CN113560760B - 一种用于照明灯具的led芯片引脚焊接装置 - Google Patents
一种用于照明灯具的led芯片引脚焊接装置 Download PDFInfo
- Publication number
- CN113560760B CN113560760B CN202110901027.8A CN202110901027A CN113560760B CN 113560760 B CN113560760 B CN 113560760B CN 202110901027 A CN202110901027 A CN 202110901027A CN 113560760 B CN113560760 B CN 113560760B
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- led chip
- rod
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- welding
- plate
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- 238000003466 welding Methods 0.000 title claims abstract description 71
- 238000009434 installation Methods 0.000 claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000011111 cardboard Substances 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims 4
- 241001465382 Physalis alkekengi Species 0.000 claims 1
- 238000000265 homogenisation Methods 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 230000010354 integration Effects 0.000 claims 1
- 210000001503 joint Anatomy 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 238000003032 molecular docking Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 9
- 230000013011 mating Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110901027.8A CN113560760B (zh) | 2021-08-06 | 2021-08-06 | 一种用于照明灯具的led芯片引脚焊接装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110901027.8A CN113560760B (zh) | 2021-08-06 | 2021-08-06 | 一种用于照明灯具的led芯片引脚焊接装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113560760A CN113560760A (zh) | 2021-10-29 |
CN113560760B true CN113560760B (zh) | 2022-09-16 |
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CN202110901027.8A Active CN113560760B (zh) | 2021-08-06 | 2021-08-06 | 一种用于照明灯具的led芯片引脚焊接装置 |
Country Status (1)
Country | Link |
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CN (1) | CN113560760B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6237832B1 (en) * | 1999-10-18 | 2001-05-29 | Henry Chung | Wave soldering fixture |
CN105414700A (zh) * | 2016-01-17 | 2016-03-23 | 孙晓玮 | 一种电路板电子元器件焊接夹具 |
CN207114713U (zh) * | 2017-08-22 | 2018-03-16 | 昆山市线路板厂 | 一种电路板的检测装置 |
CN108580744A (zh) * | 2018-06-21 | 2018-09-28 | 上海空间电源研究所 | 一种qfp器件引脚成型工装及其使用方法 |
CN109300814A (zh) * | 2018-10-10 | 2019-02-01 | 彭婷 | 一种电子芯片引脚自动矫正修复系统及芯片引脚修复工艺 |
CN110729217A (zh) * | 2019-10-22 | 2020-01-24 | 江苏佳晟精密设备科技有限公司 | 一种安装半导体芯片的装置 |
CN211840705U (zh) * | 2020-03-26 | 2020-11-03 | 陈华 | 一种芯片安装用引脚焊接设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4057457B2 (ja) * | 2003-04-15 | 2008-03-05 | 株式会社ディスコ | フリップチップボンダー |
-
2021
- 2021-08-06 CN CN202110901027.8A patent/CN113560760B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6237832B1 (en) * | 1999-10-18 | 2001-05-29 | Henry Chung | Wave soldering fixture |
CN105414700A (zh) * | 2016-01-17 | 2016-03-23 | 孙晓玮 | 一种电路板电子元器件焊接夹具 |
CN207114713U (zh) * | 2017-08-22 | 2018-03-16 | 昆山市线路板厂 | 一种电路板的检测装置 |
CN108580744A (zh) * | 2018-06-21 | 2018-09-28 | 上海空间电源研究所 | 一种qfp器件引脚成型工装及其使用方法 |
CN109300814A (zh) * | 2018-10-10 | 2019-02-01 | 彭婷 | 一种电子芯片引脚自动矫正修复系统及芯片引脚修复工艺 |
CN110729217A (zh) * | 2019-10-22 | 2020-01-24 | 江苏佳晟精密设备科技有限公司 | 一种安装半导体芯片的装置 |
CN211840705U (zh) * | 2020-03-26 | 2020-11-03 | 陈华 | 一种芯片安装用引脚焊接设备 |
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CN113560760A (zh) | 2021-10-29 |
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GR01 | Patent grant | ||
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Effective date of registration: 20221207 Address after: 518100 101, Building B11, Yintian Industrial Zone, Yantian Community, Xixiang Street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Fuluo Lighting Co.,Ltd. Address before: 529000 Building 2, No. 17, Caihong Road, Jianghai District, Jiangmen City, Guangdong Province Patentee before: FULUO LIGHTING Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240902 Address after: Building 2, No. 150 Linjiang Road, Jianghai District, Jiangmen City, Guangdong Province, 529000 (Information Application) Patentee after: FULUO LIGHTING Co.,Ltd. Country or region after: China Address before: 518100 101, Building B11, Yintian Industrial Zone, Yantian Community, Xixiang Street, Bao'an District, Shenzhen, Guangdong Patentee before: Shenzhen Fuluo Lighting Co.,Ltd. Country or region before: China |