CN112399772B

CN112399772B - Heat dissipation and noise shielding combined structure of electronic device

Info

Publication number: CN112399772B
Application number: CN201910758904.3A
Authority: CN
Inventors: 吴启荣
Original assignee: Mitac Computer Kunshan Co Ltd; Getac Technology Corp
Current assignee: Mitac Computer Kunshan Co Ltd; Getac Technology Corp
Priority date: 2019-08-16
Filing date: 2019-08-16
Publication date: 2023-05-16
Anticipated expiration: 2039-08-16
Also published as: CN112399772A

Abstract

A heat dissipation and noise shielding combined structure of an electronic device comprises a circuit board, wherein a shielding pad body is formed on the circuit board through surface welding, and a shielding area is formed by the shielding pad body in a sealing mode; an electronic element arranged in the shielding region of the circuit board; the shielding heat dissipation piece is fixedly arranged on the circuit board and is provided with a heat conduction plate, the periphery of the heat conduction plate extends towards the direction of the circuit board, the heat conduction plate contacts the electronic element, and the heat conduction plate contacts the shielding pad body. Therefore, the shielding cover can integrally solve the correlation problem of the heat dissipation module and Radio Frequency (RF)/electromagnetic compatibility (EMC), further has excellent shielding effect and rapid heat dissipation operation effect, and can solve the problems of the weight, the cost design deficiency and the insufficient space of the circuit motherboard of the shielding cover.

Description

Heat dissipation and noise shielding combined structure of electronic device

[ field of technology ]

The present invention relates to a shielding structure, and more particularly to a combined structure of heat dissipation and noise shielding for an electronic device, which is capable of shielding noise of an electronic device and facilitating the fast heat dissipation operation of the electronic device.

[ background Art ]

At present, with more and more functions of 3C electronic products, many electronic components or electronic devices (such as high-speed solid-state hard disk/SSD) are often disposed in a limited circuit board area, so that noise and electromagnetic interference at the system and circuit board terminals are relatively improved due to Radio frequency (RF/Radio frequency) phenomenon, and therefore, the electronic devices need to perform electromagnetic interference (EMI/Electromagnetic Interference) and electromagnetic compatibility (EMC/Electromagnetic Compatibility) test, so that the electronic components/devices cannot generate electromagnetic interference (EMI) or generate electromagnetic interference (EMI) to other devices too much, and the electronic components/devices still need to operate normally under electromagnetic interference below a certain level.

In a processor (CPU) block, a metal cover (cover) is often disposed on a circuit board to achieve Shielding (Shielding) effect, so as to solve the problems of Radio Frequency (RF) and electromagnetic compatibility (EMC). The prior art metal cover shielding technique is shown in fig. 1, and includes a circuit motherboard 90, the circuit motherboard 90 having a processor (CPU) block 91, the processor (CPU) block 91 including a circuit sub-board 911 and a processor (CPU) 912 on the circuit sub-board 911; of course, the processor (CPU) 912 may also be directly disposed on the circuit motherboard 90; the circuit motherboard 90 has a metal cover 92, and the metal cover 92 has an opening 921 corresponding to the processor block 91.

Although the conventional Shielding (Shielding) technique can achieve Shielding of the processor (CPU) block 91 by the metal cover 92, there are drawbacks, for example, the metal cover 92 is provided with the opening 921 for heat dissipation of the processor (CPU) 912, so that Shielding effect of the metal cover 92 on the processor (CPU) 912 is reduced, and the opening 921 needs to cover the processor block 91, so that the metal cover 92 and the opening 921 need to have a relatively large size area, which cannot make the metal cover 92 compact and light, and the overall design is not ideal under the limited circuit motherboard 90 utilization environment. Furthermore, when the processor (CPU) 912 needs to perform rapid heat dissipation of a large amount of heat sources, the opening 921 of the metal cover 92 does not meet the actual heat dissipation requirement, and it is difficult to apply rapid removal of a large amount of heat sources, which is also a drawback; if a heat dissipation and conduction device is disposed on the metal cover 92, the metal cover 92 needs to be in contact with the processor (CPU) 912, and at this time, the metal cover 92 needs to be in contact with the processor (CPU) 912 and also needs to be in conductive connection with a grounding circuit disposed on the circuit motherboard 90 for removing noise, so that the conductive effect of the metal cover 92 and the grounding circuit is poor, and the overall shielding effect is affected, which is also necessary to be improved. Therefore, there is no suitable technology to solve the problems to be overcome, which is an important direction for the industry to try to solve and break through.

Therefore, in view of the existing problems of metal cover Shielding (Shielding) and the fact that the structural design thereof is not ideal, the inventor starts to develop a solution, and hopefully develop a combined heat dissipation and noise Shielding structure with better Shielding efficacy, heat dissipation effect and excellent combination technical scheme, so as to serve the public and promote the development of the industry, and the invention is generated through the concept of multiple times.

[ invention ]

The present invention provides a heat dissipation and noise shielding combined structure for an electronic device, which can integrally solve the correlation problem of a heat dissipation module and Radio Frequency (RF)/electromagnetic compatibility (EMC), and further has an excellent shielding technology and a fast heat dissipation operation effect.

Another objective of the present invention is to provide a heat dissipation and noise shielding combined structure of an electronic device, which can solve the problems of the shielding cover, such as weight, cost design loss and insufficient space of a motherboard, when the shielding problem of Radio Frequency (RF)/electromagnetic compatibility (EMC) RF is solved.

The technical means adopted by the invention for achieving the purpose comprise: a circuit board, on which a shielding pad is formed by surface welding, and a shielding area is formed by the shielding pad in a sealing way; an electronic element arranged in the shielding region of the circuit board; the shielding heat dissipation piece is fixedly arranged on the circuit board and is provided with a heat conduction plate, the periphery of the heat conduction plate extends towards the direction of the circuit board, the heat conduction plate contacts the electronic element, and the heat conduction plate contacts the shielding pad body in a pressing mode.

Optionally, the heat conducting plate is connected with a heat dissipating pipe, and the heat dissipating pipe is connected with a heat dissipating device.

Optionally, the heat conducting plate is provided with a plurality of fixing holes, and the fixing holes enable the shielding heat dissipation part to be fixedly positioned on the circuit board through screw fixing, and enable the connecting plate to generate the pressing contact on the at least one shielding pad body.

Optionally, the shielding pad is made of soft conductive material.

Optionally, the shielding pad body includes a plurality of shielding pad elements, and the plurality of shielding pad elements are arranged to form the shielding region.

Optionally, the shielding heat sink is made of alloy copper.

Optionally, the heat dissipation tube is adhered to the heat conduction plate with a heat dissipation paste.

Optionally, the shielding pad is electrically connected to at least one grounding circuit of the circuit board.

Optionally, the shielding pad body is formed by a continuous guide type sealing connector by the plurality of shielding pad elements.

Optionally, the shielding pad body is formed by a discontinuous sealing section connector by the plurality of shielding pad elements.

Optionally, the shielding heat dissipation member forms a pair of closed covers of the electronic component and the shielding region by the heat conducting plate and the peripheral connecting plate.

[ description of the drawings ]

FIG. 1 is a schematic diagram of a conventional hard disk heating structure.

FIG. 2 is an exploded view of an embodiment of the present invention.

Fig. 3 is a schematic top view of the heat sink according to the embodiment of the invention after being turned over.

Fig. 4 is a schematic top view of an embodiment of the shielding pad of the present invention.

Fig. 5 is a schematic top view of a second embodiment of the shielding pad of the present invention.

FIG. 6 is a schematic diagram of a combination of embodiments of the present invention.

FIG. 7 is a schematic diagram of two crimping of an embodiment of the shielding gasket of the present invention.

FIG. 8 is a schematic diagram illustrating a press-fit manner of the shielding pad according to the present invention.

[ detailed description ] of the invention

The invention is developed aiming at the heat dissipation and noise shielding combined structure of the electronic device, and solves the problems that the noise shielding cannot be effectively processed and the rapid and large-scale heat dissipation is required in the prior art.

Referring to fig. 2 and 3, a heat dissipation and noise shielding combined structure of an electronic device according to the present invention is illustrated, and in the disclosed embodiment, the heat dissipation and noise shielding combined structure includes: a circuit board device 10, a shielding heat dissipation structure 20 and a heat dissipation device 30; the circuit board device 10 includes a circuit board 11, and the circuit board 11 is provided with a plurality of electronic components and devices for achieving the intended functions of the product, and in this embodiment, the circuit board 11 is provided with a processor (CPU) 12, i.e. an electronic component is shown as the processor (CPU) 12, but not limited thereto; the circuit board 11 is provided with a shielding region 14 at the periphery of the processor 12, the shielding region 14 is formed by a shielding pad (gasset) 13 disposed on the circuit board 11, in other words, the shielding pad 13 encloses the shielding region 14, in a proper embodiment, the shielding pad 13 is disposed on the circuit board 11 by a Surface mount technology (SMT/Surface-mount technology), so the shielding pad 13 may be called a SMT gasset, the shielding pad 13 is made of a conductive material with a soft property, so as to have a proper soft hardness or elasticity, and the shielding pad 13 is connected to a grounding circuit (not shown) of the circuit board in a conductive manner for rapidly removing noise; the circuit board 11 is provided with a plurality of fixing slots 15 in the shielding region 14, and three fixing slots 15 are shown in the embodiment, but not limited thereto.

The shielding heat dissipation structure 20 includes a shielding heat dissipation member 21, and the shielding heat dissipation member 21 may be made of alloy copper for increasing heat dissipation efficiency. The shielding heat sink 21 has a heat conducting plate 210 and a plurality of connection plates 22 extending from the periphery of the heat conducting plate 210 (toward the circuit board), i.e. the shielding heat sink 21 has a cover structure; the heat conducting plate 210 of the shielding heat sink 21 is provided with a plurality of fastening holes 23, and the fastening holes 23 are disposed corresponding to the fixing slots 15 for fastening the fastening members 24.

The heat dissipating device 30 is connected to a heat dissipating tube 32 for dissipating heat from the processor (CPU) 12 through the shielding heat dissipating member 21, the heat dissipating tube 32 comprises at least a heat dissipating tube front section 32A and a heat dissipating tube rear section 32B, the heat dissipating tube front section 32A (heat dissipating tube 32) is in contact with the heat conducting plate 210 of the shielding heat dissipating member 21, the heat dissipating tube 32 is typically adhered to the heat conducting plate 210 by a heat dissipating paste, and the heat dissipating tube rear section 32B is connected to the heat dissipating device 30 for removing heat sources guided from the heat dissipating tube front section 32A; in a suitable embodiment, the heat dissipating device 30 includes a plurality of heat dissipating fins 31, and a heat dissipating fan (not shown) may be added to force heat dissipation/dissipation of the plurality of heat dissipating fins 31.

Please refer to fig. 4 and 5 together, which illustrate different embodiments of the shielding pad 13 (shielding region 14); in a suitable embodiment, the shielding pad 13 may be formed by combining a plurality of shielding pad elements 131, that is, the shielding pad 13 includes a plurality of shielding pad elements 131, and the plurality of shielding pad elements 131 are arranged to form the shielding region 14. As shown in fig. 4, the shielding pad 13 (shielding region 14) is formed by a plurality of shielding pad elements 131 to form a continuous conductive type of sealing connection (shown in solid line segments). As shown in fig. 5, the shielding pad 13 (shielding region 14) is formed by the shielding pad elements 131 into an intermittent enclosure (shown as a dashed line).

Referring to fig. 6, when the heat dissipating and noise shielding assembly structure of the electronic device of the present invention is assembled, the shielding heat sink 21 is fixed on the circuit board 11 through the fixing hole 23 and the fixing slot 15 by the screw 24, and the front section 32A of the heat dissipating tube (heat dissipating tube 32) is contacted with the heat conducting plate 210 of the shielding heat sink 21; at this time, the heat conducting plate 210 of the shielding heat sink 21 contacts the processor 12 (electronic component), and the plate 22 at the periphery of the shielding heat sink 21 is pressed against and contacted with the shielding pad 13 (by screwing operation), and the shielding pad 13 is a conductive body with proper hardness or elasticity, and is further provided on the circuit board 11 by Surface Mount Technology (SMT), so that the shielding pad 13 can be completely and fully contacted with the plate 22 of the shielding heat sink 21 under the pressing press contact assembly, noise can be completely removed by the grounding circuit connected with the shielding pad 13, and the shielding heat sink 21 forms a pair of the processor (electronic component) 12 and the closed cover of the shielding region 14 by the heat conducting plate 210 and the peripheral plate 22, so that an extremely excellent shielding effect can be exerted. Thus, the shielding cover 21 can be reduced in size, and the weight and cost thereof can be greatly reduced, and meanwhile, the space of the circuit board can be simplified or fully utilized, so as to solve the problem of insufficient space of the circuit board.

Furthermore, the heat source guided by the shielding heat sink 21 from the processor 12 (electronic component) is guided to the heat sink 30 through the heat dissipating tube 32, so as to rapidly guide and discharge a large amount of heat generated by the processor 12 (electronic component) to ensure the normal operation of the processor 12 (electronic component).

As shown in fig. 7, the shielding pad 13 is an intermittent enclosure formed by the shielding pad elements 131, and the connection plate 22 contacts the intermittent shielding pad 13 (shielding pad elements 131) in a pressing manner. As shown in fig. 8, the shielding pad 13 is a continuous conductive type sealing connection formed by the shielding pad elements 131, and similarly, the connection plate 22 is in pressing contact with the continuous conductive type shielding pad 13 (shielding pad element 131).

The invention relates to a heat dissipation and noise shielding combined structure of an electronic device, which can integrally solve the correlation problem of a heat dissipation module and Radio Frequency (RF)/electromagnetic compatibility (EMC) through the structural design, thereby having the excellent shielding technology and the effect of rapid heat dissipation operation; furthermore, the invention solves the problems of weight, cost design deficiency and insufficient circuit board space of the shielding cover body when the shielding problem of Radio Frequency (RF)/electromagnetic compatibility (EMC) RF is solved.

However, the above-mentioned embodiments are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, but all equivalent changes and modifications in shape, construction, characteristics and spirit according to the present invention as defined in the appended claims are intended to be included in the scope of the present invention.

Claims

1. The utility model provides a heat dissipation and noise shielding integrated configuration of electron device which characterized in that includes:

the circuit board is provided with at least one shielding pad body formed by surface welding (SMT), a shielding area is formed by the at least one shielding pad body in a sealing way, and the at least one shielding pad body is made of soft conductive materials and is connected with at least one grounding circuit of the circuit board in a conducting way;

an electronic element arranged in the shielding region of the circuit board;

the shielding heat dissipation piece is fixedly arranged on the circuit board and is provided with a heat conduction plate, and the periphery of the heat conduction plate extends towards the direction of the circuit board and is provided with a connecting plate, wherein the heat conduction plate contacts the electronic element, and the connecting plate is in pressing contact with the at least one shielding pad body.

2. The combined heat dissipating and noise shielding structure of an electronic device as defined in claim 1, wherein the heat conducting plate is connected to a heat dissipating tube, and the heat dissipating tube is connected to a heat dissipating device.

3. The combination structure of claim 1, wherein the shielding heat sink is made of alloy copper.

4. The combined heat dissipating and noise shielding structure of claim 2, wherein the heat dissipating tube is adhered to the heat conducting plate with a heat dissipating paste.

5. The heat dissipating and noise shielding structure of claim 1, wherein the heat conducting plate has a plurality of fastening holes, and the fastening holes fix the shielding heat sink on the circuit board by screwing, and the contact plate makes the pressing contact with the at least one shielding pad.

6. The combined heat dissipating and noise shielding structure of an electronic device as defined in claim 1, wherein the at least one shielding pad comprises a plurality of shielding pad elements arranged to form the shielding region.

7. The combined heat dissipating and noise shielding structure of claim 6, wherein the at least one shielding pad forms a continuous conductive enclosure connection from the plurality of shielding pad elements.

8. The combined heat dissipating and noise shielding structure of claim 6, wherein the at least one shielding pad forms an intermittent enclosure segment interface with the plurality of shielding pad elements.

9. The combined heat dissipating and noise shielding structure of electronic device of claim 1, wherein the shielding heat sink comprises a pair of closed covers of the electronic device and the shielding region formed by the heat conducting plate and the peripheral connecting plate.