the metal sheet 1, compared with the substrate 200 made of CCL (Copper Clad Laminate), the substrate 200 made of the metal sheet 1 has a lower cost, and the purpose of reducing the cost of the substrate 200 can be achieved.
In addition, when the second side 12 of the dot structure 10 is connected to the circuit, since the current of the second side 12 of the dot structure 10 can be conducted to the first side 11 of the dot structure 10 through the dot structure 10, the dot-like structure 10 will therefore be a conductor for realizing the conduction of the second face 12 and the first face 11 to each other, it being understood that, since the dot-like structure 10 is not subjected to any processing, it is the structure of the metal sheet 1 itself, that is, the conductors for conducting the second surface 12 and the first surface 11 to each other are not processed, and are the structures of the metal sheet 1 itself, compared with the method of conducting the two side surfaces of the CCL by implanting the conductors (such as copper pillars) after the holes are formed in the CCL in the related art, the electrical conductivity of the dot structure 10 is more stable than that of the implanted conductors, and further, the performance of the display panel 100 is more stable, thereby improving the reliability of the display panel 100.
The cross section of the dot structure 10 may be substantially circular or substantially rectangular, which is not limited in the embodiments of the present application.
It should be noted that the above-mentioned insulating element 2 has multiple understandings, when the first sub-insulating element is included in the embodiment of the present invention, the insulating element is the first sub-insulating element, and when the first sub-insulating element and the second sub-insulating element are included in the embodiment of the present invention, the insulating element 2 is a structure formed by the first sub-insulating element and the second sub-insulating element together.
The insulator 2 may be a BT (Bismaleimide) insulator. Since the BT insulator has better insulating properties and lower cost, the manufacturing cost of the substrate 200 can be reduced to a certain extent while ensuring the mutual insulation of the dot structures 10.
Of course, the material of the insulating member 2 may also be other possible materials, for example, the insulating member 2 may also be a polyurethane insulating member, and the like, and only needs to play an insulating role, and the material of the insulating member 2 is not limited in this embodiment of the application.
It should be noted that the metal sheet 1 may be a copper sheet, and since the copper sheet has excellent conductivity and low cost, the cost of the metal sheet 1 may be reduced to some extent.
Of course, the metal sheet 1 may be a gold strip, an iron alloy strip, or the like, and the metal sheet 1 is not limited in the present embodiment.
In some embodiments, referring to FIG. 3, when the metal sheet 1 is a copper sheet, the thickness of the copper sheet in the direction from the first side 11 to the second side 12 (i.e., the negative direction along the Z axis in FIG. 3) is d, and 20 μm. ltoreq. d.ltoreq.500 μm. For example, d can be 20um, 50um, 100um, 200um, 300um, 400um, 500, and the like. When d is less than 20 mu m, the copper sheet has weaker structural strength and is easy to break in the using process, and when d is more than 500 mu m, the material waste is serious, and the cost is higher, so that the structural strength of the copper sheet can be ensured on one hand, on the other hand, the material waste can be avoided to be serious, and the material cost is further reduced by enabling d to be less than or equal to 20 mu m and less than or equal to 500 mu m.
In some embodiments, referring to fig. 3, the mesh holes 13 include a first mesh hole 131 and a second mesh hole 132, the first mesh hole 131 is disposed on the first side 11, and the second mesh hole 132 is disposed on the second side 12 corresponding to the first mesh hole 131 and is in communication with the first mesh hole 131. Wherein the cross-sectional area of the first mesh-like holes 131 gradually decreases in a direction in which the first face 11 is directed toward the second face 12 (i.e., a negative direction along the Z-axis in fig. 3), and the cross-sectional area of the second mesh-like holes 132 gradually decreases in a direction in which the second face 12 is directed toward the first face 11 (i.e., a positive direction along the Z-axis in fig. 3).
By making the cross-sectional area of the first mesh-like pores 131 gradually decrease in the direction in which the first face 11 is directed toward the second face 12, and making the cross-sectional area of the second mesh-like pores 132 gradually decrease in the direction in which the second face 12 is directed toward the first face 11, that is, making the openings of the first mesh-like pores 131 and the second mesh-like pores 132 larger, on the one hand, it is convenient to fill the insulator 2 in the first mesh-like pores 131 and/or the second mesh-like pores 132, and on the other hand, when the insulator 2 is a BT insulator, it can be understood that the BT insulator is liquid-like before being solidified, and therefore, it is possible to avoid or reduce the occurrence of a situation in which the liquid-like BT insulator flows out of the first mesh-like pores 131 and the second mesh-like pores 132.
In other embodiments, the cross-sectional area of the first mesh-shaped holes 131 may gradually decrease along the direction from the first side 11 to the second side 12, or the cross-sectional area of the second mesh-shaped holes 132 may gradually decrease along the direction from the second side 12 to the first side 11, which is not limited in the embodiment of the present application.
It should be noted that the cross section of the first mesh-shaped hole 131 refers to a section formed by cutting the first mesh-shaped hole 131 perpendicular to a plane in which the first surface points to the second surface. Illustratively, referring to fig. 2, the cross-section of the first mesh-shaped hole 131 refers to a section formed by cutting the first mesh-shaped hole 131 in a plane parallel to the XY-plane.
Similarly, the cross section of the second mesh hole 132 can be similarly understood, and the description thereof is omitted here.
In some embodiments, the first mesh holes 131 and the second mesh holes 132 are etched holes. Since the first and second mesh holes 131 and 132 formed by etching have higher manufacturing efficiency and lower cost than the first and second mesh holes 131 and 132 formed by laser drilling, the manufacturing cost of the substrate 200 can be reduced to some extent.
Of course, the first mesh holes 131 and the second mesh holes 132 may be made in other manners, which is not limited in the embodiments of the present application.
In some embodiments, referring to fig. 3, the insulation member 2 includes a first sub-insulation member 21, and the first sub-insulation member 21 is filled in the first mesh holes 131 and connected to the dot structures 10.
When the insulating member 2 includes the first sub-insulating member 21, such that the first sub-insulating member 21 is filled in the first mesh-like hole 131 and connected to the dot-shaped structures 10, the first sub-insulating member 21 can achieve the purpose of insulating the dot-shaped structures 10 from each other while connecting the dot-shaped structures 10 to each other to form an integral structure.
With this arrangement, the second mesh holes 132 can be left empty, so that the material consumption of the insulating member 2 can be reduced, and the weight of the entire substrate 200 can be reduced.
In other embodiments, referring to fig. 8, the insulating member 2 includes a first sub-insulating member 21 and a second sub-insulating member 22, the first sub-insulating member 21 is filled in the first mesh-shaped hole 131, the second sub-insulating member 22 is filled in the second mesh-shaped hole 132, and the first sub-insulating member 21 and the second sub-insulating member 22 are connected to each other and are respectively connected to the dot structures 10. With this arrangement, on the one hand, the structural strength of the entire substrate 200 can be enhanced, and on the other hand, the dot structures 10 can be better insulated from each other.
Specifically, when the first sub-insulator 21 and the second sub-insulator 22 are made of the same material, both the first sub-insulator 21 and the second sub-insulator 22 may be BT insulators, and when the first sub-insulator 21 and the second sub-insulator 22 are made of different materials, the first sub-insulator 21 may be BT insulators and the second sub-insulator 22 may be polyurethane insulators, which is not limited in this embodiment of the present invention.
In some embodiments, referring to fig. 9, the first side 11 and/or the second side 12 of the dot-shaped structures 10 are laminated with the conductive reinforcing layer 3.
Through setting up electrically conductive enhancement layer 3 in the range upon range of first face 11 and the second face 12 at dot-shaped structure 10, can be so that the electric conductive property of first face 11 and second face 12 is stronger, and then when this base plate 200 was used in display panel 100, first face 11 can be connected with lamp pearl 101 electricity through electrically conductive enhancement layer 3, and second face 12 also can insert into the circuit through electrically conductive enhancement layer 3, and then makes lamp pearl 101 can be more stable insert into the circuit.
In addition, by providing the conductive reinforcing layer 3, the conductive reinforcing layer 3 can also protect the first surface 11 and the second surface 12, and the heat resistance and the oxidation resistance of the first surface 11 and the second surface 12 are enhanced. At the same time, the weldability of the first face 11 and the second face 12 can also be enhanced.
Of course, the conductive reinforcing layer 3 may be disposed on only one of the first side 11 and the second side 12, which is not limited in the embodiment of the present application.
The conductive enhancement layer 3 may include at least one of a gold layer, a nickel layer, and a nickel-gold alloy layer. Since the gold layer, the nickel layer, and the nickel-gold alloy layer have strong conductivity and stable chemical properties, when the conductive reinforcing layer 3 includes at least one of the gold layer, the nickel layer, and the nickel-gold alloy layer, the purpose of reinforcing the heat resistance, oxidation resistance, and solderability of the first face 11 and the second face 12 can be achieved.
Since the gold layer, the nickel layer, and the nickel-gold alloy layer are easy to manufacture, specifically, the gold layer, the nickel layer, and the nickel-gold alloy layer may be stacked on the first surface 11 and the second surface 12 of the dot structure 10 by plating or the like, the manufacturing cost of the entire substrate 200 may be reduced.
Fig. 4 is a schematic structural diagram of a display panel 100 according to an embodiment of the present disclosure. Referring to fig. 4, the display panel 100 includes: lamp pearl 101 and base plate 200, lamp pearl 101 electricity is connected on punctiform structure.
The structure of the substrate 200 may be the same as that of any one of the substrates 200 in the above embodiments, and may have the same or similar beneficial effects, and specific reference may be made to the description of the substrate 200 in the above embodiments, which is not repeated herein.
In the embodiment of the present application, since the substrate 200 is made of the metal sheet 1, the substrate 200 made of the metal sheet 1 has a lower cost than the substrate 200 made of the CCL, and the purpose of reducing the cost of the substrate 200 can be achieved.
In addition, because the electric conductive property of punctiform structure compares in copper post more stable, consequently, when lamp pearl 101 electricity was connected on the first face of punctiform structure, can be so that lamp pearl 101 more stable insert the circuit in.
Based on this, when the substrate 200 is applied in a display panel, the cost of the display panel 100 can be made cheaper and the performance can be more stable.
Fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application. Referring to fig. 10, the electronic device includes a display panel 100.
The structure of the display panel 100 may be the same as the structure of the display panel 100 in the above embodiments, and may have the same or similar beneficial effects, and specific reference may be made to the description of the display panel 100 in the above embodiments, which is not repeated herein.
In the embodiment of the application, since the display panel 100 has a lower cost and a more stable performance, when the display panel 100 is applied to an electronic device, the electronic device can have a lower cost and a more stable performance.
The electronic device may be a mobile phone, a notebook computer, a learning machine, or a desktop computer, and the electronic device is not limited in the embodiments of the present application.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the scope of the technical solutions of the embodiments of the present application.
Claims (14)
1. A method of manufacturing a substrate, the method comprising:
forming a first mesh hole in a first surface of the metal sheet;
filling insulating glue in the first mesh holes;
curing the insulating glue to form a first sub-insulating part;
and forming second reticular holes communicated with the first reticular holes on the second surface of the metal sheet corresponding to the first reticular holes so as to enable the metal sheet to form a plurality of mutually independent point-shaped structures, wherein the second reticular holes and the first reticular holes jointly form the reticular holes, and the second surface is opposite to the first surface.
2. The method of claim 1, wherein the forming of the first mesh-like holes on the first surface of the metal sheet comprises:
and etching the first mesh hole on the first surface of the metal sheet in a yellow light etching mode.
3. The method for manufacturing a substrate according to claim 1, wherein the filling of the insulating paste in the first mesh holes comprises:
providing insulating glue;
and pasting and pressing the insulating glue and the first surface of the metal sheet so as to fill the insulating glue in the first reticular holes.
4. The method for manufacturing a substrate according to any one of claims 1 to 3, further comprising, after forming second mesh holes communicating with the first mesh holes in correspondence with the first mesh holes in the second surface of the metal sheet, the steps of:
and polishing the first sub-insulating part covered on the first surface of the metal sheet until the dot-shaped structure is exposed.
5. The method according to claim 4, wherein after forming second mesh holes communicating with the first mesh holes in correspondence with the first mesh holes in the second surface of the metal sheet, the method further comprises polishing the first sub-insulator covering the first surface of the metal sheet until the dot structures are exposed:
filling insulating glue in the second mesh holes;
and curing the insulating glue to form a second sub-insulating part, so that the second sub-insulating part and the first sub-insulating part jointly form an insulating part.
6. The method for manufacturing a substrate according to claim 5, further comprising, after polishing the first sub-insulator covering the first surface of the metal sheet until the dot structures are exposed:
and polishing the second sub-insulating part covering the second surface of the metal sheet until the point-shaped structure is exposed.
7. The method for manufacturing a substrate according to claim 6, further comprising, after the polishing the second sub-insulator covering the second surface of the metal sheet until the dot structures are exposed:
plating the first face and/or the second face of the dot structure with a conductive reinforcing layer.
8. A substrate manufactured by the method for manufacturing a substrate according to any one of claims 1 to 7, wherein the substrate is applied in a display panel, the display panel comprises a lamp bead, and the substrate comprises:
the metal sheet comprises a first surface and a second surface which are opposite to each other, wherein the metal sheet is provided with mesh holes which penetrate through the first surface and the second surface, and the mesh holes enable the metal sheet to form a plurality of mutually independent point-shaped structures;
the insulating part is filled in the mesh holes, the point-shaped structures are connected with the insulating part, and the point-shaped structures are used for being electrically connected with the lamp beads.
9. The substrate of claim 8, wherein the mesh openings comprise a first mesh opening disposed on the first side and a second mesh opening disposed on the second side opposite the first mesh opening and in communication with the first mesh opening; wherein,
the cross-sectional area of the first mesh openings gradually decreases in a direction from the first face to the second face; and/or the presence of a gas in the gas,
the cross-sectional area of the second reticulated pores decreases in a direction from the second face toward the first face.
10. The substrate according to claim 9, wherein the insulating member comprises a first sub-insulating member, the first sub-insulating member is filled in the first mesh holes and connected to the dot structures; or the like, or a combination thereof,
the insulating member includes a first sub-insulating member and a second sub-insulating member, the first sub-insulating member is filled in the first mesh hole, the second sub-insulating member is filled in the second mesh hole, and the first sub-insulating member and the second sub-insulating member are connected to each other and are respectively connected to the dot structures.
11. The substrate according to any one of claims 8 to 10, wherein a conductive reinforcement layer is provided on the first side and/or the second side of the dot structures.
12. The substrate according to any one of claims 8 to 10, wherein the insulator is a BT insulator; and/or the presence of a gas in the atmosphere,
the metal sheet is a copper sheet; and/or the presence of a gas in the gas,
the thickness of the metal sheet in the direction from the first surface to the second surface is d, and d is more than or equal to 20um and less than or equal to 500 um.
13. A display panel, comprising:
the lamp bead and the substrate according to any one of claims 8 to 12, wherein the lamp bead is electrically connected to the dot-shaped structure.
14. An electronic device characterized in that the electronic device comprises the display panel of claim 13.
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