CN112939487B - Sandwich type glass microfluidic chip double-sided laser processing device and method - Google Patents

Abstract

The application relates to a double-sided laser processing device and method for a sandwich type glass microfluidic chip. The application sandwich type glass micro-fluidic chip double-sided laser processing device includes: the device comprises double-layer glass, a metal powder layer, a thickness control plate, a clamping buckle, a sealing paste and a laser emitter; an accommodating gap is formed between the double layers of glass; the metal powder layer is paved in the accommodating gap; the cross section of each thickness control plate is trapezoidal, the two thickness control plates are respectively arranged on two sides of the double-layer glass, and the inclined edge of each trapezoid is tightly matched with the accommodating clearance; the sealing paste is pasted on one of the other two sides of the accommodating gap; the clamping buckles are clamped on the double-layer glass in a fastening mode and are clamped on two sides corresponding to the accommodating gaps in a fastening mode. The sandwich type glass micro-fluidic chip double-sided laser processing device and method have the advantages of being simple in structure and convenient to achieve.

Description

Sandwich type glass microfluidic chip double-sided laser processing device and method

technical field

The present application relates to a processing device and method, in particular to a double-sided laser processing device and method for a sandwich glass microfluidic chip.

Background technique

Microfluidic chips integrate micron-scale flow channels, micropores and other structures, which can react chemical reagents, separate cells, and detect viruses, and are widely used in chemical, biomedical and other fields. Silicon-based glass has the advantages of chemical high temperature resistance, corrosion resistance, and stable performance. It is a commonly used high-performance material for preparing microchannels, but its processing is difficult. Commonly used processing methods for structures such as microchannels are chemical etching, mechanical grinding, and hot embossing. Chemically etched microchannels need complex processes such as surface treatment, photoresist coating, optical exposure, and development to obtain processing auxiliary templates, and then hydrofluoric acid corrosion to obtain formed microchannels. The whole process is cumbersome, costly, and not environmentally friendly. ; Mechanical grinding and processing of glass micro-channels requires the manufacture of abrasive micro-tips to control the stress when the tool abrasives are in contact with the glass; hot embossing needs to form microstructures in the state of glass hot-melt softening, and then cool and solidify, which is difficult Micro-molded glass with a high point transition temperature. Laser processing can better solve the above-mentioned problems, but the existing laser processing microfluidic channels focus on materials with high-energy laser beams, and ablate micro-nano structures. Transparent materials such as glass require expensive ultraviolet laser processing, and it is difficult for low-cost infrared lasers to directly process materials with strong light transmission (such as glass).

Contents of the invention

Based on this, the purpose of this application is to provide a double-sided laser processing device and method for a sandwich glass microfluidic chip, which has the advantages of simple structure and easy realization of microstructure processing of glass plates.

In one aspect of the present application, a double-sided laser processing device for a sandwich glass microfluidic chip is provided, including double-layer glass, a metal powder layer, a thickness control plate, a clamping buckle, a sealing sticker, and a laser emitter;

An accommodating gap is formed between the double-layer glass;

The metal powder layer is tiled in the accommodation gap;

The cross-sectional shape of the thickness control plate is trapezoidal, and the two thickness control plates are respectively installed on both sides of the double-glazed glass, and the hypotenuse of the trapezoid is closely matched with the accommodation gap;

One of the other two sides of the accommodating gap is pasted with the sealing sticker;

The clamping buckle is tightly clamped on the double-layer glass, and is firmly clamped on both sides corresponding to the accommodation gap;

The laser emitter is placed on one side of the double-layer glass, and the laser beam emitted by the laser emitter is focused on the metal powder layer.

The sandwich-type glass microfluidic chip double-sided laser processing device described in this application controls the temperature field of the laser on the surface of the metal powder and the double-layer glass by controlling the composition and thickness of the metal powder sandwiched between the double-layer glass. Microfluidic channels are simultaneously processed on the glass surface. It can process two pieces of glass at the same time, and the matching precision of the two pieces of glass is high. Compared with the existing laser processing microstructure method, the device and method are simple in operation and high in efficiency, and are beneficial to mass processing of the surface microstructure of the glass microfluidic chip.

Further, the double-layer glass includes two transparent glass plates, and the two transparent glass plates are arranged in parallel and relatively spaced apart to form the accommodation gap;

The clamping buckles are respectively clamped on the outer sides of the two transparent glass plates;

The two slopes of the thickness control plate abut against the two transparent glass plates respectively;

The sealing sticker is pasted on the two transparent glass plates;

The metal powder layer is placed in the accommodation gap between the two transparent glass plates;

The laser emitter is placed on one side of the transparent glass plate.

Further, a feeding funnel is also included, and the feeding funnel communicates with the accommodating gap;

The feed funnel is placed on the opposite side of the double-glazed glass to which the sealing sticker is attached.

Further, a vibration platform is also included, the double-layer glass is vertically placed on the vibration platform, and the feeding funnel is placed above the double-layer glass.

Further, a fastening mechanism is also included, and the double-layer glass is placed on the fastening mechanism, and is installed and fastened with the fastening mechanism.

Further, the fastening mechanism includes a clamp base, a pressure block and fastening bolts; the pressure block is fastened to the clamp base through the fastening bolts, and the double-layer glass is placed flat on the clamp on the base, and the two sides of the double-glazed glass are respectively pressed on the clamp base by the pressing blocks.

Further, the metal powder layer includes a copper powder layer, a stainless steel powder layer or an iron powder layer.

Further, the cross-section of the clamping buckle is "C"-shaped, and the clamping buckle is a metal buckle.

In one aspect of the present application, a double-sided laser processing method for a sandwich glass microfluidic chip is provided, comprising steps:

A double-sided laser processing device for a sandwich glass microfluidic chip as described in any of the above schemes is provided;

Through the vibration of the vibration platform, the metal powder enters the accommodation gap from the feeding hopper, and forms the metal powder layer;

By rotating the double-layer glass and laying it flat on the fixture base, emitting laser and focusing the laser beam inside the metal powder layer, adjusting the laser processing parameters, the metal powder absorbs and melts the laser energy, making the two transparent glass plates process a microstructure .

Further, after the microstructure is processed, the surface of the microstructure is cleaned with dilute hydrochloric acid or dilute nitric acid.

For better understanding and implementation, the present application will be described in detail below in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a three-dimensional structure of an exemplary sandwich glass microfluidic chip double-sided laser processing device in use in the present application;

FIG. 2 is a front view of another usage state of an exemplary sandwich glass microfluidic chip double-sided laser processing device of the present application;

3 is a top view of a state of an exemplary sandwich glass microfluidic chip double-sided laser processing device of the present application;

Fig. 4 is a schematic top view of the assembly relationship between the exemplary double-layer glass and the thickness control panel of the present application;

FIG. 5 is a schematic diagram of a microstructure (microfluidic channel) processed and formed by using an exemplary sandwich glass microfluidic chip double-sided laser processing device of the present application.

Detailed ways

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and The description is simplified, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus should not be construed as limiting the application. In the description of the present application, unless otherwise specified, "plurality" means two or more.

Fig. 1 is a schematic diagram of the three-dimensional structure of an exemplary sandwich glass microfluidic chip double-sided laser processing device of the present application; Fig. 2 is a schematic diagram of the double-sided laser processing device of the sandwich type glass microfluidic chip exemplary of the present application Another front view of the use state; FIG. 3 is a top view of a state of an exemplary sandwich glass microfluidic chip double-sided laser processing device of the present application; FIG. 4 is an exemplary double-layer glass and thickness control board of the present application Fig. 5 is a schematic diagram of a microstructure (microfluidic channel) processed and formed by using an exemplary sandwich glass microfluidic chip double-sided laser processing device of the present application.

Please refer to Figures 1-5, an exemplary double-sided laser processing device for sandwich glass microfluidic chips in this application, including double-layer glass 3, metal powder layer 1, thickness control plate 4, clamping buckle 5, Sealing sticker 7 and laser emitter 12;

An accommodating gap is formed between the double-layer glass 3;

The metal powder layer 1 is tiled in the accommodation gap;

The cross-sectional shape of the thickness control plate 4 is trapezoidal, and the two thickness control plates 4 are installed on both sides of the double-glazed glass 3 respectively, and the hypotenuse of the trapezoid fits closely with the accommodating gap;

One of the other two sides of the accommodating gap is pasted with the sealing sticker 7;

The clamping buckle 5 is tightly clamped on the double-glazed glass 3, and is firmly clamped on both sides corresponding to the accommodating gap;

The laser emitter 12 is placed on one side of the double-layer glass 3 , and the laser beam 11 emitted by the laser emitter 12 is focused on the metal powder layer 1 . By adjusting the relative depth between the thickness control plate 4 and the double-layer glass 3 , the distance between the double-layer glass 3 is adjusted, thereby realizing the adjustment of the width of the accommodating gap.

In some preferred embodiments, the double-layer glass 3 includes two transparent glass plates, and the two transparent glass plates are arranged in parallel and spaced apart from each other to form the accommodation gap;

The clamping buckles 5 are respectively clamped on the outer sides of the two transparent glass plates;

The two slopes of the thickness control plate 4 respectively abut against the two transparent glass plates;

The seal sticker 7 is pasted on the two transparent glass plates;

The metal powder layer 1 is placed in the accommodation gap between the two transparent glass plates;

The laser emitter 12 is placed on one side of the transparent glass plate.

The cross-section of the thickness control plate 4 is trapezoidal, and the two hypotenuses of the trapezoid abut against the two corresponding transparent glass plates respectively. By adjusting the depth of the relative accommodation gap of the thickness control plate 4, the relative distance between the two transparent glass plates is adjusted. Then adjust the thickness of the accommodation gap.

In some preferred embodiments, the transparent glass plate is made of transparent, hard and brittle materials such as ultra-clear glass, K9 optical glass or quartz glass, and its thickness is 1-3mm.

In some preferred embodiments, the thickness control plate 4 is made of metal foil, polymer and other materials.

In some preferred embodiments, a feed funnel 2 is also included, and the feed funnel 2 communicates with the accommodation gap;

The feed funnel 2 is placed on the opposite side of the double-layer glass 3 on which the sealing sticker 7 is attached.

In some preferred embodiments, a vibration platform 6 is also included, the double-layer glass 3 is vertically placed on the vibration platform 6 , and the feeding funnel 2 is placed above the double-layer glass 3 .

In some preferred embodiments, the vibration mode of the vibration platform 6 is ultrasonic vibration or mechanical vibration. Further, the vibration frequency range of the vibration platform 6 is 1kHz-60kHz, the power is 3-50W, and the vibration duration is 8s-12s.

In some preferred embodiments, laser emitter 12 is an infrared laser.

In some preferred embodiments, a fastening mechanism is also included, and the double-layer glass 3 is laid flat on the fastening mechanism, and is installed and fastened with the fastening mechanism.

In some preferred embodiments, the fastening mechanism includes a clamp base 8, a pressure block 9 and a fastening bolt 10; the pressure block 9 is fastened to the clamp base 8 through the fastening bolt 10, so The double-layer glass 3 is placed flat on the clamp base 8, and both sides of the double-layer glass 3 are respectively pressed on the clamp base 8 by the pressing blocks 9.

In some preferred embodiments, the metal powder layer 1 includes a copper powder layer, a stainless steel powder layer or an iron powder layer.

In some preferred embodiments, the section of the clamping buckle 5 is "C" shaped, and the clamping buckle 5 is a metal buckle.

In some preferred embodiments, a convex portion is formed in the middle of the clamping buckle, and the convex portion abuts against the thickness control plate.

An exemplary double-sided laser processing method for a sandwich glass microfluidic chip in the present application, comprising steps:

A double-sided laser processing device for a sandwich glass microfluidic chip as described in any of the above schemes is provided;

Through the vibration of the vibration platform 6, the metal powder enters the accommodation gap from the feed hopper 2, and forms the metal powder layer 1;

By rotating the double-layer glass 3 and laying it flat on the fixture base 8, the laser is emitted and the laser beam 11 is converged inside the metal powder layer 1, and the laser processing parameters are adjusted. The metal powder absorbs and melts the laser energy, making two transparent glass plates A microstructure 13 is machined.

In some preferred embodiments, after the microstructure 13 is processed, the surface of the microstructure 13 is cleaned with dilute hydrochloric acid or dilute nitric acid. Further, then, the processed transparent glass plate is put into solutions such as alcohol and distilled water to clean in turn.

In some preferred embodiments, the thickness of the metal powder layer 1 is 100-300 μm, which is adjusted according to the melting point of the processed glass; when the transparent glass plate is high-melting point glass, it is necessary to increase the thickness of the metal powder appropriately so that the laser energy can be transmitted to the lower Microstructures 13 are machined on the metallic glass plate.

In some preferred embodiments, when the transparent glass plate is a low melting point transparent material such as K9 glass, the laser processing parameters are: laser power is 1-20W, scanning speed is 200mm/s-900mm/s, and the power percentage is 10%- 60%, frequency 20kHz-40kHz; processing times 1-30 times.

When the transparent glass plate is a high melting point transparent material such as quartz glass, the laser processing parameters are: laser power 3-30W, scanning speed 100mm/s-500mm/s, power 50%-95%, frequency 20kHz-40kHz ; Processing times are 10-25 times.

In some preferred embodiments, the metal powder is copper powder, stainless steel powder, iron powder, etc., which have a high absorption rate of laser energy, and the particle size diameter of the powder is 1-10 μm; the powder can be dry powder or wet powder.

In some preferred embodiments, during packaging, the microstructures 13 of the upper and lower transparent glass plates can be aligned and packaged together to form a microfluidic chip; or the upper and lower transparent glass plates can be respectively covered with glass packages with flat surfaces. Two pieces of microfluidic chips can be packaged by curing glue, electrostatic bonding, hot pressing and other methods.

The working principle of the exemplary sandwich glass microfluidic chip double-sided laser processing device in this application:

First, load powder. As shown in Figure 1, the double-layer glass 3 is placed vertically, and the metal powder is filled into the accommodation gap of the double-layer glass 3 through the feed funnel 2. At this time, the left and right sides of the accommodation gap are respectively sealed by the thickness control plate 4, and can be passed through The thickness control board 4 adjusts the gap width of the double-layer glass 3; after the gap width is adjusted, the double-layer glass 3 is clamped by the clamping buckle 5. The bottom of the accommodation gap is pasted with a sealing sticker 7, so that the left, right, bottom, and bottom directions of the accommodation gap are tightly sealed; through the vibration of the vibration platform 6, the metal powder can easily enter the accommodation gap and fill it up. At the same time, after filling the metal powder, the sealing sticker 7 can be pasted on the top of the accommodation gap, so as to seal the surroundings of the accommodation gap.

Second, laser processing. As shown in Fig. 2, the filled double-layer glass 3 is moved into the feeding funnel 2, and the sealing sticker 7 is pasted to make the surroundings of the accommodating gap sealed. Then the double-layer glass 3 is laid flat (or placed horizontally), the laser emitter 12 is placed on the top of the double-layer glass 3, and the double-layer glass 3 is clamped and fixed on the fixture base 8 by a pressing plate. The laser beam 11 of the laser emitter 12 converges, and the energy is aimed at the middle of the metal powder layer 1, and the metal powder absorbs the laser energy to melt the metal powder, and then thermally fuse the upper and lower transparent glass plates, thereby processing a microstructure.

Third, clean the package. After the processing is completed, the metal powder on the surface of the microstructure is cleaned and removed by acid, and then washed with alcohol or distilled water to obtain a clean glass plate with a microstructure, and finally a microfluidic chip is obtained through packaging. The structural pattern of the formed microchannel is shown in Fig. 4 .

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims (8)

1. The utility model provides a two-sided laser beam machining device of sandwich type glass micro-fluidic chip which characterized in that: the device comprises double-layer glass, a metal powder layer, a thickness control plate, a clamping buckle, a sealing paste and a laser emitter;

an accommodating gap is formed between the double layers of glass;

the metal powder layer is paved in the accommodating gap;

the cross section of each thickness control plate is trapezoidal, the two thickness control plates are respectively arranged on two sides of the double-layer glass, and the inclined edge of each trapezoid is tightly matched with the accommodating clearance;

the sealing paste is pasted on one of the other two sides of the accommodating gap;

the clamping buckles are tightly clamped on the double-layer glass and tightly clamped on two sides corresponding to the accommodating gaps;

the laser emitter is arranged on one side of the double-layer glass, and a laser beam emitted by the laser emitter is focused on the metal powder layer;

the feeding hopper is communicated with the accommodating gap;

the feeding hopper is arranged on the opposite side of the double-layer glass, which is pasted with the sealing paste;

the double-layer glass is vertically placed on the vibration platform, and the feeding hopper is placed above the double-layer glass;

the vibration mode of the vibration platform is ultrasonic vibration or mechanical vibration; the vibration frequency range of the vibration platform is 1kHz-60kHz, the power is 3-50W, and the vibration duration is 8s-12s.

2. The sandwich-type glass microfluidic chip double-sided laser processing device according to claim 1, wherein: the double-layer glass comprises two transparent glass plates which are arranged in parallel and are oppositely spaced, and the accommodating gap is formed;

the clamping buckles are respectively clamped at the outer sides of the two transparent glass plates;

the two inclined planes of the thickness control plate are respectively abutted against the two transparent glass plates;

the sealing paste is adhered to the two transparent glass plates;

the metal powder layer is arranged in a containing gap between the two transparent glass plates;

the laser emitter is arranged on one side of the transparent glass plate.

3. The sandwich type glass microfluidic chip double-sided laser processing device according to claim 2, characterized in that: the double-layer glass is flatly placed on the fastening mechanism and is fixedly installed with the fastening mechanism.

4. The sandwich-type glass microfluidic chip double-sided laser processing device according to claim 3, wherein: the fastening mechanism comprises a clamp base, a pressing block and a fastening bolt; the pressing block is fixedly connected to the clamp base through the fastening bolt, the double-layer glass is flatly placed on the clamp base, and two sides of the double-layer glass are respectively pressed on the clamp base through the pressing block.

5. The sandwich-type glass microfluidic chip double-sided laser processing device according to any one of claims 1 to 4, wherein: the metal powder layer comprises a copper powder layer, a stainless steel powder layer or an iron powder layer.

6. The sandwich-type glass microfluidic chip double-sided laser processing device according to any one of claims 1 to 4, wherein: the cross-section of centre gripping buckle is "C" font, just the centre gripping buckle is the metal buckle.

7. A double-sided laser processing method of a sandwich type glass microfluidic chip is characterized by comprising the following steps:

arranging the sandwich type glass microfluidic chip double-sided laser processing device of any one of claims 1 to 6;

the metal powder enters the containing gap from the feeding hopper through the vibration of the vibration platform and forms the metal powder layer;

by rotating the double-layer glass and horizontally placing the double-layer glass on the clamp base, laser is emitted and converged inside the metal powder layer, laser processing parameters are adjusted, and the metal powder absorbs and fuses laser energy, so that the two transparent glass plates are processed into the microstructure.

8. The sandwich-type glass microfluidic chip double-sided laser processing method according to claim 7, characterized in that: after the microstructure is machined, the surface of the microstructure is cleaned by dilute hydrochloric acid or dilute nitric acid.

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