CN108351607B - Substrate processing equipment - Google Patents

Abstract

The exposure apparatus EX, which forms a predetermined pattern on a long substrate P while conveying the substrate P in a longitudinal direction, includes: a cylindrical drum DR supporting the substrate P; a main body frame 21 and a1 st optical surface plate 23 as a1 st supporting member for supporting the cylindrical drum DR; a drawing device 11 disposed opposite to the rotary drum DR with the substrate P interposed therebetween, for forming a pattern on the substrate P; the 2 nd optical stage 25 as the 2 nd supporting member holds the drawing device 11; a rotation mechanism 24 for rotatably connecting the 1 st optical bench 23 and the 2 nd optical bench 25; scale parts GPa, GPb for measuring a change in position of the drum DR; and encoder readheads EN1, EN2 that detect the scale of the scale portions GPa, GPb.

Description

Substrate processing equipment

technical field

The present invention relates to a substrate processing apparatus, an adjustment method of the substrate processing apparatus, a device manufacturing system, and a device manufacturing method.

Background technique

Conventionally, as a substrate processing apparatus, a proximity-type pattern exposure apparatus is known, which includes an exposure drum for conveying a sheet-like workpiece (substrate), a mask arranged on the upper portion of the exposure drum, and a multi-surface rotating light from an exposure light source. The mirror is scanned and irradiated to the illumination portion of the exposure mask (see, for example, Patent Document 1). This pattern exposure apparatus exposes the mask pattern of the photomask to the workpiece by irradiating the photomask with light from the illumination unit while conveying the sheet-like workpiece by the exposure drum. In the pattern exposure apparatus described in Patent Document 1, although the workpiece is wound around the exposure drum and conveyed, there is a possibility that the arrangement relationship between the mask and the workpiece may be changed due to the influence of vibration due to the rotation of the exposure drum. In this case, since the arrangement relationship between the workpiece and the mask wound around the exposure drum is shifted from a predetermined arrangement relationship suitable for exposure, it is difficult to accurately expose the mask pattern of the mask to the workpiece.

prior art documents

Patent Document 1: Japanese Patent Laid-Open No. 2007-72171

SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is provided a substrate processing apparatus that conveys a long sheet-like substrate in the longitudinal direction and sequentially forms a predetermined pattern on the sheet-like substrate, comprising: a cylindrical roll having A cylindrical outer peripheral surface having a predetermined radius from a center line extending in a direction intersecting the longitudinal direction supports the sheet-like substrate with a part of the outer peripheral surface; rotatable around the center line; a pattern forming device is disposed opposite to a portion of the outer peripheral surface of the drum that supports the sheet substrate, and forms the pattern on the sheet substrate; a second support member holds the pattern a forming device; a connecting mechanism for connecting the relative arrangement relationship between the reel and the pattern forming device so as to be adjustable; a reference member for rotating around the center line together with the reel, and provided with a measuring device for measuring the reel an index of a positional change in the direction of rotation of the drum or the direction of the centerline; and a first detection device provided on the second support member for detecting the index of the reference member to detect the direction of rotation of the drum or the direction of the centerline position changes.

According to a second aspect of the present invention, there is provided a method for adjusting a substrate processing apparatus having a cylindrical outer peripheral surface with a constant radius from a center line that supports a sheet substrate and is supported by a first support member so as to surround the aforementioned A drum that rotates on a center line, and a pattern forming apparatus that is supported by a second support member so as to form a predetermined pattern on the sheet substrate supported by the drum, the adjustment method comprising: by arranging the second The operation of reading each of a pair of scale portions of the encoder for rotation measurement provided on both sides in the centerline direction of the reel by a pair of read heads on the support member side; detection from the pair of read heads As a result, the operation of the deviation from the predetermined relative arrangement relationship between the reel and the pattern forming apparatus is obtained, and the connection between the first support member and the second support member is adjusted so as to reduce the obtained deviation. The action of the linking mechanism capable of relative displacement.

According to a third aspect of the present invention, there is provided a method for adjusting a substrate processing apparatus having a cylindrical outer peripheral surface with a constant radius from a center line that supports a sheet substrate and is supported by a first support member so as to surround the above-mentioned A drum that rotates on a center line, and a pattern forming apparatus that is supported by a second support member so as to form a predetermined pattern on the sheet substrate supported by the drum, the adjustment method comprising: by arranging the second The operation of reading each of a pair of scale portions of the encoder for rotation measurement provided on both sides in the centerline direction of the reel by a pair of read heads on the support member side; detection from the pair of read heads As a result, the operation of the deviation from a predetermined relative arrangement relationship between the reel and the pattern forming apparatus is obtained, and the pattern forming apparatus on the sheet substrate is adjusted with respect to the reel with respect to the reel reflecting the obtained deviation. The action on the spatial location of the patterned area.

According to a fourth aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus of the first aspect of the present invention.

According to a fifth aspect of the present invention, there is provided a device manufacturing method, wherein the pattern forming apparatus according to the first aspect of the present invention is an exposure apparatus for irradiating the sheet-like substrate with light energy corresponding to the shape of a predetermined pattern; and comprising: The operation of conveying the sheet-like substrate on which the photosensitive functional layer is formed on the surface in the state of being supported by a part of the cylindrical roll in the longitudinal direction; An operation of partially irradiating the light energy from the exposure device, and an operation of forming a layer corresponding to the shape of a predetermined pattern on the sheet substrate by processing the irradiated sheet substrate.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus that sequentially forms a predetermined pattern on the sheet substrate while conveying a long sheet substrate in the longitudinal direction, comprising: a first support member, A shaft-supported drum having a cylindrical outer peripheral surface having a predetermined radius from a center line extending in a direction intersecting the longitudinal direction, and capable of supporting the sheet-like shape with a part of the outer peripheral surface The substrate rotates around the center line, and the second support member aligns and holds a plurality of pattern forming portions in the width direction of the sheet substrate, and the pattern forming portion is formed with the cylinder in order to form the pattern on the sheet substrate. The portion of the outer peripheral surface of the reel that supports the sheet-like substrate is arranged to face each other, and the first rotating mechanism is capable of adjusting the first support member and the second support in order to adjust the inclination of the pattern to be formed on the sheet-like substrate. the relative angular relationship of the members; a reference member, which rotates around the center line together with the drum, and is provided with an index for measuring the rotation direction of the drum or the positional change in the direction of the center line; and a first detection device is provided on the side of the second support member, and detects an index of the reference member to detect a positional change in the rotational direction of the drum, and to detect a relative angle change between the first support member and the second support member.

Description of drawings

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.

FIG. 2 is a perspective view showing the configuration of a main part of the exposure apparatus of FIG. 1 .

FIG. 3 is a diagram showing an arrangement relationship between an alignment microscope and a drawing line on a substrate.

It is a figure which shows the structure of the rotating drum of the exposure apparatus of FIG. 1, and a drawing apparatus.

FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1 .

FIG. 6 is a perspective view showing the configuration of a branched optical system of the exposure apparatus of FIG. 1 .

FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners in the exposure apparatus of FIG. 1 .

FIG. 8 is a perspective view showing the arrangement relationship of the alignment microscope, the trace line, and the encoder head on the substrate.

FIG. 9 is a perspective view showing the surface structure of the rotating drum of the exposure apparatus of FIG. 1 .

FIG. 10 is a plan view showing the configuration of an encoder head of the exposure apparatus of FIG. 1 .

FIG. 11 is a plan view showing an arrangement relationship between a rotating reel and a drawing device of the exposure apparatus of FIG. 1 .

FIG. 12 is a flowchart showing the adjustment method of the exposure apparatus according to the first embodiment.

13 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the second embodiment.

FIG. 14 is a perspective view showing the arrangement of the main parts of the exposure apparatus according to the third embodiment.

FIG. 15 is a diagram showing the configuration of a rotating reel and a drawing device according to the fourth embodiment.

16 is a plan view showing the arrangement of the encoder head of the exposure apparatus according to the fifth embodiment.

17 is a plan view showing the arrangement of the scale disks of the exposure apparatus according to the sixth embodiment.

FIG. 18 is a flowchart showing the device manufacturing method according to the first to fifth embodiments.

Symbol Description

1 Component Manufacturing System

11 Drawing device

12 Substrate transfer mechanism

13 Device Frame

14 Rotational position detection mechanism

16 Controls

21 ontology frame

22 three-point seat

23 The first optical table

24 Rotary Mechanism

25 2nd optical table

31 Calibration detection system

44, 45 XY bisector adjustment mechanism

51 1/2 wavelength plate

52 Polarizer

53 Diffusers

60 1st beam splitter

62 2nd beam splitter

63 3rd beam splitter

73 4th beam splitter

81 Optical deflector

82 1/4 wavelength plate

83 Scanner

84 Bending Mirror

85 f-θ lens system

86 Optical components for Y magnification correction

92 visor

96 Mirrors

97 Rotating polygon mirror

98 Origin detector

100 Mounting components for encoder read heads EN1, EN2

101 Encoder read head EN3, EN4 mounting components

105 Rotation measuring device

106 Driving part of the rotary mechanism

110 Drive part of three-point seat

121 X Moving Mechanisms

122 Z moving mechanism

123 Bearings

130 Roll Support Frame

131 Reel rotation mechanism

132 Reel support member

141 Encoder read head EN5, EN6 mounting components

P substrate

U1, U2 processing unit

EX exposure unit

AM1, AM2 Alignment Microscope

EVC conditioning room

SU1, SU2 Anti-vibration unit

E set face

EPC Edge Position Controller

RT1, RT2 Tensioning Rollers

DR Rotary Reel

AX2 Rotation Centerline

Sf2 shaft

p3 center plane

DL relaxation

UW1～UW5 drawing module

CNT light source device

LB trace beam

I Rotation axis

LL1 to LL5 trace lines

PBS Polarizing Beamsplitter

A7 exposure field

SL beam distribution optics

Le1～Le4 set bearing line

Vw1～Vw6 Observation area

Ks1～Ks3 alignment marks

GPa, GPb scale section

EN1～EN6 encoder read head

SD Ruler Disc

Detailed ways

The form (embodiment) for implementing this invention is demonstrated in detail, referring drawings. It goes without saying that the present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include those that are easily thought of by those with ordinary knowledge in the technical field to which the invention pertains, and those that are substantially the same. In addition, the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the gist of the present invention.

[1st Embodiment]

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs exposure processing on a substrate P, and the exposure apparatus EX is incorporated in a component manufacturing system 1 that performs various processes on the exposed substrate P to manufacture components. First, the component manufacturing system 1 will be described.

＜Component manufacturing system＞

The component manufacturing system 1 is a production line (flexible display manufacturing line) that manufactures a flexible display as a component. Flexible displays, such as organic EL displays, etc. In this component manufacturing system 1, a flexible substrate P is fed out from a supply reel (not shown) that rolls the flexible substrate P into a cylindrical shape, and after various treatments are continuously applied to the fed out substrate P, The so-called roll-to-roll (Ro11 to Ro11) method in which the processed substrate P is wound on a reel for recovery (not shown) as a flexible element. In the component manufacturing system 1 of the first embodiment, the film-like sheet substrate P is fed out from the supply reel, and the substrate P sent out from the supply reel is passed through the processing apparatus U1, the exposure apparatus EX, and the processing apparatus U2 in this order. Afterwards, an example of winding on a reel for recovery. Here, the substrate P to be processed by the component manufacturing system 1 will be described.

The substrate P is made of, for example, a resin film, a foil, or the like made of a metal such as stainless steel or an alloy. As the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin can be used. One or more of resins, polystyrene resins, polyvinyl alcohol resins and other materials.

For the substrate P, it is preferable to select, for example, a thermal expansion coefficient that is not significantly large and that can substantially ignore the amount of deformation due to heat applied to the substrate P in various treatments. The thermal expansion coefficient can be set to be smaller than a threshold value corresponding to the processing temperature or the like by, for example, mixing an inorganic filler with the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, or the like. In addition, the substrate P may be a monolayer of ultra-thin glass having a thickness of about 100 μm produced by a float method or the like, or a laminate in which the above-mentioned resin film, foil, or the like is bonded to the ultra-thin glass.

The board|substrate P comprised in this way is wound into a roll shape, and becomes the roll for supply, and this roll for supply is mounted in the component manufacturing system 1. As shown in FIG. The component manufacturing system 1 equipped with the supply reel repeatedly performs various processes for manufacturing components with respect to the board|substrate P sent out from the supply reel in the longitudinal direction. Therefore, the processed substrate P is in a state in which a plurality of elements are connected. That is, the board|substrate P sent out from the reel for supply is a board|substrate for multiple surfaces. In addition, the surface of the substrate P may be modified and activated by a predetermined pretreatment in advance, or a fine partition structure (concave-convex structure) for precise patterning may be formed on the surface.

The processed board|substrate P is wound up in a roll shape, and is collect|recovered as the roll for collection|recovery. The reel for collection is attached to a not-shown cutting device. The dicing device equipped with the reel for collection divides (cuts) the processed board|substrate P into each element, and becomes a several element according to it. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (direction of the short side), and 10 m or more in the longitudinal direction (the direction of the long side). In addition, the size of the board|substrate P is not limited to the said size.

Next, the component manufacturing system 1 will be described with reference to FIG. 1 . The component manufacturing system 1 includes a processing apparatus U1, an exposure apparatus EX, and a processing apparatus U2. In addition, FIG. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is the direction from the processing apparatus U1 to the processing apparatus U2 via the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. As shown in FIG. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

The processing apparatus U1 performs pre-process processing (pre-processing) with respect to the substrate P subjected to the exposure processing by the exposure apparatus EX. The processing apparatus U1 sends the preprocessed board|substrate P to the exposure apparatus EX. At this time, the board|substrate P sent to the exposure apparatus EX is the board|substrate (photosensitive board|substrate) P on which the photosensitive functional layer (photosensitive layer) was formed in the surface.

Here, the photosensitive functional layer is applied on the substrate P as a solution, and dried to form a layer (film). A typical photosensitive functional layer includes a photoresist, but as a material that is not required after the development treatment, there are photosensitive silane coupling agents (SAM) modified for liquid repellency in the part exposed to ultraviolet rays, or photosensitive silane coupling agents exposed to ultraviolet rays. The part of the photosensitive reducing material of the plating reducing base is exposed. When a photosensitive silane coupling agent is used as the photosensitive functional layer, since the part of the pattern exposed to ultraviolet rays on the substrate P is modified from liquid repellency to lyophilic, the conductive part is selectively coated on the part which becomes lyophilic. Ink (ink containing conductive nanoparticles such as silver or copper) to form a patterned layer. When a photosensitive reducing material is used as the photosensitive functional layer, since the plating reducing group is exposed on the pattern portion exposed to ultraviolet rays on the substrate P, immediately after the exposure, the substrate P is immersed in electroless plating containing palladium ions or the like. A certain period of time in the liquid to form (precipitate) a patterned layer of palladium.

The exposure apparatus EX draws, for example, a pattern of a circuit or wiring for a display on the substrate P supplied from the processing apparatus U1. Although the details will be described later, this exposure apparatus EX exposes the substrate P by a plurality of drawing lines LL1 to LL5 obtained by scanning each of the plurality of drawing light beams LB in a predetermined scanning direction.

The processing apparatus U2 performs post-process processing (post-processing) on the substrate P subjected to the exposure processing by the exposure apparatus EX. The board|substrate P after exposure processing by the exposure apparatus EX is sent to processing apparatus U2. The processing apparatus U2 forms the pattern layer of an electronic element on the board|substrate P by performing predetermined processing on the board|substrate P which has performed the exposure process.

<Exposure apparatus (substrate processing apparatus)>

Next, the exposure apparatus EX will be described with reference to FIGS. 1 to 9 . FIG. 2 is a perspective view showing the configuration of a main part of the exposure apparatus of FIG. 1 . FIG. 3 is a diagram showing an arrangement relationship between an alignment microscope and a drawing line on a substrate. It is a figure which shows the structure of the rotating drum of the exposure apparatus of FIG. 1, and a drawing apparatus. FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1 . FIG. 6 is a perspective view showing the configuration of a branched optical system of the exposure apparatus of FIG. 1 . FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners in the exposure apparatus of FIG. 1 . FIG. 8 is a perspective view showing the arrangement relationship of the alignment microscope, the trace line, and the encoder head on the substrate. FIG. 9 is a perspective view showing the surface structure of the rotating drum of the exposure apparatus of FIG. 1 .

As shown in FIG. 1 , the exposure apparatus EX is an exposure apparatus that does not use a mask, a so-called reticle-less drawing exposure apparatus, and the drawing light beam LB is moved in a predetermined scanning direction while the substrate P is conveyed in the conveying direction. By scanning, the surface of the substrate P is drawn, so as to form a predetermined pattern on the substrate P.

As shown in FIG. 1 , the exposure apparatus EX includes a drawing device 11 , a substrate conveyance mechanism 12 , alignment microscopes AM1 and AM2 , and a control device 16 . The drawing apparatus 11 has several drawing modules UW1-UW5, and draws a predetermined pattern on a part of the board|substrate P conveyed by the board|substrate conveying mechanism 12 by the several drawing modules UW1-UW5. The substrate conveyance mechanism 12 conveys the substrate P conveyed from the processing apparatus U1 of the previous process to the processing apparatus U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 detect alignment marks and the like formed in advance on the substrate P in order to perform the relative position alignment of the pattern to be drawn on the substrate P and the substrate P. The control apparatus 16 controls each part of the exposure apparatus EX, and makes each part perform a process. The control device 16 may be a part or all of the upper control device of the control element manufacturing system 1 . In addition, the control device 16 may be a device different from the upper control device and controlled by the upper control device. The control device 16 includes, for example, a computer.

Moreover, the exposure apparatus EX is provided with the apparatus frame 13 (refer FIG. 2) which supports the drawing apparatus 11 and the board|substrate conveyance mechanism 12, and the rotation position detection mechanism (refer FIG. 4 and FIG. 8) 14. Furthermore, the light source device CNT which emits laser light (pulse light) as the drawing light beam LB is provided in the exposure apparatus EX. In this exposure apparatus EX, the drawing light beam LB emitted from the light source device CNT is guided in the drawing apparatus 11 and projected on the substrate P conveyed by the substrate conveying mechanism 12 .

As shown in FIG. 1, the exposure apparatus EX is accommodated in the temperature control room EVC. The air conditioning room EVC is installed on the installation surface E of the manufacturing plant through passive or active vibration isolation units SU1 and SU2. The anti-vibration units SU1 and SU2 are provided on the installation surface E to reduce vibration from the installation surface E. The temperature-controlled chamber EVC keeps the inside at a predetermined temperature, thereby suppressing the change in the shape of the substrate P conveyed inside due to temperature.

Next, the substrate conveyance mechanism 12 of the exposure apparatus EX will be described with reference to FIG. 1 . The substrate conveyance mechanism 12 includes an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotary reel (roller) DR, a tension adjustment roller RT2, and a drive roller in this order from the upstream side in the conveyance direction of the substrate P DR6, and drive roller DR7.

The edge position controller EPC adjusts the position in the width direction of the board|substrate P conveyed from the processing apparatus U1. The edge position controller EPC can make the width direction end (edge) position of the substrate P sent from the processing apparatus U1 within a range of about ± tens of μm to several tens of μm relative to the target position, so that the width of the substrate P can be adjusted. The direction is moved, and the position of the substrate P in the width direction is corrected.

The drive roller DR4 rotates while sandwiching the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P to the downstream side in the conveying direction to convey the substrate P to the rotary drum DR. The rotary drum DR transports the substrate P by rotating around the rotation center line X2 around the rotation center line AX2 extending in the Y direction while supporting the portion of the substrate P to be exposed with a pattern in a cylindrical surface. In order to rotate such a rotating reel DR around the rotation center line AX2, a shaft portion Sf2 coaxial with the rotation center line AX2 is provided on both sides of the rotating reel DR. The shaft portion Sf2 is given a rotational torque from a drive source (a motor, a reduction gear mechanism, etc.) not shown. In addition, the surface extending in the Z direction through the rotation center line AX2 is the center surface p3. The two sets of tension adjustment rolls RT1 and RT2 give a predetermined tension to the substrate P wound and supported by the rotating roll DR. The two sets of drive rollers DR6 and DR7 are arranged at a predetermined interval in the conveyance direction of the substrate P, and give a predetermined slack DL to the substrate P after exposure. The substrate P is conveyed to the processing apparatus U2 by the rotation of the upstream side of the board|substrate P clamped and conveyed by the drive roller DR6, and the downstream side of the drive roller DR7 of the board|substrate P clamped and conveyed by rotation. At this time, since the slack DL is given to the substrate P, the fluctuation of the conveyance speed of the substrate P generated on the downstream side of the drive roller DR6 in the conveyance direction can be absorbed, and the influence of the exposure process on the substrate P caused by the fluctuation of the conveyance speed can be blocked.

Therefore, the board|substrate conveyance mechanism 12 can adjust the position of the width direction by the edge position controller EPC with respect to the board|substrate P conveyed from the processing apparatus U1. The board|substrate conveyance mechanism 12 conveys the board|substrate P whose position in the width direction is adjusted to the tension adjustment drum RT1 by the drive roller DR4, and conveys the board|substrate P which passed the tension adjustment drum RT1 to the rotation drum DR. The board|substrate conveyance mechanism 12 conveys the board|substrate P supported by the rotary drum DR to the tension adjustment drum RT2 by rotating the rotary drum DR. The board|substrate conveyance mechanism 12 conveys the board|substrate P conveyed to the tension adjustment drum RT2 to the drive drum DR6, and conveys the board|substrate P conveyed to the drive drum DR6 to the drive drum DR7. Next, the board|substrate conveyance mechanism 12 conveys the board|substrate P to the processing apparatus U2, giving the slack DL to the board|substrate P by the drive roller DR6 and the drive roller DR7.

2, the apparatus frame 13 of the exposure apparatus EX is demonstrated. In FIG. 2 , the X direction, the Y direction, and the Z direction are an orthogonal coordinate system, which is the same orthogonal coordinate system as that in FIG. 1 . The exposure apparatus EX is provided with the drawing apparatus 11 shown in FIG. 1, and the apparatus frame 13 which supports the rotating roll DR of the board|substrate conveyance mechanism 12.

The apparatus frame 13 shown in FIG. 2 includes a main body frame 21 , a three-point mount (support mechanism) 22 , a first optical table 23 , a rotation mechanism 24 , and a second optical table 25 in this order from the lower side in the Z direction. The main body frame 21 is installed on the installation surface E via the anti-vibration units SU1 and SU2. The main body frame 21 rotatably supports the rotary drum DR and the tension adjustment drums RT1 (not shown) and RT2. The first optical table 23 is provided on the upper side in the vertical direction of the rotating drum DR, and is provided on the main body frame 21 via the three-point mount 22 . The three-point mount 22 supports the first optical table 23 at three support points 22a, and the position of each support point 22a in the Z direction can be adjusted. Therefore, the three-point mount 22 can adjust the inclination of the table surface of the first optical table 23 with respect to the horizontal plane to a predetermined inclination. In addition, when the device frame 13 is assembled, the position between the main body frame 21 and the three-point seat 22 can be adjusted in the X direction and the Y direction in the XY plane. On the other hand, after the assembly of the device frame 13, the space between the main body frame 21 and the three-point seat 22 is in a fixed state (rigid state). As described above, the main body frame 21 and the first optical table 23 connected by the three-point mount 22 function as the first support member.

The second optical table 25 is provided on the upper side in the vertical direction of the first optical table 23 , and is provided on the first optical table 23 via the rotation mechanism 24 . The second optical table 25 has a table surface parallel to the table surface of the first optical table 23 . The second optical table 25 is provided with a plurality of drawing modules UW1 to UW5 of the drawing device 11 . The rotation mechanism 24 can be centered on a predetermined rotation axis I extending in the vertical direction with respect to the first optical table 23 while maintaining the table surfaces of the first optical table 23 and the second optical table 25 in a substantially parallel state. The second optical table 25 is rotated. The rotation axis I extends in the vertical direction in the center plane p3 and passes through a predetermined point (refer to FIG. 3 ) on the surface of the substrate P (the drawing surface curved along the circumferential surface) of the rotary reel DR. The rotation mechanism 24 can adjust the position of the several drawing modules UW1-UW5 with respect to the board|substrate P wound by the rotating roll DR by rotating the 2nd optical table 25 with respect to the 1st optical table 23.

Next, the light source device CNT will be described with reference to FIGS. 1 and 5 . The light source device CNT is provided on the body frame 21 of the device frame 13 . The light source device CNT emits laser light as the drawing light beam LB projected on the substrate p. The light source device CNT has a light source that emits light in a predetermined wavelength band suitable for exposure of the photosensitive functional layer on the substrate P, and is set to light in the ultraviolet region having a strong photoactive effect. As the light source, for example, a laser light source that emits YAG third-harmonic laser light (wavelength 355 nm) can be used, or the seed light in the infrared wavelength region from a semiconductor laser light source can be amplified by a fiber amplifier and then converted by wavelength. A fiber-amplified laser light source or the like that emits laser light in the ultraviolet wavelength region with a wavelength of 400 nm or less, such as an element (a crystal element that generates harmonics, etc.). In this case, the emitted ultraviolet laser light may oscillate continuously, or may be pulsed laser light whose emission time per pulse is less than tens of picoseconds and oscillates at a frequency of 100 MHz or more. In addition, as the light source, for example, a light source such as a mercury lamp having a glow line (g-line, h-line, i-line, etc.) in the ultraviolet region, a laser diode having an oscillation peak in the ultraviolet region with a wavelength of 450 nm or less, Solid-state light sources such as light emitting diodes (LEDs), or KrF excimer laser light (wavelength 248nm), ArF excimer laser light (wavelength 193nm), XeCl excimer laser light (wavelength 308nm) that oscillates far ultraviolet light (DUV light) etc. gas laser light source.

Here, the drawing light beam LB emitted from the light source device CNT is incident on the later-described polarization beam splitter PBS. In order to suppress the energy loss of the drawing light beam LB due to the separation of the drawing light beam LB by the polarization beam splitter PBS, it is preferable that the incident drawing light beam LB be substantially totally reflected by the polarization beam splitter PBS. The polarizing beam splitter PBS reflects the linearly polarized light beam that becomes S-polarized light, and transmits the linearly polarized light beam that becomes P-polarized light. Therefore, the light source device CNT is preferably a laser beam in which the drawing beam LB entering the polarization beam splitter PBS becomes a linearly polarized (S-polarized) beam. Moreover, since the energy density of laser light is high, the illuminance of the light beam projected on the board|substrate P can be suitably ensured.

Next, the drawing apparatus 11 of the exposure apparatus EX is demonstrated. The drawing apparatus 11 is a so-called multi-beam type drawing apparatus 11 using a plurality of drawing modules UW1 to UW5. In this drawing device 11 , the drawing light beam LB emitted from the light source device CNT is branched into a plurality of lines, and the branched drawing light beam LB is drawn along a plurality of (for example, five in the first embodiment) drawing lines on the substrate P LL1 to LL5 are scanned respectively. Next, the drawing device 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3 , a description will be given of a plurality of drawing lines LL1 to LL5 formed on the substrate P by scanning the plurality of drawing light beams LB with the drawing device 11 .

As shown in FIG. 3 , the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary reel DR with the center plane p3 interposed therebetween. On the substrate P on the upstream side in the rotational direction, odd-numbered first drawing lines LL1 , third drawing lines LL3 , and fifth drawing lines LL5 are arranged. On the substrate P on the downstream side in the rotational direction, even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged.

The respective drawing lines LL1 to LL5 are formed in the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotary reel DR, and are shorter than the length of the substrate P in the width direction. Strictly speaking, each of the drawing lines LL1 to LL5 is used to rotate the reel so as to minimize the joining error of the pattern obtained by the plurality of drawing lines LL1 to LL5 when the substrate P is conveyed at the reference speed by the substrate conveyance mechanism 12 . The rotation center line AX2 of the DR is inclined by a predetermined angle.

The odd-numbered first drawing line LL1 , the third drawing line LL3 , and the fifth drawing line LL5 are arranged at predetermined intervals in the direction (axial direction) in which the rotation center line AX2 of the rotary reel DR extends. In addition, the even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged at a predetermined interval in the axial direction of the rotating reel DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the axial direction. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. Moreover, the 1st - 5th drawing lines LL1-LL5 are arrange|positioned so that the width direction (axial direction) full width of the exposure area A7 drawn on the board|substrate P may be covered.

The scanning direction of the drawing light beam LB scanned along the odd-numbered first drawing line LL1 , the third drawing line LL3 , and the fifth drawing line LL5 is a one-dimensional direction and the same direction. In addition, the scanning direction of the drawing light beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction and the same direction. At this time, the scanning direction of the drawing light beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the drawing light beam LB scanned along the even-numbered drawing lines LL2, LL4 are opposite directions. Therefore, when viewed from the conveying direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL1, LL3, and LL5 are adjacent to the drawing end positions of the even-numbered drawing lines LL2, LL4. Similarly, the odd-numbered drawing lines LL1, LL3 The drawing end position of LL5 is adjacent to the drawing start position of the even-numbered drawing lines LL2 and LL4.

Next, the drawing device 11 will be described with reference to FIGS. 4 to 7 . The drawing device 11 includes the above-described plurality of drawing modules UW1 to UW5, a beam distribution optical system SL for branching the drawing light beam LB from the light source device CNT to the plurality of drawing modules UW1 to UW5, and a calibration detection for calibrating Department 31.

The beam distribution optical system SL branches the drawing light beam LB emitted from the light source device CNT into a plurality of pieces, and guides the branched drawing light beam LB to the plurality of drawing modules UW1 to UW5, respectively. The beam distribution optical system SL has a first optical system 41 in which the drawing light beam LB emitted from the light source device CNT is branched into two, a second optical system 42 which is irradiated with a drawing light beam LB branched from the first optical system 41 , and The third optical system 43 is irradiated with another drawing light beam LB branched from the first optical system 41 . In addition, the beam distribution optical system SL includes an XY halving adjustment mechanism 44 and an XY halving adjustment mechanism 45 . A part of the light beam distribution optical system SL on the side of the light source device CNT is provided on the main body frame 21 , and the other part on the side of the drawing modules UW1 to UW5 is provided on the second optical table 25 .

The first optical system 41 includes a half wavelength plate 51, a polarizer 52, a beam diffuser 53, a first reflector 54, a first relay lens 55, a second relay lens 56, and a second reflector 57 , the third mirror 58 , the fourth mirror 59 , and the first beam splitter 60 .

The half-wavelength plate 51 is irradiated with the drawing light beam LB emitted in the +X direction from the light source device CNT. The half-wavelength plate 51 is rotatable within the irradiation surface of the drawing light beam LB. The polarization direction of the drawing light beam LB irradiated on the half-wavelength plate 51 is a predetermined polarization direction corresponding to the rotation amount of the half-wavelength plate 51 . The drawing light beam LB passing through the half-wavelength plate 51 is irradiated on a polarizer (polarizing beam splitter) 52 . The polarizer 52 transmits the drawing light beam LB in a predetermined polarization direction, and reflects the drawing light beam LB in a direction other than the predetermined polarization direction in the +Y direction. Therefore, since the drawing light beam LB reflected by the polarizer 52 passes through the half-wavelength plate 51 , the half-wavelength plate 51 and the half-wavelength plate 52 can be rotated by the cooperative action of the half-wavelength plate 51 and the polarizer 52 . the corresponding beam intensity. That is, by rotating the half-wavelength plate 51 to change the polarization direction of the drawing light beam LB, the beam intensity of the drawing light beam LB reflected by the polarizer 52 can be adjusted.

The drawing light beam LB transmitted through the polarizer 52 is irradiated on the diffuser 53 . The diffuser 53 absorbs the drawing light beam LB, and suppresses leakage of the drawing light beam LB irradiated to the diffuser 53 to the outside. The first reflecting mirror 54 is irradiated with the drawing light beam LB reflected in the +Y direction by the polarizer 52 . The drawing light beam LB irradiated on the first reflecting mirror 54 is reflected by the first reflecting mirror 54 in the +X direction, and is irradiated on the second reflecting mirror 57 via the first relay lens 55 and the second relay lens 56 . The drawing light beam LB irradiated to the second reflection mirror 57 is reflected by the second reflection mirror 57 in the −Y direction, and is irradiated to the third reflection mirror 58 . The drawing light beam LB irradiated to the third reflection mirror 58 is reflected by the third reflection mirror 58 in the −Z direction, and is irradiated to the fourth reflection mirror 59 . The drawing light beam LB irradiated on the fourth reflection mirror 59 is reflected by the fourth reflection mirror 59 in the +Y direction, and is irradiated on the first beam splitter 60 . A part of the drawing light beam LB irradiated to the first beam splitter 60 is reflected in the −X direction and irradiated on the second optical system 42 , and the other part is transmitted and irradiated on the third optical system 43 .

The third mirror 58 and the fourth mirror 59 are provided at a predetermined interval on the rotation axis I of the rotation mechanism 24 . In addition, the configuration up to the light source device CNT including the third reflecting mirror 58 (the portion surrounded by the double-dotted line on the upper side in the Z direction in FIG. The configuration of the plurality of drawing modules UW1 to UW5 (the portion surrounded by the two-dot chain line on the lower side in the Z direction in FIG. 4 ) is provided on the second optical table 25 side. Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the rotation mechanism 24, since the third reflecting mirror 58 and the fourth reflecting mirror 59 are provided on the rotation axis I, the optical path of the drawing light beam LB does not change. . Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the rotation mechanism 24, the drawing light beam LB emitted from the light source device CNT provided on the main frame 21 side can be guided very appropriately to the second optical table 23. The plurality of drawing modules UW1 to UW5 on the optical table 25 side.

The second optical system 42 divides the drawing light beam LB from the one branched from the first optical system 41 and guides it to the odd-numbered drawing modules UW1 , UW3 , and UW5 described later. The second optical system 42 includes a fifth mirror 61 , a second beam splitter 62 , a third beam splitter 63 , and a sixth mirror 64 .

The drawing light beam LB in the −X direction is reflected by the first beam splitter 60 of the first optical system 41 and irradiated on the fifth reflecting mirror 61 . The drawing light beam LB irradiated on the fifth reflecting mirror 61 is reflected by the fifth reflecting mirror 61 in the −Y direction, and is irradiated on the second beam splitter 62 . A part of the drawing light beam LB irradiated on the second beam splitter 62 is reflected and irradiated on one odd-numbered drawing module UW5 (see FIG. 5 ). The other part of the drawing light beam LB irradiated to the second beam splitter 62 penetrates and is irradiated to the third beam splitter 63 . A part of the drawing light beam LB irradiated on the third beam splitter 63 is reflected and irradiated on one odd-numbered drawing module UW3 (see FIG. 5 ). The other part of the drawing light beam LB irradiated on the third beam splitter 63 penetrates and is irradiated on the sixth reflecting mirror 64 . The drawing light beam LB irradiated to the sixth reflecting mirror 64 is reflected by the sixth reflecting mirror 64 and irradiated to one odd-numbered drawing module UW1 (see FIG. 5 ). Moreover, in the 2nd optical system 42, the drawing light beam LB irradiated to odd-numbered drawing modules UW1, UW3, and UW5 is slightly inclined with respect to the −Z direction (Z axis).

The third optical system 43 branches off the other drawing light beam LB from the first optical system 41 and guides it to the even-numbered drawing modules UW2 and UW4 described later. The third optical system 43 includes a seventh mirror 71 , an eighth mirror 72 , a fourth beam splitter 73 , and a ninth mirror 74 .

The drawing light beam LB transmitted in the Y direction through the first beam splitter 60 of the first optical system 41 is irradiated on the seventh reflecting mirror 71 . The drawing light beam LB irradiated on the seventh reflecting mirror 71 is reflected by the seventh reflecting mirror 71 in the X direction, and is irradiated on the eighth reflecting mirror 72 . The drawing light beam LB irradiated on the eighth reflecting mirror 72 is reflected by the eighth reflecting mirror 72 in the −Y direction, and is irradiated on the fourth beam splitter 73 . A part of the drawing light beam LB irradiated on the fourth beam splitter 73 is reflected and irradiated on one even-numbered drawing module UW4 (see FIG. 5 ). The other part of the drawing light beam LB irradiated on the fourth beam splitter 73 penetrates and is irradiated on the ninth reflecting mirror 74 . The drawing light beam LB irradiated on the ninth reflecting mirror 74 is reflected by the ninth reflecting mirror 74 and irradiated on one even-numbered drawing module UW2. Moreover, in the 3rd optical system 43, the drawing light beam LB irradiated to the even-numbered drawing modules UW2 and UW4 is also slightly inclined with respect to the −Z direction (Z axis).

As described above, in the beam distribution optical system SL, the drawing light beams LB from the light source device CNT are branched into a plurality of lines toward the plurality of drawing modules UW1 to UW5. At this time, the reflectance (transmittance) of the first beam splitter 60 , the second beam splitter 62 , the third beam splitter 63 and the fourth beam splitter 73 is adjusted appropriately depending on the number of branches of the drawing light beam LB The reflectance is such that the beam intensities of the drawing light beams LB irradiated on the plurality of drawing modules UW1 to UW5 are the same.

The XY bisector adjustment mechanism 44 is arranged between the second relay lens 56 and the second mirror 57 . The XY bisector adjustment mechanism 44 can adjust all the drawing lines LL1 to LL5 formed on the substrate P so as to move slightly within the drawing surface of the substrate P. As shown in FIG. The XY halving adjustment mechanism 44 is constituted by a transparent parallel flat glass which can be inclined in the XZ plane of FIG. 6 and a transparent parallel flat glass which can be inclined in the YZ plane in FIG. 6 . The drawing lines LL1 to LL5 formed on the substrate P can be slightly displaced in the X direction or the Z direction by adjusting the respective inclination amounts of the two parallel plate glasses.

The XY bisector adjustment mechanism 45 is arranged between the seventh mirror 71 and the eighth mirror 72 . The XY halving adjustment mechanism 45 can adjust the even-numbered second drawing line LL2 and the fourth drawing line LL4 among the drawing lines LL1 to LL5 formed on the substrate P so as to move slightly within the drawing surface of the substrate P. Like the XY halving adjustment mechanism 44, the XY halving adjustment mechanism 45 is constituted by a transparent parallel flat glass which can be inclined in the XZ plane of FIG. 6 and a transparent parallel flat glass which can be inclined in the YZ plane in FIG. 6 . The drawing lines LL2 and LL4 formed on the substrate P can be slightly displaced in the X direction or the Z direction by adjusting the respective inclination amounts of the two parallel flat glass sheets.

Next, a plurality of drawing modules UW1 to UW5 will be described with reference to FIGS. 4 , 5 and 7 . The plurality of drawing modules UW1 to UW5 are provided corresponding to the plurality of drawing lines LL1 to LL5. The plurality of drawing light beams LB branched by the beam distribution optical system SL are respectively irradiated on the plurality of drawing modules UW1 to UW5 . Each of the drawing modules UW1 to UW5 guides the plurality of drawing light beams LB to the drawing lines LL1 to LL5, respectively. That is, the first drawing module UW1 guides the drawing light beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 guide the drawing light beam LB to the second to fifth drawing lines LL2 to LL5 . As shown in FIG. 4 (and FIG. 1 ), the plurality of drawing modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. The plurality of drawing modules UW1 to UW5 are arranged on the side of the first, third, and fifth drawing lines LL1, LL3, and LL5 (the -X direction side in FIG. 5 ) across the center plane p3, and the first drawing modules UW1, The third drawing module UW3 and the fifth drawing module UW5. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at a predetermined interval in the Y direction. In addition, among the plurality of drawing modules UW1 to UW5, the second and fourth drawing lines LL2 and LL4 are arranged on the side of the second and fourth drawing lines LL2 and LL4 (the side in the +X direction in FIG. 5 ) across the center plane p3, and the second drawing module UW2 and the fourth drawing module are arranged. Module UW4. The second drawing module UW2 and the fourth drawing module UW4 are arranged at a predetermined interval in the Y direction. At this time, the second drawing module UW2 is arranged between the first drawing module UW1 and the third drawing module UW3 in the Y direction. Similarly, the third drawing module UW3 is arranged between the second drawing module UW2 and the fourth drawing module UW4 in the Y direction. The fourth drawing module UW4 is arranged between the third drawing module UW3 and the fifth drawing module UW5 in the Y direction. In addition, as shown in FIG. 4 , the first drawing module UW1, the third drawing module UW3, the fifth drawing module UW5, the second drawing module UW2 and the fourth drawing module UW4, when viewed from the Y direction, are The center plane p3 is centrally symmetric.

Next, each of the drawing modules UW1 to UW5 will be described with reference to FIG. 4 . In addition, since each of the drawing modules UW1 to UW5 has the same configuration, the first drawing module UW1 (hereinafter, simply referred to as the drawing module UW1 ) will be described as an example.

The drawing module UW1 shown in FIG. 4 includes a light deflector 81 , a polarization beam splitter PBS, a quarter-wave plate 82 , and a scanner 83 to scan the drawing light beam LB along the drawing line LL1 (first drawing line LL1 ). , a bending mirror 84 , a telecentric f-θ lens system 85 , and an optical member 86 for Y magnification correction. In addition, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

As the optical deflector 81, for example, an Acousto-Optic Modulator (AOM: AcoustIic Optic Modulator) is used. The light deflector 81 is switched ON/OFF by the control device 16 to switch the projection/non-projection of the drawing light beam LB on the substrate P at a high speed. Specifically, the drawing light beam LB from the light beam distribution optical system SL is irradiated on the light deflector 81 by passing through the relay lens 91 of the second optical system 42 and being slightly inclined with respect to the −Z direction. When the light deflector 81 is switched OFF, the drawing light beam LB travels straight in an inclined state, and is blocked by the light shielding plate 92 provided after passing through the light deflector 81 . On the other hand, when the optical deflector 81 is switched ON, the drawing light beam LB entering the optical deflector 81 becomes a first-order diffracted light beam, deflects in the −Z direction, exits from the optical deflector 81 and enters the optical deflection beam Polarizing beam splitter PBS in the Z direction of the filter 81 . Therefore, when the optical deflector 81 is switched ON, the drawing light beam LB is projected on the substrate P, and when it is switched OFF, the drawing light beam LB is brought into a non-projecting state on the substrate P.

The polarizing beam splitter PBS reflects the drawing light beam LB irradiated from the light deflector 81 through the relay lens 93 . On the other hand, the polarizing beam splitter PBS cooperates with the quarter-wave plate 82 provided between the polarizing beam splitter PBS and the scanner 83, and penetrates the substrate P ( or the reflected light generated by the outer peripheral surface of the rotating reel DR). That is, the drawing light beam LB irradiated from the light deflector 81 to the polarization beam splitter PBS is S-polarized linearly polarized laser light, and is reflected by the polarization beam splitter PBS. In addition, the drawing light beam LB reflected by the polarization beam splitter PBS passes through the quarter-wave plate 82 and is irradiated on the substrate P, and passes through the quarter-wave plate 82 from the substrate P again, thereby becoming a linearly polarized light beam of P-polarized light. shoot light. Therefore, the reflected light generated from the substrate P (or the outer peripheral surface of the rotating reel DR) and irradiated on the polarization beam splitter PBS penetrates the polarization beam splitter PBS. In addition, the reflected light transmitted through the polarization beam splitter PBS is irradiated to the calibration detection system 31 through the relay lens 94 . On the other hand, the drawing light beam LB reflected by the polarization beam splitter PBS passes through the quarter-wave plate 82 and enters the scanner 83 .

As shown in FIGS. 4 and 7 , the scanner 83 includes a mirror 96 , a rotating polygon mirror 97 , and an origin detector 98 . The drawing light beam LB that has passed through the quarter-wave plate 82 is irradiated to the reflection mirror 96 through the relay lens 95 . The drawing light beam LB reflected by the mirror 96 is irradiated on the rotating polygon mirror 97 . The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction, and a plurality of reflecting surfaces (eg, eight surfaces) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction about the rotation axis 97a, so that the reflection angle of the drawing light beam LB irradiated on the reflection surface 97b is continuously changed, and the reflected drawing light beam LB is caused to pass along the substrate P. Depicted line LL1 scan. The drawing light beam LB reflected by the rotating polygon mirror 97 is irradiated on the bending mirror 84 . The origin detector 98 detects the origin of the drawing light beam LB scanned along the drawing line LL1 of the substrate P. The origin detector 98 is arranged on the opposite side of the reflection mirror 96 across the drawing light beam LB reflected by each reflection surface 97b. Therefore, the origin detector 98 detects the drawing light beam LB before being irradiated on the f-θ lens system 85 . That is, the origin detector 98 detects the passage of the drawing light beam LB just before the drawing start position of the drawing line LL1 irradiated on the substrate P.

The drawing light beam LB irradiated to the bending mirror 84 from the scanner 83 is reflected by the bending mirror 84 and irradiated to the f-θ lens system 85 . The f-θ lens system 85 includes a telecentric f-θ lens, and projects the drawing light beam LB reflected from the rotating polygon mirror 97 by the bending mirror 84 on the drawing surface of the substrate P vertically. At this time, each reflective surface 97b of the rotating polygon mirror 97 and the drawing surface of the substrate P are optically conjugated in the sub-scanning direction (the longitudinal direction of the substrate P) orthogonal to the drawing line LL1, and are directed toward the rotating polygon mirror. Cylindrical lenses (not shown) are arranged in the optical paths of the drawing light beams LB of 97 and the optical paths of the drawing light beams LB emitted from the f-θ lens system 85 , respectively, and a surface that cooperates with the f-θ lens system 85 is also provided. Skew (optical face tangle error) corrects the optical system.

As shown in FIG. 7 , the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 are configured to be bilaterally symmetrical with respect to the center plane p3. The plurality of scanners 83, three scanners 83 corresponding to the drawing modules UW1, UW3, and UW5 are arranged on the upstream side in the rotational direction of the rotary reel DR (the -X direction side in FIG. 7 ), and the drawing modules UW2, The two scanners 83 corresponding to UW4 are arranged on the downstream side (+X direction side in FIG. 7 ) in the rotational direction of the rotary reel DR. On the other hand, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 therebetween. At this time, each of the scanners 83 arranged on the upstream side and each of the scanners 83 arranged on the downstream side are configured to be 180° point-symmetrical about the rotation axis I as the center. Therefore, after the three rotating polygon mirrors 97 on the upstream side rotate to the left (counterclockwise in the XY plane) and irradiate the rotating polygon mirror 97 with the drawing light beam LB, the drawing light beam LB reflected by the rotating polygon mirror 97 is The drawing start position is scanned in a predetermined scanning direction (for example, the +Y direction in FIG. 7 ) toward the drawing end position. On the other hand, after the two rotating polygon mirrors 97 on the downstream side irradiate the drawing beam LB to the rotating polygon mirror 97 while rotating to the left, the drawing beam LB reflected by the rotating polygon mirror 97 goes from the drawing start position to the drawing end. position, and scan in the opposite scanning direction (for example, the −Y direction in FIG. 7 ) to the three rotating polygon mirrors 97 on the upstream side.

Here, when viewed in the XZ plane of FIG. 4 , the axis of the drawing light beam LB reaching the substrate P from the odd-numbered drawing modules UW1 , UW3 , and UW5 is the direction that matches the installation azimuth line Le1 . That is, the azimuth line Le1 is provided and is a line connecting the odd-numbered drawing lines LL1 , LL3 , and LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4 , the axis of the drawing light beam LB reaching the substrate P from the even-numbered drawing modules UW2 and UW4 is in the same direction as the setting azimuth line Le2 . That is, the azimuth line Le2 is provided, and in the XZ plane, is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2.

The optical member 86 for Y magnification correction is arrange|positioned between the f-theta lens system 85 and the board|substrate P. The optical member 86 for Y magnification correction slightly enlarges or reduces the dimension in the Y direction of the drawing lines LL1 to LL5 formed by the drawing modules UW1 to UW5.

In the drawing apparatus 11 comprised in this way, each part is controlled by the control apparatus 16 so that a predetermined pattern is drawn on the board|substrate P. That is, the control device 16 scans the drawing light beam LB projected on the substrate P in the scanning direction, based on CAD (Computer Aided Design) information (for example, a dot matrix format) of the pattern to be drawn on the substrate P, by using The light deflector 81 is ON/OFF modulated to deflect the drawing light beam LB, so as to draw a pattern on the photosensitive layer of the substrate P. As shown in FIG. In addition, the control device 16 synchronizes the scanning direction of the drawing light beam LB scanned along the drawing line LL1 with the movement of the substrate P in the conveying direction by the rotation of the rotating drum DR, so that the exposure area A7 corresponds to the drawing line LL1. Parts depict established patterns.

At this time, the size (spot diameter) of the drawing light beams LB projected from the respective drawing modules UW1 to UW5 on the substrate P is set to D (μm), and the scanning speeds along the drawing lines LL1 to LL5 of the drawing light beams LB are set to be In the case of V (μm/sec), when the light source device CNT is a pulsed laser light source, the light emission repetition period T (sec) of the pulsed light is set as a relationship of T<D/V.

Next, the alignment microscopes AM1 and AM2 will be described with reference to FIGS. 3 and 8 . The alignment microscopes AM1 and AM2 detect the alignment marks formed on the substrate P in advance, the reference marks and reference patterns formed on the rotating reel DR, and the like. Hereinafter, the alignment mark of the board|substrate P and the reference mark and reference pattern of the rotating roll DR are simply called a mark. The alignment microscopes AM1 and AM2 are used for alignment (alignment) of the substrate P with a predetermined pattern drawn on the substrate P, or alignment of the rotating roll DR and the drawing device 11 .

The alignment microscopes AM1 and AM2 are provided on the upstream side in the rotational direction of the rotating reel DR than the drawing lines LL1 to LL5 formed by the drawing device 11 . Moreover, the alignment microscope AM1 is arrange|positioned at the rotation direction upstream side of the rotary reel DR rather than the alignment microscope AM2.

The microscopes AM1 and AM2 are aligned, and the objective lens system GA as the detection probe is the light generated by projecting the illumination light on the substrate P or the rotating reel DR and incident on the mark, and the mark that receives the light through the objective lens system GA The images (bright-field images, dark-field images, fluorescent images, etc.) are composed of a photographic system GD, etc., which is captured by a two-dimensional CCD, CMOS, and the like. In addition, the illumination light for alignment is light of the wavelength band which has little sensitivity with respect to the photosensitive layer on the board|substrate P, for example, the light of the wavelength of about 500 nm - 800 nm.

A plurality of (for example, three) alignment microscopes AM1 are arranged in a line in the Y direction (the width direction of the substrate P). Similarly, a plurality of (for example, three) alignment microscopes AM2 are arranged in a line in the Y direction (the width direction of the substrate P). That is, a total of six alignment microscopes AM1 and AM2 are provided.

In FIG. 3 , in order to facilitate understanding, the arrangement of each pair of objective lens systems GA1 to GA3 of three alignment microscopes AM1 is shown in each pair of objective lens systems GA of six alignment microscopes AM1 and AM2. The observation areas Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) of each pair of objective lenses GA1 to GA3 of the three alignment microscopes AM1 are, as shown in FIG. 3, parallel to the rotation center line AX2. are arranged at predetermined intervals in the Y direction. As shown in FIG. 8 , the optical axes La1 to La3 of the respective pairs of objective lens systems GA1 to GA3 passing through the centers of the respective observation areas Vw1 to Vw3 are all parallel to the XZ plane. Similarly, the observation areas Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotating drum DR) of each pair of objective lens systems GA of the three alignment microscopes AM2 are parallel to the rotation center line AX2 as shown in FIG. 3 . are arranged at predetermined intervals in the Y direction. As shown in FIG. 8 , the optical axes La4 to La6 of the respective pairs of objective lens systems GA passing through the centers of the respective observation areas Vw4 to Vw6 are also parallel to the XZ plane. On the other hand, the observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotating reel DR.

The observation areas Vw1 to Vw6 of the marks with the alignment microscopes AM1 and AM2 are set in the range of, for example, about 200 μm diagonally on the substrate P and the rotating roll DR. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA, are set to the installation azimuth lines extending from the rotation center line AX2 in the radial direction of the rotary drum DR. Le3 in the same direction. That is, the azimuth line Le3 is provided and is a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of FIG. 4 . Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA, are set to the installation azimuth lines extending from the rotation center line AX2 in the radial direction of the rotary drum DR. Le4 in the same direction. That is, the azimuth line Le4 is provided and is a line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when observed in the XZ plane of FIG. 4 . At this time, since the alignment microscope AM1 is disposed on the upstream side in the rotational direction of the rotating reel DR compared to the alignment microscope AM2, the angle formed by the center plane p3 and the installation azimuth line Le3 is closer than the center plane p3 and the installation azimuth line The angle formed by Le4 is large.

On the board|substrate P, as shown in FIG. 3, the exposure area A7 drawn by each of five drawing lines LL1-LL5 is arrange|positioned at predetermined intervals in the X direction. Around the exposure area A7 on the substrate P, there are a plurality of alignment marks Ks1 to Ks3 (hereinafter, simply referred to as marks) for alignment, which are formed in, for example, a cross shape.

In FIG. 3 , marks Ks1 are provided at regular intervals in the X direction in the peripheral area on the −Y side of the exposure area A7 , and marks Ks3 are provided at regular intervals in the X direction in the peripheral area on the +Y side of the exposure area A7 . Further, the mark Ks2 is provided at the center of the Y direction in the blank area between the two adjacent exposure areas A7 in the X direction.

The mark Ks1 can be sequentially captured during the conveyance of the substrate P in the observation area Vw1 of the objective lens system GA1 of the alignment microscope AM1 and the observation area Vw4 of the objective lens system GA of the alignment microscope AM2 way of forming. In addition, the mark Ks3 is used in the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and the observation area Vw6 of the objective lens system GA of the alignment microscope AM2 so that it can be adhered to during the conveyance of the substrate P formed by sequential capture. Further, the mark Ks2 is used in the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens system GA of the alignment microscope AM2 during the conveyance of the substrate P, respectively. Formed in a sequential manner.

Therefore, the alignment microscopes AM1 and AM2 of the three alignment microscopes AM1 and AM2 on both sides in the Y direction of the rotating drum DR can observe or detect the marks Ks1 and Ks3 formed on both sides of the substrate P in the width direction at any time. In addition, among the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 in the center of the Y-direction of the rotating roll DR can observe or detect the blanks etc. formed between the exposure areas A7 drawn on the substrate P at any time. The marker Ks2.

Here, since the so-called multi-beam type drawing apparatus 11 is applied to the exposure apparatus EX, in order to align the plurality of patterns drawn on the substrate P by the respective drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 in the Y direction It is necessary to perform proper bonding to suppress the bonding accuracy of the plurality of drawing modules UW1 to UW5 within the allowable range. In addition, the relative arrangement relationship of the alignment microscopes AM1 and AM2 with respect to the observation areas Vw1 to Vw6 of the respective drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 (or the amount of error with respect to the designed arrangement interval) is referred to as The reference line, the relative arrangement relationship or the amount of error, must be precisely calculated by the reference line management. Calibration is also required for this baseline management.

In the calibration for confirming the joining accuracy of the plurality of drawing modules UW1 to UW5 and the calibration for the reference line management of the alignment microscopes AM1 and AM2, at least one of the outer peripheral surfaces of the rotating roll DR supporting the substrate P is required. The fiducial mark or fiducial pattern is set in the part. Therefore, as shown in FIG. 9, in the exposure apparatus EX, the rotating drum DR which provided the reference mark or the reference pattern on the outer peripheral surface is used.

On both end sides of the outer peripheral surface of the rotary reel DR, scale portions GPa and GPb constituting a part of the rotational position detection mechanism 14 to be described later are formed. In addition, the rotating reel DR is provided with narrow-width restriction tapes CLa and CLb formed of concave grooves or convex edges on the inner side of the scale parts GPa and GPb, engraved on the entire circumference. The width in the Y direction of the substrate P is set to be smaller than the interval in the Y direction of the two restriction belts CLa and CLb, and the substrate P is in close contact with the outer peripheral surface of the rotating reel DR in an inner region sandwiched by the restriction belts CLa and CLb. be supported.

The rotating reel DR is provided with a plurality of line patterns RL1 inclined at +45 degrees with respect to the rotation center line AX2, and a plurality of line patterns RL1 inclined at -45 degrees with respect to the rotation center line AX2 on the outer peripheral surface sandwiched by the restriction belts CLa and CLb. The plurality of line patterns RL2 are a grid-shaped reference pattern (which can also be used as a reference mark) RMP in which the plurality of line patterns RL2 are repeatedly engraved at constant pitches (periods) Pf1 and Pf2.

The reference pattern RMP is an oblique pattern (oblique lattice pattern) that is uniform across the entire surface in order to avoid variations in friction force or tension of the substrate P at the contact portion between the substrate P and the outer peripheral surface of the rotary drum DR. Note that the line patterns RL1 and RL2 do not necessarily have to be inclined at 45 degrees, and the line pattern RL1 may be a vertical and horizontal grid pattern parallel to the Y axis and the line pattern RL2 parallel to the X axis. Furthermore, it is not necessary to make the line patterns RL1 and RL2 intersect at 90 degrees, and the rectangular area enclosed by the adjacent two line patterns RL1 and the adjacent two line patterns RL2 may be formed into a square (or a rectangle). ) at angles other than rhombus make the line patterns RL1 and RL2 intersect.

Next, the rotational position detection mechanism 14 will be described with reference to FIGS. 3 , 4 and 8 . As shown in FIG. 8 , the rotational position detection mechanism 14 optically detects the rotational position of the rotary reel DR, and is applicable to an encoder system using, for example, a rotary encoder or the like. The rotational position detection mechanism 14 includes scale portions (indicators) GPa and GPb provided at both ends of the rotating reel DR, and a plurality of encoder heads (read heads) EN1 and GPb facing each of the scale portions GPa and GPb. EN2, EN3, EN4. In FIGS. 4 and 8 , only the four encoder heads EN1, EN2, EN3, and EN4 that face the scale portion GPa are shown, but the scale portion GPb also has the encoder heads EN1, EN1, and EN1, which are arranged opposite to each other. EN2, EN3, EN4 (see Figure 10).

The scale portions GPa and GPb are formed in a ring shape as a whole in the circumferential direction of the outer peripheral surface of the rotary drum DR. The scales of the scale parts GPa and GPb are diffraction gratings in which concave or convex grating lines are engraved at a constant pitch (eg, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and constitute an incremental scale. Therefore, the scale parts GPa and GPb rotate integrally with the rotary reel DR around the rotation center line AX2.

The substrate P is wound on the inner side of the scale portions GPa and GPb avoiding both ends of the rotating reel DR, that is, on the inner side of the restriction tapes CLa and CLb. If a strict arrangement relationship is required, the outer peripheral surfaces of the scale parts GPa and GPb are set to be flush with the outer peripheral surface of the portion of the substrate P wound around the rotary drum DR (same radius from the center line AX2 ). In order to achieve this, the outer peripheral surfaces of the scale parts GPa and GPb may be made as high as the thickness of the substrate P in the radial direction with respect to the outer peripheral surface for substrate winding of the rotating reel DR. Therefore, the outer peripheral surfaces of the scale portions GPa and GPb formed on the rotary reel DR can be set to be approximately the same radius as the outer peripheral surface of the substrate P. As shown in FIG. Therefore, the encoder heads EN1, EN2, EN3, and EN4 can detect the scale parts GPa and GPb at the same radial position as the drawing surface on the substrate P wound on the rotary reel DR, and reduce the measurement position and the processing position due to the rotation. Abbe error caused by different radial directions.

The encoder heads EN1 , EN2 , EN3 , and EN4 are disposed around the scale parts GPa and GPb, respectively, at different positions in the circumferential direction of the rotary drum DR as viewed from the rotation center line AX2 . The encoder read heads EN1 , EN2 , EN3 and EN4 are connected to the control device 16 . The encoder read heads EN1, EN2, EN3, and EN4 project measurement beams toward the scale parts GPa and GPb, and perform photoelectric detection on the reflected beams (diffracted light) to detect changes in the circumferential position of the corresponding scale parts GPa and GPb. A signal (eg, a 2-phase signal with a phase difference of 90 degrees) is output to the control device 16 . The control device 16 performs digital processing by interpolating the detection signals (2-phase signals) from the encoder read heads EN1 to EN4 with a counting circuit (not shown), that is, it can measure the rotating roll with a sub-micron resolution. The angle change of the drum DR, that is, the circumferential position change of the outer peripheral surface of the rotating drum DR at each of the installation positions of the encoder heads EN1 to EN4 is measured. At this time, the control apparatus 16 may measure the conveyance speed of the board|substrate P on the rotary drum DR, or the movement amount of the circumferential direction from the angle change of the rotary drum DR.

In addition, as shown in FIGS. 4 and 8 , the encoder head EN1 is arranged on the setting azimuth line Le1. The setting azimuth line Le1 is a line connecting the projection area (reading position) on the scale part GPa (GPb) of the measuring beam of the encoder head EN1 and the rotation center line AX2 in the XZ plane. Moreover, as mentioned above, the orientation line Le1 is provided, and it is a line which connects the drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. As can be seen from the above, the line connecting the reading position of the encoder head EN1 and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same azimuth lines.

Similarly, as shown in FIGS. 4 and 8 , the encoder head EN2 is arranged on the setting azimuth line Le2. The azimuth line Le2 is provided and is a line connecting the projection area on the scale part GPa (GPb) and the rotation center line AX2 of the light beam for measurement of the encoder head EN2 in the XZ plane. In addition, as described above, the azimuth line Le2 is provided as a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. As can be seen from the above, the line connecting the reading position of the encoder head EN2 and the rotation center line AX2 and the line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 are the same azimuth lines.

Moreover, as shown in FIG.4 and FIG.8, the encoder head EN3 is arrange|positioned on the setting azimuth line Le3. The azimuth line Le3 is provided and is a line connecting the projection area on the scale part GPa (GPb) and the rotation center line AX2 of the light beam for measurement of the encoder head EN3 in the XZ plane. In addition, as described above, the azimuth line Le3 is provided as a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 with respect to the substrate P and the rotation center line AX2 in the XZ plane. As can be seen from the above, the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are the same azimuth line.

Similarly, as shown in FIGS. 4 and 8 , the encoder head EN4 is arranged on the setting azimuth line Le4. The azimuth line Le4 is provided and is a line connecting the projection area on the scale part GPa (GPb) and the rotation center line AX2 of the light beam for measurement of the encoder head EN4 in the XZ plane. In addition, as described above, the orientation line Le4 is provided as a line connecting the observation areas Vw4 to Vw6 of the substrate P with the alignment microscope AM2 and the rotation center line AX2 in the XZ plane. As can be seen from the above, the line connecting the reading position of the encoder head EN4 and the rotation center line AX2 and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 are the same azimuth line.

When the setting orientation of the encoder heads EN1, EN2, EN3, and EN4 (the angular direction in the XZ plane with the rotation center line AX2 as the center) is represented by the setting orientation lines Le1, Le2, Le3, and Le4, as shown in the figure As shown in FIG. 4 , the plurality of drawing modules UW1 to UW5 and the encoder heads EN1 and EN2 are arranged so that the azimuth lines Le1 and Le2 form an angle ±θ° with respect to the center plane p3.

Here, the control device 16 detects the rotational angular positions of the scale parts (rotating reels DR) GPa and GPb with the encoder heads EN1 and EN2, and specifies the moving position of the substrate P based on the detected rotational angular positions. The drawing control of the odd-numbered and even-numbered drawing modules UW1 to UW5 is performed. That is, while the drawing light beam LB projected on the substrate P is scanned in the scanning direction, the control device 16 performs ON/OFF modulation of the light deflector 81 based on the CAD information of the pattern to be drawn on the substrate P, but also The timing of ON/OFF modulation using the optical deflector 81 can be performed according to the detected rotational angle position (movement position of the substrate P), whereby a pattern can be drawn on the photosensitive layer of the substrate P with good accuracy.

In addition, the control device 16 can store the scale parts GPa and GPb (rotating drum DR) detected by the encoder heads EN3 and EN4 when the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2. ), the correspondence between the positions of the alignment marks Ks1 to Ks3 on the substrate P and the rotational angle position of the rotary reel DR can be obtained. Similarly, the control device 16 stores the values of the scale parts GPa and GPb (rotating drum DR) detected by the encoder heads EN3 and EN4 when the alignment microscopes AM1 and AM2 detect the reference pattern RMP on the rotating drum DR. The rotation angle position allows the correspondence between the position of the reference pattern RMP on the rotating reel DR and the rotation angle position of the rotating reel DR to be obtained. As described above, the alignment microscopes AM1 and AM2 can precisely measure the rotational angular position (or circumferential position) of the rotating reel DR at the moment when the marks are sampled in the observation areas Vw1 to Vw6. The exposure apparatus EX performs the alignment (alignment) of the board|substrate P and the predetermined pattern drawn on the board|substrate P, or the alignment of the rotating roll DR and the drawing apparatus 11 based on this measurement result.

In addition, the multi-beam type exposure apparatus EX is a spot light that scans the drawing light beam LB along a plurality of drawing lines LL1 to LL5 on the substrate P while conveying the substrate P in the conveyance direction (longitudinal direction) by the rotating reel DR . Here, although the substrate P is wound around a part of the outer peripheral surface of the rotary drum DR and is transported, the relationship between the rotary drum DR and the second optical table 25 may be affected by vibration or the like caused by the rotation of the rotary drum DR in some cases. The configuration relationship is relatively displaced. As a displacement of the arrangement relationship between the rotating reel DR and the second optical table 25 , for example, there is a case where the rotating reel DR and the rotation center line AX2 in the XY plane are inclined with respect to the Y direction. In this case, the relative arrangement relationship between the substrate P wound on the rotating roll DR and the drawing device 11 provided on the second optical table 25 is changed from a predetermined suitable for exposure due to the positional displacement of the rotating roll DR. Displacement relative to the configuration relationship (initial setting state). Therefore, in the exposure apparatus EX of 1st Embodiment, in order to measure the relative arrangement relationship of the rotary reel DR and the drawing apparatus 11, the attachment of the encoder heads EN1-EN4 is set as the structure shown in FIG. 10. FIG.

FIG. 10 is a plan view showing the configuration of an encoder head of the exposure apparatus of FIG. 1 . As shown in FIG. 10 , the encoder heads (first detection devices) EN1 and EN2 are attached to the second optical table 25 via the attachment member 100 . On the other hand, the encoder heads (second detection devices) EN3 and EN4 are attached to the body frame 21 via the attachment member 101 , and the alignment microscopes AM1 and AM2 are also attached to the body frame 21 . The encoder heads EN1 and EN2 are provided as a pair corresponding to the pair of scale portions GPa and GPb provided on both sides of the rotation center line AX2 of the rotary reel DR. Therefore, the pair of encoder heads EN1 and EN2 detect the respective rotational positions of the scale parts GPa and GPb.

Further, between the first optical table 23 and the second optical table 25, a rotation amount measuring device 105 that measures the rotation amount of the rotation mechanism 24 is provided. The rotation amount measuring device 105 is disposed farther from the rotation axis I so that the direction of the linear motion follows the circumferential direction of the rotation axis I, using, for example, a linear encoder. The control device 16 detects the rotation amount of the second optical table 25 with respect to the first optical table 23 based on the minute movement amount in the circumferential direction of the rotation axis I detected by the rotation amount measuring device 105 . In addition, the rotation mechanism 24 includes a drive unit 106 , and the drive unit 106 is driven and controlled by the control device 16 to rotate the second optical table 25 . At this time, the control device 16 performs drive control of the drive unit 106 to rotate the second optical table 25 so that the rotation amount detected by the rotation amount measuring device 105 becomes a predetermined rotation amount.

FIG. 11 is a plan view illustrating a state in which the rotary reel DR and the drawing device 11 (especially the second optical table 25 ) rotate relatively slightly in the XY plane in the configuration of FIG. 10 . As shown in FIG. 11 , the rotation center line AX2 of the rotary reel DR extends in the Y direction, and the rotation center line AX2 is located at the reference position when the rotation center line AX2 is exactly parallel to the Y axis of the stationary coordinate system XYZ. Here, in the XY plane, the rotation center line AX2 is inclined by a predetermined angle θ _z from the reference position due to the influence of ground vibration, vibration from a drive source in the apparatus, or the like. In addition, in FIG. 11 , the displacement of the left rotation is +θ _z , and the displacement of the right rotation is −θ _z . In the XY plane, when the rotation center line AX2 is inclined by a predetermined angle from the reference position, one end portion in the axial direction of the rotary reel DR moves in a predetermined direction (for example, the -X direction in FIG. 11 ). The other end of the DR in the axial direction moves in the direction opposite to the one end of the rotating reel DR (for example, the +X direction in FIG. 11 ).

Therefore, the pair of encoder heads EN1 and EN2 are inclined by a predetermined angle θ _z from the reference position by the rotation center line AX2, and the rotation positions ( The movement position of the scale part GPa) and the rotational position (movement position of the scale part GPb) detected by the encoder heads EN1 and EN2 on the scale part _GPb side generate a difference according to the angle θz. Therefore, the control device 16 can detect the inclination angle θ _z of the rotation center line AX2 of the rotary reel DR in the XY plane based on the rotational positions detected by the pair of encoder heads EN1 and EN2. Specifically, let the count value (movement position of the scale GPa) counted by the counting circuit corresponding to the encoder head EN1 on the scale part GPa side be CD1a, When the count value counted by the corresponding counting circuit (the movement position of the scale GPb) is set to CD1b, the difference value between the count value CD1a and the count value CD1b is rotated by a certain angle or every time the rotating reel DR (scale parts GPa, GPb) rotates. It is possible to measure the inclination variation (angle θ _z ) of the rotation center line AX2 of the rotary reel DR in the XY plane by successively obtaining it over a certain period of time and monitoring the change of the difference value. The same is true for the pair of encoder heads EN2, as long as the count value (movement position of the scale GPa) counted by the counting circuit corresponding to the encoder head EN2 on the scale part GPa side is CD2a, The count value counted by the counter circuit corresponding to the encoder read head EN2 on the GPb side (the movement position of the scale GPb) is set as CD2b, and the change of the differential value is monitored.

In addition, in the measurement of the inclination variation (angle θ _z ), the pair of encoder heads EN1 and the pair of encoder heads EN2 are arranged symmetrically across the center plane p3 in the X direction as in the previous FIG. 4 . Therefore, it is also possible to monitor the change in the difference value between the count value CD1a of the encoder head EN1 facing the scale part GPa and the count value CD2b of the encoder head EN2 facing the scale part GPb, or the difference value between the count value CD2b of the encoder head EN2 facing the scale part GPa Changes in the difference value between the count value CD2a of the encoder head EN2 facing toward and the count value CD1b of the encoder head EN1 facing the scale portion GPb.

Here, the control device 16 corrects the position of the drawing device 11 relative to the substrate P based on the detection results of the alignment microscopes AM1 and AM2 in order to appropriately perform the drawing by the drawing device 11 on the substrate P conveyed by the rotary reel DR. . That is, the control device 16 detects the shape of the substrate P or the deformation of the element pattern (underlying pattern) region formed on the substrate P based on the positions of the marks Ks1 to Ks3 detected by the alignment microscopes AM1 and AM2. , the relative correction rotation amount θ ₂ corresponding to the detected deformation state (particularly, inclination, etc.) is obtained. In addition, the correction rotation amount θ ₂ is an angle from a reference line extending in the X direction. In addition, in FIG. 11, the displacement of the left rotation is +θ ₂ , and the displacement of the right rotation is −θ ₂ . Next, the control device 16 corrects the arrangement relationship of the second optical table 25 with respect to the rotating reel DR by controlling the drive unit 106 of the rotating mechanism 24 based on the obtained correction rotation amount θ ₂ .

At this time, after the control device 16 rotates and corrects the rotation mechanism 24 (second optical table 25 ) from the initial position based on the obtained relative correction rotation amount θ ₂ , the encoder heads EN1 and EN2 also rotate, so that the encoder heads EN1 and EN2 are also rotated. The inclination θ _z of the rotation center line AX2 measured after the rotation correction cannot be taken into consideration, that is, it becomes meaningless. Therefore, the control device 16 rotates the rotation mechanism ₂₄ according to the corrected rotation amount θ2 in consideration of the inclination θ _z of the rotation center line AX2 measured in advance (or just beforehand).

Specifically, the control device 16 is such that the relative correction rotation amount θ ₂ measured based on the detection results of the alignment microscopes AM1 and AM2 becomes zero, that is, “θ ₂ −θ _z (=0°)” becomes zero. In this manner, the rotation mechanism 24 is rotated while the rotation amount measuring device 105 is used to measure the rotation amount by the rotation mechanism 24 .

In this way, the control device 16 obtains offset information, that is, in the XY plane, from the predetermined relative arrangement relationship between the rotary reel DR and the second optical table 25 based on the detection results of the pair of encoder heads EN1 and EN2. _The inclination of the rotation center line AX2 (the inclination of the rotating drum DR in the XY plane) θ _z of the The drive unit 106 of the rotation mechanism 24 is controlled so that the deviation from the inclination θ _z of the rotation center line AX2 is reduced, that is, the predetermined relative arrangement relationship is maintained.

Next, an adjustment method of the exposure apparatus EX will be described with reference to FIG. 12 . 12 is a flowchart related to the adjustment method of the exposure apparatus according to the first embodiment. When correcting the arrangement relationship between the rotary reel DR and the second optical table 25 by the rotation mechanism 24 in order to appropriately draw the substrate P by the drawing device 11, the control device 16 first acquires the data detected by the alignment microscopes AM1 and AM2. Detection results (the inclination of the element pattern region on the substrate P, etc.) (step S1 ). The control device 16 obtains the correction rotation amount θ ₂ to be adjusted by the rotation mechanism 24 based on the detection results detected by the alignment microscopes AM1 and AM2 (step S2 ). After that, the control device 16 acquires information about the inclination θ _z from the comparison of the detection results of the pair of encoder heads EN1 and EN2 (step S3 ). The control device 16 obtains the inclination θ _z of the rotation center line AX2 from the respective rotational angular positions (count values CD1a, CD1b, CD2a, CD2b) of the scale portions GPa, GPb detected by the pair of encoder heads EN1, EN2 (step S4). Next, the control device 16 performs feedback control of the rotation mechanism 24 or the like so that the deviation of the obtained correction rotation amount θ ₂ and the inclination θ _z of the rotation center line AX2, that is, “θ ₂ −θ _z ” becomes zero. is rotated (step S5). In addition, after this step S5, the control device 16 is again based on the rotational angular positions (count values CD1a, CD1b, CD2a, CD2b) of the scale portions GPa, GPb detected by the pair of encoder heads EN1, EN2. , and obtain a new inclination θ' _z of the rotation center line AX2 at appropriate time intervals. Next, when the new inclination _θ'z is changed due to the vibration of the device or the like, the rotation mechanism 24 is feedback-controlled so that the new inclination _θ'z is maintained.

In the first embodiment described above, since the encoder heads EN1 and EN2 are attached to the second optical table 25, the exposure apparatus EX can obtain the rotation in the XY plane based on the detection results of the encoder heads EN1 and EN2. Offset information (inclination θ _z of the rotation center line AX2 ) from the predetermined relative arrangement relationship between the reel DR and the second optical table 25 . Next, the exposure apparatus EX can correct the relative arrangement relationship between the rotating drum DR and the second optical table 25 based on the obtained offset information. Therefore, in the exposure apparatus EX, even if the position of the rotary drum DR is displaced due to the influence of vibration due to the rotation of the rotary drum DR, the predetermined relative arrangement relationship between the rotary drum DR and the second optical table 25 can be maintained. , the drawing by the drawing device 11 can be performed on the substrate P with good accuracy.

In addition, in the first embodiment, the encoder heads EN1 and EN2 can be provided on the installation azimuth lines Le1 and Le2. Therefore, the direction connecting the encoder head EN1 and the rotation center line AX2 can be the same direction as the direction connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2. Similarly, the direction connecting the encoder head EN2 and the rotation center line AX2 can be the same direction as the direction connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2. Therefore, the arrangement relationship of the encoder heads EN1 and EN2 and the drawing lines LL1 to LL5 can be matched. Therefore, even if the position of the rotating reel DR is displaced, the encoder heads EN1 and EN2 can measure the arrangement relationship of the drawing lines LL1 to LL5 with respect to the rotating reel DR with high accuracy, so that it is possible to carry out a process that is less susceptible to disturbances. A measure of the resulting impact.

In addition, in the first embodiment, the encoder heads EN3 and EN4 can be attached to the main body frame 21 . Therefore, the exposure apparatus EX can measure the marks Ks1 to Ks3 with the alignment microscopes AM1 and AM2 based on the detection results of the encoder heads EN3 and EN4 with the main body frame 21 (bearing portion of the rotary drum DR) as a stationary reference. . Next, the exposure apparatus EX can obtain the relative correction rotation amount θ ₂ to be corrected by the rotation mechanism 24 based on the detection results of the alignment microscopes AM1 and AM2. Therefore, the exposure apparatus EX can precisely correct the arrangement of the rotating drum DR and the second optical table 25 based on the deviation between the obtained correction rotation amount θ ₂ and the inclination θ _z of the rotation center line AX2, which is offset information. relation.

In addition, in the first embodiment, the encoder heads EN3 and EN4 can be provided on the installation azimuth lines Le3 and Le4. Therefore, the direction connecting the encoder head EN3 and the rotation center line AX2 and the direction connecting the observation areas Vw1 to Vw3 and the rotation center line AX2 can be the same direction. In addition, the direction connecting the encoder head EN4 and the rotation center line AX2 and the direction connecting the observation areas Vw4 to Vw6 and the rotation center line AX2 can be the same direction. Therefore, the arrangement relationship of the encoder heads EN3 and EN4 and the observation areas Vw1 to Vw6 can be matched. Therefore, even if the position of the rotating reel DR is displaced, the encoder heads EN3 and EN4 can measure the disposition relationship of the observation areas Vw1 to Vw6 with respect to the rotating reel DR with good accuracy, so that it is possible to perform an operation that is less susceptible to disturbances. A measure of the resulting impact.

Moreover, in 1st Embodiment, by rotating the 2nd optical table 25 with respect to the 1st optical table 23 by the rotation mechanism 24, the arrangement|positioning relationship of the rotating drum DR and the 2nd optical table 25 can be corrected. Therefore, the exposure apparatus EX can correct the drawing lines LL1 to LL5 formed by the drawing apparatus 11 provided on the second optical table 25 to appropriate positions with respect to the substrate P wound around the rotary reel DR, so that it can be accurately Drawing of the board|substrate P by the drawing apparatus 11 is performed.

In addition, in the first embodiment, the steps S3 and S4 for obtaining the offset information are executed after the steps S1 and S2 for obtaining the correction rotation amount θ2 are _executed , but the configuration is not limited to this. Steps S1 and S2 for obtaining the correction rotation amount θ ₂ and steps S3 and S4 for obtaining the offset information may be performed in parallel, and the steps S3 and S4 for obtaining the offset information may be executed simultaneously. After S4, steps S1 and S2 for obtaining the correction rotation amount _θ2 are performed.

[Second Embodiment]

Next, the exposure apparatus EX of the second embodiment will be described with reference to FIG. 13 . 13 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the second embodiment. In addition, in the second embodiment, in order to avoid overlapping description with the first embodiment, only the parts different from the first embodiment will be described, and the same components as those of the first embodiment will be given the same reference numerals as those of the first embodiment. Be explained. In the exposure apparatus EX of the first embodiment, as the displacement of the arrangement relationship between the rotary drum DR and the second optical table 25, the rotation center line AX2 of the rotary drum DR in the XY plane with respect to the X direction (reference position) has been described. inclined situation. In the exposure apparatus EX according to the second embodiment, as the displacement of the arrangement relationship between the rotary drum DR and the second optical table 25, the inclination of the rotation center line AX2 of the rotary drum DR with respect to the Y direction (reference position) in the YZ plane will be described. situation.

As shown in FIG. 13 , the three-point mount 22 functions as a connecting mechanism for connecting the main body frame 21 to the first optical table 23 and the second optical table 25 . Here, in the first embodiment, the main body frame 21 and the first optical table 23 connected by the three-point mount 22 function as the first support member, the second optical table 25 functions as the second support member, and the rotation The mechanism 24 functions as a connecting mechanism. In the second embodiment, the main body frame 21 is made to function as the first support member, the first optical table 23 and the second optical table 25 connected by the rotating mechanism 24 are made to function as the second support member, and the three-point mount 22 is made to function as the second support member. Play the function of the linking mechanism.

The three-point stand 22 includes a drive unit 110 having a motor or a piezoelectric element, and the drive unit 110 is driven and controlled by the control device 16 to independently adjust the Z-direction length (height) of each support point 22a, thereby adjusting the relative inclination of the first optical table 23 of the main body frame 21 . Here, the rotation center line AX2 extends in the Y direction, and the position of the rotation center line AX2 extending in the Y direction is used as a reference position. In the YZ plane, the rotation center line AX2 serving as the reference position is inclined by a predetermined angle from the reference position due to the influence of vibration or the like due to rotation. After the rotation center line AX2 is inclined by a predetermined angle from the reference position, one end portion of the rotary reel DR in the axial direction moves in a predetermined direction (for example, the -Z direction in FIG. 13 ), and the other end portion of the rotary reel DR in the axial direction moves in a predetermined direction. It relatively moves in the direction opposite to one end of the rotating drum DR (for example, the +Z direction in FIG. 13 ).

Therefore, when the pair of encoder heads EN1 and EN2 is mounted on the side of the second optical table 25 (or the first optical table 23 ), the rotation center line AX2 is inclined from the reference position by a predetermined angle in the YZ plane, The rotation angle positions (count values CD1a, CD2a) detected by the encoder heads EN1, EN2 on the scale part GPa side and the rotation angle positions (count values CD1a, CD2a) detected by the encoder heads EN1, EN2 on the scale part GPb side ( The count values CD1b, CD2b) produced a difference. Therefore, the control device 16 can detect a change in the inclination of the rotation center line AX2 of the rotating reel DR in the YZ plane in the YZ plane based on the rotational angle positions detected by the pair of encoder heads EN1 and EN2. However, the rotation center line AX2 (rotating reel DR) is displaced in the Z direction based on the information of the rotational angular position detected by the encoders EN1 and EN2 on the scale part GPa side or the encoder heads EN1 and EN2 on the scale part GPb side. It has almost no sensitivity, and is a configuration that has sensitivity to displacement in the X direction of the rotation center line AX2 (rotating reel DR) as in the first embodiment.

Therefore, in the second embodiment, a pair of encoder heads EN3 and EN4 directions arranged in the installation directions of the microscopes AM1 and AM2 shown in FIGS. 4 , 8 , 10 and 11 are used. The displacement in the Z direction on both ends of the rotation center line AX2 (rotating drum DR) is measured. Therefore, as shown in FIGS. 10 and 11 , the encoder heads EN3 and EN4 mounted on the main body frame 21 may be mounted on the first optical table 23 or the second optical table 25 , and the encoder heads EN3 and EN4 may be mounted on the first optical table 23 or the second optical table 25 . The rotational angle positions detected by the pair of encoder heads EN3 and EN4 (count values CD3a and CD4a of the corresponding counter circuit) and the rotational angles detected by the pair of encoder heads EN3 and EN4 facing the scale part GPb The difference between the positions (count values CD3b and CD4b of the corresponding counter circuits) detects the inclination of the rotation center line AX2 of the rotary reel DR in the YZ plane with respect to the rotation center line AX2 of the reference position.

Next, the control device 16 obtains from the predetermined relative arrangement relationship between the rotating reel DR and the second optical table 25 based on the respective detection results (count values CD3a, CD3b, CD4a, CD4b) of the pair of encoder heads EN3 and EN4 The offset information, that is, the inclination of the rotation center line AX2 in the YZ plane, controls the drive unit 110 of the three-point seat 22 so that the inclination of the rotation center line AX2 obtained decreases, that is, the predetermined relative arrangement relationship is maintained. , the inclination of the entire second optical table 25 is corrected.

As described above, in the second embodiment, by attaching the encoder heads EN3 and EN4 (or the encoder heads EN1 and EN2) to the second optical table 25, the encoder heads EN3 and EN4 (or the encoder heads EN2) can be EN1, EN2) detection results (difference in rotational angle position), and obtain the offset information (the displacement in the Z direction and the displacement in the YZ direction) from the predetermined relative arrangement relationship between the rotating drum DR and the second optical table 25 in the YZ plane. in-plane tilt). Next, the exposure apparatus EX can correct the relative arrangement relationship between the rotating drum DR and the second optical table 25 based on the obtained offset information. Therefore, the exposure apparatus EX can maintain the predetermined relative arrangement relationship between the rotary drum DR and the second optical table 25 even if the position of the rotary drum DR is displaced due to the influence of vibration or the like, so that the substrate P can be treated with high accuracy. Expose.

[third embodiment]

Next, the exposure apparatus EX of the third embodiment will be described with reference to FIG. 14 . FIG. 14 is a perspective view showing the arrangement of the main parts of the exposure apparatus according to the third embodiment. Also, in the third embodiment, in order to avoid overlapping descriptions with the first and second embodiments, only the parts different from the first and second embodiments will be described, and the same configuration as the first and second embodiments will be described. Elements are described with the same reference numerals as in the first and second embodiments. In the exposure apparatus EX of the first and second embodiments, the position of the drawing apparatus 11 side (second support member side) is displaced by the rotation mechanism 24 and the three-point mount 22 . In the exposure apparatus EX of the third embodiment, the positions of both end sides of the rotating drum DR (rotation center axis AX2 ) are displaced in the X direction and the Z direction by the X moving mechanism 121 and the Z moving mechanism 122 .

As shown in FIG. 14 , the rotating drum DR is provided with shaft portions Sf2 on both sides in the axial direction, and each shaft portion Sf2 is rotatably supported by the main body frame 21 via bearings 123 . The bearings 123 on both sides are provided with an X moving mechanism 121 and a Z moving mechanism 122 adjacent to each other. Each X moving mechanism 121 and each Z moving mechanism 122 can move the bearing 123 in the X and Z directions (fine movement).

Here, in the third embodiment, the bearing 123 functions as a first support member, the apparatus frame 13 functions as a second support member, and each X moving mechanism 121 and each Z moving mechanism 122 function as a connecting mechanism.

The pair of X moving mechanisms 121 on both sides can respectively move the pair of bearings 123 on both sides in the X direction to fine-tune the inclination and the X-direction position of the rotation center line AX2 of the rotary drum DR in the XY plane. Here, the rotation center line AX2 extends in the Y direction similarly to the first embodiment, and the position of the rotation center line AX2 extending in the Y direction is used as a reference position. In the XY plane, when the rotation center line AX2 serving as the reference position is tilted by a predetermined angle from the reference position due to the influence of vibration or the like, the rotation drum DR can be corrected by adjusting the driving amount of the pair of X moving mechanisms 121 on both sides. Tilt in the XY plane.

In addition, the pair of Z moving mechanisms 122 on both sides can respectively move the pair of bearings 123 on both sides in the Z direction to finely adjust the inclination and Z direction position of the rotation center line AX2 of the rotary drum DR in the YZ plane. Here, the rotation center line AX2 extends in the Y direction similarly to the second embodiment, and the position of the rotation center line AX2 extending in the Y direction is used as a reference position. In the YZ plane, when the rotation center line AX2 serving as the reference position is tilted by a predetermined angle from the reference position due to the influence of vibration, etc., the rotation drum DR can be corrected by adjusting the driving amount of the pair of Z moving mechanisms 122 on both sides. Tilt in the YZ plane.

The pair of encoder heads EN1 and EN2 can measure the relative inclination error of the second optical table 25 and the rotary reel DR (rotation center line AX2 ) in the XY plane as described in the first embodiment. Also, in the third embodiment, similarly to the second embodiment, when the encoder heads EN3, EN4 are mounted on the second optical table 25 (or the first optical table 23), a pair of encoder heads EN3, EN4 EN4 can measure the relative inclination error in the YZ plane of the 2nd optical table 25 and the rotating drum DR (rotation center line AX2) as demonstrated in 2nd Embodiment.

Therefore, the control device 16 obtains a predetermined relative arrangement relationship between the rotary reel DR and the second optical table 25 based on the detection results (count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder heads EN1 and EN2 offset information (relative inclination θ _Z of the rotation center line AX2 in the XY plane). Further, the control device 16 measures the inclination and the like of the element pattern region on the substrate P based on the detection results of the alignment microscopes AM1 and AM2, and obtains the correction rotation amount θ ₂ of the X moving mechanism 121 . The control device 16 controls the drive amounts of the X moving mechanisms 121 on both sides so that the deviation between the obtained corrected rotation amount _θ2 and the inclination _θZ of the rotation center line AX2 is reduced, that is, a predetermined relative arrangement relationship is maintained. Similarly, the control device 16 determines the relative arrangement relationship between the rotating reel DR and the second optical table 25 based on the detection results (count values CD3a, CD3b, CD4a, CD4b) of the pair of encoder heads EN3 and EN4. , obtain the offset information, that is, the inclination of the rotation center line AX2 in the YZ plane (set as θ _X ), and reduce the obtained inclination θ _X of the rotation center line AX2, that is, maintain a predetermined relative arrangement relationship, the driving amount of the Z moving mechanisms 122 on both sides is controlled.

In the third embodiment described above, the rotating drum DR can be rotated with respect to the main body frame 21 about an axis parallel to the Z axis by the X moving mechanism 121 in the XY plane, and the rotating drum DR can be rotated in the YZ plane by the Z moving mechanism 122 The drum DR is rotated about an axis parallel to the X axis with respect to the main body frame 21, and the relative arrangement relationship between the rotating drum DR and the second optical table 25 is adjusted. Therefore, the exposure apparatus EX can correct the drawing lines LL1 to LL5 formed by the drawing apparatus 11 provided on the second optical table 25 to appropriate positions with respect to the substrate P wound around the rotary reel DR, and can Good precision exposure of element patterns.

[4th Embodiment]

Next, the exposure apparatus EX of the fourth embodiment will be described with reference to FIG. 15 . FIG. 15 is a diagram showing the configuration of the rotating reel and the drawing device of the exposure apparatus according to the fourth embodiment. In addition, the fourth embodiment is also similar, in order to avoid overlapping descriptions with the first to third embodiments, only the parts different from the first to third embodiments will be described, and the same configuration as the first to third embodiments will be described. Elements are described with the same reference numerals as in the first to third embodiments. In the exposure apparatus EX of the third embodiment, the position of the rotating drum DR is displaced by the X moving mechanism 121 and the Z moving mechanism 122 that move the bearing 123 . In the exposure apparatus EX of the fourth embodiment, the position of the rotating reel DR is displaced by the reel support frame 130 which is separate and independent from the apparatus frame 13 .

As shown in FIG. 15 , the reel support frame 130 includes a reel rotation mechanism 131 and a reel support member 132 in this order from the lower side in the Z direction. The reel rotation mechanism 131 is installed on the installation surface E via the vibration isolation unit SU3. The reel support member 132 is provided on the reel rotation mechanism 131, and supports the shaft of the rotating reel DR so as to be rotatable by both sides. The reel rotation mechanism 131 adjusts the rotation center line AX2 of the rotating reel DR by rotating the reel support member 132 about the rotation axis _Ia (intersecting the rotation center axis AX2) parallel to the Z axis in the XY plane Tilt in the XY plane.

In addition, since the rotating reel DR is provided in the reel support frame 130 separate from the apparatus frame 13, in this embodiment, the three-point mount 22 and the first optical table in the previous first to third embodiments can be omitted. 23 and the rotation mechanism 24, on the main body frame 21, only the second optical table 25 and the drawing device 11 supported by the second optical table 25 are provided. Here, in the fourth embodiment, the reel support frame 130 functions as a first support member, the device frame 13 functions as a second support member, and the reel rotation mechanism 131 functions as a connection mechanism.

Here, the control device 16 detects, based on the respective detection results (count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder heads EN1 and EN2 mounted on the second optical table 25, relative to the extension in the Y direction. The relative inclination θ _Z of the rotation reel DR (rotation center line AX2 ) and the second optical table 25 in the XY plane with respect to the rotation center line AX2 of the reference position. Furthermore, the control apparatus 16 measures the inclination etc. of the element pattern area on the board|substrate P based on the detection result of alignment microscope AM1, AM2, and obtains the correction|amendment rotation amount (theta _{) 2} of the reel rotation mechanism 131. The control device 16 controls the spool rotation mechanism 131 so that the deviation between the obtained correction rotation amount _θ2 and the inclination _θZ of the rotation center line AX2 is reduced, that is, a predetermined relative arrangement relationship is maintained. In addition, the pair of encoder heads EN3 and EN4 arranged in the same direction as the installation orientation of the alignment microscopes AM1 and AM2 are attached to the second optical table 25 , but may be attached to the reel support member 132 side.

As described above, in the fourth embodiment, since the reel support frame 130 is rotated by the reel rotation mechanism 131 to rotate the reel DR relative to the second optical table 25, the reel DR and the second optical table can be corrected. The relative configuration relationship of the platform 25 . Therefore, the exposure apparatus EX can adjust the board|substrate P wound around the rotary drum DR to an appropriate position with respect to the drawing lines LL1-LL5 formed by the drawing apparatus 11 provided in the 2nd optical table 25. Good precision exposure of element patterns.

[Fifth Embodiment]

Next, the exposure apparatus EX of the fifth embodiment will be described with reference to FIG. 16 . 16 is a plan view showing the arrangement of the encoder head of the exposure apparatus according to the fifth embodiment. Also, in the fifth embodiment, in order to avoid overlapping descriptions with the first to fourth embodiments, only the parts different from the first to fourth embodiments will be described, and the same configuration as the first to fourth embodiments will be described. Elements are described with the same reference numerals as in the first to fourth embodiments. The exposure apparatus EX of 1st Embodiment detects the inclination of the rotary drum DR with a pair of encoder heads EN1 and EN2. In the fifth embodiment, the inclination of the rotating drum DR is detected by the pair of encoder heads EN1 and EN2 and the pair of encoder heads EN5 and EN6.

As shown in FIG. 16 , the pair of encoder heads EN1 and EN2 are attached to the second optical table 25 via the attachment member 100 . In addition, the pair of encoder heads EN5 and EN6 are attached to the main body frame 21 via the attachment member 141 . Here, each encoder head EN1 and each encoder head EN5 are arranged adjacent to each other with a certain gap in the Y direction. In addition, the Y-direction widths of the scale portions GPa and GPb are set to be relatively large so that each of the two encoder heads EN1 and EN5 adjacent to the Y direction can detect the respective scale portions GPa and GPb. width.

Here, since the rotating reel DR is attached to the main body frame 21, the control device 16 is based on the rotation angle position detected by each of the pair of encoder heads EN5 and EN6 (count values CD5a and CD5b of the corresponding counter circuit). , CD6a, CD6b), detect the inclination θ _{ZR of the rotation center line AX2 of the rotary reel DR in the XY plane, and use the detected inclination θ ZR as} a reference position. That is, by the count value CD5a of the encoder head EN5 facing the scale part GPa on one side of the rotation center axis AX2 and the encoder head facing the scale part GPb on the other side of the rotation center axis AX2 The change in the difference value of the count value CD5b of EN5, or the count value CD6a of the encoder head EN6 facing the scale part GPa and the encoder head facing the scale part GPb on the other side of the rotation center axis AX2 The change in the difference value of the count value CD56 of EN6 can measure the change in the inclination θ _ZR of the rotary drum DR in the XY plane with the main body frame 21 as a reference.

In addition, the control device 16 obtains the rotating reel DR based on the rotational angular positions (count values CD1a, CD1b, CD2a, CD2b) detected by the pair of encoder heads EN1, EN2, as in the first embodiment Relative inclination θ _Z with respect to the second optical table 25 in the XY plane. Therefore, based on the tilt θ ZR measured from the rotational angular position detected by each of the pair of encoder heads EN5 and EN6, and the tilt θ _ZR measured from the rotational angular position detected by the pair of encoder heads EN1 and EN2 By tilting θ _Z and rotating the second optical table 25 by the rotation mechanism 24 , the second optical table 25 and the drawing device 11 supported by the second optical table 25 can be set without rotational error relative to the main body frame 21 (stationary reference). However, as in the first embodiment, when corresponding to the inclination error of the element pattern region formed on the substrate P, the relative inclination of the element pattern region measured from the detection results of the alignment microscopes AM1 and AM2 is added. The rotation mechanism 24 is driven by a correction amount corresponding to θ ₂ .

As described above, in the fifth embodiment, it is possible to detect the inclination θ in the XY plane of the rotation center line AX2 of the rotary reel DR with the main body frame 21 as a reference based on the rotational positions detected by the pair of encoder heads EN5 and EN6 _ZR . Therefore, the control device 16 can measure the reference position of the rotation center line AX2 of the rotating reel DR, and thereby can measure the predetermined relative arrangement relationship between the rotating reel DR and the second optical table 25 with high accuracy. In particular, when the first exposure of the pattern for the first layer in which the element pattern region is drawn on the substrate P is performed, even if the rotating roll DR is inclined in the XY plane with respect to the main body frame 21 serving as a stationary reference, correction can be made. The pattern of the first exposure is tilted on the substrate P and transferred.

[Sixth Embodiment]

Next, the exposure apparatus EX of the sixth embodiment will be described with reference to FIG. 17 . 17 is a plan view showing the arrangement of the scale disks of the exposure apparatus according to the sixth embodiment. Also, in the sixth embodiment, in order to avoid overlapping descriptions with the first to fifth embodiments, only the parts different from the first to fifth embodiments will be described, and the same configuration as the first to fifth embodiments will be described. Elements are described with the same reference numerals as in the first to fifth embodiments. The exposure apparatuses EX of the first to fifth embodiments detect the rotational position of the rotary drum DR using the scale parts GPa and GPb formed on the outer peripheral surface of the rotary drum DR. The exposure apparatus EX of the sixth embodiment detects the rotational position of the rotary drum DR using a highly rounded scale disk SD attached to the rotary drum DR.

As shown in FIG. 17 , the scale disk SD has scale portions GPa and GPb engraved on the outer peripheral surface, and is fixed to the end portion of the rotary drum DR so as to be perpendicular to the rotation center line AX2. Therefore, the scale disk SD rotates integrally with the rotary reel DR around the rotation center line AX2. In addition, the scale disk SD uses low thermal expansion metal, glass, ceramics, etc. as the base material, and in order to improve the measurement resolution, the diameter is as large as possible (for example, the diameter is 20 cm or more). In FIG. 17, although the diameter of the outer peripheral surface of the scale disk SD is shown to be smaller than the diameter of the outer peripheral surface of the photosensitive drum DR, it is possible to set the diameter of the scale portion GP of the scale disk SD to be the same as the diameter of the outer peripheral surface of the photosensitive drum DR. The diameters of the outer peripheral surfaces of the substrates P of the roll DR are uniform (substantially uniform), and the so-called measurement Abbe error can be further reduced.

As described above, in the sixth embodiment, since individual scale disks SD can be attached to the rotating reel DR, the scale disk SD suitable for the rotating reel DR can be selected. In addition, since the scale disc SD can be used in multiple places in the circumferential direction with mechanisms (such as pressing screws) that can finely adjust the roundness, it is possible to further reduce the eccentricity error or the eccentricity from the rotation center axis AX2 of the scale portion GP. Measurement error (cumulative error) caused by pitch error of the scale (diffraction lattice), etc.

In addition, in the first to sixth embodiments, although the drawing device 11 using the scanning spot light forms a pattern on the substrate P, it is not limited to this configuration, and any device that forms a pattern on the substrate P may be used. However, a projection exposure system that forms a pattern on the substrate P by projecting and exposing the projection beam from the mask to the substrate P using a flat or cylindrical mask of a transmission type or a reflection type. Furthermore, instead of a mask, a digital micromirror device (DMD) in which a plurality of tiltable micromirrors are arranged in a matrix can be used to project the light distribution corresponding to the pattern to be drawn on the substrate P without a mask. exposure device. In addition, as an apparatus which forms a pattern on the board|substrate P, the drawing apparatus of the inkjet system which forms a pattern on the board|substrate P using the ejection head which discharges liquid droplets, such as ink, may be sufficient, for example. In the case of such a maskless exposure machine or an inkjet drawing apparatus, for example, as disclosed in Japanese Patent Application Laid-Open No. 2010-091990, the light distribution corresponding to the pattern formed by the DMD can be projected onto the substrate P as a light distribution. A structure in which a plurality of exposure parts (pattern forming parts) are arranged in the width direction of the substrate P, or a plurality of droplet application parts (pattern forming parts) provided with ink nozzles of an ink jet method are arranged in the width direction of the substrate P. As a configuration, the entire plurality of exposure sections or the entire plurality of droplet application sections can be relatively rotated with respect to the substrate P within the XY plane.

In addition, in the first to sixth embodiments, the second optical table 25 that fixes the plurality of drawing modules UW1 to UW5 constituting the drawing device 11 is rotated in the XY plane by the rotating mechanism 24, but In order to adjust each of the drawing lines LL1 to LL5 to be parallel in the XY plane or to have a predetermined inclination in the XY plane, it is also possible to provide a second optical table 25 capable of placing each of the drawing modules UW1 to UW5 on the second optical table 25 . An actuator (second rotation mechanism, drive mechanism) that independently rotates slightly in the XY plane. In this case, a separate angle measuring sensor may be provided for measuring the rotational angle position (the amount of inclination, etc.) of each of the drawing modules UW1 to UW5 (pattern forming section) relative to the second optical table 25, and a pair of angle measurement sensors can be provided. The difference between the inclination amount of the second optical table 25 in the XY plane measured by the encoder head EN1 or EN2, etc. and the inclination amount of each of the drawing modules UW1 to UW5 measured by the separate angle measurement sensor (second detection device) Otherwise, the inclination of each of the drawing lines LL1 to LL5 on the substrate P is adjusted. Therefore, even if the substrate P is slightly displaced in the Y direction on the rotary drum DR while the rotary drum DR is rotated to transport the substrate P in the longitudinal direction (X direction) at a constant speed, it is accompanied by a meandering phenomenon. Here, when the conveyance direction of the substrate P is slightly inclined, since the inclination can be measured successively by the position detection of the alignment marks Ks1 to Ks3 by the alignment microscope AM1 (or AM2), the drawing line LL1 can be made to match the inclination. The actuators (drive mechanisms) of the drawing modules UW1 to UW5 are controlled so as to be tilted, respectively. Thereby, even when a new pattern is superimposed on the base pattern for electronic components (for example, the first layer pattern) formed in the exposure area A7 on the substrate P, even if meandering occurs during the conveyance of the substrate P, it is possible to The exposure area A7 on the board|substrate P maintains the superposition precision well over the whole.

Furthermore, in the first to sixth embodiments, the second optical table 25 supporting the drawing device 11 and the main body frame 21 supporting the rotary reel DR are provided with relatively small widths in the XY plane (or in the YZ plane). A drive mechanism such as a rotating motor (the rotation mechanism 24, the drive unit 110 of the three-point seat 22, the X movement mechanism 121, and the Z movement mechanism 122). However, instead of electric operation by a motor or the like, manual operations such as adjustment screws, micro-pressure gauges, replacement of washers with different thicknesses, etc. may be used so that the spatial arrangement relationship between the drawing device 11 and the rotating reel DR is relatively relative. The connection mechanism of the second optical table 25 and the main body frame 21 is connected in a fine-tuning manner. In the coupling mechanism having such a manually-operated adjustment portion, for example, at the time of assembling the device or during maintenance and inspection, the second optical table 25 (first optical table 23 ) on which the drawing device 11 is mounted is detached from the main body frame 21 and reassembled. When the three-point mount 22 is attached to the main body frame 21, it is useful for fine-tuning the position of each of the three-point mounts 22 in the XYZ directions.

<Element manufacturing method>

Next, an element manufacturing method will be described with reference to FIG. 18 . FIG. 18 is a flowchart showing a device manufacturing method according to each embodiment.

The device manufacturing method shown in FIG. 18 firstly performs function and performance design of a display panel formed using self-luminous elements such as organic EL, and designs required circuit patterns and wiring patterns by CAD or the like (step S201 ). Then, a supply roll on which the flexible substrate P (resin film, metal foil film, plastic, etc.) serving as the base material of the display panel is wound is prepared (step S202 ). In addition, the roll-shaped substrate P prepared in this step S202 may have its surface modified as necessary, or a bottom layer (for example, micro unevenness by imprinting) may be formed in advance, or a photosensitive layer may be pre-laminated. functional film or transparent film (insulating material).

Next, a substrate layer composed of electrodes, wirings, insulating films, TFTs (thin film semiconductors), etc. that constitute display panel elements is formed on the substrate P, and a self-luminous element such as organic EL is formed by laminating on the substrate. the light-emitting layer (display pixel portion) (step S203). This step S203 also includes the conventional lithography process for exposing the photoresist layer using the exposure apparatus EX described in the previous embodiments, and the substrate P coated with the photosensitive silane coupling agent instead of the photoresist. Exposure process of pattern exposure to form hydrophilic and water repellent patterns on the surface, wet process of pattern exposure of photosensitive catalyst layer to form metal film patterns (wiring, electrodes, etc.) by electroless plating, or Processing such as a printing process in which a pattern is drawn with conductive ink containing silver nanoparticles.

Next, the substrate P is cut for each display panel element continuously manufactured on the elongated substrate P in a roll method, or a protective film (environmentally resistant barrier layer) or a color filter film is attached to the surface of each display panel element, etc., Components are assembled (step S204). Next, a step of checking whether the display panel elements can operate normally, or whether the desired performance and characteristics are satisfied (step S205 ) is performed. In the above manner, a display panel (flexible display) can be manufactured. In addition to the manufacture of the display panel as shown in FIG. 18, a flexible printed circuit board that requires precise wiring patterns (high-density wiring), chemical sensors including semiconductor elements such as TFTs, and electrode patterns for sensing When a sheet, a DNA chip, or the like is produced on the flexible substrate P, the exposure apparatuses of the above-described embodiments can also be used.

Claims (9)

1. A substrate processing apparatus for conveying a long sheet-like substrate in a longitudinal direction and sequentially forming a predetermined pattern on the sheet-like substrate, comprising:

a cylindrical drum having a cylindrical outer peripheral surface with a constant radius from a center line extending in a direction intersecting the longitudinal direction, the cylindrical drum supporting the sheet-like substrate with a part of the outer peripheral surface;

a1 st support member for supporting the drum rotatably around the center line;

a pattern forming device disposed opposite to a portion of the outer peripheral surface of the cylindrical drum, the portion supporting the sheet-like substrate, the pattern forming device forming the pattern on the sheet-like substrate;

a2 nd support member that holds the pattern forming device;

a reference member that rotates around the center line together with the drum, and that is provided with an index for measuring a change in position in the direction of rotation of the drum or in the direction of the center line;

a1 st detecting device attached to the 2 nd support member, for detecting an index of the reference member to detect a change in position in the rotation direction or the center line direction of the cylindrical drum;

a2 nd detection device attached to the 1 st support member and detecting an index of the reference member; and

a connecting mechanism for connecting the relative arrangement of the cylinder drum and the pattern forming device to be adjustable based on the detection results of the 1 st and 2 nd detection devices.

2. The substrate processing apparatus according to claim 1, wherein the 1 st detecting device is arranged such that a pattern forming position of the pattern forming device with respect to the sheet-like substrate substantially coincides with a direction connecting a detection position of the index of the 1 st detecting device with respect to the reference member with the center line when the 2 nd supporting member is viewed from an extending direction of the center line.

3. The substrate processing apparatus according to claim 2, further comprising a mark detection device mounted on the 1 st support member and having a detection probe for detecting a mark formed on the sheet-like substrate;

the 2 nd detecting device is disposed in the 1 st supporting member such that a detection position of the index of the reference member by the 2 nd detecting device substantially coincides with a direction in which a detection position of the mark by the detection probe is connected to the center line when viewed from the extending direction of the center line.

4. The substrate processing apparatus according to any one of claims 1to 3, wherein the coupling mechanism is provided between the 1 st support member and the 2 nd support member, and couples the 2 nd support member to be rotatable with respect to the 1 st support member around a predetermined point in a plane intersecting a direction in which the 1 st support member and the 2 nd support member face each other.

5. The substrate processing apparatus according to any one of claims 1to 3, wherein the coupling mechanism couples the rotation axis of the cylindrical drum to be tiltable so that the center line as the rotation axis of the cylindrical drum is tilted relative to the patterning device.

6. The substrate processing apparatus according to any one of claims 1to 3, wherein the 1 st support member has a main body frame disposed on an installation surface, a1 st stage provided on the main body frame, and a support mechanism provided between the main body frame and the 1 st stage;

the 2 nd support member has a2 nd stage disposed on the 1 st stage.

7. The substrate processing apparatus according to any one of claims 1to 3, wherein the coupling mechanism includes a driving unit that relatively displaces the 1 st support member and the 2 nd support member;

the index of the reference member is a pair of scale parts of an encoder for rotation measurement provided on both sides of the cylindrical drum in the center line direction;

the 1 st detecting device and the 2 nd detecting device are a pair of heads disposed to face each of the pair of scale parts.

8. The substrate processing apparatus according to claim 7, further comprising: a control device for controlling the driving part;

the control device obtains offset information of the cylinder drum and the 2 nd support member from a predetermined relative arrangement relationship based on the detection results of the pair of heads, and controls the drive unit to maintain the predetermined relative arrangement relationship based on the offset information.

9. The substrate processing apparatus according to any one of claims 1to 3,

the pattern forming apparatus is any one of the following apparatuses:

a pattern drawing device for drawing the pattern by one-dimensionally scanning a spot beam of a drawing beam ON/OFF-modulated in accordance with CAD information of the pattern to be drawn ON the sheet-like substrate in the direction of the center line;

a mask type exposure device for exposing the pattern on the sheet-like substrate using a transmission type or reflection type flat or cylindrical mask;

a maskless exposure device that projects and exposes light distribution corresponding to a pattern to be drawn on the sheet-like substrate by a plurality of micromirrors onto the sheet-like substrate;

in the drawing device of the ink jet system, a pattern made of the ink is formed on the sheet-like substrate by a head for ejecting droplets of the ink.

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