CN108463085B

CN108463085B - Air cooling radiator

Info

Publication number: CN108463085B
Application number: CN201710089912.4A
Authority: CN
Inventors: 廖家淯; 陈世昌; 黄哲威; 黄启峰; 韩永隆
Original assignee: Microjet Technology Co Ltd
Current assignee: Microjet Technology Co Ltd
Priority date: 2017-02-20
Filing date: 2017-02-20
Publication date: 2020-03-27
Anticipated expiration: 2037-02-20
Also published as: CN108463085A

Abstract

An air-cooled heat dissipation device is used to dissipate heat from electronic components. The air-cooled heat dissipation device includes a carrier substrate, a gas pump, and a radiator. The carrier substrate includes a gas-conducting end opening and a heat-conducting plate, wherein the heat-conducting plate is arranged on the upper surface and corresponds to the gas-conducting end opening, and the electronic component is arranged on the heat-conducting plate. The gas pump is fixed on the lower surface of the carrier substrate and corresponds to the closed gas-conducting end opening. The radiator is arranged on the electronic component. By driving the gas pump, gas flows into the gas-conducting end opening and performs heat exchange on the heat-conducting plate to achieve heat dissipation of the electronic component.

Description

Air cooling heat dissipation device

[ technical field ] A method for producing a semiconductor device

The present invention relates to an air-cooled heat dissipation device, and more particularly, to an air-cooled heat dissipation device using a gas pump to provide driving airflow for heat dissipation.

[ background of the invention ]

With the progress of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, video players, etc. have been developed towards being light, thin, portable and high-performance, and these electronic devices must be configured with various high-integration or high-power electronic components in their limited internal spaces, so that the electronic devices generate more heat energy during operation and cause high temperature in order to make the operation speed of the electronic devices faster and function more powerful. In addition, most of these electronic devices are designed to be thin, flat and compact, and have no additional internal space for heat dissipation and cooling, so that the electronic components in the electronic devices are susceptible to heat energy and high temperature, which may cause interference or damage.

Generally, the heat dissipation method inside the electronic device can be divided into active heat dissipation and passive heat dissipation. The active heat dissipation is usually implemented by disposing an axial fan or a blower fan inside the electronic device, and driving airflow by the axial fan or the blower fan to transfer heat energy generated by electronic components inside the electronic device. However, the axial flow fan and the blower fan generate relatively large noise during operation, and have relatively large volumes, which are not easy to be thinned and miniaturized, and the axial flow fan and the blower fan have relatively short service lives, so the conventional axial flow fan and the blower fan are not suitable for being used in light-weight, thin and portable electronic equipment to dissipate heat.

Furthermore, many electronic components are soldered on a Printed Circuit Board (PCB) by using Surface Mount Technology (SMT), Selective Soldering (Selective Soldering), etc., however, the electronic components soldered by the above Soldering method are easily separated from the PCB after being exposed to high heat energy and high temperature for a long time, and most of the electronic components are not resistant to high temperature, and if the electronic components are exposed to high heat energy and high temperature for a long time, the performance stability and the lifetime of the electronic components are easily reduced.

Fig. 1 is a schematic structural diagram of a conventional heat dissipation mechanism. As shown in fig. 1, the conventional heat dissipation mechanism is a passive heat dissipation mechanism, and includes a heat conduction plate 12, the heat conduction plate 12 is attached to an electronic component 11 to be dissipated by a heat conduction glue 13, and the electronic component 11 can dissipate heat by heat conduction and natural convection through a heat conduction path formed by the heat conduction glue 13 and the heat conduction plate 12. However, the heat dissipation efficiency of the heat dissipation mechanism is poor, and the application requirements cannot be met.

In view of the above, there is a need to develop an air-cooling heat dissipation device to solve the problems in the prior art.

[ summary of the invention ]

An object of the present invention is to provide an air-cooled heat dissipation device, which can be applied to various electronic devices to dissipate heat from electronic components inside the electronic devices, so as to improve heat dissipation efficiency, reduce noise, stabilize the performance of the electronic components inside the electronic devices, and prolong the service life.

Another objective of the present invention is to provide an air-cooled heat dissipation device, which has a temperature control function, and can control the operation of an air pump according to the temperature change of electronic components inside an electronic device, so as to enhance the heat dissipation performance and prolong the service life of the air-cooled heat dissipation device.

In order to achieve the above object, a broader aspect of the present invention is to provide an air-cooled heat dissipation device for dissipating heat from an electronic component, the air-cooled heat dissipation device including a carrier substrate including an upper surface, a lower surface, an air-guiding end opening, and a heat conduction plate, wherein the heat conduction plate is disposed on the upper surface and corresponds to the air-guiding end opening, and the electronic component is disposed on the heat conduction plate; the gas pump, the gas pump is piezoelectric actuation gas pump, sets firmly in the lower surface of bearing substrate, and corresponds and seals the air guide end opening, and the gas pump contains: the resonance sheet is provided with a hollow hole; a piezoelectric actuator disposed corresponding to the resonator plate; the side wall is arranged on the bottom plate in a protruding mode around the periphery of the bottom plate and forms an accommodating space with the bottom plate, the resonance sheet and the piezoelectric actuator are arranged in the accommodating space, the opening is arranged on the side wall, and the resonance sheet and the side wall of the cover plate define a confluence chamber together; when the piezoelectric actuator is driven to perform the exhaust operation, the gas flows into the opening of the gas guide end from the first cavity through the hollow hole of the resonance sheet and exchanges heat with the heat conduction plate.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of a conventional heat dissipation mechanism.

Fig. 2A is a schematic structural diagram of an air-cooled heat dissipation device according to a preferred embodiment of the present disclosure.

Fig. 2B is a schematic structural diagram of the air-cooled heat dissipation apparatus shown in fig. 2A from another view angle.

Fig. 3 is a schematic structural diagram of the air-cooled heat dissipation apparatus shown in fig. 2A in an AA cross section.

Fig. 4A and 4B are schematic exploded views of a gas pump according to a preferred embodiment of the present invention from different viewing angles.

Fig. 5A is a schematic front view of a piezoelectric actuator according to a preferred embodiment of the present invention.

Fig. 5B is a schematic diagram of a back structure of the piezoelectric actuator according to the preferred embodiment of the present invention.

Fig. 5C is a schematic cross-sectional view of a piezoelectric actuator according to a preferred embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of the air-cooled heat dissipation device shown in fig. 2B in BB cross section.

Fig. 7A is a schematic cross-sectional view of the air-cooled heat dissipation apparatus shown in fig. 2B in a cross-section CC.

Fig. 7B to 7D are schematic views illustrating the operation of the gas pump according to the preferred embodiment of the present invention.

Fig. 8 is a schematic diagram of a control system of an air-cooled heat dissipation device according to a preferred embodiment of the present invention.

[ detailed description ] embodiments

Exemplary embodiments that embody features and advantages of this disclosure are described in detail below in the detailed description. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Referring to fig. 2A, fig. 2B and fig. 3, fig. 2A is a schematic structural diagram of an air-cooled heat dissipation device according to a preferred embodiment of the present invention, fig. 2B is a schematic structural diagram of the air-cooled heat dissipation device shown in fig. 2A from another view angle, and fig. 3 is a schematic structural diagram of the air-cooled heat dissipation device shown in fig. 2A at an AA cross section. As shown in the figure, the air-cooled heat dissipation device 2 can be applied to an electronic device, such as but not limited to a portable computer, a tablet computer, an industrial computer, a portable communication device, and a video player, to dissipate heat of an electronic component 3 to be dissipated in the electronic device. The air-cooled heat dissipation device 2 comprises a carrier substrate 20, an air pump 21 and a heat sink 26, wherein the carrier substrate 20 comprises an upper surface 20a, a lower surface 20b, an air guide end opening 23 and a heat conduction plate 25. The carrier substrate 20 may be, but is not limited to, a printed circuit board for carrying and disposing the electronic components 3 and the gas pump 21. The air guide end opening 23 of the carrier substrate 20 penetrates the upper surface 20a and the lower surface 20 b. The gas pump 21 is fixedly disposed on the lower surface 20b of the carrier substrate 20, correspondingly assembled and positioned at the gas guide end opening 23, and closes the gas guide end opening 23. The heat conduction plate 25 is disposed on the upper surface 20a of the carrier substrate 20 and is assembled and positioned on the air guide end opening 23, and a gap G is formed between the heat conduction plate 25 and the carrier substrate 20 for air to flow through. In the present embodiment, the heat conduction plate 25 further has a plurality of heat dissipation fins 25a disposed on the surface of the heat conduction plate 25 and disposed adjacent to the air guiding end opening 23, but not limited thereto, for increasing the heat dissipation area and further improving the heat dissipation efficiency. The electronic component 3 is disposed on the heat conduction plate 25, and one surface of the electronic component 3 is attached to the heat conduction plate 25, and the heat can be dissipated through the heat conduction path of the heat conduction plate 25. The heat sink 26 is disposed on the electronic component 3 and attached to the other surface of the electronic component 3. The heat dissipation of the electronic component 3 is realized by driving the air pump 21 to guide the air flow into the air guide end opening 23 and perform heat exchange on the heat conduction plate 25.

In the present embodiment, the heat sink 26 includes a base 261 and a plurality of heat dissipation sheets 262, the base 261 is attached to the other surface of the electronic component 3, and the plurality of heat dissipation sheets 262 are vertically connected to the base 261. By the arrangement of the heat sink 26, the heat dissipation area can be increased, so that the heat generated by the electronic component 3 can be conducted away through the heat conduction path of the heat sink 26.

In the present embodiment, the gas pump 21 is a piezoelectric-actuated gas pump for driving the gas to flow so as to guide the gas from the outside of the air-cooled heat sink 2 into the gas guide opening 23. In some embodiments, the carrier substrate 20 further includes at least one reflow groove 24, and the reflow groove 24 penetrates the upper surface 20a and the lower surface 20b and is disposed adjacent to the periphery of the heat conduction plate 25. When the gas pump 21 introduces the gas into the gas guide end opening 23, the introduced gas flow exchanges heat with the heat conductive plate 25 disposed on the upper surface 20a of the carrier substrate 20, and pushes the gas in the gap G between the carrier substrate 20 and the heat conductive plate 25 to rapidly flow, so that the heat exchanged gas flow discharges heat energy through the gap G, wherein a part of the gas flow flows back to the lower surface 20b of the carrier substrate 20 through the back flow through groove 24, and is subsequently used by the gas pump 21 to cool. In addition, part of the air flow flows along the periphery of the heat conduction plate 25 toward the heat sink 26, and flows through the heat dissipation fins 261 of the heat sink 26 after cooling, so as to accelerate the heat dissipation of the electronic component 3. Because the gas pump 21 is continuously operated to introduce gas, the electronic component 3 can exchange heat with the continuously introduced gas, and the heat exchanged gas is exhausted, so that the heat dissipation of the electronic component 3 can be realized, the heat dissipation efficiency can be improved, and the performance stability and the service life of the electronic component 3 are further improved.

Referring to fig. 4A and 4B, fig. 4A is a front exploded view of a gas pump according to a preferred embodiment of the present invention, and fig. 4B is a rear exploded view of the gas pump according to the preferred embodiment of the present invention. In the present embodiment, the gas pump 21 is a piezoelectric-actuated gas pump for driving the gas flow. As shown in the drawing, the gas pump 21 of the present embodiment includes a resonator plate 212, a piezoelectric actuator 213, a cover plate 216, and the like. The resonator plate 212 is disposed corresponding to the piezoelectric actuator 213 and has a hollow hole 2120 disposed in a central region of the resonator plate 212, but not limited thereto. The piezoelectric actuator 213 includes a suspension plate 2131, an outer frame 2132 and a piezoelectric ceramic plate 2133, wherein the suspension plate 2131 includes a central portion 2131c and an outer peripheral portion 2131d, when the piezoelectric ceramic plate 2133 is driven by a voltage, the suspension plate 2131 can be bent and vibrated from the central portion 2131c to the outer peripheral portion 2131d, the outer frame 2132 is disposed around the outer side of the suspension plate 2131 and has at least one support 2132a and a conductive pin 2132b, but not limited thereto, each support 2132a is disposed between the suspension plate 2131 and the outer frame 2132, and two ends of each support 2132a are connected to the suspension plate 2131 and the outer frame 2132 to provide an elastic support, the conductive pin 2132b is protruded outward from the outer frame 2132 for power supply, and the piezoelectric ceramic plate 2133 is attached to a second surface 2131b of the suspension plate 2131 to deform by receiving the applied voltage to drive the suspension plate 2131 to bend and vibrate. The cover plate 216 has a sidewall 2161, a bottom plate 2162 and an opening 2163, wherein the sidewall 2161 surrounds the periphery of the bottom plate 2162 and protrudes from the bottom plate 2162, and forms a receiving space 216a together with the bottom plate 2162 for the resonator plate 212 and the piezoelectric actuator 213 to be disposed therein, and the opening 2163 is disposed on the sidewall 2161 for the conductive pin 2132b of the outer frame 2132 and the conductive pin 2151 of the conductive plate 215 to pass through the opening 2163 and protrude out of the cover plate 216, so as to connect to an external power source, but not limited thereto.

In the present embodiment, the gas pump 21 further includes two insulating

sheets

2141, 2142 and a conducting sheet 215, but not limited thereto, wherein the two insulating

sheets

2141, 2142 are respectively disposed on the top and bottom of the conducting sheet 215, and the outer shape thereof substantially corresponds to the outer frame 2132 of the piezoelectric actuator 213, and is made of an insulating material, for example: plastic for insulation, but not limited thereto, the conductive sheet 215 is made of conductive material, such as: metal for electrical conduction, and has an outer shape substantially corresponding to the outer frame 2132 of the piezoelectric actuator 213, but not limited thereto. In this embodiment, a conductive pin 2151 may be disposed on the conductive sheet 215 for electrical conduction.

Referring to fig. 5A, 5B and 5C, fig. 5A is a front structural diagram of a piezoelectric actuator according to a preferred embodiment of the present invention, fig. 5B is a rear structural diagram of a piezoelectric actuator according to a preferred embodiment of the present invention, and fig. 5C is a cross-sectional structural diagram of a piezoelectric actuator according to a preferred embodiment of the present invention. As shown in the drawings, in the present embodiment, the suspension plate 2131 has a stepped structure, that is, a protrusion 2131e is further disposed on the central portion 2131c of the first surface 2131a of the suspension plate 2131, and the protrusion 2131e has a circular protrusion structure, but not limited thereto, and in some embodiments, the suspension plate 2131 may also have a plate-shaped square shape with two flat surfaces. As shown in fig. 5C, the protruding portion 2131e of the suspension plate 2131 is coplanar with the first surface 2132C of the outer frame 2132, the first surface 2131a of the suspension plate 2131 and the first surface 2132a 'of the bracket 2132a are also coplanar, and a specific depth is provided between the protruding portion 2131e of the suspension plate 2131 and the first surface 2132C of the outer frame 2132, and the first surface 2131a of the suspension plate 2131 and the first surface 2132 a' of the bracket 2132 a. As shown in fig. 5B and 5C, the second surface 2131B of the suspension plate 2131, the second surface 2132d of the outer frame 2132 and the second surface 2132a "of the support 2132a are planar and coplanar, and the piezoelectric ceramic plate 2133 is attached to the second surface 2131B of the planar suspension plate 2131. In other embodiments, the suspension plate 2131 may also be a square structure with a flat surface and a plate shape, but not limited thereto, and may be varied according to the actual implementation. In some embodiments, the suspension plate 2131, the outer frame 2132 and the support 2132a may be integrally formed, and may be made of a metal plate, such as stainless steel, but not limited thereto. In the present embodiment, the gas pump 21 further has at least one gap 2134 between the suspension plate 2131, the outer frame 2132 and the bracket 2132a for gas to pass through.

Next, an internal and external structure of the gas pump 21 after assembly is described, referring to fig. 6 and 7A, fig. 6 is a schematic cross-sectional view of the air-cooled heat dissipation apparatus shown in fig. 2A in a BB cross-section, and fig. 7A is a schematic cross-sectional view of the air-cooled heat dissipation apparatus shown in fig. 2B in a CC cross-section. As shown in the figure, the gas pump 21 of the present embodiment is sequentially stacked from top to bottom by the cover plate 216, the insulating sheet 2142, the conducting sheet 215, the insulating sheet 2141, the piezoelectric actuator 213, the resonator plate 212 and the like, and the adhesive is applied around the combined and stacked piezoelectric actuator 213, insulating sheet 2141, conducting sheet 215 and the other insulating sheet 2142 to form the adhesive 218, thereby filling the periphery of the accommodating space 216a of the cover plate 216 to complete the sealing. The assembled gas pump 21 has a quadrilateral structure, but not limited thereto, and the shape thereof may be changed according to actual requirements. In addition, in the embodiment, only the conductive pin 2151 (not shown) of the conductive sheet 215 and the conductive pin 2132b (shown in fig. 6) of the piezoelectric actuator 213 are protruded out of the cover plate 216 for connecting with an external power source, but not limited thereto. The assembled gas pump 21 forms a first chamber 217b between the cover plate 216 and the resonator plate 212.

After the gas pump 21 and the carrier substrate 20 are assembled, as shown in fig. 3, the sidewall 2161 of the cover plate 216 abuts against the lower surface 20b of the carrier substrate 20, and closes the gas-guiding opening 23, and the converging chamber 217a is defined by the sidewall 2161 of the cover plate 216 and the resonator plate 212, and as shown in fig. 6, the gas pump is communicated with the outside through the opening 2163 of the cover plate 216, so as to collect gas from the external environment. In the present embodiment, a gap g0 is formed between the resonator plate 212 and the piezoelectric actuator 213 of the gas pump 21, and the gap g0 is filled with a conductive material, such as: the conductive paste, but not limited thereto, can maintain a depth of a gap g0 between the resonator plate 212 and the protrusion 2131e of the suspension plate 2131 of the piezoelectric actuator 213, so as to guide the airflow to flow more rapidly, and since the protrusion 2131e of the suspension plate 2131 and the resonator plate 212 maintain a proper distance, the contact interference between them is reduced, so as to reduce the noise. Therefore, when the piezoelectric actuator 213 is driven to perform the gas collection operation, the gas is firstly collected from the opening 2163 of the cover plate 216 to the collecting chamber 217a, and further flows to the first chamber 217b through the hollow hole 2120 of the resonator plate 212 for temporary storage, and when the piezoelectric actuator 213 is driven to perform the gas discharge operation, the gas flows from the first chamber 217b to the collecting chamber 217a through the hollow hole 2120 of the resonator plate 212, and flows into the gas guide end opening 23, so that the gas flow exchanges heat with the heat conduction plate 25.

The operation of the gas pump 21 is further described below with reference to fig. 7A to 7D, wherein fig. 7B to 7D are schematic views illustrating the operation of the gas pump according to the preferred embodiment of the present invention. First, as shown in fig. 7A, the gas pump 21 is formed by sequentially stacking and positioning the cover plate 216, the other insulating sheet 2142, the conducting sheet 215, the insulating sheet 2141, the piezoelectric actuator 213 and the resonator plate 212 as described above, wherein a gap g0 is formed between the resonator plate 212 and the piezoelectric actuator 213, the resonator plate 212 and the sidewall 2161 of the cover plate 216 jointly define the collecting chamber 217A, and a first chamber 217b is formed between the resonator plate 212 and the piezoelectric actuator 213. When the gas pump 21 is not yet driven by the voltage, the positions of the respective elements are as shown in fig. 7A.

As shown in fig. 7B, when the piezoelectric actuator 213 of the gas pump 21 is actuated by a voltage to vibrate upward, the gas enters the gas pump 21 through the opening 2163 of the cover plate 216, is collected in the collecting chamber 217a, and then flows upward into the first chamber 217B through the hollow hole 2120 of the resonator plate 212, and the resonator plate 212 is also affected by the resonance of the suspension plate 2131 of the piezoelectric actuator 213 to vibrate reciprocally, i.e., the resonator plate 212 deforms upward, i.e., the resonator plate 212 slightly protrudes upward from the hollow hole 2120.

Thereafter, as shown in fig. 7C, the piezoelectric actuator 213 is vibrated downward to return to the initial position, and the upper protrusion 2131e of the suspension plate 2131 of the piezoelectric actuator 213 is slightly protruded upward near the resonator plate 212 at the hollow hole 2120, so as to temporarily store the gas in the gas pump 21 in the upper half of the first chamber 217 b.

As shown in fig. 7D, the piezoelectric actuator 213 vibrates downwards, and the resonator plate 212 vibrates downwards due to the resonance effect of the piezoelectric actuator 213, so that the resonator plate 212 deforms downwards to compress the volume of the first chamber 217b, thereby forcing the gas in the upper layer of the first chamber 217b to flow to both sides and pass through the gap 2134 of the piezoelectric actuator 213 downwards to flow to the hollow hole 2120 of the resonator plate 212 for compression and discharge, and forming a compressed gas flow to the air guide end opening 23 of the supporting substrate 20 to dissipate heat of the heat conducting plate 25. In this embodiment, when the resonator plate 212 vertically reciprocates, the maximum vertical displacement distance can be increased by the gap g0 between the resonator plate 212 and the piezoelectric actuator 213, i.e., the gap g0 between the resonator plate 212 and the piezoelectric actuator 213 can allow the resonator plate 212 to vertically displace more greatly when resonating.

Finally, the resonator plate 212 returns to the initial position, as shown in fig. 7A, and then continuously circulates through the aforementioned operation flow in the sequence of fig. 7A to 7D, so that the gas continuously flows into the converging chamber 217A through the opening 2163 of the cover plate 216, then flows into the first chamber 217b, and then flows into the converging chamber 217A through the first chamber 217b, so that the gas continuously flows into the gas guide opening 23, and the gas can be stably transported. In other words, when the gas pump 21 of the present invention is operated, the gas flows through the opening 2163 of the cover plate 216, the collecting chamber 217a, the first chamber 217b, the collecting chamber 217a and the gas guide opening 23 in sequence, so that the gas pump 21 of the present invention can reduce the number of components of the gas pump 21 and simplify the overall process by using a single component, i.e., the cover plate 216, and the structural design of the opening 2163 of the cover plate 216.

As mentioned above, by the operation of the gas pump 21, the gas is introduced into the gas-guiding end opening 23 of the supporting substrate 20, so that the gas flows into the gap G, and the introduced gas exchanges heat with the heat-conducting plate 25 connected to the electronic component 3, and continuously pushes the gas in the gap G to flow rapidly, so as to make the heat-exchanged gas discharge heat energy to the outside of the gap G, thereby improving the efficiency of heat dissipation and cooling, and further increasing the performance stability and the service life of the electronic component 3. In addition, the fast flowing gas is exhausted from the gap G, so that the convection of the gas around the heat sink 26 is indirectly increased, and the efficiency of heat dissipation and cooling can also be increased.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a control system of the air-cooled heat dissipation apparatus of the present disclosure. As shown in the drawings, the air-cooled heat dissipation device 2 of the preferred embodiment has a temperature control function, and further includes a control system 5, wherein the control system 5 further includes a control unit 51 and a temperature sensor 52, wherein the control unit 51 is electrically connected to the gas pump 21 for controlling the operation of the gas pump 21. The temperature sensor 52 is electrically connected to the control unit 51, is disposed adjacent to the electronic element 3, and is used for sensing the temperature near the electronic element 3, or is directly attached to the electronic element 3 to sense the temperature of the electronic element 3, but not limited thereto, and can transmit the sensing signal to the control unit 51. The control unit 51 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 52, and when the control unit 51 determines that the temperature of the electronic component 3 is higher than the temperature threshold, a control signal is sent to the air pump 21 to operate the air pump 21, so that the air pump 21 drives the airflow to cool the electronic component 3, thereby cooling the electronic component 3 and reducing the temperature. When the control unit 51 determines that the temperature of the electronic component 3 is lower than the temperature threshold, a control signal is sent to the gas pump 21 to stop the operation of the gas pump 21, thereby preventing the gas pump 21 from being operated continuously to shorten the service life and reduce the extra energy consumption. Therefore, through the arrangement of the control system 5, the gas pump 21 of the gas-cooled heat dissipation device 2 can perform heat dissipation and cooling when the temperature of the electronic element 3 is too high, and stop operating after the temperature of the electronic element 3 is reduced, thereby avoiding the reduction of the service life caused by the continuous operation of the gas pump 21, reducing the extra energy consumption, and also enabling the electronic element 3 to operate in a better temperature environment, and improving the stability of the electronic element 3.

In summary, the present disclosure provides an air-cooling heat dissipation device, which can be applied to various electronic devices to dissipate heat from electronic components therein, so as to improve heat dissipation efficiency, reduce noise, stabilize performance of the electronic components in the electronic devices, and prolong service life. In addition, the air cooling heat dissipation device has a temperature control function, and can control the operation of the air pump according to the temperature change of the electronic element in the electronic equipment, so that the heat dissipation efficiency is improved, and the service life of the air cooling heat dissipation device is prolonged.

Various modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims.

[ notation ] to show

11: electronic component

12: heat conduction plate

13: heat-conducting glue

2: air cooling heat dissipation device

20: bearing substrate

20 a: upper surface of

20 b: lower surface

21: gas pump

212: resonance sheet

2120: hollow hole

213: piezoelectric actuator

2131: suspension plate

2131 a: first surface

2131 b: second surface

2131 c: center part

2131 d: outer peripheral portion

2131 e: convex part

2132: outer frame

2132 a: support frame

2132 a': first surface

2132 a': second surface

2132 b: conductive pin

2132 c: first surface

2132 d: second surface

2133: piezoelectric ceramic plate

2134: voids

2141. 2142, and (b) 2: insulating sheet

215: conductive sheet

2151: conductive pin

216: cover plate

216 a: containing space

2161: side wall

2162: base plate

2163: opening part

217 b: the first chamber

217 a: confluence chamber

218: colloid

23: opening of air guide end

24: backflow penetrating groove

25: heat conduction plate

25 a: heat sink

26: heat radiator

261: base seat

262: heat sink

3: electronic component

5: control system

51: control unit

52: temperature sensor

G0, G: gap

Claims

1. an air-cooled radiator, for radiating heat to an electronic component, it is characterized in that, this air-cooled radiator comprises:

a carrier substrate, comprising an upper surface, a lower surface, an air-conducting end opening, and a heat-conducting plate, wherein the heat-conducting plate is disposed on the upper surface and corresponding to the air-conducting end opening, and the electronic component is disposed on the heat-conducting plate ;

A gas pump, the gas pump is a piezoelectrically actuated gas pump, fixed on the lower surface of the carrier substrate, and correspondingly closes the opening of the gas guide end, the gas pump includes:

a resonance sheet, which has a hollow hole;

a piezoelectric actuator, disposed corresponding to the resonant plate; and

A cover plate has a side wall, a bottom plate and an opening, the side wall surrounds the periphery of the bottom plate and protrudes on the bottom plate, and forms an accommodating space with the bottom plate, and the resonance plate and the piezoelectric The actuator is arranged in the accommodating space, the opening is arranged on the side wall, the resonance plate and the side wall of the cover plate together define a confluence chamber, and the resonance plate and the bottom plate of the cover plate together defining a first chamber; and

a radiator, disposed on the electronic component;

Wherein, when the piezoelectric actuator is driven to perform the gas collecting operation, the gas is first collected into the confluence chamber from the opening of the cover plate, and then flows to the first chamber through the hollow hole of the resonant plate The chamber is temporarily stored, when the piezoelectric actuator is driven to perform the exhaust operation, the gas first flows from the first chamber through the hollow hole of the resonance sheet into the opening of the gas guide end, and heats the heat conduction plate exchange.

2 . The air-cooled heat dissipation device of claim 1 , wherein the air-conducting end opening of the carrier substrate penetrates through the upper surface and the lower surface. 3 .

3 . The air-cooled heat dissipation device as claimed in claim 1 , wherein a gap is formed between the heat conduction plate and the carrier substrate for allowing airflow to circulate. 4 .

4 . The air-cooled heat dissipation device of claim 1 , wherein the thermally conductive plate is attached to one surface of the electronic component, and the heat sink is attached to the other surface of the electronic component. 5 .

5 . The air-cooled heat dissipation device of claim 1 , wherein the carrier substrate further comprises at least one reflow channel, the reflow channel penetrates the upper surface and the lower surface, and is adjacent to the heat conduction plate. 6 . perimeter.

6. The air-cooled heat dissipation device of claim 1, wherein the piezoelectric actuator comprises:

a hoverboard with a first surface and a second surface;

an outer frame having at least one bracket, the at least one bracket is connected to the suspension board and the outer frame and is disposed between the suspension board and the outer frame; and

A piezoelectric ceramic plate is attached to the first surface of the suspension board, and is used for applying a voltage to drive the suspension board to bend and vibrate.

7 . The air-cooled heat dissipation device of claim 1 , wherein there is a gap between the resonance plate and the piezoelectric actuator. 8 .

8 . The air-cooled heat dissipation device of claim 6 , wherein the gas pump further comprises at least one insulating sheet and a conductive sheet, and the at least one insulating sheet and the conductive sheet are sequentially arranged on the piezoelectric under the actuator.

9 . The air-cooled heat dissipation device of claim 6 , wherein at least one gap is further formed between the bracket, the suspension board and the outer frame, and two ends of the bracket are respectively connected to the outer frame and the suspension. 10 . plate.

10 . The air-cooled heat dissipation device of claim 6 , wherein the suspension board of the gas pump further has a convex portion on the second surface, and the convex portion is a cylindrical structure. 11 .

11. The air-cooled heat dissipation device of claim 1, wherein the air-cooled heat dissipation device further comprises a control system, the control system comprising:

a control unit electrically connected to the gas pump to control the operation of the gas pump; and

a temperature sensor, electrically connected to the control unit and adjacent to the electronic component, for sensing a temperature of the electronic component and outputting a sensing signal to the control unit;

Wherein, when the control unit receives the sensing signal and determines that the temperature of the electronic component is greater than a temperature threshold, the control unit starts the gas pump to drive the airflow, and when the control unit receives the Upon receiving the sensing signal and judging that the temperature of the electronic component is lower than the temperature threshold, the control unit stops the operation of the gas pump.

12 . The air-cooled heat dissipation device of claim 8 , wherein the outer frame of the piezoelectric actuator has a conductive pin, the conductive sheet has a conductive pin, and the cover of the gas pump has a conductive pin. 13 . The opening part of the board is arranged on the side wall for the conductive pin of the outer frame and the conductive pin of the conductive sheet to pass through the opening part and protrude out of the cover plate, so as to for connection to an external power supply.