CN110504246A - Light-emitting device and light-emitting device - Google Patents

Abstract

The invention provides a light-emitting device and a light-emitting device. The LED bracket used by the LED includes a substrate and a circuit layer arranged on the substrate and insulated from the substrate, that is, the LED bracket itself is provided with a circuit layer. The circuit that connects the LED chips in the lamp bead area on the substrate to the connection points of other lamp beads and/or other devices on the substrate can be directly connected to other lamp beads or devices through the circuit layer of the LED bracket itself, and does not An additional circuit board is required; the LED device provided by the present invention is also provided with a secondary optical reflective lens on the LED to control the diffusion of the light emitted by the LED chip, so that the light emitted by the LED can be evenly distributed in a wider area , so that the backlight unit made by using the light-emitting device has better light distribution characteristics and light utilization efficiency.

Description

Light-emitting device and light-emitting device

technical field

The present invention relates to the field of LED (Light Emitting Diode, light emitting diode), in particular to a light emitting device and a light emitting device.

Background technique

With the development of LED technology and the application of various scenarios in various fields, LED structures that meet various needs have been produced. In various LED structures, LED brackets are basically used, and in order to meet various needs, LED brackets of various sizes, structures and materials have also been derived. However, the setting of the current LED support structure is only to carry the LED chip, protect the LED chip, and lead out the positive and negative poles of the LED chip. Various current LED brackets do not undertake circuit wiring. When in some application scenarios, it is necessary to electrically connect LEDs to other LEDs or to other devices, the electrical connection can only be realized through additional PCB board circuits.

In addition, when it is necessary to arrange multiple LED chips connected in series or in parallel or in a combination of series and parallel in an LED bracket, the current method can only be to arrange multiple LED chips on the substrate of the bracket, and then additionally pass through the gold wire To realize the connection between LED chips, for example, see a typical existing LED structure shown in Fig. 1-Fig. In the cross-sectional view, in Fig. 1-Fig. 2, assuming that multiple LED chips 11 sequentially connected in series need to be arranged in the LED bracket 1, the current method can only realize the positive and negative polarity of adjacent LED chips 11 on the series circuit through gold wires in sequence. electrical connection between poles. It can be seen from Fig. 1 that by additionally using gold wires at the bottom of the LED bracket to realize the connection between the LED chips 11, there are many and complicated lines to be connected, and the soldering process for realizing the connection is inefficient, and is limited by the size of the LED bracket. Desoldering, virtual soldering or even soldering errors are prone to occur, resulting in high product cost, poor product quality and poor reliability, and what is shown in Figures 1-2 is only the simplest series connection between LED chips 11. If it is necessary to realize the series-parallel hybrid connection between LED chips or other complex connection methods in an LED bracket, it is basically impossible to realize in the current LED bracket structure.

And when an LED is used as a light source, the light is often emitted while being confined to a limited area. Therefore, in order to apply LEDs to planar light sources such as display devices, it is also necessary to uniformly distribute light over a wider area.

Contents of the invention

The main technical problem to be solved by the light-emitting device and light-emitting device provided by the present invention is: to solve the problem that the existing LED cannot bear the circuit wiring and the distribution area of the emitted light is too small and uneven.

In order to solve the above technical problems, the present invention provides a light-emitting device, including an LED and a reflective lens arranged on the LED after the LED is packaged, the LED includes a substrate, is located on the front surface of the substrate and A circuit layer and at least one LED chip insulated from the substrate, a lamp bead area is arranged on the front of the substrate, the LED chip is arranged in the lamp bead area, and the circuit layer includes A circuit in which the LED chip in the lamp bead area on the substrate is connected to other lamp beads and/or connection points of other devices on the substrate;

The reflective lens is located on the substrate, and the reflective lens includes a lens body, a light incident surface located at the lower part of the lens body, a light exit surface located at the side of the lens body, and a light emitting surface located at the upper part of the lens body. The light reflecting surface, the light emitted by the LED chip enters the lens body from the light incident surface, and the light rays whose angle with the optical axis of the LED chip is less than or equal to the first preset angle threshold value are reflected by the light After being reflected by the surface, it emits from the light exiting surface.

In one embodiment of the present invention, the light incident surface is the inner wall surface of the bottom cavity that is concave from the bottom of the lens body, and the light emitted by the LED chip enters the bottom cavity, and passes through the bottom cavity. The inner wall surface of the bottom cavity injects into the lens body;

The light reflection surface is the inner wall surface of the top recess of the lens body concave inward, which is incident into the lens body and has an included angle with the optical axis less than or equal to the first preset The light at the angle threshold is reflected on the light reflecting surface and exits from the light emitting surface.

In an embodiment of the present invention, the light exit surface includes a plurality of convex surfaces extending outward from the side of the lens body.

In one embodiment of the present invention, one LED chip is set in the lamp bead area, or at least two LED chips are set with a distance smaller than the preset first distance threshold to form a point light source, or multiple LED chips are set. A plurality of LED chips with a spacing greater than the preset second distance threshold to form a surface light source.

In an embodiment of the present invention, all the light bead areas on the substrate correspond to one reflective lens, or one light bead area on the substrate corresponds to one reflective lens, or the One LED chip in the lamp bead area corresponds to one reflective lens.

In one embodiment of the present invention, when a plurality of LED chips are arranged in the area of the lamp bead, the plurality of LED chips include at least two kinds of LED chips with different luminous peak wavelengths.

In one embodiment of the present invention, the LED further includes a luminescence conversion layer, a transparent adhesive layer or a diffusion adhesive layer disposed between the LED chip and the reflective lens.

In one embodiment of the present invention, the LED includes a luminescence conversion layer arranged between the LED chip and the refractive lens, and the LED chip in the area of the lamp bead includes any one of the following chips or a combination of at least two:

Blue LED chips with a peak emission wavelength of 440nm to 500nm;

A green LED chip with a luminous peak wavelength of 510nm to 540nm;

Yellow LED chips with a luminous peak wavelength of 550nm to 570nm;

Red LED chips with a luminous peak wavelength above 620nm;

The luminescence conversion layer is a luminescence conversion layer for converting the light emitted by the LED chip into preset color-mixed light.

In an embodiment of the present invention, the preset mixed color light includes white light.

In an embodiment of the present invention, the reflective lens is a circular reflective lens forming a circular light spot, a square reflective lens forming a square light spot, or an elliptical reflective lens forming an ellipse.

In one embodiment of the present invention, the front side of the substrate is further provided with a first functional electrical connection area which is insulated from the substrate itself and electrically connected to the circuit layer, and/or, the back side of the substrate is provided with a The substrate is insulated and isolated, and is a second functional electrical connection area electrically connected to the circuit layer.

In an embodiment of the present invention, the circuit layer further includes a driving circuit and/or a control circuit for controlling the LED chip.

In one embodiment of the present invention, the substrate includes at least two lamp bead areas, and the circuit layer includes LED chips corresponding to the positive pins and negative pins of the LED chips to be placed in the respective lamp bead areas. The positive pin welding area and the negative pin welding area, and a circuit for electrically connecting the at least two lamp bead areas.

In one embodiment of the present invention, there is a lamp bead area on the substrate, and the circuit layer includes positive pins corresponding to the positive pins and negative pins of the LED chips to be placed in the lamp bead area, respectively. The pin welding area and the negative pin welding area; the lamp bead area is used to place one LED chip or at least two LED chips.

In one embodiment of the present invention, at least two LED chips are arranged in at least one of the lamp bead regions, and the circuit layer further includes a chip connection circuit for realizing electrical connection between LED chips in the lamp bead region; The at least two LED chips are connected through the chip connection circuit.

In order to solve the above problems, the present invention also provides a light emitting device, comprising the above light emitting device, the light emitting device is an illuminating device, an optical signal indicating device, a supplementary light device or a backlight device.

The beneficial effects of the present invention are:

In the light-emitting device and light-emitting device provided by the present invention, firstly, the LED bracket used by the LED includes a substrate and a circuit layer arranged on the substrate and insulated from the substrate, that is, the LED bracket itself is provided with a circuit layer, and the circuit layer includes It is a circuit that connects the LED chip in the lamp bead area on the substrate to the connection points of other lamp beads and/or other devices on the substrate, so that when it is necessary to electrically connect the LED to other LEDs or to other devices, it can be directly The connection with other lamp beads or devices is realized through the circuit layer of the LED bracket itself, and no additional circuit board is required, which not only simplifies the connection structure, but also avoids the increase in size and cost caused by the use of circuit boards, and can be used better. in various application scenarios;

In addition, in the LED device provided by the present invention, after the LED package is completed, a reflective lens (that is, a secondary optical reflective lens) is arranged on the LED to control the diffusion of the light emitted by the LED chip, so that the LED emits The light can be evenly distributed in a wider area, so that the backlight unit made by using the LED device has better light distribution characteristics and light utilization efficiency.

Description of drawings

Fig. 1 is a top view of an LED structure;

Fig. 2 is a top view of the LED structure in Fig. 1;

Fig. 3 is a schematic diagram of the structure of the LED bracket with the circuit layer higher than the front of the substrate provided by Embodiment 1 of the present invention;

Fig. 4 is a schematic structural diagram of an LED bracket in which the circuit layer is flush with the front of the substrate provided by Embodiment 1 of the present invention;

Fig. 5 is a schematic structural diagram of an LED bracket with an insulating layer as a whole structure provided by Embodiment 1 of the present invention;

Fig. 6 is a schematic structural diagram of an LED bracket in which the shape of the insulating layer and the circuit layer are adapted according to Embodiment 1 of the present invention;

Figure 7-1 is a schematic structural diagram of an LED provided in Embodiment 1 of the present invention;

Figure 7-2 is a cross-sectional view in the width direction of a reflective lens in Figure 7-1;

Fig. 7-3 is a longitudinal sectional view of a reflective lens in Fig. 7-1;

Figure 7-4 is a cross-sectional view in the width direction of three reflective lenses in Figure 7-1;

Figure 7-5 is a longitudinal sectional view of three reflective lenses in Figure 7-1;

Figure 7-6 is a cross-sectional view in the width direction of nine reflective lenses in Figure 7-1;

Figure 7-7 is a longitudinal sectional view of nine reflective lenses in Figure 7-1;

Figure 8-1 is a schematic diagram of the combination of reflective lens and LED provided by the third embodiment of the present invention;

Figure 8-2 is a perspective view of the reflective lens in Figure 8-1;

Fig. 8-3 is a perspective view of another reflective lens in Fig. 8-1;

Figure 8-4 is a schematic cross-sectional view of the reflective lens in Figure 8-2;

Fig. 8-5 is a schematic diagram of the light spot emitted by the reflective lens in Fig. 8-2;

Figure 9-1 is a schematic diagram of the combination of reflective lens and LED provided by Embodiment 3 of the present invention;

Figure 9-2 is a schematic diagram of the optical path of the reflective lens in Figure 9-1;

Fig. 10-1 is a front view of another reflective lens provided by Embodiment 3 of the present invention;

Figure 10-2 is a schematic diagram of the combination of reflective lens and LED in Figure 10-1;

Figure 10-3 is a schematic diagram of the optical path of the reflective lens in Figure 10-2;

Fig. 11-1 is a schematic diagram of the combination of another reflective lens and LED provided by Embodiment 3 of the present invention;

Figure 11-2 is a perspective view of the reflective lens in Figure 11-1;

Figure 11-3 is a perspective view of another reflective lens in Figure 11-1;

Figure 11-4 is a schematic cross-sectional view of the reflective lens in Figure 11-2;

Fig. 12-1 is a schematic structural diagram of an LED with multi-chip series-parallel connection provided by Embodiment 3 of the present invention;

Figure 12-2 is a sectional view of the LED shown in Figure 12-1;

Among them, the reference numeral 1 in Fig. 1-Fig. 2 is the LED bracket, 11 is the LED chip; the reference numeral 31 in Fig. 3 is the substrate, and 32 is the circuit layer; the reference numeral 41 in Fig. 4 is the substrate, 42 is the circuit layer; the reference numeral 51 in Fig. 5 is the substrate, 52 is the circuit layer, and 53 is the insulating layer; the reference numeral 61 in Fig. 6 is the substrate, 62 is the circuit layer, and 63 is the insulating layer; Fig. 7-1 -In Figure 7-7, 911 is the substrate, 912 is the LED chip, 913 is the reflective lens; in Figure 8-1-Figure 8-4, 90 is the lens body, 901 is the bottom cavity, 9011 is the light incident surface, 902 is the light reflection surface in the top cavity, 903 is the light exit surface, 904 is the leg, 91 is the substrate, and 911 is the light emitting part; in Figure 9-1-9-2, 100 is the lens body, 1001 is the light incident 1002 is the light reflection surface, 1003 is the light exit surface, 101 is the substrate, and 1011 is the light emitting part; in Figure 10-1-Figure 10-3, 110 is the lens body, 1101 is the light incident surface, and 1102 is the light reflection surface , 1103 is a light exit surface, 111 is a substrate, and 1111 is a light-emitting part; among Figures 11-1-11-4, 120 is a lens body, 1201 is a light incident surface, 1202 is a light reflection surface, and 1203 is a light exit surface 1204 is a leg, 121 is a substrate, 1211 is a light-emitting part; reference numeral 181 in Fig. 12-1-Fig. 12-2 is a conductive substrate, 182 is a circuit layer, 183 is an insulating layer, 1813 is a dam, and 180 is an LED Chip, 1821 is the pin welding area, 187 is the white oil layer.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below through specific implementation manners in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

Embodiment one:

In order to solve the problems that the existing LED bracket can only protect the LED chip and lead out the positive and negative poles of the LED chip, but cannot bear the circuit wiring, this embodiment provides an LED bracket, The LED bracket provided in this embodiment has its own circuit, which can meet the requirements of connecting the LED chip to be placed in the lamp bead area on the substrate with other lamp beads (it can be other lamp beads on the same substrate, or it can be in other lamp beads) lamp beads formed on the substrate) and/or other devices on the substrate (in theory, it can be any other device, including but not limited to various chips, resistors, capacitors and other circuit devices, etc., and these devices can be set on the substrate A circuit connected to a connection point (which can be a variety of electrical connection points) that is integrated with the LED package, or not arranged on the substrate, and can be located outside the LED bracket. When the LED needs to be electrically connected to other LEDs or to other devices, it can be directly connected to other lamp beads or devices through the circuit layer of the LED bracket itself, without additional circuit boards, which can simplify the connection structure. In addition, the increase in size and cost caused by the use of circuit boards can be avoided.

In addition, in the LED device provided by this embodiment, after the LED packaging is completed, a reflective lens (that is, a secondary optical reflective lens) is provided on the obtained LED lamp bead to control the diffusion of the light emitted by the LED chip. The light emitted by the LED can be evenly distributed in a wider area, so that the backlight unit made by using the LED device has better light distribution characteristics and light utilization efficiency.

In this embodiment, when multiple LED chips need to be arranged in one lamp bead area, the circuit layer can also include a circuit for realizing the electrical connection between the LED chips in the lamp bead area, without additionally using a PCB outside the LED The electrical connection between the LED chips can be realized through the gold wire on the board or in the LED bracket. The use of the LED bracket can greatly improve the reliability, versatility and yield rate of LED products, and reduce the cost of LED products.

In this embodiment, a lamp bead area on the front of the substrate refers to the area where LED chips are arranged on the front of the substrate to form a lamp bead, and it should be understood that the lamp bead on the front of the substrate in this embodiment The bead area refers to the space located above the front of the substrate, including the lamp bead area set directly on the substrate, and also including the lamp bead area set on the insulating layer or circuit layer on the substrate, and can be flexibly set according to the application scenario.

For ease of understanding, the structure of the LED used in the LED device will be illustrated below in this embodiment.

The LED bracket provided in this embodiment includes a substrate and a circuit layer arranged on the substrate and insulated from the substrate. The circuit connected to the connection points of other devices on the substrate may also optionally include a positive pin welding area and a negative pin welding area connected to the positive pin and the negative pin of the LED chip respectively; in this way, when the LED chip is set, It is also only necessary to connect the positive and negative pins of the LED chip to the corresponding positive pin welding area and the negative pin welding area on the circuit layer, and the connection relationship between the LED chips can also be determined in advance by the circuit layer. Set up a good circuit implementation. Of course, in this embodiment, the circuit layer may also not include the positive lead pad and the negative lead pad, but the positive lead pad and the negative pin pad are arranged on other layer structures (such as a substrate) in the support. ), as long as the corresponding electrical connections between the positive pin pads and the negative pin pads are realized with the circuit layer.

It should be understood that, in this embodiment, the insulation and isolation manner between the circuit layer and the substrate can be flexibly set. For example, when the substrate itself is an insulating substrate, the circuit layer can be directly arranged on the substrate, and at this time, the circuit layer and the substrate are in an insulating and isolated state; An insulating layer is provided between the layers. For another example, when the substrate is a conductive substrate, an insulating layer can be provided between the substrate and the circuit layer, or insulation can be realized by other arbitrary insulation isolation methods (such as setting a specific structure to separate the circuit layer from the front of the substrate). isolation.

In this embodiment, the conductive substrate can be a substrate made of various conductive materials, such as various metal conductive substrates, including but not limited to copper substrates, aluminum substrates, and iron substrates; the conductive substrate can also be a mixture of conductive materials. Material Conductive substrate, such as conductive rubber, etc.

In this embodiment, the insulating substrate may be a substrate made of various insulating materials, of course, it may also include a substrate containing conductive materials inside, an outside made of insulating materials, and a non-conductive substrate as a whole. For example, insulating materials may include but not limited to epoxy resin (EP, Epoxide resin), high temperature resistant nylon (PPA plastic), polyphthalamide (PPA, Polyphthalamide), polyterephthalic acid 1,4-ring Hexanedimethanol ester (PCT, Poly1,4-cyclohexylenedimethylene terephthalate), epoxy molding compound (EMC, Epoxy molding compound), unsaturated polyester (UP) resin, liquid crystal polymer (LCP, Liquid Crystal Polymer), flake Molding compound (SMC, Sheet molding compound), polyester resin (PET, Polyethylene terephthalate), polycarbonate (PC, Polycarbonate), polyhexamethylene adipamide (nylon 66).

In this embodiment, the substrate can be a planar substrate, or a non-planar substrate with a raised structure or a concave structure on the front, and the corresponding raised areas and sunken areas can be used to set LED chips, that is, raised The area or the concave area can be used as the die-bonding area. Moreover, in this embodiment, the whole or part of the raised area or the sunken area may be covered with the circuit layer, or may not be covered with the circuit layer, which can be flexibly set according to actual needs and application scenarios. In addition, it should be understood that the circuit layer in this embodiment may also be a circuit layer that is generally planar, or a circuit layer that is generally non-planar with a raised structure or a concave structure in some areas, and these raised areas or The recessed area can also be used to place LED chips, that is, as a die-bonding area.

In this embodiment, the upper surface of the circuit layer on the substrate and the front of the substrate can be arranged flush, or higher than the front of the substrate, or lower than the front of the substrate, depending on the process used to make the LED bracket and the specific application scenario. and other factors can be set flexibly.

For example, in an exemplary structure, the circuit layer is higher than the front surface of the substrate, as shown in FIG. 3 , in which the circuit layer 32 is higher than the upper surface of the substrate 31 (ie, the front surface of the substrate). In another example, as shown in FIG. 4 , the circuit layer 42 is flush with the upper surface of the substrate 41 in FIG. 4 . Which structure to choose can be flexibly determined.

In addition, it should be understood that, in this embodiment, when an insulating layer needs to be added between the substrate and the circuit layer, and the insulating layer is used to insulate and isolate the substrate and the circuit layer, the provided insulating layer The entire area corresponding to the circuit layer on the substrate can be directly covered, and the insulating layer at this time is an integral structure; for example, as shown in FIG. The area corresponding to the circuit layer 52 on the substrate 51 is covered. In this embodiment, the insulating layer may also be adapted to the shape of the circuit layer, as long as the circuit layer and the substrate can be reliably insulated and isolated. For example, referring to Fig. 6, an insulating layer 63 is arranged between the substrate 61 and the circuit layer 62, the insulating layer 63 matches the shape and size of the circuit layer 62, and the insulating layer 63 does not cover the area not covered by the circuit layer 62; Of course, the arrangement of the insulating layer in this embodiment is not limited to the manner shown in Fig. 5 and Fig. 6. On the basis of realizing reliable insulation and isolation between the circuit layer and the substrate, the covered area and specific shape can be arbitrary. set up.

In addition, it should be understood that, in this embodiment, the process used when the insulating layer is disposed on the substrate can be flexibly selected, for example including but not limited to printing, pressing, pasting and so on. Correspondingly, the bonding method between the circuit layer and the insulating layer may also include, but not limited to, pressing, pasting, and directly printing the circuit layer on the insulating layer. In this embodiment, the insulating layer can use various insulating materials for insulation and isolation, such as including but not limited to insulating varnish, insulating glue, insulating paper, insulating fiber products, plastics, rubber, varnished paper, glass, ceramics, and the like.

In this embodiment, when the circuit layer includes a positive pin pad and a negative pin pad, the specific distribution positions and distribution methods of the positive pin pad and the negative pin pad on the circuit layer can be flexibly set. In addition, the circuit included in the circuit layer to realize the circuit between the LED chips may include at least one of the circuits that realize the serial connection, the parallel connection, and the series-parallel hybrid connection between the LED chips, and may specifically be based on the application scenarios of the LED bracket and The needs can be set flexibly.

The LED used in the LED device in this embodiment may be the LED manufactured by the LED bracket with its own circuit in the above example. And it should be understood that in this embodiment, the number of lamp bead areas on the substrate and the number of LED chips in each lamp bead area can be flexibly set, and one lamp bead area can include one crystal-bonding area, Multiple die-bonding areas can also be included as required. For example, in one example, the LED is a point light source. At this time, one LED chip can be arranged in the lamp bead area to form a point light source, or at least two LED chips can be arranged in the lamp bead area, but the at least two LED chips set The distance between the LED chips (such as two or three) is smaller than the preset first distance threshold to form a point light source. For another example, in some examples, LEDs provide a surface light source (or called a block light surface), and at this time, the distance between multiple LEDs (such as two, five, ten, etc.) can be greater than the preset second in the lamp bead area. The distance from the threshold to form multiple LED chips of a surface light source.

For example, in one example, at least two lamp bead areas may be included on the substrate, and the circuit layer includes a positive pin welding area and a Negative pin welding area, and a circuit for electrically connecting at least two lamp bead areas.

For another example, in one example, a lamp bead area is provided on the substrate, and the circuit layer includes a positive electrode pin welding area and a negative electrode lead respectively corresponding to the positive electrode pin and the negative electrode pin of the LED chip to be placed in the lamp bead area. Foot welding area.

For another example, in one example, at least two LED chips are arranged in at least one lamp bead area, and the circuit layer can also include a chip connection circuit that realizes the electrical connection between the LED chips in the lamp bead area; at least two LED chips The connection is realized through the chip connection circuit.

In this embodiment, the number of reflective lenses arranged on the substrate can also be flexibly set. It should be understood that, in this embodiment, the lens is arranged on the substrate, not just referring to the fact that the lens is directly in contact with the substrate. A setting method, but means that the main body of the lens is located on the substrate in space, and the lens can be directly arranged on the substrate or on the circuit layer or the insulating layer or the light-emitting conversion adhesive layer on the substrate, or the lower end of the lens and the Lens side contacts form fixation etc.

In this embodiment, the reflective lens provided on the LED is a secondary optical reflective lens, that is, after the LED is packaged, the primary lens is separately pasted on the obtained LED bead. Specific mounting methods include but are not limited to pasting and other methods. And in this embodiment, the reflective lens can be a circular reflective lens forming a circular light spot, a square reflective lens forming a square light spot, or an elliptical reflective lens forming an ellipse according to requirements.

The material, shape and size of various types of lenses in this embodiment can also be flexibly determined. For example, silica gel lenses, PMMA (polymethyl methacrylate, commonly known as: acrylic) lenses, PC (Polycarbonate, polycarbonate) lenses, glass lenses and the like can be used.

In addition, in this embodiment, in addition to the flexible setting of the number of LED chips in the lamp bead area on the substrate, the combination of the luminous peak wavelength (that is, the color) and the luminous peak wavelength (that is, the combination of colors) of the LED chips set etc. can also be set flexibly. For example, the LED chips provided on the substrate in this embodiment may include any one of the following chips, or any combination of two or more:

Blu-ray chip with peak emission wavelength between 440nm and 500nm;

Green chip with peak emission wavelength between 510nm and 540nm;

Yellow light chips with peak emission wavelengths between 550nm and 570nm;

A red light chip with a luminous peak wavelength greater than 620nm.

However, it should be understood that the above four chips are only an example in this embodiment, and are not limited to the above four chips.

In this embodiment, when the LED chips arranged on the substrate are one of the four types of chips in the above examples, and the number of LED chips arranged on the substrate is at least two, the peak luminous value of the at least two LED chips The wavelengths can be the same (for example, they are all blue light chips with a light emission peak wavelength of 440nm, 445nm or 450nm, etc.), or they can be different (for example, some of them are blue light chips with a light emission peak wavelength of 440nm, 445nm or 450nm, and the other part is a blue light chip with a light emission peak wavelength of 455nm). , 465nm or 480nm Blu-ray chip, etc.).

In this embodiment, when the LED chips arranged on the substrate are two or more of the four types of chips in the above examples, it may specifically include two, three or four types, and the specific combination methods include but are not limited to the above examples Any combination of the four chips. For example, when two types are included, it can be a blue chip and a green chip, or a blue chip and a red chip, or a green chip and a yellow chip; when three types are included, it can be a blue chip, a green chip and a red chip. The chip can also be a yellow light chip, a blue light chip and a red light chip, or a blue light chip, a green light chip and a yellow light chip, etc. And according to the above analysis, it can be seen that the peak wavelengths of light emitted by each chip can be the same or different. For ease of understanding, this embodiment will be described below in conjunction with several specific examples.

In an example, the LED chips in the lamp bead area are provided with one type of chip and have the same luminous peak wavelength, for example, a blue LED chip with a luminous peak wavelength of 500nm, or a green LED chip with a luminous peak wavelength of 530nm.

In one example, the LED chip in the lamp bead area is provided with one kind of chip and at least two types of LED chips with peak luminous wavelengths, for example, blue LED chips with peak luminous wavelengths of 450nm and 500nm, or a peak luminous wavelength of 550nm , 560nm and 570nm yellow light chips.

In another example, the LED chips in the lamp bead area are provided with two types of chips, and the luminous peak wavelength of each chip is the same, for example, if a red LED chip and a blue LED chip are used, the luminous peak wavelength of the red LED chip is Both are 650nm, and the luminous peak wavelength of the blue LED chip is 450nm.

In another example, the LED chips in the lamp bead area are provided with two types of chips, and at least one of the chips has different luminous peak wavelengths. For example, a yellow LED chip and a green LED chip are used, and the luminous peak wavelength of the yellow LED chip The wavelengths are all 560nm, the luminous peak wavelength of some green LED chips is 530nm, and the luminous peak wavelength of another part of green LED chips is 540nm.

In another example, the LED chips in the lamp bead area are provided with three types of chips, and the luminous peak wavelengths of each chip are the same, for example, blue LED chips, green LED chips and red LED chips are used, and the blue LED chip The luminous peak wavelength of the green LED chip is 480nm, the luminous peak wavelength of the green LED chip is 535nm, and the luminous peak wavelength of the red LED chip is 620nm.

In another example, the LED chips in the lamp bead area are provided with three types of chips, and at least one of the chips has a different luminous peak wavelength, for example, a blue LED chip, a green LED chip and a red LED chip are used, and the blue LED chip The luminous peak wavelength of some green LED chips is 480nm, the luminous peak wavelength of some green LED chips is 535nm, the luminous peak wavelength of another part of green LED chips is 540nm, the luminous peak wavelength of some red LED chips is 620nm, and the other part of red LED chips The emission peak wavelength of the chip is 650nm.

In another example, the LED chips in the lamp bead area are provided with four types of chips, and each chip has the same luminous peak wavelength. For example, blue LED chips, green LED chips, yellow LED chips and red LED chips are used. Chip, the peak luminescence wavelength of the blue LED chip is 480nm, the peak luminescence wavelength of the green LED chip is 536nm, the luminescence peak wavelength of the yellow LED chip is 570nm, and the luminescence peak wavelength of the red LED chip is 625nm.

During the LED packaging process, a luminescence conversion layer, a transparent adhesive layer or a diffusion adhesive layer can also be formed between the LED chip and the lens by means of molding, spraying, dispensing, etc. That is to say, the color of the light irradiated by the LED provided in this embodiment and presented to the user can be flexibly set according to actual needs and application scenarios. The color of the light irradiated by the LED and presented to the user can be determined according to the peak wavelength of the light emitted by the LED chip itself and the specific luminescence conversion layer used when the luminescence conversion layer is used.

For ease of understanding, several examples of combinations of LED chips and luminescence conversion layers are described below.

As can be seen from the above analysis, the LED chips in the lamp bead area in this embodiment can be any one or a combination of at least two of the four types of chips in the above examples, so any one of the above four types of chips can be used in this embodiment A combination of one or at least two, combined with the luminescence conversion layer to generate preset mixed color light, will be described as an example. And it should be understood that the preset mixed color light in this embodiment can be flexibly set according to specific requirements, for example, it can be white light, magenta light, cyan light, blue-white light and so on. In the following, white light is taken as an example for illustration.

For example, when the LED chip in the lamp bead area is any one of the four chips in the above examples, if it is a blue light chip (for example, the peak wavelength of light emission is 450nm), the light emission conversion layer at this time can use a yellow phosphor glue layer, Yellow fluorescent film or yellow quantum dot QD film; if it is a green light chip, the luminescence conversion layer at this time can be made of a phosphor adhesive layer, fluorescent film or blue quantum dots and A QD film made by mixing red quantum dots; if it is a yellow light chip, the luminescence conversion layer at this time can use a phosphor powder adhesive layer made of blue phosphor powder, a fluorescent film or a QD film made of blue quantum dots, If it is a red light chip, the luminescence conversion layer at this time can be a phosphor powder adhesive layer made by mixing blue phosphor and green phosphor, a fluorescent film or a QD film made by mixing blue quantum dots and green quantum dots .

For another example, when the LED chip in the lamp bead area is a combination of any two of the four chips in the above examples, if it is a combination of a blue chip and a green chip, the luminescence conversion layer at this time can be made of red phosphor Phosphor adhesive layer, fluorescent film or QD film made of red quantum dots; if it is a combination of blue chip and red chip, the luminescence conversion layer at this time can use phosphor adhesive layer and fluorescent film made of green phosphor Or a QD film made of green quantum dots; if it is a combination of a blue chip and a yellow chip, the luminescence conversion layer at this time can be a phosphor glue layer made by mixing blue phosphor, green phosphor and red phosphor , fluorescent film or QD film made by mixing blue quantum dots, green quantum dots and red quantum dots, and so on.

For another example, when the LED chip in the lamp bead area is a combination of any three of the four chips in the above examples, if it is a combination of blue chips, green chips and red chips, the luminescence conversion layer at this time can use blue chips. Phosphor glue layer, fluorescent film or blue quantum dots, green quantum dots and red quantum dots mixed to form a QD film; if it is a red light chip, For the combination of the green light chip and the yellow light chip, the luminescence conversion layer at this time can be a phosphor powder glue layer made of blue phosphor powder, a fluorescent film or a QD film made of blue quantum dots. Of course, in some examples, color-mixed light can also be obtained directly through color mixing of the chip itself, for example, white light can be obtained directly through the combination of a blue chip, a green chip and a red chip without using a luminescence conversion layer. Specific settings can be flexibly determined according to application scenarios.

For another example, when the LED chip in the lamp bead area is a combination of the four types of chips in the above examples, the luminescence conversion layer at this time can be made of a phosphor adhesive layer made of blue phosphor, a phosphor film, or blue quantum dots. QD film; of course, it is also possible to mix the white light obtained by directly mixing the light emitted by the blue chip, the green chip and the red chip itself with the white light emitted by the additional white light unit in the lamp bead area to obtain white light. The white light unit It can be obtained by combining at least one LED chip with a luminescence conversion layer, specifically, it can be obtained by using but not limited to any of the above methods.

In this embodiment, the type of light emitted by the LED chip itself can be visible light visible to the naked eye, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light invisible to the naked eye , Infrared light, a luminescence conversion layer can also be provided on the LED chip to convert invisible light to naked eye visible light, so that the light irradiated by the LED is visible to the user. For example, when the light emitted by the LED chip itself is ultraviolet light, if you want the LED to display white light visible to the user, the luminescence conversion layer can be made by mixing red, green, and blue phosphors.

When the luminescence conversion layer is provided in this embodiment, it can at least play the following role: it is one of the decisive factors for the color presented to the user when the light of the LED is irradiated, and it can also protect the LED chip, such as preventing Dust, water, oil, etc. When there is a transparent adhesive layer on the LED chip, the color of the LED light irradiated and presented to the user is the color after the light emitted by multiple LED chips is mixed; for example, the LED includes 3 chips, which are blue light respectively. For LED chips, red LED chips, and green LED chips, when a transparent adhesive layer is set on the three LED chips, the light of the LED is irradiated and the colors presented to the user are blue light, red light, and green light. The color obtained by mixing the three colors of light is white. The transparent adhesive layer is to protect the LED chip, such as dustproof, waterproof, oilproof and so on. When there is a diffusion adhesive layer on the LED chip, the diffusion adhesive layer can be made of inorganic type light diffusing agent and organic type light diffusing agent; when the diffusion adhesive layer is set on the LED chip, the scattering of light can be increased And transmission, while covering the light source of the LED chip and the glare light source, it can make the whole resin emit softer, more beautiful and elegant light, and achieve the comfortable effect of light transmission and opacity; Add the corresponding diffusing powder to the layer.

In this embodiment, the luminescence conversion layer flexibly adopts a phosphor adhesive layer, a fluorescent film or a quantum dot QD (Quantum Dots) film according to specific application scenarios. In this embodiment, the luminescence conversion layer includes a phosphor adhesive layer, a fluorescent film, or a quantum dot QD film; the phosphor adhesive layer and the fluorescent film can be made of inorganic phosphors, which can be inorganic phosphors doped with rare earth elements , wherein the inorganic phosphor is at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphors. The phosphor powder adhesive layer may be formed by uniformly mixing phosphor powder and glue and then curing, and the glue may be photocurable colloid, photosensitive glue, or the like. The production of fluorescent film can be made by uniformly mixing phosphor powder and glue to form phosphor colloid, and then using printing process to evenly print phosphor colloid on the support mold, and finally take it off from the support mold after heating or drying at room temperature form. It should be understood that the above is only an example of a method of manufacturing the phosphor adhesive layer and the fluorescent film, and the manufacturing of the phosphor adhesive layer and the fluorescent film in this embodiment is not limited to the above methods.

Quantum dot QD film can be made of quantum dot phosphor; At least one of GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd(SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI3. The quantum dot QD film can be formed by uniformly mixing quantum dot phosphor powder and glue and then curing. The glue can be photocurable colloid, photosensitive glue, etc. It should be understood that the above is only an example of a fabrication method of the quantum dot QD film, and the fabrication of the quantum dot QD film in this embodiment is not limited to the above method.

In this embodiment, the arrangement of the reflective lens on the substrate can also be flexibly set according to specific requirements. For example, it can be set that all the lamp bead areas on the substrate correspond to a reflective lens. In this case, all the areas on the substrate where LED chips are placed form a large lamp bead area, and a reflective lens can be used at this time. It is also possible to selectively set one lamp bead area on the substrate to correspond to one reflective lens. At this time, when there are multiple lamp bead areas on the substrate, multiple LEDs with reflective lenses are finally formed on one substrate. It is also possible to selectively set one LED chip in the lamp bead area to correspond to one reflective lens. In this case, it can be regarded as an LED with a reflective lens that finally forms multiple single LED chips on the substrate.

For ease of understanding, this embodiment uses a specific structural example to illustrate the arrangement and combination of reflective lenses.

Please refer to FIG. 7-1, assume that there are three columns of LED chips 912 arranged on the substrate 911, and each column of LED chips is composed of a red LED chip, a green LED chip and a blue LED chip. In the figure, structures such as circuit layers, insulating layers, light-emitting conversion adhesive layers or transparent adhesive layers are not shown, but are only for the convenience of simply explaining the arrangement and combination of lenses. In Figure 7-1, X shows the length direction of the substrate, and Y shows the width direction of the substrate; and in this example, it is assumed that the substrate is divided into three lamp bead areas A1, A2, and A3 in the direction of columns.

In one example, all light bead areas on the substrate share a reflective lens. For example, see Figure 7-2 and Figure 7-3, where 7-2 is a cross-sectional view in the width direction after the reflective lens is set in Figure 7-1, and Figure 7-3 is the reflective lens in Figure 7-1. From Figure 7-2 and Figure 7-3, it can be seen from the cross-sectional view in the longitudinal direction that the lamp bead areas A1, A2, and A3 share a reflective lens 913, that is, in this example, only one reflective lens 913 is provided on the substrate 911 .

In an example, one light bead area on the substrate corresponds to one reflective lens. For example, see Figure 7-4 and Figure 7-5, where 7-4 is a cross-sectional view in the width direction after the reflective lens is set in Figure 7-1, and Figure 7-6 is the reflective lens in Figure 7-1. From the cross-sectional view in the longitudinal direction, it can be seen from Figures 7-4 and 7-5 that each of the lamp bead areas A1, A2, and A3 is provided with a reflective lens 913. At this time, 3 reflective lenses are provided on the substrate 911. The three reflective lenses can be independent lenses, or can be combined into one lens module according to requirements.

In one example, one LED chip in the lamp bead area on the substrate (it should be understood that the number can be flexibly set, and this is just an example) corresponds to one reflective lens. For example, see Figure 7-6 and Figure 7-7, where 7-5 is a cross-sectional view in the width direction after the reflective lens is set in Figure 7-1, and Figure 7-7 is the reflective lens in Figure 7-1 From the cross-sectional view in the longitudinal direction, it can be seen from Figures 7-4 and 7-5 that each LED chip in the lamp bead areas A1, A2, and A3 is respectively provided with a reflective lens 913. At this time, a reflective lens 913 is provided on the substrate 911 9 reflective lenses, these 9 reflective lenses can be combined into one lens module, or can be independent of each other, or use three lens modules in columns, each lens module has three lens modules in the column direction lens.

It should be understood that the arrangement and combination of lenses in the above example is only an example, and can be flexibly selected to be used alone or in combination according to specific application scenarios.

Embodiment two:

In order to facilitate understanding, this embodiment further exemplifies the present invention by combining several example structures of reflective lenses.

It should be understood that the reflective lens structure illustrated in this embodiment is only an example structure for illustrating the idea of the present invention, and is not limited to the following specific structures. And it should be understood that, in this embodiment, the specific size, material and combination method of the lens and the LED can be flexibly selected.

The reflective lens illustrated in this embodiment includes a lens body, a light incident surface at the bottom of the lens body, a light exit surface at the side of the lens body, and a light reflection surface at the top of the lens body. The light emitted by the LED chip of the LED is from the light incident surface. The light entering the lens body and having an included angle with the optical axis of the LED chip less than or equal to the first preset angle threshold is reflected by the reflective surface and then emitted from the light exit surface; while the included angle with the optical axis of the LED chip is greater than The light at the first preset angle threshold is generally directly emitted from the light exit surface.

It should be understood that the first preset angle threshold in this embodiment can be flexibly set according to specific application requirements, for example, it can be set to 60°, 59°, 58°, 55°, 50°, 40°, etc. It can be set to a value greater than 60° according to requirements. In this embodiment, it is said that the light emitted by the LED chip enters the lens body from the light incident surface, and the part of the light that has an included angle with the optical axis of the LED chip that is less than or equal to the first preset angle threshold is a small-angle light, and the light that is greater than the first The part of the rays with the preset angle threshold is the large-angle rays.

The optical axis of the LED chip in this embodiment, when only one LED chip is arranged on the substrate, then the optical axis here is the optical axis of the LED chip; when multiple LED chips are arranged on the substrate, then The optical axis of the light-emitting surface composed of a plurality of LED chips can be used as the optical axis of each LED chip.

The arrangement positions of the light incident surface, the light reflecting surface, and the light exiting surface of the lens are not limited to the above-mentioned example positions.

And it should be understood that, in this embodiment, the shape of the light spot formed by the light emitted by the LED after passing through the lens can also be flexibly set according to the specific application scene, for example, it can be formed as a circular light spot, and the lens at this time can also be formed as a circle. A circular lens with a shaped spot can also form a square spot according to the requirements. At this time, the lens can use a square lens that forms a square spot; it can also be formed into other shapes of spots according to the needs. At this time, the corresponding structural shape of the lens Make corresponding adjustments.

In this embodiment, the formation method of the light incident surface at the lower part of the lens body and the specific shape of the light incident surface can also be flexibly set. For example, in one example, the bottom of the lens body has a concave cavity, which is called the bottom cavity in this embodiment, and the inner wall of the bottom cavity serves as the light incident surface, and the light emitted by the LED chip enters the bottom In the concave cavity, the light enters the lens body through the incident surface. However, it should be understood that the bottom of the lens body may not be provided with a recess, but may be directly set as a plane, and the area surface corresponding to the LED light incident area is the light incident surface.

In an example of this embodiment, the light reflecting surface is the inner wall surface of the top cavity of the lens body whose top is concave inward, and the light incident into the lens body is reflected on the light reflecting surface and emitted from the light exiting surface. In this embodiment, the light exit surface can be selected as at least a part of the sides connecting the bottom surface and the top surface of the lens body; and in order to further adjust the exit angle of the light incident on the light exit surface, the light exit surface can also include a A plurality of convex surfaces extending outside the side of the lens body can further adjust the outgoing angle of the light to make the light distribution more uniform.

For ease of understanding, the present invention will be further illustrated below in conjunction with several specific structures shown in the accompanying drawings.

Please refer to Figures 8-1 to 8-5, where 90 is the lens body, 901 is the bottom cavity, 9011 is the light incident surface, 902 is the light reflection surface in the top cavity, 903 is the light exit surface, 91 It can be a substrate, or a carrier plate for carrying LEDs, and 904 is a leg; 91 can be a substrate 911, which is the LED chip part for emitting light set on the substrate (this example is called a light emitting part, that is, a lamp bead The corresponding part of the area), this part may include a luminescence conversion adhesive layer, and in some examples it may not have a luminescence conversion adhesive layer.

In FIG. 8-1 , the light emitting portion 911 on the substrate 91 is disposed in the bottom cavity 901 . The interior of the bottom cavity 901 is hollow, and of course, in some examples, it is not excluded that the interior of the bottom cavity 901 is filled with a corresponding medium. The inner wall surface of the bottom cavity 901 constitutes a light incident surface 9011, which can be rotationally symmetrical with the reference optical axis of the LED as the axis center; of course, it can also be arranged as an asymmetric structure. The light reflection surface 902 also has an axisymmetric curved surface about the reference optical axis. At least a part of the side surface of the lens body 90 is the light exit surface 903. The specific distribution position and area size of the light exit surface 903 on the side surface are affected by factors such as the light reflection surface, the light incident surface, and the lens material used. Therefore, it can be determined according to specific application scenarios. Flexible confirmation.

When working, the light emitted by the light emitting part 911 enters the bottom cavity 901, and enters the lens body through the light incident surface 9011. The small-angle light is reflected at the reflective surface 902 to the light exit surface 903, and passes through the light exit surface 903. out of the lens body. Light rays with a large angle directly exit the lens body from the light exit surface 903 . The schematic diagram of the optical path is shown in Figure 8-5, that is, the lens changes the direction of the light emitted from the LED, that is, the light is diffused by turning the light in a direction close to the direction perpendicular to the reference optical axis of the LED.

Please refer to Figure 8-2 to Figure 8-5, which shows a product schematic diagram of a reflective lens with the cross-sectional structure shown in Figure 8-1. In an example, the LED shown in Figure 8 is set -2 to the lens shown in FIG. 8-4 , the lens can be fixed by cooperating with the corresponding adhesive layer or the corresponding buckle hole or other structures on the base plate or the carrier plate through the feet 904 . However, it should be understood that the supporting feet 904 are not a necessary structure, and the supporting feet 904 may not be provided. Moreover, the number of 904 and the specific structure of 904 can also be flexibly changed according to specific application scenarios. The schematic diagrams of the light spots emitted by the reflective lens shown in Figures 8-1 to 8-4 are shown in Figure 8-5.

Please refer to Figure 9-1 to Figure 9-2, which are schematic diagrams of reflective lenses with another cross-sectional structure. Wherein 100 is the lens body, 1001 is the light incident surface (also can be formed by the cavity at the bottom of the lens body), 1002 is the light reflection surface (also can be formed by the cavity at the top of the lens body), 1003 is the light exit surface, 101 is The substrate, 1011 is the part of the LED chip used to emit light (called the light emitting part in this example) disposed on the substrate.

In FIG. 9-1 , the light emitting part 1011 of the LED on the substrate 101 is disposed in the cavity at the bottom. The interior of the bottom cavity is hollow, and of course, in some examples, it is not excluded that the interior of the bottom cavity is filled with a corresponding medium. The inner wall surface of the bottom cavity constitutes the light incident surface 1001 . At least a part of the side surface of the lens body 100 is the light exit surface 1003, and the specific distribution position and area size of the light exit surface 1003 on the side surface are affected by factors such as the light reflection surface, the light incident surface, and the lens material used, so it can be determined according to specific application scenarios. Flexible setting, for example, it is possible to set the entire side as the light exit surface, or part of the side as the light exit surface.

When working, as shown in Figure 9-2, the light emitted by the light-emitting part 1011 of the LED enters the bottom cavity, and enters the lens body through the light incident surface 1001, and then the small-angle light is reflected at the light reflecting surface 1002 To the light exit surface 1003, the light exits the lens body through the light exit surface 1003, and the light with a large angle directly exits the lens body from the light exit surface 1003. The direction of the light emitted from the LED is changed through the reflective lens, so that the light emitted by the LED is evenly distributed in a wider range.

Please refer to FIG. 10-1 to FIG. 10-3 , which are schematic diagrams of reflective lenses with another cross-sectional structure provided in this embodiment. Wherein 110 is the lens body, 1101 is the light incident surface (also can be formed by the cavity at the bottom of the lens body), 1102 is the light reflection surface (also can be formed by the cavity at the top of the lens body), 1103 is the light exit surface, 111 is The substrate, 1111 is the part of the LED chip on the substrate for emitting light (referred to as the light-emitting part in this example), which may include a light-emitting conversion adhesive layer, and in some examples it may not have a light-emitting conversion adhesive layer. The light exit surface 1103 of the lens body shown in FIGS. 10-1 to 10-3 includes a plurality of convex surfaces extending outward from the side of the lens body.

During operation, as shown in Figure 10-3, the light emitted by the light-emitting part 1111 of the LED enters the cavity at the bottom, enters the lens body through the light incident surface 1101, and then is reflected at the light reflecting surface 1102 until the light exits. The surface 1103 exits the lens body through the light exit surface 1103 . The direction of the light emitted from the LED is changed through the reflective lens, so that the light emitted by the LED is evenly distributed in a wider range.

Please refer to FIG. 11-1 to FIG. 11-4 , which are schematic diagrams of reflective lenses with another cross-sectional structure provided in this embodiment. Wherein 120 is a lens body, 1201 is a light incident surface, 1202 is a light reflection surface (also can be formed by the recess on the top of the lens body), 1203 is a light exit surface, 1204 is a leg, 121 is a base plate, and 1211 is a set on the base plate The part of the LED chip used to emit light (referred to as the light emitting part in this example), this part may include a luminescence conversion adhesive layer, and in some examples it may not have a luminescence conversion adhesive layer.

When working, the light emitted by the light-emitting part 1211 of the LED enters the bottom cavity, and enters the lens body through the light incident surface 1201, and then reflects at the light reflecting surface 1202. out of the lens body. The direction of the light emitted from the LED is changed through the reflective lens, so that the light emitted by the LED is evenly distributed in a wider range.

It can be seen that the LED device obtained by combining the LED and the reflective lens in this embodiment can obtain more evenly distributed light in a wider range. Therefore, the LED device can be used as a light source module of a backlight unit to be applied in various backlight application scenarios, so as to provide users with better visual effects and experiences.

In addition, it should be understood that when the lens is provided on the LED in the above embodiments, in some application scenarios it may be required that the light emitted by the LED is non-uniformly distributed, the structure of the lens can be adjusted accordingly.

Embodiment three:

For ease of understanding, this embodiment further exemplifies the structure of the LED used in the LED device.

This embodiment also provides an LED manufactured by using the LED bracket in the above embodiment, which includes at least one LED chip disposed in the area of the lamp bead on the substrate.

In this embodiment, the LED may also include a luminescence conversion adhesive, a lens adhesive layer or a diffusion adhesive layer disposed on the LED chip. It should be understood that the luminescence conversion adhesive in this embodiment may be a fluorescent adhesive containing phosphor powder. , can also be a colloid containing quantum dot photosensitive materials, or other luminescence conversion glue that can realize luminescence conversion, and can also include diffusion powder or silicon powder as required; in this embodiment, a luminescence conversion glue is formed on the LED chip, The method of lens adhesive layer or diffusion adhesive layer includes but not limited to dispensing, molding, spraying, sticking and so on.

For example, in an application scenario, it is necessary to arrange four rows of LED chips connected in series in the LED bracket, and then connect the four rows of LED chips connected in series in parallel. For this application scenario, this embodiment provides a metal substrate LED bracket structure, as shown in Figure 12-1 to Figure 12-2, the metal substrate 181 of the LED bracket is sequentially provided with an insulating layer 183, a circuit layer 182 and The white oil layer 187 arranged on the circuit layer 182, and the metal substrate 181 has a crystal-bonding area exposed outside the circuit layer 182 and the white oil layer 187, the white oil layer 187 does not cover the pin welding area 1821, and the periphery of the conductive substrate 181 is provided with Dam 1813. The LED chips 180 in the bracket realize the structure of connecting four rows of LED chips 180 in series and then connecting them in parallel through the circuit layer, that is, the circuit layer at this time includes a circuit for connecting four rows of LED chips in series and then parallel. In one application scenario, the LED shown in Figure 12-1 can be cut as shown in the dotted line frame in the figure to obtain four LED lamp beads, or the lamp bead area can be divided on the metal substrate 181 as shown in the dotted line frame , four lamp bead areas are obtained, and four LED chips are arranged in series in each lamp bead area, and the circuits provided by the circuit layer between each lamp bead area are connected in parallel. And the division of the lamp bead area can be flexibly determined, for example, it can also be divided vertically.

As shown above, in this embodiment, the number of lamp bead areas on the substrate can be flexibly set, and the number of LED chips disposed in each lamp bead area can also be flexibly set. For example, it can be set that the substrate includes at least two lamp bead areas, and the circuit layer includes a circuit to realize the connection between each lamp bead area, and one LED chip or at least two LED chips can be arranged in one lamp bead area, and the circuit The layer includes pin welding areas connected to the LED chips in the area of each lamp bead. And optionally, the LED bracket in this embodiment may use a dam, or may not use a dam, and the specific layout can be flexibly set according to actual requirements. For example, in an example, a dam may be used, and at this time, one dam may be provided in one lamp bead area.

When multiple dams are set on the substrate, one dam and the LED chips in the dam are equivalent to one LED made by using the existing LED bracket, that is, the LED bracket provided by this embodiment can be implemented on one substrate. Multiple lamp beads are set, and the multiple lamp beads can be connected in series or parallel or a combination of series and parallel through the built-in circuit layer of the LED bracket. Compared with the existing LED bracket, the integration degree is further improved, and compared with the existing multiple The combined use of LEDs reduces product cost and product size.

According to the above example, in this embodiment, the circuit layer provided on the substrate can not only realize the connection between the lamp beads and/or the connection between the lamp beads and other devices, but also realize the connection between the LED chips in the lamp bead area. Connection.

According to requirements, the circuit layer in this embodiment can also be arranged on the entire front surface of the substrate, or at least a part of it extends out of the lamp bead area on the substrate to lay out circuits connected to other lamp beads and/or devices, including but not limited to The driving circuit (the driving circuit can be the driving circuit for driving the LED chip, or the driving circuit for the entire circuit layer or other devices), the control circuit for controlling the LED chip, etc.

That is to say, in this embodiment, in addition to the above-mentioned example circuits, the circuits that can be realized by the circuit layer can also be flexibly set according to specific application scenarios, such as the above-mentioned control circuit for controlling the LED chip, and the circuit for driving the LED chip. drive circuit, etc. In this embodiment, the above-mentioned control circuit and drive circuit may only be the basic circuits required to realize control and drive, and do not include various electronic components (such as resistors, capacitors, various chips, etc.) required to realize control and drive. (such as driver chips)), the points where various components are connected on these basic lines are the connection points of the above-mentioned devices. Moreover, in this embodiment, various electronic components required for realizing control or driving can be arranged on the front surface of the substrate, or on the back surface of the substrate, or outside the substrate according to requirements. For example, when the circuit layer includes a driver circuit, a driver chip in the form of a bare chip can be used, and the driver chip can be arranged on the back or front of the substrate, that is, the driver chip and/or other components can be integrated into the LED bracket.

It can be seen that, through the extended layout of the above-mentioned lines in this embodiment, at least a part of the driving circuit and/or control circuit can be integrated on the LED bracket when the size of the LED bracket is satisfied, which further improves the integration level and is more conducive to reducing the size of the LED bracket. Dimensions and assembly of application modules, etc. For example, the control circuit in this embodiment may include but not limited to a local dimming circuit.

In this embodiment, the substrate of the LED bracket is provided with a circuit layer, so when the LED chip is arranged in the LED bracket, the LED chip can be directly arranged on the circuit layer according to specific requirements (at this time, the circuit layer includes at least one The chip placement area where the LED chip is placed, and the lamp bead area may include at least one chip placement area), or the LED chip is directly placed on the substrate (at this time, the substrate includes at least one die-bonding area exposed outside the circuit layer), Alternatively, when an insulating layer is provided between the circuit layer and the substrate, the LED chip is directly placed on the insulating layer (at this time, the insulating layer includes at least one chip placement area for placing the LED chip).

For example, in some examples, when the substrate is a substrate with relatively low thermal conductivity, if the circuit layer is flush with the front surface of the substrate or lower than the substantially front surface, and the thermal conductivity of the material used for the circuit layer is greater than or equal to the thermal conductivity of the substrate coefficient, the LED chip can be directly arranged on the circuit layer, at this time, at least one chip placement area for placing the LED chip can be arranged on the circuit layer, and one chip placement area can place one or more LED chips according to actual needs. For another example, if the circuit layer is higher than the front side of the substrate, in order to realize the rapid derivation of the heat emitted by the LED chip, the front side of the substrate can be provided with at least one die-bonding area exposed outside the circuit layer for placing the LED chip, so that the LED chip It can be directly arranged on the substrate, and in contact with the substrate, the heat emitted by the LED can be directly transferred to the substrate, and then transmitted outward through the substrate to achieve rapid heat dissipation. Moreover, in this embodiment, the die-bonding regions of the LED chips can be isolated from each other, or connected to each other, and the interconnected structure is more conducive to the comprehensive and rapid dissipation of heat and electricity.

In this embodiment, when the substrate is a conductive substrate, an insulating layer must be arranged between the conductive substrate and the circuit layer. The thermal conductivity coefficient of the metal substrate) is generally relatively large, so when the LED chip is directly placed on the conductive substrate, the heat emitted by the LED chip can be dissipated at the fastest speed to avoid various damages caused by the high temperature of the LED. adverse effects.

In this embodiment, when the substrate is an insulating substrate and the circuit layer is higher than the front surface of the insulating substrate, the LED chip is directly arranged on the insulating substrate, and the thermoelectricity generated by the LED chip is passed through The way the circuit layer is transferred to the substrate, the heat dissipation effect is better. In this embodiment, in order to further improve heat dissipation efficiency, a heat conductor with a thermal conductivity higher than that of the insulating substrate may also be pre-embedded in the die-bonding area of the insulating substrate, so that the heat dissipation speed and efficiency can be improved through the heat conductor.

In this embodiment, in order to realize the connection between the circuit layer and the outside of the bracket or to facilitate the connection between the circuit layer and the devices in the bracket or the modules in the circuit layer, it can be flexibly arranged on the back side and/or the front side of the substrate A functional electrical connection area that is insulated from the substrate and electrically connected to the circuit layer on the substrate. Moreover, the position where the functional electrical connection area and the circuit layer are specifically connected in this embodiment can be specifically determined according to the specific function to be realized by the functional electrical connection area.

In this embodiment, the setting of the functional electrical connection area on the LED bracket can be flexibly set. For example, the functional electrical connection area may not be drawn out on the back side of the substrate, but a functional electrical connection area isolated from the substrate may be provided on the front side of the substrate (at this time, the functional electrical connection area may be directly located on the substrate or may be located on the circuit layer), Alternatively, functional electrical connection areas may be provided on the back and the front of the substrate at the same time as required. In this embodiment, when the functional electrical connection area is set on the front side of the substrate, the functional electrical connection area set on the front side of the substrate can be called the first functional electrical connection area, and the connection points of other devices can also be set on the first functional electrical connection area. In the functional electrical connection area; when the functional electrical connection area is set on the back side of the substrate, the functional electrical connection area on the back of the substrate can be called the second functional electrical connection area, and according to requirements, the connection points of other devices can also be connected to the second functional electrical connection area. The electrical connection area is connected. In this embodiment, the interface used to connect with the outside of the functional electrical connection area is called an electrical connection interface (as shown above, it may be a connection point of other devices), and the electrical connection interface can be set as an electrical connection jack, PIN pin terminal , gold finger or pad structure interface, etc.

In this embodiment, when the second functional electrical connection area is basically provided on the back side, the position where the second functional electrical connection area on the back of the substrate is connected to the circuit layer can be specifically determined according to the specific function to be realized by the second functional electrical connection area. . And in this embodiment, the connection between the second functional electrical connection area on the back and the circuit layer can be realized along the path from the front of the substrate to the side and then to the back, or a through hole can be opened directly from the front of the substrate to the back, and through the through hole The conductor electrically connected to the corresponding position of the circuit layer realizes the setting of the second functional electrical connection area.

It should be understood that, in this embodiment, when the first functional electrical connection area and the second functional electrical connection area are respectively provided on the front and back sides of the substrate, the set first functional electrical connection area and the second functional electrical connection area The functions corresponding to the regions may be the same or different, and the first functional electrical connection region and the second functional electrical connection region may cooperate to realize a function. For example, the first functional electrical connection area includes a support positive electrode connection area and a support negative electrode connection area; the second functional electrical connection area includes a device connection area for connecting with devices outside the LED support. For another example, the first functional electrical connection area is the positive electrode connection area of the bracket, and the second functional electrical connection area is the negative electrode connection area of the bracket, and the two cooperate to realize the connection between the LED bracket and the external power supply; for another example, the first functional electrical connection area Including the positive electrode connection area of the stent and the negative electrode connection area of the stent, the second functional electrical connection area also includes the positive electrode connection area of the stent and the negative electrode connection area of the stent. In actual use, the front or back of the substrate can be flexibly selected according to the current application scenario The positive electrode connection area of the stent and the negative electrode connection area of the stent are used.

In this embodiment, in order to improve the reliability and light extraction efficiency of the LED bracket, optionally, at least one of a protective layer and a metal plating layer may be provided on the circuit layer provided on the substrate, and in this embodiment The protective layer includes but is not limited to at least one of a protective coating and an insulating protective film; the arrangement of the metal plating layer in this embodiment can also facilitate wiring when connecting devices.

For example, various protective coatings can be provided on the circuit layer. It should be understood that the protective coating does not cover the welding area on the circuit layer, and the protective coating can protect the circuit layer. Requirements can also be used to identify the circuit structure on the circuit layer, and/or improve the light output efficiency of the LED bracket. For example, the protective coating in this embodiment can be configured as a solder resist ink coating, and the solder resist ink coating can include at least one of a white oil layer, a green oil layer and a black oil layer. For example, white oil layer can be set in some areas, green oil layer can be set in some areas, or white oil layer can be set in some areas, black oil layer can be set in some areas, or only white oil layer, green oil layer or black oil layer can be set, or even multi-layer ink layers can be set according to requirements, etc. . The types of ink layers to be selected and the specific combination methods can be flexibly set. The setting of the black oil layer can absorb part of the light, and the final emitted light can be adjusted again. For another example, various insulating protective films can be provided on the circuit layer (i.e., protected by coating). The insulating protective film in this embodiment can be an insulating reflective film, such as including but not limited to a reflective flexible film, to Improve the light output rate of the LED bracket. In this embodiment, the light-reflecting flexible film does not have a soldering area on the circuit layer. And it should be understood that, in an example, the insulating protective layer and the protective coating can also be provided in combination, for example, the protective coating can be provided on the circuit layer first, and then the insulating protective layer can be provided on the protective coating. In this embodiment, it is also possible to directly arrange a metal coating on the circuit layer, and the metal coating can be a single-layer metal layer, or a composite metal layer composed of at least two metal layers; for example, a single-layer metal layer When it is a single-layer silver-plated layer; when it is a composite metal layer, it can be a composite metal layer composed of a silver layer and a gold layer or other metal layers.

This embodiment also provides a light emitting device, which includes the LED exemplified in the above embodiments. The light emitting device in this embodiment may be an illuminating device, a light signal indicating device, a supplementary light device or a backlight device, and the like. When it is a lighting device, it can specifically be a lighting device used in various fields, such as desk lamps, fluorescent lamps, ceiling lamps, downlights, street lights, projection lights, etc. in daily life, and for example, high beams and low beams in cars Lamps, ambient lights, etc., such as surgical lights, low-electromagnetic lighting, and lighting for various medical instruments, and various colored lights, landscape lighting, advertising lights, etc. in the field of decorative lighting; for In the case of an optical signal indicating device, it can specifically be an optical signal indicating device applied in various fields, such as a signal indicator light in the traffic field, and various signal status indicators on communication equipment in the communication field; when it is a supplementary light device, it can be The supplementary light in the field of photography, such as flashlight, supplementary light, can also be a plant supplementary light for plant supplementation in the agricultural field; when it is a backlight device, it can be a backlight module used in various backlight fields, such as a Applied to monitors, TV sets, mobile phones and other mobile terminals, advertising machines and other equipment.

It should be understood that the above-mentioned applications are only several applications exemplified in this embodiment, and it should be understood that the application of LED devices is not limited to the several fields exemplified above.

The above content is a further detailed description of the embodiments of the present invention in conjunction with specific implementation modes, and it cannot be assumed that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field of the present invention, without departing from the concept of the present invention, some simple deduction or replacement can be made, which should be regarded as belonging to the protection scope of the present invention.

Claims (16)

1. a kind of luminescent device, which is characterized in that including LED and after LED encapsulation is completed, be arranged on the LED Reflective lens, the LED includes substrate, the circuit layer being dielectrically separated from the substrate front side and with the substrate And an at least LED chip, lamp bead region is equipped on the substrate front side, the LED chip is set to the lamp bead area In domain, the circuit layer include for by the lamp bead region on the substrate LED chip and other lamp beads and/or the base The circuit of the tie point connection of other devices on plate；

The reflective lens are located on the substrate, and the reflective lens include lens body, are located at the lens sheet The light incident surface of body lower part, the light positioned at the light-emitting face of the lens body side and positioned at the lens body top are anti- Face is penetrated, the light of the LED chip transmitting injects the lens body from the light incident surface, between the LED chip optical axis Angle be less than or equal to the first predetermined angle threshold value light after the reflective surface from the light-emitting face project.

2. luminescent device as described in claim 1, which is characterized in that the light incident surface be from the lens body bottom to The light of the inner wall of the bottom depression of indent, the LED chip transmitting is incident upon in the bottom depression, through the bottom depression Inner wall inject the lens body；

The light reflection surface is the inner wall of the top depression to concave at the top of the lens body, is incident upon the lens body The light that interior and between the optical axis angle is less than or equal to first predetermined angle threshold value occurs in the light reflection surface Reflection, and projected from the light-emitting face.

3. luminescent device as claimed in claim 2, which is characterized in that the light-emitting face includes to the lens body side Multiple convex surfaces that outside extends.

4. luminescent device as described in any one of claims 1-3, which is characterized in that be provided with one in the lamp bead region LED chip, or be provided at least two spacing and be less than default first distance threshold value to form the plurality of LEDs chip of point light source, or It is provided with more spacing and is greater than default second distance threshold value to form the plurality of LEDs chip of area source.

5. luminescent device as claimed in claim 4, which is characterized in that the corresponding institute in all lamp bead regions on the substrate State the corresponding reflective lens in the lamp bead region or the lamp bead on reflective lens or the substrate The corresponding reflective lens of a LED chip in region.

6. luminescent device as claimed in claim 5, which is characterized in that when being provided with plurality of LEDs chip in the lamp bead region, It include the LED chip of at least two different peak luminous wavelengths in the plurality of LEDs chip.

7. luminescent device as described in any one of claims 1-3, which is characterized in that the LED further includes being set to the LED Luminescent conversion layer, substratum transparent or diffusion glue-line between chip and the reflective lens.

8. luminescent device as claimed in claim 7, which is characterized in that the LED include be set to the LED chip with it is described Luminescent conversion layer between refraction type lens, the LED chip in the lamp bead region include in following chip any one or At least two combination:

Peak luminous wavelength is the blue-light LED chip of 440nm to 500nm；

Peak luminous wavelength is the green LED chip of 510nm to 540nm；

Peak luminous wavelength is the yellow light LED chip of 550nm to 570nm；

Peak luminous wavelength is the red LED chip of 620nm or more；

The luminescent conversion layer is that the light that the LED chip issues is converted into default colour mixture light luminescent conversion layer.

9. luminescent device as claimed in claim 8, which is characterized in that the default colour mixture light includes white light.

10. luminescent device as described in any one of claims 1-3, which is characterized in that the reflective lens are to form circle The round reflective lens of hot spot, the rectangular reflective lens for forming square focus spot or the ellipse for forming ellipse are reflective Mirror.

11. luminescent device as described in any one of claims 1-3, which is characterized in that the substrate front side is additionally provided with and base Plate is dielectrically separated from itself, and the first function electrical connection area being electrically connected with the circuit layer, and/or, the substrate back setting The the second function electrical connection area for having and being dielectrically separated from substrate, and be electrically connected with the circuit layer.

12. luminescent device as described in any one of claims 1-3, which is characterized in that the circuit layer further includes driving circuit And/or the control circuit for being controlled LED chip.

13. luminescent device as described in any one of claims 1-3, which is characterized in that include at least two lamps on the substrate Pearl region, the circuit layer include and the positive pin of LED chip to be placed in each lamp bead region and negative pin point Not corresponding positive pin welding section and negative pin welding section, and at least two lamp bead region is electrically connected Circuit.

14. luminescent device as described in any one of claims 1-3, which is characterized in that have a lamp bead area on the substrate Domain, the circuit layer include respectively corresponding with the positive pin of LED chip to be placed in the lamp bead region and negative pin Positive pin welding section and negative pin welding section；

For placing a LED chip or at least two LED chips in the lamp bead region.

15. luminescent device as described in any one of claims 1-3, which is characterized in that set at least one described lamp bead region At least two LED chips are equipped with, the circuit layer further includes realizing that the chip being electrically connected between each LED chip in lamp bead region connects Connect circuit；Circuit is connected by the chip between at least two LED chips and realizes connection.

16. a kind of light emitting device, which is characterized in that including such as described in any item luminescent devices of claim 1-15, the hair Electro-optical device is lighting device, optical signal instruction device, light compensating apparatus or back lighting device.