CN109824261B - Substrate cutting device and substrate cutting method - Google Patents

Abstract

The substrate cutting device and the substrate cutting method in the embodiment of the invention comprise the following steps: a cutting wheel module provided with a cutting wheel; the cutting wheel module comprises a first plate and a second plate, wherein the first plate and the second plate are respectively arranged on two sides of the cutting wheel module; and a plate lowering module that lowers the second plate in a Z-axis direction with respect to the first plate when the substrate is transferred to the first plate and the second plate.

Description

Substrate cutting device and substrate cutting method

Technical Field

The invention relates to a substrate cutting device and a substrate cutting method, which are used for cutting a substrate.

Background

In general, a liquid crystal display panel, an organic electroluminescence display panel, an inorganic electroluminescence display panel, a transmissive projection substrate, a reflective projection substrate, and the like used for a flat panel display use a unit glass panel (hereinafter referred to as "unit substrate") obtained by cutting a brittle mother glass panel (hereinafter referred to as "substrate") such as glass into a predetermined size.

The step of cutting the substrate includes: a scribing process of pressing and moving a scribing wheel made of a material such as diamond along a predetermined line of a substrate to be cut to form a scribing line, and a breaking process of cutting the substrate by pressing the substrate along the scribing line to obtain a unit substrate.

Therefore, in order to cut the substrate, the dicing step and the breaking step need to be performed separately, which causes a problem of increase in the number of steps. Accordingly, there is a need for a substrate cutting apparatus that can easily cut and separate a substrate without separately performing a breaking process for vertically pressing the substrate. Further, there is a need for a solution that can prevent the substrate from colliding with a support plate supporting the substrate in the process of being cut and separated.

Documents of the prior art

Patent document

Korean laid-open patent No. 10-2007-0070824 (2007.07.04)

Disclosure of Invention

In order to solve the above-described problems of the prior art, an object of the present invention is to provide a substrate cutting apparatus and a substrate cutting method, which can prevent a leading end of a substrate from colliding with a supporting plate supporting the substrate, thereby preventing the substrate from being damaged.

In order to achieve the above object, the present invention provides a substrate cutting apparatus, comprising: a cutter wheel module provided with a cutter wheel; the cutting wheel module comprises a first plate and a second plate, wherein the first plate and the second plate are respectively arranged on two sides of the cutting wheel module; and a plate lowering module that lowers the second plate in a Z-axis direction with respect to the first plate when the substrate is transferred to the first plate and the second plate.

The first and second plates inject gas to the substrate to float the substrate when the substrate is transferred to the first and second plates, and the substrate is adsorbed when the cutting wheel applies pressure to the substrate.

The present invention provides a substrate cutting apparatus, further comprising: and a moving device connected to the second plate and moving the second plate away from the first plate along the Y-axis direction.

The present invention provides a substrate cutting apparatus, further comprising: and the guide rail is extended along the Y-axis direction, and the moving device moves along the guide rail.

The substrate cutting apparatus according to an embodiment of the present invention includes: an alignment unit which determines a position of a substrate entering from the outside; a first cutting unit including the cutting wheel module, the first cutting unit forming a first X-axis cutting line and a second X-axis cutting line parallel to the X-axis direction on the first surface and the second surface of the substrate, respectively; a second cutting unit for forming a first Y-axis cutting line parallel to the Y-axis direction on the first surface of the substrate; a substrate turning unit for turning the substrate on which the first Y-axis cutting line is formed; and the third cutting unit is used for forming a second Y-axis cutting line parallel to the Y-axis direction on the second surface of the substrate.

The alignment unit includes: a plurality of conveyor belts extending in the Y-axis direction and arranged at predetermined intervals in the X-axis direction; a conveyor belt lifting device for lifting the plurality of conveyor belts; a plurality of floating devices disposed between the plurality of conveyor belts for floating the substrate; a plurality of pressurizing means for pressurizing a side of the substrate floated by the plurality of floating means.

The first cutting unit includes: a first frame extending in the X-axis direction; at least one pair of first heads provided to the first frame so as to be movable in an X-axis direction and provided to be opposed to each other in a Z-axis direction, the at least one pair of first heads including: a first cutting wheel and a second cutting wheel which are arranged at a distance in the Z-axis direction and are respectively provided with a cutting wheel; the roller cutting device comprises a first roller module and a second roller module, wherein the first roller module and the second roller module are arranged at intervals in the Z-axis direction and respectively provided with rollers, a cutting wheel of the first cutting wheel module and the rollers of the second roller module are arranged in alignment, and a cutting wheel of the second cutting wheel module and the rollers of the first roller module are arranged in alignment.

The cutting wheels of the first cutting wheel module and the cutting wheels of the second cutting wheel module are spaced in the Y-axis direction.

The substrate cutting method in the embodiment of the invention comprises the following steps: a substrate transfer step of transferring the substrate to a first plate and a second plate which are adjacently arranged; a cutting line forming step of forming a cutting line on the substrate by moving the cutting wheel module on the substrate; and lowering the second plate in a Z-axis direction with respect to the first plate when the substrate is transferred to the first plate and the second plate.

The substrate cutting method in the embodiment of the invention further comprises the following steps: a substrate floating step of floating a substrate when the substrate is transferred to the first plate and the second plate; and a substrate adsorption step of adsorbing the substrate when the cutting wheel applies pressure to the substrate.

Effects of the invention

As described above, according to the substrate cutting apparatus and the substrate cutting method in the embodiments of the present invention, when the substrate moves to the first plate and the second plate, the second plate is lowered in the Z-axis direction with respect to the first plate by the plate lowering module, so that the leading end of the substrate and the leading end of the second plate can be prevented from colliding with each other, and thus, the substrate can be prevented from being damaged.

Drawings

Fig. 1 is a block diagram schematically showing a substrate cutting apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic view showing a substrate cut by the substrate cutting apparatus in the embodiment of the present invention.

Fig. 3 is a side view schematically showing an alignment unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 4 is a plan view schematically showing an alignment unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 5 is a side view schematically showing an alignment unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 6 is a plan view schematically showing a first transfer unit, a first cutting unit, and a second transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 7 and 8 are side views schematically showing a first transfer unit, a first cutting unit, and a second transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 9 is a side view schematically showing a pressing unit of the first transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 10 to 13 are schematic views illustrating a first plate and a second plate of a substrate cutting apparatus according to an embodiment of the present invention.

Fig. 14 is a control block diagram schematically showing the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 15 to 25 are schematic views sequentially showing the operation of the first transfer unit, the first cutting unit, and the second transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 26 is a side view schematically showing a second transfer unit and a second cutting unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 27 to 29 are schematic views showing a process of transferring a substrate from the second transfer unit to the second cutting unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 30 is a plan view schematically showing a second cutting unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 31 is a side view schematically showing a second cutting unit and a substrate reversing unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 32 to 37 are schematic views illustrating the operation of the substrate reversing unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 38 is a side view schematically showing a substrate reversing unit and a third cutting unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 39 is a plan view schematically showing a third cutting unit of the substrate cutting apparatus according to the embodiment of the present invention.

Fig. 40 is a side view schematically showing a third transfer unit in the embodiment of the present invention.

Fig. 41 is a schematic view schematically showing a third transfer unit in the embodiment of the present invention.

Fig. 42 is a control block diagram of the third transfer unit in the embodiment of the present invention.

Reference numerals are as follows:

100 alignment unit 200 first cutting unit

300 second cutting unit 400 substrate reversing unit

500 third cutting unit 600 first transfer unit

700 second transfer unit 800 third transfer unit

900 dummy removal unit S substrate

S1, a first surface S2, a second surface

Detailed Description

Hereinafter, a substrate cutting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

The object to be cut by the substrate cutting device according to the embodiment of the invention is a bonded substrate formed by bonding a first substrate and a second substrate. For example, the first substrate may include a thin film transistor, and the second substrate may include a color filter, or the reverse structure. Hereinafter, the bonded substrate is simply referred to as a substrate, a surface of the first substrate exposed to the outside is referred to as a first surface, and a surface of the second substrate exposed to the outside is referred to as a second surface. Wherein the substrate has a predetermined flexibility.

Further, a transfer direction of the substrate to be subjected to the substrate dicing step is defined as a Y-axis direction, and a direction intersecting the substrate transfer direction (Y-axis direction) is defined as an X-axis direction. And, a direction perpendicular to an X-Y plane on which the substrate is placed is defined as a Z-axis direction.

As shown in fig. 1 and 2, the substrate cutting apparatus according to the embodiment of the present invention includes: an alignment unit 100 that determines a position of a substrate entering from the outside; a first cutting unit 200 that forms a first X-axis cutting line XL1 and a second X-axis cutting line XL2 parallel to the X-axis direction on the first surface S1 and the second surface S2 of the substrate S, respectively; a second cutting unit 300 forming a first Y-axis cutting line YL1 parallel to the Y-axis direction on the first surface S1 of the substrate S; a substrate turning unit 400 for turning the substrate S on which the first Y-axis cutting line YL1 is formed; a third cutting unit 500 forming a second Y-axis cutting line YL2 parallel to the Y-axis direction on the second surface S2 of the substrate S; a first transfer unit 600 disposed between the alignment unit 100 and the first cutting unit 200, for transferring the substrate from the alignment unit 100 to the first cutting unit 200; a second transfer unit 700 disposed between the first cutting unit 200 and the second cutting unit 300, transferring the substrate from the first cutting unit 200 to the second cutting unit 300; a third transfer unit 800 that sends out the substrate cut by the third cutting unit 500 to the outside; a control unit 1000 for controlling the operation of the structural members of the substrate cutting apparatus.

The aligning unit 100, the first cutting unit 200, the second cutting unit 300, the substrate reversing unit 400, and the third cutting unit 500 are horizontally arranged in a row parallel to the ground. Accordingly, the substrate S is horizontally and continuously transferred along the alignment unit 100, the first cutting unit 200, the second cutting unit 300, the substrate reversing unit 400, and the third cutting unit 500, during which the substrate S is cut.

As shown in fig. 2, the substrate cutting apparatus according to the embodiment of the invention forms a first X-axis cutting line XL1 and a second X-axis cutting line XL2 on a first surface S1 and a second surface S2 of a substrate S, respectively, inverts the substrate S about an X-axis after forming a first Y-axis cutting line YL1 on the first surface S1 of the substrate S, and forms a second Y-axis cutting line YL2 on the second surface S2 of the substrate S, thereby cutting the substrate S into unit substrates. However, the present invention is not limited to the method of forming the cutting line as shown in fig. 2, and the second X-axis cutting line XL2 as shown in fig. 2 may be formed on either side of the first X-axis cutting line XL1 in the Y-axis direction, for example.

As shown in fig. 3 to 5, the aligning unit 100 includes: a plurality of belts 110 extending in a direction (Y-axis direction) in which the substrate S is transferred and disposed at predetermined intervals in the X-axis direction; a strap lifting device 120 for lifting the plurality of straps 110; a plurality of floating devices 130 disposed between the plurality of straps 110 for floating the substrate S; and a plurality of pressurizing means 140 for pressurizing the side surface of the substrate S floated by the plurality of floating means 130.

The plurality of belts 110 are supported by a plurality of pulleys 111, respectively. At least one of the plurality of pulleys 111 is a drive pulley that provides a driving force for rotating the belt 110.

The belt elevating device 120 may be an actuator connected to the plurality of pulleys 111 and operated by air pressure or oil pressure, a linear moving device such as a linear motor or a ball screw device operated according to electromagnetic interaction, or the like.

The plurality of floatation devices 130 may include a plurality of gas nozzles 131 connected to a gas supply source (not shown). The plurality of gas nozzles 131 are provided at predetermined intervals in the Y-axis direction.

The pressing devices 140 may be provided in two or more numbers, and the substrates S are aligned on the X-Y plane by pressing, and the two or more pressing devices 140 are disposed to face each other in the X-axis direction or the Y-axis direction. Each pressurizing device 140 includes: a pressing member 141 for pressing a side surface of the substrate S; and a pressing member moving device 142 for moving the pressing member 141 in a direction toward the substrate S or in a direction away from the substrate S. The plurality of pressing devices 140 include pressing members 141, respectively, and the plurality of pressing members 141 are disposed to be capable of pressing at least two side surfaces of the substrate S. The pressing member 141 has a shape corresponding to the side of the substrate S so as to press the side of the substrate S. For another example, the pressing member 141 may have a shape corresponding to a corner portion of the substrate S so as to press the corner portion of the substrate S.

According to the above structure, as shown in fig. 3, the plurality of straps 110 maintain a state of being raised compared to the plurality of floating devices 130 in the process of feeding the substrate S to the aligning unit 100 from the outside. And, the substrate S can move to a predetermined position between the plurality of pressing members 141 as the plurality of belts 110 rotate.

As shown in fig. 4 and 5, when the substrate S moves to a predetermined position on the plurality of belts 110, the plurality of belts 110 descend, and gas is injected from the gas nozzles 131 toward the substrate S, so that the substrate S is floated by the injected gas.

In a state where the substrate S is floating, the pressing member 141 presses the side surface of the substrate S by the operation of the pressing member moving device 142, and thereby the substrate S translates or rotates to determine the position and posture of the substrate S.

After the position and posture of the substrate S are determined, the gas injection from the gas nozzles 131 is interrupted and the plurality of belts 110 are raised, so that the substrate S can be supported by the plurality of belts 110 in a state where the position thereof is determined.

In addition, the substrate S is discharged from the aligning unit 100 according to the rotation of the plurality of belts 110, and at the same time, the first transfer unit 600 operates to transfer the substrate S to the first cutting unit 200.

As shown in fig. 6 to 9, the first transfer unit 600 includes: a plurality of straps 610 for supporting the substrate S; a shuttle unit 620 disposed between the alignment unit 100 and the first cutting unit 200 to absorb and transfer the substrate S; a first holding unit 630 for holding a rear end of the substrate S supported on the plurality of belts 610; a first guide rail 640 connected to the first grip unit 630 and extending in the Y-axis direction; a pressing unit 650 for pressing the rear end of the substrate S to align the substrate S when the substrate S is fed onto the plurality of tapes 610; a first plate 660 disposed adjacent to the first cutting unit 200, for floating or adsorbing the substrate S to support the substrate S.

The plurality of bands 610 are spaced apart from each other in the X-axis direction. Each belt 610 is supported by a plurality of pulleys 611, and at least one of the plurality of pulleys 611 may be a driving pulley that provides a driving force to rotate the belt 610.

The belts 610 of the first transfer unit 600 are disposed adjacent to the belts 110 of the alignment unit 100 on the same plane, and the substrates S may be directly transferred from the belts 110 of the alignment unit 100 to the belts 610 of the first transfer unit 600.

As shown in fig. 6, the shuttle unit 620 includes a guide rail 621 extending in the Y-axis direction, a shuttle 622 movable along the guide rail 621, and a shuttle lifting device 623 configured to lift and lower the shuttle 622 in the Z-axis direction.

An actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, a ball screw device, or the like may be provided between the shuttle 622 and the guide rail 621. For example, the linear motion device may be connected to the shuttle 622 and/or the guide 621. Thereby, the shuttle 622 can be moved in the Y-axis direction along the guide rail 621 by the linear movement device.

The guide rail 621 is extended to the alignment unit 100, and thus, the shuttle 622 may be moved from the alignment unit 100 to the first transfer unit 600.

The shuttle 622 is connected to a vacuum source to adsorb the substrate S. Thus, the substrate S can move in the Y-axis direction as the shuttle 622 moves in the Y-axis direction while adsorbing the substrate S.

The shuttle 622 performs a role of transferring the substrate S from the alignment unit 100 to the first transfer unit 600 while reciprocating on the alignment unit 100 and the first transfer unit 600.

The shuttle member lifting and lowering device 623 may include an actuator operated by air pressure or oil pressure, a linear motor operated according to electromagnetic interaction, a ball screw device, or the like, which is connected to the shuttle member 622. When transferring the substrate S, the shuttle lifting device 623 lifts the shuttle 622 so that the shuttle 622 attracts the substrate S. After the substrate S is transferred to the first transfer unit 600 by the shuttle 622, the shuttle lifting device 623 lowers the shuttle 622 to prevent the shuttle 622 from interfering with the substrate S, the pusher 652, and the first holding unit 630.

An actuator operated by air pressure or oil pressure, a linear moving device operated by electromagnetic interaction, a linear motor or a ball screw device, or the like may be disposed between the first grip unit 630 and the first guide rail 640. For example, the linear moving device is connected to the first holding unit 630 and/or the first guide rail 640.

Therefore, in a state where the first holding unit 630 holds the substrate S, the first holding unit 630 is moved in the Y-axis direction by the linear movement device, and the substrate S can be transferred in the Y-axis direction. At this time, the plurality of bands 610 are rotated together with the movement of the first holding unit 630, so that the substrate S can be stably supported.

The first grasping unit 630 includes a support bar 631 extending in the X-axis direction and connected to the first guide rail 640, and a plurality of grasping members 632 provided on the support bar 631 to grasp the substrate S. The holding member 632 may be a jig that can maintain the posture of the substrate S while being pressurized. For another example, the holding member 632 may have a vacuum hole connected to a vacuum source to suck the substrate S.

The pressing unit 650 includes a guide rail 651 extending in the Y-axis direction, a pusher 652 movable along the guide rail 651, and a pusher elevating device 653 configured to elevate the pusher 652 in the Z-axis direction.

An actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, a ball screw device, or the like may be provided between the pusher 652 and the guide rail 651. Thereby, the mover 652 can be moved in the Y-axis direction along the guide 651 by the linear moving device.

The pusher elevating device 653 may include an actuator operated by air pressure or oil pressure, a linear motor operated according to electromagnetic interaction, or a linear moving device such as a ball screw device, which is connected to the pusher 652. The pusher elevating device 653 ascends the pusher 652 so that the pusher 652 can press the trailing end of the substrate S, and after the pusher 652 presses the trailing end of the substrate S, the pusher elevating device 653 descends the pusher 652 so that the pusher 652 is prevented from interfering with the substrate S, the shuttle 622, and the first grip unit 630.

In a state where the substrate S is positioned on the plurality of tapes 610, the pressing unit 650 pushes the trailing end of the substrate S so that the substrate S is positioned at the accurate position P.

As another example, when the pusher 652 moves at a speed higher than the moving speed of the substrate S and contacts the trailing end of the substrate S while the leading end of the substrate S is being sucked by the shuttle 622 and transferred in the Y-axis direction, the pusher 652 may move at the same speed as the substrate S in synchronization with the moving speed of the substrate S by the shuttle 622.

As another example, in the process of transferring the substrate S in the Y-axis direction according to the rotation of the plurality of tapes 610, after the pusher 652 contacts the rear end of the substrate S at a moving speed faster than the moving speed of the substrate S, the pusher 652 moves at the same speed as the substrate S in synchronization with the moving speed of the substrate S.

The base plate S can be moved on the band 610 to be located at an accurate position without shaking by the pusher 652 as described above.

The first plate 660 may float or adsorb the substrate S. For example, a plurality of grooves that can be connected to a gas supply source and a vacuum source may be formed on the surface of the first plate 660. When gas is supplied from the gas supply source to the plurality of groove portions of the first plate 660, the substrate S may float from the first plate 660. When the gas is sucked into the grooves of the first plate 660 by the vacuum source, the substrate S is adsorbed by the first plate 660.

In a state where the substrate S floats from the first plate 660, the substrate S may move without friction with the first plate 660. In addition, the substrate S is adsorbed and fixed to the first plate 660 while the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed on the first surface S1 and the second surface S2 of the substrate S.

As shown in fig. 6 to 8, the first cutting unit 200 forms a first X-axis cutting line XL1 and a second X-axis cutting line XL2 on the first surface S1 and the second surface S2 of the substrate S, respectively.

The first cutting unit 200 includes a first housing 210 extending in the X-axis direction and a first head 220 movably provided in the X-axis direction on the first housing 210.

The pair of first heads 220 is provided on the first housing 210 so as to face each other in the Z-axis direction.

The pair of first heads 220 includes: a first cutting wheel module and a second cutting wheel module 221, the first cutting wheel module and the second cutting wheel module 221 are arranged at intervals in the Z-axis direction and respectively provided with a cutting wheel 225; the first and second roller modules 222 are provided with rollers 229, respectively, and the first and second roller modules 222 are provided at intervals in the Z-axis direction.

The cutoff wheel 225 of the first cutoff wheel module 221 is aligned with the rollers 229 of the second roller module 222 and the cutoff wheel 225 of the second cutoff wheel module 221 is aligned with the rollers 229 of the first roller module 222.

The cutter wheel 225 of the first cutter wheel module 221 and the roller 229 of the first roller module may be pressed against the first face S1, and the cutter wheel 225 of the second cutter wheel module 222 and the roller 229 of the second roller module may be pressed against the second face S2.

Accordingly, in a state where the plurality of cutter wheels 225 and the plurality of rollers 229 are pressed against the first surface S1 and the second surface S2, respectively, the first head 220 is moved in the X-axis direction with respect to the substrate S so that the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed on the first surface S1 and the second surface S2, respectively.

Also, the cutter wheel 225 of the first cutter wheel module 221 and the cutter wheel 225 of the second cutter wheel module 221 may be spaced in the Y-axis direction, and the roller 229 of the first roller module 222 and the roller 229 of the second roller module 222 may be spaced in the Y-axis direction. Thus, the first X-axis cutting line XL1 and the second X-axis cutting line XL2 can be formed to be spaced from each other in the Y-axis direction.

As a result, as shown in fig. 2, after the substrate S is cut, a Y-axis step portion YS having a distance corresponding to the first X-axis cutting line XL1 and the second X-axis cutting line XL2 spaced apart from each other in the Y-axis direction may be formed, and the wiring and/or electrodes connected to the wiring and the like may be formed on the Y-axis step portion YS.

The first and second cutting wheel modules 221 may include wheel moving modules 230, respectively, and the wheel moving modules 230 may move the cutting wheels 225 in the Z-axis direction so as to press the cutting wheels 225 against the substrate S. The cutting wheel 225 may be in contact with the surface of the substrate S by the wheel moving module 230, and may be pressurized to the surface of the substrate S with a predetermined pressurizing force. For example, the wheel moving module 230 may move the cutting wheel module 221 in a vertical (Z-axis) direction with respect to the substrate S such that the cutting wheel 225 moves vertically with respect to the substrate S. The wheel moving module 230 functions to adjust the position of the cutting wheel 225 with respect to the substrate S.

The wheel moving module 230 may be an actuator connected to the cutting wheel module 221 to move the cutting wheel module 221 in the Z-axis direction by oil pressure or air pressure. However, the present invention is not limited to this structure, and the wheel moving module 230 may be a linear motor operating by electromagnetic interaction or a linear moving device such as a ball screw.

Also, as shown in fig. 15 to 25, the substrate cutting apparatus in the embodiment of the present invention further includes a dummy removal unit 900 that grips a dummy portion (cullet), i.e., a non-effective area that is not used as a unit substrate but discarded after cutting, located at a leading end edge or a trailing end edge of the substrate S, to remove the dummy portion from the substrate S.

The dummy removal unit 900 may be disposed between the first transfer unit 600 and the second transfer unit 700.

The dummy removal unit 900 includes: a jig 910 for holding a non-effective region of the substrate S; and a clamp driving device 920 for moving the clamp 910 vertically and horizontally and rotating the clamp 910 around the X-axis or the Z-axis.

The clamp 910 may include a pair of clamp members that move adjacent to each other or that move apart from each other. The pair of chuck members moves adjacent to each other with the substrate S therebetween, and the substrate S is held by the chuck members.

For example, the jig driving device 920 may be a multi-axis robot including a plurality of arms connected to the jig 910.

As shown in fig. 6 to 25, the second transfer unit 700 includes: a second plate 760 which is disposed adjacent to the first cutting unit 200 and supports the substrate S by floating or adsorbing the substrate S; a strap 710 attached to the second plate 760; and a moving device 730 for moving the second plate 760 and the band 710 back and forth in the Y-axis direction.

Also, the second transfer unit 700 may include a lifting device 740 for lifting the belt 710.

The second plate 760 and the band 710 are movable in the same Y-axis direction. That is, the second plate 760 and the tape 710 may be moved together in a direction (Y-axis direction) parallel to the direction in which the substrate S is transferred.

When the first cutting unit 200 forms the first X-axis cutting line XL1 and the second X-axis cutting line XL2 on the first surface S1 and the second surface S2 of the substrate S, respectively, the second plate 760 moves toward the first plate 660, and the first head 220 may be positioned between the first plate 660 and the second plate 760. When the first and second X-axis cutting lines XL1 and XL2 are formed on the first and second surfaces S1 and S2 of the substrate S by the first cutting unit 200, respectively, the second plate 760 moves toward the first plate 660, and the substrate S is supported by the first and second plates 660 and 760.

The band 710 may be plural, and the plural bands 710 may be spaced apart from each other in the X-axis direction. Each belt 710 is supported by a plurality of pulleys 711, and at least one of the plurality of pulleys 711 may be a driving pulley that provides a driving force to rotate the belt 710.

The second plate 760 may float or adsorb the substrate S. For example, the second plate 760 may have a plurality of grooves formed on the surface thereof to be connected to a gas supply source and a vacuum source. When gas is supplied from the gas supply source to the plurality of groove portions of the second plate 760, the substrate S may float from the second plate 760. When air is sucked from the plurality of grooves of the second plate 760 by the vacuum source, the substrate S may be adsorbed to the second plate 760.

In the process of transferring the substrate S to the second plate 760, the gas is supplied to the grooves of the second plate 760, and thus the substrate S can move without friction with the second plate 760.

Process for forming first and second X-axis cutting lines XL1 and XL2 on first and second surfaces S1 and S2 of substrate S

The substrate S is attracted and fixed by the second plate 760.

In the process of moving the substrate S from the second plate 760 to the subsequent process, gas is supplied to the groove portions of the second plate 760, and thus the substrate S can move without friction with the second plate 760.

The second transfer unit 700 further includes a plate lifting module 750 for lifting and lowering the second plate 760. The plate elevating module 750 is disposed below the guide rail 720 extended in the Y-axis direction, and elevates the second plate 760 and the belt 710 together. However, the present invention is not limited thereto, and the board lifting module 750 may be connected to the second board 760 to lift the second board 760. The second plate 760 may be lifted by one plate lifting module 750 according to an embodiment of the present invention. However, the present invention is not limited thereto, and the plate lifting module 750 may include a plate lowering module 751 for lowering the second plate 760 and a plate raising module 752 for raising the second plate 760.

The plate lifting module 750, the plate lowering module 751, or the plate lifting module 752 may be a linear moving device such as an actuator operated by air pressure or oil pressure, a linear motor or a ball screw device operated according to electromagnetic interaction, or the like.

As shown in fig. 10, in the process of transferring the substrate S from the first plate 660 to the second plate 760, the second plate 760 is lowered by a predetermined distance by the plate lowering module 751. This prevents the leading end of the substrate S from colliding with the leading end of the second plate 760 when the leading end enters the upper portion of the second plate 760.

As shown in fig. 11, in the process in which the second plate 760 is moved from the first plate 660 and the substrate S is separated, the second plate 760 is raised by a predetermined distance by the plate-raising module 752. Accordingly, stress can be concentrated along the first X axis scribe line XL1 and the second X axis scribe line XL2 formed on the substrate S, and the substrate S can be smoothly separated along the first X axis scribe line XL1 and the second X axis scribe line XL2.

Still alternatively, if there is the plate lifting module 750 for lifting the second plate 760, the second plate 760 may be lifted or lowered by a predetermined distance by the plate lifting module 750 in the process of separating the substrate S. The rising and falling of the second plate 760 may be repeated a predetermined number of times. As a result, the stress is concentrated along the first X-axis cutting line XL1 and the second X-axis cutting line XL2 formed on the substrate S, and the substrate S can be smoothly separated along the first X-axis cutting line XL1 and the second X-axis cutting line XL2.

The above-described effects can be produced not only when the substrate S is separated into unit substrates but also when the dummy portion is removed from the substrate S.

Alternatively, as shown in fig. 12, the first plate 660 may be inclined at a predetermined angle A1 in the transfer direction of the substrate S. Similarly, the second plate 760 is also inclined by a predetermined angle A2 in the transfer direction of the substrate S. That is, the first plate 660 and the second plate 760 may have surfaces inclined at a predetermined angle with respect to the substrate S.

In an embodiment of the present invention, the first plate 660 and the second plate 760 may be both inclined. At this time, the first plate 660 and the second plate 760 may be inclined in the same direction. However, the present invention is not limited thereto, and only one of the first plate 660 or the second plate 760 may be inclined. That is, the first plate 660 and the second plate 760 are inclined in different directions from each other.

In addition, the first plate 660 and the second plate 760 are inclined at different angles from each other.

The first plate 660 and the second plate 760 are inclined at any angle of 0 to 45 degrees.

For example, the first plate 660 may be inclined downward at a predetermined angle A1 toward the transfer direction of the substrate S. For another example, the first plate 660 may be inclined upward at a predetermined angle A1 toward the transfer direction of the substrate S.

Alternatively, the second plate 760 may be inclined downward at a predetermined angle A2 toward the transfer direction of the substrate S. For another example, the second plate 760 may be inclined upward at a predetermined angle A2 toward the transfer direction of the substrate S.

In the embodiment of the present invention, the first plate 660 is inclined downward by a predetermined angle A1 toward the transfer direction of the substrate S, and the second plate 760 is inclined downward by a predetermined angle A2 toward the transfer direction of the substrate S.

According to the above configuration, as shown in fig. 13, in the process of separating the substrate S along the first X-axis scribe line XL1 and the second X-axis scribe line XL2 while moving the second plate 760 away from the first plate 660, it is possible to prevent sliding (friction) between the end portions P1 and P2 of the two separated unit substrates. Thus, it is possible to prevent the breakage of the substrate S due to the sliding (friction) between the end portions P1, P2 of the two unit substrates to be separated, and the breakage of the substrate S due to scratches, static electricity, or the like caused by the sliding (friction).

The above-described effects occur not only when the substrate S is separated into unit substrates but also when the dummy portion of the substrate S is eliminated.

The mobile device 730 functions to: the second plate 760 and the band 710 are reciprocated in the Y-axis direction by the guide rail 720 extending in the Y-axis direction. The moving device 730 may be a linear moving device such as an actuator operated by air pressure or oil pressure, a linear motor operated according to electromagnetic interaction, or a ball screw device.

As shown in fig. 22, after the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed on the substrate S, the second plate 760 is separated from the first plate 660 by the moving device 730 in a state where the substrate S is adsorbed on the first plate 660 and the second plate 760, and the substrate S can be separated along the first X-axis cutting line XL1 and the second X-axis cutting line XL2.

As shown in fig. 14, the mobile device 730 is connected to the control unit 1000 and controlled by the control unit 1000. A load measuring module 1100 for measuring a load of the mobile device 730 is connected to the mobile device 730.

For example, if the moving device 730 is a linear moving device including a rotating motor, the load of the moving device 730 may be a torque. In order to separate the substrate S along the first X-axis cutting line XL1 and the second X-axis cutting line XL2, a load of the moving device 730 may be increased while the moving device 730 moves the second plate 760. Also, the load of the moving device 730 may be reduced at the time point when the substrate S is separated.

The load of the moving device 730 that moves the second plate 760 to separate the substrate S may be different according to the pressing force of the cutting wheel 225 pressing the substrate S. For example, if the pressing force of the cutting wheel 225 is reduced, the cutting depth of the cutting wheel 225 is also reduced to make it difficult to separate the substrate S, and the load of the moving device 730 measured when the substrate S is separated is increased. On the contrary, when the pressing force of the cutter wheel 225 is increased, the cutting depth of the cutter wheel 225 is also increased, and the separation of the substrate S becomes easy, and thus the load of the transfer device 730 measured when the substrate S is separated is reduced.

Accordingly, the pressing force applied to the substrate S by the cutter wheel 225 can be adjusted based on the load of the moving device 730 measured when the substrate S is separated.

For example, as the cutting wheel 225 is used repeatedly and the amount of use of the cutting wheel 225 increases, the cutting wheel 225 may be worn. As the cutting wheel 225 wears, the diameter of the cutting wheel 225 may decrease and the cutting depth of the cutting wheel 225 may also decrease. Accordingly, since the pressing force applied to the substrate S by the cutting wheel 225 is reduced, the load of the transfer device 730 measured when the substrate S is separated may be increased. In this case, by increasing the pressing force applied to the substrate S by the cutter wheel 225, the shape of the cut line formed on the substrate S can be uniformly maintained even when the cutter wheel 225 is worn. Also, in order to increase the pressurizing force applied to the substrate S by the cutting wheel 225, the wheel moving module 230 may further move the cutting wheel 225 toward the substrate S.

The load measuring module 1100 is used to measure the load of the moving device 730 when the substrate S is separated. The control unit 1000 may adjust the pressing force applied to the substrate S by the cutting wheel 225 based on the load of the moving device 730 measured by the load measuring module 1100. For this purpose, an experiment or simulation may be performed in advance in which the load of the transfer device 730 when the substrate S is separated is measured while changing the pressurizing force applied to the substrate S. Through the above experiment or simulation, data on a load change of the moving device 730 according to a change of the pressing force of the cutting wheel 225 to the substrate S can be obtained.

The load of the moving device 730 when the substrate S is properly separated may be preset as a reference load. Such a reference load may vary depending on the characteristics of the substrate S such as the thickness and material of the substrate S. Thus, a plurality of reference loads according to the characteristics of the substrate S can be preset through experiments or simulations.

The control unit 1000 compares the load of the moving device 730 measured when the substrate S is separated with the reference load, and thus can determine whether or not an appropriate pressurizing force is pressurized on the substrate S.

The control unit 1000 may determine that a pressing force necessary to properly separate the substrate S is applied to the substrate S if the load measured when the substrate S is separated is within the reference load range. And, if the measured load exceeds the reference load range, the control unit 1000 determines that an excessive or insufficient pressurizing force is applied to the substrate S.

If the load of the moving device 730 measured when the substrate S is separated is less than the reference load, the control unit 1000 determines that a pressurizing force exceeding a proper pressurizing force is applied to the substrate S, and moves the cutting wheel 225 in a direction away from the substrate S by controlling the wheel moving module 230. Thereby, the pressing force applied to the substrate S by the cutting wheel 225 is reduced, and the load of the moving device 730 required to separate the substrate S is increased.

When the load of the moving device 730 measured when the substrate S is separated exceeds the reference load, the control unit 1000 determines that the substrate S is pressed with a pressing force smaller than the proper pressing force, and controls the wheel moving module 230 to move the cutting wheel 225 toward the substrate S. Accordingly, the pressing force applied to the substrate S by the cutting wheel 225 is increased, and the load of the moving device 730 required to separate the substrate S is reduced.

As described above, if the load of the moving device 730 when the substrate S is separated exceeds the reference load range, the pressing force applied to the substrate S by the cutting wheel 225 is adjusted to maintain the load of the moving device 730 within the reference load range. Thereby, the moving device 730 can separate the substrate S while operating within the optimal reference load range. Also, the load of the mobile device 730 can be prevented from excessively increasing or decreasing.

When the pressing force applied to the substrate S is different according to the wear of the cutting wheel 225, the wheel moving module 230 is controlled based on the load of the moving device 730 to automatically adjust the pressing force of the cutting wheel 225. Accordingly, even when the dicing wheel 225 is worn, the degree of pressing the substrate S by the dicing wheel 225 can be stably maintained, and thus, a uniform and flat dicing line can be formed on the substrate S.

In addition, when the pressing force applied to the substrate S is small due to a defect of the dicing wheel 225, etc., there is a possibility that the load of the moving device 730 excessively increases. At this time, the control unit 1000 may determine that this is a malfunction of the substrate cutting apparatus, and may interrupt the operation of the substrate cutting apparatus.

Hereinafter, the operation of the first transfer unit 600, the first cutting unit 200, and the second transfer unit 700 will be described with reference to fig. 15 to 25.

As shown in fig. 15, the substrate S is transferred to the first cutting unit 200 in a state where the dummy portion of the leading end thereof is not removed. At this time, the substrate S may float from the first plate 660 by the gas injected from the first plate 660.

When the substrate S is positioned on the first plate 660, the substrate S is adsorbed by the first plate 660. At this time, after the cutting wheels 225 of the first cutting wheel module 221 and the second cutting wheel module 222 are respectively brought into contact with the substrate S, the cutting wheels 225 are moved in the X-axis direction, and thereby the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed at the dummy portion of the substrate S.

Then, as shown in fig. 16 and 17, the jig 910 of the dummy removal unit 900 is moved to the dummy portion of the substrate S on which the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed. After holding the dummy portion of the substrate S, the jig 910 rotates about the X axis or moves in the Y axis direction, thereby removing the dummy portion from the substrate S. The jig 910 from which the dummy portion is removed returns to the original position where the movement of the cutting wheels 225 of the first cutting wheel module 221 and the second cutting wheel module 222 is not hindered.

As shown in fig. 18, the second plate 760 moves in the Y-axis direction toward the first plate 660 in a state where the first plate 660 is fixed. Accordingly, the interval between the first plate 660 and the second plate 760 is reduced, and the substrate S is supported by the first plate 660 and the second plate 760.

As shown in fig. 19, the substrate S is transferred to the second transfer unit 700. At this time, the substrate S floats from the first plate 660 and the second plate 760 by the gas supplied to the first plate 660 and the second plate 760.

As shown in fig. 20, when the substrate S is positioned on the first plate 660 and the second plate 760, the substrate S is attracted by the first plate 660 and the second plate 760. At this time, after the dicing wheels 225 of the first and second dicing wheel modules 221 and 222 are brought into contact with the substrate S, the dicing wheels 225 are moved in the X-axis direction, thereby forming the first and second X-axis scribe lines XL1 and XL2 on the substrate S.

As shown in fig. 21 and 22, after the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed on the substrate S, the dicing wheel 225 of the first dicing wheel module 221 and the second dicing wheel module 222 moves away from the substrate S. When the second plate 760 moves away from the first plate 660 in a state where the substrate S is attracted by the first plate 660 and the second plate 760, the substrate S is separated along the first X-axis cutting line XL1 and the second X-axis cutting line XL2.

As shown in fig. 23, after the middle portion of the substrate S is separated, the substrate S is transferred to the first cutting unit 200 in a state where the dummy portion of the rear row end of the substrate S is not removed. At this time, the substrate may float from the second plate 760 by the gas injected from the second plate 760.

Furthermore, when the substrate S is located on the second plate 760, the substrate S is adsorbed by the second plate 760. At this time, after the cutting wheels 225 of the first cutting wheel module 221 and the second cutting wheel module 222 are respectively brought into contact with the substrate S, the cutting wheels 225 are moved in the X-axis direction, and thereby the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed at the dummy portion of the substrate S.

As shown in fig. 24 and 25, the jig 910 of the dummy removal unit 900 is moved to the dummy portion of the substrate S on which the first X-axis cutting line XL1 and the second X-axis cutting line XL2 are formed. After the jig 910 holds the dummy portion of the substrate S, the dummy portion is removed from the substrate S by rotating or horizontally moving. The jig 910 removing the dummy portion is restored to the original position without hindering the movement of the cutting wheels 225 of the first and second cutting wheel modules 221 and 222.

As shown in fig. 26, the substrate S separated along the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is transferred to the second cutting unit 300 by the rotation of the plurality of belts 710.

At this time, as shown in fig. 27, the second transfer unit 700 and the second cutting unit 300 are disposed at the same height, and the substrate S may be directly transferred to the second cutting unit 300. At this time, the substrate S floats from the second plate 760 under the influence of the gas supplied from the second plate 760.

In another example, a pickup unit (not shown) that can be lifted and moved horizontally is disposed between the second transfer unit 700 and the second cutting unit 300, and the substrate S is transferred from the second transfer unit 700 to the second cutting unit 300. As shown in fig. 28 and 29, the second transfer unit 700 may be disposed at a position lower than the second cutting unit 300 by a predetermined height H. At this time, the tape 710 is raised by a predetermined height H by the tape elevating device 740 so that the tape 710 is located at the same height as the second cutting unit 300. At this time, when the tape 710 is lifted by the tape lifting and lowering device 740, the base plate S moves away from the second plate 760. As described above, the strap 710 is raised with respect to the second plate 760 by the elevating device 740 so that the base plate S is spaced apart from the second plate 760. Thus, it is not necessary to float the substrate S from the second plate 760 in order to prevent friction between the substrate S and the second plate 760.

As shown in fig. 30 and 31, the second cutting unit 300 forms a first Y-axis cutting line YL1 on the first surface S1 of the substrate S.

The second cutting unit 300 includes: a second frame 310 which can be extended in the X-axis direction and moved in the Y-axis direction; a second head 320 provided to the second frame 310 movably in the X-axis direction and having a cutter wheel 321; a second guide rail 330 for guiding the movement of the second frame 310; a strap 340 supporting the substrate S; a support plate 350 which is movably disposed below the tape 340 in the Z-axis direction, and supports the tape 340 when the cutter wheel 321 presses the substrate S, thereby supporting the substrate S; and a support plate elevating device 360 for elevating the support plate 350 in the Z-axis direction.

The second frame 310 is provided with a plurality of second heads 320 in the X-axis direction.

An actuator operated by air pressure or oil pressure, a linear moving device operated by electromagnetic interaction, such as a linear motor or a ball screw device, may be provided between the second housing 310 and the second guide rail 330. For example, the linear motion device may be disposed on the second housing 310 or/and the second guide rail 330. Accordingly, as the second housing 310 moves in the Y-axis direction along the second guide rail 330 in a state where the cutting wheel 321 presses the substrate S, the first Y-axis cutting line YL1 is formed on the first surface S1 of the substrate S.

The belt 340 is supported by a plurality of pulleys 341, and at least one of the plurality of pulleys 341 may be a driving pulley that provides a driving force for rotating the belt 340. The belt 340 is preferably an integral belt that is not divided into a plurality of parts, so as to uniformly support the entire surface of the substrate S and transfer the substrate S.

When the strap 340 rotates and the substrate S moves, the supporting plate 350 is lowered by the supporting plate elevating device 360 to be spaced apart from the strap 340, so that the strap 340 can move smoothly without friction with the supporting plate 350. When the first Y-axis cutting line YL1 is formed on the substrate S, the support plate 350 is lifted by the support plate lifting and lowering device 360 to support the bottom surface of the tape 340, thereby supporting the substrate S. For example, the support plate 350 may include a vacuum hole connected to a vacuum source, and the substrate S may be adsorbed through the fine holes in the tape 340.

In the process of forming the first Y-axis cutting line YL1 on the first surface S1 of the substrate S, the second frame 310 provided with the second head 320 having the cutting wheel 321 is moved, and the substrate S is supported by the support plate 350, so that the cutting wheel 321 may apply a large pressure to the substrate S, and thus the substrate S may be easily cut.

Also, the substrate S is supported by the support plate 350, and thus a roller for supporting the cutting wheel 321 is not required. Thereby, the width of the second head 320 corresponding to the size of the space of the removing roller may be reduced, so that the interval between the cutting wheels 321 of the plurality of second heads 320 when the plurality of second heads 320 are closely adjacent may be reduced. Thereby, the interval between the first Y-axis cutting lines YL1 formed by the cutting wheel 320 may be reduced.

As shown in fig. 31, the base plate S formed with the first Y-axis cutting line YL1 is transferred from the second cutting unit 300 to the flipping unit 400 by the rotation of the tape 340. For another example, a pick-up unit (not shown) that can move horizontally while being lifted up and down is disposed between the second cutting unit 300 and the substrate reversing unit 400, and transfers the substrate S from the second cutting unit 300 to the reversing unit 400.

As shown in fig. 31 to 38, the substrate inverting unit 400 includes: a plurality of bands 410 provided spaced apart from each other in the X-axis direction; a support table 420 extending in the Z-axis direction; a first adsorption plate 430 having a first adsorption nozzle 431; a second adsorption plate 440 having a second adsorption nozzle 441; a suction plate lifting device 450 for moving the first suction plate 430 and the second suction plate 440 along the support table 420 in the Z-axis direction; and a suction plate rotating device 460 for rotating the first suction plate 430 and the second suction plate 440.

The belt 410 is supported by a plurality of pulleys 411, and at least one of the plurality of pulleys 411 may be a driving pulley that provides a driving force to rotate the belt 410.

The adsorption plate elevating device 450 may include an actuator operated by air pressure or oil pressure, a linear motor operated according to electromagnetic interaction, a ball screw device, or the like.

The adsorption plate rotating means 460 may include a motor.

The first adsorption plate 430 and the second adsorption plate 440 are spaced apart from each other to dispose the substrate S therebetween. The first adsorption nozzles 431 of the first adsorption plate 430 and the second adsorption nozzles 441 of the second adsorption plate 440 may be disposed to face each other.

The operation of turning the substrate S will be described below. For convenience of description, the first adsorption plate 430 is positioned above the second adsorption plate 440.

First, as shown in fig. 32, when the substrate S is not positioned on the tape 410, the first suction plate 430 and the second suction plate 440 are positioned in the space between the tape 410. As shown in fig. 33, when the substrate S is transferred onto the tape 410, the substrate S is positioned between the first suction plate 430 and the second suction plate 440.

As shown in fig. 34, as the first suction plate 430 and the second suction plate 440 move upward, the substrate S contacts the second suction nozzles 441 of the second suction plate 440. Then, as the first suction plate 430 and the second suction plate 440 continue to be raised, the substrate S is raised in contact with the second suction nozzles 441 of the second suction plate 440. At this time, the substrate S is supported by the second suction nozzle 441 by gravity, and thus the posture of the substrate S can be maintained even if the suction force is not applied to the second suction nozzle 441.

When the suction force is applied to the first suction nozzle 431 or the second suction nozzle 441, a predetermined time is required to increase the suction force to a magnitude at which the substrate S can be properly sucked. In the present invention, the substrate S may be raised by supporting the substrate S on the first adsorption nozzle 431 or the second adsorption nozzle 441 by gravity while the adsorption force of the first adsorption nozzle 431 or the second adsorption nozzle 441 is increased for a predetermined time. This prevents the substrate S from being lifted and waiting while the suction force is increased to a strength at which the substrate S can be properly sucked. That is, the time required to raise the substrate S can be reduced.

When the second suction nozzle 441 of the second suction plate 440 sucks the substrate S while the substrate S is lifted, the second suction plate 430 and the second suction plate 440 are rotated by the suction plate rotating device 460, as shown in fig. 35.

As shown in fig. 36, the substrate S descends while being sucked by the second suction nozzle 441 of the second suction plate 440.

Further, as shown in fig. 37, when the second adsorption plate 430 is inserted into the space between the tapes 410, the substrate S is positioned above the tapes 410 and separated from the second adsorption nozzle 441. In this state, the first adsorption plate 430 is positioned below the second adsorption plate 440, so that a subsequent operation of inverting the substrate S can be immediately performed, thereby shortening the time required for the process.

In this state, as shown in fig. 38, the turned substrate S is transferred from the substrate-turning unit 400 to the third cutting unit 500 by the rotation of the belt 410. In another example, a pick-up unit (not shown) that can be lifted and moved horizontally is disposed between the substrate reversing unit 400 and the third cutting unit 500, and transfers the substrate S from the substrate reversing unit 400 to the third cutting unit 500.

As shown in fig. 38 and 39, the third cutting unit 500 forms a second Y-axis cutting line YL2 on the second surface S2 of the substrate S.

The third cutting unit 500 includes: a third frame 510 extending in the X-axis direction and movable in the Y-axis direction; a third head 520 provided to the third housing 510 to be movable in the X-axis direction and having a cutter wheel 521; a third guide rail 530 for guiding the movement of the third frame 510; a tape 540 for supporting the substrate S; a support plate 550 which is movably disposed below the tape 540 in the Z-axis direction, and supports the substrate S by supporting the tape 540 when the cutter wheel 521 presses the substrate S; and a support plate elevating device 560 for elevating and lowering the support plate 550 in the Z-axis direction.

The third frame 510 may include a plurality of third heads 520 in the X-axis direction.

An actuator operated by air pressure or oil pressure, a linear motion device operated by electromagnetic interaction, such as a linear motor or a ball screw device, is provided between the third housing 510 and the third guide rail 530. Accordingly, in a state where the cutting wheel 521 is pressed by the substrate S, the third housing 510 moves in the Y-axis direction along the third guide rail 530, and a second Y-axis cutting line YL2 is formed on the second surface S2 of the substrate S.

The belt 540 is supported by a plurality of pulleys 541, and at least one of the plurality of pulleys 541 may be a driving pulley that provides a driving force for rotating the belt 540. The tape 540 is preferably an integral type tape that is not separated into a plurality of parts, so as to uniformly support the entire surface of the substrate S and transfer the substrate.

When the belt 540 rotates and the moving substrate S moves, the supporting plate 550 is lowered by the supporting plate elevating device 560 to be spaced apart from the belt 540, so that the belt 540 smoothly moves without friction with the supporting plate 550. And, when the second Y-axis cutting line YL2 is formed on the substrate S, the support plate 550 is lifted by the support plate lifting and lowering device 560 to support the bottom surface of the tape 540, thereby supporting the substrate S. For example, the support plate 550 has a vacuum hole connected to a vacuum source, and the support plate 550 adsorbs the substrate S through a fine hole of a tape.

In the process of forming the second Y-axis cutting line YL2 on the second surface S2 of the substrate S, the third frame body 510 provided with the third head 520 having the cutting wheel 521 is moved, and the substrate S is supported by the support plate 550, so that the cutting wheel 521 can apply a greater pressure to the substrate S, thereby easily cutting the substrate S.

Also, the substrate S is supported by the support plate 550, so a roller for supporting the cutting wheel 521 is not required. Thereby, the size of the space corresponding to the removing roller can be reduced to the width of the third head 520, and thereby, the interval between the cutting wheels 521 of the plurality of third heads 520 when the plurality of third heads 520 are closely adjacent can be shortened. So that the interval between the second Y-axis cutting lines YL2 formed by the cutting wheel 520 may be shortened.

As the second Y-axis cutting line YL2 is formed on the second side S2 of the substrate S, the substrate S may be separated along the first Y-axis cutting line YL1 and the second Y-axis cutting line YL2.

Thus, after the substrate S is cut, an X-axis step portion XS having a width corresponding to a distance by which the first and second Y-axis cutting lines YL2 and YL2 are spaced apart from each other in the X-axis direction may be formed, and the X-axis step portion XS may be formed with a wiring and/or an electrode connected to the wiring, and the like.

The cut substrate S may be transferred from the third cutting unit 500 to the third transfer unit 800 by the rotation of the belt 540.

As shown in fig. 40 and 42, the third transfer unit 800 includes: a tape 810 for receiving the substrate S transferred from the third cutting unit 500; a pickup module 820 for holding and transferring the substrate S; a support frame 830 for movably supporting the pickup module 820 in the Y-axis direction; a moving module 840 that moves the pickup module 820 along the support frame 830; and a lifting module 850 for moving the pickup module 820 in the Z-axis direction.

The belt 810 is supported by a plurality of pulleys 811, and at least one of the plurality of pulleys 811 may be a driving pulley that provides a driving force for rotating the belt 810. The belt 810 of the third transfer unit 800 may be formed at the same height as the belt 540 of the third cutting unit 500 such that the substrate S is horizontally transferred from the third cutting unit 500 to the third transfer unit 800.

The moving module 840 and the lifting module 850 may be linear moving devices such as actuators operated by air pressure or oil pressure, linear motors operated by electromagnetic interaction, ball screw devices, and the like.

The pickup module 820 may include: a plurality of suction plates 821 connected to a vacuum source 860 through a vacuum line 861; plate height adjusting devices 822 connected to the plurality of suction plates 821 to lift and lower the suction plates 821, respectively; and pressure sensors 823 connected to the plurality of suction plates 821 to measure pressures in the suction plates 821.

The plate height adjusting device 822 may allow a user to manually adjust the heights of the plurality of suction plates 821. The plate height adjusting device 822 may be an actuator operated by air pressure or oil pressure, or a linear moving device such as a linear motor or a ball screw device operated by electromagnetic interaction, so that the heights of the plurality of suction plates 821 are automatically adjusted.

In another example, the plurality of plate height adjusting devices 822 are not connected to the plurality of suction plates 821, respectively, but two or more suction plates 821 are used as one group to designate the plurality of groups of suction plates 821, and the height of each group of suction plates 821 is adjusted.

At this time, the control unit 1000 may control the plate height adjusting means 822 according to the pressure change in the suction plate 821 measured by the pressure sensor 823, thereby lifting and lowering the plurality of suction plates 821.

When the substrate S is transferred to the belt 810 of the third transfer unit 800, the substrate S is adsorbed by the pickup module 820, and is transferred to a subsequent process by the vertical movement and the horizontal movement of the pickup module 820.

In this process, the substrate S needs to be uniformly adsorbed to the plurality of adsorption plates 821 of the pick-up module 820. However, the substrates S may not be uniformly adsorbed on the plurality of adsorption plates 821 of the pickup module 820 due to a change in the flatness of the substrates S caused by a change in the height of the belt 810 of the third transfer unit 800 and a change in the vertical position of the plurality of adsorption plates 821 of the pickup module 820. When the pickup module 820 moves vertically and horizontally in a state where the substrate S is not uniformly adsorbed on the plurality of adsorption plates 821, there is a possibility that the substrate S is separated from the plurality of adsorption plates 821.

Thus, in the third transfer unit 800 according to the embodiment of the present invention, the pickup module 820 is gradually moved toward the substrate S before the pickup module 820 completely adsorbs the substrate S, and the pressure in the plurality of adsorption plates 821 is measured by the pressure sensor 823.

As the pickup module 820 is gradually moved toward the substrate S, the substrate S is adsorbed by the adsorption plates 821, and when the flatness of the substrate S is uniform and the vertical positions of the plurality of adsorption plates 821 are uniform, the pressure inside the plurality of adsorption plates 821 is simultaneously changed when the substrate S is adsorbed by the plurality of adsorption plates 821.

However, if the flatness of the substrate S is not uniform or the vertical positions of the plurality of suction plates 821 are not uniform, only a part of the substrate S is sucked by a part of the plurality of suction plates 821 and the rest of the substrate S is not sucked by the suction plates 821. At this time, although the pressure of the suction plates 821 is partially changed, the pressure of the suction plates 821 which do not suck the substrate S is not changed.

It can be seen that there is a relative height difference between the suction plate 821 with a pressure change and the suction plate 821 with no pressure change with respect to the substrate S, and the relative height difference can be eliminated by adjusting the height of the suction plate 821 with a pressure change or the height of the suction plate 821 with no pressure change.

The control unit 1000 controls the plate height adjusting means 822 according to the pressures (pressure variations) of the plurality of suction plates 821 measured by the plurality of pressure sensors 823, thereby adjusting the height of the suction plate 821 with the pressure variation or the height of the suction plate 821 with no pressure variation.

Accordingly, a relative height difference between the plurality of suction plates 821 with respect to the substrate S can be eliminated, and the entire surface of the substrate S can be uniformly sucked by the plurality of suction plates 821.

According to the above-described structure, the entire surface of the substrate S can be uniformly sucked by the plurality of suction plates 821, and thus the substrate S can be stably transferred to the subsequent process by the pickup module 820.

As described above, in the substrate cutting apparatus according to the embodiment of the present invention, the plurality of cutting lines, i.e., the first and second X-axis cutting lines XL1 and XL2, the first and second Y-axis cutting lines YL1 and YL2, are sequentially formed by the first, second and third cutting units 200, 300 and 400, which are sequentially disposed, thereby cutting the substrate S. Accordingly, the number of processes is reduced compared to the related art in which the scribing process and the breaking process are separately performed in order to cut the substrate, so that the efficiency of cutting the substrate can be improved.

Although the preferred embodiments of the present invention have been described by way of example, the scope of the present invention is not limited to the specific embodiments, and may be modified as appropriate within the scope described in the claims.

The substrate cutting method in the embodiment of the invention comprises the following steps: in order to achieve the above object, the present invention provides a substrate cutting method, including: a substrate transfer step of transferring a substrate to a first plate and a second plate which are adjacently arranged; a cutting line forming step of forming cutting lines on the substrate by moving the cutting wheel module on the substrate; and a plate lowering step of lowering the second plate in a Z-axis direction with respect to the first plate when the substrate is transferred to the first plate and the second plate.

In the plate elevating step, it may further include: a substrate floating step of floating a substrate when the substrate is transferred to the first plate and the second plate; and a substrate adsorption step of adsorbing the substrate when the cutting wheel applies pressure to the substrate.

Claims (10)

1. A substrate cutting apparatus, comprising:

a cutter wheel module provided with a cutter wheel;

the cutting wheel module comprises a first plate and a second plate, wherein the first plate and the second plate are respectively arranged on two sides of the cutting wheel module; and

a board lowering module that lowers the second board in a Z-axis direction with respect to the first board when the substrate is transferred to the first board and the second board,

wherein the first plate is disposed to be inclined at a first predetermined angle in a transfer direction of the substrate, and the second plate is disposed to be inclined at a second predetermined angle in the transfer direction of the substrate, thereby preventing sliding friction between end portions of the two unit substrates to be separated.

2. The substrate cutting apparatus according to claim 1,

when the substrate is transferred to the first plate and the second plate, the first plate and the second plate inject gas to the substrate to float the substrate, and the substrate is adsorbed when the cutting wheel applies pressure to the substrate.

3. The substrate cutting apparatus according to claim 1 or 2, further comprising:

and a moving device connected to the second plate and moving the second plate away from the first plate along the Y-axis direction.

4. The substrate cutting apparatus according to claim 1 or 2, further comprising:

and the guide rail is extended along the Y-axis direction, and the moving device moves along the guide rail.

5. The substrate cutting apparatus according to claim 1 or 2, comprising:

an alignment unit which determines a position of a substrate entering from the outside;

a first cutting unit including the cutting wheel module, the first cutting unit forming a first X-axis cutting line and a second X-axis cutting line parallel to the X-axis direction on the first surface and the second surface of the substrate, respectively;

a second cutting unit for forming a first Y-axis cutting line parallel to the Y-axis direction on the first surface of the substrate;

a substrate turnover unit for turning over the substrate on which the first Y-axis cutting line is formed; and a (C) and (D) and,

and the third cutting unit is used for forming a second Y-axis cutting line parallel to the Y-axis direction on the second surface of the substrate.

6. The substrate cutting apparatus according to claim 5, wherein the alignment unit comprises:

a plurality of conveyor belts extending in the Y-axis direction and arranged at predetermined intervals in the X-axis direction;

a conveyor belt lifting device for lifting the plurality of conveyor belts;

a plurality of floating devices disposed between the plurality of conveyor belts for floating the substrate;

a plurality of pressurizing means for pressurizing a side of the substrate floated by the plurality of floating means.

7. The substrate cutting apparatus according to claim 5,

the first cutting unit includes:

a first frame extending in the X-axis direction; at least one pair of first heads provided to the first frame movably in the X-axis direction and provided to face each other in the Z-axis direction,

the at least one pair of first heads includes: a first cutting wheel and a second cutting wheel which are arranged at a distance in the Z-axis direction and are respectively provided with a cutting wheel; a first roller module and a second roller module which are provided with rollers and spaced apart from each other in a Z-axis direction,

the cutting wheel of the first cutting wheel module and the roller of the second roller module are arranged in alignment with each other, and the cutting wheel of the second cutting wheel module and the roller of the first roller module are arranged in alignment with each other.

8. The substrate cutting apparatus according to claim 7,

the cutting wheel of the first cutting wheel module and the cutting wheel of the second cutting wheel module are spaced in the Y-axis direction.

9. A method of cutting a substrate, comprising:

a substrate transfer step of transferring a substrate to a first plate and a second plate which are adjacently arranged;

a cutting line forming step of forming cutting lines on the substrate by moving the cutting wheel module on the substrate;

a step of lowering the second plate in a Z-axis direction with respect to the first plate when the substrate is transferred to the first plate and the second plate,

wherein the first plate is disposed to be inclined at a first predetermined angle in a transfer direction of the substrate, and the second plate is disposed to be inclined at a second predetermined angle in the transfer direction of the substrate, thereby preventing sliding friction between ends of the two unit substrates to be separated.

10. The substrate cutting method according to claim 9, further comprising:

a substrate floating step of floating a substrate when the substrate is transferred to the first plate and the second plate; and a (C) and (D) and,

and a substrate adsorption step of adsorbing the substrate when the cutting wheel applies pressure to the substrate.

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