CN108710263A - Scanning-exposure apparatus - Google Patents

Abstract

The present invention provides a kind of scanning-exposure apparatus, it makes to rotate around center line at the cylinder light shield for the pattern for being formed with electronic equipment on cylindric peripheral surface from center line with defined radius bend, make the speed movement for being supported to cylindric or planar substrate with the rotary speed corresponding to cylinder light shield, thus by the pattern exposure of cylinder light shield to substrate, it has rotatably supports the both sides shaft outstanding on the direction that the center line of cylinder light shield extends in exposure device main body, and in the center line for changing cylinder light shield and the supporting device that cylinder light shield can be moved in the Z-direction at a distance from substrate relative to exposure device main body, supporting device includes：Rotatably support the movable body of shaft；Drive the driving source of movable body in z-direction in a manner of changing movable body relative to exposure device main body position in z-direction；And mitigate the elastic bearing component of the load of driving source for the major part of the dead weight using exposure device body abutment cylinder light shield.

Description

Scanning-exposure apparatus

The present patent application be international filing date be on March 24th, 2014, international application no be PCT/ JP2014/058109, National application number into National Phase in China is 201480034715.7, entitled " substrate board treatment, device system Make method, scanning exposure method, exposure device, device inspection apparatus and device making method " patent application division Shen Please.

Technical field

The pattern of light shield is projected at the substrate for exposing the pattern on substrate and on the substrate the present invention relates to a kind of Manage device, device making method, scanning exposure method, exposure device, device inspection apparatus and device making method.

Background technology

There is a kind of device inspection apparatus of the various devices such as the display device or semiconductor of manufacture liquid crystal display etc..Device Part manufacture system has the substrate board treatments such as exposure device.The substrate board treatment recorded in patent document 1 will be formed It projects to the substrate for being configured at view field etc. in the picture of the pattern for the light shield for being configured at illumination region, is exposed on substrate The pattern.The light shield used in substrate board treatment has planar, also there is cylindrical shape etc..

In the exposure device used in photo-mask process, it is known to which a kind of that disclosed in following patent documents makes With cylindric or columned light shield (hereinafter also referred to collectively as cylinder light shield) come exposure device (such as the patent of exposure base Document 2).Additionally, it is known that also a kind of using cylinder light shield, the device pattern of display panel, which is continuously exposed to, to be had Exposure device (such as patent document 3) on the sheet material substrate of the strip of flexible (flexibility).

Existing technical literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2007-299918 bulletins

Patent document 2：International Publication WO2008/029917

Patent document 3：Japanese Unexamined Patent Publication 2011-221538 bulletins

Invention content

Herein, substrate board treatment is by increasing the exposure area (view field of slit-shaped) on scan exposure direction, The scan exposure time for an irradiation area or device area on substrate can be shortened, so as to improve every list The productivitys such as the processing number of substrate of position time.But as described in Patent Document 1, when for productive When improving and using rotatable cylindric light shield, mask pattern is bent into cylindrical shape, therefore, if by mask pattern (circle Tubular) direction of the circumferential direction as scan exposure, increase the size on scan exposure direction of the view field of slit-shaped, Then projection exposure can decline in the quality (picture quality) of the pattern on substrate sometimes.

As shown in above-mentioned patent document 2, cylindric or columned light shield is from defined Pivot axle (center Line) peripheral surface (barrel surface) with certain radius is played, electronic device (such as semiconducter IC core is formed on the peripheral surface Piece etc.) mask pattern.When being transferred to mask pattern on photosensitive substrate (wafer), make substrate with regulation speed on one side It spends to a direction and moves, make cylinder light shield around Pivot axle synchronous rotary on one side.In this case, if so that cylinder The entire perimeter mode corresponding with the length of substrate of the peripheral surface of light shield sets the diameter of cylinder light shield, then can be Continuously scan exposure mask pattern in the length range of substrate.In addition, as described in patent document 3, if using circle as such Cylinder light shield, then the sheet material substrate flexible for only transporting strip on strip direction with fixing speed by one side (have sense Photosphere), so that cylinder light shield with the speed sync is rotated on one side, it will be able to repeat continuously to expose by the pattern of display panel Light is on sheet material substrate.In this way, using cylinder light shield so that the efficiency or rhythm of the exposure-processed of substrate It is improved, to expect that the productivity of electronic device, display panel etc. improves.

But especially in the case where the mask pattern to display panel is exposed, the picture ruler of display panel Very little is several inches~tens inches, is diversified, therefore, size, the length-width ratio in the region of mask pattern are also a variety of more Sample.In this case, if in uniquely determining diameter or the rotation of the cylinder light shield that can be installed on exposure device Mandrel to size, then be difficult to the display panel of various size correspondingly the peripheral surface of cylinder light shield effectively Configure mask pattern region.For example, even if can be by the display panel for the display panel of big picture dimension The mask pattern region of size is formed in the substantially whole circumference of the peripheral surface of cylinder light shield on one side, but for than the ruler In the case of very little slightly smaller display panel, the mask pattern region of two sides size can not be formed so that circumferential (or in rotation Mandrel to) blank will increase.

The purpose of form of the present invention is, provide it is a kind of can be to produce the substrate of high-quality compared with high productivity Substrate board treatment, device making method and scanning exposure method.

The purpose of another form of the present invention is, provides a kind of exposure that can install the different cylinder light shield of diameter Electro-optical device, device inspection apparatus and the device making method using this exposure device.

First form according to the present invention, provides a kind of substrate board treatment, the substrate board treatment have will come from light The light beam of the pattern of cover is projected to the projection optical system of the view field configured with substrate, wherein the light shield is configured at photograph The illumination region of Mingguang City, the substrate board treatment have：First supporting member, in the illumination region and the projection In a side region in region, by along by regulation curvature bending at the first face of cylinder planar in a manner of support the light A side in cover and the substrate；Second supporting member, another party area in the illumination region and the view field In domain, another party in the light shield and the substrate is supported in a manner of along defined second face；And mobile mechanism, It makes first supporting member rotate, and makes the side in the light shield and the substrate that first supporting member supported It is moved on scan exposure direction, and second supporting member is made to move, so that second supporting member is supported described Another party in light shield and the substrate moves on the scan exposure direction；The projection optical system is by the pattern Picture be formed in as defined in projection image planes on, the mobile mechanism sets movement speed and the institute of first supporting member The movement speed for stating the second supporting member keeps the curvature in the projection image planes of the pattern and the plane of exposure of the substrate larger Face or the movement speed of another party is relatively shorter than as the movement speed of plane side.

Second form according to the present invention, provides a kind of device making method, which includes using first Substrate board treatment described in form forms the pattern of the light shield on the substrate；With to the substrate board treatment Supply the substrate.

Third form according to the present invention, provides a kind of scanning exposure method, which will be formed in advise Fixed radius of curvature bends to the pattern of the one side of cylindric light shield and is projected via projection optical system to being supported to cylinder The surface of shape or planar flexible base board, and light shield is made to be moved with defined speed along the one side of bending on one side, one While substrate is made to be moved with defined speed along the surface for being supported to cylindric or planar substrate, it is right on substrate When the projection image of pattern based on projection optical system is scanned exposure, it will be formed with best focus based on throwing The radius of curvature of the projection image planes of the projection image of the pattern of shadow optical system is set as Rm, will be supported to cylindric or plane The radius of curvature on the surface of the substrate of shape is set as Rp, by the pattern image moved along projection image planes by the movement of light shield Movement speed is set as Vm, when by being set as Vp along the defined speed on the surface of substrate, is set as Vm in the case of Rm < Rp > Vp are set as Vm < Vp in the case of Rm > Rp.

4th form according to the present invention, provides a kind of exposure device, which has：Lamp optical system, By conduct illuminating light to cylinder light shield, which is being bent relative to defined axis with defined radius of curvature Curved surface peripheral surface on have pattern；Base supporting mechanism, supporting substrates；Projection optical system, will be by the illumination The pattern of the cylinder light shield of optical illumination projects the substrate supported to the base supporting mechanism；Changing machine Structure replaces the cylinder light shield；And adjustment section, the cylinder light shield is changed to diameter difference in the replacement mechanism Cylinder light shield when, at least part to the lamp optical system and at least part of the projection optical system At least one party be adjusted.

5th form according to the present invention, provides a kind of exposure device, which has：Light shield holding mechanism, There is pattern on bending to cylindric peripheral surface with predetermined radius relative to defined axis, pacified in a manner of replaceable Equipped with one in the different multiple cylinder light shields of diameter each other, and it is made to be rotated around the defined axis；Lighting system, It is by illumination in the pattern of the cylinder light shield；Base supporting mechanism, the face along bending or flat bearing Substrate, the substrate are exposed by the light of the pattern of the cylinder light shield irradiated from illuminated light；And adjustment Portion, according to the diameter for the cylinder light shield for being installed on the light shield holding mechanism, at least to the defined axis and institute The distance between base supporting mechanism is stated to be adjusted.

6th form according to the present invention, provides a kind of device inspection apparatus, which has：Above-mentioned Exposure device；With the substrate feeding device for supplying the substrate to the exposure device.

7th form according to the present invention, provides a kind of device making method, which includes：Using upper The exposure device stated, by the pattern exposure of the cylinder light shield in the substrate；With by the exposed substrate It is handled, to form device corresponding with the pattern of cylinder light shield.

Invention effect

Form according to the present invention, can prevent because the projection image planes that are formed with pattern image with transferred with the base of pattern image One party in the surface of plate is bent upwards in the scan exposure side of substrate and the offset (image displacement) of image position that generates, and And the exposed width in scan exposure can be increased, so as to obtain having transferred pattern image with high-quality with high productivity Substrate.

Other forms using the present invention, even if being capable of providing, a kind of to be equipped with diameter within the limits prescribed different In the case of cylinder light shield, exposure device, device inspection apparatus and the device system of the pattern transfer of high-quality can be also carried out Make method.

Description of the drawings

Fig. 1 is the figure of the structure for the device inspection apparatus for showing first embodiment.

Fig. 2 is the integrally-built figure for the exposure device (substrate board treatment) for showing first embodiment.

Fig. 3 is the figure of the illumination region for showing exposure device shown in Fig. 2 and the configuration of view field.

Fig. 4 is the figure of the structure of the lamp optical system and projection optical system that show exposure device shown in Fig. 2.

Fig. 5 is the figure for the state for large showing illuminating bundle and projected light beam on light shield.

Fig. 6 is the traveling mode of the illuminating bundle and projected light beam in the polarising beam splitter schematically illustrated in Fig. 4 Figure.

Fig. 7 is between the movement of the projection image planes for the pattern for large showing light shield and the movement of the plane of exposure of substrate The definition graph of relationship.

Fig. 8 A be show when project image planes and plane of exposure without difference when the picture in exposed width deviation The curve graph for the example that amount, difference component change.

Fig. 8 B are the deviations for showing the picture in exposed width when having difference when projection image planes and plane of exposure The curve graph for the example that amount, difference component change.

Fig. 8 C be show when change plane of exposure with projection image planes peripheral speed difference when in exposed width as The curve graph of one example of difference component variation.

Fig. 9 is to show that the pattern projection image that the peripheral speed according to projection image planes and plane of exposure has indifference and changes exists The curve graph of contrast in exposed width than an example of variation.

Figure 10 is the integrally-built figure for the exposure device (substrate board treatment) for showing second embodiment.

Figure 11 is between the movement of the projection image planes for the pattern for large showing light shield and the movement of the plane of exposure of substrate The definition graph of relationship.

Figure 12 be the peripheral speed according to projection image planes and plane of exposure for showing in this second embodiment have an indifference and The curve graph of one example of the departure variation of the picture in the exposed width of variation.

Figure 13 A are the L&amp shown on light shield M;The figure of the light intensity distributions of the projection image of S patterns.

Figure 13 B are the figures of the light intensity distributions for the projection image for showing isolated line (ISO) pattern on light shield M.

Figure 14 is to emulate L&amp in the state of no difference (before amendment);The contrast value of the projection image of S patterns and Contrast than curve graph.

Figure 15 is to emulate L&amp in the state of having difference (after amendment);The contrast value of the projection image of S patterns and Contrast than curve graph.

Figure 16 is to emulate the comparison for the projection image for isolating (ISO) pattern in the state of no difference (before amendment) The curve graph of angle value and contrast ratio.

Figure 17 is to emulate the comparison for the projection image for isolating (ISO) pattern in the state of having difference (after amendment) The curve graph of angle value and contrast ratio.

Figure 18 is to show to change the circle of the projection image planes of light shield M when the movement speed relative to the plane of exposure on substrate The curve graph of relationship of the picture addendum modification (departure) between exposed width when circular velocity.

Figure 19 is evaluation of estimate Q1, Q2 shown according to using departure and resolution ratio to find out, wide come the exposure of evaluating best The curve graph of one example of the emulation of degree.

Figure 20 is the integrally-built figure for the exposure device (substrate board treatment) for showing third embodiment.

Figure 21 is the integrally-built figure for the exposure device (substrate board treatment) for showing the 4th embodiment.

Figure 22 is the relationship between the movement of the projection image planes for the pattern for showing light shield and the movement of the plane of exposure of substrate Definition graph.

Figure 23 is the integrally-built figure for the exposure device for showing the 5th embodiment.

Figure 24 is flow chart the step of showing when the light shield used in exposure device is changed to other light shields.

Figure 25 is position and the even number of the field of view of the light shield side for the first projection optical system for showing odd number The figure of relationship between the position of the field of view of the light shield side of second projection optical system.

Figure 26 is the stereogram for showing to have on the surface the light shield for the information storage part for being stored with light shield information.

Figure 27 depicts the schematic diagram of the exposure condition setting table of conditions of exposure.

Figure 28 is Fig. 5 based on front, roughly shows the illuminating bundle between the different light shield of diameter and projection The figure of the state of light beam.

Figure 29 is the configuration change for showing encoder head in the case where being changed to the different light shield of diameter etc. Figure.

Figure 30 is the figure of calibrating installation.

Figure 31 is the figure for illustrating calibration.

Figure 32 is the side view for showing to support the example of light shield in a manner of it can rotate using air bearing.

Figure 33 is the stereogram for showing to support the example of light shield in a manner of it can rotate using air bearing.

Figure 34 is the integrally-built figure for the exposure device for showing sixth embodiment.

Figure 35 is the integrally-built figure for the exposure device for showing the 7th embodiment.

Figure 36 be show the supporting device in the exposure device of the cylinder light shield M of reflection-type local structure example it is vertical Body figure.

Figure 37 is the flow chart for showing device making method.

Specific implementation mode

Mode for carrying out the present invention (embodiment) is directed at while with reference to attached drawing to be described in detail.Below Embodiment described in content be not intended to limit the present invention.In addition, including ability in the inscape of following record The technical staff in domain it can be readily appreciated that or substantially the same element.Moreover, the inscape recorded below can fit Work as combination.In addition, do not depart from the present invention emphasis in the range of, can to inscape carry out it is various omit, replace or Person changes.For example, in the following embodiments, although to manufacturing flexible display as device the case where illustrates, But it is not limited to this.As device, can also manufacture using copper foil etc. formed wiring pattern circuit board, be formed with it is multiple The substrate etc. of semiconductor element (transistor, diode etc.).

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The substrate board treatment to substrate application exposure-processed of first embodiment is exposure device.In addition, exposure dress It sets to be assembled in and the substrate after exposure is applied in device inspection apparatus of the various processing to manufacture device.First, for device system The system of making illustrates.

< device inspection apparatus >

Fig. 1 is the figure of the structure for the device inspection apparatus for showing first embodiment.Device inspection apparatus 1 shown in FIG. 1 It is assembly line (flexible display manufacture assembly line) of the manufacture as the flexible display of device.As flexible display, such as There is a kind of organic el display etc..The device inspection apparatus 1 uses so-called roll-to-roll (Roll to Roll) mode, the roller Two pairs of rollers (Roll to Roll) mode refers to sending out the substrate with roller FR1 from the supply that flexible substrate P is wound into roll P is furled treated substrate P as flexible device to returning after the substrate P to submitting is applied continuously in various processing It receives and uses roller FR2.In the device inspection apparatus 1 of first embodiment, show to use roller FR1 to send out as film-form from supply The substrate P of sheet material, the substrate P sent out from supply with roller FR1 pass through successively n platform processing units U1, U2, U3, U4, U5 ... Un Until being furled example until recycling roller FR2.First, for the substrate of the process object as device inspection apparatus 1 P is illustrated.

Substrate P uses the foil (sheet metal) etc. formed such as resin film, the metal or alloy by stainless steel.Make For the material of resin film, contain：Such as polyvinyl resin, acrylic resin, polyester resin, Ethylene Vinyl Ester Copolymers tree Fat, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene tree It is more than one or two kinds of in fat, vinyl acetate resin.

Substrate P is preferably selected such as coefficient of thermal expansion and less apparent big material, so that can actually ignore The deflection caused by heated in the various processing applied to substrate P.Coefficient of thermal expansion for example can be by by inorganic fill Object is mixed in resin film and is set to smaller than threshold value corresponding with technological temperature etc..Inorganic filler for example can be Titanium oxide, zinc oxide, aluminium oxide, silica etc..In addition, it is 100 μm that substrate P, which can be by the thickness of the manufactures such as float technique, The individual layers of the very thin glass of left and right can also be the layer pasted above-mentioned resin film, foil etc. on the very thin glass and formed Stack.

The substrate P constituted in this way is by being wound into roll into roller FR1, supply roller FR1 for the supply It is mounted in device inspection apparatus 1.The device inspection apparatus 1 of supply roller FR1 is installed to being sent out from supply roller FR1 Substrate P repeat the various processing for manufacturing a device.Therefore, substrate P that treated becomes multiple devices and is connected The state connect.That is, becoming the substrate of layout with the roller FR1 substrate Ps sent out from supply.In addition, substrate P can be by advance Defined pre-treatment makes its surface activation come modified to its surface, is used for alternatively, being formed on surface by stamped method etc. The small next door construction (sag and swell) of precise pattern.

Substrate P that treated is used as recycling by being wound into roll and is recovered with roller FR2.Recycling is mounted with roller FR2 In on cutter device (not shown).Be equipped with the cutter device of recycling roller FR2 by will treated substrate P by each device Part is split (cutting) to form multiple devices.For the size of substrate P, such as the width direction (side as short side To) size be 10cm~2m or so, the size of length direction (direction as long side) is 10m or more.In addition, substrate P Size be not limited to above-mentioned size.

X-direction, Y-direction and the orthogonal orthogonal coordinate system of Z-direction are used in Fig. 1.The directions X are to connect in the horizontal plane The direction for tying supply roller FR1 and recycling roller FR2, is the left and right directions in Fig. 1.Y-direction be in the horizontal plane with the side X It is the front-rear direction in Fig. 1 to orthogonal direction.Y-direction makees the axial direction of roller FR1 for the supply and recycling roller FR2. Z Direction is vertical direction, is the upper and lower directions in Fig. 1.

Device inspection apparatus 1 has substrate feeding device 2, the base to being supplied by substrate feeding device 2 of supplying substrate P Plate P applies processing unit U1~Un of various processing, will apply the base that the substrate P of processing recycles by processing unit U1~Un Plate retracting device 4, the host control device 5 that each device of device inspection apparatus 1 is controlled.

Supply roller FR1 is installed in a rotatable way in substrate feeding device 2.Substrate feeding device 2 have from The supply installed sends out the driven roller R1 of substrate P with roller FR1, adjusts the position in width direction (Y-direction) of substrate P Marginal position controller EPC1.Driven roller R1 rotates while the front and back sides of substrate P are clamped, by substrate P to from supply It is sent out with the carry direction of roller FR1 towards recycling roller FR2, thus supplies substrate P to processing unit U1~Un.At this point, side Edge positioner EPC1 is so that the position of the end (edge) of substrate P in the direction of the width is converged on relative to target location Mode in the range of ± more than ten μm~tens μm or so makes substrate P move in the direction of the width, to correct substrate P in width Position on direction.

Recycling roller FR2 is installed in a rotatable way in substrate retracting device 4.Substrate retracting device 4 has will Substrate P that treated pull to the driven roller R2 of the sides recycling roller FR2, adjustment substrate P in width direction (Y-direction) The marginal position controller EPC2 of position.The front and back sides one of substrate P are clamped using driven roller R2 on one side for substrate retracting device 4 Side rotates, and pulls substrate P to carry direction, and recycling roller FR2 is made to rotate, thus rolls substrate P.At this point, margin location It sets and corrects the position of substrate P in the direction of the width in the same manner as controller EPC2 and marginal position controller EPC1, to avoid substrate The end (edge) in the direction of the width of P generates deviation in width direction.

Processing unit U1 is the painting that photonasty functional liquid is applied on the surface of the substrate P supplied from substrate feeding device 2 Coating apparatus.As photonasty functional liquid, such as photoresist, photonasty silane coupling agent (such as photonasty hydrophobe are used Property modifying agent, photonasty plating reducing agent etc.), UV curable resin solutions etc..Processing unit U1 is from the carry direction of substrate P Upstream side is risen is equipped with applying mechanism Gp1 and drier Gp2 successively.Applying mechanism Gp1 has the roller platen for being wound with substrate P DR1, the application roll DR2 opposite with roller platen DR1.The substrate P supplied is being wound in roller platen DR1's by applying mechanism Gp1 Under state, substrate P is clamped using roller platen DR1 and application roll DR2.Then, applying mechanism Gp1 is by making roller platen DR1 And application roll DR2 rotations, so that substrate P is moved to carry direction on one side, utilizes application roll DR2 to apply photosensitive sexual function on one side Liquid.Drier Gp2 is contained by the drying air such as blowout hot wind or the air of drying with removing in photonasty functional liquid Some solutes (solvent or water) make the substrate P coated with photonasty functional liquid dry, to form photonasty in substrate P Functional layer.

Processing unit U2 is that the photonasty functional layer on the surface in order to make to be formed in substrate P is stablized, will be from processing unit U1 Carry the heating device that the substrate P come is heated to set point of temperature (for example, several 10~120 DEG C or so).Processing unit U2 is from substrate The upstream side of the carry direction of P is equipped with heating chamber HA1 and cooling chamber HA2 successively.In being internally provided with for heating chamber HA1 Multiple rollers and multiple aerial turning-bars (air turn bar), multiple rollers and multiple aerial turning-bars constitute removing for substrate P Transport path.Multiple rollers are set as being in rolling contact with the back side of substrate P, and multiple aerial turning-bars are arranged to the not table with substrate P The state of surface side contact.In order to extend the transport path of substrate P, multiple rollers and multiple aerial turning-bars are to form snake shape The mode of transport path configure.It is removed on one side by the transport path along snake shape by the substrate P in heating chamber HA1 Fortune, is heated to set point of temperature on one side.In order to make the temperature in the substrate P of heating chamber HA1 heating and subsequent handling (processing Device U3) environment temperature it is consistent, substrate P is cooled to environment temperature by cooling chamber HA2.In the inside of cooling chamber HA2 Equipped with multiple rollers, in the same manner as heating chamber HA1, in order to extend the transport path of substrate P, multiple rollers are to form snake shape The mode of transport path configures.It is carried on one side by the transport path along snake shape by the substrate P in cooling chamber HA2, one Side is cooled.Downstream side in the carry direction of cooling chamber HA2 is equipped with driven roller R3, and driven roller R3 is clamped on one side to be passed through The substrate P of cooling chamber HA2 rotates on one side, thus supplies substrate P towards processing unit U3.

Processing unit (substrate board treatment) U3 is to be formed with photosensitive sexual function for from the surface that processing unit U2 is supplied The exposure device of the patterns such as the circuit of substrate (sensitive substrate) P projection exposure displays of layer or wiring.Details exists It is hereinafter described, processing unit U3 is obtained illuminating bundle by light shield M reflection by irradiating illuminating bundle to the light shield M of reflection-type To projected light beam projection exposure in substrate P.Processing unit U3, which has to the downstream side of carry direction, to be transported from processing unit The marginal position controller of the position in width direction (Y-direction) of substrate P driven roller DR4, adjustment substrate P that U2 is supplied EPC3.Driven roller DR4 rotates while the front and back sides of substrate P are clamped, and substrate P is sent to the downstream side of carry direction Go out, thus comes to the rotating cylinder DR5 supplies in exposure position supporting substrates P.Marginal position controller EPC3 and marginal position control Device EPC1 processed is similarly constituted, and the position of substrate P in the direction of the width is corrected, so that the width side of the substrate P in exposure position To as target location.In addition, processing unit U3 has in the state of assigning slackness to the substrate P after exposure, to removing Transport two groups of driven rollers DR6, DR7 of substrate P in the downstream side for transporting direction.Two groups of driven rollers DR6, DR7 are in the carrying of substrate P The mode being spaced as defined in being separated by direction configures.Driven roller DR6 holds the upstream side of the substrate P of carrying and rotation, driving Roller DR7 holds the downstream side of the substrate P of carrying and rotation, thus supplies substrate P to processing unit U4.At this point, by It is endowed slackness in substrate P, so can absorb in the carrying for more leaning on the downstream side of carry direction to generate than driven roller DR7 The variation of speed can break off the influence of the exposure-processed caused by the variation of transporting velocity to substrate P.In addition, in order to make The picture of a part for the mask pattern of light shield M is relatively aligned with substrate P and (is aligned), and inspection is equipped in processing unit U3 Survey aligming microscope AM1, AM2 of alignment mark being previously formed in substrate P etc..

Processing unit U4 is development treatment, the nothing for carrying out wet type to carrying the substrate P after the exposure come from processing unit U3 It is electrolysed the wet type processing device of electroplating processes etc..Have in the inside of processing unit U4：It is layered along vertical direction (Z-direction) Multiple rollers of 3 treatment troughs BT1, BT2, BT3 and handling substrate P for changing.Multiple rollers are handled from 3 successively with forming substrate P The inside of slot BT1, BT2, BT3 transport path by way of configure.Downstream side in the carry direction for the treatment of trough BT3 Equipped with driven roller, driven roller DR8 is on one side being clamped by being rotated while substrate P after treatment trough BT3, thus by substrate P direction Processing unit U5 supplies.

Although illustration omitted, processing unit U5 is done to what the substrate P come from processing unit U4 carryings was dried Dry device.Processing unit U5 removes the drop for being applied in processing unit U4 and having adhered in the substrate P of wet processed, and Adjust the moisture of substrate P.The substrate P dried by processing unit U5 is carried to processing using several processing units Device Un.Then, after processing unit Un is handled, substrate P is rolled up to the recycling roller FR2 of substrate retracting device 4.

The pool control base board of host control device 5 feedway 2, substrate retracting device 4 and multiple processing unit U1~ Un.5 control base board feedway 2 of host control device and substrate retracting device 4 are recycled from substrate feeding device 2 to substrate 4 handling substrate P of device.In addition, host control device 5 on one side synchronizes the carrying of substrate P, multiple processing units are controlled on one side U1~Un carries out various processing to substrate P.

< exposure devices (substrate board treatment) >

Hereinafter, with reference to Fig. 2~Fig. 5, to the exposure device (processing substrate of the processing unit U3 as first embodiment Device) structure illustrate.Fig. 2 is the overall structure for the exposure device (substrate board treatment) for showing first embodiment Figure.Fig. 3 is the figure of the illumination region for showing exposure device shown in Fig. 2 and the configuration of view field.Fig. 4 is to show Fig. 2 Shown in exposure device lamp optical system and projection optical system structure figure.Fig. 5 is to show to expose to light shield Illuminating bundle and from light shield project projected light beam state figure.Fig. 6 is the polarised light point schematically illustrated in Fig. 4 The figure of the traveling mode of illuminating bundle and projected light beam in beam device.Hereinafter, processing unit U3 is known as exposure device U3.

Exposure device U3 shown in Fig. 2 is so-called scanning-exposure apparatus, on one side to carry direction handling substrate P, on one side Will be formed in the mask pattern of the peripheral surface of cylindric light shield M as projection exposure is on the surface of substrate P.In addition, scheming Using X-direction, Y-direction and the orthogonal orthogonal coordinate system of Z-direction in 2, using orthogonal coordinate system same as Fig. 1.

First, the light shield M used in exposure device U3 is illustrated.Light shield M is for example using metal cylinder Reflection-type light shield.Light shield M is formed to have the cylinder of peripheral surface (periphery), the peripheral surface (periphery) have with Radius of curvature R m centered on the first axle AX1 that Y-direction extends.The periphery of light shield M is to be formed with defined light shield The light shield face P1 of pattern.Light shield face P1 has：With high efficiency to the high reflection portion of prescribed direction the reflected beams and not to regulation Direction the reflected beams or the reflection suppression portion reflected with poor efficiency.Mask pattern is by high reflection portion and reflection suppression portion It is formed.Herein, as long as the light that reflection suppression portion is reflected to prescribed direction is reduced.Therefore, reflection suppression portion can inhale Receive light, through light or to the direction reflected light (such as diffusing reflection) other than prescribed direction.Herein, it can utilize and absorb The material of light or the reflection suppression portion that light shield M is constituted through the material of light.Exposure device U3 can be used by aluminium or SUS Light shield M of the light shield that the cylinder of equal metals makes as above structure.Therefore, exposure device U3 can use the light of low price Cover is exposed.

In addition, light shield M could be formed with panel pattern corresponding with a display device entirety or one Point, panel pattern corresponding with multiple display devices can also be formed with.In addition, light shield M can be around first axle It has been repeatedly formed multiple panel patterns in the circumferential direction of AX1, can also be repeatedly formed on the direction parallel with first axle AX1 There are multiple small-sized panel patterns.Moreover, light shield M can also be formed with the panel pattern and ruler of the first display device The panel pattern of the very little equal second display part different from the first display device.In addition, as long as light shield M has with first axle The periphery that radius of curvature centered on AX1 is Rm, is not limited to the shape of cylinder.For example, light shield M can also It is the plank of the arc-shaped with periphery.In addition, light shield M can also be laminal, laminal light shield M can be made curved Song simultaneously has periphery.

Then, exposure device U3 shown in Fig. 2 is illustrated.Exposure device U3 above-mentioned driven roller DR4, DR6, On the basis of DR7, rotating cylinder DR5, marginal position controller EPC3 and aligming microscope AM1, AM2, also have：Light shield is protected Hold mechanism 11, base supporting mechanism 12, lamp optical system IL, projection optical system PL, slave control device 16.Exposure dress U3 is set to irradiate the illumination light projected from light supply apparatus 13 via a part of lamp optical system IL and projection optical system PL In the pattern plane P1 for the light shield M that light shield holding mechanism 11 is supported, by by the projected light beam of the pattern plane P1 reflections of light shield M (at As light) via projection optical system PL it is projeced into the substrate P that base supporting mechanism 12 is supported.

Slave control device 16 controls each section of exposure device U3, and each section is made to be handled.Slave control device 16 Can be some or all of the host control device 5 of device inspection apparatus 1.In addition, slave control device 16 can also It is controlled by host control device 5, is other devices different from host control device 5.Slave control device 16 is for example with meter Calculation machine.

Light shield holding mechanism 11 has：It keeps the cylinder roller (also referred to as light shield holding cylinder) 21 of light shield M, cylinder is made to roll First driving portion 22 of 21 rotation of cylinder.Cylinder roller 21 keeps light by the first axle AX1 of light shield M in the way of rotation center Cover M.First driving portion 22 is connect with slave control device 16, and makes cylinder roller 21 as rotation center using first axle AX1 Rotation.

In addition, light shield holding mechanism 11 cylinder roller 21 peripheral surface by high reflection portion and the direct shape of low reflecting part At mask pattern, but it is not limited to the structure.Cylinder roller 21 as light shield holding mechanism 11 can also copy its peripheral surface To wind and keep laminal reflection-type light shield M.In addition, the cylinder roller 21 as light shield holding mechanism 11 can also be with Can the mode of installing and dismounting the reflection-type light shield M for the plate for bending to arc-shaped with radius Rm in advance is held in cylinder roller 21 peripheral surface.

Base supporting mechanism 12 has the substrate supporting cylinder 25 (the rotating cylinder DR5 in Fig. 1) supported to substrate P, makes The second driving portion 26, a pair of aerial turning-bar ATB1, ATB2 and a pair of of the deflector roll 27,28 that substrate supporting cylinder 25 rotates.Substrate Bearing cylinder 25 is formed to have the cylindrical shape of peripheral surface (periphery), which has on the directions Y Radius of curvature R p centered on the second axis AX2 extended.Herein, first axle AX1 and the second axis AX2 is mutually parallel, with from One axis AX1 and the second axis AX2 by face centered on face CL.A part for the periphery of substrate supporting cylinder 25 becomes branch Hold the bearing surface P2 of substrate P.That is, substrate supporting cylinder 25 is supported substrate P by the way that substrate P to be wound on its bearing surface P2 To bend to cylinder planar.Second driving portion 26 is connect with slave control device 16, is made as rotation center using the second axis AX2 Substrate supporting cylinder 25 rotates.A pair of aerial turning-bar ATB1, ATB2 and a pair of of deflector roll 27,28 are distinguished across substrate supporting cylinder 25 Set on the upstream side and downstream side of the carry direction of substrate P.Deflector roll 27 will carry the substrate P come via sky from driven roller DR4 Middle turning-bar ATB1 is guided to substrate supporting cylinder 25, and deflector roll 28 will be carried via substrate supporting cylinder 25 from aerial turning-bar ATB2 The substrate P come is guided to driven roller DR6.

Base supporting mechanism 12 makes substrate supporting cylinder 25 rotate by using the second driving portion 26, comes on one side to utilize substrate The bearing surface P2 bearings for supporting cylinder 25 have imported the substrate P of substrate supporting cylinder 25, on one side with fixing speed in the strip direction (side X To) on transport the substrate P of importing substrate supporting cylinder 25.

At this point, the slave control device 16 being connect with the first driving portion 22 and the second driving portion 26 is by making cylinder roll Cylinder 21 and substrate supporting cylinder 25 will be formed in the light shield figure of the light shield face P1 of light shield M with defined rotary speed ratio synchronous rotary The picture of case continuously repeats projection exposure and (copies circumference on the surface of the substrate P for the bearing surface P2 for being wound in substrate supporting cylinder 25 Face and the face being bent) on.The first driving portion 22 and the second driving portion 26 of exposure device U3 is the movement of present embodiment Mechanism.

Light supply apparatus 13 projects the illuminating bundle EL1 of irradiation light shield M.Light supply apparatus 13 has light source 31 and light conducting member 32.Light source 31 is the light source for the light for projecting defined wavelength.Light source 31 be, for example, the lamp sources such as mercury vapor lamp, laser diode or Person's light emitting diode (LED) etc..Light source 31 project illumination light be, for example, projected from lamp source bright line (g lines, h lines, i lines), The extreme ultraviolet lights such as KrF excimer laser (wavelength 248nm) (DUV light), ArF excimer laser (wavelength 193nm) etc..Herein, light Source 31 is preferred to project the illuminating bundle EL1 containing the light shorter than the wavelength of i line (wavelength of 365nm).As illumination as such Light beam EL1 can use the laser (wavelength of 355nm) projected from YAG laser (third harmonic laser device), swash from YAG The laser (wavelength of 266nm) that light device (four-time harmonic laser) projects or the laser projected from KrF excimer lasers (wavelength of 248nm) etc..

Light conducting member 32 conducts the illuminating bundle EL1 projected from light source 31 to lamp optical system IL.Light conducting member 32 It is constituted by optical fiber or using the relaying module etc. of speculum.In addition, light conducting member 32 is equipped with multiple lamp optical system IL In the case of, the illuminating bundle EL1 from light source 31 is divided into multiple, multiple illuminating bundle EL1 are conducted to multiple illuminations Optical system IL.The light conducting member 32 of present embodiment is using the illuminating bundle EL1 projected from light source 31 as defined polarization shape The light of state is incident to polarising beam splitter PBS.Polarising beam splitter PBS penetrates illumination and set on light shield to light shield M fall Between M and projection optical system PL, it will reflect, make as the straight of P polarization light as the light beam of the rectilinearly polarized light of S-polarization light The light beam of linearly polarized light transmits.Therefore, light supply apparatus 13, which projects, is incident to the illuminating bundle EL1 of polarising beam splitter PBS and becomes The illuminating bundle EL1 of the light beam of rectilinearly polarized light (S-polarization light).Light supply apparatus 13 to polarising beam splitter PBS project wavelength with And the polarization ray laser that phase is consistent.For example, light supply apparatus 13 is in the situation that the light beam projected from light source 31 is the light polarized Under, keep optical fiber as light conducting member 32 under the polarization state for the laser for maintaining to export from light supply apparatus 13 using plane of polarization It carries out guide-lighting.In addition, for example, the light beam that fiber guides are exported from light source 31 can also be used, made from optical fiber output using polarizing film Light generate polarization.That is light supply apparatus 13 in the case where the light beam of random polarization is guided, using polarizing film make with The light beam polarization of machine polarised light.In addition, light supply apparatus 13 can also by using the relay optical system of lens etc. come guide from The light beam that light source 31 exports.

Herein, as shown in figure 3, the exposure device U3 of first embodiment assumes that the exposure of so-called poly-lens mode Device.In addition, showing in figure 3, the illumination region from the light shield M that the cylinder roller 21 that the sides-Z are observed is kept The vertical view (left figure of Fig. 3) of IR, from the view field PA in the substrate P that the substrate supporting cylinder 25 that the sides+Z are observed is supported Vertical view (right figure of Fig. 3).The reference numeral Xs of Fig. 3 shows the moving direction of cylinder roller 21 and substrate supporting cylinder 25 (direction of rotation).Multiple (are in the first embodiment, for example, 6) of the exposure device U3 of poly-lens mode on light shield M Illumination region IR1~IR6 irradiate illuminating bundle EL1 respectively, by each illuminating bundle EL1 in each illumination region IR1~IR6 quilts Reflect multiple (are in the first embodiment, for example, 6) of the obtained multiple projected light beam EL2 projection exposures in substrate P View field PA1~PA6.

First, the multiple illumination region IR1~IR6 illuminated using lamp optical system IL are illustrated.Such as Fig. 3 institutes Show, multiple illumination region IR1~IR6 configure the first illumination across median plane CL on the light shield M of the upstream side of direction of rotation Region IR1, third illumination region IR3 and the 5th illumination region IR5 configure on the light shield M in the downstream side of direction of rotation Two illumination region IR2, the 4th illumination region IR4 and the 6th illumination region IR6.Each illumination region IR1~IR6 is in having Along the elongated trapezoidal region for the parallel short side and long side that the axial direction (Y-direction) of light shield M extends.At this point, trapezoidal Each illumination region IR1~IR6 is that its short side is located at the sides median plane CL and its long side is located at the region in outside.First illumination region IR1, third illumination region IR3 and the 5th illumination region IR5 are spaced as defined in being separated by the axial direction to configure.In addition, second Illumination region IR2, the 4th illumination region IR4 and the 6th illumination region IR6 are spaced as defined in being separated by the axial direction to configure. At this point, the second illumination region IR2 is configured in the axial direction between the first illumination region IR1 and third illumination region IR3.Equally Ground, third illumination region IR3 are configured in the axial direction between the second illumination region IR2 and the 4th illumination region IR4.4th shines Area pellucida domain IR4 is configured in the axial direction between third illumination region IR3 and the 5th illumination region IR5.5th illumination region IR5 It configures in the axial direction between the 4th illumination region IR4 and the 6th illumination region IR6.Each illumination region IR1~IR6 is enclosed with working as When around circumferential direction (X-direction) of light shield M, in the Y direction between the triangular part in the bevel edge portion of adjacent trapezoidal illumination region mutually The mode (mode of overlapping) of coincidence configures.In addition, in the first embodiment, each illumination region IR1~IR6 is trapezoidal Region of the region but it is also possible to be oblong-shaped.

It is formed with the pattern forming region A3 of mask pattern in addition, light shield M has and does not form the non-pattern of mask pattern Forming region A4.Non- pattern forming region A4 is the not easily reflective region for absorbing illuminating bundle EL1, is configured to enclose with frame-shaped Around pattern forming region A3.First~the 6th illumination region IR1~IR6 is configured to cover the Y-direction of pattern forming region A3 Entire width.

Lamp optical system IL is correspondingly equipped with multiple (in first embodiment with multiple illumination region IR1~IR6 In be, for example, 6).It injects in multiple lamp optical system (segmentation lamp optical system) IL1~IL6 and is filled from light source respectively Set 13 illuminating bundle EL1.Each lamp optical system IL1~IL6 respectively will be from the incident each illuminating bundle of light supply apparatus 13 EL1 is conducted to each illumination region IR1~IR6.It is shone that is, the first lamp optical system IL1 conducts illuminating bundle EL1 to first Area pellucida domain IR1, similarly, the second~the 6th lamp optical system IL2~IL6 conduct illuminating bundle EL1 to the second~the 6th Illumination region IR2~IR6.Multiple lamp optical system IL1~IL6 are across median plane CL, configured with first, third, The side (left side of Fig. 2) of five illumination region IR1, IR3, IR5 configures the first lamp optical system IL1, lamp optical system IL3 and the 5th lamp optical system IL5.First lamp optical system IL1, third lamp optical system IL3 and the 5th photograph Bright optical system IL5 is spaced as defined in being separated by the Y direction to configure.In addition, multiple lamp optical system IL1~IL6 every Median plane CL, in side (right side of Fig. 2) configuration the configured with the second, the 4th, the 6th illumination region IR2, IR4, IR6 Two lamp optical system IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6.Second illumination optical system System IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6 are spaced as defined in being separated by the Y direction to match It sets.At this point, the second lamp optical system IL2 is configured in the axial direction in the first lamp optical system IL1 and third illumination optical system Between system IL3.Similarly, third lamp optical system IL3, the 4th lamp optical system IL4, the 5th lamp optical system IL5 is configured in the axial direction between the second lamp optical system IL2 and the 4th lamp optical system IL4, third illumination optical system Between system IL3 and the 5th lamp optical system IL5, between the 4th lamp optical system IL4 and the 6th lamp optical system IL6. In addition, the first lamp optical system IL1, third lamp optical system IL3 and the 5th lamp optical system IL5 and second shine Bright optical system IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6 are configured to from Y-direction When be symmetrical.

Then, with reference to Fig. 4, each lamp optical system IL1~IL6 is illustrated.Further, since each illumination optical system IL1~the IL6 that unites is same structure, so with the first lamp optical system IL1 (hereinafter simply referred to as lamp optical system IL) For illustrate.

In order to which with uniform illumination irradiation illumination region IR (the first illumination region IR1), lamp optical system IL makes to come from The illuminating bundle EL1 of light supply apparatus 13 carries out Ke Le (Kohler) to the illumination region IR on light shield M and illuminates.In addition, illumination light System IL is to penetrate lighting system using falling for polarising beam splitter PBS.Lamp optical system IL is from from light supply apparatus 13 Illuminating bundle EL1 light incident side successively have light optics module ILM, polarising beam splitter PBS and quarter wave plate 41.

As shown in figure 4, light optics module ILM includes collimation lens 51 successively, answers from the light incident side of illuminating bundle EL1 Eyelens 52, multiple collector lenses 53, cylindrical lens 54, illuminated field diaphragm 55 and multiple relay lens 56, and be arranged On primary optic axis BX1.

51 incidence of collimation lens has the light projected from light conducting member 32, and the face for irradiating the light incident side of fly's-eye lens 52 is whole.

Fly's-eye lens 52 is set to the emitting side of collimation lens 51.The center configuration in the face of the emitting side of fly's-eye lens 52 in On primary optic axis BX1.The illuminating bundle EL1 that fly's-eye lens 52 generates self-focus lens in future 51 is divided into multiple point light source pictures Area source picture.Illuminating bundle EL1 is generated by the area source picture.At this point, generating the emitting side of the fly's-eye lens 52 of point light source picture Face pass through the first concave mirror 72 from fly's-eye lens 52 via illuminated field diaphragm 55 to aftermentioned projection optical system PL Various lens, be configured to reach optical conjugate with the pupil plane where the reflecting surface of the first concave mirror 72.

Collector lens 53 is set to the emitting side of fly's-eye lens 52.The optical axis of collector lens 53 is configured at primary optic axis BX1 On.Collector lens 53 makes multiple point light sources from the emitting side for being formed in fly's-eye lens 52 as respective light is in illumination field of view It is overlapped on diaphragm 55, illuminated field diaphragm 55 is irradiated with uniform Illumination Distribution.Illuminated field diaphragm 55 has as shown in figure 3 Illumination region IR is similar trapezoidal or rectangular rectangular-shaped opening portion, the center configuration of the opening portion is in the first light On axis BX1.By relay lens 56 in from illuminated field diaphragm 55 to the light path of light shield M, polarising beam splitter PBS, Quarter wave plate 41 so that the opening portion of illuminated field diaphragm 55 is configured to have optical conjugate with the illumination region IR on light shield M Relationship.Relay lens 56 makes the illuminating bundle EL1 transmitted from the opening portion of illuminated field diaphragm 55 be incident to polarized light beam splitting Device PBS.Collector lens 53 emitting side with 55 adjoining position of illuminated field diaphragm be equipped with cylindrical lens 54.Cylinder is saturating Mirror 54 is light incident side in the piano convex cylindrical lens that plane and emitting side are in cylindrical lens face.The optical axis of cylindrical lens 54 is configured at On primary optic axis BX1.Cylindrical lens 54 makes each chief ray of the illuminating bundle EL1 of the illumination region IR on irradiation light shield M restrain It is in parastate in the Y direction in the faces XZ.

Polarising beam splitter PBS configurations are between light optics module ILM and median plane CL.Polarising beam splitter PBS exists Division of wave front face makes the light beam as the rectilinearly polarized light of S-polarization light reflect, and makes the rectilinearly polarized light as P polarization light Light beam transmits.Herein, if the illuminating bundle EL1 for being incident to polarising beam splitter PBS to be set as to the rectilinearly polarized light of S-polarization light, Then illuminating bundle EL1 is reflected by the division of wave front face of polarising beam splitter PBS, is transmitted from 1/4 wave plate 41 and is become circular polarization Light simultaneously irradiates the illumination region IR on light shield M.Passed through by the projected light beam EL2 of the illumination region IR reflections on light shield M saturating again It penetrates quarter wave plate 41 and converts the P polarization light that is in line from circularly polarized light, through the division of wave front face of polarising beam splitter PBS Directive projection optical system PL.Polarising beam splitter PBS preferably to be incident to division of wave front face illuminating bundle EL1 it is big Part is reflected, and makes most of transmission of projected light beam EL2.On the division of wave front face of polarising beam splitter PBS Polarised light stalling characteristic indicated by extinction ratio, due to the extinction ratio entering also according to the light towards division of wave front face Firing angle and change, so in order in practical applications to the influence of imaging performance will not become problem, the spy in division of wave front face Property also considers illuminating bundle EL1, the NA (numerical aperture) of projected light beam EL2 is designed.

Fig. 5 is to be greatly exaggerated to show the lighting area exposed on light shield M in the faces XZ (plane vertical with first axle AX1) The figure of the state of the illuminating bundle EL1 of domain IR and the projected light beam EL2 of illuminable area IR reflections.As shown in figure 5, above-mentioned photograph Bright optical system IL by the chief ray of the projected light beam EL2 of the illumination region IR reflections of light shield M so as to become telecentricity (collateral series System) mode, the chief ray that will expose to the illuminating bundle EL1 of the illumination region IR of light shield M is (vertical with axis AX1 in the faces XZ Plane) in be set as non-telecentricity state consciously, be set as telecentricity state in the YZ planes (parallel with median plane CL).According to This characteristic of Mingguang City beam EL1 is that cylindrical lens 54 shown in Fig. 4 assigns.Specifically, when setting is from the P1 of light shield face Illumination region IR circumferential central point Q1 by and towards first axle AX1 line, 1/2 with the radius Rm of light shield face P1 When round intersection point Q2, with from illumination region IR by illuminating bundle EL1 each chief ray on the faces XZ towards intersection point Q2's Mode sets the curvature of the pillar lens face of cylindrical lens 54.Like this, the projected light beam reflected in illumination region IR Each chief ray of EL2 becomes the state with the straight line parallel (telecentricity) by first axle AX1, point Q1, intersection point Q2 in the faces XZ.

Then, to carried out using projection optical system PL multiple view fields (exposure area) PA1 of projection exposure~ PA6 is illustrated.As shown in figure 3, multiple illumination regions on multiple view field PA1~PA6 in substrate P and light shield M IR1~IR6 is configured accordingly.That is, multiple view field PA1~PA6 in substrate P are across median plane CL, in carrying side To upstream side substrate P on configure the first view field PA1, third view field PA3 and the 5th view field PA5, The second view field PA2, the 4th view field PA4 and the 6th view field are configured in the substrate P in the downstream side of carry direction PA6.Each view field PA1~PA6 is in the short side and long side extended with the width direction (Y-direction) along substrate P Elongated trapezoidal (rectangle) region.At this point, trapezoidal each view field PA1~PA6, which is its short side, is located at the sides median plane CL And its long side is located at the region in outside.First view field PA1, third view field PA3 and the 5th view field PA5 exist It is spaced as defined in being separated by width direction to configure.In addition, the second view field PA2, the 4th view field PA4 and the 6th View field PA6 is spaced as defined in being separated by the direction of the width to configure.At this point, the second view field PA2 is configured in the axial direction Between the first view field PA1 and third view field PA3.Similarly, third view field PA3 is configured in the axial direction Between second view field PA2 and the 4th view field PA44.4th view field PA4 is configured at third projection in the axial direction Between region PA3 and the 5th view field PA5.5th view field PA5 be configured in the axial direction the 4th view field PA4 with Between 6th view field PA6.Each view field PA1~PA6 is in the same manner as each illumination region IR1~IR6, in the Y direction Mode (the weight overlapped in the carry direction of substrate P between the triangular part in the bevel edge portion of upper adjacent trapezoidal view field PA Folded mode) configuration.At this point, view field PA become so that adjacent view field PA repeat region light exposure with Substantially the same shape of light exposure in unduplicated region.Moreover, the first~the 6th view field PA1~PA6 is configured At the entire width in the Y-direction for covering the exposure area A7 exposed in substrate P.

Herein, in fig. 2, when being observed in the faces XZ, in the illumination region IR1 (and IR3, IR5) on light shield M The perimeter of heart point to the central point of illumination region IR2 (and IR4, IR6) is set to：With from the substrate P for copying bearing surface P2 On view field PA1 (and PA3, PA5) central point to the second view field PA2 (and PA4, PA6) central point Perimeter be substantially equal.

Projection optical system PL is correspondingly equipped with multiple with multiple view field PA1~PA6

(being, for example, 6 in the first embodiment).Multiple projection optical system (segmentation projection optical system) PL1~ In PL6, the multiple projected light beam EL2 reflected from multiple illumination region IR1~IR6 are injected respectively.Each projection optical system PL1 ~PL6 will respectively be conducted by each projected light beam EL2 of light shield M reflection to each view field PA1~PA6.That is, the first projected light System PL1 conducts the projected light beam EL2 from the first illumination region IR1 to the first view field PA1, similarly, second ~the six projection optical system PL2~PL6 will be passed from each projected light beam EL2 of the second~the 6th illumination region IR2~IR6 It is directed at the second~the 6th view field PA2~PA6.Multiple projection optical system PL1~PL6 across median plane CL, configured with The first, third, the 5th view field PA1, PA3, PA5 side

(left side of Fig. 2) configures the first projection optical system PL1, third projection optical system PL3 and the 5th projected light System PL5.First projection optical system PL1, third projection optical system PL3 and the 5th projection optical system PL5 are in Y It is spaced as defined in being separated by direction to configure.In addition, multiple projection optical system PL1~PL6 are being configured across median plane CL Have second, the four, the 6th view field PA2, PA4, PA6 side (right side of Fig. 2) configure the second projection optical system PL2, 4th projection optical system PL4 and the 6th projection optical system PL6.Second projection optical system PL2, the 4th projection optics System PL4 and the 6th projection optical system PL6 is spaced as defined in being separated by the Y direction to configure.At this point, the second projected light System PL2 is configured in the axial direction between the first projection optical system PL1 and third projection optical system system PL3.Equally Ground, third projection optical system PL3, the 4th projection optical system PL4, the 5th projection optical system PL5 are configured in the axial direction Between second projection optical system PL2 and the 4th projection optical system PL4, third projection optical system PL3 and the 5th projection Between optical system PL5, between the 4th projection optical system PL4 and the 6th projection optical system PL6.In addition, the first projected light System PL1, third projection optical system PL3 and the 5th projection optical system PL5 and the second projection optical system PL2, 4th projection optical system PL4 and the 6th projection optical system PL6 are configured to when from Y-direction be symmetrical.

Referring again to Fig. 4, illustrated for each projection optical system PL1~PL6.Further, since each projection optics system PL1~the PL6 that unites is same structure, so with the first projection optical system PL1 (hereinafter simply referred to as projection optical system PL) It illustrates as an example.

Projection optical system PL is by the picture of the mask pattern on the illumination region IR (the first illumination region IR1) on light shield M The view field PA being projected in substrate P.Projection optical system PL from the light incident side of the projected light beam EL2 from light shield M successively With above-mentioned quarter wave plate 41, above-mentioned polarising beam splitter PBS and projection optics module PLM.

Quarter wave plate 41 and polarising beam splitter PBS can be with lamp optical system IL dual-purposes.In other words, light optics System IL and projection optical system PL shares quarter wave plate 41 and polarising beam splitter PBS.

As shown in fig. 7, the projected light beam EL2 of illuminable area IR (with reference to Fig. 3) reflections is that each chief ray is mutually parallel The light beam of telecentricity, and it is incident to projection optical system PL shown in Fig. 2.As the illuminable area IR circularly polarized lights reflected Projected light beam EL2 after circularly polarized light is converted to rectilinearly polarized light (P polarization light), is being incident to polarised light by quarter wave plate 41 Beam splitter PBS.The projected light beam EL2 of polarising beam splitter PBS is incident to after polarising beam splitter PBS transmissions, is incident to Projection optics module PLM shown in Fig. 4.

As an example, polarising beam splitter PBS is bonded the prism (quartz system) of two triangles in the faces XZ, or Person is kept by optical contact to contact, rectangular on the whole.In order to which polarised light separation is effectively performed, in the fitting The multilayer film containing hafnium oxide etc. is formed on surface.Moreover, by the polarized light beam splitting of the projected light beam EL2 incidences from light shield M The face of device PBS and projected light beam EL2 is penetrated to the first reflecting surface P3 of the first deflecting member 70 of projection optical system PL The face gone out is set as vertical relative to the chief ray of projected light beam EL2.Moreover, the polarising beam splitter that illuminating bundle EL1 is incident to The face of PBS is set as vertical (with reference to Fig. 4) with the primary optic axis BX1 of lamp optical system IL.In addition, because using adhesive And in the case of worrying the tolerance to ultraviolet light or laser, the coating surface of polarising beam splitter PBS is applied without using viscous The engagement of the optical contact of mixture.

The projected light beam EL2 of illuminable area IR reflections is the light beam of telecentricity, is incident to projection optical system PL.As The projected light beam EL2 of the circularly polarized light of illuminable area IR reflections is being converted to linear polarization by quarter wave plate 41 from circularly polarized light After light (P polarization light), it is incident to polarising beam splitter PBS.Be incident to the projected light beam EL2 of polarising beam splitter PBS from After polarising beam splitter PBS transmissions, it is incident to projection optics module PLM.

Projection optics module PLM is correspondingly arranged with light optics module ILM.That is, the first projection optical system PL1 Projection optics module PLM will be by the first illumination region of the light optics module ILM illumination of the first lamp optical system IL1 The picture of the mask pattern of IR1 is projected in the first view field PA1 in substrate P.Similarly, the second~the 6th projection optics system The projection optics module PLM of system PL2~PL6 will be by the projection optics module of the second~the 6th lamp optical system IL2~IL6 The picture of the mask pattern of second~the 6th illumination region IR2~IR6 of ILM illuminations is projected in the second~the 6th throwing in substrate P Shadow zone domain PA2~PA6.

As shown in figure 4, there is projection optics module PLM the picture for making the mask pattern on illumination region IR to image in centre The first optical system 61 of image planes P7 makes at least part reimaging for the intermediary image being imaged by the first optical system 61 in base The second optical system 62 of the view field PA of plate P and the perspective view for being configured at the intermediate image plane P7 for being formed with intermediary image Diaphragm 63.In addition, also there is projection optics module PLM focus to correct optical component 64, as offset optical component 65, multiplying power It corrects with optical component 66, rotation correction mechanism 67 and polarization adjustment mechanism (polarization adjustment unit) 68.

First optical system 61 and the second optical system 62 are obtained from for example making Dai Sen (Dyson) system variant The reflection and refraction optical system of telecentricity.The optical axis (hereinafter referred to as the second optical axis BX2) of first optical system 61 and median plane CL It is substantially orthogonal.First optical system 61 has the first deflecting member 70, the first lens group 71, the first concave mirror 72.First Deflecting member 70 is the triangular prism with the first reflecting surface P3 and the second reflecting surface P4.First reflecting surface P3 is that reflection comes from The projected light beam EL2 of polarising beam splitter PBS makes the projected light beam EL2 of reflection be incident to first by the first lens group 71 The face of concave mirror 72.Second reflecting surface P4 is that the projected light beam EL2 reflected by the first concave mirror 72 is made to pass through the first lens group 71 and face incident, and that incident projected light beam EL2 is reflected to perspective view diaphragm 63.First lens group 71 includes various The optical axis of lens, various lens is configured on the second optical axis BX2.First concave mirror 72 configures the light in the first optical system 61 On pupil face, it is set as the relationship with the multiple point light source pictures generated by fly's-eye lens 52 with optical conjugate.

Projected light beam EL2 from polarising beam splitter PBS is reflected by the first reflecting surface P3 of the first deflecting member 70, From the field of view of the top half of the first lens group 71 by by be incident to the first concave mirror 72.It is incident to the first concave mirror 72 projected light beam EL2 is reflected by the first concave mirror 72, and from the field of view of the lower half portion of the first lens group 71 by by It is incident to the second reflecting surface P4 of the first deflecting member 70.The projected light beam EL2 for being incident to the second reflecting surface P4 is anti-by second Penetrate face P4 reflection, from focus correct optical component 64 and as offset optical component 65 by by be incident to perspective view light Door screen 63.

Perspective view diaphragm 63 has the opening of the shape of regulation view field PA.That is, the opening of perspective view diaphragm 63 Shape carry out the actual shape of regulation view field PA.Therefore, it is possible to by the illumination field of view in lamp optical system IL The shape of the opening of diaphragm 55 be set as it is similar with the actual shape of view field PA it is trapezoidal in the case of, omit projection Field stop 63.

Second optical system 62 is structure same as the first optical system 61, across intermediate image plane P7 and the first optics System 61 is symmetrically arranged.The optical axis (hereinafter referred to as third optical axis BX3) of second optical system 62 is substantial with median plane CL It is orthogonal, it is parallel with the second optical axis BX2.Second optical system 62 has the second deflecting member 80, the second lens group 81, second recessed Face mirror 82.Second deflecting member 80 has third reflecting surface P5 and the 4th reflecting surface P6.Third reflecting surface P5 is made from projection The projected light beam EL2 reflection of field stop 63, and make the projected light beam EL2 after reflection from the second lens group 81 by by it is incident To the face of the second concave mirror 82.4th reflecting surface P6 be the projected light beam EL2 that makes to be reflected by the second concave mirror 82 from second thoroughly Microscope group 81 by by face incident, and that make incident projected light beam EL2 be reflected to view field PA.Second lens group 81 includes The optical axis of various lens, various lens is configured on third optical axis BX3.Second concave mirror 82 is configured at the second optical system 62 Pupil plane on, and be set as and image in the first concave mirror 72 multiple point light source pictures have optical conjugate relationship.

Projected light beam EL2 from perspective view diaphragm 63 is reflected by the third reflecting surface P5 of the second deflecting member 80, from The field of view of the top half of second lens group 81 by by be incident to the second concave mirror 82.It is incident to the second concave mirror 82 Projected light beam EL2 reflected by the second concave mirror 82, from the field of view of the lower half portion of the second lens group 81 by by it is incident To the 4th reflecting surface P6 of the second deflecting member 80.The projected light beam EL2 of the 4th reflecting surface P6 is incident to by the 4th reflecting surface P6 reflect, from multiplying power amendment optical component 66 by by be projected to view field PA.Light shield on illumination region IR as a result, The picture of pattern with etc. multiplying powers (× 1) be projected on view field PA.

Focus corrects the configuration of optical component 64 between the first deflecting member 70 and perspective view diaphragm 63.Focus amendment The adjustment of optical component 64 is projected to the focus state of the picture of the mask pattern in substrate P.It is for example that focus, which corrects optical component 64, The prism for keeping two panels wedge-shaped is reversed (reversed in the X direction in Fig. 4) and overlaps made of integral transparent parallel flat. It is slided along bevel direction in the state of the interval between not changing face relative to each other by making a pair of prism so that make For the variable thickness of parallel flat.The effective optical path length of the first optical system 61 is finely adjusted as a result, and to being formed It is finely adjusted in the focus state of the picture of the mask pattern of intermediate image plane P7 and view field PA.

As offset optical component 65 configures between the first deflecting member 70 and perspective view diaphragm 63.As offset is used Optical component 65 is adjusted in image planes in a manner of the picture of mask pattern that can be on mobile projector to substrate P.As offset With optical component 65 by Fig. 4 in the faces XZ tiltable transparent parallel plate glass and Fig. 4 in the faces YZ it is tiltable Transparent parallel plate glass is constituted.By adjusting this respective tilt quantity of two panels parallel plate glass, can make to be formed in The micro offset in the x direction or the y direction of the picture of the mask pattern of intermediate image plane P7 and view field PA.

Multiplying power amendment is configured with optical component 66 between the second deflecting member 80 and substrate P.Multiplying power amendment optics structure Part 66 is for example configured to, and concavees lens, convex lens, concavees lens this 3 are configured at coaxially at predetermined intervals, recessed before and after fixing Lens make intermediate convex lens be moved on optical axis (chief ray) direction.It is formed in the mask pattern of view field PA as a result, Maintain the image formation state of telecentricity as one side, isotropically micro zooms in or out on one side.In addition, constituting multiplying power amendment Optical axis with 3 lens groups of optical component 66 is tilted in the faces XZ in a manner of parallel with the chief ray of projected light beam EL2.

Correction mechanism 67 is rotated for example using actuator (illustration omitted), makes the first deflecting member 70 around parallel with Z axis The micro rotation of axis.The rotation correction mechanism 67 can make to be formed in intermediate image plane P7's by the rotation of the first deflecting member 70 The micro rotation in intermediate image plane P7 of the picture of mask pattern.

Adjustment mechanism 68 is polarized for example using actuator (illustration omitted), and quarter wave plate 41 is made to be revolved around the axis orthogonal with plate face Transfer adjustment polarization direction.Polarization adjustment mechanism 68, can be to being projected to view field PA's by making 1/4 wave plate 41 rotate The illumination of projected light beam EL2 is adjusted.

In the projection optical system PL constituted in this way, the projected light beam EL2 from light shield M is from illumination region IR is projected with the state (state that each chief ray is mutually parallel) of telecentricity, and passes through quarter wave plate 41 and polarising beam splitter PBS and be incident to the first optical system 61.The projected light beam EL2 of the first optical system 61 is incident to by the first optical system 61 The first deflecting member 70 the first reflecting surface (plane mirror) P3 reflections, and pass through from the first lens group 71 by the first concave mirror 72 reflections.The projected light beam EL2 reflected by the first concave mirror 72 again from the first lens group 71 by by by the first deflecting member 70 the second reflecting surface (plane mirror) P4 reflections, and transmit overfocus and correct optical component 64 and as offset optical component 65 and be incident to perspective view diaphragm 63.From perspective view diaphragm 63 by projected light beam EL2 by the second optical system 62 Third reflecting surface (plane mirror) P5 of second deflecting member 80 reflects, from the second lens group 81 by by by the second concave mirror 82 Reflection.The projected light beam EL2 reflected by the second concave mirror 82 again from the second lens group 81 by by by the second deflecting member 80 the 4th reflecting surface (plane mirror) P6 reflections, are incident to multiplying power amendment optical component 66.From multiplying power amendment optical component The 66 projected light beam EL2 projected are incident to the view field PA in substrate P, will become apparent from the mask pattern in illumination region IR Picture with etc. multiplying powers (× 1) be projected on view field PA.

In the present embodiment, the second reflecting surface (plane mirror) P4 and the second deflecting member 80 of the first deflecting member 70 Third reflecting surface (plane mirror) P5 become and tilt 45 ° of face relative to median plane CL (or optical axis BX2, BX3), and first The first reflecting surface (plane mirror) P3 of deflecting member 70 and the 4th reflecting surface (plane mirror) P6 of the second deflecting member 80 are set as With median plane CL (or optical axis BX2, BX3) at the angle other than 45 °.When point Q1, intersection point Q2, will be passed through in Figure 5 When the straight line of one axis AX1 is set as θ ° with median plane CL angulations, by the first reflecting surface P3 phases of the first deflecting member 70 α °=45 °+θ °/2 relationship is determined as the angle [alpha] ° (absolute value) of median plane CL (or optical axis BX2).Similarly, when It will be along the key light of the circumferential projected light beam EL2 by the central point in view field PA of the peripheral surface of substrate supporting cylinder 25 It, will be opposite in the 4th reflecting surface P6 of the second deflecting member 80 when line is set as ε ° with angles of the median plane CL in ZX planes It is determined as β °=45 °+ε °/2 relationship in the angle beta ° (absolute value) of median plane CL (or optical axis BX2).In addition, angle ε roots According to the sides light shield M of projection optical system PL, substrate P side structure on size, polarising beam splitter PBS equidimensions, illumination Size in the circumferential direction of region IR or view field PA etc. and it is different, but be set as 10 °~30 ° or so.

Relationship > between the projection image planes and the plane of exposure of substrate of the pattern of < light shields

Fig. 7 is the projection image planes Sm for the cylindric pattern plane P1 for large showing light shield M and bearing is cylindric base The definition graph of relationship between the plane of exposure Sp of plate P.Then, with reference to Fig. 7, in the exposure device U3 of first embodiment Relationship between the projection image planes and the plane of exposure of substrate of the pattern of light shield illustrates.

Projected light beam EL2 by being imaged by exposure device U3 by projection optical system PL, to form the pattern of light shield M Project image planes Sm.Projection image planes Sm is the position that the pattern of light shield M is imaged, and is the position for reaching optimum focusing.In addition, The surface of the position other than optimum focusing can be used to replace projection image planes Sm.For example, it can be formed in Face of the optimum focusing at a distance of the position of predetermined distance.Herein, it is Rm that being configured with as described above on light shield M, which has radius of curvature, Curved surface (being curve in ZX planes).The projection multiplying power of projection optical system PL such as set to multiplying powers, as a result, in conduct In the range of the exposed width 2A of size in the circumferential direction of view field PA, also will projection image planes Sm approximatively regard as with A part for the curved surface that radius of curvature centered on the center line AX1 ' extended in Y-direction is Rm.In addition, as noted previously, as Substrate P is kept by the bearing surface P2 of the substrate supporting cylinder 25 of cylindrical shape, so the plane of exposure Sp on the surface of substrate P is curvature Radius is a part for the curved surface (being curve in ZX planes) of Rp.If moreover, as the center of curvature for projecting image planes Sm Center line AX1 ' and the central shaft AX2 of substrate supporting cylinder 25 be parallel to each other and included in the plane KS parallel with YZ planes, Then plane KS is located at the midpoint of exposed width 2A, moreover, being Rp positioned at the projection image planes Sm for being Rm included in radius and radius The tangent Y-directions of plane of exposure Sp on position including the tangent line Cp that extends.In addition, for convenience of description, the half of plane of exposure Sp The radius Rm of diameter Rp and projection image planes Sm is set as the relationship of Rp > Rm.

Herein, it keeps the cylinder roller 21 of light shield M to be driven by the first driving portion 22 and rotated with angular velocity omega m, supports base The substrate supporting cylinder 25 of plate P (plane of exposure Sp) is driven by the second driving portion 26 and is rotated with angular velocity omega p.In addition, will be with plane KS it is orthogonal and include project image planes Sm and plane of exposure Sp tangent line Cp including face as reference plane HP.It is assumed that reference plane HP It is parallel with the faces XY, and reference plane HP is mobile with imaginary movement speed V (at the uniform velocity) in the X direction.Movement speed V and throwing The movement speed (peripheral speed) of image plane Sm and plane of exposure Sp in the circumferential is consistent.It (throws the exposure area of present embodiment Shadow zone domain PA) on the direction parallel with reference plane HP, centered on the tangent line Cp of the projection image planes Sm and plane of exposure Sp, Using width 2A as width.That is, exposure area (view field PA) is included on the moving direction of reference plane HP, from projection Region until the tangent line Cp to the position for moving distance A to +X direction and -X direction respectively of image planes Sm and plane of exposure Sp.

Since projection image planes Sm on the face of radius of curvature R m with angular velocity omega m by being rotated, so being located at tangent line The specified point on projection image planes Sm on Cp is only rotating θ m=ω mt after time t.Therefore, when on reference plane HP When observation, which is located at the point Cp1 only to +X direction movement Xm=RmSin (θ m).On the other hand, when positioned at tangent line When above-mentioned specified point on Cp is moved linearly along reference plane HP with movement speed V, which is located at after time t The point Cp0 of Vt is only moved to +X direction.Therefore, when the specified point on tangent line Cp is moved along projection image planes Sm and on edge The departure Δ 1 of the amount of movement in the X-direction after time t when reference plane HP linear movements is Δ 1=Vt-Xm =Vt-RmSin (θ m).

Similarly, since plane of exposure Sp on the face of radius of curvature R p with angular velocity omega p by being rotated, so working as When being observed on reference plane HP, the specified point on the plane of exposure Sp on tangent line Cp is only rotating θ p=ω after time t p·t.Therefore, the specified point on plane of exposure Sp is located at the point Cp2 only to +X direction movement Xp=RpSin (θ p).Cause This, passes through time t when the specified point on tangent line Cp is moved along plane of exposure Sp and when moving linearly along reference plane HP The departure Δ 2 of the amount of movement in X-direction afterwards is Δ 2=Vt-Xp=Vt-RpSin (θ p).Above-mentioned departure Δ 1, Δ 2 are also referred to as projection error when by the spot projection in barrel surface in plane (reference plane HP).As previously in Fig. 5 As middle explanation, in the present embodiment, in the view field PA of exposed width 2A shown in Fig. 7, the pattern of light shield M Projection image plane of exposure Sp is projected onto with the state of telecentricity.That is, in the faces XZ, project each point on image planes Sm along with it is flat Line (line vertical with reference plane HP) parallel face KS projects on plane of exposure Sp.Therefore, with the point Cp0 phases on reference plane HP Point Cp1 (position Xm) on corresponding projection image planes Sm is also projected to the position in identical X-direction on plane of exposure Sp The position Xp of Xm, the position Xm of point Cp1 and the point Cp2 on plane of exposure Sp corresponding with the point Cp0 on reference plane HP it Between generate deviation.The main reason for deviation is that the radius Rm of projection image planes Sm is different from the radius Rp of plane of exposure Sp.

Like this, differentiated in radius Rm and radius Rp, the point Cp1 on projection image planes Sm shown in fig. 7 Departure Δ 1 and plane of exposure Sp on point Cp2 departure Δ 2 between difference component Δ (=Δ 1- Δs 2), it is wide with exposure The position of X-direction in degree 2A correspondingly gradually changes.Therefore, to because of projection image planes Sm and exposure in exposed width 2A The difference component Δ for the deviation that the semidiameter (Rm/Rp) of face Sp generates carries out quantification (emulation), and thereby, it is possible to set to consider The best conditions of exposure of the quality (quality of projection image) of pattern on projection exposure to substrate P.In addition, difference component Δ Projection error referred to as when cylindric projection image planes Sm to be transferred on cylindric plane of exposure Sp.

Fig. 8 A are as an example, the radius Rm for projecting image planes Sm to be set as 125mm, by the radius Rp of plane of exposure Sp It is set as 200mm, in the peripheral speed (being set as Vp) one of the peripheral speed (being set as Vm) and plane of exposure Sp that make projection image planes Sm In the state of causing, being movement speed V, in the range of ± the 10mm as exposed width 2A, above-mentioned departure Δ is calculated 1, the curve graph of the variation of Δ 2 and difference component Δ.In fig. 8 a, horizontal axis indicates that (plane KS is logical with the center of view field PA The position crossed) as the Zuo Biaoweizhi &#91 on the reference plane HP of origin;mm&#93;, the longitudinal axis indicates calculated departure Δ 1, Δ 2, poor Component Δ &#91;μm&#93;.As shown in Figure 8 A, the feelings consistent with the peripheral speed Vp of plane of exposure Sp in the peripheral speed Vm of projection image planes Sm Under condition, the absolute value of difference component Δ is with from the position (origin) of projection image planes Sm and tangent line Cp tangent plane of exposure Sp to ± X Direction is separate and becomes larger.For example, being transferred in order to carry out the loyal of pattern that minimum feature is several μm~10 μm or so And in the case that the absolute value of difference component Δ is limited in 1 μm or so, according to the result of calculation of Fig. 8 A, need view field The exposed width 2A of PA is set as ± 6mm (being 12mm on width) below.

If in addition, the peripheral speed of the pattern plane for the light shield M that cylinder roller 21 is kept is set to Vf, according to throwing The peripheral speed Vm for projecting image planes Sm is set as the relationship of Vm=β Vf by the projection multiplying power β of shadow optical system PL.For example, If projection multiplying power β be 1.00 (etc. multiplying powers), the peripheral speed Vp of the peripheral speed Vf and plane of exposure Sp of the pattern plane of light shield M Be set to it is equal, if projection multiplying power β be 2.00 (being amplified with 2 times), be set as 2Vf=Vp.Usually, such as Fig. 8 A institutes Show, since each peripheral speed of projection image planes Sm and plane of exposure Sp is set as Vm=Vp, so so that the relationship of β Vf=Vp The mode that (length velocity relation of benchmark) is set up critically controls the substrate of the cylinder roller 21 and supporting substrates P that keep light shield M Support the angular velocity of rotation of cylinder 25.But as shown in Fig. 8 C as be described hereinafter, to projecting the peripheral speed Vm of image planes Sm The difference that very little is assigned with the peripheral speed Vp of plane of exposure Sp, the case where how variation come the difference component Δ in the analogous diagram 8A that tries Under, by assigning the difference of very little to peripheral speed Vm and peripheral speed Vp, can the absolute value of difference component Δ limited very Expand the exposed width 2A that can be utilized in the state of small.In the present embodiment, the radius Rp based on plane of exposure Sp, which is more than, throws The peripheral speed Vp of plane of exposure Sp is set as the peripheral speed relative to projection image planes Sm by the condition of the radius Rm of image plane Sm Vm is lower.Specifically, so that the peripheral speed Vp of plane of exposure Sp is constant and makes a little higher than figures of peripheral speed Vm of projection image planes Sm The mode of the movement speed V of reference plane HP shown in 7 is only the angular velocity of rotation ω m for projecting the side image planes Sm (light shield M) Go out some changes.It sets the angular speed after change to ω m ', the rotation angle of the projection image planes Sm after time t is set It is set to θ m '.When trying to be set as being higher by a little only with respect to movement speed V by the peripheral speed Vm for projecting image planes Sm, to calculate partially When residual quantity Δ 1, the curve of the curve graph of the departure Δ 1 in Fig. 8 A is become in a manner of becoming with negative slope in origin 0 Change.

Therefore, in the present embodiment, using such tendency, with the position in exposed width 2A and across origin 0 The mode that the difference component Δ of symmetrical two positions is zero projects the peripheral speed Vm (angular velocity omegas of image planes Sm to set m').Fig. 8 B be the difference component Δ obtained after the peripheral speed Vm for indicating change projection image planes Sm, departure Δ 1, Δ 2 it is each The definition of the curve graph of result of calculation, the longitudinal axis and horizontal axis is identical as Fig. 8 A.In the fig. 8b, the curve graph of departure Δ 2 and Fig. 8 A In curve graph it is identical, but each position and origin 0 of+5mm of the curve graph of departure Δ 1 in exposed width, -5mm On, the angular velocity omega m ' (θ m ') of projection image planes Sm is set in such a way that departure Δ 1 is zero.As a result, difference component Δ Position in exposed width in the range of ± 4mm with negative slope variation, on the outside in the range of become with positive slope Change, everybody of origin 0 ,+6.4mm, -6.4mm in exposed width is set to zero.

In the case where the range that can allow for as difference component Δ is such as ± 1 μm or so, Fig. 8 A's in front Under the conditions of exposed width be ± 6mm, but exposed width under conditions of Fig. 8 B is expanded to ± 8mm or so.This meaning It, the size in the scan exposure direction (circumferential direction) of view field PA can be increased to 16mm (about increasing by 33%) from 12mm, If the illumination of the illumination light of exposure is identical, the fidelity of pattern transfer need not be reduced, just puies forward the transporting velocity of substrate P High about 33% improves productivity.Make imparting substrate P in addition, can the size of view field PA be increased 33% and also implied that Light exposure only increase this tittle, conditions of exposure can be mitigated.In addition, exposure device U3 can utilize high de-agglomeration energy on one side Rotary encoder measures the rotation of the rotation for the cylinder roller 21 for keeping light shield M and the substrate supporting cylinder 25 of supporting substrates P respectively And SERVO CONTROL is carried out, the difference of small rotary speed is generated thereby, it is possible to one side, carries out high-precision rotation control on one side.

In the movement speed V that the peripheral speed Vp of plane of exposure Sp is equal to reference plane HP, the circle of image planes Sm will be projected In the case that circular velocity Vm is set as the movement speed V of a little higher than reference plane HP, difference component Δ shown in Fig. 8 A is as shown in Figure 8 C Ground changes.Fig. 8 C show tendency in the case of following, that is, only for the curve graph of the difference component Δ in Fig. 8 A, will throw The peripheral speed Vm of image plane Sm relative to the change rate of the peripheral speed Vp (=V) of plane of exposure Sp be set as α (=(Vm-Vp)/ Vp) %, so that α is changed+0.01% every time from ± 0%.In the curve graph and Fig. 8 A of the difference component Δ of α=± 0% in Fig. 8 C The curve graph of difference component Δ is identical.In the case of change rate α=± 0%, peripheral speed Vm and peripheral speed Vp is in one The state of cause, for example, in the case of change rate α=+ 0.02%, peripheral speed Vm is in bigger than peripheral speed Vp by 0.02% State.Based on being calculated as shown in Fig. 8 C, in the fig. 8b, make the peripheral speed Vm of projection image planes Sm relative to benchmark The reference speed V (=Vp) of face HP is emulated in the state of increasing about 0.026%.The simulation result of Fig. 8 C be pass through by The θ m of RmSin (θ m) in the mathematical expression solved to the departure Δ 1 of the reference plane HP relative to projection image planes Sm are replaced It is changed to (1+ α) θ m and change rate α is carried out obtained from various changes.In fact, when V t are replaced with expression exposure When the A of the position (mm) in the X-direction of width, difference component Δ can simply be found out by following formula.

Δ=Δ 1- Δs 2=(A-RmSin ((1+ α) A/Rm))-Δ 2

As described above, in the case where projecting the radius Rp differences of radius Rm and plane of exposure Sp of image planes Sm, by throwing Each movement speed (peripheral speed Vm, Vp) of image plane Sm and plane of exposure Sp assigns the difference of very little, when can expand scan exposure Various conditions of exposures (sensitivity of the radius, photosensitive layer of light shield M, the transporting velocity of substrate P, the work(of illuminating light source Rate, the size etc. of view field PA) setting range, the exposure device that can neatly cope with change of technique etc. can be obtained.

Hereinafter, assigning very little to each peripheral speed Vm, Vp of projection image planes Sm and plane of exposure Sp as shown in Figure 8 B In the case of difference, with reference to Fig. 9, illustrated for the contrast of the pattern image obtained on plane of exposure Sp.Fig. 9 is shown below Curve graph：The position (absolute value) for taking the exposed width that the origin 0 in Fig. 8 A, 8B is set as to 0mm on transverse axis, in the longitudinal axis On take the value by origin 0 to be set as the contrast ratio of 1.00 (100%), there is no circumference between projecting image planes Sm and plane of exposure Sp The case where speed difference (Fig. 8 A) and with difference the case where (Fig. 8 B) under, calculated and the position in exposed width Corresponding contrast than variation curve graph.In the present embodiment, by the wavelength of illuminating bundle EL1 (exposure light) λ is set as 365nm, the numerical aperture NA of projection optical system PL (PLM) shown in Fig. 4 is set as 0.0875, by process constant k It is set as 0.6.Since the maximum resolution ratio Rs obtained under this condition obtains 2.5 μm according to Rs=k (λ/NA), so 2.5 μm of L&amp has been used in accordance with calculating;S (Xian &Interval) pattern.

As shown in figure 9, larger by the curvature in the plane of exposure Sp on the projection image planes Sm and substrate P by mask pattern The peripheral speed Vp of a surface side be set to slightly less than another peripheral speed Vm, come make to obtain high contrast than exposure it is wide The range of degree expands.For example, needing the contrast ratio to be to maintain the quality for the pattern image being transferred on plane of exposure Sp In the case of 0.8 or so, the exposed width under the state (Vm=Vp) of not difference is ± 6mm or so, therewith Relatively, the exposed width under the state (Vm > Vp) with difference can ensure in ± 8mm or more.If in addition, right May be 0.6 or so than degree ratio, then the exposed width under the state (Vm > Vp) with difference can be expanded to ± 9.5mm or so.As described above, being assigned by the peripheral speed Vp of peripheral speed Vm and plane of exposure Sp to projecting image planes Sm The difference of very little, even if increasing that view field PA can realize if size (the exposed width 2A) on scan exposure direction will be by The contrast (picture quality) of the pattern image of projection is maintained good pattern exposure.In addition, since projected area can be increased Exposed width 2As of the domain PA on scan exposure direction so the transporting velocity of substrate P can be further increased, or is reduced The illumination of the exposure light (projected light beam EL2) of per unit area in view field PA.

In addition, as shown in Fig. 8 C of front, gradually changes difference (Vm-Vp) a little on one side, emulate phase on one side For the position of exposed width difference component Δ in the case of, preferably by the projection image planes Sm of the pattern in view field PA It is set with the average value or maximum value of the difference component Δ of the offset on scan exposure direction of the plane of exposure Sp in substrate P For the minimum feature (minimum dimension) less than the pattern image that should be transferred.For example, when being conceived in the exposed width in Fig. 8 B For exposed width in the range of 0mm~+6mm, the average value of difference component Δ in the range is about -0.42 μm, maximum value About -0.66 μm.In addition, when being conceived to range of the exposed width in 0mm~+8mm, difference component Δ in the range Average value be about -0.18 μm, maximum value be about+1.2 μm.If the minimum feature for the pattern image that should be transferred is set as 2.5 μm set when carrying out the emulation of Fig. 9 of front, then reach the range of 6mm in exposed width and exposed width reach In the range of 8mm, the average value of difference component Δ, maximum value can be contracted to be less than 2.5 μm of minimum feature.

In addition, as shown in Fig. 8 B of front, in the variation characteristic by emulating the difference component Δ found out, preferably in reality The position that difference component Δ is zero is at least set in the exposed width (sizes of the view field PA on scan exposure direction) on border 3.For example, in the case where view field PA to be set as to the exposed width of ± 8mm, during scan exposure, projection is extremely The position of -8mm of the point out of exposed width in pattern image in view field PA is moved to the position of+8mm.Herein During, a point in pattern image respectively by difference component Δ be zero position -6.4mm, position 0mm (origin), position+ 6.4mm and be transferred on plane of exposure Sp.In this way, by in the exposed width on the scan exposure direction of view field PA At least three position on make the mode that difference component Δ is zero, critically control keeps the cylinder roller 21 and substrate branch of light shield M Each rotary speed of cylinder 25 is held, can will be exposed to the pattern image of (plane of exposure Sp) in view field PA in scan exposure direction On size (line width) limits of error be made smaller, thus allow for loyal pattern transfer.

As previously explained above, maximum resolution ratio Rs is according to the sides projection image planes Sm of projection optical system PL (usual 1 or less) is determined by Rs=k (λ/NA) by numerical aperture NA, the wavelength X of illuminating bundle EL2, process constant k. In this case, when the movement speed of reference plane HP is set as V, the displacement distance of reference plane HP is set as x, by exposed width Absolute value when being set as A, preferably satisfy following relationships.

&#91;Mathematical expression 1&#93;

&#91;Mathematical expression 2&#93;

The mathematical expression F (x) is the formula of the difference component Δ for the position x for indicating some point on reference plane HP, such as reference As Fig. 7 is illustrated, the relationship of the movement speed V and displacement distance x of reference plane HP are equivalent to time t (=x/V).This reality The exposure device U3 of mode is applied by meeting above-mentioned mathematical expression, even if increasing the exposed width of effective view field PA The contrast for the pattern image being projected need not be reduced, pattern can be formed in substrate P with good picture quality.

In addition, the exposure device U3 of present embodiment can replace the cylinder roller 21 for keeping light shield M.For reflection-type Cylinder light shield in the case of, high reflection portion as mask pattern can be directly formed on the peripheral surface of cylinder roller 21 With low reflecting part (light absorption department).In this case, light shield replacement is carried out to each cylinder roller 21.At this point, making sometimes It is re-installed in the radius (diameter) of the cylinder roller 21 of the reflection-type cylinder light shield of exposure device and the circle for replacing preceding installation The radius of cylinder light shield is different.This is to change the size (size etc. of display panel) that be exposed to the device in substrate P In the case of etc. may occur.In the present embodiment, even in this case, based on the cylinder roller 21 after replacement The radius in mask pattern face carries out the calculating (emulation) such as Fig. 8 A~8C, Fig. 9, and thereby, it is possible to determine in advance should be to cylinder The exposed width for the view field PA that roller 21 and the angular velocity of rotation of the setting of substrate supporting cylinder 25 are poor, should set should be adjusted The illumination of whole illuminating bundle EL2 or the transporting velocity (rotary speed of substrate supporting cylinder 25) for the substrate P that should be adjusted Etc. parameters.In addition, being replaceably mounted radius Rm with the different multiple cylinder rollers of such as millimeter unit or centimetre unit In the case of 21, it is equipped in z-direction to the bearing portion of the exposure device side of the Pivot axle AX1 of supporting cylinder roller 21 The mechanism being adjusted.In addition, in the parameter as adjustment, and change the exposure on the scan exposure direction of view field PA In the case of width, it can be carried out using the field stop 63 of illuminated field diaphragm 55 or intermediate image plane P7 in such as Fig. 4 Adjustment.As described above, exposure device U3 (substrate board treatment) is by adjusting above-mentioned various parameters, it can be corresponding with light shield M Ground suitably adjusts conditions of exposure, thus allows for the exposure for adapting to light shield M.

Exposure device U3 be preferably based on according to the conditional as defined in the relationship between projection image planes Sm and plane of exposure Sp and The value that is calculated, the value being also calculated based on the measurement results such as flexible with reference to the substrate P in manufacturing process, to adjust The movement speed for the substrate P that integral basis is kept in substrate holding mechanism 12 (substrate supporting cylinder 25) and the scanning of view field PA The width of exposure directions it is at least one.Exposure device U3 can automatically adjust various conditions as a result,.

The width of the entire area of the pattern of display panels of the exposure device U3 of present embodiment on being formed in substrate P etc. Under the premise of spending the size on the directions axis AX2 of the size on direction more than view field PA, with a projection optical system PL The modes that are arranged as shown in the right part of Fig. 3 of view field PA be equipped with 6 projection optical system PL1~PL6, but according to The width of substrate P, the quantity can be one, can also be 7 or more.

Preferably, it in the case where multiple projection optical system PL are arranged in the width direction of substrate P, is scanning The light exposure being accumulated by the exposed width of each view field PA when exposure is in the direction orthogonal with scan exposure direction In (width direction of substrate P) anywhere all substantially certain (such as ± a few % within).

&#91;Er Shishifangshi &#93;

Hereinafter, referring to Fig.1 0, the exposure device U3a of second embodiment is illustrated.In addition, in order to avoid repeating Record, illustrate only for the part different from first embodiment, wanted for similarly being constituted with first embodiment Element mark pays reference numeral same as the first embodiment to illustrate.Figure 10 is the exposure dress for showing second embodiment Set the integrally-built figure of (substrate board treatment).The exposure device U3 of first embodiment is to utilize cylindric substrate branch Hold cylinder 25 keep from view field by substrate P structure, but the exposure device U3a of second embodiment be utilize Moveable base supporting mechanism 12a keeps the structure of flat substrate P.

In the exposure device U3a of second embodiment, base supporting mechanism 12a is planar with substrate P is remained Substrate objective table 102 and so that substrate objective table 102 (faces XY) in the plane orthogonal with median plane CL is swept along the X direction Retouch mobile mobile device (illustration omitted).

Since the bearing surface P2 of the substrate P of Figure 10 is substantially the plane parallel with the faces XY, so simultaneously by light shield M reflection The projected light beam EL2 for being incident to projection optics module PLM (PL1~PL6) is set as, when being projeced into substrate P, projected light beam The chief ray of EL2 is vertical with the faces XY.

In addition, in this second embodiment also in the same manner as Fig. 2 of front, when being observed in the faces XZ, from light shield M Illumination region IR1 (and IR3, IR5) central point to the central point of illumination region IR2 (and IR4, IR6) until week Length is set as, and from the central point of the view field PA1 (and PA3, PA5) in the substrate P for copying bearing surface P2 to second Perimeter until the central point of view field PA2 (and PA4, PA6) is substantially equal.

In the exposure device U3a of Figure 10, the mobile device of the also control base board supporting device 12 of slave control device 16 (linear motor of scan exposure or the actuator of fine motion etc.), rotation with cylinder roller 21 synchronously drive substrate Objective table 102.In addition, substrate P in the present embodiment can be the flexible base boards such as resin film, can also be liquid crystal Show the glass plate of panel.Moreover, it is mobile come in the case of implementing scan exposure in the precision by substrate objective table 102, Equipped with by substrate P vacuum suction, in the construction of bearing surface P2, (such as chuck pin (pin chuck) mode, Porous mode is flat Face holder etc.).In addition, in not moving substrate objective table 102 and in the case of being only planar by substrate P bearing, it is equipped with On bearing surface P2 using the gas blanket based on air bearing with low friction state or contactless state come the machine of supporting substrates P Structure (such as plane holder etc. of bernoulli gripper (Bernoulli chuck) mode) is used for as defined in substrate P imparting Tension keeps the tension imparting mechanism of flatness.

Hereinafter, referring to Fig.1 1, to the projection image planes Sm of the pattern of the light shield M in the exposure device U3a of second embodiment Movement and substrate P plane of exposure Sp movement between relationship illustrate.Figure 11 is based on same as Fig. 7 of front Condition and definition large show the relationship between the plane of exposure Sp on the projection image planes Sm and substrate P of the pattern of light shield M Definition graph.

Exposure device U3a forms the projection of the pattern of the light shield M of cylinder planar using the projection optical system PL of telecentricity Image planes Sm.Projection image planes Sm is also the optimum focusing face of the pattern imaging of light shield M.Herein also due to the pattern plane of light shield M is formed The curved surface for being Rm for radius of curvature, so it is Rm that projection image planes Sm, which also becomes the radius of curvature centered on imaginary line AX1 ', Barrel surface (being circular curve in ZX planes) a part.On the other hand, it is kept by substrate objective table 102 due to substrate P For plane, so plane of exposure Sp is plane (being straight line in ZX planes).Therefore, the plane of exposure Sp in present embodiment be with Surface consistent the reference plane HP shown in fig. 7 of front.That is, plane of exposure Sp is considered as radius of curvature R p's infinitely great (∞) Surface, alternatively, the great curved surfaces of radius Rm relative to projection image planes Sm.

Due to projecting image planes Sm by radius of curvature to be rotated with angular velocity omega m on the face of Rm, so projection image planes Point Cp on Sm and projection image planes Sm tangent plane of exposure Sp after time t positioned at only having rotated angle, θ m=ω mt Point Cp1.Therefore, position Xms of the point Cp1 on projection image planes Sm on the direction (X-direction) along reference plane HP becomes Xm =RmSin (θ m).In addition, since plane of exposure Sp is the plane consistent with reference plane HP, so projection image planes Sm and plane of exposure Point Cp on plane of exposure Sp tangent Sp is being located at the point Cp0 that Xp=Vt is moved on only in an X direction after time t.Cause This, such as Fig. 7 explanations using front, on the point Cp1 and plane of exposure Sp on the projection image planes Sm after time t Departure Δs 1 of the point Cp0 in X-direction (scan exposure direction) be Δ 1=Vt-RmSin (θ m).

The departure Δ 1 of Figure 11 is the substrate P or exposure due to light shield M either projects image planes Sm with constant angular velocity movement Projection error (Sin errors) caused by smooth surface Sp uniform rectilinears movement.If in point Cp is located at as in exposed width 2A When on the plane KS of the heart, which is set as zero, then the departure Δ 1 is with far from from the position to ± X-direction And gradually increase.When scan exposure, in the range of the exposed width 2A on the plane of exposure Sp in substrate P, to projecting image planes The pattern image of Sm is continuously added up and is transferred.But because being influenced by the projection error of departure Δ 1 so that turned The size on scan exposure direction of the pattern image of print relative to the size of the pattern on light shield M there is error, transfer to protect True degree declines.

Therefore, in the present embodiment, by projecting image planes Sm and plane of exposure Sp, by radius of curvature it is smaller one Side surface peripheral speed be set to the larger side of a little higher than radius of curvature surface peripheral speed, can obtain with The same effect of first embodiment of front.In the present embodiment, due to the radius of curvature R p of plane of exposure Sp and projection image Relationships of the radius of curvature R m of face Sm with Rp > > Rm relatively slightly carries so compared with the movement speed V of plane of exposure Sp The peripheral speed Vm of height projection image planes Sm.

Hereinafter, using Figure 12~Figure 18, an example of various emulation is performed to the structure using exposure device U3a It illustrates.Figure 12 is the circle for showing movement speed V (identical as peripheral speed Vp) and projection image planes Sm based on plane of exposure Sp Circular velocity Vm has indifference and the curve graph of the variation of the generation of departure Δ 1, the longitudinal axis of Figure 12 is made to indicate the deviation in Figure 11 Δ 1 is measured, exposed width is indicated in the same manner as horizontal axis and Fig. 8 A, 8B.In addition, in each emulation after Figure 12, by the half of light shield M The radius Rm that diameter Rm will project image planes Sm is set as 150mm.As being illustrated in Figure 11, in the movement for making plane of exposure Sp In the case that speed V (peripheral speed Vp) is equal to the peripheral speed Vm of projection image planes Sm, i.e., the feelings in not difference Under condition, when the allowable range of departure Δ 1 is set as ± 1 μm or so, exposed width is the range of ± 5mm or so.

Therefore, if the angular speed for projecting image planes Sm is adjusted to ω m ' (ω m < ω m ') from ω m, make projection image planes Sm's The movement speed V (peripheral speed Vp) of a little higher than plane of exposure Sp of peripheral speed Vm, then departure Δ 1 ' is centered on origin 0 Exposed width ± 4mm in the range of with negative slope variation, with positive slope variation on the outside of the range.If by departure The position on exposed width that Δ 1 ' is zero is set to the place of ± 6.7mm or so, then the allowable range convergence of departure Δ 1 ' In ± 1 μm or so of exposed width be the range of ± 8mm or so.Compared with the case where not assigning difference, this will The exposed width used as scan exposure expands 60% or so.

Hereinafter, in the same manner as Fig. 9 of front, for the movement speed V (=peripheral speed Vp) and projection for making plane of exposure Sp The peripheral speed Vm unanimous circumstances (no difference) of image planes Sm and the situation for assigning small difference (have peripheral speed Difference) under the variation of contrast value (or contrast ratio) of pattern image illustrate.

Figure 13 A show to work as and the numerical aperture NA of the sides plane of exposure Sp of projection optical system PL are set as 0.0875, will be illuminated When the wavelength of light beam EL1 is set as 365nm, process constant is set as to 0.6 and illumination σ is set as 0.7, on it will be formed in light shield M 2.5 μm of maximum resolution Rs=L&The contrast for the picture that S patterns obtain in the case of being projected on plane of exposure Sp. Figure 13 B indicate that isolated line (ISO) pattern of Rs=2.5 μm of the maximum resolution obtained under the conditions of by same projection is thrown The contrast of the picture obtained on plane of exposure Sp in the case of shadow.

Either 2.5 μm of L&S patterns or ISO patterns reach the contrast value of the bright part of picture close to 1.0 and dark Part close to 0 intensity distribution CN1 preferably.Contrast value is the maximum value Imax and dark-part using the luminous intensity of bright part Luminous intensity minimum value Imin, found out according to (Imax-Imin)/(Imax+Imin).Intensity distribution CN1 is generally The state high in contrast, the low state of contrast refer to the maximum value Imax and minimum value Imin as intensity distribution CN2 Difference (amplitude) the case where becoming smaller.The intensity distribution CN1 of the picture shown in Figure 13 A, 13B is 2.5 μm of L&S patterns or The contrast of the static projection image of ISO patterns, but in the case of scan exposure, substrate P setting entire exposure On optical width in a period of movement, such as on one side according to the difference component Δ or departure illustrated in fig. 12 illustrated in Fig. 8 B The variation of Δ 1, to make static intensity distribution CN1 be offset up in scan exposure side, the value being accumulated by one side becomes and turns It prints to the final contrast of the pattern image in substrate P.

Hereinafter, the simulation result being shown below in Figure 14, Figure 15, that is, the projection exposure illustrated in Figure 13 A, 13B Under condition (Rm=150mm, Rp=∞, NA=0.0875, λ=365nm, k=0.6), to the L&amp relative to 2.5 μm;S patterns The result that the variation of the contrast value (contrast ratio) of the position on exposed width of projection image is emulated.Figure 14, The horizontal axis of Figure 15 indicates that the position of the exposed width A of positive side, the longitudinal axis indicate that (Imax-Imin)/(Imax+Imin) is utilized to find out Contrast value and the contrast ratio in the case where the contrast value at exposed width 0mm is standardized as 1.0.Moreover, Figure 14 shows consistent with the projection peripheral speed Vm of image planes Sm in the movement speed V (=peripheral speed Vp) for making plane of exposure Sp Contrast in the case of no difference changes, and Figure 15 is shown as the variation characteristic of the departure Δ 1 ' in Figure 12, Project movement speed Vs (=peripheral speed Vp) of the peripheral speed Vm slightly larger than plane of exposure Sp of image planes Sm has peripheral speed Contrast variation in the case of difference.

As shown in figure 14, in the case of no difference (before amendment), although contrast ratio is in the position of exposed width Substantially certain setting from origin 0 to 4mm or so, but since the position of 5mm or more drastically decline.Moreover, exposure In the case of 8mm or more, contrast is than becoming 0.4 hereinafter, may become to the exposure of photoresist for the position of width Contrast is insufficient.In the position of exposed width be contrast value at 0mm it is about 0.934 in addition, in simulations, contrast Than the value is standardized as 1.0 expressions.

In contrast, in the case where having difference (after amendment) as shown in figure 15, in the position of exposed width Between 0~4mm, contrast ratio gradually decreases down 0.8 or so from 1.0, but the position of exposed width be 4mm~8mm it Between, contrast ratio maintains 0.8 or so.In simulations, it is about for the contrast ratio at 5mm in the position of exposed width 0.77, it is set to the contrast at 7mm in place than being about 0.82.

Like this, by making the peripheral speed Vm of projection image planes Sm be slightly larger than the movement speed V of planar plane of exposure Sp (=peripheral speed Vp), the exposed width 2A for the view field PA that can be set in scan exposure can be increased.

In addition, as shown in figure 16,2.5 μm of ISO patterns in the case of no difference (before amendment) as Contrast is begun slowly to down than being all substantially certain until the position of exposed width is 5mm from 5mm or more Drop, it is about 0.9 to be set in place at 6mm, and it is about 0.6 to be set in place at 8mm, and it is about 0.5 to be set in place at 9mm, and And it is about 0.4 to be set in place at 10mm.In addition, the contrast ratio in Figure 16 is with the position of exposed width in fig. 14 For 2.5 μm of the L&amp obtained at 0mm;On the basis of the contrast value (being about 0.934) of the picture of S patterns, takes and utilize 2.5 μm The ratio for the contrast value (set to 0 in place at mm is about 0.968) that the picture of ISO patterns obtains.Therefore, contrast shown in Figure 16 The initial value (being set to the value at 0mm in place) of ratio is about 1.04.

In contrast, in the case where having difference (after amendment) as shown in figure 17, in the position of exposed width In the range of 0~8mm, the contrast ratio of the picture of 2.5 μm of ISO patterns maintains 0.9 or more, is set at 9mm and declines in place To 0.8 or so, but even if in place be set at 10mm is also maintained at about 0.67.As described above, by making projection image planes Sm The opposite movement speed V (=peripheral speed Vp) for being slightly larger than planar plane of exposure Sp of peripheral speed Vm, can increase and sweep The exposed width 2A for the view field PA that can be set when retouching exposure.

In addition, also following evaluation assessment, that is, the circumference speed to the peripheral speed Vm and plane of exposure Sp that project image planes Sm Small difference is assigned between degree Vp (either translational velocity V) to obtain as inclined in the difference component Δ or Figure 12 in Fig. 8 B The characteristic of residual quantity Δ 1 ' utilizes difference component Δ or deviation for the range of clearly best exposed width 2A (either A) Measure the relationship between Δ 1 ' and resolution ratio Rs.Hereinafter, this method is illustrated, but to put it more simply, sometimes will be in Fig. 8 B Departure Δ 1 ' in difference component Δ or Figure 12 is known as image displacement amount Δ.

In the evaluation assessment, average value/Rs of image displacement amount Δ is calculated for each position on exposed width Relationship or image displacement amount Δ²Average value/Rs relationship.Therefore, it is based on Figure 18, Figure 19, is illustrated with the flat of image displacement amount Δ Mean value/Rs is as evaluation of estimate Q1, the example that is emulated using average value/Rs of image displacement amount Δ 2 as evaluation of estimate Q2.Figure 18 is identical as the curve graph of departure Δ 1 ' shown in Figure 12 of front, but the exposed width that will be calculated is set as ± 12mm Range.In addition, it is interval that it is same as Figure 12, which to calculate sampled point on the exposed width of departure Δ 1 ' (image displacement amount Δ), 0.5mm。

The average value of image displacement amount Δ is to being obtained to the sampled point having in mind from the origin 0mm of exposed width The absolute value of each departure Δ 1 ' carries out what arithmetic average obtained.For example, position is the image displacement amount Δ of the sampled point of -10mm Average value be that will be set to 0mm~position in place to obtain at each sampled point (being 21 points in figure 18) between -10mm The absolute value of departure Δ 1 ' is added, then the value that will add up divided by sampled point quantity are found out.Figure 18 the case where Under, the additive value for being set to the absolute value of the departure Δ 1 ' at each sampled point of 0mm~-10mm in place is 20.86 μm, then is removed The average value obtained with sampling number 21 is about 0.99 μm.In addition, it is normal to set NA=0.0875, λ=368nm, technique herein Number k=0.5, to which the resolution ratio Rs in emulation is set as 2.09 μm.Therefore, it is at -10mm in the position of exposed width Evaluation of estimate Q1 (no unit) is about 0.48.If each position (sampled point) in exposed width is calculated as described above, The dynamic trend of evaluation of estimate Q1 known to then.

In addition, (image displacement amount Δ)²Average value be to will be from the origin 0mm of exposed width to the sampled point of concern Between the obtained absolute value of each departure Δ 1 ' carry out the value after square operation (μm²) carry out what arithmetic average obtained.Scheming In the case of 18, it is added again for example, the absolute value of the departure Δ 1 ' for each sampled point that position is 0mm~-10mm is squared Obtained value is 42.47 μm², then divided by the obtained average value of sampling number 21 be about 2.02 μm².Due to it will emulate in Resolution ratio Rs is set as 2.09 μm, thus the position of exposed width be -10mm at evaluation of estimate Q2 be about 0.97 μm.If Each position (sampled point) in exposed width is calculated as described above, then understands the dynamic trend of evaluation of estimate Q2 (μm).

Figure 19 is to take evaluation of estimate Q1, Q2 found out through the above way on longitudinal axis, takes the position of exposed width on transverse axis The curve graph set.Evaluation of estimate Q1 (average value/resolution ratio Rs of image displacement amount Δ) is as exposed width (absolute value) becomes larger and puts down Change slowly, about becomes substantially 1.0 in the position of ± 12mm of exposed width.This means that the picture in the position of ± 12mm The average value of displacement Δ and resolution ratio Rs are roughly the same.On the other hand, evaluation of estimate Q2 (image displacement amount Δs²Average value/point Resolution Rs) become with the tendency same with evaluation of estimate Q1 in the range of until the position of exposed width is at ± 8mm Change, increased dramatically in 8mm or more, is substantially to become 1 (μm) at ± 10mm in the position of exposed width.

Herein, the contrast variation of ISO patterns shown in Figure 17 in front or L&amp shown in figure 15;Pair of S patterns Than degree change in, contrast than since exposed width 8mm or more place significantly decline.It is found out in Figure 15, Figure 17 Contrast than variation be the case where resolution ratio Rs is set as 2.5 μm, although not being to utilize Rs=2.09 μm of calculated comparison The variation of ratio is spent, but is inclined to substantially the same.Like this, the evaluation using evaluation of estimate Q1 or Q2 as index can be passed through Method, to determine the best exposed width of reflection contrast variation.

In addition, in this case, since plane of exposure Sp and reference plane HP is parallelly in the X direction to move Dynamic speed V (peripheral speed Vp) is mobile, thus by the mathematical expression F (x) used in the first embodiment of front replace with such as with Under mathematical expression F ' (X).

&#91;Mathematical expression 3&#93;

The exposure device U3a of second embodiment shown in Fig. 10 is implemented by the way that formula F ' (X) is applied to above-mentioned first In the mathematical expression of mode, and meet the relationship, effect same as first embodiment can be obtained.

&#91;Third Shi Shifangshi &#93;

Hereinafter, being illustrated to the exposure device U3b of third embodiment with reference to Figure 20.In addition, in order to avoid repetition It records, is illustrated only for the part different from the first, second embodiment, for same as the first, second embodiment Inscape mark identical with the first, second embodiment reference numeral and illustrate.Figure 20 is to show third embodiment party The integrally-built figure of the exposure device (substrate board treatment) of formula.The exposure device U3 of first embodiment is use with quilt Structure of the light of the pattern plane reflection of light shield M as the reflection-type light shield of projected light beam, the exposure device of third embodiment U3b is the structure for using the transmission-type light shield using the light of the pattern plane through light shield as projected light beam.

In the exposure device U3b of third embodiment, light shield holding mechanism 11a has the cylinder roller for keeping light shield M (light shield holding cylinder) 21a, the deflector roll 93 of supporting cylinder roller 21a, the driven roller 94 of driving cylinder roller 21a, driving portion 96.

Cylinder roller 21a forms the light shield face configured with the illumination region IR on light shield MA.In the present embodiment, light Cover includes around the face that axis (central shaft of the cylindrical shape) rotation parallel with the line segment obtains by line segment (busbar) (hereinafter, claiming For barrel surface).Barrel surface is, for example, the peripheral surface etc. of the peripheral surface of cylinder, cylinder.Cylinder roller 21a by such as glass or The compositions such as quartz, in the cylindrical shape with certain thickness, peripheral surface (barrel surface) forms light shield face.That is, in this implementation In mode, the illumination region on light shield MA bends to the cylinder planar with radius of curvature R m from center line.Cylinder roller 21a In slave light shield holding cylinder 21a radial observation when part with the pattern registration of light shield M, such as cylinder roller 21a is in Y axis Center portion of the direction other than two end sides has translucency relative to illuminating bundle EL1.

Light shield MA is made into the very thin glass plate (such as 100~500 μm of thickness) for example in the good strip of flatness A surface on using the planar sheet material light shield for foring the transmission-type of pattern by light shield layers such as chromium, so that it is copied circle The peripheral surface of cylinder roller 21a is bent, and is used in the state of the peripheral surface with winding (fitting).Light shield MA, which has, not to be formed The non-pattern forming region of pattern, is installed on cylinder roller 21a in non-pattern forming region.Light shield MA can be rolled from cylinder Cylinder 21a is detached from.The light shield MA and light shield M of first embodiment is it is equally possible that substitution is wound in by transparent cylinder base material structure At cylinder roller 21a, and directly utilize the shadings such as chromium in the peripheral surface for the cylinder roller 21a being made of transparent cylinder base material It is next integrated that layer drafting forms mask pattern.In this case, cylinder roller 21a can also realize the holding of mask pattern The function of component.

Deflector roll 93 and driven roller 94 extend along the Y direction parallel with the central shaft of cylinder roller 21a.Deflector roll 93 And driven roller 94 is arranged to rotate around the axis parallel with central shaft.Deflector roll 93 and driven roller 94 be arranged to not with circle The light shield MA contacts that cylinder roller 21a is kept.Driven roller 94 is connect with driving portion 96.Driven roller 94 is by will be from driving portion 96 The torque of supply is conducted to cylinder roller 21a, to make cylinder roller 21a around center axis rotation.

The lighting device 13a of present embodiment has light source (illustration omitted) and lamp optical system ILa.Illumination light System ILa is more with correspondingly being arranged in the Y-axis direction with each in multiple projection optical system PL1~PL6 A (such as 6) lamp optical system ILa1~ILa6.It can be used in the same manner as light source and above-mentioned various lighting device 13a Various light sources.The Illumination Distribution of illumination light shot from the light source is homogenized, for example, via the light conducting members such as optical fiber distribute to Multiple lamp optical system ILa1~ILa6.

Multiple lamp optical system ILa1~ILa6 be respectively provided with multiple optical components of lens etc., integrated optics system, Cylindrical lenses, fly's-eye lens etc. utilize the illuminating bundle EL1 irradiation illumination regions IR of uniform Illumination Distribution.In this embodiment party In formula, multiple lamp optical system ILa1~ILa6 are configured at the inside of cylinder roller 21a.Multiple lamp optical system ILa1 ~ILa6 is kept respectively from the inside of cylinder roller 21a by cylinder roller 21a to the peripheral surface of cylinder roller 21a Each illumination region irradiation on light shield MA.

Lighting device 13a guiding is by lamp optical system ILa1~ILa6 light shot from the light source, by the illumination light of guiding Beam is from cylinder roller 21a internal irradiations to light shield MA.Lighting device 13a, which is irradiated using illuminating bundle EL1 with uniform brightness, to be justified The part (illumination region IR) for the light shield M that cylinder roller 21a is kept.In addition, light source can be configured at cylinder roller 21a's Inside can also be configured at the outside of cylinder roller 21a.In addition, light source can also be other separated with exposure device EX Device (external device (ED)).

Exposure device U3b is also same as exposure device U3, U3a in the case where using transmission-type light shield as light shield Ground passes through the movement speed (peripheral speed Vm) of adjustment (amendments) projection image planes Sm in the same manner as the second embodiment with front Relationship between the movement speed (V or peripheral speed Vp) of plane of exposure Sp can expand available in scan exposure Exposed width.

&#91;4th Shi Shifangshi &#93;

Hereinafter, the exposure device U3c with reference to Figure 21 pairs of the 4th embodiment is illustrated.In addition, in order to avoid repetition It records, is illustrated only for the part different from previous each embodiment, for same as previous each embodiment Inscape marks identical reference numeral to illustrate.Figure 21 is to show the exposure device of the 4th embodiment (at substrate Manage device) integrally-built figure.Exposure device U3, U3a, U3b of previous each embodiment are using rotatable The structure for the cylindric light shield M that cylinder roller 21 (or 21a) is kept.In the exposure device U3c of the 4th embodiment Equipped with light shield holding mechanism 11b, light shield holding mechanism 11b, which has, remains flat reflection-type light shield MB and when scanning The light shield objective table 110 moved in the X direction along the faces XY when exposure.

In the exposure device U3c of the 4th embodiment, light shield holding mechanism 11b, which has, keeps flat reflection-type The light shield objective table 110 of light shield MB, making light shield objective table 110, scanning moves along the X direction in the plane orthogonal with median plane CL Dynamic mobile device (illustration omitted).

Since the light shield face P1 of the light shield MB of Figure 21 is substantially the plane parallel with the faces XY, so being reflected from light shield MB Projected light beam EL2 chief ray it is vertical with the faces XY.Therefore, from each illumination region IR1~IR6's irradiated on light shield MB The chief ray of the illuminating bundle EL1 of lamp optical system IL1~IL6 be also configured as via polarising beam splitter PBS and with the faces XY Vertically.

In addition, in the case where the chief ray of the projected light beam EL2 reflected from light shield MB is vertical with the faces XY, projection optics The angle of first reflecting surface P3 of the first deflecting member 70 possessed by the first optical system 61 of module PLM is set as, to coming from The projected light beam EL2 of polarising beam splitter PBS is reflected, and the projected light beam EL2 after reflection is made to penetrate the first lens group 71 It is incident to the angle of the first concave mirror 72.Specifically, by the first reflecting surface P3 of the first deflecting member 70 be set as substantially with Second optical axis BX2 (faces XY) is at 45 °.

In addition, in the fourth embodiment, in the same manner as Fig. 2 of front, when being observed in the faces XZ, from light shield MB Illumination region IR1 (and IR3, IR5) central point to the central point of illumination region IR2 (and IR4, IR6) until X Air line distance on direction is set as, and from the view field PA1 in the substrate P of bearing surface P2 for copying substrate supporting cylinder 25 Week until the central point of (and PA3, PA5) to the central point of the second view field PA2 (and PA4, PA6) exists over long distances It is substantially equal.

In the exposure device U3c of Figure 21, slave control device 16 also controls the mobile device of light shield holding mechanism 11 (linear motor of scan exposure, actuator of fine motion etc.), light shield is synchronously driven with the rotation with substrate supporting cylinder 25 Objective table 110.In the exposure device U3c of Figure 21, the +X direction synchronizing moving to light shield MB and carry out scan exposure it Afterwards, the action (backrush) that the initial position of -X direction is back into enforcement light shield MB is needed.Therefore, make substrate supporting cylinder 25 Come that in the case that at the uniform velocity (peripheral speed Vp) constantly transports substrate P, backrush is carried out in light shield MB with fixing speed continuous rotation During action, pattern exposure is carried out not in substrate P, but dispersedly (discretely) shape in the carry direction of substrate P At panel pattern.But in practical applications, due to speed (the circumference speed by assuming the substrate P when scan exposure Spend Vp) and light shield MB speed be 50~100mm/s, if so most with such as 500~1000mm/s when light shield MB backrush Driving light shield objective table 110 at high speed, then can reduce between the panel pattern being formed in substrate P in carry direction Blank.

Then, with reference to the projection image planes Sm and base of the pattern of the light shield of the exposure device U3c of Figure 22 pairs of the 4th embodiment The relationship between plane of exposure Sp on plate P illustrates.Figure 22 provides movement and the substrate of the projection image planes Sm of the pattern of light shield Relationship between the movement of the plane of exposure Sp of P is equivalent to projection image planes Sm and plane of exposure illustrated in fig. 11 in front Relationship between Sp in turn the case where.That is, in fig. 22, will be formed in the projection image of planar (radius of curvature is infinitely great) The pattern image of face Sm is transferred on the plane of exposure Sp of radius of curvature R p.

Herein, since light shield M is plane, so projection image planes Sm (optimum focusing face) is also plane.Therefore, Figure 22 In projection image planes Sm be equivalent to shown in Fig. 7 in front speed V move reference plane HP.On the other hand, substrate P On plane of exposure Sp and Fig. 7 in front shown in the same manner as, be the barrel surface that radius of curvature is Rp (is in ZX planes Circular arc).

In the present embodiment, if setting the angular speed of substrate holding cylinder 25 (plane of exposure Sp) to ω p, also with Fig. 7 Similarly, projection image planes Sm and plane of exposure Sp is tangent in the position of plane KS, using Xp=RpSin (ω pt), finds out this Point of contact Cp is the position Xp in the X direction of the plane of exposure Sp of the Rp point Cp2 being moved to after time t along radius.This Place, ω pt are the rotation angle θ p on plane of exposure Sp from origin after time t using point of contact Cp as origin.Therewith Relatively, indicate the point of contact Cp of projection image planes Sm and plane of exposure Sp along flat throwing using Xm=Vt (wherein, V=Vm) The position Xm for the point Cp0 that image plane Sm is moved to from origin after time t, it is therefore, same as each embodiment of front Ground generates projection error (departure or image displacement amount) between projecting image planes Sm and plane of exposure Sp.

If the projection error (departure or image displacement amount) is set as departure Δ 2, found out using Δ 2=Xm-Xp Departure Δ 2 obtains Δ 2=Vt-RpSin (θ p).The song of the characteristic of the departure Δ 2 and the departure Δ 2 in Fig. 8 A Line chart is identical, and preceding by assigning small difference to the peripheral speed Vp of movement speed V and plane of exposure Sp for projecting image planes Sm Each embodiment in face similarly, can expand the exposed width of the available view field PA in scan exposure.For this purpose, Need to make the speed (peripheral speed) on the surface of the small side of the radius of curvature in projection image planes Sm and plane of exposure Sp relatively slightly Greatly.Speed Vf when in the present embodiment, by the scan exposure of light shield MB is set to slightly smaller than be based on the β decisions of projection multiplying power Reference speed V so that peripheral speed Vp small examples of the speed V (peripheral speed Vm) of projection image planes Sm only than plane of exposure Sp Such as change rate α or so exemplified in Fig. 8 C.

Herein, in the case of the exposure device U3c of present embodiment, by the mathematical expression of the F (x) of first embodiment Replace with the mathematical expression of following F ' (X).

&#91;Mathematical expression 4&#93;

Herein, formula F ' (X) by being applied to the mathematical expression of the first embodiment of front by exposure device U3c, and is expired The foot relationship, can obtain effect same as the respective embodiments described above.

In addition, in the light shield holding mechanism and base supporting mechanism of the exposure device of present embodiment using curved surface come The side kept is the first supporting member, and the side supported using curved surface or plane is the second supporting member.

More than, cylindric or planar light shield M has been used in various embodiments, even but being based on CAD numbers According to DMD (digital mirror device) or SLM (spatial optical modulation element) etc. is controlled, light distribution corresponding with pattern is passed through By projection optical system (can also include microlens array) be projected on plane of exposure Sp without light shield Exposure mode, also can Obtain same effect.

In addition, in various embodiments, the radius of curvature of the plane of exposure Sp of projection image planes Sm and substrate P to pattern into Row compares, by scan exposure, relatively slightly increasing the circumference speed of the small side of radius of curvature in the Sm knead doughs Sp of face Degree, either relatively peripheral speed (or the linear movement speed of the big side of the radius of curvature in slightly reduction face Sm knead doughs Sp Degree), the available exposed width in scan exposure can be expanded.By opposite peripheral speed (or translational velocity) Small difference which kind of degree be set as, being can be according to image displacement amount Δ (difference component Δ, departure Δ 1, Δ 2) and resolution ratio Rs and change.For example, in the evaluation assessment using evaluation of estimate Q1, Q2 of Figure 19 of front, resolution ratio Rs is set as 2.09 μ M, but this be by the numerical aperture NA of projection optical system PL, exposure wavelength lambda, process constant k and determine.Actually expose The minimum dimension (line width) of pattern in substrate P is that the pattern by being formed on light shield M is determined with projection multiplying power β.It is false It is located in the pattern that be formed in the display panel in substrate P, as long as minimum actual size (actual linewidth) is 5 μm As long as then using the value of the actual linewidth as resolution ratio Rs, the circumference in the range of image displacement amount Δ of permission is found out Speed difference (change rate α etc.).That is, the resolution ratio Rs that is determined according to the structure (NA, λ) by exposure device or should transfer The minimum dimension of pattern on to substrate P, to determine the change rate α of the difference for expanding exposed width.

More than, by using the exposure device shown in various embodiments, implement scan exposure side as described below Method.That is, will be formed in bending to the pattern in a face of cylindric light shield (M, MB) with defined radius of curvature via projection Optical system PL (PLM) is projected to the surface (plane of exposure Sp) for being supported to cylindric or planar flexible base board P, and And light shield M is made to be moved with defined speed along a face of bending on one side, make substrate P along being supported to cylindrical shape on one side Or the surface (Sp) of planar substrate is moved with defined speed, thus to based on projection optical system on substrate The projection image of pattern is scanned exposure, when carrying out the scan exposure, if by the projection of the pattern based on projection optical system It, will be by as the radius of curvature of projection image planes Sm formed under best focus is set as Rm (also comprising Rm=∞ the case where) It (also includes Rp=∞'s that bearing is set as Rp for the radius of curvature of cylindric or planar substrate P surface (plane of exposure) Sp Situation), it will be set as Vm along the movement speed of the mobile pattern image of projection image planes (Sm) by the movement of light shield (M, MB), When by being set as Vp along the defined speed of the surface of substrate P (plane of exposure) Sp, then it is set as Vm > in the case of Rm < Rp Vp is set as Vm < Vp in the case of Rm > Rp.

&#91;5th Shi Shifangshi &#93;

Figure 23 is the integrally-built figure for the exposure device for showing the 5th embodiment.Processing unit U3d is equivalent to Fig. 1 And processing unit U3 shown in Fig. 2.Hereinafter, processing unit U3d is known as exposure device U3d and is illustrated.The exposure fills Setting U3d has the mechanism for replacing light shield M.Since exposure device U3d is structure same as above-mentioned exposure device U3, so In principle to shared incomplete structure explanation.

Exposure device U3d is in addition to above-mentioned driven roller R4~R6, marginal position controller EPC3 and aligming microscope Other than AM1, AM2, also there is light shield holding mechanism 11, base supporting mechanism 12, lamp optical system (lighting system) IL, throwing Shadow optical system PL, slave control device 16.

Slave control device 16 controls each section of exposure device U3d, and each section is made to be handled.Slave control device 16 can be some or all of the host control device 5 of device inspection apparatus 1.In addition, slave control device 16 also may be used It is other devices different from host control device 5 to be controlled by host control device 5.Slave control device 16 for example wraps Include computer.In the present embodiment, slave control device 16 will be from information storage part (such as the bar shaped for being installed on light shield M Code, magnetic storage medium or the IC tag etc. that information can be stored) read information related with light shield M reading device 17 and The measuring device 18 that the shape, size and installation site etc. of light shield M measure is connected.

In addition, light shield holding mechanism 11 keeps the light shield M of cylinder (by high reflection portion and low using light shield holding cylinder 21 The mask pattern face of reflecting part composition), but in the same manner as first embodiment, however it is not limited to the structure.In present embodiment In, when mentioning light shield M or cylinder light shield, light shield M is referred not only to, is also contained in the light shield kept in the state of light shield M Holding cylinder 21 (assembly of light shield M and light shield holding cylinder 21).

Base supporting mechanism 12 is used for the figure of the light shield M of free illumination along the face of bending or flat bearing The substrate P of the light exposure of case.Substrate supporting cylinder 25 is formed to have centered on the second axis AX2 extended in the Y direction and song Rate radius is the cylindrical shape of the peripheral surface (periphery) of Rfa.Herein, first axle AX1 and the second axis AX2 are parallel to each other, will Including face CL centered on first axle AX1 and the second axis AX2 and the plane parallel with the two.Median plane CL is straight by two The plane that line (being first axle AX1 and the second axis AX2 in this example embodiment) determines.One of the periphery of substrate supporting cylinder 25 It is allocated as the bearing surface P2 for supporting substrates P.That is, substrate supporting cylinder 25 is by substrate P by being wound in its bearing surface P2, to support And handling substrate P.Like this, substrate supporting cylinder 25 has from the second axis AX as defined axis with defined radius The curved surface (peripheral surface) of (radius of curvature R fa) bending is wound with a part for substrate P on peripheral surface and is made with the second axis AX2 It pivots about.Second driving portion 26 is connect with slave control device 16, and substrate supporting cylinder 25 is made to make with the second axis AX2 It is rotated for Pivot axle.

A pair of aerial turning-bar ATB1, ATB2 are respectively arranged on the upper of the carry direction of substrate P across substrate supporting cylinder 25 Swim side and downstream side.A pair of aerial turning-bar ATB1, ATB2 are set to the surface side of substrate P, and in vertical direction (Z-direction) On be configured at substrate supporting cylinder 25 bearing surface P2 lower side.A pair of of deflector roll 27,28 across a pair of aerial turning-bar ATB1, ATB2 and the upstream side and downstream side for being respectively arranged on the carry direction of substrate P.A deflector roll 27 in a pair of of deflector roll 27,28 It is guided the substrate P come is carried from driven roller R4 to aerial turning-bar ATB1, another deflector roll deflector roll 28 will be from aerial turning-bar ATB2 carries the substrate P come and guides to driven roller R5.

Therefore, base supporting mechanism 12 using deflector roll 27 by from driven roller R4 carry come substrate P guide to turning in the air Bar ATB1, and substrate supporting cylinder 25 will be imported by the substrate P of aerial turning-bar ATB1.Base supporting mechanism 12 by using Second driving portion 26 makes substrate supporting cylinder 25 rotate, and base is directed in come the bearing surface P2 bearings on one side using substrate supporting cylinder 25 Plate supports the substrate P of cylinder 25, carries the substrate P to aerial turning-bar ATB2 on one side.Base supporting mechanism 12 is turned to using aerial Bar ATB2 guides the substrate P for being carried to aerial turning-bar ATB2 to deflector roll 28, and the substrate P for having passed through deflector roll 28 is guided To driven roller R5.

At this point, the slave control device 16 being connect with the first driving portion 22 and the second driving portion 26 is by making light shield protect Cylinder 21 and substrate supporting cylinder 25 are held with defined rotary speed ratio synchronous rotary, will be formed in the light shield of the light shield face P1 of light shield M The picture of pattern continuously repeats projection exposure and (copies circle on the surface of the substrate P for the bearing surface P2 for being wound in substrate supporting cylinder 25 Circumferential surface and the face being bent).

As shown in Fig. 2, exposure device U3d has the alignment to being previously formed in light shield M on the outside of the peripheral surface of light shield M Aligming microscope GS1, GS2 that label etc. is detected.In addition, exposure device U3d also has for detecting light shield M and light Encoder head EH1, EH2 of the rotation angle of cover holding cylinder 21 etc..They are along light shield M's (or light shield holding cylinder 21) It is arranged circumferentially.For example, encoder head EH1, EH2 are installed on the both ends in the directions first axle AX1 of light shield holding cylinder 21, read Take with light shield holding cylinder 21 together by first axle AX1 centered on the peripheral surface of dial disc SD that rotates carve set scale (with Regulation pitch carves the pattern for setting clathrate in the circumferential).Moreover, focus measuring device AFM can be arranged in exposure device U3d And foreign body detecting device CD；Focus measuring device AFM measures the peripheral surface (light shield face P1) of the light shield M of rotation in radial direction On micro-displacement, to which detection light cover P1 is deviated relative to the focusing of projection optical system PL, foreign body detecting device CD inspection Survey the foreign matter being attached on the P1 of light shield face.Although they can be configured at the arbitrary orientation of the peripheral surface around light shield M, It is preferably arranged at the direction for the handling mobile space for avoiding light shield M when light shield is replaced.

In addition, the scale reading position of encoder head EH1 is set as, on the XZ face orthogonal with first axle AX1 with light The circumferential center (the intersection point Q1 in Fig. 5 or Fig. 7) for covering illumination region IR1, IR3, IR5 of the odd number on M is right Together, the scale reading position of encoder head EH2 is set as, on the faces XZ with the illumination region of the even number on light shield M The circumferential center alignment of IR2, IR4, IR6.In addition, the scale measured by encoder head EH1, EH2 can also be with light Cover pattern is formed in the peripheral surface at the both ends of light shield holding cylinder 21 (light shield M) together.

Exposure device U3d also has and is used for other than detecting aligming microscope AM1, AM2 of label in substrate P etc. Detect encoder head EN1, EN2, EN3, EN4 of rotation angle of substrate supporting cylinder 25 etc..They are along substrate supporting cylinder 25 It is arranged circumferentially.For example, encoder head EN1, EN2, EN3, EN4 are installed on the side of the second axis AX2 of substrate supporting cylinder 25 Upward both ends, and read with substrate supporting cylinder 25 together by the second axis AX2 centered on the periphery of dial disc that rotates The peripheral surface at the both ends on the direction of the second axis AX2 of face or substrate supporting cylinder 25 is carved the scale set and (is set with regulation pitch quarter In the pattern of circumferential clathrate).

In addition, the scale reading position of encoder head EN1 is set as, on the XZ face orthogonal with the second axis AX2 with it is right The circumferential aligned in position of the observation visual field of quasi- microscope AM1, the scale reading position of encoder head EN4 is set as, in XZ Circumferential aligned in position on face with the observation visual field of aligming microscope AM2.Similarly, the scale of encoder head EN2 is read Fetch bit, which installs, to be set to, and is aligned, is encoded with the circumferential center of view field PA1, PA3, PA5 of the odd number in substrate P The scale reading position of device read head EN3 is set as, on the faces XZ with view field PA2, PA4, PA6 of the even number in substrate P Circumferential center alignment.

Moreover, as shown in Fig. 2, exposure device U3d has the replacement mechanism 150 for replacing light shield M.Replace mechanism 150 The light shield M that exposure device U3d is kept can be changed to identical other light shields M of radius of curvature R m, or be changed to curvature Other light shields M different radius Rm.In the case where being changed to the identical light shield M of radius of curvature R m, replacing mechanism 150 can be with Light shield M is only removed into replacement from light shield holding cylinder 21, light shield M can also be filled together with light shield holding cylinder 21 from exposure It sets U3d and removes replacement.In the case where being changed to the different light shield M of radius of curvature R m, replacing mechanism 150 can be by light shield M Together with light shield holding cylinder 21 replacement is removed from exposure device U3d.It is integrated feelings in light shield M and light shield holding cylinder 21 Under condition, replaces mechanism 150 and also replace the two as integrally.As long as replace mechanism 150 can by light shield M or light shield M with The assembly of light shield holding cylinder 21 is installed on exposure device U3d and is removed from exposure device U3d, structure whatever It can.

Exposure device U3d, which has, replaces mechanism 150, and thereby, it is possible to automatically install the different light shield M of diameter by light Cover pattern exposure is in substrate P.Therefore, the device inspection apparatus 1 with exposure device U3d can be (aobvious according to the device of manufacture Show panel) size use the light shield M with appropriate diameter.Therefore, device inspection apparatus 1 can avoid substrate P from generating not The blank parts used avoid the waste of substrate P, reduce the manufacturing cost of device.In this way, with the exposure for replacing mechanism 150 Device U3d is since the selection degree of freedom of device (display panel) size that device inspection apparatus 1 manufactures is larger, so with such as Under advantage：This excessive equipment investment of exposure device itself need not be replaced, it will be able to effectively manufacture different inches The display panel of size.

In the case where being changed to the different light shield M of diameter, between two kinds of light shield M, because light shield face P1 curvature and The differences such as the position in z-direction of first axle AX1 lead to the pass between illuminating bundle EL1 and light shield M and projected light beam EL2 Non- telecentricity degree of chief ray of system, the position of illumination region IR on light shield M and illuminating bundle EL1 etc. is in diameter difference Light shield M between change, or make encoder head EH1, EH2 it is different from the position relationship of dial disc SD.

Therefore, in the case where the light shield M of exposure device U3d is changed to the different light shield M of diameter, it will be formed in light The picture of the mask pattern of the light shield face P1 of M is covered with picture quality projection exposure appropriate to substrate P, and in poly-lens mode In the case of, it needs to splice the mask pattern presented in each in multiple view field PA1~PA6 with high precision The mode of picture, to adjust related organization and the part related with this in exposure device U3d.

In the present embodiment, when being changed to the different light shield M of diameter, for example, by slave control device 16 as adjusting Whole control unit (adjustment section) uses, and carries out specifically constituting lamp optical system to each section of exposure device U3d At least part of position of the IL either optical components of projection optical system PL changes or by the one of optical component Part is switched to the adjustment of component of different characteristics etc..As a result, after replacing light shield M, exposure device U3d can be appropriate and good Substrate P is exposed well.That is, exposure device U3d can suitably and well realize it is big to the degree of freedom of the size of device Exposure, that is, be exposed using the light shield M of different-diameter size.Then, to by light shield M used in exposure device U3d The outline of the step of being changed to other light shields M of the different light shield M of diameter or same diameter and adjustment exposure device U3d's Specific example illustrates.

The flow chart for the step of Figure 24 is when showing the light shield that exposure device uses being changed to other light shields.Figure 25 is The position of the field of view of the light shield side of first projection optical system of odd number and the second projection optics system of even number are shown The figure of relationship between the position of the field of view of the light shield side of system.Figure 26, which shows to have on the surface, stores light shield The stereogram of the light shield of the information storage part of information.Figure 27 depicts the signal of the exposure condition setting table of conditions of exposure Figure.

In the case of the light shield M that light shield M used in exposure device U3d is changed to different-diameter, in step S101 In, slave control device 16 shown in Figure 23 starts to start the replacement action of light shield M.Specifically, slave control device 16 is driving The light shield M being installed in current exposure device U3d is removed and then is driven replacement mechanism 150 will make by the dynamic mechanism 150 that replaces Light shield M to replace object is installed on exposure device U3d.In the replacement, replacing mechanism 150 will protect with the light shield of light shield M It holds cylinder 21 to remove together with the shaft as first axle AX1, then the different light shield M of diameter and light shield holding cylinder 21 is pacified It is attached in exposure device U3d.At this point, being coaxially mounted on the two of light shield holding cylinder 21 in dial disc SD and first axle AX1 In the case of end, replaced together preferably in conjunction with dial disc SD.

In the present embodiment, when being changed to the different light shield M of diameter, based on being re-installed in exposure device U3d's The diameter of light shield M (light shield face P1), come change the first axle AX1 as the Pivot axle of light shield holding cylinder 21 in Z axis side Upward shaft support position.Therefore, exposure device U3d has to move in the Z-axis direction and prop up in a rotatable way The mechanism of the bearing arrangement of chengguang cover holding cylinder 21.

The bearing arrangement has and will divide to the both ends side of light shield holding cylinder 21 each shaft outstanding as first axle AX1 (contact-types such as ball bearing, needle bearing or air bearing etc. are non-contact for the bearing not being pivotally supported in a rotatable way Type).The bearing of contact-type by be fixed in the shaft of light shield holding cylinder 21 inner ring, be fixed on the main body side of exposure device U3d Outer ring and sandwich ball between inner ring and outer ring or needle roller is constituted.

In order to successfully carry out light shield replacement, the inner ring of contact-type bearing is installed in the shaft side of light shield holding cylinder 21 In the state of the two of outer ring, it is preferably constructed to remove contact-type bearing from the bearing arrangement of the main body side of exposure device U3d Outer ring construction.In addition, the bearing arrangement of the main body side of exposure device U3d includes so that first axle AX1 (shaft) and second The Z driving mechanisms that mode parallel axis AX2 (Y-axis) is adjusted the slope in YZ planes, and be used for so that First axle AX1 (shaft) the X driving mechanisms that also mode parallel with median plane CL is adjusted the slope in the faces XY.

Figure 25 shows to be changed to, light shield holding cylinder smaller than its diameter in the light shield M for being kept light shield holding cylinder 21 State in the case of the light shield Ma that 21a is kept.The radius of curvature of light shield M is Rm, and the radius of curvature of light shield Ma is Rma (Rma < Rm).The IRa of Figure 25 is that the first projection optical system (throw by the first projection optical system PL1 shown in Figure 23, third Shadow optical system PL3 and the 5th projection optical system PL5) the field of view of the sides light shield M (be equivalent to from light optics The illuminating bundle EL1 of system IL exposes to illumination region IR1, IR3, IR5 of the odd number on light shield M), IRb is the second projection Optical system (the second projection optical system PL2, the 4th projection optical system PL4 and the 6th projection optics shown in Figure 23 System PL6) the field of view of the sides light shield M (be equivalent to the illuminating bundle EL1 from lamp optical system IL and expose to light shield M On even number illumination region IR2, IR4, IR6).

In the present embodiment, before and after light shield M is changed to light shield Ma, preferably make the first throwing in the Z-axis direction The position of the position of the field of view IRa of shadow optical system and the field of view IRb of the second projection optical system in z-direction It sets constant.Z-direction is and the Pivot axle (first axle AX) of light shield M (light shield holding cylinder 21) and substrate supporting cylinder 25 Both Pivot axles (the second axis AX2) are orthogonal, and along the direction of median plane CL.By being set as making regarding in Z-direction The configuration relation spatially of field areas IRa and field of view IRb is constant before and after replacing light shield M, can be by illumination light (encoder head EH1, EH2, alignment are micro- for the adjusting of system IL and projection optical system PL, various measurement equipment Mirror GS1, GS2 etc.) position adjustment or the change etc. of component that is associated be limited in minimum limit.

Present embodiment premised on poly-lens mode as shown in figure 23, arrange in the Y direction it is single or it is multiple such as Under projection optical system exposure device in the case of, preferably will be in the circumferential direction of illumination region IR and view field PA Each center configures on median plane CL, which sets a position in the circumferential direction of the peripheral surface of light shield M Pattern in fixed illumination region IR is projected to view field PA.In exposure device as such, by radius (curvature half Diameter) be Rm light shield M be changed to the cylinder light shield Ma that radius is Rma (Rma < Rm) in the case of, as long as so that light shield Ma Rotation center (shaft) in z-direction to carry out Z drivings to bearing arrangement by the mode of only position offset semidiameter (Rma-Rm) .

But in the poly-lens mode of present embodiment, due to the field of view of the projection optical system of odd number In the circumferential detach two positions of the IRa (object plane being conjugated with the view field PA of odd number) on the peripheral surface of light shield M A side in setting, the field of view IRb (object plane being conjugated with the view field PA of even number) of the projection optical system of even number Positioned at another party, so even if making the distance of light shield Ma position change only semidiameters (Rma-Rm) in z-direction, according to radius The degree of difference, also cannot get good focusing accuracy (or good stitching position precision) sometimes.Therefore, in this embodiment party In formula, so that the field of view IRa (object plane) of the projection optical system of the peripheral surface and odd number for the cylinder light shield being replaced The mode accurately to match with field of view IRb (object plane) the two of the projection optical system of even number is to bearing arrangement Carry out Z drivings.

In the above embodiment, according to the diameter of the cylinder light shield of installation, change cylinder light shield in z-direction Position, so that the projection optics of the field of view IRa and even number of the projection optical system (PL1, PL3, PL5) of odd number Positions (all directions of XYZ) of the field of view IRb of system (PL2, PL4, PL6) in exposure device is constant.In this way, if Do not change the position of field of view IRa, IRb, then has seldom for the different cylinder light shield setting of diameter in device side The advantages of change of location or adjustment position.But in this case, make the motor and make that cylinder light shield rotates It is also moved in Z-direction on the whole to the drive system of the actuator of the directions XYZ fine motion, it is also possible to damage drive system Stability.

Therefore, the advantages of ensuring the stability of drive system in order to obtain, can also make the cylinder light in exposure device The Z location (or X position) of the rotation center (first axle AX1, shaft) of cover unchangeably installs the different cylinder light shield of diameter. In this way, other than the advantages of keeping the stability of drive system, the fixed rotary shaft of diameter is installed on as long as also obtaining replacing Outside hollow form the cylinder light shield radius of peripheral surface (different) characteristic effect.In order to correspondingly, expose Electro-optical device side is preferably constructed for headed by the adjustment of the focal position of each projection optical system, can carry out to various right The adjustment of the focal position of the cylinder light shield of quasi- sensor (microscope), the inspection of field of view IRa, IRb and alignment sensor Survey the position adjustment on the directions XYZ of visual field, the slope of the chief ray of illuminating bundle EL1 and the adjustment of degree of convergence or Between between the projection optical system (PL1, PL3, PL5) of odd number and the projection optical system (PL2, PL4, PL6) of even number Every adjustment etc..

And in the present embodiment, as shown in figure 23, using replace mechanism 150 from bearing arrangement remove light shield M (and Light shield holding cylinder 21), the light shield Ma in addition prepared (related light shield holding cylinder 21a) is installed on bearing arrangement.When removing light shield When M and installation light shield Ma, focus measuring device AFM or foreign body detecting device CD in fig 23 are spatially interfered with Them are made temporarily to keep out of the way in advance in the case of a part for light shield or replacement mechanism 150.In addition, as shown in figure 23, due to phase For supporting the bearing arrangement of first axle AX1, projection optical system PL and lamp optical system IL are located in -Z direction, right Quasi- microscope G S1, GS2 are located in -X direction, so can move out, move in the direction of light shield M or light shield Ma relative to axis Installation is set to +Z direction either +X direction or ± Y-direction (direction of first axle AX1).

If light shield M is changed to the different light shield Ma of diameter, S102 is entered step, slave control device 16 is being replaced Afterwards, information (light shield information after replacement) related with the light shield Ma of exposure device U3d is installed on is obtained.For example, light shield after replacing Information be diameter, perimeter, width, thickness equidimension, tolerance, the type of pattern, the out of roundness of light shield face P1, eccentric nature or This various specifications value generated by light shield such as person's flatness and correction value etc..

These information are as shown in figure 26, are stored in the information storage part 19 set on the surface of light shield holding cylinder 21a.Information Storage part 19 is, for example, bar code, hologram or IC tag etc..In the present embodiment, information storage part 19 is set to light shield The surface of holding cylinder 21a, but light shield Ma can also be set to together with the pattern of device.In the present embodiment, it is mentioning The either one when surface of cylinder light shield, including in the surface of light shield Ma and the surface of light shield holding cylinder 21a.In fig. 26, Information storage part 19 is set to the cylindric peripheral surface of light shield holding cylinder 21a, but can also be set on light shield holding cylinder 21a's End face portion on axis direction.

Slave control device 16 is obtained by reading device 17 from light shield information after the replacement that information storage part 19 is read.It reads Take device 17 that can use barcode reader in the case where information storage part 19 is bar code, in the case of IC tag IC tag reader etc. can be used.Information storage part 19 can also be the part for writing information into light shield Ma in advance.

Light shield information can also include exposure information related with conditions of exposure after replacement.Exposure information is exposure object The information of substrate P, the sweep speed of substrate P, illuminating bundle EL1 power these exposure devices U3d substrate P applied expose Required information when light processing.In the present embodiment, light shield information after replacing is added in exposure information and carries out various tune Whole and amendment, and carry out the setting of the formulation condition and parameter in the device operating in exposure.Exposure information example If being stored in exposure information preservation table TBL shown in Figure 27, it is stored in the storage part of slave control device 16 or upper control In the storage part of device 5 processed.Slave control device 16 reads exposure information preservation table TBL to obtain more from above-mentioned storage part Change rear light shield information.In addition, light shield information can also be via to slave control device 16 or host control device 5 after replacing Input unit (keyboard or mouse etc.) input.In this case, slave control device 16 is from above-mentioned input unit Obtain light shield information after replacing.If slave control device 16 obtains light shield information after replacement, S103 is entered step.

In step s 103, slave control device 16 is collected or is calculated and expose according to the diameter of the light shield Ma after replacement The related data of condition needed for part and adjustment needed for the adjustment of electro-optical device U3d.For example, as the portion needed for adjustment Point be the positions in the Z-axis direction light shield M, lamp optical system IL, projection optical system PL, light shield M rotary speed, expose Optical width (the circumferential width of illumination region IR), the position of encoder head EH1, EH2 or posture and alignment are micro- The position of mirror GS1, GS2 or posture etc..In addition, in the present embodiment, due to the Pivot axle of the light shield Ma after replacement (first axle AX1a) compared with the rotation center position of the light shield M before replacement Z-direction generate offset, so need so that The mode that the output shaft of driving source (such as motor) of driving light shield Ma can link with the shaft of light shield Ma, in step Installation site of (position offset) driving source in exposure device main body is adjusted in S103.Therefore, exposure device U3d has root It is at least adjusted between first axle AX1 and base supporting mechanism according to the diameter for the light shield Ma for being installed on light shield holding mechanism 11 The adjustment section of distance, the light shield holding mechanism 11 install one in diameter multiple light shields different from each other in a manner of replaceable It is a, and around the first axle AX1 rotations as defined axis.The adjustment section will be installed on the light shield of light shield holding mechanism 11 Interval between peripheral surface and the substrate P supported by base supporting mechanism is set in prespecified allowable range.

As described above, in the present embodiment, before and after being changed to the different light shield Ma of diameter, the illumination in Z-direction The position of visual field IR is constant.Thus, for example, in step S101, slave control device 16 is only changed to the different light shield of diameter Ma makes light shield Ma in Z-direction after acquisition is replaced in step s 102 after light shield information based on light shield information after the replacement On illumination field of view IR position control with replace before same position.In addition, before being changed to light shield Ma, bottom control Device 16 processed can also obtain the information of light shield Ma from such as exposure information preservation table TBL, be based on the information, be changed to light The opportunity for covering Ma, by the control of the position of the illumination field of view IR of light shield Ma in the Z-axis direction with replace before same position.With Under, the example of the adjustment in step S103 is illustrated.

Figure 28 is that Fig. 5 based on front roughly shows the illuminating bundle between the different light shield of diameter and projected light The figure of the state of beam.If as described above, keeping the positions of illumination field of view IR in the Z-axis direction constant before and after replacing light shield M Change, then as shown in figure 25, makes in the Pivot axle of the light shield M and light shield holding cylinder 21 i.e. Z-direction of first axle AX1 Change in location.Specifically, the first axle AX1 of the Pivot axle AX1a of the small light shield Ma of diameter and the light shield M being relatively large in diameter It compares, closer to the second axis AX2 of the Pivot axle as substrate supporting cylinder 25.

As shown in figure 28, even if if in the case that the light shield Ma after replacement is smaller than the diameter of the light shield M before replacement not Change absolute positions of the intersection point Q1 at the centers of illumination region IR in the circumferential on light shield Ma (light shield face P1a) in XYZ coordinate It sets (the specific position in exposure device).Therefore, as shown in figure 28, if being maintained on one side to the light shield M settings before replacement The lighting condition of illuminating bundle EL1, that is, maintaining makes each chief ray of illuminating bundle EL1 to radius (radius of curvature) in the faces XZ The 1/2 inclined conditions of point Q2 of Rm irradiate illuminating bundle EL1, then by the illumination on light shield Ma to the small light shield Ma of diameter on one side Each chief ray of the projected light beam EL2a of region IR reflections becomes dissipating in the faces XZ from state offset parallel to each other The direction of state, traveling also deviates.

Therefore, it is necessary to the illuminating bundle EL1 from lamp optical system IL is adjusted to the illuminating bundle suitable for light shield Ma EL1.Therefore, in step s 103, cylindrical lens 54 possessed by lamp optical system IL is changed to difference (with reference to Fig. 4) Power, be adjusted to make each chief ray of illuminating bundle EL1 in the faces XZ to the half of light shield Ma the state of multiplying power telecentricity It restrains 1/2 position of diameter Rma.Moreover, using drift angle prism (not shown), it will be as field of view IRa (illumination regions The state of the axis telecentricity of the intersection point Q1 at center IR) be adjusted to from intersection point Q1 by illuminating bundle EL1 chief ray extension The state that line passes through the central shaft AX1a of light shield Ma.

In addition, the angle of the adjustment the reflected beams from light shield Ma, that is, projected light beam EL2a.In this case, due to The shaft angle degree (angle in the faces XZ of chief ray) of illuminating bundle EL1 and projected light beam EL2a is (main according to the diameter of light shield Ma The center of light) and change, so can be between the polarising beam splitter PBS and light shield Ma as shared light path Drift angle prism (plane of incidence and the not parallel wedge-shaped prism of outgoing plane) is configured to adjust the angle of projected light beam EL2a.

In addition, in the case of the only angle of adjustment projected light beam EL2a, projection optical system PL can also be adjusted and had Some polarizing members (such as the 4th reflecting surface of the first reflecting surface P3 of the first deflecting member 70 or the second deflecting member 80 P6 angle).As a result, in the case where being changed to the different light shield Ma of diameter (light shield Ma's after replacing in this example embodiment Diameter is smaller than before replacing), each chief ray of the projected light beam EL2a reflected by light shield Ma can be set as putting down each other in the faces XZ Capable light.That is, even if adjustment exposes on light shield Ma if different to the diameter after replacement light shield Ma lamp optical system IL Illumination region IR illuminating bundle EL1 lighting condition so that by the projected light of the illumination region IR reflection of light shield Ma Beam EL2a becomes the state of telecentricity.

In the case where carrying out above-mentioned adjustment, for example, being set up in the light optics module ILM of lamp optical system IL There are the lens being set in a manner of it can replace one in the different multiple cylindrical lenses 54 of power in light path to replace mechanism Deng.Mechanism can also be replaced to be switched to best power to control the lens according to the instruction from slave control device 16 Cylindrical lens 54.At this point, slave control device 16 switches cylindrical lens based on the information of the diameter of the light shield Ma after replacement 54.In addition, the control of slave control device 16 can also be used between above-mentioned polarising beam splitter PBS and light shield Ma What the angle (and position in the faces XZ) of drift angle prism or the polarizing member in projection optics module PLM was adjusted Actuator, to adjust by the optical characteristics of the light shield Ma projected light beam EL2 reflected.In this case, slave control device 16 adjust the angle of drift angle prism or polarizing member also based on the information of the diameter of the light shield Ma after replacement.In addition, cylinder The replacement of lens 54 and the adjustment of drift angle prism etc. can be carried out by the operator of exposure device U3d.

Figure 29 is the configuration change for showing encoder head in the case where being changed to the different light shield of diameter etc. Figure.In adjustment in step s 103, as needed, also to encoder head EH1, EH2, aligming microscope GS1, GS2, light The focus measuring device AFM of the sides cover M and the foreign body detecting device CD for detecting foreign matter are adjusted.As shown in figure 29, for example, It is changed to the light shield that diameter is smaller and radius is Rma in the light shield M and light shield holding cylinder 21 for being Rm from radius (radius of curvature) In the case of Ma and light shield holding cylinder 21a, encoder head EH1, the EH2 being configured at around light shield M, aligming microscope GS1, GS2, focus measuring device AFM and foreign body detecting device CD need the week for being reconfigured in the light shield Ma that diameter becomes smaller It encloses, or adjustment posture.Thereby, it is possible to accurately measure the rotation angle of the position of the alignment mark on light shield Ma, light shield Ma Deng.

The example shown in Figure 29, by aligming microscope GS1, GS2, focus measuring device AFM and foreign body detecting device CD is newly configured at around the light shield Ma that diameter becomes smaller.In addition, encoder head EH1, EH2 in this example embodiment is in the faces XZ It is respectively arranged at position, the second projection optical system (even number of the field of view IRa of the first projection optical system (odd number) Number) field of view IRb position near.It therefore, there is no need to after replacing light shield, encoder significantly changed in the faces XZ The position of read head EH1, EH2.

But due to being changed to light shield Ma, can cause by the outer of encoder head EH1, EH2 dial disc SD read The scale of circumferential surface or be formed in together with light shield Ma light shield holding cylinder 21a peripheral surface scale and each encoder head Opposite reading angular between EH1, EH2 changes.Therefore, it is accurate by the stance adjustment of encoder head EH1, EH2 Ground is opposite with scale face.Specifically, arrow N1, N2 as shown in figure 29 are such, according to the diameter in scale face, make each read head EH1, EH2 rotate (inclination) on its position.Thereby, it is possible to accurately obtain the information of the rotation angle of light exit cover Ma.

When being changed to light shield Ma, dial disc can also be replaced simultaneously together with light shield Ma and light shield holding cylinder 21a SD, the posture (inclination) of adjustment encoder head EH1, EH2, and adjust installation site etc..Scale can also be set to light shield Ma Surface or light shield holding cylinder 21a peripheral surface.It is read in encoder head EH1, EH2 when being changed to light shield Ma In the case that the grid pitch of scale in the circumferential is different from before replacement, lattice of the slave control device 16 to the scale after replacement Correspondence between sub- pitch and the detected value of encoder head EH1, EH2 is modified.Specifically, following turn is corrected Coefficient is changed, which indicates to count the light shield Ma's being converted into after replacing by 1 time of the digit counter of coded system Displacement distance in rotation angle or the circumferential direction of light shield face P1a is great value.

As used illustrated by imaginary line in Figure 29, focus measuring device AFM and foreign body detecting device CD can match It is placed in Pivot axle (the first axle AX1 or first axle AX1a) underface in the Z-axis direction of light shield M either light shield Ma, And configure between the illumination field of view IRa of the first projection optical system and the illumination field of view IRb of the second projection optical system, from Detect the light shield M either light shield face P1 of light shield Ma or light shield face P1a in lower section.Thereby, it is possible to reduce before replacing light shield Ma Afterwards, until focus measuring device AFM and foreign body detecting device CD to the surface of light shield M or the surface of light shield Ma away from From variation.Therefore, having can be by the optical system or processing of focus measuring device AFM and foreign body detecting device CD Amendment of software etc. carrys out corresponding possibility.In this case, focus measuring device AFM and different can not also be changed The installation site of object check device CD.

By being changed to light shield Ma so that radius of curvature becomes smaller, it is thereby possible to the exposed width (base of view field PA The scanning direction of plate P or the circumferential direction of light shield Ma) in defocus and become larger.In this case it is necessary to adjust exposed width (packet Include sloping portion), the illumination of lamp optical system IL or the sweep speed (carrying of the rotary speed and substrate P of light shield Ma Speed).These can be by adjusting perspective view diaphragm 63, or utilizes the adjustment light supply apparatus 13 of slave control device 16 The rotation of the output of light source, light shield holding cylinder 21a and substrate supporting cylinder 25 is adjusted.In such a situation it is preferred to same Shi Biangeng exposed widths, illumination, sweep speed.

Moreover, according to the position of the view field PA of projection optical system PL, the relative position of projection optics module PLM Relationship and perimeter change because of light shield Ma need to adjust light shield Ma multiplying powers etc. in a rotational direction.For example, the next control Device 16 can by possessed by the projection optics module PLM to projection optical system PL as offset optical component 65 or The amendment of person's multiplying power is controlled with optical component 66 etc., to adjust the view field PA or light shield Ma of projection optical system PL Multiplying power etc. in a rotational direction.

In step s 103, the adjustment of the positions of light shield Ma in the Z-axis direction is carried out, lamp optical system IL is had The adjustment of optical component, optical component possessed by projection optical system PL adjustment and encoder head EH1, EH2 The adjustment of the machinery such as adjustment.Have in these can utilize driving mechanism of slave control device 16 and adjustment etc. it is automatic (or It is semi-automatic) the component that adjusts, also have the component that the operator of exposure device U3d manually adjusts.In addition to this, in step In S103, slave control device 16 is based on light shield information or exposure information etc. after replacing, and changes for controlling exposure device Control data (various parameters) of U3d etc..

In step s 103, exposure device is had adjusted based on light shield information after the replacement obtained in step s 102 U3d, but shape, size and the installation site of light shield Ma etc. that measuring device 18 shown in figure 23 can also be measured Exposure device U3d is adjusted as light shield information after replacement, and according to light shield information after the replacement.In this case, example Such as, slave control device 16, based on the light shield Ma that measuring device 18 measures, carries out various adjustment after being changed to light shield Ma. In addition, for the component etc. that operator must adjust, replace, for example, slave control device 16 will need component adjusted etc. aobvious Show and notifies operator on monitor etc..Exposure device U3d is adjusted by the measured value based on the light shield Ma after replacement, is come Light shield information after the replacement with reference to the variation of the environment such as such as temperature or humidity is obtained, therefore, it is possible to be more in line with reality The state on border adjusts exposure device U3d.In step s 103, at the end of the adjustment carried out because being changed to light shield Ma, into Enter to step S104.

As described above, when being changed to the light shield of different diameters, sometimes the associated optical system in exposure device, Train of mechanism, each characteristic of detecting system change.In the present embodiment, after in order to confirm as light shield is replaced Exposure device characteristic or performance, calibrating installation as shown in figure 30 is set.Figure 30 is the figure of calibrating installation.Figure 31 is Figure for illustrating calibration.Exposure device U3d is in the state of the light shield Ma after being suitable for replacing in step s 103, still By being calibrated in step S104, the state of exposure device U3d is set as the shape more suitable for the light shield Ma after replacement State.Calibration uses calibrating installation 110 shown in Figure 30.Calibration in present embodiment is that slave control device 16 carries out.Under Level control device 16 is made using first label ALMM of the detection of calibrating installation 110 and the second label ALMR, first label ALMM By the adjustment label on the surface for being set to the light shield Ma that light shield holding cylinder 21a is kept as shown in figure 31, second label ALMR is as the adjustment label set on the surface (part of 25 supporting substrates P of substrate supporting cylinder) of substrate supporting cylinder 25.So Afterwards, slave control device 16 adjusts lamp optical system IL, projection optical system PL, the rotary speed of light shield Ma, substrate P Transporting velocity or multiplying power etc., so that the relative position of the first label ALMM and the second label ALMR become defined position Relationship.Therefore, the step S104 of calibration is preferably carried out before substrate P is wound in substrate supporting cylinder 25, if but substrate P Transmittance is higher, and in the state of not forming various patterns in substrate P, then can also be wound in substrate supporting cylinder in substrate P It is calibrated in the state of 25.

As shown in figure 30, calibrating installation 110 has photographing element (such as CCD, CMOS) 111, lens group 112, prism anti- Penetrate mirror 113, beam splitter 114.Calibrating installation 110 in the case of poly-lens mode, respectively with lamp optical system IL1~IL6 Correspondingly it is arranged.In the case where being calibrated, slave control device 16 configures the beam splitter 114 of calibrating installation 110 In the light path of illuminating bundle EL1 between lamp optical system IL and polarising beam splitter PBS.In the feelings without calibration Under condition, beam splitter 114 avoids the light path of illuminating bundle EL1.

Since the sensitivity of photographing element 111 is sufficiently high, so can not also consider the loss of the power of light.Therefore, divide Beam device 114 can also be such as half prism.In addition, by making beam splitter 114 in lamp optical system IL and polarized light beam splitting The light path of illuminating bundle EL1 between device PBS passes in and out, and calibrating installation 110 can be made to minimize.

As shown in figure 30, also following method：Make the light beam of the light source 115 for carrying out self calibration from polarising beam splitter PBS's is incident with the face opposite side of illuminating bundle EL1 incidences, polarising beam splitter PBS separation illuminating bundle EL1 and throwing Shadow light beam EL2.Furthermore, it is also possible to light source of the back side configured with calibration of the second label ALMR in substrate supporting cylinder 25 115 (illumination regions) irradiate the light beam of calibration from the back side of the second label ALMR, and the light of the second label of transmission ALMR is passed through By projection optical system PL and polarising beam splitter PBS, it is projected to the light shield face P1a of the light shield Ma after replacing.In such case Under, the photographing element 111 of calibrating installation 110 can shoot substrate supporting of the back projection on the light shield Ma after replacement simultaneously The first label ALMM on the picture and light shield Ma of second label ALMR of cylinder 25.

Pass through illuminating bundle beam splitter 114 being configured between lamp optical system IL and polarising beam splitter PBS The light path of EL1, by the picture of the picture of the first label ALMM from light shield Ma and the second label ALMR from substrate supporting cylinder 25 Via the prism mirror 113 of the conduction of beam splitter 114 to calibrating installation 110.Each label picture reflected by prism mirror 113 Light after by lens group 112, be incident to the photographing element 111 with high shutter speed, a frame of the high shutter speed The camera time (sampling time) of size is extremely short, at 0.1~1 millisecond or so.16 pairs of slave control device with from camera shooting member The picture of the first label ALMM and being parsed as corresponding picture signal for the second label ALMR that part 111 exports, base The measured value of each encoder head EH1, EH2, EN2, EN3 (when sampling) finds out first when its analysis result and camera shooting The relative position relation between the labels of ALMM and second ALMR is marked, to lamp optical system IL, projection optical system PL, light Rotary speed, the transporting velocity of substrate P or the multiplying power etc. of cover Ma is adjusted, so that the relative position of the two is in rule Fixed state.

As shown in figure 31, the first label ALMM configurations are corresponding with each lamp optical system IL (IL1~IL6) Each illumination region IR (IR1~IR6) is across the position that the median plane CL is overlapped (both ends in the Y direction of each illumination region IR Triangular part).Second label ALMR configurations are in each projection corresponding with each projection optical system PL (PL1~PL6) Region PA (PA1~PA6) is across the position that median plane CL is overlapped (triangular parts at the both ends in the Y-direction of each view field PA). In calibration, by the calibrating installation 110 of each setting in each projection optics module PLM according to across the of median plane CL One row (odd number), secondary series (even number) sequence, successively receive first label ALMM as and second label ALMR Picture.

As described above, in step s 103, based on the adjustment (the mainly adjustment of machinery) for being changed to light shield Ma progress After end, slave control device 16 adjusts exposure device U3d, so that the substrate of the light shield Ma and handling substrate P after replacing The position offset between cylinder 25 is supported below allowable range.In this way, slave control device 16 at least uses the first label The picture of the picture of ALMM and the second label ALMR adjust exposure device U3d.As a result, based on from the light shield Ma and base after replacement The picture of actual label that plate bearing cylinder 25 is got, to the adjustment by machinery without complete modified error further into Row is corrected.Therefore, exposure device U3d can be exposed with appropriate and good precision using the light shield Ma after replacement.

In the above example, after having replaced light shield, exposure device U3d is mainly mechanically had adjusted, but replacing Adjustment after light shield is not limited to this.For example, the difference very little of the diameter in the cylinder light shield for being mountable to exposure device U3d In the case of, by coordinating the cylinder light shield of the diameter minimum in these cylinder light shields, be determined in advance lamp optical system IL with And the effective diameter of projection optical system PL and the size of polarising beam splitter PBS, it can need not also carry out illuminating bundle The adjustment of the angular characteristics of EL1 etc. etc..Thereby, it is possible to simplify the adjustment of exposure device U3d operation.In the present embodiment, may be used Multiple groups are classified as according to the diameter of light shield respectively with the light shield that can use exposure device U3d, changes light shield in group In the case of the case where diameter and diameter of the range to change light shield beyond group, change the regulating object of exposure device U3d Or component etc..

Figure 32 is the side view for showing to support the example of light shield in a rotatable way using air bearing.Figure 33 is to show Go out to support the stereogram of the example of light shield in a rotatable way using air bearing.Keep the light shield holding cylinder 21 of light shield M Both ends can also in a rotatable way be supported by air bearing 160.Air bearing 160 is made as multiple bearings are single Member 161 is configured to ring-type in the peripheral part of light shield holding cylinder 21.Moreover, air bearing 160 is by from each bearing unit 161 Peripheral surface of the inner circumferential towards light shield holding cylinder 21 spray air (air), to support light shield holding cylinder in a rotatable way 21.In this way, one in multiple light shield M different as diameter each other is equipped in a manner of replaceable of air bearing 160 and Light shield holding mechanism around the rotation of defined axis (first axle AX1) works.

In above-mentioned step S103, air bearing 160 replaces bearing unit according to the diameter of the light shield Ma of replacement 161.In addition, each bearing can also be adjusted in the case of the difference very little of the diameter (2 × Rm) of light shield M before and after the replacement 161 diametrical position of unit keeps it corresponding with the light shield M after replacement.Like this, in exposure device U3d via air In the case that bearing 160 supports light shield M in a rotatable way, air bearing 160 in a manner of replaceable as supporting diameter The bearing arrangement of the exposure device U3d main body sides of different light shields works.

< sixth embodiments >

Figure 34 is the integrally-built figure for the exposure device for showing sixth embodiment.Using Figure 34 to exposure device U3e It illustrates.In order to avoid repeat record, illustrated only for the part different from above-mentioned embodiment, for The same inscape of embodiment marks reference numeral identical with embodiment and illustrates.In addition, the 5th embodiment Each structure of exposure device U3d can be applied to present embodiment.

The exposure device U3 of embodiment is to use light to reflect as the structure of the reflection-type light shield of projected light beam, But the exposure device U3e of present embodiment is to use the light to be transmitted from light shield as the transmission-type light shield (transmission of projected light beam Type cylinder light shield) structure.In exposure device U3e, light shield holding mechanism 11e has the light shield holding cylinder for keeping light shield MA The driven roller 94 and driving portion 96 of 21e, the deflector roll 93 of bearing light shield holding cylinder 21e, driving light shield holding cylinder 21e.Although It is not shown, but exposure device U3e has the replacement mechanism 150 for replacing light shield MA as shown in figure 23.

Light shield holding mechanism 11e installs one in the different multiple light shield MA of diameter each other in a manner of replaceable, and It is rotated around defined axis (first axle AX1).Exposure device U3e has adjustment section, and the adjustment section is according to being installed on replaceable Mode be equipped with one of the different multiple light shield MA of diameter each other and and around the first axle AX1 as defined axis into The diameter of the light shield MA of the light shield holding mechanism 11e of row rotation, to adjust at least between first axle AX1 and base supporting mechanism Distance.The adjustment section is supported the peripheral surface for the light shield MA for being installed on light shield holding mechanism 11e and base supporting mechanism Interval between substrate P is set in prespecified allowable range.

Light shield holding cylinder 21e using the manufactures such as such as glass or quartz, have certain thickness cylindrical shape, Its peripheral surface (barrel surface) forms the light shield face of light shield MA.That is, in the present embodiment, the illumination region on light shield MA is therefrom Heart line bends to the cylinder planar with certain radius of curvature R m.When from the radial direction from light shield holding cylinder 21e, light shield In holding cylinder 21e with the part such as light shield holding cylinder 21e of the pattern registration of light shield MA in addition to two end sides in Y direction Center portion in addition has translucency to illuminating bundle.Configured with the illumination region on light shield MA on light shield face.

Light shield MA is made into very thin glass plate (such as 100 μm~500 μ of thickness for example in the good strip of flatness M) using the planar sheet material light shield for foring the transmission-type of pattern by light shield layers such as chromium on a surface, it is made to copy The peripheral surface of light shield holding cylinder 21e is bent, and is used in the state of the peripheral surface with winding (fitting).Light shield MA has not The non-pattern forming region for forming pattern, is installed in non-pattern forming region on light shield holding cylinder 21e.Light shield MA can It is detached from from light shield holding cylinder 21e.The light shield MA and light shield M of embodiment is it is equally possible that substitution is wound in transparent cylinder The light shield holding cylinder 21e that base material is constituted, and the peripheral surface in the light shield holding cylinder 21e being made of transparent cylinder base material is directly sharp With drafting mask pattern on the light shield layers such as chromium come integrated.In this case, light shield holding cylinder 21e also realizes the branch of light shield The function of bearing member.

Deflector roll 93 and driven roller 94 extend in the Y direction parallel with the central shaft of light shield holding cylinder 21e.Deflector roll 93 and driven roller 94 be arranged to revolve around the axis parallel with the Pivot axle of light shield MA and light shield holding cylinder 21e Turn.The outer diameter of end on 94 respective axis direction of deflector roll 93 and driven roller than other parts shape bigger, the end with Light shield holding cylinder 21e is circumscribed.Like this, deflector roll 93 and driven roller 94 are arranged to not kept with light shield holding cylinder 21e Light shield MA contacts.Driven roller 94 is connect with driving portion 96.Driven roller 94 is by conducting the torque supplied from driving portion 96 to light Cover holding cylinder 21e is rotated to make light shield holding cylinder 21e rotate about central shaft.

There are one deflector rolls 93 for light shield holding mechanism 11e tools, but quantity is not to limit, and can also be two or more.Together Sample, there are one driven rollers 94 for light shield holding mechanism 11e tools, but quantity is not to limit, and can also be two or more.It leads At least one of roller 93 and driven roller 94 can be only fitted to the inside of light shield holding cylinder 21e, and in light shield holding cylinder 21e It cuts.In addition, when from the radial direction from light shield holding cylinder 21e, the not pattern registration with light shield MA in light shield holding cylinder 21e Part (two end sides of Y direction) to illuminating bundle can have translucency, can not also have translucency.In addition, deflector roll 93 and driven roller 94 in one side or both can also be such as circular cone shape, central shaft (rotary shaft) and central shaft It is not parallel.

Preferably, exposure device U3e is respectively by the field of view (lighting area of the first projection optical system shown in Figure 25 Domain) field of view (illumination region) IRb of IRa and the second projection optical system is configured at the position of deflector roll 93 and driven roller 94. Even if if it does, then the diameter change of light shield MA if can keep the position of field of view IRa, IRb respectively in the Z-axis direction Set fixation.As a result, in the case where being changed to the different light shield MA of diameter, it is easy to each leisure of field of view IRa, IRb Position in Z-direction is adjusted.

The lighting device 13e of present embodiment has light source (illustration omitted) and lamp optical system (lighting system) ILe.Lamp optical system ILe has with each in multiple projection optical system PL1~PL6 correspondingly in Y direction Multiple (such as 6) lamp optical system ILe1~ILe6 of upper arrangement.Light source and the light supply apparatus of embodiment 13 are same Ground can use various light sources.So that the Illumination Distribution of illumination light shot from the light source is homogenized, such as is led via optical fiber etc. Light component is distributed to multiple lamp optical system ILe1~ILe6.

Multiple lamp optical system ILe1~ILe6 are respectively provided with multiple optical components such as lens.Multiple illumination optical systems System ILe1~ILe6 is respectively provided with such as integrated optics system, cylindrical lenses or fly's-eye lens, uniform using Illumination Distribution Illuminating bundle irradiate the illumination region of light shield MA.In the present embodiment, multiple lamp optical system ILe1~ILe6 match It is placed in the inside of light shield holding cylinder 21e.Multiple lamp optical system ILe1~ILe6 are respectively from the inside of light shield holding cylinder 21e By light shield holding cylinder 21e, each illumination region on light shield MA kept to the peripheral surface of light shield holding cylinder 21e is irradiated.

Lighting device 13e guides light shot from the light source by lamp optical system ILe1~ILe6, by the illumination light of guiding Beam is from light shield holding cylinder 21e internal irradiations to light shield MA.Lighting device 13e is using illuminating bundle with uniform brightness irradiation light The part (illumination region) for the light shield MA that cover holding cylinder 21e is kept.In addition, light source can be configured at light shield holding cylinder 21e Inside, the outside of light shield holding cylinder 21e can also be configured at.In addition, light source can also be different from exposure device U3e Other devices (external device (ED)).

Lamp optical system ILe1~ILe6 is radiated at from the inside of light shield MA towards its peripheral surface as defined axis The side of the first axle AX1 of line extends upward to the illuminating bundle of slit-shaped.In addition, exposure device U3e has adjustment section, the tune It is whole that width of the illuminating bundle on the direction of rotation of light shield MA is adjusted according to the diameter of the light shield MA of installation.

The base supporting mechanism 12e of exposure device U3e have keep planar substrate P substrate objective table 102, with And so that substrate objective table 102 is scanned mobile mobile device along the X direction in the plane orthogonal with median plane CL and (save Sketch map shows).Since the surface of the substrate P of the sides bearing surface P2 shown in Figure 34 is substantially the plane parallel with the faces XY, institute With by light shield MA reflect and from projection optical system PL by by be projeced into substrate P the chief ray of projected light beam hang down with the faces XY Directly.In the calibration of above-mentioned steps S104, it is equipped with the shown in Figure 31 on the surface of the bearing surface P2 of substrate objective table 102 Two label ALMR.

Exposure device U3e uses transmission-type light shield as light shield MA, but in this case, it is same with exposure device U3 Sample, it can also replace the light shield MA of different-diameter.Moreover, in the case where being changed to the light shield MA of different-diameter, exposure dress U3e is set in the same manner as exposure device U3, is at least having adjusted lamp optical system ILe1~ILe6 and projection optical system PL1 After at least one party in~PL6 so that replace after light shield MA and the substrate objective table 102 of handling substrate P between it is opposite Position relationship is adjusted (setting) in the mode of defined allowable range bias internal.It is based on carrying from light shield MA and substrate as a result, The actual label picture etc. that object platform 102 obtains further carries out precision to the error that the adjustment by machinery has not been corrected It corrects.Therefore, exposure device U3e can keep appropriate and good precision, carry out the exposure based on the light shield after replacement.

In addition it is also possible to replace the base supporting mechanism 12 of the exposure device U3 with embodiment, and by this embodiment party Base supporting mechanism 12e possessed by the exposure device U3e of formula is applied to exposure device U3.Alternatively, it is also possible in embodiment Exposure device U3 on, using deflector roll 93 and driven roller 94, supporting substrates support cylinder 25 in a rotatable way, and respectively will figure The field of view of field of view (illumination region) IRa and the second projection optical system of first projection optical system shown in 25 (illumination region) IRb is configured at the position of deflector roll 93 and driven roller 94.As a result, in the feelings for being changed to the different light shield MA of diameter Under condition, it is easy to adjust the position of field of view IRa, IRb respectively in the Z-axis direction.

The 7th embodiment > of <

Figure 35 is the integrally-built figure for the exposure device for showing the 7th embodiment.Using Figure 35 to exposure device U3f It illustrates.In order to avoid repeat record, illustrated only for the part different from above-mentioned embodiment, for The same inscape of embodiment marks reference numeral identical with embodiment and illustrates.In addition, the 5th embodiment Exposure device U3d and each structure of exposure device U3e of sixth embodiment can be applied to present embodiment.

Exposure device U3f is the substrate board treatment for implementing so-called proximity printing to substrate P.Exposure device U3f will The gap (proximity gap) of light shield MA and substrate supporting cylinder 25f is set as several μm~tens μm or so, lamp optical system ILc directly irradiates illuminating bundle EL to carry out non-contact exposure to substrate P.Light shield MA is set to the surface of light shield holding cylinder 21f. The exposure device U3f of present embodiment is used to transmit the light of light shield MA as the transmission-type light shield of projected light beam EL.It is exposing In device U3f, light shield holding cylinder 21f is the cylindrical shape with certain thickness by manufactures such as such as glass or quartz, Its peripheral surface (barrel surface) forms the light shield face of light shield MA.Although it is not shown, still exposure device U3f has as shown in figure 23 For replacing the replacement mechanism 150 of light shield MA.

In the present embodiment, substrate supporting cylinder 25f is by from the second driving portion with actuators such as electro-motors 26f supply torque and rotate.In such a way that the direction of rotation with the second driving portion 26f oppositely rotates, for example, by magnetism A pair of of driven roller MGG, MGG driving light shield holding cylinder 21f of gear connection.Second driving portion 26f makes substrate supporting cylinder 25f revolve Turn, and driven roller MGG, MGG and light shield holding cylinder 21f is made to rotate, keeps light shield holding cylinder 21f synchronous with substrate supporting cylinder 25f Mobile (synchronous rotary).Since a part for substrate P is via a pair of aerial turning-bar ATB1f, ATB2f, a pair of of deflector roll 27f, 28f is wound in substrate supporting cylinder 25f, so when substrate supporting cylinder 25f rotates, substrate P and light shield holding cylinder 21f are synchronously It is handled upside down.Like this, a pair of of driven roller MGG, MGG multiple light different as diameter each other is equipped in a manner of replaceable One in cover, and its light shield holding mechanism rotated around defined axis (first axle AX1) is made to work.

Positions of the lamp optical system ILc between a pair of of driven roller MGG, MGG and the peripheral surface and base in light shield MA The immediate position of substrate P that plate bearing cylinder 25f is supported, extends in the Y direction from the interior side of light shield MA to substrate P projection For the illuminating bundle of slit-shaped.In proximity printing mode as such, due to exposure position of the mask pattern in substrate P It sets and (is equivalent to view field PA) in the circumferential direction of light shield MA as at one, so when being changed to the different cylinder light shield of diameter, As long as adjusting the positions of the substrate supporting cylinder 25f of cylinder light shield position in the Z-axis direction or supporting substrates P in the Z-axis direction It sets, so that proximity gap remains specified value.

Like this, exposure device U3f uses transmission-type light shield as light shield MA, and implements proximity printing to substrate P, In this case, it also in the same manner as exposure device U3, can be replaced with the light shield MA of different-diameter.Moreover, being changed to not In the case of light shield MA with diameter, exposure device U3f can be by similarly calibrated with exposure device U3, will more Opposite position offset (also including proximity gap) between the substrate supporting cylinder 25f of light shield MA after changing and handling substrate P Adjustment is within the allowable range.It is further smart as a result, based on the actual label picture obtained from light shield MA and substrate supporting cylinder 25f Thickly correct through the adjustment of machinery without complete modified error, as a result, exposure device U3f can keep it is appropriate and Good precision is exposed.

Further, since the lamp optical system ILc of exposure device U3f as shown in figure 35 will it is elongated in the Y direction and The illuminating bundle of narrower width in X-direction (direction of rotation of light shield MA) is radiated at light shield with defined numerical aperture (NA) The light shield face of MA, so even if the diameter of the cylinder light shield of installation need not be to from lamp optical system ILc's if different The directional characteristic (slope etc. of chief ray) of illuminating bundle is substantially significantly adjusted.Here, can also be with according to light The diameter (radius) of MA is covered to change width of the illuminating bundle for exposing to light shield face in X-direction (direction of rotation of light shield MA) The illuminated field diaphragm (variable window shade) of variable-width is arranged in the mode of degree in lamp optical system ILc, or setting is only Reduce or expand dioptric system (such as the cylinder of width of the illuminating bundle in X-direction (direction of rotation of light shield MA) Zoom lens etc.).

In addition, in the exposure device U3f of Figure 35, substrate P is cylinder planar by the 25f bearings of substrate supporting cylinder, but It can be supported to as the exposure device U3e of Figure 34 planar.When substrate P is supported to planar, and it is supported to The case where cylinder planar, is compared, and can expand illuminating bundle corresponding with the difference of the diameter of light shield MA in X-direction (light shield The direction of rotation of MA) on width adjusting range.Thereby, it is possible in proximity corresponding with the diameter of light shield MA gap Allowable range in, be best by width adjustment of the illuminating bundle in X-direction (direction of rotation of light shield MA), can make turn The maintenance and productivity printed to the pattern quality (fidelity etc.) in substrate P optimizes.In this case, can be changed window shade or Person's cylinder zoom lens etc. are included in adjusts the adjustment section of the width of illuminating bundle according to the diameter of the light shield MA of transmission-type In.

In above each embodiment, being mountable to the diameter of the cylinder light shield of exposure device, there are certain ranges. For example, in the exposure device of the projection optical system projected with the fine pattern for being 2 μm~3 μm or so to line width, The width of the depth of focus DOF of the projection optical system is tens μm or so very narrow, the in addition focusing in projection optical system The range of adjustment generally also can be very narrow.For this exposure device, it is difficult to install diameter relative to being defined as the straight of specification Diameter is with the cylinder light shield of millimeter Unit alteration.Here, in exposure device side, from initially just to become with the diameter of cylinder light shield Change corresponding mode make each section, each mechanism have larger adjusting range in the case of, on the basis of the adjusting range On, to determine the diameter range for the cylinder light shield that can be installed.In addition, in the exposure device as shown in figure 35 close to mode In, as long as a part for the peripheral surface of light shield MA and the gap of substrate P converge on defined range, if cylinder light shield Supporting device be can corresponding structure, then when diameter is 0.5 times, 1.5 times, 2 times ..., even if largely different Cylinder light shield can also be installed.

Figure 36 be show the supporting device in the exposure device of the cylinder light shield M of reflection-type local structure example it is vertical Body figure.In Figure 36, the direction (side Y to extending towards the rotary shaft AX1 of cylinder light shield M (light shield holding cylinder 21) is illustrated only To) the mechanisms that are supported of side shaft 21S outstanding, but also be provided with same mechanism in opposite side.Figure 36's In the case of, dial disc SD is integrally provided with cylinder light shield M, but can also formed device use up cover pattern while, The scale (grid) that two end sides setting in the Y-direction of the peripheral surface of cylinder light shield M can be read by encoder head.

Even being formed with the light shield M (light shield holding cylinder 21) of different-diameter also always with solid in the top end part of shaft 21S Fixed diameter carrys out precision machined cylinder 21K.Cylinder 21K is by the one of the frame (fuselage) 200 of exposure device main body Part incised notch is supported at the part of U-shaped by moveable Z movable bodys 204 in (Z-direction) in above-below direction.In frame 200 U-shaped the end that extends in z-direction of incised notch part, be formed in a manner of opposite at a prescribed interval in the X direction Rail portion 201A, 201B linearly extended in z-direction.

It is formed on Z movable bodys 204：For the recessed of the substantially lower half portion using air bearing supporting cylinder body 21K Fall into the cushion part 204P of semicircle shape；Slide section 204A, 204B to fasten with rail portion 201A, 201B with frame 200. Slide section 204A, 204B is mechanically contacted in a manner of smoothly being moved relative to rail portion 201A, 201B in z-direction Bearing or air bearing bearing.

On frame 200 be equipped with by can around the axis parallel with Z axis rotate in a manner of be pivotally supported ball-screw 203, The driving source (motor, reduction gearing etc.) 202 for making the ball-screw 203 rotate.The nut portions screwed togather with ball-screw 203 are set In in cam member 206, which is set to the downside of Z movable bodys 204.Therefore, pass through the rotation of ball-screw 203 Turn so that cam member 206 moves linearly in z-direction, and Z movable bodys 204 also move linearly in z-direction as a result,.Scheming Though being not shown in 36, can also be equipped on the component of the top end part of rotating bearing ball leading screw 203 so that cam member 206 is in X Displacement is not generated on direction or Y-direction and the guiding elements that guides of the mode that moves in z-direction.

Cam member 206 and Z movable bodys 204 can be fixed as one, and can also be by the rigidity height on the directions Z and in X The direction either connections such as rigidity low leaf spring or flexure member in Y-direction.Alternatively, can also be respectively in cam member 206 Upper surface and Z movable bodys 204 lower surface on form spheric seating, steel ball is set between these spheric seatings.Like this, energy Enough one side allows convex centered on steel ball on one side in z-direction with high rigidity bearer cams component 206 and Z movable bodys 204 Take turns the opposite micro inclination of component 206 and Z movable bodys 204.Moreover, in the supporting device of Figure 36, Z movable bodys 204 with The most elastic bearing component of the dead weight for supporting cylinder light shield M (light shield holding cylinder 21) is equipped between frame 200 208A、208B。

Elastic bearing component 208A, 208B is by changing the air slide of length by internally supplying compressed gas It constitutes, the load-carrying of the cylinder light shield M (light shield holding cylinder 21) supported by Z movable bodys 204 is supported using air pressure.Using Z can The cushion part 204P of kinetoplast 204 supports the feelings of the cylinder 21K of the rotary shaft as cylinder light shield M (light shield holding cylinder 21) Under condition, dead weight is also different certainly by the different cylinder light shield M (light shield holding cylinder 21) of diameter.Therefore, confession is adjusted according to the dead weight To the pressure extremely as the compressed gas in the air slide of elastic bearing component 208A, 208B.Thereby, it is possible to significantly drop The low load-carrying acted in the Z-direction between the nut portions in ball-screw 203 and cam member 206, makes ball-screw 203 are also rotated with minimum torque, therefore driving source 202 can be made also to minimize, and can be prevented caused by fever etc. Frame 200 deforms.

In addition, be not shown in Figure 36, but the position in the Z-direction of Z movable bodys 204 be using as linear encoder this The device for measuring length of sample is critically measured with sub-micron Measurement Resolution below, and based on the measured value come servo control Driving source 202 processed.Furthermore, it is also possible to be additionally provided with the variation to acting on the load-carrying between Z movable bodys 204 and cam member 206 The load measuring sensor that measures measures the strain deformed caused by the stress in z-direction of cam member 206 and passes Sensor etc., according to the measured value from each sensor, SERVO CONTROL is to the air as elastic bearing component 208A, 208B The pressure (supply and exhaust of gas) of the compressed gas of piston supply.

Moreover, cylinder light shield M (light shield holding cylinder 21) is being mounted on the cushion part 204P of Z movable bodys 204 sometimes, And after the height in z-direction based on driving source 202 is set in defined position, lamp optical system is being carried out IL, the various adjustment of projection optical system PL, calibration way in, or based on calibration as a result, making cylinder light shield M again The position fine motion of (light shield holding cylinder 21) in z-direction.The supporting device of Z movable bodys 204 with Figure 36 is also set to cylinder light It is movable by each Z for adjusting separately the supporting device for being set to both sides in the shaft for covering the opposite side of M (light shield holding cylinder 21) The position in z-direction of body 204, additionally it is possible to adjust micro slopes of the Pivot axle AX1 relative to the faces XY.By with Upper type, can also installation cylinder light shield M (light shield holding cylinder 21) on the directions Z position adjustment, tilt adjustments complete Later, Z movable bodys 204 are mechanically clipped between rail portion 201A, 201B (that is, frame 200).

It is set as when by the maximum gauge for being mountable to the cylinder light shield M (light shield holding cylinder 21) of projection aligner DSa, when minimum diameter is set as DSb, the stroke of Z movable bodys 204 in z-direction is preferably (DSa-DSb)/2.As one Example, when setting the maximum gauge of installable cylinder light shield M (light shield holding cylinder 21) to 300mm, minimum diameter is arranged For 240mm when, the stroke of Z movable bodys 204 is 30mm.

The cylinder light shield M of diameter 300mm is it is meant that compared with the cylinder light shield M of diameter 240mm, in the week of cylinder light shield It will only expand 60mm × π ≈ 188mm as the pattern forming region of light shield M on (scan exposure direction).It is swept in such as previous It is such to retouch exposure device, in the case of so that plane light shield is one-dimensionally scanned movement, expands pattern shape in a scanning direction It can lead to the enlargement of light shield objective table corresponding with the plane light shield expansion size of 180mm or more at region and in order to make The mobile stroke of light shield objective table expands the enlargement of the airframe structure of 180mm or more.In contrast, as shown in figure 36, only logical The Z movable bodys 204 that crossing enables the rotary shaft AX1 (shaft 21S) to cylinder light shield M (light shield holding cylinder 21) to be supported exist It is critically moved in Z-direction, it is not necessary to make the other parts enlargement of device, it will be able to which the pattern for easily expanding light shield is formed Region.

< device making methods >

Hereinafter, being illustrated to device making method with reference to Figure 37.Figure 37 is the device manufacture for showing device inspection apparatus The flow chart of method.The device making method can be real by any of embodiment of first embodiment~the 7th It is existing.

In the device making method shown in Figure 37, first, carry out such as the display based on self-emission device organic EL The function and performance design of panel, the circuit pattern needed using designs such as CAD, wiring pattern (step S201).Then, base The pattern of each layer in the various layers by designs such as CAD, to make the light shield M (step S202) of required layer amount. In addition, preparing the flexible substrate P (resin film, metal foil film, plastics etc.) for being wound with the base material as display panel in advance Supply with volume FR1 (step S203).In addition, the substrate P of the web-like prepared in step S203 can be pair as needed Substrate that its surface is modified, the substrate for being formed with basal layer (such as minute asperities based on coining mode) in advance, It is laminated with the substrate of photosensitive functional membrane or hyaline membrane (insulating materials) in advance.

Then, form that (film is partly led by the electrode, wiring, insulating film, the TFT that constitute display panel device in substrate P Body) etc. compositions backsheet layer, and the hair based on self-emission devices such as organic EL is formed in a manner of being laminated on the backsheet layer Photosphere (display pixel portion) (step S204).In step S204, also contains and said using in each embodiment in front Clear exposure device U3 further includes based on following the previous photo-mask process that is exposed to photoresist layer The processing of process, the process include：To substitution photoresist, the substrate P coated with photonasty silane coupling material carries out Pattern exposure come form the exposure process of hydrophily and hydrophobic pattern on a surface of the substrate, to photosensitive catalysis Oxidant layer carries out pattern exposure and forms the wet type operation of the pattern (wiring, electrode etc.) of metal film by non-electrolytic plating method, Alternatively, the printing process etc. to be drawn a design using the electrically conductive ink etc. containing Nano silver grain.

Then, base is cut by each display panel device being continuously manufactured by the substrate P of strip by volume mode Plate P, protective film (environment reply barrier layer) and/or colored filter etc. are pasted on the surface of each display panel device, from And assembly device (step S205).Then, inspection operation is carried out, checks whether display panel device normally functions, is It is no to meet desired performance and characteristic (step S206).By the above, display panel (Flexible Displays can be manufactured Device).

The exposure device of above-mentioned embodiment and its variation is by with mechanical precision as defined in holding, electrical The mode of precision and optical accuracy by with this application claims in the range of each integral part enumerated including it is each Subsystem assembles manufacture.In order to ensure these various precision, before and after group device, exposure device, for various light System carries out the adjustment for reaching optical accuracy, and the tune for reaching mechanical precision is carried out for various mechanical systems It is whole, carry out the adjustment for reaching electric precision for various electrical systems.The group of exposure device is assembled to from each subsystem Dress process includes mechanical connection, the wiring connection of electric circuit and the pipeline of pneumatic circuit between each subsystem Connection etc..Before being assembled to the assembling procedure of exposure device from each subsystem, there certainly exist each subsystem is respective Assembling procedure.At the end of each subsystem is assembled to the assembling procedure of exposure device, structure adjusting is carried out, it is ensured that exposure The various precision of device on the whole.In addition, the manufacture of exposure device is preferably managed to temperature and cleanliness factor etc. It is carried out in the dust free room of reason.

In addition, the inscape of the above embodiment and its variation can be appropriately combined.In addition, also not making sometimes With a part of inscape.Moreover, can also carry out without departing from the spirit and scope of the invention inscape replacement or Person changes.In addition, as long as laws and regulations allow, having with exposure device etc. of quoting in the above-described embodiment can be quoted The part of the entire disclosure bulletin of pass and the record of United States Patent (USP) as the record of this specification.Like this, it is based on upper Embodiment is stated, the other embodiment and application technology etc. made by those skilled in the art etc. are also integrally incorporated in In the scope of the present invention.

Reference sign

1 device inspection apparatus

2 substrate feeding devices

4 substrate retracting devices

5 host control devices

U3 exposure devices (substrate board treatment)

M light shields

IR1~IR6 illumination regions

IL1~IL6 lamp optical systems

ILM light optics modules

PA1~PA6 view fields

PLM projection optics modules

Claims (18)

1. a kind of scanning-exposure apparatus makes to be formed on the peripheral surface from center line with defined radius bend at cylindrical shape The cylinder light shield of the pattern of electronic equipment is rotated around the center line, and make to be supported to cylindric or planar substrate with Corresponding to the speed movement of the rotary speed of the cylinder light shield, as a result, by the pattern exposure of the cylinder light shield to the base Plate, the scanning-exposure apparatus be characterized in that,

With supporting device, rotatably supports in exposure device main body and extend to the center line of the cylinder light shield Direction on both sides shaft outstanding, and between the center line and the substrate for changing the cylinder light shield away from From Z-direction on can move the cylinder light shield relative to the exposure device main body,

The supporting device includes：Rotatably support the movable body of the shaft；To change the movable body relative to described The mode of position of the exposure device main body in the Z-direction drives the driving source of the movable body in z-direction；And it is used for Mitigate the bullet of the load of the driving source using the major part of the dead weight of cylinder light shield described in the exposure device body abutment Property supporting member.

2. scanning-exposure apparatus according to claim 1, which is characterized in that

The supporting device further includes the length measuring instrument measured to position of the movable body in the Z-direction,

The driving source is servo-controlled based on the measured value measured by the length measuring instrument.

3. scanning-exposure apparatus according to claim 2, which is characterized in that

The elastic bearing component is made of air slide, and the air slide is by supplying to the air pressure of the compressed gas of inside Come support the cylinder light shield dead weight major part.

4. scanning-exposure apparatus according to claim 3, which is characterized in that

It is set as maximum dimension D Sa in the diameter of the peripheral surface for the cylinder light shield that can be installed on the exposure device main body When between minimum diameter DSb, the shift motion in the Z-direction of the movable body is set to (DSa-DSb)/2 or more.

5. scanning-exposure apparatus according to claim 4, which is characterized in that

The pressure to the compressed gas of the air slide is supplied according to because being installed on described in the exposure device main body The diameter of the peripheral surface of cylinder light shield and the dead weight of the cylinder light shield that changes adjust.

6. scanning-exposure apparatus according to claim 5, which is characterized in that

It is additionally provided with the load that the load-carrying of the cylinder light shield to acting on the movable body for supporting the shaft measures Retransmit sensor or to deforming the strain measured as caused by the stress in the Z-direction generated by the load-carrying Sensor,

It supplies to the pressure of the compressed gas of the air slide and is based on the load measuring sensor or the strain transducer Measured value and by SERVO CONTROL.

7. according to scanning-exposure apparatus according to any one of claims 1 to 6, which is characterized in that

The supporting device is set as individually supporting two pleurapophysis in the direction extended to the center line of the cylinder light shield Each of the shaft gone out,

Each described movable body for being included of the supporting device is individually adjusted in the Z-direction by the driving source On position, to adjust slope of the center line relative to the substrate.

8. a kind of scanning-exposure apparatus makes to be formed on the peripheral surface from center line with defined radius bend at cylindrical shape The cylinder light shield of the pattern of electronic equipment is rotated around the center line, the projected light that will be generated by the pattern of the cylinder light shield Beam via projection optical system and projection exposure to the substrate moved with the speed of the rotary speed corresponding to the cylinder light shield On, the scanning-exposure apparatus is characterized in that,

With supporting structure, in exposure device main body by make the cylinder light shield around the center line rotate in a manner of carry out Bearing, and in order to by a certain of the diameter of peripheral surface the first cylinder light shield different from each other and the second cylinder light shield It is a to be installed on the exposure device main body, the Z-direction at a distance from the change center line is between the projection optical system On can move the cylinder light shield relative to the exposure device main body,

It is described when the first cylinder light shield for being installed on the exposure device main body is replaced with the second cylinder light shield Supporting device by the peripheral surface of the second cylinder light shield after replacing to be set in the peripheral surface with the first cylinder light shield In be set with the projection optical system perspective view the Z-direction on the identical position in position mode, adjust institute State position of the second cylinder light shield in the Z-direction.

9. scanning-exposure apparatus according to claim 8, which is characterized in that

The supporting device includes：

Movable body rotatably supports and prolongs to the center line of the first cylinder light shield or the second cylinder light shield The both sides shaft outstanding in the direction stretched, the movable body can move in the Z-direction；

Driving source drives the movable body in the Z-direction；And

Elastic bearing component is used to utilize the first cylinder light shield described in the exposure device body abutment or described the The major part of the dead weight of two cylinder light shields, to mitigate the load of the driving source.

10. scanning-exposure apparatus according to claim 9, which is characterized in that

The supporting device further includes the length measuring instrument measured to position of the movable body in the Z-direction, institute It is servo-controlled based on the measured value measured by the length measuring instrument to state driving source.

11. scanning-exposure apparatus according to claim 10, which is characterized in that

The elastic bearing component is made of air slide, and the air slide is by supplying to the air pressure of the compressed gas of inside To support the major part of the first cylinder light shield installed or the respective dead weight of the second cylinder light shield.

12. scanning-exposure apparatus according to claim 11, which is characterized in that

The pressure to the compressed gas of the air slide is supplied according to the institute that can be installed on the exposure device main body The difference of the first cylinder light shield and the respective dead weight of the second cylinder light shield is stated to adjust.

13. the scanning-exposure apparatus according to any one of claim 8~12, which is characterized in that

The projection optical system includes the first projection optics module and the second projection optics module, the first projection optics mould Group and the second projection optics module are configured to, the week on the peripheral surface of the first cylinder light shield or the second cylinder light shield The field of view has been set separately in two positions on the direction with the center line in separation.

14. scanning-exposure apparatus according to claim 13, which is characterized in that

For the field of view of described two positions, the first field of view of the first projection optics module and described second Second field of view of projection optics module is set in identical position in the Z-direction,

It is described when the exposure device main body is mounted with some of the first cylinder light shield and the second cylinder light shield Peripheral surface is adjusted to first field of view and the second field of view both sides by the supporting device in the side Z Upward position consistency.

15. a kind of scanning-exposure apparatus makes to be formed on the peripheral surface from center line with defined radius bend at cylindrical shape There is the cylinder light shield of the pattern of electronic equipment to be rotated around the center line, will will shone from the illumination light of lamp optical system The reflected light generated when the pattern of the cylinder light shield is incident upon via projection optical system and projection exposure to described to correspond to On the substrate of the speed movement of the rotary speed of cylinder light shield, the scanning-exposure apparatus is characterized in that,

Have：

The supporting device of light shield, in exposure device main body by make the cylinder light shield around the center line rotate in a manner of into Row bearing, and some of the different multiple cylinder light shields of the diameter of the peripheral surface can be installed on the exposure device Main body；

Base supporting mechanism supports the substrate, and makes the substrate with the speed of the rotary speed based on the cylinder light shield Degree movement；

Polarising beam splitter, configure by the light shield supporting device bearing the cylinder light shield peripheral surface it is attached Closely, the illumination from the lamp optical system is guided towards the illumination region of the part setting on the peripheral surface Light, and the reflected light generated from the pattern in the illumination region is guided to the projection optical system；With And

Calibrating installation, in the cylinder light shield that will be supported by the supporting device of the light shield other cylinders different from diameter When light shield is replaced, be detected optically by other cylinder light shields peripheral surface formation adjustment first label, with Position relationship between the second label of the adjustment that a part for the base supporting mechanism is formed.

16. scanning-exposure apparatus according to claim 15, which is characterized in that

Calibrating installation includes：

Beam splitter, with the light path of the illumination light that can be between the lamp optical system and the polarising beam splitter The mode of middle disengaging configures；And

Photographing element detects the picture and described second of first label by the polarising beam splitter and the beam splitter The picture of label.

17. scanning-exposure apparatus according to claim 16, which is characterized in that

Calibrating installation further includes light source, the light source make the light beam of calibration from the photograph from the lamp optical system The face opposite side of the polarising beam splitter of Mingguang City's incidence is incident.

18. scanning-exposure apparatus according to claim 16, which is characterized in that

Calibrating installation further includes light source, and the light source is arranged in the base supporting mechanism, irradiates second label from the negative, The light source, which is sent out, to be transmitted from second label and is projected to via the projection optical system and the polarising beam splitter The light beam of the calibration of other cylinder light shields after replacement.