TWM505707U - Light-emitting diode package structure - Google Patents

Description

Light-emitting diode package structure

The present invention relates to a package structure of a light-emitting diode, in particular to a package structure of a light-emitting diode capable of emitting two different color temperature light sources.

The technology is changing with each passing day. There is a big leap forward in lighting technology. In recent years, there has been a development of a technology related to Light-Emitting Diode (LED), which is a kind of semiconductor electronic component capable of emitting light. The light has spread over visible light, infrared light and ultraviolet light, and the luminosity has also increased to a considerable extent. The use of the initial indicator lights and display panels; with the emergence of white light emitting diodes, in recent years has gradually developed to be widely used for lighting purposes.

The traditional lighting fixtures are only suitable for illuminating indoor devices, but the color tone design is not particularly particular. Most of the lights provide white light, cool white light and warm white light, but with LED smart lighting. The application is mature, so that the luminaire is no longer a tool that only provides enough light source for people. By means of luminaires combined with intelligent lighting, people change the experience and feelings of people in the past.

According to the research, the light source affects both human physiology and psychology, and affects people's physiological clock conditions. The timely and appropriate amount of light source, as well as appropriate sunshine and night distribution are also the key to affect the human body's operation. Natural light is for people's productivity. Positive help, and good for both mood and health. Therefore, the office’s light source can be adjusted with changes in sunlight, which will make people productive. The job satisfaction is improved simultaneously, and the use of light sources to further increase the emotional and health benefits.

The role of the future light source will no longer be just a illuminating effect. Smart lighting will bring more comfort and convenience to the lighting, and also bring more comfort to the user. The future use and development of smart lighting is expected to become the medium of information transmission. Smart lighting is definitely a major trend in the next few years, and the maturity of technology and the acceptance of users are the key to the smooth penetration of smart lighting penetration.

In the prior art, the way in which the luminaire emits light source illumination is only a light source that provides a single color temperature. If a warm white light source is required, only a warm white light bulb can be selected. If a cold white light source is required, only a cold white light bulb can be selected. If you need to create a good light source environment or a place to send out the required light source according to the user's needs, it will cost more cost, and the light source is not necessarily the ideal color light source. Therefore, the present invention proposes a package structure of a light-emitting diode to overcome the shortcomings of the prior art.

One of the purposes of the present invention is to provide a package structure for a light-emitting diode that utilizes the same package structure to emit light sources of two color temperatures.

One of the purposes of the present invention is to provide a package structure of a light-emitting diode having two color temperature light sources in the same package structure, which can be controlled to individually emit light or to emit light together.

In order to achieve the above-mentioned purpose and effect, the present invention relates to a package structure for a light-emitting diode, comprising a package body, a first light-emitting diode chip and a second light-emitting diode chip, the package The body has a receiving groove, the first light emitting diode crystal The first light-emitting diode layer is disposed on the first light-emitting diode wafer, and the second light-emitting diode chip is disposed in the accommodating groove, and is located in the accommodating groove One side of a light-emitting diode chip and covering a second phosphor layer on the second LED chip and the first phosphor layer.

Furthermore, the package structure of the light-emitting diode of the present invention has a package body, a first light-emitting diode chip and a second light-emitting diode chip, and the package body has a receiving groove. The first LED chip is disposed in the accommodating groove, and the second LED chip is disposed in the accommodating groove and is located on one side of the first illuminating diode chip and covers a first a phosphor layer is disposed on the first LED chip and the second LED chip, and a second phosphor layer is disposed on the first phosphor layer, and is located at the first Above the light-emitting diode wafer.

Furthermore, a control module is further disposed, the control module is electrically connected to the first LED chip and the second LED chip, and controls the first LED chip and the The second LED chips are individually illuminated or co-illuminated.

An embodiment of the present invention is that the first light emitting diode chip and the second light emitting diode chip emit a wavelength of 360 nm to 480 nm.

In one embodiment of the present invention, the phosphor powder in the first phosphor layer is selected from the group consisting of red phosphor powder, orange phosphor powder and dark yellow phosphor powder.

An embodiment of the present invention is that the phosphor powder in the second phosphor layer is yellow phosphor powder.

An embodiment of the present invention is to provide a control module electrically connected to the first LED chip and the second LED chip, and control The first light emitting diode chip and the second light emitting diode chip are separately illuminated or co-illuminated.

One embodiment of the present invention is that the control module uses an input current to change the color temperature of the light source of the first LED chip or/and the color temperature of the source of the second LED chip.

An embodiment of the present invention is to provide a third LED chip disposed in the accommodating groove and located on one side of the second illuminating diode chip.

1‧‧‧Package

10‧‧‧First LED Diode Wafer

11‧‧‧ accommodating slots

12‧‧‧ bracket

13‧‧‧ collar

100‧‧‧first light source

110‧‧‧First phosphor layer

110A‧‧‧First phosphor layer

20‧‧‧Second light-emitting diode chip

200‧‧‧second light source

210‧‧‧Second phosphor layer

210A‧‧‧Second phosphor layer

30‧‧‧ Third LED Diode Wafer

40‧‧‧Control Module

50‧‧‧Power Module

The first figure is a schematic diagram of the package structure of the light-emitting diode of the first embodiment of the present invention; the second figure is a circuit connection diagram of the light-emitting diode of the first embodiment of the present invention; Figure: is a schematic diagram of the illumination of the first embodiment of the creation; the fourth diagram is another illumination diagram of the first embodiment of the creation; the fifth diagram: it is the first embodiment of the creation A further schematic diagram of a light-emitting diode; a sixth diagram: a schematic diagram of a package structure of a light-emitting diode according to a second embodiment of the present invention; and a seventh diagram: a light-emitting diode of the third embodiment of the present invention A schematic diagram of a package structure; and an eighth diagram: a schematic diagram of a package structure of a light-emitting diode according to a fourth embodiment of the present invention.

In order for your review board to further the characteristics of the creation and the effectiveness achieved Understanding and understanding, with the best examples and detailed explanations, as explained below:

Please refer to the first figure, which is a schematic diagram of a package structure of a light-emitting diode according to a first embodiment of the present invention; as shown in the figure, the present embodiment relates to a package structure of a light-emitting diode, which comprises a package. a first light-emitting diode wafer 10 and a second light-emitting diode wafer 20, the package body 1 has a receiving groove 11 and the first light-emitting diode wafer 10 and the second light-emitting body The diode chip 20 is disposed in the accommodating groove 11. In this embodiment, the two color phosphors are used to change the color temperature light source emitted by the two light emitting diode chips, and the two color temperature light sources are further used to individually emit light or It is a form of mixed illumination to adjust the color temperature source required by the user.

According to the above-mentioned package structure of the light-emitting diode of the present embodiment, the package body 1 has a receiving groove 11 , and the first light-emitting diode chip 10 is disposed in the receiving groove 11 and covers a first The phosphor layer 110 is disposed on the first LED chip 10, and the second LED chip 20 is disposed in the receiving slot 11 and located on one side of the first LED wafer 10 And covering a second phosphor layer 210 on the second LED chip 20 and the first phosphor layer 110.

The package 1 is composed of a bracket 12 and a set of rings 13 and is described as an embodiment. The collar 13 can be a reflector. The collar 13 is disposed on the bracket 12 and is mounted on the bracket. The first light-emitting diode wafer 10 and the second light-emitting diode wafer 20 are disposed in the receiving space 11 and the second light-emitting diode chip 20 is disposed in the receiving ring 11. The light source emitted by the first LED chip 10 and the second LED chip 20 is reflected.

The first LED chip 10 is identical to the second LED chip 20, and the second LED chip 10 The first light-emitting diode wafer 10 and the second light-emitting diode wafer 20 are disposed on the first light-emitting diode wafer 10 by using a blue light wafer having a wavelength of 360 nm to 480 nm. The color of the phosphor powder in the first phosphor layer 110 is a warm color system, which is selected from a series of phosphor powders such as red phosphor powder, orange phosphor powder or deep yellow phosphor powder. The light source emitted from the LED chip 10 is biased toward the low color temperature light source. Further, the second phosphor layer 210 is disposed on the first phosphor layer 110 above the first LED substrate 10. The phosphor powder in the second phosphor layer 210 is used to polish the first LED wafer 10 and the second LED wafer 20 on the second and second LED chips 20 The light source is mainly composed of white light, which is a yellow fluorescent powder.

After the light source of the first LED powder 10 passes through the first phosphor layer 110, the light source continues to pass through the second phosphor layer 210 disposed on the first phosphor layer 110. The light source of the light-emitting diode wafer 10 is excited by the first phosphor powder layer 110 and the second phosphor powder layer 210, so that the first light-emitting diode wafer 10 emits a first light source 100 as a warm color system. One of the low color temperature light sources is warm white light, and the light source emitted by the second light emitting diode chip 20 passes through the second phosphor powder layer 210, and the light source is excited by the second phosphor powder layer 210, so that the first The second light emitting diode chip 20 emits a second light source 200 which is white light or cool white light which is a high color temperature light source which is biased toward a cool color system.

In this embodiment, the first light-emitting diode wafer 10 and the second light-emitting diode wafer 20 are matched with the first phosphor powder layer 110 and the second phosphor powder layer 210, thereby further encapsulating the package. The light source emitted in the first light source passes through the first phosphor powder layer 110 and the second phosphor powder layer 210, and the light source of the first light source 100 and the second light source 200 is emitted. Create a comfortable light source according to the needs of the user The environment, or the place where the required color temperature light source can be emitted according to the user's needs.

Please refer to the second figure, which is a schematic diagram of the circuit connection of the light-emitting diode of the first embodiment of the present invention; as shown in the figure, the present embodiment is a circuit-related application mode of the light-emitting diode, and further set The power module 40 and the control module 50 are electrically connected to the control module 50, and the control module 50 is electrically connected to the first LED chip 10 and the first The two-light-emitting diode chip 20 controls the power supply and the input current of the first LED chip 10 and the second LED chip 20 through the control module 50. The output control of the figure is not shown.

Please refer to the third to fifth figures, which are schematic diagrams of the illumination of the first embodiment of the present invention, another illumination diagram and a further illumination diagram; as shown in the figure, the embodiment passes through the control module 50. Controlling the first light emitting diode chip 10 or the second light emitting diode chip 20 to be individually illuminated or the first light emitting diode chip 10 and the second light emitting diode chip 20 can simultaneously emit light And the light source is mixed, wherein the third figure illustrates that only the first LED chip 10 is separately illuminated, and the light source is received by the first phosphor layer 110 and the second phosphor layer 210. After the excitation, the first light source 100 is emitted. The first light source 100 is a light source with a warm white light of one of the low color temperature light sources and a color temperature of about 3300K or less.

The fourth figure illustrates that only the second LED chip 20 is separately illuminated, and the light source is excited by the second phosphor layer 210 to emit the second source 200. The second source 200 is a white light or It is a light source of high color temperature light source, and its color temperature is about 6000K.

The fifth figure is the first light emitting diode chip 10 and the second light emitting diode chip 20 Simultaneously emitting the first light source 100 and the second light source 200, and after the light source is mixed, the color temperature of the light source is different from the color temperature light source and the second light emitting diode chip of the first light emitting diode wafer 10 20 separately between the color temperature light sources, that is, the light source between the high color temperature source and the low color temperature source, and the color temperature is between 3000K and 6000K.

The color temperature value of the light source of the embodiment can control the amount of the input current input between the first LED chip 10 and the second LED chip 20 through the control module 40. The amount of the input current is increased. The higher the color temperature value of the light source is, the lower the input current amount is, the lower the color temperature value of the light source is, and the color temperature value of the light source of the first light source 100 is adjusted. The second light-emitting diode wafer 20 emits a light source color temperature value of the second light source 200, or the first light-emitting diode wafer 10 and the second light-emitting diode wafer 20 emit light together, the first light source The color temperature value of the light source mixed with the second light source 200 can be adjusted according to the user's needs.

Please refer to the sixth figure, which is a schematic diagram of the package structure of the light-emitting diode according to the second embodiment of the present invention; as shown in the figure, the difference between the embodiment and the first embodiment is that the first light-emitting two A phosphor layer coating method of the polar body wafer 10 and the second LED substrate 20 covers a first phosphor layer 110A on the first LED array 10 and the second LED On the body wafer 20, a second phosphor layer 210A is disposed on the first phosphor layer 110A and above the second LED chip 20, and further, the second phosphor The powder layer 210A is not disposed above the second LED wafer 20.

As described above, in the embodiment, the first LED substrate 10 and the second LED wafer 20 are coated with a thin layer of the first phosphor layer 110A. The phosphor powder of the phosphor layer 110A is used for mixing the first light-emitting diode wafer 10 and the light source of the second light-emitting diode wafer 20 into white light, which is a yellow phosphor powder, the first The light source of the light emitting diode chip 10 and the second light emitting diode chip 20 is excited by the first phosphor powder layer 110A to emit a white light or a cool white light of a high color temperature light source, and then the second fluorescent light is emitted. The powder layer 210A is disposed on the first phosphor layer 110A and above the first LED array 10, and the color of the phosphor in the second phosphor layer 210A is a warm color system. The light source is selected from the group consisting of red phosphor powder, orange phosphor powder or dark yellow phosphor powder, so that the light source of the first light-emitting diode wafer 10 is again excited by the second phosphor powder layer 210A. And one of the low color temperature light sources emits warm white light.

Referring to the second figure, the embodiment is also the same as the circuit-related application mode of the first embodiment and the corresponding light-emitting form. In this embodiment, the power module 40 and the control module 50 are also used. The control module 50 is used. The first light-emitting diode wafer 10 and the second light-emitting diode wafer 20 are electrically connected to each other, and thus will not be described herein.

Please refer to the seventh figure, which is a schematic diagram of the package structure of the light-emitting diode according to the third embodiment of the present invention; as shown in the figure, the difference between the embodiment and the first embodiment is that the embodiment further sets a The third LED chip 30 is disposed in the accommodating groove 11 and located in the first illuminating diode chip 10 or the second illuminating diode chip 20 The third LED chip 30 is a light-emitting diode chip of different color systems, such as a red light-emitting diode chip or a green light-emitting diode chip, and is mainly used for adding the first light-emitting diode. The portion of the wafer 10 and the color light source of the second LED chip 20 is insufficient, or is used to adjust the first LED substrate 10 and the second LED wafer 20 to emit light separately. The color temperature value of the light source or the color temperature value of the light source of the mixed light.

The third LED module 30 is electrically connected to the control module 50, and the control module 50 is used to control the third LED chip 30. The power module 40 controls the power supply of the third LED chip 30 and the output of the input current, thereby adjusting the color temperature value of the light source emitted by the third LED chip 30.

Please refer to FIG. 8 , which is a schematic diagram of a package structure of a light-emitting diode according to a fourth embodiment of the present invention; as shown in the figure, the difference between this embodiment and the second embodiment is that the embodiment further sets a The third LED chip 30 is disposed in the accommodating groove 11 and located on one side of the second illuminating diode chip 20, and has the same function as the third The third LED chip 20 of the embodiment is not described again.

In summary, the present invention relates to a package structure of a light-emitting diode, having the first light-emitting diode chip and the second light-emitting diode chip in the package body, and transmitting the structure of the phosphor powder layer The design is such that the package can emit two color temperature light sources. Further, the first light emitting diode chip and the second light emitting diode chip are electrically connected by the control module, and the control module is used to adjust the light source. The power supply of the first light emitting diode chip and the second light emitting diode chip and the output of the input current are controlled, so that the first light emitting diode chip and the second light emitting diode chip can emit light separately Alternatively, the third light emitting diode chip is added to the package body, and the third light emitting diode chip is used to supplement the color temperature of the light source or to adjust the color temperature value of the light source emitted by the package.

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the shapes, structures, features, and spirits described in the scope of the present patent application are equally changed. Modifications should be included in the application of this new type Please be within the scope of the patent.

Therefore, this creation is a novelty, progressive and available for industrial use. It should be in line with the patent application requirements of China's patent law. It is undoubtedly a new type of patent application, and the Prayer Council will grant the patent as soon as possible. .

1‧‧‧Package

10‧‧‧First LED Diode Wafer

11‧‧‧ accommodating slots

12‧‧‧ bracket

13‧‧‧ collar

110‧‧‧First phosphor layer

20‧‧‧Second light-emitting diode chip

210‧‧‧Second phosphor layer

Claims (14)

A package structure of a light-emitting diode, comprising: a package body having a receiving groove; a first light-emitting diode chip disposed in the receiving groove and covering a first firefly a light emitting layer on the first light emitting diode wafer; and a second light emitting diode chip disposed in the receiving groove and located on one side of the first light emitting diode chip, and Covering a second phosphor layer on the second LED chip and the first phosphor layer. The package structure of the light-emitting diode according to the first aspect of the invention, wherein the first light-emitting diode wafer and the second light-emitting diode wafer emit a wavelength of 360 nm to 480 nm. The package structure of the light-emitting diode according to claim 1, wherein the phosphor powder in the first phosphor layer is selected from the group consisting of red phosphor powder, orange phosphor powder and deep yellow phosphor powder. One of the components. The package structure of the light-emitting diode according to claim 1, wherein the phosphor powder in the second phosphor layer is yellow phosphor powder. The package structure of the light-emitting diode according to the first aspect of the invention is further provided with a control module electrically connected to the first light-emitting diode chip and the second light-emitting diode And controlling the first light emitting diode chip and the second light emitting diode chip to emit light or to emit light separately. The package structure of the light-emitting diode according to claim 5, wherein the control module uses an input current to change the color temperature of the light source of the first light-emitting diode chip or / and the color temperature of the light source of the second LED chip. The package structure of the light-emitting diode according to the first aspect of the invention is further provided with a third light-emitting diode chip, the third light-emitting diode chip is disposed in the accommodating groove, and is located at the second One side of the light emitting diode chip. A package structure of a light-emitting diode, comprising: a package body having a receiving groove; a first light-emitting diode chip disposed in the receiving groove; and a second light-emitting diode a body wafer disposed in the accommodating groove and located on one side of the first illuminating diode chip, and covering a first luminescent phosphor layer on the first illuminating diode chip and the second illuminating A second phosphor layer is overlaid on the first phosphor layer and above the first LED chip. The package structure of the light-emitting diode according to claim 8, wherein the first light-emitting diode wafer and the second light-emitting diode wafer emit a wavelength of 360 nm to 480 nm. The package structure of the light-emitting diode according to claim 8, wherein the phosphor powder in the first phosphor layer is selected from the group consisting of red phosphor powder, orange phosphor powder and deep yellow phosphor powder. One of the components. The package structure of the light-emitting diode according to claim 8, wherein the phosphor powder in the second phosphor layer is yellow phosphor powder. The package structure of the light-emitting diode according to claim 8 is further provided with a control module electrically connected to the first light-emitting diode chip and the second light-emitting diode And controlling the first light emitting diode chip and the second light emitting diode chip to emit light or to emit light separately. The package structure of the light-emitting diode according to claim 12, wherein the control module uses an input current to change the color temperature of the light source of the first light-emitting diode chip or / and the color temperature of the light source of the second LED chip. The package structure of the light-emitting diode according to the eighth aspect of the invention is further provided with a third light-emitting diode chip, wherein the third light-emitting diode chip is disposed in the receiving groove, and the second light-emitting device is located in the second light-emitting diode. One side of the diode chip, and the first phosphor layer is coated on the light-emitting path of the third LED chip.