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CN112103228B - Substrate transfer head - Google Patents

Substrate transfer head Download PDF

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Publication number
CN112103228B
CN112103228B CN201911182537.3A CN201911182537A CN112103228B CN 112103228 B CN112103228 B CN 112103228B CN 201911182537 A CN201911182537 A CN 201911182537A CN 112103228 B CN112103228 B CN 112103228B
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China
Prior art keywords
substrate
rim charge
gas
unit
unit substrate
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CN201911182537.3A
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Chinese (zh)
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CN112103228A (en
Inventor
朴鲁贤
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Top Engineering Co Ltd
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Top Engineering Co Ltd
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Publication of CN112103228A publication Critical patent/CN112103228A/en
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Publication of CN112103228B publication Critical patent/CN112103228B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The substrate transfer head of an embodiment of the present invention includes: an adsorption member configured to adsorb the unit substrates divided from the mother substrate; a first frit pressurizing section including: a plurality of push rods arranged to correspond to an area occupied by the rim charge located around the unit substrate; a push plate provided with a plurality of push rods; and a push plate driver for moving the push plate in such a manner that the plurality of push rods pressurize the rim charge; and a second rim charge pressing portion including: a gas jet nozzle configured to jet gas toward an edge portion of the unit substrate to pressurize the rim charge; and a gas supply source configured to supply gas to the gas injection nozzle, wherein either one of the first rim charge pressing portion and the second rim charge pressing portion may be configured to press the rim charge before or when the unit substrate is adsorbed by the adsorbing member, and the other one of the first rim charge pressing portion and the second rim charge pressing portion is configured to press the rim charge remaining at the edge portion of the unit substrate adsorbed by the adsorbing member.

Description

Substrate transfer head
Technical Field
The present invention relates to a substrate transfer head configured to transfer unit substrates divided from a mother substrate.
Background
In general, various kinds of panels, semiconductor substrates, and the like for displays are manufactured using unit substrates cut into a predetermined size from a mother substrate composed of a brittle material.
In order to cut a mother substrate into unit substrates, a scribing process is performed in which a scribing wheel made of a material such as diamond is pressed against the mother substrate, and then the scribing wheel is moved along a virtual dicing saw scribe line to cut the mother substrate, thereby forming a scribe line on the mother substrate. Further, a breaking process is performed, that is, the mother substrate is pressurized along the scribe lines, thereby dividing the mother substrate into unit substrates. Thereafter, a substrate transfer process is performed, i.e., taking and transferring the unit substrates divided from the mother substrate through a breaking process to a subsequent process.
When the mother substrate is divided into unit substrates, there are edges (dummy portions, stubbles) which are portions that are not actually used for removal of the product at least at one edge portion of the unit substrates. Such a margin should be separated from the unit substrate, but may remain in an attached state at an edge portion of the unit substrate for various reasons.
Disclosure of Invention
The invention aims to provide a substrate conveying head capable of reliably separating rim charge from the edge part of a unit substrate so as to prevent the rim charge from remaining on the edge part of the unit substrate.
The substrate transfer head of an embodiment of the present invention for achieving the above object includes: an adsorption member configured to adsorb the unit substrates divided from the mother substrate; a first frit pressurizing section including: a plurality of push rods arranged to correspond to an area occupied by the rim charge located around the unit substrate; a push plate provided with a plurality of push rods; and a push plate driver for moving the push plate in such a manner that the plurality of push rods press the rim charge; and a second rim charge pressing portion including: a gas jet nozzle configured to jet gas toward an edge portion of the unit substrate to pressurize the rim charge; and a gas supply source configured to supply gas to the gas injection nozzle, wherein either one of the first rim charge pressing portion and the second rim charge pressing portion may be configured to press the rim charge before or when the unit substrate is adsorbed by the adsorption member, and the other one of the first rim charge pressing portion and the second rim charge pressing portion may be configured to press the rim charge remaining at the edge portion of the unit substrate adsorbed by the adsorption member.
The substrate transfer head of the embodiment of the present invention may further include a rim charge sensing sensor disposed at one side of the adsorption member and detecting whether rim charges exist at an edge portion of the unit substrate adsorbed to the adsorption member.
The gas injection nozzle may be disposed to be inclined with respect to a vertical axis orthogonal to the surface of the unit substrate such that the gas is injected toward the trim in a direction in which the trim is spaced apart from the unit substrate.
The substrate transfer head of the embodiment of the present invention may further include a nozzle rotator that rotates the air injection nozzle centering on a horizontal axis orthogonal to a vertical axis orthogonal to the unit substrate to adjust an inclination angle of the air injection nozzle with respect to the vertical axis.
The substrate transfer head of the embodiment of the present invention may further include a gas temperature regulator that regulates a temperature of the gas supplied from the gas supply source to the gas injection nozzle.
The gas supply source may supply the gas to the gas injection nozzle while periodically changing the pressure of the gas.
The substrate transfer head according to the embodiment of the invention is provided with the rim charge pressurizing assembly for applying pressurizing force to rim charges around the unit substrate in a second direction opposite to the first direction when the unit substrate is adsorbed and moved in the first direction, thereby the rim charges can be separated from the edge portion of the unit substrate more easily and reliably, and the rim charges are prevented from remaining on the edge portion of the unit substrate. Therefore, the problem of the unit substrate being transferred to the subsequent process in a state where the margin remains at the edge portion of the unit substrate can be prevented. In addition, the problem that the rim charge remaining at the edge portion of the unit substrate falls down to an undesired place during the transfer of the unit substrate to the subsequent process can be prevented.
Drawings
Fig. 1 is a plan view schematically showing a substrate cutting apparatus provided with a substrate transfer head according to a first embodiment of the present invention.
Fig. 2 is a side view schematically showing a substrate cutting apparatus provided with a substrate transfer head of a first embodiment of the present invention.
Fig. 3 is a diagram schematically showing a substrate transfer head according to a first embodiment of the present invention.
Fig. 4 is a diagram schematically showing the bottom of a base member of a substrate transfer head according to a first embodiment of the present invention.
Fig. 5 is a diagram schematically showing the bottom of a push plate of a substrate transfer head according to a first embodiment of the present invention.
Fig. 6 is a diagram schematically showing a push plate and a push rod of a substrate transfer head according to a first embodiment of the present invention.
Fig. 7 to 10 are diagrams for explaining the operation of the substrate transfer head according to the first embodiment of the present invention.
Fig. 11 is a diagram schematically showing a substrate transfer head according to a second embodiment of the present invention.
Fig. 12 and 13 are diagrams for explaining the operation of the substrate transfer head according to the second embodiment of the present invention.
Fig. 14 is a diagram schematically showing a substrate transfer head according to a third embodiment of the present invention.
Fig. 15 is a diagram schematically showing a substrate transfer head according to a fourth embodiment of the present invention.
Fig. 16 is a diagram schematically showing a substrate transfer head according to a fifth embodiment of the present invention.
Fig. 17 is a diagram schematically showing a substrate transfer head according to a sixth embodiment of the present invention.
Fig. 18 is a diagram schematically showing a substrate transfer head according to a seventh embodiment of the present invention.
Fig. 19 is a diagram schematically showing the bottom of a base member of a substrate transfer head according to a seventh embodiment of the present invention.
Fig. 20 is a diagram schematically showing another example of the substrate transfer head according to the seventh embodiment of the present invention.
Fig. 21 is a diagram schematically showing the bottom of a base member of another example of a substrate transfer head according to a seventh embodiment of the present invention.
Description of the reference numerals
70. 170, 270, 370, 470, 570, 770: a rim charge pressurizing assembly; 71. 771: a push plate; 72. 772: a push rod; 175. 275, 375, 475, 575, 775: a jet nozzle; 176. 276, 376, 476, 576, 776: and a gas supply source.
Detailed Description
Hereinafter, a substrate transfer head according to an embodiment of the present invention will be described with reference to the drawings.
First, a substrate cutting apparatus including a substrate transfer head according to a first embodiment of the present invention will be described with reference to fig. 1 to 2.
Referring to fig. 1 and 2, a direction in which the mother substrate S to be subjected to the substrate cutting process is transferred is defined as a Y-axis direction, and a direction intersecting the direction in which the mother substrate S is transferred (Y-axis direction) is defined as an X-axis direction. Further, a direction perpendicular to the X-Y plane in which the mother substrate S is placed is defined as a Z-axis direction. The term scribe line means a groove and/or a crack formed on the surface of the mother substrate S so as to extend in a predetermined direction. The term "cutting plan line" means a virtual line on which a scribe line is to be formed.
As shown in fig. 1 and 2, the substrate cutting apparatus may include a scribing unit 30, a first stage 10, a second stage 20, a substrate transfer unit 40, and a substrate transfer unit 50.
The first stage 10 is disposed on the upstream side of the scribing unit 30 in the transfer direction of the mother substrate S. The first stage 10 serves to support the mother substrate S during movement of the mother substrate S toward the scribing unit 30. The first stage 10 can also support the mother substrate S during scribing of the mother substrate S. For example, the first table 10 may be constituted by a belt 11. The belt 11 may be supported by a plurality of pulleys 12. At least one of the plurality of pulleys 12 may be a driving pulley that provides a driving force for rotating the belt 11.
The second stage 20 is disposed on the downstream side of the scribing unit 30 in the transfer direction of the mother substrate S. The second stage 20 serves to accommodate and support the mother substrate S on which scribing lines are formed by the scribing unit 30. In addition, the second stage 20 can function to support the mother substrate S during the scribing process of the mother substrate S. For example, the second table 20 may be constituted by a belt 21. The belt 21 may be supported by a plurality of pulleys 22. At least one of the plurality of pulleys 22 may be a driving pulley that provides a driving force for rotating the belt 21.
The scribing unit 30 is configured to form scribing lines on the mother substrate S along the X-axis direction and/or the Y-axis direction. The scribing unit 30 includes a frame 31 extending in the X-axis direction and a scribing head 32 provided on the frame 31 so as to be movable in the X-axis direction. The scribing head 32 is provided with a scribing wheel 34. The scribing wheel 34 may be mounted to the scribing head 32 through a wheel frame 33.
The scribe head 32 may be configured to be movable in the X-axis direction with respect to the frame 31. For this purpose, the frame 31 may be provided with an X-axis moving mechanism such as a linear motor or a ball screw mechanism that operates under electromagnetic interaction using an actuator of pneumatic or hydraulic pressure. The X-axis moving mechanism can provide a driving force for moving the scribing head 32 in the X-axis direction.
The scribing head 32 is moved relative to the mother substrate S in the X-axis direction in a state where the scribing wheel 34 presses the surface of the mother substrate S, so that scribing can be formed on the surface of the mother substrate S in the X-axis direction. In addition, in a state where the scribing wheel 34 pressurizes the surface of the mother substrate S, the mother substrate S is moved in the Y-axis direction by the substrate transfer unit 40, so that scribing lines can be formed on the surface of the mother substrate S in the Y-axis direction.
In this way, when scribing lines are formed on the surface of the mother substrate S in the X-axis direction and/or the Y-axis direction by the scribing wheel 34, the mother substrate S can be divided from the unit substrate S1 along the scribing lines as the crack formed on the scribing lines advances into the mother substrate S, or the mother substrate S can be divided into the unit substrates S1 along the scribing lines by a small force.
As another example, although not shown, the present invention can be applied to a structure in which a breaking unit that applies a predetermined pressing force to the mother substrate S along scribe lines to divide the mother substrate S along the scribe lines is provided between the scribing unit 30 and the second table 20.
On the other hand, when the mother substrate S is divided into a plurality of unit substrates S1, there is a margin S2, which is a portion that is not actually used for the product removal, at least one edge portion of the unit substrates S1.
The scribing wheel 34 may be rotatably mounted to the wheel frame 33 about the Z axis. Therefore, the cutter of the scribing wheel 34 can be parallel to the X-axis direction or parallel to the Y-axis direction.
The scribe head 32 may be configured to be movable in the Z-axis direction with respect to the frame 31. For this purpose, the frame 31 may be provided with a Z-axis moving mechanism such as a linear motor or a ball screw mechanism that operates under electromagnetic interaction using an actuator of pneumatic or hydraulic pressure. The Z-axis moving mechanism can provide a driving force for moving the scribing head 32 in the Z-axis direction.
As the scribing head 32 moves in the Z axis direction with respect to the frame 31, the scribing wheel 34 can be pressed against the mother substrate S or spaced apart from the mother substrate S. Further, by adjusting the degree to which the scribing head 32 moves in the Z axis direction, the pressing force applied by the scribing wheel 34 to the mother substrate S can be adjusted. The scribe head 32 is moved in the Z-axis direction, whereby the cutting depth (penetration depth) of the scribe wheel 34 into the mother substrate S can be adjusted.
The substrate transfer unit 40 is configured to transfer the mother substrate S to the scribing unit 30 while sandwiching a rear end portion of the mother substrate S in the transfer direction, that is, a rear end of the mother substrate S. The substrate transfer unit 40 may include: a clamp assembly 41 configured to clamp a trailing end of the mother substrate S supported on the first stage 10; a support frame 42 connected to the jig assembly 41 and extending in the X-axis direction; and a guide rail 43 connected to the support frame 42 and extending in the Y-axis direction. A linear movement mechanism such as a linear motor or a ball screw mechanism that operates under electromagnetic interaction using an actuator that uses pneumatic or hydraulic pressure may be provided between the support frame 42 and the guide rail 43. Accordingly, in a state where the clamp assembly 41 clamps the trailing end of the mother substrate S, the mother substrate S can be transferred in the Y-axis direction as the support frame 42 is moved in the Y-axis direction by the linear movement mechanism. At this time, the first stage 10 can stably support the mother substrate S while moving in synchronization with the movement of the clamp assembly 41. The clamp assembly 41 is capable of pressurizing and holding the top and bottom surfaces of the mother substrate S in the trailing end of the mother substrate S. As another example, the jig assembly 41 may be configured to have a vacuum hole connected to a negative pressure source to adsorb the top surface or the bottom surface of the mother substrate S.
The substrate transfer unit 50 is configured to transfer the unit substrate S1 supported by the second stage 20 to a subsequent process.
The substrate transfer unit 50 includes a substrate transfer head 60, a support frame 52, a head moving assembly 53, and a head lifting assembly 54.
The support frame 52 is configured to support the substrate transfer head 60 so that the substrate transfer head 60 can move in the Y-axis direction.
The head moving assembly 53 is configured to move the substrate transfer head 60 in the Y-axis direction following the support frame 52. The head lift assembly 54 is configured to move the substrate transfer head 60 in the Z-axis direction. The head moving unit 53 and the head lifting unit 54 may be applied to a linear moving mechanism such as an actuator operated under pneumatic or hydraulic pressure, a linear motor operated under electromagnetic interaction, or a ball screw mechanism.
On the other hand, although not shown, the substrate transfer unit 50 may further include an actuator operated under pneumatic or hydraulic pressure, a linear movement mechanism such as a linear motor or a ball screw mechanism operated under electromagnetic interaction, to move the substrate transfer head 60 in the X-axis direction.
According to this configuration, the substrate transfer head 60 can move in the X-axis direction and/or the Y-axis direction to be positioned above the unit substrate S1 to be carried out, and the substrate transfer head 60 can move in the Z-axis direction to be attracted to the unit substrate S1.
As shown in fig. 3 to 6, the substrate transfer head 60 of the first embodiment of the present invention is configured to hold and transfer the unit substrate S1.
The substrate transfer head 60 includes a base member 61 and a lift member 62.
The base member 61 and the lifting member 62 are connected to each other. A predetermined space is provided between the base member 61 and the lifting member 62. The lifting member 62 is coupled to the head lift assembly 54. Thus, by the head lifting assembly 54, the base member 61 and the lifting member 62 can be moved together in the Z-axis direction.
The lower side of the base member 61 may have a shape corresponding to the shape of an area including the area occupied by one unit substrate S1 and the area occupied by the rim charge S2 around one unit substrate S1.
The base member 61 is provided with a plurality of adsorbing members 63. The plurality of adsorption members 63 may be arranged in an area corresponding to the area occupied by one unit substrate S1. The plurality of suction members 63 are connected to a negative pressure source 82. The plurality of suction members 63 may be configured to suck the unit substrates S1 by the negative pressure applied to the negative pressure source 82.
The substrate transfer head 60 may further include a rim charge pressing unit 70, and the rim charge pressing unit 70 may be configured to press the rim charge S2 mounted on the second table 20 (the belt 21).
The rim charge pressurization assembly 70 includes a push plate 71, a plurality of push rods 72, and a push plate driver 73.
The push plate driver 73 may be constructed of a linear motion mechanism such as a linear motor or a ball screw mechanism that operates under electromagnetic interaction using an actuator that is pneumatic or hydraulic. The push plate driver 73 is configured to move the push plate 71 in the Z-axis direction by being connected to the push plate 71.
The pushing plate 71 may have a shape corresponding to the shape of the region including one unit substrate S1 and the surrounding rim charge S2.
The plurality of push rods 72 are provided on the bottom surface (the surface facing the unit substrate S1 and the rim charge S2) of the push plate 71. A plurality of push rods 72 extend from the bottom surface of the push plate 71 in the Z-axis direction. The plurality of push rods 72 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of push rods 72 are arranged along the outline of the area occupied by the plurality of adsorbing members 63. That is, the plurality of push rods 72 are arranged along the outline of the area occupied by the unit substrate S1.
The base member 61 is formed with a plurality of through holes 612 corresponding to the plurality of push rods 72, respectively. The plurality of push rods 72 pass through the plurality of through holes 612, whereby respective lower ends of the plurality of push rods 72 can be exposed to the outside toward the mother substrate S.
Next, the operation of the substrate transfer head 60 according to the first embodiment of the present invention will be described with reference to fig. 7 to 10.
As shown in fig. 7, as the substrate transfer head 60 descends toward the unit substrate S1 by the head lifting assembly 54, the plurality of adsorption members 63 contact the surface of the unit substrate S1. At this time, the end portions of the plurality of push rods 72 may be maintained in a state of being spaced upward from the plane in which the end portions of the plurality of adsorbing members 63 are located. As other examples, the ends of the plurality of push rods 72 may be located in the same plane as the plane in which the ends of the plurality of adsorbing members 63 are located. In this case, as the substrate transfer head 60 descends toward the unit substrate S1, the ends of the plurality of suction members 63 can contact the surface of the edge material S2 while the ends of the plurality of push rods 72 contact the surface of the unit substrate S1.
As shown in fig. 8, as the push plate 71 is lowered by the push plate driver 73, the plurality of push rods 72 provided in the push plate 71 contact the rim charge S2 to press the rim charge S2 downward.
Then, by applying negative pressure to the plurality of suction members 63 by the negative pressure source 82, an upward suction force acts on the unit substrate S1.
Therefore, the unit substrate S1 is applied with an adsorption force in a first direction (upward), and the rim charge S2 is applied with a pressing force in a second direction (downward) opposite to the first direction (upward).
Further, as shown in fig. 9, the substrate transfer head 60 is raised by the head lift assembly 54. At this time, the push plate 71 descends, and thus the plurality of push rods 72 can be kept in a state of continuing to press the rim charge S2. That is, when the plurality of adsorbing members 63 are lifted in the first direction, the plurality of push rods 72 can be kept in a state of pressing the rim charge S2 in the second direction.
As a result, a force (suction force and a force based on the rising of the plurality of suction members 63) in the first direction acts on the unit substrate S1, and a pressing force in the second direction acts on the rim charge S2. In this way, forces in opposite directions act on the unit substrate S1 and the trim S2, and the trim S2 can be reliably separated from the edge portion of the unit substrate S1.
As shown in fig. 10, the substrate transfer head 60 is raised in a state where the trim S2 is separated from the edge portion of the unit substrate S1. Also, the substrate transfer head 60 can transfer to the subsequent process while moving horizontally. At this time, the pushing plate 71 can be lifted up so that the end portions of the plurality of pushing rods 72 are spaced upward from the plane in which the end portions of the plurality of adsorbing members 63 are located, whereby the plurality of pushing rods 72 can be prevented from interfering with other peripheral devices and members when the unit substrate S1 is conveyed.
The substrate transfer head 60 according to the first embodiment of the present invention includes the rim charge pressing assembly 70 that applies a pressing force to the rim charge S2 around the unit substrate S1 in a second direction opposite to the first direction when the unit substrate S1 is suctioned and moved in the first direction, whereby the rim charge S2 can be separated from the edge portion of the unit substrate S1 more easily and reliably, and the rim charge S2 is prevented from remaining on the edge portion of the unit substrate S1. Therefore, the unit substrate S1 can be prevented from being transferred to the subsequent process in a state where the margin S2 remains at the edge portion of the unit substrate S1. In addition, the problem that the margin S2 remaining at the edge portion of the unit substrate S1 falls down to an undesired place during the transfer of the unit substrate S1 to the subsequent process can be prevented.
Next, a substrate transfer head 160 according to a second embodiment of the present invention will be described with reference to fig. 11 to 13. The same constituent elements as those described in the foregoing first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 11, the substrate transfer head 160 of the second embodiment of the present invention may include a base member 161, a plurality of adsorption members 163, and a rim charge pressurization assembly 170.
The lower portion of the base member 161 may have a shape corresponding to the shape of the region including the region occupied by one unit substrate S1 and the region occupied by the rim charge S2 around one unit substrate S1.
The base member 161 is provided with a plurality of adsorbing members 163. The plurality of adsorption members 163 may be disposed in an area corresponding to the area occupied by one unit substrate S1. The plurality of suction members 163 are connected to a negative pressure source 182. The plurality of suction members 163 may be configured to suck the unit substrates S1 by the negative pressure applied to the negative pressure source 182.
The trim pressurization assembly 170 includes a plurality of jet nozzles 175 and a gas supply 176.
The gas supply source 176 is connected to the plurality of gas injection nozzles 175 and supplies gas to the plurality of gas injection nozzles 175.
On the other hand, the gas supply source 176 can supply gas to the gas injection nozzle 175 at a certain pressure. As another example, the gas supply source 176 can supply gas to the gas injection nozzles 175 while periodically varying the gas pressure. In this case, the gas injected from the gas injection nozzles 175 can vibrate the margin S2 while colliding with the margin S2 in the form of a predetermined vibration wave, and thus the margin S2 can be separated from the unit substrate S1 more reliably.
The plurality of air jet nozzles 175 are provided on the bottom surface (the surface facing the unit substrate S1 and the trim S2) of the base member 161. The plurality of air injection nozzles 175 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of air injection nozzles 175 are arranged along the outline of the area occupied by the plurality of adsorbing members 163. That is, the plurality of air injection nozzles 175 are arranged along the outline of the area occupied by the unit substrate S1.
Next, the operation of the substrate transfer head 160 according to the second embodiment of the present invention will be described with reference to fig. 12 and 13.
As shown in fig. 12, as the substrate transfer head 160 descends toward the unit substrate S1, the plurality of suction members 163 contact the surface of the unit substrate S1.
Then, by the negative pressure source 182, a negative pressure acts on the plurality of suction members 163, and thereby an upward suction force acts on the unit substrate S1. At this time, as the gas is supplied from the gas supply source 176 to the plurality of gas injection nozzles 175, the gas is injected from the plurality of gas injection nozzles 175 toward the rim charge S2.
Therefore, the unit substrate S1 is applied with an adsorption force in a first direction (upward), and the rim charge S2 is applied with a pressing force in a second direction (downward) opposite to the first direction (upward).
As shown in fig. 13, as the substrate transfer head 160 is raised, the plurality of adsorbing members 163 are raised. At this time, the gas is continuously injected from the plurality of injection nozzles 175 toward the rim charge S2.
As a result, a force (suction force and a force based on the rising of the plurality of suction members 163) in the first direction acts on the unit substrate S1, and a pressing force in the second direction acts on the rim charge S2. In this way, forces in opposite directions act on the unit substrate S1 and the trim S2, and the trim S2 can be reliably separated from the edge portion of the unit substrate S1.
The substrate transfer head 160 according to the second embodiment of the present invention includes the rim charge pressing unit 170 that applies a pressing force to the rim charge S2 around the unit substrate S1 in a second direction opposite to the first direction when the unit substrate S1 is suctioned and moved in the first direction, and thus the rim charge S2 can be separated from the edge portion of the unit substrate S1 more easily and reliably, and the rim charge S2 is prevented from remaining on the edge portion of the unit substrate S1. Therefore, the unit substrate S1 can be prevented from being transferred to the subsequent process in a state where the margin S2 remains at the edge portion of the unit substrate S1. In addition, the problem that the margin S2 remaining at the edge portion of the unit substrate S1 falls down to an undesired place during the transfer of the unit substrate S1 to the subsequent process can be prevented.
Next, a substrate transfer head 260 according to a third embodiment of the present invention will be described with reference to fig. 14. The same components as those described in the first and second embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 14, the substrate transfer head 260 of the third embodiment of the present invention may include a base member 261, a plurality of adsorption members 263, and a rim charge pressing assembly 270.
The lower side of the base member 261 may have a shape corresponding to the shape of the region including the region occupied by one unit substrate S1 and the region occupied by the rim charge S2 around one unit substrate S1.
The base member 261 is provided with a plurality of adsorbing members 263. The plurality of adsorption members 263 may be disposed in an area corresponding to the area occupied by one unit substrate S1. The plurality of suction members 263 are connected to a negative pressure source 282. The plurality of suction members 263 may be configured to suck the unit substrates S1 by the negative pressure applied to the negative pressure source 282.
The trim pressurization assembly 270 includes a plurality of jet nozzles 275 and a gas supply 276.
The gas supply source 276 is connected to the plurality of gas injection nozzles 275, and supplies gas to the plurality of gas injection nozzles 275.
The plurality of air jet nozzles 275 are provided on the bottom surface (the surface facing the unit substrate S1 and the trim S2) of the base member 261. The plurality of air injection nozzles 275 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of air injection nozzles 275 are arranged along the outline of the area occupied by the plurality of adsorption members 263. That is, the plurality of air injection nozzles 275 are arranged along the outline of the area occupied by the unit substrate S1.
The jet nozzles 275 may be disposed to be inclined with respect to a vertical axis orthogonal to the surface of the unit substrate S1. In particular, the jet nozzles 275 may be inclined with respect to the vertical axis such that the outlets of the jet nozzles 275 face the outside of the edge portion of the unit substrate S1. This makes it possible to jet the gas toward the trim S2 in the direction in which the trim S2 is spaced apart from the unit substrate S1. As a result, a resultant force of the pressing force in the second direction (downward) and the pressing force in the direction in which the edge material S2 is spaced apart from the unit substrate S1 can be applied to the edge material S2.
Therefore, when the plurality of adsorbing members 263 are lifted up in a state where the plurality of adsorbing members 263 adsorb the unit substrate S1, a force (adsorbing force and a force based on the lifting up of the plurality of adsorbing members 263) in the first direction acts on the unit substrate S1, and a pressing force in the second direction (downward) and a pressing force in a direction in which the rim charge S2 is spaced apart from the unit substrate S1 act on the rim charge S2. Therefore, the trim S2 can be separated from the edge portion of the unit substrate S1 more reliably.
Next, a substrate transfer head 360 according to a fourth embodiment of the present invention will be described with reference to fig. 15. The same constituent elements as those described in the foregoing first to third embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in fig. 15, the substrate transfer head 360 of the fourth embodiment of the present invention may include a base member 361, a plurality of suction members 363, and a rim charge pressing assembly 370.
The lower side of the base member 361 may have a shape corresponding to the shape of an area including the area occupied by one unit substrate S1 and the area occupied by the rim charge S2 around one unit substrate S1.
The base member 361 is provided with a plurality of adsorbing members 363. The plurality of adsorbing members 363 may be arranged in an area corresponding to the area occupied by one unit substrate S1. A plurality of absorbent members 363 are connected to a negative pressure source 382. The plurality of adsorbing members 363 may be configured to adsorb the unit substrates S1 by the negative pressure acting on the negative pressure source 382.
The rim charge pressurization assembly 370 includes a plurality of jet nozzles 375, a gas supply 376, and a nozzle rotator 377.
The gas supply source 376 is connected to the plurality of gas injection nozzles 375 and supplies gas to the plurality of gas injection nozzles 375.
The plurality of air jet nozzles 375 are provided on the bottom surface (the surface facing the unit substrate S1 and the trim S2) of the base member 361. The plurality of air jetting nozzles 375 are arranged in a region corresponding to the region occupied by the rim charge S2. The plurality of air injection nozzles 375 are arranged along the outline of the area occupied by the plurality of adsorbing members 363. That is, the plurality of air jetting nozzles 375 are arranged along the outline of the area occupied by the unit substrate S1.
The air jetting nozzles 375 may be disposed in such a manner that their inclination angles can be adjusted with respect to a vertical axis perpendicular to the surface of the unit substrate S1. By adjusting the inclination angle of the gas jetting nozzle 375, the jetting direction of the gas jetted from the gas jetting nozzle 375 can be adjusted. Therefore, the direction of the gas injected from the gas injection nozzles 375 can be adjusted according to the shape of the margin S2 remaining on the unit substrate S1, the direction in which the margin S2 should be separated from the unit substrate S1, and the like, and thus the margin S2 can be separated from the unit substrate S1 more easily and reliably.
A nozzle rotator 377 may be attached to the air jet nozzle 375 to enable automatic adjustment of the angle of inclination of the air jet nozzle 375 to a vertical axis. The nozzle rotator 377 can rotate the air jet nozzle 375 about a horizontal axis orthogonal to the vertical axis, adjusting the inclination angle of the air jet nozzle 375 to the vertical axis. Such a nozzle rotator 377 may be adapted to a linear movement mechanism connected to the upper end of the air injection nozzle 375 by a chain or the like, and such a linear movement mechanism may be a linear motor or a ball screw mechanism operated under electromagnetic interaction using an actuator of pneumatic or hydraulic pressure.
On the other hand, the nozzle rotator 377 may be configured to repeatedly reciprocate the gas injection nozzle 375 during the injection of the gas from the gas injection nozzle 375. Accordingly, the vibration can be applied to the edge material S2 while the jetting direction of the gas jetted from the jet nozzles 375 is repeatedly changed, and thereby the edge material S2 can be separated from the unit substrate S1 more reliably.
Next, a substrate transfer head 460 according to a fifth embodiment of the present invention will be described with reference to fig. 16. The same constituent elements as those described in the foregoing first to fourth embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in fig. 16, the substrate transfer head 460 of the fifth embodiment of the present invention may include a base member 461, a plurality of suction members 463, and a rim charge pressing assembly 470.
The lower side of the base member 461 may have a shape corresponding to the shape of the region including the region occupied by one unit substrate S1 and the region occupied by the rim charge S2 around one unit substrate S1.
The base member 461 is provided with a plurality of suction members 463. The plurality of suction members 463 may be arranged in an area corresponding to the area occupied by one unit substrate S1. The plurality of suction members 463 are connected to a negative pressure source 482. The plurality of suction members 463 may be configured to suck the unit substrates S1 by the negative pressure applied to the negative pressure source 482.
The trim pressurization assembly 470 includes a plurality of jet nozzles 475, a gas supply 476, and a gas temperature regulator 478.
The gas supply source 476 is connected to the plurality of gas injection nozzles 475, and supplies gas to the plurality of gas injection nozzles 475.
The plurality of air jet nozzles 475 are provided on the bottom surface of the base member 461 (the surface facing the unit substrate S1 and the trim S2). The plurality of air jet nozzles 475 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of air jetting nozzles 475 are arranged along the outline of the area occupied by the plurality of suction members 463. That is, the plurality of air jetting nozzles 475 are arranged along the outline of the area occupied by the unit substrate S1.
The gas temperature regulator 478 may be configured to regulate the temperature of the gas supplied from the gas supply 476. The gas temperature regulator 478 may be configured to heat the gas using a temperature higher than the ambient temperature of the substrate transfer head 460. Alternatively, the gas temperature regulator 478 may be configured to cool the gas using a temperature lower than the ambient temperature of the substrate transfer head 460. Therefore, the peripheral temperature may be higher or lower than that of the unit substrate S1. Therefore, as the gas injected from the gas injection nozzles 475 collides with the trim S2, the temperature of the trim S2 may become higher or lower than the temperature of the unit substrate S1. Therefore, there is a temperature difference between the trim S2 and the unit substrate S1, and by a difference in the degree of thermal expansion/thermal contraction based on such a temperature difference, the trim S2 can be separated from the edge portion of the unit substrate S1 more easily and reliably.
Next, a substrate transfer head 560 according to a sixth embodiment of the present invention will be described with reference to fig. 17. The same constituent elements as those described in the foregoing first to fifth embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in fig. 17, the substrate transfer head 560 of the sixth embodiment of the present invention may include a base member 561, a plurality of suction members 563, a rim charge pressing assembly 570, and a rim charge sensing sensor 90.
The lower side of the base member 561 may have a shape corresponding to the shape of the region including the region occupied by one unit substrate S1 and the region occupied by the rim charge S2 around one unit substrate S1.
The base member 561 is provided with a plurality of suction members 563. The plurality of adsorption members 563 may be arranged in an area corresponding to the area occupied by one unit substrate S1. The plurality of suction members 563 are connected to a negative pressure source 582. The plurality of suction members 563 may be configured to suck the unit substrates S1 by the negative pressure applied to the negative pressure source 582.
The rim charge pressurization assembly 570 includes a plurality of jet nozzles 575 and a gas supply 576.
The gas supply source 576 is connected to the plurality of gas injection nozzles 575 to supply gas to the plurality of gas injection nozzles 575.
The plurality of air jet nozzles 575 are provided on the bottom surface of the base member 561 (the surface facing the unit substrate S1 and the trim S2). The plurality of air jet nozzles 575 are arranged in a region corresponding to the region occupied by the rim charge S2. The plurality of air jet nozzles 575 are arranged along the outline of the area occupied by the plurality of adsorbing members 563. That is, the plurality of jet nozzles 575 are arranged along the outline of the region occupied by the unit substrate S1.
The rim charge sensing sensor 90 may be configured to detect whether the rim charge S2 exists at the edge portion of the unit substrate S1. The rim charge sensing sensor 90 may be disposed in plurality along the outline of the area occupied by the plurality of adsorption members 563. That is, the plurality of rim charge sensing sensors 90 may be arranged along the outline of the area occupied by the unit substrate S1.
For example, the rim charge sensing sensor 90 may be constituted by an optical sensor (distance sensor) including a light emitting portion and a light receiving portion, and configured to detect whether or not the rim charge S2 is present at the edge portion of the unit substrate S1 by detecting whether or not the light emitted from the light emitting portion reaches the light receiving portion after being reflected by the rim charge S2.
When the plurality of suction members 563 are raised by a predetermined height in a state of suctioning the unit substrate S1, the rim charge sensing sensor 90 can detect whether or not the rim charge S2 is present at the edge portion of the unit substrate S1.
The gas supply source 576 and the trim sensing sensor 90 may be controlled by a control unit, not shown. When the trim S2 is sensed by the trim sensing sensor 90, the control unit controls the gas supply source 576 so that the gas is injected from the gas injection nozzle 575 or the pressure of the gas injected from the gas injection nozzle 575 is increased. Therefore, the trim S2 can be separated from the edge portion of the unit substrate S1 more reliably.
Next, a substrate transfer head 760 according to a seventh embodiment of the present invention will be described with reference to fig. 18 to 21. The same constituent elements as those described in the first to sixth embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in fig. 18 and 19, the substrate transfer head 760 of the seventh embodiment of the present invention may include a base member 761, a lifting member 762, and a rim charge pressing assembly 770.
The base member 761 and the lifting member 762 may be configured in the same manner as the base member 61 and the lifting member 62, respectively, of the first embodiment of the present invention.
The base member 761 is provided with a plurality of adsorbing members 763. The plurality of adsorption members 763 may be arranged in an area corresponding to the area occupied by one unit substrate S1. The plurality of adsorption members 763 are connected to a negative pressure source 782. The plurality of adsorbing members 763 may be configured to adsorb the unit substrates S1 by the negative pressure acting on the negative pressure source 782.
The rim charge pressing assembly 570 may include: a first scrap pressurizing section including a push plate 771, a plurality of push rods 772, and a push plate driver 773; and a second rim charge pressing portion having a plurality of jet nozzles 775 and a gas supply source 776.
The push plate 771, the plurality of push rods 772, and the push plate driver 773 may be configured identically to the push plate 71, the plurality of push rods 72, and the push plate driver 73, respectively, of the first embodiment of the present invention. The plurality of jet nozzles 775 and the gas supply source 776 may be configured in the same manner as the plurality of jet nozzles 175 and the gas supply source 176 in the second embodiment of the present invention, respectively.
Such a structure is not limited thereto, and the substrate transfer head 760 of the seventh embodiment of the present invention may further include at least any one of the nozzle rotator 377 of the fourth embodiment of the present invention, the gas temperature regulator 478 of the fifth embodiment of the present invention, and the rim charge sensing sensor 90 of the sixth embodiment of the present invention.
For example, when the substrate transfer head 760 of the seventh embodiment of the present invention is provided with the rim charge sensing sensor 90, the control unit controls the gas supply source 776 such that the gas is ejected from the jet nozzle 775, or the pressure of the gas ejected from the jet nozzle 775 is increased, or the push plate 771 is driven such that the plurality of push rods 772 pressurize the rim charge S2 when the rim charge S2 is sensed by the rim charge sensing sensor 90.
On the other hand, as an example, as shown in fig. 18 and 19, a plurality of jet nozzles 775 may be arranged outside the plurality of push rods 772. As another example, as shown in fig. 20 and 21, a plurality of jet nozzles 775 may be disposed inside a plurality of push rods 772. For still other examples, although not illustrated, a portion of the plurality of jet nozzles 775 may be disposed outside of a portion of the plurality of push rods 772 and another portion of the plurality of jet nozzles 775 may be disposed inside of another portion of the plurality of push rods 772.
According to the substrate transfer head 760 of the seventh embodiment of the present invention, any one of the first and second rim charge pressing parts may be configured to press the rim charge S2 before the adsorption member 763 adsorbs the unit substrate S1 or when the adsorption member 763 adsorbs the unit substrate S1. That is, it may be configured as follows: when the suction member 763 sucks the unit substrate S1 mounted on the second table 20, or immediately before the suction member 763 sucks the unit substrate S1 mounted on the second table 20, either one of the first and second trim pressing portions presses the trim S2 mounted on the second table 20.
The other of the first edge pressing portion and the second edge pressing portion may be configured to press the edge S2 remaining on the edge portion of the unit substrate S1 adsorbed to the adsorption member 763. That is, it may be configured as follows: when the unit substrate S1 is transferred (vertically and horizontally moved) while being adsorbed to the adsorbing member 763, the other one of the first and second edge pressing portions presses the edge material S2 remaining on the edge portion of the unit substrate S1. At this time, when the edge sensor 90 senses that the edge material S2 exists at the edge portion of the unit substrate S1, the other of the first edge material pressing portion and the second edge material pressing portion can press the edge material S2 remaining at the edge portion of the unit substrate S1.
In this way, the ejector 772 and the jet nozzle 775 can be used together to press the trim S2, so that the trim S2 can be separated from the edge portion of the unit substrate S1 more reliably.
The substrate transfer heads 60, 160, 260, 360, 460, 560, 760 according to the embodiments of the present invention include the rim charge pressurizing assemblies 70, 170, 270, 370, 470, 570, 770 that apply pressurizing force to the rim charge S2 around the unit substrate S1 in a second direction opposite to the first direction when the unit substrate S1 is moved by being adsorbed in the first direction, thereby enabling the rim charge S2 to be separated from the edge portion of the unit substrate S1 more easily and reliably, and preventing the rim charge S2 from remaining on the edge portion of the unit substrate S1. Therefore, the unit substrate S1 can be prevented from being transferred to the subsequent process in a state where the margin S2 remains at the edge portion of the unit substrate S1. In addition, the problem that the margin S2 remaining at the edge portion of the unit substrate S1 falls down to an undesired place during the transfer of the unit substrate S1 to the subsequent process can be prevented.
While the preferred embodiments of the present invention have been described by way of example, the scope of the present invention is not limited to the specific embodiments, and may be appropriately modified within the scope of the claims.

Claims (6)

1. A substrate transfer head, comprising:
an adsorption member configured to adsorb the unit substrate;
a first frit pressurizing section including: a plurality of push rods arranged to correspond to an area occupied by rim charge located around the unit substrate; a push plate provided with the plurality of push rods; and a push plate driver for moving the push plate in such a manner that the plurality of push rods pressurize the rim charge; and
second rim charge pressurization portion includes: a gas jet nozzle configured to jet gas toward an edge portion of the unit substrate to pressurize the rim charge; and a gas supply source configured to supply gas to the gas injection nozzle,
either one of the first and second trim pressing portions is configured to press the trim before the unit substrate is adsorbed by the adsorbing member or while the unit substrate is adsorbed by the adsorbing member,
the other of the first edge pressing portion and the second edge pressing portion is configured to press the edge remaining on the edge portion of the unit substrate adsorbed to the adsorption member.
2. The substrate transfer head of claim 1, wherein,
the substrate transfer head further includes a rim charge sensing sensor disposed at one side of the adsorption member and detecting whether the rim charge exists at an edge portion of the unit substrate adsorbed to the adsorption member.
3. The substrate transfer head of claim 1, wherein,
the gas injection nozzle is disposed to be inclined with respect to a vertical axis orthogonal to a surface of the unit substrate such that gas is injected toward the trim in a direction in which the trim is spaced apart from the unit substrate.
4. The substrate transfer head of claim 1, wherein,
the substrate transfer head further includes a nozzle rotator that rotates the jet nozzle centering on a horizontal axis orthogonal to a vertical axis orthogonal to the unit substrate to adjust an inclination angle of the jet nozzle to the vertical axis.
5. The substrate transfer head of claim 1, wherein,
the substrate transfer head further includes a gas temperature regulator that regulates a temperature of the gas supplied from the gas supply source to the gas injection nozzle.
6. The substrate transfer head of claim 1, wherein,
the gas supply source supplies gas to the gas injection nozzle while periodically changing the pressure of the gas.
CN201911182537.3A 2019-06-17 2019-11-27 Substrate transfer head Active CN112103228B (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101734849A (en) * 2008-11-05 2010-06-16 细美事有限公司 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same
KR20110059121A (en) * 2009-11-27 2011-06-02 세메스 주식회사 Substrate transfer unit and substrate transfer method using the same
KR20170115636A (en) * 2016-04-07 2017-10-18 주식회사 탑 엔지니어링 Scribing apparatus
CN107993971A (en) * 2016-10-26 2018-05-04 三星电子株式会社 Base plate processing device and the method using base plate processing device
KR20180069676A (en) * 2016-12-14 2018-06-25 주식회사 탑 엔지니어링 Substrate cutting apparatus
CN109574484A (en) * 2017-09-29 2019-04-05 塔工程有限公司 Cutter for substrate
CN109824261A (en) * 2017-11-23 2019-05-31 塔工程有限公司 Cutter for substrate and method for dividing substrate
CN109824259A (en) * 2017-11-23 2019-05-31 塔工程有限公司 Cutter for substrate and method for dividing substrate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101734849A (en) * 2008-11-05 2010-06-16 细美事有限公司 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same
KR20110059121A (en) * 2009-11-27 2011-06-02 세메스 주식회사 Substrate transfer unit and substrate transfer method using the same
KR20170115636A (en) * 2016-04-07 2017-10-18 주식회사 탑 엔지니어링 Scribing apparatus
CN107993971A (en) * 2016-10-26 2018-05-04 三星电子株式会社 Base plate processing device and the method using base plate processing device
KR20180069676A (en) * 2016-12-14 2018-06-25 주식회사 탑 엔지니어링 Substrate cutting apparatus
CN109574484A (en) * 2017-09-29 2019-04-05 塔工程有限公司 Cutter for substrate
CN109824261A (en) * 2017-11-23 2019-05-31 塔工程有限公司 Cutter for substrate and method for dividing substrate
CN109824259A (en) * 2017-11-23 2019-05-31 塔工程有限公司 Cutter for substrate and method for dividing substrate

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