CN217214477U - Electronic component packaging structure and semi-finished product assembly - Google Patents

Abstract

The utility model discloses an electronic component packaging structure and a semi-finished product assembly. The electronic component packaging structure includes a plurality of protective substrates, a first capacitor core, an insulating glue material, an anode terminal and a cathode terminal. A plurality of protection substrates are stacked and arranged at intervals, and a conductive thin material is arranged between any two adjacent protection substrates. The first capacitor core is disposed between the plurality of protective substrates and forms a sandwich structure together. The first capacitor core includes a cathode and an anode. An insulating adhesive material fills the gaps between the plurality of protection substrates and the first capacitor cores, and forms a flat body structure together with the plurality of protection substrates and the first capacitor cores. Anode terminals and cathode terminals are located at opposite ends of the flat body structure. Thereby, a solid electrolytic capacitor with low profile, low ESR (equivalent series resistance) and high reliability is obtained.

Description

Electronic component packaging structure and semi-finished product assembly

technical field

The utility model relates to an electronic component packaging structure and a semi-finished product assembly suitable for the electronic component packaging structure, in particular to an electronic component packaging structure including a capacitor core and a semi-finished product assembly.

Background technique

The existing solid electrolytic capacitors have the characteristics of low profile, high capacitance, and low ESR (equivalent series resistance), so they are suitable for surface mounting (assembly) in small-sized high-frequency electronic systems. Further, the existing solid electrolytic capacitor components are usually formed by stacking one or more solid electrolytic capacitor cores and packing them with insulating materials. In addition, the electrodes (anode and cathode) of the solid electrolytic capacitor core will pass through a number of electrical contacts to connect to terminals on the outer surface of the package.

It should be noted that the existing solid electrolytic capacitor core (hereinafter referred to as: capacitor core) is usually formed of aluminum base, and most of the surface of the above-mentioned aluminum base is etched to form a plurality of deep holes correspondingly, thereby increasing the effective surface area . And a very thin layer of aluminum oxide is formed on the surface of the aluminum base with many deep holes to serve as the dielectric interface of the capacitor core. In addition, on the dielectric interface of the capacitor core, a continuous conductive polymer (solid electrolyte) and conductive coating (usually carbon powder and silver particle binder) will be deposited and correspond to the cathode, while the aluminum-based body will be as the anode. One end of the aluminum base has no conductive polymer deposited, while a small portion of the coating will be used for the external connection of the anode.

Further, as shown in FIG. 1 , FIG. 1 is a schematic cross-sectional view of a typical solid electrolytic capacitor core 10 , which is cross-sectioned from the anode 11 to the cathode 12 of the solid electrolytic capacitor core 10 . Wherein, the dielectric interface 14 is on the surface of the aluminum base 15 , and the conductive polymer layer 16 covers the dielectric interface 14 , and the conductive coating is covered on the outermost surface 12 with silver glue on the conductive polymer layer 16 . Thus, in its external view, as shown in assembly 10A in Figure 2A, most of the surface area is covered by silver paste 12 on the cathode layer (not shown), with anode 11 at one end.

It should be noted that a barrier coating is usually applied between the regions of the anode 11 and the cathode 12 to prevent a short circuit between the two regions of the anode 11 and the cathode 12 . For example, as shown in barrier coating 13A in FIG. 2A, and the width of barrier coating 13A may be narrow, or as shown in barrier coating 13B in FIG. 2B, the width of barrier coating 13B may also be very wide to cover most of the anode area, except for the tip face 11B of the anode end.

It should be emphasized that, in the packaging of the existing solid electrolytic capacitor device, one or more capacitor cores 10 are packaged in an insulating material, and the anode 11 and the cathode 12 are electrically connected to external terminals. However, since the capacitance of the capacitor core 10 is disposed on the dielectric interface 14 , for the aluminum base 15 of a fixed size, the surface area of the dielectric interface 14 covering the aluminum base 15 can preferably be maximized. Therefore, the exposed area of the anode tip is relatively small. Furthermore, in order to minimize the area and profile of the packaged capacitor device, it is preferable to place the package case as close to the capacitor core as possible.

For the above reasons, there are currently two challenges in minimizing capacitor packaging. The first challenge is that the external terminations are preferably as close to the anode and cathode as possible and the size of the connecting conductors should be minimal. But since the anode area is so small, it becomes a challenge to make and maintain good electrical connections in this small area. Furthermore, this anode connection issue becomes even more critical when multiple capacitor cores are stacked together to increase the overall capacitance of the device. For example, as shown in Figures 2A-2C, it is known that the anode connection must be made at the tip face of the anode tip 11B, as this is the only exposed area available for electrical contact.

Of course, to further complicate the situation, there is always a very thin film of aluminum oxide on the exposed anode surface and tip area due to the high activity of metallic aluminum. This oxide film not only affects conductivity, but also prevents effective equipotentialization with any external terminations.

The second challenge is that the insulating material surrounding the capacitor core should be as thin as possible. But traditional encapsulation processes (eg, molding by transfer molding) use high pressure to force the flow of highly viscous materials into the mold. In order to make thin insulating materials, the spacing between the mold wall and the capacitor core must be reduced, but at the same material flow rate, this increases the viscous stress on the capacitor core. The process of using compression molding can reduce pressure flow, but still cannot eliminate it. In addition, there is a process of compression molding, which also involves high pressure.

Having said that, because solid electrolytic capacitor cores generally lack good mechanical strength, and because of the above-mentioned factors, it is extremely difficult to package thin capacitors without damaging the capacitor core or electrode connections.

At present, many people have proposed corresponding solutions for the above-mentioned technical problems. For example, as set forth in Japanese Patent No. JP 8(1996)-273983A (JPH09273983A), which describes a method of forming a metal plating layer on the anode surface of each capacitor core, and combining a plurality of stacked The anode of the capacitor core is connected further to another plating layer.

For example, as set forth in US Pat. No. 6,392,869B2 (US6392869B2), and with reference to FIGS. 1B , 2A, 2B and the corresponding descriptions in the patent, it can be seen that the patent describes a Sub compact packaging. Capacitor cores are stacked together by conductive glue and adhered to conductors with extensions that serve as cathode external terminals; then, the stack with cathode conductor terminations is wrapped with insulating material; then, the anode ends are polished to The tip surface of the anode end of the stacked capacitor core is shown exposed; then, the aluminum oxide film on the exposed tip surface is removed by a zinc replacement process; then, a layer of nickel is applied to the tip surface by electroless plating; next, Another layer of gold is applied by electroless plating; then, a layer of conductive resin is applied to the tip of the capacitor core. Through the above processes, gold and nickel and surrounding insulating materials have been covered to form an anode conductive elastomer, that is, an anode terminal.

For example, as set forth in US Pat. No. 10,340,092B2 (US10340092B2), which describes another compact packaging for multiple capacitive dies. Similar to that described in US Patent No. 6,392,869B2 (US6392869B2). The capacitor cores described in US Patent No. 10,340,092B2 (US10340092B2) can be stacked and bonded together by conductive glue, and the leading layer on one side of the base substrate will be used as a cathode. Among them, the components, including the leading layer, are compression-molded, and then completely wrapped and covered by insulating material; then, the base with the assembled capacitor body is cut into individual capacitor bodies; then, the capacitor body is roll-polished , so that the corners and edges of each capacitor body are rounded, and the tip surface of the cathode leading layer and the anode of the capacitor core are exposed; The zinc replacement process makes electrical connections to the anode metal aluminum, followed by electroless nickel plating. However, as described in US Patent No. 10,340,092B2 (US10340092B2) and its Figures 2 and 8, the anode terminal is not a conductive resin, but is made of electroless copper, nickel and tin.

As mentioned above, despite the development of the above-mentioned technical means to address the above-mentioned problems, the electronic industry and the market still require solid electrolytic capacitors with low profile, low ESR (equivalent series resistance) and high reliability. Furthermore, micro-scale cracks or peeling or delamination due to the thermal effects of solder reflow during device assembly can increase ESR (equivalent series resistance) and reduce capacitor reliability. Therefore, better packaging structures and more cost-effective manufacturing processes are needed.

Utility model content

Aiming at the shortcomings of the prior art, the embodiments of the present invention provide an electronic component packaging structure and a semi-finished product assembly, which can effectively improve the possible defects of the existing packaging structure.

One of the embodiments of the present utility model discloses a semi-finished product assembly, which is suitable for an electronic component packaging structure. A plurality of predetermined positions are defined between the protective substrates, and a plurality of conductive thin materials are further provided on the surface of each of the protective substrates corresponding to the plurality of predetermined positions; The edge of one of the protective substrates exceeds a projection area formed by the orthographic projection of the other protective substrate, and the part of the surface of the protective substrate that exceeds the projection area is defined as a a glue placement area; a plurality of electronic core components located between a plurality of the protective substrates, and a plurality of the electronic core components are arranged at the predetermined positions; wherein, each of the electronic core components includes a plurality of contact points ; a conductive connecting material, connected to a plurality of the conductive thin materials and some of the contacts; an insulating adhesive material, filling the gaps between the plurality of the protective substrates and the plurality of the electronic core pieces; and a plurality of Slot openings pass through a plurality of the protective substrates and the insulating adhesive material, and a plurality of the slot openings can be used to make a plurality of the conductive thin films connected to some of the contacts of the electronic core piece. material exposed.

Preferably, each of the electronic core components further includes a capacitor core, and the two contacts of the capacitor core are respectively defined as an anode and a cathode, and the cathode can be used to communicate with a plurality of all The conductive thin material is combined, and a plurality of the slot openings can be used to expose part of the anode; wherein, a zinc layer is formed on the surface of the exposed part of the anode by electroplating.

Preferably, each of the protective substrates is an all-copper substrate, and each of the protective substrates is etched to form a plurality of the conductive thin materials.

One of the embodiments of the present utility model discloses an electronic component packaging structure, which includes: a plurality of protective substrates, which are stacked and arranged at intervals, and a predetermined position is defined between any two adjacent protective substrates, and a corresponding A plurality of conductive thin materials are further arranged on the surface of each of the protective substrates at the predetermined position; a first capacitor core is arranged at the predetermined position and forms an interlayer together with the plurality of the protective substrates structure; wherein, the first capacitor core includes a cathode and an anode; an insulating adhesive material fills the gaps between a plurality of the protective substrates and the first capacitor core, and is connected with a plurality of the The protective substrate and the first capacitor core together form a flat body structure; an anode terminal is located at one end of the flat body structure; a cathode terminal is located at the other end of the flat body structure away from the anode terminal; and a conductive connection material, connected to a plurality of the conductive thin materials on each protective substrate and a part of the cathode; wherein, a part of the plurality of the conductive thin materials extends and is connected to the cathode terminal, and the The cathode terminal is connected by copper plating and formed on the plurality of conductive thin materials; wherein, a part of the anode is connected to the anode terminal, and the anode terminal is connected and formed in a conductive film. formed on a part of the anode.

Preferably, each of the protective substrates is an all-copper substrate, and each of the protective substrates is etched to form a plurality of the conductive thin materials.

Preferably, the electronic component packaging structure further includes a second capacitor core, and the second capacitor cores are stacked on the first capacitor core at intervals, and the second capacitor cores are located in multiple between the protection substrates; wherein a plurality of the protection substrates, the first capacitor cores and the second capacitor cores together form a multi-layer core structure, and the second capacitor cores include a cathode and an anode, and the two cathodes of the first capacitor core and the second capacitor core are connected to the cathode terminal, and the first capacitor core and the second capacitor core The two anodes of the sub are connected to the anode terminals.

Preferably, the electronic component packaging structure further includes a middle-layer substrate, and the middle-layer substrate is disposed between the first capacitor core and the second capacitor core, and the middle-layer substrate includes mutually separated An anode end conductive thin material group and a cathode end conductive thin material group; wherein the cathode end conductive thin material group is connected to the first capacitor core and the second capacitor core with the conductive connecting material two of the cathodes, and the anode terminal conductive thin material group is connected to the anode terminal.

Preferably, the conductive film includes a zinc layer and a nickel layer, the zinc layer is plated on a part of the surface of the anode, and the nickel layer is plated on the zinc layer.

Preferably, the anode has two side surfaces on opposite sides, and the two side surfaces can be connected to a plurality of the protective substrates and the anode terminals with the conductive connection material, so as to enhance the packaging structure of the electronic component. Structural strength.

Preferably, a plurality of the protective substrates further comprise an anode-side conductive thin material, which is located at a plurality of end portions of the protective substrates adjacent to the anode terminals, and the anode terminals are covered on the anode side to conduct electricity The thin material and the end surface and side surface of the flat body structure adjacent to the anode terminal to form the anode terminal covered on five sides correspondingly; wherein, the structural strength of the electronic component packaging structure is enhanced; wherein, many Each of the protective substrates further includes a cathode-side conductive thin material, which is located at a plurality of ends of the protective substrate adjacent to the cathode terminals, and the cathode terminals cover the cathode-side conductive thin material and the positions The end surface and the side surface of the flat body structure adjacent to the cathode terminal enhance the structural strength of the electronic component packaging structure.

One embodiment of the present invention discloses a manufacturing method of an electronic component packaging structure, which includes: (a) providing a first plate as a base substrate, a plurality of predetermined positions on the upper surface of which include conductive thin materials, and Coating a bonding material on a partial area of the conductive thin material; (b) placing a plurality of electronic core components on the bonding material on the conductive thin material at a plurality of predetermined positions on the upper surface; (c) providing a The second plate is a top substrate, a plurality of predetermined positions on the lower surface of the second plate include a conductive thin material, and the bonding material is coated on a part of the conductive thin material, and then the top substrate is laminated on the bottom substrate , placing the plurality of electronic components between the top substrate and the bottom substrate, and exposing a part of the upper surface near the edge of the bottom substrate as a glue placement area; (d) hardening the bonding material The top substrate is combined with the bottom substrate and the plurality of electronic core components to form a basic assembly, and the internal space forms a channel communicating with the aforementioned glue placement area; (e) an insulating glue material is formed by The glue placement area is filled into the aforementioned channel, and the plurality of electronic core components are embedded between the top substrate and the bottom substrate; (f) hardening the insulating glue material to make the basic assembly forming a first semi-finished product assembly with the insulating adhesive material; (g) cutting a plurality of slot openings on the first semi-finished product assembly, so that the conductive layers of the top substrate and the bottom substrate are thin A part of the material is exposed to form a second semi-finished product assembly; (h) a conductive film is formed at a specific position on the second semi-finished product assembly to communicate with the aforementioned exposed conductive thin material, and then a component terminal is formed thereon to form a third semi-finished product assembly; (i) cutting the aforesaid third semi-finished product assembly into a plurality of electronic component packaging structures.

Preferably, the filling process of the insulating adhesive material is to place adhesive in the adhesive placement area so that the insulating adhesive material fills the aforementioned channel due to the inflow of capillary phenomenon.

Preferably, the electronic core component includes a capacitor core, which includes an anode and a cathode; the cathode is combined with the conductive thin material on the bottom substrate and the top substrate by the bonding material; the second semi-finished product assembly A plurality of slot openings on the anode expose a part of the anode; in the process of forming the conductive film, a layer of zinc is first plated on the surface of the exposed part of the anode, and then a layer of nickel is plated; The process forms an anode terminal and a cathode terminal, the anode terminal is connected to the anode of the capacitor core through the aforementioned nickel layer conductive film, and the cathode terminal is connected to the cathode of the capacitor core through the aforementioned conductive thin material.

One of the embodiments of the present invention discloses a semi-finished product assembly, which includes at least two protective substrates, such as a bottom substrate and a top substrate, which are stacked on top of each other, and a plurality of predetermined positions on the surface include conductive thin materials, and the bottom substrate A part of the upper surface near the edge of the electronic core is exposed as a glue placement area; a plurality of electronic core components are placed in a plurality of predetermined positions between the top substrate and the bottom substrate, and at least a part of the contacts of the electronic core components are connected with a conductive The bonding material is combined with the conductive thin material; an insulating adhesive material is filled into the gap channel between the top substrate, the bottom substrate and the plurality of electronic core components; a plurality of slot openings pass through the The top substrate, the bottom substrate and the insulating adhesive material expose the conductive parts connected to the contacts of the electronic core components.

Preferably, the electronic core component includes a capacitor core, and its contact includes an anode and a cathode; the cathode is combined with the conductive thin material on the aforementioned protective substrate; the plurality of slot openings expose a part of the anode , the exposed anode surface is plated with a layer of zinc.

Preferably, the protective substrate is an all-copper substrate, and the conductive thin material is formed by etching the all-copper substrate.

One of the embodiments of the present utility model discloses an electronic component packaging structure, which includes: at least two protective substrates, such as a bottom substrate and a top substrate, which are stacked on top of each other, and a predetermined position on the surface includes a conductive thin material; at least one first The capacitor core is placed at a predetermined position between the protection substrates to form a sandwich structure; a capillary filling insulating adhesive material fills the gap between the protection substrate and the capacitor core to form a flat body structure; An anode terminal and a cathode terminal are located at opposite ends of the flat body structure, respectively; the contact point of the capacitor core includes an anode and a cathode, and a part of the cathode is connected to a conductive material on the protective substrate with a conductive bonding material. Thin materials are combined, the conductive thin material extends to one end of the cathode terminal of the flat body structure, the cathode terminal is formed by connecting with the conductive thin material by copper plating, and a part of the anode is located at one end of the anode terminal of the flat body structure, so The anode terminal is formed with a conductive film connected to a portion of the anode.

Preferably, the protective substrate is an all-copper substrate, and the conductive thin material is formed by etching the all-copper substrate.

Preferably, the package structure of the capacitor component further includes at least one second capacitor core, which is stacked on the first capacitor core, and a multilayer is formed between the bottom substrate and the top substrate. In the core structure, the cathodes of the two capacitor cores are connected to the same cathode terminal, and the anodes are connected to the same anode terminal.

Preferably, the capacitor component packaging structure further includes a middle-layer substrate placed between the two capacitor cores, and the middle-layer substrate includes a set of anode-end conductive thin materials and a set of cathode-end conductive thin materials separated from each other and the conductive thin material at the cathode end is connected with the cathodes of the two capacitor cores by the conductive bonding material, and the conductive thin material at the anode end is connected with the anode terminal.

Preferably, the conductive film includes a zinc layer directly plated on a part of the surface of the anode and a nickel layer plated on the zinc layer.

Preferably, the upper and lower surfaces of the anode further comprise conductive bonding materials on the anode side to bond with the bottom substrate and the top substrate, as well as with the anode terminals to enhance the strength of the structure.

Preferably, the bottom substrate and the top substrate further include an anode-side conductive thin material facing outward, and the conductive film covers the anode-side conductive thin material and the anode end face and side surface of the flat body structure to form five sides. A coated anode terminal to improve the strength of the structure; the cathode end of the bottom substrate and the top substrate further includes a cathode side conductive thin material facing outward, and the cathode terminal covers the cathode side conductive thin material and the flat body structure. The end face and side of the cathode end to improve the strength of the structure.

One of the beneficial effects of the present invention is that the electronic component packaging structure and the semi-finished product assembly provided by the present invention can fill a plurality of the protective substrates and the first A space between capacitor cores” technical solution to obtain solid electrolytic capacitors with low profile, low ESR (equivalent series resistance) and high reliability.

In order to further understand the features and technical content of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model, but these descriptions and drawings are only used to illustrate the present utility model, not to protect the present utility model. any limitation on the scope.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a solid electrolytic capacitor core belonging to the prior art.

FIG. 2A is a schematic perspective view of a solid electrolytic capacitor core belonging to the prior art.

FIG. 2B is another perspective schematic diagram of a solid electrolytic capacitor core belonging to the prior art.

FIG. 2C is a schematic perspective view of a tantalum capacitor belonging to the prior art.

3 is a schematic cross-sectional view of an electronic component packaging structure according to the first embodiment of the present invention.

4 is an exploded schematic view of the packaging structure of the electronic component according to the first embodiment of the present invention.

FIG. 5 is a schematic perspective view of the packaging structure of the electronic component according to the first embodiment of the present invention.

6A is a schematic cross-sectional view (1) of an electronic component packaging structure according to the second embodiment of the present invention.

6B is another schematic cross-sectional view (2) of the electronic component packaging structure according to the second embodiment of the present invention.

6C is another schematic cross-sectional view (3) of the electronic component packaging structure according to the second embodiment of the present invention.

7A is a schematic cross-sectional view (1) of an electronic component packaging structure according to a third embodiment of the present invention.

7B is another cross-sectional schematic diagram (2) of the electronic component packaging structure according to the third embodiment of the present invention.

7C is another schematic cross-sectional view (3) of the electronic component packaging structure according to the third embodiment of the present invention.

8 is a schematic cross-sectional view of an electronic component packaging structure according to a fourth embodiment of the present invention.

9 is a schematic cross-sectional view of an electronic component packaging structure according to a fifth embodiment of the present invention.

10 is a schematic cross-sectional view of an electronic component packaging structure according to a sixth embodiment of the present invention.

11 is another schematic cross-sectional view of the electronic component packaging structure according to the sixth embodiment of the present invention.

12 is a schematic perspective view of an electronic component packaging structure according to a seventh embodiment of the present invention.

13 is a flow chart of the steps of a manufacturing method of an electronic component packaging structure according to an eighth embodiment of the present invention.

14A is a schematic top view (1) of the packaging structure of an electronic component according to the eighth embodiment of the present invention.

FIG. 14B is a schematic cross-sectional view of the XIVB-XIVB section of FIG. 14A .

15A is another schematic top view (2) of the packaging structure of the electronic component according to the eighth embodiment of the present invention.

FIG. 15B is a schematic cross-sectional view of the XVB-XVB section of FIG. 15A .

16 is another schematic cross-sectional view (1) of the electronic component packaging structure according to the eighth embodiment of the present invention.

17A is another cross-sectional schematic diagram (2) of the electronic component packaging structure according to the eighth embodiment of the present invention.

17B is another schematic cross-sectional view (3) of the electronic component packaging structure according to the eighth embodiment of the present invention.

17C is another schematic cross-sectional view (4) of the electronic component packaging structure according to the eighth embodiment of the present invention.

18 is another schematic top view (3) of the packaging structure of the electronic component according to the eighth embodiment of the present invention.

Detailed ways

The following are specific embodiments to illustrate the embodiments of the “electronic component packaging structure, its manufacturing method and semi-finished product assembly” disclosed in the present invention. Those skilled in the art can understand the present invention from the content disclosed in this specification. Advantages and Effects. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the accompanying drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. In addition, if it is indicated below, please refer to a specific drawing or as shown in a specific drawing, it is only used to emphasize in the subsequent description, and most of the related content mentioned appears in the specific drawing, but is not limited In this subsequent description, reference may only be made to the specific drawings. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", "third" and the like may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component, or one signal from another. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Please refer to FIG. 3 to FIG. 5 , which are the first embodiment of the present invention. It should be noted that the drawings corresponding to this embodiment and the related numbers and shapes mentioned in this embodiment are only used for The embodiments of the present invention are specifically described to facilitate understanding of the content of the present invention, rather than to limit the protection scope of the present invention.

As shown in FIG. 3, the first embodiment of the present invention provides an electronic component packaging structure 100, which includes: a first capacitor core 10, a plurality of protective substrates 20, an anode terminal 30, a cathode terminal 40, a The conductive connecting material 50 , an insulating glue material 60 , an external anode terminal 70 and an external cathode terminal 80 , but the present invention is not limited thereto. For example, in other embodiments of the present invention, the electronic component packaging structure 100 may not include the external anode terminal 70 and the external cathode terminal 80 .

In the following, for the convenience of description and understanding, a plurality of the protective substrate 20 , the first capacitor core 10 , the anode terminal 30 , the cathode terminal 40 , the external anode terminal 70 and the external cathode will be sequentially described. terminal 80 , and the relative positional relationship between the above components, the conductive connecting material 50 and the insulating adhesive material 60 is described in a timely manner.

It should be stated in advance that, for the convenience of description and understanding, the anode terminal 30 , the cathode terminal 40 , the conductive connection material 50 and the insulating glue material 60 are not shown in FIG. 4 , but in fact, the above Components still exist in the electronic component packaging structure 100 , which is hereby declared to avoid misunderstandings.

As shown in FIG. 3 , in this embodiment, a plurality of the protective substrates 20 are stacked and arranged at intervals from each other. In this embodiment, each of the protective substrates 20 is an insulating plate body, and a plurality of the protective substrates 20 The number of is preferably two, but the present invention is not limited to this. For example, in other embodiments of the present invention, each of the protective substrates 20 can also be a substrate made of other materials, and the number of the plurality of protective substrates 20 can be adjusted according to actual needs.

It should be noted that, for the convenience of understanding and description, two protective substrates 20 will be used in the following description, but in fact, any two adjacent protective substrates 20 among the plurality of protective substrates 20 can also be applied. The description made with two of the protective substrates 20 is hereby stated.

Further, a predetermined position (not marked in FIG. 3 ) is defined between two adjacent protective substrates 20 , and in this embodiment, the surface of each protective substrate 20 corresponding to the predetermined position A plurality of conductive thin materials 21 and an insulating material (not shown in the figure) not covered on the plurality of conductive thin materials 21 are further disposed on the top, but the present invention is not limited thereto. For example, in other embodiments of the present invention, the protective substrate 20 may also be a conductive material such as copper metal, and the plurality of conductive thin materials 21 may also be formed by etching the conductive metal to protect the substrate 20 .

Specifically, as shown in FIGS. 3 and 4 , in this embodiment, four conductive thin materials 21 are provided on the outer surface of each of the protective substrates 20 , and the conductive thin materials 21 on each of the protective substrates 20 are The four conductive thin materials 21 are respectively defined as: a first outer conductive thin material 21AO, a second outer conductive thin material 21CO, an inner anode conductive thin material 21AI, and an inner cathode conductive thin material 21CI. Among them, the above-mentioned four conductive thin materials 21AO, 21CO, 21AI, and 21CI are preferably copper conductor pads in this embodiment, and the number of the plurality of conductive thin materials 21 can also be adjusted according to actual needs. Not limited to this.

More specifically, the first outer conductive thin material 21AO and the second outer conductive thin material 21CO are disposed on an upper surface 22 of the protective substrate 20 , and the inner anode conductive thin material 21AI and the inner The cathode conductive thin material 21CI is disposed on the lower surface 23 of the protection substrate 20 .

A plurality of the protective substrates 20 have been introduced so far, and the first capacitor core 10 will be described below. As shown in FIG. 3 and FIG. 4 , the first capacitor core 10 is disposed between any two adjacent protective substrates 20 , and the first capacitor core 10 includes an anode 11 and a cathode 12 and a barrier coating 13 between the anode 11 and the cathode 12, and a portion of the cathode 12 can be connected to each of the guards with the conductive connecting material 50 (eg, silver or copper paste) A plurality of the conductive thin materials on the substrate 20 .

Further, the first capacitor core 10 is disposed at the predetermined position, and the insulating adhesive 60 (low-viscosity epoxy resin material) fills the two protective substrates 20 and the first capacitor space between the cores 10 . The first capacitor core 10 can form a sandwich structure together with the two protective substrates 20 , and the first capacitor core 10 can also form a sandwich structure with the insulating adhesive 60 and the two protective substrates. 20 and together form a flat body structure.

In addition, as shown in FIG. 3 , the conductive connecting materials 50 are disposed on opposite sides of the cathode 12 , and the two inner cathode conductive thin materials 21CI of the two protective substrates 20 can be respectively disposed on the above conductive The connecting material 50 is extended and cut to be aligned with one end of the cathode 12 of the first capacitor core 10 , so that a part of the cathode 12 can be electrically connected to the connecting material 50 through the conductive connecting material 50 . The inner cathode conductive thin material 21CI is described.

The first capacitor core 10 has been introduced so far, and the anode terminal 30 and the cathode terminal 40 will be introduced below. As shown in FIG. 3 , the anode terminal 30 is located at one end of the flat body structure, and the cathode terminal 40 is located at the other end of the flat body structure away from the anode terminal 30 , and the anode terminal 30 and The cathode terminals 40 are respectively C-shaped. In other words, the anode terminal 30 and the cathode terminal 40 are respectively located at two ends of the plurality of protective substrates 20 that are common and corresponding to each other.

Further, the anode terminal 30 is connected to a part of the anode 11 by forming a conductive film, and the anode terminal 30 is a copper conductive film in this embodiment and is connected to the first The outer conductive thin material 21AO and the inner anode conductive thin material 21AI further enable the anode terminal 30 to be electrically connected to the anode 11; the cathode terminal 40 is connected by copper plating and formed on the first The two outer conductive sheets 21CO and the inner cathode conductive sheets 21CI further enable the cathode terminal 40 to be electrically connected to the cathode 12 .

The anode terminal 30 and the cathode terminal 40 have been introduced so far, and the description of the external anode terminal 70 and the external cathode terminal 80 will be started below. As shown in FIGS. 3 and 5 , the electronic component packaging structure 100 excluding the external anode terminal 70 and the external cathode terminal 80 can be regarded as an insulator 101 , and the external anode terminal 70 and the external Cathode terminals 80 are respectively formed on the sides of the anode terminals 30 and the cathode terminals 40 that are relatively far away from the first capacitor core 10 , and the external anode terminals 70 and the external cathode terminals 80 are also wrapped around the Consider at least three sides of the insulator 101 .

Further, in this embodiment, the external anode terminal 70 and the external cathode terminal 80 can be used to further increase the metal thickness and strength of the anode terminal 30 or the cathode terminal 40, and the external anode terminal The terminal 70 and the external cathode terminal 80 are preferably copper metal layers formed by additional electroplating on the anode terminal 30 and the cathode terminal 40 , but the present invention is not limited thereto. In other embodiments of the present invention, the external anode terminal 70 and the external cathode terminal 80 may also be made of other metals.

It should be noted that, after the anode 11 and the cathode 12 of the first capacitor core 10 are respectively connected to the anode terminal 30 and the cathode terminal 40 and are covered with electroless copper, further The copper metal layer is plated to form the external anode terminal 70 and the external cathode terminal 80 correspondingly. In addition, after the additional electroplating of the copper metal layer is completed, a tin metal layer (not shown) may be further plated to protect the copper metal layer.

It should be added that in this embodiment, the inner anode conductive thin material 21AI can also be selectively not provided, but if the inner anode conductive thin material 21AI is provided, it can effectively help increase the number of post-copper plating the adhesion strength of the positive terminal 30.

The above-mentioned first embodiment describes the electronic component packaging structure 100 of the present invention, basically taking a chip-type aluminum solid electrolytic capacitor as an example for description. The aluminum-based solid electrolytic capacitor uses aluminum as the anode, and its oxide film affects the conductivity, which makes it difficult to connect the conductive terminals to the outside, as described in the background of the utility model. Therefore, the better method is to use zinc substitution (zinc substitution or zincate treatment), first plating a layer of zinc, and then replacing it with nickel, then copper plating. The method is detailed in the second embodiment. However, the present invention is not limited to encapsulating aluminum-based solid electrolytic capacitor cores. For example, the electronic component packaging structure 100 of the present invention can also be used for tantalum capacitors (or called tantalum electrolytic capacitors), and the process, capacitor structure and intermediate assembly structure corresponding to the above-mentioned first embodiment can also be applied to Packaging of other types of electronic devices.

The tantalum capacitor core uses a porous tantalum structure as the anode, and smears manganese oxide on the surface of the pores of the porous tantalum structure as a conductive electrolyte cathode, and the tantalum anode structure is linked outward through a tantalum wire, as shown by 11T in Figure 2C. The communication between the external terminal and the anode tantalum wire can be made by 11TC electroplating or vacuum sputtering deposition of a nickel or copper coating on the tip surface of the tantalum wire, or by applying a silver adhesive. In addition, a small piece of nickel or copper can also be combined with the anode tantalum wire by welding or pressing, and then the copper of the outer terminal can be directly electroplated on this nickel or copper piece.

[Second Embodiment]

Please refer to FIG. 6A to FIG. 6C , which are the second embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments are omitted. Repeated descriptions (eg: the protective substrate 20 ); furthermore, the relevant numbers and shapes mentioned in the accompanying drawings in this embodiment are only used to specifically describe the embodiments of the present invention, so as to facilitate understanding of the content of the present invention , rather than being used to limit the protection scope of the present invention.

It should be noted in advance that, for the convenience of understanding and description, FIG. 6A to FIG. 6C of this embodiment do not show the external anode terminal 70 and the external cathode terminal 80 as shown in FIG. 3 of the first embodiment, but the present invention The new type is not limited to this. The electronic component packaging structure 100 of the present embodiment actually still includes the external anode terminal 70 and the external cathode terminal 80 , which is hereby described.

As shown in FIG. 6C , the main difference between this embodiment and the above-mentioned first embodiment is that the anode terminal 30 (the conductive film) further includes a zinc layer (not shown) and a nickel layer 31 in detail. , the zinc layer is plated on a tip surface 11A of the anode 11, the nickel layer 31 is plated on the zinc layer, and the second outer conductive thin material 21CO and the inner cathode conductive thin material 21CI A part of it extends and is connected to the cathode terminal 30 .

The following describes the detailed formation process of the zinc layer and the nickel layer 31 for further understanding and explanation. First, as shown in FIG. 6A , the first capacitor core 10 , a plurality of the protective substrates 20 and the insulating adhesive material 60 together form a first semi-finished product assembly, and the two parts of the first semi-finished product assembly are The ends will be processed separately so that the surface thereof is flattened, and the tip surface 11A of the anode 11 of the first capacitor core 10 and the conductive thin materials on the plurality of protective substrates 20 are formed. 21AO and 21CO are exposed.

Then, as shown in FIG. 6B , the zinc layer is first deposited on the tip surface 11A by a zinc substitution reaction (Zinc Substitution process), and the nickel layer 31 is then plated on the tip surface 11A by an electroless nickel plating strike process (Electroless NickelPlating Strike process). on the zinc layer. Wherein, when the electroless nickel plating bombardment reaction is carried out, metal nickel will not be plated on the upper surface 22 and the lower surface 23 of the protective substrate 20 which are non-conductors or the insulating adhesive material 60, and also It will not be plated onto the first outer conductive sheet 21AO and the second outer conductive sheet 21CO belonging to the copper pads because copper has no catalytic effect on electroless nickel plating.

Next, as shown in FIG. 6C , the upper surface 22 and the lower surface 23 of the non-conductive protective substrate 20 are shielded by electroplating masks, respectively, and then subjected to pretreatment (eg, palladium plating), and finally chemical Copper plating, covering both ends of the flat body structure and the first outer conductive thin material 21AO and the second outer conductive thin material 21CO with electroless copper plating. It should be noted that, after the electroless copper plating is completed, the plated copper metal will form a good electrical connection relationship with the nickel layer 31, and correspondingly formed with the zinc layer and the nickel layer 31. The anode terminal 30 (the conductive film).

[Third Embodiment]

Please refer to FIG. 7A to FIG. 7C , which are the third embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first and second embodiments. No further description (eg: the protective substrate 20) is repeated; furthermore, the relevant numbers and shapes mentioned in the accompanying drawings in this embodiment are only used to specifically describe the embodiments of the present utility model, so as to facilitate understanding of the present utility model. The content of the new model is not used to limit the protection scope of the present invention.

It should be noted in advance that, for the convenience of understanding and description, FIG. 7A to FIG. 7C of this embodiment do not show the external anode terminal 70 and the external cathode terminal 80 as shown in FIG. 3 of the first embodiment. The new type is not limited to this. The electronic component packaging structure 100 of the present embodiment actually still includes the external anode terminal 70 and the external cathode terminal 80 , which is hereby described.

As shown in FIG. 7A to FIG. 7C , the main difference between this embodiment and the above-mentioned second embodiment is that the electronic component packaging structure 100 can further dispose the conductive connection material 50A on the anode 11 . The two sides on the opposite side (that is, part of the tip surface 11A), the protective substrates 20 and the anode terminals 30 are further connected to further connect the above three components and correspondingly improve the adhesion of the anode terminals 30 Strength and structural strength of the electronic component packaging structure 100 .

Further, the conductive connection material 50A provided on the anode 11 can be used to connect the inner anode conductive sheet 21AI to the anode 11 , and the conductive connection material 50A provided on the anode 11 A material other than the conductive connecting material 50 connecting the cathode 12 and the inner cathode conductive sheet 21CI may be used.

It should be noted that, through the technical solution of "disposing the conductive connection material 50A on the anode 11", the conductive connection material 50A can have a relatively large bonding area and its end close to the anode 11, The mechanical strength of the anode terminal 30 is increased.

Since the difference between this embodiment and the above-mentioned second embodiment is only that "the conductive connecting material 50A is disposed on the two sides of the anode 11", other components or manufacturing processes (such as the zinc layer or the The formation process of the nickel layer 31) is similar, so it is not repeated here.

[Fourth Embodiment]

Please refer to FIG. 8 , which is the fourth embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be repeated here (such as : the protective substrate 20); furthermore, the relevant numbers and shapes mentioned in the accompanying drawings in this embodiment are only used to specifically describe the embodiments of the present invention, so as to facilitate understanding of the content of the present invention, rather than It is used to limit the protection scope of the present invention.

As shown in FIG. 8 , the main difference between this embodiment and the above-mentioned first embodiment is that the electronic component packaging structure 100 further includes a second capacitor core 10 - 2 , and in this embodiment, the The specific structure of the second capacitor core 10-2 is substantially the same as that of the first capacitor core 10, but the present invention is not limited thereto. For example, in other embodiments of the present invention, the specific structure of the second capacitor core 10-2 may also be different from that of the first capacitor core 10.

Further, the second capacitor cores 10 - 2 are stacked on the first capacitor core 10 at intervals, and the second capacitor core 10 - 2 is located between the two protective substrates 20 , and the two protective substrates 20 , the first capacitor core 10 and the second capacitor core 10 - 2 together form a multi-layer core structure. Wherein, the two cathodes (not shown) of the first capacitor core 10 and the second capacitor core 10-2 are connected to the cathode terminal 40, and the first capacitor core 10 and The two anodes (not shown) of the second capacitor core 10 - 2 are connected to the anode terminal 30 .

It should be noted that, as shown in FIG. 8 , the conductive connection material 50 is provided between the two cathodes of the first capacitor core 10 and the second capacitor core 10 - 2 , and the The insulating adhesive material 60 is filled between the two anodes of the first capacitor core 10 and the second capacitor core 10-2.

[Fifth Embodiment]

Please refer to FIG. 9 , which is the fifth embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first embodiment and the above-mentioned fourth embodiment. No further description (eg: the protective substrate 20) is repeated; furthermore, the relevant numbers and shapes mentioned in the accompanying drawings in this embodiment are only used to specifically describe the embodiments of the present utility model, so as to facilitate understanding of the present utility model. The content of the new model is not used to limit the protection scope of the present invention.

As shown in FIG. 9 , the main difference between this embodiment and the above-mentioned first and fourth embodiments is that the electronic component packaging structure 100 further includes a middle-layer substrate 20-2, and the middle-layer substrate 20-2 Disposed between the first capacitor core 10 and the second capacitor core 10-2, and the middle-layer substrate 20-2 includes an anode-end conductive thin material group and a cathode-end conductive thin material group separated from each other material group. Wherein, the conductive thin material group at the cathode end is connected to the two cathodes (not shown) of the first capacitor core 10 and the second capacitor core 10-2 by the conductive connection material 50, The anode terminal conductive thin material group is connected to the anode terminal 30 .

Further, as shown in FIG. 9 , the middle-layer substrate 20 - 2 located between the first capacitor core 10 and the second capacitor core 10 - 2 has the negative electrode disposed on its surface. Extremely conductive thin material group, which includes two inner cathode conductive thin materials 20-2AM, and the two inner cathode conductive thin materials 20-2AM can be electrically connected to the first capacitor through the conductive connection material 50 The core 10 and the two cathodes of the second capacitor core 10-2; the middle-layer substrate 20- located between the first capacitor core 10 and the second capacitor core 10-2 2. The anode terminal conductive thin material group is arranged on its surface, which includes two inner anode conductive thin materials 20-2BM, and the two inner anode conductive thin materials 20-2BM are electrically connected to the first capacitor The core 10 and the two anodes (not shown) and the anode terminal 30 of the second capacitor core 10-2.

Therefore, through the technical solution of "arranging the middle-layer substrate 20-2 between the first capacitor core 10 and the second capacitor core 10-2", it is helpful to improve the electronic components. Structural strength of the package structure 100 . In addition, the middle-layer substrate 20-2 located between the first capacitor core 10 and the second capacitor core 10-2 has two inner anode conductive thin materials 20-2AM disposed on the surface thereof. , which helps to strengthen the adhesion of the two anodes of the first capacitor core 10 and the second capacitor core 10 - 2 .

[Sixth Embodiment]

Please refer to FIG. 10 and FIG. 11 , which are the sixth embodiment of the present invention. This embodiment corresponds to the relevant numbers and shapes mentioned in the drawings, and is only used to specifically describe the embodiments of the present invention, so that It is used to understand the content of the present invention, but not to limit the protection scope of the present invention.

As shown in FIG. 10 , the main difference between this embodiment and the above-mentioned first, fourth and fifth embodiments is that the protective substrate 20 is an all-conductor (such as a copper substrate, which may be referred to as all-copper for convenience) substrate), and the all-conductor plate is etched into conductive pads through selective etching, and a plurality of the conductive pads can be further defined as two anode conductive pads 20A and two cathode conductive pads 20B in this embodiment, and The two anode conductive pads 20A and the two cathode conductive pads 20B may be made of thin copper sheets, but the present invention is not limited thereto. For example, in other embodiments of the present invention, the number of the conductive pads can be adjusted according to actual needs.

Further, the two anode conductive pads 20A and the two cathode conductive pads 20B are electrically connected to the external anode terminal 70 and the external cathode terminal 80 respectively, and the insulating adhesive 60 is filled in the space between the first capacitor core 10 , the two anode conductive pads 20A and the two cathode conductive pads 20B. Wherein, there is no electrical connection between any two adjacent anode conductive pads 20A and the cathode conductive pad 20B, and the two anode conductive pads 20A and the two cathode conductive pads 20B are connected Therefore, the overall thickness of the electronic component packaging structure 100 of the present invention can be effectively reduced.

It should be noted that, in this embodiment, each of the cathode conductive pads 20B is large, and is only smaller than the cathode (not shown). Thus, each of the cathode conductive pads 20B can replace the main part of the protective substrate 20, and the cathode can be connected to each of the cathode conductive pads 20B with a relatively large contact area to provide low electrical impedance . In addition, the cathode terminal 40 or the external cathode terminal 80 may only cover a part of each of the cathode conductive pads 20B in this embodiment.

The advantage of using an all-conductor protective substrate is to reduce the thickness of the package. The example of the conductive thin material attached to the insulating protection substrate in the foregoing first embodiment can be a typical printed circuit board as an example, which usually includes a substrate made of non-conductive material, and its upper and lower surfaces are covered with a copper foil layer, and The substrate is usually made of glass fiber reinforced epoxy resin, and its thickness is between 0.1 mm and 0.2 mm, and the copper foil layer is usually 1/2 ounce or 1 ounce, and its thickness is equivalent to 0.018 mm to 0.035 mm. Therefore, if a typical printed circuit board is used as the protective substrate 20, the total thickness of the two protective substrates 20 is approximately between 0.27 mm and 0.54 mm. On the other hand, if only a 0.1 mm thick full copper substrate is used, the total thickness of the two full copper protective substrates can be reduced to 0.2 mm. If only the copper clad laminate used for the copper foil layer of the printed circuit board is used as the all-copper protective substrate, the total thickness of the two all-copper protective substrates can be further reduced to between 0.035 mm and 0.07 mm.

It should be noted that, as shown in FIG. 9 and FIG. 11 , even if a plurality of the protective substrates 20 are replaced with a plurality of the conductive pads of all conductors, the electronic component packaging structure 100 can still be used to package the first A capacitor core 10 and the second capacitor core 10-2. Wherein, comparing FIG. 9 with FIG. 11 , the only difference is that an anode conductive pad 20A and an additional anode conductive pad 20A are additionally disposed between the first capacitor core 10 and the second capacitor core 10 - 2 . Cathode conductive pad 20B.

In other words, comparing FIG. 11 with FIG. 8 of the fourth embodiment, the difference is only in the protection originally located between the first capacitor core 10 and the second capacitor core 10 - 2 The substrate 20 is replaced with one of the anode conductive pads 20A and one of the cathode conductive pads 20B.

[Seventh Embodiment]

Please refer to FIG. 12 , which is the seventh embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first embodiment, the above-mentioned fourth embodiment and the above-mentioned fifth embodiment, so there are many The same parts of the embodiments will not be repeated (eg: the protective substrate 20 ); furthermore, the relevant numbers and shapes mentioned in the accompanying drawings in this embodiment are only used to specifically describe the embodiments of the present invention. , so as to facilitate understanding of the content of the present invention, rather than limit the protection scope of the present invention.

As shown in FIG. 12 , the main difference between this embodiment and the first embodiment is that the ends of the protective substrates 20 located adjacent to the anode terminal 30 further include a The anode-side conductive sheet 21AX and the ends of the protective substrates 20 located adjacent to the cathode terminal 40 further include a cathode-side conductive sheet 21BX thereon.

Further, the conductive film (the anode terminal 30 ) covers the anode-side conductive thin material 21AX and the end surface and side surface of the flat structure adjacent to the anode terminal 30 , and the anode terminal 30 The end surface and the side surface of the flat body structure are covered to form the anode terminal 30 covered on five sides correspondingly, and the structural strength of the electronic component packaging structure 100 is enhanced; the cathode terminal 40 is covered with The cathode-side conductive thin material 21BX and the end surface and the side surface of the flat body structure located adjacent to the cathode terminal 40 enhance the structural strength of the electronic component packaging structure 100 .

[Eighth Embodiment]

Please refer to FIG. 13 to FIG. 18 , which are the eighth embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first to seventh embodiments. No further description (eg: the protective substrate 20) is repeated; furthermore, the relevant numbers and shapes mentioned in the accompanying drawings in this embodiment are only used to specifically describe the embodiments of the present utility model, so as to facilitate understanding of the present utility model. The content of the new model is not used to limit the protection scope of the present invention.

As shown in FIG. 13 , the eighth embodiment of the present invention provides a manufacturing method S100 of an electronic component packaging structure, which includes: a first providing step S101 , a setting step S102 , a second providing step S103 , a superimposing step S104 , and a first step S104 . A hardening step S105, a glue filling step S106, a second hardening step S107, a cutting step S108, a film forming step S109 and a cutting step S110. Wherein, the film forming step S109 further includes an electroplating sub-step and a connector step, but the present invention is not limited thereto. For example, in other embodiments of the present invention, the film forming step S109 may not include the electroplating sub-step and the connector step.

As shown in FIGS. 14A and 14B , in the first providing step S101 , a base substrate 20C is provided, and an upper surface 20C1 of the base substrate 20C defines a plurality of first predetermined positions (not shown) , and the upper surface 20C1 of the base substrate 20C corresponding to the plurality of first predetermined positions is further provided with a plurality of conductive thin materials 21 . A conductive connection material 50 is coated on a plurality of the conductive thin materials 21 , and the structure and material of the base substrate 20C are the same as the protection substrate 20 disclosed in the first embodiment of the present invention.

As shown in FIG. 13 , FIG. 14A and FIG. 14B , in the setting step S102 , a plurality of electronic core components (not shown) are placed on the conductive connecting materials 50 on the plurality of the conductive thin materials 21 . Wherein, each of the electronic core components includes a first capacitor core 10 , and the first capacitor core 10 includes an anode 11 , a cathode 12 and a barrier coating 13 .

As shown in FIG. 13 , FIG. 14A and FIG. 14B , in the second providing step S103 , a top substrate 20D is provided, and a lower surface 20D1 of the top substrate 20D defines a plurality of second predetermined positions (not shown in the figure). mark), and the lower surface 20D1 of the top substrate 20D corresponding to the plurality of second predetermined positions is provided with a plurality of the conductive thin materials 21, and the plurality of the conductive thin materials 21 are coated with The conductive connection material 50 . The structure and material of the top substrate 20D are the same as the protection substrate 20 disclosed in the first embodiment of the present invention.

It should be noted that the cathode 12 can be used to cooperate with the conductive connection material 50 to connect with the conductive thin materials 21 on the bottom substrate 20C and the conductive thin materials on the top substrate 20D material 21 combined.

As shown in FIG. 13 , FIG. 14A and FIG. 14B , in the stacking step S104 , the top substrate 20D is stacked and disposed on the bottom substrate 20C at intervals, so that all of the plurality of electronic core components are stacked. The first capacitor core 10 is located between the top substrate 20D and the bottom substrate 20C. Wherein, the edge of the bottom substrate 20C exceeds a projection area (not shown) formed by the orthographic projection of the top substrate 20D, and the part of the upper surface 20C1 of the bottom substrate 20C that exceeds the projection area Defined as a glue placement area 20CA.

It should be noted that, in this embodiment, the first capacitor cores 10 of the plurality of electronic core components are disposed between the top substrate 20D and the bottom substrate 20C for encapsulation, but this practical The new type is not limited to this. For example, in other embodiments of the present invention, the first capacitor cores 10 of the plurality of electronic core components can also be configured as shown in FIG. 9 of the fifth embodiment or as shown in FIGS. 14A to 14B . It is disposed between two or more of the protective substrates 20 to be processed together to form a plurality of the electronic chip package structures 100 .

As shown in FIG. 13 , FIG. 14A and FIG. 14B , in the first curing step S105 , the conductive connection material 50 is cured, and then the top substrate 20D, the bottom substrate 20C and the plurality of electronic cores are cured. The first capacitor cores 10 of the components are connected and correspondingly form a basic assembly. Wherein, a channel (not marked in the figure) is formed in the inner space of the basic assembly, which is communicated with the glue placement area 20CA.

As shown in FIG. 13 , FIG. 14A and FIG. 14B , in the glue filling step S106 , an insulating glue material 60 fills the channel from the glue placement area 20CA to correspond to all the electronic core components. The first capacitor core 10 is embedded between the top substrate 20D and the bottom substrate 20C. Wherein, the insulating adhesive material 60 can fill the channel through capillary action.

Further, since the first capacitor core 10 of each of the electronic core components is sandwiched between the top substrate 20D and the bottom substrate 20C, and buried therein. Therefore, the conventional liquid dispensing package cannot be applied to encapsulate the first capacitor cores 10 of the plurality of electronic cores sandwiched between the top substrate 20D and the bottom substrate 20C, because the conventional Liquid dispensing encapsulation is usually performed on a single exposed structure. In addition, it is difficult to use the encapsulation method of composite molding or transfer molding, because in this case, the liquid must be squeezed in through the narrow edge opening between the top substrate 20D and the bottom substrate 20C, so it is necessary to Special molds are used for sealing and pressurization.

As mentioned above, in order to fill the insulating adhesive 60 into the gap (the channel) between the top substrate 20D and the bottom substrate 20C, the preferred method is to fill the capillary. Further, the area of the bottom substrate 20C needs to be larger than that of the top substrate 20D, so that the part of the upper surface 20C1 of the bottom substrate 20C beyond the projection area is defined as the glue placement area 20CA .

The uncured insulating glue 60 will flow into the gap (the channel) by capillary effect. Preferably, liquid is injected at one end between the top substrate 20D and the bottom substrate 20C, so that the uncured insulating adhesive 60 flows from one end to the other end. The capillary effect is able to pull liquid into narrow gaps to fill sandwich assemblies with an area of at least 100 mm by 240 mm. This process can be carried out with a simple liquid dispensing device at normal atmospheric pressure.

As shown in FIG. 13 , FIG. 14A and FIG. 14B , in the second curing step S107 , the insulating adhesive material 60 is baked and cured, so that the basic assembly corresponds to the insulating adhesive material 60 . A first semi-finished assembly is formed.

As shown in FIG. 13 , FIG. 15A and FIG. 15B , in the cutting step S108 , the first semi-finished product assembly is cut and a plurality of slot openings 105 are correspondingly cut out, so that a plurality of slot openings 105 on the base substrate 20C are cut. The conductive thin material 21 and the plurality of conductive thin materials 21 on the top substrate 20D are partially exposed, and correspondingly form a second semi-finished product assembly. Wherein, a part of the anode 11 can be exposed to the tip surface 11A through the plurality of slot openings 105 on the second semi-finished product assembly.

It should be noted that, as shown in FIG. 18 , in the cutting step S108 , in addition to the plurality of slot openings 105 , additional multiple secondary slot openings 105A may be cut to expose a plurality of the slot openings 105A. A plurality of the anodes 11 and a plurality of the cathodes 12 of the first capacitor core 10 . Thereby, the top substrate 20D and the bottom substrate 20C of the second semi-finished product assembly can be processed more conveniently, and it is convenient to further deposit metal to cover and wrap the top substrate 20D and the bottom substrate 20C .

It should be additionally noted that, in other embodiments of the second semi-finished product assembly not shown in the present invention, the second semi-finished product assembly can also be used alone (eg, sold) or used with other components .

As shown in FIG. 13 , and referring to FIG. 3 of the first embodiment of the present invention and FIGS. 6A to 6C of the second embodiment of the present invention, in the film forming step S109 , the second semi-finished product assembly is A conductive film is formed and a plurality of component terminals (such as the anode terminal 30 and the cathode terminal 40 in the first embodiment of the present invention) are formed correspondingly, so that the second semi-finished product assembly and a plurality of the component terminals are formed. Correspondingly, a third semi-finished product assembly is formed. Wherein, a plurality of component terminals are connected to a plurality of the exposed conductive thin materials 21 .

It should be noted that, in the electroplating sub-step, metal zinc is electroplated on the exposed partial surface of the anode 11 to form a corresponding zinc layer, and then metal nickel is electroplated on the zinc layer to form a corresponding nickel layer 31.

It should be noted that, in the connector step, the anode 11 of the first capacitor core 10 is connected to an anode terminal 30 via the nickel layer 31 and the conductive film, and connects the first The cathode 12 of the capacitor core 10 is connected to a cathode terminal 40 through a plurality of the conductive thin materials 21 .

As shown in FIG. 13 , in the cutting step S110 , the third semi-finished product assembly is cut to form a plurality of electronic component packaging structures 100 correspondingly.

It should be noted that, in the above-mentioned manufacturing method S100 of the electronic component packaging structure, the electronic component packaging structure 100 can also be as shown in FIG. 10 and FIG. 11 of the sixth embodiment of the present invention. The base substrate 20C is replaced with a plurality of all-conductor conductive pads. Further, as shown in FIG. 17A. First, a plurality of the first capacitor cores 10 of the plurality of the electronic core components are placed between an upper conductor sheet 20E and a lower conductor sheet 20F, and are bonded to the conductor sheets through the conductive connection material 50, form a complete sandwich structure. Then, the insulating adhesive 60 is filled into the gap between the upper conductor sheet 20E and the lower conductor sheet 20F and cured. Then, as shown in FIG. 17B , the selected portion 20E1 of the upper conductor sheet 20E and the selected portion 20F1 of the lower conductor sheet 20F are etched away, and the remaining portions of the upper conductor sheet 20E and the lower conductor sheet 20F are etched away. The portions of the 20A form separate two anode conductive pads 20A and two cathode conductive pads 20B. After that, as shown in FIG. 17C , the cutting step S108 will be performed to cut out a plurality of the slot openings 105 .

It should be noted that, for the convenience of description and understanding below, a plurality of the electronic core components will be used as aluminum capacitor cores to be produced in quantity. For example, as shown in FIG. 16 , the second semi-finished product assembly additionally includes the middle-layer substrate 20 - 2 , and in this embodiment, the size of each of the electronic core components is 7.4 mm×3.7 mm ×0.25 mm, and a plurality of the electronic core pieces are connected in parallel. The top substrate 20D and the bottom substrate 20C both have a thickness of 0.075 mm, and are covered with 1 ounce copper foil, the thickness of which is equivalent to 0.035 mm.

The size of the top substrate 20D is 230 mm×110 mm; the size of the middle substrate 20-2 is 230 mm×108 mm; the size of the bottom substrate 20C is 240 mm×125 mm. Therefore, 506 capacitor cores may be included between any two of the above-mentioned substrates. In the subsequent cutting step S110 , a plurality of the electronic component packaging structures 100 are cut and separated, and the size of each electronic component packaging structure 100 is 7.3 mm×4.4 mm×1.1 mm thick. In contrast, if a conventional lead frame and composite molding package were used, the dimensions of each electronic component package structure 100 would be 7.3 mm x 4.3 mm x 1.9 mm, which is significantly thicker than the product of the present invention.

It should be noted that, for the convenience of description and understanding, a plurality of the electronic core components will be used as tantalum capacitor cores to be produced in quantity. For example, as shown in FIG. 14B , the second semi-finished product assembly only includes the top substrate 20D and the bottom substrate 20C, and in this embodiment, the size of each of the electronic core components is 7.0 mm × 3.65 mm × 1.0 mm, and a plurality of the electronic core pieces are connected in parallel. The top substrate 20D and the bottom substrate 20C both have a thickness of 0.075 mm, and are covered with 1 ounce copper foil, the thickness of which is equivalent to 0.035 mm.

The size of the top substrate 20D is 230 mm x 110 mm, and the size of the bottom substrate 20C is 240 mm x 125 mm. Therefore, 506 capacitor cores can be included between the two substrates 20D and 20C. In the subsequent cutting step S110 , a plurality of the electronic component packaging structures 100 are cut and separated, and the size of each electronic component packaging structure 100 is 7.3 mm×4.4 mm×1.5 mm thick. In contrast, if a conventional lead frame and composite molding package were used, the dimensions of each electronic component package structure 100 would be 7.3 mm x 4.3 mm x 1.9 mm, which is significantly thicker than the product of the present invention.

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the electronic component packaging structure 100 , the manufacturing method S100 and the semi-finished product assembly provided by the present invention can fill a plurality of The technical solution of "the gap between the protective substrate 20 and the first capacitor core 10" is used to obtain a solid electrolytic capacitor with low profile, low ESR and high reliability.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the present invention. within the scope of the utility model patent application.

Claims (10)

1. A semi-finished product assembly, wherein the semi-finished product assembly is adapted for use in an electronic component package, the semi-finished product assembly comprising:

a plurality of protective substrates which are arranged to be stacked at intervals, and a plurality of predetermined positions are defined between any two adjacent protective substrates, and a plurality of conductive thin materials are further arranged on the surface of each of the protective substrates corresponding to the plurality of predetermined positions; the edge of one of the two adjacent protective substrates exceeds a projection area formed by the orthographic projection of the other protective substrate on the protective substrate, and the partial surface of the protective substrate exceeding the projection area is defined as a glue placing area;

A plurality of electronic core pieces located between the plurality of protective substrates, and the plurality of electronic core pieces being disposed at a plurality of the predetermined positions; wherein each of the electronic core pieces comprises a plurality of contacts;

a conductive connecting material connected to the plurality of conductive thin materials and part of the contacts;

an insulating adhesive material filling gaps between the plurality of protective substrates and the plurality of electronic core members; and

and a plurality of slot openings passing through the plurality of protective substrates and the insulating adhesive material, and the plurality of slot openings can be used for exposing the plurality of conductive thin materials communicated with the partial contacts of the electronic core member.

2. The assembly as claimed in claim 1, wherein each of said electronic core pieces further comprises a capacitor core, and two of said contacts of said capacitor core are respectively defined as an anode and a cathode, said cathode being adapted to be joined to a plurality of said conductive sheets, and said slotted openings being adapted to expose portions of said anode; wherein, a zinc layer is formed on the surface of the exposed anode by electroplating.

3. The assembly as claimed in claim 1, wherein each of the protection substrates is an all-copper substrate, and each of the protection substrates is etched to form a plurality of the conductive thin materials.

4. An electronic package assembly, comprising:

a plurality of protective substrates which are arranged on top of each other at intervals, wherein a preset position is defined between any two adjacent protective substrates, and a plurality of conductive thin materials are further arranged on the surface of each protective substrate corresponding to the preset position;

the first capacitor core is arranged at the preset position and forms a sandwich structure together with the plurality of protective substrates; wherein, the first capacitor core comprises a cathode and an anode;

the insulating glue material is filled in gaps between the plurality of protective substrates and the first capacitor core and forms a flat structure together with the plurality of protective substrates and the first capacitor core;

an anode terminal located at one end of the flat body structure;

a cathode terminal located at the other end of the flat structure from the anode terminal; and

a conductive connecting material connected to a plurality of the conductive thin materials and a part of the cathode on each protective substrate;

wherein a part of the plurality of conductive thin materials extends and is connected to the cathode terminal, and the cathode terminal is connected and formed on the plurality of conductive thin materials in a copper plating manner; wherein a portion of the anode is connected to the anode terminal, and the anode terminal is connected to and formed at a portion of the anode in such a manner as to form a conductive film.

5. The electronic component package structure of claim 4, wherein each of the protective substrates is an all-copper substrate, and a plurality of the conductive thin materials are formed after each of the protective substrates is etched.

6. The electronic component package according to claim 4, further comprising a second capacitor core, wherein the second capacitor core is disposed on the first capacitor core at a distance from the first capacitor core, and the second capacitor core is disposed between the plurality of protective substrates; wherein the plurality of protective substrates, the first capacitor core and the second capacitor core together form a multi-layer core structure, the second capacitor core includes a cathode and an anode, two cathodes of the first capacitor core and the second capacitor core are connected to the cathode terminal, and two anodes of the first capacitor core and the second capacitor core are connected to the anode terminal.

7. The electronic component package according to claim 6, further comprising a middle substrate disposed between the first capacitor core and the second capacitor core, wherein the middle substrate comprises an anode-side conductive sheet set and a cathode-side conductive sheet set separated from each other; the cathode end conductive thin material group is connected to the two cathodes of the first capacitor core and the second capacitor core through the conductive connecting material, and the anode end conductive thin material group is connected to the anode terminal.

8. The electronic device package of claim 4, wherein the conductive film comprises a zinc layer and a nickel layer, and wherein the zinc layer is plated on a portion of the surface of the anode and the nickel layer is plated on the zinc layer.

9. The electronic component package structure according to claim 4, wherein the anode has two sides on opposite sides, and the two sides are connectable to the plurality of protective substrates and the anode terminal with the conductive connecting material to enhance the structural strength of the electronic component package structure.

10. The electronic device package structure of claim 4, wherein the plurality of protective substrates further comprise an anode-side conductive thin material disposed on the plurality of protective substrates and located adjacent to the ends of the anode terminal, and the anode terminal covers the anode-side conductive thin material and the end surface and the side surface of the flat body structure located adjacent to the anode terminal, so as to form the five-surface-coated anode terminal correspondingly and enhance the structural strength of the electronic device package structure; the plurality of protective substrates further comprise a cathode side conductive thin material positioned at a plurality of protective substrates and adjacent to a plurality of ends of the cathode terminal, and the cathode terminal covers the cathode side conductive thin material and the end surface and the side surface of the flat body structure positioned adjacent to the cathode terminal, and the structural strength of the electronic component packaging structure is enhanced.

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