CN202297373U - Glass processing equipment - Google Patents

Abstract

A glass processing equipment, comprising a laser, a beam expander, a vibrating mirror, a telecentric lens and a control device; the laser beam is focused by the telecentric lens after passing through the beam expander and the vibrating mirror; the control device is electrically connected to the laser, and The relative position between the vibrating mirror and the glass is controlled so that the laser beam forms a cutting groove along the cutting line on the processing surface of the glass, and the cutting line is a helical line. The above-mentioned glass processing equipment controls the laser beam to form a cutting groove along the cutting line. As the cutting surface descends, the focal point will drop along with it, that is, the focal point is always on the cutting surface, thereby deepening the depth of the cutting groove. Therefore, the above-mentioned glass processing equipment can process glass with a relatively large thickness. Moreover, the entire helix is a curve. During the cutting process, the laser turns on the laser from the starting point to the end point. There is no need to switch the laser frequently, which improves the cutting efficiency and avoids the problem of starting and ending points due to delay parameters. , improving the cutting quality.

Description

Glass processing equipment

【Technical field】

The utility model relates to a plate processing equipment, in particular to a glass processing equipment.

【Background technique】

Glass, a transparent solid substance, forms a continuous network structure when molten, and a silicate non-metallic material that gradually increases in viscosity and hardens during cooling. There are many kinds and various chemical compositions, the main ingredient is silicon dioxide. It is widely used in construction, daily household products, chemical industry, electronics, military, industry and other fields. It is one of the most widely used and most important materials at present. It is also called the three pillar non-metallic materials together with polymer materials and ceramic materials.

Due to the different requirements in practical use, glass processing technology is particularly important. Traditional processes include melt blowing or mold forming, mechanical and chemical processing, etc. In recent years, as flat glass is widely used in the fields of electronics, chemical industry, biology, and micro-optics, the requirements for high-precision processing of flat glass are getting higher and higher, and the precision is required to be at the level of one hundredth of a millimeter. The more it seems to be unable to do what it wants, both in terms of processing quality and processing efficiency, it is gradually unable to keep up with and meet the needs of increasing progress. Especially with the emergence of flat-panel consumer electronics products such as IPHONE/IPAD, our consumer electronics products have undergone fundamental and revolutionary changes. Numerous leading companies and leading manufacturers have been forced to transform and follow Apple's footsteps. The demand for the processing of flat glass with high precision, high quality and high efficiency is also increasing day by day, and it is becoming more and more urgent.

Traditional flat glass precision processing technologies mainly include mechanical processing, ultrasonic processing, sandblasting, and chemical etching. Mechanical processing, ultrasonic processing, sandblasting, etc. are all contact processing, which has many disadvantages such as slow speed, relatively low yield, many consumables, and low precision. Chemical etching uses hydrofluoric acid, which is highly toxic and highly corrosive or Potassium hydroxide and other strong alkalis, although the safety protection measures are perfect, still have potential safety hazards, and various safety accidents continue to occur. At this point we will consider the emerging processing technology - laser processing.

Laser processing technology is known as "universal processing technology". It gradually replaces traditional craft. Therefore, after the emergence of lasers, people tried to use lasers to process glass. So far, there have been technologies using carbon dioxide lasers, YAG lasers, green lasers and ultraviolet lasers for processing.

Among them, the principle of carbon dioxide cutting glass is that the laser is focused on the glass surface to form an elliptical spot, and the glass strongly absorbs the carbon dioxide laser. With the relative movement of the laser and the glass, the cutting line is moved, and at the same time, the quenching nozzle sprays cold water or cold air onto the cutting path, making the glass Cracking, but only very shallow cracks can be produced, and subsequent processes are required to crack the glass, and this method can only cut straight lines, and cannot process complex graphics, such as curved outer frames, internal openings, etc.

The cutting principle and advantages and disadvantages of YAG are similar to those of carbon dioxide.

The cutting principle of green light and ultraviolet laser is similar. It does not rely solely on the thermal effect to process glass like carbon dioxide laser, but the wavelength of ultraviolet laser is shorter than that of green light, which can destroy the chemical bonds of materials, melt or vaporize materials, so as to achieve is the purpose of material separation. And most glass usually has a higher absorption rate in the ultraviolet band, so the effect of cutting glass with ultraviolet laser will be better. Especially with the emergence and rapid development of Q-switched green and ultraviolet solid-state lasers, the use of green and ultraviolet lasers to cut glass will become more and more widespread. However, the current green and ultraviolet laser cutting glass focuses the laser on the surface of the material. The laser can easily remove the glass and form small grooves. However, due to the short depth of focus of the ultraviolet laser, the formed grooves are small. , so that the cutting cannot go deep, the cutting depth is limited, and then the laser will be absorbed by the side wall and bottom of the groove at the cutting place, and the temperature of the glass will rise, and even burst.

In addition, ultraviolet laser is not a universal tool. Not all glass can be cut. At present, there are two main types that cannot be cut. The first type is optical glass with high transmittance, such as quartz glass (BK7) or crystal glass. The transmittance of the wavelength band greater than 300nm is more than 90%. The second type is glass with a high thermal expansion coefficient. Because of its large thermal expansion and deformation, it will cause the glass to crack, so it cannot be processed.

【Content of utility model】

In view of the above situation, it is necessary to provide a processing equipment capable of processing glass with a relatively large thickness.

A glass processing equipment, comprising:

a laser emitting a laser beam;

a beam expander, opposite to the laser;

A vibrating mirror, opposite to the beam expander;

A telecentric lens is fixedly connected to the vibrating mirror, and the laser beam is focused by the telecentric lens after passing through the beam expander and the vibrating mirror; and

The control device is electrically connected with the laser, and controls the relative position between the vibrating mirror and the glass so that the laser beam forms a cutting groove along the cutting line on the processing surface of the glass, and the cutting line is Helix.

Further, the pitch of the helix is smaller than the spot diameter of the laser beam, and the number of turns of the helix is determined by the following formula:

N=kD/d

Wherein, N is the number of turns of the helix, D is the thickness of the glass, d is the pitch of the helix, and k is a constant greater than or equal to 0.2 and less than or equal to 0.5.

Further, the glass processing equipment further includes a blowing device for blowing cooling gas toward the processing surface of the glass.

Further, the glass processing equipment further includes a coating device for coating an absorbing layer on the processing surface of the glass.

Further, the glass processing equipment further includes an imaging device electrically connected to the control device, and the imaging device photographs the processing position and graphics of the glass to automatically position and focus the laser beam.

Further, the laser is a pulsed laser with a pulse energy greater than 100 microjoules.

Further, the laser is an ultraviolet laser with a wavelength of 260-360 nm or a green laser with a wavelength of 525-540 nm.

Further, the laser is a high-power laser with a peak power greater than 10 kilowatts.

Further, the telecentric lens is a lens with a focal length less than 120 mm.

Further, the glass processing equipment further includes a high-precision platform for carrying the glass, and the high-precision platform is movable relative to the vibrating mirror, so as to adjust the relative position of the glass relative to the vibrating mirror.

The above-mentioned glass processing equipment controls the laser beam to form a cutting groove along the cutting line. The cutting line is a helical line. As the cutting surface descends, the focus will drop along with it, that is, the focus is always on the cutting surface, thereby deepening the depth of the cutting groove. . Therefore, the above-mentioned glass processing equipment can process glass with a relatively large thickness. Moreover, the entire helix is a curve. During the cutting process, the laser turns on the laser from the starting point to the end point. There is no need to switch the laser frequently, which improves the cutting efficiency and avoids the problem of starting and ending points due to delay parameters. , improving the cutting quality.

【Description of drawings】

Fig. 1 is the structural representation of the glass processing equipment of this embodiment;

Fig. 2 is a schematic diagram of the state of processing glass by the glass processing equipment shown in Fig. 1;

Fig. 3 is a schematic diagram of another state of processing glass by the glass processing equipment shown in Fig. 1;

Fig. 4 is a schematic flow chart of the glass processing method of the present embodiment;

Fig. 5 is a schematic diagram of cutting a circular glass plate by the glass processing method of this embodiment.

【Detailed ways】

In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present utility model are provided in the accompanying drawings. However, the invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present utility model more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of this invention. The terminology used in the description of the utility model herein is only for the purpose of describing specific embodiments, and is not intended to limit the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

1 and 2, the glass processing equipment 100 of this embodiment includes a laser 110, a high-precision platform 120, a beam expander (not shown), a vibrating mirror 130, a telecentric lens 140, a control device 150, and an air blower. Device 160 and coating device 170.

The laser 110 emits a laser beam 111 . The laser 110 can be a semiconductor-pumped solid-state laser with a peak power greater than 10 kilowatts. Specifically, in this embodiment, the laser 110 is a Q-switched semiconductor-pumped solid-state green laser or an ultraviolet laser, wherein the wavelength of the green light is between 525-540nm, and the wavelength of the ultraviolet laser is between 260-360nm. A laser with a narrow width will have a higher peak power. The peak power of the laser is greater than 10kw, which can exceed the processing threshold of the material, making it easier to process, and can obtain better processing quality and faster processing speed.

The high-precision platform 120 is used to carry the glass 200 to be processed, and the high-precision platform 120 is movable relative to the vibrating mirror 130 to adjust the relative position of the glass 200 relative to the vibrating mirror 130 .

It should be noted that the high-precision platform 120 does not move, and the control device 130 controls the vibrating mirror 130 to move, and the relative position of the glass 200 relative to the vibrating mirror 130 can also be adjusted.

The beam expander is disposed between the vibrating mirror 130 and the laser 110 , and is opposite to the laser 110 .

The vibrating mirror 130 is opposite to the beam expander. The telecentric lens 140 is fixedly connected with the vibrating mirror, and the laser beam emitted by the laser 110 is focused by the telecentric lens 140 after passing through the beam expander and the vibrating mirror 130 . Specifically, in this embodiment, the focal length of the telecentric lens is less than 120 millimeters.

The control device 150 is electrically connected with the laser 110, and controls the relative position between the vibrating mirror 130 and the glass 200, for example, the horizontal position and the height position, so that the laser beam 110 passes through the vibrating mirror 130 and the telecentric lens 140 and passes through the glass 200. A cutting groove 201 is formed on the processed surface along the cutting line, which is a helical line.

Preferably, in order to further improve the cutting efficiency and prevent edge collapse during cutting, the pitch of the helix to improve the cutting quality is smaller than the spot diameter of the laser beam, and the number of turns of the helix is determined by the following formula:

N=kD/d

Wherein, N is the number of turns of the helix, D is the thickness of the glass 200, d is the pitch of the helix, and k is a constant greater than or equal to 0.2 and less than or equal to 0.5.

Where k is a constant greater than or equal to 0.2 and less than or equal to 0.5, which is obtained from cutting experience. Usually, the line width of the cutting groove is one-fifth to one-half of the thickness D of glass 200, and it cannot be cut when it is less than one-fifth , it will waste time when it is greater than half, so the cutting line width is kD; and for different glasses, k will have an optimal value, which can get the fastest cutting efficiency. This value should be tested according to the properties of different glasses It can be concluded that when the value is less than this optimal value, it will not be able to cut or the cutting time will be longer, and the cutting quality will be poor, and there will be more chipping. When it is greater than this optimal value, it will waste time and reduce production efficiency; d is the line of the helix Spacing, this line spacing is required to be smaller than the diameter of the spot, so that there is a sufficient overlap rate between the spots. Therefore, divide the line width kD by the line spacing d to get the number N of turns that need to be added. The best cutting effect and the fastest cutting efficiency can be achieved only when the number of turns N of the appropriate helix is appropriate.

The air blowing device 160 is controlled by the control device 150 and used for blowing cooling gas toward the processing surface of the glass 200 . While cutting, the compressed gas is blown to the cutting surface, and the vaporized glass and broken debris are avoided as the cutting depth increases; at the same time, it also cools the cutting surface to avoid excessive temperature. The glass is broken; and the lens of the telecentric lens 140 can also be protected to prevent debris from splashing and contaminating the lens.

The coating device 170 is electrically connected with the control device 150 and used for coating the processing surface of the glass 200 with an absorbing layer. For some optical glass with high transmittance, an absorbing layer is added on the surface to increase the absorption of laser light, improve the efficiency of laser processing, and make it possible to cut from uncut; moreover, the absorbing layer can protect the edge of the cutting groove at the same time and reduce chipping .

It can be understood that the coating device 170 may not be controlled by the control device 150, and the coating may be manually controlled.

In order to improve the efficiency and accuracy of laser processing glass, the glass processing equipment 100 also includes a camera (not shown) electrically connected to the control device 150. The camera is used to photograph the processing position and processing pattern of the processed glass, thereby automatically positioning and focusing .

The control device 150 of the above-mentioned glass processing equipment 100 controls the laser beam to form a cutting groove 201 along the cutting line. The cutting line is a spiral line. As the cutting surface descends, the focal point will drop together, that is, the focal point is always located on the cutting surface. Thereby deepening the depth of the cutting groove. Therefore, the glass processing apparatus 100 described above can process glass with a relatively large thickness. Moreover, the entire helix is a curve. During the cutting process, the laser turns on the laser from the starting point to the end point. There is no need to switch the laser frequently, which improves the cutting efficiency and avoids the problem of starting and ending points due to delay parameters. , improving the cutting quality.

Referring to FIG. 1 , FIG. 3 and FIG. 4 , the glass processing method of this embodiment includes the following steps S201 - S205 .

S201, providing a laser beam. The laser 110 emits a laser beam 111 . The pulse energy of the laser beam 111 is greater than 100 microjoules. The laser beam 111 is an ultraviolet laser with a wavelength of 260-360 nm or a green laser with a wavelength of 525-540 nm.

S202, coating the processing surface of the glass with an absorbing layer to increase the laser absorption rate. For some optical glass with high transmittance, the coating device 170 coats the absorbing layer on the surface of the glass 200 to increase the absorption of laser light, improve the efficiency of laser processing, and make it impossible to cut; and the absorbing layer can protect the glass at the same time Cut the edge of the groove to reduce edge chipping.

S203, the laser beam forms a cutting groove along the cutting line on the glass surface, and the cutting line is a helical line.

Preferably, in order to further improve the cutting efficiency and prevent edge collapse during cutting, the pitch of the helix to improve the cutting quality is smaller than the spot diameter of the laser beam, and the number of turns of the helix is determined by the following formula:

N=kD/d

Wherein, N is the number of turns of the helix, D is the thickness of the glass, d is the pitch of the helix, and k is a constant greater than or equal to 0.2 and less than or equal to 0.5.

Specifically in this embodiment, the control device 150 is electrically connected to the laser 110, and controls the relative position between the vibrating mirror 130 and the glass 200, for example, the horizontal position and the height position, so that the laser beam 110 passes through the vibrating mirror 130 and the telecentric After the lens 140, a cutting groove 201 is formed on the processed surface of the glass 200 along the cutting line, and the cutting line is composed of parallel and equally spaced helical lines. The pitch of the helix is less than or equal to 0.03 mm.

S204, blowing cooling airflow toward the processing surface of the glass. Specifically, in this embodiment, the air blowing device 160 is controlled by the control device 150 to blow cooling gas toward the processing surface of the glass 200 . While cutting, the compressed gas is blown to the cutting surface, and the vaporized glass and broken debris are avoided as the cutting depth increases; at the same time, it also cools the cutting surface to avoid excessive temperature. The glass is broken; and the lens of the telecentric lens 140 can also be protected to prevent debris from splashing and contaminating the lens.

S205, as the depth of the cutting groove increases, the focal point of the laser beam decreases relative to the bottom of the cutting groove.

As shown in Figure 3, due to the short depth of focus of the laser, the cutting cannot go deep, and the cutting depth is limited. If the cutting groove is a rectangular groove, the number of turns of the helix increases with the depth of the cutting groove, thereby forming a rectangular groove. The laser beam can process grooves, scribes, cuts, through-holes, blind holes or cavities in the glass surface.

Please refer to Figure 5. Taking the cutting of a circular glass plate as an example, adding a spiral edge to the graphics can be easily realized in graphics processing software such as CAD, and the process is simple. The entire helix is a curve. During the cutting process, the laser turns on the laser from the starting point to the end point. There is no need to switch on and off the laser frequently, which improves the cutting efficiency and avoids the problem of starting and ending points due to delay parameters. cut quality.

It can be understood that other shapes, such as square shape, various special-shaped holes, etc., can also be processed through simple drawing in CAD to realize the spiral edge, so that the glass processing method of this embodiment can be adopted.

It can be understood that the glass processing pattern is formed by splicing multiple small-area patterns, that is, large-scale processing can be realized by splicing small-area patterns into large patterns.

The above-mentioned embodiments only express several implementations of the utility model, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (10)

1. a glass processing equipment is characterized in that, comprising:

Laser apparatus is launched a laser beam;

Beam expanding lens is relative with said laser apparatus;

Galvanometer is relative with said beam expanding lens;

Telecentric lens is fixedly connected with said galvanometer, focuses on through said telecentric lens behind the said beam expanding lens of said laser beam process, the said galvanometer again; And

Gear is electrically connected with said laser apparatus, and controls the relative position between said galvanometer and the glass and make said laser beam form a slot at the finished surface of said glass along line of cut, and said line of cut is a spiral-line.

2. glass processing equipment as claimed in claim 1 is characterized in that, the spacing of said spiral-line is less than the spot diameter of said laser beam, and the number of turns of said spiral-line is confirmed by following formula:

N＝kD/d

Wherein, N is the number of turns of said spiral-line, and D is the thickness of said glass, and d is the spacing of said spiral-line, and k is more than or equal to 0.2 and smaller or equal to 0.5 constant.

3. glass processing equipment as claimed in claim 1 is characterized in that, said glass processing equipment also comprises the blowing device towards the finished surface blowing cooling gas of said glass.

4. glass processing equipment as claimed in claim 1 is characterized in that, said glass processing equipment also is included in the coating unit of the finished surface coating absorption layer of said glass.

5. glass processing equipment as claimed in claim 1; It is characterized in that; Said glass processing equipment also comprises the camera head that is electrically connected with said gear, and said camera head is taken Working position and the graphics processing of said glass and made said laser beam locate automatically, focus on.

6. glass processing equipment as claimed in claim 1 is characterized in that, said laser apparatus is a pulse energy greater than 100 little joules pulsed laser.

7. glass processing equipment as claimed in claim 1 is characterized in that, said laser apparatus is that wavelength is the ultraviolet laser device of 260～360 nanometers or the green (light) laser of 525～540 nanometers.

8. glass processing equipment as claimed in claim 1 is characterized in that, said laser apparatus is a peak power greater than 10 kilowatts high power laser.

9. glass processing equipment as claimed in claim 1 is characterized in that, said telecentric lens is a focal length less than 120 millimeters lens.

10. glass processing equipment as claimed in claim 1; It is characterized in that; Said glass processing equipment also comprises the high accuracy platform that is used to carry said glass, and said high accuracy platform is removable with respect to said galvanometer, to regulate the relative position of said glassy phase for said galvanometer.

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