[go: up one dir, main page]

CN105880956A - Microchannel heat exchanger with porous bottom face of micro-pore structures and manufacturing method of microchannel heat exchanger - Google Patents

Microchannel heat exchanger with porous bottom face of micro-pore structures and manufacturing method of microchannel heat exchanger Download PDF

Info

Publication number
CN105880956A
CN105880956A CN201610429493.XA CN201610429493A CN105880956A CN 105880956 A CN105880956 A CN 105880956A CN 201610429493 A CN201610429493 A CN 201610429493A CN 105880956 A CN105880956 A CN 105880956A
Authority
CN
China
Prior art keywords
microchannel
heat exchanger
laser
micro
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610429493.XA
Other languages
Chinese (zh)
Other versions
CN105880956B (en
Inventor
邓大祥
万伟
黄青松
谢炎林
连云淞
褚旭阳
覃宇
汪晓煜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen University
Original Assignee
Xiamen University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen University filed Critical Xiamen University
Priority to CN201610429493.XA priority Critical patent/CN105880956B/en
Publication of CN105880956A publication Critical patent/CN105880956A/en
Application granted granted Critical
Publication of CN105880956B publication Critical patent/CN105880956B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/0316—Assemblies of conduits in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)

Abstract

本发明公开了一种具有微孔隙结构多孔底面的微通道换热器及其制造方法，该微通道换热器包括上下贴合在一起的上顶板和下底板，所述下底板的上表面设有若干条平行间隔排布的微通道，所述微通道的水力直径为100～1000μm，所述微通道底面为具有大量微孔隙结构的多孔表面，所述微孔隙结构的孔径为1～200μm、深度为1～200μm，能够显著增大换热面积、增加汽化核心，从而显著增强微通道换热器的传热性能。制备时，先通过微细电火花线切割加工出平行微通道，再利用低功率脉冲激光器在微通道底面激光加工形成具有大量微孔隙结构的多孔表面。本发明制造方法能够实现大面积扫描加工，生产效率高，热影响区小，操作简单方便，成本低廉，无污染。

The invention discloses a microchannel heat exchanger with a porous bottom surface of a micropore structure and a manufacturing method thereof. There are several microchannels arranged in parallel at intervals. The hydraulic diameter of the microchannels is 100-1000 μm. The bottom surface of the microchannels is a porous surface with a large number of micropore structures. The depth is 1-200 μm, which can significantly increase the heat exchange area and increase the vaporization core, thereby significantly enhancing the heat transfer performance of the microchannel heat exchanger. During preparation, parallel microchannels are processed by micro electric discharge wire cutting, and then a porous surface with a large number of micropore structures is formed by laser processing on the bottom surface of the microchannels with a low-power pulse laser. The manufacturing method of the invention can realize large-area scanning processing, has high production efficiency, small heat-affected zone, simple and convenient operation, low cost and no pollution.

Description

A kind of micro-channel heat exchanger with micro hole structure porous bottom surface and manufacture method thereof
Technical field
The present invention relates to a kind of micro-channel heat exchanger and manufacture method thereof, particularly relate to one and there is micropore knot The micro-channel heat exchanger of structure porous bottom surface and manufacture method thereof.
Background technology
Along with the rise of the various advanced manufacturing technologies such as microelectromechanical systems (MEMS), nano material and fluffy The exhibition of breaking out, in fields such as Aero-Space, microelectronics, photoelectricity, military project weapons, device all towards multi-functional, High-power, the trend development of miniaturization, the heat flow density thus brought improves constantly, high heat flux device Heat dissipation problem have become as one of key technical problem affecting electronic device design.
At present, a lot of radiating elements can not meet the most far away the cooling requirements of some electronic device, traditional The most air-cooled bottleneck having reached technology especially of radiating mode.Micro-channel heat exchanger is owing to making full use of Working fluid flow Boiling phase transformation, therefore significantly increase heat and mass efficiency, therefore become the desirable route that High Efficiency Thermal controls.Boiling Rise heat transfer and utilize the principle of phase-change heat transfer, it is possible to realize quick heat radiating.And improve the boiling heat transfer of heat-delivery surface Performance-critical is to increase the nucleus of boiling of heat exchange surface, strengthens nucleate boiling.Research shows, given Under the conditions of adding the degree of superheat of hot surface, only it is more than the smaller part needed for air bubble growth when the radius of the nucleus of boiling Footpath, bubble just can grow up, and nucleate boiling just can be carried out.And in fine depression on porous surface or crack Adsorb gas or the steam of trace, be the best nucleus of boiling.In boiling process, when bubble parameters takes off Behind hole, owing to liquid shows the effect of tension force, the some vapor that these holes are retained is difficult to be flowed into Liquid is thoroughly discharged, and just becomes the new nucleus of boiling, and the long bubble made new advances, so that boiling process is constantly held Continuous.Prepare the method predominantly organic tool processing of porous surface, sintering, flame-spraying, ionization deposition etc. at present , there is finished surface hole too big in method, specific surface area is little, and working (machining) efficiency is low, high in cost of production defect.This Outward, these methods are only applicable to macro surface, and the processing for bottom surface, microchannel is the most helpless.
On the other hand, current micro-channel heat exchanger mainly uses the methods such as the cutting of etching, line, LIGA, milling Prepare MCA, be glossy bottom surface, have that heat transfer area temperature little, boiled is big, heat transfer property The defects such as difference.
Summary of the invention
The invention provides a kind of micro-channel heat exchanger with micro hole structure porous bottom surface and manufacture method thereof, The heat exchange area of microchannel can be dramatically increased, increase the nucleus of boiling, increase heat transfer property.The present invention solves its skill Art problem be the technical scheme is that
A kind of micro-channel heat exchanger with micro hole structure porous bottom surface, upper including fit together up and down Top board and lower shoe, the upper surface of described lower shoe is provided with the microchannel of some parallel interval arrangements, described One end of microchannel connects the entrance of cooling working medium, and the other end of described microchannel connects the outlet of cooling working medium, It is characterized in that: the hydraulic diameter of described microchannel is 100～1000 μm, and the bottom surface of described microchannel is to set Have the porous surface of a large amount of micro hole structure, the aperture of described micro hole structure be 1～200 μm, the degree of depth be 1～ 200μm。
Among one preferred embodiment: cooling working medium in described microchannel along longitudinal flow, described microchannel Lateral cross section shape is rectangle or trapezoidal.
Among one preferred embodiment: cooling working medium in described microchannel along longitudinal flow, described microchannel Lateral cross section shape is rectangle, the width of this microchannel be 0.4mm-1.0mm, the degree of depth be 0.8mm-1.5mm, Spacing between adjacent two microchannels is 0.4mm-0.6mm.
Among one preferred embodiment: cooling working medium in described microchannel along longitudinal flow, described microchannel Lateral cross section shape is trapezoidal, its upper bottom surface width is 0.7mm-1.0mm, face width of going to the bottom is 0.4mm-0.6mm, The degree of depth is 0.8mm-1.5mm, and the spacing between adjacent two microchannels is 0.4mm-0.6mm.
Among one preferred embodiment: the material of described lower shoe is copper or aluminum or rustless steel.
A kind of micro-channel heat exchanger manufacture method with micro hole structure porous bottom surface, comprises the steps:
(1) choose two pieces of cleaned scrubbing, drying sheet metal as upper plate and lower shoe
(2) lower shoe is fixed on fine electric spark line cutting working platform, uses the cutting of fine electric spark line Processing method processes, at the upper surface of lower shoe, the microchannel that some parallel interval are arranged；
(3) with kerosene, dehydrated alcohol, lower shoe is carried out ultrasonic waves for cleaning successively, remove bottom surface, microchannel Greasy dirt and oxide skin；
(4) lower shoe is placed on the workbench of low power pulse laser location clamping；
(5) open laser instrument, open laser instrument protection gas, prevent laser from sending out when surface of the work is processed Raw oxidation, drawn Laser Processing path in laser software, control the moving area of laser facula, make Laser processing area without departing from bottom surface, microchannel scope, bottom surface, microchannel is laser machined, described The bottom surface of microchannel processes a large amount of micro hole structure；
(6) lower shoe is placed in ultrasonic waves for cleaning 10-20 minute in dehydrated alcohol, removes slag；
(7) lower surface of the upper surface of lower shoe and upper plate is sealed laminating encapsulation, and with outside adapter And water pump connects into an entirety, finally give complete micro-channel heat exchanger
Among one preferred embodiment: the output of Laser Processing is 15～24W；The scanning speed of Laser Processing It is 100～300mm/s；The scanning times of Laser Processing is 8～20 times；Laser Processing overlapping rate be 60%～ 92%.
Among one preferred embodiment: the cutting of fine electric spark line selects the molybdenum filament of a diameter of 0.1mm as processing Electrode, uses slow wire feeding processing mode, and linear cutter short circuit current is 2-4A, and pulse width is 4-8 μ s, Pulse spacing is 40-80 μ s, and open-circuit voltage is 100-110V, and wire travelling speed is 4-8mm2/min。
Among one preferred embodiment: in the middle of step (2), microchannel hydraulic diameter is 100～1000 μm；
Among one preferred embodiment: in the middle of step (5), the aperture of micro hole structure is 1～200 μm, deep Degree is 1～200 μm.
The technical program is compared with background technology, and it has the advantage that
1. the bottom surface of the microchannel of micro-channel heat exchanger is the porous bottom surface being formed with a large amount of micro hole structure, can Significantly increase the heat exchange area of microchannel, form the nucleus of boiling that seethes with excitement in a large number, thus be obviously enhanced microchannel and change The heat transfer property of hot device.
2. use the porous bottom surface that low power pulse laser obtains after carrying out being processed bottom surface, microchannel, Pore structure size is little, and quantity is many, and micro hole structure can obtain different by controlling laser output parameter Pore-size, specific surface area.
3. use low power pulse laser that bottom surface, microchannel is processed, it is not necessary to complicated manufacturing process and Equipment, production efficiency is high, and heat affected area is little, simple to operation, with low cost, pollution-free.
Accompanying drawing explanation
The invention will be further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 depicts the schematic perspective view of micro-channel heat exchanger.
Fig. 2 depicts the perspective exploded view of micro-channel heat exchanger shown in Fig. 1.
Fig. 3 depicts the malformation schematic diagram of micro-channel heat exchanger.
Fig. 4 depicts the schematic diagram of the method processing micro hole structure using Laser Processing.
Fig. 5 depicts the SEM figure of the micro hole structure of first embodiment.
Fig. 6 depicts the SEM figure of the micro hole structure of the second embodiment.
Fig. 7 depicts the SEM figure of the micro hole structure of the 3rd embodiment.
Fig. 8 depicts the SEM figure of the micro hole structure of the 4th embodiment.
Detailed description of the invention
Refer to Fig. 1 and Fig. 2, a kind of micro-channel heat exchanger with micro hole structure porous bottom surface of the present invention, Including the upper plate 2 fit together up and down and lower shoe 1, the upper surface of described lower shoe 1 is provided with some The microchannel 11 of parallel interval arrangement, one end of described microchannel connects the entrance of cooling working medium, described microchannel The other end connect cooling working medium outlet.The hydraulic diameter of described microchannel 11 is 100～1000 μm.Institute The bottom surface stating microchannel 11 is provided with the porous surface of a large amount of micro hole structure 111, described micro hole structure 111 Aperture be 1～200 μm, the degree of depth be 1～200 μm.
Preferably, cooling working medium in described microchannel 11 along longitudinal flow, the lateral cross section of described microchannel Shape is rectangle.Certainly, the cross sectional shape of microchannel 11 can also be trapezoidal (as shown in Figure 3).
Preferably, cooling working medium in described microchannel 11 along longitudinal flow, described microchannel 11 horizontal Cross sectional shape is rectangle, the width of this microchannel be 0.4mm-1.0mm, the degree of depth be 0.8mm-1.5mm, adjacent Article two, the spacing between microchannel is 0.4mm-0.6mm.
Preferably, cooling working medium in described microchannel 11 along longitudinal flow, described microchannel 11 horizontal Cross sectional shape is rectangle, the width of this microchannel be 0.4mm-1.0mm, the degree of depth be 0.8mm-1.5mm, adjacent Article two, the spacing between microchannel is 0.4mm-0.6mm.
Preferably, the material of described lower shoe 1 is copper or aluminum or rustless steel；The material of described upper plate 2 is Copper or aluminum or rustless steel.
This has the micro-channel heat exchanger of micro hole structure porous bottom surface, is formed and has a large amount of micro hole structure Porous bottom surface, significantly increases the heat exchange area of microchannel, forms the nucleus of boiling that seethes with excitement in a large number, thus significantly increases The heat transfer property of strong micro-channel heat exchanger.Low power pulse laser is used to carry out bottom surface, microchannel is added The porous bottom surface obtained after work, pore structure size is little, and quantity is many, and micro hole structure can be by controlling Laser output parameter obtains different pore-size, specific surface area.Use low power pulse laser to micro-logical Bottom surface, road is processed, it is not necessary to complicated manufacturing process and equipment, and production efficiency is high, and heat affected area is little, behaviour Make simple and convenient, with low cost, pollution-free.
Divide four embodiments that the manufacture method of micro-channel heat exchanger is introduced below:
Embodiment 1, refer to Fig. 4 and Fig. 5, comprises the following steps:
(1) copper plate of two pieces of a size of 25mm × 11mm × 2mm and 25mm × 11mm × 1mm is chosen, and Being cleaned scrubbing, drying, the copper plate of the most a size of 25mm × 11mm × 1mm is as Thermal Performance of Micro Channels The upper plate 2 of device, the copper plate of a size of 25mm × 11mm × 2mm is as the lower shoe 1 of micro-channel heat exchanger；
(2) by lower shoe 1 clamping to wire cutting machine fixture, upper at lower shoe 1 of wire cutting technology is used Surface Machining goes out the Rectangular Microchannel 11 along coolant flow direction parallel arrangement.Particularly as follows: select a diameter of The molybdenum filament of 0.1mm, as machined electrode, uses slow wire feeding processing mode, and linear cutter short circuit current is 3A, Pulse width is 6 μ s, and the pulse spacing is 60 μ s, and open-circuit voltage is 105V, and wire travelling speed is 6mm2/min。 By the TRAJECTORY CONTROL microchannel cross section shape of molybdenum filament, the upper surface at lower shoe 1 cuts out the 8 road degree of depth and is 1.2mm, width is 0.8mm, and spacing is the Rectangular Microchannel 11 of 0.5mm, the hydraulic diameter of microchannel 11 For 0.96mm；
(3) with kerosene, dehydrated alcohol, lower shoe 1 is carried out ultrasonic waves for cleaning 15 minutes successively, remove micro- The greasy dirt of passage 11 bottom surface and oxide skin；
(4) lower shoe 1 is placed on the workbench of low power pulse laser location, uses fixture by it Clamping；
(5) open laser instrument, adjust laser beam 3 and the position of lower shoe 1, make laser beam 3 pass through Focus in lower shoe 1 on bottom surface, microchannel 11 after condenser lens 4, form the laser facula 5 after focusing on, Adjust the protection valve 6 of laser instrument and open laser radiation gas, preventing laser from lower shoe 1 surface being added Man-hour aoxidizes；The most drawn Laser Processing path also arranges the output parameter of laser instrument and is set to: Laser power is 21W, and scanning speed is 250mm/s, and scanning times is 10 times, and overlapping rate is 82%；Laser Output parameter starts to be processed bottom surface, microchannel 11 after setting, and processes in bottom surface, microchannel 11 The micro hole structure 111 of porous bottom surface, the aperture of micro hole structure 111 is about 20～105 μm, the degree of depth be 1～ 114μm；
(6) lower shoe 1 is placed in ultrasonic waves for cleaning 15 minutes in dehydrated alcohol, after removing slag；
(7) lower surface of upper plate 2 and the upper surface of lower shoe 1 fit together, and carry out close by welding Envelope encapsulation, makes the two fit tightly, and connects into an entirety with outside adapter and water pump afterwards.
Embodiment 2, refer to Fig. 3, Fig. 4, Fig. 6, comprises the following steps:
(1) copper plate of two pieces of a size of 25mm × 11mm × 2mm and 25mm × 11mm × 1mm is chosen, and Being cleaned scrubbing, drying, the copper plate of the most a size of 25mm × 11mm × 1mm is as Thermal Performance of Micro Channels The upper plate 2 of device, the copper plate of a size of 25mm × 11mm × 2mm is as the lower shoe 1 of micro-channel heat exchanger；
(2) by lower shoe 1 clamping to wire cutting machine fixture, wire cutting technology is used to process along coolant The trapezoidal microchannel 11 of flow direction parallel arrangement.Particularly as follows: select the molybdenum filament of a diameter of 0.1mm as adding Work electrode, uses slow wire feeding processing mode, and linear cutter short circuit current is 2A, and pulse width is 8 μ s, Pulse spacing is 50 μ s, and open-circuit voltage is 100V, and wire travelling speed is 5mm2/min.By the track control of molybdenum filament Microchannel cross section shape processed, cuts out the 8 a width of 0.8mm of road upper bottom surface on copper plate, and bottom surface is a width of 0.5mm, a height of 1.2mm, spacing is the isosceles trapezoid microchannel of 0.5mm, and the hydraulic diameter of microchannel is 0.84mm；
(3) with kerosene, dehydrated alcohol, lower shoe 1 is carried out ultrasonic waves for cleaning 15 minutes successively, remove micro- The greasy dirt of passage bottom and oxide skin；
(4) lower shoe 1 is placed on the workbench of low power pulse laser location, uses fixture by it Clamping；
(5) open laser instrument, adjust laser beam 3 and the position of lower shoe 1, make laser beam 3 pass through Focus in lower shoe 1 on bottom surface, microchannel after condenser lens 4, form the laser facula 5 after focusing on, adjust The protection valve 6 of laser instrument also opens laser radiation gas, when preventing laser to be processed lower shoe 1 surface Aoxidize；The most drawn Laser Processing path also arranges the output parameter of laser instrument and is set to: swash Luminous power is 18W, and scanning speed is 300mm/s, and scanning times is 10 times, and overlapping rate is 82%；Laser is defeated Go out after parameter sets and start the bottom surface, trapezoidal microchannel of micro-channel heat exchanger is processed, had The trapezoidal microchannel 11 of micro hole structure 111 porous bottom surface, the aperture of micro hole structure is about 34～115 μm, The degree of depth is 1～90 μm；
(6) lower shoe 1 is placed in ultrasonic waves for cleaning 15 minutes in dehydrated alcohol, removes slag；
(7) lower surface of upper plate 2 and the upper surface of lower shoe 1 fit together, and carry out close by welding Envelope encapsulation, makes the two fit tightly, and connects into an entirety with outside adapter and water pump afterwards.
Embodiment 3, refer to Fig. 2, Fig. 4, Fig. 7, comprises the following steps:
(1) choose two pieces of sizes and be the copper plate of 15mm × 10mm × 2mm, and cleaned scrubbing, baking Dry, respectively as upper plate 2 and the lower shoe 1 of micro-channel heat exchanger；
(2) by lower shoe clamping to wire cutting machine fixture, wire cutting technology is used to process along cooling liquid stream The Rectangular Microchannel 11 of dynamic direction parallel arrangement.Particularly as follows: select the molybdenum filament of a diameter of 0.1mm as processing Electrode, uses slow wire feeding processing mode, and linear cutter short circuit current is 4A, and pulse width is 8 μ s, arteries and veins Punching is spaced apart 80 μ s, and open-circuit voltage is 110V, and wire travelling speed is 8mm2/min.By the TRAJECTORY CONTROL of molybdenum filament Microchannel cross section shape, cutting out the 12 road degree of depth on lower shoe 1 is 1.0mm, and width is 0.5mm, Away from the Rectangular Microchannel 11 for 0.5mm, the hydraulic diameter of microchannel 11 is 0.67mm；
(3) with kerosene, dehydrated alcohol, lower shoe 1 is carried out ultrasonic waves for cleaning 15 minutes successively, remove micro- The greasy dirt of passage bottom and oxide skin；
(4) lower shoe 1 is placed on the workbench of low power pulse laser location, uses fixture by it Clamping；
(5) open laser instrument, adjust laser beam 3 and the position of lower shoe 1, make laser beam 3 pass through Focus in lower shoe 1 on bottom surface, microchannel after condenser lens 4, form the laser facula 5 after focusing on, adjust The protection valve 6 of laser instrument also opens laser radiation gas, when preventing laser to be processed lower shoe 1 surface Aoxidize；The most drawn Laser Processing path also arranges the output parameter of laser instrument and is set to: swash Luminous power is 18W, and scanning speed is 250mm/s, and scanning times is 8 times, and overlapping rate is 82%；Laser is defeated Go out after parameter sets and start the bottom surface of microchannel 11 is processed, obtain substantial amounts of micro hole structure 111, the aperture of micro hole structure 111 is about 29～150 μm, and the degree of depth is 1～104.6 μm；
(6) lower shoe 1 is placed in ultrasonic waves for cleaning 15 minutes in dehydrated alcohol, removes slag；
(7) lower surface of upper plate 2 and the upper surface of lower shoe 1 fit together, and carry out close by welding Envelope encapsulation, makes the two fit tightly, and connects into an entirety with outside adapter and water pump afterwards.
Embodiment 4, refer to Fig. 3, Fig. 4, Fig. 7, comprises the following steps:
(1) choose two pieces of sizes and be the copper plate of 45mm × 20mm × 2mm, and cleaned scrubbing, baking Dry, respectively as upper plate 2 and the lower shoe 1 of micro-channel heat exchanger；
(2) by lower shoe 1 clamping to wire cutting machine fixture, wire cutting technology table on lower shoe 1 is used Face processes the Rectangular Microchannel 11 along coolant flow direction parallel arrangement.Particularly as follows: select a diameter of The molybdenum filament of 0.1mm, as machined electrode, uses slow wire feeding processing mode, and linear cutter short circuit current is 3A, Pulse width is 6 μ s, and the pulse spacing is 60 μ s, and open-circuit voltage is 105V, and wire travelling speed is 6mm2/min。 By the TRAJECTORY CONTROL microchannel cross section shape of molybdenum filament, cutting out the 18 road degree of depth on lower shoe 1 is 1.0mm, Width is 0.6mm, and spacing is the Rectangular Microchannel 11 of 0.5mm, and the hydraulic diameter of microchannel 11 is 0.75mm；
(3) with kerosene, dehydrated alcohol, lower shoe 1 is carried out ultrasonic waves for cleaning 15 minutes successively, remove micro- The greasy dirt of passage 11 bottom surface and oxide skin；
(4) lower shoe 1 is placed on the workbench of low power pulse laser location, uses fixture by it Clamping；
(5) open laser instrument, adjust laser beam 3 and the position of lower shoe 1, make laser beam 3 pass through Focus on bottom surface, lower shoe 1 microchannel 11 after condenser lens 4, form the laser facula 5 after focusing on, adjust The protection valve 6 of whole laser instrument also opens laser radiation gas, prevents laser to be processed lower shoe 1 surface Shi Fasheng aoxidizes；The most drawn Laser Processing path also arranges the output parameter of laser instrument and is set to: Laser power is 18W, and scanning speed is 300mm/s, and scanning times is 10 times, and overlapping rate is 73%；Laser Output parameter starts to be processed bottom surface, microchannel 11 after setting, and obtains a large amount of micro hole structure 111, The aperture of micro hole structure 111 is about 43～187 μm, and the degree of depth is 1～92.6 μm；
(6) base plate 1 is placed in ultrasonic waves for cleaning 15 minutes in dehydrated alcohol, removes slag；
(7) lower surface of upper plate 2 and the upper surface of lower shoe 1 fit together, and carry out close by welding Envelope encapsulation, makes the two fit tightly, and connects into an entirety with outside adapter and water pump afterwards.
The above, only present pre-ferred embodiments, therefore the scope that the present invention implements can not be limited according to this, The equivalence change i.e. made according to the scope of the claims of the present invention and description and modification, all should still belong to the present invention and contain In the range of.

Claims (10)

1.一种具有微孔隙结构多孔底面的微通道换热器，包括上下贴合在一起的上顶板和下底板，所述下底板的上表面设有若干条平行间隔排布的微通道，所述微通道的一端连接冷却工质的入口，所述微通道的另一端连接冷却工质的出口，其特征在于：所述微通道的水力直径为100～1000μm，所述微通道的底面为具有大量微孔隙结构的多孔表面，所述微孔隙结构的孔径为1～200μm、深度为1～200μm。 1. A microchannel heat exchanger with a microporous structure porous bottom surface, comprising an upper top plate and a lower base plate that fit together up and down, and the upper surface of the lower base plate is provided with several parallel microchannels arranged at intervals, so One end of the microchannel is connected to the inlet of the cooling medium, and the other end of the microchannel is connected to the outlet of the cooling medium. It is characterized in that: the hydraulic diameter of the microchannel is 100-1000 μm, and the bottom surface of the microchannel has A porous surface with a large number of microporous structures, the microporous structure has a pore diameter of 1-200 μm and a depth of 1-200 μm. 2.根据权利要求1所述的具有微孔隙结构多孔底面的微通道换热器，其特征在于：冷却工质在所述微通道内沿纵向流动，所述微通道的横向截面形状是矩形或梯形。 2. the microchannel heat exchanger with microporous structure porous bottom surface according to claim 1, is characterized in that: cooling medium flows longitudinally in described microchannel, and the transverse cross-sectional shape of described microchannel is rectangle or trapezoidal. 3.根据权利要求2所述的具有微孔隙结构多孔底面的微通道换热器，其特征在于：所述微通道的微通道的横向截面形状为矩形，其宽度是0.4mm-1.0mm、深度是0.8mm-1.5mm，相邻两条微通道之间的间距是0.4mm-0.6mm。 3. The microchannel heat exchanger with microporous structure porous bottom according to claim 2, characterized in that: the transverse cross-sectional shape of the microchannel of the microchannel is rectangular, and its width is 0.4mm-1.0mm, depth It is 0.8mm-1.5mm, and the distance between two adjacent microchannels is 0.4mm-0.6mm. 4.根据权利要求2所述的具有微孔隙结构多孔底面的微通道换热器，其特征在于：所述微通道的横向截面形状是梯形，其上底面宽是0.7mm-1.0mm、下底面宽是0.4mm-0.6mm、深度是0.8mm-1.5mm，相邻两条微通道之间的间距是0.4mm-0.6mm。 4. The microchannel heat exchanger with microporous structure porous bottom according to claim 2, characterized in that: the transverse cross-sectional shape of the microchannel is trapezoidal, the upper bottom surface width is 0.7mm-1.0mm, and the lower bottom surface The width is 0.4mm-0.6mm, the depth is 0.8mm-1.5mm, and the distance between two adjacent microchannels is 0.4mm-0.6mm. 5.根据权利要求1所述的具有微孔隙结构多孔底面的微通道换热器，其特征在于：所述下底板的材料为铜或铝或不锈钢。 5 . The microchannel heat exchanger with microporous bottom surface according to claim 1 , characterized in that: the material of the lower bottom plate is copper or aluminum or stainless steel. 6 . 6.一种具有微孔隙结构多孔底面的微通道换热器制造方法，其特征在于：包括步骤 6. A method for manufacturing a microchannel heat exchanger with a porous bottom surface of a microporous structure, characterized in that: comprising the steps (1)选取两块经清洗除污、烘干的金属薄板作为上顶板和下底板； (1) Select two metal sheets that have been cleaned, decontaminated, and dried as the upper top plate and the lower bottom plate; (2)将下底板固定到微细电火花线切割工作台上，采用微细电火花线切割加工方法在下底板的上表面加工出若干条平行间隔排布的微通道； (2) fixing the lower base plate on the micro-wire electric discharge cutting workbench, and processing several micro-channels arranged in parallel at intervals on the upper surface of the lower base plate by using the micro-wire electric discharge cutting processing method; (3)依次用煤油、无水乙醇对下底板进行超声波清洗，去除微通道底面的油污和氧化皮； (3) Ultrasonic cleaning is carried out to the bottom plate with kerosene and absolute ethanol in turn to remove oil stains and scales on the bottom surface of the microchannel; (4)将下底板放置在低功率脉冲激光器的工作台上定位夹紧； (4) Place the lower base plate on the workbench of the low-power pulse laser for positioning and clamping; (5)打开激光器，开启激光器保护气，防止激光对工件表面进行加工时发生氧化，在激光器软件中绘制好激光加工路径，控制激光光斑的移动区域，使得激光加工区域不超出微通道底面范围，对微通道底面进行激光加工，在所述微通道的底面加工大量微孔隙结构； (5) Turn on the laser, turn on the laser shielding gas, prevent the laser from oxidizing the surface of the workpiece, draw the laser processing path in the laser software, and control the moving area of the laser spot so that the laser processing area does not exceed the range of the bottom surface of the microchannel, performing laser processing on the bottom surface of the microchannel, and processing a large number of microporous structures on the bottom surface of the microchannel; (6)将下底板置于无水乙醇中超声波清洗10-20分钟，去除熔渣； (6) Place the lower bottom plate in absolute ethanol for ultrasonic cleaning for 10-20 minutes to remove slag; (7)将下底板的上表面与上顶板的下表面密封贴合封装，并与外部的接管及水泵连接成一个整体，最终得到完整的微通道换热器。 (7) The upper surface of the lower bottom plate and the lower surface of the upper top plate are hermetically bonded and packaged, and connected with an external connecting pipe and a water pump to form a whole, and finally a complete microchannel heat exchanger is obtained. 7.根据权利要求6所述的制造方法，其特征在于：所述激光加工的输出功率为15～24W；激光加工的扫描速度为100～300mm/s；激光加工的扫描次数为8～20次；激光加工的搭接率为60％～92％。 7. The manufacturing method according to claim 6, characterized in that: the output power of the laser processing is 15-24W; the scanning speed of the laser processing is 100-300mm/s; the scanning times of the laser processing is 8-20 times ; The overlapping rate of laser processing is 60% to 92%. 8.根据权利要求6所述的制造方法，其特征在于：微细电火花线切割选用直径为0.1mm的钼丝作为加工电极，采用慢走丝加工方式，线切割加工短路电流为2-4A，脉冲宽度为4-8μs，脉冲间隔为40-80μs，开路电压为100-110V，走丝速度为4-8mm2/min。 8. The manufacturing method according to claim 6, characterized in that: the fine wire electric discharge cutting selects a molybdenum wire with a diameter of 0.1mm as the processing electrode, adopts a slow wire processing method, and the short-circuit current of the wire cutting processing is 2-4A, The pulse width is 4-8μs, the pulse interval is 40-80μs, the open circuit voltage is 100-110V, and the wire speed is 4-8mm 2 /min. 9.根据权利要求6所述的制造方法，其特征在于：步骤(2)当中，所述微通道水力直径为100～1000μm。 9. The manufacturing method according to claim 6, characterized in that in step (2), the hydraulic diameter of the microchannel is 100-1000 μm. 10.根据权利要求6所述的制造方法，其特征在于：步骤(5)当中，所述微孔隙结构的孔径为1～200μm、深度为1～200μm。 10 . The manufacturing method according to claim 6 , wherein in step (5), the microporous structure has a pore diameter of 1-200 μm and a depth of 1-200 μm. 11 .
CN201610429493.XA 2016-06-16 2016-06-16 A kind of micro-channel heat exchanger and its manufacture method with micro hole structure porous bottom surface Active CN105880956B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610429493.XA CN105880956B (en) 2016-06-16 2016-06-16 A kind of micro-channel heat exchanger and its manufacture method with micro hole structure porous bottom surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610429493.XA CN105880956B (en) 2016-06-16 2016-06-16 A kind of micro-channel heat exchanger and its manufacture method with micro hole structure porous bottom surface

Publications (2)

Publication Number Publication Date
CN105880956A true CN105880956A (en) 2016-08-24
CN105880956B CN105880956B (en) 2017-11-10

Family

ID=56730609

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610429493.XA Active CN105880956B (en) 2016-06-16 2016-06-16 A kind of micro-channel heat exchanger and its manufacture method with micro hole structure porous bottom surface

Country Status (1)

Country Link
CN (1) CN105880956B (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106322436A (en) * 2016-11-11 2017-01-11 厦门大学 Micro-channel regenerative cooling micro-combustor
CN106653711A (en) * 2016-10-27 2017-05-10 湖北工程学院 Cooling device with internal micro-channel heat sink module
CN107155284A (en) * 2017-06-15 2017-09-12 华南理工大学 One kind is based on jet microchannel mixing heat sink
CN107275299A (en) * 2017-05-26 2017-10-20 北京大学 A kind of micro-channel heat exchanger and preparation method thereof
CN107570821A (en) * 2017-10-24 2018-01-12 厦门大学 A kind of microchannel wire-electrode cutting and processing method
CN107717355A (en) * 2017-11-10 2018-02-23 厦门大学 A kind of reactor microchannel manufacture method based on laser secondary operation
CN108090282A (en) * 2017-12-18 2018-05-29 上海理工大学 Slow wire feeding Wire-cut Electrical Discharge Machining gap multiple physical field coupling Simulation analysis method
CN108206168A (en) * 2018-02-08 2018-06-26 华南理工大学 A kind of phase transformation substrate for promoting heat directional transmissions and preparation method thereof
CN108895873A (en) * 2018-06-14 2018-11-27 中国电子科技集团公司第十四研究所 The micro- logical heat exchanger of metal and preparation method based on UV-LIGA technology
CN109405610A (en) * 2018-11-27 2019-03-01 华南理工大学 A kind of wick structure and preparation method thereof
CN110220402A (en) * 2019-05-30 2019-09-10 哈尔滨工业大学（深圳） It is a kind of with micropin rib-nanowire structure micro-channel heat exchanger and its manufacturing method
CN110323140A (en) * 2019-04-12 2019-10-11 厦门大学 Manufacturing method and heat exchanger with microflute-fold micro-channel heat exchanger core
CN110560875A (en) * 2019-09-23 2019-12-13 南昌航空大学 double-layer plate with channel structure and vacuum electron beam processing method thereof
CN110631386A (en) * 2019-09-09 2019-12-31 贵州永红航空机械有限责任公司 Micro-channel plate-fin heat exchanger and forming and assembling method
CN111328251A (en) * 2020-03-30 2020-06-23 华南理工大学 Microchannel heat dissipation structure with dual-scale surface features and preparation method thereof
CN111895814A (en) * 2020-05-06 2020-11-06 上海交通大学 Sinusoidal waveform microchannel heat exchanger with micro-cavity structure and manufacturing method thereof
CN112207509A (en) * 2020-09-02 2021-01-12 上海坤勇节能科技有限公司 Manufacturing method of micro-channel heat exchange plate
CN112939487A (en) * 2021-01-28 2021-06-11 佛山科学技术学院 Sandwich type glass microfluidic chip double-sided laser processing device and method
CN115609140A (en) * 2022-09-20 2023-01-17 东莞赛诺高德蚀刻科技有限公司 Vapor chamber preparation method and device based on laser-induced etching
CN117001289A (en) * 2023-08-25 2023-11-07 西安交通大学 A composite process and system for preparing special-shaped micro-channel plate heat exchangers
CN117588990A (en) * 2023-10-20 2024-02-23 中国长江三峡集团有限公司 Heat exchange device, heat exchange system and manufacturing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2369201Y (en) * 1999-05-12 2000-03-15 中国科学技术大学 Assembled porous media heat exchanger
US20040251008A1 (en) * 2003-05-30 2004-12-16 O'neill Patrick S. Method for making brazed heat exchanger and apparatus
CN102014598A (en) * 2010-11-27 2011-04-13 上海大学 Prism-array jet micro-channel radiator
CN102878845A (en) * 2012-09-18 2013-01-16 华南理工大学 An inner groove porous enhanced boiling microchannel structure and its manufacturing method and application
CN104154777A (en) * 2014-08-01 2014-11-19 厦门大学 Micro-channel heat exchanger with staggered inner groove structure and manufacturing method of micro-channel heat exchanger
CN205684974U (en) * 2016-06-16 2016-11-16 厦门大学 A kind of micro-channel heat exchanger with micro hole structure porous bottom surface

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2369201Y (en) * 1999-05-12 2000-03-15 中国科学技术大学 Assembled porous media heat exchanger
US20040251008A1 (en) * 2003-05-30 2004-12-16 O'neill Patrick S. Method for making brazed heat exchanger and apparatus
CN102014598A (en) * 2010-11-27 2011-04-13 上海大学 Prism-array jet micro-channel radiator
CN102878845A (en) * 2012-09-18 2013-01-16 华南理工大学 An inner groove porous enhanced boiling microchannel structure and its manufacturing method and application
CN104154777A (en) * 2014-08-01 2014-11-19 厦门大学 Micro-channel heat exchanger with staggered inner groove structure and manufacturing method of micro-channel heat exchanger
CN205684974U (en) * 2016-06-16 2016-11-16 厦门大学 A kind of micro-channel heat exchanger with micro hole structure porous bottom surface

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653711A (en) * 2016-10-27 2017-05-10 湖北工程学院 Cooling device with internal micro-channel heat sink module
CN106322436A (en) * 2016-11-11 2017-01-11 厦门大学 Micro-channel regenerative cooling micro-combustor
CN106322436B (en) * 2016-11-11 2018-10-26 厦门大学 The micro combustions room of microchannel re-generatively cooled
CN107275299B (en) * 2017-05-26 2019-08-20 北京大学 A kind of microchannel heat exchanger and its manufacturing method
CN107275299A (en) * 2017-05-26 2017-10-20 北京大学 A kind of micro-channel heat exchanger and preparation method thereof
CN107155284A (en) * 2017-06-15 2017-09-12 华南理工大学 One kind is based on jet microchannel mixing heat sink
CN107155284B (en) * 2017-06-15 2023-06-16 华南理工大学 A hybrid cooling plate based on jet microchannel
CN107570821A (en) * 2017-10-24 2018-01-12 厦门大学 A kind of microchannel wire-electrode cutting and processing method
CN107570821B (en) * 2017-10-24 2020-06-02 厦门大学 Micro-channel linear cutting machining method
CN107717355B (en) * 2017-11-10 2020-02-14 厦门大学 Reactor microchannel manufacturing method based on laser secondary machining
CN107717355A (en) * 2017-11-10 2018-02-23 厦门大学 A kind of reactor microchannel manufacture method based on laser secondary operation
CN108090282B (en) * 2017-12-18 2021-03-05 上海理工大学 Multi-physical-field coupling simulation analysis method for machining gap of slow wire-cut electrical discharge machining
CN108090282A (en) * 2017-12-18 2018-05-29 上海理工大学 Slow wire feeding Wire-cut Electrical Discharge Machining gap multiple physical field coupling Simulation analysis method
CN108206168A (en) * 2018-02-08 2018-06-26 华南理工大学 A kind of phase transformation substrate for promoting heat directional transmissions and preparation method thereof
CN108895873A (en) * 2018-06-14 2018-11-27 中国电子科技集团公司第十四研究所 The micro- logical heat exchanger of metal and preparation method based on UV-LIGA technology
CN109405610A (en) * 2018-11-27 2019-03-01 华南理工大学 A kind of wick structure and preparation method thereof
CN110323140A (en) * 2019-04-12 2019-10-11 厦门大学 Manufacturing method and heat exchanger with microflute-fold micro-channel heat exchanger core
CN110323140B (en) * 2019-04-12 2021-03-16 厦门大学 Manufacturing method and heat exchanger of microchannel heat exchanger core with microgrooves-folds
CN110220402A (en) * 2019-05-30 2019-09-10 哈尔滨工业大学（深圳） It is a kind of with micropin rib-nanowire structure micro-channel heat exchanger and its manufacturing method
CN110631386A (en) * 2019-09-09 2019-12-31 贵州永红航空机械有限责任公司 Micro-channel plate-fin heat exchanger and forming and assembling method
CN110560875A (en) * 2019-09-23 2019-12-13 南昌航空大学 double-layer plate with channel structure and vacuum electron beam processing method thereof
CN111328251A (en) * 2020-03-30 2020-06-23 华南理工大学 Microchannel heat dissipation structure with dual-scale surface features and preparation method thereof
CN111895814A (en) * 2020-05-06 2020-11-06 上海交通大学 Sinusoidal waveform microchannel heat exchanger with micro-cavity structure and manufacturing method thereof
CN112207509A (en) * 2020-09-02 2021-01-12 上海坤勇节能科技有限公司 Manufacturing method of micro-channel heat exchange plate
CN112939487B (en) * 2021-01-28 2023-03-10 佛山科学技术学院 Sandwich type glass microfluidic chip double-sided laser processing device and method
CN112939487A (en) * 2021-01-28 2021-06-11 佛山科学技术学院 Sandwich type glass microfluidic chip double-sided laser processing device and method
CN115609140A (en) * 2022-09-20 2023-01-17 东莞赛诺高德蚀刻科技有限公司 Vapor chamber preparation method and device based on laser-induced etching
CN115609140B (en) * 2022-09-20 2023-09-05 东莞赛诺高德蚀刻科技有限公司 Soaking plate preparation method and equipment based on laser-induced etching
CN117001289A (en) * 2023-08-25 2023-11-07 西安交通大学 A composite process and system for preparing special-shaped micro-channel plate heat exchangers
CN117001289B (en) * 2023-08-25 2024-05-03 西安交通大学 A composite process and system for preparing special-shaped micro-channel plate heat exchanger
CN117588990A (en) * 2023-10-20 2024-02-23 中国长江三峡集团有限公司 Heat exchange device, heat exchange system and manufacturing method
CN117588990B (en) * 2023-10-20 2025-01-17 中国长江三峡集团有限公司 Heat exchange device, heat exchange system and manufacturing method

Also Published As

Publication number Publication date
CN105880956B (en) 2017-11-10

Similar Documents

Publication Publication Date Title
CN105880956A (en) Microchannel heat exchanger with porous bottom face of micro-pore structures and manufacturing method of microchannel heat exchanger
CN111879158B (en) A partition-optimized 0.1-0.4 mm ultra-thin VC and preparation method thereof
CN205684974U (en) A kind of micro-channel heat exchanger with micro hole structure porous bottom surface
CN104567502B (en) A Laser Fabrication Method of Micro Heat Pipe with Discontinuous Capillary Structure
CN106705713B (en) Micro-channel heat exchanger with multi-channel interconnection structure and manufacturing method thereof
US11092391B2 (en) Enhanced boiling with selective placement of nucleation sites
CN103594430B (en) Micro-channel radiator for dissipating heat of power electronic device
CN110220402A (en) It is a kind of with micropin rib-nanowire structure micro-channel heat exchanger and its manufacturing method
CN101782346A (en) Heat exchange plate with alternate intercommunicating microchannel net structure and manufacturing method thereof
CN104842077B (en) Aluminum alloy microwave assembly brazing sheet processing method
CN105841535A (en) Sectional composite-structure panel heat transfer tube and manufacture method thereof
CN111735331B (en) Ultra-thin heat spreader super-hydrophilic micro-nano structure liquid wick and preparation method thereof
CN110919193B (en) Nanosecond laser processing method for ceramic surface hole based on processing track optimization
Deng et al. Experimental investigation on laser micromilling of SiC microchannels
CN110243213A (en) Composite structure flat liquid-absorbent core and manufacturing method thereof
EP3907457A1 (en) Boiling enhancement apparatus
CN106440898A (en) Composite grooved liquid-absorbing core of flat heat pipe and preparation method thereof
CN103894739A (en) Method and device for etching and processing high-quality aluminum oxide ceramics
CN104668675B (en) A kind of electrode with micro cone tower array end face and processing method thereof and application
CN104002041B (en) Equipment for manufacturing mask
CN115540641B (en) A Tesla-type microchannel flow boiling heat exchanger and its preparation method
CN107283067A (en) A laser preparation method of micro-channels with unequal widths in micro-heat pipes on metal substrates
Deng et al. Fabrication of micro pin fins on inclined V-shaped microchannel walls via laser micromilling
CN110560876A (en) Double-layer plate with cooling turbulence column structure and vacuum electron beam processing method
CN114857986A (en) Super-lipophilic evaporator with multistage micro-nano structure and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant