CN110828642B - A kind of light-emitting device and preparation method thereof - Google Patents

Abstract

The present application relates to a light-emitting device and a preparation method thereof, wherein the light-emitting device comprises: a substrate; a plurality of light-emitting areas arranged on the substrate; at least one LED chip arranged on each light-emitting area; a light-transmitting glue structure arranged on the LED chip correspondingly; a plurality of reflective cups formed by highly reflective glue arranged on the substrate; a side light interception ring arranged on the plurality of reflective cups for absorbing side light, wherein the side light interception ring comprises a plurality of light-emitting channels, and the plurality of light-emitting channels are arranged correspondingly to the plurality of reflective cups. The preparation method of the present invention is convenient and has low cost, and the light-emitting device prepared by the light-emitting device has a simple structure, a small volume, can independently realize light emission at a small beam angle, has high light emission efficiency, and emits light uniformly.

Description

A kind of light-emitting device and preparation method thereof

Technical field

The present invention relates to the technical field of electronic products, and in particular to a light-emitting device and a preparation method thereof.

Background technique

In the prior art, LED chips are packaged into LED packages to ensure electrical connection between the LED chips and the substrate and to protect the LED chips from damage by external attacks (such as mechanical shock, heat or moisture). In addition, as a lighting device, LED packages need to meet certain requirements to improve luminous efficiency, achieve a specific optical profile, and output visible light.

COB is an LED packaging technology. In traditional COB LED packages, multiple LED chips are arranged to form a circular or square arrangement. The LED chips are directly fixed on the substrate, which usually has good thermal conductivity, and are connected to each other by gold wires. These LED chips are then connected to a power source through positive and negative pads on the substrate. To manufacture white COBLEDs, an encapsulant (eg, resin, epoxy) mixed with phosphor is applied to cover the LED chip to form the light-emitting surface of the LED. A white dam is pre-formed to define the area of the luminous surface and prevent the sealant from overflowing before it sets. It can be seen that COB LED packages usually have good heat dissipation properties because the LED chips are directly integrated onto the substrate with high thermal conductivity. Coupled with simple circuit design and light efficiency, COB LED packages are becoming more and more popular, especially in spotlights, floodlights and flashlight applications.

However, traditional COB LED packaging has its own shortcomings. First, traditional COB LED packages do not have internal reflective structures (such as reflective cups). In this way, the light excited by the LED chip in the encapsulant propagates in all directions, and the light extraction efficiency is poor. In addition, due to total reflection at the interface of the encapsulant and air, some light is reflected into the encapsulant and absorbed by the LED chip, further reducing the light extraction efficiency of the COB LED package.

Secondly, in order to manufacture COB LED-based lighting devices, additional optical components, such as lenses, reflectors, etc., are often required to focus the beam angle of the output light. Because a COB LED package contains multiple LED chips, its light-emitting surface is larger. Therefore, in order to effectively focus the light output from the LED chips to achieve the required beam angle, the optical components used to focus the output light are usually larger than the COB LED package. Its own size makes the entire lighting device larger.

In the related art, there are various solutions for solving the above-mentioned problems. For example, one solution is to increase the density of LED chips on COB substrates, thus reducing the size of the light-emitting surface. However, this solution increases the current density in the chip bonding area of the substrate, which generates a large amount of heat and cannot dissipate it quickly. Therefore, it may lead to a reduction in product reliability.

Chinese patent application number 201310714412.7 proposes another solution, which discloses a silicon lens for COB LED packaging. The silicone lens disclosed in this patent has multiple silicone layers arranged sequentially from the inside to the outside. The refractive index of the organic silicon layer located on the outer layer is less than or equal to the refractive index of silicon. The structural complexity of resin lenses not only increases the complexity of the manufacturing process, but also increases the cost of the final product. In addition, for COB packaged LED chip arrays, silicone lenses are less efficient at extracting light from LED chips located in the peripheral areas of the array than from LED chips located in the center. Therefore, the ability to improve the light extraction efficiency of COB LED packages is limited.

Chinese patent application number 103474564 proposes another solution. The patent discloses a method of laying a white oil layer on the circuit layer, and then covering the white oil layer with a flexible reflective film to form a reflective cup. Each reflective cup Contains individual LED chips. However, as disclosed in this patent, the depth of these reflective cups does not exceed 0.4mm. When liquid sealant is dispensed into the reflective cup, the sealant will overflow from the reflective cup due to capillary action, thus reducing yield and compromising light color uniformity within the COB LED lighting device. In addition, the light-emitting surface of the COB LED package disclosed in the patent is the same size or even larger than that of the traditional COB LED package. Therefore, it increases the difficulty and cost of providing additional optical components for concentrating light to obtain the desired beam angle when incorporating the COB LED package structure into a lighting device.

Therefore, currently, in the relevant technology, the light-emitting devices (such as COB, lamp beads, etc.) used in lighting devices to achieve small beam angles (such as beam angles less than 40°) cannot truly independently emit small beam angles. Beams require the assistance of additional optical components to achieve small beam angle requirements. However, the optical components used to obtain the required beam angle are larger, resulting in a larger volume of the entire lighting device composed of light-emitting devices and optical components. The problem of large size and high cost has become a technical problem that the industry urgently needs to solve.

Summary of the invention

In view of the above technical problems, the present invention provides a light-emitting device and a preparation method thereof. The device has a simple structure, can achieve the light extraction effect of a small beam angle, has high light extraction efficiency, is small in size, has a simple preparation process and is low in cost.

The technical solution of the present invention to solve the above technical problems is to provide a light-emitting device, which includes: a substrate;

a plurality of light emitting regions disposed on the substrate;

At least one LED chip arranged on each light-emitting area;

Correspondingly, the light-transmitting glue structure is provided on the LED chip;

A plurality of reflective cups formed by high-reflective glue are provided on the base plate;

A side light cutting ring is provided on a plurality of the reflecting cups for absorbing side light. The side light cutting ring includes a plurality of light emitting channels, and the plurality of light emitting channels are arranged corresponding to the plurality of reflecting cups.

Optionally, a plurality of the light emitting channels and a plurality of the reflecting cups are arranged in one-to-one correspondence.

Optionally, the side light intercepting ring is mounted on a side of the reflective cup away from the substrate, and a lens assembly is arranged on a side of the side light intercepting ring away from the reflective cup.

Optionally, a lens assembly is further provided between the side light cutting ring and the reflective cup.

Optionally, the lens assembly includes a plurality of lens bodies and a connecting portion between the lens bodies, the connecting portion is connected between adjacent lens bodies, and the plurality of lens bodies are correspondingly disposed on a plurality of the reflecting surfaces. In the cup, the connecting part is provided at the mouth of the reflecting cup; the side light cutting ring is connected between the connecting part, the lens body and the corresponding reflecting cup.

Optionally, the lens assembly includes: a plurality of lens bodies and a carrier disposed on a side of the lens body away from the reflection cup; the plurality of lens bodies are correspondingly disposed in a plurality of the reflection cups; the carrier Parts are used to set the side light cut-off ring.

Optionally, the carrier comprises a carrier body, a first molding ring and a second molding ring;

The carrier body includes a plurality of light emitting holes, the first molding ring is arranged on the outer periphery of the carrier body and extends toward the carrier body away from the lens body; the second molding ring is formed by the hole walls of the plurality of light emitting holes extending toward the direction away from the lens body; when the side light intercepting ring is installed on the first molding ring, the light emitting channel is correspondingly sleeved on the second molding ring.

Optionally, the side light cutting ring is made of light-absorbing material, and the light-absorbing material is selected from one or more of the following materials: metal materials, resins, and plastics.

Optionally, an electroplating layer for specular reflection is provided on the reflective surface of the reflective cup.

The invention also provides a method for preparing a light-emitting device, which method includes:

S100. Divide the substrate into multiple light-emitting areas, and arrange at least one LED chip in each light-emitting area;

S200. Set light-transmitting glue on the bottom of each LED chip and/or mold, and use the mold to shape each light-transmitting glue into a light-transmitting glue structure;

S300. Fill the gap between the substrate and the mold with highly reflective glue and solidify it to form multiple reflective cups;

S400. Remove the mold, and set side light cutoff rings for absorbing side light on multiple reflective cups;

Wherein, the side light interception ring includes a plurality of light exit channels for limiting the light exit angle, and the plurality of light exit channels are arranged correspondingly to the plurality of reflective cups.

Optionally, step S400 includes the following steps:

S401. Install a lens assembly on the side of the side light cutting ring away from the reflection cup.

Optionally, step S400 further includes the following steps:

S402. Install a lens assembly at the reflection cup;

S403: Install the side light intercepting ring on a side of the lens assembly away from the reflective cup.

Optionally, step S400 includes the following steps:

S404, placing the side light interception ring preparation material on the cup mouth of the reflection cup;

S405. Provide connection parts between multiple lens bodies to form a lens assembly;

S406. Place multiple lens bodies in the reflective cup, cure the side light cut-off ring preparation material to form a side light cut-off ring, and solidify the side light cut-off ring preparation material to connect the lens assembly and the side light cut-off ring. The reflective cup.

Optionally, step S400 includes the following steps:

S407. Prepare a lens assembly; wherein, the lens assembly includes a carrier and a plurality of lens bodies arranged on the carrier. The carrier includes: a carrier body, a first molding ring and a second molding ring, and a light outlet is provided on the carrier body. , the first molding ring is disposed on the outer periphery of the carrier body and extends toward the direction away from the lens body, and the second molding ring is directed away from the lens body from the hole walls of the plurality of light exit holes. extended;

S408, disposing the carrier body on a side of the reflector cup away from the substrate, so that each lens body is correspondingly disposed in each reflector cup;

S409: Inject the side light cutting ring preparation material between the first forming ring and the second forming ring to form the side light cutting ring.

Optionally, a plurality of the light emitting channels and a plurality of the reflecting cups are arranged in one-to-one correspondence.

The invention provides a light-emitting device and a preparation method thereof, which have the following advantages: first, the light-emitting device is provided with different light-emitting areas on the substrate, and reflective cups are provided between the light-emitting areas. The reflective cup achieves preliminary control of the beam angle. effect, and improve the light extraction efficiency of the light-emitting device; secondly, in order to meet the demand for a smaller beam angle, the directionality of the light is further enhanced by adding a side light cutoff ring, so that the light-emitting device independently emits a beam with a beam angle of less than 40°. At the same time, uniform light emission is ensured; finally, the light-emitting device of the present invention can also place a condenser lens in the reflection cup to ensure the light concentration effect, or place an even light lens on one side of the reflection cup to increase the uniformity of light emission. In summary, the light-emitting device achieves the technical effects of being small in size, capable of achieving light emission at a small beam angle, high light extraction efficiency, and uniform light emission. In addition, the light-emitting device has a simple structure, a convenient preparation method, and low cost.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be further described below in conjunction with the accompanying drawings and examples. In the accompanying drawings:

Figure 1 is a schematic structural diagram of a light-emitting device provided by Embodiment 1 of the present invention;

Figure 2 is a schematic structural diagram of the light-emitting area in Embodiment 1 of the present invention;

Figure 3 is a schematic structural diagram of a lens assembly according to Embodiment 2 of the present invention;

Figure 4 is a schematic structural diagram of a lens assembly according to Embodiment 3 of the present invention;

Figure 5 is a schematic structural diagram of a lens assembly according to Embodiment 4 of the present invention;

Figure 6 is a schematic structural diagram of a light-emitting device according to Embodiment 4 of the present invention;

Figure 7 is an exploded schematic diagram of the light-emitting device according to Embodiment 5 of the present invention;

Figure 8 is a schematic structural diagram of a light-emitting device according to Embodiment 5 of the present invention;

Figure 9 is a flow chart of a method for manufacturing a light-emitting device according to Embodiment 2 of the present invention;

Figure 10 is a mold diagram when the light-transmitting glue structure is formed according to the present invention;

11 is a schematic structural diagram of the upper mold of the present invention;

Figure 12 is a mold diagram when forming a reflective cup according to the present invention;

Figure 13 is a flow chart of a method for manufacturing a light-emitting device according to Embodiment 2 of the present invention;

Figure 14 is a flow chart of step S400 in the method for manufacturing a light-emitting device according to Embodiment 3 of the present invention;

Figure 15 is a flow chart of step S400 in the method for manufacturing a light-emitting device according to Embodiment 4 of the present invention;

FIG. 16 is a flow chart of step S400 in the method for preparing a light-emitting device according to the fifth embodiment of the present invention.

Detailed ways

In order to enable those skilled in the art to more clearly understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

Embodiment 1

As shown in Figure 1, the present invention discloses a light-emitting device, including: a substrate 100; a plurality of light-emitting areas 110 provided on the substrate 100 (see Figure 2 for details); and at least one light-emitting area provided on each light-emitting area 110. One LED chip 111; a light-transmitting glue structure 120 correspondingly provided on the LED chip 111; a plurality of reflective cups 130 formed by high-reflective glue provided on the substrate 100; provided on a plurality of the reflective cups 130 for The side light cutting ring 140 absorbs side light. The side light cutting ring 140 includes a plurality of light exit channels 141 , and the plurality of light exit channels 141 are arranged corresponding to the plurality of reflective cups 130 . This light-emitting device is provided with different light-emitting areas 110 on the substrate 100, and reflective cups 130 are provided between the light-emitting areas 110. By controlling the reflective cups 130, the effect of preliminary control of the beam angle is achieved, and the light extraction efficiency of the light-emitting device is improved; at the same time, in order to To meet the demand for a smaller beam angle, the directionality of the light is further enhanced by adding the side light cutoff ring 140, so that the light-emitting device can independently emit a beam with a beam angle of less than 40°, while ensuring uniform light output. Therefore, by applying this embodiment, a light-emitting device that can independently emit a light beam with a small beam angle without the assistance of other optical components can be truly obtained, and the light-emitting device has the characteristics of small size, good light concentration effect, high light extraction efficiency and uniform light emission. technical effects.

Alternatively, the LED chip 111 may be a regular chip or a flip chip. It can be understood that it can also be other light-emitting elements, such as LED lamp beads, etc., as long as it can emit light, there is no limitation here. In this embodiment, the reflective cup 130 is formed on the substrate 100 with highly reflective glue, and the side of the reflective cup 130 close to the substrate 100 is connected to the light-transmitting glue structure 120 and/or the side of the LED chip 111 . Among them, the LED chip 111 may only include an LED chip, or may include the LED chip 111 and the original fluorescent glue structure and/or transparent glue structure of the LED chip 111. The light-transmitting glue structure 120 may be directly provided on the LED chip 111 through this embodiment. The single-layer or multi-layer fluorescent glue structure and/or the transparent glue structure on the LED chip 111, and the single-layer or multi-layer fluorescent glue structure and/or the transparent glue structure provided in this embodiment on the original fluorescent glue structure and/or transparent glue structure of the LED chip 111. Or transparent glue structure. Preferably, the plurality of light emitting channels 141 and the plurality of reflecting cups 130 are arranged in one-to-one correspondence, so that the light emitting is more uniform. The substrate 100 may be an MCPCB substrate 100 (made of aluminum, mirror aluminum or copper), a ceramic substrate 100, a glass substrate 100, an FR4 substrate 100 or a BT substrate 100.

Optionally, each light-transmitting glue structure 120 covers the top surface and side surface of the corresponding LED chip 111 to make the light emission more uniform. The light-transmitting glue structure 120 does not have a shape design, which makes the processing technology simple and convenient, as long as it covers the LED chip 111. Of course, it can also be a bowl-shaped, trapezoidal, arc-shaped, etc. shape to achieve the actual requirements. Required brightness and irradiation range. It is understood that the light-transmitting glue structure 120 can be a transparent glue structure or a translucent glue structure, as long as it can transmit light, which is not limited here. It can be made of fluorescent glue or other mixtures of fluorescent materials and resins. Made to cover the LED chip 111. This fluorescent glue can be visible light fluorescent glue or infrared fluorescent glue, and the wavelength range of the light emitted from the LED chip 111 covered with fluorescent glue also ranges from 350 nm to 2000 nm.

The side light cut-off ring 140 is installed on the side of the reflective cup 130 away from the substrate 100. The side light cut-off ring 140 has the function of absorbing light and can be black, gray or white. It is not limited here and can be as follows: Made of any material or their mixture: metal, plastic, resin and other materials, the metal surface can be further blackened to achieve better light absorption effect. By arranging the light outlet channel 141 on the side light cutoff ring 140, the side light emitted from the reflective cup 130 is cut off, and a light beam of the light emitting device with a small angle is obtained, and the light output is uniform and the outline of the beam is clear.

As shown in Figure 2, when the LED chip is a formal chip, the size of each light-emitting area 110 can be selected and set according to actual needs. In this embodiment, the sizes of different light-emitting areas 110 are consistent, making processing simpler. A plurality of adjacent light-emitting areas 110 are connected in series or in parallel via wires 150 to form a light-emitting circuit 160 . In this embodiment, the light-emitting line 160 is a curve, but it can also be a straight line, which is not limited here. By controlling the power supply of the light-emitting circuit 160 through the circuit, the effect of adjusting the light brightness of the light-emitting device can be achieved. Each light-emitting area 110 includes at least one LED chip 111 to complete the light-emitting function of the light-emitting area 110 . In this embodiment, an LED chip 111 is provided in the light-emitting area 110 (see Figure 1 for details). Since the reflective cups 130 are disposed between adjacent light-emitting areas 110 (see FIG. 1 for details), the wires 150 are simultaneously covered by the adjacent light-transmitting glue structures 120 and the reflective cups 130 .

Optionally, in this embodiment, an electroplating layer can also be provided on the reflective surface of the reflective cup 130. The reflective surface of the shaped reflective cup 130 reflects light as diffuse reflection. By providing the electroplated layer, the reflective cup 130 can reflect light. Light is reflected specularly, and the light extraction efficiency is higher.

The light-emitting device has different light-emitting areas 110 on the substrate 100, and reflective cups 130 are set between the light-emitting areas 110. The preliminary beam angle can be controlled by controlling the ratio of the diameter of the circumscribed circle of the light-emitting area 110 to the diameter of the mouth of the reflective cup 130. To control, the effect of preliminary control of the beam angle is achieved through the reflective cup 130, and the light extraction efficiency of the light-emitting device is improved. Furthermore, by adding the side light cutting ring 140 and selecting the diameter of the light outlet channel 141, the directionality of the light is further enhanced to meet the requirement of a smaller beam angle, while making the light output uniform and the outline of the light beam clear. Among them, the ratio of the diameter of the circumscribed circle of the light-emitting area 110 to the diameter of the mouth of the reflecting cup 130 and the diameter of the light emitting channel 141 can be selected and adjusted according to actual needs. Therefore, the light-emitting device can provide small-angle beams (for example, small-angle beams with beam angles of 10°, 20°, etc.) without additional optical devices. On the one hand, it can be used directly as a built-in light-emitting device; on the other hand, it can also be used directly as a lighting device such as a lighting fixture, without the need for other additional optical devices to obtain a light beam with a small beam angle. Therefore, by applying this embodiment, a light-emitting device that can independently emit a light beam with a small beam angle without the assistance of other optical components can be truly obtained, and the light-emitting device has the characteristics of small size, good light concentration effect, high light extraction efficiency and uniform light emission. technical effects.

Embodiment 2

As shown in FIG. 3 , the structural difference between the second embodiment and the first embodiment is that in this embodiment, a lens assembly 200 is provided on the side of the side light cutting ring 140 away from the reflection cup 130 . In this embodiment, , the light-transmitting component 200 includes a uniform light lens to make the light output more uniform. In other embodiments, it may also include a condenser lens to condense the light leaving the reflective cup 130, which is not limited here. The advantage of implementing this embodiment is that the light emission is more uniform and can have a light condensing effect.

Embodiment 3

As shown in FIG. 4 , in this embodiment, the structural difference between Embodiment 3 and Embodiment 2 lies in the position of the lens assembly 200 . In this embodiment, there is a gap between the side light cutoff ring 140 and the reflection cup 130 . A lens assembly 200 is provided. In this embodiment, a lens assembly 200 is provided on the side of the side light cutting ring 140 close to the reflecting cup 130. In this embodiment, the light-transmitting assembly 200 includes a uniform light lens, so that the light emission is more uniform. In other embodiments, it may also be a condenser lens or may also include a condenser lens, which is not limited here. When the light-transmitting assembly 200 includes a condenser lens, it may include a plurality of condenser lenses (not shown), and the condenser lenses are correspondingly disposed in the reflection cups 130 to condense the light emitted from each reflection cup 130, Compared with the technical solution of Embodiment 2, the condenser lens is disposed in the reflective cup 130 to further save space and make the light-emitting device smaller.

Embodiment 4

As shown in Figure 5, in this embodiment, the difference between the structures of Embodiment 4 and Embodiment 3 lies in the structure of the lens assembly 200. The lens assembly 200 includes a plurality of lens bodies 210 and connections between the lens bodies 210. The connecting portion 220 is connected between adjacent lens bodies 210 .

Referring to FIG. 6 in conjunction with FIG. 5 , a plurality of lens bodies 210 are correspondingly arranged in a plurality of reflective cups 130 , the connecting portion 220 is arranged at the mouth of the reflecting cup 130 , and the side light cutting ring 140 is connected to the connecting portion 220 and the lens body 210 and the corresponding reflective cup 130. Preferably, the lens body 210 has the same shape and size as the reflective cup 130 . It can be understood that the lens body 210 and the connecting portion 220 can be integrally formed from the same material, making the preparation process of the light-emitting device simpler and the assembly process more convenient.

The advantage of implementing this embodiment is that the light-emitting device of this embodiment has a light condensing effect, and the side light cutting ring 140 is clamped between the connecting part 220, the lens body 210 and the reflective cup 130 corresponding to them to cause light emission. The device is more convenient to install and smaller in size.

Embodiment 5

As shown in FIG. 7 , in this embodiment, the difference between the structures of the fifth embodiment and the third embodiment lies in the structure of the lens assembly 200. The lens assembly 200 includes: a plurality of lens bodies 210 and a carrier 230 disposed on a side of the lens body 210 away from the reflective cup 130. The plurality of lens bodies 210 are correspondingly disposed in the plurality of reflective cups 130.

As shown in FIG8 , the carrier 230 is used to set the side light intercepting ring 140. The carrier 230 includes a carrier body 231, a first molding ring 232 and a second molding ring 233; the carrier body 231 includes a plurality of light exit holes 234, the first molding ring 232 is arranged on the outer periphery of the carrier body 231 and extends in the direction away from the lens body 210 toward the carrier body 231; the second molding ring 233 is formed by the hole wall of the light exit hole 234 extending in the direction away from the lens body 210; when the side light intercepting ring 140 is installed on the first molding ring 232, the light exit channel 141 (see FIG1 for details) is correspondingly sleeved on the second molding ring 233. It can be understood that there is a gap between adjacent second molding rings 233 for the light exit channel 141 of the side light intercepting ring 140 to be sleeved outside the second molding ring 233.

Preferably, in this embodiment, the carrier 230 and the side light cutting ring 140 can be integrally formed from the same material, making the preparation process of the light-emitting device simpler and the assembly process more convenient.

The advantage of implementing this embodiment is that the side light intercepting ring 140 is easy to install, and the second molding ring 233 ensures that the shape and edge of the channel wall of the light outlet channel 141 are relatively smooth, so that the light output of each light outlet channel 141 is uniform.

Embodiment 6

The present invention also provides a preparation method for preparing the light-emitting device in the above-mentioned Embodiment 1, as shown in Figure 9, which includes the following steps:

S100. Divide the substrate into multiple light-emitting areas, and arrange at least one chip in each light-emitting area;

S200. Set light-transmitting glue on the bottom of each LED chip and/or mold, and use the mold to shape each light-transmitting glue into a light-transmitting glue structure;

S300. Fill the gap between the substrate and the mold with highly reflective glue and solidify it to form multiple reflective cups;

S400. Remove the mold, and set side light cutoff rings for absorbing side light on multiple reflective cups;

Wherein, the side light cutting ring includes a plurality of light-emitting channels for limiting the light-emitting angle, and the plurality of light-emitting channels are arranged corresponding to the plurality of reflective cups.

As shown in FIG. 10 , the mold 700 includes an upper mold 710 and a lower mold 720 . The lower mold 720 is used to fix a substrate on which a light-emitting circuit formed by a plurality of light-emitting areas connected by wires is disposed.

Referring to Figure 11 in conjunction with Figure 10, the upper mold 710 has a plurality of sub-molds 711, each sub-mold 711 having a cup-shaped body 711a and a bottom 711b. When the mold 700 is used to form the light-transmitting glue structure, the light-transmitting glue can be placed on the bottom 711b, or the light-transmitting glue can be placed on the top of the light-emitting area, which is not limited here. The upper mold 710 is positioned above the lower mold 720 by passing the positioning posts 721 on the lower mold 720 through the positioning holes 712 of the upper mold 710 . When the upper mold 710 is positioned above the lower mold 720, each sub-mold 711 is located just above the corresponding LED chip, so that when the upper mold 710 is pressed down, the bottom 711b of each sub-mold 711 will be in contact with the corresponding transparent hole on the LED chip. The light glue is formed into a light-transmitting glue structure. Each light-transmitting glue structure 120 covers the top surface of the LED chip and partially encapsulates the wires. It should be noted that during the molding process of the light-transmitting glue structure 120, the bottom 711b of the sub-mold 711 should only contact the glue and not the LED chip or wires to avoid damage to the LED chips or wires.

As shown in Figure 12, in step 300, after step 200, the light-transmitting glue structure has been formed on the top surface of the LED chip. At this time, highly reflective glue is injected to fill the gap between the base 100 and the upper mold 710 . Highly reflective glue is injected into the gap between the upper mold 710 and the substrate 100, encapsulating the remainder of the wires. Because the top surface of each LED chip is covered by the molded light-transmitting glue structure 120, and due to the existence of the sub-mold 711 (see Figure 11 for details), the injected high-reflective glue cannot reach above the top surface of the LED chip. Therefore, the molding The reflective cup at the back will not block the light output of the LED chip. The wavelength of the highly reflective glue is selected based on the wavelength of light emitted by the LED chip. Preferably, the high-reflective glue is highly reflective silica with a reflectivity greater than 70%.

As shown in Figure 13, when preparing the second embodiment above, step S400 includes the following steps:

S401. Install a lens assembly on the side of the side light cutting ring away from the reflection cup.

As shown in Figure 14, when preparing the above-mentioned Embodiment 3, step S400 includes the following steps:

S402. Install a lens assembly at the reflection cup;

S403. Install the side light cutting ring on the side of the lens assembly away from the reflection cup.

As shown in Figure 15, when preparing the above-mentioned Embodiment 4, step S400 includes the following steps:

S404. Arrange the side light cut-off ring preparation material on the mouth of the reflective cup;

S405. Provide connection parts between multiple lens bodies to form a lens assembly;

S406. Place multiple lens bodies in the reflective cup, cure the side light cut-off ring preparation material to form a side light cut-off ring, and solidify the side light cut-off ring preparation material to connect the lens assembly and the side light cut-off ring. The reflective cup.

As shown in FIG. 16 , when preparing the fifth embodiment, step S400 includes the following steps:

S407. Prepare a lens assembly; wherein, the lens assembly includes a carrier and a plurality of lens bodies arranged on the carrier. The carrier includes: a carrier body, a first molding ring and a second molding ring, and a light outlet is provided on the carrier body. , the first molding ring is disposed on the outer periphery of the carrier body and extends toward the direction away from the lens body, and the second molding ring is directed away from the lens body from the hole walls of the plurality of light exit holes. extended;

Preferably, in this embodiment, the bearing member and the plurality of lens bodies are integrally formed using the same material through a mold.

S408. Arrange the carrier body on the side of the reflection cup away from the substrate, so that each lens body is correspondingly disposed in each reflection cup;

S409, injecting a material for preparing a side light cutoff ring between the first molding ring and the second molding ring to form a side light cutoff ring.

It can be understood that there is a gap between adjacent second forming rings for the side light cutting ring preparation material to flow into the space between the adjacent second forming rings through capillary action to form the side light cutting ring.

To sum up, the preparation method is convenient and low-cost. The prepared light-emitting device has a simple structure, a small size, can realize light emission at a small beam angle, has high light extraction efficiency and uniform light emission.

It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the protection scope of the appended claims of the present invention.

Claims (9)

1. A light emitting device, comprising: substrate(100); A plurality of light-emitting regions (110) arranged on the substrate (100); At least one LED chip (111) provided on each light-emitting area (110); A light-transmitting adhesive structure (120) correspondingly arranged on the LED chip (111); A plurality of reflective cups (130) formed by high-reflective glue provided on the substrate (100); A side light interception ring (140) is arranged on the plurality of reflection cups (130) and is used for absorbing side light, the side light interception ring (140) comprising a plurality of light exit channels (141), and the plurality of light exit channels (141) are arranged corresponding to the plurality of reflection cups (130); The side light interception ring (140) is made of a light absorbing material, and the light absorbing material is selected from one or more of the following materials: metal material, resin, and plastic; the side light interception ring (140) is mounted on a side of the reflective cup (130) away from the substrate (100); It also includes a light-transmitting component (200), which includes a uniform light lens; the light-transmitting component (200) is provided between the side light cut-off ring (140) and the reflective cup (130). space, or arranged on the side of the side light cutting ring (140) away from the reflective cup (130). 2. The light emitting device according to claim 1, characterized in that the plurality of light emitting channels (141) and the plurality of reflective cups (130) are arranged in one-to-one correspondence. 3. The light-emitting device according to claim 1 is characterized in that the light-transmitting component (200) comprises a plurality of lens bodies (210) and a connecting portion (220) located between the lens bodies (210), the connecting portion (220) is connected between adjacent lens bodies (210), the plurality of lens bodies (210) are correspondingly arranged in a plurality of reflective cups (130), and the connecting portion (220) is arranged at the cup mouth of the reflective cup (130); the side light intercepting ring (140) is connected between the connecting portion (220), the lens body (210) and the corresponding reflective cup (130). 4. The light-emitting device according to claim 1, characterized in that the light-transmitting component (200) includes: a plurality of lens bodies (210) and a lens body (210) arranged away from the reflective cup (130). On the side of the carrier (230), a plurality of lens bodies (210) are correspondingly arranged in a plurality of the reflection cups (130); the carrier (230) is used to set the side light cut-off ring (140). 5. The light-emitting device according to claim 4, wherein the carrier (230) includes a carrier body (231), a first molding ring (232) and a second molding ring (233); The carrier body (231) includes a plurality of light exit holes (234), and the first forming ring (232) is disposed on the outer periphery of the carrier body (231) and faces the carrier body (231). Extending in a direction away from the lens body (210); the second forming ring (233) is formed by extending from the hole walls of the plurality of light exit holes (234) in a direction away from the lens body (210); when When the side light cutting ring (140) is installed on the first molding ring (232), the light outlet channel (141) is correspondingly sleeved on the second molding ring (233). 6. The light-emitting device according to claim 1, characterized in that an electroplating layer for specular reflection is provided on the reflective surface of the reflective cup (130). 7. A method for preparing a light-emitting device, characterized in that the method includes: S100, dividing the substrate into a plurality of light-emitting areas, and disposing at least one LED chip in each light-emitting area; S200. Set light-transmitting glue on the bottom of each LED chip and/or mold, and use the mold to shape each light-transmitting glue into a light-transmitting glue structure; S300. Fill the gap between the substrate and the mold with highly reflective glue and solidify it to form multiple reflective cups; S400. Remove the mold, and set side light cutoff rings for absorbing side light on multiple reflective cups; Wherein, the side light interception ring includes a plurality of light exit channels for limiting the light exit angle, and the plurality of light exit channels are arranged correspondingly to the plurality of reflective cups; Step S400 includes the following steps: S401. Install a lens assembly on the side of the side light cut-off ring away from the reflection cup, or install a lens assembly on the reflection cup and install the side light on the side of the lens assembly away from the reflection cup. Cut off the ring. 8. The preparation method according to claim 7, characterized in that step S400 includes the following steps: S404. Arrange the side light cut-off ring preparation material on the mouth of the reflective cup; S405. Provide connection parts between multiple lens bodies to form a lens assembly; S406. Place multiple lens bodies in the reflective cup, cure the side light cut-off ring preparation material to form a side light cut-off ring, and solidify the side light cut-off ring preparation material to connect the lens assembly and the side light cut-off ring. The reflective cup. 9. The preparation method according to claim 7, characterized in that step S400 comprises the following steps: S407. Prepare a lens assembly; wherein, the lens assembly includes a carrier and a plurality of lens bodies arranged on the carrier. The carrier includes: a carrier body, a first molding ring and a second molding ring, and a light outlet is provided on the carrier body. , the first molding ring is disposed on the outer periphery of the carrier body and extends toward the direction away from the lens body, and the second molding ring is directed away from the lens body from the hole walls of the plurality of light exit holes. extended; S408. Arrange the carrier body on the side of the reflection cup away from the substrate, so that each lens body is correspondingly disposed in each reflection cup; S409, injecting a material for preparing a side light cutoff ring between the first molding ring and the second molding ring to form a side light cutoff ring.