CN206981997U - A laser composite processing device for glass microfluidic channels - Google Patents

Abstract

The utility model relates to a laser composite processing device of glass miniflow channel, processingequipment mainly includes: the device comprises a cutting head lens group, a side shaft air inlet, a controllable moving platform, a laser cleaning beam shaping system, an X/Y scanning galvanometer, a focusing mirror, a back-etching primary forming sample piece and a laser cleaning clamp. The whole set of processing device consists of two modules, namely laser back etching and laser cleaning, and can realize the composite processing of back etching forming and laser cleaning of the glass micro-channel. The utility model discloses the miniflow channel structure size that the device processed out is even, and roughness is good, and the runner inner wall does not have harmful chemical residue, the utility model discloses the device is convenient for integrate, easy operation, and convenient and practical has higher processing speed and processing cost low.

Description

A laser composite processing device for glass microfluidic channel

technical field

The utility model is used in the technical field of laser processing hard and brittle transparent materials, in particular to a laser composite processing device for glass micro flow channels.

Background technique

Microfluidic channels are an important part of microreactors and microfluidic systems, and integrated microfluidic systems are widely used in chemical, optical, biomedical, and military fields. Glass and silicon materials are high-performance materials for preparing microchannels because of their chemical stability, reliability, high pressure and high temperature resistance, and electroosmotic flow drive. However, the brittleness of glass materials makes microfabrication difficult, and the high cost of preparing microfluidic components by special processes restricts the large-scale use of glass in the field of microfluidics.

In recent years, the microchannel processing technology has achieved rapid development. The commonly used glass microprocessing technology includes: chemical etching, mechanical processing, ultrasonic processing, glass thermoforming, laser processing, etc. 1) Chemical etching micro-channel is the main processing method currently used. It needs to go through surface treatment, photoresist coating, optical exposure, development and other processes to obtain the required pattern as a mask and then pass through the HF corrosion environment to obtain the formed micro-channel. , the process is cumbersome, costly, and not environmentally friendly; 2) Machining glass microchannels requires the use of specific tools and abrasives, and the glass stress needs to be controlled during processing, which is difficult; 3) Ultrasonic machining needs to add different sizes of Abrasives, when the size of the workpiece is at the um level, the processing difficulty will increase sharply; 4) Glass thermoforming is often divided into compression molding, blow molding, and binding molding, which use the continuous rapid increase of the viscosity of the glass as the temperature decreases As the viscosity changes, the glass that can flow gradually hardens into a solid, and the field of microfluidics requires a large area of fine flow channel structure. If this method is adopted, the process will be more complicated and the cost will be higher; 5) Laser processing of micro-flow channels is to focus high-energy laser beams on the surface of the material generation processing area to generate high-temperature melting or gasification processing to form processing shapes. This method has a simple process, direct writing of patterns does not require masks, and is environmentally friendly and efficient. At present, it is generally believed that laser is one of the powerful tools for micro-nano processing. However, due to the good permeability of glass materials, ordinary infrared lasers are difficult to focus on the glass surface. However, blue-violet or ultrafast lasers are used to process microstructures. higher cost.

Laser back etching mostly uses substrates with low energy, short wavelength and high laser absorption rate. The laser penetrates the processing material and is incident on the substrate on the back of the material. After the substrate absorbs the laser, the temperature rises to reach the melting or gasification of the processing material. The temperature achieves material removal. This method can use low-cost infrared lasers to microfabricate transparent materials and save equipment investment costs. However, due to the problems of chip removal and large thermal stress in the backside etching of microchannels by infrared lasers, traditional cleaning is easy to occur inside the trenches. It is difficult to remove the accumulation of slag and the deposition of micro-particles on the substrate. In order to overcome the above problems, it is necessary to select a substrate with a suitable absorption rate and a cleaning method for slag inside the micro-groove. Laser cleaning technology is a "green" cleaning method that does not require chemical reagents and cleaning solutions. It has strong decontamination ability and is applicable to a wide range of substrates, and can achieve non-damaging cleaning. Laser cleaning equipment has high flexibility and adaptability, which is convenient for automatic operation and low operating cost.

Therefore, it is necessary to provide a method and device for preparing a glass microchannel that can reduce the preparation cost and ensure the processing quality.

Utility model content

The purpose of this utility model is to consider the above-mentioned problems and provide a kind of simple operation, convenient and practical, low cost, efficient and environment-friendly laser method for preparing micro-channels.

The laser composite processing device of the glass micro flow channel of the utility model is composed of two modules of laser back engraving and laser cleaning. Among them, the laser back engraving module is composed of a cutting head lens group, a side axis air inlet, a controllable moving platform, a graphite substrate and a glass substrate, and its function is to prepare a preliminary formed glass microfluidic channel sample by back engraving on a graphite substrate; The laser cleaning module is composed of laser cleaning beam shaping system, X/Y scanning galvanometer, focusing mirror, back engraved preliminary forming sample, and laser cleaning fixture. The graphite particle deposits and slag sputtering on the surface of the sample are cleaned; the optical path switching component can switch the optical path of the two modules to realize the integration of laser back engraving and laser cleaning.

The graphite substrate in the above-mentioned back engraving module is placed on a controllable mobile platform and the surface is polished to facilitate the close contact of the glass substrate to form a good back engraving condition; by controlling the Z-axis movement of the cutting head, the focus is on the combination of glass and graphite During the process of back engraving, compressed air is constantly blown into the air inlet of the side axis of the cutting head to reduce heat accumulation during the back engraving process.

The above-mentioned laser cleaning module uses an optical shaping system to shape the beam in space to make the energy distribution more uniform, and the laser is output through the scanning galvanometer and the focusing field lens and acts on the back-engraved micro-channel sample, and the surface of the sample is attached Graphite particle deposits and slag sputtering are removed under the ablation impact of the laser. When the sample is cleaned, the laser directly penetrates the sample and the cleaning is automatically stopped.

The advantages and positive effects of the utility model are: the utility model adopts the combined method of laser engraving and laser cleaning to realize the laser compound processing of the micro-channel, and fully utilizes the advantages of the low-cost infrared band laser to realize the back engraving of the micro-channel Preliminary forming and laser cleaning and repairing of micro-channels; the laser composite processing device for glass micro-channels of the utility model is easy to integrate, and is a convenient and practical processing device with ingenious design and excellent performance.

Description of drawings

Fig. 1 is a schematic diagram of a processing device for preparing a microfluidic channel by laser compounding.

Fig. 2 is a partially enlarged schematic diagram of a laser back-engraved microfluidic channel.

Fig. 3 is a partially enlarged schematic diagram of laser dry cleaning of microfluidic channels.

Fig. 4 is a schematic diagram of the initial forming of the laser back-engraved glass microfluidic channel.

Fig. 5 is a schematic diagram of forming a microfluidic channel by laser composite preparation method.

In Figure 1: 1. Graphite substrate, 2. Glass substrate, 3. Side shaft inlet, 4. Cutting head lens group, 5. Optical path switching component, 6. Laser cleaning beam shaping system, 7. X/Y Scanning galvanometer, 8. Focusing mirror, 9. Back engraving preliminary forming sample, 10. Laser cleaning fixture, 11. 2-station controllable mobile platform.

detailed description

Example:

The schematic diagram of the device of the present invention is shown in Figures 1, 2, 3, 4, and 5. The laser composite processing device of the glass microchannel of the present invention is composed of a laser back engraving module and a laser cleaning module.

In this embodiment, station 1 is a laser back engraving module consisting of a graphite substrate 1 , a glass substrate 2 , a side shaft air inlet 3 , a cutting head lens group 4 and a controllable moving platform 11 .

In this embodiment, the station 2 is a laser cleaning module consisting of an optical path switching component 5, a laser cleaning beam shaping system 6, an X/Y scanning galvanometer 7, a focusing galvanometer 8, a back engraved preliminary forming sample 9, and a laser cleaning fixture 10 And a controllable mobile platform 11 constitutes.

In this embodiment, 0.1MPa compressed air is continuously injected into the inlet 3 of the shaft on the intake side to reduce the thermal stress generated during the back engraving process.

In this embodiment, the polished surface of the graphite substrate 1 has a surface roughness of Ra 0.04-0.1, which is favorable for back engraving conditions in which the glass substrate and the graphite substrate are closely bonded to form a good shape.

In this embodiment, the above-mentioned laser beam used is a pulsed infrared laser; the above-mentioned laser wavelength range is 700-1400nm; the above-mentioned laser pulse width range is 0-200ns; the above-mentioned laser energy density range is 0-500J/ ^cm2 ; 100KHz; the scanning speed range of the above-mentioned laser galvanometer is 1-2000mm/s; the number of times of marking and cutting on the back of the above-mentioned laser cutting head is 1-10 times, and the number of times of laser cleaning and scanning is 1-20 times. In this example, the wavelength of the laser beam used for back engraving is 1064 nm, the pulse width is 100 ns, the energy density is 198.4 J/cm ² , the frequency is 40 KHz, and the number of scribing is 2 times. The pulse width used for laser cleaning and repairing the preliminarily formed microfluidic channel is 100ns, the energy density is 88.16J/cm ² , the scanning speed is 1000mm/s, the frequency is 40KHz, and the scanning times are 3 times.

The processing method of the processing device of the utility model laser forming cutting sapphire substrate comprises the following steps:

1) Fixing the graphite substrate 1 on the controllable mobile platform 11 of station 1, and attaching the glass substrate 2 to the graphite substrate 1;

2) Adjust the cutting head so that the outgoing laser focus is focused on the contact surface between the graphite substrate 1 and the glass substrate 2, and at the same time ensure that the side axis air inlet 3 of the processing cutting head is continuously fed with compressed air, the air pressure is 5Mpa, reducing the laser processing process Medium thermal stress;

3) Control the movement of the controllable platform 11 in the X/Y plane of the station 1 to realize the preliminary formation of the back engraving of the micro-channel;

4) placing the preliminarily formed microfluidic channel sample 9 on the laser cleaning jig 10 of the controllable platform 11 at station 2;

5) By controlling the optical path switching component 5, the optical path is switched to the laser cleaning beam shaping system 6 for beam shaping and then output through the X/Y scanning galvanometer 7 and focusing mirror 8;

6) Focusing the laser focus on the lower surface of the preliminarily formed microfluidic channel sample 9, controlling the movement of the X/Y vibrating mirror 7 to perform laser cleaning on the preliminarily formed glass microfluidic channel until the laser completely passes through the glass, and the laser cleaning is completed;

Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the scope of protection of the utility model. Simple modifications or equivalent replacements to the technical solution of the utility model by those skilled in the art are all acceptable. Do not depart from the essence and scope of the technical solution of the utility model.

Claims (4)

1. A laser composite processing device for glass microfluidic channels is characterized in that two stations are included, and station 1 is a laser back engraving module, which is used to realize the laser back engraving forming of microfluidic channels, made of graphite substrate (1 ), glass substrate (2), measuring axis air inlet (3), cutting head lens group (4) and controllable moving platform (11); station 2 is a laser cleaning module, which is used to realize the alignment of station 1 The laser cleaning of the preliminarily formed microfluidic channel samples on the back engraving can achieve the purpose of removing graphite particles and slag remaining in the flow channel and repairing the flow channel structure. The optical path switching component (5), laser cleaning beam shaping system (6), X /Y scanning galvanometer (7), focusing galvanometer (8), back engraved preliminary forming sample (9), laser cleaning jig (10) and controllable mobile platform (11). 2. A laser composite processing device for glass microfluidics as claimed in claim 1, characterized in that the surface of the graphite substrate (1) used in station 1 is polished to better match the glass substrate (2) fit. 3. The laser composite processing device of a glass microfluidic channel as claimed in claim 1 or 2, wherein the laser back engraving module of station 1 and the laser cleaning module of station 2 share the same infrared band pulse laser and pass through the optical path The switching component (5) realizes switching and using of the light beam at the station 1 and the station 2. 4. A laser composite processing device for glass microfluidics as claimed in claim 3, characterized in that the wavelength range of the infrared band laser used is 700-1400nm, the laser pulse width range is 0-200ns, and the laser frequency range is 10-100KHz .