CN113257980A - LED device, backlight module and display unit - Google Patents
LED device, backlight module and display unit Download PDFInfo
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- CN113257980A CN113257980A CN202110665700.2A CN202110665700A CN113257980A CN 113257980 A CN113257980 A CN 113257980A CN 202110665700 A CN202110665700 A CN 202110665700A CN 113257980 A CN113257980 A CN 113257980A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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Abstract
本发明提供一种LED器件、背光模组及显示单元，LED器件包括：正极基板，负极基板，LED芯片，LED支架；所述LED支架设置在所述正极基板与所述负极基板表面，将所述正极基板与所述负极基板包围，所述LED支架与所述正极基板和所述负极基板形成碗状结构，所述LED芯片设置在至少一个基板上；所述LED支架与所述正极基板和所述负极基板形成的碗状结构内依次填充有第一封装胶层、第二封装胶层，所述第一封装胶层包覆所述LED芯片，所述第二封装胶层远离所述LED芯片的一面呈球面凸出形状；通过第一封装胶层以及呈球面凸出的第二封装胶层将LED芯片表面发出的光折射到LED器件外，第二封装胶层远离LED芯片的一面呈球面凸出形状使得LED器件发光角度增大，进而提升了整体发光角度，发光角度提升的同时提升了LED器件的发光亮度。
The invention provides an LED device, a backlight module and a display unit. The LED device includes: a positive electrode substrate, a negative electrode substrate, an LED chip, and an LED bracket; the LED bracket is arranged on the surface of the positive electrode substrate and the negative electrode substrate, and the The positive electrode substrate and the negative electrode substrate are surrounded, the LED bracket forms a bowl-shaped structure with the positive electrode substrate and the negative electrode substrate, and the LED chip is arranged on at least one substrate; the LED bracket is connected to the positive electrode substrate and the negative electrode substrate. The bowl-shaped structure formed by the negative substrate is filled with a first encapsulation adhesive layer and a second encapsulation adhesive layer in turn, the first encapsulation adhesive layer wraps the LED chip, and the second encapsulation adhesive layer is far away from the LED One side of the chip has a spherical convex shape; the light emitted from the surface of the LED chip is refracted to the outside of the LED device through the first encapsulating adhesive layer and the second encapsulating adhesive layer that is spherically convex, and the second encapsulating adhesive layer is away from the LED chip. The spherical convex shape increases the light-emitting angle of the LED device, thereby improving the overall light-emitting angle. The light-emitting angle is increased and the light-emitting brightness of the LED device is also improved.
Description
Technical Field
The embodiment of the invention relates to the field of LED chips, in particular to but not limited to an LED device, a backlight module and a display unit.
Background
An LED (Light Emitting Diode) device is a semiconductor device that emits Light by using energy released during carrier recombination, and has many advantages of low power consumption, pure chromaticity, long life, small volume, fast response time, energy saving, environmental protection, and the like. The backlight module is one of the key components of the display unit, and is used to provide a light source for the display unit, and the backlight module is light, thin, power-saving, and HDR (High-Dynamic Range, High Dynamic Range image) is the development trend of the display unit.
Among the present LED device, LED chip luminous angle receives the restriction of the LED support among the LED device, the LED support has restricted LED chip's light-emitting angle, and then make whole luminous luminance of LED device all receive the influence with luminous angle, if realize increasing luminous luminance through increasing the mixed light distance that LED chip luminous surface goes out the plain noodles to backlight unit or through increasing LED number, increase luminous angle, then can't satisfy the frivolous demand of display device, the power saving, therefore, how to increase LED device luminous angle has just become the problem that needs to solve urgently.
Disclosure of Invention
The LED device, the backlight module and the display unit provided by the embodiment of the invention mainly solve the technical problems that in the related art, the light emitting angle of an LED chip in the LED device is limited by an LED support in the LED device, the light emitting angle of the LED chip is limited by the LED support, and further the whole light emitting brightness and the light emitting angle of the LED device are influenced.
To solve the above technical problem, an embodiment of the present invention provides an LED device, including: the LED light source comprises a positive electrode substrate, a negative electrode substrate, an LED chip and an LED bracket; the LED support is arranged on the surfaces of the anode substrate and the cathode substrate to surround the anode substrate and the cathode substrate, the LED support, the anode substrate and the cathode substrate form a bowl-shaped structure, and the LED chip is arranged on at least one substrate; the LED support with the bowl-shaped structure that positive pole base plate and negative pole base plate formed is filled in proper order has first encapsulation glue film, second encapsulation glue film, first encapsulation glue film cladding the LED chip, the second encapsulation glue film is kept away from the one side of LED chip is the spherical surface convex shape.
Optionally, the height of the first packaging adhesive layer in a bowl-shaped structure formed by the LED bracket, the anode substrate and the cathode substrate does not exceed the height of the LED bracket;
optionally, the surface of the first packaging adhesive layer away from the LED chip is an arc surface recessed towards the LED chip;
optionally, the width of the second packaging adhesive layer is not greater than the width of the upper surface of a bowl-shaped structure formed by the LED support, the anode substrate and the cathode substrate;
optionally, the refractive index of the first encapsulation adhesive layer is higher than that of the second encapsulation adhesive layer, and the refractive index of the second encapsulation adhesive layer is higher than that of air;
optionally, the LED support is a transparent support;
optionally, a distributed bragg reflector is disposed in the LED chip.
Optionally, the upper surface of the LED support is serrated;
optionally, the LED chip includes at least one of a red LED chip, a green LED chip, and a blue LED chip.
Further, the present embodiment also provides a backlight module, which includes at least one LED device as described above.
Further, the embodiment of the invention also provides a display device, and the display unit comprises the LED backlight module.
According to the LED device, the backlight module and the display unit provided by the embodiment of the invention, the LED device, the backlight module and the display unit comprise: the LED light source comprises a positive electrode substrate, a negative electrode substrate, an LED chip and an LED bracket; the LED support is arranged on the surfaces of the anode substrate and the cathode substrate to surround the anode substrate and the cathode substrate, the LED support, the anode substrate and the cathode substrate form a bowl-shaped structure, and the LED chip is arranged on at least one substrate; the LED support with the bowl-shaped structure that positive pole base plate and negative pole base plate formed is filled in proper order has first encapsulation glue film, second encapsulation glue film, first encapsulation glue film cladding the LED chip, the second encapsulation glue film is kept away from the one side of LED chip is the spherical surface convex shape. Through first encapsulation glue film and be outside the light refraction that the convex second encapsulation glue film of sphere sent the LED chip surface to the LED device, the one side that the LED chip was kept away from to the second encapsulation glue film is the spherical convex shape and makes the luminous angle increase of LED device, and then has promoted whole luminous angle, when luminous angle promoted, has promoted the luminous luminance of LED device.
Additional features and corresponding advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic diagram of a basic structure of an LED device according to a first embodiment of the present invention;
fig. 2 is a schematic diagram of basic parameters measured by an LED device according to a first embodiment of the present invention;
fig. 3 is a schematic diagram of a basic structure of an LED device according to an embodiment of the present invention, in which a first packaging adhesive layer is recessed;
fig. 4 is a schematic view of a basic structure of a first encapsulating adhesive layer of another LED device according to a first embodiment of the present invention;
FIG. 5 is a schematic diagram of another LED device basic parameter measurement provided in the first embodiment of the present invention;
fig. 6 is a schematic view of a basic structure of an LED device according to an embodiment of the present invention, in which an upper surface of an LED support is serrated;
fig. 6-1 is a schematic partially enlarged basic structure diagram of an LED support in an LED device according to an embodiment of the present invention, where the upper surface of the LED support is sawtooth-shaped;
fig. 7 is a schematic diagram of a basic structure of an LED device according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
in order to solve the problem in the related art that, in an LED device, the limitation of an LED chip received by an LED support causes the overall luminance and the light emitting angle of the LED device to be affected, please refer to fig. 1, this embodiment provides an LED, where the LED device includes: the LED lamp comprises a positive electrode substrate 1, a negative electrode substrate 2, an LED chip 3 and an LED bracket 4; the LED support 4 is arranged on the surfaces of the anode substrate 1 and the cathode substrate 2 to surround the anode substrate 1 and the cathode substrate 2, the LED support 4, the anode substrate 1 and the cathode substrate 2 form a bowl-shaped structure, and the LED chip 3 is arranged on at least one substrate; LED support 4 with anodal base plate 1 with it has first encapsulation glue film 5, second encapsulation glue film 6 to fill in proper order in the bowl-shaped structure that negative pole base plate 2 formed, first encapsulation glue film 5 cladding LED chip 3, second encapsulation glue film 6 is kept away from LED chip 3's one side is the sphere convex shape, can completely cut off steam through encapsulation glue film and second encapsulation glue film 6, protects LED chip 3, and simultaneously, the light refraction, reflection, the diffusion of emitting LED chip 3 are gone out through first encapsulation glue film 5 and second encapsulation glue film 6 to light that refracts LED chip 3 surface is all around, has increased the luminous angle of LED device.
It should be understood that the second encapsulating glue layer 6 completely covers the first encapsulating glue layer 5, as shown in fig. 1; the first encapsulation adhesive layer 5 and/or the second encapsulation adhesive layer 6 may be transparent adhesive layers formed by curing transparent glue, where the transparent glue includes, but is not limited to, epoxy resin, silica gel, silicone resin, and the like; of course, the first encapsulating adhesive layer 5 and/or the second encapsulating adhesive layer 6 may also be a fluorescent adhesive layer formed by mixing transparent adhesive and fluorescent powder and then curing the mixture.
It should be understood that the positive electrode substrate 1 and the negative electrode substrate 2 in the present embodiment are both conductive substrates, and the conductive substrate in the present embodiment may be a substrate made of various conductive materials, such as various metal conductive substrates, including but not limited to one of a copper substrate, an aluminum substrate, an iron substrate, a silver substrate, etc.; the conductive substrate may also be a mixed material conductive substrate containing a conductive material, such as conductive rubber, and the LED chip 3 can be fixed on at least one conductive substrate by a die bond adhesive such as silver adhesive or insulating adhesive. The LED chip 3 can be a normally-mounted LED chip 3 and can be electrically connected with the substrate through a bonding wire at the moment, or the LED chip 3 can be reversely mounted and can be electrically connected with the substrate through an eutectic process; for example, as shown in fig. 1, an LED chip 3 is fixed on a negative electrode substrate 2, and then a positive electrode pin and a negative electrode pin of the LED chip 3 are electrically connected to the positive electrode substrate 1 and the negative electrode substrate 2 through bonding wires, respectively; wherein 3 light emitting surfaces of LED chip cover has the reflection stratum of different thickness, according to different demands, can adopt the reflection stratum of different materials and thickness, with the increase of chip light-emitting half-power angle, and then further increase LED device's luminous angle.
In some examples of the present embodiment, as shown in fig. 2, a height H of the first encapsulant layer 5 in a bowl-shaped structure formed by the LED support 4 and the anode substrate 1 and the cathode substrate 2 does not exceed a height H of the LED support 4, and it should be understood that the first encapsulant layer 5 covers the LED chip 3, so that a lowest height H of the first encapsulant layer 5 in the bowl-shaped structure exceeds a height H1 of the LED chip 3; in some examples, the lowest height h of the first encapsulating glue layer 5 within the bowl-like structure is the cover wire bond, it being understood that the cover wire bond covers the LED chip 3, as shown in fig. 1 and 2; the first packaging adhesive layer 5 completely covers the LED chip 3, and light emitted from the surface of the LED chip 3 is respectively refracted and diffused to the second packaging adhesive layer 6 and the LED support 4, so that the light emitting angle of the LED chip 3 is increased.
In some examples of the present embodiment, as shown in fig. 3, a height h of the first encapsulant layer 5 in a bowl-shaped structure formed by the LED support 4 and the positive electrode substrate 1 and the negative electrode substrate 2 is the same as a height of the LED support 4, that is, an upper surface of the first encapsulant layer 5 is flush with an upper surface of the LED support.
In some examples of this embodiment, the surface of the first encapsulating adhesive layer 5 away from the LED chip 3 is an arc surface that is concave towards the LED chip 3, and the concave arc surface of the first encapsulating adhesive layer 5 changes a reflection angle and a refraction angle of light, so that the light can more easily irradiate onto the LED support 4 and the second encapsulating adhesive layer, and thus the light emission of the LED device is more uniform, as shown in fig. 3 and 4, and further the light emission angle of the LED device is increased, wherein the lowest height of the concave first encapsulating adhesive layer 5 is flush with the LED chip 3; it should be understood that, the first encapsulating adhesive layer 5 may be directly concave from the place contacting with the LED support 4, or the first encapsulating adhesive layer 5 may be concave from the transparent support after keeping a horizontal shape; it should be appreciated that in some examples, the first encapsulant layer 5 is a horizontal structure that is not recessed, as shown in fig. 1 and 2.
In some examples of this embodiment, the width B of the second encapsulating glue layer 6 is not higher than the width B of the upper surface of the bowl-shaped structure, so as to define the second encapsulating glue layer 6 on the bowl-shaped structure of the LED device, as shown in fig. 5; it should be understood that the width B of the second encapsulating adhesive layer 6 is the lowest width B1 of the surface of the first encapsulating adhesive layer 5 far away from the LED chip 3, and further completely covers the first encapsulating adhesive layer 5, wherein the first encapsulating adhesive layer 5 completely covers the LED chip 3, and respectively refracts and diffuses light emitted from the surface of the LED chip 3 onto the second encapsulating adhesive layer 6 and the LED support 4, the first encapsulating adhesive layer 5 refracts light emitted from the LED chip 3 onto the second encapsulating adhesive layer 6, and the second encapsulating adhesive layer 6 further refracts and diffuses light, so that the light emitting angle of the LED chip 3 is increased; it should be understood that when the first encapsulating adhesive layer 5 is concave, the surface of the second encapsulating adhesive layer 6 close to one side of the first encapsulating adhesive layer 5 protrudes towards the first encapsulating adhesive layer 5, and the protruding portion matches with the concave portion of the first encapsulating adhesive layer 5, as shown in fig. 3 and 4.
It should be understood that one surface of the second encapsulating adhesive layer 6, which is far away from the LED chip 3, is in a spherical convex shape, and forms a convex lens shape, so that light can be diffused, and the light emitting angle of the LED device is increased; wherein, the height of second encapsulation glue film 6 is unrestricted, and that is to say, the outside protruding radian of second encapsulation glue film 6 is unrestricted, and is preferred, and the height of second encapsulation glue film 6 is no longer than LED support 4, and then makes the outside protruding radian of second encapsulation angle in a reasonable within range.
In some examples of this embodiment, the refractive index of the first encapsulation glue layer 5 is higher than the refractive index of the second encapsulation glue layer 6, and the refractive index of the second encapsulation glue layer 6 is higher than the refractive index of air, so that the light emitted by the LED chip 3 reaches the second encapsulation glue layer 6 after being refracted through the first encapsulation glue layer 5, and then reaches the outside through the refraction of the second encapsulation glue layer 6, so that the light emitted from the front surface of the LED chip 3 is refracted all around more, the light emitting angle of the LED device is increased, and the maximum light emitting angle of the LED device can reach 180 °.
In some examples of this embodiment, the LED support 4 is a transparent support; that is, the LED support 4 may be made of a transparent material, such as transparent resin, transparent thermoplastic such as PPA (Polyphthalamide), and transparent thermosetting plastic such as EMC (Epoxy Molding Compound), so that light emitted by the LED chip 3 directly penetrates through the LED support 4 to reach the outside, thereby increasing the light emitting angle of the LED device; it should be understood that in some examples, the LED support 4 may use a material used for a non-transparent support, such as Epoxy resin (EP), high temperature resistant nylon (PPA plastic), Polyphthalamide (PPA, Polyphthalamide), 1, 4-cyclohexanedimethanol terephthalate (PCT, Poly1, 4-cyclohexylenedimethylene terephthalate), Liquid Crystal Polymer (LCP), sheet molding compound (SMC, sheeting molding compound), Epoxy molding compound (EMC, Epoxy molding compound), Unsaturated Polyester (UP) resin, polyester resin (PET), Polycarbonate (PC, Polycarbonate), polyhexamethylene adipamide (nylon66), glass fiber, etc.;
in some examples of the present embodiment, a DBR (distributed bragg reflectors) is disposed in the LED chip 3; for example, the DBR is plated on the front surface of the LED chip 3, so that the front light emitting is reduced, and the light emitting area of the side wall is increased, so that the light emitting angle is increased, the transparent LED support 4 is matched, the light emitting efficiency of the side wall of the LED device is improved, and the whole light emitting efficiency is improved.
In some examples of this embodiment, the upper surface of the LED support 4 is serrated, as shown in fig. 6 and fig. 6-1, the upper surface of the LED support 4 is serrated, so that when the second encapsulant layer 6 is combined with the LED support 4, the combining ability of the second encapsulant layer 6 and the LED support 4 is enhanced; meanwhile, the upper surface of the LED support 4 is serrated, so that the flowability of the second packaging adhesive layer 6 can be limited, and the purpose of controlling the forming of the second packaging adhesive layer 6 is achieved.
In some examples of the present embodiment, the LED chip 3 includes at least one of a red LED chip 3, a green LED chip 3, and a blue LED chip 3; or, the LED chip 3 includes at least one of a red LED chip 3, a green LED chip 3, a blue LED chip 3, and a yellow LED chip 3.
In some examples of the present embodiment, the LED module further includes an insulating isolation strip 7, and the insulating isolation strip 7 is located between the positive electrode substrate 1 and the negative electrode substrate 2 to isolate the positive electrode substrate and the negative electrode substrate from each other, and it should be understood that the material of the insulating isolation strip 7 may be the same as or different from the material of the LED support 4.
The LED device provided by the present embodiment includes: the LED light source comprises a positive electrode substrate, a negative electrode substrate, an LED chip and an LED bracket; the LED support is arranged on the surfaces of the anode substrate and the cathode substrate to surround the anode substrate and the cathode substrate, the LED support, the anode substrate and the cathode substrate form a bowl-shaped structure, and the LED chip is arranged on at least one substrate; the LED support with the bowl-shaped structure that positive pole base plate and negative pole base plate formed is filled in proper order has first encapsulation glue film, second encapsulation glue film, first encapsulation glue film cladding the LED chip, the second encapsulation glue film is kept away from the one side of LED chip is the spherical surface convex shape. The light that is sent through first encapsulation glue film and be spherical convex second encapsulation glue film and handing over LED chip surface is refracted outside the LED device, and the one side that the LED chip was kept away from to the second encapsulation glue film is spherical convex shape and makes the luminous angle increase of LED device, and then has promoted whole luminous angle, when luminous angle promoted, has promoted the luminous luminance of LED device.
Example two:
for better understanding of the present invention, the present embodiment provides a more specific example to illustrate an LED device, as shown in fig. 7, which includes: the LED lamp comprises a positive electrode substrate 1, a negative electrode substrate 2, an LED chip 3 and an LED bracket 4; the LED support 4 is arranged on the surfaces of the anode substrate 1 and the cathode substrate 2 to surround the anode substrate 1 and the cathode substrate 2, the LED support 4, the anode substrate 1 and the cathode substrate 2 form a bowl-shaped structure, and the LED chip 3 is arranged on at least one substrate; a first packaging adhesive layer 5 and a second packaging adhesive layer 6 are sequentially filled in a bowl-shaped structure formed by the LED support 4, the anode substrate 1 and the cathode substrate 2, the LED chip 3 is coated by the first packaging adhesive layer 5, one surface of the second packaging adhesive layer 6, which is far away from the LED chip 3, is in a spherical convex shape, and an insulating isolation belt 7 is arranged between the anode substrate 1 and the cathode substrate 2 to isolate the anode substrate 1 and the cathode substrate 2;
it should be understood that, wherein, the upper surface of the first packaging adhesive layer 5 is flush with the upper surface of the LED support, and the first packaging adhesive layer 5 is far away from the surface of the LED chip 3 is an arc surface concave towards the LED chip 3, and the concave arc surface of the first packaging adhesive layer 5 changes the reflection angle and the refraction angle of light, so that the light can be more easily emitted onto the LED support 4 and the second packaging adhesive layer, thereby making the light emitting of the LED device more uniform and increasing the light emitting angle of the LED device.
It should be understood that the width of the second encapsulating adhesive layer 6 is the same as the width of the upper surface of the bowl-shaped structure, and completely covers the first encapsulating adhesive layer 5, and the surface of the second encapsulating adhesive layer 6 near one side of the first encapsulating adhesive layer 5 protrudes toward the first encapsulating adhesive layer 5, and the protruding portion is matched with the concave portion in the first encapsulating adhesive layer 5.
It should be understood that the surface of the second encapsulant layer 6 away from the LED chip 3 is in a spherical convex shape, forming a convex lens shape, which can diffuse light and further increase the light-emitting angle of the LED device.
It should be understood that the LED support 4 is a transparent support, the upper surface of the LED support 4 is serrated, and the serrated upper surface of the LED support 4 can enhance the bonding capability of the second encapsulating adhesive layer 6 and the LED support 4 when the second encapsulating adhesive layer 6 is bonded with the support; meanwhile, the upper surface of the LED support 4 is serrated, so that the flowability of the second packaging adhesive layer 6 can be limited, and the purpose of controlling the forming of the second packaging adhesive layer 6 is achieved.
Example three:
the present embodiment further provides a backlight module, which includes the LED device and the driving circuit described in the first and/or second embodiments, and the driving circuit is connected to the LED device.
The embodiment also provides a display unit, which comprises the backlight module and a back plate, wherein the driving circuit of the backlight module and the LED device are arranged on the back plate.
It should be understood that the LED provided in the foregoing embodiments can be applied to various light emitting fields, for example, it can be manufactured into a backlight module applied to a display backlight field (which can be a backlight module of a terminal such as a television, a display, a mobile phone, etc.). It can be applied to a backlight module at this time. The display backlight module can be applied to the fields of display backlight, key backlight, shooting, household lighting, medical lighting, decoration, automobiles, traffic and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured. The above applications are only a few applications exemplified by the present embodiment, and it should be understood that the application of the LED in the present embodiment is not limited to the above exemplified fields.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (11)
1. An LED device, comprising: the LED light source comprises a positive electrode substrate, a negative electrode substrate, an LED chip and an LED bracket;
the LED support is arranged on the surfaces of the anode substrate and the cathode substrate to surround the anode substrate and the cathode substrate, the LED support, the anode substrate and the cathode substrate form a bowl-shaped structure, and the LED chip is arranged on at least one substrate;
the LED support with the bowl-shaped structure that positive pole base plate and negative pole base plate formed is filled in proper order has first encapsulation glue film, second encapsulation glue film, first encapsulation glue film cladding the LED chip, the second encapsulation glue film is kept away from the one side of LED chip is the spherical surface convex shape.
2. The LED device of claim 1, wherein a height of the first encapsulant layer within a bowl-shaped structure formed by the LED support and the anode and cathode substrates does not exceed a height of the LED support.
3. The LED device of claim 1, wherein a surface of the first encapsulant layer away from the LED chip is a concave surface that is concave towards the LED chip.
4. The LED device of claim 1, wherein the width of the second encapsulant layer is no greater than the width of the upper surface of the bowl formed by the LED support and the anode and cathode substrates.
5. The LED device of claim 1, wherein the refractive index of the first encapsulant layer is higher than the refractive index of the second encapsulant layer, and the refractive index of the second encapsulant layer is higher than the refractive index of air.
6. The LED device of any of claims 1-5, wherein the LED support is a transparent support.
7. The LED device of claim 6, wherein a distributed bragg reflector layer is disposed in the LED chip.
8. The LED device of any of claims 1-5, wherein the LED support upper surface is serrated.
9. The LED device of any of claims 1-5, wherein the LED chips comprise at least one of red LED chips, green LED chips, and blue LED chips.
10. A backlight module, characterized in that the backlight module comprises at least one LED device according to any one of claims 1-9.
11. A display unit, characterized in that the display unit comprises the LED backlight module according to claim 10.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110665700.2A CN113257980A (en) | 2021-06-16 | 2021-06-16 | LED device, backlight module and display unit |
| JP2023535480A JP7538389B2 (en) | 2020-12-11 | 2021-12-10 | LED BRACKET, LIGHT-EMITTING UNIT, AND LIGHT-EMITTING ASSEMBLY |
| EP21902718.2A EP4261904A4 (en) | 2020-12-11 | 2021-12-10 | LED HOLDER, LIGHT-EMITTING UNIT AND LIGHT-EMITTING ARRANGEMENT |
| US18/266,298 US20240047623A1 (en) | 2020-12-11 | 2021-12-10 | Led bracket, light-emitting unit, and light-emitting assembly |
| KR1020237020528A KR20230107347A (en) | 2020-12-11 | 2021-12-10 | LED bracket, light emitting unit and light emitting assembly |
| PCT/CN2021/137073 WO2022122013A1 (en) | 2020-12-11 | 2021-12-10 | Led bracket, light-emitting unit, and light-emitting assembly |
| JP2024110876A JP2024147639A (en) | 2020-12-11 | 2024-07-10 | LED BRACKET, LIGHT-EMITTING UNIT, AND LIGHT-EMITTING ASSEMBLY |
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| CN202110665700.2A CN113257980A (en) | 2021-06-16 | 2021-06-16 | LED device, backlight module and display unit |
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| CN114063350A (en) * | 2021-10-28 | 2022-02-18 | 联想(北京)有限公司 | Light source module, display module and light source module preparation method |
| CN114089565A (en) * | 2021-12-06 | 2022-02-25 | 武汉创维光显电子有限公司 | Light emitting assembly and backlight module |
| WO2022122013A1 (en) * | 2020-12-11 | 2022-06-16 | 深圳市聚飞光电股份有限公司 | Led bracket, light-emitting unit, and light-emitting assembly |
| CN115551306A (en) * | 2022-09-29 | 2022-12-30 | 深圳市思坦科技有限公司 | A micro light emitting diode packaging structure, packaging method and display device |
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| CN115877612A (en) * | 2022-12-26 | 2023-03-31 | 惠科股份有限公司 | Backlight module and display device |
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