CN106933066B - Exposure device, device inspection apparatus and device making method and pattern exposure method using the exposure device - Google Patents

Abstract

Have：First supporting member, by along by regulation curvature bending at the first face of cylinder planar in a manner of support the side in light shield and substrate；Second supporting member supports another party in light shield and substrate in a manner of along defined second face；And mobile mechanism, it makes the first supporting member rotate, and the second supporting member is made to move, light shield and substrate is set to be moved on scan exposure direction, projection optical system, which utilizes, includes the projected light beam including the chief ray substantially parallel with the line at the center perpendicular to the scan exposure direction of view field, the picture of pattern is formed in defined projection image planes, mobile mechanism sets the movement speed of the first supporting member and the movement speed of the second supporting member, so that the larger face of curvature in the projection image planes of pattern and the plane of exposure of substrate or being relatively shorter than the movement speed of another party as the movement speed of plane side.

Description

Exposure device, device inspection apparatus and device making method using the exposure device And pattern exposure method

The present patent application be international filing date be on October 23rd, 2014, international application no PCT/JP2014/058109, National application number into National Phase in China is 201480034715.7, entitled " substrate board treatment, device manufacture The divisional application of the patent application of method, scanning exposure method, exposure device, device inspection apparatus and device making method ".

Technical field

The pattern of light shield is projected at the substrate for exposing the pattern on substrate and on the substrate the present invention relates to a kind of Manage device, device making method, scanning exposure method, exposure device, device inspection apparatus and device making method.

Background technology

There is a kind of device inspection apparatus of the various devices such as the display device or semiconductor of manufacture liquid crystal display etc..Device Manufacture system has the substrate board treatments such as exposure device.The substrate board treatment recorded in patent document 1, matches being formed in The picture for being placed in the pattern of the light shield of illumination region is projected to the substrate for being configured at view field etc., and the figure is exposed on substrate Case.The light shield used in substrate board treatment has planar, also there is cylindrical shape etc..

In the exposure device used in photo-mask process, it is known to a kind of that use disclosed in following patent documents Cylindric or columned light shield (hereinafter also referred to collectively as cylinder light shield) carrys out exposure device (such as the patent document of exposure base 2).Additionally, it is known that also a kind of using cylinder light shield, the device pattern of display panel is continuously exposed to flexibility Exposure device (such as patent document 3) on the sheet material substrate of the strip of (flexibility).

Existing technical literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2007-299918 bulletins

Patent document 2：International Publication WO2008/029917

Patent document 3：Japanese Unexamined Patent Publication 2011-221538 bulletins

Invention content

Herein, substrate board treatment is by increasing the exposure area (view field of slit-shaped) on scan exposure direction, The scan exposure time for an irradiation area or device area on substrate can be shortened, so as to improve per unit The productivitys such as the processing number of the substrate of time.But as described in Patent Document 1, carried when for productive It is high and when using rotatable cylindric light shield, mask pattern is bent into cylindrical shape, therefore, if by mask pattern (cylindrical shape) Direction of the circumferential direction as scan exposure, increase the size on scan exposure direction of the view field of slit-shaped, then sometimes Projection exposure can decline in the quality (picture quality) of the pattern on substrate.

As shown in above-mentioned patent document 2, cylindric or columned light shield is from defined Pivot axle (center Line) peripheral surface (barrel surface) with certain radius is played, electronic device (such as semiconductor IC chip is formed on the peripheral surface Deng) mask pattern.When mask pattern being transferred on photosensitive substrate (wafer), make on one side substrate with fixing speed to One direction movement, makes cylinder light shield around Pivot axle synchronous rotary on one side.In this case, if so that cylinder light shield The entire perimeter mode corresponding with the length of substrate of peripheral surface sets the diameter of cylinder light shield, then can be in the length of substrate Spend continuously scan exposure mask pattern in range.In addition, as described in patent document 3, if using cylinder light shield as such, The sheet material substrate flexible (having photosensitive layer) for only transporting strip with fixing speed on strip direction by one side, makes on one side Cylinder light shield with the speed sync rotates, it will be able to repeat the pattern of display panel to be continuously exposed on sheet material substrate On.In this way, using cylinder light shield so that the efficiency or rhythm of the exposure-processed of substrate are improved, to Expect that the productivity of electronic device, display panel etc. improves.

But especially in the case where the mask pattern to display panel is exposed, the picture ruler of display panel Very little is several inches~tens inches, is diversified, therefore, size, the length-width ratio in the region of mask pattern are also a variety of more Sample.In this case, if in uniquely determining diameter or the rotation of the cylinder light shield that can be installed on exposure device Mandrel to size, then be difficult to correspondingly effectively match in the peripheral surface of cylinder light shield with the display panel of various size Set mask pattern region.For example, even if can be by the one of the display panel for the display panel of big picture dimension The mask pattern region of face size is formed in the substantially whole circumference of the peripheral surface of cylinder light shield, but for slightly than the size In the case of small display panel, the mask pattern region of two sides size can not be formed so that circumferential (or Pivot axle To) blank will increase.

The purpose of form of the present invention is, provide it is a kind of can be to produce the base of the substrate of high-quality compared with high productivity Plate processing unit, device making method and scanning exposure method.

The purpose of another form of the present invention is, provides a kind of exposure that can install the different cylinder light shield of diameter Device, device inspection apparatus and the device making method using this exposure device.

First form according to the present invention, provides a kind of substrate board treatment, the substrate board treatment have will come from light The light beam of the pattern of cover is projected to the projection optical system of the view field configured with substrate, wherein the light shield is configured at photograph The illumination region of Mingguang City, the substrate board treatment have：First supporting member, in the illumination region and the projected area In a side region in domain, by along by regulation curvature bending at the first face of cylinder planar in a manner of come support the light shield and A side in the substrate；Second supporting member, in another party region in the illumination region and the view field, Another party in the light shield and the substrate is supported in a manner of along defined second face；And mobile mechanism, make institute The rotation of the first supporting member is stated, the side in the light shield and the substrate that first supporting member supported is made to be exposed in scanning It is moved on light direction, and second supporting member is made to move, the light shield for making second supporting member be supported and institute The another party stated in substrate moves on the scan exposure direction；The picture of the pattern is formed in by the projection optical system In defined projection image planes, the mobile mechanism sets the movement speed of first supporting member and the second bearing structure The movement speed of part, the face for keeping the curvature in the projection image planes of the pattern and the plane of exposure of the substrate larger or as flat The movement speed of face side is relatively shorter than the movement speed of another party.

Second form according to the present invention, provides a kind of device making method, which includes using first Substrate board treatment described in form forms the pattern of the light shield on the substrate；It is supplied with to the substrate board treatment To the substrate.

Third form according to the present invention, provides a kind of scanning exposure method, which will be formed in advise Fixed radius of curvature bends to the pattern of the one side of cylindric light shield and is projected via projection optical system to being supported to cylinder The surface of shape or planar flexible base board, and light shield is made to be moved with defined speed along the one side of bending on one side, one While making substrate be moved with defined speed along the surface for being supported to cylindric or planar substrate, to base on substrate When the projection image of the pattern of projection optical system is scanned exposure, it will be formed with based on projected light with best focus The radius of curvature of the projection image planes of the projection image of the pattern of system is set as Rm, will be supported to cylindric or planar base The radius of curvature on the surface of plate is set as Rp, by the movement speed of the pattern image moved along projection image planes by the movement of light shield It being set as Vm, when by being set as Vp along the defined speed on the surface of substrate, being set as Vm > Vp in the case of Rm < Rp, in Rm It is set as Vm < Vp in the case of > Rp.

4th form according to the present invention, provides a kind of exposure device, which has：Lamp optical system, By conduct illuminating light to cylinder light shield, the cylinder light shield relative to defined axis with defined radius of curvature made of being bent There is pattern on the peripheral surface of curved surface；Base supporting mechanism, supporting substrates；Projection optical system, will be by the illumination light The pattern of the cylinder light shield of illumination projects the substrate supported to the base supporting mechanism；Mechanism is replaced, It replaces the cylinder light shield；And adjustment section, the cylinder light shield is changed to the different circle of diameter in the replacement mechanism When cylinder light shield, at least part to the lamp optical system and at least part of the projection optical system at least One side is adjusted.

5th form according to the present invention, provides a kind of exposure device, which has：Light shield holding mechanism, There is pattern on bending to cylindric peripheral surface with predetermined radius relative to defined axis, installed in a manner of replaceable There is one in multiple cylinder light shields that diameter is different each other, and it is made to be rotated around the defined axis；Lighting system, will Illumination is in the pattern of the cylinder light shield；Base supporting mechanism, the face along bending or flat bearing substrate, should Substrate is exposed by the light of the pattern of the cylinder light shield irradiated from illuminated light；And adjustment section, basis It is installed on the diameter of the cylinder light shield of the light shield holding mechanism, at least to the defined axis and the substrate supporting The distance between mechanism is adjusted.

6th form according to the present invention, provides a kind of device inspection apparatus, which has：Above-mentioned exposure Electro-optical device；With the substrate feeding device for supplying the substrate to the exposure device.

7th form according to the present invention, provides a kind of device making method, which includes：Using above-mentioned Exposure device, by the pattern exposure of the cylinder light shield in the substrate；With by the exposed substrate into Row processing, to form device corresponding with the pattern of cylinder light shield.

Invention effect

Form according to the present invention, can prevent because the projection image planes that are formed with pattern image with transferred with the substrate of pattern image Surface in one party be bent upwards in the scan exposure side of substrate and the offset (image displacement) of image position that generates, and energy Enough exposed widths increased in scan exposure, so as to obtain having transferred the base of pattern image with high-quality with high productivity Plate.

Other forms using the present invention a kind of being equipped with the different circle of diameter within the limits prescribed even if being capable of providing In the case of cylinder light shield, the exposure device, device inspection apparatus and device manufacture of the pattern transfer of high-quality can be also carried out Method.

Description of the drawings

Fig. 1 is the figure of the structure for the device inspection apparatus for showing first embodiment.

Fig. 2 is the integrally-built figure for the exposure device (substrate board treatment) for showing first embodiment.

Fig. 3 is the figure of the illumination region for showing exposure device shown in Fig. 2 and the configuration of view field.

Fig. 4 is the figure of the structure of the lamp optical system and projection optical system that show exposure device shown in Fig. 2.

Fig. 5 is the figure for the state for large showing illuminating bundle and projected light beam on light shield.

Fig. 6 is the traveling mode of the illuminating bundle and projected light beam in the polarising beam splitter schematically illustrated in Fig. 4 Figure.

Fig. 7 is the pass between the movement of the projection image planes for the pattern for large showing light shield and the movement of the plane of exposure of substrate The definition graph of system.

Fig. 8 A be show when project image planes and plane of exposure without difference when the picture in exposed width deviation The curve graph for the example that amount, difference component change.

Fig. 8 B are the deviations for showing the picture in exposed width when having difference when projection image planes and plane of exposure The curve graph for the example that amount, difference component change.

Fig. 8 C be show when change plane of exposure with projection image planes peripheral speed difference when in exposed width as The curve graph of one example of difference component variation.

Fig. 9 is to show that the pattern projection image that the peripheral speed according to projection image planes and plane of exposure has indifference and changes is exposing The curve graph of contrast in optical width than an example of variation.

Figure 10 is the integrally-built figure for the exposure device (substrate board treatment) for showing second embodiment.

Figure 11 is between the movement of the projection image planes for the pattern for large showing light shield and the movement of the plane of exposure of substrate The definition graph of relationship.

Figure 12 be the peripheral speed according to projection image planes and plane of exposure for showing in this second embodiment have an indifference and The curve graph of one example of the departure variation of the picture in the exposed width of variation.

Figure 13 A are the L&amp shown on light shield M;The figure of the light intensity distributions of the projection image of S patterns.

Figure 13 B are the figures of the light intensity distributions for the projection image for showing isolated line (ISO) pattern on light shield M.

Figure 14 is to emulate L&amp in the state of no difference (before amendment);The contrast value of the projection image of S patterns and Contrast than curve graph.

Figure 15 is to emulate L&amp in the state of having difference (after amendment);The contrast value of the projection image of S patterns and Contrast than curve graph.

Figure 16 is to emulate the comparison for the projection image for isolating (ISO) pattern in the state of no difference (before amendment) The curve graph of angle value and contrast ratio.

Figure 17 is to emulate the comparison for the projection image for isolating (ISO) pattern in the state of having difference (after amendment) The curve graph of angle value and contrast ratio.

Figure 18 is to show to change the circumference of the projection image planes of light shield M when the movement speed relative to the plane of exposure on substrate The curve graph of relationship of the picture addendum modification (departure) between exposed width when speed.

Figure 19 is evaluation of estimate Q1, Q2 shown according to using departure and resolution ratio to find out, wide come the exposure of evaluating best The curve graph of one example of the emulation of degree.

Figure 20 is the integrally-built figure for the exposure device (substrate board treatment) for showing third embodiment.

Figure 21 is the integrally-built figure for the exposure device (substrate board treatment) for showing the 4th embodiment.

Figure 22 is the relationship between the movement of the projection image planes for the pattern for showing light shield and the movement of the plane of exposure of substrate Definition graph.

Figure 23 is the integrally-built figure for the exposure device for showing the 5th embodiment.

Figure 24 is flow chart the step of showing when the light shield used in exposure device is changed to other light shields.

Figure 25 is position and the even number of the field of view of the light shield side for the first projection optical system for showing odd number The figure of relationship between the position of the field of view of the light shield side of second projection optical system.

Figure 26 is the stereogram for showing to have on the surface the light shield for the information storage part for being stored with light shield information.

Figure 27 depicts the schematic diagram of the exposure condition setting table of conditions of exposure.

Figure 28 is Fig. 5 based on front, roughly shows the illuminating bundle between the different light shield of diameter and projection The figure of the state of light beam.

Figure 29 is the figure for the configuration change for showing encoder head in the case where being changed to the different light shield of diameter etc..

Figure 30 is the figure of calibrating installation.

Figure 31 is the figure for illustrating calibration.

Figure 32 is the side view for showing to support the example of light shield in a manner of it can rotate using air bearing.

Figure 33 is the stereogram for showing to support the example of light shield in a manner of it can rotate using air bearing.

Figure 34 is the integrally-built figure for the exposure device for showing sixth embodiment.

Figure 35 is the integrally-built figure for the exposure device for showing the 7th embodiment.

Figure 36 is the solid for the local structure example for showing the supporting device in the exposure device of the cylinder light shield M of reflection-type Figure.

Figure 37 is the flow chart for showing device making method.

Specific implementation mode

Mode for carrying out the present invention (embodiment) is directed at while with reference to attached drawing to be described in detail.It is below Content described in embodiment is not intended to limit the present invention.In addition, including this field in the inscape of following record Technical staff it can be readily appreciated that or substantially the same element.Moreover, the inscape recorded below can be appropriate Combination.In addition, in the range of not departing from the emphasis of the present invention, various omissions can be carried out to inscape, replaces or becomes More.For example, in the following embodiments, although to manufacturing flexible display as device the case where illustrates, simultaneously It is without being limited thereto.As device, it can also manufacture and form the circuit board of wiring pattern using copper foil etc., be formed with multiple semiconductors The substrate etc. of element (transistor, diode etc.).

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The substrate board treatment to substrate application exposure-processed of first embodiment is exposure device.In addition, exposure dress It sets to be assembled in and the substrate after exposure is applied in device inspection apparatus of the various processing to manufacture device.First, for device system The system of making illustrates.

< device inspection apparatus >

Fig. 1 is the figure of the structure for the device inspection apparatus for showing first embodiment.Device inspection apparatus 1 shown in FIG. 1 It is assembly line (flexible display manufacture assembly line) of the manufacture as the flexible display of device.As flexible display, such as There is a kind of organic el display etc..The device inspection apparatus 1 uses so-called roll-to-roll (Roll to Roll) mode, the roller pair Roller (Roll to Roll) mode refers to sending out the substrate P with roller FR1 from the supply that flexible substrate P is wound into roll, After being applied continuously in various processing to the substrate P of submitting, using treated, substrate P is furled as flexible device to recycling roller FR2.In the device inspection apparatus 1 of first embodiment, show to use roller FR1 to send out the base as the sheet material of film-form from supply Plate P, the substrate P sent out from supply roller FR1 pass through successively n platform processing units U1, U2, U3, U4, U5 ... Un is until being furled To example of the recycling until roller FR2.First, it is illustrated for the substrate P of the process object as device inspection apparatus 1.

Substrate P uses the foil (sheet metal) etc. formed such as resin film, the metal or alloy by stainless steel.As The material of resin film, contains：Such as polyvinyl resin, acrylic resin, polyester resin, Ethylene Vinyl Ester Copolymers resin, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, second It is more than one or two kinds of in vinyl acetate resin.

Substrate P is preferably selected such as coefficient of thermal expansion and less apparent big material, so that can actually ignore The deflection caused by heated in the various processing applied to substrate P.Coefficient of thermal expansion for example can be by by inorganic fill Object is mixed in resin film and is set to smaller than threshold value corresponding with technological temperature etc..Inorganic filler for example can be oxygen Change titanium, zinc oxide, aluminium oxide, silica etc..In addition, it is 100 μm or so that substrate P, which can be by the thickness of the manufactures such as float technique, Very thin glass individual layers, can also be the laminated body pasted above-mentioned resin film, foil etc. on the very thin glass and formed.

The substrate P constituted in this way is by being wound into roll into roller FR1, supply roller FR1 for the supply It is mounted in device inspection apparatus 1.The device inspection apparatus 1 of supply roller FR1 is installed to being sent out from supply roller FR1 Substrate P repeats the various processing for manufacturing a device.Therefore, substrate P that treated becomes multiple devices and is connected State.That is, becoming the substrate of layout with the roller FR1 substrate Ps sent out from supply.In addition, substrate P can be by prespecified Pre-treatment make its surface activation come modified to its surface, alternatively, being formed with for precision on surface by stamped method etc. Patterned small next door construction (sag and swell).

Substrate P that treated is used as recycling by being wound into roll and is recovered with roller FR2.Recycling is mounted with roller FR2 In on cutter device (not shown).Be equipped with the cutter device of recycling roller FR2 by will treated substrate P by each device (cutting) is split to form multiple devices.For the size of substrate P, such as width direction (direction as short side) Size is 10cm~2m or so, and the size of length direction (direction as long side) is 10m or more.In addition, the size of substrate P is simultaneously It is not limited to above-mentioned size.

X-direction, Y-direction and the orthogonal orthogonal coordinate system of Z-direction are used in Fig. 1.X-direction is to link in the horizontal plane The supply direction of roller FR1 and recycling roller FR2, is the left and right directions in Fig. 1.Y-direction be in the horizontal plane with X-direction just The direction of friendship is the front-rear direction in Fig. 1.Y-direction makees the axial direction of roller FR1 for the supply and recycling roller FR2.Z-direction is Vertical direction is the upper and lower directions in Fig. 1.

Device inspection apparatus 1 has substrate feeding device 2, the substrate to being supplied by substrate feeding device 2 of supplying substrate P P applies processing unit U1~Un of various processing, returns the substrate for the substrate P recycling for applying processing by processing unit U1~Un Receiving apparatus 4, the host control device 5 that each device of device inspection apparatus 1 is controlled.

Supply roller FR1 is installed in a rotatable way in substrate feeding device 2.Substrate feeding device 2 have from The driven roller R1 of substrate P, the position in width direction (Y-direction) that adjusts substrate P are sent out in the supply installed with roller FR1 Marginal position controller EPC1.Driven roller R1 rotates while the front and back sides of substrate P are clamped, and substrate P is used to from supply Roller FR1 is sent out towards the recycling carry direction of roller FR2, thus supplies substrate P to processing unit U1~Un.At this point, edge Positioner EPC1 is so that the position of the end (edge) of substrate P in the direction of the width converges on ± ten relative to target location Mode in the range of several μm~tens μm or so makes substrate P move in the direction of the width, to correct substrate P in the direction of the width Position.

Recycling roller FR2 is installed in a rotatable way in substrate retracting device 4.Substrate retracting device 4 has will Substrate P that treated pulls to the driven roller R2 of the sides recycling roller FR2, adjusts the position in width direction (Y-direction) of substrate P The marginal position controller EPC2 set.Substrate retracting device 4 is revolved using driven roller R2 while the front and back sides of substrate P are clamped Turn, pulls substrate P to carry direction, and recycling roller FR2 is made to rotate, thus roll substrate P.At this point, marginal position control The position of substrate P in the direction of the width is corrected in the same manner as device EPC2 processed and marginal position controller EPC1, is existed to avoid substrate P End (edge) in width direction generates deviation in width direction.

Processing unit U1 is the painting that photonasty functional liquid is applied on the surface of the substrate P supplied from substrate feeding device 2 Coating apparatus.As photonasty functional liquid, such as photoresist, photonasty silane coupling agent (such as photonasty hydrophobe are used Property modifying agent, photonasty plating reducing agent etc.), UV curable resin solutions etc..Processing unit U1 is upper from the carry direction of substrate P Side is swum to rise successively equipped with applying mechanism Gp1 and drier Gp2.Applying mechanism Gp1 have be wound with substrate P roller platen DR1, The application roll DR2 opposite with roller platen DR1.Applying mechanism Gp1 is in the state that the substrate P supplied is wound in roller platen DR1 Under, substrate P is clamped using roller platen DR1 and application roll DR2.Then, applying mechanism Gp1 is by making roller platen DR1 and painting Roller DR2 rotations are applied, so that substrate P is moved to carry direction on one side, utilizes application roll DR2 to apply photonasty functional liquid on one side.It is dry Mechanism Gp2 is by the drying air such as blowout hot wind or the air of drying, to remove the solute contained in photonasty functional liquid (solvent or water) makes the substrate P coated with photonasty functional liquid dry, forms photonasty functional layer in substrate P.

Processing unit U2 is that the photonasty functional layer on the surface in order to make to be formed in substrate P is stablized, will be from processing unit U1 Carry the heating device that the substrate P come is heated to set point of temperature (for example, several 10~120 DEG C or so).Processing unit U2 is from substrate P Carry direction upstream side successively be equipped with heating chamber HA1 and cooling chamber HA2.It is more in being internally provided with for heating chamber HA1 A roller and multiple aerial turning-bars (air turn bar), multiple rollers and multiple aerial turning-bars constitute the carrying of substrate P Path.Multiple rollers are set as being in rolling contact with the back side of substrate P, and multiple aerial turning-bars are arranged to the not surface with substrate P The state of side contacts.In order to extend the transport path of substrate P, multiple rollers and multiple aerial turning-bars to form removing for snake shape The mode in fortune path configures.It is carried on one side by the transport path along snake shape by the substrate P in heating chamber HA1, on one side It is heated to set point of temperature.In order to make temperature and subsequent handling (processing unit U3) in the substrate P of heating chamber HA1 heating Environment temperature is consistent, and substrate P is cooled to environment temperature by cooling chamber HA2.It is multiple in being internally provided with for cooling chamber HA2 Roller, in the same manner as heating chamber HA1, in order to extend the transport path of substrate P, multiple rollers are to form the transport path of snake shape Mode configures.It is carried by the transport path along snake shape by the substrate P in cooling chamber HA2, is cooled on one side on one side. Downstream side in the carry direction of cooling chamber HA2 is equipped with driven roller R3, and driven roller R3 is clamped on one side through cooling chamber HA2's Substrate P rotates on one side, thus supplies substrate P towards processing unit U3.

Processing unit (substrate board treatment) U3 is to be formed with photosensitive sexual function for from the surface that processing unit U2 is supplied The exposure device of the patterns such as the circuit of substrate (sensitive substrate) P projection exposure displays of layer or wiring.Details exists It is hereinafter described, processing unit U3 is obtained illuminating bundle by light shield M reflection by irradiating illuminating bundle to the light shield M of reflection-type To projected light beam projection exposure in substrate P.Processing unit U3, which has to the downstream side of carry direction, to be transported from processing unit The marginal position controller of the position in width direction (Y-direction) of substrate P driven roller DR4, adjustment substrate P that U2 is supplied EPC3.Driven roller DR4 rotates while the front and back sides of substrate P are clamped, and substrate P is sent out to the downstream side of carry direction, Thus come to the rotating cylinder DR5 supplies in exposure position supporting substrates P.Marginal position controller EPC3 and marginal position controller EPC1 is similarly constituted, and corrects substrate P position in the direction of the width so that exposure position substrate P width direction at For target location.In addition, processing unit U3 has in the state of assigning slackness to the substrate P after exposure, to carry direction Downstream side transport substrate P two groups of driven rollers DR6, DR7.Two groups of driven rollers DR6, DR7 are with the phase in the carry direction of substrate P Mode every defined interval configures.Driven roller DR6 holds the upstream side of the substrate P of carrying and rotation, driven roller DR7 clampings The downstream side for the substrate P carried and rotation, thus supplies substrate P to processing unit U4.At this point, since substrate P is assigned Slackness is given, so the variation in the transporting velocity for more leaning on the downstream side of carry direction to generate than driven roller DR7, energy can be absorbed Enough break off the influence of the exposure-processed caused by the variation of transporting velocity to substrate P.In addition, in order to make the light shield figure of light shield M The picture of a part for case is relatively aligned with substrate P and (is aligned), and detection is equipped in processing unit U3 and is previously formed in base Aligming microscope AM1, AM2 of alignment mark on plate P etc..

Processing unit U4 is development treatment, the nothing for carrying out wet type to carrying the substrate P after the exposure come from processing unit U3 It is electrolysed the wet type processing device of electroplating processes etc..Have in the inside of processing unit U4：Along vertical direction (Z-direction) stratification 3 treatment troughs BT1, BT2, BT3 and handling substrate P multiple rollers.Multiple rollers are to form substrate P successively from 3 treatment troughs The inside of BT1, BT2, BT3 transport path by way of configure.Downstream side in the carry direction for the treatment of trough BT3 is equipped with Driven roller, driven roller DR8 is on one side being clamped by being rotated while substrate P after treatment trough BT3, thus by substrate P towards handling Device U5 supplies.

Although illustration omitted, processing unit U5 is done to what the substrate P come from processing unit U4 carryings was dried Dry device.Processing unit U5 removes the drop for being applied in processing unit U4 and having adhered in the substrate P of wet processed, and adjusts The moisture of whole substrate P.The substrate P dried by processing unit U5 is carried to processing unit using several processing units Un.Then, after processing unit Un is handled, substrate P is rolled up to the recycling roller FR2 of substrate retracting device 4.

The pool control base board of host control device 5 feedway 2, substrate retracting device 4 and multiple processing unit U1~ Un.5 control base board feedway 2 of host control device and substrate retracting device 4 are recycled from substrate feeding device 2 to substrate 4 handling substrate P of device.In addition, host control device 5 on one side synchronizes the carrying of substrate P, multiple processing unit U1 are controlled on one side ~Un carries out various processing to substrate P.

< exposure devices (substrate board treatment) >

Hereinafter, with reference to Fig. 2~Fig. 5, to exposure device (the processing substrate dress of the processing unit U3 as first embodiment Set) structure illustrate.Fig. 2 be show first embodiment exposure device (substrate board treatment) it is integrally-built Figure.Fig. 3 is the figure of the illumination region for showing exposure device shown in Fig. 2 and the configuration of view field.Fig. 4 is to show Fig. 2 institutes The figure of the lamp optical system of the exposure device shown and the structure of projection optical system.Fig. 5 is to show to expose to the photograph of light shield The figure of the state of Mingguang City's beam and the projected light beam projected from light shield.Fig. 6 is in the polarising beam splitter schematically illustrated in Fig. 4 Illuminating bundle and projected light beam traveling mode figure.Hereinafter, processing unit U3 is known as exposure device U3.

Exposure device U3 shown in Fig. 2 is so-called scanning-exposure apparatus, on one side to carry direction handling substrate P, on one side Will be formed in the mask pattern of the peripheral surface of cylindric light shield M as projection exposure is on the surface of substrate P.In addition, in Fig. 2 It is middle using X-direction, Y-direction and the orthogonal orthogonal coordinate system of Z-direction, using orthogonal coordinate system same as Fig. 1.

First, the light shield M used in exposure device U3 is illustrated.Light shield M is for example using metal cylinder Reflection-type light shield.Light shield M is formed to have the cylinder of peripheral surface (periphery), which has with edge Radius of curvature R m centered on the first axle AX1 that Y-direction extends.The periphery of light shield M is to be formed with defined mask pattern Light shield face P1.Light shield face P1 has：With high efficiency to the high reflection portion of prescribed direction the reflected beams and not to prescribed direction The reflected beams or the reflection suppression portion reflected with poor efficiency.Mask pattern is formed by high reflection portion and reflection suppression portion 's.Herein, as long as the light that reflection suppression portion is reflected to prescribed direction is reduced.Therefore, reflection suppression portion can absorb light, thoroughly Cross light or to the direction reflected light (such as diffusing reflection) other than prescribed direction.Herein, light absorbing material can be utilized Or the reflection suppression portion of light shield M is constituted through the material of light.Exposure device U3 can be used by the circle of the metals such as aluminium or SUS Light shield M of the light shield that cylinder makes as above structure.Therefore, exposure device U3 can use the light shield of low price to be exposed.

In addition, light shield M could be formed with the entirety or a part of panel pattern corresponding with a display device, Panel pattern corresponding with multiple display devices can also be formed with.In addition, light shield M can be around first axle AX1's It has been repeatedly formed multiple panel patterns in circumferential direction, can also be repeatedly formed on the direction parallel with first axle AX1 multiple Small-sized panel pattern.Moreover, light shield M can also be formed with panel pattern and size of the first display device etc. and The panel pattern of the different second display part of one display device.In addition, as long as light shield M has centered on first axle AX1 Radius of curvature be Rm periphery, be not limited to the shape of cylinder.For example, light shield M can also be with circumference The plank of the arc-shaped in face.In addition, light shield M can also be laminal, laminal light shield M can be made to be bent and there is circumference Face.

Then, exposure device U3 shown in Fig. 2 is illustrated.Exposure device U3 above-mentioned driven roller DR4, DR6, On the basis of DR7, rotating cylinder DR5, marginal position controller EPC3 and aligming microscope AM1, AM2, also have：Light shield is kept Mechanism 11, base supporting mechanism 12, lamp optical system IL, projection optical system PL, slave control device 16.Exposure device U3 The illumination light projected from light supply apparatus 13 is irradiated in light via a part of lamp optical system IL and projection optical system PL The pattern plane P1 for the light shield M that cover holding mechanism 11 is supported, will be by the projected light beam (imaging) of the pattern plane P1 reflections of light shield M It is projeced into the substrate P that base supporting mechanism 12 is supported via projection optical system PL.

Slave control device 16 controls each section of exposure device U3, and each section is made to be handled.Slave control device 16 Can be some or all of the host control device 5 of device inspection apparatus 1.In addition, slave control device 16 can also It is controlled by host control device 5, is other devices different from host control device 5.Slave control device 16 is for example with meter Calculation machine.

Light shield holding mechanism 11 has：It keeps the cylinder roller (also referred to as light shield holding cylinder) 21 of light shield M, make cylinder roller First driving portion 22 of 21 rotations.Cylinder roller 21 keeps light shield M by the first axle AX1 of light shield M in the way of rotation center. First driving portion 22 is connect with slave control device 16, and so that cylinder roller 21 is rotated as rotation center using first axle AX1.

In addition, the peripheral surface in the cylinder roller 21 of light shield holding mechanism 11 is directly formed by high reflection portion and low reflecting part Mask pattern, but it is not limited to the structure.Cylinder roller 21 as light shield holding mechanism 11 can also copy its peripheral surface It winds and keeps laminal reflection-type light shield M.In addition, the cylinder roller 21 as light shield holding mechanism 11 can also be can pacify It assembles and disassembles the mode unloaded and the reflection-type light shield M for the plate for bending to arc-shaped with radius Rm in advance is held in the outer of cylinder roller 21 Circumferential surface.

Base supporting mechanism 12 has the substrate supporting cylinder 25 (the rotating cylinder DR5 in Fig. 1) supported to substrate P, makes The second driving portion 26, a pair of aerial turning-bar ATB1, ATB2 and a pair of of the deflector roll 27,28 that substrate supporting cylinder 25 rotates.Substrate Bearing cylinder 25 is formed to have the cylindrical shape of peripheral surface (periphery), which has to prolong in the Y direction Radius of curvature R p centered on the second axis AX2 stretched.Herein, first axle AX1 and the second axis AX2 is mutually parallel, with from first Axis AX1 and the second axis AX2 by face centered on face CL.A part for the periphery of substrate supporting cylinder 25 becomes bearing base The bearing surface P2 of plate P.That is, substrate supporting cylinder 25 is bending by the way that substrate P to be wound in substrate P bearing on its bearing surface P2 At cylinder planar.Second driving portion 26 is connect with slave control device 16, makes substrate supporting as rotation center using the second axis AX2 Cylinder 25 rotates.A pair of aerial turning-bar ATB1, ATB2 and a pair of of deflector roll 27,28 are respectively arranged on substrate P across substrate supporting cylinder 25 Carry direction upstream side and downstream side.Deflector roll 27 will carry the substrate P come via aerial turning-bar from driven roller DR4 ATB1 is guided to substrate supporting cylinder 25, and deflector roll 28 will carry the substrate P of coming via substrate supporting cylinder 25 from aerial turning-bar ATB2 It guides to driven roller DR6.

Base supporting mechanism 12 makes substrate supporting cylinder 25 rotate by using the second driving portion 26, comes on one side to utilize substrate branch The bearing surface P2 bearings for holding cylinder 25 have imported the substrate P of substrate supporting cylinder 25, on one side with fixing speed in strip direction (X-direction) The upper transport importing substrate P of substrate supporting cylinder 25.

At this point, the slave control device 16 being connect with the first driving portion 22 and the second driving portion 26 is by making cylinder roller 21 and substrate supporting cylinder 25 with defined rotary speed ratio synchronous rotary, will be formed in the mask pattern of the light shield face P1 of light shield M Picture continuously repeat projection exposure (copy periphery on the surface of the substrate P for the bearing surface P2 for being wound in substrate supporting cylinder 25 And the face being bent) on.The first driving portion 22 and the second driving portion 26 of exposure device U3 is the mobile mechanism of present embodiment.

Light supply apparatus 13 projects the illuminating bundle EL1 of irradiation light shield M.Light supply apparatus 13 has light source 31 and light conducting member 32.Light source 31 is the light source for the light for projecting defined wavelength.Light source 31 be, for example, the lamp sources such as mercury vapor lamp, laser diode or Light emitting diode (LED) etc..The illumination light that light source 31 projects is, for example, bright line (g lines, h lines, i lines), the KrF projected from lamp source The extreme ultraviolet lights such as excimer laser (wavelength 248nm) (DUV light), ArF excimer laser (wavelength 193nm) etc..Herein, light source 31 It is preferred that projecting the illuminating bundle EL1 containing the light shorter than the wavelength of i line (wavelength of 365nm).As illuminating bundle as such EL1 can use the laser (wavelength of 355nm) projected from YAG laser (third harmonic laser device), from YAG laser (four Subharmonic laser) project laser (wavelength of 266nm) or from KrF excimer lasers project the laser (wave of 248nm It is long) etc..

Light conducting member 32 conducts the illuminating bundle EL1 projected from light source 31 to lamp optical system IL.Light conducting member 32 It is constituted by optical fiber or using the relaying module etc. of speculum.In addition, light conducting member 32 is equipped with multiple lamp optical system IL In the case of, the illuminating bundle EL1 from light source 31 is divided into multiple, multiple illuminating bundle EL1 are conducted to multiple illuminations Optical system IL.The light conducting member 32 of present embodiment is using the illuminating bundle EL1 projected from light source 31 as defined polarization shape The light of state is incident to polarising beam splitter PBS.Polarising beam splitter PBS penetrates illumination and set on light shield M to light shield M fall Between projection optical system PL, it will be reflected as the light beam of the rectilinearly polarized light of S-polarization light, make the straight line as P polarization light The light beam of polarised light transmits.Therefore, light supply apparatus 13, which projects, is incident to the illuminating bundle EL1 of polarising beam splitter PBS and becomes straight The illuminating bundle EL1 of the light beam of linearly polarized light (S-polarization light).Light supply apparatus 13 to polarising beam splitter PBS project wavelength and The consistent polarization ray laser of phase.For example, light supply apparatus 13 makes in the case where the light beam projected from light source 31 is the light of polarization Use plane of polarization that optical fiber is kept to be led under the polarization state for maintaining the laser exported from light supply apparatus 13 as light conducting member 32 Light.In addition, for example, the light beam that fiber guides are exported from light source 31 can also be used, make to produce from the light of optical fiber output using polarizing film Raw polarization.That is light supply apparatus 13 makes random polarization in the case where the light beam of random polarization is guided using polarizing film Light beam polarization.In addition, light supply apparatus 13 can also be guided by using the relay optical system of lens etc. it is defeated from light source 31 The light beam gone out.

Herein, as shown in figure 3, the exposure device U3 of first embodiment assumes that the exposure dress of so-called poly-lens mode It sets.In addition, showing in figure 3, from the illumination region IR's on the light shield M that the cylinder roller 21 that the sides-Z are observed is kept Vertical view (left figure of Fig. 3), from the vertical view of the view field PA in the substrate P that the substrate supporting cylinder 25 that the sides+Z are observed is supported Scheme (right figure of Fig. 3).The reference numeral Xs of Fig. 3 shows moving direction (the rotation side of cylinder roller 21 and substrate supporting cylinder 25 To).The lighting area of multiple (are in the first embodiment, for example, 6) of the exposure device U3 of poly-lens mode on light shield M Domain IR1~IR6 irradiates illuminating bundle EL1 respectively, and each illuminating bundle EL1 is reflected in each illumination region IR1~IR6 The view field of multiple (are in the first embodiment, for example, 6) of multiple projected light beam EL2 projection exposures in substrate P PA1~PA6.

First, the multiple illumination region IR1~IR6 illuminated using lamp optical system IL are illustrated.Such as Fig. 3 institutes Show, multiple illumination region IR1~IR6 configure the first lighting area across median plane CL on the light shield M of the upstream side of direction of rotation Domain IR1, third illumination region IR3 and the 5th illumination region IR5 configure second on the light shield M in the downstream side of direction of rotation Illumination region IR2, the 4th illumination region IR4 and the 6th illumination region IR6.Each illumination region IR1~IR6 be in have along The elongated trapezoidal region for the parallel short side and long side that the axial direction (Y-direction) of light shield M extends.At this point, trapezoidal each photograph Area pellucida domain IR1~IR6 is that its short side is located at the sides median plane CL and its long side is located at the region in outside.First illumination region IR1, Three illumination region IR3 and the 5th illumination region IR5 are spaced as defined in being separated by the axial direction to configure.In addition, the second lighting area Domain IR2, the 4th illumination region IR4 and the 6th illumination region IR6 are spaced as defined in being separated by the axial direction to configure.At this point, the Two illumination region IR2 are configured in the axial direction between the first illumination region IR1 and third illumination region IR3.Similarly, third is shone Area pellucida domain IR3 is configured in the axial direction between the second illumination region IR2 and the 4th illumination region IR4.4th illumination region IR4 exists Configuration is between third illumination region IR3 and the 5th illumination region IR5 in axial direction.5th illumination region IR5 is configured in the axial direction Between the 4th illumination region IR4 and the 6th illumination region IR6.Each illumination region IR1~IR6 is with when the circumferential direction around light shield M When (X-direction), the mode to overlap between the triangular part in the bevel edge portion of adjacent trapezoidal illumination region in the Y direction is (heavy Folded mode) configuration.In addition, in the first embodiment, each illumination region IR1~IR6 be trapezoidal region but it is also possible to be The region of oblong-shaped.

It is formed with the pattern forming region A3 of mask pattern in addition, light shield M has and does not form the non-pattern of mask pattern Forming region A4.Non- pattern forming region A4 is the not easily reflective region for absorbing illuminating bundle EL1, is configured to surround with frame-shaped Pattern forming region A3.First~the 6th illumination region IR1~IR6 is configured to cover the whole of the Y-direction of pattern forming region A3 A width.

Lamp optical system IL and multiple illumination region IR1~IR6 be correspondingly equipped with it is multiple (in the first embodiment E.g. 6).It is injected respectively in multiple lamp optical system (segmentation lamp optical system) IL1~IL6 and comes from light supply apparatus 13 Illuminating bundle EL1.Each lamp optical system IL1~IL6 will conduct respectively from the incident each illuminating bundle EL1 of light supply apparatus 13 To each illumination region IR1~IR6.That is, the first lamp optical system IL1 conducts illuminating bundle EL1 to the first illumination region IR1, similarly, the second~the 6th lamp optical system IL2~IL6 conduct illuminating bundle EL1 to the second~the 6th lighting area Domain IR2~IR6.Multiple lamp optical system IL1~IL6 are across median plane CL, configured with first, third, the 5th lighting area The side (left side of Fig. 2) of domain IR1, IR3, IR5 configures the first lamp optical system IL1, lamp optical system IL3 and the Five lamp optical system IL5.First lamp optical system IL1, third lamp optical system IL3 and the 5th lamp optical system IL5 is spaced as defined in being separated by the Y direction to configure.In addition, multiple lamp optical system IL1~IL6 are across median plane CL, Side (right side of Fig. 2) configured with second, the four, the 6th illumination region IR2, IR4, IR6 configures the second lamp optical system IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6.Second lamp optical system IL2, the 4th illumination light System IL4 and the 6th lamp optical system IL6 is spaced as defined in being separated by the Y direction to configure.At this point, the second illumination light System IL2 is configured in the axial direction between the first lamp optical system IL1 and third lamp optical system IL3.Similarly, Three lamp optical system IL3, the 4th lamp optical system IL4, the 5th lamp optical system IL5 are configured in the axial direction to be shone second Between bright optical system IL2 and the 4th lamp optical system IL4, third lamp optical system IL3 and the 5th lamp optical system Between IL5, between the 4th lamp optical system IL4 and the 6th lamp optical system IL6.In addition, the first lamp optical system IL1, third lamp optical system IL3 and the 5th lamp optical system IL5 and the second lamp optical system IL2, the 4th illumination Optical system IL4 and the 6th lamp optical system IL6 are configured to when from Y-direction be symmetrical.

Then, with reference to Fig. 4, each lamp optical system IL1~IL6 is illustrated.Further, since each lamp optical system IL1~IL6 is same structure, so by taking the first lamp optical system IL1 (hereinafter simply referred to as lamp optical system IL) as an example To illustrate.

In order to which with uniform illumination irradiation illumination region IR (the first illumination region IR1), lamp optical system IL makes to come from The illuminating bundle EL1 of light supply apparatus 13 carries out Ke Le (Kohler) to the illumination region IR on light shield M and illuminates.In addition, illumination light System IL is to penetrate lighting system using falling for polarising beam splitter PBS.Lamp optical system IL is from from light supply apparatus 13 The light incident side of illuminating bundle EL1 has light optics module ILM, polarising beam splitter PBS and quarter wave plate 41 successively.

As shown in figure 4, light optics module ILM includes collimation lens 51, compound eye successively from the light incident side of illuminating bundle EL1 Lens 52, multiple collector lenses 53, cylindrical lens 54, illuminated field diaphragm 55 and multiple relay lens 56, and be arranged the On one optical axis BX1.

51 incidence of collimation lens has the light projected from light conducting member 32, and the face for irradiating the light incident side of fly's-eye lens 52 is whole.

Fly's-eye lens 52 is set to the emitting side of collimation lens 51.The center configuration in the face of the emitting side of fly's-eye lens 52 is in On one optical axis BX1.The illuminating bundle EL1 of the generation of fly's-eye lens 52 self-focus lens in future 51 is divided into the face of multiple point light source pictures Light source picture.Illuminating bundle EL1 is generated by the area source picture.At this point, generating the face of the emitting side of the fly's-eye lens 52 of point light source picture By from fly's-eye lens 52 via illuminated field diaphragm 55 to aftermentioned projection optical system PL the first concave mirror 72 it is various Lens are configured to reach optical conjugate with the pupil plane where the reflecting surface of the first concave mirror 72.

Collector lens 53 is set to the emitting side of fly's-eye lens 52.The optical axis of collector lens 53 is configured on primary optic axis BX1. Collector lens 53 makes multiple point light sources from the emitting side for being formed in fly's-eye lens 52 as respective light is in illuminated field diaphragm It is overlapped on 55, illuminated field diaphragm 55 is irradiated with uniform Illumination Distribution.Illuminated field diaphragm 55 has illumination as shown in figure 3 Region IR is similar trapezoidal or rectangular rectangular-shaped opening portion, and the center configuration of the opening portion is on primary optic axis BX1. Pass through relay lens 56, polarising beam splitter PBS, the quarter wave plate in from illuminated field diaphragm 55 to the light path of light shield M 41 so that the opening portion of illuminated field diaphragm 55 is configured to the relationship for having optical conjugate with the illumination region IR on light shield M.In The illuminating bundle EL1 transmitted from the opening portion of illuminated field diaphragm 55 is set to be incident to polarising beam splitter PBS after lens 56.Poly- The emitting side of optical lens 53 is equipped with cylindrical lens 54 with 55 adjoining position of illuminated field diaphragm.Cylindrical lens 54 is light incident side It is in the piano convex cylindrical lens in cylindrical lens face in plane and emitting side.The optical axis of cylindrical lens 54 is configured on primary optic axis BX1. Cylindrical lens 54 makes each chief ray of the illuminating bundle EL1 of the illumination region IR on irradiation light shield M converge in the faces XZ, in the side Y It is in parastate upwards.

Polarising beam splitter PBS configurations are between light optics module ILM and median plane CL.Polarising beam splitter PBS exists Division of wave front face makes the light beam as the rectilinearly polarized light of S-polarization light reflect, and makes the light of the rectilinearly polarized light as P polarization light Beam transmits.Herein, if the illuminating bundle EL1 for being incident to polarising beam splitter PBS to be set as to the rectilinearly polarized light of S-polarization light, Illuminating bundle EL1 is reflected by the division of wave front face of polarising beam splitter PBS, is transmitted from quarter wave plate 41 and is become circularly polarized light And irradiate the illumination region IR on light shield M.By the projected light beam EL2 of the illumination region IR reflections on light shield M by transmiting again Quarter wave plate 41 and be in line P polarization light from circularly polarized light conversion, through the division of wave front face directive of polarising beam splitter PBS Projection optical system PL.Polarising beam splitter PBS preferably to be incident to division of wave front face illuminating bundle EL1 it is most of into Row reflection, and make most of transmission of projected light beam EL2.Polarization on the division of wave front face of polarising beam splitter PBS Light stalling characteristic is indicated by extinction ratio, since the extinction ratio becomes also according to the incidence angle of the light towards division of wave front face Change, so in order to become problem to the influence of imaging performance in practical applications, the characteristic in division of wave front face also considers Illuminating bundle EL1, projected light beam EL2 NA (numerical aperture) be designed.

Fig. 5 is to be greatly exaggerated to show the illumination region exposed on light shield M in the faces XZ (plane vertical with first axle AX1) The figure of the state of the illuminating bundle EL1 of IR and the projected light beam EL2 of illuminable area IR reflections.As shown in figure 5, above-mentioned illumination light System IL by the chief ray of the projected light beam EL2 of the illumination region IR reflections of light shield M so as to become telecentricity (parallel system) Mode will expose to the chief ray of the illuminating bundle EL1 of the illumination region IR of light shield M in the faces XZ (plane vertical with axis AX1) It is inside set as non-telecentricity state consciously, telecentricity state is set as in YZ planes (parallel with median plane CL).Illuminating bundle This characteristic of EL1 is that cylindrical lens 54 shown in Fig. 4 assigns.Specifically, when setting is from the lighting area on the P1 of light shield face The circumferential central point Q1 of domain IR by and towards first axle AX1 line, the intersection point Q2 with 1/2 circle of the radius Rm of light shield face P1 When, by from illumination region IR by illuminating bundle EL1 each chief ray on the faces XZ towards intersection point Q2 in a manner of, set cylinder The curvature of the pillar lens face of lens 54.Like this, each chief ray of the projected light beam EL2 reflected in illumination region IR exists Become the state with the straight line parallel (telecentricity) by first axle AX1, point Q1, intersection point Q2 in the faces XZ.

Then, to multiple view fields (exposure area) PA1~PA6 using projection optical system PL progress projection exposures It illustrates.As shown in figure 3, multiple illumination region IR1 on multiple view field PA1~PA6 in substrate P and light shield M~ IR6 is configured accordingly.That is, multiple view field PA1~PA6 in substrate P are across median plane CL, in the upstream of carry direction The first view field PA1, third view field PA3 and the 5th view field PA5 are configured in the substrate P of side, in carry direction Downstream side substrate P on configure the second view field PA2, the 4th view field PA4 and the 6th view field PA6.It is each to throw Shadow zone domain PA1~PA6 is the elongated ladder in the short side and long side extended with the width direction (Y-direction) along substrate P The region of shape (rectangle).At this point, trapezoidal each view field PA1~PA6, which is its short side, is located at the sides median plane CL and its long side position Region in outside.First view field PA1, third view field PA3 and the 5th view field PA5 phase in the direction of the width It is configured every defined interval.In addition, the second view field PA2, the 4th view field PA4 and the 6th view field PA6 exist It is spaced as defined in being separated by width direction to configure.At this point, the second view field PA2 is configured in the axial direction in the first view field Between PA1 and third view field PA3.Similarly, third view field PA3 is configured in the axial direction in the second view field PA2 Between the 4th view field PA44.4th view field PA4 is configured at the projections of third view field PA3 and the 5th in the axial direction Between the PA5 of region.5th view field PA5 be configured in the axial direction the 4th view field PA4 and the 6th view field PA6 it Between.Each view field PA1~PA6 is in the same manner as each illumination region IR1~IR6, with trapezoidal projected area adjacent in the Y direction Mode (mode of the overlapping) configuration overlapped in the carry direction of substrate P between the triangular part in the bevel edge portion of domain PA.At this point, throwing Shadow zone domain PA becomes so that in the light exposure of the repeat region of adjacent view field PA and in the light exposure in unduplicated region Substantially the same shape.Moreover, the first~the 6th view field PA1~PA6 is configured to cover the exposure exposed in substrate P Entire width in the Y-direction of region A7.

Herein, in fig. 2, when being observed in the faces XZ, the center of the illumination region IR1 (and IR3, IR5) on light shield M The perimeter of point to the central point of illumination region IR2 (and IR4, IR6) is set to：With from the substrate P for copying bearing surface P2 View field PA1 (and PA3, PA5) central point to the second view field PA2 (and PA4, PA6) central point week Length is substantially equal.

Projection optical system PL and multiple view field PA1~PA6 be correspondingly equipped with it is multiple (in the first embodiment E.g. 6).In multiple projection optical system (segmentation projection optical system) PL1~PL6, injected respectively from multiple lighting areas Multiple projected light beam EL2 of domain IR1~IR6 reflections.Each projection optical system PL1~PL6 will be by each projected light of light shield M reflection Beam EL2 is conducted respectively to each view field PA1~PA6.That is, the first projection optical system PL1 will come from the first illumination region IR1 Projected light beam EL2 conduct to the first view field PA1, similarly, the second~the 6th projection optical system PL2~PL6 is in the future It is conducted from each projected light beam EL2 of the second~the 6th illumination region IR2~IR6 to the second~the 6th view field PA2~PA6. Multiple projection optical system PL1~PL6 across median plane CL, configured with first, third, the 5th view field PA1, PA3, The side (left side of Fig. 2) of PA5 configures the first projection optical system PL1, third projection optical system PL3 and the 5th projected light System PL5.First projection optical system PL1, third projection optical system PL3 and the 5th projection optical system PL5 are in the side Y It is spaced as defined in being separated by upwards to configure.In addition, multiple projection optical system PL1~PL6 are across median plane CL, configured with Two, the side (right side of Fig. 2) of the four, the 6th view field PA2, PA4, PA6 configures the second projection optical system PL2, the 4th Projection optical system PL4 and the 6th projection optical system PL6.Second projection optical system PL2, the 4th projection optical system PL4 and the 6th projection optical system PL6 is spaced as defined in being separated by the Y direction to configure.At this point, the second projection optical system PL2 is configured in the axial direction between the first projection optical system PL1 and third projection optical system system PL3.Similarly, third Projection optical system PL3, the 4th projection optical system PL4, the 5th projection optical system PL5 are configured in the axial direction in the second projection Between optical system PL2 and the 4th projection optical system PL4, third projection optical system PL3 and the 5th projection optical system PL5 Between, between the 4th projection optical system PL4 and the 6th projection optical system PL6.In addition, the first projection optical system PL1, Three projection optical system PL3 and the 5th projection optical system PL5 and the second projection optical system PL2, the 4th projection optics system System PL4 and the 6th projection optical system PL6 is configured to when from Y-direction be symmetrical.

Referring again to Fig. 4, illustrated for each projection optical system PL1~PL6.Further, since each projection optics system PL1~the PL6 that unites is same structure, so being made with the first projection optical system PL1 (hereinafter simply referred to as projection optical system PL) It is illustrated for example.

Projection optical system PL is by the picture of the mask pattern on the illumination region IR (the first illumination region IR1) on light shield M The view field PA being projected in substrate P.Projection optical system PL from the light incident side of the projected light beam EL2 from light shield M successively With above-mentioned quarter wave plate 41, above-mentioned polarising beam splitter PBS and projection optics module PLM.

Quarter wave plate 41 and polarising beam splitter PBS can be with lamp optical system IL dual-purposes.In other words, light optics System IL and projection optical system PL shares quarter wave plate 41 and polarising beam splitter PBS.

As shown in fig. 7, the projected light beam EL2 of illuminable area IR (with reference to Fig. 3) reflections is that each chief ray is mutually parallel The light beam of telecentricity, and it is incident to projection optical system PL shown in Fig. 2.The throwing of circularly polarized light as illuminable area IR reflections Shadow light beam EL2 after circularly polarized light is converted to rectilinearly polarized light (P polarization light), is being incident to polarized light beam splitting by quarter wave plate 41 Device PBS.The projected light beam EL2 of polarising beam splitter PBS is incident to after polarising beam splitter PBS transmissions, is incident to Fig. 4 institutes The projection optics module PLM shown.

As an example, polarising beam splitter PBS is bonded the prism (quartz system) of two triangles in the faces XZ, or It is kept by optical contact to contact, it is rectangular on the whole.In order to which polarised light separation is effectively performed, in the coating surface Upper multilayer film of the formation containing hafnium oxide etc..Moreover, by the polarising beam splitter PBS of the projected light beam EL2 incidences from light shield M Face and the faces projected to the first reflecting surface P3 of the first deflecting member 70 of projection optical system PL projected light beam EL2 are set It is vertical for the chief ray relative to projected light beam EL2.Moreover, the face for the polarising beam splitter PBS that illuminating bundle EL1 is incident to is set It is set to vertical (with reference to Fig. 4) with the primary optic axis BX1 of lamp optical system IL.In addition, worrying to purple because using adhesive In the case of the tolerance of outside line or laser, the coating surface of polarising beam splitter PBS applies the optics without using adhesive The engagement of contact.

The projected light beam EL2 of illuminable area IR reflections is the light beam of telecentricity, is incident to projection optical system PL.As quilt The projected light beam EL2 of the circularly polarized light of illumination region IR reflections is being converted to rectilinearly polarized light by quarter wave plate 41 from circularly polarized light After (P polarization light), it is incident to polarising beam splitter PBS.The projected light beam EL2 of polarising beam splitter PBS is incident to from polarization After beam splitter PBS transmissions, it is incident to projection optics module PLM.

Projection optics module PLM is correspondingly arranged with light optics module ILM.That is, the first projection optical system PL1 Projection optics module PLM will be by the first illumination region IR1 of the light optics module ILM illuminations of the first lamp optical system IL1 The picture of mask pattern be projected in the first view field PA1 in substrate P.Similarly, the second~the 6th projection optical system PL2 The projection optics module PLM of~PL6 will be by the projection optics module ILM illuminations of the second~the 6th lamp optical system IL2~IL6 The picture of mask pattern of the second~the 6th illumination region IR2~IR6 be projected in the second~the 6th view field in substrate P PA2~PA6.

As shown in figure 4, there is projection optics module PLM the picture for making the mask pattern on illumination region IR to image in intermediary image The first optical system 61 of face P7 makes at least part reimaging for the intermediary image being imaged by the first optical system 61 in substrate P View field PA the second optical system 62 and be configured at the perspective view diaphragm of the intermediate image plane P7 for being formed with intermediary image 63.In addition, also there is projection optics module PLM focus to correct optical component 64, as offset optical component 65, multiplying power amendment are used Optical component 66, rotation correction mechanism 67 and polarization adjustment mechanism (polarization adjustment unit) 68.

First optical system 61 and the second optical system 62 are remote obtained from for example making Dai Sen (Dyson) system variant The reflection and refraction optical system of the heart.The optical axis (hereinafter referred to as the second optical axis BX2) of first optical system 61 and median plane CL essence It is upper orthogonal.First optical system 61 has the first deflecting member 70, the first lens group 71, the first concave mirror 72.First deflection structure Part 70 is the triangular prism with the first reflecting surface P3 and the second reflecting surface P4.First reflecting surface P3 is reflection from polarised light point The projected light beam EL2 of beam device PBS makes the projected light beam EL2 of reflection be incident to the first concave mirror 72 by the first lens group 71 Face.Second reflecting surface P4 be the projected light beam EL2 that makes to be reflected by the first concave mirror 72 by first lens group 71 by it is incident, and The face that incident projected light beam EL2 is reflected to perspective view diaphragm 63.First lens group 71 includes various lens, various lens Optical axis be configured on the second optical axis BX2.First concave mirror 72 configure on the pupil plane of the first optical system 61, be set as with There is the relationship of optical conjugate by multiple point light source pictures that fly's-eye lens 52 generates.

Projected light beam EL2 from polarising beam splitter PBS is reflected by the first reflecting surface P3 of the first deflecting member 70, from The field of view of the top half of first lens group 71 by by be incident to the first concave mirror 72.It is incident to the first concave mirror 72 Projected light beam EL2 is reflected by the first concave mirror 72, and from the field of view of the lower half portion of the first lens group 71 by by it is incident To the second reflecting surface P4 of the first deflecting member 70.The projected light beam EL2 of the second reflecting surface P4 is incident to by the second reflecting surface P4 Reflection, from focus correct optical component 64 and as offset optical component 65 by by be incident to perspective view diaphragm 63.

Perspective view diaphragm 63 has the opening of the shape of regulation view field PA.That is, the opening of perspective view diaphragm 63 Shape carry out the actual shape of regulation view field PA.Therefore, it is possible to by the illumination field of view in lamp optical system IL The shape of the opening of diaphragm 55 be set as it is similar with the actual shape of view field PA it is trapezoidal in the case of, omit projection regard Field diaphragm 63.

Second optical system 62 is structure same as the first optical system 61, across intermediate image plane P7 and the first optical system System 61 is symmetrically arranged.The optical axis (hereinafter referred to as third optical axis BX3) and median plane CL of second optical system 62 are substantially just It hands over, it is parallel with the second optical axis BX2.Second optical system 62 has the second deflecting member 80, the second lens group 81, the second concave mirror 82.Second deflecting member 80 has third reflecting surface P5 and the 4th reflecting surface P6.Third reflecting surface P5 is to make to come from perspective view The projected light beam EL2 reflection of diaphragm 63, and make the projected light beam EL2 after reflection from the second lens group 81 by by be incident to second The face of concave mirror 82.4th reflecting surface P6 is to make to be led to from the second lens group 81 by the projected light beam EL2 that the second concave mirror 82 reflects It crosses and face that is incident, and making incident projected light beam EL2 be reflected to view field PA.Second lens group 81 includes various lens, The optical axis of various lens is configured on third optical axis BX3.Second concave mirror 82 is configured on the pupil plane of the second optical system 62, And the multiple point light source pictures for being set as and imaging in the first concave mirror 72 have the relationship of optical conjugate.

Projected light beam EL2 from perspective view diaphragm 63 is reflected by the third reflecting surface P5 of the second deflecting member 80, from The field of view of the top half of second lens group 81 by by be incident to the second concave mirror 82.It is incident to the second concave mirror 82 Projected light beam EL2 is reflected by the second concave mirror 82, from the field of view of the lower half portion of the second lens group 81 by by be incident to 4th reflecting surface P6 of the second deflecting member 80.The projected light beam EL2 for being incident to the 4th reflecting surface P6 is anti-by the 4th reflecting surface P6 Penetrate, from multiplying power amendment optical component 66 by by be projected to view field PA.Mask pattern on illumination region IR as a result, As with etc. multiplying powers (× 1) be projected on view field PA.

Focus corrects the configuration of optical component 64 between the first deflecting member 70 and perspective view diaphragm 63.Focus corrects light The adjustment of component 64 projection is learned to the focus state of the picture of the mask pattern in substrate P.It is for example to make that focus, which corrects optical component 64, The wedge-shaped prism of two panels is reversed (reversed in the X direction in Fig. 4) and overlaps made of integral transparent parallel flat.Pass through A pair of prism is set to be slided along bevel direction in the state of the interval between not changing face relative to each other so that as parallel The variable thickness of tablet.The effective optical path length of the first optical system 61 is finely adjusted as a result, and to being formed in intermediary image The focus state of the picture of the mask pattern of face P7 and view field PA is finely adjusted.

As offset optical component 65 configures between the first deflecting member 70 and perspective view diaphragm 63.As offset is used up Component 65 is learned to be adjusted in a manner of the picture of mask pattern that can be on mobile projector to substrate P in image planes.As offset is used Optical component 65 by Fig. 4 in the faces XZ tiltable transparent parallel plate glass and Fig. 4 in the faces YZ it is tiltable Bright parallel plate glass is constituted.By adjusting this respective tilt quantity of two panels parallel plate glass, can make to be formed in centre The micro offset in the x direction or the y direction of the picture of the mask pattern of image planes P7 and view field PA.

Multiplying power amendment is configured with optical component 66 between the second deflecting member 80 and substrate P.Multiplying power amendment optics structure Part 66 is for example configured to, and concavees lens, convex lens, concavees lens this 3 are configured at coaxially at predetermined intervals, recessed before and after fixing Mirror makes intermediate convex lens be moved on optical axis (chief ray) direction.It is formed in the picture of the mask pattern of view field PA as a result, The image formation state of telecentricity is maintained on one side, it is isotropically micro on one side to zoom in or out.In addition, constituting multiplying power amendment optics The optical axis of 3 lens groups of component 66 is tilted in the faces XZ in a manner of parallel with the chief ray of projected light beam EL2.

Correction mechanism 67 is rotated for example using actuator (illustration omitted), makes the first deflecting member 70 around parallel with Z axis The micro rotation of axis.The rotation correction mechanism 67 can make to be formed in intermediate image plane P7's by the rotation of the first deflecting member 70 The micro rotation in intermediate image plane P7 of the picture of mask pattern.

Adjustment mechanism 68 is polarized for example using actuator (illustration omitted), and quarter wave plate 41 is made to be revolved around the axis orthogonal with plate face Transfer adjustment polarization direction.Polarization adjustment mechanism 68, can be to being projected to the throwing of view field PA by making quarter wave plate 41 rotate The illumination of shadow light beam EL2 is adjusted.

In the projection optical system PL constituted in this way, the projected light beam EL2 from light shield M is from illumination region IR It is projected with the state (state that each chief ray is mutually parallel) of telecentricity, and by quarter wave plate 41 and by polarising beam splitter PBS It is incident to the first optical system 61.The projected light beam EL2 of the first optical system 61 is incident to by the first of the first optical system 61 The first reflecting surface (plane mirror) P3 of deflecting member 70 reflects, and from the first lens group 71 by being reflected by the first concave mirror 72. The projected light beam EL2 reflected by the first concave mirror 72 again from the first lens group 71 by by by the second of the first deflecting member 70 Reflecting surface (plane mirror) P4 reflects, and transmits overfocus and correct optical component 64 and be incident to as offset optical component 65 Perspective view diaphragm 63.From perspective view diaphragm 63 by projected light beam EL2 by the second optical system 62 second deflect structure Third reflecting surface (plane mirror) P5 of part 80 reflects, from the second lens group 81 by by reflected by the second concave mirror 82.By second Concave mirror 82 reflect projected light beam EL2 again from the second lens group 81 by by by the 4th reflecting surface of the second deflecting member 80 (plane mirror) P6 reflects, and is incident to multiplying power amendment optical component 66.The projected light projected from multiplying power amendment with optical component 66 Beam EL2 is incident to the view field PA in substrate P, will become apparent from the picture of the mask pattern in illumination region IR with etc. multiplying powers (× 1) it is projected on view field PA.

In the present embodiment, the second reflecting surface (plane mirror) P4 of the first deflecting member 70 and the second deflecting member 80 Third reflecting surface (plane mirror) P5 becomes tilts 45 ° of face relative to median plane CL (or optical axis BX2, BX3), and the first deflection The first reflecting surface (plane mirror) P3 of component 70 and the 4th reflecting surface (plane mirror) P6 of the second deflecting member 80 is set as and center Face CL (or optical axis BX2, BX3) is at the angle other than 45 °.When point Q1, intersection point Q2, first axle AX1 will be passed through in Figure 5 Straight line and median plane CL angulations when being set as θ °, by the first reflecting surface P3 of the first deflecting member 70 relative to center The angle [alpha] ° (absolute value) of face CL (or optical axis BX2) is determined as α °=45 °+θ °/2 relationship.Similarly, when will be along substrate Support the chief ray and median plane CL of the circumferential projected light beam EL2 by the central point in view field PA of the peripheral surface of cylinder 25 When angle in ZX planes is set as ε °, by the 4th reflecting surface P6 of the second deflecting member 80 relative to median plane CL (or Person optical axis BX2) angle beta ° (absolute value) be determined as β °=45 °+ε °/2 relationship.In addition, angle ε is according to projection optical system The sides light shield M of PL, the size in the structure of substrate P side, polarising beam splitter PBS equidimensions, illumination region IR or projected area Size in the circumferential direction of domain PA etc. and it is different, but be set as 10 °~30 ° or so.

Relationship > between the projection image planes and the plane of exposure of substrate of the pattern of < light shields

Fig. 7 is the projection image planes Sm for the cylindric pattern plane P1 for large showing light shield M and bearing is cylindric base The definition graph of relationship between the plane of exposure Sp of plate P.Then, with reference to Fig. 7, to the light in the exposure device U3 of first embodiment Relationship between the projection image planes and the plane of exposure of substrate of the pattern of cover illustrates.

Exposure device U3 by the way that projected light beam EL2 is imaged by projection optical system PL, come formed light shield M pattern throwing Image plane Sm.Projection image planes Sm is the position that the pattern of light shield M is imaged, and is the position for reaching optimum focusing.In addition it is also possible to Replace projection image planes Sm using the surface of the position other than optimum focusing.For example, it can be formed in and most preferably gather The burnt face at a distance of the position of predetermined distance.Herein, it is configured with as described above with the curved surface that radius of curvature is Rm on light shield M (being curve in ZX planes).The projection multiplying power of projection optical system PL such as set to multiplying powers, as a result, as view field In the range of the exposed width 2A of size in the circumferential direction of PA, also projection image planes Sm is approximatively regarded as to prolong in the Y direction A part for the curved surface that radius of curvature centered on the center line AX1 ' stretched is Rm.In addition, as noted previously, as substrate P is justified The bearing surface P2 of the substrate supporting cylinder 25 of barrel shape is kept, so it is Rp's that the plane of exposure Sp on the surface of substrate P, which is radius of curvature, A part for curved surface (being curve in ZX planes).If moreover, as projection image planes Sm the center of curvature center line AX1 ' with The central shaft AX2 of substrate supporting cylinder 25 is parallel to each other and is included in the plane KS parallel with YZ planes that then plane KS is located at The midpoint of exposed width 2A, moreover, tangent positioned at the plane of exposure Sp that projection image planes Sm and radius that radius is Rm are Rp is included in Y-direction on position including the tangent line Cp that extends.In addition, for convenience of description, radius Rp and the projection image planes of plane of exposure Sp The radius Rm of Sm is set as the relationship of Rp > Rm.

Herein, it keeps the cylinder roller 21 of light shield M to be driven by the first driving portion 22 and rotated with angular velocity omega m, supports base The substrate supporting cylinder 25 of plate P (plane of exposure Sp) is driven by the second driving portion 26 and is rotated with angular velocity omega p.In addition, will be with plane KS it is orthogonal and include project image planes Sm and plane of exposure Sp tangent line Cp including face as reference plane HP.It is assumed that reference plane HP with The faces XY are parallel, and reference plane HP is mobile with imaginary movement speed V (at the uniform velocity) in the X direction.Movement speed V and projection image The movement speed (peripheral speed) of face Sm and plane of exposure Sp in the circumferential is consistent.Exposure area (the projected area of present embodiment Domain PA) on the direction parallel with reference plane HP, centered on the tangent line Cp of the projection image planes Sm and plane of exposure Sp, by width 2A is as width.That is, exposure area (view field PA) is included on the moving direction of reference plane HP, from projection image planes Sm with Region until the tangent line Cp of plane of exposure Sp to the position for moving distance A to +X direction and -X direction respectively.

Since projection image planes Sm on the face of radius of curvature R m with angular velocity omega m by being rotated, so being located at tangent line The specified point on projection image planes Sm on Cp is only rotating θ m=ω mt after time t.Therefore, it is seen when on reference plane HP When examining, which is located at the point Cp1 only to +X direction movement Xm=RmSin (θ m).On the other hand, when on tangent line Cp Above-mentioned specified point when being moved linearly with movement speed V along reference plane HP, which is being located at after time t only to+X Move the point Cp0 of Vt in direction.Therefore, when the specified point on tangent line Cp is moved along projection image planes Sm and along reference plane The departure Δ 1 of the amount of movement in the X-direction after time t when HP moves linearly is Δ 1=Vt-Xm=Vt- Rm·Sin(θm)。

Similarly, since plane of exposure Sp on the face of radius of curvature R p with angular velocity omega p by being rotated, so working as When being observed on reference plane HP, the specified point on the plane of exposure Sp on tangent line Cp is only rotating θ p=ω p after time t t.Therefore, the specified point on plane of exposure Sp is located at the point Cp2 only to +X direction movement Xp=RpSin (θ p).Therefore, it is cutting The side X after time t when specified point on line Cp is moved along plane of exposure Sp and when moving linearly along reference plane HP The departure Δ 2 of upward amount of movement is Δ 2=Vt-Xp=Vt-RpSin (θ p).Above-mentioned departure Δ 1, Δ 2 Projection error referred to as when by the spot projection in barrel surface in plane (reference plane HP).Such as that being previously illustrated in Figure 5 Sample, in the present embodiment, in the view field PA of exposed width 2A shown in Fig. 7, the projection image of the pattern of light shield M is with remote The state of the heart is projected onto plane of exposure Sp.That is, in the faces XZ, each point on image planes Sm is projected along the line parallel with plane KS (line vertical with reference plane HP) projects on plane of exposure Sp.Therefore, projection image planes corresponding with the point Cp0 on reference plane HP Point Cp1 (position Xm) on Sm is also projected to the position Xm in identical X-direction, the position of point Cp1 on plane of exposure Sp Xm and and reference plane HP on the corresponding plane of exposure Sp of point Cp0 on point Cp2 position Xp between generate deviation.The deviation Main cause is that the radius Rm of projection image planes Sm is different from the radius Rp of plane of exposure Sp.

Like this, differentiated in radius Rm and radius Rp, the point Cp1 on projection image planes Sm shown in fig. 7 Departure Δ 1 and plane of exposure Sp on point Cp2 departure Δ 2 between difference component Δ (=Δ 1- Δs 2), with exposed width The position of X-direction in 2A correspondingly gradually changes.Therefore, to because of projection image planes Sm and plane of exposure Sp in exposed width 2A Semidiameter (Rm/Rp) generate deviation difference component Δ carry out quantification (emulation), thereby, it is possible to set consider projection exposure The best conditions of exposure of the quality (quality of projection image) of pattern on light to substrate P.In addition, difference component Δ is also referred to as being incited somebody to action Projection error when cylindric projection image planes Sm is transferred on cylindric plane of exposure Sp.

Fig. 8 A are as an example, the radius Rm for projecting image planes Sm to be set as 125mm, the radius Rp of plane of exposure Sp is set For 200mm, the peripheral speed (being set as Vm) for making projection image planes Sm it is consistent with the peripheral speed (being set as Vp) of plane of exposure Sp, It is in the range of ± the 10mm as exposed width 2A, to calculate above-mentioned departure Δ 1, Δ 2 in the state of movement speed V And the curve graph of the variation of difference component Δ.In fig. 8 a, horizontal axis indicate with the center of view field PA (plane KS by position Set) as the Zuo Biaoweizhi &#91 on the reference plane HP of origin;mm&#93;, the calculated departure Δ 1 of longitudinal axis expression, Δ 2, difference component Δ &#91;μm&#93;.As shown in Figure 8 A, poor under the peripheral speed Vp unanimous circumstances of the peripheral speed Vm and plane of exposure Sp of projection image planes Sm The absolute value of component Δ is with from the position (origin) of the projection image planes Sm tangent line Cps tangent with plane of exposure Sp to far from ± X-direction And it becomes larger.For example, in order to carry out minimum feature as the loyal transfer of several μm~10 μm or so of pattern and by difference component In the case that the absolute value of Δ is limited in 1 μm or so, according to the result of calculation of Fig. 8 A, need the exposed width of view field PA 2A is set as ± 6mm (being 12mm on width) below.

If in addition, the peripheral speed of the pattern plane for the light shield M that cylinder roller 21 is kept is set to Vf, according to projection The peripheral speed Vm for projecting image planes Sm is set as the relationship of Vm=β Vf by the projection multiplying power β of optical system PL.If for example, throwing Shadow multiplying power β be 1.00 (etc. multiplying powers), then the peripheral speed Vp of the peripheral speed Vf and plane of exposure Sp of the pattern plane of light shield M are set To be equal, if projection multiplying power β is 2.00 (amplifying with 2 times), it is set as 2Vf=Vp.Usually, as shown in Figure 8 A, due to Each peripheral speed of projection image planes Sm and plane of exposure Sp is set as Vm=Vp, so so that the relationship (speed of benchmark of β Vf=Vp Degree relationship) mode set up critically control the rotation of the cylinder roller 21 of holding light shield M and the substrate supporting cylinder 25 of supporting substrates P Tarnsition velocity.But as shown in Fig. 8 C as be described hereinafter, the circle of peripheral speed Vm and plane of exposure Sp to projecting image planes Sm Circular velocity Vp assigns the difference of very little, in the case of how changing come the difference component Δ in the analogous diagram 8A that tries, by circumference speed Spend the difference that Vm and peripheral speed Vp assigns very little, can the absolute value of difference component Δ is limited very little in the state of expand energy The exposed width 2A enough utilized.In the present embodiment, the radius Rp based on plane of exposure Sp is more than the radius Rm of projection image planes Sm Condition, by the peripheral speed Vp of plane of exposure Sp be set as relative to projection image planes Sm peripheral speed Vm it is lower.Specifically, so that The peripheral speed Vp of plane of exposure Sp is constant and makes reference plane HP shown in a little higher than Fig. 7 of peripheral speed Vm of projection image planes Sm The mode of movement speed V only makes some changes to the angular velocity of rotation ω m for projecting the side image planes Sm (light shield M).After change Angular speed is set as ω m ', sets the rotation angle of the projection image planes Sm after time t to θ m '.When trying projection image The peripheral speed Vm of face Sm is set as being higher by a little only with respect to movement speed V, come when calculating departure Δ 1, the deviation in Fig. 8 A The curve for measuring the curve graph of Δ 1 is changed in a manner of becoming with negative slope in origin 0.

Therefore, in the present embodiment, using such tendency, with the position in exposed width 2A and across origin 0 The mode that the difference component Δ of symmetrical two positions is zero projects the peripheral speed Vm (angular velocity omega m ') of image planes Sm to set. Fig. 8 B are each calculating of the difference component Δ, departure Δ 1, Δ 2 that indicate that the peripheral speed Vm of change projection image planes Sm is obtained later As a result the definition of curve graph, the longitudinal axis and horizontal axis is identical as Fig. 8 A.In the fig. 8b, in the curve graph of departure Δ 2 and Fig. 8 A Curve graph is identical, but on each position of+5mm of the curve graph of departure Δ 1 in exposed width, -5mm and origin 0, with The mode that departure Δ 1 is zero sets the angular velocity omega m ' (θ m ') of projection image planes Sm.As a result, difference component Δ is exposing Position in width in the range of ± 4mm with negative slope variation, on the outside in the range of with positive slope variation, exposing Everybody of origin 0 ,+6.4mm, -6.4mm in optical width is set to zero.

In the case where the range that can allow for as difference component Δ is such as ± 1 μm or so, Fig. 8 A's in front Under the conditions of exposed width be ± 6mm, but exposed width under conditions of Fig. 8 B is expanded to ± 8mm or so.It means that The size in the scan exposure direction (circumferential direction) of view field PA can be increased to 16mm (about increasing by 33%) from 12mm, if exposure The illumination of illumination light is identical, then need not reduce the fidelity of pattern transfer, and the transporting velocity of substrate P is just improved about 33% To improve productivity.Make the light exposure of imparting substrate P only in addition, can the size of view field PA be increased 33% and also implied that Increase this tittle, conditions of exposure can be mitigated.In addition, exposure device U3 can utilize the rotary encoder point of high de-agglomeration energy on one side The rotation of the cylinder roller 21 of light shield M and the rotation of the substrate supporting cylinder 25 of supporting substrates P Ce Liang not kept and carry out servo control System, the difference of small rotary speed is generated thereby, it is possible to one side, carries out high-precision rotation control on one side.

In the movement speed V that the peripheral speed Vp of plane of exposure Sp is equal to reference plane HP, the circle of image planes Sm will be projected In the case that circular velocity Vm is set as the movement speed V of a little higher than reference plane HP, difference component Δ shown in Fig. 8 A is as shown in Figure 8 C Ground changes.Fig. 8 C show tendency in the case of following, that is, only for the curve graph of the difference component Δ in Fig. 8 A, will project The peripheral speed Vm of image planes Sm relative to the change rate of the peripheral speed Vp (=V) of plane of exposure Sp be set as α (=(Vm-Vp)/ Vp) %, so that α is changed+0.01% every time from ± 0%.In the curve graph and Fig. 8 A of the difference component Δ of α=± 0% in Fig. 8 C The curve graph of difference component Δ is identical.In the case of change rate α=± 0%, peripheral speed Vm and peripheral speed Vp is in consistent State, for example, in the case of change rate α=+ 0.02%, peripheral speed Vm is in bigger than peripheral speed Vp 0.02% shape State.Based on being calculated as shown in Fig. 8 C, in the fig. 8b, make the peripheral speed Vm of projection image planes Sm relative to reference plane HP's Reference speed V (=Vp) is emulated in the state of increasing about 0.026%.The simulation result of Fig. 8 C be by will to relative to The θ m of RmSin (θ m) in the mathematical expression that the departure Δ 1 of the reference plane HP of projection image planes Sm is solved replace with (1+ α) θ m and change rate α is carried out obtained from various changes.In fact, when Vt to be replaced with to the side X for indicating exposed width When the A of upward position (mm), difference component Δ can simply be found out by following formula.

Δ=Δ 1- Δs 2=(A-RmSin ((1+ α) A/Rm))-Δ 2

As described above, in the case where projecting the radius Rp differences of radius Rm and plane of exposure Sp of image planes Sm, by throwing Each movement speed (peripheral speed Vm, Vp) of image plane Sm and plane of exposure Sp assigns the difference of very little, when can expand scan exposure Various conditions of exposures (sensitivity of the radius, photosensitive layer of light shield M, the transporting velocity of substrate P, the power of illuminating light source, The size etc. of view field PA) setting range, the exposure device that can neatly cope with change of technique etc. can be obtained.

Hereinafter, assigning very little to each peripheral speed Vm, Vp of projection image planes Sm and plane of exposure Sp as shown in Figure 8 B In the case of difference, with reference to Fig. 9, illustrated for the contrast of the pattern image obtained on plane of exposure Sp.What Fig. 9 was shown below Curve graph：The position (absolute value) for taking the exposed width that the origin 0 in Fig. 8 A, 8B is set as to 0mm on transverse axis, takes on longitudinal axis The value of origin 0 is set as to the contrast ratio of 1.00 (100%), does not have difference between projecting image planes Sm and plane of exposure Sp The case where (Fig. 8 A) and with difference the case where (Fig. 8 B) under, calculated corresponding with the position in exposed width Contrast than variation curve graph.In the present embodiment, the wavelength X of illuminating bundle EL1 (exposure light) is set as The numerical aperture NA of projection optical system PL (PLM) shown in Fig. 4 is set as 0.0875, process constant k is set as by 365nm 0.6.Since the maximum resolution ratio Rs obtained under this condition obtains 2.5 μm according to Rs=k (λ/NA), so in accordance with meter Calculate and used 2.5 μm of L&S (Xian &Interval) pattern.

As shown in figure 9, larger by the curvature in the plane of exposure Sp on the projection image planes Sm and substrate P by mask pattern The peripheral speed Vp of one surface side is set to slightly less than another peripheral speed Vm, come make to obtain high contrast than exposed width Range expands.For example, in order to maintain the quality for the pattern image being transferred on plane of exposure Sp and need contrast ratio to be 0.8 or so In the case of, the exposed width under the state (Vm=Vp) of not difference is ± 6mm or so, in contrast, is being had There is the exposed width under the state (Vm > Vp) of difference that can ensure in ± 8mm or more.In addition, if contrast ratio also may be used Think 0.6 or so, then the exposed width under the state (Vm > Vp) with difference can be expanded to ± 9.5mm or so. As described above, the difference of very little is assigned by the peripheral speed Vp of peripheral speed Vm and plane of exposure Sp to projecting image planes Sm, even if Increase sizes (exposed width 2A) of the view field PA on scan exposure direction, can also realize the pattern image that will be projected Contrast (picture quality) is maintained good pattern exposure.In addition, since view field PA can be increased in scan exposure side Upward exposed width 2A so the transporting velocity of substrate P can be further increased, or is reduced every single in view field PA The illumination of the exposure light (projected light beam EL2) of plane product.

In addition, as shown in Fig. 8 C of front, gradually changes difference (Vm-Vp) a little on one side, emulate phase on one side For the position of exposed width difference component Δ in the case of, preferably by the projection image planes Sm of the pattern in view field PA with The average value or maximum value of the difference component Δ of the offset on scan exposure direction of plane of exposure Sp in substrate P are set as small In the minimum feature (minimum dimension) for the pattern image that should be transferred.For example, when the exposure being conceived in the exposed width in Fig. 8 B For width in the range of 0mm~+6mm, the average value of difference component Δ in the range is about -0.42 μm, and maximum value is about It is -0.66 μm.In addition, when being conceived to range of the exposed width in 0mm~+8mm, difference component Δ in the range is averaged Value is about -0.18 μm, and maximum value is about+1.2 μm.If being set as the minimum feature for the pattern image that transfer before progress 2.5 μm set when the emulation of the Fig. 9 in face then reach the range of 6mm in exposed width and exposed width reach the range of 8mm In, the average value of difference component Δ, maximum value can be contracted to be less than 2.5 μm of minimum feature.

In addition, as shown in Fig. 8 B of front, in the variation characteristic by emulating the difference component Δ found out, preferably in reality Exposed width (sizes of the view field PA on scan exposure direction) in the position that difference component Δ is zero at least set 3 It is a.For example, in the case where view field PA to be set as to the exposed width of ± 8mm, during scan exposure, projection to throwing The position of -8mm of the point out of exposed width in pattern image in the PA of shadow zone domain is moved to the position of+8mm.During this period It is interior, a point in pattern image respectively by difference component Δ be zero position -6.4mm, position 0mm (origin), position+6.4mm And it is transferred on plane of exposure Sp.In this way, by at least 3 in the exposed width on the scan exposure direction of view field PA Make the mode that difference component Δ is zero on a position, critically controls the cylinder roller 21 and substrate supporting cylinder 25 for keeping light shield M Each rotary speed can will be exposed to size of the pattern image of (plane of exposure Sp) in view field PA on scan exposure direction (line width) limits of error is made smaller, thus allows for loyal pattern transfer.

As previously explained above, maximum resolution ratio Rs is according to the numbers of the sides projection image planes Sm of projection optical system PL Value aperture NA, the wavelength X of illuminating bundle EL2, (usual 1 or less) is determined process constant k by Rs=k (λ/NA).This In the case of, when the movement speed of reference plane HP is set as V, the displacement distance of reference plane HP is set as x, by the absolute of exposed width When value is set as A, following relationships is preferably satisfied.

&#91;Mathematical expression 1&#93;

&#91;Mathematical expression 2&#93;

The mathematical expression F (x) is the formula of the difference component Δ for the position x for indicating some point on reference plane HP, such as reference As Fig. 7 is illustrated, the relationship of the movement speed V and displacement distance x of reference plane HP are equivalent to time t (=x/V).This implementation The exposure device U3 of mode is by meeting above-mentioned mathematical expression, even if need not if increasing the exposed width of effective view field PA The contrast for reducing the pattern image being projected, can form pattern with good picture quality in substrate P.

In addition, the exposure device U3 of present embodiment can replace the cylinder roller 21 for keeping light shield M.For reflection-type In the case of cylinder light shield, can directly it be formed on the peripheral surface of cylinder roller 21 as the high reflection portion of mask pattern and low Reflecting part (light absorption department).In this case, light shield replacement is carried out to each cylinder roller 21.At this point, making sometimes again It is installed on the radius (diameter) of the cylinder roller 21 of the reflection-type cylinder light shield of exposure device and the cylinder light shield for replacing preceding installation Radius it is different.This is in the case where changing size (size etc. of display panel) that be exposed to the device in substrate P Etc. what may be occurred.In the present embodiment, even in this case, the mask pattern based on the cylinder roller 21 after replacement The radius in face carries out the calculating (emulation) such as Fig. 8 A~8C, Fig. 9, and thereby, it is possible to determine in advance should be to cylinder roller 21 and base Plate supports the exposed width for the view field PA that the angular velocity of rotation that cylinder 25 is set is poor, should set, the illumination light that should be adjusted The parameters such as the transporting velocity (rotary speed of substrate supporting cylinder 25) of the illumination of beam EL2 or the substrate P that should be adjusted.In addition, In the case where being replaceably mounted radius Rm with different multiple cylinder roller 21 of such as millimeter unit or centimetre unit, if There is the mechanism that the bearing portion of the exposure device side of the Pivot axle AX1 to supporting cylinder roller 21 in z-direction is adjusted. In addition, in the case of exposed width on the scan exposure direction that the parameter as adjustment changes view field PA, it can It is adjusted using the field stop 63 of illuminated field diaphragm 55 or intermediate image plane P7 in such as Fig. 4.As described above, exposure Device U3 (substrate board treatment) correspondingly can suitably adjust conditions of exposure by adjusting above-mentioned various parameters with light shield M, Thus allow for adapting to the exposure of light shield M.

Exposure device U3 be preferably based on according to the conditional as defined in the relationship between projection image planes Sm and plane of exposure Sp and The value that is calculated, the value being also calculated based on the measurement results such as flexible with reference to the substrate P in manufacturing process, to adjust The movement speed of substrate P based on substrate holding mechanism 12 (substrate supporting cylinder 25) holding and the scan exposure of view field PA The width in direction it is at least one.Exposure device U3 can automatically adjust various conditions as a result,.

The width of the entire area of the pattern of display panels of the exposure device U3 of present embodiment on being formed in substrate P etc. Under the premise of size on the directions axis AX2 of size on direction more than view field PA, with projection optical system PL's The mode that view field PA is arranged as shown in the right part of Fig. 3 is equipped with 6 projection optical system PL1~PL6, but according to substrate The width of P, the quantity can be one, can also be 7 or more.

Preferably, it in the case where multiple projection optical system PL are arranged in the width direction of substrate P, is exposed in scanning The light exposure that light time is accumulated by the exposed width of each view field PA is in the direction (base orthogonal with scan exposure direction The width direction of plate P) on anywhere all substantially certain (such as ± a few % within).

&#91;Er Shishifangshi &#93;

Hereinafter, referring to Fig.1 0, the exposure device U3a of second embodiment is illustrated.In addition, in order to avoid repetition It records, is illustrated only for the part different from first embodiment, for inscape same as first embodiment Mark pays reference numeral same as the first embodiment to illustrate.Figure 10 is the exposure device for showing second embodiment The integrally-built figure of (substrate board treatment).The exposure device U3 of first embodiment is to utilize cylindric substrate supporting cylinder 25 come keep from view field by substrate P structure, but the exposure device U3a of second embodiment is using removable Base supporting mechanism 12a keep the structure of flat substrate P.

In the exposure device U3a of second embodiment, base supporting mechanism 12a is planar with substrate P is remained Substrate objective table 102 and so that substrate objective table 102 (faces XY) in the plane orthogonal with median plane CL is swept along the X direction Retouch mobile mobile device (illustration omitted).

Since the bearing surface P2 of the substrate P of Figure 10 is substantially the plane parallel with the faces XY, so being incorporated to by light shield M reflection The projected light beam EL2 for being incident upon projection optics module PLM (PL1~PL6) is set as, when being projeced into substrate P, projected light beam EL2 Chief ray it is vertical with the faces XY.

In addition, in this second embodiment also in the same manner as Fig. 2 of front, when being observed in the faces XZ, from light shield M Perimeter until the central point to the central point of illumination region IR2 (and IR4, IR6) of illumination region IR1 (and IR3, IR5) It is set as, is projected with from the central point of the view field PA1 (and PA3, PA5) in the substrate P for copying bearing surface P2 to second Perimeter until the central point of region PA2 (and PA4, PA6) is substantially equal.

In the exposure device U3a of Figure 10, the mobile device of the also control base board supporting device 12 of slave control device 16 (is swept Retouch the linear motor of exposure or the actuator of fine motion etc.), the rotation synchronously drive substrate loading with cylinder roller 21 Platform 102.In addition, substrate P in the present embodiment can be the flexible base boards such as resin film, can also be liquid crystal display panel Glass plate.Moreover, in the case of implementing scan exposure, being equipped with base in the precision movement by substrate objective table 102 Plate P vacuum suctions are in construction (such as the plane holder of chuck pin (pin chuck) mode, Porous mode of bearing surface P2 Deng).In addition, in not moving substrate objective table 102 and in the case of being only planar by substrate P bearing, it is equipped in bearing surface P2 It is upper using the gas blanket based on air bearing with low friction state or contactless state come the mechanism (such as primary of supporting substrates P Exert the plane holder etc. of sharp sucker (Bernoulli chuck) mode), keep for tension as defined in being assigned to substrate P The tension imparting mechanism of flatness.

Hereinafter, referring to Fig.1 1, to the projection image planes Sm of the pattern of the light shield M in the exposure device U3a of second embodiment Movement and substrate P plane of exposure Sp movement between relationship illustrate.Figure 11 is based on item same as Fig. 7 of front Part and definition large show the explanation of the relationship between the plane of exposure Sp on the projection image planes Sm and substrate P of the pattern of light shield M Figure.

Exposure device U3a forms the projection of the pattern of the light shield M of cylinder planar using the projection optical system PL of telecentricity Image planes Sm.Projection image planes Sm is also the optimum focusing face of the pattern imaging of light shield M.Herein also due to the pattern plane of light shield M is formed The curved surface for being Rm for radius of curvature, so it is Rm's that projection image planes Sm, which also becomes the radius of curvature centered on imaginary line AX1 ', A part for barrel surface (being circular curve in ZX planes).On the other hand, it is remained by substrate objective table 102 due to substrate P Plane, so plane of exposure Sp is plane (being straight line in ZX planes).Therefore, the plane of exposure Sp in present embodiment is and front The consistent surfaces reference plane HP shown in fig. 7.That is, plane of exposure Sp is considered as the surface of radius of curvature R p infinitely great (∞), Alternatively, the great curved surfaces of radius Rm relative to projection image planes Sm.

Due to projecting image planes Sm by radius of curvature to be rotated with angular velocity omega m on the face of Rm, so projection image planes Point Cp on Sm and projection image planes Sm tangent plane of exposure Sp after time t positioned at only having rotated angle, θ m=ω mt's Point Cp1.Therefore, position Xms of the point Cp1 on projection image planes Sm on the direction (X-direction) along reference plane HP becomes Xm= Rm·Sin(θm).In addition, since plane of exposure Sp is the plane consistent with reference plane HP, so projection image planes Sm and plane of exposure Sp Point Cp on tangent plane of exposure Sp is being located at the point Cp0 that Xp=Vt is moved on only in an X direction after time t.Therefore, Such as Fig. 7 explanations using front, the point on point Cp1 and plane of exposure Sp on the projection image planes Sm after time t Departure Δs 1 of the Cp0 in X-direction (scan exposure direction) is Δ 1=Vt-RmSin (θ m).

The departure Δ 1 of Figure 11 is the substrate P or exposure due to light shield M either projects image planes Sm with constant angular velocity movement Projection error (Sin errors) caused by face Sp uniform rectilinears movement.If when point Cp is located at as the center in exposed width 2A Plane KS on when, which is set as zero, then the departure Δ 1 with from the position to ± X-direction far from and by It is cumulative big.When scan exposure, in the range of the exposed width 2A on the plane of exposure Sp in substrate P, to projection image planes Sm's Pattern image is continuously added up and is transferred.But because being influenced by the projection error of departure Δ 1 so that be transferred The size on scan exposure direction of pattern image has error relative to the size of the pattern on light shield M, under transfer fidelity Drop.

Therefore, in the present embodiment, by projecting image planes Sm and plane of exposure Sp, by the smaller side of radius of curvature Surface peripheral speed be set to the larger side of a little higher than radius of curvature surface peripheral speed, can obtain and front The same effect of first embodiment.In the present embodiment, due to the radius of curvature R p of plane of exposure Sp and projection image planes Sm Radius of curvature R m there is the relationship of Rp > > Rm relatively slightly to improve projection so compared with the movement speed V of plane of exposure Sp The peripheral speed Vm of image planes Sm.

Hereinafter, using Figure 12~Figure 18, to the structure using exposure device U3a perform an example of various emulation into Row explanation.Figure 12 is the circumference for showing movement speed V (identical as peripheral speed Vp) and projection image planes Sm based on plane of exposure Sp Speed Vm has indifference and the curve graph of the variation of the generation of departure Δ 1, the longitudinal axis of Figure 12 is made to indicate the departure Δ in Figure 11 1, exposed width is indicated in the same manner as horizontal axis and Fig. 8 A, 8B.In addition, in each emulation after Figure 12, it is by the radius Rm of light shield M The radius Rm for projecting image planes Sm is set as 150mm.As being illustrated in Figure 11, in the movement speed V (circles for making plane of exposure Sp Circular velocity Vp) be equal to the peripheral speed Vm of projection image planes Sm in the case of, i.e., in the case of no difference, when will be inclined When the allowable range of residual quantity Δ 1 is set as ± 1 μm or so, exposed width is the range of ± 5mm or so.

Therefore, if the angular speed for projecting image planes Sm is adjusted to ω m ' (ω m < ω m ') from ω m, make projection image planes Sm's The movement speed V (peripheral speed Vp) of a little higher than plane of exposure Sp of peripheral speed Vm, then departure Δ 1 ' is centered on by origin 0 With negative slope variation in the range of exposed width ± 4mm, with positive slope variation on the outside of the range.If by departure Δ 1 ' The position on exposed width for being zero is set to the place of ± 6.7mm or so, then the allowable range of departure Δ 1 ' converges on ± 1 μm or so exposed width be ± 8mm or so range.Compared with the case where not assigning difference, this will be used as and sweep It retouches the exposed width that exposure uses and expands 60% or so.

Hereinafter, in the same manner as Fig. 9 of front, for the movement speed V (=peripheral speed Vp) and projection for making plane of exposure Sp The peripheral speed Vm unanimous circumstances (no difference) of image planes Sm and the situation for assigning small difference (have peripheral speed Difference) under the variation of contrast value (or contrast ratio) of pattern image illustrate.

Figure 13 A show to work as and the numerical aperture NA of the sides plane of exposure Sp of projection optical system PL are set as 0.0875, will be illuminated When the wavelength of light beam EL1 is set as 365nm, process constant is set as to 0.6 and illumination σ is set as 0.7, on it will be formed in light shield M Rs=2.5 μm of maximum resolution L&The contrast for the picture that S patterns obtain in the case of being projected on plane of exposure Sp.Figure 13B indicates that isolated line (ISO) pattern of Rs=2.5 μm of the maximum resolution obtained under the conditions of by same projection projects In the case of the contrast of picture that is obtained on plane of exposure Sp.

Either 2.5 μm of L&S patterns or ISO patterns reach the contrast value of the bright part of picture close to 1.0 and dark portion Tap nearly 0 intensity distribution CN1 preferably.Contrast value is the light using the maximum value Imax and dark-part of the luminous intensity of bright part The minimum value Imin of intensity is found out according to (Imax-Imin)/(Imax+Imin).Intensity distribution CN1 generally be in pair The state higher than degree, the low state of contrast refer to that the difference of maximum value Imax and minimum value Imin as intensity distribution CN2 (are shaken Width) the case where becoming smaller.The intensity distribution CN1 of the picture shown in Figure 13 A, 13B is 2.5 μm of L&S patterns or ISO patterns The contrast of static projection image, but in the case of scan exposure, moved on the entire exposed width of setting in substrate P In a period of, such as on one side according to the variation of the difference component Δ or departure Δ 1 illustrated in fig. 12 that illustrate in Fig. 8 B, to make Static intensity distribution CN1 is offset up in scan exposure side, and the value being accumulated by one side becomes the figure being transferred in substrate P The final contrast of case picture.

Hereinafter, the simulation result being shown below in Figure 14, Figure 15, that is, the projection exposure item illustrated in Figure 13 A, 13B Under part (Rm=150mm, Rp=∞, NA=0.0875, λ=365nm, k=0.6), to the L&amp relative to 2.5 μm;The throwing of S patterns The result that the variation of the contrast value (contrast ratio) of the position on exposed width of image is emulated.Figure 14, Figure 15 Horizontal axis indicate positive side exposed width A position, the longitudinal axis indicates to utilize the comparisons that find out of (Imax-Imin)/(Imax+Imin) Angle value and the contrast ratio in the case where the contrast value at exposed width 0mm is standardized as 1.0.Moreover, Figure 14 is shown In the movement speed V (=peripheral speed Vp) for making plane of exposure Sp no peripheral speeds consistent with the projection peripheral speed Vm of image planes Sm Contrast variation in the case of difference, Figure 15 is shown as the variation characteristic of the departure Δ 1 ' in Figure 12, projects image planes Sm Peripheral speed Vm slightly larger than plane of exposure Sp movement speed V (=peripheral speed Vp) have difference in the case of Contrast changes.

As shown in figure 14, in the case of no difference (before amendment), although contrast ratio is in the position of exposed width Substantially certain setting from origin 0 to 4mm or so, but since the position of 5mm or more drastically decline.Moreover, exposure In the case of 8mm or more, contrast is than becoming 0.4 hereinafter, may become pair to the exposure of photoresist for the position of width Than degree deficiency.In the position of exposed width be contrast value at 0mm it is about 0.934 in addition, in simulations, contrast ratio The value is standardized as 1.0 expressions.

In contrast, in the case where having difference (after amendment) as shown in figure 15, in the position of exposed width Between 0~4mm, contrast ratio gradually decreases down 0.8 or so from 1.0, but in the position of exposed width between 4mm~8mm, Contrast ratio maintains 0.8 or so.In simulations, it is the contrast ratio about 0.77 at 5mm in the position of exposed width, Position is that the contrast ratio at 7mm is about 0.82.

Like this, by making the peripheral speed Vm of projection image planes Sm be slightly larger than the movement speed V of planar plane of exposure Sp (=peripheral speed Vp), the exposed width 2A for the view field PA that can be set in scan exposure can be increased.

In addition, as shown in figure 16,2.5 μm of ISO patterns in the case of no difference (before amendment) as Contrast is begun slowly to down than being all substantially certain until the position of exposed width is 5mm from 5mm or more Drop, it is about 0.9 to be set in place at 6mm, and it is about 0.6 to be set in place at 8mm, and it is about 0.5 to be set in place at 9mm, and In place be set at 10mm is about 0.4.In addition, the contrast ratio in Figure 16 is to be with the position of exposed width in fig. 14 2.5 μm of the L&amp obtained at 0mm;On the basis of the contrast value (being about 0.934) of the picture of S patterns, the ISO figures using 2.5 μm are taken The ratio for the contrast value (set to 0 in place at mm is about 0.968) that the picture of case obtains.Therefore, contrast shown in Figure 16 than just Initial value (being set to the value at 0mm in place) is about 1.04.

In contrast, in the case where having difference (after amendment) as shown in figure 17, in the position of exposed width In the range of 0~8mm, the contrast ratio of the picture of 2.5 μm of ISO patterns maintains 0.9 or more, is set at 9mm and declines in place To 0.8 or so, but even if in place be set at 10mm is also maintained at about 0.67.As described above, by making projection image planes Sm's The opposite movement speed V (=peripheral speed Vp) for being slightly larger than planar plane of exposure Sp of peripheral speed Vm, can increase and scan The exposed width 2A for the view field PA that can be set when exposure.

In addition, also following evaluation assessment, that is, the peripheral speed to the peripheral speed Vm and plane of exposure Sp that project image planes Sm Small difference is assigned between Vp (either translational velocity V) to obtain such as the deviation in the difference component Δ or Figure 12 in Fig. 8 B The characteristic for measuring Δ 1 ' utilizes difference component Δ or departure Δ for the range of clearly best exposed width 2A (either A) Relationship between 1 ' and resolution ratio Rs.Hereinafter, this method is illustrated, but to put it more simply, sometimes by the difference in Fig. 8 B The departure Δ 1 ' measured in Δ or Figure 12 is known as image displacement amount Δ.

In the evaluation assessment, average value/Rs of image displacement amount Δ is calculated for each position on exposed width Relationship or image displacement amount Δ²Average value/Rs relationship.Therefore, it is based on Figure 18, Figure 19, is illustrated with the flat of image displacement amount Δ Mean value/Rs is as evaluation of estimate Q1, the example that is emulated using average value/Rs of image displacement amount Δ 2 as evaluation of estimate Q2.Figure 18 It is identical as the curve graph of departure Δ 1 ' shown in Figure 12 of front, but the exposed width that will be calculated is set as the model of ± 12mm It encloses.In addition, it is interval that it is same as Figure 12, which to calculate sampled point on the exposed width of departure Δ 1 ' (image displacement amount Δ), 0.5mm。

The average value of image displacement amount Δ is to each to what is obtained the sampled point having in mind in the origin 0mm from exposed width The absolute value of departure Δ 1 ' carries out what arithmetic average obtained.For example, position is the flat of the image displacement amount Δ of the sampled point of -10mm Mean value is the deviation that will be set to 0mm~position in place and be obtained at each sampled point (being 21 points in figure 18) between -10mm The absolute value for measuring Δ 1 ' is added, then the value that will add up divided by sampled point quantity are found out.In the case of Figure 18, in place The additive value for being set to the absolute value of the departure Δ 1 ' at each sampled point of 0mm~-10mm is 20.86 μm, then divided by sampled point The average value that number 21 obtains is about 0.99 μm.In addition, NA=0.0875, λ=368nm, process constant k=0.5 are set herein, To which the resolution ratio Rs in emulation is set as 2.09 μm.Therefore, it is the evaluation of estimate Q1 (nothings at -10mm in the position of exposed width Unit) it is about 0.48.If each position (sampled point) in exposed width is calculated as described above, evaluation of estimate is understood The dynamic trend of Q1.

In addition, (image displacement amount Δ)²Average value be to by the sampled point from the origin 0mm of exposed width to concern it Between the obtained absolute value of each departure Δ 1 ' carry out the value after square operation (μm²) carry out what arithmetic average obtained.In Figure 18 In the case of, it is added again for example, the absolute value of the departure Δ 1 ' for each sampled point that position is 0mm~-10mm is squared To value be 42.47 μm², then divided by the obtained average value of sampling number 21 be about 2.02 μm².Due to the resolution in emulating Rate Rs is set as 2.09 μm, thus the position of exposed width be -10mm at evaluation of estimate Q2 be about 0.97 μm.If wide in exposure Each position (sampled point) in degree is calculated as described above, then understands the dynamic trend of evaluation of estimate Q2 (μm).

Figure 19 is to take evaluation of estimate Q1, Q2 found out through the above way on longitudinal axis, takes the position of exposed width on transverse axis The curve graph set.Evaluation of estimate Q1 (average value/resolution ratio Rs of image displacement amount Δ) is as exposed width (absolute value) becomes larger and puts down Change slowly, about becomes substantially 1.0 in the position of ± 12mm of exposed width.This means that the image position in the position of ± 12mm The average value and resolution ratio Rs of shifting amount Δ are roughly the same.On the other hand, evaluation of estimate Q2 (image displacement amount Δs²Average value/resolution ratio Rs it) is changed with the tendency same with evaluation of estimate Q1 in the range of until the position of exposed width is at ± 8mm, It increased dramatically when 8mm or more, be substantially to become 1 (μm) at ± 10mm in the position of exposed width.

Herein, the contrast variation of ISO patterns shown in Figure 17 in front or L&amp shown in figure 15;The comparison of S patterns Degree variation in, contrast than since exposed width 8mm or more place significantly decline.Pair found out in Figure 15, Figure 17 Than degree than variation be the case where resolution ratio Rs is set as 2.5 μm, although not being to utilize Rs=2.09 μm of calculated contrast The variation of ratio, but be inclined to substantially the same.Like this, can by the evaluation assessment using evaluation of estimate Q1 or Q2 as index, To determine the best exposed width of reflection contrast variation.

In addition, in this case, since plane of exposure Sp and reference plane HP is parallelly in the X direction with movement Speed V (peripheral speed Vp) is mobile, so replacing with the mathematical expression F (x) used in the first embodiment of front as following Mathematical expression F ' (X).

&#91;Mathematical expression 3&#93;

The exposure device U3a of second embodiment shown in Fig. 10 is implemented by the way that formula F ' (X) is applied to above-mentioned first In the mathematical expression of mode, and meet the relationship, effect same as first embodiment can be obtained.

&#91;Third Shi Shifangshi &#93;

Hereinafter, being illustrated to the exposure device U3b of third embodiment with reference to Figure 20.In addition, in order to avoid repetition It records, is illustrated only for the part different from the first, second embodiment, for same as the first, second embodiment Inscape mark identical with the first, second embodiment reference numeral and illustrate.Figure 20 is to show third embodiment party The integrally-built figure of the exposure device (substrate board treatment) of formula.The exposure device U3 of first embodiment is using with by light Structure of the light of the pattern plane reflection of cover M as the reflection-type light shield of projected light beam, the exposure device U3b of third embodiment are Use the structure of the transmission-type light shield using the light of the pattern plane through light shield as projected light beam.

In the exposure device U3b of third embodiment, light shield holding mechanism 11a has the cylinder roller for keeping light shield M (light shield holding cylinder) 21a, the deflector roll 93 of supporting cylinder roller 21a, the driven roller 94 of driving cylinder roller 21a, driving portion 96.

Cylinder roller 21a forms the light shield face configured with the illumination region IR on light shield MA.In the present embodiment, light shield Bread contains the face for rotating line segment (busbar) around the axis (central shaft of cylindrical shape) parallel with the line segment and obtaining (hereinafter referred to as Barrel surface).Barrel surface is, for example, the peripheral surface etc. of the peripheral surface of cylinder, cylinder.Cylinder roller 21a is by such as glass or quartz Deng composition, in the cylindrical shape with certain thickness, peripheral surface (barrel surface) forms light shield face.That is, in the present embodiment, Illumination region on light shield MA bends to the cylinder planar with radius of curvature R m from center line.Slave light in cylinder roller 21a Part when the radial observation of cover holding cylinder 21a with the pattern registration of light shield M, for example, cylinder roller 21a in Y direction in addition to two Center portion other than end side has translucency relative to illuminating bundle EL1.

Light shield MA is made into the very thin glass plate (such as 100~500 μm of thickness) for example in the good strip of flatness A surface on using the planar sheet material light shield for foring the transmission-type of pattern by light shield layers such as chromium, so that it is copied cylinder The peripheral surface of roller 21a is bent, and is used in the state of the peripheral surface with winding (fitting).Light shield MA, which has, to be unpatterned Non- pattern forming region, cylinder roller 21a is installed in non-pattern forming region.Light shield MA can be from cylinder roller 21a It is detached from.The light shield MA and light shield M of first embodiment is it is equally possible that substitution is wound in the circle being made of transparent cylinder base material Cylinder roller 21a, and directly the light shield layers such as chromium is utilized to draw shape in the peripheral surface for the cylinder roller 21a being made of transparent cylinder base material Come at mask pattern integrated.In this case, cylinder roller 21a can also realize the work(of the holding member of mask pattern Energy.

Deflector roll 93 and driven roller 94 extend along the Y direction parallel with the central shaft of cylinder roller 21a.Deflector roll 93 with And driven roller 94 is arranged to rotate around the axis parallel with central shaft.Deflector roll 93 and driven roller 94 are arranged to not roll with cylinder The light shield MA contacts that cylinder 21a is kept.Driven roller 94 is connect with driving portion 96.Driven roller 94 is by will supply from driving portion 96 Torque is conducted to cylinder roller 21a, to make cylinder roller 21a around center axis rotation.

The lighting device 13a of present embodiment has light source (illustration omitted) and lamp optical system ILa.Light optics System ILa is multiple with correspondingly being arranged in the Y-axis direction with each in multiple projection optical system PL1~PL6 (such as 6) lamp optical system ILa1~ILa6.It can be used in the same manner as light source and above-mentioned various lighting device 13a various Light source.The Illumination Distribution of illumination light shot from the light source is homogenized, such as is distributed to multiple photographs via light conducting members such as optical fiber Bright optical system ILa1~ILa6.

Multiple lamp optical system ILa1~ILa6 be respectively provided with multiple optical components of lens etc., integrated optics system, Cylindrical lenses, fly's-eye lens etc. utilize the illuminating bundle EL1 irradiation illumination regions IR of uniform Illumination Distribution.In this embodiment party In formula, multiple lamp optical system ILa1~ILa6 are configured at the inside of cylinder roller 21a.Multiple lamp optical system ILa1~ ILa6 is respectively from the inside of cylinder roller 21a by cylinder roller 21a, the light shield that is kept to the peripheral surface of cylinder roller 21a Each illumination region irradiation on MA.

Lighting device 13a guiding is by lamp optical system ILa1~ILa6 light shot from the light source, by the illumination light of guiding Beam is from cylinder roller 21a internal irradiations to light shield MA.Lighting device 13a, which is irradiated using illuminating bundle EL1 with uniform brightness, to be justified The part (illumination region IR) for the light shield M that cylinder roller 21a is kept.In addition, light source can be configured at the interior of cylinder roller 21a Side can also be configured at the outside of cylinder roller 21a.In addition, light source can also be other devices separated with exposure device EX (external device (ED)).

Exposure device U3b is in the case where using transmission-type light shield as light shield, also in the same manner as exposure device U3, U3a, Movement speed (peripheral speed Vm) and the exposure of image planes Sm are projected by adjustment (amendments) in the same manner as the second embodiment with front Relationship between the movement speed (V or peripheral speed Vp) of smooth surface Sp, can expand the available exposure in scan exposure Width.

&#91;4th Shi Shifangshi &#93;

Hereinafter, the exposure device U3c with reference to Figure 21 pairs of the 4th embodiment is illustrated.In addition, in order to avoid repetition It records, is illustrated only for the part different from previous each embodiment, for same as previous each embodiment Inscape marks identical reference numeral to illustrate.Figure 21 is to show the exposure device of the 4th embodiment (at substrate Manage device) integrally-built figure.Exposure device U3, U3a, U3b of previous each embodiment are to use rotatable circle The structure for the cylindric light shield M that cylinder roller 21 (or 21a) is kept.It is set in the exposure device U3c of the 4th embodiment There is light shield holding mechanism 11b, light shield holding mechanism 11b, which has, to be remain flat reflection-type light shield MB and work as scan exposure When the light shield objective table 110 that is moved in the X direction along the faces XY.

In the exposure device U3c of the 4th embodiment, light shield holding mechanism 11b, which has, keeps flat reflection type optical It covers the light shield objective table 110 of MB, make the scanning movement along the X direction in the plane orthogonal with median plane CL of light shield objective table 110 Mobile device (illustration omitted).

Since the light shield face P1 of the light shield MB of Figure 21 is substantially the plane parallel with the faces XY, so reflected from light shield MB The chief ray of projected light beam EL2 is vertical with the faces XY.Therefore, the illumination of each illumination region IR1~IR6 on irradiation light shield MB The chief ray of the illuminating bundle EL1 of optical system IL1~IL6 is also configured as vertical with the faces XY via polarising beam splitter PBS.

In addition, in the case where the chief ray of the projected light beam EL2 reflected from light shield MB is vertical with the faces XY, projection optics mould The angle of first reflecting surface P3 of the first deflecting member 70 possessed by the first optical system 61 of group PLM is set as, to carrying out self-bias The projected light beam EL2 of beam splitter PBS of shaking is reflected, and keeps the projected light beam EL2 after reflection incident through the first lens group 71 To the angle of the first concave mirror 72.Specifically, the first reflecting surface P3 of the first deflecting member 70 is set as substantially with second Optical axis BX2 (faces XY) is at 45 °.

In addition, in the fourth embodiment, in the same manner as Fig. 2 of front, when being observed in the faces XZ, from light shield MB X-direction until the central point to the central point of illumination region IR2 (and IR4, IR6) of illumination region IR1 (and IR3, IR5) On air line distance be set as, with from the substrate P of bearing surface P2 for copying substrate supporting cylinder 25 view field PA1 (and PA3, PA5) central point to the central point of the second view field PA2 (and PA4, PA6) until week over long distances substantially It is equal.

In the exposure device U3c of Figure 21, the mobile device that slave control device 16 also controls light shield holding mechanism 11 (is swept Retouch the linear motor of exposure, actuator of fine motion etc.), light shield loading is synchronously driven with the rotation with substrate supporting cylinder 25 Platform 110.In the exposure device U3c of Figure 21, in the +X direction synchronizing moving to light shield MB and after carrying out scan exposure, need The action (backrush) of the initial position of -X direction is back into enforcement light shield MB.Therefore, keep substrate supporting cylinder 25 fast with regulation Degree continuous rotation that in the case that at the uniform velocity (peripheral speed Vp) constantly transports substrate P, the phase of rolling back action is carried out in light shield MB Between, pattern exposure is carried out not in substrate P, but panel figure dispersedly (discretely) is formed in the carry direction of substrate P Case.But in practical applications, due to the speed (peripheral speed Vp) and light shield by assuming the substrate P when scan exposure The speed of MB is 50~100mm/s, if so driving light when light shield MB backrush with the maximum speed of such as 500~1000mm/s Cover objective table 110 can then reduce the blank in carry direction between the panel pattern being formed in substrate P.

Then, with reference to the projection image planes Sm and base of the pattern of the light shield of the exposure device U3c of Figure 22 pairs of the 4th embodiment The relationship between plane of exposure Sp on plate P illustrates.Figure 22 provides movement and the substrate P of the projection image planes Sm of the pattern of light shield Plane of exposure Sp movement between relationship, be equivalent to by projection image planes Sm illustrated in fig. 11 and plane of exposure Sp in front it Between relationship in turn the case where.That is, in fig. 22, will be formed in the projection image planes Sm's of planar (radius of curvature is infinitely great) Pattern image is transferred on the plane of exposure Sp of radius of curvature R p.

Herein, since light shield M is plane, so projection image planes Sm (optimum focusing face) is also plane.Therefore, Tu22Zhong Projection image planes Sm be equivalent to shown in Fig. 7 in front speed V move reference plane HP.On the other hand, in substrate P It is the barrel surface (being circular arc in ZX planes) that radius of curvature is Rp in the same manner as shown in plane of exposure Sp and Fig. 7 in front.

In the present embodiment, if setting the angular speed of substrate holding cylinder 25 (plane of exposure Sp) to ω p, also with Fig. 7 Similarly, projection image planes Sm and plane of exposure Sp is tangent in the position of plane KS, using Xp=RpSin (ω pt), finds out this Point of contact Cp is the position Xp in the X direction of the plane of exposure Sp of the Rp point Cp2 being moved to after time t along radius.Herein, ω pt are the rotation angle θ p on plane of exposure Sp from origin after time t using point of contact Cp as origin.Phase therewith It is right, indicate the point of contact Cp of projection image planes Sm and plane of exposure Sp along flat projection image using Xm=Vt (wherein, V=Vm) Therefore the position Xm for the point Cp0 that face Sm is moved to from origin after time t in the same manner as each embodiment of front, is being thrown Projection error (departure or image displacement amount) is generated between image plane Sm and plane of exposure Sp.

If the projection error (departure or image displacement amount) is set as departure Δ 2, found out using Δ 2=Xm-Xp Departure Δ 2 obtains Δ 2=Vt-RpSin (θ p).The song of the characteristic of the departure Δ 2 and the departure Δ 2 in Fig. 8 A Line chart is identical, small difference is assigned by the peripheral speed Vp of movement speed V and plane of exposure Sp to projecting image planes Sm, with front Each embodiment similarly, the exposed width of the available view field PA in scan exposure can be expanded.For this reason, it may be necessary to The speed (peripheral speed) on the surface for the side for keeping the radius of curvature in projection image planes Sm and plane of exposure Sp small is relatively slightly larger.At this In embodiment, speed Vf when by the scan exposure of light shield MB is set to the benchmark speed slightly smaller than determined based on projection multiplying power β V is spent, so that peripheral speed Vp small such as Fig. 8 Cs of the speed V (peripheral speed Vm) of projection image planes Sm only than plane of exposure Sp passes the imperial examinations at the provincial level Change rate α exemplified or so.

Herein, in the case of the exposure device U3c of present embodiment, the mathematical expression of the F (x) of first embodiment is replaced It is changed to the mathematical expression of following F ' (X).

&#91;Mathematical expression 4&#93;

Herein, formula F ' (X) by being applied to the mathematical expression of the first embodiment of front by exposure device U3c, and is expired The foot relationship, can obtain effect same as the respective embodiments described above.

In addition, being protected using curved surface in the light shield holding mechanism and base supporting mechanism of the exposure device of present embodiment The side held is the first supporting member, and the side supported using curved surface or plane is the second supporting member.

More than, cylindric or planar light shield M has been used in various embodiments, even but being based on CAD numbers According to controlling DMD (digital mirror device) or SLM (spatial optical modulation element) etc., will corresponding with pattern light distribution via Projection optical system (can also include microlens array) be projected on plane of exposure Sp without light shield Exposure mode, can also obtain Same effect.

In addition, in various embodiments, the radius of curvature of the plane of exposure Sp of projection image planes Sm and substrate P to pattern carry out Compare, by scan exposure, relatively slightly increasing the peripheral speed of the small side of radius of curvature in the Sm knead doughs Sp of face, The either relatively peripheral speed (or translational velocity) of the big side of the radius of curvature in slightly reduction face Sm knead doughs Sp, The available exposed width in scan exposure can be expanded.By the small of opposite peripheral speed (or translational velocity) Difference which kind of degree be set as, be that can be changed according to image displacement amount Δ (difference component Δ, departure Δ 1, Δ 2) and resolution ratio Rs 's.For example, in the evaluation assessment using evaluation of estimate Q1, Q2 of Figure 19 of front, resolution ratio Rs is set as 2.09 μm, but this be by The numerical aperture NA of projection optical system PL, exposure wavelength lambda, process constant k and determine.Actually it is exposed in substrate P The minimum dimension (line width) of pattern is that the pattern by being formed on light shield M is determined with projection multiplying power β.Assuming that should be formed In the pattern of the display panel in substrate P, as long as minimum actual size (actual linewidth) is 5 μm, as long as then will The value of the actual linewidth finds out difference (the change rate α in the range of image displacement amount Δ of permission as resolution ratio Rs Deng).That is, the resolution ratio Rs determined according to the structure (NA, λ) by exposure device or the pattern that should be transferred in substrate P Minimum dimension, to determine the change rate α of the difference for expanding exposed width.

More than, by using the exposure device shown in various embodiments, implement scanning exposure method as described below. That is, will be formed in bending to the pattern in a face of cylindric light shield (M, MB) with defined radius of curvature via projection optics System PL (PLM) is projected to the surface (plane of exposure Sp) for being supported to cylindric or planar flexible base board P, and on one side So that light shield M is moved with defined speed along a face of bending, makes substrate P along being supported to cylindric or plane on one side The surface (Sp) of the substrate of shape is moved with defined speed, to the projection on substrate to the pattern based on projection optical system As being scanned exposure, when carrying out the scan exposure, if by the projection image of the pattern based on projection optical system most preferably poly- The radius of curvature of the projection image planes Sm formed under coke-like state is set as Rm (the case where also including Rm=∞), will be supported to cylindrical shape Or the radius of curvature of surface (plane of exposure) Sp of planar substrate P is set as Rp (the case where also including Rp=∞), will pass through The movement of light shield (M, MB) and be set as Vm along the movement speed of the mobile pattern image of projection image planes (Sm), will be along substrate P When the defined speed of surface (plane of exposure) Sp is set as Vp, then it is set as Vm > Vp in the case of Rm < Rp, Rm > Rp's In the case of be set as Vm < Vp.

&#91;5th Shi Shifangshi &#93;

Figure 23 is the integrally-built figure for the exposure device for showing the 5th embodiment.Processing unit U3d be equivalent to Fig. 1 with And processing unit U3 shown in Fig. 2.Hereinafter, processing unit U3d is known as exposure device U3d and is illustrated.The exposure device U3d has the mechanism for replacing light shield M.Since exposure device U3d is structure same as above-mentioned exposure device U3, so in original To shared incomplete structure explanation on then.

Exposure device U3d is in addition to above-mentioned driven roller R4~R6, marginal position controller EPC3 and aligming microscope Other than AM1, AM2, also there is light shield holding mechanism 11, base supporting mechanism 12, lamp optical system (lighting system) IL, projection Optical system PL, slave control device 16.

Slave control device 16 controls each section of exposure device U3d, and each section is made to be handled.Slave control device 16 Can be some or all of the host control device 5 of device inspection apparatus 1.In addition, slave control device 16 can also It is controlled by host control device 5, is other devices different from host control device 5.Slave control device 16 is for example including meter Calculation machine.In the present embodiment, slave control device 16 is by from the information storage part for being installed on light shield M, (such as bar code, magnetic are deposited Storage media or the IC tag etc. that information can be stored) read the reading device 17 of information related with light shield M and to light shield M's The measuring device 18 that shape, size and installation site etc. measure connects.

In addition, light shield holding mechanism 11 keeps the light shield M of cylinder (by high reflection portion and low anti-using light shield holding cylinder 21 Penetrate the mask pattern face of portion's composition), but in the same manner as first embodiment, however it is not limited to the structure.In the present embodiment, When mentioning light shield M or cylinder light shield, light shield M is referred not only to, is also contained in the light shield holding cylinder kept in the state of light shield M 21 (assemblies of light shield M and light shield holding cylinder 21).

Base supporting mechanism 12 is used for the pattern of the light shield M of free illumination along the face of bending or flat bearing Light exposure substrate P.Substrate supporting cylinder 25 is formed to have centered on the second axis AX2 extended in the Y direction and curvature Radius is the cylindrical shape of the peripheral surface (periphery) of Rfa.Herein, first axle AX1 and the second axis AX2 are parallel to each other, will include Face CL centered on first axle AX1 and the second axis AX2 and the plane parallel with the two.Median plane CL be by two straight lines ( First axle AX1 and the second axis AX2 in the example) determine plane.A part of conduct of the periphery of substrate supporting cylinder 25 The bearing surface P2 of supporting substrates P.That is, substrate supporting cylinder 25 is by substrate P by being wound in its bearing surface P2, to support and carry base Plate P.Like this, substrate supporting cylinder 25 has from the second axis AX as defined axis with defined radius (radius of curvature Rfa) the curved surface (peripheral surface) being bent, being wound with a part for substrate P on peripheral surface and to be carried out centered on the second axis AX2 Rotation.Second driving portion 26 is connect with slave control device 16, makes substrate supporting cylinder 25 using the second axis AX2 as Pivot axle It is rotated.

A pair of aerial turning-bar ATB1, ATB2 are respectively arranged on the upper of the carry direction of substrate P across substrate supporting cylinder 25 Swim side and downstream side.A pair of aerial turning-bar ATB1, ATB2 are set to the surface side of substrate P, and in vertical direction (Z-direction) It is configured at the lower side of the bearing surface P2 of substrate supporting cylinder 25.A pair of of deflector roll 27,28 is across a pair of aerial turning-bar ATB1, ATB2 And it is respectively arranged on the upstream side and downstream side of the carry direction of substrate P.A deflector roll 27 in a pair of of deflector roll 27,28 will be from drive Dynamic roller R4 carries the substrate P come and guides to aerial turning-bar ATB1, another deflector roll deflector roll 28 will be removed from aerial turning-bar ATB2 The substrate P shipped is guided to driven roller R5.

Therefore, base supporting mechanism 12 using deflector roll 27 by from driven roller R4 carry come substrate P guide to turning in the air Bar ATB1, and substrate supporting cylinder 25 will be imported by the substrate P of aerial turning-bar ATB1.Base supporting mechanism 12 is by using Two driving portions 26 make substrate supporting cylinder 25 rotate, and substrate branch is directed in come the bearing surface P2 bearings on one side using substrate supporting cylinder 25 The substrate P of cylinder 25 is held, carries the substrate P to aerial turning-bar ATB2 on one side.Base supporting mechanism 12 utilizes aerial turning-bar ATB2 guides the substrate P for being carried to aerial turning-bar ATB2 to deflector roll 28, and the substrate P for having passed through deflector roll 28 is guided to drive Dynamic roller R5.

At this point, the slave control device 16 being connect with the first driving portion 22 and the second driving portion 26 is by making light shield keep Cylinder 21 and substrate supporting cylinder 25 will be formed in the light shield figure of the light shield face P1 of light shield M with defined rotary speed ratio synchronous rotary The picture of case continuously repeats projection exposure and (copies circumference on the surface of the substrate P for the bearing surface P2 for being wound in substrate supporting cylinder 25 Face and the face being bent).

As shown in Fig. 2, exposure device U3d on the outside of the peripheral surface of light shield M have to be previously formed in light shield M to fiducial mark Aligming microscope GS1, GS2 that note etc. is detected.It is protected in addition, exposure device U3d also has for detecting light shield M and light shield Hold encoder head EH1, EH2 of rotation angle of cylinder 21 etc..They match along the circumferential direction of light shield M (or light shield holding cylinder 21) It sets.For example, encoder head EH1, EH2 are installed on the both ends in the directions first axle AX1 of light shield holding cylinder 21, read with light The peripheral surface for the dial disc SD that cover holding cylinder 21 is rotated centered on first axle AX1 together carves the scale set (to provide pitch Carve the pattern for setting clathrate in the circumferential).Moreover, focus measuring device AFM and foreign matter inspection can be arranged in exposure device U3d Look into device CD；Focus measuring device AFM measures diametrical small position peripheral surface (light shield face P1) of the light shield M of rotation It moves, to which detection light cover P1 is deviated relative to the focusing of projection optical system PL, foreign body detecting device CD detections are attached to light Foreign matter on cover P1.Although they can be configured at the arbitrary orientation of the peripheral surface around light shield M, it is preferably arranged at and keeps away The direction of the handling mobile space of light shield M when the cover that opens the light is replaced.

In addition, the scale reading position of encoder head EH1 is set as, on the XZ face orthogonal with first axle AX1 with light Circumferential center (the intersection point Q1 in Fig. 5 or Fig. 7) alignment of illumination region IR1, IR3, IR5 of the odd number on M are covered, The scale reading position of encoder head EH2 is set as, on the faces XZ with illumination region IR2, IR4 of the even number on light shield M, The circumferential center alignment of IR6.In addition, the scale measured by encoder head EH1, EH2 can also be with mask pattern one Act the peripheral surface at the both ends for being formed in light shield holding cylinder 21 (light shield M).

Exposure device U3d also has and is used for other than detecting aligming microscope AM1, AM2 of label in substrate P etc. Detect encoder head EN1, EN2, EN3, EN4 of rotation angle of substrate supporting cylinder 25 etc..They are along substrate supporting cylinder 25 It is arranged circumferentially.For example, encoder head EN1, EN2, EN3, EN4 are installed on the direction of the second axis AX2 of substrate supporting cylinder 25 On both ends, and read with substrate supporting cylinder 25 together by the second axis AX2 centered on the peripheral surface of dial disc that rotates Or the peripheral surface at the both ends on the direction of the second axis AX2 of substrate supporting cylinder 25 carves the scale set (to provide that pitch quarter is set to The pattern of circumferential clathrate).

In addition, the scale reading position of encoder head EN1 is set as, on the XZ face orthogonal with the second axis AX2 with it is right The circumferential aligned in position of the observation visual field of quasi- microscope AM1, the scale reading position of encoder head EN4 is set as, in XZ Circumferential aligned in position on face with the observation visual field of aligming microscope AM2.Similarly, the scale of encoder head EN2 is read Position is set as, and is aligned with the circumferential center of view field PA1, PA3, PA5 of the odd number in substrate P, encoder The scale reading position of read head EN3 is set as, on the faces XZ with view field PA2, PA4, PA6 of the even number in substrate P Circumferential center alignment.

Moreover, as shown in Fig. 2, exposure device U3d has the replacement mechanism 150 for replacing light shield M.Replace mechanism 150 The light shield M that exposure device U3d is kept can be changed to identical other light shields M of radius of curvature R m, or be changed to curvature Other light shields M different radius Rm.In the case where being changed to the identical light shield M of radius of curvature R m, replacing mechanism 150 can be only Light shield M is removed into replacement from light shield holding cylinder 21, can also by light shield M together with light shield holding cylinder 21 from exposure device U3d removes replacement.In the case where being changed to the different light shield M of radius of curvature R m, light shield M can be connected by replacing mechanism 150 With light shield holding cylinder 21 replacement is removed from exposure device U3d together.It is integrated situation in light shield M and light shield holding cylinder 21 Under, it replaces mechanism 150 and also replaces the two as integrally.It can be by light shield M or light shield M and light as long as replacing mechanism 150 The assembly of cover holding cylinder 21 is installed on exposure device U3d and is removed from exposure device U3d, and structure whatever all may be used With.

Exposure device U3d, which has, replaces mechanism 150, and thereby, it is possible to automatically install the different light shield M of diameter by light shield Pattern exposure is in substrate P.Therefore, the device inspection apparatus 1 with exposure device U3d can be according to the device (display of manufacture Panel) size use the light shield M with appropriate diameter.Therefore, device inspection apparatus 1 can avoid substrate P generation from not making Blank parts avoid the waste of substrate P, reduce the manufacturing cost of device.In this way, with the exposure dress for replacing mechanism 150 The selection degree of freedom for setting device (display panel) size that U3d is manufactured due to device inspection apparatus 1 is larger, so with following Advantage：This excessive equipment investment of exposure device itself need not be replaced, it will be able to effectively manufacture different inch dimensions Display panel.

In the case where being changed to the different light shield M of diameter, between two kinds of light shield M, because light shield face P1 curvature and The differences such as the position in z-direction of first axle AX1 lead to the pass between illuminating bundle EL1 and light shield M and projected light beam EL2 The non-telecentricity degree of chief ray of system, the position of illumination region IR on light shield M and illuminating bundle EL1 etc. is different in diameter Change between light shield M, or makes encoder head EH1, EH2 different from the position relationship of dial disc SD.

Therefore, in the case where the light shield M of exposure device U3d is changed to the different light shield M of diameter, it will be formed in light shield The picture of the mask pattern of the light shield face P1 of M with picture quality projection exposure appropriate to substrate P, and in the feelings of poly-lens mode Under condition, the side for splicing the mask pattern picture presented in each in multiple view field PA1~PA6 with high precision is needed Formula, to adjust related organization and the part related with this in exposure device U3d.

In the present embodiment, when being changed to the different light shield M of diameter, for example, by slave control device 16 as adjusting Whole control unit (adjustment section) uses, and carries out specifically constituting lamp optical system to each section of exposure device U3d At least part of position of the IL either optical components of projection optical system PL changes or by one of optical component Cutting is changed to the adjustment of component of different characteristics etc..As a result, after replacing light shield M, exposure device U3d can suitably and well Substrate P is exposed.That is, exposure device U3d can suitably and well realize the exposure big to the degree of freedom of the size of device Light, that is, be exposed using the light shield M of different-diameter size.Then, to light shield M used in exposure device U3d to be changed to The specific example of the outline and adjustment exposure device U3d of the step of different light shield M of diameter or other light shields M of same diameter It illustrates.

The flow chart for the step of Figure 24 is when showing the light shield that exposure device uses being changed to other light shields.Figure 25 is to show Go out the position of the field of view of the light shield side of the first projection optical system of odd number and the second projection optical system of even number Light shield side field of view position between relationship figure.Figure 26 is to show there is the information for storing light shield on the surface Information storage part light shield stereogram.Figure 27 depicts the schematic diagram of the exposure condition setting table of conditions of exposure.

In the case of the light shield M that light shield M used in exposure device U3d is changed to different-diameter, in step S101, Slave control device 16 shown in Figure 23 starts to start the replacement action of light shield M.Specifically, slave control device 16 is driving more The light shield M being installed in current exposure device U3d is removed and then is driven replacement mechanism 150 will be used as and replaces by converting mechanism 150 The light shield M of object is installed on exposure device U3d.In the replacement, mechanism 150 is replaced by the light shield holding cylinder 21 with light shield M It is removed together with the shaft as first axle AX1, then the different light shield M of diameter and light shield holding cylinder 21 is installed to exposure In device U3d.At this point, the case where dial disc SD and first axle AX1 are coaxially mounted on the both ends of light shield holding cylinder 21 Under, it is replaced together preferably in conjunction with dial disc SD.

In the present embodiment, when being changed to the different light shield M of diameter, based on being re-installed in exposure device U3d's The diameter of light shield M (light shield face P1), come change the first axle AX1 as the Pivot axle of light shield holding cylinder 21 in Z axis side Upward shaft support position.Therefore, exposure device U3d has to move in the Z-axis direction and support in a rotatable way The mechanism of the bearing arrangement of light shield holding cylinder 21.

The bearing arrangement has and will distinguish to the both ends side of light shield holding cylinder 21 each shaft outstanding as first axle AX1 The bearing (non-contact types such as the contact-types such as ball bearing, needle bearing or air bearing) being pivotally supported in a rotatable way. The bearing of contact-type by be fixed in the shaft of light shield holding cylinder 21 inner ring, be fixed on exposure device U3d main body side it is outer Circle and the ball sandwiched between inner ring and outer ring or needle roller are constituted.

In order to successfully carry out light shield replacement, the shaft side of light shield holding cylinder 21 be equipped with contact-type bearing inner ring and In the state of the two of outer ring, it is preferably constructed to remove contact-type bearing from the bearing arrangement of the main body side of exposure device U3d The construction of outer ring.In addition, the bearing arrangement of the main body side of exposure device U3d includes so that first axle AX1 (shaft) and the second axis The Z driving mechanisms that mode parallel AX2 (Y-axis) is adjusted the slope in YZ planes, and with for so that first Axis AX1 (shaft) the X driving mechanisms that also mode parallel with median plane CL is adjusted the slope in the faces XY.

Figure 25 shows to be changed to, light shield holding cylinder 21a smaller than its diameter in the light shield M for being kept light shield holding cylinder 21 State in the case of the light shield Ma kept.The radius of curvature of light shield M is Rm, and the radius of curvature of light shield Ma is Rma (Rma < Rm).The IRa of Figure 25 is the first projection optical system (the first projection optical system PL1, third projection optics system shown in Figure 23 System PL3 and the 5th projection optical system PL5) the field of view of the sides light shield M (be equivalent to the photograph from lamp optical system IL Mingguang City beam EL1 exposes to illumination region IR1, IR3, IR5 of the odd number on light shield M), IRb is the second projection optical system (figure Second projection optical system PL2, the 4th projection optical system PL4 and the 6th projection optical system PL6 shown in 23) light shield The field of view of the sides M (is equivalent to the photograph that the even number on light shield M is exposed to from the illuminating bundle EL1 of lamp optical system IL Area pellucida domain IR2, IR4, IR6).

In the present embodiment, before and after light shield M is changed to light shield Ma, preferably make the first throwing in the Z-axis direction The position of the position of the field of view IRa of shadow optical system and the field of view IRb of the second projection optical system in z-direction It is constant.Z-direction is the rotation with the Pivot axle (first axle AX) and substrate supporting cylinder 25 of light shield M (light shield holding cylinder 21) Both central shafts (the second axis AX2) are orthogonal, and along the direction of median plane CL.Pass through the visual field area for being set as making in Z-direction The configuration relation spatially of domain IRa and field of view IRb is constant before and after replacing light shield M, can be by illumination optical system System the adjusting of IL and projection optical system PL, various measurement equipment (encoder head EH1, EH2, aligming microscope GS1, GS2 etc.) position adjustment or the change etc. of component that is associated be limited in minimum limit.

Present embodiment premised on poly-lens mode as shown in figure 23, arrange in the Y direction it is single or it is multiple such as Under projection optical system exposure device in the case of, preferably will be each in the circumferential direction of illumination region IR and view field PA Center configures on median plane CL, which sets a position in the circumferential direction of the peripheral surface of light shield M Illumination region IR in pattern project to view field PA.In exposure device as such, by radius (radius of curvature) For Rm light shield M be changed to the cylinder light shield Ma that radius is Rma (Rma < Rm) in the case of, as long as so that the rotation of light shield Ma The mode of only position offset semidiameter (Rma-Rm) to carry out Z drivings to bearing arrangement in z-direction at center (shaft).

But in the poly-lens mode of present embodiment, due to the field of view IRa of the projection optical system of odd number (object plane being conjugated with the view field PA of odd number) is in two detached in the circumferential the position on the peripheral surface of light shield M A side, the field of view IRb (object plane being conjugated with the view field PA of even number) of the projection optical system of even number is located at Another party, so even if making the distance of light shield Ma position change only semidiameters (Rma-Rm) in z-direction, according to the journey of semidiameter Degree, also cannot get good focusing accuracy (or good stitching position precision) sometimes.Therefore, in the present embodiment, with So that the field of view IRa (object plane) and even number of the projection optical system of the peripheral surface and odd number for the cylinder light shield being replaced The mode that accurately matches of both field of view IRb (object plane) of projection optical system Z drivings are carried out to bearing arrangement.

In the above embodiment, according to the diameter of the cylinder light shield of installation, change the position of cylinder light shield in z-direction It sets, so that the projection optical system of the field of view IRa and even number of the projection optical system (PL1, PL3, PL5) of odd number Positions (all directions of XYZ) of the field of view IRb of (PL2, PL4, PL6) in exposure device is constant.If in this way, in order not to change Become the position of field of view IRa, IRb, then has and seldom change bit is set for the different cylinder light shield of diameter in device side The advantages of setting or adjusting position.But in this case, make the motor and make it to XYZ that cylinder light shield rotates The drive system of the actuator of direction fine motion is also moved in Z-direction on the whole, it is also possible to damage the stability of drive system.

Therefore, the advantages of ensuring the stability of drive system in order to obtain, can also make the cylinder light in exposure device The Z location (or X position) of the rotation center (first axle AX1, shaft) of cover unchangeably installs the different cylinder light shield of diameter.Such as This is installed on the fixed rotary shaft of diameter other than the advantages of keeping the stability of drive system as long as also obtaining replacing The characteristic effect of the cylinder light shield (radius of peripheral surface is different) of the hollow form in outside.In order to which correspondingly, exposure fills It sets side to be preferably constructed for headed by the adjustment of the focal position of each projection optical system, can carry out sensing various alignments The field of detection of the adjustment of the focal position of the cylinder light shield of device (microscope), field of view IRa, IRb and alignment sensor The position adjustment on the directions XYZ, the slope of the chief ray of illuminating bundle EL1 and the adjustment of degree of convergence or odd number Interval adjustment between projection optical system (PL1, PL3, PL5) and the projection optical system (PL2, PL4, PL6) of even number etc..

And in the present embodiment, as shown in figure 23, light shield M (and light is removed from bearing arrangement using mechanism 150 is replaced Cover holding cylinder 21), the light shield Ma in addition prepared (related light shield holding cylinder 21a) is installed on bearing arrangement.When remove light shield M with And when installation light shield Ma, focus measuring device AFM or foreign body detecting device CD in fig 23 spatially interfere with light shield Or them are made temporarily to keep out of the way in advance in the case of replacing a part for mechanism 150.In addition, as shown in figure 23, due to relative to The bearing arrangement of first axle AX1 is supported, projection optical system PL and lamp optical system IL are located in -Z direction, and alignment is micro- Mirror GS1, GS2 are located in -X direction, thus can move out, move in the direction of light shield M or light shield Ma relative to bearing arrangement be+ Z-direction either +X direction or ± Y-direction (direction of first axle AX1).

If light shield M is changed to the different light shield Ma of diameter, S102 is entered step, slave control device 16 is being replaced Afterwards, information (light shield information after replacement) related with the light shield Ma of exposure device U3d is installed on is obtained.For example, light shield after replacing Information be diameter, perimeter, width, thickness equidimension, tolerance, the type of pattern, the out of roundness of light shield face P1, eccentric nature or This various specifications value generated by light shield such as flatness and correction value etc..

These information are as shown in figure 26, are stored in the information storage part 19 set on the surface of light shield holding cylinder 21a.Information is deposited Storage portion 19 is, for example, bar code, hologram or IC tag etc..In the present embodiment, information storage part 19 is kept set on light shield The surface of cylinder 21a, but light shield Ma can also be set to together with the pattern of device.In the present embodiment, cylinder is being mentioned The either one when surface of light shield, including in the surface of light shield Ma and the surface of light shield holding cylinder 21a.In fig. 26, information Storage part 19 is set to the cylindric peripheral surface of light shield holding cylinder 21a, but can also be set to the axis side of light shield holding cylinder 21a Upward end face portion.

Slave control device 16 is obtained by reading device 17 from light shield information after the replacement that information storage part 19 is read.It reads Device 17 can use barcode reader in the case where information storage part 19 is bar code, can in the case of IC tag Use IC tag reader etc..Information storage part 19 can also be the part for writing information into light shield Ma in advance.

Light shield information can also include exposure information related with conditions of exposure after replacement.Exposure information is exposure object The information of substrate P, the sweep speed of substrate P, illuminating bundle EL1 power these exposure devices U3d to substrate P apply exposure at Required information when reason.In the present embodiment, in exposure information be added replace after light shield information come carry out it is various adjustment with And correct, and carry out the setting of the formulation condition and parameter in the device operating in exposure.Exposure information for example stores The exposure information shown in Figure 27 preserves in table TBL, is stored in the storage part or host control device 5 of slave control device 16 Storage part in.Slave control device 16 reads exposure information preservation table TBL to obtain light shield after replacement from above-mentioned storage part Information.In addition, light shield information can also be via the input unit to slave control device 16 or host control device 5 after replacing (keyboard or mouse etc.) inputs.In this case, slave control device 16 is after above-mentioned input unit obtains replacement Light shield information.If slave control device 16 obtains light shield information after replacement, S103 is entered step.

In step s 103, slave control device 16 is collected or is calculated and expose according to the diameter of the light shield Ma after replacement The related data of condition needed for part and adjustment needed for the adjustment of electro-optical device U3d.For example, as the part needed for adjustment It is that the positions in the Z-axis direction light shield M, lamp optical system IL, projection optical system PL, the rotary speed of light shield M, exposure are wide Degree (illumination region IR circumferential width), the position of encoder head EH1, EH2 or posture and aligming microscope GS1, The position of GS2 or posture etc..In addition, in the present embodiment, due to the Pivot axle (first axle of the light shield Ma after replacement AX1a offset) is generated in Z-direction compared with the rotation center position of the light shield M before replacement, so needing so that driving light shield The mode that the output shaft of driving source (such as motor) of Ma can link with the shaft of light shield Ma, adjusts in step s 103 Installation site of (position offset) driving source in exposure device main body.Therefore, there is exposure device U3d basis to be installed on light shield The diameter of the light shield Ma of holding mechanism 11 at least adjusts the adjustment section of the distance between first axle AX1 and base supporting mechanism, The light shield holding mechanism 11 installs one in diameter multiple light shields different from each other in a manner of replaceable, and around as regulation Axis first axle AX1 rotation.The adjustment section will be installed on the peripheral surface of the light shield of light shield holding mechanism 11 and by substrate branch The interval held between the substrate P of mechanism bearing is set in prespecified allowable range.

As described above, in the present embodiment, before and after being changed to the different light shield Ma of diameter, the illumination in Z-direction The position of visual field IR is constant.Thus, for example, in step S101, slave control device 16 is only changed to the different light shield of diameter Ma makes light shield Ma in the Z-axis direction after acquisition is replaced in step s 102 after light shield information based on light shield information after the replacement Illumination field of view IR position control with replace before same position.In addition, before being changed to light shield Ma, bottom control dress The information of light shield Ma can also be obtained from such as exposure information preservation table TBL by setting 16, be based on the information, be changed to light shield Ma's Opportunity, by the control of the position of the illumination field of view IR of light shield Ma in the Z-axis direction with replace before same position.Hereinafter, to step The example of adjustment in rapid S103 illustrates.

Figure 28 is that Fig. 5 based on front roughly shows illuminating bundle and projected light beam between the different light shield of diameter State figure.If as described above, make the positions of illumination field of view IR in the Z-axis direction not change before and after replacing light shield M, As shown in figure 25, the position in the Pivot axle of the light shield M and light shield holding cylinder 21 i.e. Z-direction of first axle AX1 is made to become Change.Specifically, the Pivot axle AX1a of the small light shield Ma of diameter more connects compared with the first axle AX1 for the light shield M being relatively large in diameter Early work is the second axis AX2 of the Pivot axle of substrate supporting cylinder 25.

As shown in figure 28, even if not changing if in the case that the light shield Ma after replacement is smaller than the diameter of the light shield M before replacement Become absolute positions of the intersection point Q1 at the centers of illumination region IR in the circumferential on light shield Ma (light shield face P1a) in XYZ coordinate (the specific position in exposure device).Therefore, as shown in figure 28, if maintaining the illumination to the light shield M settings before replacement on one side The lighting condition of light beam EL1, that is, maintaining makes each chief ray of illuminating bundle EL1 to radius (radius of curvature) Rm's in the faces XZ The 1/2 inclined conditions of point Q2 irradiate illuminating bundle EL1, then by the illumination region on light shield Ma to the small light shield Ma of diameter on one side Each chief ray of the projected light beam EL2a of IR reflections becomes the state dissipated in the faces XZ from state offset parallel to each other, The direction of traveling also deviates.

Therefore, it is necessary to the illuminating bundle EL1 from lamp optical system IL is adjusted to the illuminating bundle suitable for light shield Ma EL1.Therefore, in step s 103, cylindrical lens 54 possessed by lamp optical system IL is changed to (with reference to Fig. 4) different The state of multiplying power telecentricity is adjusted to make each chief ray of illuminating bundle EL1 in the faces XZ to the radius Rma of light shield Ma by power 1/2 position convergence.Moreover, using drift angle prism (not shown), it will be in as field of view IRa (illumination region IR) The state of the axis telecentricity of the intersection point Q1 of the heart be adjusted to from intersection point Q1 by the extended line of chief ray of illuminating bundle EL1 pass through light Cover the state of the central shaft AX1a of Ma.

In addition, the angle of the adjustment the reflected beams from light shield Ma, that is, projected light beam EL2a.In this case, due to shining The shaft angle degree (angle in the faces XZ of chief ray) of Mingguang City beam EL1 and projected light beam EL2a is according to the diameter (key light of light shield Ma The center of line) and change, so can be configured between the polarising beam splitter PBS and light shield Ma as shared light path Drift angle prism (plane of incidence with the not parallel wedge-shaped prism of outgoing plane) adjusts the angle of projected light beam EL2a.

In addition, in the case of the only angle of adjustment projected light beam EL2a, projection optical system PL can also be adjusted and had Some polarizing members (such as the 4th reflecting surface of the first reflecting surface P3 of the first deflecting member 70 or the second deflecting member 80 P6 angle).In the case where being changed to the different light shield Ma of diameter, (light shield Ma's after replacing in this example embodiment is straight as a result, Diameter is smaller than before replacing), each chief ray of the projected light beam EL2a reflected by light shield Ma can be set as parallel to each other in the faces XZ Light.That is, even if adjustment exposes to the photograph on light shield Ma if different to the diameter after replacement light shield Ma lamp optical system IL The lighting condition of the illuminating bundle EL1 of area pellucida domain IR, so that by the projected light beam EL2a of the illumination region IR reflections of light shield Ma Become the state of telecentricity.

In the case where carrying out above-mentioned adjustment, for example, being attached in the light optics module ILM of lamp optical system IL The lens being set in a manner of it can replace one in the different multiple cylindrical lenses 54 of power in light path replace mechanism etc.. Mechanism can also be replaced to be switched to the cylinder of best power to control the lens according to the instruction from slave control device 16 Lens 54.At this point, slave control device 16 switches cylindrical lens 54 based on the information of the diameter of the light shield Ma after replacement.Separately Outside, the control of slave control device 16 can also be used for the drift angle rib between above-mentioned polarising beam splitter PBS and light shield Ma The actuator that the angle (and position in the faces XZ) of mirror or the polarizing member in projection optics module PLM is adjusted, To adjust by the optical characteristics of the light shield Ma projected light beam EL2 reflected.In this case, slave control device 16 is also based on more The information of the diameter of light shield Ma after changing adjusts the angle of drift angle prism or polarizing member.In addition, cylindrical lens 54 is more It changes and the adjustment of drift angle prism etc. can be carried out by the operator of exposure device U3d.

Figure 29 is the figure for the configuration change for showing encoder head in the case where being changed to the different light shield of diameter etc.. In adjustment in step s 103, as needed, also to encoder head EH1, EH2, aligming microscope GS1, GS2, the sides light shield M Focus measuring device AFM and detect foreign matter foreign body detecting device CD be adjusted.As shown in figure 29, for example, from partly The light shield M and light shield holding cylinder 21 that diameter (radius of curvature) is Rm be changed to the light shield Ma that diameter is smaller and radius is Rma and In the case of light shield holding cylinder 21a, encoder head EH1, the EH2 being configured at around light shield M, aligming microscope GS1, GS2 are burnt Point measuring device AFM and foreign body detecting device CD needs to be reconfigured in around the light shield Ma that diameter becomes smaller, or adjustment Posture.Thereby, it is possible to accurately measure the rotation angle etc. of the position of the alignment mark on light shield Ma, light shield Ma.

The example shown in Figure 29, by aligming microscope GS1, GS2, focus measuring device AFM and foreign body detecting device CD is newly configured at around the light shield Ma that diameter becomes smaller.In addition, encoder head EH1, EH2 in this example embodiment divides in the faces XZ It is not configured at position, the second projection optical system (even number) of the field of view IRa of the first projection optical system (odd number) Field of view IRb position near.It therefore, there is no need to after replacing light shield, encoder head significantly changed in the faces XZ The position of EH1, EH2.

But due to being changed to light shield Ma, can cause by the periphery of encoder head EH1, EH2 dial disc SD read The scale in face or be formed in together with light shield Ma light shield holding cylinder 21a peripheral surface scale and each encoder head EH1, Opposite reading angular between EH2 changes.Therefore, by the stance adjustment of encoder head EH1, EH2 adequately with Scale face is opposite.Specifically, arrow N1, N2 as shown in figure 29 are such, according to the diameter in scale face, make each read head EH1, EH2 (inclination) is rotated on its position.Thereby, it is possible to accurately obtain the information of the rotation angle of light exit cover Ma.

When being changed to light shield Ma, dial disc can also be replaced simultaneously together with light shield Ma and light shield holding cylinder 21a SD, the posture (inclination) of adjustment encoder head EH1, EH2, and adjust installation site etc..Scale can also be set to light shield Ma Surface or light shield holding cylinder 21a peripheral surface.When being changed to light shield Ma at encoder head EH1, EH2 read quarter In the case that the grid pitch of degree in the circumferential is different from before replacement, grid section of the slave control device 16 to the scale after replacement Correspondence between detected value away from encoder head EH1, EH2 is modified.Specifically, following conversion system is corrected Number, the conversion coefficient indicate the rotation angle for counting the light shield Ma being converted into after replacing by 1 time of the digit counter of coded system Displacement distance in the circumferential direction of degree or light shield face P1a is great value.

As used illustrated by imaginary line in Figure 29, focus measuring device AFM and foreign body detecting device CD can match It is placed in Pivot axle (the first axle AX1 or first axle AX1a) underface in the Z-axis direction of light shield M either light shield Ma, And configure between the illumination field of view IRa of the first projection optical system and the illumination field of view IRb of the second projection optical system, under Detect the light shield M either light shield face P1 of light shield Ma or light shield face P1a in side.Thereby, it is possible to reduce before and after replacing light shield Ma, Distance until focus measuring device AFM and foreign body detecting device CD to the surface of light shield M or the surface of light shield Ma Variation.Therefore, having can be by the soft of the optical system or processing of focus measuring device AFM and foreign body detecting device CD Amendment of part etc. carrys out corresponding possibility.In this case, focus measuring device AFM and inspection of foreign substance dress can not also be changed Set the installation site of CD.

By being changed to light shield Ma so that radius of curvature becomes smaller, it is thereby possible to the exposed width (base of view field PA The scanning direction of plate P or the circumferential direction of light shield Ma) in defocus and become larger.In this case it is necessary to adjust exposed width (including Sloping portion), the illumination of lamp optical system IL or sweep speed (rotary speed of light shield Ma and the carrying speed of substrate P Degree).These can be by adjusting perspective view diaphragm 63, or utilizes the light source of the adjustment light supply apparatus 13 of slave control device 16 Output, light shield holding cylinder 21a and substrate supporting cylinder 25 rotation be adjusted.In such a situation it is preferred to same time-varying More exposed width, illumination, sweep speed.

Moreover, being closed according to the relative position of the position of the view field PA of projection optical system PL, projection optics module PLM System and perimeter change because of light shield Ma, need to adjust light shield Ma multiplying power etc. in a rotational direction.For example, slave control device 16 can pass through picture offset optical component 65 or multiplying power possessed by the projection optics module PLM to projection optical system PL Amendment is controlled with optical component 66 etc., to adjust the view field PA or light shield Ma of projection optical system PL in rotation side Upward multiplying power etc..

In step s 103, it carries out possessed by the adjustment of the position of light shield Ma in the Z-axis direction, lamp optical system IL The adjustment of optical component and the tune of encoder head EH1, EH2 possessed by the adjustment of optical component, projection optical system PL The adjustment of whole equal machinery.Driving mechanism of slave control device 16 and adjustment etc. automatic (or half can be utilized by having in these Automatically the component adjusted) also has the component that the operator of exposure device U3d manually adjusts.In addition to this, in step S103 In, slave control device 16 is based on light shield information or exposure information etc. after replacing, and changes the control for controlling exposure device U3d Data (various parameters) processed etc..

In step s 103, exposure device U3d is had adjusted based on light shield information after the replacement obtained in step s 102, But shape, size and installation site of light shield Ma that can also measure measuring device 18 shown in figure 23 etc. is as more Rear light shield information is changed, and exposure device U3d is adjusted according to light shield information after the replacement.In this case, for example, the next control Device 16 processed, based on the light shield Ma that measuring device 18 measures, carries out various adjustment after being changed to light shield Ma.In addition, for behaviour The component etc. that author must adjust, replace, for example, slave control device 16 includes in monitor etc. by the component etc. adjusted is needed On notify operator.Exposure device U3d is adjusted by the measured value based on the light shield Ma after replacement, to obtain with reference to for example Light shield information after the replacement of the variation of the environment such as temperature or humidity exposes therefore, it is possible to be more in line with actual state to adjust Electro-optical device U3d.In step s 103, at the end of the adjustment carried out because being changed to light shield Ma, step S104 is entered.

As described above, when being changed to the light shield of different diameters, the associated optical system in exposure device, machine sometimes Construction system, detecting system each characteristic change.In the present embodiment, in order to confirm as replace light shield after exposure The characteristic or performance of electro-optical device, are arranged calibrating installation as shown in figure 30.Figure 30 is the figure of calibrating installation.Figure 31 is for saying The figure of bright calibration.Exposure device U3d is in the state of the light shield Ma after being suitable for replacing in step s 103, but by step It is calibrated in rapid S104, the state of exposure device U3d is set as the state more suitable for the light shield Ma after replacement.Calibration uses Calibrating installation 110 shown in Figure 30.Calibration in present embodiment is that slave control device 16 carries out.Slave control device 16 Using calibrating installation 110 detection first label ALMM and second label ALMR, this first label ALMM as shown in figure 31 The adjustment on the surface of the light shield Ma kept set on light shield holding cylinder 21a marks, and second label ALMR, which is used as, is set to substrate Support the adjustment label on the surface (part of 25 supporting substrates P of substrate supporting cylinder) of cylinder 25.Then, slave control device 16 is adjusted Whole lamp optical system IL, projection optical system PL, the rotary speed of light shield Ma, the transporting velocity of substrate P or multiplying power etc., with So that the relative position of the first label ALMM and the second label ALMR become defined position relationship.Therefore, the step of calibration S104 is preferably carried out before substrate P is wound in substrate supporting cylinder 25, if but substrate P transmittance it is higher, and in substrate P It is not formed in the state of various patterns, then can also be calibrated in the state that substrate P is wound in substrate supporting cylinder 25.

As shown in figure 30, calibrating installation 110 has photographing element (such as CCD, CMOS) 111, lens group 112, prism anti- Penetrate mirror 113, beam splitter 114.Calibrating installation 110 in the case of poly-lens mode, respectively with lamp optical system IL1~IL6 Correspondingly it is arranged.In the case where being calibrated, the beam splitter 114 of calibrating installation 110 is configured at by slave control device 16 In the light path of illuminating bundle EL1 between lamp optical system IL and polarising beam splitter PBS.Without calibrating the case where Under, beam splitter 114 avoids the light path of illuminating bundle EL1.

Since the sensitivity of photographing element 111 is sufficiently high, so can not also consider the loss of the power of light.Therefore, divide Beam device 114 can also be such as half prism.In addition, by making beam splitter 114 in lamp optical system IL and polarized light beam splitting The light path of illuminating bundle EL1 between device PBS passes in and out, and calibrating installation 110 can be made to minimize.

As shown in figure 30, also following method：Make the light beam of the light source 115 for carrying out self calibration from polarising beam splitter PBS's is incident with the face opposite side of illuminating bundle EL1 incidences, polarising beam splitter PBS separation illuminating bundle EL1 and projection Light beam EL2.Furthermore, it is also possible to light source 115 of the back side configured with calibration of the second label ALMR in substrate supporting cylinder 25 (illumination region) irradiates the light beam of calibration from the back side of the second label ALMR, by the light of the second label of transmission ALMR via throwing Shadow optical system PL and polarising beam splitter PBS is projected to the light shield face P1a of the light shield Ma after replacing.In this case, school The photographing element 111 of standard apparatus 110 can shoot substrate supporting cylinder 25 of the back projection on the light shield Ma after replacement simultaneously The first label ALMM on the picture and light shield Ma of second label ALMR.

Pass through illuminating bundle EL1 beam splitter 114 being configured between lamp optical system IL and polarising beam splitter PBS Light path, by from light shield Ma first label ALMM picture with from substrate supporting cylinder 25 second label ALMR picture via Beam splitter 114 is conducted to the prism mirror 113 of calibrating installation 110.Existed by the light for each label picture that prism mirror 113 reflects After lens group 112, it is incident to the photographing element 111 with high shutter speed, a frame sign of the high shutter speed Camera time (sampling time) is extremely short, at 0.1~1 millisecond or so.16 pairs of slave control device with it is defeated from photographing element 111 The picture of the first label ALMM gone out and the second label ALMR as corresponding picture signal is parsed, based on its parsing knot The measured value of each encoder head EH1, EH2, EN2, EN3 (when sampling) find out the first label ALMM and the when fruit and camera shooting Relative position relation between two label ALMR, to the rotation speed of lamp optical system IL, projection optical system PL, light shield Ma Degree, the transporting velocity of substrate P or multiplying power etc. are adjusted, so that the relative position of the two is in defined state.

As shown in figure 31, the first label ALMM configurations are corresponding with each lamp optical system IL (IL1~IL6) each A illumination region IR (IR1~IR6) across the position that median plane CL is overlapped (both ends in the Y direction of each illumination region IR Triangular part).Second label ALMR configurations are in each view field corresponding with each projection optical system PL (PL1~PL6) PA (PA1~PA6) is across the position that median plane CL is overlapped (triangular parts at the both ends in the Y-direction of each view field PA).In school In standard, by the calibrating installation 110 of each setting in each projection optics module PLM according to the first row across median plane CL The sequence of (odd number), secondary series (even number) receives the picture of the picture and the second label ALMR of the first label ALMM successively.

As described above, in step s 103, based on the adjustment (the mainly adjustment of machinery) for being changed to light shield Ma progress After end, slave control device 16 adjusts exposure device U3d, so that the substrate of the light shield Ma and handling substrate P after replacing The position offset between cylinder 25 is supported below allowable range.In this way, slave control device 16 at least uses the first label ALMM Picture and the picture of the second label ALMR adjust exposure device U3d.As a result, based on from the light shield Ma and substrate supporting after replacement The picture for the actual label that cylinder 25 is got further is modified the adjustment by machinery without complete modified error. Therefore, exposure device U3d can be exposed with appropriate and good precision using the light shield Ma after replacement.

In the above example, after having replaced light shield, exposure device U3d is mainly mechanically had adjusted, but replacing Adjustment after light shield is not limited to this.For example, in the difference very little of the diameter of the cylinder light shield for being mountable to exposure device U3d In the case of, by coordinating the cylinder light shield of the diameter minimum in these cylinder light shields, be determined in advance lamp optical system IL and The effective diameter of projection optical system PL and the size of polarising beam splitter PBS can need not also carry out illuminating bundle EL1 etc. Angular characteristics etc. adjustment.Thereby, it is possible to simplify the adjustment of exposure device U3d operation.In the present embodiment, it can will expose The light shield that electro-optical device U3d can be used is classified as multiple groups according to the diameter of light shield respectively, changes the diameter of light shield in group In the case of situation and diameter of the range to change light shield beyond group, change the regulating object or component of exposure device U3d Deng.

Figure 32 is the side view for showing to support the example of light shield in a rotatable way using air bearing.Figure 33 is to show Support the stereogram of the example of light shield in a rotatable way using air bearing.Keep the two of the light shield holding cylinder 21 of light shield M End can also in a rotatable way be supported by air bearing 160.Air bearing 160 is made as multiple bearing units 161 are configured to ring-type in the peripheral part of light shield holding cylinder 21.Moreover, air bearing 160 passes through out of each bearing unit 161 Circumferential surface sprays air (air) to the peripheral surface of light shield holding cylinder 21, to support light shield holding cylinder 21 in a rotatable way.Such as This, one in multiple light shield M different as diameter each other is equipped in a manner of replaceable of air bearing 160 and around regulation Axis (first axle AX1) rotation light shield holding mechanism work.

In above-mentioned step S103, air bearing 160 replaces bearing unit according to the diameter of the light shield Ma of replacement 161.In addition, before and after the replacement in the case of the difference very little of the diameter (2 × Rm) of light shield M, it is single that each bearing can also be adjusted First 161 diametrical positions, keep it corresponding with the light shield M after replacement.Like this, in exposure device U3d via air axis 160 are held in a rotatable way in the case of bearing light shield M, air bearing 160 in a manner of replaceable as supporting diameter not The bearing arrangement of the exposure device U3d main body sides of same light shield works.

< sixth embodiments >

Figure 34 is the integrally-built figure for the exposure device for showing sixth embodiment.Using Figure 34 to exposure device U3e It illustrates.In order to avoid repeat record, illustrated only for the part different from above-mentioned embodiment, for reality The same inscape mark of mode reference numeral identical with embodiment is applied to illustrate.In addition, the 5th embodiment Each structure of exposure device U3d can be applied to present embodiment.

The exposure device U3 of embodiment be use light to reflect as the structure of the reflection-type light shield of projected light beam, but The exposure device U3e of present embodiment is to use the light to be transmitted from light shield as the transmission-type light shield (transmission-type of projected light beam Cylinder light shield) structure.In exposure device U3e, light shield holding mechanism 11e have keep light shield MA light shield holding cylinder 21e, Support the deflector roll 93 of light shield holding cylinder 21e, the driven roller 94 and driving portion 96 of driving light shield holding cylinder 21e.Although not scheming Show, but exposure device U3e has the replacement mechanism 150 for replacing light shield MA as shown in figure 23.

Light shield holding mechanism 11e installs one in the different multiple light shield MA of diameter each other in a manner of replaceable, and It is rotated around defined axis (first axle AX1).Exposure device U3e has adjustment section, and the adjustment section is according to being installed on replaceable Mode be equipped with one of the different multiple light shield MA of diameter each other and and carried out around the first axle AX1 as defined axis The diameter of the light shield MA of the light shield holding mechanism 11e of rotation, come adjust at least between first axle AX1 and base supporting mechanism away from From.The substrate P that the adjustment section is supported the peripheral surface for the light shield MA for being installed on light shield holding mechanism 11e and base supporting mechanism Between interval be set in prespecified allowable range.

Light shield holding cylinder 21e using the manufactures such as such as glass or quartz, have certain thickness cylindrical shape, at it Peripheral surface (barrel surface) forms the light shield face of light shield MA.That is, in the present embodiment, illumination region on light shield MA is from center line Bend to the cylinder planar with certain radius of curvature R m.When from the radial direction from light shield holding cylinder 21e, light shield holding cylinder In 21e with the part such as light shield holding cylinder 21e of the pattern registration of light shield MA other than two end sides in Y direction in Part is entreated, there is translucency to illuminating bundle.Configured with the illumination region on light shield MA on light shield face.

Light shield MA is made into very thin glass plate (such as 100 μm~500 μ of thickness for example in the good strip of flatness M) using the planar sheet material light shield for foring the transmission-type of pattern by light shield layers such as chromium on a surface, it is made to copy light The peripheral surface of cover holding cylinder 21e is bent, and is used in the state of the peripheral surface with winding (fitting).Light shield MA, which has, not to be formed The non-pattern forming region of pattern, is installed in non-pattern forming region on light shield holding cylinder 21e.Light shield MA can be from light shield It is detached from holding cylinder 21e.The light shield MA and light shield M of embodiment is it is equally possible that substitution is wound in transparent cylinder base material structure At light shield holding cylinder 21e, and directly utilize the screenings such as chromium in the peripheral surface for the light shield holding cylinder 21e being made of transparent cylinder base material It is next integrated that mask pattern is drawn on photosphere.In this case, light shield holding cylinder 21e also realizes the work(of the supporting member of light shield Energy.

Deflector roll 93 and driven roller 94 extend in the Y direction parallel with the central shaft of light shield holding cylinder 21e.Deflector roll 93 And driven roller 94 is arranged to rotate around the axis parallel with the Pivot axle of light shield MA and light shield holding cylinder 21e. The outer diameter of end on 94 respective axis direction of deflector roll 93 and driven roller is than the shape bigger of other parts, the end and light shield Holding cylinder 21e is circumscribed.Like this, deflector roll 93 and driven roller 94 are arranged to the light shield MA not kept with light shield holding cylinder 21e Contact.Driven roller 94 is connect with driving portion 96.Driven roller 94 is kept by conducting the torque supplied from driving portion 96 to light shield Cylinder 21e, is rotated to make light shield holding cylinder 21e rotate about central shaft.

There are one deflector rolls 93 for light shield holding mechanism 11e tools, but quantity is not to limit, and can also be two or more.Together Sample, there are one driven rollers 94 for light shield holding mechanism 11e tools, but quantity is not to limit, and can also be two or more.Deflector roll At least one of 93 and driven roller 94 can be only fitted to the inside of light shield holding cylinder 21e, and with light shield holding cylinder 21e inscribes. In addition, when from the radial direction from light shield holding cylinder 21e, the not portion with the pattern registration of light shield MA in light shield holding cylinder 21e It is divided to (two end sides of Y direction) there can be translucency to illuminating bundle, there can not also be translucency.In addition, deflector roll 93 with And the one side or both in driven roller 94 can also be such as circular cone shape, central shaft (rotary shaft) is uneven with central shaft Row.

Preferably, exposure device U3e is respectively by the field of view (lighting area of the first projection optical system shown in Figure 25 Domain) field of view (illumination region) IRb of IRa and the second projection optical system is configured at the position of deflector roll 93 and driven roller 94. Even if if it does, then the diameter change of light shield MA if can keep the position of field of view IRa, IRb respectively in the Z-axis direction It is fixed.As a result, in the case where being changed to the different light shield MA of diameter, it is easy to comfortable Z axis each to field of view IRa, IRb Position on direction is adjusted.

The lighting device 13e of present embodiment has light source (illustration omitted) and lamp optical system (lighting system) ILe.Lamp optical system ILe has with each in multiple projection optical system PL1~PL6 correspondingly in Y direction Multiple (such as 6) lamp optical system ILe1~ILe6 of upper arrangement.Light source in the same manner as the light supply apparatus 13 of embodiment, Various light sources can be used.The Illumination Distribution of illumination light shot from the light source is set to be homogenized, such as via the guide-lighting structure such as optical fiber Part is distributed to multiple lamp optical system ILe1~ILe6.

Multiple lamp optical system ILe1~ILe6 are respectively provided with multiple optical components such as lens.Multiple lamp optical systems ILe1~ILe6 is respectively provided with such as integrated optics system, cylindrical lenses or fly's-eye lens, uniform using Illumination Distribution Illuminating bundle irradiates the illumination region of light shield MA.In the present embodiment, multiple lamp optical system ILe1~ILe6 configurations In the inside of light shield holding cylinder 21e.Multiple lamp optical system ILe1~ILe6 pass through on the inside of light shield holding cylinder 21e respectively Each illumination region irradiation on light shield holding cylinder 21e, the light shield MA kept to the peripheral surface of light shield holding cylinder 21e.

Lighting device 13e guides light shot from the light source by lamp optical system ILe1~ILe6, by the illumination light of guiding Beam is from light shield holding cylinder 21e internal irradiations to light shield MA.Lighting device 13e irradiates light shield using illuminating bundle with uniform brightness The part (illumination region) for the light shield MA that holding cylinder 21e is kept.In addition, light source can be configured at light shield holding cylinder 21e's Inside can also be configured at the outside of light shield holding cylinder 21e.In addition, light source can also be other different from exposure device U3e Device (external device (ED)).

Lamp optical system ILe1~ILe6 is radiated at from the inside of light shield MA towards its peripheral surface as defined axis The side of first axle AX1 extend upward to the illuminating bundle of slit-shaped.In addition, exposure device U3e has adjustment section, the adjustment section Width of the illuminating bundle on the direction of rotation of light shield MA is adjusted according to the diameter of the light shield MA of installation.

The base supporting mechanism 12e of exposure device U3e have keep planar substrate P substrate objective table 102 and So that substrate objective table 102 is scanned mobile mobile device along the X direction in the plane orthogonal with median plane CL and (saves sketch map Show).Since the surface of the substrate P of the sides bearing surface P2 shown in Figure 34 is substantially the plane parallel with the faces XY, so by light Cover MA reflection and from projection optical system PL by by be projeced into substrate P projected light beam chief ray it is vertical with the faces XY.Upper In the calibration for stating step S104, the second label shown in Figure 31 is equipped on the surface of the bearing surface P2 of substrate objective table 102 ALMR。

Exposure device U3e uses transmission-type light shield as light shield MA, but in this case, it is same as exposure device U3 Ground can also replace the light shield MA of different-diameter.Moreover, in the case where being changed to the light shield MA of different-diameter, exposure device U3e in the same manner as exposure device U3, at least have adjusted lamp optical system ILe1~ILe6 and projection optical system PL1~ After at least one party in PL6 so that replace after light shield MA and the substrate objective table 102 of handling substrate P between opposite position The mode that relationship is set in defined allowable range bias internal is adjusted (setting).It is based on as a result, from light shield MA and substrate loading The actual label picture etc. that platform 102 obtains further carries out accurate amendment to the error that the adjustment by machinery has not been corrected. Therefore, exposure device U3e can keep appropriate and good precision, carry out the exposure based on the light shield after replacement.

In addition it is also possible to replace the base supporting mechanism 12 of the exposure device U3 with embodiment, and by this embodiment party Base supporting mechanism 12e possessed by the exposure device U3e of formula is applied to exposure device U3.Alternatively, it is also possible in embodiment Exposure device U3 on, using deflector roll 93 and driven roller 94, supporting substrates support cylinder 25 in a rotatable way, and respectively will figure The field of view of field of view (illumination region) IRa and the second projection optical system of first projection optical system shown in 25 (illumination region) IRb is configured at the position of deflector roll 93 and driven roller 94.As a result, the case where being changed to diameter different light shield MA Under, it is easy to adjust the position of field of view IRa, IRb respectively in the Z-axis direction.

The 7th embodiment > of <

Figure 35 is the integrally-built figure for the exposure device for showing the 7th embodiment.Using Figure 35 to exposure device U3f It illustrates.In order to avoid repeat record, illustrated only for the part different from above-mentioned embodiment, for reality The same inscape mark of mode reference numeral identical with embodiment is applied to illustrate.In addition, the 5th embodiment Each structure of exposure device U3d and the exposure device U3e of sixth embodiment can be applied to present embodiment.

Exposure device U3f is the substrate board treatment for implementing so-called proximity printing to substrate P.Exposure device U3f will The gap (proximity gap) of light shield MA and substrate supporting cylinder 25f is set as several μm~tens μm or so, lamp optical system ILc Directly illuminating bundle EL is irradiated to substrate P to carry out non-contact exposure.Light shield MA is set to the surface of light shield holding cylinder 21f.This reality The exposure device U3f for applying mode is used to transmit the light of light shield MA as the transmission-type light shield of projected light beam EL.In exposure device In U3f, light shield holding cylinder 21f is the cylindrical shape with certain thickness by manufactures such as such as glass or quartz, outside it Circumferential surface (barrel surface) forms the light shield face of light shield MA.Although it is not shown, still exposure device U3f has as shown in figure 23 be used for Replace the replacement mechanism 150 of light shield MA.

In the present embodiment, substrate supporting cylinder 25f is by from the second driving portion 26f with actuators such as electro-motors The torque of supply and rotate.In such a way that the direction of rotation with the second driving portion 26f oppositely rotates, for example, by magnetic gear A pair of of driven roller MGG, MGG driving light shield holding cylinder 21f of connection.Second driving portion 26f makes substrate supporting cylinder 25f rotate, and So that driven roller MGG, MGG and light shield holding cylinder 21f is rotated, keeps light shield holding cylinder 21f and substrate supporting cylinder 25f synchronizing movings (same Step rotation).Since a part for substrate P is via a pair of aerial turning-bar ATB1f, ATB2f, a pair of of deflector roll 27f, 28f are wound in Substrate supporting cylinder 25f, so when substrate supporting cylinder 25f rotates, substrate P is synchronously handled upside down with light shield holding cylinder 21f.As this Sample, one in a pair of of driven roller MGG, MGG multiple light shields different as diameter each other is equipped in a manner of replaceable, and Its light shield holding mechanism rotated around defined axis (first axle AX1) is set to work.

Positions of the lamp optical system ILc between a pair of of driven roller MGG, MGG and the peripheral surface and substrate in light shield MA The immediate position of substrate P that bearing cylinder 25f is supported extends to narrow in the Y direction from the interior side of light shield MA to substrate P projection The illuminating bundle of gap-like.In proximity printing mode as such, due to exposure position (phase of the mask pattern in substrate P When in view field PA) in the circumferential direction of light shield MA at one, so when being changed to the different cylinder light shield of diameter, as long as adjusting The positions of the substrate supporting cylinder 25f of full circle cylinder light shield position in the Z-axis direction or supporting substrates P in the Z-axis direction, so that Proximity gap remains specified value.

Like this, exposure device U3f uses transmission-type light shield as light shield MA, and implements proximity printing to substrate P, In this case, it also in the same manner as exposure device U3, can be replaced with the light shield MA of different-diameter.Moreover, being changed to difference In the case of the light shield MA of diameter, exposure device U3f can be by similarly calibrated with exposure device U3, after replacing Light shield MA and the substrate supporting cylinder 25f of handling substrate P between opposite position offset (also including proximity gap) adjustment Within the allowable range.As a result, based on the actual label picture obtained from light shield MA and substrate supporting cylinder 25f, further critically The adjustment by machinery is corrected without complete modified error, as a result, exposure device U3f can keep appropriate and good Precision is exposed.

Further, since the lamp optical system ILc of exposure device U3f as shown in figure 35 will be elongated in the Y direction and in X The illuminating bundle of narrower width on direction (direction of rotation of light shield MA) is radiated at light shield MA with defined numerical aperture (NA) Light shield face, so even if the diameter of the cylinder light shield of installation need not be to the illumination from lamp optical system ILc if different The directional characteristic (slope etc. of chief ray) of light beam is substantially significantly adjusted.Here, can also be with according to light shield MA Diameter (radius) change the side of width of the illuminating bundle for exposing to light shield face in X-direction (direction of rotation of light shield MA) Formula, in lamp optical system ILc be arranged variable-width illuminated field diaphragm (variable window shade), either setting only reduce or Expand dioptric system (such as the cylinder zoom lens of width of the illuminating bundle in X-direction (direction of rotation of light shield MA) Deng).

In addition, in the exposure device U3f of Figure 35, substrate P is cylinder planar by the 25f bearings of substrate supporting cylinder, but It can be supported to as the exposure device U3e of Figure 34 planar.When substrate P is supported to planar, and it is supported to The case where cylinder planar, is compared, and can expand illuminating bundle corresponding with the difference of the diameter of light shield MA in X-direction (light shield MA Direction of rotation) on width adjusting range.Thereby, it is possible to permitting in proximity corresponding with the diameter of light shield MA gap Perhaps in range, it is best by width adjustment of the illuminating bundle in X-direction (direction of rotation of light shield MA), can makes to be transferred to base The maintenance of pattern quality (fidelity etc.) on plate P and productivity optimize.In this case, it can be changed window shade or cylinder become Focus lens etc. are included in the adjustment section according to the diameter of the light shield MA of transmission-type to adjust the width of illuminating bundle.

In above each embodiment, being mountable to the diameter of the cylinder light shield of exposure device, there are certain ranges. For example, in the exposure device of the projection optical system projected with the fine pattern for being 2 μm~3 μm or so to line width, The width of the depth of focus DOF of the projection optical system is tens μm or so very narrow, the in addition focusing in projection optical system The range of adjustment generally also can be very narrow.For this exposure device, it is difficult to install diameter relative to the diameter for being defined as specification With the cylinder light shield of millimeter Unit alteration.Here, in exposure device side, from initially just with the diameter change phase with cylinder light shield In the case that corresponding mode makes each section, each mechanism have larger adjusting range, on the basis of the adjusting range, to determine Surely the diameter range for the cylinder light shield that can be installed.In addition, in the exposure device as shown in figure 35 close to mode, as long as light It covers a part for peripheral surface of MA and the gap of substrate P converges on defined range, if the supporting device of cylinder light shield is Can corresponding structure can largely different cylinder light shields then when diameter is 0.5 times, 1.5 times, 2 times ... Enough installations.

Figure 36 is the solid for the local structure example for showing the supporting device in the exposure device of the cylinder light shield M of reflection-type Figure.In Figure 36, the direction (Y-direction) to extending towards the rotary shaft AX1 of cylinder light shield M (light shield holding cylinder 21) is illustrated only The mechanisms that are supported of side shaft 21S outstanding, but also be provided with same mechanism in opposite side.Figure 36 the case where Under, dial disc SD is integrally provided with cylinder light shield M, but can also be while formation device uses up cover pattern, in circle The scale (grid) that two end sides setting in the Y-direction of the peripheral surface of cylinder light shield M can be read by encoder head.

Even being formed with the light shield M (light shield holding cylinder 21) of different-diameter also always with solid in the top end part of shaft 21S Fixed diameter carrys out precision machined cylinder 21K.Cylinder 21K is by the one of the frame (fuselage) 200 of exposure device main body Part incised notch is supported at the part of U-shaped by moveable Z movable bodys 204 in (Z-direction) in above-below direction.In frame 200 The end that the incised notch part of U-shaped extends in z-direction is formed in a manner of opposite at a prescribed interval in the X direction in Z Rail portion 201A, 201B linearly extended on direction.

It is formed on Z movable bodys 204：For the recessed of the substantially lower half portion using air bearing supporting cylinder body 21K Fall into the cushion part 204P of semicircle shape；Slide section 204A, 204B to fasten with rail portion 201A, 201B with frame 200.It is sliding The axis that block portion 204A, 204B is mechanically contacted in a manner of smoothly being moved relative to rail portion 201A, 201B in z-direction It holds or air bearing supports.

On frame 200 be equipped with by can around the axis parallel with Z axis rotate in a manner of be pivotally supported ball-screw 203, The driving source (motor, reduction gearing etc.) 202 for making the ball-screw 203 rotate.The nut portions screwed togather with ball-screw 203 are set to In cam member 206, which is set to the downside of Z movable bodys 204.Therefore, by the rotation of ball-screw 203, make It obtains cam member 206 to move linearly in z-direction, Z movable bodys 204 also move linearly in z-direction as a result,.Though in Figure 36 Be not shown, but can also be equipped on the component of the top end part of rotating bearing ball leading screw 203 so that cam member 206 in X-direction or Displacement is not generated in person's Y-direction and the guiding elements that guides of the mode that moves in z-direction.

Cam member 206 and Z movable bodys 204 can be fixed as one, and can also be by rigidity height in z-direction and in X The direction either connections such as rigidity low leaf spring or flexure member in Y-direction.Alternatively, can also be respectively in cam member 206 Upper surface and Z movable bodys 204 lower surface on form spheric seating, steel ball is set between these spheric seatings.Like this, can On one side in z-direction with high rigidity bearer cams component 206 and Z movable bodys 204, allow the cam structure centered on steel ball on one side The opposite micro inclination of part 206 and Z movable bodys 204.Moreover, in the supporting device of Figure 36, in Z movable bodys 204 and frame Between 200 be equipped with for supporting cylinder light shield M (light shield holding cylinder 21) dead weight most elastic bearing component 208A, 208B。

Elastic bearing component 208A, 208B is by changing the air slide structure of length by internally supplying compressed gas At supporting the load-carrying of the cylinder light shield M (light shield holding cylinder 21) supported by Z movable bodys 204 using air pressure.Movable using Z The cushion part 204P of body 204 is come the case where supporting the cylinder 21K as the rotary shaft of cylinder light shield M (light shield holding cylinder 21) Under, dead weight is also different certainly by the different cylinder light shield M (light shield holding cylinder 21) of diameter.Therefore, supply is adjusted according to the dead weight The pressure of compressed gas in the air slide as elastic bearing component 208A, 208B.Thereby, it is possible to be greatly lowered to make For the load-carrying in the Z-direction between the nut portions in ball-screw 203 and cam member 206, make ball-screw 203 also with Minimum torque is rotated, therefore driving source 202 can be made also to minimize, and can prevent the frame 200 caused by fever etc. Deformation.

In addition, be not shown in Figure 36, but the position in the Z-direction of Z movable bodys 204 is using as linear encoder Device for measuring length with sub-micron Measurement Resolution below critically to measure, and driven come SERVO CONTROL based on the measured value Dynamic source 202.The variation for acting on the load-carrying between Z movable bodys 204 and cam member 206 is carried out furthermore, it is also possible to be additionally provided with The load measuring sensor of measurement measures the strain transducer etc. deformed caused by the stress in z-direction of cam member 206, According to the measured value from each sensor, SERVO CONTROL is supplied to the air slide as elastic bearing component 208A, 208B Compressed gas pressure (supply and exhaust of gas).

Moreover, cylinder light shield M (light shield holding cylinder 21) is being mounted on the cushion part 204P of Z movable bodys 204 sometimes, and And after the height in z-direction based on driving source 202 is set in defined position, carry out lamp optical system IL, It is in the way of various adjustment, the calibration of projection optical system PL, or based on calibration that as a result, making cylinder light shield M again, (light shield is protected Hold cylinder 21) position fine motion in z-direction.The supporting device of Z movable bodys 204 with Figure 36 is also set to cylinder light shield M (light shields Holding cylinder 21) opposite side shaft on, by adjust separately be set to both sides supporting device each Z movable bodys 204 in Z Position on direction, additionally it is possible to adjust micro slopes of the Pivot axle AX1 relative to the faces XY.In the above manner, also may be used It is to be adjusted, after tilt adjustments completion in the positions of the cylinder light shield M (light shield holding cylinder 21) of installation in z-direction, Z is movable Body 204 is mechanically clipped between rail portion 201A, 201B (that is, frame 200).

When setting the maximum gauge for being mountable to the cylinder light shield M (light shield holding cylinder 21) of projection aligner to DSa, When minimum diameter is set as DSb, the stroke of Z movable bodys 204 in z-direction is preferably (DSa-DSb)/2.As an example, When setting the maximum gauge of installable cylinder light shield M (light shield holding cylinder 21) to 300mm, minimum diameter is set as 240mm When, the stroke of Z movable bodys 204 is 30mm.

The cylinder light shield M of diameter 300mm is it is meant that compared with the cylinder light shield M of diameter 240mm, in the week of cylinder light shield It will only expand 60mm × π ≈ 188mm as the pattern forming region of light shield M on (scan exposure direction).It is swept in such as previous It is such to retouch exposure device, in the case of so that plane light shield is one-dimensionally scanned movement, expands pattern in a scanning direction and is formed Region can lead to the enlargement of light shield objective table corresponding with the plane light shield expansion size of 180mm or more and in order to make light The mobile stroke of cover objective table expands the enlargement of the airframe structure of 180mm or more.In contrast, as shown in figure 36, only pass through Enable the Z movable bodys 204 that the rotary shaft AX1 (shaft 21S) to cylinder light shield M (light shield holding cylinder 21) is supported in the side Z It critically moves upwards, it is not necessary to make the other parts enlargement of device, it will be able to easily expand the pattern forming region of light shield.

< device making methods >

Hereinafter, being illustrated to device making method with reference to Figure 37.Figure 37 is the device manufacture for showing device inspection apparatus The flow chart of method.The device making method can be real by any of embodiment of first embodiment~the 7th It is existing.

In the device making method shown in Figure 37, first, carry out such as the display based on self-emission device organic EL The function and performance design of panel, the circuit pattern needed using designs such as CAD, wiring pattern (step S201).Then, it is based on By the pattern of each layer in the various layers of the designs such as CAD, to make the light shield M (step S202) of required layer amount.In addition, Prepare the supply for being wound with the flexible substrate P (resin film, metal foil film, plastics etc.) of the base material as display panel in advance With volume FR1 (step S203).In addition, the substrate P of the web-like prepared in step S203 can be to its surface as needed The substrate that is modified, the substrate for being formed with basal layer (such as minute asperities based on coining mode) in advance, are laminated in advance There is the substrate of photosensitive functional membrane or hyaline membrane (insulating materials).

Then, form that (film is partly led by the electrode, wiring, insulating film, the TFT that constitute display panel device in substrate P Body) etc. compositions backsheet layer, and the hair based on self-emission devices such as organic EL is formed in a manner of being laminated on the backsheet layer Photosphere (display pixel portion) (step S204).In step S204, also contains and illustrate using in each embodiment in front Exposure device U3 come the previous photo-mask process that is exposed to photoresist layer, but further include based on following process Processing, which includes：To substitution photoresist, the substrate P coated with photonasty silane coupling material carries out pattern exposure Light come formed on a surface of the substrate hydrophily and hydrophobic pattern exposure process, to photosensitive catalyst layer carry out Pattern exposure and by non-electrolytic plating method formed metal film pattern (wiring, electrode etc.) wet type operation, alternatively, using containing The printing process etc. that the electrically conductive ink etc. for having Nano silver grain draws a design.

Then, base is cut by each display panel device being continuously manufactured by the substrate P of strip by volume mode Plate P, protective film (environment reply barrier layer) and/or colored filter etc. are pasted on the surface of each display panel device, from And assembly device (step S205).Then, inspection operation is carried out, checks whether display panel device normally functions, is It is no to meet desired performance and characteristic (step S206).By the above, display panel (flexible display) can be manufactured.

The exposure device of above-mentioned embodiment and its variation is by with mechanical precision as defined in holding, electrical essence The mode of degree and optical accuracy by with this application claims in the range of each integral part enumerated including it is various Subsystem assembles manufacture.In order to ensure these various precision, before and after group device, exposure device, for various optical systems System carries out the adjustment for reaching optical accuracy, and the adjustment for reaching mechanical precision is carried out for various mechanical systems, for Various electrical systems carry out the adjustment for reaching electric precision.The assembling procedure packet of exposure device is assembled to from each subsystem Include mechanical connection, the wiring connection of electric circuit and the pipeline connection etc. of pneumatic circuit between each subsystem. Before being assembled to the assembling procedure of exposure device from each subsystem, there certainly exist the respective assembling procedures of each subsystem. At the end of each subsystem is assembled to the assembling procedure of exposure device, structure adjusting is carried out, it is ensured that exposure device is in entirety On various precision.In addition, the manufacture of exposure device is preferably in the dust free room managed temperature and cleanliness factor etc. Middle progress.

In addition, the inscape of the above embodiment and its variation can be appropriately combined.In addition, not using sometimes yet A part of inscape.Moreover, can also carry out without departing from the spirit and scope of the invention inscape replacement or Change.As long as in addition, laws and regulations allow, can quote quote in the above-described embodiment it is related with exposure device etc. A part of the record of entire disclosure bulletin and United States Patent (USP) as the record of this specification.Like this, it is based on above-mentioned implementation Mode, the other embodiment and application technology etc. made by those skilled in the art etc. are also integrally incorporated in the present invention's In range.

Reference sign

1 device inspection apparatus

2 substrate feeding devices

4 substrate retracting devices

5 host control devices

U3 exposure devices (substrate board treatment)

M light shields

IR1~IR6 illumination regions

IL1~IL6 lamp optical systems

ILM light optics modules

PA1~PA6 view fields

PLM projection optics modules

Claims (24)

1. a kind of exposure device, which is characterized in that

Have：

Lamp optical system, by conduct illuminating light to cylinder light shield, the cylinder light shield relative to first axle with defined There is pattern on the peripheral surface of curved surface made of radius of curvature bending；

Substrate supporting cylinder has relative to the second axis configured with the relationship parallel with the first axle with defined half Peripheral surface made of diameter bending is supported with flexible substrate along peripheral surface winding, and centered on the second axis It is rotated；

Projection optical system will be projected by the pattern of the cylinder light shield of the illumination optical illumination to by the substrate Support the substrate of the periphery surface bearing of cylinder；

Mechanism is replaced, the cylinder light shield is replaced；With

Adjustment section, when the cylinder light shield is changed to the different cylinder light shield of diameter by the replacement mechanism, to the photograph At least one party at least part of at least part of bright optical system and the projection optical system is adjusted.

2. exposure device as described in claim 1, which is characterized in that

When the replacement mechanism is changed to the different cylinder light shield of the diameter,

The adjustment section is in the information based on the different cylinder light shield of the diameter, at least one of the lamp optical system It is at least described straight using being set to after at least one party divided at least part with the projection optical system is adjusted The adjustment of the peripheral surface of the bearing substrate of the peripheral surface and the substrate supporting cylinder of the different cylinder light shield of diameter is used Pattern, to adjust the exposure device.

3. exposure device as claimed in claim 2, which is characterized in that

The different cylinder light shield of the diameter has the information storage part of storage information on the surface,

The information storage of the different cylinder light shield of the diameter in described information storage part or is contained in related with conditions of exposure Exposure information,

The adjustment section obtains the letter of the different cylinder light shield of the diameter from described information storage part or the exposure information Breath.

4. exposure device as claimed in claim 2, which is characterized in that

With measuring device, which measures the cylinder light shield for replacing object, to obtain the different cylinder light of the diameter The information of cover.

5. exposure device as described in any one of claims 1 to 4, which is characterized in that

The projection optical system has with flat including comprising the first axle parallel to each other and the second axis The first projection optical system and the second projection optical system configured in a manner of the sandwiched median plane when face centered on face,

The lamp optical system is to the cylinder light corresponding with the illumination position in the visual field of first projection optical system The first illumination region on cover and the cylinder light shield corresponding with the illumination position in the visual field of second projection optical system On the second illumination region respectively irradiate the illumination light.

6. exposure device as claimed in claim 5, which is characterized in that the diameter replaced using the replacement mechanism is different Cylinder light shield be configured to, on the first axle of the cylinder light shield and the second axis edge of the substrate supporting cylinder The position and described second for the illumination field of view of on the direction at the interval of the median plane, described first projection optical system are thrown The position of the illumination field of view of shadow optical system is constant.

7. exposure device as described in any one of claims 1 to 4, which is characterized in that

Cylinder light shield that can be different from multiple diameters correspondingly replaces component.

8. a kind of exposure device, which is characterized in that

Have：

Light shield holding mechanism has figure on bending to cylindric peripheral surface with predetermined radius relative to defined axis Case, one be equipped in a manner of replaceable in the different multiple cylinder light shields of diameter each other, and make it around described defined Axis rotates；

Lighting system, by illumination in the pattern of the cylinder light shield；

Base supporting mechanism, the face along bending or flat bearing substrate, the substrate are shone by coming from by the illumination light The light of the pattern for the cylinder light shield penetrated is exposed；With

Adjustment section, according to the diameter for the cylinder light shield for being installed on the light shield holding mechanism, at least to described defined The distance between axis and the base supporting mechanism are adjusted.

9. exposure device as claimed in claim 8, which is characterized in that

The different multiple cylinder light shields of the diameter are the transmission-type cylinder light of the pattern with transmission-type on the peripheral surface Cover,

The adjustment section will be installed on the peripheral surface of the transmission-type cylinder light shield of the light shield holding mechanism and the substrate Interval between the substrate that supporting device is supported is set in prespecified allowable range.

10. exposure device as claimed in claim 9, which is characterized in that

The lighting system has lamp optical system, inside direction of the lamp optical system from the transmission-type cylinder light shield The peripheral surface be radiated at it is described as defined in the side of axis extend upward to the illuminating bundle of slit-shaped,

The adjustment section justifies the illuminating bundle in the transmission-type according to the diameter of the transmission-type cylinder light shield of the installation Width on the direction of rotation of cylinder light shield is adjusted.

11. a kind of device inspection apparatus, which is characterized in that

Have：

Exposure device according to any one of claims 1 to 10；With

The substrate feeding device of the substrate is supplied to the exposure device.

12. a kind of device making method, which is characterized in that

Including：

Using the exposure device described in any one of claim 1~10, by the pattern exposure of the cylinder light shield in institute State substrate；With

By handling the exposed substrate, to form the pattern with the cylinder light shield on the substrate Corresponding device.

13. a kind of exposure device makes to form figuratum cylinder light at a distance of the barrel surface of predetermined radius along with first axle Cover is rotated around the first axle, to being supported on the substrate that face or flat face along bending are moved projection from described The light of the pattern of cylinder light shield, on the substrate pattern described in scan exposure, the exposure device be characterized in that,

Including：

Light shield holding mechanism is installed in the different multiple cylinder light shields of the diameter each other prepared as the cylinder light shield Any one, is driven by the first driving portion and is rotated around the first axle；

Base supporting mechanism supports the substrate, by the second driving portion drive and along the face of the bending or described flat Face movement；And

Adjustment section, according to be installed on the light shield holding mechanism the cylinder light shield diameter, to the first axle with The distance between described base supporting mechanism is adjusted.

14. exposure device as claimed in claim 13, which is characterized in that

The multiple cylinder light shield is respectively provided with to the both sides shaft outstanding on the direction that the first axle extends,

The light shield holding mechanism has the cushion part for supporting the shaft,

The adjustment section includes movable body, and the movable body is at a distance to the first axle between the base supporting mechanism The mobile cushion part on the direction being adjusted.

15. exposure device as claimed in claim 13, which is characterized in that

The substrate is the substrate of the sheet of flexible strip,

The base supporting mechanism has rotating cylinder, and the rotating cylinder is relative to the with the first axle configured in parallel The part that two axis bend to the peripheral surface of cylinder planar with predetermined radius winds the substrate to support the substrate, and It is rotated around the second axis by the driving of the second driving portion, the substrate is made to be moved to strip direction.

16. the exposure device as described in claim 13 or 15, which is characterized in that

The adjustment section is according to the diameter of the cylinder light shield for being installed on the light shield holding mechanism, so that is be mounted is described The side in gap as defined in being configured between the substrate that the peripheral surface of cylinder light shield and the base supporting mechanism are supported Formula, to adjust the position of mounted the cylinder light shield or the base supporting mechanism on the direction equipped with the gap.

17. exposure device as claimed in claim 15, which is characterized in that

Further include projection optical system, configures in the cylinder light shield for being installed on the light shield holding mechanism and the rotation Between roller, by the pattern of the mounted cylinder light shield as projection is in the base supported by the rotating cylinder On plate.

18. exposure device as claimed in claim 17, which is characterized in that

Further include field stop, which will project the pattern on the substrate by the projection optical system The view field of picture be set as the exposed width of predetermined size in the circumferential direction of the peripheral surface of the rotating cylinder.

19. exposure device as claimed in claim 18, which is characterized in that

Further include lamp optical system, which shines to the cylinder light shield for being installed on the light shield holding mechanism The illumination light of exposure is penetrated,

The field stop configuration is in the lamp optical system, by setting the illumination light on the cylinder light shield Illumination region sets the exposed width.

20. exposure device as claimed in claim 18, which is characterized in that

The field stop is adjusted to change according to the diameter for the cylinder light shield for being installed on the light shield holding mechanism The exposed width.

21. the exposure device as described in any one of claim 17~20, which is characterized in that

The radius of curvature of the projection image planes of the pattern projected by the projection optical system is being set as Rm, institute will be passed through It states the rotation of cylinder light shield and is set as Vm along the peripheral speed of the picture for projecting the pattern that image planes move, it will be by described The radius of curvature on the surface of the substrate of rotating cylinder bearing is set as Rp, by the movement by rotation of the rotating cylinder When the peripheral speed on the surface of the substrate is set as Vp,

With in Rm<It is set as Vm&gt in the case of Rp;Vp, in Rm>It is set as Vm&lt in the case of Rp;The mode of Vp, control described the One driving portion and second driving portion.

22. a kind of pattern exposure method, to scan exposure on the substrate of the sheet of flexible strip by exposure device The method of pattern described in light, the exposure device installation are formed with pattern along the barrel surface with first axle at a distance of predetermined radius Cylinder light shield, and the cylinder light shield is made to be rotated around the first axle on one side, on one side can around with the first axle The peripheral surface of the rotating cylinder of the second axis rotation of line configured in parallel winds the substrate and makes the substrate in the side of strip It moving up, the pattern exposure method is characterized in that,

Including：

First stage, in different any of the multiple cylinder light shields of the radius each other that will prepare as the cylinder light shield When being installed on the exposure device, the position according to the radius of the cylinder light shield relative to the rotating cylinder adjusts the circle The installation site of cylinder light shield, and be set as the pattern plane of the cylinder planar of mounted cylinder light shield and be wound in the rotation rolling There is predetermined distance between the surface of the substrate of cylinder；And

Second stage, when carrying out the scan exposure, according to the radius and winding of the pattern plane because of mounted cylinder light shield Difference between the radius on the surface of the substrate of the rotating cylinder and the difference component of deviation generated, to being mounted The cylinder light shield angular velocity of rotation and the angular velocity of rotation of the rotating cylinder between set difference.

23. pattern exposure method as claimed in claim 22, which is characterized in that

The exposure device has：

Lighting system, the illumination region irradiation illumination of a part for the pattern plane to being set in the mounted cylinder light shield Light；And

Projection optical system, the picture of the pattern in the illumination region is imaged in be set in is wound in rotation rolling The view field of the part on the surface of the substrate of the peripheral surface of cylinder,

In the first stage, including：

So that the illumination region being set on mounted cylinder light shield be set in it is described on the surface of the substrate The mode of view field's optical conjugate, according to the radius of the cylinder light shield, adjustment constitutes the projection optical system or described At least part of position of the optical component of lighting system.

24. pattern exposure method as claimed in claim 23, which is characterized in that

The projection image planes of the picture for the pattern being imaged by the projection optical system are according to the half of mounted cylinder light shield Diameter and in the state of radius of curvature R m bending, the surface of the substrate is according to the radius of the rotating cylinder and in song The state of rate radius Rp bendings,

In the second stage, including：

In the peripheral speed for the picture of the pattern that will be moved along the projection image planes by the rotation of the cylinder light shield Be set as Vm, when the peripheral speed on the surface of the substrate of movement by the rotation of the rotating cylinder is set as Vp, with Rm<Vm&gt is adjusted in the case of Rp;Vp, in Rm>Vm&lt is adjusted in the case of Rp;The mode of Vp, set the cylinder light shield and The respective angular velocity of rotation of rotating cylinder.