CN109638005A - A kind of high aobvious finger high photosynthetic efficiency packaging body - Google Patents
A kind of high aobvious finger high photosynthetic efficiency packaging body Download PDFInfo
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- CN109638005A CN109638005A CN201811495570.7A CN201811495570A CN109638005A CN 109638005 A CN109638005 A CN 109638005A CN 201811495570 A CN201811495570 A CN 201811495570A CN 109638005 A CN109638005 A CN 109638005A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 113
- 230000000243 photosynthetic effect Effects 0.000 title claims abstract description 53
- 239000000843 powder Substances 0.000 claims abstract description 228
- 239000000084 colloidal system Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims description 34
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 15
- 235000000177 Indigofera tinctoria Nutrition 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 229940097275 indigo Drugs 0.000 claims description 12
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 12
- 230000005496 eutectics Effects 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims 1
- 239000010426 asphalt Substances 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 230000005284 excitation Effects 0.000 abstract description 37
- 238000001228 spectrum Methods 0.000 description 17
- 238000009877 rendering Methods 0.000 description 11
- 241001062009 Indigofera Species 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000000695 excitation spectrum Methods 0.000 description 5
- 230000009102 absorption Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000002284 excitation--emission spectrum Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/14—Measures for saving energy, e.g. in green houses
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Cultivation Of Plants (AREA)
- Luminescent Compositions (AREA)
Abstract
The present invention relates to a kind of high aobvious finger high photosynthetic efficiency packaging body, including a supporting element, short wavelength's LED chip and long wavelength's LED chip are provided on the supporting element；The top surface of long wavelength's LED chip and side are provided with long wavelength's fluorescent powder colloid layer, form packaging body A；The top surface and side of short wavelength's LED chip and packaging body A are provided with short wavelength's fluorescent powder colloid layer, form overall package body.The present invention has the advantages that the high aobvious finger high photosynthetic efficiency packaging body of the present invention, the excitation wavelength of different fluorescent powders can be taken into account using the chip excitation of multiple and different wavelength.
Description
Technical field
The invention belongs to semi-conductor photoelectronic and optical field, in particular to a kind of high aobvious finger high photosynthetic efficiency packaging body.
Background technique
Generally there are several types of forms for current white light LEDs, as shown in Fig. 1 curve (1), excite single yellow using blue light
Fluorescent powder.In this case general light efficiency is higher, but shows that index only has 70 or so, and be unsuitable for low color temperature and answer
With.Low color temperature is in application, will generally be added red fluorescence powder in needing to do.If necessary to which colour rendering index is further increased to
When 80 or more, then need to be added red and green emitting phosphor simultaneously.As shown in Fig. 1 curve (2), at the same it is glimmering using red and green
Its colour rendering index of light powder can achieve 80.But from Fig. 1 curve (2) as can be seen that in full spectrum of use, spectrum is in 460-
Blue and cyan portion between 510nm still have missing, therefore usually need in full spectrum of use that peak wavelength is added and exist
Hanced cyan fluorescent powder between 490-505nm.
But above scheme has following Railway Project
First, as can be seen that its optimal excitation wave of different fluorescent powders from the spectrum of six kinds of fluorescent powders in Fig. 2-Fig. 7
It is long different, it cannot be considered in terms of the maximum excitation wavelength of every kind of fluorescent powder using the light excitation mixed fluorescent powder of single wavelength, thus
For certain fluorescent powder, its launching efficiency is lower.So mixed fluorescent powder is used, and although improving colour rendering index, its energy damage
Lose larger, luminous efficiency is lower.Such as hanced cyan fluorescent powder, relatively due to its emission wavelength and excitation wavelength, excitation
Efficiency is very low, should use shorter wavelengths of blue light or purple light excited.But it is glimmering using shorter wavelengths of blue light or purple light excited mixing
Light powder although the launching efficiency of hanced cyan fluorescent powder can be improved, but increases short wavelength photons in excitation yellow and red
Photon energy consumption when fluorescent powder.
Second, the problem of there is also double absorptions for mixed fluorescent powder.655 from Fig. 6 and Fig. 7,660nm fluorescence
As can be seen that its light for being issued to the fluorescent powder of 495nm in the excitation spectrum of powder, however it remains up to 40% opposite suction
It receives, this can not only reduce the ingredient of cyan light, also will cause the secondary loss of energy.Assuming that hanced cyan fluorescent powder and red fluorescence powder
Quantum efficiency be 90%, then hanced cyan fluorescent powder is excited by blue light, and then the quantum efficiency of excitated red fluorescent powder is
81%, low compared to the quantum efficiency of blue directly excitated red fluorescent powder 10% or so.Therefore double absorption is for colour developing
Property and luminous efficiency all have significant effect.
Thirdly, for using blue light excitated fluorescent powder, a blue photons can only at most excite an other face
The photon of color, the energy difference between two photons are known as Stocks displacement.It can be seen from figures 6 and 7 that when using single shortwave
When long blue light excites mixed fluorescent powder simultaneously, feux rouges therein and blue light energy difference are very big, and photon energy loss is more, extra
Energy is absorbed by lattice vibration, not only causes the waste of photon energy, but also also creates thermal energy, is proposed to the heat dissipation of device
Very high requirement.
4th point, as can be seen from Figure 8, same fluorescent powder is excited using the blue light of different wave length, shine wave
Length is not also identical.Emission wavelength can generate relative movement with the movement of excitation wavelength.People increasingly pay close attention to health at present
Illumination, that is, wish that luminescent spectrum is wider, colour rendering index is higher.Compared to multi-wavelength excitation, the luminous light of single wavelength exciting light
Compose relatively narrow, colour rendering index is lower, is not able to satisfy the demand of wide spectrum high color rendering index (CRI).
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of with more high color rendering index (CRI) and guarantees that the height of luminous efficiency is aobvious
Refer to high photosynthetic efficiency packaging body.
In order to solve the above technical problems, the technical solution of the present invention is as follows: a kind of high aobvious finger high photosynthetic efficiency packaging body, innovative point
It is: including a supporting element, short wavelength's LED chip and long wavelength's LED chip is provided on the supporting element；In the long wavelength
The top surface and side of LED chip are provided with long wavelength's fluorescent powder colloid layer, form packaging body A；In short wavelength's LED chip and
The top surface and side of packaging body A is provided with short wavelength's fluorescent powder colloid layer, forms overall package body.
Further, short wavelength's LED chip selects LED chip of the wavelength in 390~445nm, long wavelength's LED chip
Select wavelength in the LED chip of 445~550nm, and long wavelength's LED chip and the wavelength of short wavelength's LED chip between the two it
Poor Δ λ=5~160nm.
Further, the fluorescent powder in long wavelength's fluorescent powder colloid layer is in red fluorescence powder or yellow fluorescent powder
A kind of or both mixture；Fluorescent powder in short wavelength's fluorescent powder colloid layer be green emitting phosphor, indigo color fluorescent powder,
The one or more of hanced cyan fluorescent powder, yellow fluorescent powder and blue colour fluorescent powder.
Further, the supporting element be the substrate with circuit, the bracket with circuit or without circuit viscosity it is thin
One of film.
Further, when the supporting element is the substrate with circuit, chip is set up directly on its circuit structure；It is described
When supporting element is the bracket with circuit, chip is welded by die bond or eutectic weldering is connected on its circuit；The substrate be without
When the adhesive membrane of circuit, after chip posts, then it is packaged the CSP packaging body that cutting forms multi-chip.
A kind of high aobvious finger high photosynthetic efficiency packaging body, innovative point are: including a supporting element, being provided on the supporting element short
Wavelength LED chip and long wavelength's LED chip；The top surface of long wavelength's LED chip and side are provided with long wavelength's fluorescent powder
Colloid layer forms packaging body A；The top surface of short wavelength's LED chip and side are provided with short wavelength's fluorescent powder colloid layer, shape
At packaging body B；The top surface of the packaging body A and packaging body B and side are provided with medium wavelength fluorescent powder colloid layer, formed whole
Packaging body.
Further, short wavelength's LED chip selects LED chip of the wavelength in 390~445nm, long wavelength's LED chip
Select wavelength in the LED chip of 445~550nm, and long wavelength's LED chip and the wavelength of short wavelength's LED chip between the two it
Poor Δ λ=5~160nm.
Further, the fluorescent powder in long wavelength's fluorescent powder colloid layer is red fluorescence powder；The medium wavelength fluorescence
Fluorescent powder in powder colloid layer is the mixture of one or both of yellow fluorescent powder or green emitting phosphor, and the short wavelength is glimmering
Fluorescent powder in light powder colloid layer be one of green emitting phosphor, hanced cyan fluorescent powder, blue colour fluorescent powder or indigo color fluorescent powder or
It is a variety of.
Further, the supporting element be the substrate with circuit, the bracket with circuit or without circuit viscosity it is thin
One of film.
Further, when the supporting element is the substrate with circuit, chip is set up directly on its circuit structure；It is described
When supporting element is the bracket with circuit, chip is welded by die bond or eutectic weldering is connected on its circuit；The substrate be without
When the adhesive membrane of circuit, after chip posts, then it is packaged the CSP packaging body that cutting forms multi-chip.
A kind of high aobvious finger high photosynthetic efficiency packaging body, innovative point are: including a supporting element, being provided on the supporting element short
Wavelength LED chip, medium wavelength LED chip and long wavelength's LED chip are arranged in the top surface of long wavelength's LED chip and side
There is long wavelength's fluorescent powder colloid layer, forms packaging body A；The top surface of the medium wavelength LED chip and side are provided with medium wavelength
Fluorescent powder colloid layer forms packaging body B；The top surface of short wavelength's LED chip and side are provided with short wavelength's phosphor gel
Body layer forms packaging body C；The top surface of the packaging body A, packaging body B and packaging body C and side are provided with colloid layer, formed
Overall package body, or it is not provided with colloid layer directly and is the overall package body of airspace.
Further, short wavelength's LED chip selects LED chip of the wavelength in 390~445nm, medium wavelength LED chip
Select wavelength in the LED chip of 420~465nm, long wavelength's LED chip selects wavelength in the LED chip of 445~550nm, and grows
Difference 5nm≤Δ λ≤130nm of the wavelength of wavelength LED chip and medium wavelength LED chip between the two, medium wavelength LED chip with it is short
Difference 5nm≤Δ λ≤130nm of the wavelength of wavelength LED chip between the two.
Further, the fluorescent powder in long wavelength's fluorescent powder colloid layer is red fluorescence powder, the medium wavelength fluorescence
Fluorescent powder in powder colloid layer is the mixture of one or both of yellow fluorescent powder or green emitting phosphor, and the short wavelength is glimmering
Fluorescent powder in light powder colloid layer be one of green emitting phosphor, hanced cyan fluorescent powder, blue colour fluorescent powder or indigo color fluorescent powder or
It is a variety of.
Further, the colloid layer selects one or more of epoxy resin, silica gel or polyimides.
Further, the supporting element be the substrate with circuit, the bracket with circuit or without circuit viscosity it is thin
One of film.
Further, when the supporting element is the substrate with circuit, chip is set up directly on its circuit structure；It is described
When supporting element is the bracket with circuit, chip is welded by die bond or eutectic weldering is connected on its circuit；The substrate be without
When the adhesive membrane of circuit, after chip posts, then it is packaged the CSP packaging body that cutting forms multi-chip.
A kind of high aobvious finger high photosynthetic efficiency packaging body, innovative point are: including a supporting element, being provided on the supporting element short
Wavelength LED chip, medium wavelength LED chip and long wavelength's LED chip；It is arranged in the top surface of long wavelength's LED chip and side
There is long wavelength's fluorescent powder colloid layer, forms packaging body A；The top surface of short wavelength's LED chip and side are provided with short wavelength
Fluorescent powder colloid layer forms packaging body B；It is arranged in the top surface of the packaging body A, packaging body B and medium wavelength LED chip and side
There is medium wavelength fluorescent powder colloid layer, forms overall package body.
Further, short wavelength's LED chip selects LED chip of the wavelength in 390~445nm, medium wavelength LED chip
Select wavelength in the LED chip of 420~465nm, long wavelength's LED chip selects wavelength in the LED chip of 445~550nm, and grows
Difference 5nm≤Δ λ≤130nm of the wavelength of wavelength LED chip and medium wavelength LED chip between the two, medium wavelength LED chip with it is short
Difference 5nm≤Δ λ≤130nm of the wavelength of wavelength LED chip between the two.
Further, the fluorescent powder in long wavelength's fluorescent powder colloid layer is red fluorescence powder, the medium wavelength fluorescence
Fluorescent powder in powder colloid layer is the mixture of one or both of yellow fluorescent powder or green emitting phosphor, and the short wavelength is glimmering
Fluorescent powder in light powder colloid layer is the mixture of one or both of blue colour fluorescent powder or indigo color fluorescent powder.
Further, the supporting element be the substrate with circuit, the bracket with circuit or without circuit viscosity it is thin
One of film.
Further, when the supporting element is the substrate with circuit, chip is set up directly on its circuit structure；It is described
When supporting element is the bracket with circuit, chip is welded by die bond or eutectic weldering is connected on its circuit；The substrate be without
When the adhesive membrane of circuit, after chip posts, then it is packaged the CSP packaging body that cutting forms multi-chip.
The present invention has the advantages that
(1) the high aobvious finger high photosynthetic efficiency packaging body of the present invention can take into account difference using the chip excitation of multiple and different wavelength
The excitation wavelength of fluorescent powder, it can realize that short wavelength's chip excites short wavelength's fluorescent powder, long wavelength's chip excites long wavelength glimmering
Light powder, at the same can to avoid the short wavelength's fluorescence generated due to short wavelength's fluorescent powder excites long wavelength's fluorescent powder again and by again
It absorbs；Optimal excitation wavelength realizes highest quantum efficiency.
(2) the high aobvious finger high photosynthetic efficiency packaging body of the present invention, it is therein red using the encapsulating structure of the chip of multiple and different wavelength
Color fluorescent powder is encapsulated in the region of a very little using CSP, and only few short wavelength and medium wavelength fluorescence can be irradiated to red
On color fluorescent powder, it is possible to prevente effectively from red fluorescence powder is to green, blue, green fluorescence double absorption problem.Especially hanced cyan fluorescent
Launching efficiency is low (Fig. 2), can effectively reduce the secondary loss of hanced cyan fluorescent, to while improving light efficiency and promote colour developing and refer to
Number.
(3) present invention is high aobvious refers to high photosynthetic efficiency packaging body, according to Stokes shift phenomenon, for same fluorescent powder, when
When the wavelength of exciting light is mobile, emission wavelength can also make a relative move to corresponding wavelength direction；Therefore the present invention uses
The available longer wavelengths of red fluorescence of long wavelength's chip excitated red fluorescent powder, it is green, blue using the excitation of short wavelength's chip,
The shorter blueness of the available wavelength of green emitting phosphor, indigo plant, green fluorescence, so that fluorescence band spectrum broadens, to further increase colour developing
Index.
Detailed description of the invention
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is the luminescent spectrum figure of traditional white light LEDs.
Fig. 2 is the excitation of 495 fluorescent powders and launching light spectrogram.
Fig. 3 is the excitation of 518 fluorescent powders and launching light spectrogram.
Fig. 4 is the excitation of 530 fluorescent powders and launching light spectrogram.
Fig. 5 is the excitation of 535 fluorescent powders and launching light spectrogram.
Fig. 6 is the excitation of 655 fluorescent powders and launching light spectrogram.
Fig. 7 is the excitation of 660 fluorescent powders and launching light spectrogram.
Fig. 8 is the excitation spectrum and launching light spectrogram using different excitation wavelength excitated red fluorescent powders.
Fig. 9 is a kind of high aobvious structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 1.
Figure 10 is the high aobvious another structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 1.
Figure 11 is a kind of high aobvious structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 2.
Figure 12 is the high aobvious another structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 2.
Figure 13 is the high aobvious top view for referring to high photosynthetic efficiency packaging body of embodiment 2.
Figure 14 is a kind of high aobvious structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 3.
Figure 15 is the high aobvious another structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 3.
Figure 16 is the high aobvious top view for referring to high photosynthetic efficiency packaging body of embodiment 3.
Figure 17 is a kind of high aobvious structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 4.
Figure 18 is the high aobvious another structural schematic diagram for referring to high photosynthetic efficiency packaging body of embodiment 4.
Specific embodiment
The following examples can make professional and technical personnel that the present invention be more fully understood, but therefore not send out this
It is bright to be limited among the embodiment described range.
Embodiment 1
The present embodiment height is aobvious to refer to high photosynthetic efficiency packaging body, as shown in figure 9, including a bracket 1 for having circuit, goes back on bracket 1
It is provided with short wavelength's LED chip 2 and long wavelength's LED chip 3, and short wavelength's LED chip 2 and long wavelength's LED chip 3 pass through die bond
Weldering or eutectic weldering are connected on its circuit；The top surface of long wavelength's LED chip 3 and side are provided with long wavelength's fluorescent powder colloid layer
4, form packaging body A；The top surface and side of short wavelength's LED chip and packaging body A are provided with short wavelength's fluorescent powder colloid layer 5,
Form overall package body.
In the present embodiment, short wavelength's LED chip 2 selects LED chip of the wavelength in 390~445nm, long wavelength's LED chip 3
Select wavelength in the LED chip of 445~550nm, and long wavelength's LED chip 3 and the wavelength of short wavelength's LED chip 2 between the two
Difference Δ λ=5~
160nm；Fluorescent powder in long wavelength's fluorescent powder colloid layer 4 be one of red fluorescence powder or yellow fluorescent powder or
The mixture of the two, the fluorescent powder in short wavelength's fluorescent powder colloid layer 5 be green emitting phosphor, indigo color fluorescent powder, hanced cyan fluorescent powder,
The one or more of yellow fluorescent powder and blue colour fluorescent powder.
As the more specific embodiment of the present embodiment:
Short wavelength's LED chip 2 and long wavelength's LED chip 3 on bracket 1, are not limited to one, can be shone according to practical
Spectrum needs, and increase accordingly the number of short wavelength's LED chip 2 and long wavelength's LED chip 3, as shown in Figure 10.
The present embodiment height is aobvious to refer to that high photosynthetic efficiency packaging body is encapsulated using SMD, can also be according to practical need in practical application
It wants, is encapsulated using COB encapsulation, CSP encapsulation or filament item.
Embodiment 2
The present embodiment height is aobvious to refer to high photosynthetic efficiency packaging body, as shown in figure 11, the substrate 1 for having circuit including one, and on substrate 1 also
It is provided with short wavelength's LED chip 2 and long wavelength's LED chip 3, and short wavelength's LED chip 2 and long wavelength's LED chip 3 are arranged at it
On circuit structure；The top surface of long wavelength's LED chip 3 and side are provided with long wavelength's fluorescent powder colloid layer 4, form packaging body A；
The top surface of short wavelength's LED chip 2 and side are provided with short wavelength's fluorescent powder colloid layer 5, form packaging body B；In packaging body A and
The top surface and side of packaging body B is provided with medium wavelength fluorescent powder colloid layer 6, forms overall package body.
In the present embodiment, short wavelength's LED chip 2 selects LED chip of the wavelength in 390~445nm, long wavelength's LED chip 3
Select wavelength in the LED chip of 445~550nm, and long wavelength's LED chip 3 and the wavelength of short wavelength's LED chip 2 between the two
Difference Δ λ=5~160nm；Fluorescent powder in long wavelength's fluorescent powder colloid layer 4 is red fluorescence powder, medium wavelength fluorescent powder colloid
Fluorescent powder in layer 6 can be yellow fluorescent powder, can be green emitting phosphor, is also possible to yellow fluorescent powder and green emitting phosphor
Mixture, the fluorescent powder in short wavelength's fluorescent powder colloid layer 5 is green emitting phosphor, hanced cyan fluorescent powder, blue colour fluorescent powder or indigo
One of color fluorescent powder is a variety of.
As the more specific embodiment of the present embodiment:
Short wavelength's LED chip 2 and long wavelength's LED chip 3 on substrate 1, are not limited to one, can be shone according to practical
Spectrum needs, and increase accordingly the number of short wavelength's LED chip 2 and long wavelength's LED chip 3, as shown in figure 12.
The present embodiment height is aobvious to refer to that high photosynthetic efficiency packaging body is encapsulated using COB, as shown in figure 13, the specific process is as follows:
After in LED chip die bond to the substrate with circuit, dispensing in basketry is being enclosed, is forming round or rectangular, then whole painting again
Fluorescent powder colloid layer is covered, whole COB encapsulating structure is ultimately formed；In practical application, it can also use according to actual needs
SMD encapsulation, CSP encapsulation or the encapsulation of filament item.
Embodiment 3
The present embodiment height is aobvious to refer to high photosynthetic efficiency packaging body, as shown in figure 14, the substrate 1 for having circuit including one, and on substrate 1 also
It is provided with short wavelength's LED chip 2, medium wavelength LED chip 7 and long wavelength's LED chip 3, and short wavelength's LED chip 2, medium wavelength
LED chip 7 and long wavelength's LED chip 3 are arranged on its circuit structure；It is provided in the top surface of long wavelength's LED chip 3 and side
Long wavelength's fluorescent powder colloid layer 4 forms packaging body A；The top surface of medium wavelength LED chip 7 and side are provided with medium wavelength fluorescence
Powder colloid layer 6 forms packaging body B；The top surface of short wavelength's LED chip 2 and side are provided with short wavelength's fluorescent powder colloid layer 5,
Form packaging body C；Packaging body A, the top surface of packaging body B and packaging body C and side are provided with colloid layer 8, form overall package
Body.
In the present embodiment, short wavelength's LED chip 2 selects LED chip of the wavelength in 390~445nm, medium wavelength LED chip 7
Select wavelength in the LED chip of 420~465nm, long wavelength's LED chip 3 selects wavelength in the LED chip of 445~550nm；And
Difference 5nm≤Δ λ≤130nm of the wavelength of long wavelength's LED chip 3 and medium wavelength LED chip 7 between the two, medium wavelength LED chip
7 and the wavelength between the two of short wavelength's LED chip 2 difference 5nm≤Δ λ≤130nm；It is glimmering in long wavelength's fluorescent powder colloid layer 4
Light powder is red fluorescence powder, and the fluorescent powder in medium wavelength fluorescent powder colloid layer 6 can be yellow fluorescent powder, can be green fluorescence
Powder is also possible to the mixture of yellow fluorescent powder and green emitting phosphor, and the fluorescent powder in short wavelength's fluorescent powder colloid layer 5 is green
One of fluorescent powder, hanced cyan fluorescent powder, blue colour fluorescent powder or indigo color fluorescent powder are a variety of；Colloid layer 8 selects epoxy resin, silicon
One or more of glue or polyimides.
As the more specific embodiment of the present embodiment:
Short wavelength's LED chip 2, medium wavelength LED chip 7 and long wavelength's LED chip 3 on substrate 1, are not limited to one,
Short wavelength's LED chip 2, medium wavelength LED chip 7 and long wavelength's LED chip can be increase accordingly according to practical luminescent spectrum needs
3 number, as shown in figure 15.
The present embodiment height is aobvious to refer to that high photosynthetic efficiency packaging body is encapsulated using filament item, as shown in figure 16, or is not provided with glue
Body layer is directly the overall package body of airspace, wherein short wavelength's fluorescent powder colloid can be coated in the top of short wavelength's chip 2
Face or its side in practical application, can also be encapsulated using SMD encapsulation, COB encapsulation or CSP according to actual needs.
Embodiment 4
The present embodiment height is aobvious to refer to high photosynthetic efficiency packaging body, and as shown in figure 17, the substrate for having circuit including one is also set on substrate
It is equipped with short wavelength's LED chip 2, medium wavelength LED chip 7 and long wavelength's LED chip 3, and short wavelength's LED chip 2, medium wavelength LED
Chip 7 and long wavelength's LED chip 3 are arranged on its circuit structure；The top surface of long wavelength's LED chip 3 and side are provided with length
Wavelength fluorescent powder colloid layer 4 forms packaging body A；The top surface of short wavelength's LED chip 2 and side are provided with short wavelength's fluorescent powder
Colloid layer 5 forms packaging body B；Packaging body A, the top surface of packaging body B and medium wavelength LED chip 7 and side are provided with medium wavelength
Fluorescent powder colloid layer 6 forms overall package body.
In the present embodiment, short wavelength's LED chip 2 selects LED chip of the wavelength in 390~445nm, medium wavelength LED chip 7
Select wavelength in the LED chip of 420~460nm, long wavelength's LED chip 3 selects wavelength in the LED chip of 445~550nm；And
Difference 5nm≤Δ λ≤130nm of the wavelength of long wavelength's LED chip 3 and medium wavelength LED chip 7 between the two, medium wavelength LED chip
7 and the wavelength between the two of short wavelength's LED chip 2 difference 5nm≤Δ λ≤130nm；It is glimmering in long wavelength's fluorescent powder colloid layer 4
Light powder is red fluorescence powder, and the fluorescent powder in medium wavelength fluorescent powder colloid layer 5 can be yellow fluorescent powder, can be green fluorescence
Powder is also possible to the mixture of yellow fluorescent powder and green emitting phosphor, and the fluorescent powder in short wavelength's fluorescent powder colloid layer 5 is green
One of fluorescent powder, hanced cyan fluorescent powder, blue colour fluorescent powder or indigo color fluorescent powder are a variety of.
As the more specific embodiment of the present embodiment:
Short wavelength's LED chip 2, medium wavelength LED chip 7 and long wavelength's LED chip 3 on substrate, are not limited to one, can
To increase accordingly short wavelength's LED chip 2, medium wavelength LED chip 7 and long wavelength's LED chip 3 according to practical luminescent spectrum needs
Number, as shown in figure 18.
The present embodiment height is aobvious to refer to that high photosynthetic efficiency packaging body is encapsulated using CSP, and processing step is main are as follows: high to the aobvious finger of height
After light efficiency packaging body whole face is dried, then cutting separation is carried out, obtains the CSP encapsulating structure of multi-chip.It, can be in practical application
According to actual needs, it is encapsulated using SMD encapsulation, COB encapsulation or filament item.
Embodiment 1-3 high is aobvious to refer to that high photosynthetic efficiency packaging body efficiently solves the above-mentioned problem that conventional white light LED faces.
First, the excitation wavelength of different fluorescent powders can be taken into account using the chip excitation of multiple and different wavelength.Fig. 2-Fig. 7
Give the excitation spectrum and emission spectrum of different fluorescent powders.For 495nm fluorescent powder, when excitation wavelength is in 360nm-
When 400nm, relative excitation efficiency can achieve 80% or more.For the fluorescent powder of 518nm, 530nm, 535nm, when exciting light exists
With respect to launching efficiency 80% or more when between 420nm-470nm.And for 655,660 fluorescent powders, when using short wavelength's blue light
When excitation, although its higher Stokes shift of relative excitation efficiency is larger, many energy are absorbed by lattice vibration to be turned
Turn to thermal energy.Such as same excitation photon energy is the 655nm feux rouges of 1.89eV, uses photon energy for the 475nm of 2.61eV
Blue light excitation, relative excitation efficiency are 60%, and photon energy loss is 0.72eV, use photon energy for 2.81eV's
The excitation of 440nm blue light, relative excitation efficiency are 70%, and photon energy loss is 0.92eV.Although being excited using short wavelength
Its launching efficiency improves 10%, but photon energy therein loss increases 28%.It is also contemplated that feux rouges excitation spectrum exists
Change gently between 450-500nm, relative excitation efficiency is slowly decreased to 55% from 65%.So being more suitable for selecting wavelength relatively
The light of long 450-500nm carrys out excitated red fluorescent powder.Unabsorbed exciting light can be to the blue green light lacked in spectrum
It compensates, can also be used to the yellow or blue-green fluorescent powder outside excitation, improve colour rendering index.
Second, using the chip of multiple and different wavelength encapsulating structure it is possible to prevente effectively from red fluorescence powder to blue green light
Double absorption problem, only few blue green light can be irradiated on red fluorescence powder.This is conducive to improve glaucous in spectrum
Ingredient, to improve colour rendering index.
Third, according to Stokes shift phenomenon, for same fluorescent powder, when the wavelength of exciting light is mobile, hair
Optical wavelength can also make a relative move to corresponding wavelength direction.Therefore long wavelength's chip excitation red fluorescence that the present invention uses
The available longer wavelengths of feux rouges of powder, using shorter bluish-green of the available wavelength of short wavelength's chip excited blue-green fluorescent powder
Light, so that band spectrum broadens, to greatly improve colour rendering index.Fig. 8 is using different excitation wavelength excitated red fluorescent powders
Excitation spectrum and emission spectrum.As can be seen from Figure 8 when using short wavelength's excitation, luminescent spectrum can also be moved to shortwave
It is dynamic.Equally, when being excited using longer wavelength, luminescent spectrum can be mobile to long wave.Therefore long wavelength's chip that the present invention uses
Excitated red fluorescent powder can make emission wavelength red shift, help to obtain higher colour rendering index.Also have for blue green light same
The advantages of.
Basic principles and main features and advantages of the present invention of the invention have been shown and described above.The skill of the industry
Art personnel it should be appreciated that the present invention is not limited to the above embodiments, the above embodiments and description only describe
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (21)
1. a kind of high aobvious finger high photosynthetic efficiency packaging body, it is characterised in that: including a supporting element, be provided with short wavelength on the supporting element
LED chip and long wavelength's LED chip；The top surface of long wavelength's LED chip and side are provided with long wavelength's fluorescent powder colloid
Layer forms packaging body A；The top surface and side of short wavelength's LED chip and packaging body A are provided with short wavelength's fluorescent powder colloid
Layer forms overall package body.
2. high aobvious finger high photosynthetic efficiency packaging body according to claim 1, it is characterised in that: short wavelength's LED chip is selected
For wavelength in the LED chip of 390~445nm, long wavelength's LED chip selects wavelength in the LED chip of 445~550nm, and long wavelength
Difference Δ λ=5~160nm of the wavelength of LED chip and short wavelength's LED chip between the two.
3. high aobvious finger high photosynthetic efficiency packaging body according to claim 1 or 2, it is characterised in that: long wavelength's phosphor gel
Fluorescent powder in body layer is the mixture of one of red fluorescence powder or yellow fluorescent powder or both；Short wavelength's fluorescence
Fluorescent powder in powder colloid layer is green emitting phosphor, indigo color fluorescent powder, hanced cyan fluorescent powder, yellow fluorescent powder and blue colour fluorescent powder
It is one or more kinds of.
4. high aobvious finger high photosynthetic efficiency packaging body according to claim 1, it is characterised in that: the supporting element is with circuit
Substrate, the bracket with circuit or without one of adhesive membrane of circuit.
5. high aobvious finger high photosynthetic efficiency packaging body according to claim 4, it is characterised in that: the supporting element is with circuit
When substrate, chip is set up directly on its circuit structure；When the supporting element is the bracket with circuit, chip is welded by die bond
Or eutectic weldering is connected on its circuit；When the substrate is the adhesive membrane without circuit, after chip posts, then it is packaged
Cutting forms the CSP packaging body of multi-chip.
6. a kind of high aobvious finger high photosynthetic efficiency packaging body, it is characterised in that: including a supporting element, be provided with short wavelength on the supporting element
LED chip and long wavelength's LED chip；The top surface of long wavelength's LED chip and side are provided with long wavelength's fluorescent powder colloid
Layer forms packaging body A；The top surface of short wavelength's LED chip and side are provided with short wavelength's fluorescent powder colloid layer, form envelope
Fill body B；The top surface of the packaging body A and packaging body B and side are provided with medium wavelength fluorescent powder colloid layer, form overall package
Body.
7. high aobvious finger high photosynthetic efficiency packaging body according to claim 6, it is characterised in that: short wavelength's LED chip is selected
For wavelength in the LED chip of 390~445nm, long wavelength's LED chip selects wavelength in the LED chip of 445~550nm, and long wavelength
Difference Δ λ=5~160nm of the wavelength of LED chip and short wavelength's LED chip between the two.
8. high aobvious finger high photosynthetic efficiency packaging body according to claim 6 or 7, it is characterised in that: long wavelength's phosphor gel
Fluorescent powder in body layer is red fluorescence powder；Fluorescent powder in the medium wavelength fluorescent powder colloid layer is yellow fluorescent powder or green
The mixture of one or both of fluorescent powder, the fluorescent powder in short wavelength's fluorescent powder colloid layer are green emitting phosphor, blueness
One of color fluorescent powder, blue colour fluorescent powder or indigo color fluorescent powder are a variety of.
9. high aobvious finger high photosynthetic efficiency packaging body according to claim 6, it is characterised in that: the supporting element is with circuit
Substrate, the bracket with circuit or without one of adhesive membrane of circuit.
10. high aobvious finger high photosynthetic efficiency packaging body according to claim 6, it is characterised in that: the supporting element is with circuit
Substrate when, chip is set up directly on its circuit structure；When the supporting element is the bracket with circuit, chip passes through die bond
Weldering or eutectic weldering are connected on its circuit；When the substrate is the adhesive membrane without circuit, after chip posts, then sealed
Dress cutting forms the CSP packaging body of multi-chip.
11. a kind of high aobvious finger high photosynthetic efficiency packaging body, it is characterised in that: including a supporting element, be provided with shortwave on the supporting element
Long LED chip, medium wavelength LED chip and long wavelength's LED chip are provided in the top surface of long wavelength's LED chip and side
Long wavelength's fluorescent powder colloid layer forms packaging body A；It is glimmering that the top surface of the medium wavelength LED chip and side are provided with medium wavelength
Light powder colloid layer forms packaging body B；The top surface of short wavelength's LED chip and side are provided with short wavelength's fluorescent powder colloid
Layer forms packaging body C；The top surface of the packaging body A, packaging body B and packaging body C and side are provided with colloid layer, formed whole
Body packaging body, or it is not provided with colloid layer directly and is the overall package body of airspace.
12. high aobvious finger high photosynthetic efficiency packaging body according to claim 11, it is characterised in that: short wavelength's LED chip choosing
LED chip with wavelength in 390~445nm, LED chip of the medium wavelength LED chip selection wavelength in 420~465nm, long wavelength
LED chip selects wavelength in the LED chip of 445~550nm, and long wavelength's LED chip and medium wavelength LED chip are between the two
Difference 5nm≤Δ λ≤130nm of wavelength, difference 5nm≤Δ of the wavelength of medium wavelength LED chip and short wavelength's LED chip between the two
λ≤130nm。
13. high aobvious finger high photosynthetic efficiency packaging body according to claim 11 or 12, it is characterised in that: long wavelength's fluorescent powder
Fluorescent powder in colloid layer is red fluorescence powder, and the fluorescent powder in the medium wavelength fluorescent powder colloid layer is yellow fluorescent powder or green
The mixture of one or both of color fluorescent powder, the fluorescent powder in short wavelength's fluorescent powder colloid layer be green emitting phosphor,
One of hanced cyan fluorescent powder, blue colour fluorescent powder or indigo color fluorescent powder are a variety of.
14. high aobvious finger high photosynthetic efficiency packaging body according to claim 11, it is characterised in that: the colloid layer selects asphalt mixtures modified by epoxy resin
One or more of rouge, silica gel or polyimides.
15. high aobvious finger high photosynthetic efficiency packaging body according to claim 11, it is characterised in that: the supporting element is with circuit
Substrate, the bracket with circuit or without one of adhesive membrane of circuit.
16. high aobvious finger high photosynthetic efficiency packaging body according to claim 15, it is characterised in that: the supporting element is with circuit
Substrate when, chip is set up directly on its circuit structure；When the supporting element is the bracket with circuit, chip passes through die bond
Weldering or eutectic weldering are connected on its circuit；When the substrate is the adhesive membrane without circuit, after chip posts, then sealed
Dress cutting forms the CSP packaging body of multi-chip.
17. a kind of high aobvious finger high photosynthetic efficiency packaging body, it is characterised in that: including a supporting element, be provided with shortwave on the supporting element
Long LED chip, medium wavelength LED chip and long wavelength's LED chip；It is provided in the top surface of long wavelength's LED chip and side
Long wavelength's fluorescent powder colloid layer forms packaging body A；It is glimmering that the top surface of short wavelength's LED chip and side are provided with short wavelength
Light powder colloid layer forms packaging body B；It is provided in the top surface of the packaging body A, packaging body B and medium wavelength LED chip and side
Medium wavelength fluorescent powder colloid layer forms overall package body.
18. high aobvious finger high photosynthetic efficiency packaging body according to claim 17, it is characterised in that: short wavelength's LED chip choosing
LED chip with wavelength in 390~445nm, LED chip of the medium wavelength LED chip selection wavelength in 420~465nm, long wavelength
LED chip selects wavelength in the LED chip of 445~550nm, and long wavelength's LED chip and medium wavelength LED chip are between the two
Difference 5nm≤Δ λ≤130nm of wavelength, difference 5nm≤Δ of the wavelength of medium wavelength LED chip and short wavelength's LED chip between the two
λ≤130nm。
19. height described in 7 or 18 is aobvious according to claim 1 refers to high photosynthetic efficiency packaging body, it is characterised in that: long wavelength's fluorescent powder
Fluorescent powder in colloid layer is red fluorescence powder, and the fluorescent powder in the medium wavelength fluorescent powder colloid layer is yellow fluorescent powder or green
The mixture of one or both of color fluorescent powder, the fluorescent powder in short wavelength's fluorescent powder colloid layer be blue colour fluorescent powder or
The mixture of one or both of indigo color fluorescent powder.
20. high aobvious finger high photosynthetic efficiency packaging body according to claim 17, it is characterised in that: the supporting element is with circuit
Substrate, the bracket with circuit or without one of adhesive membrane of circuit.
21. high aobvious finger high photosynthetic efficiency packaging body according to claim 20, it is characterised in that: the supporting element is with circuit
Substrate when, chip is set up directly on its circuit structure；When the supporting element is the bracket with circuit, chip passes through die bond
Weldering or eutectic weldering are connected on its circuit；When the substrate is the adhesive membrane without circuit, after chip posts, then sealed
Dress cutting forms the CSP packaging body of multi-chip.
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811495570.7A CN109638005A (en) | 2018-12-07 | 2018-12-07 | A kind of high aobvious finger high photosynthetic efficiency packaging body |
| CN201910639866.XA CN111180428B (en) | 2018-12-07 | 2019-07-16 | A spectrum dimming packaging structure containing ultraviolet or near-ultraviolet chip and its manufacturing method |
| CN201910640049.6A CN111180429B (en) | 2018-12-07 | 2019-07-16 | Solar spectrum-like plant illumination package and manufacturing method thereof |
| CN201921109828.5U CN210535663U (en) | 2018-12-07 | 2019-07-16 | Spectrum dimming packaging structure containing purple light or near ultraviolet chip |
| CN201921109829.XU CN210535664U (en) | 2018-12-07 | 2019-07-16 | High-color rendering index and high-light efficiency packaging body |
| CN201910639825.0A CN111180427B (en) | 2018-12-07 | 2019-07-16 | Spectrum dimming packaging structure and manufacturing method thereof |
| CN201922007924.5U CN212277195U (en) | 2018-12-07 | 2019-11-20 | A high CRI and high luminous efficiency package |
| CN201911139025.9A CN111192868B (en) | 2018-12-07 | 2019-11-20 | A high-cdr and high-light-efficiency package |
| PCT/CN2019/123375 WO2020114463A1 (en) | 2018-12-07 | 2019-12-05 | Packaging body and preparation method therefor |
| US17/339,944 US20210296294A1 (en) | 2018-12-07 | 2021-06-05 | Packaging body and preparation method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811495570.7A CN109638005A (en) | 2018-12-07 | 2018-12-07 | A kind of high aobvious finger high photosynthetic efficiency packaging body |
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| Publication Number | Publication Date |
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| CN109638005A true CN109638005A (en) | 2019-04-16 |
Family
ID=66071967
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| CN201811495570.7A Withdrawn CN109638005A (en) | 2018-12-07 | 2018-12-07 | A kind of high aobvious finger high photosynthetic efficiency packaging body |
| CN201910639825.0A Active CN111180427B (en) | 2018-12-07 | 2019-07-16 | Spectrum dimming packaging structure and manufacturing method thereof |
| CN201910639866.XA Active CN111180428B (en) | 2018-12-07 | 2019-07-16 | A spectrum dimming packaging structure containing ultraviolet or near-ultraviolet chip and its manufacturing method |
| CN201910640049.6A Active CN111180429B (en) | 2018-12-07 | 2019-07-16 | Solar spectrum-like plant illumination package and manufacturing method thereof |
| CN201922007924.5U Withdrawn - After Issue CN212277195U (en) | 2018-12-07 | 2019-11-20 | A high CRI and high luminous efficiency package |
| CN201911139025.9A Active CN111192868B (en) | 2018-12-07 | 2019-11-20 | A high-cdr and high-light-efficiency package |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910639825.0A Active CN111180427B (en) | 2018-12-07 | 2019-07-16 | Spectrum dimming packaging structure and manufacturing method thereof |
| CN201910639866.XA Active CN111180428B (en) | 2018-12-07 | 2019-07-16 | A spectrum dimming packaging structure containing ultraviolet or near-ultraviolet chip and its manufacturing method |
| CN201910640049.6A Active CN111180429B (en) | 2018-12-07 | 2019-07-16 | Solar spectrum-like plant illumination package and manufacturing method thereof |
| CN201922007924.5U Withdrawn - After Issue CN212277195U (en) | 2018-12-07 | 2019-11-20 | A high CRI and high luminous efficiency package |
| CN201911139025.9A Active CN111192868B (en) | 2018-12-07 | 2019-11-20 | A high-cdr and high-light-efficiency package |
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| WO2020114463A1 (en) * | 2018-12-07 | 2020-06-11 | 海迪科（南通）光电科技有限公司 | Packaging body and preparation method therefor |
| CN113161466A (en) * | 2020-01-20 | 2021-07-23 | 海迪科（南通）光电科技有限公司 | Solar-like spectrum packaging structure and manufacturing method thereof |
| WO2021147812A1 (en) * | 2020-01-20 | 2021-07-29 | 海迪科（南通）光电科技有限公司 | Spectrum packaging structure and manufacturing method therefor |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111192868B (en) | 2025-03-07 |
| CN212277195U (en) | 2021-01-01 |
| CN111192868A (en) | 2020-05-22 |
| CN111180429B (en) | 2023-06-13 |
| CN111180427B (en) | 2023-06-13 |
| CN111180428B (en) | 2025-03-07 |
| CN111180429A (en) | 2020-05-19 |
| CN111180427A (en) | 2020-05-19 |
| CN111180428A (en) | 2020-05-19 |
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Application publication date: 20190416 |