JP6680330B2 - Pattern forming equipment - Google Patents

Description

  The present invention relates to a pattern forming device.

  As a substrate processing device, a sheet-shaped medium (flexible printed wiring board) is conveyed while being attracted flatly onto a metal endless belt, and a digital micromirror device (DMD) is used at a predetermined position on the substrate surface. There is known an apparatus that draws a pattern by a drawing unit including a plurality of exposure heads (see, for example, Patent Document 1).

JP, 2006-098720, A

  In Patent Document 1, in order to accurately form a pattern at a predetermined position on a substrate, an alignment camera (mark detection system) for capturing an image of a mark formed in advance on the substrate is provided and It is shown that the drawing position and the exposure position of the pattern are adjusted based on the above. In such a device, speed fluctuations, straightness error, vertical movement error, etc. of a transport mechanism (in Patent Document 1, an endless belt and its driving roller, etc.) that supports a flexible sheet-shaped substrate and sends it in a lengthwise direction, etc. However, it affects the feeding accuracy of the sheet-shaped substrate. Even if the feeding accuracy of the transport mechanism is suppressed within the allowable range, if the position or orientation of the mark detection system (reading device) such as the alignment camera deviates from the initial position, a predetermined exposure accuracy range (allowing positional deviation of the pattern drawing position) An alignment error that is out of the range) occurs. Furthermore, when the position and orientation of the mark detection system fluctuate over time due to changes in temperature inside the apparatus and changes in environmental temperature, alignment errors also occur. When such an alignment error occurs, it is possible to perform some kind of calibration work periodically. Due to the work, the apparatus is generally stopped temporarily, and the production efficiency (tact time, throughput) of the device is reduced.

  According to the embodiment of the present invention, in order to continuously perform various kinds of processing (exposure, drawing, printing, processing, etc.) with highly accurate alignment on a sheet-like substrate which is being conveyed, calibration for maintaining accuracy is performed. An object of the present invention is to reduce the labor and time for work and the like, and to prevent the reduction in device production efficiency.

  According to the first embodiment of the present invention, the flexible sheet-shaped substrate is curved and supported along a cylindrical outer circumferential surface having a constant radius from a predetermined axis, and the flexible sheet-shaped substrate is rotated about the axis to rotate the substrate. A pattern forming apparatus having a rotating drum for conveying a sheet-shaped substrate in a longitudinal direction, wherein the pattern forming device is set to a first azimuth direction of the outer peripheral surface of the rotating drum in which the sheet-shaped substrate is supported. On the sheet-shaped substrate, there is a processing unit that forms a pattern on the surface of the sheet-shaped substrate in the processing region, and a detection region that is set on the upstream side of the processing region in the transport direction of the sheet-shaped substrate. Are formed at substrate marks provided at predetermined intervals along the lengthwise direction, at specific positions on the outer peripheral surface of the rotating drum, or at specific positions on a reference sheet plate temporarily fixed to the outer peripheral surface of the rotating drum. Standard The rotation of the rotary drum is achieved by reading a mark on a mark detection unit that detects any one of the loops through the detection area and an annular scale unit that rotates around the axis along with the rotary drum. A scale measuring unit that outputs measurement information regarding a position in a direction, and a position regarding a direction of the axis of a reference flat surface that is arranged on the side surface side of the rotating drum so as to be orthogonal to the axis and that rotates together with the rotating drum. A lateral deviation detection unit that outputs a lateral deviation amount according to a change, and detected by the mark detection unit each time the reference pattern appears in the detection area of the mark detection unit with a plurality of rotations of the rotary drum. Based on the position information of the reference pattern, the measurement information by the scale measuring unit, and the lateral deviation amount by the lateral deviation detecting unit. Relative positional relationship between the rotary drum and the click detection unit, or the pattern forming apparatus provided with an arithmetic unit for obtaining an error from a predetermined state of the positional relationship is provided.

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to this embodiment. FIG. 2 is a perspective view showing the arrangement of the main parts of the exposure apparatus of FIG. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a diagram showing a configuration of a rotary drum and a drawing device of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. FIG. 8-1 is a perspective view showing a positional relationship between an alignment microscope, a drawing line, and an encoder head on a substrate. FIG. 8-2 is a perspective view showing a positional relationship between the alignment microscope and the encoder head. FIG. 9-1 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus shown in FIG. 1. FIG. 9-2 is an enlarged view showing a reference pattern provided on the rotary drum. FIG. 9C is a diagram showing a modified example of the rotary drum. 9-4 is a figure which shows the modification of a scale part. FIG. 10A is a diagram illustrating a lateral deviation detection unit that detects the lateral deviation amount of the rotating drum. FIG. 10-2 is a diagram illustrating a lateral deviation detection unit that detects the lateral deviation amount of the rotating drum. FIG. 10C is a diagram illustrating a lateral deviation detection unit that detects the lateral deviation amount of the rotating drum. FIG. 11 is a diagram for explaining an error of the alignment microscope. FIG. 12-1 is a diagram showing an enlarged image of the detection region of the alignment microscope. FIG. 12-2 is a diagram showing an enlarged image of the detection region of the alignment microscope. FIG. 12C is a diagram showing an enlarged image of the detection area of the alignment microscope. FIG. 13 is a diagram showing a detection region of the alignment microscope on the substrate. FIG. 14 is a diagram for explaining the position where the alignment microscope detects the drum-side reference pattern. FIG. 15-1 is a diagram illustrating an example of an image detected by the alignment microscope when determining an attachment error of the alignment microscope. FIG. 15-2 is a diagram showing an example of an image detected by the alignment microscope when the attachment error of the alignment microscope is obtained. FIG. 15C is a diagram showing an example of an image detected by the alignment microscope when determining an attachment error of the alignment microscope. FIG. 16-1 is a diagram for explaining a method of obtaining a rotation error of the alignment microscope. FIG. 16-2 is a diagram for explaining the correction of the position in the detected image in consideration of the lateral shift amount. FIG. 17 is a diagram for explaining a method of obtaining a mounting error of each alignment microscope when the alignment microscopes are arranged in two rows in the substrate transport direction. FIG. 18 is a diagram for explaining an example of obtaining the displacement of the substrate that occurs while the rotating drum is transporting the substrate. FIG. 19 is a diagram for explaining an example of obtaining the displacement of the substrate that occurs while the rotating drum is transporting the substrate. FIG. 20 is a flowchart showing the device manufacturing method of this embodiment.

  Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to this embodiment. The substrate processing apparatus of this embodiment is an exposure apparatus EX that performs an exposure process on a substrate P. The exposure apparatus EX is incorporated in the device manufacturing system 1 that manufactures devices by performing various types of processing on the substrate P after exposure. First, the device manufacturing system 1 will be described.

<Device manufacturing system>
The device manufacturing system 1 is a line (flexible / electronic device manufacturing line) for manufacturing electronic devices such as flexible displays, multilayer flexible wirings, and flexible sensors as devices. In the following embodiments, a flexible display will be described as an example of the electronic device. Examples of flexible displays include organic EL displays. In the device manufacturing system 1, the substrate P is sent out from a supply roll (not shown) in which a flexible long sheet-like substrate P is wound in a roll shape, and various processing is performed on the sent-out substrate P. Is continuously applied and then the processed substrate P is wound as a flexible device on a recovery roll (not shown), which is a so-called roll-to-roll system. The substrate P is also called a flexible substrate. In the device manufacturing system 1, the substrate P, which is a film-like sheet, is sent out from the supply roll, and the substrate P sent out from the supply roll is sequentially collected through the process device U1, the exposure device EX, and the process device U2. It shows an example until it is wound up on a roll.

  The substrate P to be processed by the device manufacturing system 1 will be described. As the substrate P, for example, a resin film, a foil made of metal or alloy such as stainless steel, or the like is used. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin and vinyl acetate resin. Contains at least one.

  It is desirable to select the substrate P that does not have a remarkably large coefficient of thermal expansion, for example, so that the amount of deformation of the substrate P due to the heat received in various treatments can be substantially ignored. The coefficient of thermal expansion may be set smaller than a threshold value according to the process temperature or the like by mixing an inorganic filler with the resin film, for example. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single-layer body of ultra-thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminate obtained by laminating the above-mentioned resin film, foil or the like on the ultra-thin glass. May be

  The substrate P becomes a supply roll by being wound in a roll shape. This supply roll is attached to the device manufacturing system 1. The device manufacturing system 1 with the supply roll mounted thereon repeatedly executes various processes for manufacturing a device on the substrate P sent from the supply roll. Therefore, the processed substrate P is in a state in which a plurality of devices are connected. That is, the substrate P sent out from the supply roll is a substrate for multiple cutting. The substrate P may be a substrate whose surface has been modified and activated in advance by a predetermined pretreatment, or a substrate on which a fine partition structure (uneven structure) for precision patterning is formed.

  The processed substrate P is collected as a collecting roll by being wound into a roll. The recovery roll is mounted on a dicing device (not shown). The dicing apparatus equipped with the recovery roll divides the processed substrate P into devices (dicing) to form a plurality of devices. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (shorter direction) and 10 m or more in the length direction (longer direction). The size of the substrate P is not limited to the above size.

  Subsequently, the device manufacturing system 1 will be described with reference to FIG. The device manufacturing system 1 includes a process apparatus U1, an exposure apparatus EX, and a process apparatus U2. In FIG. 1, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction is a direction from the process device U1 through the exposure device EX to the process device U2 in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X and Y directions.

  The process apparatus U1 performs a pre-process (pre-process) on the substrate P exposed by the exposure apparatus EX. The process apparatus U1 sends the preprocessed substrate P to the exposure apparatus EX. At this time, the substrate P sent to the exposure apparatus EX is, for example, a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on the surface thereof.

  The photosensitive functional layer is, for example, applied as a solution on the substrate P and dried to form a layer (film). A typical photosensitive functional layer is photoresist, but a photosensitive silane coupling material (SAM) is used as a material that does not require development processing and whose lyophobic property is modified in a portion exposed to ultraviolet rays. Alternatively, there is a photosensitive reducing material or the like in which a plating reducing group is exposed at a portion irradiated with ultraviolet rays. When a photosensitive silane coupling material is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the surface of the substrate P is changed from lyophobic to lyophilic and thus becomes lyophilic. A conductive ink (ink containing conductive nanoparticles such as silver or copper) is selectively applied to the surface of the portion to form a pattern layer. When a photosensitive reducing material is used as the photosensitive functional layer, the plating reducing group is exposed on the pattern portion of the surface of the substrate which is exposed to ultraviolet light, and therefore the substrate P is immediately exposed to electroless plating solution containing palladium ions or the like. A pattern layer of palladium is formed (deposited) by immersing in the metal for a certain period of time.

  The exposure apparatus EX draws a pattern such as a display circuit or wiring on the substrate P supplied from the process apparatus U1. As will be described later in detail, the exposure apparatus EX exposes a predetermined pattern on the substrate P with a plurality of drawing lines obtained by scanning each of the plurality of drawing beams LB in a predetermined scanning direction. The substrate P that has been subjected to the exposure processing by the exposure apparatus EX is sent to the process apparatus U2, and the process apparatus U2 performs post-process (post-processing) on the substrate P. As a result, a specific pattern layer of the electronic device is formed on the surface of the substrate P. Next, the exposure apparatus EX will be described.

<Exposure device (substrate processing device)>
FIG. 2 is a perspective view showing the arrangement of the main parts of the exposure apparatus of FIG. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a diagram showing the configuration of the rotary drum and the drawing device of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. FIG. 8-1 is a perspective view showing a positional relationship between an alignment microscope, a drawing line, and an encoder head on a substrate. FIG. 8-2 is a perspective view showing a positional relationship between the alignment microscope and the encoder head. FIG. 9-1 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus shown in FIG. 1. FIG. 9-2 is an enlarged view showing a reference pattern provided on the rotary drum. FIG. 9C is a diagram showing a modified example of the rotary drum. 9-4 is a figure which shows the modification of a scale part.

  As shown in FIG. 1, the exposure apparatus EX is a maskless exposure apparatus that does not use a mask, and is a so-called raster scan type direct drawing exposure apparatus. This exposure apparatus draws the surface of the substrate P by forming a predetermined pattern by scanning the spot of the drawing beam LB in a predetermined scanning direction while carrying the substrate P in the carrying direction. As shown in FIG. 1, the exposure apparatus EX includes a drawing device 11 as a processing unit, a substrate transfer mechanism 12, alignment microscopes AM1 and AM2 as reference pattern detection units, and a control device 16 as a calculation unit. ing. The drawing apparatus 11 sequentially performs a predetermined process on the target region of the substrate P along the long direction of the substrate P. In the present embodiment, the drawing apparatus 11 includes a plurality of drawing modules UW1 to UW5, and a predetermined pattern is drawn by the plurality of drawing modules UW1 to UW5 on a part of the substrate P which is transferred by the substrate transfer mechanism 12 at a constant speed. To be done.

  The substrate transfer mechanism 12 transfers the substrate P transferred from the process device U1 of the previous process to the process device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 as pattern (mark) detection units precisely align (align) the drawing pattern drawn on the surface of the substrate P on the substrate P in the order of microns, preferably submicrons. First, an alignment mark as a substrate mark previously formed on the substrate P, a reference pattern formed on the outer peripheral surface of the rotating drum DR, or the like is detected. The control device 16 controls each unit of the exposure apparatus EX and causes each unit to execute processing. The control device 16 may be a part or all of a higher-level control device that controls the device manufacturing system 1. Further, the control device 16 may be a device that is controlled by a higher-order control device and is different from the higher-order control device. The control device 16 includes, for example, a computer.

  The exposure apparatus EX includes an apparatus frame 13 (see FIG. 2) that supports the drawing apparatus 11 and the substrate transport mechanism 12, and a rotational position detection mechanism (see FIGS. 4 and 8) 14. Further, a light source device CNT that emits laser light (pulse light) as a drawing beam LB is provided inside the exposure device EX. The exposure apparatus EX guides the drawing beam LB emitted from the light source device CNT by the drawing apparatus 11 and projects the drawing beam LB on the substrate P transported by the substrate transport mechanism 12.

  The exposure apparatus EX shown in FIG. 1 is housed in the temperature control chamber EVC. The temperature control chamber EVC is installed on the installation surface E of a manufacturing factory or the like via the passive or active vibration isolation units SU1 and SU2. The anti-vibration units SU1 and SU2 are provided on the installation surface E and reduce the vibration from the installation surface E. The temperature control chamber EVC keeps the inside at a predetermined temperature, thereby suppressing the shape change of the substrate P transported inside due to the temperature. Next, the substrate transfer mechanism 12 of the exposure apparatus EX will be described.

  The substrate transport mechanism 12 includes an edge position controller EPC, a driving roller DR4, a tension adjusting roller RT1, a rotary drum DR as a cylindrical member, a tension adjusting roller RT2, a driving roller DR6, and a driving roller in this order from the upstream side in the carrying direction of the substrate P. It has DR7. The edge position controller EPC adjusts the position of the substrate P transported from the process apparatus U1 in the width direction (direction parallel to the Y axis). The edge position controller EPC adjusts the position of the substrate P sent from the process device U1 at both ends (edges) in the width direction within a range of ± tens of μm to ± tens of μm with respect to the target position. The position of the substrate P in the width direction is corrected by moving P in the width direction. Therefore, the edge position controller EPC functions as a pre-alignment (coarse positioning) mechanism for the substrate P.

  The drive roller DR4 rotates while sandwiching both front and back surfaces of the substrate P conveyed from the edge position controller EPC, and sends the substrate P to the downstream side in the conveying direction, that is, the lengthwise direction of the substrate P to rotate the substrate P. It is conveyed toward the drum DR. The rotary drum DR is a longitudinal direction in which a pattern on the surface of the substrate to be processed, that is, the substrate P is exposed by a part of a cylindrical outer peripheral surface having a constant radius r from a rotation center axis AX2 as a predetermined axis extending in the Y direction. Support a part of. Then, the rotating drum DR is rotated about the rotation center axis AX2 around the rotation center axis AX2 at a constant speed by a drive motor, so that the substrate P supported on the outer peripheral surface has a constant speed in the longitudinal direction. Be transported in. The rotary drum DR is provided with a reference pattern at a specific position on the outer peripheral surface. The reference pattern of the rotary drum DR will be described later.

  In order to rotate the rotary drum DR around the rotation center axis AX2, shaft portions Sf2 coaxial with the rotation center axis AX2 are provided on both sides of the rotation drum DR. Rotational torque from a drive source (not shown) (motor, reduction gear mechanism, etc.) is applied to the shaft portion Sf2. A plane including the rotation center axis AX2, parallel to the rotation center axis AX2, and extending in the Z direction is the center plane p3. The two sets of tension adjusting rollers RT1 and RT2 as guide members apply a predetermined tension to the substrate P wound and supported by the rotating drum DR. The two sets of tension adjusting rollers RT1 and RT2 guide the substrate P so that the substrate P is wound around a predetermined peripheral length range CL of the outer peripheral surface of the rotary drum DR. Each detection region of the alignment microscope AM1 as the first pattern detection unit and the alignment microscope AM2 as the second pattern detection unit and the processing position of the drawing device 11 are arranged within a predetermined circumferential length range CL of the rotary drum DR. .

  The two sets of drive rollers DR6 and DR7 are arranged at a predetermined interval in the transport direction of the substrate P, and give the substrate P after exposure a predetermined slack (play) DL. The drive roller DR6 clamps (nip) the upstream side of the transported substrate P to rotate, and the drive roller DR7 clamps (nip) the downstream side of the transported substrate P to rotate to thereby rotate the substrate P. Are transported to the process device U2. At this time, since the substrate P is provided with the slack DL, it is possible to absorb fluctuations in the transport speed of the substrate P that occur downstream of the drive roller R6 in the transport direction, and to perform exposure processing on the substrate P due to fluctuations in the transport speed. The effects of can be cut off.

  The substrate transfer mechanism 12 adjusts the position of the substrate P transferred from the process device U1 in the width direction by the edge position controller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction is adjusted to the tension adjustment roller RT1 by the drive roller DR4, and transports the substrate P that has passed through the tension adjustment roller RT1 to the rotary drum DR. The substrate transport mechanism 12 rotates the rotary drum DR to transport the substrate P supported by the rotary drum DR toward the tension adjusting roller RT2. The substrate transport mechanism 12 transports the substrate P transported to the tension adjusting roller RT2 to the drive roller DR6, and transports the substrate P transported to the drive roller DR6 to the drive roller DR7. Then, the substrate transport mechanism 12 transports the substrate P toward the process apparatus U2 while giving the slack DL to the substrate P by the drive roller DR6 and the drive roller DR7.

  Next, the apparatus frame 13 of the exposure apparatus EX will be described with reference to FIG. FIG. 2 shows an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal, but this is the same as the orthogonal coordinate system shown in FIG. The exposure apparatus EX includes an apparatus frame 13 that supports the drawing apparatus 11 shown in FIG. 1 and the rotary drum DR of the substrate transport mechanism 12. The device frame 13 shown in FIG. 2 includes a main body frame 21, a three-point seat 22, a first optical surface plate 23, a rotation mechanism 24, and a second optical device in order from the lower side (vertical direction side) in the Z direction. It has a surface plate 25. The body frame 21 is installed on the installation surface E via the vibration isolation units SU1 and SU2. The body frame 21 rotatably supports the rotating drum DR and the tension adjusting rollers RT1 (see FIG. 1) and RT2. The first optical surface plate 23 is provided on the upper side in the vertical direction of the rotary drum DR, and is installed on the main body frame 21 via the three-point seat 22. The three-point seat 22 supports the first optical surface plate 23 at three support points. The three-point seat 22 is adjustable in the Z direction at each support point. Therefore, the three-point seat 22 can adjust the inclination of the surface of the first optical surface plate 23 with respect to the horizontal plane to a predetermined inclination. When the device frame 13 is assembled, the position between the body frame 21 and the three-point seat 22 can be adjusted in the X and Y directions within the XY plane. On the other hand, after the device frame 13 is assembled, the body frame 21 and the three-point seat 22 are fixed, that is, rigid.

  The second optical surface plate 25 is provided on the upper side in the vertical direction of the first optical surface plate 23, and is installed on the first optical surface plate 23 via the rotation mechanism 24. The surface of the second optical surface plate 25 is parallel to the surface of the first optical surface plate 23. A plurality of drawing modules UW1 to UW5 of the drawing device 11 are installed on the second optical surface plate 25. The rotation mechanism 24 moves the first optical surface plate 23 and the second optical surface plate 25 on the first optical surface plate 23 about a predetermined rotation axis I extending in the vertical direction with the surface surfaces of the first optical surface plate 23 and the second optical surface plate 25 kept parallel to each other. On the other hand, the second optical surface plate 25 is rotated. The rotation axis I extends in the vertical direction in the center plane p3 shown in FIG. 1 and is a predetermined value on the surface (drawing surface curved along the circumferential surface) of the substrate P wound around the rotating drum DR. Through the position (see Figure 3). The rotating mechanism 24 can adjust the positions of the plurality of drawing modules UW1 to 5 with respect to the substrate P wound around the rotating drum DR by rotating the second optical surface plate 25 with respect to the first optical surface plate 23. it can.

  Subsequently, the light source device CNT will be described with reference to FIGS. 1 and 5. The light source device CNT is installed on the main body frame 21 of the device frame 13. The light source device CNT emits laser light as the drawing beam LB projected on the substrate P. The light source device CNT has a light source that emits light in a predetermined wavelength range suitable for exposure of the photosensitive functional layer on the substrate P and light in the ultraviolet range having a strong photoactive effect. As the light source, for example, a YAG third harmonic laser light (wavelength 355 nm), a laser light source that continuously oscillates or pulse-oscillates at about 50 MHz to 100 MHz, or pulsed light having an infrared wavelength is oscillated at a frequency of 100 MHz or more. It is composed of a semiconductor laser, a fiber amplifier that amplifies the pulsed light, a crystal element that converts the amplified pulsed light into a harmonic wave, and emits ultraviolet pulsed light with a wavelength of 355 nm (emission time of about several picoseconds). Fiber amplifier laser light source can be used.

  The drawing beam LB emitted from the light source device CNT enters a polarization beam splitter PBS described later. It is preferable that the drawing beam LB is a light beam that reflects almost all of the incident drawing beam LB in the polarization beam splitter PBS in order to suppress energy loss due to separation of the drawing beam LB by the polarization beam splitter PBS. . The polarization beam splitter PBS reflects the S-polarized linearly polarized light and transmits the P-polarized linearly polarized light. Therefore, in the light source device CNT, it is preferable that the drawing beam LB that enters the polarization beam splitter PBS emits a laser beam that is a linearly polarized (S-polarized) light beam. Further, since the laser light has a high energy density, the illuminance of the light flux projected on the substrate P can be appropriately secured.

  Next, the drawing device 11 of the exposure apparatus EX will be described. The drawing device 11 is a so-called multi-beam type drawing device 11 using a plurality of drawing modules UW1 to UW5. As shown in FIG. 1, the drawing apparatus 11 splits a plurality of drawing beams LB emitted from a light source device CNT into a plurality of branched drawing beams LB, and outputs the plurality of branched drawing beams LB on a substrate P shown in FIG. In the embodiment, scanning is performed along each of the five drawing lines LL1 to LL5. Then, the drawing apparatus 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, a plurality of drawing lines LL1 to LL5 formed on the substrate P by scanning a plurality of drawing beams LB by the drawing device 11 will be described.

  As shown in FIG. 3, the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged on the substrate P on the upstream side in the rotation direction. Even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged on the substrate P on the downstream side in the rotation direction. The drawing lines LL1 to LL5 are formed along the width direction (Y direction) of the substrate P, that is, along the rotation center axis AX2 of the rotary drum DR, and are shorter than the length of the substrate P in the width direction. Strictly speaking, each of the drawing lines LL1 to LL5 is such that when the substrate P is carried by the substrate carrying mechanism 12 at the reference speed, the splicing error of the patterns obtained by the plurality of drawing lines LL1 to LL5 is minimized. It is tilted on the substrate P by a predetermined minute angle with respect to the rotation center axis AX2 of the rotary drum DR.

  The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at predetermined intervals in the axis AX2 direction of the rotary drum DR. The even-numbered second drawing line LL2 and fourth even drawing line LL4 are arranged at a predetermined interval in the direction of the axis AX2 of the rotary drum DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the axial direction. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. The first drawing line LL1 to the fifth drawing line LL1 to LL5 are arranged so as to cover the entire width in the Y direction of the processing target area A7 drawn on the substrate P.

  The scanning direction of the drawing beam LB that is scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction, and is the same direction. Further, the scanning direction of the drawing beam LB that is scanned along the even-numbered second drawing line LL2 and fourth drawing line LL4 is a one-dimensional direction, and is the same direction. However, the scanning direction of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the drawing beam LB scanned along the even-numbered drawing lines LL2, LL4 are mutually different. It is in the opposite direction. Therefore, when viewed from the transport direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL3 and LL5 and the drawing end positions of the even-numbered drawing lines LL2 and LL4 are adjacent to each other, and similarly, The drawing end positions of the even-numbered drawing lines LL1 and LL3 are adjacent to the drawing start positions of the even-numbered drawing lines LL2 and LL4.

  Next, the drawing device 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 is arranged on the downstream side in the transport direction of the substrate P from the detection region of the reference pattern of the substrate P by the alignment microscopes AM1 and AM2 shown in FIG. It functions as a processing unit that performs a predetermined process (exposure process in this embodiment) on a part of the substrate P. The drawing device 11 includes the above-described plurality of drawing modules UW1 to UW5, a branch optical system SL that branches the drawing beam LB from the light source device CNT, and a calibration detection system 31 for performing calibration.

  The branching optical system SL branches the drawing beam LB emitted from the light source device CNT into a plurality of beams, and guides the plurality of branched drawing beams LB toward the plurality of drawing modules UW1 to UW5. The branching optical system SL includes a first optical system 41 that splits the drawing beam LB emitted from the light source device CNT into two, and a second optical system that is irradiated with one drawing beam LB that is branched by the first optical system 41. It has a system 42 and a third optical system 43 which is irradiated with the other drawing beam LB branched by the first optical system 41. Further, the branching optical system SL includes an XY overall harbing adjusting mechanism 44 that two-dimensionally shifts the pre-branching beam LB in the first optical system 41 in a plane perpendicular to the beam axis, and in the third optical system 43. XY one-side harbing adjusting mechanism 45 that two-dimensionally shifts the beam LB of No. 2 in a plane perpendicular to the beam axis. A part of the branch optical system SL on the light source device CNT side is installed on the main body frame 21, while another part on the drawing module UW side is installed on the second optical surface plate 25.

  The first optical system 41 includes a half-wave plate 51, a polarization beam splitter 52, a beam diffuser 53, a first reflection mirror 54, a first relay lens 55, a second relay lens 56, and a second reflection lens. It has a mirror 57, a third reflection mirror 58, a fourth reflection mirror 59, and a first beam splitter 60.

  The drawing beam LB emitted from the light source device CNT in the + X direction is applied to the ½ wavelength plate 51. The half-wave plate 51 is rotatable within the irradiation surface of the drawing beam LB. The polarization direction of the drawing beam LB irradiated on the half-wave plate 51 is a predetermined polarization direction according to the rotation amount of the half-wave plate 51. The drawing beam LB that has passed through the half-wave plate 51 is applied to the polarization beam splitter 52. The polarization beam splitter 52 transmits the drawing beam LB having a predetermined polarization direction, while reflecting the drawing beam LB other than the predetermined polarization direction in the + Y direction. Therefore, since the drawing beam LB reflected by the polarization beam splitter 52 has passed through the ½ wavelength plate 51, the drawing beam LB of the drawing beam LB is cooperated with the ½ wavelength plate 51 and the polarization beam splitter 52. The beam intensity is adjusted. That is, the beam intensity of the drawing beam LB reflected by the polarization beam splitter 52 can be adjusted by rotating the half-wave plate 51 and changing the polarization direction of the drawing beam LB.

  The drawing beam LB that has passed through the polarization beam splitter 52 is absorbed by the beam diffuser 53, and the drawing beam LB with which the beam diffuser 53 is irradiated is suppressed from leaking to the outside. The drawing beam LB reflected in the + Y direction by the polarization beam splitter 52 is applied to the first reflecting mirror 54. The drawing beam LB emitted to the first reflection mirror 54 is reflected in the + X direction by the first reflection mirror 54, and is emitted to the second reflection mirror 57 via the first relay lens 55 and the second relay lens 56. . The drawing beam LB applied to the second reflection mirror 57 is reflected in the −Y direction by the second reflection mirror 57 and applied to the third reflection mirror 58. The drawing beam LB applied to the third reflection mirror 58 is reflected in the −Z direction by the third reflection mirror 58 and is applied to the fourth reflection mirror 59. The drawing beam LB applied to the fourth reflection mirror 59 is reflected in the + Y direction by the fourth reflection mirror 59 and applied to the first beam splitter 60. The drawing beam LB emitted to the first beam splitter 60 is partially reflected in the −X direction and is emitted to the second optical system 42, while the other portion is transmitted to the third optical system. Is irradiated.

  The third reflection mirror 58 and the fourth reflection mirror 59 are provided on the rotation axis I of the rotation mechanism 24 with a predetermined gap. The configuration up to the light source device CNT including the third reflection mirror 58 (the portion surrounded by the chain double-dashed line on the upper side in the Z direction in FIG. 4) is installed on the body frame 21 side. The configuration of the plurality of drawing modules UW1 to UW5 including the fourth reflection mirror 59 (the portion surrounded by the chain double-dashed line on the lower side in the Z direction of FIG. 4) is installed on the second optical surface plate 25 side. With such a structure, since the third reflection mirror 58 and the fourth reflection mirror 59 are provided on the rotation axis I, the rotation mechanism 24 moves the second optical surface plate 25 relative to the first optical surface plate 23. Even if rotated, the optical path of the drawing beam LB is not changed. Therefore, in the drawing apparatus 11, even if the second optical surface plate 25 is rotated with respect to the first optical surface plate 23 by the rotation mechanism 24, the drawing beam LB emitted from the light source device CNT installed on the main body frame 21 side. Can be suitably guided to each of the plurality of drawing modules UW1 to UW5 installed on the second optical surface plate 25 side.

  The second optical system 42 branches and guides one of the drawing beams LB branched by the first optical system 41 toward odd-numbered drawing modules UW1, UW3, and UW5 described later. The second optical system 42 has a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.

  The drawing beam LB reflected by the first beam splitter 60 of the first optical system 41 in the −X direction is applied to the fifth reflection mirror 61. The drawing beam LB applied to the fifth reflection mirror 61 is reflected in the −Y direction by the fifth reflection mirror 61 and applied to the second beam splitter 62. A part of the drawing beam LB irradiated on the second beam splitter 62 is reflected and is irradiated on one odd-numbered drawing module UW5 (see FIGS. 5 and 6). The other part of the drawing beam LB irradiated on the second beam splitter 62 is transmitted and is irradiated on the third beam splitter 63. A part of the drawing beam LB irradiated on the third beam splitter 63 is reflected and is irradiated on one odd-numbered drawing module UW3 (see FIGS. 5 and 6). The drawing beam LB applied to the third beam splitter 63 is transmitted through the other part and is applied to the sixth reflection mirror 64. The drawing beam LB applied to the sixth reflection mirror 64 is reflected by the sixth reflection mirror 64 and applied to one drawing module UW1 of odd number (see FIG. 5). In the second optical system 42, the drawing beam LB emitted to the odd-numbered drawing modules UW1, UW3, and UW5 is slightly inclined with respect to the −Z direction.

  The third optical system 43 branches and guides the other drawing beam LB branched by the first optical system 41 toward even-numbered drawing modules UW2 and UW4 described later. The third optical system 43 has a seventh reflection mirror 71, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.

  The drawing beam LB that has passed through the first beam splitter 60 of the first optical system 41 in the Y direction is applied to the seventh reflection mirror 71. The drawing beam LB emitted to the seventh reflection mirror 71 is reflected in the X direction by the seventh reflection mirror 71 and is emitted to the eighth reflection mirror 72. The drawing beam LB applied to the eighth reflection mirror 72 is reflected in the −Y direction by the eighth reflection mirror 72 and applied to the fourth beam splitter 73. A part of the drawing beam LB irradiated on the fourth beam splitter 73 is reflected and is irradiated on one even-numbered drawing module UW4 (see FIGS. 5 and 6). The drawing beam LB emitted to the fourth beam splitter 73 is transmitted through a part of the other portion and is emitted to the ninth reflection mirror 74. The drawing beam LB applied to the ninth reflection mirror 74 is reflected by the ninth reflection mirror 74 and applied to one even-numbered drawing module UW2. Also in the third optical system 43, the drawing beam LB irradiated on the even-numbered drawing modules UW2 and UW4 is slightly inclined with respect to the −Z direction.

  In this way, in the branching optical system SL, the drawing beam LB from the light source device CNT is branched into a plurality of beams toward the plurality of drawing modules UW1 to UW5. At this time, in the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73, the beam intensities of the drawing beams LB with which the plurality of drawing modules UW1 to UW5 are irradiated have the same intensity. As described above, the reflectance (transmittance) is set to an appropriate reflectance according to the number of branches of the writing beam LB.

  The XY overall harping adjustment mechanism 44 is arranged between the second relay lens 56 and the second reflection mirror 57, as shown in FIG. The XY overall harving adjustment mechanism 44 minutely two-dimensionally shifts the beam LB entering the first beam splitter 60 in a plane perpendicular to the beam axis, and particularly adjusts the position of the beam passing through the second optical system 42. The XY overall harving adjustment mechanism 44 has a transparent parallel flat plate glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass plate that can be tilted in the YZ plane of FIG. The beam LB incident on the first beam splitter 60 can be finely shifted in the X direction and the ZY direction in FIG. 6 by adjusting the respective inclination amounts of the two parallel plate glasses.

  The XY one-sided harping adjustment mechanism 45 is arranged between the seventh reflection mirror 71 and the eighth reflection mirror 72. The XY one-sided harping adjustment mechanism 45 minutely two-dimensionally shifts the beam LB transmitted through the first beam splitter 60 in a plane perpendicular to the beam axis, and particularly adjusts the position of the beam passing through the third optical system 43. . The XY one-sided harbing adjustment mechanism 45, like the XY whole harbing adjustment mechanism 44, is a transparent parallel flat plate glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass that can be tilted in the YZ plane of FIG. Have and. The position of the drawing beam LB incident on the even-numbered drawing modules UW2 and UW4 can be minutely shifted by adjusting the respective tilt amounts of the two parallel flat glass plates. Note that, as is clear from the configuration of FIG. 6, the position shift of the beam LB by the XY overall harping adjustment mechanism 44 also shifts the position of the beam that passes through the first beam splitter 60 and is incident on the third optical system 43. The position adjustments of the beams incident on the even-numbered drawing modules UW2 and UW4 are performed by both the XY overall arbor adjusting mechanism 44 and the XY one-side arbor adjusting mechanism 45.

  The plurality of drawing modules UW1 to UW5 will be described with reference to FIGS. 4, 5, and 7. The plurality of drawing modules UW1 to UW5 are provided according to the plurality of drawing lines LL1 to LL5. The plurality of drawing beams LB branched by the branch optical system SL are respectively incident on the plurality of drawing modules UW1 to UW5. Each of the drawing modules UW1 to UW5 collects a plurality of drawing beams LB into spot light on each of the drawing lines LL1 to LL5 and scans the spot light. That is, the first drawing module UW1 guides the drawing beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 direct the drawing beam LB to the second to fifth drawing lines LL2 to LL5. Lead to.

  As shown in FIGS. 4 and 1, the plurality of drawing modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. The plurality of drawing modules UW1 to UW5 have the first drawing on the side (the −X direction side in FIG. 5) on which the first, third, and fifth drawing lines LL1, LL3, and LL5 are arranged with the center plane p3 interposed therebetween. A module UW1, a third drawing module UW3 and a fifth drawing module UW5 are arranged. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at predetermined intervals in the Y direction.

  The plurality of drawing modules UW1 to UW5 have the second drawing module UW2 and the fourth drawing on the side (the + X direction side in FIG. 5) on which the second and fourth drawing lines LL2 and LL4 are arranged with the center plane p3 interposed therebetween. The module UW4 is arranged. The second drawing module UW2 and the fourth drawing module UW4 are arranged at predetermined intervals in the Y direction. At this time, the second drawing module UW2 is located between the first drawing module UW1 and the third drawing module UW3 in the Y direction. Similarly, the third drawing module UW3 is located between the second drawing module UW2 and the fourth drawing module UW4 in the Y direction. The fourth drawing module UW4 is located between the third drawing module UW3 and the fifth drawing module UW5 in the Y direction. Further, as shown in FIG. 4, the first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5, and the second drawing module UW2 and the fourth drawing module UW4 have a center plane p3 when viewed from the Y direction. Are arranged symmetrically with respect to.

  Next, the drawing modules UW1 to UW5 will be described with reference to FIG. Since the drawing modules UW1 to UW5 have the same configuration, the first drawing module UW1 (hereinafter simply referred to as the drawing module UW1) will be described as an example. Since the drawing module UW1 shown in FIG. 4 scans the drawing beam LB along the drawing line LL1 (first drawing line LL1), the modulator 81, the polarization beam splitter PBS, the quarter wavelength plate 82, and the scanning A device 83, a bending mirror 84, a telecentric f-θ lens system 85, and a Y magnification correction optical member 86. Further, a calibration detection system 31 is provided adjacent to the polarization beam splitter PBS.

  The modulator 81 is composed of, for example, an acousto-optic modulator (AOM: Acousto Optic Modulator), and switches the generation / non-generation of the diffracted light of the incident beam at high speed to project the drawing beam LB onto the substrate P. / Switch non-projection at high speed. As a result, the intensity of the spot light with which the substrate P is irradiated is modulated based on the pattern drawing information (serial bit string signal) applied to the modulator (AOM) 81. Specifically, the drawing beam LB from the branch optical system SL is applied to the modulator 81 via the relay lens 91 with a slight inclination with respect to the −Z direction. When the modulator 81 is in the OFF state, the drawing beam LB moves straight in an inclined state, and is shielded by the light shielding plate 92 provided at the end after passing through the modulator 81. When the modulator 81 is in the ON state, the diffracted drawing beam LB is deflected in the −Z direction, passes through the modulator 81, and is incident on the polarization beam splitter PBS provided on the Z direction of the modulator 81. Therefore, while the modulator 81 is ON, the spot light of the drawing beam LB continues to be projected onto the substrate P, and while the modulator 81 is OFF, the projection of the spot light of the drawing beam LB onto the substrate P is interrupted. It

  The polarization beam splitter PBS reflects the drawing beam LB emitted from the modulator 81 via the relay lens 93. The polarization beam splitter PBS cooperates with the quarter-wave plate 82 provided between the polarization beam splitter PBS and the scanner 83 to transmit the drawing beam LB reflected by the surface of the substrate P or the rotating drum DR. ing. That is, the drawing beam LB traveling from the modulation to the polarization beam splitter PBS is a laser beam that is linearly polarized S polarization and is reflected by the polarization beam splitter PBS. The drawing beam LB reflected by the polarization beam splitter PBS passes through the quarter-wave plate 82 to become circularly polarized light and reaches the substrate P. Part of the reflected light of the drawing beam LB that is reflected by the surface of the substrate P or the rotating drum DR and returns via the f-θ lens system 85 and the scanner 83 passes through the quarter-wave plate 82 again. Thus, the P-polarized light becomes linearly polarized light. Therefore, the reflected light of the drawing beam LB emitted from the substrate P to the polarization beam splitter PBS passes through the polarization beam splitter PBS. The reflected light of the drawing beam LB that has passed through the polarization beam splitter PBS is applied to the calibration detection system 31 via the relay lens 94. The drawing beam LB reflected by the polarization beam splitter PBS via the relay lens system 93 passes through the quarter-wave plate 82 and then enters the scanner 83.

  As shown in FIGS. 4 and 7, the scanner 83 has a reflection mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing beam LB that has passed through the quarter-wave plate 82 is applied to the reflection mirror 96 via the relay lens 95. The drawing beam LB reflected by the reflection mirror 96 is applied to the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of polygonal surfaces (reflection planes) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 is rotated about a rotation axis 97a in a predetermined rotation direction to continuously change the reflection angle of the drawing beam LB irradiated on the polygon surface 97b, whereby the reflected drawing beam LB is reflected. Are scanned along the drawing line LL1 on the substrate P. The drawing beam LB reflected by the rotating polygon mirror 97 is applied to the folding mirror 84. The origin detector 98 detects the origin (predetermined scanning start point) of the drawing beam LB that scans along the drawing line LL1 of the substrate P. The origin detector 98 is arranged on the opposite side of the reflection mirror 96 with the drawing beam LB reflected by each polygon surface 97b interposed therebetween. Therefore, the origin detector 98 detects the drawing beam LB before being irradiated on the f-θ lens system 85. That is, the origin detector 98 detects the angular position of the polygon surface 97b immediately before the spot light is irradiated to the drawing start position of the drawing line LL1 on the substrate P.

  The drawing beam LB emitted from the scanner 83 to the folding mirror 84 is reflected by the folding mirror 84 and is emitted to the f-θ lens system 85. The f-θ lens system 85 includes a telecentric f-θ lens, and projects the drawing beam LB reflected from the rotating polygon mirror 97 via the bending mirror 84 perpendicularly to the drawing surface of the substrate P.

  As shown in FIG. 7, the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 have the same structure. Among the plurality of scanners 83, the three scanners 83 corresponding to the drawing modules UW1, UW3, and UW5 are arranged on the upstream side (the -X direction side in FIG. 7) in the rotation direction of the rotary drum DR, and the drawing modules UW2, Two scanners 83 corresponding to UW4 are arranged on the downstream side (the + X direction side in FIG. 7) in the rotation direction of the rotating drum DR. The three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 interposed therebetween. Therefore, when the rotary polygon mirror 97 is irradiated with the drawing beam LB while the three rotary polygon mirrors 97 on the upstream side rotate counterclockwise, the drawing beam LB reflected by the rotary polygon mirror 97 is moved to the drawing start position. From this to the drawing end position, spot light is formed and is scanned in a predetermined scanning direction (for example, + Y direction in FIG. 7). On the other hand, when the rotary polygon mirror 97 is irradiated with the drawing beam LB while the two rotary polygon mirrors 97 on the downstream side rotate counterclockwise, the drawing beam LB reflected by the rotary polygon mirror 97 is moved to the drawing start position. From the direction toward the drawing end position, spot light is scanned in the scanning direction (for example, the −Y direction in FIG. 7) opposite to that of the three rotating polygon mirrors 97 on the upstream side.

  When viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB that reaches the substrate P from the odd-numbered drawing modules UW1, UW3, and UW5 is in the direction corresponding to the installation azimuth line Le1. That is, the installation azimuth line Le1 is a line that connects the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center axis AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the even-numbered drawing modules UW2 and UW4 is in a direction that coincides with the installation azimuth line Le2. That is, the installation azimuth line Le2 is a line connecting the even-numbered drawing lines LL2, LL4 and the rotation center axis AX2 in the XZ plane.

  The Y-magnification correcting optical member 86 is a combination of a cylindrical lens having a positive refractive power in the Y direction and a cylindrical lens having a negative refractive power in the Y direction, and includes an f-θ lens system 85 and a substrate P. It is located between. Formed by each drawing module UW1 to UW5 by finely moving at least one of the plurality of cylindrical lenses constituting the Y-magnification correction optical member 86 in the optical axis direction of the f-θ lens system 85 (axis of the drawing beam LB). The length of each of the drawn lines LL1 to LL5 can be expanded or reduced isotropically in the Y direction by a very small amount.

  The drawing device 11 having such a structure draws a predetermined pattern on the substrate P by controlling each part by the control device 16. That is, the control device 16 performs modulation based on CAD (Computer Aided Design) information, which is information of a pattern to be drawn on the substrate P during a period in which the drawing beam LB projected on the substrate P is scanning in the scanning direction. The drawing beam LB is deflected by On / Off modulation of the device 81 to draw a pattern on the photosensitive layer of the substrate P. Further, the control device 16 synchronizes the scanning direction of the spot light of the drawing beam LB that scans along the drawing line LL1 with the movement of the substrate P in the transport direction due to the rotation of the rotating drum DR, so that the substrate P is covered. A predetermined pattern is drawn in the portion corresponding to the drawing line LL1 in the processing area A7.

  When the substrate P passes through the drawing lines LL1, LL3, LL5 formed by the drawing modules UW1, UW3, UW5 and the drawing lines LL2, LL4 formed by the drawing modules UW2, UW4, a predetermined pattern is drawn. As shown in FIG. 3, a region surrounded by a straight line SL1 connecting the odd-numbered drawing lines LL1, LL3, LL5, a straight line SL2 connecting the even-numbered drawing lines LL2, LL4, a straight line SL3, and a straight line SL4 is processed. The area (or exposure area) TR is used. When the substrate P passes through the processing region TR, a predetermined pattern is drawn on the surface of the substrate P by the exposure processing of the drawing device 11. The straight line SL3 passes through the end portion LL1T on the one end portion DRT1 side of the rotary drum DR among the end portions of the drawing line LL1, is orthogonal to the rotation center axis AX2 of the rotary drum DR, and is on the outer peripheral surface of the rotary drum DR. It is a line along. The straight line SL4 passes through the end portion LL5T on the one end portion DRT1 side of the rotary drum DR among the end portions of the drawing line LL5, is orthogonal to the rotation center axis AX2 of the rotary drum DR, and is on the outer peripheral surface of the rotary drum DR. It is a line along. The distance between the end LL1T of the drawing line LL1 and the end LL5T of the drawing line LL5 is the maximum width of the device pattern that the drawing apparatus 11 can draw on the substrate P.

  Next, with reference to FIGS. 3, 8-1 and 8-2, the alignment microscopes AM1 and AM2 as pattern detection units will be described. The alignment microscopes AM1 and AM2 use a predetermined detection area to form an alignment mark as a reference pattern previously formed on the surface of the substrate P along the lengthwise direction thereof or a reference pattern or reference mark formed on the rotating drum DR. To detect within. Hereinafter, the alignment mark of the substrate P and the reference mark and reference pattern of the rotary drum DR may be simply referred to as a mark. In the present embodiment, the exposure apparatus EX includes the alignment microscopes AM1 and AM2 arranged in two rows along the circumferential direction of the rotary drum DR, but may include at least one row of alignment microscopes. The alignment microscopes AM1 and AM2 perform alignment (alignment) between the substrate P and a predetermined pattern drawn on the substrate P, and detect displacement in the direction of rotation of the rotary drum DR or the direction of the rotation center axis AX2. It is also provided for calibrating the rotary drum DR and the drawing device 11.

  The alignment microscopes AM1 and AM2 are provided upstream of the drawing lines LL1 to LL5 (processing region TR) formed by the drawing device 11 in the rotation direction of the rotary drum DR, that is, in the transport direction of the substrate P. There is. The alignment microscope AM1 is provided upstream of the alignment microscope AM2 in the rotation direction of the rotary drum DR, that is, in the transport direction of the substrate P. When the alignment microscope is provided in two rows along the circumferential direction of the rotary drum DR, the upstream alignment microscope AM1 serves as the first pattern detection unit, and the downstream alignment microscope AM2 serves as the second pattern detection unit. The alignment microscope AM1 and the alignment microscope AM2 are arranged apart from each other by a predetermined angle β in the rotation direction of the rotary drum DR as shown in FIG. 8-1.

  As shown in FIGS. 8-1 and 8-2, the alignment microscopes AM1 and AM2 include an objective lens system GA as an objective optical system, an image pickup system GD as an image sensor, and an illumination system GC. The objective lens system GA functions as a detection probe that projects the illumination light from the illumination system GC onto the substrate P or the rotary drum DR, and that receives the reflected light from the mark. The objective lens system GA enlarges the detection areas Vw1 to Vw3 at a predetermined magnification. The imaging system GD photoelectrically detects an enlarged image of the detection area. Specifically, the imaging system GD captures an enlarged image (bright-field image, dark-field image, fluorescent image, etc.) of the mark received through the objective lens system GA with a photoelectric conversion element such as a two-dimensional CCD or CMOS. . The illumination system GC irradiates the outer peripheral surface of the rotary drum DR or the substrate P with illumination light for detecting the reference pattern of the rotary drum DR or the alignment mark of the substrate P. The illumination light is light in a wavelength range having almost no sensitivity to the photosensitive layer on the substrate P, for example, light having a wavelength bandwidth of several nm to several tens nm within a wavelength range of 500 nm to 800 nm. .

  A beam splitter unit GBU shown in FIGS. 8-1 and 8-2 is provided between the illumination system GC and the objective lens system GA. The beam splitter unit GBU stores the polarization beam splitter GB (and a quarter wavelength plate) shown in FIG. 8-2. Most of the illumination light (linearly polarized light) emitted from the illumination system GC to the polarization beam splitter GB passes through the quarter wave plate and the objective lens system GA, and the outer peripheral surface of the rotary drum DR or the substrate P. It is projected as circularly polarized light on. The reflected light (circularly polarized light) of the illumination light reflected by the outer peripheral surface of the rotating drum DR or the substrate P passes through the objective lens system GA, and is then mostly reflected by the beam splitter unit GBU toward the image pickup system GD for image pickup. The light enters the photoelectric conversion element included in the system GD. The photoelectric conversion element images the reflected light of the illumination light. When the wavelength band width of the illumination light from the illumination system GC is widened to several tens of nm or more, the polarization beam splitter GB may be replaced with an amplitude division type beam splitter (half mirror).

  The alignment microscope AM1 (as well as the alignment microscope AM2) has an image processing circuit OC, as shown in FIG. 8-2. The image processing circuit OC stores image information (waveform data of an image pickup signal) output from the image pickup system GD when the reference pattern of the rotary drum DR or the alignment mark of the substrate P appears in each of the detection areas Vw1 to Vw3. Based on position information (or angle information) from an encoder head EN3 (which will be described later) that determines the rotation angle position of the rotating drum DR, the position information of the reference pattern of the rotating drum DR or the alignment mark of the substrate P is set to each detection region Vw1. ~ Individually calculated for each Vw3. The output of the image processing circuit OC is acquired by the control device 16 shown in FIG. The image processing circuit OC may be provided in the control device 16, or the control device 16 may realize the function of the image processing circuit OC.

  A plurality of alignment microscopes AM1 (three in the present embodiment) are arranged in a row in the Y direction (width direction of the substrate P) at predetermined intervals. Similarly, a plurality of alignment microscopes AM2 (three in the present embodiment) are arranged in a row in the Y direction (width direction of the substrate P) at predetermined intervals. Therefore, in this embodiment, a total of six alignment microscopes AM1 and AM2 are provided, but the number is not limited to six.

  In FIG. 3, for the sake of convenience, the arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens systems GA of the six alignment microscopes AM1 and AM2 is shown. The detection regions Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 are, as shown in FIG. 3, in the Y direction parallel to the rotation center axis AX2. Are arranged at predetermined intervals. As shown in FIG. 8, the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the detection regions Vw1 to Vw3 are all parallel to the XZ plane. Similarly, the detection regions Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the respective objective lens systems GA of the three alignment microscopes AM2 are parallel to the rotation center axis AX2, as shown in FIG. They are arranged at predetermined intervals in the Y direction. As shown in FIG. 8, the optical axes La4 to La6 of each objective lens system GA passing through the centers of the detection regions Vw4 to Vw6 are all parallel to the XZ plane. The detection areas Vw1 to Vw3 and the detection areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotary drum DR, that is, the transport direction of the substrate P.

  The detection areas Vw1 to Vw6 for detecting the alignment marks by the alignment microscopes AM1 and AM2 are set on the surface of the substrate P or the rotating drum DR, for example, in a square range of about 200 μm square, that is, one side of about 200 μm. As shown in FIG. 8, the optical axes La1 to La3 of the objective lens system GA of the three alignment microscopes AM1 are set in the same direction as the installation azimuth line Le3 extending from the rotation center axis AX2 in the radial direction of the rotary drum DR. . Similarly, the optical axes La4 to La6 of the objective lens system GA of the three alignment microscopes AM2 are set in the same direction as the installation azimuth line Le4 extending from the rotation center axis AX2 in the radial direction of the rotary drum DR. At this time, since the alignment microscope AM1 is arranged upstream of the alignment microscope AM2 in the rotation direction of the rotary drum DR, the angle formed by the center plane p3 and the installation azimuth line Le3 is equal to the center plane p3 and the installation azimuth. It is larger than the angle formed by the line Le4.

  On the surface of the substrate P, as shown in FIG. 3, processing target areas A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at predetermined intervals in the X direction. A plurality of alignment marks Ks1 to Ks3 previously formed on the surface of the substrate P, that is, on the surface of the substrate P are provided along the lengthwise direction of the substrate P around the processing target area A7 on the substrate P for alignment. To be The alignment marks Ks1 to Ks3 are formed in a cross shape, for example. The alignment microscopes AM1 and AM2 detect the alignment marks Ks1 to Ks2 on the substrate P, and the drawing module aligns the position on the substrate P on which the pattern should be drawn based on the detection result, but the alignment is limited to this. Not done. For example, the alignment microscopes AM1 and AM2 may be used to detect a part of the shape of the circuit pattern or the like formed on the substrate P to perform the alignment.

  In FIG. 3, the alignment marks Ks1 are provided in the −Y side peripheral region of the processed region A7 at regular intervals in the X direction, and the alignment marks Ks3 are provided in the + Y side peripheral region of the processed region A7. It is provided at regular intervals in the direction. Further, the alignment mark Ks2 is provided at the center in the Y direction in the blank area existing between the two processed areas A7 adjacent in the X direction. The alignment mark Ks1 is sequentially captured in the detection area Vw1 of the objective lens system GA1 of the alignment microscope AM1 and the detection area Vw4 of the objective lens system GA4 of the alignment microscope AM2 while the substrate P is being transported. Is formed. The alignment mark Ks3 is sequentially captured in the detection area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and the detection area Vw6 of the objective lens system GA6 of the alignment microscope AM2 while the substrate P is being transported. Is formed. Further, the alignment mark Ks2 is sequentially captured in the detection area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the detection area Vw5 of the objective lens system GA5 of the alignment microscope AM2 while the substrate P is being transported. Formed as described above.

  Therefore, among the alignment microscopes AM1 and AM2 in which three units are arranged in the Y direction, that is, the width direction of the substrate P, the alignment microscopes AM1 and AM2 arranged on both sides of the rotary drum DR in the Y direction have the width of the substrate P. The alignment marks Ks1 and Ks3 formed on both sides in the direction can always be observed or detected. The width direction of the substrate P is a direction orthogonal to the lengthwise direction of the substrate P. Further, among the alignment microscopes AM1 and AM2 in which three units are arranged in the Y direction, the alignment microscopes AM1 and AM2 arranged in the center of the rotary drum DR in the Y direction have the processed regions A7 drawn on the substrate P. It is possible to constantly observe or detect the alignment mark Ks2 formed in the blank portion or the like in the lengthwise direction between them.

  Since the exposure apparatus EX includes the so-called multi-beam type drawing apparatus 11, a plurality of drawing patterns LL1 to LL5 of the plurality of drawing modules UW1 to UW5 form a plurality of patterns drawn on the substrate P in the Y direction. In order to appropriately splice, it is necessary to perform calibration to keep the splicing accuracy of the plurality of drawing modules UW1 to UW5 within an allowable range. Further, the relative positional relationship of the detection regions Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 needs to be precisely obtained by baseline management. Calibration is also necessary for the baseline management.

  In the calibration for confirming the splicing accuracy by the plurality of drawing modules UW1 to UW5 and the calibration for the baseline management of the alignment microscopes AM1 and AM2, at least a part of the outer peripheral surface of the rotary drum DR supporting the substrate P is used. It is necessary to provide a reference mark or a reference pattern. Therefore, as shown in FIG. 9A, the exposure apparatus EX uses a rotary drum DR having a reference mark or a reference pattern on the outer peripheral surface.

  The rotary drum DR has scale parts GPa and GPb, which are parts of a rotational position detection mechanism 14 described later, formed on both ends of the outer peripheral surface thereof. The scale parts GPa and GPb rotate around the rotation center axis AX2 together with the rotary drum DR, and scales corresponding to the angular position of the rotary drum DR in the rotation direction are engraved in an annular shape. In the rotary drum DR, narrower restriction bands CLa, CLb are formed on the inner sides of the scale parts GPa, GPb by concave grooves or convex rims over the entire circumference. The width of the substrate P in the Y direction is set to be smaller than the distance between the two regulation bands CLa and CLb in the Y direction, and the substrate P is sandwiched between the regulation bands CLa and CLb on the outer peripheral surface of the rotary drum DR. It is closely supported by the inner area.

  As shown in FIG. 9-2, the rotary drum DR has a plurality of line patterns RL1 inclined at +45 degrees with respect to the rotation center axis AX2 and a rotation center axis AX2 on the outer peripheral surface sandwiched between the regulation bands CLa and CLb. A plurality of line patterns RL2 inclined at −45 degrees with respect to the mesh-shaped reference pattern (drum side reference pattern) RMP on the rotating drum DR side, which are repeatedly engraved at constant pitches (cycles) Pf1 and Pf2, It is provided. As an example, the line widths of the line patterns RL1 and RL2 are set to about several μm to 20 μm, and the pitches (cycles) Pf1 and Pf2 are set to about several tens μm to several hundreds μm.

  As shown in FIG. 9-2, in the rotary drum DR, a part of a portion where the line pattern RL1 and the line pattern RL2 intersect is removed. In this portion, a plurality of cross-shaped drum-side reference marks RLX are provided as drum-side reference patterns. The cross-shaped reference mark RLX on the drum side includes a first line pattern RLXy parallel to the rotation center axis AX2 and a second line pattern RLXx intersecting (orthogonal in the present embodiment) the first line pattern RLXy. An interval between two drum-side reference marks RLX adjacent to each other in the Y direction parallel to the rotation center axis AX2, that is, an interval between the first line patterns RLXx is ΔYm.

  The drum-side reference pattern RMP has a uniform diagonal pattern (where the frictional force, the tension of the substrate P, and the like do not change at a portion where the substrate P and the outer peripheral surface of the rotating drum DR come into contact with each other). Slanted grid pattern). The line patterns RL1 and RL2 do not necessarily need to be inclined at 45 degrees, and may be a vertical and horizontal mesh pattern in which the line pattern RL1 is parallel to the Y axis and the line pattern RL2 is parallel to the X axis. Furthermore, it is not necessary to intersect the line patterns RL1 and RL2 at 90 degrees, and the rectangular area surrounded by the two adjacent line patterns RL1 and the two adjacent line patterns RL2 is not a square (or a rectangle). The line patterns RL1 and RL2 may intersect at an angle that forms a rhombus.

  Next, a modified example of the drum side reference mark as the reference pattern on the rotating drum DR side will be described. The rotary drum DRa shown in FIG. 9C has a drum-side reference pattern RMP and a drum-side reference mark RLXa on a part of the outer peripheral surface. The drum-side reference mark RLXa includes a first straight line pattern Ly that extends in a direction parallel to the rotation center axis AX2 on the surface of the rotary drum DR, and a second straight line that intersects with the first straight line pattern Ly (orthogonal in the present embodiment). It is the intersection with the pattern Lx. The drum-side reference mark RLXa is provided between two drum-side reference patterns RMP, RMP that are adjacent to each other in the circumferential direction of the rotary drum RD. The rotary drum DRa has a portion NRMP in which the drum side reference pattern RMP and the drum side reference mark RLXa are not provided.

  The rotating drum DRa is provided with a reference mark TP as a reference pattern on the rotating drum DR side different from the drum side reference mark RLXa between the scale part GPa and the regulation band CLa and between the scale part GPb and the regulation band CLb. ing. The control device 16 shown in FIG. 1 can also perform calibration by using the drum-side reference pattern RMP, the drum-side reference mark RLXa, and the reference mark TP.

  As in the rotating drum DRb shown in FIG. 9-4, instead of forming the scale portion GPa on a part of the outer peripheral surface of the rotating drum DRb, a disk (scale disc) having lattice-shaped scale portions GPab formed on the outer peripheral surface. The DEN may be integrally attached to the rotary shaft on the end side of the rotary drum DRb in the direction of the axis AX2. In the example shown in FIG. 9-4, the disk DEN is attached to one side of the rotary shaft of the rotary drum DRb, but a similar disk DEN may be provided at the opposite end of the rotary drum DRb. good. The diameter of the disc DEN and the diameter of the rotary drum DRb are preferably aligned as much as possible, but the relative range of the dimensional difference between the diameters may be aligned within ± 10%, and more preferably within ± 4%. . The absolute value of the relative range is when the diameter of the rotary drum DR is about 20 to 40 cm, and when the diameter of the rotary drum DR is 40 cm or more, the absolute value of the relative range becomes small.

  Next, the rotational position detection mechanism 14 will be described with reference to FIGS. 3, 4, and 8. As shown in FIG. 8, the rotational position detection mechanism 14 optically detects the rotational position of the rotary drum DR, and an encoder system using, for example, a rotary encoder is applied. In the present embodiment, the rotational position detection mechanism 14 uses an incremental encoder system, but may also be an absolute encoder system. The rotational position detection mechanism 14 includes scale portions GPa and GPb (or GPab in FIG. 9-4) provided at both ends of the rotary drum DR, and a plurality of encoder heads facing the scale portions GPa and GPb (or GPab). It has EN1, EN2, EN3, and EN4. 4 and 8, only four encoder heads EN1, EN2, EN3, EN4 facing the scale part GPa are shown, but similar encoder heads EN1, EN2, EN3, EN4 also face the scale part GPb. Are placed.

  The scale parts GPa and GPb are each formed in an annular shape over the entire outer peripheral surface of the rotary drum DR in the circumferential direction. The scale parts GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and are used as an incremental type scale. In the case of the present embodiment, the grid lines (scales) of the scale parts GPa and GPb, and the drum side reference pattern RMP, the drum side reference mark RLX, the drum side reference mark RLXa, and the reference shown in FIGS. 9-1 to 9-3. Since the mark TP is formed simultaneously by a device (pattern engraving machine or the like) that processes the surface of the rotary drum DR (or DRa, DRb), it has a unique positional relationship on the order of microns. An origin mark is provided at one location in the circumferential direction of the scale parts GPa, GPb (or GPab), and each of the encoder heads EN1, EN2, EN3, EN4 detects the origin mark and detects the origin signal. It has a function to output. Therefore, even with respect to the origin mark, the reference pattern RMP and the drum-side reference marks RLX, RLXa, and TP have a unique positional relationship (known angular positional relationship) in the circumferential direction.

  The substrate P is wound inside the scale drums GPa and GPb at both ends of the rotary drum DR, that is, inside the regulation bands CLa and CLb. When a strict arrangement relationship is required, the outer peripheral surfaces of the scale parts GPa and GPb and the outer peripheral surface of the portion of the substrate P wound around the rotary drum DR are flush with each other (the same radius from the rotation center axis AX2). Set. For that purpose, the outer peripheral surfaces of the scale parts GPa and GPb may be made higher than the outer peripheral surface of the rotating drum DR for winding the substrate by the thickness of the substrate P in the radial direction. Therefore, the outer peripheral surfaces of the scale parts GPa and GPb formed on the rotary drum DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. As a result, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa, GPb at the same radial position as the drawing surface on the substrate P wound around the rotating drum DR, and the measurement position and the processing position can be detected. It is possible to reduce the Abbe error caused by the difference in the radial direction of the rotating system.

  The encoder heads EN1, EN2, EN3, EN4 as scale measuring units are arranged around the scale parts GPa, GPb as viewed from the rotation center axis AX2, respectively, and are arranged at different positions in the circumferential direction of the rotary drum DR. There is. In this way, the encoder heads EN1, EN2, EN3, EN4 are arranged so as to read the scale of the scale part GPa in a predetermined measurement region on the scale parts GPa, GPb. The encoder heads EN1, EN2, EN3, EN4 are connected to the control device 16. The encoder heads EN1, EN2, EN3, EN4 project a light beam for measurement toward the scale parts GPa, GPb, and photoelectrically detect the reflected light flux (diffracted light) to detect the circumferential direction of the scale parts GPa, GPb. A detection signal (for example, a two-phase signal having a phase difference of 90 degrees) corresponding to the position change of 1 is output to the control device 16 as measurement information regarding the position of the rotating drum DR in the rotation direction. The control device 16 interpolates the detected signal by a counter circuit (not shown) and digitally processes the detected signal, thereby changing the angle of the rotary drum DR, that is, the position change of the outer peripheral surface in the circumferential direction with a submicron resolution. It can be measured. The control device 16 can also measure the transport speed of the substrate P from the change in the angle of the rotating drum DR. In the present embodiment, the control device 16 as the calculation unit determines that the reference pattern or the reference mark provided at the specific position on the outer peripheral surface of the rotary drum DR is the detection area of the alignment microscopes AM1 and AM2 as the rotary drum DR rotates. Of each of the alignment microscopes AM1 and AM2 and the rotary drum DR based on the position information of at least two of the reference patterns or reference marks detected by the alignment microscopes AM1 and AM2 when they come to each of at least two different locations. The error of the physical positional relationship.

  As shown in FIGS. 4 and 8, the encoder head EN1 is arranged on the installation azimuth line Le1. The installation azimuth line Le1 is a line that connects the projection area (reading position) of the measurement light beam on the scale portion GPa (GPb, GPab) by the encoder head EN1 and the rotation center axis AX2 in the XZ plane. There is. Further, as described above, the installation azimuth line Le1 is a line connecting the drawing lines LL1, LL3, LL5 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN1 and the rotation center axis AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center axis AX2 have the same azimuth line (viewed from the rotation center axis AX2. Same direction).

  Similarly, as shown in FIGS. 4 and 8, the encoder head EN2 is arranged on the installation azimuth line Le2. The installation azimuth line Le2 is a line connecting the projection area (reading position) of the measurement light beam on the scale portion GPa (GPb) by the encoder head EN2 and the rotation center axis AX2 in the XZ plane. Further, as described above, the installation azimuth line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN2 and the rotation center axis AX2 and the line connecting the drawing lines LL2 and LL4 and the rotation center axis AX2 have the same azimuth line.

  Further, as shown in FIGS. 4 and 8, the encoder head EN3 is arranged on the installation azimuth line Le3. The installation azimuth line Le3 is a line connecting the projection area (measurement area) of the measurement light beam on the scale portion GPa (GPb, GPab) by the encoder head EN3 and the rotation center axis AX2 in the XZ plane. There is. Further, as described above, the installation azimuth line Le3 is a line connecting the detection regions Vw1 to Vw3 of the substrate P by the alignment microscope AM1 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center axis AX2 and the line connecting the detection areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center axis AX2 have the same azimuth line (from the rotation center axis AX2. The same direction as you see). With such a structure, when viewed from the direction in which the rotation center axis AX2 extends, the measurement area of the encoder head EN3 and the detection areas Vw1 to Vw3 of the alignment microscope AM1 on the scale parts GPa and GPb (or GPab) are the rotation drum DR. The same position in the circumferential direction.

  Similarly, as shown in FIGS. 4 and 8, the encoder head EN4 is arranged on the installation azimuth line Le4. The installation azimuth line Le4 is a line that connects the projection area (measurement area) of the measurement light beam on the scale portion GPa (GPb, GPab) by the encoder head EN4 and the rotation center axis AX2 in the XZ plane. There is. Further, as described above, the installation azimuth line Le4 is a line connecting the detection regions Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center axis AX2 and the line connecting the detection areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center axis AX2 have the same azimuth line (from the rotation center axis AX2. The same direction as you see). With such a structure, when viewed from the direction in which the rotation center axis AX2 extends, the measurement area of the encoder head EN4 and the detection areas Vw4 to Vw6 of the alignment microscope AM2 on the scale parts GPa and GPb (or GPab) are the rotating drum DR. The same position in the circumferential direction.

  When the installation azimuths of the encoder heads EN1, EN2, EN3, EN4 (angle directions in the XZ plane about the rotation center axis AX2) are represented by installation azimuth lines Le1, Le2, Le3, Le4, FIGS. As shown in FIG. 2, the plurality of drawing modules UW1 to UW5 and the encoder heads EN1 and EN2 are arranged such that the installation azimuth lines Le1 and Le2 form an angle ± th ° with respect to the center plane p3.

  The control device 16 controls the rotation angle positions of the encoder heads EN1 and EN2 and the scale parts (rotating drums DR) GPa and GPb detected by the counter circuit, that is, the moving position and the moving amount in the circumferential direction of the outer peripheral surface of the rotating drum DR. Based on at least one of them, the drawing start positions of the odd-numbered and even-numbered drawing modules UW1 to UW5 are controlled. That is, the control device 16 performs ON / OFF modulation of the modulator 81 based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected on the substrate P is scanning in the scanning direction. However, by determining the start timing of ON / OFF modulation of the CAD information for one scan by the modulator 81 based on the detected rotation angle position, the pattern is accurately drawn on the surface of the photosensitive layer of the substrate P. be able to.

  The controller 16 controls the rotation angle positions of the scale parts (rotating drums DR) GPa and GPb detected by the encoder heads EN3 and EN4 when the alignment marks Ks1 to Ks5 on the substrate P are detected by the alignment microscopes AM1 and AM2. By storing, the correspondence between the positions of the alignment marks Ks1 to Ks5 on the substrate P and the rotation angle position of the rotary drum DR can be obtained. Similarly, the control device 16 is detected by the encoder heads EN3 and EN4 when the alignment microscopes AM1 and AM2 detect the drum-side reference pattern RMP or the drum-side reference marks RLX and RLXa on the rotary drum DR. By storing the rotation angle positions of the scale unit (rotating drum DR) GPa and GPb, the positions of the drum side reference pattern RMP or the drum side reference marks RLX and RLXa on the rotating drum DR and the rotation angle position of the rotating drum DR are stored. Can be obtained. As described above, the alignment microscopes AM1 and AM2 can precisely measure the rotation angle position (or the circumferential position) of the rotating drum DR at the moment of sampling the reference pattern or mark within the detection areas Vw1 to Vw6. Then, in the exposure apparatus EX, based on this measurement result, the substrate P and the predetermined pattern drawn on the surface of the substrate P are aligned (aligned), and the drawing modules of the rotary drum DR and the drawing apparatus 11 are aligned. The positional relationship between UW1 to UW5 and the scanning lines LL1 to LL5 is calibrated.

  10A to 10C are diagrams showing a lateral deviation detection unit that detects the lateral deviation amount in the central axis AX2 direction (Y direction) of the rotary drum DR. The lateral deviation detection unit includes two displacement sensors SD1 and SD2 arranged to face the end surface DRT of the rotary drum DR. As shown in FIGS. 10-1 and 10-2, the rotary drum DR has a reference flat surface PPB formed in an annular shape on the end surface DRT. The reference flat surface PPB is machined so as to be exactly 90 ° with respect to the rotation center axis AX2, but it is actually ± α ° with respect to 90 ° depending on the accuracy of the processing machine (lathe or polishing machine). It is assumed that the image has been processed with an inclination error of. In the case where the disc (scale disc) DEN is attached to the end of the rotary drum DRb as shown in FIG. 9-4, the reference flat surface PPB may be formed on the side end face of the disc (scale disc) DEN. . In this case, the tilt error ± α ° shown in FIG. 10B also includes a tilt component due to a mounting error of the disc (scale disc) DEN.

  The displacement sensors SD1 and SD2 detect the lateral displacement (displacement in the Y direction) of the rotating drum DR in a non-contact manner at the measurement position on the reference flat surface PPB displaced by a certain amount in the radial direction of the rotating drum DR from the rotation center axis AX2. Although the types of the displacement sensors SD1 and SD2 are not limited, for example, a laser distance sensor or a capacitance type gap sensor can be used. In the present embodiment, the two displacement sensors SD1 and SD2 detect the lateral displacement of the rotary drum DR, but the number thereof is not limited and may be one or three or more. As shown in FIG. 10-2, the displacement sensors SD1 and SD2 may be arranged symmetrically (axisymmetrically) with the rotation center axis AX2 interposed therebetween. That is, the two displacement sensors SD1 and SD2 may be arranged around the rotation center axis AX2 at intervals of about 180 °. As shown in FIG. 10-3, three displacement sensors SD1, SD2, SD3 may be arranged around the rotation center axis AX2 at intervals of about 120 °. A single displacement sensor may be used. By using a plurality of displacement sensors, the lateral deviation detection accuracy is improved, and the inclination of the reference flat surface PPB can be easily obtained. Next, detection of an error of the alignment microscope will be described.

(About detection of alignment microscope error)
In the present embodiment, the exposure apparatus EX, more specifically, the control apparatus 16 detects angular data (circumferential direction) detected by the encoder heads EN3 and EN4 on the alignment microscopes AM1 and AM2 side and the encoder heads EN1 and EN2 on the drawing apparatus 11 side. Of the alignment marks Ks1, Ks2, and Ks3 detected by the alignment microscopes AM1 and AM2, and the absolute position (angle) coordinates of the substrate P are managed. The controller 16 feeds back the absolute position (angle) of the substrate P to the drawing device 11 to draw (expose) a pattern in a specified region on the substrate P in a highly accurately aligned state.

  FIG. 11 is a diagram for explaining an error of the alignment microscope. 12-1 to 12-3 are diagrams showing enlarged images of the detection region of the alignment microscope. When converting the image data photographed by the alignment microscope AM and image-processed by the image processing circuit OC into an actual measurement value, there is a possibility that a magnification error or a rotation error due to an attachment error of the alignment microscope AM or the like is included. When the alignment microscope AM is attached at a correct position with respect to the rotating drum DR, an image obtained from image information output from the image pickup system GD of the alignment microscope AM, that is, an enlarged image of the detection area Vw of the alignment microscope AM ( Vwc (referred to as a detected image as appropriate) is as shown in FIG. 12-1. That is, the first line pattern RLXy of the drum-side reference mark RLX captured by the alignment microscope AM in the detection area Vw is parallel to the y-axis of the xy coordinate system of the detection image Vwc, and the second line pattern RLXx is the detection image. It is parallel to the x axis of the xy coordinate system of Vwc.

  For example, when the alignment microscope AM is attached by rotating around the installation azimuth line Lea with respect to the original attachment position (the direction indicated by the arrow RQ in FIG. 11), a rotation error occurs on the rotating drum DR. The detected image Vwc of the drum side reference mark RLX at this time is, as shown in FIG. 12-2, the angle (rotation angle) of the alignment microscope AM rotated around the installation azimuth line Lea is γ, and the drum side reference mark The first line pattern RLXx and the second line pattern RLXx of the RLX are inclined by the rotation angle γ with respect to the xy coordinates.

  When the alignment microscope AM is attached with a deviation from the original attachment position in the direction of the installation azimuth line Lea (direction indicated by arrow FQ in FIG. 11), the image detected through the objective lens system GA of the alignment microscope AM is slightly different. Magnification error may occur. In the detected image Vwc of the drum side reference mark RLX at this time, as shown in FIG. 12C, the first line pattern RLXx and the second line pattern RLXx of the drum side reference mark RLX have the original thickness (see FIG. 12- (Thickness shown in 1) becomes thicker.

  In the present embodiment, the control device 16 shown in FIG. 1 utilizes the orbiting property of the rotating drum DR that rotates during drawing by the drawing device 11, and the drum-side reference pattern RMP or drum engraved on the surface of the rotating drum DR. An error such as a rotation error of the alignment microscope AM is obtained by repeatedly measuring the side reference mark RLX and the like. Then, the control device 16 detects the marks Ks1, Ks2, and Ks3 on the substrate P in a state where the alignment microscope AM is calibrated using the obtained error, and the drawing device 11 draws a predetermined pattern on the substrate P. To do. Next, a method of obtaining an attachment error of the alignment microscope AM, that is, an error of a relative positional relationship between the alignment microscope AM and the rotating drum DR will be described.

  FIG. 13 is a diagram showing a detection region of the alignment microscope on the substrate. FIG. 14 is a diagram for explaining the position where the alignment microscope detects the drum-side reference pattern. 15-1 to 15-3 are diagrams showing an example of an image detected by the alignment microscope when the attachment error of the alignment microscope is obtained. In the present embodiment, the control device 16 causes the drum-side reference pattern RMP or the drum-side reference mark RLX provided on the surface of the rotating drum DR to detect the detection areas Vw1 to Vw1 of the alignment microscopes AM1 and AM2 as the rotating drum DR rotates. The alignment microscopes AM1 and AM2 are based on at least two position information of the drum side reference pattern RMP or the drum side reference mark RLX detected by the alignment microscopes AM1 and AM2 when they come to at least two mutually different places in the Vw6. An error in the relative positional relationship between the rotary drum DR and the rotary drum DR (hereinafter appropriately referred to as an attachment error) is obtained. In the following description, the drum-side reference mark RLX is used as the reference pattern, but the drum-side reference pattern RMP may be used. In the following description, an example of measuring an attachment error between the alignment microscope AM1 and the rotary drum DR, that is, an error in a relative positional relationship will be described, but the error measurement of the alignment microscope AM2 is the same as that of the alignment microscope AM1.

  As shown in FIG. 13, the position at which the alignment microscope AM1 is provided is at the angle θa. The angle θa is an angle from the center plane p3 about the rotation center axis AX2. As described above, the angle between the alignment microscope AM1 and the alignment microscope AM2 is β, and thus the position where the alignment microscope AM1 is provided is represented by an angle about the rotation center axis AX2 as θb = θa + β. As shown in FIG. 14, the alignment microscope AM1 includes a drum-side reference mark RLX provided on the surface of the rotary drum DR at at least two locations (three locations in the present embodiment) in the detection area Vw1 on the surface of the rotary drum DR. Is imaged to detect the position information. At this time, the position of the drum-side reference mark RLX is determined by the angle of the rotary drum DR detected by the encoder head EN3 (see FIG. 8-1) having the installation azimuth line Le3 parallel to the optical axes La1, La2, La3 of the alignment microscope AM1. Is specified.

  In this example, the alignment microscope AM1 detects the drum-side reference mark RLX at three positions: a position of an angle θ1, a position of an angle θ1 + Δθ, and a position of an angle θ + 2 × Δθ. That is, the alignment microscope AM1 detects (images) the drum side reference mark RLX for each angle Δθ. More specifically, the alignment microscope AM1 detects the image of the drum-side reference mark RLX every time the rotating drum DR makes one revolution, by utilizing the revolving property (repeatability) of the rotating drum DR in one direction. The drum-side reference mark RLX is detected so that the position in the area is shifted by a predetermined angle + Δθ (or −Δθ). Thus, the rotary drum DR rotates 360 ° + Δθ ° from the angular position θ1 (first angular position) of the rotary drum DR when the alignment microscope AM1 first detects the reference mark RLX in the detection area Vw1. The drum-side reference mark RLX is detected and imaged at each of the angular position θ1 + Δθ (second angular position) and the angular position θ1 + 2 · Δθ (third angular position) obtained by rotating the rotary drum DR by 360 ° + Δθ °. As is clear from FIG. 14, the distance on the outer peripheral surface of the rotary drum DR from the first angular position (θ1 + 2 · Δθ) to the third angular position (θ1 + 2 · Δθ) is the circumference of the detection region Vw1 of the alignment microscope AM1. The angle Δθ is set so as to be smaller than the range of the direction. The image processing circuit OC (FIG. 8-2) connected to the alignment microscope AM1 obtains the position information of the drum side reference mark RLX based on the image information picked up by the image pickup system GD at each angular position, and the control device Output to 16.

  By the way, the controller 16 resets the counter circuit, which counts the measurement signal (two-phase signal) from the encoder head EN3, to zero, in response to the origin signal output from the encoder head EN3 every time the rotary drum DR makes one revolution. are doing. The positional relationship in the circumferential direction between the reference mark RLX on the rotary drum DR and the origin mark provided alongside the scale parts GPa and GPb is known. Therefore, assuming that the center of the reference mark RLX and the center of the detection area Vw1 of the alignment microscope AM1 coincide with each other in the circumferential direction at a position where the rotary drum DR is rotated by an angle (θ1 + Δθ) from the time of detecting the origin mark, the encoder head EN3 is used. A trigger signal is generated at each of the time when the measured angular position (count value of the counter circuit) reaches the angular position θ1, the time when it reaches the angular position θ1 + Δθ, and the time when it reaches the angular position θ1 + 2Δθ, and the imaging of the alignment microscope AM1 is performed. It suffices to sample the image information captured by the unit.

  As described above, the orbiting property of the rotating drum DR is used to cause the alignment microscope AM1 to make the same drum-side reference mark at different positions in the detection region Vw1 on the surface of the rotating drum DR every time the rotating drum DR makes one revolution. Image the RLX. In this way, in the alignment microscope AM1, since the same drum-side reference mark RLX appears in the detection area Vw1 for each revolution of the rotary drum DR, continuous imaging by the high-speed image sensor and rotation of the rotary drum DR at an extremely low speed are performed. No imaging is required. Further, the control device 16 shown in FIG. 1 can obtain the mounting error online, and can automatically accumulate and update the data regarding the mounting error.

  15-1 shows the detected image Vwc at the position of the angle θ1, FIG. 15-2 shows the detected image Vwc at the position of the angle θ1 + Δθ, and FIG. 15-3 shows the detected image Vwc at the position of the angle θ + 2 × Δθ. Indicates. In this example, the position at which the drum-side reference mark RLX is detected changes in the order of the angle θ1, the angle θ1 + Δθ, and the angle θ1 + 2 × Δθ every time the rotary drum DR makes one revolution. As described above, the alignment microscope AM1 images the drum-side reference mark RLX imaged for the first time at different positions in the detection region Vw1 on the surface of the rotating drum DR every time the rotating drum DR makes one revolution. Therefore, the positions of the three detection images Vwc picked up by the alignment microscope AM1 in the x direction in the xy coordinates of the drum side reference mark RLX in the detection image Vwc change. The amount by which the position where the drum side reference mark RLX is imaged in the detection area Vw1 is made different can be set and changed by the magnitude of Δθ described above. Δθ is determined based on the magnification of enlargement by the objective lens system GA of the alignment microscope AM1, the transport speed of the substrate P, or the like.

  If the alignment microscope AM1 does not rotate around the installation azimuth line Le3 with respect to the original mounting position, only the position of the drum side reference mark RLX in the x direction changes with the rotation of the rotating drum DR, and the y direction. The position of does not change. In the examples shown in FIGS. 15-1 to 15-3, the position of the drum-side reference mark RLX in the y direction also changes as the rotary drum DR rotates. Therefore, in the example shown in FIGS. 15-1 to 15-3, the alignment microscope AM1 is attached (rotated) around the installation azimuth line Le3 with respect to the original attachment position. In the example shown in FIGS. 15-1 to 15-3, the position change in the y direction of the reference mark RLX in the three detection images Vwc is exaggeratedly expressed, but the rotation error of the alignment microscope AM1 that may actually occur is Smaller, within ± 1 °.

  However, even when the rotation error Δγ of the alignment microscope AM1 is ± 0.6 °, when the size of the detection area Vw1 in the X direction is 200 μm, the reference mark RLX detected at the end in the + X direction within the detection area Vw1. The shift amount ΔYγ in the Y direction between the center position and the center position of the reference mark RLX detected at the end in the −X direction within the detection region Vw1 is deviated from ΔYγ = 200 · tan (Δγ) by a maximum of about 2 μm. As an alignment sensor for an apparatus that draws a pattern having a minimum line width of 10 μm to 15 μm, such a deviation amount ΔYγ cannot be ignored.

(An example of a method for obtaining the rotation error)
FIG. 16-1 is a diagram for explaining a method of obtaining a rotation error of the alignment microscope AM1. In FIG. 16, the x-axis and the y-axis are the respective coordinate axes showing the xy coordinate system of the detected image Vwc, and the X-axis and the Y-axis are the respective coordinate axes showing the XY coordinate system of the exposure apparatus EX shown in FIG. . The rotation error is a mounting error that occurs between the alignment microscope AM1 and the rotating drum DR in the rotation direction around the installation azimuth line Le3, and FIG. 16-1 exaggerates the error. Next, the image processing circuit OC may perform the process of the control device 16 illustrated in FIG. 1, or the control device 16 may perform the process of the image processing circuit OC. Either one of the control device 16 and the image processing circuit OC may perform all the processing.

  The magnification of enlargement by the objective lens system GA of the alignment microscope AM1 has a magnification coefficient a in the x-axis direction and a magnification coefficient b in the y-axis direction of the xy coordinate system of the detected image Vwc. In this embodiment, a = b. The magnification factors a and b correspond to how large the size or pixel pitch of one pixel (pixel) of the CCD or CMOS image sensor in the image pickup system GD is on the actual substrate P or on the surface of the rotary drum DR. It is a converted value indicating whether or not. For example, when the detection area Vw1 on the substrate P or on the outer peripheral surface of the rotary drum DR is 200 μm × 200 μm and the area is imaged by 2000 × 2000 pixels of the image sensor, the magnification factors a and b are 0.1 μm.

First, a rotation angle Δγ indicating how much the alignment microscope AM1 is rotated around the installation azimuth line Le3 with respect to the regular installation position is obtained. For example, the image processing circuit OC illustrated in FIG. 8B uses the drum-side reference mark at each position as the position information of the same drum-side reference mark RLX captured at different positions within the detection area Vw1 on the surface of the rotating drum DR. The center position coordinates (x1, y1), (x2, y2), (x3, y3) of the RLX in the detected image Vwc are obtained. Since the scaling factors a and b are a = b, the formula (1) is established. For example, Δx = x2-x1 and Δy = y2-y1.
tan (Δγ) = Δy / Δx (1)

For example, the control device 16 causes the alignment microscope AM1 to pick up the same drum-side reference mark RLX a plurality of times to obtain a plurality of position coordinates (x1, y1), (x2, y2), (x3) obtained by the image processing circuit OC. , Y3) is obtained. The slope of the approximate straight line LV corresponds to Δx / Δy. Therefore, the rotation angle γ can be calculated by the equation (2). Next, a method for obtaining the error of the magnification coefficient a (or the magnification) will be described. Next, a method for obtaining the error of the magnification coefficient a (or the magnification) will be described.
Δγ = tan ⁻¹ (Δy / Δx) (2)

(One example of a method for obtaining a magnification coefficient or magnification error)
When an error occurs in the mounting position of the alignment microscope AM1 in the direction of the installation azimuth line Le3 and the distance between the alignment microscope AM1 and the rotating drum DR is not appropriate, the magnification coefficient of magnification by the objective lens system GA of the alignment microscope AM or the like. Or, an error may occur in the magnification. If the moving amount (actual moving amount) of the same drum-side reference mark RLX when the rotating drum DR rotates by Δθ is ΔL, equations (3) and (4) are established. Δx and Δy are values in the detected image Vwc, and correspond to, for example, the number of pixels of the image pickup device of the image pickup system GD included in the alignment microscope AM1. The actual movement amount ΔL can be obtained based on the detection value (angle) of the encoder head EN3, for example, as in Expression (5). r is the radius of the rotating drum DR. The control device 16 obtains the magnification coefficient a of the alignment microscope AM from the equations (3) and (5) or the equations (4) and (5), and obtains the magnification of the alignment microscope AM from the obtained magnification coefficient a. be able to.
a = ΔL × cos (Δγ) / Δx (3)
b = ΔL × sin (Δγ) / Δy (4)
ΔL = r × Δθ (rad) = 2 × π × r × Δθ (°) / 360 (°) (5)

  In obtaining the rotation error and the magnification coefficient a or the magnification, the control device 16 detects the displacement sensors SD1, SD2 shown in FIGS. 10-1 and 10-1 or the displacement sensors SD1, SD2, SD3 shown in FIG. 10-3. An error in the relative positional relationship between the alignment microscope AM1 and the rotating drum DR may also be obtained by using the lateral displacement amount of the rotating drum DR. By doing so, the accuracy of measurement of the rotation error and the magnification coefficient a or the magnification of the alignment microscope AM1 from which the lateral deviation error of the rotary drum DR is removed is improved, so that the drawing device 11 of the exposure apparatus EX causes the drawing pattern 11 on the substrate P to have a predetermined pattern. The accuracy of alignment when drawing is improved.

FIG. 16-2 is a diagram for explaining the correction of the position in the detected image in consideration of the lateral shift amount. The displacement sensors SD1, SD2, etc. detect the lateral shift amount of the rotary drum DR, that is, the positional shift of the exposure apparatus EX in the Y-axis direction in the XY coordinate system. Assuming that the lateral displacement amount of the rotating drum DR is Ye, in the xy coordinate system of the detected image Vwc shown in FIG. Has occurred. That is, as shown in FIG. 16-2, there are errors xe and ye between the position coordinates (xp, yp) detected by the alignment microscope AM1 and the true position coordinates (x, y). There is. When the lateral shift amount Ye and the rotation angle Δγ obtained by using the equation (2) are used, the error xe is given by the equation (6) and the error ye is given by the equation (7). The control device 16 acquires the lateral deviation amount Ye from the displacement sensors SD1 and SD2 at each position where the alignment microscope AM1 detects the same drum-side reference mark RLX in the detected image Vwc for each Δθ. The position where the drum-side reference mark RLX is detected can be obtained from the measurement information of the encoder head EN3.
xe = Ye × sin (Δγ) (6)
ye = Ye × cos (Δγ) (7)

  The control device 16 uses the errors xe and ye obtained by the equations (6) and (7) to show the position coordinates of the drum side reference mark RLX at the xy coordinates in the detected image Vwc shown in FIG. 16-1. x1, y1), (x2, y2), (x3, y3) are corrected. When the lateral deviation amount at the angular position θ1 is Ye1, the lateral deviation amount at the angular position θ1 + Δθ is Ye2, and the lateral deviation amount at the angular position θ1 + 2 × Δθ is Ye3, the respective position coordinates (x1, y1), (x2, y2), The errors (xe1, ye1), (xe2, ye2), and (xe3, ye3) of (x3, y3) can be obtained by using the lateral deviation amounts Ye1, Ye2, Ye3 and Equations (6) and (7). . The control device 16 uses the respective position coordinates (x1, y1), (x2, y2), (x3, y3) using the corresponding errors (xe1, ye1), (xe2, ye2), (xe3, ye3). To correct. The corrected position coordinates are (xc1, yc1), (xc2, yc2), (xc3, yc3), and for example, xc1 = x1-xe1, yc1 = y1-ye1.

  The control device 16 recalculates Δx and Δy in Expression (2) using the corrected position coordinates (xc1, yc1), (xc2, yc2), and (xc3, yc3), and recalculates the rotation angle Δγ. . The control device 16 recalculates the errors xe and ye using the recalculated Δγ, and uses the recalculated errors xe and ye to obtain the most recently corrected position coordinates (xc1, yc1), (xc2, yc2) and (xc3, yc3) are corrected. The control device 16 repeats recalculation of the rotation angle Δγ and the errors xe and ye until the errors xe and ye converge. For example, when the errors xe and ye are equal to or less than a predetermined value, the control device 16 reduces the difference in the rotation angle Δγ before and after the recalculation or the difference in the position coordinates (xc1, yc1) before and after the correction to a predetermined value or less. If the rotation angle Δγ after recalculation or the corrected position coordinates (xc1, yc1) becomes constant, it is determined that the errors xe and ye have converged. The control device 16 stores the rotation angle Δγ when the errors xe and ye converge, as the rotation error and the magnification coefficient of the alignment microscope AM1.

  In the present embodiment, the alignment microscope AM1 moves toward the drum side when the drum-side reference mark RLX comes to each of at least two different areas in the detection regions Vw1 to Vw3 of the alignment microscope AM1 as the rotary drum DR rotates. At least two pieces of position information of the reference mark RLX are detected. The control device 16 obtains an error in the relative positional relationship between the alignment microscope AM1 and the rotary drum DR based on at least two pieces of position information of the drum side reference mark RLX detected by the alignment microscope AM1.

  In this way, since the exposure apparatus EX obtains the attachment error of the alignment microscope AM1 by utilizing the orbiting property of the rotating drum DR, it is possible to obtain the attachment error even while the rotating drum DR is rotating. Therefore, during rotation of the rotary drum DR, for example, even when the rotary drum DR conveys the substrate P and the drawing apparatus 11 draws (exposes) on the substrate P, the controller 16 attaches the alignment microscope AM1. It is possible to obtain an error and correct the position information detected by the alignment microscope AM1. In this case, the alignment microscope AM1 can detect the reference mark RLX on the rotary drum DR via the substrate P, and a blank portion where a device pattern is not formed over a certain range in the longitudinal direction of the substrate P. Good to do. As a result, the exposure apparatus EX can immediately correct the drawing position of the drawing apparatus 11 by obtaining the mounting error even when the alignment microscope AM1 is displaced during drawing. As a result, the exposure apparatus EX can suppress a decrease in drawing accuracy. Further, since the control device 16 can obtain the mounting error of the alignment microscope AM1 during the drawing by the drawing device 11, it is not necessary to stop the exposure apparatus EX to obtain the mounting error. As a result, productivity is improved.

  As described above, the exposure apparatus EX uses the measurement value from the encoder or the displacement sensor that highly accurately measures the fluctuation of at least one of the rotational position and the rotational axis direction of the rotary drum DR, and the orbiting property due to the rotation of the rotary drum DR. The result obtained by detecting the same reference pattern a plurality of times by using the alignment microscope AM1 (pattern detection unit) is used. As a result, the exposure apparatus EX can highly accurately determine the variation in at least one of the relative position and orientation of the rotary drum DR and the alignment microscope AM1.

(When there are multiple alignment microscopes)
FIG. 17 is a diagram for explaining a method of obtaining a mounting error of each alignment microscope when the alignment microscopes are arranged in two rows in the substrate transport direction. In the following description, when a plurality of alignment microscopes AM1a, AM1b, AM1c arranged in a direction parallel to the rotation center axis AX2 of the rotary drum DR are not distinguished, they are referred to as an alignment microscope AM1. Similarly, when a plurality of alignment microscopes AM2a, AM2b, AM2c arranged in a direction parallel to the rotation center axis AX2 of the rotary drum DR are not distinguished, they are referred to as an alignment microscope AM1.

  The control device 16 shown in FIG. 1 sequentially detects the detection areas Vw1, Vw2, and Vw3 of the alignment microscope AM1 and the detection areas Vw4, Vw5, and Vw6 of the alignment microscope AM2 with the rotation of the rotary drum DR. The relative positional relationship between the alignment microscope AM1 and the alignment microscope AM2 is obtained based on each position information of the drum side reference mark RLX. The mounting error of the alignment microscope AM1 and the mounting error of the alignment microscope AM2 are obtained by utilizing the orbiting property of the rotary drum DR, as described above. For example, the alignment microscope AM1a and the alignment microscope AM2a arranged at the same position in the transport direction of the substrate P, that is, the rotation direction of the rotary drum DR, have the same drum-side reference mark RLX1 appearing in the respective detection images Vwc1 and Vwc4. The mounting error is calculated using. The alignment microscope AM1b and the alignment microscope AM2b use the same drum side reference mark RLX2 that appears in the respective detection images Vwc2 and Vwc4 to find the mounting error, and the alignment microscope AM1c and the alignment microscope AM2c detect the respective errors. The mounting error is obtained using the same drum side reference mark RLX3 that appears in the images Vwc3 and Vwc6. Due to a mounting error, the same drum-side reference mark that appears in the detected image Vwc1 and the drum-side reference mark that appears in the detected image Vwc4 are detected at different positions in one detected image. Since the drum-side reference marks RLX1 appearing in the detected images Vwc1 and Vwc4 are the same as in the present embodiment, it is possible to eliminate the error due to the different positions of the drum-side reference marks.

  The alignment microscope AM1 and the alignment microscope AM2 are provided apart from each other by a predetermined angle β (°) about the rotation center axis AX2 of the rotary drum DR. If there is no error in the relative positional relationship between the alignment microscopes AM1 and AM2 and the rotary drum DR, if the same drum-side reference mark RLX1 advances by a predetermined angle β, the detected image Vwc1 of the alignment microscope AM1a and the alignment microscope In the detected image Vwc4 of AM2a, the same drum side reference mark RLX1 appears at the same position. If the alignment microscope AM1a and the alignment microscope AM2a are attached while being displaced from their original positions in the transport direction of the substrate P, the distance between the two will change. As a result, when the rotary drum DR rotates by a predetermined angle β, the same drum-side reference mark RLX1 is detected in the detection image Vwc1 of the alignment microscope AM1a and the detection image Vwc4 of the alignment microscope AM2a in the conveyance direction of the substrate P. Appear in different positions. The deviation of the position where the same drum-side reference mark RLX1 appears in the detected image Vwc1 and the detected image Vwc4 is the positional deviation between the alignment microscope AM1a and the alignment microscope AM2a in the transport direction of the substrate P. The control device 16 obtains this positional deviation and corrects the positional information detected by the alignment microscopes AM1a and AM2a using the obtained positional deviation. Then, the control device 16 controls the drawing (exposure) of the drawing device 11 using the corrected position information. Although the alignment microscope AM1a and the alignment microscope AM2a have been described, the same applies to the alignment microscopes AM1b and AM1c and the alignment microscopes AM2b and AM2c. By doing so, the control device 16 causes the alignment microscope AM1 and the alignment microscope AM2, that is, the alignment microscope AM1a and the alignment microscope AM2a, the alignment microscope AM1b and the alignment microscope AM2b, and the alignment microscope AM1c. It is possible to obtain the error in the relative positional relationship between the position and the alignment microscope AM2c.

  When the long substrate P transported by the rotating drum DR is transported by the rotating drum DR, as shown in FIG. 3, in the detection regions Vw1 to Vw3 of the alignment microscope AM1 and the alignment microscope AM2 and the detection region Vw4. There are a plurality of alignment marks Ks1, Ks2, Ks3 arranged in the longitudinal direction so as to appear within Vw6. When the alignment microscopes AM1 and AM2 detect the alignment marks Ks1, Ks2, and Ks3, the imaged alignment marks Ks1, Ks2, and Ks3 appear in the detected images Vwc1 to Vwc3 and the detected images Vwc4 to Vwc6, respectively. The control device 16 defines on the substrate P based on each position information of the alignment marks Ks1, Ks2, Ks3 obtained by sequentially detecting the alignment microscope AM1 and the alignment microscope AM2 by the rotation of the rotary drum DR. The position of the processed area A7 (see FIG. 3) to be processed is determined. In this case, since the control device 16 knows the error amount caused by the mounting error of the alignment microscopes AM1 and AM2, the position information of the alignment marks Ks1, Ks2, and Ks3 detected by these is corrected by the above-described error amount. . By doing so, the control device 16 can minimize the influence of the attachment error of the alignment microscopes AM1 and AM2 and suppress the deterioration of the drawing (exposure) accuracy of the drawing device 11.

  When the alignment marks Ks1, Ks2, and Ks3 shown in FIG. 3 are simultaneously detected by the plurality of alignment microscopes AM1a, AM1b, AM1c, AM2a, AM2b, and AM2c, the control device 16 can correct the respective mounting errors. As described above, since the positional relationship between the alignment microscope AM1 and the alignment microscope AM2 is known, the control device 16 can also obtain the change amount due to the expansion and contraction of the substrate P, the sliding of the substrate P, or the like.

  The substrate P is preferably transparent to the illumination light emitted by the illumination system GC (see FIGS. 8-1 and 8-2) included in the alignment microscopes AM1 and AM2. By doing so, the alignment microscopes AM1 and AM2 can detect the drum-side reference mark RLX provided on the rotating drum DR through the substrate P. As a result, the alignment microscopes AM1 and AM2 detect the drum-side reference mark RLX during the conveyance of the substrate P, and the control device 16 determines the attachment error of the alignment microscopes AM1 and AM2 based on the detection results of the alignment microscopes AM1 and AM2. Can be corrected.

  18 and 19 are diagrams for explaining an example of obtaining the deviation of the substrate that occurs while the rotating drum conveys the substrate. In the present embodiment, the control device 16 uses the alignment microscope AM1 and the alignment microscope AM2 shown in FIG. 8A to change the substrate P such that the substrate P slides on the surface of the rotary drum DR or the substrate P expands and contracts. Can be asked. 18 and 19, the change of the substrate P is obtained using the alignment microscope AM1a of the plurality of alignment microscopes AM1 and the alignment microscope AM2a of the plurality of alignment microscopes AM2, but the invention is not limited to this. .

  With the rotation of the rotary drum DR, the control device 16 sequentially detects the detection area Vw1 of the alignment microscope AM1a (see FIG. 8-1 etc.) and the detection area Vw4 of the alignment microscope AM2 (see FIG. 8-2 etc.). Each position information of the drum side reference mark RLX is detected. Further, the control device 16 causes the specific substrate mark Ks1t (see FIGS. 18 and 19) of the plurality of alignment marks Ks1 shown in FIG. 3 to be the alignment microscope AM1a when the rotary drum DR rotates by the predetermined angle β. Each position information of the specific substrate mark Ks1t is obtained by detecting it with the alignment microscope AM2a. The control device 16 obtains a change in the relative position between the outer peripheral surface of the rotary drum DR and the substrate P based on the obtained position information of the drum side reference mark RLX and the obtained position information of the specific substrate mark Ks1t.

  Before obtaining the change in the relative position between the outer peripheral surface of the rotary drum DR and the substrate P, the control device 16, as described above, the mounting error of the respective alignment microscopes AM1 and AM2 and the relative alignment between the alignment microscopes AM1 and AM2. The error of such a positional relationship is obtained and stored in, for example, a storage unit included in itself. Next, the alignment microscope AM1a simultaneously detects the drum-side reference mark RLX and the specific substrate mark Ks1t appearing in the detection area Vw1, and the image processing circuit OC causes the position coordinates (positional information (positional information of the drum-side reference mark RLX) ( x1, y1) and position coordinates (x2, y2) as position information of the specific substrate mark Ks1t are obtained. The position coordinates (x1, y1) are the coordinates of the intersection RLXc of the drum side reference mark RLX, and the position coordinates (x2, y2) are the coordinates of the intersection Ks1c of the specific substrate mark Ks1t. In the detected image Vwc1 of the alignment microscope AM1a, the drum side reference mark RLX and the specific substrate mark Ks1t appear.

  When the rotating drum DR conveys the substrate P and rotates about the rotation center axis AX2 by a predetermined angle β, the specific substrate mark Ks1t and the drum-side reference mark RLX detected by the alignment microscope AM1a enter the detection region Vw4 of the alignment microscope AM2. . The alignment microscope AM2 simultaneously detects the drum-side reference mark RLX and the specific substrate mark Ks1t appearing in the detection area Vw4, and the image processing circuit OC determines the position coordinates (x3, y3) as the position information of the drum-side reference mark RLX. ) And position coordinates (x4, y4) as position information of the specific substrate mark Ks1t. The position coordinates (x3, y3) are the coordinates of the intersection RLXc of the drum side reference mark RLX, and the position coordinates (x4, y4) are the coordinates of the intersection Ks1c of the specific substrate mark Ks1t. In the detected image Vwc2 of the alignment microscope AM2a, the drum side reference mark RLX and the specific substrate mark Ks1t appear.

  The intersection RLXc and the intersection Ks1c of the drum-side reference mark RLX and the specific substrate mark Ks1t appearing in the detection image Vwc1 of the alignment microscope AM1a shown in FIG. 18 are separated from each other. The drum-side reference mark RLX and the specific substrate mark Ks1t appearing in the detection image Vwc2 of the alignment microscope AM2a shown in FIG. 19 are separated from each other at the intersection RLXc and the intersection Ks1c, but the distance is the alignment microscope AM1a. Is larger than the distance appearing in the detected image Vwc1. That is, the relative position between the outer peripheral surface of the rotary drum DR and the substrate P changes due to slippage or expansion / contraction of the substrate P while the substrate P is transported from the alignment microscope AM1a to the alignment microscope AM2a.

  In the detected image Vwc1 of the alignment microscope AM1, the drum-side reference mark RLX and the specific substrate mark Ks1t are separated by x2-x1 in the x direction and y2-y1 in the y direction in the xy coordinate system. In the detected image Vwc2 of the alignment microscope AM2, the drum-side reference mark RLX and the specific substrate mark Ks1t are separated by x4-x3 in the x direction and y4-y3 in the y direction in the xy coordinate system. Since the drum side reference mark RLX is common to the detection image Vwc1 of the alignment microscope AM1 and the detection image Vwc2 of the alignment microscope AM2, the specific substrate mark Ks1t is x in the xy coordinate system between the detection image Vwc1 and the detection image Vwc2. This means that it has moved by x4-x3-x2 + x3 in the direction and by y4-y3-y2 + y3 in the y direction. That is, the substrate P moves by x4-x3-x2 + x3 in the x direction and y4-y3-y2 + y3 in the y direction in the xy coordinate system while being transported from the alignment microscope AM1a to the alignment microscope AM2a.

  The control device 16 is based on the position information of the drum-side reference mark RLX and the specific substrate mark Ks1t simultaneously detected by the alignment microscope AM1a and the position information of the drum-side reference mark RLX and the specific substrate mark Ks1t simultaneously detected by the alignment microscope AM2a. , Changes in relative positions of the rotating drum DR, the outer peripheral surface, and the substrate P are obtained. As a result, the control device 16 can estimate the amount of change in the position of the substrate P in the transport direction of the substrate P, and thus predicts the timing at which the drawing device 11 starts drawing (exposure) in the processed region A7 of the substrate P. can do. Further, the control device 16 can also detect a sudden slip of the substrate P.

  A plurality of drum-side reference marks RLX are provided at predetermined angular intervals (denoted by ε °) in the rotation direction of the outer peripheral surface of the rotary drum DR. When a plurality of alignment marks Ks1, Ks2, and Ks3 are provided at intervals M in the longitudinal direction of the substrate P, the drum-side reference mark RLX has a radius r of the rotating drum DR, and π · r · ε / 180 ≠ M. It is preferable that the relationship be set so that In this way, since the overlap between the drum-side reference mark RLX and the alignment marks Ks1, Ks2, and Ks3 is suppressed, the alignment microscopes AM1a and AM2a can more reliably ensure the difference between the drum-side reference mark RLX and the specific substrate mark Ks1t. Can be detected.

  In the present embodiment, the alignment marks Ks1, Ks2, Ks3 are preferably provided on the surface side of the substrate P supported by the rotary drum DR, that is, on the back surface side of the substrate P as viewed from the drawing device 11. With this configuration, the alignment marks Ks1, Ks2, and Ks3 can be arranged at substantially the same surface position as the drum-side reference mark RLX, so that the imaging system GD can focus the focus of the objective lens system GA of the alignment microscopes AM1a and AM2a. Both the drum side reference mark RLX and the alignment marks Ks1, Ks2, Ks3 can be imaged within the depth. Although the depth of focus becomes shallower when the magnification of the objective lens system GA is increased, the magnification of the objective lens system GA is increased by providing the alignment marks Ks1, Ks2, and Ks3 on the surface side of the substrate P supported by the rotary drum DR. Even if it is raised, the imaging system GD can image both the drum-side reference mark RLX and the alignment marks Ks1, Ks2, and Ks3 in a good in-focus state.

  In each of the above-described embodiments and modified examples, the reference mark RLX or the like directly formed on the outer peripheral surface of the rotating drum DR when measuring the mounting position error or the minute rotation error of the alignment microscope AM for device calibration. Was used. However, a single reference sheet plate having a plurality of reference marks RLX and the like formed on the surface is wound around the outer peripheral surface of the rotating drum DR and temporarily fixed, that is, a reference position is set at a specific position along the outer peripheral surface of the rotating drum DR. The calibration may be performed in the state where the reference mark RLX as the pattern is provided. In that case, the reference sheet plate has a thickness similar to that of the substrate P and is made of a material that is less likely to be deformed by tension, for example, a metal (SUS material or the like) electrode that is cut into individual sheets of A4 size or B4 size. Sheets are available. Although such a reference sheet plate takes time and effort to wind it around the outer peripheral surface of the rotary drum DR, it can be easily created. Therefore, when the mounting position of the alignment microscope AM in the Y direction is changed, the reference sheet plate corresponds to the position change. It is possible to prepare one having the reference mark RLX formed therein. From this, the reference sheet plate is suitable for the calibration of the exposure apparatus (processing apparatus) including the rotating drum DR in which the reference mark RLX and the like cannot be formed on the outer peripheral surface, and the reference sheet plate is used between a plurality of exposure apparatuses including the same rotating drum. There is also an advantage in that it can be used in common with each other, and that various precisions can be managed among a plurality of exposure apparatuses based on one standard (one standard sheet plate).

  The above-described present embodiment, the first modified example, and the second modified example exemplify an exposure apparatus that performs patterning by light energy as the substrate processing apparatus. The substrate processing apparatus is not limited to the exposure apparatus, and the processing unit prints a pattern on the substrate P, which is the object to be processed, by an inkjet ink dropping apparatus, or a coating apparatus that patterns the substrate P with a liquid or paste ink. May be Further, the processing unit may be an inspection device. In the above-described present embodiment, the first modified example, and the second modified example, a so-called raster scan type drawing exposure apparatus that does not use a mask is taken as an example of the substrate processing apparatus, but an exposure apparatus that uses a plane mask or a cylindrical mask, Alternatively, a maskless exposure apparatus that exposes a pattern image on a substrate by controlling the inclination of each mirror of a DMD (digital micromirror device) based on the CAD information of the pattern may be used as the substrate processing apparatus.

(Device manufacturing method)
FIG. 20 is a flowchart showing the procedure of a device manufacturing method for manufacturing a device using the substrate processing apparatus (exposure apparatus) according to the embodiment. In this device manufacturing method, first, the function / performance of a display panel is formed by self-luminous elements such as organic EL, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Further, a supply roll around which a flexible substrate P (resin film, metal foil film, plastic, etc.) serving as a base material of the display panel is wound is prepared (step S202). The roll-shaped substrate P prepared in step S202 has a surface modified as necessary, a base layer (for example, fine irregularities formed by an imprint method) preformed, and a light-sensitive substrate. It may be a laminate of a functional film and a transparent film (insulating material) in advance.

  Then, a backplane layer having electrodes, wirings, insulating films, TFTs (thin film semiconductors), etc., which constitute the display panel device, is formed on the substrate P, and the organic EL or other organic EL is formed so as to be laminated on the backplane. A light emitting layer (display pixel portion) is formed by the light emitting element (step S203). This step S203 includes a conventional photolithography process of exposing the photoresist layer using the exposure apparatus EX described in each of the above embodiments, but a photosensitive silane coupling material is applied instead of the photoresist. The substrate P is subjected to pattern exposure to form a pattern having hydrophilicity / repellency on the surface, and a wet process for pattern-exposing a photosensitive catalyst layer to form a metal film pattern (wiring, electrodes, etc.) by electroless plating. A process such as a process or a printing process of drawing a pattern with a conductive ink containing silver nanoparticles or the like is also included.

  Then, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by a roll method, or a protective film (environmental barrier layer) or a color filter is provided on the surface of each display panel device. A device or the like is assembled by laminating sheets or the like (step S204). Next, an inspection process is performed as to whether or not the display panel device functions normally or satisfies the desired performance and characteristics (step S205). In this way, a display panel (flexible display) can be manufactured.

  In the above-described embodiment, the light-transmitting reticle in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on the light-transmitting substrate is used, but instead of this reticle, for example, US Pat. No. 6,778,257, a variable shaped reticle (also called an electronic reticle, active reticle, or image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable-shaped reticle including the non-luminous image display element.

  In addition, the exposure apparatus of the above-described embodiment can assemble various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured. In order to ensure these various accuracies, before and after assembling the exposure apparatus, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical Adjustments are made to the system to achieve electrical accuracy. The process of assembling various subsystems into the exposure apparatus includes mechanical connection between various subsystems, electrical circuit wiring connection, and pneumatic circuit piping connection. It goes without saying that there is an individual assembly process for each subsystem before the assembly process for the exposure apparatus from these various subsystems. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to ensure the various accuracies of the exposure apparatus as a whole. It is desirable that the exposure apparatus is manufactured in a clean room where the temperature and cleanliness are controlled.

  Further, the constituent elements of the above-described embodiments can be combined appropriately. In addition, some components may not be used. Further, the constituent elements can be replaced or changed without departing from the scope of the present invention. Further, as far as legally permitted, the descriptions of all the publications and US patents relating to the exposure apparatus and the like cited in the above-mentioned embodiments are incorporated as part of the description of the present specification. As described above, all other embodiments and operation techniques made by those skilled in the art based on the above-described embodiments are included in the scope of the present invention.

  Although the present embodiment and its modified example have been described above, the present embodiment and its modified example are not limited by the contents described above. The constituent elements of the above-described embodiment and its modifications include those that can be easily conceived by those skilled in the art, those that are substantially the same, and those that are within the so-called equivalent range. Furthermore, the components described above can be combined appropriately. In addition, various omissions, replacements, and changes of the constituent elements can be made without departing from the scope of the present embodiment and the modifications thereof.

1 Device Manufacturing System 11 Drawing Device 12 Substrate Transfer Mechanism 16 Control Device 31 Calibration Detection System A7 Processing Area AM, AM1, AM1a, AM1b, AM1c, AM2, AM2a, AM2b, AM2c Alignment Microscope AX2 Rotation Center Axis CL Perimeter Range CNT Light source device DEN Discs DR, DRa, DRb Rotating drums EN1, EN2, EN3, EN4 Encoder head EX Exposure device GA, GA1, GA2, GA3 Objective lens system GB Polarization beam splitter GBU Beam splitter unit GC Illumination system GD Imaging system GPa , GPb Scale part I Rotation axes Ks1, Ks2, Ks3 Alignment mark Ks1c Intersection Ks1t Specific substrate mark LB Drawing beam OC Image processing circuit P Substrate p3 Center plane PPB Reference flat planes RLX, RLX1, LX2, RLX3 Drum side reference mark RLXc Intersection RMP Drum side reference pattern SD1, SD2, SD3 Displacement sensor TR Processing area UW, UW1 to UW5 Drawing module Vw, Vw1 to Vw4 Detection area Vwc, Vwc1 to Vwc4 Detected image xe, ye Error Ye Lateral deviation amount β Predetermined angle γ Rotation angle Δθ Angle ε Angle interval

Claims (15)

A rotating drum that rotates around the axis and conveys the sheet-shaped substrate in the longitudinal direction while supporting the flexible sheet-shaped substrate by bending along a cylindrical outer peripheral surface having a constant radius from a predetermined axis. A pattern forming apparatus comprising:
A processing unit that forms a pattern on the surface of the sheet-shaped substrate in a processing region of the outer peripheral surface of the rotating drum that is set in a first orientation in the circumferential direction in which the sheet-shaped substrate is supported;
A substrate mark having a detection region set upstream of the processing region with respect to the transport direction of the sheet-like substrate and provided on the sheet-like substrate at predetermined intervals along the lengthwise direction, or Mark detection for detecting, via the detection area, either a specific position on the outer peripheral surface of the rotating drum or a reference pattern formed on a reference sheet plate temporarily fixed to the outer peripheral surface of the rotating drum. Department,
A scale measuring unit that reads scales engraved on an annular scale unit that rotates around the axis together with the rotating drum, and outputs measurement information regarding a position in the rotating direction of the rotating drum,
A lateral deviation detection unit that is arranged on the side surface side of the rotating drum so as to be orthogonal to the axis and outputs a lateral deviation amount according to a position change in the direction of the axis of a reference flat surface that rotates together with the rotating drum,
Each time the reference pattern appears in the detection area of the mark detection unit with the rotation of the rotary drum a plurality of times, position information of the reference pattern detected by the mark detection unit and the scale measurement unit. Thus it said measurement information measured, based on said lateral deviation amount of the is the lateral displacement detecting section thus measured, the relative positional relationship between the rotary drum and the mark detecting unit, or a predetermined state of the positional relationship and a calculation unit for obtaining an error from,
When the scale measuring unit is viewed from the direction in which the axis extends, the measurement region for reading the scale of the scale unit and the detection region of the mark detecting unit are located at the same position in the circumferential direction of the rotary drum. Placed,
When the reference pattern reaches an arbitrary position in the detection area of the mark detection unit during a plurality of rotations of the rotating drum, the first state is set, and the rotating drum is set to the first state. When the rotation of 360 ° ± Δθ ° is set to the second state, the ± Δθ ° is set so that the reference pattern appears at each of at least two different locations in the detection area of the mark detection unit. that, the patterning device. The pattern forming apparatus according to claim 1, wherein
The reference flat surface is formed so as to intersect the axis at 90 ° ± α ° when the inclination error is ± α °.
The lateral deviation detection unit includes a displacement sensor that detects the lateral deviation amount of the rotary drum in the axial direction in a non-contact manner at a measurement position on the reference flat surface that is displaced from the axis by a certain amount in the radial direction of the rotary drum. , Pattern forming device. The pattern forming apparatus according to claim 2, wherein
The displacement sensor is composed of two displacement sensors arranged at intervals of about 180 ° around the axis, or three displacement sensors arranged at intervals of about 120 ° about the axis. Pattern forming device. The pattern forming apparatus according to any one of claims 1 to 3,
The mark detection unit,
An objective optical system for enlarging the inside of the detection area at a predetermined magnification,
An image sensor for photoelectrically detecting an enlarged image of the detection area,
An image for obtaining position information based on the detection area of the substrate mark or the reference pattern based on image information output from the image sensor when the substrate mark or the reference pattern appears in the detection area A processing circuit,
A pattern forming apparatus including. The pattern forming apparatus according to claim 4 ,
The arithmetic unit is
In the first state, the measurement information output by the scale measurement unit is stored as first measurement information, and the position information of the reference pattern detected by the mark detection unit is stored in the first position. As information,
In the second state, the measurement information output by the scale measuring unit is stored as second measurement information, and the position information of the reference pattern detected by the mark detecting unit is stored in the second position. A pattern forming device that is obtained as information. The pattern forming apparatus according to claim 5 , wherein
The arithmetic unit further includes
The mark based on the first position information and the second position information detected by the mark detecting unit, and the first measurement information and the second measurement information measured by the scale measuring unit. A pattern forming apparatus for obtaining a magnification error or a magnification coefficient of the magnified image detected by the image sensor of the detection unit. The pattern forming apparatus according to claim 5 , wherein
The arithmetic unit further includes
Based on the first position information and the second position information detected by the mark detection unit, and the lateral deviation amount measured by the lateral deviation detection unit, the image sensor of the mark detection unit detects A pattern forming apparatus for obtaining a rotation error of the magnified image. The pattern forming apparatus according to any one of claims 1 to 7 ,
The mark detection unit,
To the outer peripheral surface of the rotating drum, the surface of the sheet-shaped substrate supported by the outer peripheral surface of the rotating drum, or the surface of the reference sheet plate temporarily fixed to the outer peripheral surface of the rotating drum, the substrate mark or An illumination system for illuminating with an illumination light for detecting the reference pattern,
The pattern forming apparatus, wherein the sheet-shaped substrate is transparent to the illumination light. The pattern forming apparatus according to claim 8 , wherein
The reference pattern is
A plurality is provided at a predetermined angular interval ε in the rotation direction of the outer peripheral surface of the rotating drum,
When the distance in the lengthwise direction of the substrate marks formed on the sheet-like substrate is M and the radius of the outer peripheral surface of the rotating drum is r, the angular interval ε and the interval M are π · r. A pattern forming apparatus set to have a relationship of ε / 180 ≠ M. The pattern forming apparatus according to any one of claims 1 to 9 ,
The pattern forming apparatus, wherein the scale portion is formed over the entire circumference of the outer peripheral surface of the rotary drum near the end portion in the axial direction. The pattern forming apparatus according to any one of claims 1 to 9 ,
The scale portion is mounted coaxially with the axis on an end portion side of the rotary drum in the axial direction, and is formed on an outer peripheral surface of a scale disk that rotates together with the rotary drum.
A pattern forming apparatus in which the relative range of the dimensional difference between the diameters of the rotary drum and the scale disk is set to ± 10% or less.   The pattern forming apparatus according to any one of claims 1 to 9,
  The scale portion is mounted coaxially with the axis on an end portion side of the rotary drum in the axial direction, and is formed on an outer peripheral surface of a scale disk that rotates together with the rotary drum.
  A pattern forming apparatus in which the relative range of the dimensional difference between the diameters of the rotary drum and the scale disk is set within ± 4%. The pattern forming apparatus according to any one of claims 1 to 12 ,
The processing unit is
A pattern forming device, which is a coating device for patterning the surface of the sheet-shaped substrate with a liquid or paste ink, or an exposure device for patterning with light energy. The pattern forming apparatus according to claim 13 , wherein
The exposure apparatus is
A modulator for converting an ultraviolet beam from a laser light source into a drawing beam whose intensity is modulated according to pattern drawing information corresponding to a pattern to be exposed, and a rotary polygon mirror for deflecting the drawing beam one-dimensionally for scanning. An f-θ lens system that receives the drawing beam that is one-dimensionally scanned by the rotating polygonal mirror and condenses it as spot light that is one-dimensionally scanned on the sheet-like substrate,
A pattern forming apparatus, wherein a drawing line formed on the sheet-shaped substrate by scanning the spot light is set substantially parallel to the axis of the rotating drum. The pattern forming apparatus according to claim 14 , wherein
The exposure apparatus is
A pattern forming apparatus having a plurality of the drawing modules arranged at predetermined intervals in a direction of the axis of the rotating drum, when the rotary polygon mirror and the f-θ lens system are used as a drawing module.

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