CN115799434B - A kind of health lighting backlight source and preparation method thereof - Google Patents

Abstract

The invention discloses a healthy lighting backlight and a preparation method thereof. The healthy lighting backlight has: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, the light-emitting chip is located directly below the first fluorescent film layer, The first fluorescent film layer is covered directly above the light-emitting chip to present an arch shape, and is connected to the second fluorescent film layer above, and the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line , the thickness ratio of the first fluorescent film layer and the second fluorescent film layer is (200-500): (250-550). The wavelength range of the double-layer CSP light source obtained by the present invention is 500-720nm, so that the spectrum is flat, the relative light intensity is high, the color saturation is high, and the color rendering index rises. The spectral wavelength is within the visible spectrum range, and the ultraviolet light and Infrared light can protect the skin to a certain extent. At the same time, the red light (wavelength range 640-720nm) in the backlight can enhance the activity of fibroblasts in the skin.

Description

A healthy lighting backlight source and preparation method thereof

Technical Field

The present invention relates to the field of LED lighting, with a classification number of H01L33/26, and in particular to a healthy lighting backlight source and a preparation method thereof.

Background Art

LED has been widely used in the field of lighting and display due to its advantages of high luminous efficiency, long life, no pollution, compact structure, etc. The current mainstream white light LED light source is fluorescent conversion white light LED, which mainly uses blue LED chip to excite yellow fluorescent layer to form yellow light, and blue light and yellow light are mixed to form white light, but the spectrum of this scheme is discontinuous and the color rendering index is low. Subsequently, a blue LED chip, green phosphor and red phosphor were combined to obtain white light. Although the color rendering index can reach about 75-85, there is still the problem of spectrum discontinuity, and the above two methods do not achieve the adjustment of color temperature parameters and relative light intensity. In order to solve the above problems, it is urgent to introduce a low color temperature, high relative light intensity, continuous spectrum, and high color saturation LED lighting source.

Chinese patent CN105702837 discloses a sunlight-simulated spectrum LED light source, which realizes a full-spectrum LED light source based on different chip wavelengths and different sizes of light-emitting chips under different phosphor materials through different proportions. Although its spectrum can achieve a certain relative light intensity and has a wide wavelength, the waveform of the spectrum is not flat, and it is mainly used for lighting in people's daily lives.

Summary of the invention

In order to solve the above problems, the first aspect of the present invention provides a healthy lighting backlight source, which comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the light-emitting chip directly above in an arch shape, and is connected to the second fluorescent film layer above, the center of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is (200-500): (250-550).

If the thickness of the first fluorescent film layer is too high, the concentration of the first fluorescent powder will increase, and the peak emitted by the first fluorescent powder will cover the peak emitted by the second fluorescent powder, which will lead to a reduction in the spectral range, discontinuity, and uneven spectrum. If the thickness of the first fluorescent film layer is too small, it will affect the relative light intensity of the CSP light source. The applicant has found that when the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is (200-500): (250-550), the generated spectrum covers a wide and continuous range, increasing from the 480-630nm band to the 500-720nm band, and the formed spectrum is flat and has a high relative light intensity.

Further preferably, the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is (350-400): (300-450).

Further preferably, the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is (380-400): (380-450).

Further preferably, the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 380:420.

Preferably, the light emitting chip is a blue light chip with a wavelength range of 455-462.5 nm.

Further preferably, the wavelength of the blue light chip is 455 nm.

Preferably, the raw materials for preparing the first fluorescent film layer include first fluorescent powder and silica gel, and the weight ratio between the first fluorescent powder and silica gel is (15-60): (20-40).

Further preferably, the silica gel is LED encapsulation silica gel, and the weight ratio between the first phosphor and the silica gel is (30-50): (25-35).

Further preferably, the weight ratio between the first phosphor and silica gel is 50:30.

Preferably, the first phosphor includes at least one of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor.

Further preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor.

Further preferably, the wavelength range of the blue phosphor is 475-480nm, the green phosphor is 490-495nm, the cyan phosphor is 535-540nm, the amber phosphor is 600-610nm, the bright red phosphor is 630-635nm and the red phosphor is 655-660nm.

Further preferably, the wavelength of the blue phosphor is 478 nm, the green phosphor is 593 nm, the cyan phosphor is 537 nm, the amber phosphor is 605 nm, the bright red phosphor is 632 nm, and the red phosphor is 658 nm.

Preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor, and the weight ratio of the six phosphors is (2-8): (3-10): (10-20): (1-5): (1-5): (0.1-1).

Further preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor, and the weight ratio of the six phosphors is (4-6): (5-10): (15-20): (2-4): (1-3): (0.5-1).

The applicant has found that when the content of blue-green phosphor is too high, a concave spectrum will occur. It is speculated that the reason may be that the content of blue-green phosphor is too high, which makes it difficult to degas and stir, thereby affecting the shape of its spectrum. When the weight ratio of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor is (4-6): (5-10): (15-20): (2-4): (1-3): (0.5-1), under the joint action of the first fluorescent film layer, not only the spectrum continuity is good, but also the blue light is greatly reduced, thus avoiding eye damage and improving the display index of the light source.

Further preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor, and the weight ratio of the six phosphors is 6:7:20:3:3:1.

Preferably, the raw materials for preparing the second fluorescent film layer include a second fluorescent powder and silica gel, and the weight ratio of the second fluorescent powder to the silica gel is (30-60): (10-40). The applicant has found that if the content of the second fluorescent powder is too low, the color rendering index of the CSP light source will decrease. The reason may be that the color point will shift, the spectrum will be discontinuous, and then the color will have obvious color difference and the color rendering index will decrease. At the same time, if the content of the second fluorescent powder is too low, the color temperature will be too high. The applicant has found that when the weight ratio of the second fluorescent powder to the silica gel is (30-60): (10-40), under the joint action of the first fluorescent film layer, the color point will not shift, the color rendering index will increase, and the color temperature will decrease.

Further preferably, the silica gel is LED encapsulation silica gel, and the weight ratio of the second phosphor to the LED encapsulation silica gel is (30-50): (20-40).

Further preferably, the weight ratio of the second phosphor to the LED encapsulation silica gel is 40:20.

Preferably, the wavelength range of the second phosphor is 720-745 nm.

Further preferably, the wavelength range of the second phosphor is 725-735 nm.

Further preferably, the wavelength range of the second phosphor is 730 nm.

The second aspect of the present invention provides a method for preparing a healthy lighting backlight source, comprising the following steps:

(1) Mix blue, green, blue-green, amber, bright red and red phosphors and silica gel according to the weight ratio, stir at a speed of 1000-1400 rpm/min for 170-190 seconds, repeat 2-3 times, adjust the speed to 900-1200 rpm/min, continue to stir for 170-190 seconds under vacuum conditions, make the vacuum-stirred fluorescent glue into a fluorescent glue film with a thickness of 350-400 um, and bake it in an oven at 70-90°C for 12-18 minutes to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength range of 720-745 nm and silica gel according to the weight ratio, stir at a rotation speed of 1000-1400 rpm/min for 170-190 s, repeat 2-3 times, adjust the rotation speed to 900-1200 rpm/min, continue to stir for 170-190 s under vacuum conditions, make the vacuum-stirred fluorescent glue into a fluorescent glue film with a thickness of 400-450 um and bake it in an oven at 70-90°C for 12-18 minutes to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3500-4000, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the pressure range is 5-7KN, and then cut them after pressing to obtain a single-layer CSP light source, and then perform current testing.

(4) Using a laminating mold, the second fluorescent film layer and the single-layer CSP light source obtained in step (3) are laminated and cut to obtain a double-layer CSP light source, and then a current test is performed.

Preferably, the pressing time in steps (3) and (4) is 3-10 min, and the pressing temperature is 80-150° C.

Further preferably, the pressing time in steps (3) and (4) is 5-7 minutes, and the pressing temperature is 100-120°C.

Further preferably, the pressing time in steps (3) and (4) is 6 minutes and the pressing temperature is 110°C.

Preferably, the current range in step (3) is 3-750 mA.

Further preferably, the current range in step (3) is 350-750 mA.

Further preferably, the current in step (3) is 350 mA.

Beneficial effects:

The wavelength range of the double-layer CSP light source obtained by the present invention is 500-720nm through the optimized design of the first fluorescent film layer and the second fluorescent film layer, so that the emitted spectrum is flat and the relative light intensity is high. The wavelength of the spectrum is within the visible spectrum range, and ultraviolet light and infrared light are filtered out, which provides certain protection for the skin. At the same time, through the reasonable proportion of the first fluorescent powder, not only the continuity of the spectrum is good, but also the blue light is greatly reduced to avoid eye damage and be softer. Then, the weight ratio of the second fluorescent powder and silica gel is optimized to achieve high color saturation and an increased color rendering index. In addition, the red light (wavelength range 640-720nm) in the lighting backlight source provided by the present invention can enhance the activity of fibroblasts in the skin.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a single-layer CSP light source prepared according to Example 1. FIG.

FIG. 2 is a schematic structural diagram of a double-layer CSP light source manufactured according to Example 1.

FIG. 3 is a spectrum diagram of the single-layer CSP light source prepared according to Example 1.

FIG. 4 is a spectrum diagram of the double-layer CSP light source prepared according to Example 1.

In Figure 1: 1. Light-emitting chip 2. First fluorescent film layer; the arrow indicates the direction of emission of a single-layer CSP light source

In Figure 2: 1. Light-emitting chip 2. First fluorescent film layer 3. Second fluorescent film layer

DETAILED DESCRIPTION

Example 1

A healthy lighting backlight source, the light source comprising: a light-emitting chip 1, a first fluorescent film layer 2 and a second fluorescent film layer 3, the light-emitting chip 1 is located directly below the first fluorescent film layer 2, the first fluorescent film layer 2 covers the light-emitting chip 1 directly above in an arch shape, and is connected to the second fluorescent film layer 3 above, the center of gravity of the light-emitting chip 1, the first fluorescent film layer 2 and the second fluorescent film layer 3 are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer 2 to the second fluorescent film layer 3 is 390:350.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 33.7:30, and the LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., model HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 5:6:17:3:2:0.7. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 40:20, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 723 nm and silica gel according to the weight ratio, stir at a rotation speed of 1200 rpm/min for 180 s. After repeating twice, adjust the rotation speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 2

A healthy lighting backlight source, the light source comprising: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 380:420.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, and the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 50:30. The LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., and the model is HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 6:7:20:3:3:1. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 40:20, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 723 nm and silica gel according to the weight ratio, stir at a rotation speed of 1200 rpm/min for 180 s. After repeating twice, adjust the rotation speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 3

A healthy lighting backlight source comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 390:420.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 38:35, and the LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., model HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the green phosphor is 493nm, the cyan phosphor is 537nm, the amber phosphor is 605nm, the bright red phosphor is 632nm and the red phosphor is 658nm, and the weight ratio between the six is 5:6:20:3:3:1. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 40:20, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 723 nm and silica gel according to the weight ratio, stir at a rotation speed of 1200 rpm/min for 180 s. After repeating twice, adjust the rotation speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 4

A healthy lighting backlight source comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 390:420.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 30:30, and the LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., model HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 4:6:16:2:1:1. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 60:40, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 723 nm and silica gel according to the weight ratio, stir at a rotation speed of 1200 rpm/min for 180 s. After repeating twice, adjust the rotation speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 5

A healthy lighting backlight source comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 390:420.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, and the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 44:30. The LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., and the model is HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 6:10:20:4:3:1. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 40:20, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 723 nm and silica gel according to the weight ratio, stir at a rotation speed of 1200 rpm/min for 180 s. After repeating twice, adjust the rotation speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 6

A healthy lighting backlight source comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 390:420.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 31.4:30, and the LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., model HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 5:6:17:3:0.2:0.2. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 20:20, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 730 nm and silica gel according to the weight ratio, stir at a speed of 1200 rpm/min for 180 s. After repeating twice, adjust the speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 7

A healthy lighting backlight source comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 390:420.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 36:30, and the LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., model HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 5:6:17:3:3:2. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 21:10, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 723 nm and silica gel according to the weight ratio, stir at a rotation speed of 1200 rpm/min for 180 s. After repeating twice, adjust the rotation speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 8

A healthy lighting backlight source comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 390:420.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 35.5:30, and the LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., model HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 5:6:17:3:4:0.5. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 40:20, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 390 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 730 nm and silica gel according to the weight ratio, stir at a speed of 1200 rpm/min for 180 s. After repeating twice, adjust the speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 420 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Example 9

A healthy lighting backlight source, the light source comprising: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the top of the blue light chip in an arch shape and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the ratio of the thickness of the first fluorescent film layer to the second fluorescent film layer is 450:350.

The light-emitting chip is a blue light chip with a wavelength of 455 nm, purchased from Sanan Optoelectronics Co., Ltd., model number S-32ABFUD.

The first fluorescent film layer includes a first fluorescent powder and LED encapsulation silica gel, the weight ratio between the first fluorescent powder and the LED encapsulation silica gel is 33.7:50, and the LED encapsulation silica gel is purchased from Beijing Kangmeite Technology Co., Ltd., model HM-0892.

The first phosphor is a mixture of blue phosphor, green phosphor, cyan phosphor, amber phosphor, bright red phosphor and red phosphor, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 493nm, the wavelength of the cyan phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm, and the weight ratio of the six is 5:6:17:3:2:0.7. The first phosphor is purchased from Shandong Yingguang New Materials Co., Ltd., and the phosphor models are 478nm: 9#480, 493nm: 1#490, 537nm; 4#535, 605nm: 11#603, 632nm: 5#630nm, 658nm: 6#660.

The second fluorescent film layer includes a second fluorescent powder and LED encapsulation silica gel, the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is 40:20, the wavelength of the second fluorescent powder is 730nm. The second fluorescent powder is purchased from Shandong Yingguang New Materials Co., Ltd., and the model is 723nm: 8#720.

A method for preparing a healthy lighting backlight source, the steps are as follows:

(1) Blue, green, cyan, amber, bright red and red phosphors and silica gel were mixed and stirred according to the weight ratio. The mixture was stirred at 1200 rpm/min for 180 s. After repeating the process twice, the mixture was adjusted to 1000 rpm/min. The mixture was stirred for 180 s under a vacuum degree of -95 KPa. The vacuum-stirred fluorescent glue was made into a fluorescent glue film with a thickness of 450 um. The film was baked in an oven at 80°C for 15 min to obtain a first fluorescent film layer.

(2) Mix the phosphor with a wavelength of 723 nm and silica gel according to the weight ratio, stir at a rotation speed of 1200 rpm/min for 180 s. After repeating twice, adjust the rotation speed to 1000 rpm/min, and continue stirring for 180 s at a vacuum degree of -95 KPa. Make the fluorescent glue after vacuum stirring into a fluorescent glue film with a thickness of 350 um and bake it in an oven at 80°C for 15 min to obtain a second fluorescent film layer.

(3) Arrange the light-emitting chips on the glass substrate, the number of the light-emitting chips is 3844, then vacuum press the first fluorescent film layer of step (1) and the light-emitting chips arranged on the glass substrate, the vacuum degree is -95 KPa, the pressure range is 6.4 KN, the pressing time is 6 min, the temperature is 110 ° C, and after pressing, cut to obtain a single-layer CSP light source, and then test at a current of 350 mA to obtain the spectrum of the single-layer CSP light source.

(4) Using a pressing mold, vacuum press and cut the second fluorescent film layer and the single-layer CSP light source obtained in step (3) at a vacuum degree of -95 KPa to obtain a double-layer CSP light source. Then, the double-layer CSP light source is tested at a current of 350 mA to obtain the spectrum of the double-layer CSP light source.

Performance Evaluation

The spectrum test instrument used for spectrum test is: WY+HAAS2000-V1-USB; instrument status: scanning wavelength range is 350-1000nm, waveform accuracy is ±0.3nm, and the relative light intensity, color temperature and color rendering index of the double-layer CSP light source are measured. The test data are shown in Table 1.

Table 1

Claims (5)

1. A healthy lighting backlight source, characterized in that the light source comprises: a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, the light-emitting chip is located directly below the first fluorescent film layer, the first fluorescent film layer covers the light-emitting chip directly above in an arch shape, and is connected to the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 200-500:250-550; the raw materials for preparing the first fluorescent film layer include a first fluorescent powder and silica gel, and the weight ratio between the first fluorescent powder and the silica gel is 15-60:20-40; the raw materials for preparing the second fluorescent film layer include a second fluorescent powder and silica gel, and the weight ratio between the second fluorescent powder and the silica gel is 30-60:10-40; the first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder; The wavelength range of the blue phosphor is 478nm, the green phosphor is 493nm, the blue-green phosphor is 537nm, the amber phosphor is 605nm, the bright red phosphor is 632nm and the red phosphor is 658nm, and the weight ratio among the six is 2-8:3-10:10-20:1-5:1-5:0.1-1; the wavelength range of the second phosphor is 720-745nm. 2. A healthy lighting backlight source according to claim 1, characterized in that the light-emitting chip is a blue light chip with a wavelength range of 455-462.5nm. 3. The healthy lighting backlight source according to claim 1, characterized in that the preparation method of the healthy lighting backlight source comprises the following steps: (1) mixing a first fluorescent powder and silica gel according to a weight ratio, stirring and baking to obtain a first fluorescent film layer; (2) mixing the second phosphor and silica gel according to a weight ratio, stirring and baking to obtain a second fluorescent film layer; (3) Pressing and cutting the first fluorescent film layer and the light-emitting chip in step (1) to obtain a single-layer CSP light source, and then performing a current test; (4) The second fluorescent film layer in step (2) and the single-layer CSP light source obtained in step (3) are pressed together and cut to obtain a double-layer CSP light source, and then a current test is performed. 4. A healthy lighting backlight source according to claim 3, characterized in that the pressing time in steps (3) and (4) is 3-10 minutes and the pressing temperature is 80-150°C. 5. A healthy lighting backlight source according to claim 3, characterized in that the current range in step (3) is 3-750mA.

Images