CN114063350A - Light source module, display module and light source module preparation method - Google Patents
Light source module, display module and light source module preparation method Download PDFInfo
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- CN114063350A CN114063350A CN202111265583.7A CN202111265583A CN114063350A CN 114063350 A CN114063350 A CN 114063350A CN 202111265583 A CN202111265583 A CN 202111265583A CN 114063350 A CN114063350 A CN 114063350A
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- 238000002360 preparation method Methods 0.000 title claims description 3
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000006243 chemical reaction Methods 0.000 claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 82
- 230000003287 optical effect Effects 0.000 claims description 62
- 238000005538 encapsulation Methods 0.000 claims description 38
- 239000000843 powder Substances 0.000 claims description 36
- 239000002096 quantum dot Substances 0.000 claims description 26
- 239000004568 cement Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000011247 coating layer Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 10
- 239000010408 film Substances 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000012788 optical film Substances 0.000 description 4
- 230000004075 alteration Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
The present disclosure provides a light source module, a display module and a method for manufacturing the light source module, wherein the light source module includes a substrate, a light emitting assembly and a packaging layer, the light emitting assembly includes a plurality of light sources capable of emitting first color light, the packaging layer is used for packaging the light sources on the substrate, and a light conversion medium capable of converting the first color light emitted by the light sources into second color light is arranged in the packaging layer. According to the display module, the light conversion medium capable of converting the first color light emitted by the light source into the second color light is arranged in the packaging layer, so that the packaging layer has a light color conversion function besides the light source packaging function, light emitted by the light emitting component can be subjected to light color conversion, and the problem of light color difference at the edge part is avoided.
Description
Technical Field
The present disclosure relates to the field of electronic display technologies, and in particular, to a light source module, a display module, and a method for manufacturing the light source module.
Background
The display module mainly adopts the backlight module to provide a backlight Light source for the display panel, in order to meet the development requirement of lightness and thinness, the backlight module mostly adopts blue Light Emitting Diodes (LED for short) combined with a quantum dot film technology, but because the quantum dot film has a failure area and an assembly gap, the problem that four sides of a display area are blackened or four sides are blued to cause the Light chromatic aberration at the edge part is easy to occur, and for the display module with a medium-sized or large-sized frame such as a TV and the like which is wider, the wider frame can hide the area with the Light chromatic aberration at the edge part; for small-sized products with narrow frames, the narrow frames cannot completely hide the areas with optical chromatic aberration at the edge parts; moreover, the thickness and weight of the quantum dot film may affect the assembly of the backlight module, resulting in increased complexity of the assembly of the display module.
Disclosure of Invention
In view of this, according to an aspect of the present disclosure, a light source module is provided.
A light source module, comprising:
a substrate;
a light emitting assembly comprising a plurality of light sources capable of emitting a first color of light; and
the packaging layer is used for packaging the light source on the substrate, and a light conversion medium capable of converting first color light emitted by the light source into second color light is arranged in the packaging layer.
In one embodiment, the material of the encapsulation layer is an optical hybrid glue formed by mixing phosphor powder or quantum dot powder in optical glue.
In one embodiment, a plurality of the light sources are distributed discretely, and a spacing space is arranged between every two adjacent light sources;
the packaging layer comprises a filling part and a covering part, and the filling part is filled in the interval space and is surrounded with the covering part to form a coating cavity surrounding the light source;
the encapsulation layer is provided with a light conversion medium at least within the cover portion.
In one embodiment, the covering portion is made of an optical mixed glue formed by mixing phosphor powder or quantum dot powder in an optical glue.
In one embodiment, the filling portion has a first top surface far from the substrate, the plurality of light sources are formed with a second top surface far from the substrate, the first top surface and the second top surface are flush to form an upper end surface, and the cover portion includes a coating layer formed on the upper end surface by phosphor or quantum dot powder and an optical sealing layer disposed on the coating layer.
According to another aspect of the present disclosure, a display module is further provided, which includes a backlight module, where the backlight module is the light source module as described above.
According to another aspect of the present disclosure, there is also provided a light source module manufacturing method, including the steps of:
arranging a substrate;
positioning a plurality of light sources capable of emitting first color light onto the substrate, wherein the plurality of positioned light sources are distributed in rows and columns, a spacing space is formed between every two adjacent light sources, and the spacing spaces are distributed into a row space distributed along a first direction and a column space distributed along a second direction;
and configuring an encapsulation layer to encapsulate the light source on the substrate, wherein the encapsulation layer is internally provided with a light conversion medium capable of converting the first color light emitted by the light source into the second color light.
In one embodiment, the step of disposing the encapsulation layer includes a step of mixing the quantum dot powder or the red-green phosphor powder with the optical adhesive to form a mixed optical adhesive.
In an embodiment, the step of configuring the encapsulation layer further includes:
using a dispenser to dispense optical cement in a line space along a first direction;
using a dispenser to dispense optical cement in the column space along the second direction;
and (4) using a glue dispenser to mix optical glue above the light source.
In one embodiment, the step of configuring the encapsulation layer includes:
using a screen glue dispenser to simultaneously dispense optical glue in a row space and a column space;
coating a fluorescent powder layer or a quantum dot powder layer;
and (3) using a screen glue dispenser to dot optical glue on the fluorescent powder layer or the quantum dot powder layer and self-leveling to form an optical sealing layer.
The present disclosure has the following beneficial effects: the light conversion medium capable of converting the first color light emitted by the light source into the second color light is arranged in the packaging layer, so that the packaging layer has a light color conversion function besides a light source packaging function. When the light source module is applied to the display module as the backlight module, the light emitted by the light-emitting component can be subjected to light color conversion (such as white conversion) by virtue of the arrangement of the packaging layer, so that the problem of light color difference at the edge part is solved, and moreover, because the light conversion medium is directly arranged in the packaging layer, the light color conversion is realized without additionally arranging a quantum dot film layer, the thickness and the weight of the display module are optimized, and the problem of the assembly complexity of the display module caused by the increase of the thickness and the weight is avoided.
Advantages and features of the present disclosure are described in detail below with reference to the accompanying drawings.
Drawings
The following drawings of the present disclosure are included to provide an understanding of the present disclosure. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure. In the drawings, there is shown in the drawings,
fig. 1 is a schematic structural diagram of a display module according to an exemplary embodiment of the present disclosure;
fig. 2 is a top view of a light source module according to an exemplary embodiment of the present disclosure;
FIG. 3 is a schematic cross-sectional view of the light source module of FIG. 2 without self-leveling;
FIG. 4 is a cross-sectional view of the light source module shown in FIG. 2;
fig. 5 is a top view of a light source module according to another exemplary embodiment of the present disclosure;
FIG. 6 is a cross-sectional view of the light source module shown in FIG. 5;
fig. 7 is a flowchart of a method of fabricating a light source module according to an exemplary embodiment of the present disclosure;
FIG. 8 is a flowchart of configuring the encapsulation layers of the exemplary embodiment of FIG. 7;
fig. 9 is a flowchart of configuring an encapsulation layer of another exemplary embodiment of fig. 7.
The reference numbers in the figures illustrate: 10. a substrate; 101. a mounting surface; 20. a light emitting assembly; 21. a light source; 22. an intervening space; 201. a second top surface; 30. a packaging layer; 301. a light-emitting surface; 31. a filling section; 311. a first top surface; 32. a covering section; 321. a coating layer; 322. an optical confinement layer; 200. a display panel; 300. a backlight module; 400. a display module; 41. a protective shell; 42. a glue layer; 43. an optical film; 44. a lower polarizer; 45. a TFT glass plate; 46. a CF glass plate; 47. an upper polarizer; 48. a rubber frame; 49. and a shading glue layer.
Detailed Description
In the following description, numerous details are provided to provide a thorough understanding of the present disclosure. One skilled in the art, however, will understand that the following description merely illustrates alternative embodiments of the disclosure and that the disclosure may be practiced without one or more of these details. In addition, some features that are well known in the art have not been described in detail to avoid obscuring the present disclosure.
The light source module is mainly used in a display module, is used as a backlight module and provides a backlight light source for a display panel. In order to understand the present disclosure as a whole, a display module employing the backlight module will be described first.
As shown in fig. 1, a display module 400 according to an exemplary embodiment of the disclosure includes a display panel 200 and a backlight module 300, the display panel 200 is a liquid crystal panel, the liquid crystal panel has a main structure that a liquid crystal cell formed by a layer of liquid crystal (liquid crystal is not shown in the figure) is sandwiched between two glass plates, one of the glass plates is a CF glass plate 46(CF is an abbreviation of Color filter, i.e., Color filter, and the CF glass plate 46 is also called Color filter), the other glass plate is a TFT glass plate 45(TFT is an abbreviation of Thin Film Transistor, i.e., Thin Film field effect Transistor), a lower polarizer 44 is disposed below the TFT glass plate 45, and an upper polarizer 47 is disposed above the CF glass plate 46. The backlight module 300 generally comprises a backlight source, an optical film 43, and a frame 48, and the basic principle is to transmit a "point light source" or a "line light source" provided by a CCFL (cold cathode tube) or an LED (light emitting diode) through the optical film 43 to improve the light emitting efficiency and convert the light into a high-brightness and uniform surface light source. As shown in the display module 400 of fig. 1, the backlight module 300 is disposed on the protective casing 41 through the adhesive layer 42, and the periphery of the backlight module 300 is fixed by the adhesive frame 48, the adhesive frame 48 is disposed around the periphery of the display panel 200, and the display panel 200 is further disposed with a light-shielding adhesive layer 49 around the periphery thereof to avoid light leakage.
The light source module of the present disclosure is described in detail below with reference to two different embodiments.
As shown in fig. 2, 3 and 4, a light source module according to an embodiment of the present disclosure includes a substrate 10, a light emitting assembly 20 and an encapsulation layer 30.
The substrate 10 has a mounting surface 101, and a power supply circuit (the power supply circuit is not shown in the drawing) may be provided on the mounting surface 101 so that the substrate 10 forms a driving board.
The light emitting assembly 20 is positioned on the power circuit such that the light emitting assembly 20 is protrudingly disposed on the mounting surface 101. The light emitting assembly 20 includes a plurality of light sources 21 capable of emitting a first color light, the plurality of light sources 21 are distributed discretely, a space 22 is provided between each two adjacent light sources 21, and a sealing material can be filled in the space 22 to encapsulate each light source 21. When the light source module is used as the backlight module 300, the light source 21 may be a blue Mini LED chip emitting blue light, which is also called a sub-millimeter light emitting diode, and the size of the Mini LED is usually 80 to 200 micrometers, which is a new generation LED. The light source 21 is electrically connected to the substrate 10, and an external power supply is connected to the light source 21 through a power supply circuit to supply power to the light source 21, thereby causing the light source 21 to emit light.
The encapsulation layer 30 is used for encapsulating the light source 21 on the substrate 10, a light conversion medium capable of converting the first color light emitted by the light source 21 into the second color light is arranged in the encapsulation layer 30, and for the case that the light source 21 is a blue light Mini LED chip, the blue light emitted by the blue light Mini LED chip is converted into white light when being transmitted outwards through the encapsulation layer 30. Of course, under the condition that the light source module is not used as the backlight module 300, the light source 21 is not limited to the blue Mini LED chip, but may be a common LED capable of emitting blue light, red light and green light, or a cold cathode tube, and the disclosure is not limited thereto; likewise, the light conversion medium in the encapsulation layer 30 is not limited to converting blue light into white light, and may also convert light of other colors emitted by the light source 21 into other colors, and the disclosure is not limited as long as color conversion of light can be achieved. It should be noted that the light emitting surface of the light emitting module 20 is the light emitting surface of the light source 21 when the light source 21 is not encapsulated, and is the light emitting surface 301 of the encapsulation layer when the light source 21 is encapsulated by the encapsulation layer 30, and the structures shown in fig. 4 and fig. 6 are that the light emitting surface 301 of the encapsulation layer is the light emitting surface of the light emitting module 20 when the light source 21 is encapsulated.
Referring to fig. 3 and 4 again, in an embodiment of the present disclosure, the encapsulation layer 30 includes a filling portion 31 and a covering portion 32, the filling portion 31 is filled in the spacing space 22 and surrounds the covering portion 32 to form a cladding cavity surrounding the light source 21, and by the arrangement of the cladding cavity, not only the light source 21 can be fixed on the substrate 10, but also the light source 21 can be sealed to prevent the light source 21 from being oxidized. Since the light emitting surface 301 of the package layer is used as the light emitting surface of the light emitting module 20, as can be seen from fig. 4, the light emitting surface 301 of the package layer is actually served by the top surface of the filling portion 31 and the top surface of the covering portion 32, and the plurality of light sources 21 are distributed discretely, because of the light mixing reason, the covering portion 32 does not affect the light emitting color of the light sources 21, therefore, in order to convert the light emitted by the light sources 21 into other colors, a light conversion medium may be disposed only in the covering portion 32 of the package layer 30, specifically, the material of the covering portion 32 may be an optical mixed glue formed by mixing fluorescent powder or quantum dot powder in the optical glue, so that the covering portion 32 may convert the blue light emitted by the blue Mini LED into white light and then emit the white light, thereby solving the phenomenon that blue light appears at the edge portion. For the filling portion 31 of the encapsulation layer 30, a common optical adhesive may be used, that is, a different sealing material may be used for the covering portion 32 and the filling portion 31 of the encapsulation layer 30.
In an embodiment not shown, the filling portion 31 and the covering portion 32 may be made of the same material, and specifically, both the filling portion 31 and the covering portion 32 are made of an optical hybrid formed by mixing phosphor powder or quantum dot powder in optical cement, that is, the whole encapsulation layer 30 is made of an optical hybrid formed by mixing phosphor powder or quantum dot powder in optical cement.
Referring to fig. 2, 3, 4 and 7 in combination, a method for manufacturing a light source module according to an embodiment includes the steps of:
s100, a substrate 10 is provided, and the substrate 10 may be a driving board provided with a power circuit.
S200, positioning a plurality of light sources 21 capable of emitting first color light onto the substrate 10, wherein the plurality of positioned light sources 21 are distributed in rows and columns, an interval space 22 is formed between every two adjacent light sources 21, and the plurality of interval spaces 22 are distributed into a row space arranged along the first direction X and a column space arranged along the second direction Y. The light source 21 may be a blue light Mini LED chip, and a plurality of blue light Mini LED chips may be mounted on a driving board, i.e., a pad surface for positioning a chip component on a printed circuit board (i.e., a PCB) by a chip mounter (i.e., an SMT machine).
S300, the encapsulation layer 30 is configured to encapsulate the light source 21 on the substrate 10, and the encapsulation layer 30 has a light conversion medium therein, which is capable of converting the first color light emitted by the light source 21 into the second color light.
For the case where the light conversion medium structure is provided only in the cover portion 32 of the encapsulation layer 30, as shown in fig. 8, the step S300 specifically includes:
s310, mixing quantum dot powder or red-green fluorescent powder into optical cement to form mixed optical cement;
s320, using a dispenser to dispense optical cement in a line space along a first direction X;
s330, using a dispenser to dispense optical cement in the column space along the second direction Y;
s340, using a dispenser to dispense optical cement above the light source 21, wherein the structure of the encapsulation layer 30 formed by the step is as shown in fig. 3;
s350, performing spin coating on the side of the point optical adhesive and the mixed optical adhesive of the point optical adhesive and the point optical adhesive far from the substrate 10 to form the planar light emitting surface 301, wherein the step is mainly to form the planar light emitting surface 301, the step is referred to as self-leveling, and the structure of the package layer 30 formed after the step is as shown in fig. 4.
It should be understood that the step S310 of forming the mixed optical cement is not strictly sequential to the step S320 of dispensing the optical cement in the row space and the step S330 of dispensing the optical cement in the column space, and the step S310 of forming the mixed optical cement may also be subsequent to the step S330 of dispensing the optical cement in the column space; similarly, the step S320 of dispensing optical paste in the row space may be after the step S330 of dispensing optical paste in the column space.
In addition, in the case of an optical hybrid formed by mixing phosphor or quantum dot powder in an optical cement for both the filling portion 31 and the covering portion 32, step S320 is to use a dispenser to dot-mix the optical cement in the line space along the first direction X; in step S330, an optical glue is dispensed and mixed in the column space along the second direction Y by using a dispenser.
As shown in fig. 5 and 6, in the light source module according to another embodiment of the present disclosure, the encapsulation layer 30 includes a filling portion 31 and a covering portion 32, the filling portion 31 is filled in the space 22 and surrounds the covering portion 32 to form a coating cavity surrounding the light source 21, and by the arrangement of the coating cavity, the light source 21 can be fixed on the substrate 10, and the light source 21 can be sealed to prevent the light source 21 from being oxidized. In contrast, in this embodiment, the filling part 31 has a first top surface 311 away from the substrate 10, the plurality of light sources 21 are formed with a second top surface 201 away from the substrate 10, the first top surface 311 is flush with the second top surface 201 to form an upper end surface, and the covering part 32 includes an overcoat layer 321 formed on the upper end surface by phosphor or quantum dot powder and an optical sealing layer 322 disposed on the overcoat layer 321. As can be seen from fig. 6, the light emitting surface 301 of the encapsulation layer is actually formed by the surface of the optical sealing layer 322 far from the coating layer 321, and the coating layer 321 can convert the blue light emitted by the blue Mini LED into white light and emit the white light, so that the phenomenon that the blue light appears at the edge portion can be solved.
Referring to fig. 5, fig. 6, fig. 7 and fig. 9, the method for manufacturing a light source module according to another embodiment also includes the steps of:
s100, a substrate 10 is provided, and the substrate 10 may be a driving board provided with a power circuit.
S200, positioning a plurality of light sources 21 capable of emitting first color light onto the substrate 10, wherein the plurality of positioned light sources 21 are distributed in rows and columns, an interval space 22 is formed between every two adjacent light sources 21, and the plurality of interval spaces 22 are distributed into a row space arranged along the first direction X and a column space arranged along the second direction Y. The light source 21 can be a blue light Mini LED chip, and a plurality of blue light Mini LED chips can be printed on the driving board, wherein the printed part is the surface of a bonding pad which is used for positioning the surface mounted part on the PCB through an SMT machine.
S300, the encapsulation layer 30 is configured to encapsulate the light source 21 on the substrate 10, and the encapsulation layer 30 has a light conversion medium therein, which is capable of converting the first color light emitted by the light source 21 into the second color light.
Differently, for the structure shown in fig. 5 and 6 in which the covering part 32 includes the coating layer 321 and the optical sealing layer 322, the step S300 specifically includes:
s310, using a screen dispenser to dispense optical glue in the row space and the column space, wherein the screen dispenser is called as a screen dispenser, and the screen dispenser can dispense glue in an array manner, and the screen dispenser belongs to the field of the prior art, and thus, the description thereof is omitted here.
And S320, coating a fluorescent powder layer or a quantum dot powder layer.
And S330, using a screen dispenser to dot optical cement on the fluorescent powder layer or the quantum dot powder layer and self-leveling to form the optical sealing layer 322, wherein self-leveling refers to self-leveling based on the fluidity of the optical cement to form a plane layer, or slightly assisting leveling by a scraper to form the plane layer.
The display module 400 according to the present disclosure includes the display panel 200 and the backlight module 300, the backlight module 300 is the light source module as described above, it should be understood that, in order to meet the backlight requirement, the light source 21 is only a light source 21 capable of emitting blue light, such as a blue light Mini LED chip, which is not described herein, and besides, the display panel 200 and the like may have various structures that may appear in the present or future, which does not limit the protection scope of the present disclosure.
In summary, according to the display module of the present disclosure, based on the arrangement of the encapsulation layer having the light color conversion function, the backlight module of white light can be integrally manufactured, so that the problem of blue light leakage at the edge portion caused by using the quantum dot film/phosphor film is solved, and the additional arrangement of optical films such as the quantum dot film/phosphor film outside the encapsulation layer is omitted, thereby optimizing the thickness and weight of the display module, and avoiding the problem of complexity in assembling the display module due to the increase of the thickness and weight.
In the description of the present disclosure, it is to be understood that the directions or positional relationships indicated by the directional terms "upper", "lower", etc. are generally based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present disclosure and simplifying the description, and in the case of not making a reverse explanation, these directional terms do not indicate and imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore, should not be construed as limiting the scope of the present disclosure; the terms "inner" and "outer" refer to the interior and exterior relative to the contours of the components themselves.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe the spatial relationship of one or more components or features shown in the figures to other components or features. It is to be understood that the spatially relative terms are intended to encompass not only the orientation of the component as depicted in the figures, but also different orientations of the component in use or operation. For example, if an element in the drawings is turned over in its entirety, the articles "over" or "on" other elements or features will include the articles "under" or "beneath" the other elements or features. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". Further, these components or features may also be positioned at various other angles (e.g., rotated 90 degrees or other angles), all of which are intended to be encompassed herein.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, elements, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are capable of operation in sequences other than those illustrated or otherwise described herein.
The present disclosure has been illustrated by the above-described embodiments, but it should be understood that the above-described embodiments are for purposes of illustration and description only and are not intended to limit the present disclosure to the described embodiments. Furthermore, it will be understood by those skilled in the art that the present disclosure is not limited to the embodiments described above, and that many variations and modifications may be made in light of the teaching of the present disclosure, all of which fall within the scope of the claimed disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof.
Claims (10)
1. A light source module, comprising:
a substrate (10);
a light emitting assembly (20), said light emitting assembly (20) comprising a plurality of light sources (21) capable of emitting light of a first color; and
the packaging layer (30) is used for packaging the light source (21) on the substrate (10), and a light conversion medium capable of converting the first color light emitted by the light source (21) into the second color light is arranged in the packaging layer (30).
2. The light source module of claim 1, wherein the encapsulation layer (30) is made of an optical hybrid adhesive formed by mixing phosphor powder or quantum dot powder in the optical adhesive.
3. The light source module of claim 1, a plurality of the light sources (21) are distributed discretely with a spacing space (22) between each adjacent two of the light sources (21);
the packaging layer (30) comprises a filling part (31) and a covering part (32), wherein the filling part (31) is filled in the spacing space (22) and surrounds the covering part (32) to form a coating cavity surrounding the light source (21);
the encapsulation layer (30) is provided with a light conversion medium at least within the cover (32).
4. The light source module of claim 3, wherein the material of the covering part (32) is an optical mixed glue formed by mixing fluorescent powder or quantum dot powder in optical glue.
5. The light source module according to claim 3, the filling part (31) having a first top surface (311) away from the substrate (10), the plurality of light sources (21) being formed with a second top surface (201) away from the substrate (10), the first top surface (311) being flush with the second top surface (201) to form an upper end surface, the covering part (32) including a coating layer (321) formed on the upper end surface by phosphor or quantum dot powder and an optical sealing layer (322) disposed on the coating layer (321).
6. A display module (400) comprising a backlight module (300), wherein the backlight module (300) is the light source module according to any one of claims 1 to 5.
7. A preparation method of a light source module comprises the following steps:
providing a substrate (10);
positioning a plurality of light sources (21) capable of emitting first color light onto the substrate (10), wherein the plurality of positioned light sources (21) are distributed in rows and columns, an interval space (22) is formed between every two adjacent light sources (21), and the plurality of interval spaces (22) are distributed into a row space arranged along a first direction and a column space arranged along a second direction;
an encapsulation layer (30) is configured to encapsulate the light source (21) on the substrate (10), the encapsulation layer (30) having a light conversion medium therein capable of converting a first color light emitted by the light source (21) into a second color light.
8. The method for manufacturing a light source module according to claim 7, wherein the step of disposing the encapsulation layer (30) includes a step of mixing quantum dot powder or red/green phosphor powder with the optical cement to form a mixed optical cement.
9. The light source module manufacturing method according to claim 8, further comprising, in the step of configuring the encapsulation layer (30):
using a dispenser to dispense optical cement in a line space along a first direction;
using a dispenser to dispense optical cement in the column space along the second direction;
an optical cement is spot-mixed above the light source (21) using a dispenser.
10. The light source module manufacturing method according to claim 7, comprising, in the step of configuring the encapsulation layer (30):
using a screen glue dispenser to simultaneously dispense optical glue in a row space and a column space;
coating a fluorescent powder layer or a quantum dot powder layer;
and (3) using a screen glue dispenser to dot optical glue on the fluorescent powder layer or the quantum dot powder layer and self-leveling to form an optical sealing layer (322).
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