CN201629939U - Solid-state hard disk - Google Patents
Solid-state hard disk Download PDFInfo
- Publication number
- CN201629939U CN201629939U CN2010201259612U CN201020125961U CN201629939U CN 201629939 U CN201629939 U CN 201629939U CN 2010201259612 U CN2010201259612 U CN 2010201259612U CN 201020125961 U CN201020125961 U CN 201020125961U CN 201629939 U CN201629939 U CN 201629939U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- radiator
- pcb
- state hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009434 installation Methods 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 description 4
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the utility model relates to a solid-state hard disk, which comprises a printed circuit board assembly and a radiator fixed with the printed circuit board assembly by a fastening part. Installing holes needed by external installation are arranged on the radiator. The radiator of the solid-state hard disk improves radiating efficiency of the solid-state hard disk, and ensures normal work of the solid-state hard disk.
Description
Technical field
The utility model relates to communication technical field, particularly a kind of solid state hard disc.
Background technology
Solid state hard disc (Solid State Disk; Be called for short: SSD) inner printed circuit board (PCB) is gathered (PrintedCircuit Board+Assembly; Be called for short: PCBA) generally fix and protect by shell.Along with the lifting of solid state hard disc performance, the power consumption of solid state hard disc increases day by day, and the caloric value of the electronic device of solid state hard disc inside increases, and heat dissipation problem also becomes increasingly conspicuous.The modular housing of existing solid state hard disc only can be fixed and protect integrated circuit (integrated circuit that can not be huge to the caloric value of SSD inside to the PCBA of SSD inside; Be called for short: IC) dispel the heat, influence the operate as normal of SSD.
The utility model content
The utility model embodiment provides a kind of solid state hard disc, in order to solve the problem of existing solid state hard disc heat dispersion difference, improves the heat dispersion of solid state hard disc.
The utility model embodiment provides a kind of solid state hard disc to comprise: printed circuit board (PCB) set and radiator, and described radiator and the set of described printed circuit board (PCB) are fixed by securing member, and described radiator is provided with the required installing hole of external installation.
The solid state hard disc that the utility model embodiment provides, the employing radiator has improved the radiating efficiency of solid state hard disc, guarantees the operate as normal of solid state hard disc.
Description of drawings
In order to be illustrated more clearly in the technical scheme among the utility model embodiment, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the utility model solid state hard disc first embodiment;
Fig. 2 is a kind of structural representation of the utility model solid state hard disc second embodiment;
Fig. 3 is the another kind of structural representation of the utility model solid state hard disc second embodiment;
Fig. 4 is the structural representation of the utility model solid state hard disc the 3rd embodiment.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Fig. 1 is the structural representation of the utility model solid state hard disc first embodiment, as shown in Figure 1, this solid state hard disc comprises: printed circuit board (PCB) set 12 and radiator 11, radiator 11 is fixing by securing member 13 with printed circuit board (PCB) set 12, and radiator 11 is provided with the required installing hole of external installation 14.Wherein, the printed circuit board (PCB) of SSD set 12 can be fixed on the centre of radiator 11 by securing member 13, and need the device that dispels the heat for example above the printed circuit board (PCB) set 12: processor can fit tightly with radiator 11.Installing hole 14 can be generally the standard setting for required fixing threaded hole externally is installed.
As shown in Figure 1, radiator 11 can be separately positioned on the above and below of printed circuit board (PCB) set 12; The radiator 111 of the top of printed circuit board (PCB) set 12, the radiator 112 of below are fixed by securing member 13 with printed circuit board (PCB) set 12.Wherein, securing member can be for fixing with the radiator 112 of the radiator 111 of printed circuit board (PCB) set and top thereof and below by the installing hole that penetrates, also can directly printed circuit board (PCB) be gathered 12 and the radiator 111 of top, the radiator 112 of below bond together.
Radiator in the present embodiment solid state hard disc has improved the radiating efficiency of solid state hard disc, guarantees the operate as normal of solid state hard disc.
Fig. 2 is a kind of structural representation of the utility model solid state hard disc second embodiment, as shown in Figure 2, on the basis of the utility model solid state hard disc first embodiment, with different among Fig. 1, this radiator 11 can be separately positioned on the top and the both sides of printed circuit board (PCB) set 12; The radiator 111 of the top of printed circuit board (PCB) set 12 and the radiator 113 of both sides are fixing by securing member 13 with printed circuit board (PCB) set 12.In Fig. 2, the radiator 111 of printed circuit board (PCB) set and its top, the radiator 113 of both sides are can be respectively bonding or penetrate and be fixed together by securing member 13, and can also be provided with in the radiator up 111 and be connected used installing hole 14 with external equipment.
As shown in Figure 3, be the another kind of structural representation of the utility model solid state hard disc second embodiment, different with Fig. 2 is that radiator 11 can also be separately positioned on the below and the both sides of printed circuit board (PCB) set 12; The radiator 112 of the below of printed circuit board (PCB) set 12 and the radiator 113 of both sides can also be fixing by securing member 13 with printed circuit board (PCB) set 12.In Fig. 3, the radiator 112 of printed circuit board (PCB) set and its below, the radiator 113 of both sides are can be by securing member 13 bonding or penetrate and be fixed together.
Further, radiator 11 is preferably to contact with printed circuit board (PCB) set 12 and fixes.
Radiator in the present embodiment solid state hard disc has improved the radiating efficiency of solid state hard disc, guarantees the operate as normal of solid state hard disc; Radiator contacts fixing with the printed circuit board (PCB) set, can further improve heat dispersion.
Fig. 4 is the structural representation of the utility model solid state hard disc the 3rd embodiment, as shown in Figure 4, on the basis of first, second embodiment of the utility model solid state hard disc, radiator 11 and printed circuit board (PCB) set 12 inner surfaces that contacts are provided with device groove 114, and device groove 114 and printed circuit board (PCB) are gathered needs the shape and the position of the device 121 that dispels the heat corresponding in 12.
In addition, securing member can be various ways, for example: screw, rivet or buckling piece etc.
Further, the radiator in this solid state hard disc can be made by various heat sink materials, and for example: the shape of being made by the metal material of good heat conductivity such as aluminium, copper is beneficial to the metal fin of heat radiation.Radiator can also be the heat pipe radiator, the heat in the solid state hard disc can be derived by the liquid of the good heat conductivity in the heat pipe.Radiator can also be the fan radiator, and the fan in the fan radiator rotates and causes air flows, the heat in the solid state hard disc can be taken away.Only for giving an example, the utility model does not limit the particular type of radiator to the type of above-mentioned radiator.
Radiator in the present embodiment solid state hard disc has improved the radiating efficiency of solid state hard disc, thereby guarantee the operate as normal of solid state hard disc, the radiator inner surface is provided with the device groove, the set of radiator and printed circuit board (PCB) is fitted tightly, the radiator outer surface is provided with projection, can increase area of dissipation, thereby further improve heat dispersion.
It should be noted that at last: above embodiment only in order to the explanation the technical solution of the utility model, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of each embodiment technical scheme of the utility model.
Claims (9)
1. a solid state hard disc is characterized in that, described solid state hard disc comprises: printed circuit board (PCB) set and radiator, and described radiator and the set of described printed circuit board (PCB) are fixed by securing member, and described radiator is provided with the required installing hole of external installation.
2. solid state hard disc according to claim 1 is characterized in that, described radiator is separately positioned on the above and below of described printed circuit board (PCB) set; The described radiator of the above and below of described printed circuit board (PCB) set and the set of described printed circuit board (PCB) are fixed by securing member.
3. solid state hard disc according to claim 1 is characterized in that, described radiator is separately positioned on the top and the both sides of described printed circuit board (PCB) set; The top of described printed circuit board (PCB) set and the described radiator of both sides and the set of described printed circuit board (PCB) are fixed by securing member.
4. solid state hard disc according to claim 1 is characterized in that, described radiator is separately positioned on the below and the both sides of described printed circuit board (PCB) set; The below of described printed circuit board (PCB) set and the described radiator of both sides and the set of described printed circuit board (PCB) are fixed by securing member.
5. according to the arbitrary described solid state hard disc of claim 1-4, it is characterized in that described radiator contacts fixing with described printed circuit board (PCB) set.
6. according to the arbitrary described solid state hard disc of claim 1-4, it is characterized in that, described radiator is provided with the device groove with the inner surface that the set of described printed circuit board (PCB) contact, and described device groove is corresponding with the shape and the position of the device that needs during described printed circuit board (PCB) is gathered to dispel the heat.
7. according to the arbitrary described solid state hard disc of claim 1-4, it is characterized in that the outer surface that described radiator and the set of described printed circuit board (PCB) deviate from is provided with the projection that is used to increase area of dissipation.
8. according to the arbitrary described solid state hard disc of claim 1-4, it is characterized in that described securing member comprises: screw, rivet or buckling piece.
9. according to the arbitrary described solid state hard disc of claim 1-3, it is characterized in that described radiator is metal fin, heat pipe fin or fan radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201259612U CN201629939U (en) | 2010-03-04 | 2010-03-04 | Solid-state hard disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201259612U CN201629939U (en) | 2010-03-04 | 2010-03-04 | Solid-state hard disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201629939U true CN201629939U (en) | 2010-11-10 |
Family
ID=43061337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201259612U Expired - Lifetime CN201629939U (en) | 2010-03-04 | 2010-03-04 | Solid-state hard disk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201629939U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105264612A (en) * | 2013-04-12 | 2016-01-20 | 西部数据技术公司 | Thermal management for solid-state drive |
| CN109697994A (en) * | 2017-10-20 | 2019-04-30 | 神讯电脑(昆山)有限公司 | Heat-dissipating casing and plug-in type electronic device with this heat-dissipating casing |
| CN110189774A (en) * | 2018-02-23 | 2019-08-30 | 威刚科技股份有限公司 | Storage system and its storage module structure |
-
2010
- 2010-03-04 CN CN2010201259612U patent/CN201629939U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105264612A (en) * | 2013-04-12 | 2016-01-20 | 西部数据技术公司 | Thermal management for solid-state drive |
| CN105264612B (en) * | 2013-04-12 | 2017-12-22 | 西部数据技术公司 | The heat management of solid-state drive |
| CN109697994A (en) * | 2017-10-20 | 2019-04-30 | 神讯电脑(昆山)有限公司 | Heat-dissipating casing and plug-in type electronic device with this heat-dissipating casing |
| CN110189774A (en) * | 2018-02-23 | 2019-08-30 | 威刚科技股份有限公司 | Storage system and its storage module structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202533862U (en) | Low-noise computer radiating device | |
| CN203840687U (en) | Heat radiator, circuit board heat radiation structure, and electronic device | |
| CN201629939U (en) | Solid-state hard disk | |
| CN201894041U (en) | Heat dissipation structure for multi-power device | |
| CN209657233U (en) | Memory device with cooling module | |
| CN103879087A (en) | Heat-conducting copper foil | |
| CN202918632U (en) | Double-sided cooling structure of multi-power components and electronic device thereof | |
| CN202121492U (en) | Power source and power source casing thereof | |
| CN201174855Y (en) | Radiator assembly | |
| CN108882633A (en) | A kind of radiator structure, chip assembly and circuit board | |
| CN202310446U (en) | Circuit board with radiator | |
| CN211352964U (en) | Heat dissipation installation base that PCB board was used | |
| CN203118478U (en) | Solid state disk | |
| CN210244274U (en) | Heat sink device | |
| CN209593899U (en) | A kind of board facilitating separation radiating subassembly | |
| CN208783155U (en) | A kind of radiator structure, chip assembly and circuit board | |
| CN203645966U (en) | Combined panel radiator | |
| US20140118953A1 (en) | Heat dissipation structure | |
| CN210958937U (en) | Heat dissipation type PCB plate structure | |
| CN210745828U (en) | Heat dissipation device for electronic component | |
| CN205039175U (en) | LED antidetonation chip subassembly | |
| CN213186695U (en) | Circuit board heat radiation structure and router | |
| CN218816742U (en) | Mounting structure of variable pitch driver and variable pitch system | |
| US20050199377A1 (en) | Heat dissipation module with heat pipes | |
| CN216210967U (en) | Touch screen with heat radiation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HUAWEI DIGITAL TECHNOLOGY (CHENGDU) CO., LTD. Free format text: FORMER NAME: CHENGDU HUAWEI SYMANTEC TECHNOLOGIES CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 611731 Chengdu high tech Zone, Sichuan, West Park, Qingshui River Patentee after: Huawei Symantec Technologies Co., Ltd. Address before: 611731 Chengdu high tech Zone, Sichuan, West Park, Qingshui River Patentee before: Chengdu Huawei Symantec Technologies Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20101110 |
|
| CX01 | Expiry of patent term |