CN106933066A - Exposure device, device inspection apparatus and device making method and pattern exposure method using the exposure device - Google Patents
Exposure device, device inspection apparatus and device making method and pattern exposure method using the exposure device Download PDFInfo
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- CN106933066A CN106933066A CN201611264164.0A CN201611264164A CN106933066A CN 106933066 A CN106933066 A CN 106933066A CN 201611264164 A CN201611264164 A CN 201611264164A CN 106933066 A CN106933066 A CN 106933066A
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- Prior art keywords
- light shield
- substrate
- cylinder
- exposure
- optical system
- Prior art date
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Have：First supporting member, its with along by regulation curvature bending into supporting the side in light shield and substrate in the way of the first face of cylinder planar；Second supporting member, it supports the opposing party in light shield and substrate in the way of along the second face of regulation；And travel mechanism, it rotates the first supporting member, and move the second supporting member, light shield and substrate is set to be moved up in scan exposure side, projection optical system utilizes the projected light beam comprising the chief ray almost parallel with the line at the center perpendicular to the scan exposure direction of view field, the picture of pattern is formed in the projection image planes of regulation, travel mechanism sets the translational speed of the first supporting member and the translational speed of the second supporting member, so that the larger face of curvature in the plane of exposure of the projection image planes of pattern and substrate or the translational speed as plane side are relatively shorter than the translational speed of the opposing party.
Description
The present patent application be international filing date on March 24th, 2014, international application no be PCT/JP2014/058109,
National applications number into National Phase in China is 201480034715.7, entitled " substrate board treatment, device manufacture
The divisional application of the patent application of method, scanning exposure method, exposure device, device inspection apparatus and device making method ".
Technical field
The pattern of light shield is projected at the substrate for exposing the pattern on substrate and on the substrate the present invention relates to a kind of
Reason device, device making method, scanning exposure method, exposure device, device inspection apparatus and device making method.
Background technology
There are a kind of device inspection apparatus for manufacturing the various devices such as the display device or semiconductor of liquid crystal display etc..Device
Manufacture system has the substrate board treatments such as exposure device.In the substrate board treatment described in patent document 1, will be formed in matching somebody with somebody
It is placed in the picture of the pattern of the light shield of illumination region to project to being configured on substrate of view field etc., the figure is exposed on substrate
Case.The light used in substrate board treatment is covered with plane, also there is cylindrical shape etc..
In the exposure device used in photo-mask process, it is known to which a kind of that disclosed in following patent documents is used
Cylindric or columned light shield (hereinafter also referred to collectively as cylinder light shield) carrys out exposure device (such as patent document of exposure base
2).Additionally, it is known that there is one kind to use cylinder light shield, the device pattern of display panel is continuously exposed to flexibility
Exposure device (such as patent document 3) on the sheet material substrate of the strip of (flexibility).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2007-299918 publications
Patent document 2：International Publication WO2008/029917
Patent document 3：Japanese Unexamined Patent Publication 2011-221538 publications
The content of the invention
Herein, substrate board treatment is by increasing the exposure area on scan exposure direction (view field of slit-shaped),
Can shorten for an irradiation area on substrate or the scan exposure time of device area such that it is able to improve per unit
The productivitys such as the treatment number of the substrate of time.But, as patent document 1 is recorded, when in order to seek productive carrying
It is high and when using rotatable cylindric light shield, mask pattern is bent into cylindrical shape, therefore, if by mask pattern (cylindrical shape)
The circumferential direction as scan exposure, increase the size on scan exposure direction of the view field of slit-shaped, then sometimes
Projection exposure can decline in the quality (picture quality) of the pattern on substrate.
Shown in patent document 2 described above, cylindric or columned light shield is from the Pivot axle (center of regulation
Line) outer peripheral face (barrel surface) with certain radius is played, electronic device (such as semiconductor IC chip is formed with the outer peripheral face
Deng) mask pattern.When mask pattern being transferred on photosensitive substrate (wafer), while make substrate with fixing speed to
One direction movement, while making cylinder light shield around Pivot axle synchronous rotary.In this case, if so that cylinder light shield
The whole girth of the outer peripheral face mode corresponding with the length of substrate sets the diameter of cylinder light shield, then can be in the length of substrate
Continuously scan exposure mask pattern in the range of degree.In addition, as described in patent document 3, if using cylinder light shield as such,
The flexible sheet material substrate (there is photosensitive layer) of strip is only transported with fixing speed on strip direction by one side, while making
Cylinder light shield and the rotation of speed sync ground, it becomes possible to repeat the pattern of display panel to be continuously exposed on sheet material substrate
On.In this way, in the case of using cylinder light shield so that the efficiency or rhythm of the exposure-processed of substrate are improved, so that
Expect that the productivity of electronic device, display panel etc. is improved.
But, particularly in the case where the mask pattern to display panel is exposed, the picture chi of display panel
Very little is several inches~tens inches, is diversified, therefore, the size in the region of mask pattern, length-width ratio are also various many
Sample.In this case, can be installed in the diameter of the cylinder light shield of exposure device or rotation if uniquely determining
The size of heart axial direction, then be difficult to accordingly effectively match somebody with somebody in the outer peripheral face of cylinder light shield with the display panel of various size
Put mask pattern region.Even if for example, can be by the one of the display panel in the case of for the display panel of big picture dimension
The mask pattern region of face size is formed in the substantially whole circumference of the outer peripheral face of cylinder light shield, but for than the size slightly
In the case of small display panel, it is impossible to form the mask pattern region of two sides size so that circumferential (or Pivot axle
To) blank can increase.
The purpose of form of the invention is, there is provided it is a kind of can be producing the base of the substrate of high-quality compared with high productivity
Plate processing unit, device making method and scanning exposure method.
The purpose of another form of the invention is, there is provided a kind of exposure that can install the different cylinder light shield of diameter
Device, device inspection apparatus and the device making method using this exposure device.
A kind of first form of the invention, there is provided substrate board treatment, the substrate board treatment has will be from light
The light beam of the pattern of cover is projected to the projection optical system of the view field for being configured with substrate, wherein, the light shield is configured at photograph
The illumination region of Mingguang City, the substrate board treatment has：First supporting member, it is in the illumination region and the projected area
In a side region in domain, with along by regulation curvature bending into the way of the first face of cylinder planar come support the light shield and
A side in the substrate；In second supporting member, its opposing party region in the illumination region and the view field,
The opposing party in the light shield and the substrate is supported in the way of along the second face of regulation；And travel mechanism, it makes institute
The rotation of the first supporting member is stated, the side in the light shield and the substrate that first supporting member supported is exposed in scanning
Moved on light direction, and move second supporting member, make the light shield and institute that second supporting member is supported
The opposing party stated in substrate moves up in the scan exposure side；Be formed in for the picture of the pattern by the projection optical system
In the projection image planes of regulation, the travel mechanism sets the translational speed and the second supporting structure of first supporting member
The translational speed of part, makes the larger face of the curvature in the plane of exposure of the projection image planes of the pattern and the substrate or as flat
The translational speed of face side is relatively shorter than the translational speed of the opposing party.
A kind of second form of the invention, there is provided device making method, the device making method includes using first
Substrate board treatment described in form forms the pattern of the light shield on the substrate；Supplied with to the substrate board treatment
To the substrate.
A kind of 3rd form of the invention, there is provided scanning exposure method, the scanning exposure method will be formed in advising
The pattern that fixed radius of curvature bends to the one side of the light shield of cylindrical shape is projected to being supported to cylinder via projection optical system
The surface of shape or plane flexible base board, and while make speed movement of the light shield along the one side of bending to specify, one
While substrate is moved with the speed for specifying along the surface for being supported to cylindric or plane substrate, to base on substrate
When the projection image of the pattern of projection optical system is scanned exposure, will be formed with based on projected light with best focus
The radius of curvature of the projection image planes of the projection image of the pattern of system is set to Rm, will be supported to cylindric or plane base
The radius of curvature on the surface of plate is set to Rp, the translational speed of the pattern image that the movement by light shield is moved along projection image planes
Vm being set to, during by being set to Vp along the speed of the regulation on the surface of substrate, Vm ＞ Vp is set as in the case of Rm ＜ Rp, in Rm
It is set as Vm ＜ Vp in the case of ＞ Rp.
4th form of the invention, there is provided a kind of exposure device, the exposure device has：Lamp optical system, its
By conduct illuminating light to cylinder light shield, what the radius of curvature that the cylinder light covers on the axis relative to regulation to specify bent
There is pattern on the outer peripheral face of curved surface；Base supporting mechanism, its supporting substrates；Projection optical system, it will be by the illumination light
The pattern of the cylinder light shield of illumination projects the substrate supported to the base supporting mechanism；Change mechanism,
It changes the cylinder light shield；And adjustment portion, the cylinder light shield is replaced by the different circle of diameter by it in the replacing mechanism
During cylinder light shield, at least a portion to the lamp optical system and at least a portion of the projection optical system at least
One side is adjusted.
5th form of the invention, there is provided a kind of exposure device, the exposure device has：Light shield maintaining body, its
Being bent to predetermined radius in the axis relative to regulation has pattern on the outer peripheral face of cylindrical shape, installed in replaceable mode
There is in the different multiple cylinder light shields of diameter each other, and it is rotated around the axis of the regulation；Illuminator, it will
Illumination is in the pattern of the cylinder light shield；Base supporting mechanism, its face or flat bearing substrate along bending should
Substrate is exposed by the light of the pattern of the cylinder light shield from illuminated light irradiation；And adjustment portion, its basis
The diameter of the cylinder light shield of the light shield maintaining body is installed on, at least to the axis and the substrate supporting of the regulation
The distance between mechanism is adjusted.
6th form of the invention, there is provided a kind of device inspection apparatus, the device inspection apparatus have：Above-mentioned exposure
Electro-optical device；With the substrate feeding device that the substrate is supplied to the exposure device.
7th form of the invention, there is provided a kind of device making method, the device making method includes：Using above-mentioned
Exposure device, by the pattern exposure of the cylinder light shield in the substrate；Enter with by the exposed substrate
Row processes to form the device corresponding with the pattern of the cylinder light shield.
Invention effect
Form of the invention, is prevented from because of the projection image planes for being formed with pattern image and the substrate transferred with pattern image
Surface in the one party skew (image displacement) of image position that is bent upwards in the scan exposure side of substrate and produced, and energy
Enough increase the exposed width in scan exposure such that it is able to obtain having been transferred with high-quality the base of pattern image with high productivity
Plate.
Using other forms of the invention, using the teaching of the invention it is possible to provide even if a kind of be provided with the different circle of diameter within the limits prescribed
In the case of cylinder light shield, it is also possible to carry out exposure device, device inspection apparatus and the device manufacture of the pattern transfer of high-quality
Method.
Brief description of the drawings
Fig. 1 is the figure of the structure of the device inspection apparatus for showing first embodiment.
Fig. 2 is the integrally-built figure of the exposure device (substrate board treatment) for showing first embodiment.
Fig. 3 is the figure of the configuration of the illumination region and view field that show the exposure device shown in Fig. 2.
Fig. 4 is the figure of the structure of the lamp optical system and projection optical system for showing the exposure device shown in Fig. 2.
Fig. 5 is the figure of the state for large showing illuminating bundle and projected light beam on light shield.
Fig. 6 is the traveling mode for schematically illustrating illuminating bundle and projected light beam in the polarising beam splitter in Fig. 4
Figure.
Fig. 7 is the pass between the movement of the plane of exposure of the movement and substrate of the projection image planes of the pattern for large showing light shield
The explanatory diagram of system.
Fig. 8 A be show when project image planes and plane of exposure without difference when the picture in exposed width deviation
Amount, a curve map for example of difference component change.
Fig. 8 B are shown when projection image planes and the deviation of the picture in exposed width when having difference of plane of exposure
Amount, a curve map for example of difference component change.
Fig. 8 C be show when change plane of exposure with project image planes peripheral speed difference when in exposed width as
One curve map of example of difference component change.
Fig. 9 is to show that the pattern projection image for having indifference and changing with the peripheral speed of plane of exposure according to projection image planes is exposing
The curve map of example of the contrast than change in optical width.
Figure 10 is the integrally-built figure of the exposure device (substrate board treatment) for showing second embodiment.
Figure 11 is between the movement of the plane of exposure of the movement and substrate of the projection image planes of the pattern for large showing light shield
The explanatory diagram of relation.
Figure 12 be the peripheral speed according to projection image planes and plane of exposure for showing in this second embodiment have an indifference and
One curve map of example of the departure change of the picture in the exposed width of change.
Figure 13 A are the figures of the light intensity distributions of the projection image for showing the L＆S patterns on light shield M.
Figure 13 B are the figures of the light intensity distributions of the projection image for showing isolated line (ISO) pattern on light shield M.
Figure 14 be in the state of without difference (before amendment), emulate L＆S patterns projection image contrast value and
Contrast than curve map.
Figure 15 be in the state of having difference (after amendment), emulate L＆S patterns projection image contrast value and
Contrast than curve map.
Figure 16 is the contrast of the projection image of isolated (ISO) pattern of emulation in the state of without difference (before amendment)
Angle value and contrast than curve map.
Figure 17 is the contrast of the projection image of isolated (ISO) pattern of emulation in the state of having difference (after amendment)
Angle value and contrast than curve map.
Figure 18 is to show to work as relative to the translational speed of the plane of exposure on substrate to change the circumference of the projection image planes of light shield M
The curve map of the relation of picture addendum modification (departure) during speed and exposed width between.
Figure 19 is to show to evaluate optimal exposure according to evaluation of estimate Q1, Q2 obtained using departure and resolution ratio wide
One curve map of example of the emulation of degree.
Figure 20 is the integrally-built figure of the exposure device (substrate board treatment) for showing the 3rd implementation method.
Figure 21 is the integrally-built figure of the exposure device (substrate board treatment) for showing the 4th implementation method.
Figure 22 is the relation between the movement of the plane of exposure of the movement and substrate of the projection image planes of the pattern for showing light shield
Explanatory diagram.
Figure 23 is the integrally-built figure of the exposure device for showing the 5th implementation method.
Figure 24 is to show flow chart the step of when the light shield used by exposure device is replaced by into other light shields.
Figure 25 is position and the even number of the field of view of the light shield side of the first projection optical system for showing odd number
The figure of the relation between the position of the field of view of the light shield side of the second projection optical system.
Figure 26 is the stereogram of the light shield for showing the information storage part on the surface with the light shield information that is stored with.
Figure 27 depicts the schematic diagram of the exposure condition setting table of conditions of exposure.
Figure 28 is, based on Fig. 5 above, roughly to show the illuminating bundle between the different light shield of diameter and projection
The figure of the state of light beam.
Figure 29 is the figure of the configuration change for showing encoder head in the case where the different light shield of diameter is replaced by etc..
Figure 30 is the figure of calibrating installation.
Figure 31 is the figure for illustrating calibration.
Figure 32 is the side view for being shown with the example that air bearing supports light shield in the way of it can rotate.
Figure 33 is the stereogram for being shown with the example that air bearing supports light shield in the way of it can rotate.
Figure 34 is the integrally-built figure of the exposure device for showing the 6th implementation method.
Figure 35 is the integrally-built figure of the exposure device for showing the 7th implementation method.
Figure 36 is the solid of the local structure example for showing the supporting device in the exposure device of the cylinder light shield M of reflection-type
Figure.
Figure 37 is the flow chart for showing device making method.
Specific embodiment
While one side for implementing mode of the invention (implementation method) to being described in detail referring to the drawings.Following
Content described in implementation method is not intended to limit the present invention.In addition, including this area in the inscape of following record
Technical staff it can be readily appreciated that or substantially the same key element.And, the inscape below recorded can be appropriate
Combination.In addition, not departing from the range of emphasis of the invention, various omissions, replacement can be carried out to inscape or is become
More.For example, in the following embodiments, although the situation to flexible display is manufactured as device is illustrated, but simultaneously
Not limited to this.As device, it is also possible to which manufacture is formed the circuit board of wiring pattern using Copper Foil etc., is formed with multiple semiconductors
Substrate of element (transistor, diode etc.) etc..
[first embodiment]
The substrate board treatment for applying exposure-processed to substrate of first embodiment is exposure device.In addition, exposure dress
Put to be assembled in and the substrate after exposure is applied various treatment come in the device inspection apparatus for manufacturing device.First, for device system
The system of making is illustrated.
＜ device inspection apparatus ＞
Fig. 1 is the figure of the structure of the device inspection apparatus for showing first embodiment.Device inspection apparatus 1 shown in Fig. 1
It is streamline (flexible display manufacture streamline) of the manufacture as the flexible display of device.As flexible display, for example
There is a kind of organic el display etc..The device inspection apparatus 1 use so-called roll-to-roll (Roll to Roll) mode, the roller pair
Roller (Roll to Roll) mode refers to send out the substrate P from the supply roller FR1 that flexible substrate P is wound into roll,
After substrate P to sending out is applied continuously in various treatment, furled the substrate P after treatment as flexible device to recovery roller
FR2.In the device inspection apparatus 1 of first embodiment, show to send out the base as the sheet material of film-form from supply roller FR1
Plate P, from supply roller FR1 send out substrate P sequentially pass through n platforms processing unit U1, U2, U3, U4, U5 ... Un is until being furled
To example of the recovery roller FR2.First, the substrate P for the process object as device inspection apparatus 1 is illustrated.
Substrate P uses such as resin film, the paper tinsel (sheet metal) formed by the metals such as stainless steel or alloy etc..As
The material of resin film, contains：For example polyvinyl resin, acrylic resin, polyester resin, Ethylene Vinyl Ester Copolymers resin,
Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, second
It is more than the one or two kinds of in vinyl acetate resin.
Substrate P is preferably selected such as thermal coefficient of expansion and less substantially big material, to cause actually ignore
Because of the caused deflection that is heated in the various treatment applied to substrate P.Thermal coefficient of expansion for example can be by by inorganic fill
Thing is mixed in resin film and is set to smaller than the threshold value corresponding with technological temperature etc..Inorganic filler for example can be oxygen
Change titanium, zinc oxide, aluminum oxide, silica etc..In addition, it by the thickness of the manufactures such as float technique is 100 μm or so that substrate P can be
Very thin glass individual layers, or above-mentioned resin film, paper tinsel etc. are pasted on the very thin glass and formed layered product.
The substrate P for constituting by this way forms roller FR1 for the supply by being wound into roll, supply roller FR1
It is installed in device inspection apparatus 1.It is provided with what the device inspection apparatus 1 pair of supply roller FR1 were sent out from supply roller FR1
Substrate P repeats for manufacturing a various treatment for device.Therefore, the substrate P after treatment is changed into multiple devices and is connected
State.That is, the substrate P sent out from supply roller FR1 is changed into the substrate of layout.Additionally, substrate P can be by prespecified
Pre-treatment make its surface activation come modified to its surface, or, be formed with for precision on surface by stamped method etc.
Small next door construction (sag and swell) of patterning.
Substrate P after treatment is used as recovery roller FR2 by being wound into roll and is recovered.Reclaim and be mounted with roller FR2
In on cutter sweep (not shown).Substrate P of the cutter sweep of recovery roller FR2 after by treatment is installed by each device
Split (cutting) to form multiple devices.For the size of substrate P, such as width (as the direction of short side)
Size is 10cm~2m or so, and the size of length direction (as the direction on side long) is more than 10m.Additionally, the size of substrate P is simultaneously
It is not limited to above-mentioned size.
X-direction, Y-direction and the orthogonal orthogonal coordinate system of Z-direction are used in Fig. 1.X-direction is to link in the horizontal plane
Supply is with roller FR1 and reclaims the direction for using roller FR2, is the left and right directions in Fig. 1.Y-direction is in the horizontal plane with X-direction just
The direction of friendship, is the fore-and-aft direction in Fig. 1.Y-direction makees roller FR1 for the supply and reclaims the axial direction for using roller FR2.Z-direction is
Vertical, is the above-below direction in Fig. 1.
Device inspection apparatus 1 have substrate feeding device 2, the substrate to being supplied by substrate feeding device 2 of supplying substrate P
P applies the processing unit U1~Un of various treatment, returns the substrate that the substrate P for applying treatment by processing unit U1~Un is reclaimed
The host control device 5 that receiving apparatus 4, each device to device inspection apparatus 1 are controlled.
Supply roller FR1 is rotatably installed in substrate feeding device 2.Substrate feeding device 2 have from
The driven roller R1 of substrate P, the position on width (Y-direction) of adjustment substrate P are sent out in the supply installed with roller FR1
Marginal position controller EPC1.Driven roller R1 clamps the table back of the body two sides of substrate P while rotating, and substrate P is used to from supply
Roller FR1 sends out towards the carrying direction reclaimed with roller FR2, thus supplies to processing unit U1~Un substrate P.Now, edge
Positioner EPC1 is so that the position of substrate P end (edge) in the direction of the width converges on ± ten relative to target location
Mode in the range of several μm~tens μm or so makes substrate P move in the direction of the width, to correct substrate P in the direction of the width
Position.
Recovery roller FR2 is rotatably installed in substrate retracting device 4.Substrate retracting device 4 has will
Substrate P after treatment is pulled to the position on width (Y-direction) of the driven roller R2 of recovery roller FR2 sides, adjustment substrate P
The marginal position controller EPC2 for putting.Substrate retracting device 4 carries on the back two sides while revolving using the table that driven roller R2 clamps substrate P
Turn, to carrying direction pull substrate P, and rotate recovery roller FR2, thus roll substrate P.Now, marginal position control
Device EPC2 processed corrects substrate P position in the direction of the width in the same manner as marginal position controller EPC1, with avoid substrate P
End (edge) on width produces deviation in width.
Processing unit U1 is the painting that photonasty functional liquid is applied on the surface of the substrate P supplied from substrate feeding device 2
Coating apparatus.As photonasty functional liquid, such as photoresist, photonasty silane coupler (such as photonasty hydrophobe are used
Property modifying agent, photonasty plating reducing agent etc.), UV curable resin solutions etc..Processing unit U1 is upper from the carrying direction of substrate P
Rise and be sequentially provided with applying mechanism Gp1 and drier Gp2 in trip side.Applying mechanism Gp1 have be wound with substrate P roller platen DR1,
The application roll DR2 relative with roller platen DR1.Applying mechanism Gp1 is wound in the state of roller platen DR1 in the substrate P that will be supplied
Under, using roller platen DR1 and application roll DR2 clamping substrate Ps.Then, applying mechanism Gp1 is by making roller platen DR1 and painting
Roller DR2 rotations are applied, while substrate P is moved to direction is carried, while using application roll DR2 coating photonasty functional liquids.Dry
Mechanism Gp2 by blowing out the drying air such as hot blast or dry air, to remove the solute contained in photonasty functional liquid
(solvent or water), dries the substrate P for being coated with photonasty functional liquid, and photonasty functional layer is formed in substrate P.
Processing unit U2 be in order that be formed at the surface of substrate P photonasty functional layer stabilization, will be from processing unit U1
Carry the heater that the substrate P come is heated to set point of temperature (for example, several 10~120 DEG C or so).Processing unit U2 is from substrate P
The upstream side in carrying direction be sequentially provided with heating chamber HA1 and cooling chamber HA2.It is provided with many in the inside of heating chamber HA1
Individual roller and multiple aerial turning-bars (air turn bar), multiple rollers and multiple aerial turning-bars constitute the carrying of substrate P
Path.Multiple rollers are set to be in rolling contact with the rear side of substrate P, and multiple aerial turning-bars are arranged to surface not with substrate P
The state of side contacts.In order to extend the transport path of substrate P, multiple rollers and multiple aerial turning-bars are forming removing for the shape that crawls
The mode for transporting path is configured.By the substrate P in heating chamber HA1 while being carried by the transport path along the shape that crawls, on one side
It is heated to set point of temperature.In order that in the temperature and subsequent handling (processing unit U3) of the substrate P of heating chamber HA1 heating
Environment temperature is consistent, and substrate P is cooled to environment temperature by cooling chamber HA2.Multiple is provided with the inside of cooling chamber HA2
Roller, in the same manner as heating chamber HA1, in order to extend the transport path of substrate P, multiple rollers are forming the transport path of the shape that crawls
Mode is configured.By the substrate P in cooling chamber HA2 while being carried by the transport path along the shape that crawls, while cooled.
Downstream on the carrying direction of cooling chamber HA2 is provided with driven roller R3, driven roller R3 while clamping is by cooling chamber HA2's
Substrate P is while rotation, thus supplies substrate P towards processing unit U3.
Processing unit (substrate board treatment) U3 is directed to the surface supplied from processing unit U2 and is formed with photosensitive sexual function
The exposure device of the pattern such as the circuit of substrate (sensitive substrate) P projection exposure displays of layer or wiring.Details exists
It is hereinafter described, processing unit U3 irradiates illuminating bundle by the light shield M of reflection-type, and illuminating bundle is obtained by light shield M reflection
To projected light beam projection exposure in substrate P.Processing unit U3 is with the downstream transport to carrying direction from processing unit
The substrate P driven roller DR4 of U2 supplies, the marginal position controller of the position on width (Y-direction) of adjustment substrate P
EPC3.Driven roller DR4 clamps the table back of the body two sides of substrate P while rotating, and substrate P is sent out to the downstream for carrying direction,
Thus come to be supplied to the rotating cylinder DR5 in exposure position supporting substrates P.Marginal position controller EPC3 and marginal position controller
EPC1 is similarly constituted, amendment substrate P position in the direction of the width so that exposure position substrate P width into
It is target location.In addition, in the state of processing unit U3 is with the substrate P imparting slackness after to exposure, to carrying direction
Downstream transport substrate P two groups of driven rollers DR6, DR7.Two groups of driven rollers DR6, DR7 are with the phase on the carrying direction of substrate P
Mode every the interval of regulation is configured.Driven roller DR6 holds the upstream side of the substrate P of carrying and rotates, driven roller DR7 clampings
The downstream of the substrate P carried and rotate, thus supply to processing unit U4 substrate P.Now, because substrate P is assigned
Slackness is given, it is possible to absorbing the variation in the transporting velocity more produced by the downstream in carrying direction than driven roller DR7, energy
Enough break off the influence of the exposure-processed caused by the variation because of transporting velocity to substrate P.In addition, in order that the light shield figure of light shield M
The picture of a part for case is relatively aligned (be aligned) with substrate P, and being provided with detection in processing unit U3 is previously formed in base
Aligming microscope AM1, AM2 of alignment mark on plate P etc..
Processing unit U4 is to carry out the development treatment of wet type, nothing to carrying the substrate P after the exposure for coming from processing unit U3
The wet type processing device of electrolysis electroplating processes etc..Have in the inside of processing unit U4：Along vertical (Z-direction) stratification
3 treatment troughs BT1, BT2, BT3 and carrying substrate P multiple rollers.Multiple rollers are forming substrate P successively from 3 treatment troughs
The inside of BT1, BT2, BT3 transport path by way of configure.Downstream on the carrying direction for the treatment of trough BT3 is provided with
Driven roller, driven roller DR8 is clamped by the substrate P after treatment trough BT3 while rotate, thus by substrate P towards processing
Device U5 is supplied.
Although omitting diagram, processing unit U5 is to doing that the substrate P come from processing unit U4 carryings is dried
Dry device.Processing unit U5 removes the drop for being applied in processing unit U4 and having been adhered in the substrate P of wet processed, and adjusts
The moisture of whole substrate P.Processing unit is carried to by several processing units by the dry substrate Ps of processing unit U5 again
Un.Then, after processing unit Un is processed, substrate P is rolled up to the recovery roller FR2 of substrate retracting device 4.
Host control device 5 plan as a whole control base board feedway 2, substrate retracting device 4 and multiple processing unit U1~
Un.The control base board feedway 2 of host control device 5 and substrate retracting device 4, reclaim from substrate feeding device 2 to substrate
The carrying substrate P of device 4.In addition, the one side of host control device 5 makes the carrying synchronization of substrate P, while the multiple processing unit U1 of control
~Un, various treatment are carried out to substrate P.
＜ exposure devices (substrate board treatment) ＞
Hereinafter, 2~Fig. 5 of reference picture, to exposure device (the processing substrate dress of the processing unit U3 as first embodiment
Put) structure illustrate.Fig. 2 be show first embodiment exposure device (substrate board treatment) it is integrally-built
Figure.Fig. 3 is the figure of the configuration of the illumination region and view field that show the exposure device shown in Fig. 2.Fig. 4 is to show Fig. 2 institutes
The figure of the lamp optical system of the exposure device for showing and the structure of projection optical system.Fig. 5 is to show to expose to the photograph of light shield
The figure of the state of Mingguang City's beam and the projected light beam projected from light shield.Fig. 6 is in schematically illustrating the polarising beam splitter in Fig. 4
Illuminating bundle and projected light beam traveling mode figure.Hereinafter, processing unit U3 is referred to as exposure device U3.
Exposure device U3 shown in Fig. 2 is so-called scanning-exposure apparatus, while to direction carrying substrate P is carried, on one side
Will be formed in cylindrical shape light shield M outer peripheral face mask pattern picture projection exposure on the surface of substrate P.Additionally, in Fig. 2
Middle use X-direction, Y-direction and the orthogonal orthogonal coordinate system of Z-direction, using the orthogonal coordinate system same with Fig. 1.
First, the light shield M used in exposure device U3 is illustrated.Light shield M is for example to use metal cylinder
Reflection-type light shield.Light shield M is formed as the cylinder with outer peripheral face (periphery), and the outer peripheral face (periphery) has with edge
Y-direction extend first axle AX1 as center radius of curvature R m.The periphery of light shield M is the mask pattern for being formed with regulation
Light cover P1.Light cover P1 has：With high efficiency to the high reflection portion of prescribed direction the reflected beams and not to prescribed direction
The reflected beams or the reflection suppression portion with inefficient reflection.Mask pattern is formed by high reflection portion and reflection suppression portion
's.Herein, as long as reflection suppression portion is reduced to the light that prescribed direction reflects.Therefore, reflection suppression portion can absorb light, thoroughly
Cross light or to the direction reflected light (such as diffusing reflection) in addition to prescribed direction.Herein, light absorbing material can be utilized
Or the reflection suppression portion of the material composition light shield M through light.Exposure device U3 can be used by the circle of the metals such as aluminium or SUS
Cylinder make light shield as said structure light shield M.Therefore, exposure device U3 can be exposed using the light shield of low price.
Additionally, light shield M could be formed with the entirety or a part of the panel pattern corresponding with display device,
The panel pattern corresponding with multiple display devices can also be formed with.In addition, light shield M can be around first axle AX1's
Multiple panel patterns are repeatedly formed in circumference, it is also possible to be repeatedly formed multiple on the direction parallel with first axle AX1
Small-sized panel pattern.And, light shield M can also be formed with panel pattern and size of the first display device etc. with
The panel pattern of the different second display part of one display device.As long as in addition, light shield M has centered on first axle AX1
Radius of curvature for Rm periphery, be not limited to the shape of cylinder.For example, light shield M can also be with circumference
The sheet material of the arc-shaped in face.In addition, light shield M can also be laminal, laminal light shield M can be made to bend and with circumference
Face.
Then, the exposure device U3 shown in Fig. 2 is illustrated.Exposure device U3 above-mentioned driven roller DR4, DR6,
On the basis of DR7, rotating cylinder DR5, marginal position controller EPC3 and aligming microscope AM1, AM2, also have：Light shield keeps
Mechanism 11, base supporting mechanism 12, lamp optical system IL, projection optical system PL, slave control device 16.Exposure device U3
The illumination light projected from light supply apparatus 13 is irradiated in light via a part of lamp optical system IL and projection optical system PL
The pattern plane P1 of the light shield M that cover maintaining body 11 is supported, the projected light beam (imaging) that will be reflected by the pattern plane P1 of light shield M
The substrate P that base supporting mechanism 12 is supported is projeced into via projection optical system PL.
The each several part of the control exposure device of slave control device 16 U3, is processed each several part.Slave control device 16
Can be device inspection apparatus 1 host control device 5 it is some or all.In addition, slave control device 16 can also
Controlled by host control device 5, be other devices different from host control device 5.Slave control device 16 for example has meter
Calculation machine.
Light shield maintaining body 11 has：Keep the cylinder roller (also referred to as light shield holding cylinder) 21 of light shield M, make cylinder roller
First drive division 22 of 21 rotations.Cylinder roller 21 keeps light shield M in the way of the first axle AX1 of light shield M is as pivot.
First drive division 22 is connected with slave control device 16, and rotates cylinder roller 21 with first axle AX1 as pivot.
Additionally, the outer peripheral face in the cylinder roller 21 of light shield maintaining body 11 is directly formed by high reflection portion and low reflecting part
Mask pattern, but it is not limited to the structure.Its outer peripheral face can also be copied as the cylinder roller 21 of light shield maintaining body 11
Wind and keep laminal reflection-type light shield M.In addition, can also be can pacify as the cylinder roller 21 of light shield maintaining body 11
The reflection-type light shield M that the mode that assembly and disassembly are unloaded will bend to the tabular of arc-shaped with radius Rm in advance is held in the outer of cylinder roller 21
Side face.
Base supporting mechanism 12 has 25 (the rotating cylinder DR5 in Fig. 1) of the substrate supporting supported to substrate P cylinder, makes
The second drive division 26, a pair aerial turning-bar ATB1, ATB2 and a pair of deflector rolls 27,28 that substrate supporting cylinder 25 rotates.Substrate
Supporting cylinder 25 is formed as the drum with outer peripheral face (periphery), and the outer peripheral face (periphery) has to prolong in the Y direction
The the second axle AX2 for stretching as center radius of curvature R p.Herein, first axle AX1 and the second axle AX2 is parallel to each other, with from first
Axle AX1 and the second axle AX2 by face be used as median plane CL.A part for the periphery of substrate supporting cylinder 25 turns into supporting base
The bearing-surface P2 of plate P.That is, substrate supporting cylinder 25 is supported to bend substrate P by the way that substrate P is wound on its bearing-surface P2
Into cylinder planar.Second drive division 26 is connected with slave control device 16, and substrate supporting is made with the second axle AX2 as pivot
Cylinder 25 rotates.A pair aerial turning-bar ATB1, ATB2 and a pair of deflector rolls 27,28 are respectively arranged on substrate P across substrate supporting cylinder 25
Carrying direction upstream side and downstream.Deflector roll 27 will carry the substrate P come via aerial turning-bar from driven roller DR4
ATB1 is guided to substrate supporting cylinder 25, and deflector roll 28 will carry the substrate P of coming via substrate supporting cylinder 25 from aerial turning-bar ATB2
Guide to driven roller DR6.
Base supporting mechanism 12 rotates substrate supporting cylinder 25 by using the second drive division 26, comes while using substrate branch
The bearing-surface P2 supportings for holding cylinder 25 have imported the substrate P of substrate supporting cylinder 25, while with fixing speed in strip direction (X-direction)
It is upper to transport the substrate P for having imported substrate supporting cylinder 25.
Now, the slave control device 16 being connected with the first drive division 22 and the second drive division 26 is by making cylinder roller
21 and substrate supporting cylinder 25 with specify rotary speed than synchronous rotary, will be formed in the mask pattern of the light cover P1 of light shield M
Picture continuously repeat projection exposure and (copy periphery on the surface of substrate P of the bearing-surface P2 for being wound in substrate supporting cylinder 25
And the face for bending) on.First drive division 22 of exposure device U3 and the second drive division 26 are the travel mechanism of present embodiment.
Light supply apparatus 13 projects the illuminating bundle EL1 of irradiation light shield M.Light supply apparatus 13 has light source 31 and light conducting member
32.Light source 31 is the light source of the light of the wavelength for projecting regulation.Light source 31 be, for example, the lamp source such as mercury vapor lamp, laser diode or
Light emitting diode (LED) etc..The illumination light that light source 31 is projected is, for example, bright line (g lines, h lines, i lines), the KrF projected from lamp source
The extreme ultraviolet lights such as PRK (wavelength 248nm) (DUV light), ArF PRKs (wavelength 193nm) etc..Herein, light source 31
It is preferred that projecting the illuminating bundle EL1 containing the light shorter than the wavelength of i line (wavelength of 365nm).As illuminating bundle as such
EL1, can use the laser (wavelength of 355nm) projected from YAG laser (third harmonic laser device), from YAG laser (four
Subharmonic laser) project laser (wavelength of 266nm) or from KrF excimer lasers project the laser (ripple of 248nm
It is long) etc..
The illuminating bundle EL1 that light conducting member 32 will be projected from light source 31 is conducted to lamp optical system IL.Light conducting member 32
Relaying module by optical fiber or using speculum etc. is constituted.In addition, light conducting member 32 is being provided with multiple lamp optical system IL
In the case of, the illuminating bundle EL1 from light source 31 is divided into multiple, multiple illuminating bundle EL1 are conducted to multiple and is illuminated
Optical system IL.Polarization shapes of the illuminating bundle EL1 that the light conducting member 32 of present embodiment will be projected from light source 31 as regulation
The light of state is incident to polarising beam splitter PBS.Polarising beam splitter PBS penetrates illumination in order to light shield M fall and is located at light shield M
Between projection optical system PL, using as the reflection of the light beam of the rectilinearly polarized light of S-polarization light, make the straight line as P polarization light
The light beam transmission of polarised light.Therefore, light supply apparatus 13 projects and is incident to the illuminating bundle EL1 of polarising beam splitter PBS and is changed into straight
The illuminating bundle EL1 of the light beam of linearly polarized light (S-polarization light).Light supply apparatus 13 to polarising beam splitter PBS project wavelength and
The consistent polarization ray laser of phase.For example, light supply apparatus 13 makes in the case of the light that the light beam projected from light source 31 is polarization
Optical fiber is kept to be led under the polarization state of the laser for maintaining to be exported from light supply apparatus 13 as light conducting member 32 with plane of polarization
Light.In addition, for example, the light beam that fiber guides are exported from light source 31 can also be used, making to be produced from the light of optical fiber output using polarizer
Raw polarization.I.e. light supply apparatus 13 makes random polarization in the case where the light beam of random polarization is directed using polarizer
Light beam polarization.In addition, light supply apparatus 13 can also guide defeated from light source 31 by using the relay optical system of lens etc.
The light beam for going out.
Herein, as shown in figure 3, the exposure device U3 of first embodiment assumes that the exposure dress of so-called poly-lens mode
Put.Additionally, figure shows in figure 3, the illumination region IR's on light shield M that the cylinder roller 21 observed from-Z sides is kept
The vertical view of the view field PA in substrate P that top view (left figure of Fig. 3), the substrate supporting cylinder 25 observed from+Z sides are supported
Figure (right figure of Fig. 3).The reference Xs of Fig. 3 shows moving direction (the rotation side of cylinder roller 21 and substrate supporting cylinder 25
To).Lighting area from the exposure device U3 of poly-lens mode to the multiple (in the first embodiment be, for example, 6) on light shield M
Domain IR1~IR6 irradiates illuminating bundle EL1 respectively, and each illuminating bundle EL1 is reflected in each illumination region IR1~IR6
The view field of multiple (be in the first embodiment, for example, 6) of multiple projected light beam EL2 projection exposures in substrate P
PA1~PA6.
First, the multiple illumination region IR1~IR6 illuminated using lamp optical system IL are illustrated.Such as Fig. 3 institutes
Show, multiple illumination region IR1~IR6 configure the first lighting area across median plane CL on the light shield M of the upstream side of direction of rotation
Domain IR1, the 3rd illumination region IR3 and the 5th illumination region IR5, second is configured on the light shield M in the downstream of direction of rotation
Illumination region IR2, the 4th illumination region IR4 and the 6th illumination region IR6.Each illumination region IR1~IR6 be in have along
Parallel short side and the elongated trapezoidal region on side long that the axial direction (Y-direction) of light shield M extends.Now, trapezoidal each photograph
Area pellucida domain IR1~IR6 is the region that its short side is located at outside positioned at median plane CL sides and its side long.First illumination region IR1,
Three illumination region IR3 and the 5th illumination region IR5 are separated by the interval of regulation to configure in the axial direction.In addition, the second lighting area
Domain IR2, the 4th illumination region IR4 and the 6th illumination region IR6 are separated by the interval of regulation to configure in the axial direction.Now,
Two illumination region IR2 are configured between the first illumination region IR1 and the 3rd illumination region IR3 in the axial direction.Similarly, the 3rd shines
Area pellucida domain IR3 is configured between the second illumination region IR2 and the 4th illumination region IR4 in the axial direction.4th illumination region IR4 exists
Configured on axial direction between the 3rd illumination region IR3 and the 5th illumination region IR5.5th illumination region IR5 is configured in the axial direction
Between the 4th illumination region IR4 and the 6th illumination region IR6.Each illumination region IR1~IR6 is with when the circumference around light shield M
When (X-direction), the mode (weight for being overlapped between the triangular part in the hypotenuse portion of adjacent trapezoidal illumination region in the Y direction
Folded mode) configuration.Additionally, in the first embodiment, each illumination region IR1~IR6 be trapezoidal region but it is also possible to be
The region of oblong-shaped.
In addition, light shield M has and being formed with the pattern forming region A3 of mask pattern and not forming the non-pattern of mask pattern
Forming region A4.Non- pattern forming region A4 is the region for being difficult reflection for absorbing illuminating bundle EL1, be configured to frame-shaped around
Pattern forming region A3.First~the 6th illumination region IR1~IR6 is configured to cover the whole of the Y-direction of pattern forming region A3
Individual width.
Lamp optical system IL is accordingly provided with multiple (in the first embodiment with multiple illumination region IR1~IR6
E.g. 6).Injected respectively from light supply apparatus 13 in multiple lamp optical system (segmentation lamp optical system) IL1~IL6
Illuminating bundle EL1.Each lamp optical system IL1~IL6 will conduct from each illuminating bundle EL1 of the incidence of light supply apparatus 13 respectively
To each illumination region IR1~IR6.That is, the first lamp optical system IL1 conducts to the first illumination region illuminating bundle EL1
IR1, similarly, the second~the 6th lamp optical system IL2~IL6 conducts to the second~the 6th lighting area illuminating bundle EL1
Domain IR2~IR6.Multiple lamp optical system IL1~IL6 are being configured with first, the three, the 5th lighting areas across median plane CL
The side (left side of Fig. 2) of domain IR1, IR3, IR5 configures the first lamp optical system IL1, lamp optical system IL3 and the
Five lamp optical system IL5.First lamp optical system IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system
IL5 is separated by the interval of regulation to configure in the Y direction.In addition, multiple lamp optical system IL1~IL6 are across median plane CL,
It is configured with second, the four, the 6th illumination regions IR2, IR4, the side (right side of Fig. 2) of IR6 configures the second lamp optical system
IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6.Second lamp optical system IL2, the 4th illumination light
System IL4 and the 6th lamp optical system IL6 are separated by the interval of regulation to configure in the Y direction.Now, the second illumination light
System IL2 is configured between the first lamp optical system IL1 and the 3rd lamp optical system IL3 in the axial direction.Similarly,
Three lamp optical system IL3, the 4th lamp optical system IL4, the 5th lamp optical system IL5 are configured shone second in the axial direction
Between bright optical system IL2 and the 4th lamp optical system IL4, the 3rd lamp optical system IL3 and the 5th lamp optical system
Between IL5, between the 4th lamp optical system IL4 and the 6th lamp optical system IL6.In addition, the first lamp optical system
IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system IL5 and the second lamp optical system IL2, the 4th illumination
Optical system IL4 and the 6th lamp optical system IL6 are configured to when being observed from Y-direction be symmetrical.
Then, reference picture 4, illustrate to each lamp optical system IL1~IL6.Further, since each lamp optical system
IL1~IL6 is same structure, so by taking the first lamp optical system IL1 (hereinafter simply referred to as lamp optical system IL) as an example
To illustrate.
In order to irradiate illumination region IR (the first illumination region IR1) with uniform illumination, lamp optical system IL makes to come from
The illuminating bundle EL1 of light supply apparatus 13 carries out Ke Le (Kohler) illuminations to the illumination region IR on light shield M.In addition, illumination light
System IL is to fall to penetrating illuminator using polarising beam splitter PBS.Lamp optical system IL is from from light supply apparatus 13
The light incident side of illuminating bundle EL1 has light optics module ILM, polarising beam splitter PBS and quarter wave plate 41 successively.
As shown in figure 4, light optics module ILM includes collimation lens 51, compound eye successively from the light incident side of illuminating bundle EL1
Lens 52, multiple collector lens 53, cylindrical lens 54, illuminated field diaphragm 55 and multiple relay lens 56, and it is arranged on the
On one optical axis BX1.
The incidence of collimation lens 51 has the light projected from light conducting member 32, irradiates the face entirety of the light incident side of fly's-eye lens 52.
Emitting side of the fly's-eye lens 52 located at collimation lens 51.The center configuration in the face of the emitting side of fly's-eye lens 52 is in
On one optical axis BX1.The illuminating bundle EL1 of the generation of fly's-eye lens 52 self-focus lenses in future 51 is divided into the face of multiple spot light pictures
Light source image.Illuminating bundle EL1 is generated by the area source picture.Now, the face of the emitting side of the fly's-eye lens 52 of generation spot light picture
By from fly's-eye lens 52 via the various of the first concave mirror 72 of illuminated field diaphragm 55 to projection optical system PL described later
Lens, the pupil plane where being configured to the reflecting surface with the first concave mirror 72 reaches optical conjugate.
Emitting side of the collector lens 53 located at fly's-eye lens 52.The optical axis of collector lens 53 is configured on primary optic axis BX1.
Collector lens 53 makes the multiple spot lights from the emitting side for being formed at fly's-eye lens 52 as respective light is in illuminated field diaphragm
Overlapped on 55, illuminated field diaphragm 55 is irradiated with uniform Illumination Distribution.Illuminated field diaphragm 55 has and the illumination shown in Fig. 3
Region IR similar trapezoidal or rectangular rectangular-shaped opening portion, the center configuration of the opening portion is on primary optic axis BX1.
By relay lens 56, polarising beam splitter PBS, quarter wave plate in from illuminated field diaphragm 55 to the light path of light shield M
41 so that the opening portion of illuminated field diaphragm 55 is configured to the relation for having optical conjugate with the illumination region IR on light shield M.In
The illuminating bundle EL1 transmitted from the opening portion of illuminated field diaphragm 55 is set to be incident to polarising beam splitter PBS after lens 56.Poly-
The emitting side of optical lens 53 with the adjoining position of illuminated field diaphragm 55 is provided with cylindrical lens 54.Cylindrical lens 54 is light incident side
It is in the piano convex cylindrical lens in cylindrical lens face in plane and emitting side.The optical axis of cylindrical lens 54 is configured on primary optic axis BX1.
Cylindrical lens 54 makes each chief ray of the illuminating bundle EL1 of the illumination region IR on irradiation light shield M converge in XZ faces, in Y side
It is in upwards parastate.
Polarising beam splitter PBS is configured between light optics module ILM and median plane CL.Polarising beam splitter PBS exists
Division of wave front face makes to be reflected as the light beam of the rectilinearly polarized light of S-polarization light, makes the light of the rectilinearly polarized light as P polarization light
Beam is transmitted.Herein, if the illuminating bundle EL1 that will be incident to polarising beam splitter PBS is set to the rectilinearly polarized light of S-polarization light,
Illuminating bundle EL1 is reflected by the division of wave front face of polarising beam splitter PBS, is transmitted from quarter wave plate 41 and is changed into circularly polarized light
And the illumination region IR irradiated on light shield M.By the projected light beam EL2 of the illumination region IR reflections on light shield M by transmiting again
Quarter wave plate 41 and be in line P polarization light from circularly polarized light conversion, through the division of wave front face directive of polarising beam splitter PBS
Projection optical system PL.The major part that polarising beam splitter PBS preferred pairs are incident to the illuminating bundle EL1 in division of wave front face is entered
Row reflection, and make most of transmission of projected light beam EL2.Polarization on the division of wave front face of polarising beam splitter PBS
Light stalling characteristic is represented by extinction ratio, because the extinction ratio becomes always according to the incidence angle of the light towards division of wave front face
Change, so in order to influence in actual applications to imaging performance will not turn into problem, the characteristic in division of wave front face is further contemplated
Illuminating bundle EL1, the NA (numerical aperture) of projected light beam EL2 are designed.
Fig. 5 is that the illumination region exposed on light shield M is greatly exaggerated to show in XZ faces (plane vertical with first axle AX1)
The figure of the state of the projected light beam EL2 of illuminating bundle EL1 and illuminable area the IR reflection of IR.As shown in figure 5, above-mentioned illumination light
System IL is so that the chief ray of the projected light beam EL2 reflected by the illumination region IR of light shield M turns into telecentricity (parallel system)
Mode, will expose to the chief ray of illuminating bundle EL1 of the illumination region IR of light shield M in XZ faces (plane vertical with axle AX1)
Non- telecentricity state is inside set to consciously, and telecentricity state is set in YZ planes (parallel with median plane CL).Illuminating bundle
This characteristic of EL1 is that the cylindrical lens 54 shown in Fig. 4 is assigned.Specifically, the lighting area when setting from light cover P1
The circumferential central point Q1 of domain IR passes through and towards the line of first axle AX1, the intersection point Q2 with 1/2 circle of the radius Rm of light cover P1
When, with from illumination region IR illuminating bundle EL1 each chief ray on XZ faces towards by way of intersection point Q2, set cylinder
The curvature of the projection lens face of lens 54.Like this, each chief ray of the projected light beam EL2 for being reflected in illumination region IR exists
Be changed into XZ faces with by first axle AX1, point Q1, the straight line parallel (telecentricity) of intersection point Q2 state.
Then, to carrying out multiple view fields (exposure area) PA1~PA6 of projection exposure using projection optical system PL
Illustrate.As shown in figure 3, multiple illumination region IR1 on multiple view field PA1~PA6 in substrate P and light shield M~
IR6 is accordingly configured.That is, the multiple view field PA1~PA6 in substrate P are carrying the upstream in direction across median plane CL
The first view field PA1, the 3rd view field PA3 and the 5th view field PA5 are configured in the substrate P of side, direction is being carried
Downstream substrate P on configure the second view field PA2, the 4th view field PA4 and the 6th view field PA6.It is each to throw
Shadow zone domain PA1~PA6 is in the short side and the elongated ladder on side long that there is the width (Y-direction) along substrate P to extend
The region of shape (rectangle).Now, trapezoidal each view field PA1~PA6 is that its short side is located at median plane CL sides and its side position long
In the region in outside.First view field PA1, the 3rd view field PA3 and the 5th view field PA5 phase in the direction of the width
Configured every the interval of regulation.In addition, the second view field PA2, the 4th view field PA4 and the 6th view field PA6 exist
It is separated by the interval of regulation on width to configure.Now, the second view field PA2 is configured in the first view field in the axial direction
Between PA1 and the 3rd view field PA3.Similarly, the 3rd view field PA3 is configured in the second view field PA2 in the axial direction
Between the 4th view field PA44.4th view field PA4 is configured at the 3rd view field PA3 and the 5th projection in the axial direction
Between the PA5 of region.5th view field PA5 be configured in the axial direction the 4th view field PA4 and the 6th view field PA6 it
Between.Each view field PA1~PA6 in the same manner as each illumination region IR1~IR6, with trapezoidal projected area adjacent in the Y direction
In the mode (mode of overlap) for carrying coincidence on the direction configuration of substrate P between the triangular part in the hypotenuse portion of domain PA.Now, throw
Shadow zone domain PA turns into the light exposure and the light exposure in unduplicated region caused in the repeat region of adjacent view field PA
Substantially the same shape.And, the first~the 6th view field PA1~PA6 is configured to cover the exposure exposed in substrate P
Whole width in the Y-direction of region A7.
Herein, in fig. 2, when being observed in XZ faces, the center of the illumination region IR1 (and IR3, IR5) on light shield M
Point is set to the girth of the central point of illumination region IR2 (and IR4, IR6)：With from the substrate P for copying bearing-surface P2
View field PA1 (and PA3, PA5) central point to the central point of the second view field PA2 (and PA4, PA6) week
Length is substantially equal.
Projection optical system PL is accordingly provided with multiple (in the first embodiment with multiple view field PA1~PA6
E.g. 6).In multiple projection optical system (segmentation projection optical system) PL1~PL6, inject respectively from multiple lighting areas
Multiple projected light beam EL2 of domain IR1~IR6 reflections.Each projection optical system PL1~PL6 is by by each projected light of light shield M reflection
Beam EL2 conducts to each view field PA1~PA6 respectively.That is, the first projection optical system PL1 will be from the first illumination region IR1
Projected light beam EL2 conduct to the first view field PA1, similarly, the second~the 6th projection optical system PL2~PL6 is in the future
Conducted to the second~the 6th view field PA2~PA6 from each projected light beam EL2 of the second~the 6th illumination region IR2~IR6.
Multiple projection optical system PL1~PL6 across median plane CL, be configured with first, the three, the 5th view field PA1, PA3,
The side (left side of Fig. 2) of PA5 configures the first projection optical system PL1, the 3rd projection optical system PL3 and the 5th projected light
System PL5.First projection optical system PL1, the 3rd projection optical system PL3 and the 5th projection optical system PL5 are in Y side
It is separated by the interval of regulation upwards to configure.In addition, multiple projection optical system PL1~PL6 are across median plane CL, the is being configured with
2nd, the side (right side of Fig. 2) of the four, the 6th view field PA2, PA4, PA6 configures the second projection optical system PL2, the 4th
Projection optical system PL4 and the 6th projection optical system PL6.Second projection optical system PL2, the 4th projection optical system
PL4 and the 6th projection optical system PL6 are separated by the interval of regulation to configure in the Y direction.Now, the second projection optical system
PL2 is configured between the first projection optical system PL1 and the 3rd projection optical system system PL3 in the axial direction.Similarly, the 3rd
Projection optical system PL3, the 4th projection optical system PL4, the 5th projection optical system PL5 are configured in the second projection in the axial direction
Between optical system PL2 and the 4th projection optical system PL4, the 3rd projection optical system PL3 and the 5th projection optical system PL5
Between, between the 4th projection optical system PL4 and the 6th projection optical system PL6.In addition, the first projection optical system PL1,
Three projection optical system PL3 and the 5th projection optical system PL5 and the second projection optical system PL2, the 4th projection optics system
System PL4 and the 6th projection optical system PL6 is configured to when being observed from Y-direction be symmetrical.
Referring again to Fig. 4, illustrated for each projection optical system PL1~PL6.Further, since each projection optics system
System PL1~PL6 is same structure, so being made with the first projection optical system PL1 (hereinafter simply referred to as projection optical system PL)
For example is illustrated.
Projection optical system PL is by the picture of the mask pattern on the illumination region IR (the first illumination region IR1) on light shield M
It is projected in the view field PA in substrate P.Projection optical system PL from the light incident side of the projected light beam EL2 from light shield M successively
With above-mentioned quarter wave plate 41, above-mentioned polarising beam splitter PBS and projection optics module PLM.
Quarter wave plate 41 and polarising beam splitter PBS can be with lamp optical system IL dual-purposes.In other words, light optics
System IL and projection optical system PL shares quarter wave plate 41 and polarising beam splitter PBS.
As shown in fig. 7, the projected light beam EL2 of illuminable area IR (reference picture 3) reflections is that each chief ray is parallel to each other
The light beam of telecentricity, and it is incident to the projection optical system PL shown in Fig. 2.The throwing of the circularly polarized light reflected as illuminable area IR
Shadow light beam EL2 is incident to polarized light beam splitting after rectilinearly polarized light (P polarization light) is converted to from circularly polarized light by quarter wave plate 41
Device PBS.The projected light beam EL2 of polarising beam splitter PBS is incident to from after polarising beam splitter PBS transmissions, Fig. 4 institutes are incident to
The projection optics module PLM for showing.
Used as an example, polarising beam splitter PBS fits two prisms of triangle (quartz system) in XZ faces, or
Holding is contacted by optical contact, on the whole rectangular shape.In order to effectively carry out polarised light separation, in the coating surface
Upper multilayer film of the formation containing hafnium oxide etc..And, by the incident polarising beam splitter PBS of the projected light beam EL2 from light shield M
Face and by the first reflecting surface P3 from projected light beam EL2 to first deflecting member 70 of projection optical system PL project face set
It is vertical relative to the chief ray of projected light beam EL2.And, the face of the polarising beam splitter PBS that illuminating bundle EL1 is incident to sets
It is set to vertical with the primary optic axis BX1 (reference picture 4) of lamp optical system IL.Additionally, because being worried to purple using adhesive
In the case of the tolerance of outside line or laser, the coating surface application of polarising beam splitter PBS does not use the optics of adhesive
The engagement of contact.
The projected light beam EL2 of illuminable area IR reflections is the light beam of telecentricity, is incident to projection optical system PL.As quilt
The projected light beam EL2 of the circularly polarized light of illumination region IR reflections is being converted to rectilinearly polarized light by quarter wave plate 41 from circularly polarized light
After (P polarization light), polarising beam splitter PBS is incident to.The projected light beam EL2 of polarising beam splitter PBS is incident to from polarization
After beam splitter PBS transmissions, projection optics module PLM is incident to.
Projection optics module PLM is accordingly set with light optics module ILM.That is, the first projection optical system PL1's
The first illumination region IR1 that projection optics module PLM will be illuminated by the light optics module ILM of the first lamp optical system IL1
The picture of mask pattern be projected in the first view field PA1 in substrate P.Similarly, the second~the 6th projection optical system PL2
The projection optics module PLM of~PL6 will be illuminated by the projection optics module ILM of the second~the 6th lamp optical system IL2~IL6
The picture of mask pattern of the second~the 6th illumination region IR2~IR6 be projected in the second~the 6th view field in substrate P
PA2~PA6.
As shown in figure 4, the picture that projection optics module PLM has the mask pattern made on illumination region IR images in intermediary image
First optical system 61 of face P7, make at least a portion reimaging of the intermediary image being imaged by the first optical system 61 in substrate P
View field PA the second optical system 62 and be configured at the perspective view diaphragm of the intermediate image plane P7 for being formed with intermediary image
63.In addition, projection optics module PLM is also with focus amendment optical component 64, as skew optical component 65, multiplying power amendment use
Optical component 66, rotation correction mechanism 67 and polarization adjustment mechanism (polarization adjustment unit) 68.
First optical system 61 and the second optical system 62 be for example make it is remote obtained from Dai Sen (Dyson) system variant
The reflection and refraction optical system of the heart.The optical axis (hereinafter referred to as the second optical axis BX2) of the first optical system 61 and median plane CL essence
It is upper orthogonal.First optical system 61 has the first deflecting member 70, the first lens group 71, the first concave mirror 72.First deflection structure
Part 70 is the triangular prism with the first reflecting surface P3 and the second reflecting surface P4.First reflecting surface P3 is reflection from polarised light point
The projected light beam EL2 of beam device PBS, makes the projected light beam EL2 of reflection be incident to the first concave mirror 72 by the first lens group 71
Face.Second reflecting surface P4 is to make the projected light beam EL2 reflected by the first concave mirror 72 incident by the first lens group 71, and
The face that incident projected light beam EL2 is reflected to perspective view diaphragm 63.First lens group 71 includes various lens, various lens
Optical axis be configured on the second optical axis BX2.First concave mirror 72 is configured on the pupil plane of the first optical system 61, be set as with
The multiple spot light pictures generated by fly's-eye lens 52 have the relation of optical conjugate.
Projected light beam EL2 from polarising beam splitter PBS is reflected by the first reflecting surface P3 of the first deflecting member 70, from
The field of view of the top half of the first lens group 71 by and be incident to the first concave mirror 72.It is incident to the first concave mirror 72
Projected light beam EL2 is reflected by the first concave mirror 72, and from the field of view of the latter half of the first lens group 71 by and it is incident
To the second reflecting surface P4 of the first deflecting member 70.The projected light beam EL2 of the second reflecting surface P4 is incident to by the second reflecting surface P4
Reflection, from focus amendment optical component 64 and as skew optical component 65 by and be incident to perspective view diaphragm 63.
Perspective view diaphragm 63 has the opening of the shape of regulation view field PA.That is, the opening of perspective view diaphragm 63
Shape carry out the actual shape of regulation view field PA.Therefore, it is possible to the illumination field of view in by lamp optical system IL
The shape of the opening of diaphragm 55 be set to it is similar to the actual shape of view field PA it is trapezoidal in the case of, omit projection and regard
Field diaphragm 63.
Second optical system 62 is the structure same with the first optical system 61, across intermediate image plane P7 and the first optical system
System 61 is symmetrically arranged.The optical axis (hereinafter referred to as the 3rd optical axis BX3) of the second optical system 62 is with median plane CL substantially just
Hand over, it is parallel with the second optical axis BX2.Second optical system 62 has the second deflecting member 80, the second lens group 81, the second concave mirror
82.Second deflecting member 80 has the 3rd reflecting surface P5 and the 4th reflecting surface P6.3rd reflecting surface P5 is made from perspective view
Diaphragm 63 projected light beam EL2 reflection, and make the projected light beam EL2 after reflection from the second lens group 81 by and be incident to second
The face of concave mirror 82.4th reflecting surface P6 is the projected light beam EL2 reflected by the second concave mirror 82 is led to from the second lens group 81
Cross and incident, and make the face that the projected light beam EL2 of incidence reflects to view field PA.Second lens group 81 includes various lens,
The optical axis of various lens is configured on the 3rd optical axis BX3.Second concave mirror 82 is configured on the pupil plane of the second optical system 62,
And it is set as the relation that there is optical conjugate with the multiple spot light pictures for imaging in the first concave mirror 72.
Projected light beam EL2 from perspective view diaphragm 63 is reflected by the 3rd reflecting surface P5 of the second deflecting member 80, from
The field of view of the top half of the second lens group 81 by and be incident to the second concave mirror 82.It is incident to the second concave mirror 82
Projected light beam EL2 is reflected by the second concave mirror 82, from the field of view of the latter half of the second lens group 81 by and be incident to
4th reflecting surface P6 of the second deflecting member 80.The projected light beam EL2 for being incident to the 4th reflecting surface P6 is anti-by the 4th reflecting surface P6
Penetrate, from multiplying power amendment optical component 66 by and be projected to view field PA.Thus, mask pattern on illumination region IR
As with etc. multiplying power (× 1) be projected on view field PA.
Focus amendment optical component 64 is configured between the first deflecting member 70 and perspective view diaphragm 63.Focus amendment light
Learn the focus state of the adjustment of component 64 projection to the picture of the mask pattern in substrate P.Focus amendment optical component 64 is for example to make
The prism of two panels wedge-like reversely (reverse in the X direction in fig. 4) and the integral transparent parallel flat that overlaps.Pass through
A pair of prisms are made to be slided along bevel direction in the state of the interval between not changing face relative to each other so that as parallel
The variable thickness of flat board.Thus, the effective optical path length to the first optical system 61 is finely adjusted, and to being formed at intermediary image
The focus state of the picture of the mask pattern of face P7 and view field PA is finely adjusted.
As skew optical component 65 is configured between the first deflecting member 70 and perspective view diaphragm 63.As skew is used up
Component 65 is learned to be adjusted in the way of the picture of mask pattern that can be in mobile projector to substrate P in the image planes.As skew is used
Optical component 65 by Fig. 4 the tiltable transparent parallel plate glass in XZ faces and Fig. 4 it is tiltable in YZ faces
Bright parallel plate glass is constituted.By adjusting this respective tilt quantity of two panels parallel plate glass, can make to be formed at centre
The micro skew in the x direction or the y direction of the picture of the mask pattern of image planes P7 and view field PA.
Multiplying power amendment optical component 66 is configured between the second deflecting member 80 and substrate P.Multiplying power amendment optics structure
Part 66 is for example configured to, and concavees lens, convex lens, concavees lens this 3 are configured at coaxially at predetermined intervals, recessed before and after fixing
Mirror, makes the convex lens of centre just be moved up in optical axis (chief ray).Thus, it is formed at the picture of the mask pattern of view field PA
While the image formation state of telecentricity is maintained, it is isotropically micro on one side to zoom in or out.Additionally, constituting multiplying power amendment optics
3 optical axises of lens group of component 66 are tilted in XZ faces in the mode parallel with the chief ray of projected light beam EL2.
Rotation correction mechanism 67 for example using actuator (omitting diagram), makes the first deflecting member 70 around parallel with Z axis
The micro rotation of axle.The rotation that the rotation correction mechanism 67 passes through the first deflecting member 70, can make to be formed at intermediate image plane P7's
The micro rotation in intermediate image plane P7 of the picture of mask pattern.
Polarization adjustment mechanism 68 for example using actuator (omitting diagram), makes quarter wave plate 41 be revolved around the axle orthogonal with plate face
Transfer adjustment polarization direction.Polarization adjustment mechanism 68 is rotated by making quarter wave plate 41, can be to being projected to the throwing of view field PA
The illumination of shadow light beam EL2 is adjusted.
In the projection optical system PL for constituting by this way, the projected light beam EL2 from light shield M is from illumination region IR
Projected with the state (state that each chief ray is parallel to each other) of telecentricity, and by quarter wave plate 41 and polarising beam splitter PBS
It is incident to the first optical system 61.The projected light beam EL2 of the first optical system 61 is incident to by the first of the first optical system 61
First reflecting surface (level crossing) P3 reflections of deflecting member 70, and reflected by by the first concave mirror 72 from the first lens group 71.
The projected light beam EL2 reflected by the first concave mirror 72 again from the first lens group 71 by and by the first deflecting member 70 second
Reflecting surface (level crossing) P4 reflects, and transmits overfocus amendment optical component 64 and be incident to as skew optical component 65
Perspective view diaphragm 63.The projected light beam EL2 passed through from perspective view diaphragm 63 deflects structure by the second of the second optical system 62
3rd reflecting surface (level crossing) P5 reflections of part 80, reflect from the second lens group 81 by and by the second concave mirror 82.By second
The projected light beam EL2 of the reflection of concave mirror 82 again from the second lens group 81 by and by the second deflecting member 80 the 4th reflecting surface
(level crossing) P6 reflects, and is incident to multiplying power amendment optical component 66.From the projected light that multiplying power amendment is projected with optical component 66
Beam EL2 is incident to the view field PA in substrate P, will become apparent from the picture of mask pattern in illumination region IR with etc. multiplying power (×
1) it is projected on view field PA.
In the present embodiment, the second reflecting surface (level crossing) P4 of the first deflecting member 70 and the second deflecting member 80
3rd reflecting surface (level crossing) P5 turns into the face that 45 ° are inclined relative to median plane CL (or optical axis BX2, BX3), and first deflects
First reflecting surface (level crossing) P3 of component 70 and the 4th reflecting surface (level crossing) P6 of the second deflecting member 80 are set to and center
Face CL (or optical axis BX2, BX3) is into the angle in addition to 45 °.When will in Figure 5 pass through point Q1, intersection point Q2, first axle AX1
Straight line and median plane CL angulations when being set to θ °, by the first reflecting surface P3 of the first deflecting member 70 relative to center
The angle [alpha] ° (absolute value) in face CL (or optical axis BX2) is determined as α °=45 °+θ °/2 relation.Similarly, when will be along substrate
The chief ray and median plane CL of the projected light beam EL2 that the circumference for supporting the outer peripheral face of cylinder 25 passes through the central point in view field PA
When angle in ZX planes is set to ε °, by the 4th reflecting surface P6 of the second deflecting member 80 relative to median plane CL (or
Person optical axis BX2) angle beta ° (absolute value) be determined as β °=45 °+ε °/2 relation.Additionally, angle ε is according to projection optical system
Size, polarising beam splitter PBS equidimensions, illumination region IR or projected area on the light shield M sides of PL, the structure of substrate P side
Size in the circumference of domain PA etc. and it is different, but be set as 10 °~30 ° or so.
Relation ＞ between the projection image planes and the plane of exposure of substrate of the pattern of ＜ light shields
Fig. 7 is the projection image planes Sm of the cylindric pattern plane P1 for large showing light shield M and supporting is cylindric base
The explanatory diagram of the relation between the plane of exposure Sp of plate P.Then, reference picture 7, to the light in the exposure device U3 of first embodiment
Relation between the projection image planes and the plane of exposure of substrate of the pattern of cover is illustrated.
Exposure device U3 forms the throwing of the pattern of light shield M by being imaged projected light beam EL2 by projection optical system PL
Image plane Sm.The position that the pattern that image planes Sm is light shield M is imaged is projected, is the position for reaching optimum focusing.In addition it is also possible to
Replace projection image planes Sm using the surface of the position in addition to optimum focusing.For example, it is also possible to be formed at and most preferably gather
The face of the burnt position at a distance of predetermined distance.Herein, it is configured with the curved surface for Rm with radius of curvature as described above on light shield M
(being curve in ZX planes).The projection multiplying power of projection optical system PL such as is set at the multiplying power, thus, as view field
In the range of the exposed width 2A of the size in the circumference of PA, also projection image planes Sm is approx regarded as to prolong in the Y direction
Radius of curvature centered on the center line AX1 ' for stretching is a part for the curved surface of Rm.In addition, as noted previously, as substrate P is justified
The bearing-surface P2 of the substrate supporting cylinder 25 of barrel shape keeps, so it is Rp's that the plane of exposure Sp on the surface of substrate P is radius of curvature
A part for curved surface (being curve in ZX planes).And, if as projection image planes Sm the center of curvature center line AX1 ' with
The central shaft AX2 of substrate supporting cylinder 25 is parallel to each other and is included in the plane KS parallel with YZ planes that then plane KS is located at
The midpoint of exposed width 2A, and, it is tangent with the plane of exposure Sp that radius is Rp positioned at the projection image planes Sm that radius is Rm is included in
Y-direction on extend tangent line Cp in interior position.Additionally, for convenience of description, radius Rp and the projection image planes of plane of exposure Sp
The radius Rm of Sm is set as the relation of Rp ＞ Rm.
Herein, keep the cylinder roller 21 of light shield M to be driven by the first drive division 22 and rotated with angular velocity omega m, support base
The substrate supporting cylinder 25 of plate P (plane of exposure Sp) is driven by the second drive division 26 and is rotated with angular velocity omega p.In addition, will be with plane
KS is orthogonal and face of tangent line Cp comprising projection image planes Sm and plane of exposure Sp is used as datum level HP.It is assumed that datum level HP with
XY faces are parallel, and datum level HP is mobile with imaginary translational speed V (at the uniform velocity) in the X direction.Translational speed V and projection image
Face Sm and plane of exposure Sp translational speed (peripheral speed) in the circumferential are consistent.Exposure area (the projected area of present embodiment
Domain PA) on the direction parallel with datum level HP, using the tangent line Cp of the projection image planes Sm and plane of exposure Sp as center, by width
2A is used as width.That is, exposure area (view field PA) is included on the moving direction of datum level HP, from projection image planes Sm with
Regions of the tangent line Cp of plane of exposure Sp to being moved apart from the position of A to +X direction and -X direction respectively.
Because projection image planes Sm is formed by being rotated with angular velocity omega m on the face of radius of curvature R m, so being located at tangent line
The specified point on projection image planes Sm on Cp only rotates θ m=ω mt after elapsed time t.Therefore, when the sight on datum level HP
When examining, the specified point is located at the point Cp1 only to +X direction movement Xm=RmSin (θ m).On the other hand, when on tangent line Cp
Above-mentioned specified point when being moved linearly with translational speed V along datum level HP, the specified point is located at only to+X after elapsed time t
Move the point Cp0 of Vt in direction.Therefore, when the specified point on tangent line Cp is moved along projection image planes Sm and along datum level
The departure Δ 1 of the amount of movement in the X-direction after elapsed time t when HP moves linearly is Δ 1=Vt-Xm=Vt-
Rm·Sin(θm)。
Similarly, because plane of exposure Sp is formed by being rotated with angular velocity omega p on the face of radius of curvature R p, so working as
When being observed on datum level HP, the specified point on the plane of exposure Sp on tangent line Cp only rotates θ p=ω p after elapsed time t
t.Therefore, the specified point on plane of exposure Sp is located at the point Cp2 only to +X direction movement Xp=RpSin (θ p).Therefore, cutting
The X side after elapsed time t when specified point on line Cp is moved along plane of exposure Sp and when being moved linearly along datum level HP
The departure Δ 2 of upward amount of movement is Δ 2=Vt-Xp=Vt-RpSin (θ p).Above-mentioned departure Δ 1, Δ 2
Projection error referred to as when by the spot projection in barrel surface in plane (datum level HP).As be previously illustrated in Figure 5 that
Sample, in the present embodiment, in the view field PA of the exposed width 2A shown in Fig. 7, the projection image of the pattern of light shield M is with remote
The state of the heart is projected onto plane of exposure Sp.That is, in XZ faces, each point on image planes Sm is projected along the line parallel with plane KS
(line vertical with datum level HP) is projected on plane of exposure Sp.Therefore, the projection image planes corresponding with the point Cp0 on datum level HP
Point Cp1 (position Xm) on Sm is also projected to the position Xm in identical X-direction, the position of point Cp1 on plane of exposure Sp
Deviation is produced between the position Xp of the point Cp2 on Xm and the plane of exposure Sp corresponding with the point Cp0 on datum level HP.The deviation
Main cause is that the radius Rp of the radius Rm and plane of exposure Sp that project image planes Sm is different.
Like this, in the case of radius Rm and radius Rp are differentiated, the point Cp1 on projection image planes Sm shown in Fig. 7
Departure Δ 1 and plane of exposure Sp on point Cp2 departure Δ 2 between difference component Δ (=Δ 1- Δs 2), with exposed width
The position of the X-direction in 2A accordingly gradually changes.Therefore, to because of projection image planes Sm and plane of exposure Sp in exposed width 2A
The difference component Δ of deviation that produces of semidiameter (Rm/Rp) carry out quantification (emulation), thereby, it is possible to set in view of projection exposure
The optimal conditions of exposure of the quality (quality of projection image) of the pattern on light to substrate P.Additionally, difference component Δ is also referred to as inciting somebody to action
Cylindric projection image planes Sm is transferred to projection error when on the plane of exposure Sp of cylindrical shape.
Fig. 8 A are, as an example, the radius Rm for projecting image planes Sm to be set into 125mm, and the radius Rp of plane of exposure Sp is set
Be 200mm, make projection image planes Sm peripheral speed (being set to Vm) it is consistent with the peripheral speed (being set to Vp) of plane of exposure Sp,
It is in the state of translational speed V, in the range of ± the 10mm as exposed width 2A, calculates above-mentioned departure Δ 1, Δ 2
And the curve map of the change of difference component Δ.In fig. 8 a, transverse axis is represented with the center of the view field PA (position that plane KS passes through
Put) used as the coordinate position [mm] on the datum level HP of origin, the longitudinal axis represents departure Δ 1, Δ 2, the difference component Δ for calculating
[μm].As shown in Figure 8 A, it is poor in the case where the peripheral speed Vp of the peripheral speed Vm and plane of exposure Sp of projection image planes Sm is consistent
The absolute value of component Δ is with away from from the position (origin) of projection image planes Sm and plane of exposure Sp tangent tangent line Cp to ± X-direction
And become larger.For example, in order to carry out the loyal transfer of pattern that minimum feature is several μm~10 μm or so and by difference component
The absolute value of Δ is limited in the case of 1 μm or so, and the result of calculation according to Fig. 8 A is, it is necessary to by the exposed width of view field PA
2A is set to ± 6mm (being 12mm on width) below.
If additionally, the peripheral speed of the pattern plane of the light shield M that cylinder roller 21 is kept is set to Vf, according to projection
The projection multiplying power β of optical system PL, the peripheral speed Vm for projecting image planes Sm is set as the relation of Vm=β Vf.If for example, throwing
Shadow multiplying power β be 1.00 (etc. multiplying power), then the peripheral speed Vp of the peripheral speed Vf and plane of exposure Sp of the pattern plane of light shield M is set
For equal, if projection multiplying power β is 2.00 (with 2 times of amplifications), it is set as 2Vf=Vp.Usually, as shown in Figure 8 A, due to
Each peripheral speed for projecting image planes Sm and plane of exposure Sp is set as Vm=Vp, so so that the relation (speed of benchmark of β Vf=Vp
Degree relation) mode set up critically controls the rotation of the substrate supporting cylinder 25 for keeping the cylinder roller 21 of light shield M and supporting substrates P
Tarnsition velocity.But, as shown in Fig. 8 C as be described hereinafter, to the circle of the peripheral speed Vm and plane of exposure Sp of projection image planes Sm
In the case that how the difference of circular velocity Vp imparting very littles changes come the difference component Δ in the analogous diagram 8A that tries, by circumference speed
Degree Vm and peripheral speed Vp assign the difference of very little, can limit the absolute value of difference component Δ to expand energy in the state of very little
Enough exposed width 2A for utilizing.In the present embodiment, radius Rms of the radius Rp based on plane of exposure Sp more than projection image planes Sm
Condition, the peripheral speed Vp of plane of exposure Sp is set to lower relative to the peripheral speed Vm of projection image planes Sm.Specifically, so that
The peripheral speed Vp of plane of exposure Sp is constant and makes the datum level HP's shown in a little higher than Fig. 7 of peripheral speed Vm of projection image planes Sm
The mode of translational speed V, only makes some changes to the angular velocity of rotation ω m for projecting image planes Sm (light shield M) side.After change
Angular speed is set to ω m ', and the anglec of rotation of the projection image planes Sm after elapsed time t is set into θ m '.When trying projection image
The peripheral speed Vm of face Sm is set to be higher by a little only with respect to translational speed V calculate during departure Δ 1, the deviation in Fig. 8 A
The curve for measuring the curve map of Δ 1 is changed in the way of being changed into having negative slope in origin 0.
Therefore, in the present embodiment, using such tendency, with the position in exposed width 2A and across origin 0
The difference component Δ of two symmetrical positions is that zero mode sets the peripheral speed Vm (angular velocity omega m ') of projection image planes Sm.
Fig. 8 B are to represent difference component Δ, departure Δ 1, each calculating of Δ 2 obtained after the peripheral speed Vm for changing projection image planes Sm
The definition of the curve map of result, the longitudinal axis and transverse axis is identical with Fig. 8 A.In the fig. 8b, in the curve map of departure Δ 2 and Fig. 8 A
Curve map is identical, but on+5mm of the curve map of departure Δ 1 in exposed width, each position of -5mm and origin 0, with
Departure Δ 1 is that zero mode sets the angular velocity omega m ' (θ m ') of projection image planes Sm.Its result is that difference component Δ is in exposure
The slope variation of position in width in the range of ± 4mm to bear, on the outside of it in the range of with positive slope variation, exposing
Everybody of origin 0 ,+6.4mm, -6.4mm in optical width is set to zero.
In the case where the scope that be can allow for as difference component Δ is such as ± 1 μm or so, Fig. 8 A's above
Under the conditions of exposed width be ± 6mm, but the exposed width under conditions of Fig. 8 B is expanded to ± 8mm or so.It means that
The size in the scan exposure direction (circumference) of view field PA can be increased to 16mm (about increasing by 33%) from 12mm, if exposure
The illumination of illumination light is identical, then need not reduce the fidelity of pattern transfer, and the transporting velocity of substrate P just is improved into about 33%
To improve productivity.In addition, the size of view field PA increase 33% can be also implied that the light exposure for making imparting substrate P only
Increase this tittle, conditions of exposure can be relaxed.Additionally, exposure device U3 can be while using the rotary encoder point of high de-agglomeration energy
The rotation of the cylinder roller 21 of light shield M and the rotation of the substrate supporting cylinder 25 of supporting substrates P Ce Liang not kept and servo control is carried out
System, the difference of small rotary speed is produced thereby, it is possible to one side, while carrying out high-precision rotation control.
The peripheral speed Vp of plane of exposure Sp is being equal to the translational speed V of datum level HP, the circle of image planes Sm will projected
In the case that circular velocity Vm is set to the translational speed V of a little higher than datum level HP, the difference component Δ shown in Fig. 8 A is as shown in Figure 8 C
Ground change.Fig. 8 C show the tendency in the case of following, i.e. only for the curve map of the difference component Δ in Fig. 8 A, will project
The rate of change of peripheral speed Vps (=V) of the peripheral speed Vm of image planes Sm relative to plane of exposure Sp be set to α (=(Vm-Vp)/
Vp) %, α is changed+0.01% every time from ± 0%.In the curve map and Fig. 8 A of the difference component Δ of α=± 0% in Fig. 8 C
The curve map of difference component Δ is identical.In the case of rate of change α=± 0%, peripheral speed Vm is in consistent with peripheral speed Vp
State, for example, in the case of rate of change α=+ 0.02%, peripheral speed Vm is in bigger than peripheral speed Vp 0.02% shape
State.Based on the calculating as shown in Fig. 8 C, in the fig. 8b, make the peripheral speed Vm of projection image planes Sm relative to datum level HP's
Reference speed V (=Vp) is emulated in the state of increasing about 0.026%.The simulation result of Fig. 8 C be by will to relative to
The θ m of the RmSin (θ m) in the mathematical expression that the departure Δ 1 of the datum level HP of projection image planes Sm is solved replace with (1+
α) θ m and obtained from carrying out various changes to rate of change α.In fact, when the X side that Vt is replaced with expression exposed width
During the A of upward position (mm), difference component Δ can simply be obtained by following formula.
Δ=Δ 1- Δs 2=(A-RmSin ((1+ α) A/Rm))-Δ 2
As described above, in the case where the radius Rp of the radius Rm and plane of exposure Sp of projection image planes Sm is different, by throwing
Each translational speed (peripheral speed Vm, Vp) of image plane Sm and plane of exposure Sp assigns the difference of very little, when can expand scan exposure
Various conditions of exposures (sensitivity of the radius, photosensitive layer of light shield M, the transporting velocity of substrate P, the power of illuminating light source,
Size of view field PA etc.) setting range, can obtain neatly tackling the exposure device of the change of technique etc..
Hereinafter, very little is assigned in each peripheral speed Vm, Vp as shown in Figure 8 B to projection image planes Sm and plane of exposure Sp
In the case of difference, reference picture 9, the contrast for the pattern image obtained on plane of exposure Sp is illustrated.What Fig. 9 was shown below
Curve map：The position (absolute value) of the exposed width that the origin 0 in Fig. 8 A, 7B is set to 0mm is taken on transverse axis, is taken on the longitudinal axis
The value of origin 0 is set to 1.00 (100%) contrast ratio, there is no difference between image planes Sm and plane of exposure Sp is projected
Situation (Fig. 8 A) and under there is difference (Fig. 8 B), calculated corresponding with the position in exposed width
Contrast than change curve map.In the present embodiment, the wavelength X of illuminating bundle EL1 (exposure light) is set to
365nm, 0.0875 is set to by the numerical aperture NA of the projection optical system PL (PLM) shown in Fig. 4, and process constant k is set to
0.6.Because the maximum resolution ratio Rs for obtaining under this condition obtains 2.5 μm according to Rs=k (λ/NA), so in accordance with meter
Calculate and used 2.5 μm L＆S (line ＆ intervals) pattern.
As shown in figure 9, larger by the curvature in the plane of exposure Sp on the projection image planes Sm and substrate P by mask pattern
The peripheral speed Vp of one surface side be set to slightly less than another peripheral speed Vm make to obtain high-contrast than exposed width
Scope expands.For example, being 0.8 or so contrast ratio is needed in order to maintain the quality of the pattern image being transferred on plane of exposure Sp
In the case of, the exposed width under the state (Vm=Vp) without difference is ± 6mm or so, in contrast, in tool
There is the exposed width under the state (Vm ＞ Vp) of difference to be able to ensure that in ± more than 8mm.If in addition, contrast ratio also may be used
Think 0.6 or so, then the exposed width under the state (Vm ＞ Vp) with difference can be expanded to ± 9.5mm or so.
As described above, the difference of very little is assigned by the peripheral speed Vp of peripheral speed Vm and plane of exposure Sp to projection image planes Sm, even if
Sizes (exposed width 2A) of the increase view field PA on scan exposure direction, it is also possible to the pattern image that realization will be projected
Contrast (picture quality) is maintained good pattern exposure.Further, since view field PA can be increased in scan exposure side
Upward exposed width 2A, it is possible to further improving the transporting velocity of substrate P, or reduces every single in view field PA
The illumination of the exposure light (projected light beam EL2) of plane product.
Additionally, as shown in Fig. 8 C above, difference (Vm-Vp) is gradually changed a little on one side, while emulation phase
For the position of exposed width difference component Δ in the case of, preferably by the projection image planes Sm of the pattern in view field PA with
The average value or maximum of the difference component Δ of the skew on scan exposure direction of the plane of exposure Sp in substrate P are set as small
In the minimum feature (minimum dimension) of the pattern image that should be transferred.For example, when the exposure being conceived in the exposed width in Fig. 8 B
In the scope of 0mm~+6mm, the average value of difference component Δ within the range is about -0.42 μm to width, and maximum is about
It is -0.66 μm.In addition, when scope of the exposed width in 0mm~+8mm is conceived to, difference component Δ within the range it is average
Value is about -0.18 μm, and maximum is about+1.2 μm.If the minimum feature of the pattern image that should be transferred is set to before carrying out
2.5 μm set during the emulation of the Fig. 9 in face, the then scope and exposed width for reaching 6mm in exposed width reaches the scope of 8mm
In, the average value of difference component Δ, maximum can be contracted to less than 2.5 μm of minimum feature.
In addition, as shown in Fig. 8 B above, in the variation characteristic of the difference component Δ obtained by emulation, preferably in reality
Exposed width (sizes of the view field PA on scan exposure direction) in the position that difference component Δ is zero is at least set 3
It is individual.For example, in the case of the exposed width that view field PA is set as into ± 8mm, interior during scan exposure, projection to throwing
The position of-the 8mm of a point in the pattern image in the PA of shadow zone domain from exposed width is moved to the position of+8mm.During this period
Interior, a point in pattern image is respectively by position -6.4mm, position 0mm (origin), position+6.4mm that difference component Δ is zero
And be transferred on plane of exposure Sp.In this way, by with least 3 in the exposed width on the scan exposure direction of view field PA
Make the mode that difference component Δ is zero on individual position, critically control keeps cylinder roller 21 and the substrate supporting cylinder 25 of light shield M
Each rotary speed, can will be exposed to size of the pattern image of (plane of exposure Sp) in view field PA on scan exposure direction
(line width) limits of error is obtained smaller such that it is able to carry out the pattern transfer of loyalty.
As previously explained above, numbers of the maximum resolution ratio Rs according to the projection image planes Sm sides of projection optical system PL
It is worth aperture NA, the wavelength X of illuminating bundle EL2, (usual less than 1) is determined process constant k by Rs=k (λ/NA).This
In the case of, when the translational speed of datum level HP is set into V, the displacement of datum level HP is set to x, by the absolute of exposed width
When value is set to A, following relations are preferably met.
[mathematical expression 1]
[mathematical expression 2]
Mathematical expression F (x) is the formula of the difference component Δ of the position x for representing certain point on datum level HP, such as reference
As Fig. 7 is illustrated, the relation of the translational speed V and displacement x of datum level HP is equivalent to time t (=x/V).This implementation
The exposure device U3 of mode, even if increasing the exposed width of effective view field PA, also need not by meeting above-mentioned mathematical expression
The contrast of the pattern image that reduction is projected, can form pattern with good picture quality in substrate P.
In addition, the exposure device U3 of present embodiment can replace the cylinder roller 21 for keeping light shield M.It is being reflection-type
In the case of cylinder light shield, can directly be formed on the outer peripheral face of cylinder roller 21 as the high reflection portion of mask pattern and low
Reflecting part (light absorption department).In this case, light shield replacing is carried out to each cylinder roller 21.Now, make sometimes again
The cylinder light shield installed before being installed on the radius (diameter) of the cylinder roller 21 of the reflection-type cylinder light shield of exposure device and changing
Radius it is different.This is in the case where the size (size of display panel etc.) of the device that be exposed in substrate P is changed
Etc. what may be occurred.In the present embodiment, though in this case, the mask pattern based on the cylinder roller 21 after replacing
The radius in face, carries out the calculating (emulation) such as Fig. 8 A~7C, Fig. 9, thereby, it is possible in advance determine should be to cylinder roller 21 and base
The angular velocity of rotation of the plate supporting setting of cylinder 25 is poor, the view field PA that should set exposed width, the illumination light that should adjust
The parameters such as the transporting velocity (rotary speed of substrate supporting cylinder 25) of the illumination of beam EL2 or the substrate P that should be adjusted.Additionally,
In the case where the radius Rm multiple cylinder rollers 21 different with such as millimeter unit or centimetre unit are replaceably mounted, if
The mechanism that the bearing portion for having the exposure device side of Pivot axle AX1 in z-direction to supporting cylinder roller 21 is adjusted.
In addition, in the parameter as adjustment, and in the case of changing the exposed width on the scan exposure direction of view field PA, can
It is adjusted using the illuminated field diaphragm 55 or the field stop 63 of intermediate image plane P7 in such as Fig. 4.As described above, exposure
Device U3 (substrate board treatment) accordingly can suitably adjust conditions of exposure by adjusting above-mentioned various parameters with light shield M,
Thus allow for adapting to the exposure of light shield M.
Exposure device U3 is preferably based on according to by the conditional of the relationship specifications between projection image planes Sm and plane of exposure Sp
The value that calculates, the value for also being calculated based on the measurement result such as flexible with reference to the substrate P in manufacturing process are adjusted
The translational speed and the scan exposure of view field PA of the substrate P kept based on substrate holding mechanism 12 (substrate supporting cylinder 25)
At least one of the width in direction.Thus, exposure device U3 can automatically adjust various conditions.
Width of the exposure device U3 of present embodiment in the whole area of the pattern of the display panel being formed in substrate P etc.
On the premise of size on the axle AX2 directions of size on direction more than view field PA, with projection optical system PL's
The mode that view field PA is arranged as shown in the right part of Fig. 3 is provided with the projection optical system PL1~PL6 of 6, but according to substrate
The width of P, the quantity can be one, or more than 7.
Preferably, in the case where multiple projection optical system PL are arranged on the width of substrate P, exposed in scanning
The light exposure that light time is accumulated by the exposed width of each view field PA is in the direction (base orthogonal with scan exposure direction
The width of plate P) on it is anywhere all substantially certain (such as within ± several %).
[second embodiment]
Hereinafter, reference picture 10, the exposure device U3a to second embodiment is illustrated.Additionally, in order to avoid repetition
Record, illustrated only for the part different from first embodiment, for the inscape same with first embodiment
Mark pays first embodiment identical reference to illustrate.Figure 10 is the exposure device for showing second embodiment
The integrally-built figure of (substrate board treatment).The exposure device U3 of first embodiment is using cylindric substrate supporting cylinder
25 keep the structure of substrate P passed through from view field, but the exposure device U3a of second embodiment is using removable
Base supporting mechanism 12a keep the structure of flat substrate P.
In the exposure device U3a of second embodiment, base supporting mechanism 12a is plane with substrate P is remained
Substrate objective table 102 and substrate objective table 102 (XY faces) in the plane orthogonal with median plane CL is swept along the X direction
Retouch mobile mobile device (omitting diagram).
Because the bearing-surface P2 of the substrate P of Figure 10 is substantially the plane parallel with XY faces, so being incorporated to by light shield M reflection
The projected light beam EL2 for being incident upon projection optics module PLM (PL1~PL6) is set as, when substrate P is projeced into, projected light beam EL2
Chief ray it is vertical with XY faces.
In addition, in this second embodiment also in the same manner as Fig. 2 above, when being observed in XZ faces, from light shield M
Girth of the central point of illumination region IR1 (and IR3, IR5) to the central point of illumination region IR2 (and IR4, IR6)
It is set as, the central point with the view field PA1 (and PA3, PA5) from the substrate P for copying bearing-surface P2 is projected to second
Girth untill the central point of region PA2 (and PA4, PA6) is substantially equal.
In the exposure device U3a of Figure 10, the mobile device of the also control base board supporting device 12 of slave control device 16 (is swept
Retouch the linear motor of exposure or the actuator of fine motion etc.), the rotation with cylinder roller 21 synchronously drives substrate loading
Platform 102.Additionally, substrate P in the present embodiment can be the flexible base boards such as resin film, or liquid crystal display panel
Glass plate.And, in the case where the precision by substrate objective table 102 is mobile to implement scan exposure, it is provided with base
Plate P vacuum suctions are in construction (such as plane keeper of chuck pin (pin chuck) mode, Porous mode of bearing-surface P2
Deng).In addition, in the case of being only plane by substrate P supporting in not moving substrate objective table 102, being provided with bearing-surface P2
It is upper using based on air bearing gas blanket with low friction state or contactless state come the mechanism (such as primary of supporting substrates P
Exert plane keeper of sharp sucker (Bernoulli chuck) mode etc.), kept for assigning the tension force of regulation to substrate P
The tension force imparting mechanism of flatness.
Hereinafter, reference picture 11, to the projection image planes Sm of the pattern of the light shield M in the exposure device U3a of second embodiment
Movement and substrate P plane of exposure Sp movement between relation illustrate.Figure 11 is based on the bar same with Fig. 7 above
Part and definition, large show light shield M pattern projection image planes Sm and substrate P on plane of exposure Sp between relation explanation
Figure.
Exposure device U3a forms the projection of the pattern of the light shield M of cylinder planar using the projection optical system PL of telecentricity
Image planes Sm.Projection image planes Sm is also the optimum focusing face of the pattern imaging of light shield M.Herein also due to the pattern plane of light shield M is formed
It is that radius of curvature is the curved surface of Rm, so projection image planes Sm also turns into radius of curvature centered on imaginary line AX1 ' as Rm
A part for barrel surface (being circular curve in ZX planes).On the other hand, because substrate P is remained by substrate objective table 102
Plane, so plane of exposure Sp is plane (being straight line in ZX planes).Therefore, the plane of exposure Sp in present embodiment be with above
Fig. 7 shown in the consistent surfaces of datum level HP.That is, plane of exposure Sp is considered as the surface of radius of curvature R p infinities (∞),
Or, relative to the great curved surfaces of radius Rm of projection image planes Sm.
Because projection image planes Sm is formed by radius of curvature to be rotated with angular velocity omega m on the face of Rm, so projection image planes
Point Cp on Sm and plane of exposure Sp tangent projection image planes Sm is located at after elapsed time t and only have rotated angle, θ m=ω mt's
Point Cp1.Therefore, position Xms of the point Cp1 on projection image planes Sm on the direction (X-direction) along datum level HP is changed into Xm=
Rm·Sin(θm).Further, since plane of exposure Sp is the plane consistent with datum level HP, so projection image planes Sm and plane of exposure Sp
Point Cp on tangent plane of exposure Sp is located on only in an X direction the point Cp0 for moving Xp=Vt after elapsed time t.Therefore,
As using Fig. 7 explanations above, the point on the point Cp1 and plane of exposure Sp on projection image planes Sm after elapsed time t
Departure Δs 1 of the Cp0 in X-direction (scan exposure direction) is Δ 1=Vt-RmSin (θ m).
The departure Δ 1 of Figure 11 is substrate P or exposure so that CAV is moved because of light shield M or projection image planes Sm
Projection error (Sin errors) produced by the Sp uniform rectilinear's movements of face.If when point Cp is located at as the center in exposed width 2A
Plane KS on when, the departure Δ 1 is set to zero, then the departure Δ 1 with from the position to ± X-direction away from and by
It is cumulative big.When scan exposure, in the range of the exposed width 2A on plane of exposure Sp in substrate P, to projection image planes Sm's
Pattern image is continuously added up and is transferred.But, because the projection error by departure Δ 1 is influenceed so that be transferred
The size on scan exposure direction of pattern image has error relative to the size of the pattern on light shield M, under transfer fidelity
Drop.
Therefore, in the present embodiment, by image planes Sm and plane of exposure Sp is projected, by the less side of radius of curvature
Surface peripheral speed be set to the larger side of a little higher than radius of curvature surface peripheral speed, can obtain with above
The same effect of first embodiment.In the present embodiment, due to the radius of curvature R p and projection image planes Sm of plane of exposure Sp
Radius of curvature R m there is the relation of Rp ＞ ＞ Rm, so compared with the translational speed V of plane of exposure Sp, relatively slightly improving projection
The peripheral speed Vm of image planes Sm.
Hereinafter, using Figure 12~Figure 18, the example that various emulation are performed to the structure using exposure device U3a enters
Row explanation.Figure 12 is the circumference for showing the translational speed V (identical with peripheral speed Vp) based on plane of exposure Sp and projection image planes Sm
The curve map of the change that speed Vm has indifference and produces departure Δ 1, the longitudinal axis of Figure 12 represents the departure Δ in Figure 11
1, transverse axis represents exposed width in the same manner as Fig. 8 A, 7B.Additionally, in each emulation after Figure 12, being by the radius Rm of light shield M
The radius Rm for projecting image planes Sm is set to 150mm.As being illustrated in Figure 11, make the translational speed V (circles of plane of exposure Sp
Circular velocity Vp) equal in the case of the peripheral speed Vm for projecting image planes Sm, i.e., in the case of no difference, when by partially
When the allowed band of residual quantity Δ 1 is set to ± 1 μm or so, exposed width is the scope of ± 5mm or so.
Therefore, if the angular speed for projecting image planes Sm is adjusted into ω m ' (ω m ＜ ω m ') from ω m, make projection image planes Sm's
Translational speed V (peripheral speed Vp) of a little higher than plane of exposure Sp of peripheral speed Vm, then departure Δ 1 ' is centered on origin 0
Slope variation in the range of exposed width ± 4mm to bear, with positive slope variation on the outside of the scope.If by departure Δ 1 '
Be zero exposed width on position be arranged at the place of ± 6.7mm or so, then the allowed band of departure Δ 1 ' converges on ± 1
μm or so exposed width be ± 8mm or so scope.Compared with the situation for not assigning difference, this is possible to as sweeping
Retouch the exposed width expansion 60% or so that exposure is used.
Hereinafter, in the same manner as Fig. 9 above, for making the translational speed V (=peripheral speed Vp) of plane of exposure Sp with projection
The peripheral speed Vm of image planes Sm consistent situation (without difference) and assign the situation of small difference and (there is peripheral speed
Difference) under the change of contrast value (or contrast ratio) of pattern image illustrate.
Figure 13 A show to work as and the numerical aperture NA of the plane of exposure Sp sides of projection optical system PL are set into 0.0875, will be illuminated
When the wavelength of light beam EL1 is set to 365nm, process constant is set to 0.6 and illumination σ is set into 0.7, on it will be formed in light shield M
Rs=2.5 μm of ultimate resolution L＆S patterns projected in the case of the contrast of picture that is obtained on plane of exposure Sp.Figure
13B represents that isolated line (ISO) pattern for Rs=2.5 μm of the ultimate resolution obtained under the conditions of by same projection is projected
In the case of the contrast of picture that is obtained on plane of exposure Sp.
Either 2.5 μm of L＆S patterns or ISO patterns, reaches the contrast value of bright part of picture close to 1.0 and dark portion
Tap nearly 0 intensity distribution CN1 preferably.Contrast value is the maximum Imax and the light of dark-part using the luminous intensity of bright part
The minimum value Imin of intensity, obtains according to (Imax-Imin)/(Imax+Imin).Intensity distribution CN1 is generally in right
The state higher than degree, the low state of contrast refers to that the difference of maximum Imax and minimum value Imin as intensity distribution CN2 (is shaken
Width) situation about diminishing.The intensity distribution CN1 of the picture shown in Figure 13 A, 12B is 2.5 μm of L＆S pattern or ISO patterns
The contrast of static projection image, but in the case of scan exposure, moved on the whole exposed width of setting in substrate P
In a period of, such as while the change according to the difference component Δ or departure Δ 1 illustrated in fig. 12 that are illustrated in Fig. 8 B makes
Static intensity distribution CN1 offsets up in scan exposure side, while the value being accumulated by, as the figure being transferred in substrate P
The final contrast of case picture.
Hereinafter, the simulation result being shown below in Figure 14, Figure 15, i.e. the projection exposure bar illustrated in Figure 13 A, 12B
Under part (Rm=150mm, Rp=∞, NA=0.0875, λ=365nm, k=0.6), the throwing to the L＆S patterns relative to 2.5 μm
The result that the change of the contrast value (contrast ratio) of the position on exposed width of image is emulated.Figure 14, Figure 15
Transverse axis represent positive side exposed width A position, the longitudinal axis represents the contrast that utilization (Imax-Imin)/(Imax+Imin) is obtained
Angle value and the contrast value at by exposed width 0mm are standardized as the contrast ratio in the case of 1.0.And, Figure 14 shows
Make the translational speed V (=peripheral speed Vp) of plane of exposure Sp consistent with the peripheral speed Vm of projection image planes Sm without peripheral speed
Contrast change in the case of difference, Figure 15 shows as the variation characteristic of the departure Δ 1 ' in Figure 12, to project image planes Sm
Peripheral speed Vm slightly larger than plane of exposure Sp translational speed V (=peripheral speed Vp) with difference in the case of
Contrast changes.
As shown in figure 14, in the case of without difference (before amendment), although contrast ratio is in the position of exposed width
Substantially certain putting from origin 0 to 4mm or so, but since the position of more than 5mm drastically decline.And, exposure
In the case of more than 8mm, contrast ratio is changed into less than 0.4 for the position of width, and the exposure to photoresist may become right
It is more not enough than degree.Additionally, in simulations, in the position of exposed width for the contrast value at 0mm is about 0.934, contrast ratio
It is that the value is standardized as 1.0 expressions.
In contrast, in the case where there is difference (after amendment) as shown in figure 15, in the position of exposed width
For between 0~4mm, contrast ratio gradually decreases down 0.8 or so from 1.0, but between the position of exposed width is 4mm~8mm,
Contrast ratio maintains 0.8 or so.In simulations, it is the contrast ratio about 0.77 at 5mm in the position of exposed width,
Position is the contrast ratio about 0.82 at 7mm.
Like this, by making the peripheral speed Vm of projection image planes Sm slightly larger than the translational speed V of plane plane of exposure Sp
(=peripheral speed Vp), the exposed width 2A of the view field PA that can be set in scan exposure can be increased.
In addition, as shown in figure 16,2.5 μm in the case of without difference (before amendment) of ISO patterns as
Contrast than to the position of exposed width be 5mm be all substantially certain, but begun slowly to down from more than 5mm
Drop, is set to 0.9 is about 6mm in place, and about 0.6 is set to 8mm in place, is set at 9mm about 0.5 in place, and
In place being set to is about 0.4 at 10mm.Additionally, the contrast in Figure 16 is than being to be with the position of exposed width in fig. 14
On the basis of the contrast value (about 0.934) of the picture of the L＆S patterns of 2.5 μm obtained at 0mm, take and schemed using 2.5 μm of ISO
The ratio of the contrast value (set to 0 0.968 is about at mm in place) that the picture of case is obtained.Therefore, the contrast shown in Figure 16 than just
Initial value (being set to the value at 0mm in place) is about 1.04.
In contrast, in the case where there is difference (after amendment) as shown in figure 17, in the position of exposed width
In the range of 0~8mm, the contrast ratio of the picture of 2.5 μm of ISO patterns maintains more than 0.9, is set in place at 9mm and declines
To 0.8 or so, but even if in place being set at 10mm is also maintained at about 0.67.As described above, by making projection image planes Sm's
The relative translational speed V (=peripheral speed Vp) slightly larger than plane plane of exposure Sp of peripheral speed Vm, can increase in scanning
The exposed width 2A of the view field PA that can be set during exposure.
Additionally, also following evaluation assessment, i.e. to the peripheral speed of the peripheral speed Vm and plane of exposure Sp of projection image planes Sm
Small difference is assigned between Vp (or translational velocity V), is obtained such as the deviation in the difference component Δ or Figure 12 in Fig. 8 B
The characteristic of Δ 1 ' is measured, for the scope of clearly optimal exposed width 2A (or A), and difference component Δ or departure Δ is utilized
Relation between 1 ' and resolution ratio Rs.Hereinafter, the method is illustrated, but to put it more simply, sometimes by the difference in Fig. 8 B
Departure Δ 1 ' in amount Δ or Figure 12 is referred to as image displacement amount Δ.
In the evaluation assessment, calculate the average value/Rs's of image displacement amount Δ for each position on exposed width
Relation or image displacement amount Δ2Average value/Rs relation.Therefore, based on Figure 18, Figure 19, illustrate with the flat of image displacement amount Δ
Average/Rs is used as evaluation of estimate Q1, the example emulated using the average value/Rs of image displacement amount Δ 2 as evaluation of estimate Q2.Figure 18
Curve map with the departure Δ 1 ' shown in Figure 12 above is identical, but the exposed width that will be calculated is set to the model of ± 12mm
Enclose.In addition, it is interval to calculate sampled point on the exposed width of departure Δ 1 ' (image displacement amount Δ) same with Figure 12
0.5mm。
The average value of image displacement amount Δ is to each to what is obtained the sampled point having in mind in the origin 0mm from exposed width
The absolute value of departure Δ 1 ' carries out what arithmetic average was obtained.For example, position is the flat of the image displacement amount Δ of the sampled point of -10mm
Average is that will to be in place set to 0mm~position be the deviation that each sampled point (the being in figure 18 21 points) place between -10mm obtains
The absolute value for measuring Δ 1 ' is added, then will add up what the value for obtaining was obtained divided by sampled point quantity.In the case of Figure 18, in place
The additive value for being set to the absolute value of the departure Δ 1 ' of each sample point of 0mm~-10mm is 20.86 μm, then divided by sampled point
The average value that number 21 is obtained is about 0.99 μm.In addition, NA=0.0875, λ=368nm, process constant k=0.5 are set herein,
So as to the resolution ratio Rs in emulation is set into 2.09 μm.Therefore, it is the evaluation of estimate Q1 (nothings at -10mm in the position of exposed width
Unit) it is about 0.48.If each position (sampled point) in exposed width is calculated as described above, evaluation of estimate is understood
The dynamic trend of Q1.
In addition, (image displacement amount Δ)2Average value be to by the origin 0mm from exposed width to concern sampled point it
Between the absolute value of each departure Δ 1 ' that obtains carry out the value after square operation (μm2) carry out what arithmetic average was obtained.In Figure 18
In the case of, for example, position is added again for the absolute value of the departure Δ 1 ' of each sampled point of 0mm~-10mm is squared
To value be 42.47 μm2, then it is about 2.02 μm divided by the average value that sampling number 21 is obtained2.Due to by the resolution in emulation
Rate Rs is set to 2.09 μm, so being that evaluation of estimate Q2 at -10mm is about 0.97 μm in the position of exposed width.If wide in exposure
Each position (sampled point) in degree is calculated as described above, then understand the dynamic trend of evaluation of estimate Q2 (μm).
Figure 19 is that evaluation of estimate Q1, Q2 obtained through the above way is taken on the longitudinal axis, and the position of exposed width is taken on transverse axis
The curve map put.Evaluation of estimate Q1 (average value/resolution ratio Rs of image displacement amount Δ) puts down as exposed width (absolute value) becomes big
Change slowly, be about changed into substantially 1.0 in the position of ± 12mm of exposed width.This means the image position in the position of ± 12mm
The average value of shifting amount Δ is substantially uniform with resolution ratio Rs.On the other hand, evaluation of estimate Q2 (image displacement amount Δs2Average value/resolution ratio
Rs) it is changed with the tendency equal with evaluation of estimate Q1 in the range of untill the position of exposed width is at ± 8mm,
It is increased dramatically during more than 8mm, is substantially to be changed into 1 (μm) at ± 10mm in the position of exposed width.
Herein, in the contrast of the L＆S patterns shown in the contrast change of the ISO patterns shown in Figure 17 above or Figure 15
Degree change in, contrast than since exposed width more than 8mm place significantly decline.That is obtained in Figure 15, Figure 17 is right
Than degree than change be that resolution ratio Rs is set to 2.5 μm of situation, although be not the contrast calculated using Rs=2.09 μm
The change of ratio, but tendency is substantially the same.Like this, can by the evaluation assessment using evaluation of estimate Q1 or Q2 as index,
To determine to reflect the optimal exposed width that contrast changes.
Additionally, in this case, because plane of exposure Sp and datum level HP are abreast in the X direction with movement
Speed V (peripheral speed Vp) is mobile, so mathematical expression F (x) used in first embodiment above is replaced with as following
Mathematical expression F ' (X).
[mathematical expression 3]
The exposure device U3a of the second embodiment shown in Figure 10 is implemented by the way that formula F ' (X) is applied into above-mentioned first
In the mathematical expression of mode, and meet the relation, the effect same with first embodiment can be obtained.
[the 3rd implementation method]
Hereinafter, the exposure device U3b of 20 pairs of the 3rd implementation methods of reference picture is illustrated.Additionally, in order to avoid repetition
Record, illustrated only for the part different from first, second implementation method, for same with first, second implementation method
Inscape mark illustrated with first, second implementation method identical reference.Figure 20 is to show the 3rd embodiment party
The integrally-built figure of the exposure device (substrate board treatment) of formula.The exposure device U3 of first embodiment is using by light
Cover M pattern plane reflection light as the reflection-type light shield of projected light beam structure, the exposure device U3b of the 3rd implementation method is
Use the structure using the light of the pattern plane through light shield as the transmission-type light shield of projected light beam.
In the exposure device U3b of the 3rd implementation method, light shield maintaining body 11a has the cylinder roller for keeping light shield M
(light shield holding cylinder) 21a, the deflector roll 93 of supporting cylinder roller 21a, driven roller 94, the drive division 96 for driving cylinder roller 21a.
Cylinder roller 21a forms the light cover of the illumination region IR being configured with light shield MA.In the present embodiment, light shield
Bread containing the face that line segment (bus) is obtained around parallel with line segment axle (central shaft of drum) rotation (hereinafter referred to as
Barrel surface).Barrel surface is, for example, outer peripheral face of the outer peripheral face of cylinder, cylinder etc..Cylinder roller 21a is by such as glass or quartz
Deng constituting, in the cylindrical shape with certain thickness, its outer peripheral face (barrel surface) forms light cover.I.e., in the present embodiment,
Illumination region on light shield MA bends to the cylinder planar with radius of curvature R m from center line.In cylinder roller 21a from light
With the part of the pattern registration of light shield M when the radial direction of cover holding cylinder 21a is observed, such as cylinder roller 21a is in Y direction except two
Middle body beyond side, has translucency relative to illuminating bundle EL1.
Light shield MA is made into the very thin glass plate (such as 100~500 μm of thickness) for example in the good strip of flatness
A surface on using the plane sheet material light shield for foring by light shield layers such as chromium the transmission-type of pattern, it is copied cylinder
The outer peripheral face of roller 21a bends, and is used with winding (laminating) in the state of the outer peripheral face.Light shield MA have be unpatterned
Non- pattern forming region, cylinder roller 21a is installed in non-pattern forming region.Light shield MA can be from cylinder roller 21a
Depart from.The light shield M of light shield MA and first embodiment is it is equally possible that substitution is wound in the circle being made up of transparent cylinder mother metal
Cylinder roller 21a, and the outer peripheral face in the cylinder roller 21a being made up of transparent cylinder mother metal directly draws shape using light shield layers such as chromium
Come integrated into mask pattern.In this case, cylinder roller 21a can also realize the work(of the holding member of mask pattern
Energy.
Deflector roll 93 and driven roller 94 extend along the Y direction parallel with the central shaft of cylinder roller 21a.Deflector roll 93 with
And driven roller 94 is arranged to be rotated around the axle parallel with central shaft.Deflector roll 93 and driven roller 94 are arranged to not rolled with cylinder
The light shield MA that cylinder 21a is kept is contacted.Driven roller 94 is connected with drive division 96.Driven roller 94 is by will supply from drive division 96
Torque conducts to cylinder roller 21a to make cylinder roller 21a be rotated around central shaft.
The lighting device 13a of present embodiment has light source (omitting diagram) and lamp optical system ILa.Light optics
System ILa has and each multiple for accordingly arranging in the Y-axis direction in multiple projection optical system PL1~PL6
(such as 6) lamp optical system ILa1~ILa6.Light source can use various in the same manner as above-mentioned various lighting device 13a
Light source.The Illumination Distribution of the illumination light projected from light source is homogenized, for example, distributed to multiple via light conducting members such as optical fiber and shone
Bright optical system ILa1~ILa6.
Multiple lamp optical system ILa1~ILa6 have respectively multiple optical components of lens etc., integrated optics system,
Lens pillar, fly's-eye lens etc., using the illuminating bundle EL1 irradiation illumination regions IR of uniform Illumination Distribution.In this embodiment party
In formula, multiple lamp optical system ILa1~ILa6 are configured at the inner side of cylinder roller 21a.Multiple lamp optical system ILa1~
ILa6 passes through cylinder roller 21a from the inner side of cylinder roller 21a respectively, to the light shield that the outer peripheral face of cylinder roller 21a is kept
Each illumination region irradiation on MA.
The light that lighting device 13a guiding is projected by lamp optical system ILa1~ILa6 from light source, the illumination light that will be guided
Beam is from cylinder roller 21a internal irradiations to light shield MA.Lighting device 13a is irradiated with uniform brightness using illuminating bundle EL1 and justified
The part (illumination region IR) for the light shield M that cylinder roller 21a is kept.Additionally, light source can be configured at the interior of cylinder roller 21a
Side, it is also possible to be configured at the outside of cylinder roller 21a.In addition, light source can also be other devices separated with exposure device EX
(external device (ED)).
Exposure device U3b in the case where transmission-type light shield is used as light shield, also in the same manner as exposure device U3, U3a,
The translational speed (peripheral speed Vm) of (amendment) projection image planes Sm is adjusted by the same manner as second embodiment above and is exposed
Relation between the translational speed (V or peripheral speed Vp) of smooth surface Sp, can expand the available exposure in scan exposure
Width.
[the 4th implementation method]
Hereinafter, the exposure device U3c of 21 pairs of the 4th implementation methods of reference picture is illustrated.Additionally, in order to avoid repetition
Record, illustrated only for the part different from previous each implementation method, for same with previous each implementation method
Inscape marks identical reference to illustrate.Figure 21 is the exposure device for showing the 4th implementation method (at substrate
Reason device) integrally-built figure.Exposure device U3, U3a, U3b of previous each implementation method are to use rotatable circle
The structure of the cylindric light shield M that cylinder roller 21 (or 21a) is kept.Set in the exposure device U3c of the 4th implementation method
Have light shield maintaining body 11b, light shield maintaining body 11b have remain flat reflection-type light shield MB and work as scan exposure
When the light shield objective table 110 that is moved in the X direction along XY faces.
In the exposure device U3c of the 4th implementation method, light shield maintaining body 11b has the flat reflection type optical of holding
Cover the light shield objective table 110 of MB, make the scanning movement along the X direction in the plane orthogonal with median plane CL of light shield objective table 110
Mobile device (omit diagram).
Because the light cover P1 of the light shield MB of Figure 21 is substantially the plane parallel with XY faces, so reflected from light shield MB
The chief ray of projected light beam EL2 is vertical with XY faces.Therefore, from the illumination of each illumination region IR1~IR6 on irradiation light shield MB
The chief ray of the illuminating bundle EL1 of optical system IL1~IL6 is also configured as vertical with XY faces via polarising beam splitter PBS.
In addition, in the case where the chief ray of the projected light beam EL2 reflected from light shield MB is vertical with XY faces, projection optics mould
The angle of the first reflecting surface P3 of the first deflecting member 70 that first optical system 61 of group PLM has is set to, to carrying out self-bias
The projected light beam EL2 of beam splitter PBS of shaking is reflected, and makes the projected light beam EL2 after reflection incident through the first lens group 71
To the angle of the first concave mirror 72.Specifically, the first reflecting surface P3 of the first deflecting member 70 is set to substantially with second
Optical axis BX2 (XY faces) is at 45 °.
In addition, in the 4th implementation method, in the same manner as Fig. 2 above, when being observed in XZ faces, from light shield MB
X-direction of the central point of illumination region IR1 (and IR3, IR5) to the central point of illumination region IR2 (and IR4, IR6)
On air line distance be set as, with from copy substrate supporting cylinder 25 bearing-surface P2 substrate P on view field PA1 (and
PA3, PA5) central point to the central point of the second view field PA2 (and PA4, PA6) week over long distances substantially
It is equal.
In the exposure device U3c of Figure 21, slave control device 16 also controls the mobile device of light shield maintaining body 11 (to sweep
Retouch linear motor, actuator of fine motion of exposure etc.), light shield loading is synchronously driven with the rotation with substrate supporting cylinder 25
Platform 110.In the exposure device U3c of Figure 21, in the +X direction synchronizing moving to light shield MB and after carrying out scan exposure, it is necessary to
Enter to exercise the action (backrush) that light shield MB is back to the initial position of -X direction.Therefore, substrate supporting cylinder 25 is made with regulation speed
The continuous rotation of degree in the case that at the uniform velocity (peripheral speed Vp) constantly transports substrate P, the phase of rolling back action to be carried out in light shield MB
Between, pattern exposure is carried out not in substrate P, but panel figure dispersedly (discretely) is formed on the carrying direction of substrate P
Case.But, in actual applications, due to speed (peripheral speed Vp) and light shield by assuming the substrate P when scan exposure
The speed of MB is 50~100mm/s, if so driving light with the maximum speed of such as 500~1000mm/s when light shield MB backrush
Cover objective table 110, then can reduce the blank on direction is carried between the panel pattern being formed in substrate P.
Then, the projection image planes Sm and base of 22 pairs of patterns of the light shield of the exposure device U3c of the 4th implementation method of reference picture
The relation between plane of exposure Sp on plate P is illustrated.Figure 22 specifies movement and the substrate P of the projection image planes Sm of the pattern of light shield
Plane of exposure Sp movement between relation, equivalent to by projection image planes Sm illustrated in fig. 11 above and plane of exposure Sp it
Between relation situation in turn.I.e., in fig. 22, will be formed in the projection image planes Sm's of plane (radius of curvature is infinitely great)
Pattern image is transferred on the plane of exposure Sp of radius of curvature R p.
Herein, because light shield M is plane, so projection image planes Sm (optimum focusing face) is also plane.Therefore, Tu22Zhong
Projection image planes Sm equivalent to the datum level HP moved with the speed V that is shown in Fig. 7 above.On the other hand, in substrate P
Plane of exposure Sp is that radius of curvature is the barrel surface (being circular arc in ZX planes) of Rp in the same manner as being shown in Fig. 7 above.
In the present embodiment, if the angular speed of substrate holding cylinder 25 (plane of exposure Sp) is set into ω p, also with Fig. 7
Similarly, projection image planes Sm and plane of exposure Sp is tangent in the position of plane KS, using Xp=RpSin (ω pt), obtains this
Point of contact Cp is the position Xp in the X direction of point Cp2 moved to after the plane of exposure Sp elapsed time t of Rp along radius.Herein,
ω pt are the anglec of rotation θ p on plane of exposure Sp from origin after elapsed time t with point of contact Cp as origin.Phase therewith
It is right, represent the point of contact Cp of projection image planes Sm and plane of exposure Sp along flat projection image using Xm=Vt (wherein, V=Vm)
The position Xm of the point Cp0 that face Sm is moved to from after origin elapsed time t, therefore, in the same manner as each implementation method above, throwing
Projection error (departure or image displacement amount) is produced between image plane Sm and plane of exposure Sp.
If the projection error (departure or image displacement amount) is set into departure Δ 2, obtained using Δ 2=Xm-Xp
Departure Δ 2, obtains Δ 2=Vt-RpSin (θ p).The song of the departure Δ 2 in the characteristic and Fig. 8 A of the departure Δ 2
Line chart is identical, by the small difference of the peripheral speed Vp impartings of the translational speed V and plane of exposure Sp to projection image planes Sm, and above
Each implementation method similarly, the exposed width of the available view field PA in scan exposure can be expanded.For this reason, it may be necessary to
Make the speed (peripheral speed) on the surface of the small side of the radius of curvature in projection image planes Sm and plane of exposure Sp relatively slightly larger.At this
In implementation method, speed Vf during by the scan exposure of light shield MB is set to the benchmark speed for slightly smaller than being determined based on projection multiplying power β
Degree V, to cause that peripheral speed Vp small such as Fig. 8 C of speed V (peripheral speed Vm) of projection image face Sm only than plane of exposure Sp passes the imperial examinations at the provincial level
Rate of change α for exemplifying or so.
Herein, in the case of the exposure device U3c of present embodiment, the mathematical expression of the F (x) of first embodiment is replaced
It is changed to the mathematical expression of following F ' (X).
[mathematical expression 4]
Herein, exposure device U3c is by the way that formula F ' (X) to be applied to the mathematical expression of first embodiment above, and expires
The sufficient relation, can obtain the effect same with the respective embodiments described above.
Additionally, being protected using curved surface in the light shield maintaining body and base supporting mechanism of the exposure device of present embodiment
The side for holding is the first supporting member, and the side supported using curved surface or plane is the second supporting member.
More than, cylindric or plane light shield M is used in each implementation method, but even be based on CAD numbers
According to controlling DMD (digital mirror device) or SLM (spatial optical modulation element) etc., will corresponding with pattern light distribution via
Projection optical system (microlens array can also be included) be projected on plane of exposure Sp without light shield Exposure mode, it is also possible to obtain
Same effect.
In addition, in each implementation method, projection image planes Sm and the radius of curvature of the plane of exposure Sp of substrate P to pattern are carried out
Compare, by scan exposure, relatively somewhat increasing the peripheral speed of the small side of the radius of curvature in face Sm and face Sp,
Or the peripheral speed (or translational velocity) of the big side of radius of curvature relatively somewhat in reduction face Sm and face Sp,
The available exposed width in scan exposure can be expanded.By the small of relative peripheral speed (or translational velocity)
Difference which kind of degree be set to, be that can be changed according to image displacement amount Δ (difference component Δ, departure Δ 1, Δ 2) and resolution ratio Rs
's.For example, in using the evaluation assessment of evaluation of estimate Q1, Q2 of Figure 19 above, resolution ratio Rs is set to 2.09 μm, but this be by
The numerical aperture NA of projection optical system PL, exposure wavelength lambda, process constant k and determine.Actually it is exposed in substrate P
The minimum dimension (line width) of pattern is that the pattern being formed from light shield M is determined with projection multiplying power β.Assuming that should formed
In the pattern of the display panel in substrate P, as long as the actual size (actual linewidth) of minimum is 5 μm, as long as then will
The value of the actual linewidth obtains difference (the rate of change α in the range of the image displacement amount Δ for allowing as resolution ratio Rs
Deng).That is, according to structure (NA, λ) the resolution ratio Rs for determining or the pattern that should be transferred in substrate P by exposure device
Minimum dimension determine the rate of change α of the difference for expanding exposed width.
More than, by using the exposure device shown in each implementation method, implement scanning exposure method as described below.
That is, will be formed in bending to the pattern in face of cylindric light shield (M, MB) via projection optics with the radius of curvature for specifying
System PL (PLM) is projected to the surface (plane of exposure Sp) for being supported to cylindric or plane flexible base board P, and on one side
Light shield M is set to be moved with the speed that specifies along a face of bending, while making substrate P along being supported to cylindric or plane
The surface (Sp) of the substrate of shape is moved with the speed for specifying, so as to the projection of the pattern based on projection optical system on substrate
As being scanned exposure, when the scan exposure is carried out, if the projection image of the pattern based on projection optical system is most preferably being gathered
The radius of curvature of the projection image planes Sm formed under coke-like state is set to Rm (also comprising the situation of Rm=∞), will be supported to cylindrical shape
Or the radius of curvature of surface (plane of exposure) Sp of plane substrate P is set to Rp (also comprising the situation of Rp=∞), will pass through
The movement of light shield (M, MB) and be set to Vm along the translational speed of the mobile pattern image of projection image planes (Sm), by along substrate P
When the speed of the regulation of surface (plane of exposure) Sp is set to Vp, then it is set as Vm ＞ Vp in the case of Rm ＜ Rp, Rm ＞ Rp's
In the case of be set as Vm ＜ Vp.
[the 5th implementation method]
Figure 23 is the integrally-built figure of the exposure device for showing the 5th implementation method.Processing unit U3d equivalent to Fig. 1 with
And the processing unit U3 shown in Fig. 2.Hereinafter, processing unit U3d is referred to as exposure device U3d and is illustrated.The exposure device
U3d has the mechanism for changing light shield M.Because exposure device U3d is the structure same with above-mentioned exposure device U3, so in original
Then go up the incomplete structure explanation to having.
Exposure device U3d is except above-mentioned driven roller R4~R6, marginal position controller EPC3 and aligming microscope
Beyond AM1, AM2, also with light shield maintaining body 11, base supporting mechanism 12, lamp optical system (illuminator) IL, projection
Optical system PL, slave control device 16.
The each several part of the control exposure device of slave control device 16 U3d, is processed each several part.Slave control device 16
Can be device inspection apparatus 1 host control device 5 it is some or all.In addition, slave control device 16 can also
Controlled by host control device 5, be other devices different from host control device 5.Slave control device 16 for example includes meter
Calculation machine.In the present embodiment, slave control device 16 is by from the information storage part for being installed on light shield M, (such as bar code, magnetic is deposited
Storage media is capable of IC tag of storage information etc.) read the reading device 17 of the information relevant with light shield M and to light shield M's
The measurement apparatus 18 that shape, size and installation site etc. are measured are connected.
Additionally, light shield maintaining body 11 keeps the light shield M of cylinder using light shield holding cylinder 21 (by high reflection portion and low anti-
Penetrate the mask pattern face of portion's composition), but in the same manner as first embodiment, however it is not limited to the structure.In the present embodiment,
When light shield M or cylinder light shield is mentioned, light shield M is referred not only to, be also contained in the light shield holding cylinder kept in the state of light shield M
21 (assemblies of light shield M and light shield holding cylinder 21).
Base supporting mechanism 12 is used for the pattern of the light shield M of free illumination along the face of bending or flat bearing
Light exposure substrate P.Substrate supporting cylinder 25 is formed as having centered on the second axle AX2 for extending in the Y direction and curvature
Radius is the drum of the outer peripheral face (periphery) of Rfa.Herein, first axle AX1 is parallel to each other with the second axle AX2, will include
First axle AX1 and the second axle AX2 and plane parallel with both is used as median plane CL.Median plane CL be by two straight lines (
First axle AX1 and the second axle AX2 in the example) determine plane.A part of conduct of the periphery of substrate supporting cylinder 25
The bearing-surface P2 of supporting substrates P.That is, substrate supporting cylinder 25 is supported and carries base by the way that substrate P is wound in into its bearing-surface P2
Plate P.Like this, substrate supporting cylinder 25 has the radius (radius of curvature from the second axle AX of the axis as regulation to specify
Rfa) curved surface (outer peripheral face) of bending, a part for substrate P is wound with outer peripheral face and is carried out as center using the second axle AX2
Rotation.Second drive division 26 is connected with slave control device 16, makes substrate supporting cylinder 25 using the second axle AX2 as Pivot axle
Rotated.
A pair aerial turning-bar ATB1, ATB2 are respectively arranged on the upper of the carrying direction of substrate P across substrate supporting cylinder 25
Trip side and downstream.A pair aerial turning-bar ATB1, ATB2 are located at the face side of substrate P, and in vertical direction (Z-direction)
It is configured at the lower side of the bearing-surface P2 of substrate supporting cylinder 25.A pair of deflector rolls 27,28 are across a pair aerial turning-bar ATB1, ATB2
And it is respectively arranged on the upstream side and downstream in the carrying direction of substrate P.A deflector roll 27 in a pair of deflector rolls 27,28 will be from drive
Dynamic roller R4 carries the substrate P come and guides to aerial turning-bar ATB1, and another deflector roll deflector roll 28 will be removed from aerial turning-bar ATB2
The substrate P for shipping is guided to driven roller R5.
Therefore, base supporting mechanism 12 using deflector roll 27 by from driven roller R4 carry come substrate P guide in the air turn to
Bar ATB1, and substrate supporting cylinder 25 will be imported by the substrate P of aerial turning-bar ATB1.Base supporting mechanism 12 is by using
Two drive divisions 26 rotate substrate supporting cylinder 25, come while the bearing-surface P2 supportings using substrate supporting cylinder 25 are directed in substrate branch
The substrate P of cylinder 25 is held, while carrying the substrate P to aerial turning-bar ATB2.Base supporting mechanism 12 utilizes aerial turning-bar
The substrate P that ATB2 will be carried to aerial turning-bar ATB2 is guided to deflector roll 28, and will have been passed through the substrate P of deflector roll 28 and guided to drive
Dynamic roller R5.
Now, the slave control device 16 being connected with the first drive division 22 and the second drive division 26 is kept by making light shield
Cylinder 21 and substrate supporting cylinder 25, than synchronous rotary, will be formed in the light shield figure of the light cover P1 of light shield M with the rotary speed of regulation
The picture of case continuously repeats projection exposure and (copies circumference on the surface of the substrate P of the bearing-surface P2 for being wound in substrate supporting cylinder 25
Face and the face that bends).
As shown in Fig. 2 exposure device U3d on the outside of the outer peripheral face of light shield M have to be previously formed in light shield M to fiducial mark
Aligming microscope GS1, GS2 that note etc. is detected.In addition, exposure device U3d also has for detecting that light shield M and light shield are protected
Hold encoder head EH1, EH2 of the anglec of rotation of cylinder 21 etc..They match somebody with somebody along the circumference of light shield M (or light shield holding cylinder 21)
Put.For example, encoder head EH1, EH2 are installed on the both ends in the first axle AX1 directions of light shield holding cylinder 21, read with light
The outer peripheral face of the dial disc SD that cover holding cylinder 21 is rotated centered on first axle AX1 together carves the scale for setting (to specify pitch
Quarter sets the pattern of clathrate in the circumferential).And, exposure device U3d can set focus measurement apparatus AFM and foreign matter inspection
Look into device CD；The outer peripheral face (light cover P1) of the light shield M of focus measurement apparatus AFM measurement rotations small position diametrically
Move, so that focusing of the detection light cover P1 relative to projection optical system PL offsets, foreign body detecting device CD detections are attached to light
Foreign matter on cover P1.Although they can be configured at the arbitrary orientation of the outer peripheral face around light shield M, it is preferably arranged at and keeps away
The direction of the handling mobile space of light shield M when the cover that opens the light is changed.
Additionally, the scale reading position of encoder head EH1 is set to, with light on the XZ face orthogonal with first axle AX1
Circumferential center (the intersection point Q1 in Fig. 5 or Fig. 7) alignment of illumination region IR1, IR3, IR5 of the odd number on cover M,
The scale reading position of encoder head EH2 is set to, on the XZ faces with light shield M on even number illumination region IR2, IR4,
The circumferential center alignment of IR6.In addition, can also be with mask pattern one by the scale that encoder head EH1, EH2 are measured
Act the outer peripheral face at the both ends for being formed at light shield holding cylinder 21 (light shield M).
Exposure device U3d in addition to aligming microscope AM1, AM2 of the mark etc. in detection substrate P, also with being used for
Encoder head EN1, EN2, EN3, EN4 of the anglec of rotation of detection substrate supporting cylinder 25 etc..They are along substrate supporting cylinder 25
It is arranged circumferentially.For example, encoder head EN1, EN2, EN3, EN4 are installed on the direction of the second axle AX2 of substrate supporting cylinder 25
On both ends, and read with substrate supporting cylinder 25 together with centered on the second axle AX2 rotate dial disc outer peripheral face
Or the outer peripheral face at the two ends on the direction of the second axle AX2 of substrate supporting cylinder 25 is carved the scale for setting and (is located at specifying that pitch is carved
The pattern of circumferential clathrate).
Additionally, the scale reading position of encoder head EN1 is set to, on the XZ face orthogonal with the second axle AX2 with it is right
The circumferential aligned in position of the observation visual field of quasi- microscope AM1, the scale reading position of encoder head EN4 is set to, in XZ
With the circumferential aligned in position of the observation visual field of aligming microscope AM2 on face.Similarly, the scale of encoder head EN2 reads
Position is set to, and the circumferential center with view field PA1, PA3, PA5 of the odd number in substrate P is alignd, encoder
The scale reading position of read head EN3 is set to, on the XZ faces with substrate P on even number view field PA2, PA4, PA6
Circumferential center alignment.
And, as shown in Fig. 2 exposure device U3d has the replacing mechanism 150 for changing light shield M.Change mechanism 150
The light shield M that exposure device U3d can be kept is replaced by radius of curvature R m identical other light shields M, or is replaced by curvature
Radius Rm different other light shields M.In the case where radius of curvature R m identical light shields M is replaced by, changing mechanism 150 can be only
Light shield M is removed into replacing from light shield holding cylinder 21, it is also possible to by light shield M together with light shield holding cylinder 21 from exposure device
U3d removes replacing.In the case where the different light shield M of radius of curvature R m are replaced by, changing mechanism 150 can connect light shield M
Replacing is removed with light shield holding cylinder 21 from exposure device U3d together.It is the situation of one in light shield M and light shield holding cylinder 21
Under, change mechanism 150 and also both are changed as integrally.Can be by light shield M or light shield M and light as long as changing mechanism 150
The assembly of cover holding cylinder 21 is installed on exposure device U3d and is pulled down from exposure device U3d, and structure whatever all may be used
With.
Exposure device U3d has replacing mechanism 150, thereby, it is possible to automatically install the different light shield M of diameter by light shield
Pattern exposure is in substrate P.Therefore, the device inspection apparatus 1 with exposure device U3d can be according to the device (display of manufacture
Panel) size use the light shield M with appropriate diameter.Therefore, device inspection apparatus 1 can avoid substrate P from producing does not make
Blank parts, it is to avoid the waste of substrate P, reduce the manufacturing cost of device.In this way, with the exposure dress for changing mechanism 150
The selection free degree for putting device (display panel) size that U3d is manufactured due to device inspection apparatus 1 is larger, so with following
Advantage：Exposure device this excessive equipment investment in itself need not be changed, it becomes possible to effectively manufacture different inch dimensions
Display panel.
In the case where the different light shield M of diameter is replaced by, between two kinds of light shield M, because light cover P1 curvature and
The differences such as the position in z-direction of first axle AX1, cause the pass between illuminating bundle EL1 and light shield M and projected light beam EL2
The position of the illumination region IR in system, light shield M and the non-telecentricity degree of chief ray of illuminating bundle EL1 etc. are different in diameter
Change between light shield M, or cause that encoder head EH1, EH2 are different from the position relationship of dial disc SD.
Therefore, in the case where the light shield M of exposure device U3d is replaced by into the different light shield M of diameter, will be formed in light shield
The picture of the mask pattern of the light cover P1 of M with appropriate picture quality projection exposure to substrate P, and in the feelings of poly-lens mode
, it is necessary to accurately to splice the side of the mask pattern picture presented in each in multiple view field PA1~PA6 under condition
Formula adjusts the related organization in exposure device U3d and the part relevant with this.
In the present embodiment, when the different light shield M of diameter is replaced by, for example, using slave control device 16 as tune
It is whole with control unit (adjustment portion) use, carry out specifically constituting lamp optical system to each several part of exposure device U3d
At least one of position of the optical component of IL or projection optical system PL is changed, or by one of optical component
Cutting is changed to the adjustment of the component of different qualities etc..Thus, after light shield M is changed, exposure device U3d can suitably and well
Substrate P is exposed.That is, exposure device U3d can suitably and well realize the exposure big to the free degree of the size of device
Light, i.e. be exposed using the light shield M of different-diameter size.Then, the light shield M that exposure device U3d is used is replaced by
The outline of the step of other light shields M of the different light shield M of diameter or same diameter and the specific example of adjustment exposure device U3d
Illustrate.
The flow chart of the step of Figure 24 is when showing that the light shield for using exposure device is replaced by other light shields.Figure 25 is to show
Go out the position of the field of view of the light shield side of the first projection optical system of odd number and the second projection optical system of even number
Light shield side field of view position between relation figure.Figure 26 is to show there is the information for storing light shield on the surface
Information storage part light shield stereogram.Figure 27 depicts the schematic diagram of the exposure condition setting table of conditions of exposure.
In the case that the light shield M that exposure device U3d is used is replaced by the light shield M of different-diameter, in step S101,
Slave control device 16 shown in Figure 23 starts to start the replacing action of light shield M.Specifically, slave control device 16 is driving more
After the light shield M that converting mechanism 150 will be installed in current exposure device U3d is pulled down, then drive replacing mechanism 150 will be used as replacing
The light shield M of object is installed on exposure device U3d.In the replacing, mechanism 150 is changed by the light shield holding cylinder 21 with light shield M
Pulled down together with the rotating shaft as first axle AX1, then the different light shield M of diameter and light shield holding cylinder 21 are installed to exposure
In device U3d.Now, the situation at the both ends of light shield holding cylinder 21 is coaxially mounted in dial disc SD and first axle AX1
Under, changed together preferably in conjunction with dial disc SD.
In the present embodiment, when the different light shield M of diameter is replaced by, based on being re-installed in exposure device U3d's
The diameter of light shield M (light cover P1) is changed as the first axle AX1 of the Pivot axle of light shield holding cylinder 21 in Z axis side
Upward shaft support position.Therefore, exposure device U3d has to move in the Z-axis direction and rotatably supports
The mechanism of the bearing arrangement of light shield holding cylinder 21.
The bearing arrangement has distinguishes the prominent each rotating shaft as first axle AX1 in the two ends side to light shield holding cylinder 21
The rotatably bearing (non-contact type such as the contact-type such as ball bearing, needle bearing or air bearing) of e axle supporting.
The bearing of contact-type by the inner ring being fixed in the rotating shaft of light shield holding cylinder 21, the main body side for being fixed on exposure device U3d it is outer
Circle and the ball or needle roller that sandwich between inner ring and outer ring are constituted.
In order to successfully carry out light shield replacing, the rotating shaft side of light shield holding cylinder 21 be provided with contact-type bearing inner ring and
In the state of both outer rings, the bearing arrangement being preferably constructed to from the main body side of exposure device U3d pulls down contact-type bearing
The construction of outer ring.In addition, the bearing arrangement of the main body side of exposure device U3d includes so that first axle AX1 (rotating shaft) and the second axle
The Z drive mechanisms that AX2 (Y-axis) parallel mode is adjusted to the slope in YZ planes, and with for so that first
The X drive mechanisms that mode axle AX1 (rotating shaft) also parallel with median plane CL is adjusted to the slope in XY faces.
Figure 25 shows to be replaced by, light shield holding cylinder 21a smaller than its diameter in the light shield M for being kept light shield holding cylinder 21
State in the case of the light shield Ma for being kept.The radius of curvature of light shield M is Rm, and the radius of curvature of light shield Ma is Rma (Rma ＜
Rm).The IRa of Figure 25 is the first projection optical system (the first projection optical system PL1 shown in Figure 23, the 3rd projection optics system
System PL3 and the 5th projection optical system PL5) light shield M sides field of view (equivalent to the photograph from lamp optical system IL
Mingguang City beam EL1 exposes to illumination region IR1, IR3, the IR5 of the odd number on light shield M), IRb is the second projection optical system (figure
The second projection optical system PL2 shown in 23, the 4th projection optical system PL4 and the 6th projection optical system PL6) light shield
The field of view of M sides is (equivalent to the photograph that the illuminating bundle EL1 from lamp optical system IL exposes to the even number on light shield M
Area pellucida domain IR2, IR4, IR6).
In the present embodiment, it is replaced by before and after light shield Ma by light shield M, preferably makes the first throwing in the Z-axis direction
The position of the field of view IRb of the position of the field of view IRa of shadow optical system and the second projection optical system in z-direction
It is constant.Z-direction is the rotation of the Pivot axle (first axle AX) with light shield M (light shield holding cylinder 21) and substrate supporting cylinder 25
Both is orthogonal for central shaft (the second axle AX2), and along the direction of median plane CL.By the visual field area for being set to make in Z-direction
The configuration relation spatially of domain IRa and field of view IRb is constant before and after light shield M is changed, can be by illumination optical system
Unite the adjustment of IL and projection optical system PL, various measurements equipment (encoder head EH1, EH2, aligming microscope GS1,
GS2 etc.) position adjustment or the change etc. of the part being associated be limited in Min..
Present embodiment premised on poly-lens mode as shown in figure 23, arrange in the Y direction it is single or it is multiple such as
Under projection optical system exposure device in the case of, preferably will be each in the circumference of illumination region IR and view field PA
Center is configured on median plane CL, and the projection optical system sets a position in the circumference of the outer peripheral face of light shield M
Illumination region IR in pattern project to view field PA.In exposure device as such, by radius (radius of curvature)
In the case of being replaced by the cylinder light shield Ma that radius is Rma (Rma ＜ Rm) for the light shield M of Rm, as long as so that the rotation of light shield Ma
Center (rotating shaft) in z-direction only the mode of position radius of deflection poor (Rma-Rm) come bearing arrangement is carried out Z drive.
But, in the poly-lens mode of present embodiment, due to the field of view IRa of the projection optical system of odd number
(object plane being conjugated with the view field PA of odd number) is located in the circumferential separate two positions on the outer peripheral face of light shield M
A side, the field of view IRb (object plane being conjugated with the view field PA of even number) of the projection optical system of even number is located at
The opposing party, even if so make the distance of light shield Ma position change only semidiameters (Rma-Rm) in z-direction, according to the journey of semidiameter
Degree, also cannot get good focusing accuracy (or good stitching position precision) sometimes.Therefore, in the present embodiment, with
So that the field of view IRa (object plane) and even number of the projection optical system of the outer peripheral face of the cylinder light shield being replaced and odd number
The field of view IRb (object plane) of projection optical system both mode for matching exactly Z drivings are carried out to bearing arrangement.
In the above embodiment, according to the diameter of the cylinder light shield installed, cylinder light shield position in z-direction is changed
Put, to cause the field of view IRa and the projection optical system of even number of the projection optical system (PL1, PL3, PL5) of odd number
Positions (all directions of XYZ) of the field of view IRb of (PL2, PL4, PL6) in exposure device is constant.If in this way, in order to not change
Become the position of field of view IRa, IRb, then with setting little change bit for the different cylinder light shield of diameter in device side
Put or adjustment position advantage.But, in this case, make motor and make it to XYZ that cylinder light shield rotates
The drive system of the actuator of direction fine motion is also moved in Z-direction on the whole, it is also possible to damage the stability of drive system.
Therefore, in order to obtain ensuring the advantage of the stability of drive system, it is also possible to make the cylinder light in exposure device
The Z location (or X position) of the pivot (first axle AX1, rotating shaft) of cover unchangeably installs the different cylinder light shield of diameter.Such as
This, in addition to keeping the advantage of stability of drive system, as long as also obtain changing being installed on the rotary shaft that diameter is fixed
The characteristic effect of the cylinder light shield (radius of outer peripheral face is different) of the hollow form in outside.In order to correspondingly, exposure is filled
Putting side and being preferably constructed is that headed by the adjustment of the focal position of each projection optical system, can carry out to various alignment sensings
The field of detection of the adjustment of the focal position of the cylinder light shield of device (microscope), field of view IRa, IRb and alignment sensor
The position adjustment on XYZ directions, the adjustment of the slope and degree of convergence of the chief ray of illuminating bundle EL1 or odd number
Interval adjustment between projection optical system (PL1, PL3, PL5) and the projection optical system (PL2, PL4, PL6) of even number etc..
And in the present embodiment, as shown in figure 23, light shield M (and light is removed from bearing arrangement using mechanism 150 is changed
Cover holding cylinder 21), the other light shield Ma (related light shield holding cylinder 21a) for preparing is installed on bearing arrangement.When remove light shield M with
And when installing light shield Ma, focus measurement apparatus AFM or foreign body detecting device CD in fig 23 spatially interfere with light shield
Or them is temporarily kept out of the way in advance in the case of changing a part for mechanism 150.In addition, as shown in figure 23, due to relative to
The bearing arrangement of supporting first axle AX1, projection optical system PL and lamp optical system IL is located in -Z direction, is aligned micro-
Mirror GS1, GS2 are located in -X direction, it is possible to take out of, move into the direction of light shield M or light shield Ma relative to bearing arrangement for+
Z-direction or +X direction or ± Y-direction (direction of first axle AX1).
If light shield M is replaced by into the different light shield Ma of diameter, into step S102, slave control device 16 is being changed
Afterwards, the information (replacing after light shield information) relevant with the light shield Ma for being installed on exposure device U3d is obtained.For example, light shield after changing
Information be diameter, girth, width, thickness equidimension, tolerance, the species of pattern, the out of roundness of light cover P1, eccentric nature or
This all size value and correction value etc. produced by light shield such as flatness.
These information as shown in figure 26, are stored in the information storage part 19 located at the surface of light shield holding cylinder 21a.Information is deposited
Storage portion 19 is, for example, bar code, hologram or IC tag etc..In the present embodiment, information storage part 19 keeps located at light shield
The surface of cylinder 21a, but light shield Ma can also be located at together with the pattern of device.In the present embodiment, cylinder is being mentioned
During the surface of light shield, including either one in the surface of light shield Ma and the surface of light shield holding cylinder 21a.In fig. 26, information
Storage part 19 is located at the cylindric outer peripheral face of light shield holding cylinder 21a, but can also be located at the axis side of light shield holding cylinder 21a
Upward end face portion.
Slave control device 16 obtains light shield information after the replacing read from information storage part 19 by reading device 17.Read
Device 17 can use barcode reader in the case of being bar code in information storage part 19, can in the case of IC tag
Use IC tag reader etc..Information storage part 19 can also be the part for writing information into light shield Ma in advance.
Light shield information can also include the exposure information relevant with conditions of exposure after replacing.Exposure information is exposure object
The information of substrate P, the sweep speed of substrate P, power these exposure devices U3d of illuminating bundle EL1 apply at exposure to substrate P
Required information during reason.In the present embodiment, light shield information is added after changing in the exposure information come carry out various adjustment with
And amendment, and carry out the setting of formulation condition and parameter that the device when exposing is operated.Exposure information is for example stored
In the exposure information shown in Figure 27 preserves table TBL, storage part or host control device 5 of the storage in slave control device 16
Storage part in.Slave control device 16 obtains light shield after changing from above-mentioned storage part reading exposure information preservation table TBL
Information.Additionally, light shield information can also be via the input unit to slave control device 16 or host control device 5 after changing
(keyboard or mouse etc.) is input into.In this case, after slave control device 16 is obtained from above-mentioned input unit and changed
Light shield information.If slave control device 16 obtains light shield information after changing, into step S103.
In step s 103, slave control device 16 is collected or calculated and expose according to the diameter of the light shield Ma after replacing
Part and the relevant data of the required condition of adjustment needed for the adjustment of electro-optical device U3d.For example, as the part needed for adjustment
It is light shield M position, lamp optical system IL, projection optical system PL, the rotary speed of light shield M, exposure width in the Z-axis direction
Degree (the circumferential width of illumination region IR), the position of encoder head EH1, EH2 or posture and aligming microscope GS1,
The position of GS2 or posture etc..In addition, in the present embodiment, due to the Pivot axle (first axle of the light shield Ma after replacing
AX1a skew) is produced in Z-direction compared with the pivot position of the light shield M before replacing, so needing so as to drive light shield
The mode that the output shaft of driving source (such as motor) of Ma can link with the rotating shaft of light shield Ma, adjusts in step s 103
(position skew) installation site of driving source in exposure device main body.Therefore, there is exposure device U3d basis to be installed on light shield
The diameter of the light shield Ma of maintaining body 11 at least adjusts the adjustment portion of the distance between first axle AX1 and base supporting mechanism,
The light shield maintaining body 11 installs one in diameter multiple light shields different from each other in replaceable mode, and around as regulation
Axis first axle AX1 rotation.The adjustment portion will be installed on the outer peripheral face of the light shield of light shield maintaining body 11 and by substrate branch
The interval held between the substrate P of mechanism's supporting is set in prespecified allowed band.
As described above, in the present embodiment, before and after the different light shield Ma of diameter is replaced by, the illumination in Z-direction
The position of visual field IR is constant.Thus, for example, in step S101, slave control device 16 is only replaced by the different light shield of diameter
Ma, after acquisition is changed in step s 102 after light shield information, light shield Ma is made in the Z-axis direction based on light shield information after the replacing
Illumination field of view IR position control with change before equal position.Additionally, before light shield Ma is replaced by, bottom control dress
Putting 16 can also obtain the information of light shield Ma from such as exposure information preservation table TBL, based on the information, be replaced by light shield Ma's
Opportunity, by the position that the position control of light shield Ma illumination field of view IR in the Z-axis direction is equal before with replacing.Hereinafter, to step
The example of the adjustment in rapid S103 is illustrated.
Figure 28 is the illuminating bundle and projected light beam roughly shown between the different light shield of diameter based on Fig. 5 above
State figure.If as described above, make illumination field of view IR positions in the Z-axis direction not change before and after light shield M is changed,
As shown in figure 25, become the position in the Pivot axle i.e. Z-direction of first axle AX1 of light shield M and light shield holding cylinder 21
Change.Specifically, the Pivot axle AX1a of the small light shield Ma of diameter more connects compared with the first axle AX1 of the light shield M being relatively large in diameter
Early work is the second axle AX2 of the Pivot axle of substrate supporting cylinder 25.
As shown in figure 28, even if in the case that light shield Ma after replacing is smaller than the diameter of the light shield M before replacing, also not changing
Become absolute positions of the intersection point Q1 at illumination region IR on light shield Ma (light cover P1a) center in the circumferential in XYZ coordinate
(the clear and definite position in exposure device).Therefore, as shown in figure 28, if while maintaining the illumination to the light shield M settings before replacing
The lighting condition of light beam EL1, i.e. maintaining makes each chief ray of illuminating bundle EL1 to radius (radius of curvature) Rm's in XZ faces
The 1/2 point inclined conditions of Q2, while irradiate illuminating bundle EL1 to the small light shield Ma of diameter, then by the illumination region on light shield Ma
Each chief ray of the projected light beam EL2a of IR reflections is changed into the state dissipated in XZ faces from state offset parallel to each other,
The direction of traveling also offsets.
Accordingly, it would be desirable to the illuminating bundle EL1 from lamp optical system IL is adjusted to be suitable to the illuminating bundle of light shield Ma
EL1.Therefore, in step s 103, the cylindrical lens 54 (reference picture 4) lamp optical system IL being had is changed to different
Power, the state of multiplying power telecentricity is adjusted to make each chief ray of illuminating bundle EL1 in XZ faces to the radius Rma of light shield Ma
1/2 position convergence.And, using drift angle prism (not shown), will be in as field of view IRa (illumination region IR)
The extended line that the state of the axle telecentricity of the intersection point Q1 of the heart is adjusted to the chief ray of the illuminating bundle EL1 passed through from intersection point Q1 passes through light
Cover the state of the central shaft AX1a of Ma.
In addition, the reflected beams of the adjustment from light shield Ma are the angle of projected light beam EL2a.In this case, due to shining
The shaft angle degree (angle in XZ faces of chief ray) of Mingguang City beam EL1 and projected light beam EL2a is according to the diameter (key light of light shield Ma
The center of line) and change, it is possible to being configured between the polarising beam splitter PBS and light shield Ma as shared light path
The drift angle prism prism of the not parallel wedge-like of outgoing plane (plane of incidence with) adjusts the angle of projected light beam EL2a.
In addition, in the case of the only angle of adjustment projected light beam EL2a, it is also possible to adjust projection optical system PL and had
Some polarizing member (the first reflecting surface P3 of such as the first deflecting member 70 or the 4th reflecting surface of the second deflecting member 80
P6 angle).Thus, in the case of being replaced by the different light shield Ma of diameter (in this example embodiment change after light shield Ma it is straight
Footpath than changing before it is small), each chief ray of the projected light beam EL2a that will can be reflected by light shield Ma is set to parallel to each other in XZ faces
Light.That is, even if different to the diameter after replacing light shield Ma, lamp optical system IL also adjust the photograph exposed on light shield Ma
The lighting condition of the illuminating bundle EL1 of area pellucida domain IR, with the projected light beam EL2a for causing to be reflected by the illumination region IR of light shield Ma
It is changed into the state of telecentricity.
In the case where above-mentioned adjustment is carried out, for example, being attached in the light optics module ILM of lamp optical system IL
The lens being arranged in the way of in can changing the different multiple cylindrical lenses 54 of power in light path change mechanism etc..
The lens can also be controlled to change mechanism to switch to the cylinder of best power according to the instruction from slave control device 16
Lens 54.Now, slave control device 16 switches cylindrical lens 54 based on the information of the diameter of the light shield Ma after changing.Separately
Outward, slave control device 16 can also be used to control for the drift angle rib between above-mentioned polarising beam splitter PBS and light shield Ma
The actuator that the angle (and the position in XZ faces) of the polarizing member in mirror or projection optics module PLM is adjusted,
To adjust the optical characteristics of the projected light beam EL2 reflected by light shield Ma.In this case, slave control device 16 is also based on more
The information of the diameter of the light shield Ma after changing adjusts the angle of drift angle prism or polarizing member.Additionally, cylindrical lens 54 is more
Change and the adjustment of drift angle prism etc. can be carried out by the operator of exposure device U3d.
Figure 29 is the figure of the configuration change for showing encoder head in the case where the different light shield of diameter is replaced by etc..
In adjustment in step s 103, as needed, also to encoder head EH1, EH2, aligming microscope GS1, GS2, light shield M sides
Focus measurement apparatus AFM and detection foreign matter foreign body detecting device CD be adjusted.As shown in figure 29, for example, from partly
Footpath (radius of curvature) for the light shield M and light shield holding cylinder 21 of Rm be replaced by that diameter is smaller and radius for Rma light shield Ma and
In the case of light shield holding cylinder 21a, encoder head EH1, EH2 around light shield M are configured at, aligming microscope GS1, GS2 are burnt
Point measurement apparatus AFM and foreign body detecting device CD needs to be reconfigured in around the light shield Ma that diameter diminishes, or adjustment
Posture.Thereby, it is possible to accurately measure position, the anglec of rotation of light shield Ma etc. of the alignment mark on light shield Ma.
In the example shown in Figure 29, by aligming microscope GS1, GS2, focus measurement apparatus AFM and foreign body detecting device
CD is newly configured at around the light shield Ma that diameter diminishes.In addition, encoder head EH1, EH2 in this example embodiment divides in XZ faces
Position, second projection optical system (even number) of the field of view IRa of the first projection optical system (odd number) are not configured at
Field of view IRb position near.Therefore, there is no need to after light shield is changed, encoder head is significantly changed in XZ faces
The position of EH1, EH2.
But, due to being replaced by light shield Ma, the periphery of the dial disc SD read by encoder head EH1, EH2 can be caused
The scale in face or be formed at together with light shield Ma light shield holding cylinder 21a outer peripheral face scale and each encoder head EH1,
Relative reading angular between EH2 changes.Therefore, by the stance adjustment of encoder head EH1, EH2 adequately with
Scale face is relative.Specifically, arrow N1, N2 as shown in figure 29 like that, according to the diameter in scale face, makes each read head EH1, EH2
(inclination) is rotated on its position.Thereby, it is possible to accurately draw the information of the anglec of rotation of light shield Ma.
When light shield Ma is replaced by, it is also possible to change dial disc simultaneously together with light shield Ma and light shield holding cylinder 21a
SD, the posture (inclination) of adjustment encoder head EH1, EH2, and adjust installation site etc..Scale can also be located at light shield Ma
Surface or light shield holding cylinder 21a outer peripheral face.The quarter read in encoder head EH1, EH2 when light shield Ma is replaced by
In the case that degree grid pitch in the circumferential is different from before replacing, the grid section of the scale after 16 pairs of replacings of slave control device
The corresponding relation between detected value away from encoder head EH1, EH2 is modified.Specifically, following conversion system is corrected
Number, the conversion coefficient represents the anglec of rotation that 1 counting of the digit counter of coded system is converted into the light shield Ma after changing
Displacement in the circumference of degree or light cover P1a is great value.
As shown with imaginary line in Figure 29, focus measurement apparatus AFM and foreign body detecting device CD can match somebody with somebody
The Pivot axle (first axle AX1 or first axle AX1a) of light shield M or light shield Ma underface in the Z-axis direction is placed in,
And configuration is between the illumination field of view IRa of the first projection optical system and the illumination field of view IRb of the second projection optical system, under
The light cover P1 or light cover P1a of side's detection light shield M or light shield Ma.Thereby, it is possible to reduce before and after light shield Ma is changed,
Surface from focus measurement apparatus AFM and foreign body detecting device CD to light shield M or the distance the surface of light shield Ma
Change.Therefore, having can be by the soft of the optical system or treatment of focus measurement apparatus AFM and foreign body detecting device CD
Amendment of part etc. carrys out corresponding possibility.In this case, it is also possible to do not change focus measurement apparatus AFM and inspection of foreign substance dress
Put the installation site of CD.
By being replaced by light shield Ma so that radius of curvature diminishes, it is thereby possible to the exposed width (base of view field PA
The scanning direction of plate P or the circumference of light shield Ma) in defocus change big.In this case it is necessary to adjust exposed width (including
Sloping portion), the illumination of lamp optical system IL or sweep speed (rotary speed of light shield Ma and the carrying speed of substrate P
Degree).These can be by adjusting perspective view diaphragm 63, or the light source for utilizing the adjustment light supply apparatus 13 of slave control device 16
The rotation of output, light shield holding cylinder 21a and substrate supporting cylinder 25 be adjusted.In such a situation it is preferred to same time-varying
More exposed width, illumination, sweep speed.
And, the position of the view field PA according to projection optical system PL, the relative position of projection optics module PLM are closed
It is and because the perimeter change of light shield Ma is, it is necessary to adjust light shield Ma multiplying powers in a rotational direction etc..For example, slave control device
The 16 picture skew optical components 65 that can have by the projection optics module PLM to projection optical system PL or multiplying power
The view field PA or light shield Ma that amendment optical component 66 etc. is controlled to adjust projection optical system PL are in rotation side
Upward multiplying power etc..
In step s 103, carrying out the adjustment of light shield Ma positions in the Z-axis direction, lamp optical system IL has
The adjustment of the optical component that the adjustment of optical component, projection optical system PL have and the tune of encoder head EH1, EH2
It is whole to wait mechanical adjustment.Having in these can utilize drive mechanism of slave control device 16 and adjustment etc. automatic (or half
Automatically the part for adjusting), also there is the part that the operator of exposure device U3d manually adjusts.In addition, in step S103
In, slave control device 16 is based on light shield information or exposure information etc. after replacing, changes the control for controlling exposure device U3d
Data (various parameters) processed etc..
In step s 103, exposure device U3d have adjusted based on light shield information after the replacing for obtaining in step s 102,
But the shape of the light shield Ma that can also be measured the measurement apparatus 18 as shown in Figure 23, size and installation site etc. are used as more
Change rear light shield information, and exposure device U3d is adjusted according to light shield information after the replacing.In this case, for example, the next control
Device processed 16, based on the light shield Ma of the measurement of measurement apparatus 18, carries out various adjustment after light shield Ma is replaced by.In addition, for behaviour
Part that author must adjust, change etc., for example, slave control device 16 will need part of adjustment etc. including in monitor etc.
On notify operator.The measured value adjustment exposure device U3d of the light shield Ma after based on replacing with reference to for example to draw
Light shield information after the replacing of the change of the environment such as temperature or humidity, exposure is adjusted therefore, it is possible to more conform to actual state
Electro-optical device U3d.In step s 103, at the end of the adjustment carried out because being replaced by light shield Ma, step S104 is entered into.
As described above, when the light shield of different diameters is replaced by, the optical system of the association in exposure device, machine sometimes
Construction system, each characteristic of detecting system change.In the present embodiment, in order to confirm as the exposure changed after light shield
The characteristic or performance of electro-optical device, set calibrating installation as shown in figure 30.Figure 30 is the figure of calibrating installation.Figure 31 is for saying
The figure of bright calibration.Exposure device U3d is in the state for being suitable for the light shield Ma after changing in step s 103, but by step
Calibrated in rapid S104, the state of the light shield Ma after the state of exposure device U3d is set to more suitable for replacing.Calibration is used
Calibrating installation 110 shown in Figure 30.Calibration in present embodiment is that slave control device 16 is carried out.Slave control device 16
The mark ALMR of ALMM and second are marked using the detection of calibrating installation 110 first, first mark ALMM is used as shown in figure 31
The adjustment mark on the surface of the light shield Ma kept located at light shield holding cylinder 21a, second mark ALMR is used as located at substrate
Support the adjustment mark on the surface (parts of 25 supporting substrates P of substrate supporting cylinder) of cylinder 25.Then, slave control device 16 is adjusted
Whole lamp optical system IL, projection optical system PL, the rotary speed of light shield Ma, the transporting velocity of substrate P or multiplying power etc., with
So that the relative position of the first mark ALMM and the second mark ALMR is changed into the position relationship of regulation.Therefore, the step of calibration
S104 was preferably carried out before substrate P to be wound in substrate supporting cylinder 25, if but substrate P transmittance it is higher, and in substrate P
Do not formed in the state of various patterns, then can also be calibrated in the state of substrate P is wound in substrate supporting cylinder 25.
As shown in figure 30, calibrating installation 110 has photographing element (such as CCD, CMOS) 111, lens group 112, prism anti-
Penetrate mirror 113, beam splitter 114.Calibrating installation 110 in the case of poly-lens mode, respectively with lamp optical system IL1~IL6
Accordingly set.In the case where being calibrated, be configured at for the beam splitter 114 of calibrating installation 110 by slave control device 16
In the light path of the illuminating bundle EL1 between lamp optical system IL and polarising beam splitter PBS.In situation about not calibrated
Under, beam splitter 114 avoids the light path of illuminating bundle EL1.
Because the sensitivity of photographing element 111 is sufficiently high, so the loss of the power of light can not also be considered.Therefore, divide
Beam device 114 can also be such as half prism etc..In addition, by making beam splitter 114 in lamp optical system IL and polarized light beam splitting
The light path turnover of the illuminating bundle EL1 between device PBS, can minimize calibrating installation 110.
As shown in figure 30, also following method：Make the light beam of the light source 115 for carrying out self calibration from polarising beam splitter
The face opposite side incidence incident with illuminating bundle EL1 of PBS, polarising beam splitter PBS separates illuminating bundle EL1 with projection
Light beam EL2.Furthermore, it is also possible to the rear side in the second mark ALMR of substrate supporting cylinder 25 is configured with the light source 115 of calibration
(illuminating part), the light beam of calibration is irradiated from the rear side of the second mark ALMR, will be transmitted second and is marked the light of ALMR via throwing
Shadow optical system PL and polarising beam splitter PBS, the light cover P1a of the light shield Ma being projected to after changing.In this case, school
The photographing element 111 of standard apparatus 110 can simultaneously shoot back projection in the substrate supporting cylinder 25 on the light shield Ma after replacing
The first mark ALMM on the picture and light shield Ma of the second mark ALMR.
By the illuminating bundle EL1 being configured at beam splitter 114 between lamp optical system IL and polarising beam splitter PBS
Light path, will from the first of light shield Ma mark ALMM picture with from substrate supporting cylinder 25 second mark ALMR picture via
Beam splitter 114 is conducted to the prism mirror 113 of calibrating installation 110.The light of each mark picture reflected by prism mirror 113 exists
After by lens group 112, the photographing element 111 with shutter speed high is incident to, a frame sign of the shutter speed high
Camera time (sampling time) is extremely short, at 0.1~1 millisecond or so.Slave control device 16 pairs is defeated with from photographing element 111
Go out first mark ALMM picture and second mark ALMR as corresponding picture signal is parsed, based on its parsing knot
The fruit and measured value of each encoder head EH1, EH2, EN2, the EN3 of (during sampling) obtains the first mark ALMM and the when imaging
Relative position relation between two mark ALMR, the rotation to lamp optical system IL, projection optical system PL, light shield Ma is fast
Degree, the transporting velocity of substrate P or multiplying power etc. are adjusted, to cause that both relative positions are in the state of regulation.
As shown in figure 31, the first mark ALMM configurations are corresponding with each lamp optical system IL (IL1~IL6) each
The position that individual illumination region IR (IR1~IR6) overlaps across median plane CL be (two ends in the Y direction of each illumination region IR
Triangular part).Second mark ALMR configurations are in each view field corresponding with each projection optical system PL (PL1~PL6)
The position (triangular parts at the two ends in the Y-direction of each view field PA) that PA (PA1~PA6) is overlapped across median plane CL.In school
In standard, by the calibrating installation 110 of each setting in each projection optics module PLM according to the first row across median plane CL
The order of (odd number), secondary series (even number), receives the picture of the first picture for marking ALMM and the second mark ALMR successively.
As described above, in step s 103, based on being replaced by the adjustment (mainly mechanical adjustment) that light shield Ma is carried out
After end, the adjustment exposure device U3d of slave control device 16, to cause the substrate of the light shield Ma after changing and carrying substrate P
Position between supporting cylinder 25 is offset below allowed band.In this way, slave control device 16 at least marks ALMM using first
Picture and the picture of the second mark ALMR adjust exposure device U3d.Thus, based on the light shield Ma and substrate supporting from after replacing
The picture of the actual mark that cylinder 25 gets, is further modified to the error that the adjustment by machinery is not corrected completely.
Therefore, exposure device U3d can be exposed with appropriate and good precision using the light shield Ma after replacing.
In the above example, after light shield has been changed, exposure device U3d is mainly mechanically have adjusted, but changing
Adjustment after light shield is not limited to this.For example, in the difference very little of the diameter of the cylinder light shield for being mountable to exposure device U3d
In the case of, by the cylinder light shield for coordinating diameter in these cylinder light shields minimum, be determined in advance lamp optical system IL and
The effective diameter of projection optical system PL and the size of polarising beam splitter PBS, it is also possible to light beam EL1 etc. need not be illuminated
Angular characteristicses etc. adjustment.Thereby, it is possible to simplify the adjustment operation of exposure device U3d.In the present embodiment, will can expose
The light shield that electro-optical device U3d can be used is categorized as multiple groups according to the diameter of light shield respectively, and the diameter of light shield is changed in group
Situation and beyond group scope come in the case of the diameter for changing light shield, change the regulating object or part of exposure device U3d
Deng.
Figure 32 is the side view for being shown with the example that air bearing rotatably supports light shield.Figure 33 is to show
The stereogram of the example of light shield is rotatably supported using air bearing.Keep the two of the light shield holding cylinder 21 of light shield M
End can also rotatably be supported by air bearing 160.Air bearing 160 is made as multiple bearing units
161 are configured to ring-type in the peripheral part of light shield holding cylinder 21.And, air bearing 160 is by from each bearing unit 161
Side face sprays air (air) to the outer peripheral face of light shield holding cylinder 21, rotatably to support light shield holding cylinder 21.Such as
This, air bearing 160 is provided with one in the different multiple light shield M of diameter each other and around regulation as in replaceable mode
Axis (first axle AX1) rotation light shield maintaining body work.
In above-mentioned step S103, air bearing 160 changes bearing unit according to the diameter of the light shield Ma for changing
161.In addition, before and after changing, in the case of the difference very little of the diameter (2 × Rm) of light shield M, it is also possible to adjust each supporting single
First 161 position diametrically, makes it corresponding with the light shield M after replacing.Like this, in exposure device U3d via air axle
160 are held rotatably in the case of supporting light shield M, air bearing 160 supports diameter not as in replaceable mode
The bearing arrangement of the exposure device U3d main body sides of same light shield works.
The implementation method ＞ of ＜ the 6th
Figure 34 is the integrally-built figure of the exposure device for showing the 6th implementation method.Using Figure 34 to exposure device U3e
Illustrate.In order to avoid repeat record, illustrated only for the part different from above-mentioned implementation method, for reality
The same inscape mark of mode is applied to be illustrated with implementation method identical reference.Additionally, the 5th implementation method
Each structure of exposure device U3d can be applied to present embodiment.
The exposure device U3 of implementation method is the structure for using the reflection-type light shield using the light for reflecting as projected light beam, but
The exposure device U3e of present embodiment is to use the transmission-type light shield (transmission-type using the light transmitted from light shield as projected light beam
Cylinder light shield) structure.In exposure device U3e, light shield holding cylinder 21es of the light shield maintaining body 11e with holding light shield MA,
The deflector roll 93 of supporting light shield holding cylinder 21e, the driven roller 94 and drive division 96 that drive light shield holding cylinder 21e.Although not scheming
Show, but exposure device U3e has the replacing mechanism 150 for changing light shield MA as shown in figure 23.
Light shield maintaining body 11e installs one in the different multiple light shield MA of diameter each other in replaceable mode, and
Around axis (first axle AX1) rotation of regulation.Exposure device U3e has adjustment portion, and the adjustment portion is according to being installed on replaceable
Mode be provided with one of the different multiple light shield MA of diameter each other and and carried out around the first axle AX1 of the axis as regulation
The diameter of the light shield MA of the light shield maintaining body 11e of rotation come adjust at least between first axle AX1 and base supporting mechanism away from
From.The adjustment portion will be installed on the substrate P that the outer peripheral face of the light shield MA of light shield maintaining body 11e and base supporting mechanism are supported
Between interval be set in prespecified allowed band.
Light shield holding cylinder 21e is using manufactures such as such as glass or quartz, with certain thickness cylindrical shape, at it
Outer peripheral face (barrel surface) forms the light cover of light shield MA.I.e., in the present embodiment, the illumination region on light shield MA is from center line
Bend to the cylinder planar with certain radius of curvature R m.When being observed from the radial direction of light shield holding cylinder 21e, light shield holding cylinder
In 21e with the part such as light shield holding cylinder 21e of the pattern registration of light shield MA in addition to two sides in Y direction in
Centre part, has translucency to illuminating bundle.The illumination region on light shield MA is configured with light cover.
Light shield MA is made into very thin glass plate (such as μ of thickness 100 μm~500 for example in the good strip of flatness
M) using the plane sheet material light shield for foring by light shield layers such as chromium the transmission-type of pattern on a surface, it is made to copy light
The outer peripheral face of cover holding cylinder 21e bends, and is used with winding (laminating) in the state of the outer peripheral face.Light shield MA have do not formed
The non-pattern forming region of pattern, is installed on light shield holding cylinder 21e in non-pattern forming region.Light shield MA can be from light shield
Depart from holding cylinder 21e.Light shield MA is wound in transparent cylinder mother metal structure with the light shield M of implementation method it is equally possible that replacing
Into light shield holding cylinder 21e, and the outer peripheral face in the light shield holding cylinder 21e being made up of transparent cylinder mother metal is directly hidden using chromium etc.
Mask pattern is drawn on photosphere and comes integrated.In this case, light shield holding cylinder 21e also realizes the work(of the supporting member of light shield
Energy.
Deflector roll 93 and driven roller 94 extend in the Y direction parallel with the central shaft of light shield holding cylinder 21e.Deflector roll 93
And driven roller 94 is arranged to be rotated around the axis parallel with the Pivot axle of light shield MA and light shield holding cylinder 21e.
The external diameter of the end on deflector roll 93 and the respective axis direction of driven roller 94 is bigger than the profile of other parts, the end and light shield
Holding cylinder 21e is circumscribed.Like this, deflector roll 93 and driven roller 94 are arranged to the light shield MA not kept with light shield holding cylinder 21e
Contact.Driven roller 94 is connected with drive division 96.Driven roller 94 is kept by the way that the torque supplied from drive division 96 is conducted to light shield
Cylinder 21e is rotated making light shield holding cylinder 21e rotate about central shaft.
Light shield maintaining body 11e has a deflector roll 93, but quantity is not to limit, or two or more.Together
Sample ground, light shield maintaining body 11e has a driven roller 94, but quantity is not to limit, or two or more.Deflector roll
At least one of 93 and driven roller 94 can be only fitted to the inner side of light shield holding cylinder 21e, and with light shield holding cylinder 21e inscribes.
In addition, when being observed from the radial direction of light shield holding cylinder 21e, in light shield holding cylinder 21e not with the portion of the pattern registration of light shield MA
Being divided to (two sides of Y direction) can have translucency to illuminating bundle, it is also possible to without translucency.In addition, deflector roll 93 with
And the one side or both in driven roller 94 can also be such as circular cone shape, central shaft (rotary shaft) is uneven with central shaft
OK.
Preferably, exposure device U3e is respectively by the field of view (lighting area of the first projection optical system shown in Figure 25
Domain) field of view (illumination region) IRb of IRa and the second projection optical system is configured at the position of deflector roll 93 and driven roller 94.
Even if if it does, the then diameter change of light shield MA, it is also possible to keep field of view IRa, IRb position each in the Z-axis direction
It is fixed.Its result is, in the case where the different light shield MA of diameter is replaced by, it is easy to comfortable Z axis each to field of view IRa, IRb
Position on direction is adjusted.
The lighting device 13e of present embodiment has light source (omitting diagram) and lamp optical system (illuminator)
ILe.Lamp optical system ILe has with each in multiple projection optical system PL1~PL6 accordingly in Y direction
Multiple (such as 6) lamp optical system ILe1~ILe6 of upper arrangement.Light source in the same manner as the light supply apparatus 13 of implementation method,
Various light sources can be used.It is homogenized the Illumination Distribution of the illumination light projected from light source, such as via the leaded light structure such as optical fiber
Part is distributed to multiple lamp optical system ILe1~ILe6.
Multiple lamp optical system ILe1~ILe6 have multiple optical components such as lens respectively.Multiple lamp optical systems
ILe1~ILe6 has such as integrated optics system, lens pillar or fly's-eye lens etc. respectively, uniform using Illumination Distribution
Illuminating bundle irradiates the illumination region of light shield MA.In the present embodiment, multiple lamp optical system ILe1~ILe6 configurations
In the inner side of light shield holding cylinder 21e.Multiple lamp optical system ILe1~ILe6 pass through from the inside of light shield holding cylinder 21e respectively
Light shield holding cylinder 21e, irradiates to each illumination region on the light shield MA that the outer peripheral face of light shield holding cylinder 21e is kept.
The light that lighting device 13e is projected by lamp optical system ILe1~ILe6 guiding from light source, the illumination light that will be guided
Beam is from light shield holding cylinder 21e internal irradiations to light shield MA.Lighting device 13e irradiates light shield using illuminating bundle with uniform brightness
The part (illumination region) for the light shield MA that holding cylinder 21e is kept.Additionally, light source can be configured at light shield holding cylinder 21e's
Inner side, it is also possible to be configured at the outside of light shield holding cylinder 21e.In addition, light source can also be other different from exposure device U3e
Device (external device (ED)).
Lamp optical system ILe1~ILe6 is radiated at the axis as regulation from the inner side of light shield MA towards its outer peripheral face
The side of first axle AX1 extend upward to the illuminating bundle of slit-shaped.In addition, exposure device U3e has adjustment portion, the adjustment portion
Diameter according to the light shield MA for installing adjusts width of the illuminating bundle on the direction of rotation of light shield MA.
The base supporting mechanism 12e of exposure device U3e have the substrate objective table 102 that keeps plane substrate P and
Substrate objective table 102 is scanned mobile mobile device along the X direction in the plane orthogonal with median plane CL and (save sketch map
Show).Because the surface of the substrate P of the bearing-surface P2 sides shown in Figure 34 is substantially the plane parallel with XY faces, so by light
Cover MA reflections and from projection optical system PL by and the chief ray that is projeced into the projected light beam of substrate P is vertical with XY faces.Upper
State in the calibration of step S104, the second mark shown in Figure 31 is provided with the surface of the bearing-surface P2 of substrate objective table 102
ALMR。
Exposure device U3e uses transmission-type light shield as light shield MA, but in this case, it is same with exposure device U3
Ground, it is also possible to change the light shield MA of different-diameter.And, in the case of the light shield MA for being replaced by different-diameter, exposure device
U3e in the same manner as exposure device U3, at least have adjusted lamp optical system ILe1~ILe6 and projection optical system PL1~
After at least one party in PL6 so that change after light shield MA and the substrate objective table 102 of carrying substrate P between relative position
The mode that relation is put in the allowed band bias internal of regulation is adjusted (setting).Thus, based on from light shield MA and substrate loading
Actual mark picture that platform 102 is obtained etc., the amendment of precision is further carried out to the error that the adjustment by machinery has not been corrected.
Therefore, exposure device U3e can keep appropriate and good precision, carry out the exposure based on the light shield after changing.
In addition it is also possible to replace the base supporting mechanism 12 of the exposure device U3 with implementation method, and by this embodiment party
The base supporting mechanism 12e that the exposure device U3e of formula has is applied to exposure device U3.Alternatively, it is also possible in implementation method
Exposure device U3 on, using deflector roll 93 and driven roller 94 rotatably supporting substrates support cylinder 25, and respectively will figure
Field of view (illumination region) IRa and the field of view of the second projection optical system of the first projection optical system shown in 25
(illumination region) IRb is configured at the position of deflector roll 93 and driven roller 94.Thus, it is being replaced by the situation of the different light shield MA of diameter
Under, it is easy to adjust field of view IRa, IRb position each in the Z-axis direction.
The implementation method ＞ of ＜ the 7th
Figure 35 is the integrally-built figure of the exposure device for showing the 7th implementation method.Using Figure 35 to exposure device U3f
Illustrate.In order to avoid repeat record, illustrated only for the part different from above-mentioned implementation method, for reality
The same inscape mark of mode is applied to be illustrated with implementation method identical reference.Additionally, the 5th implementation method
Each structure of the exposure device U3e of exposure device U3d and the 6th implementation method can be applied to present embodiment.
Exposure device U3f is the substrate board treatment for implementing so-called proximity printing to substrate P.Exposure device U3f will
Light shield MA is set as several μm~tens μm or so, lamp optical system ILc with the gap (proximity gap) of substrate supporting cylinder 25f
Directly illuminating bundle EL is irradiated to substrate P to carry out noncontact exposure.Light shield MA is located at the surface of light shield holding cylinder 21f.This reality
The exposure device U3f for applying mode is used to transmit the light of light shield MA as the transmission-type light shield of projected light beam EL.In exposure device
In U3f, light shield holding cylinder 21f is by the cylindrical shape with certain thickness of the manufactures such as such as glass or quartz, outside it
Side face (barrel surface) forms the light cover of light shield MA.Although it is not shown, still exposure device U3f has as shown in figure 23 being used for
Change the replacing mechanism 150 of light shield MA.
In the present embodiment, substrate supporting cylinder 25f is by from the second drive division 26f with actuators such as electro-motors
The torque of supply and rotate.In the way of the direction of rotation with the second drive division 26f oppositely rotates, for example, by magnetic gear
A pair of driven rollers MGG, MGG for linking drive light shield holding cylinder 21f.Second drive division 26f rotates substrate supporting cylinder 25f, and
Driven roller MGG, MGG and light shield holding cylinder 21f are rotated, makes light shield holding cylinder 21f and substrate supporting cylinder 25f synchronizing movings (same
Step rotation).Because a part for substrate P is via a pair aerial turning-bar ATB1f, ATB2f, a pair of deflector rolls 27f, 28f are wound in
Substrate supporting cylinder 25f, so when substrate supporting cylinder 25f rotates, substrate P is synchronously handled upside down with light shield holding cylinder 21f.As this
Sample, a pair of driven rollers MGG, MGG as be provided with replaceable mode in the different multiple light shields of diameter each other, and
It is set to be worked around the light shield maintaining body that the axis (first axle AX1) of regulation is rotated.
Positions of the lamp optical system ILc between a pair of driven rollers MGG, MGG and in the outer peripheral face and substrate of light shield MA
The immediate position of substrate P that supporting cylinder 25f is supported, lateral substrate P projection extends to narrow in the Y direction from light shield MA
The illuminating bundle of gap-like.In proximity printing mode as such, due to exposure position (phase of the mask pattern in substrate P
When in view field PA) in the circumference of light shield MA at one, so when the different cylinder light shield of diameter is replaced by, as long as adjusting
The substrate supporting cylinder 25f of full circle cylinder light shield position in the Z-axis direction or supporting substrates P positions in the Z-axis direction, so that
Proximity gap remains setting.
Like this, exposure device U3f uses transmission-type light shield as light shield MA, and implements proximity printing to substrate P,
In this case, also in the same manner as exposure device U3, can be changed with the light shield MA of different-diameter.And, it is being replaced by difference
In the case of the light shield MA of diameter, exposure device U3f can be by carrying out the calibration same with exposure device U3, after replacing
Light shield MA and the substrate supporting cylinder 25f of carrying substrate P between relative position offset and adjusted (also including proximity gap)
In allowed band.Thus, based on the actual mark picture obtained from light shield MA and substrate supporting cylinder 25f, further critically
The error that amendment is not corrected completely by the adjustment of machinery, its result is that exposure device U3f can keep appropriate and good
Precision is exposed.
Further, since the lamp optical system ILc of exposure device U3f as shown in figure 35 will be elongated in the Y direction and in X
The illuminating bundle of the narrower width on direction (direction of rotation of light shield MA) is radiated at light shield MA with the numerical aperture (NA) for specifying
Light cover, even if so the diameter of the cylinder light shield installed is different, it is not required that to the illumination from lamp optical system ILc
The directional characteristic (slope of chief ray etc.) of light beam is substantially significantly adjusted.Here, can also be with according to light shield MA
Diameter (radius) side of width of the illuminating bundle of light cover in X-direction (direction of rotation of light shield MA) is exposed to change
Formula, in lamp optical system ILc set variable-width illuminated field diaphragm (variable window shade), or set only reduce or
Expand dioptric system (such as cylinder zoom lens of width of the illuminating bundle in X-direction (direction of rotation of light shield MA)
Deng).
In addition, in the exposure device U3f of Figure 35, substrate P is cylinder planar by substrate supporting cylinder 25f supportings, but
Can be supported to as the exposure device U3e of Figure 34 plane.When substrate P is supported to plane, and it is supported to
The situation of cylinder planar is compared, and can expand the illuminating bundle corresponding with the difference of the diameter of light shield MA in X-direction (light shield MA
Direction of rotation) on width adjusting range.Thereby, it is possible to permitting in the proximity gap corresponding with the diameter of light shield MA
Perhaps it is optimal by width adjustment of the illuminating bundle in X-direction (direction of rotation of light shield MA) in the range of, can makes to be transferred to base
The maintenance of the pattern quality (fidelity etc.) on plate P and productivity are optimized.In this case, variable window shade or cylinder become
Focus lens etc. are included in the diameter of the light shield MA according to transmission-type come in the adjustment portion of the width for adjusting illuminating bundle.
In each implementation method more than, there is certain scope in the diameter for being mountable to the cylinder light shield of exposure device.
For example, in the exposure device for line width being the projection optical system that 2 μm~3 μm or so of fine pattern is projected,
The width of the depth of focus DOF of the projection optical system is tens μm or so very narrow, the in addition focusing in projection optical system
The scope of adjustment typically also can be very narrow.For this exposure device, it is difficult to install diameter relative to the diameter for being defined as specification
With the cylinder light shield of millimeter Unit alteration.Here, in exposure device side, from initially just with the diameter change phase with cylinder light shield
In the case that corresponding mode makes each several part, each mechanism have larger adjusting range, determined on the basis of the adjusting range
The diameter range of the cylinder light shield that can be installed surely.In addition, in the exposure device close to mode as shown in figure 35, as long as light
A part for outer peripheral face and the gap of substrate P for covering MA converge on the scope of regulation, if the supporting device of cylinder light shield is
Can corresponding structure, then when diameter be 0.5 times, 1.5 times, 2 times ... when, even if largely different cylinder light shields also can
It is enough to install.
Figure 36 is the solid of the local structure example for showing the supporting device in the exposure device of the cylinder light shield M of reflection-type
Figure.In Figure 36, the direction (Y-direction) to extending towards the rotary shaft AX1 of cylinder light shield M (light shield holding cylinder 21) is illustrate only
The mechanisms that are supported of rotating shaft 21S that protrude of side, but also be provided with same mechanism in opposite side.In the situation of Figure 36
Under, dial disc SD is integrally provided with cylinder light shield M, but can also be while formation device uses up cover pattern, in circle
Two sides in the Y-direction of the outer peripheral face of cylinder light shield M set the scale (grid) that can be read by encoder head.
Even being formed with the light shield M (light shield holding cylinder 21) of different-diameter also always with solid in the top ends of rotating shaft 21S
Fixed diameter carrys out precision machined cylinder 21K.Cylinder 21K is by the one of the framework (fuselage) 200 of exposure device main body
Part incised notch is supported into the part of U-shaped by the moveable Z movable bodys 204 on above-below direction (Z-direction).In framework 200
The end that the incised notch part of U-shaped extends in z-direction, is formed with Z in mode relative at a prescribed interval in the X direction
Linearly rail portion 201A, 201B for extending on direction.
It is formed with Z movable bodys 204：For the recessed of the substantially the latter half using air bearing supporting cylinder body 21K
Fall into the cushion part 204P of semicircle shape；And slide section 204A, 204B fastened with rail portion 201A, 201B of framework 200.It is sliding
The axle that block portion 204A, 204B is mechanically contacted in the way of smoothly being moved relative to rail portion 201A, 201B in z-direction
Hold or air bearing supporting.
Be provided with framework 200 by can around the axis parallel with Z axis rotate in the way of by the ball-screw 203 of e axle supporting,
The driving source (motor, reduction gearing etc.) 202 for rotating the ball-screw 203.The nut portions screwed togather with ball-screw 203 are located at
In cam member 206, the cam member 206 is located at the downside of Z movable bodys 204.Therefore, by the rotation of ball-screw 203, make
Obtain cam member 206 to move linearly in z-direction, thus, Z movable bodys 204 also move linearly in z-direction.Though in Figure 36
It is not shown, but it is also possible to be provided with the component of the top ends of rotating bearing ball leading screw 203 so that cam member 206 in X-direction or
Displacement is not produced in person's Y-direction and the guiding elements that guides of the mode that moves in z-direction.
Cam member 206 and Z movable bodys 204 can be fixed as one, or by rigidity height in z-direction in X
The link such as the low leaf spring of rigidity or flexure member on direction or Y-direction.Or, it is also possible to respectively in cam member 206
Upper surface and Z movable bodys 204 lower surface on form spheric seating, steel ball is set between these spheric seatings.Like this, can
On one side in z-direction with high rigidity bearer cams component 206 and Z movable bodys 204, while allowing the cam structure centered on steel ball
The relative micro inclination of part 206 and Z movable bodys 204.And, in the supporting device of Figure 36, in Z movable bodys 204 and framework
Be provided between 200 deadweight for supporting cylinder light shield M (light shield holding cylinder 21) most elastic bearing component 208A,
208B。
Elastic bearing component 208A, 208B is by changing the air slide structure of length by internally supplying compressed gas
Into supporting the load-carrying of the cylinder light shield M (light shield holding cylinder 21) supported by Z movable bodys 204 using air pressure.Movable using Z
The cushion part 204P of body 204 supports the situation of the cylinder 21K of the rotary shaft as cylinder light shield M (light shield holding cylinder 21)
Under, deadweight is also different certainly for the different cylinder light shield M (light shield holding cylinder 21) of diameter.Therefore, supply is adjusted according to the deadweight
To the pressure as the compressed gas in the air slide of elastic bearing component 208A, 208B.Thereby, it is possible to work is greatly lowered
For the load-carrying in the Z-direction between the nut portions in ball-screw 203 and cam member 206, make ball-screw 203 also with
Minimum torque is rotated, and therefore, it is possible to make driving source 202 also minimize, is prevented from because of the framework 200 that heating etc. causes
Deformation.
In addition, not shown in Figure 36, but position in the Z-direction of Z movable bodys 204 is utilized as linear encoder
Device for measuring length critically measured with the Measurement Resolution below sub-micron, and driven come SERVO CONTROL based on the measured value
Dynamic source 202.Furthermore, it is also possible to the change being additionally provided with to acting on the load-carrying between Z movable bodys 204 and cam member 206 is carried out
The load measuring sensor of measurement or measurement because of strain transducer for deforming caused by the stress in z-direction of cam member 206 etc.,
According to the measured value from each sensor, SERVO CONTROL is supplied to the air slide as elastic bearing component 208A, 208B
Compressed gas pressure (supply and exhaust of gas).
And, sometimes by cylinder light shield M (light shield holding cylinder 21) on the cushion part 204P of Z movable bodys 204, and
And the height in z-direction based on driving source 202 is set at after the position of regulation, be illuminated optical system IL,
In various adjustment, the way of calibration of projection optical system PL, or the result based on calibration, cylinder light shield M is made again, and (light shield is protected
Hold cylinder 21) position fine motion in z-direction.The supporting device of the Z movable bodys 204 with Figure 36 is also located at cylinder light shield M (light shields
Holding cylinder 21) opposite side rotating shaft on, by adjust respectively the supporting device located at both sides each Z movable bodys 204 in Z
Position on direction, additionally it is possible to adjust micro slopes of the Pivot axle AX1 relative to XY faces.By with upper type, also may be used
It is after being completed in cylinder light shield M (the light shield holding cylinder 21) position adjustments in z-direction, tilt adjustments installed, Z is movable
Body 204 is mechanically clipped between rail portion 201A, 201B (that is, framework 200).
When the maximum gauge of the cylinder light shield M (light shield holding cylinder 21) that will be mountable to projection aligner is set to DSa,
When minimum diameter is set to DSb, the stroke in z-direction of Z movable bodys 204 is preferably (DSa-DSb)/2.As an example,
When the maximum gauge of installable cylinder light shield M (light shield holding cylinder 21) is set into 300mm, minimum diameter is set to 240mm
When, the stroke of Z movable bodys 204 is 30mm.
The cylinder light shield M of diameter 300mm it is meant that compared with the cylinder light shield M of diameter 240mm, in the week of cylinder light shield
To only expand 60mm × π ≈ 188mm as the pattern forming region of light shield M on (scan exposure direction).Swept such as conventional
Retouch exposure device like that, in the case of plane light shield is one-dimensionally scanned movement, pattern is expanded in a scanning direction and is formed
Region can cause maximization and in order that the light of the light shield objective table corresponding with the size of plane light shield expansion more than 180mm
The mobile stroke of cover objective table expands the maximization of the airframe structure of more than 180mm.In contrast, as shown in figure 36, only pass through
Enable the Z movable bodys 204 supported to rotary shaft AX1 (rotating shaft 21S) of cylinder light shield M (light shield holding cylinder 21) in Z side
Critically move upwards, it is not necessary to the other parts of device is maximized, it becomes possible to easily expand the pattern forming region of light shield.
＜ device making methods ＞
Hereinafter, reference picture 37 is illustrated to device making method.Figure 37 is the device manufacture for showing device inspection apparatus
The flow chart of method.The device making method can be real by any one in first embodiment~the 7th implementation method
It is existing.
In the device making method shown in Figure 37, first, such as display based on self-emission devices such as organic EL is carried out
The function and performance design of panel, circuit pattern, the wiring pattern (step S201) needed using the design such as CAD.Then, it is based on
Light shield M (step S202) of the layer amount needed for being made by the pattern of each layer in the various layers of the designs such as CAD.In addition,
Prepare to be wound with the supply as the flexible substrate P (resin film, metal foil film, plastics etc.) of the base material of display panel in advance
With volume FR1 (step S203).Additionally, the substrate P of the web-like prepared in step S203 can be as needed to its surface
The substrate being modified, the substrate for being formed with basalis (such as minute asperities based on impressing mode) in advance, are laminated in advance
There is the substrate of photosensitive functional membrane or hyaline membrane (insulating materials).
Then, formed in substrate P by constitute display panel device electrode, wiring, dielectric film, TFT (partly lead by film
Body) etc. composition backsheet layer, and the hair based on self-emission devices such as organic EL is formed in the way of being laminated on the backsheet layer
Photosphere (display pixel portion) (step S204).In step S204, also contain use explanation in each implementation method above
Exposure device U3 come the conventional photo-mask process that is exposed to photoresist layer, but also include being based on following operation
Treatment, the operation includes：The substrate P for being coated with photonasty silane coupling material to substitution photoresist carries out pattern exposure
Light forms the exposure process of hydrophily and hydrophobic pattern, photosensitive catalyst layer is carried out on a surface of the substrate
Pattern exposure and formed by non-electrolytic plating method metal film pattern (wiring, electrode etc.) wet type operation, or, using containing
There is printing process that electrically conductive ink of Nano silver grain etc. draws a design etc..
Then, base is cut by each display panel device being continuously manufactured by the substrate P of strip by volume mode
Plate P, stickup protective film (environment reply barrier layer) and/or colored filter etc. on the surface of each display panel device, from
And assembly device (step S205).Then, carry out inspection operation, check display panel device whether normally function, be
It is no to meet desired performance and characteristic (step S206).By the above, display panel (flexible display) can be manufactured.
The exposure device of above-mentioned implementation method and its variation is by with the mechanical precision for keeping regulation, electric essence
The mode of degree and optical accuracy will have in each inscape enumerated this application claims in the range of interior various
Subsystem assembles manufacture.In order to ensure these various precision, before and after exposure device is assembled, for various optical systems
System carries out the adjustment for reaching optical accuracy, and the adjustment for reaching mechanical precision is carried out for various mechanical systems, for
Various electrical systems carry out the adjustment for reaching electric precision.The assembling procedure bag of exposure device is assembled to from each subsystem
Include pipeline connection for connecting up connection and pneumatic circuit of the mechanical connection between each subsystem, electric circuit etc..
Before being assembled to the assembling procedure of exposure device from each subsystem, the respective assembling procedure of each subsystem is there certainly exist.
At the end of the assembling procedure that each subsystem is assembled into exposure device, structure adjusting is carried out, it is ensured that exposure device is in entirety
On various precision.Additionally, the manufacture of exposure device is preferably in the dust free room managed temperature and cleanliness factor etc.
In carry out.
In addition, the inscape of above-mentioned implementation method and its variation can be appropriately combined.In addition, also not using sometimes
A part of inscape.And, can also carry out without departing from the spirit and scope of the invention inscape replacing or
Change.As long as in addition, laws and regulations are allowed, quote in the above-described embodiment relevant with exposure device etc. can be quoted
The record of entire disclosure publication and United States Patent (USP) as the record of this specification a part.Like this, based on above-mentioned implementation
Mode, the other embodiment made by those skilled in the art etc. and application technology etc. are also integrally incorporated in of the invention
In the range of.
Description of reference numerals
1 device inspection apparatus
2 substrate feeding devices
4 substrate retracting devices
5 host control devices
U3 exposure devices (substrate board treatment)
M light shields
IR1~IR6 illumination regions
IL1~IL6 lamp optical systems
ILM light optics modules
PA1~PA6 view fields
PLM projection optics modules
Claims (24)
1. a kind of exposure device, it is characterised in that
Have：
Lamp optical system,, by conduct illuminating light to cylinder light shield, the cylinder light covers on the axis relative to regulation to specify for it
Radius of curvature bending curved surface outer peripheral face on have pattern；
Base supporting mechanism, its supporting substrates；
Projection optical system, it will be projected to the substrate branch by the pattern of the cylinder light shield of the illumination optical illumination
Hold the substrate that mechanism is supported；
Mechanism is changed, it changes the cylinder light shield；With
Adjustment portion, its it is described replacing mechanism the cylinder light shield is replaced by diameter different cylinder light shield when, to the photograph
At least one party at least a portion of at least a portion of bright optical system and the projection optical system is adjusted.
2. exposure device as claimed in claim 1, it is characterised in that
The base supporting mechanism is the curved surface with the radius bend relative to the axis for specifying to specify, in the curved surface
The substrate supporting cylinder for being wound with a part for substrate and being pivoted about with the axis,
The projection optical system will be projected to being configured at by the pattern of the cylinder light shield of the illumination optical illumination
State the substrate on the curved surface of substrate supporting cylinder.
3. exposure device as described in claim 1 or 2, it is characterised in that
When the replacing mechanism is replaced by the different cylinder light shield of the diameter,
The adjustment portion in the information based on the different cylinder light shield of the diameter, at least one of the lamp optical system
After at least one party divided at least a portion with the projection optical system is adjusted, at least using located at described straight
The figure of the adjustment of the part of the supporting of outer peripheral face and the base supporting mechanism substrate of the different cylinder light shield in footpath
Case adjusts the exposure device.
4. exposure device as claimed in claim 3, it is characterised in that
The different cylinder light shield of the diameter has the information storage part of storage information on the surface,
The different cylinder light shield of the diameter information Store is in described information storage part or is contained in relevant with conditions of exposure
Exposure information,
The adjustment portion obtains the letter of the different cylinder light shield of the diameter from described information storage part or the exposure information
Breath.
5. exposure device as claimed in claim 3, it is characterised in that
With measurement apparatus, the cylinder light shield cylinder light different to obtain the diameter of object is changed in measurement apparatus measurement
The information of cover.
6. the exposure device as any one of Claims 1 to 5, it is characterised in that
The projection optical system has in the rotation for including the Pivot axle of the cylinder light shield and substrate supporting cylinder
Both heart axles and each other across first projection optical system and the second projected light of the planar configuration parallel with both
System,
It is configured to using the different cylinder light shield of the diameter of replacing mechanism replacing, in the rotation with the cylinder light shield
The illumination of on the orthogonal direction of Pivot axle of central shaft and substrate supporting cylinder, first projection optical system is regarded
The position of field is constant with the position of the illumination field of view of second projection optical system.
7. the exposure device as any one of Claims 1 to 5, it is characterised in that
Cylinder light shield that can be different from multiple diameters accordingly changes part.
8. a kind of exposure device, it is characterised in that
Have：
Light shield maintaining body, it is bent in the axis relative to regulation with predetermined radius has figure on the outer peripheral face of cylindrical shape
Case, one in the different multiple cylinder light shields of diameter each other is provided with replaceable mode, and make it around the regulation
Axis rotates；
Illuminator, it is by illumination in the pattern of the cylinder light shield；
Base supporting mechanism, its face or flat bearing substrate along bending, substrate is shone by coming from by the illumination light
The light of the pattern of the cylinder light shield penetrated is exposed；With
Adjustment portion, its basis is installed on the diameter of the cylinder light shield of the light shield maintaining body, at least to the regulation
The distance between axis and described base supporting mechanism are adjusted.
9. exposure device as claimed in claim 8, it is characterised in that
The different multiple cylinder light shields of the diameter are the transmission-type cylinder light of the pattern with transmission-type on the outer peripheral face
Cover,
The adjustment portion will be installed on the outer peripheral face and the substrate of the transmission-type cylinder light shield of the light shield maintaining body
Interval between the substrate that supporting device is supported is set in prespecified allowed band.
10. exposure device as claimed in claim 9, it is characterised in that
The illuminator has lamp optical system, inner side direction of the lamp optical system from the transmission-type cylinder light shield
The side that the outer peripheral face is radiated at the axis of the regulation extends upward to the illuminating bundle of slit-shaped,
The adjustment portion is justified to the illuminating bundle according to the diameter of the transmission-type cylinder light shield of the installation in the transmission-type
Width on the direction of rotation of cylinder light shield is adjusted.
A kind of 11. device inspection apparatus, it is characterised in that
Have：
Exposure device any one of claim 1~10；With
The substrate feeding device of the substrate is supplied to the exposure device.
A kind of 12. device making methods, it is characterised in that
Including：
Exposure device any one of usage right requirement 1~10, by the pattern exposure of the cylinder light shield in institute
State substrate；With
Processed by the exposed substrate, to form the pattern with the cylinder light shield on the substrate
Corresponding device.
A kind of 13. exposure devices, it makes to form figuratum cylinder light along the barrel surface with first axle at a distance of predetermined radius
Cover rotates around the first axle, to projection on the substrate for being supported to be moved along the face or flat face that bend from described in
The light of the pattern of cylinder light shield, pattern described in scan exposure on the substrate, the exposure device is characterised by,
Including：
Light shield maintaining body, it is installed in the different multiple cylinder light shields of the diameter each other prepared as the cylinder light shield
Any one, is driven by the first drive division and is rotated around the first axle；
Base supporting mechanism, its described substrate of supporting, the face or described flat by the driving of the second drive division along the bending
Face movement；And
Adjustment portion, its according to be installed on the light shield maintaining body the cylinder light shield diameter, to the first axle with
The distance between described base supporting mechanism is adjusted.
14. exposure devices as claimed in claim 13, it is characterised in that
The multiple cylinder light shield has the rotating shaft prominent to the both sides on the direction that the first axle extends respectively,
The light shield maintaining body has the cushion part of the supporting rotating shaft,
The adjustment portion includes movable body, and the movable body is to the distance between the first axle and the base supporting mechanism
The side being adjusted moves up the cushion part.
15. exposure devices as claimed in claim 13, it is characterised in that
The substrate is the substrate of the sheet with flexible strip,
The base supporting mechanism has rotating cylinder, and the rotating cylinder is relative to the first axle configured in parallel
The part that two axis bend to the outer peripheral face of cylinder planar with predetermined radius winds the substrate to support the substrate, and
Driven by the second drive division and rotated around the second axis, the substrate is moved to strip direction.
16. exposure device as described in claim 13 or 15, it is characterised in that
The adjustment portion is according to the diameter of the cylinder light shield for being installed on the light shield maintaining body, so that what is be mounted is described
The side in the gap of regulation is configured between the substrate that the outer peripheral face of cylinder light shield and the base supporting mechanism are supported
Formula adjusts the mounted cylinder light shield or the base supporting mechanism in the position being provided with the direction in the gap.
17. exposure devices as claimed in claim 15, it is characterised in that
Also include projection optical system, its configuration is being installed on the cylinder light shield of the light shield maintaining body and the rotation
Between roller, by the picture projection of the pattern of the mounted cylinder light shield in the base supported by the rotating cylinder
On plate.
18. exposure devices as claimed in claim 17, it is characterised in that
Also include field stop, the field stop, will be by the projected light in the circumference of the outer peripheral face of the rotating cylinder
The view field for learning the picture of the Systems Projection pattern on the substrate is set as the exposed width of given size.
19. exposure devices as claimed in claim 18, it is characterised in that
Also include lamp optical system, the lamp optical system is shone to the cylinder light shield for being installed on the light shield maintaining body
The illumination light of exposure is penetrated,
Field stop configuration in the lamp optical system, by setting the illumination light on the cylinder light shield
Illumination region sets the exposed width.
20. exposure device as described in claim 18 or 19, it is characterised in that
The field stop is adjusted to change according to the diameter of the cylinder light shield for being installed on the light shield maintaining body
The exposed width.
21. exposure device as any one of claim 17~20, it is characterised in that
The radius of curvature of the projection image planes of the pattern projected by the projection optical system is being set to Rm, will be by institute
State the rotation of cylinder light shield and be set to Vm along the peripheral speed of the picture of the pattern of the projection image planes movement, will be by described
The radius of curvature on the surface of the substrate of rotating cylinder supporting is set to Rp, by the movement by the rotation of the rotating cylinder
When the peripheral speed on the surface of the substrate is set to Vp,
With in Rm<It is set as Vm in the case of Rp>Vp, in Rm>It is set as Vm in the case of Rp<The mode of Vp, controls described the
One drive division and second drive division.
A kind of 22. pattern exposure methods, are the method by pattern described in exposure device on the substrate scan exposure, described
Exposure device is installed and forms figuratum cylinder light shield along the barrel surface with first axle at a distance of predetermined radius, and while is made
The cylinder light shield rotates around the first axle, while can revolved around the second axis with the first axle configured in parallel
The outer peripheral face winding of the rotating cylinder for turning has the substrate of the sheet of flexible strip and makes the substrate in the direction of strip
Upper movement, the pattern exposure method is characterised by,
Including：
First stage, any one in the different multiple cylinder light shields of the radius each other that will prepare as the cylinder light shield
When being installed on the exposure device, the radius according to the cylinder light shield adjusts the cylinder light shield relative to the rotating cylinder
Installation site, and be set as the pattern plane of the cylinder planar of mounted cylinder light shield and the institute for being wound in the rotating cylinder
There is predetermined distance between the surface for stating substrate；And
Second stage, when the scan exposure is carried out, the radius of the pattern plane according to mounted cylinder light shield be wound in
Difference between the radius on the surface of the substrate of the rotating cylinder, the anglec of rotation of the cylinder light shield to being mounted
Difference is set between the angular velocity of rotation of speed and the rotating cylinder.
23. pattern exposure methods as claimed in claim 22, it is characterised in that
The exposure device has：
Illuminator, it irradiates illumination to the illumination region for being set in a part for the pattern plane of the mounted cylinder light shield
Light；And
Projection optical system, the picture of the pattern in the illumination region is imaged in be set in and is wound in the rotation rolling by it
The view field of the part on the surface of the substrate of the outer peripheral face of cylinder,
In the first stage, including：
So that the illumination region being set on mounted cylinder light shield be set on the surface of the substrate described in
The mode of view field's optical conjugate, according to the radius of the cylinder light shield, adjustment constitutes the projection optical system or described
At least one of position of the optical component of illuminator.
24. pattern exposure methods as claimed in claim 23, it is characterised in that
The projection image planes of the picture of the pattern being imaged by the projection optical system according to mounted cylinder light shield half
Footpath and be in radius of curvature R m bend state, the surface of the substrate is in song according to the radius of the rotating cylinder
The state of rate radius Rp bendings,
In the second stage, including：
In the peripheral speed of the picture of the pattern that will be moved along the projection image planes by the rotation of the cylinder light shield
Be set to Vm, when the peripheral speed on the surface of the substrate of movement by the rotation of the rotating cylinder is set into Vp, with
Rm<Vm is adjusted in the case of Rp>Vp, in Rm>Vm is adjusted in the case of Rp<The mode of Vp, set the cylinder light shield and
The respective angular velocity of rotation of rotating cylinder.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-087650 | 2013-04-18 | ||
| JP2013087650 | 2013-04-18 | ||
| JP2013154965 | 2013-07-25 | ||
| JP2013-154965 | 2013-07-25 | ||
| CN201480034715.7A CN105339846B (en) | 2013-04-18 | 2014-03-24 | Substrate board treatment and device making method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480034715.7A Division CN105339846B (en) | 2013-04-18 | 2014-03-24 | Substrate board treatment and device making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106933066A true CN106933066A (en) | 2017-07-07 |
| CN106933066B CN106933066B (en) | 2018-10-23 |
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ID=51731223
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711078129.4A Active CN107908083B (en) | 2013-04-18 | 2014-03-24 | Scanning exposure method and method for manufacturing electronic device |
| CN201611264164.0A Active CN106933066B (en) | 2013-04-18 | 2014-03-24 | Exposure device, device inspection apparatus and device making method and pattern exposure method using the exposure device |
| CN201810312226.3A Active CN108710263B (en) | 2013-04-18 | 2014-03-24 | Scanning exposure device |
| CN201480034715.7A Active CN105339846B (en) | 2013-04-18 | 2014-03-24 | Substrate board treatment and device making method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711078129.4A Active CN107908083B (en) | 2013-04-18 | 2014-03-24 | Scanning exposure method and method for manufacturing electronic device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810312226.3A Active CN108710263B (en) | 2013-04-18 | 2014-03-24 | Scanning exposure device |
| CN201480034715.7A Active CN105339846B (en) | 2013-04-18 | 2014-03-24 | Substrate board treatment and device making method |
Country Status (6)
| Country | Link |
|---|---|
| JP (4) | JP6269658B2 (en) |
| KR (5) | KR102062509B1 (en) |
| CN (4) | CN107908083B (en) |
| HK (2) | HK1255723A1 (en) |
| TW (4) | TWI640841B (en) |
| WO (1) | WO2014171270A1 (en) |
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| WO2017151291A1 (en) | 2016-03-04 | 2017-09-08 | Applied Materials, Inc. | Wire grid polarizer manufacturing method |
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| KR102713971B1 (en) * | 2018-01-10 | 2024-10-08 | 도판 홀딩스 가부시키가이샤 | Photomask |
| JP7232586B2 (en) * | 2018-07-31 | 2023-03-03 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM |
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