JP2015018006A - Substrate treatment apparatus, device production system, and device production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To further reduce vibration applied to an exposure unit, and to suitably perform exposure by the exposure unit.SOLUTION: The substrate treatment apparatus includes: a vibration preventing stand 131 provided on an installation face E; an exposure unit 121 provided on the vibration preventing stand 131 and performing exposure treatment to the substrate P to be fed; a position regulation unit 120 as a treatment unit provided on the installation face E, provided in an independent state in which the unit is not brought into contact with the exposure unit 121, and performing treatment to the exposure unit 121; and a driving unit.

Description

  The present invention relates to a substrate processing apparatus, a device manufacturing system, and a device manufacturing method.

  2. Description of the Related Art Conventionally, an exposure apparatus that exposes a device pattern on a substrate provided on a moving stage that moves on a surface plate is known as a substrate processing apparatus (see, for example, Patent Document 1). The surface plate of this exposure apparatus is supported on the base via a mount member having a vibration isolation mechanism. The moving stage moves in the X direction on a movable guide provided on the surface plate. The movable guide is moved in the Y direction on the surface plate by two linear motors provided on the base. The two linear motors are provided on both sides of the base in the X direction, and move the movable guide in the Y direction without contact. In other words, each linear motor has a mover and a stator, and the stator is fixed on the base, while the mover is fixed on both sides in the X direction of the movable guide, and is fixed to the mover. It is in a non-contact state with the child. In the exposure apparatus of Patent Document 1, since the mover and the stator of the linear motor are in a non-contact state, vibration due to disturbance is prevented from being transmitted to the surface plate via the movable guide and the moving stage. .

JP-A-9-219353

  In the exposure apparatus of Patent Document 1, the movable guide is moved in the Y direction on the surface plate by two linear motors. Similarly, the movement stage is moved with respect to the movable guide using the linear motor. Also in this case, the linear motor moves the moving stage in the X direction without contact. However, since the moving stage is moved with respect to the movable guide on the surface plate, vibration generated by the movement of the moving stage may be transmitted to the surface plate.

  The exposure apparatus of Patent Document 1 performs exposure while holding a substrate on a moving stage. However, the present invention is not limited to this configuration, and a film-like substrate is supplied in a continuous state. In some cases, the device pattern is scanned and exposed. In this case, the substrate may vibrate when the substrate is supplied.

  Aspects of the present invention have been made in view of the above problems, and the object thereof is to reduce the vibration applied to the exposure unit and to perform exposure by the exposure unit, and to manufacture a device. A system and a device manufacturing method are provided.

  According to the first aspect of the present invention, an anti-vibration table provided on an installation surface, an exposure unit provided on the anti-vibration table and performing an exposure process on a supplied substrate, and the installation surface There is provided a substrate processing apparatus comprising: a processing unit that is provided on the processing unit and is provided in an independent state (a state in which vibration is insulated) that is not in contact with the exposure unit and that performs processing on the exposure unit.

  According to a second aspect of the present invention, there is provided a substrate processing apparatus according to the first aspect of the present invention, a substrate supply apparatus that supplies the substrate to the substrate processing apparatus, and the substrate processed by the substrate processing apparatus. There is provided a device manufacturing system including a substrate recovery apparatus for recovery.

  According to the third aspect of the present invention, by performing exposure processing on the substrate using the substrate processing apparatus according to the first aspect of the present invention, and processing the exposed substrate, the mask Forming a pattern.

  According to the aspect of the present invention, it is possible to provide a substrate processing apparatus, a device manufacturing system, and a device manufacturing method that can further reduce the vibration applied to the exposure unit and can suitably perform exposure by the exposure unit.

FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to the first embodiment. FIG. 2 is a diagram showing a configuration when the device manufacturing system of the first embodiment is simplified. FIG. 3 is a view showing a part of the configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment. FIG. 4 is a view showing a part of the configuration of the exposure apparatus of the first embodiment shown in FIG. FIG. 5 is a view showing the overall configuration of the exposure unit of the first embodiment. FIG. 6 is a view showing the arrangement of illumination areas and projection areas of the exposure unit shown in FIG. FIG. 7 is a view showing the configuration of the projection optical system of the exposure unit shown in FIG. FIG. 8 is a flowchart showing the device manufacturing method according to the first embodiment. FIG. 9 is a view showing a part of the configuration of the exposure apparatus (substrate processing apparatus) of the second embodiment. FIG. 10 is a view showing the overall arrangement of the exposure unit according to the second embodiment of FIG. FIG. 11 is a view showing the overall arrangement of the exposure unit according to the third embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the components can be made without departing from the scope of the present invention.

[First Embodiment]
The substrate processing apparatus of the first embodiment is an exposure apparatus that performs an exposure process on a substrate, and the exposure apparatus is incorporated in a device manufacturing system that manufactures a device by performing various processes on a substrate after exposure. First, a device manufacturing system will be described.

<Device manufacturing system>
FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to the first embodiment. A device manufacturing system 1 shown in FIG. 1 is a line (flexible display manufacturing line) for manufacturing a flexible display as a device. Examples of the flexible display include an organic EL display. The device manufacturing system 1 is configured such that the substrate P is sent out from a supply roll FR1 obtained by winding the flexible substrate P in a roll shape, and various processes are continuously performed on the sent out substrate P. In addition, a so-called roll-to-roll method is adopted in which the substrate P after processing is wound as a flexible device on a collecting roll FR2. In the device manufacturing system 1 according to the first embodiment, a substrate P that is a film-like sheet is sent out from the supply roll FR1, and the substrates P sent out from the supply roll FR1 are sequentially supplied to n processing apparatuses U1, U2. , U3, U4, U5,..., Un, and the winding roll FR2 is shown as an example. First, the board | substrate P used as the process target of the device manufacturing system 1 is demonstrated.

  For the substrate P, for example, a foil (foil) made of a metal or an alloy such as a resin film or stainless steel is used. Examples of the resin film material include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Includes one or more. When making a flexible display panel, touch panel, color filter, electromagnetic wave prevention filter, etc. as an electronic device, the substrate P is a resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) having a thickness of about 200 μm to 25 μm. Sheets are used.

  As the substrate P, for example, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that deformation amounts due to heat received in various processes applied to the substrate P can be substantially ignored. Further, when an inorganic filler such as titanium oxide, zinc oxide, alumina, silicon oxide or the like is mixed into the resin film serving as a base, the thermal expansion coefficient can be reduced. In addition, the substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, and the resin film or a metal layer such as aluminum or copper is formed on the ultrathin glass. A laminate in which (foil) or the like is bonded may be used.

  By the way, the flexibility of the substrate P refers to the property that the substrate P can be bent without being broken or broken even if a force of its own weight is applied to the substrate P. In addition, flexibility includes a property of bending by a force of about its own weight. The degree of flexibility varies depending on the material, size, and thickness of the substrate P, the layer structure formed on the substrate P, or the environment such as temperature and humidity. In any case, when the substrate P is correctly wound around various transport rollers, rotary drums and other members for transport direction change provided in the transport path in the device manufacturing system 1 according to the present embodiment, the substrate P buckles and folds. If the substrate P can be smoothly transported without being attached or damaged (breaking or cracking), it can be said to be in the range of flexibility.

  The substrate P thus configured becomes a supply roll FR1 by being wound in a roll shape, and this supply roll FR1 is mounted on the device manufacturing system 1. The device manufacturing system 1 on which the supply roll FR1 is mounted repeatedly executes various processes for manufacturing devices on the substrate P sent out from the supply roll FR1. For this reason, the processed substrate P is in a state where a plurality of devices are connected. That is, the substrate P sent out from the supply roll FR1 is a multi-sided substrate. The substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may have a fine partition structure (uneven structure) for precise patterning formed on the surface.

  The processed substrate P is recovered as a recovery roll FR2 by being wound into a roll. The collection roll FR2 is attached to a dicing device (not shown). The dicing apparatus to which the collection roll FR2 is mounted divides the processed substrate P for each device (dicing) to form a plurality of devices. Regarding the dimensions of the substrate P, for example, the dimension in the width direction (short direction) is about 10 cm to 2 m, and the dimension in the length direction (long direction) is 10 m or more. In addition, the dimension of the board | substrate P is not limited to an above-described dimension.

  The device manufacturing system 1 will be described with reference to FIG. In FIG. 1, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is shown. The X direction is a direction in which the supply roll FR1 and the recovery roll FR2 are connected in a horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane. The Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

  The device manufacturing system 1 includes a substrate supply device 2 that supplies a substrate P, processing devices U1 to Un that perform various processes on the substrate P supplied by the substrate supply device 2, and processing is performed by the processing devices U1 to Un. The substrate recovery apparatus 4 that recovers the processed substrate P and the host controller 5 that controls each device of the device manufacturing system 1 are provided.

  A supply roll FR1 is rotatably mounted on the substrate supply apparatus 2. The substrate supply apparatus 2 includes a driving roller R1 that sends out the substrate P from the mounted supply roll FR1, and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R1 rotates while sandwiching both front and back surfaces of the substrate P, and feeds the substrate P to the processing apparatuses U1 to Un by feeding the substrate P in the transport direction from the supply roll FR1 to the collection roll FR2. At this time, the edge position controller EPC1 moves the substrate P in the width direction so that the position at the end (edge) in the width direction of the substrate P is within a range of about ± 10 μm to several tens μm with respect to the target position. To correct the position of the substrate P in the width direction.

  A recovery roll FR2 is rotatably mounted on the substrate recovery apparatus 4. The substrate recovery apparatus 4 includes a drive roller R2 that draws the processed substrate P toward the recovery roll FR2, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction). The substrate collection device 4 rotates while sandwiching the front and back surfaces of the substrate P by the driving roller R2, pulls the substrate P in the transport direction, and rotates the collection roll FR2, thereby winding the substrate P. At this time, the edge position controller EPC2 is configured in the same manner as the edge position controller EPC1, and corrects the position in the width direction of the substrate P so that the end portion (edge) in the width direction of the substrate P does not vary in the width direction. .

  The processing device U1 is a coating device that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling material, a UV curable resin liquid, a photosensitive plating reducing solution, or the like is used. The processing apparatus U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side in the transport direction of the substrate P. The coating mechanism Gp1 includes a pressure drum DR1 around which the substrate P is wound, and a coating roller DR2 facing the pressure drum DR1. The coating mechanism Gp1 sandwiches the substrate P between the pressure drum roller DR1 and the coating roller DR2 in a state where the supplied substrate P is wound around the pressure drum roller DR1. Then, the application mechanism Gp1 applies the photosensitive functional liquid by the application roller DR2 while rotating the impression cylinder DR1 and the application roller DR2 to move the substrate P in the transport direction. The drying mechanism Gp2 blows drying air such as hot air or dry air, removes the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid. A photosensitive functional layer is formed on the substrate P.

  The processing device U2 heats the substrate P transported from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. Device. The processing apparatus U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 is provided with a plurality of rollers and a plurality of air turn bars therein, and the plurality of rollers and the plurality of air turn bars constitute a transport path for the substrate P. The plurality of rollers are provided in rolling contact with the back surface of the substrate P, and the plurality of air turn bars are provided in a non-contact state on the surface side of the substrate P. The plurality of rollers and the plurality of air turn bars are arranged to form a meandering transport path so as to lengthen the transport path of the substrate P. The substrate P passing through the heating chamber HA1 is heated to a predetermined temperature while being transported along a meandering transport path. The cooling chamber HA2 cools the substrate P to the environmental temperature so that the temperature of the substrate P heated in the heating chamber HA1 matches the environmental temperature of the subsequent process (processing apparatus U3). The cooling chamber HA2 is provided with a plurality of rollers, and the plurality of rollers are arranged in a meandering manner in order to lengthen the conveyance path of the substrate P, similarly to the heating chamber HA1. The substrate P passing through the cooling chamber HA2 is cooled while being transferred along a meandering transfer path. A driving roller R3 is provided on the downstream side in the transport direction of the cooling chamber HA2, and the driving roller R3 rotates while sandwiching the substrate P that has passed through the cooling chamber HA2, thereby moving the substrate P toward the processing apparatus U3. Supply.

  The processing apparatus (substrate processing apparatus) U3 is an exposure apparatus that projects and exposes a pattern such as a circuit for a display panel or wiring on the substrate P having a photosensitive functional layer formed on the surface supplied from the processing apparatus U2. It is. Although details will be described later, the processing device U3 illuminates the transmissive mask M with an illumination light beam, and a projection light beam obtained by illuminating the illumination light beam with the mask M on a part of the outer peripheral surface of the rotary drum 25. Projection exposure is performed on the substrate P to be wound. The processing apparatus U3 includes a driving roller R4 that sends the substrate P supplied from the processing apparatus U2 to the downstream side in the transport direction, and an edge position controller EPC3 that adjusts the position of the substrate P in the width direction (Y direction). The drive roller R4 rotates while pinching both front and back surfaces of the substrate P, and feeds the substrate P toward the exposure position by sending the substrate P downstream in the transport direction. The edge position controller EPC3 is configured in the same manner as the edge position controller EPC1, and corrects the position in the width direction of the substrate P so that the width direction of the substrate P at the exposure position becomes the target position. Further, the processing apparatus U3 has two sets of drive rollers R5 and R6 that send the substrate P to the downstream side in the transport direction in a state where the slack DL is given to the exposed substrate P. The two sets of drive rollers R5 and R6 are arranged at a predetermined interval in the transport direction of the substrate P. The driving roller R5 rotates while sandwiching the upstream side of the substrate P to be transported, and the driving roller R6 rotates while sandwiching the downstream side of the substrate P to be transported, thereby directing the substrate P toward the processing apparatus U4. And supply. At this time, since the slack DL is given to the substrate P, it is possible to absorb fluctuations in the conveyance speed that occur downstream of the drive roller R6 in the conveyance direction, and the influence of the exposure process on the substrate P due to fluctuations in the conveyance speed. Can be trimmed. In addition, in the processing apparatus U3, an alignment microscope that detects an alignment mark or the like formed in advance on the substrate P in order to relatively align (align) a partial image of the mask pattern of the mask M with the substrate P. AM1 and AM2 are provided.

  The processing apparatus U4 is a wet processing apparatus that performs wet development processing, electroless plating processing, and the like on the exposed substrate P conveyed from the processing apparatus U3. The processing apparatus U4 has three processing tanks BT1, BT2, and BT3 that are hierarchized in the vertical direction (Z direction) and a plurality of rollers that transport the substrate P therein. The plurality of rollers are arranged so as to serve as a conveyance path through which the substrate P sequentially passes through the three processing tanks BT1, BT2, and BT3. A driving roller R7 is provided on the downstream side in the transport direction of the processing tank BT3. The driving roller R7 rotates while sandwiching the substrate P that has passed through the processing tank BT3, so that the substrate P is directed toward the processing apparatus U5. Supply.

  Although illustration is omitted, the processing apparatus U5 is a drying apparatus that dries the substrate P transported from the processing apparatus U4. The processing apparatus U5 adjusts the moisture content adhering to the substrate P wet-processed in the processing apparatus U4 to a predetermined moisture content. The substrate P dried by the processing apparatus U5 is transferred to the processing apparatus Un through several processing apparatuses. Then, after being processed by the processing device Un, the substrate P is wound up on the recovery roll FR2 of the substrate recovery device 4.

  The host control device 5 performs overall control of the substrate supply device 2, the substrate collection device 4, and the plurality of processing devices U1 to Un. The host control device 5 controls the substrate supply device 2 and the substrate recovery device 4 to transport the substrate P from the substrate supply device 2 toward the substrate recovery device 4. Further, the host control device 5 controls the plurality of processing devices U <b> 1 to Un to perform various processes on the substrate P while synchronizing with the transport of the substrate P.

  In the device manufacturing system 1 of the first embodiment, an example in which the substrate P sent out from the supply roll FR1 is sequentially wound around the collection roll FR2 through n processing apparatuses U1 to Un. Although shown, it is not restricted to this structure. For example, the device manufacturing system 1 may be configured such that the substrate P sent out from the supply roll FR1 is wound around the collection roll FR2 via one processing apparatus. At this time, when different processing is performed on the substrate P, the substrate P is supplied again to different processing devices using the substrate supply device 2 and the substrate recovery device 4.

<Simplified device manufacturing system>
Next, a device manufacturing system 1 that is a simplified version of the device manufacturing system 1 of FIG. 1 will be described with reference to FIG. FIG. 2 is a diagram showing a configuration when the device manufacturing system of the first embodiment is simplified. As shown in FIG. 2, the simplified device manufacturing system 1 includes a substrate supply device 2, a processing device U3 (hereinafter referred to as an exposure device) as an exposure device, a substrate recovery device 4, and a host control device 5. Have. 2 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other, and is an orthogonal coordinate system similar to that in FIG. In the simplified device manufacturing system 1, the substrate supply apparatus 2 has a configuration in which the edge position controller EPC1 is omitted. This is because the exposure apparatus U3 is provided with an edge position controller EPC3. First, the substrate supply apparatus 2 will be described with reference to FIG.

<Substrate supply device>
The substrate supply device 2 includes a first bearing portion 111 on which the supply roll FR1 is mounted, and a first lifting mechanism 112 that moves the first bearing portion 111 up and down. Further, the substrate supply device 2 has an approach angle detection unit 114, and the approach angle detection unit 114 is connected to the host control device 5. Here, in the first embodiment, the host control device 5 functions as a control device (control unit) of the substrate supply device 2. In addition, as a control device of the substrate supply device 2, a lower control device that controls the substrate supply device 2 may be provided, and the lower control device may control the substrate supply device 2.

  The first bearing portion 111 rotatably supports the supply roll FR1. The supply roll FR1 pivotally supported by the first bearing portion 111 has a winding diameter of the supply roll FR1 corresponding to the amount of the substrate P fed out when the substrate P is fed (sent out) toward the exposure apparatus U3. It gets smaller. For this reason, the position at which the substrate P is sent out from the supply roll FR1 changes in accordance with the feed amount at which the substrate P is sent out.

  The first elevating mechanism 112 is provided between the installation surface E and the first bearing portion 111. The first elevating mechanism 112 moves the first bearing portion 111 in the Z direction (vertical direction) together with the supply roll FR1. The first elevating mechanism 112 is connected to the host controller 5, and the host controller 5 moves the first bearing portion 111 in the Z direction by the first elevating mechanism 112 so that the supply roll FR <b> 1 is predetermined. Can be in position.

  The approach angle detector 114 detects the approach angle θ1 of the substrate P that enters a transport roller 127 of the exposure apparatus U3 described later. The approach angle detection unit 114 is provided around the transport roller 127. Here, the approach angle θ1 is an angle formed by a straight line extending in the vertical direction passing through the central axis of the transport roller 127 (parallel to the Z axis) and the substrate P on the upstream side of the transport roller 127 in the XZ plane. The approach angle detection unit 114 outputs the detection result to the connected host control device 5.

  The host controller 5 controls the first elevating mechanism 112 based on the detection result of the approach angle detector 114. Specifically, the host controller 5 controls the first elevating mechanism 112 so that the approach angle θ1 becomes a predetermined target approach angle. That is, when the delivery amount of the substrate P from the supply roll FR1 increases, the winding diameter of the supply roll FR1 decreases, so that the entry angle θ1 with respect to the target entry angle increases. For this reason, the host controller 5 moves the first elevating mechanism 112 downward (lowers) in the Z direction, thereby reducing the approach angle θ1 and correcting the approach angle θ1 to be the target approach angle. . Thus, the host controller 5 performs feedback control on the first elevating mechanism 112 based on the detection result of the approach angle detection unit 114 so that the approach angle θ1 becomes the target approach angle. For this reason, since the board | substrate supply apparatus 2 can always supply the board | substrate P with the target approach angle with respect to the conveyance roller 127, it can reduce the influence given to the board | substrate P by the change of approach angle (theta) 1. The feedback control may be any control such as P control, PI control, and PID control.

<Exposure device (substrate processing device)>
Next, the exposure apparatus U3 shown in FIG. 2 will be described with reference to FIG. The exposure apparatus U3 includes a position adjustment unit 120, an exposure unit 121, a drive unit 122 (see FIG. 3), a pressing mechanism 130, and a vibration isolation table 131. The vibration isolation table 131 is provided on the installation surface E, and reduces the transmission of vibration (so-called floor vibration) from the installation surface E to the exposure unit 121 main body. The position adjustment unit 120 is provided on the installation surface E, and includes the edge position controller EPC3 shown in FIG. The position adjustment unit 120 is provided adjacent to the substrate supply apparatus 2 in the X direction. The exposure unit 121 is provided on the vibration isolation table 131 and is provided on the opposite side of the substrate supply apparatus 2 with the position adjustment unit 120 in the X direction. The drive unit 122 (see FIG. 3) is provided on the installation surface E, and is provided adjacent to the exposure unit 121 in the Y direction. That is, the position adjustment unit 120, the exposure unit 121, and the drive unit 122 are provided at different positions on the installation surface E. Further, the exposure unit 121, the position adjustment unit 120, and the drive unit 122 (see FIG. 3) are in a mechanically non-coupled state (a non-contact independent state).

  From the above, the position adjustment unit 120 and the drive unit 122 are provided on the installation surface E, while the exposure unit 121 is provided on the installation surface E via the vibration isolation table 131. For this reason, the exposure unit 121 is in a different vibration mode from the position adjustment unit 120 and the drive unit 122. In other words, the exposure unit 121 is provided in a state where it is cut off from the position adjustment unit 120 and the drive unit 122 in terms of vibration propagation (a state in which vibrations hardly propagate to each other, that is, a state in which vibrations are effectively insulated). .

  In addition, the exposure apparatus U3 includes a first substrate detection unit 123 and a second substrate detection unit 124 that detect the position of the substrate P. The first substrate detection unit 123 and the second substrate detection unit 124 are connected to the host control device 5. In the exposure apparatus U3 as well, as in the substrate supply apparatus 2, the host control apparatus 5 functions as a control apparatus (control unit) of the exposure apparatus U3. In addition, as a control apparatus of the exposure apparatus U3, a low-order control apparatus that controls the exposure apparatus U3 may be provided, and the low-order control apparatus may control the exposure apparatus U3.

<Position adjustment unit>
As shown in FIG. 2, the position adjustment unit 120 includes a base 125, the edge position controller EPC <b> 3 (width movement mechanism), and a fixed roller 126. The base 125 is provided on the installation surface E and supports the edge position controller EPC3 and the fixed roller 126. The base 125 may be a vibration isolation table having a vibration isolation function. The base 125 is provided with a base position adjustment mechanism 128 that adjusts the position of the base 125 in the Y direction or the rotational direction around the Z axis. The base position adjustment mechanism 128 is connected to the host control device 5, and the host control device 5 controls the base position adjustment mechanism 128, whereby the edge position controller EPC 3 and the fixed roller 126 installed on the base 125. Can be adjusted together. That is, the base position adjustment mechanism 128 functions as a roller position adjustment mechanism that adjusts the position of the fixed roller 126 in the Y direction with respect to the exposure unit 121.

  The edge position controller EPC3 is movable on the base 125 in the width direction (Y direction) of the substrate P. The edge position controller EPC3 has a plurality of rollers including a transport roller 127 provided on the most upstream side in the transport direction in which the substrate P is transported. The transport roller 127 guides the substrate P supplied from the substrate supply device 2 into the position adjustment unit 120. The edge position controller EPC3 is connected to the host controller 5 and controlled by the host controller 5 based on the detection result of the first substrate detection unit 123.

  The fixed roller 126 guides the substrate P, whose position has been adjusted in the width direction by the edge position controller EPC3, toward the exposure unit 121. The fixed roller 126 is rotatable and its position with respect to the base 125 is fixed. Therefore, the position of the substrate P entering the fixed roller 126 in the width direction can be adjusted by moving the substrate P in the width direction by the edge position controller EPC3.

  The first substrate detection unit 123 detects the position in the width direction of the substrate P transported to the fixed roller 126 from the edge position controller EPC3. The first substrate detection unit 123 is fixed on the base 125. For this reason, the first substrate detection unit 123 is in the same vibration mode as the edge position controller EPC3 and the fixed roller 126. The first substrate detection unit 123 detects the position of the end (edge) of the substrate P that is in rolling contact with the fixed roller 126. The first substrate detection unit 123 outputs the detection result to the connected host control device 5.

  The second substrate detection unit 124 detects the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121. The second substrate detection unit 124 is fixed on a vibration isolation table 131 on which the exposure unit 121 is installed. For this reason, the second substrate detection unit 124 is in the same vibration mode as the exposure unit 121. The second substrate detection unit 124 is provided on the introduction side where the substrate P of the exposure unit 121 is introduced. Specifically, the second substrate detection unit 124 is provided adjacent to the guide roller 28 at a position on the upstream side of the most upstream guide roller 28 in the transport direction provided in the exposure unit 121. The second substrate detector 124 detects the position of the substrate P supplied to the exposure unit 121 in the width direction (Y direction) and the vertical direction (Z direction). The second substrate detection unit 124 outputs the detection result to the connected host controller 5.

  The host controller 5 controls the edge position controller EPC3 based on the detection result of the first substrate detector 123. Specifically, the host controller 5 determines the center in the Y direction obtained from the positions of both end portions (both edges in the Y direction) of the substrate P that is in rolling contact (enters) with the fixed roller 126 detected by the first substrate detection unit 123. A difference between the position and a first target position (target center position) defined in advance is calculated. Then, the host controller 5 feedback-controls the edge position controller EPC3 so that the difference becomes zero, moves the substrate P in the width direction, and sets the center position in the width direction of the substrate P with respect to the fixed roller 126 as the first position. Correct to the target center position. For this reason, the edge position controller EPC3 can maintain the position in the width direction of the substrate P with respect to the fixed roller 126 at the first target position, so that the positional deviation in the width direction of the substrate P with respect to the fixed roller 126 can be reduced. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

  The host controller 5 controls the base position adjustment mechanism 128 based on the detection result of the second substrate detection unit 124. Specifically, the host controller 5 calculates the difference between the center position obtained from the positions of both ends in the width direction of the substrate P detected by the second substrate detection unit 124 and the second target center position defined in advance. . Then, the host controller 5 feedback-controls the base position adjustment mechanism 128 so that the difference becomes zero, and adjusts the position of the base 125 by the base position adjustment mechanism 128, thereby The position of the fixed roller 126 in the Y direction is adjusted. At this time, the host controller 5 adjusts the position of the fixed roller 126 so that the substrate P is not twisted and does not shift in the width direction. For example, the host controller 5 adjusts the position so that the axial direction of the fixed roller 126 is parallel to the axial direction of the guide roller 28. Then, the host controller 5 adjusts the position of the fixed roller 126 in the Y direction or the rotation direction around the Z axis by the base position adjustment mechanism 128, thereby the center in the width direction of the substrate P supplied to the exposure unit 121. Since the position can be maintained at the second target center position, the twist of the substrate P and the positional deviation in the width direction can be reduced. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

  Thus, the position adjustment unit 120 can correct the position in the width direction of the substrate P supplied to the fixed roller 126 to the first target position, and the position of the substrate P supplied to the guide roller 28 of the exposure unit 121 is the first position. Two target positions can be corrected.

  In the first embodiment, the position of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 is corrected. However, the configuration is not limited to this, and for example, the substrate P is supplied from the substrate supply device 2 to the position adjustment unit 120. The position of the substrate P may be corrected. In this case, a substrate detection unit is provided on the upstream side in the conveyance direction of the conveyance roller 127, and a roll position adjustment mechanism that adjusts the position of the supply roll FR1 is provided. And the high-order control apparatus 5 may adjust supply roll FR1 by controlling a roll position adjustment mechanism based on the detection result of a board | substrate detection part. Similarly, the position of the substrate P supplied from the exposure unit 121 to the substrate recovery apparatus 4 may be corrected.

<Exposure unit>
Next, the configuration of the exposure unit of the exposure apparatus U3 according to the first embodiment will be described with reference to FIGS. FIG. 3 is a view showing a part of the configuration of the exposure apparatus (substrate processing apparatus) according to the first embodiment, and FIG. 4 is a view showing the structure of the drive unit of the substrate support mechanism 12 in FIG. FIG. 5 is a view showing the overall configuration of the exposure unit of the first embodiment. FIG. 6 is a view showing the arrangement of illumination areas and projection areas of the exposure unit shown in FIG. FIG. 7 is a view showing the configuration of the projection optical system of the exposure unit shown in FIG.

  An exposure unit 121 shown in FIGS. 2 to 5 is a so-called scanning exposure apparatus, and a substrate P is transported in a transport direction (a plurality of guide rollers 28 constituting the substrate transport mechanism 12 and a rotatable cylindrical support drum 25 ( The image of the mask pattern formed on the planar mask M is projected and exposed on the surface of the substrate P while being conveyed in the scanning direction. 3 and 4 are views of the exposure unit 121 viewed from the −X side, and FIGS. 5 and 7 are orthogonal coordinate systems in which the X direction, the Y direction, and the Z direction are orthogonal. 1 is the same orthogonal coordinate system.

  First, the mask M used in the exposure unit 121 will be described. The mask M is created as a transmission type planar mask in which a mask pattern is formed with a light shielding layer such as chrome on one surface (mask surface P1) of a glass plate with good flatness, and is held on a mask stage 21 described later. Used in the state. The mask M has a pattern non-formation region in which no mask pattern is formed, and is attached on the mask stage 21 in the pattern non-formation region. The mask M can be released with respect to the mask stage 21.

  Note that the mask M may be formed with the whole or a part of the panel pattern corresponding to one display device, or may be a multi-surface pattern in which panel patterns corresponding to a plurality of display devices are formed. May be. Further, a plurality of panel patterns may be repeatedly formed on the mask M in the scanning direction (X direction) of the mask M, or small panel patterns may be repeatedly formed in a direction orthogonal to the scanning direction (Y direction). A plurality may be formed. Further, the mask M may be formed with a panel pattern for the first display device and a panel pattern for the second display device having a size different from that of the first display device.

  As shown in FIGS. 2 to 5, the exposure unit 121 installed on the vibration isolation table 131 includes a mask holding mechanism 11 that supports the apparatus frame 132 and the mask stage 21 in addition to the alignment microscopes AM <b> 1 and AM <b> 2 described above. (FIG. 5), a substrate support mechanism 12, a projection optical system PL, and a low-order control device 16. The exposure unit 121 receives the illumination light beam EL1 from the illumination mechanism 13 and transmits the transmitted light (imaging light beam) generated from the mask pattern of the mask M held by the mask holding mechanism 11 to the substrate support mechanism 12. Projection is performed on the substrate P supported by the support drum 25, and a projection image of a part of the mask pattern is formed on the surface of the substrate P.

  The lower control device 16 controls each part of the exposure apparatus U3 and causes each part to execute processing. The lower level control device 16 may be a part or all of the higher level control device 5 of the device manufacturing system 1. Further, the lower level control device 16 may be a device controlled by the higher level control device 5 and different from the higher level control device 5. The lower control device 16 includes, for example, a computer.

  The vibration isolation table 131 is provided on the installation surface E and supports the device frame 132. Specifically, as shown in FIG. 3, the vibration isolation table 131 includes a first vibration isolation table 131a provided outside in the Y direction and a second vibration isolation table provided inside the first vibration isolation table 131a. 131b.

  The apparatus frame 132 is provided on the first vibration isolation table 131a and the second vibration isolation table 131b, and supports the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL. The apparatus frame 132 includes a first frame 132 a that supports the mask holding mechanism 11, the illumination mechanism 13, and the projection optical system PL, and a second frame 132 b that supports the substrate support mechanism 12. The first frame 132a and the second frame 132b are provided independently, and are arranged so that the first frame 132a covers the second frame 132b. The first frame 132a is provided on the first vibration isolation table 131a, and the second frame 132b is provided on the second vibration isolation table 131b.

  The first frame 132a includes a first lower frame 135 provided on the first vibration isolation base 131a, a first upper frame 136 provided above the first lower frame 135 in the Z direction, and a first upper frame 136. And an arm portion 137 standing upright. The first lower frame 135 has a leg portion 135a standing on the first vibration isolation base 131a and an upper surface portion 135b supported by the leg portion 135a, and the projection optical system via the holding member 143 on the upper surface portion 135b. System PL is supported. When viewed in the XY plane, the holding member 143 is kinematically supported by washer members 145 made of metal balls or the like disposed at three locations on the upper surface portion 135b. The leg portion 135a is arranged at a predetermined portion so that a rotation axis AX2 of the support drum 25 described later is inserted in the Y direction.

  Similarly to the first lower frame 135, the first upper frame 136 also has a leg portion 136a standing on the upper surface portion 135b and an upper surface portion 136b supported by the leg portion 136a, and holds the mask on the upper surface portion 136b. The mechanism 11 (mask stage 21) is supported. The arm part 137 stands on the upper surface part 136 b and supports the illumination mechanism 13 so that the illumination mechanism 13 is positioned above the mask holding mechanism 11.

  The second frame 132b includes a lower surface portion 139 provided on the first vibration isolation table 131a, and a pair of bearing portions 140 that are provided on the lower surface portion 139 so as to stand apart in the Y direction. The pair of bearing portions 140 is provided with an air bearing 141 that pivotally supports the rotation axis AX2 that is the rotation center of the support drum 25.

  The mask holding mechanism 11 transmits power to a mask stage (mask holding member) 21 for holding the mask M, a moving mechanism (linear guide, air bearing, etc.) (not shown) for moving the mask stage 21, and a moving mechanism. And a transmission member 23 for the purpose. The mask stage 21 is configured in a frame shape surrounding a pattern formation region of the mask M, and an upper surface portion 136b of the first upper frame 136 by a mask side drive portion (drive source such as a motor) 22 provided in the drive unit 122. In the X direction which is the scanning direction. The driving force transmitted from the transmission member 23 is used for linear driving of the mask stage 21 by the moving mechanism.

  In this embodiment, since the mask stage 21 linearly moves in the X direction for scanning exposure, the mask side drive unit (drive source) 22 is linearly fixed to the column frame 146 so as to extend in the X direction. The motor includes a magnetic track (stator) of the motor, and the transmission member 23 includes a linear motor coil unit (movable element) facing the magnet track with a certain gap. In FIG. 3, the holding member 143 that supports the projection optical system PL on the apparatus frame 132 side corresponds to the exposure position by the projection optical system PL on the outer peripheral surface of the support drum 25 (or the surface of the substrate P). A displacement sensor SG1 for measuring a change in the height of the surface and a displacement sensor SG2 for measuring a change in the position of the mask M in the Z direction from the lower side of the mask stage 21 are provided.

  On the other hand, as shown in FIGS. 2 and 3, the support drum 25 that supports the substrate P by winding it around almost half of the circumference is a substrate-side drive unit (drive of a rotary motor or the like) provided in the drive unit 122 shown in FIG. 3. Rotate by source 26. As shown also in FIG. 5, the support drum 25 is formed in a cylindrical shape having an outer peripheral surface (circumferential surface) having a curvature radius Rfa centered on the rotation axis AX2 extending in the Y direction. Here, a plane including the center line of the rotation axis AX2 and parallel to the YZ plane is defined as a center plane CL. A part of the circumferential surface of the support drum 25 is a support surface P2 that supports the substrate P with a predetermined tension. That is, the support drum 25 supports the substrate P in a stable cylindrical curved surface by winding the substrate P around the support surface P2 with a constant tension.

  Each air bearing 141 that pivotally supports the rotation shaft AX2 by the bearing portions 140 on both sides rotatably supports the rotation shaft AX2 in a non-contact state. In this embodiment, the rotary shaft AX2 is supported by the air bearing 141 at both ends of the support drum 25. However, a normal bearing using a ball or needle processed with high accuracy may be used. As shown in FIGS. 2 and 5, the plurality of guide rollers 28 are respectively provided on the upstream side and the downstream side in the transport direction of the substrate P with the support drum 25 interposed therebetween. For example, four guide rollers 28 are provided, two on the upstream side in the transport direction and two on the downstream side in the transport direction.

  Therefore, the substrate support mechanism 12 guides the substrate P conveyed from the position adjustment unit 120 to the support drum 25 by the two guide rollers 28. The substrate support mechanism 12 rotates the support drum 25 through the rotation axis AX2 by the substrate-side drive unit 26, thereby supporting the substrate P introduced into the support drum 25 while supporting the substrate P on the support surface P2 of the support drum 25. It is conveyed toward the roller 28. The substrate support mechanism 12 guides the substrate P conveyed to the guide roller 28 toward the substrate recovery device 4.

  Here, an example of the configuration of the substrate-side drive unit 26 will be described with reference to FIG. In FIG. 4, a disk-like scale plate 25c having substantially the same diameter as the radius Rfa of the outer peripheral surface 25a of the support drum 25 is fixed coaxially with the rotation axis AX2 on at least one end side of the support drum 25 around which the substrate P is wound. Has been. A diffraction grating is formed at a constant pitch in the circumferential direction on the outer peripheral surface of the scale plate 25c, and the rotation angle of the support drum 25 or the support drum 25 is detected by optically detecting the diffraction grating by the read head EH for encoder measurement. The amount of movement of the surface 25a of the drum 25 in the circumferential direction is measured. Information on the rotation angle of the support drum 25 measured by the read head EH is also used as a feedback signal for servo control of the motor that rotates the support drum 25. In FIG. 4, the displacement sensor SG <b> 1 is arranged to measure the displacement (radial displacement) of the height position of the surface of the substrate P, but the region on the end side of the support drum 25 that is not covered with the substrate P. You may arrange | position so that the displacement (radial direction displacement) of the height position of the surface of 25b may be measured.

  On the end side of the rotary shaft AX2 supported by the air bearing 141, a rotor RT in which a magnet unit MUr of a rotary motor that generates torque around the rotary shaft AX2 is annularly arranged and an axial direction on the rotary shaft AX2 And a magnet unit MUs for a voice coil motor that gives a thrust of. On the stator side fixed to the support frame 146 in FIG. 3, a coil unit CUr disposed so as to face the magnet unit MUr around the rotor RT, and a coil wound so as to surround the magnet unit MUs. Units CUs are provided. With such a configuration, the support drum 25 (and the scale plate 25c) integrated with the rotation shaft AX2 can be smoothly rotated by the torque applied to the rotor RT.

  Further, since the voice coil motor (MUs, CUs) generates thrust in the direction of the rotation axis AX2 (Y direction) even when the support drum 25 is rotating, the support drum 25 (and the scale plate 25c) is moved to Y. Can be finely moved in the direction. Thereby, a minute positional shift in the Y direction of the substrate P during scanning exposure can be sequentially corrected.

  4 is provided with a displacement sensor DT1 for measuring the displacement in the Y direction of the end surface Tp of the rotation axis AX2, or a displacement sensor DT2 for measuring the displacement in the Y direction of the end surface of the scale plate 25c. The change in position of the support drum 25 in the Y direction can be sequentially measured in real time. Therefore, if the voice coil motors (MUs, CUs) are servo-controlled based on the measurement signals from the displacement sensors DT1, DT2, the position of the support drum 25 in the Y direction can be accurately determined. .

  Here, as shown in FIG. 6, the exposure apparatus U3 of the first embodiment is an exposure apparatus that assumes a so-called multi-lens system. 6 shows a plan view (left view of FIG. 6) of the illumination area IR on the mask M held on the mask stage 21 as viewed from the −Z side, and on the substrate P supported by the support drum 25. A plan view of the projection area PA viewed from the + Z side (the right view of FIG. 6) is shown. A symbol Xs in FIG. 6 indicates the scanning direction (rotating direction) of the mask stage 21 and the support drum 25. The multi-lens exposure apparatus U3 illuminates a plurality of (for example, six in the first embodiment) illumination areas IR1 to IR6 on the mask M with the illumination light beam EL1, respectively, and each illumination light beam EL1 corresponds to each illumination area IR1 to IR6. A plurality of projection light beams EL2 obtained by illuminating the projection light are projected and exposed to a plurality of projection areas PA1 to PA6 (for example, six in the first embodiment) on the substrate P.

  First, a plurality of illumination areas IR1 to IR6 illuminated by the illumination mechanism 13 will be described. As shown in FIG. 6, the plurality of illumination areas IR1 to IR6 are arranged in two rows in the scanning direction of the substrate P across the center plane CL, and the first illumination area IR1 on the mask M on the upstream side in the scanning direction, The third illumination region IR3 and the fifth illumination region IR5 are arranged, and the second illumination region IR2, the fourth illumination region IR4, and the sixth illumination region IR6 are arranged on the mask M on the downstream side in the scanning direction. Each illumination region IR1 to IR6 is an elongated trapezoidal region having parallel short sides and long sides extending in the width direction (Y direction) of the mask M. At this time, each of the trapezoidal illumination areas IR1 to IR6 is an area where the short side is located on the center plane CL side and the long side is located outside. The odd-numbered illumination areas IR1, IR3, and IR5 are arranged at a predetermined interval in the Y direction. Further, the even-numbered illumination areas IR2, IR4, and IR6 are arranged at a predetermined interval in the Y direction. At this time, the second illumination region IR2 is disposed between the first illumination region IR1 and the third illumination region IR3 in the Y direction. Similarly, the third illumination region IR3 is disposed between the second illumination region IR2 and the fourth illumination region IR4 in the Y direction. The fourth illumination region IR4 is disposed between the third illumination region IR3 and the fifth illumination region IR5 in the Y direction. The fifth illumination region IR5 is disposed between the fourth illumination region IR4 and the sixth illumination region IR6 in the Y direction. Each illumination region IR1 to IR6 is arranged so that the triangular portions of the oblique sides of adjacent trapezoidal illumination regions overlap each other when viewed from the scanning direction of the mask M. In the first embodiment, the illumination areas IR1 to IR6 are trapezoidal areas, but may be rectangular areas.

  Further, the mask M has a pattern formation region A3 where a mask pattern is formed and a pattern non-formation region A4 where a mask pattern is not formed. The pattern non-formation region A4 is a low reflection region that absorbs the illumination light beam EL1, and is arranged so as to surround the pattern formation region A3 in a frame shape. The first to sixth illumination regions IR1 to IR6 are arranged so as to cover the entire width of the pattern formation region A3 in the Y direction.

  The illumination mechanism 13 emits an illumination light beam EL1 that is illuminated by the mask M. The illumination mechanism 13 includes a light source device and an illumination optical system. The light source device includes a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). Illumination light emitted from the light source device includes, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (Wavelength 193 nm). The illumination light emitted from the light source device has a uniform illuminance distribution and is guided to the illumination optical system via a light guide member such as an optical fiber.

  The illumination optical system IL is provided with a plurality of (for example, six in the first embodiment) illumination modules IL corresponding to the plurality of illumination regions IR1 to IR6. The illumination light beam EL1 from the light source device is incident on each of the plurality of illumination modules IL1 to IL6. Each illumination module IL1 to IL6 guides the illumination light beam EL1 incident from the light source device to each illumination region IR1 to IR6. That is, the first illumination module IL1 guides the illumination light beam EL1 to the first illumination region IR1, and similarly, the second to sixth illumination modules IL2 to IL6 transmit the illumination light beam EL1 to the second to sixth illumination regions IR2 to IR6. Lead to. The plurality of illumination modules IL1 to IL6 are arranged in two rows in the scanning direction of the mask M across the center plane CL. The plurality of illumination modules IL1 to IL6 are arranged on the side (left side in FIG. 5) where the first, third, and fifth illumination regions IR1, IR3, and IR5 are disposed across the center plane CL. A third illumination module IL3 and a fifth illumination module IL5 are arranged. The first illumination module IL1, the third illumination module IL3, and the fifth illumination module IL5 are arranged at a predetermined interval in the Y direction. The plurality of illumination modules IL1 to IL6 are arranged on the side where the second, fourth, and sixth illumination regions IR2, IR4, and IR6 are disposed (right side in FIG. 5) with the center plane CL interposed therebetween. IL2, fourth illumination module IL4, and sixth illumination module IL6 are arranged. The second illumination module IL2, the fourth illumination module IL4, and the sixth illumination module IL6 are arranged at a predetermined interval in the Y direction. At this time, the second illumination module IL2 is disposed between the first illumination module IL1 and the third illumination module IL3 in the Y direction. Similarly, the third illumination module IL3 is disposed between the second illumination module IL2 and the fourth illumination module IL4 in the Y direction. The fourth illumination module IL4 is disposed between the third illumination module IL3 and the fifth illumination module IL5 in the Y direction. The fifth illumination module IL5 is disposed between the fourth illumination module IL4 and the sixth illumination module IL6 in the Y direction. The first illumination module IL1, the third illumination module IL3, and the fifth illumination module IL5, and the second illumination module IL2, the fourth illumination module IL4, and the sixth illumination module IL6 are centered on the center plane CL when viewed from the Y direction. Are arranged symmetrically.

  Each of the plurality of illumination modules IL1 to IL6 includes a plurality of optical members such as an integrator optical system, a rod lens, and a fly-eye lens, and illuminates each illumination region IR1 to IR6 with an illumination light beam EL1 having a uniform illuminance distribution. In the first embodiment, the plurality of illumination modules IL1 to IL6 are arranged on the upper side in the Z direction of the mask M. Each of the plurality of illumination modules IL1 to IL6 illuminates each illumination region IR of the mask pattern formed on the mask M from above the mask M.

  Next, a plurality of projection areas PA1 to PA6 that are projected and exposed by the projection optical system PL will be described. As shown in FIG. 6, the plurality of projection areas PA1 to PA6 on the substrate P are arranged corresponding to the plurality of illumination areas IR1 to IR6 on the mask M. That is, the plurality of projection areas PA1 to PA6 on the substrate P are arranged in two rows in the transport direction across the center plane CL, and the first projection areas PA1 and PA1 on the upstream substrate P in the transport direction (scanning direction), The third projection area PA3 and the fifth projection area PA5 are arranged, and the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged on the substrate P on the downstream side in the transport direction. Each of the projection areas PA1 to PA6 is an elongated trapezoidal area having a short side and a long side extending in the width direction (Y direction) of the substrate P. At this time, each of the trapezoidal projection areas PA1 to PA6 is an area where the short side is located on the center plane CL side and the long side is located outside. The first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged at predetermined intervals in the width direction. Further, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged at a predetermined interval in the width direction. At this time, the second projection area PA2 is disposed between the first projection area PA1 and the third projection area PA3 in the axial direction of the rotation axis AX2. Similarly, the third projection area PA3 is arranged between the second projection area PA2 and the fourth projection area PA4 in the axial direction. The fourth projection area PA4 is disposed between the third projection area PA3 and the fifth projection area PA5. The fifth projection area PA5 is disposed between the fourth projection area PA4 and the sixth projection area PA6. Similarly to the illumination areas IR1 to IR6, the projection areas PA1 to PA6 are overlapped so that the triangular portions of the hypotenuses of adjacent trapezoidal projection areas PA overlap each other when viewed from the transport direction of the substrate P. ) Is arranged. At this time, the projection area PA has such a shape that the exposure amount in the area where the adjacent projection areas PA overlap is substantially the same as the exposure amount in the non-overlapping area. The first to sixth projection areas PA1 to PA6 are arranged so as to cover the entire width in the Y direction of the exposure area A7 exposed on the substrate P.

  Here, in FIG. 5, when viewed in the XZ plane, the length from the center point of the illumination region IR1 (and IR3, IR5) on the mask M to the center point of the illumination region IR2 (and IR4, IR6) is The circumference from the center point of the projection area PA1 (and PA3, PA5) on the substrate P following the support surface P2 to the center point of the second projection area PA2 (and PA4, PA6) is set to be substantially equal. Yes.

  Further, as shown in FIG. 5, the projection optical system PL is provided with a plurality of (for example, six in the first embodiment) projection modules PL1 to PL6 corresponding to the plurality of projection areas PA1 to PA6. The plurality of projection light beams EL2 from the plurality of illumination regions IR1 to IR6 are incident on the plurality of projection modules PL1 to PL6, respectively. Each projection module PL1-PL6 guides each projection light beam EL2 from the mask M to each projection area PA1-PA6. That is, the first projection module PL1 guides the projection light beam EL2 from the first illumination area IR1 to the first projection area PA1, and similarly, the second to sixth projection modules PL2 to PL6 are the second to sixth illumination areas. The projection light beams EL2 from IR2 to IR6 are guided to the second to sixth projection areas PA2 to PA6. The plurality of projection modules PL1 to PL6 are arranged in two rows in the scanning direction of the mask M across the center plane CL. The plurality of projection modules PL1 to PL6 are arranged on the side (left side in FIG. 5) on which the first, third, and fifth projection areas PA1, PA3, and PA5 are arranged across the center plane CL. A third projection module PL3 and a fifth projection module PL5 are arranged. The first projection module PL1, the third projection module PL3, and the fifth projection module PL5 are arranged at a predetermined interval in the Y direction. The plurality of projection modules PL1 to PL6 are arranged on the side (right side in FIG. 5) on which the second, fourth, and sixth projection areas PA2, PA4, and PA6 are arranged with the center plane CL interposed therebetween. PL2, the fourth projection module PL4, and the sixth projection module PL6 are arranged. The second projection module PL2, the fourth projection module PL4, and the sixth projection module PL6 are arranged at a predetermined interval in the Y direction. At this time, the second projection module PL2 is disposed between the first projection module PL1 and the third projection module PL3 in the axial direction. Similarly, the third projection module PL3 is disposed between the second projection module PL2 and the fourth projection module PL4 in the axial direction. The fourth projection module PL4 is disposed between the third projection module PL3 and the fifth projection module PL5. The fifth projection module PL5 is disposed between the fourth projection module PL4 and the sixth projection module PL6. The first projection module PL1, the third projection module PL3, and the fifth projection module PL5, and the second projection module PL2, the fourth projection module PL4, and the sixth projection module PL6 are centered on the center plane CL as viewed from the Y direction. Are arranged symmetrically.

  The plurality of projection modules PL1 to PL6 are provided corresponding to the plurality of illumination modules IL1 to IL6. That is, the first projection module PL1 projects an image of the mask pattern of the first illumination area IR1 illuminated by the first illumination module IL1 onto the first projection area PA1 on the substrate P. Similarly, the second to sixth projection modules PL2 to PL6 transfer the mask pattern images of the second to sixth illumination regions IR2 to IR6 illuminated by the second to sixth illumination modules IL2 to IL6 on the substrate P. Projecting to the second to sixth projection areas PA2 to PA6.

  Next, the projection modules PL1 to PL6 will be described with reference to FIG. Since each of the projection modules PL1 to PL6 has the same configuration, the first projection module PL1 (hereinafter simply referred to as the projection optical system PL) will be described as an example.

  The projection module PL projects an image of the mask pattern in the illumination area IR (first illumination area IR1) on the mask M onto the projection area PA on the substrate P. As shown in FIG. 7, the projection module PL includes a first optical system 61 that forms an image of the mask pattern in the illumination area IR on the intermediate image plane P7, and at least one of the intermediate images formed by the first optical system 61. A second optical system 62 that re-images the image on the projection area PA of the substrate P, and a projection field stop 63 disposed on the intermediate image plane P7 on which the intermediate image is formed. The projection module PL includes a focus correction optical member 64, an image shift optical member 65, a magnification correction optical member 66, and a rotation correction mechanism 67.

  The first optical system 61 and the second optical system 62 are, for example, telecentric catadioptric optical systems obtained by modifying a Dyson system. The first optical system 61 has its optical axis (hereinafter referred to as the second optical axis BX2) substantially orthogonal to the center plane CL. The first optical system 61 includes a first deflecting member 70, a first lens group 71, and a first concave mirror 72. The first deflecting member 70 is a triangular prism having a first reflecting surface P3 and a second reflecting surface P4. The first reflecting surface P3 is a surface that reflects the projection light beam EL2 from the mask M and causes the reflected projection light beam EL2 to enter the first concave mirror 72 through the first lens group 71. The second reflecting surface P4 is a surface on which the projection light beam EL2 reflected by the first concave mirror 72 enters through the first lens group 71 and reflects the incident projection light beam EL2 toward the projection field stop 63. . The first lens group 71 includes various lenses, and the optical axes of the various lenses are disposed on the second optical axis BX2. The first concave mirror 72 is arranged on a pupil plane on which a large number of point light sources generated by the fly-eye lens are imaged by various lenses from the fly-eye lens to the first concave mirror 72 via the illumination field stop.

  The projection light beam EL2 from the mask M passes through the focus correction optical member 64 and the image shift optical member 65, is reflected by the first reflecting surface P3 of the first deflecting member 70, and the upper half field of view of the first lens group 71. The light enters the first concave mirror 72 through the region. The projection light beam EL2 incident on the first concave mirror 72 is reflected by the first concave mirror 72, passes through the lower half field of view of the first lens group 71, and enters the second reflective surface P4 of the first deflecting member 70. The projection light beam EL2 incident on the second reflecting surface P4 is reflected by the second reflecting surface P4 and enters the projection field stop 63.

  The projection field stop 63 has an opening that defines the shape of the projection area PA. That is, the shape of the opening of the projection field stop 63 defines the shape of the projection area PA.

  The second optical system 62 has the same configuration as the first optical system 61, and is provided symmetrically with the first optical system 61 with the intermediate image plane P7 interposed therebetween. The second optical system 62 has an optical axis (hereinafter referred to as a third optical axis BX3) that is substantially perpendicular to the center plane CL and parallel to the second optical axis BX2. The second optical system 62 includes a second deflecting member 80, a second lens group 81, and a second concave mirror 82. The second deflecting member 80 has a third reflecting surface P5 and a fourth reflecting surface P6. The third reflecting surface P5 is a surface that reflects the projection light beam EL2 from the projection field stop 63 and causes the reflected projection light beam EL2 to enter the second concave mirror 82 through the second lens group 81. The fourth reflecting surface P6 is a surface on which the projection light beam EL2 reflected by the second concave mirror 82 enters through the second lens group 81 and reflects the incident projection light beam EL2 toward the projection area PA. The second lens group 81 includes various lenses, and the optical axes of the various lenses are disposed on the third optical axis BX3. The second concave mirror 82 is arranged on a pupil plane on which a large number of point light source images formed by the first concave mirror 72 are imaged by various lenses from the first concave mirror 72 through the projection field stop 63 to the second concave mirror 82. ing.

  The projection light beam EL2 from the projection field stop 63 is reflected by the third reflecting surface P5 of the second deflecting member 80, and enters the second concave mirror 82 through the upper half field region of the second lens group 81. The projection light beam EL <b> 2 that has entered the second concave mirror 82 is reflected by the second concave mirror 82, passes through the lower half field of view of the second lens group 81, and enters the fourth reflecting surface P <b> 6 of the second deflecting member 80. The projection light beam EL2 incident on the fourth reflection surface P6 is reflected by the fourth reflection surface P6, passes through the magnification correction optical member 66, and is projected onto the projection area PA. Thereby, the image of the mask pattern in the illumination area IR is projected to the projection area PA at the same magnification (× 1).

  The focus correction optical member 64 is disposed between the mask M and the first optical system 61. The focus correction optical member 64 adjusts the focus state of the mask pattern image projected onto the substrate P. For example, the focus correction optical member 64 is formed by superposing two wedge-shaped prisms in opposite directions (in the opposite direction in the X direction in FIG. 7) so as to form a transparent parallel plate as a whole. By sliding the pair of prisms in the direction of the slope without changing the distance between the faces facing each other, the thickness of the parallel plate is made variable. As a result, the effective optical path length of the first optical system 61 is finely adjusted, and the focus state of the mask pattern image formed on the intermediate image plane P7 and the projection area PA is finely adjusted.

  The image shift optical member 65 is disposed between the mask M and the first optical system 61. The image shift optical member 65 adjusts the image of the mask pattern projected onto the substrate P so as to be movable in the image plane. The image shifting optical member 65 is composed of a transparent parallel flat glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass that can be tilted in the YZ plane of FIG. By adjusting the respective tilt amounts of the two parallel flat glass plates, the image of the mask pattern formed on the intermediate image plane P7 and the projection area PA can be slightly shifted in the X direction and the Y direction.

  The magnification correcting optical member 66 is disposed between the second deflection member 80 and the substrate P. In the magnification correcting optical member 66, for example, a concave lens, a convex lens, and a concave lens are arranged coaxially at predetermined intervals, the front and rear concave lenses are fixed, and the convex lens between them is moved in the optical axis (principal ray) direction. It is configured. As a result, the mask pattern image formed in the projection area PA is isotropically enlarged or reduced by a small amount while maintaining a telecentric imaging state. The optical axes of the three lens groups constituting the magnification correcting optical member 66 are inclined in the XZ plane so as to be parallel to the principal ray of the projection light beam EL2.

  The rotation correction mechanism 67 is a mechanism that slightly rotates the first deflecting member 70 around an axis perpendicular to the second optical axis BX2 by an actuator (not shown), for example. The rotation correction mechanism 67 can slightly rotate the image of the mask pattern formed on the intermediate image plane P7 by rotating the first deflection member 70 within the plane P7.

  In the projection module PL configured as described above, the projection light beam EL2 from the mask M is emitted in the normal direction of the mask surface P1 from the illumination region IR and enters the first optical system 61. The projection light beam EL2 incident on the first optical system 61 is transmitted through the focus correction optical member 64 and the image shift optical member 65, and the first reflection surface (plane mirror) P3 of the first deflection member 70 of the first optical system 61. And is reflected by the first concave mirror 72 through the first lens group 71. The projection light beam EL2 reflected by the first concave mirror 72 passes through the first lens group 71 again, is reflected by the second reflecting surface (plane mirror) P4 of the first deflecting member 70, and enters the projection field stop 63. The projection light beam EL2 that has passed through the projection field stop 63 is reflected by the third reflecting surface (planar mirror) P5 of the second deflecting member 80 of the second optical system 62, and then reflected by the second concave mirror 82 through the second lens group 81. Is done. The projection light beam EL2 reflected by the second concave mirror 82 passes through the second lens group 81 again, is reflected by the fourth reflecting surface (plane mirror) P6 of the second deflecting member 80, and enters the magnification correcting optical member 66. . The projection light beam EL2 emitted from the magnification correcting optical member 66 is incident on the projection area PA on the substrate P, and an image of the mask pattern appearing in the illumination area IR is projected to the projection area PA at the same magnification (× 1). .

<Control of drive unit>
Next, control of the drive unit 122 will be described with reference to FIG. The drive unit 122 includes a mask side drive unit 22 attached to a support frame 146 installed on the installation surface E, and a substrate side drive unit 26.

  As described above, the mask side drive unit 22 is connected to the linear motor magnet track (stator) fixed to the column frame 146 so as to extend in the X direction, and the transmission member 23 coupled to the mask stage 21. It is composed of a linear motor coil unit (movable element) that is fixed and faces the magnet track with a certain gap. Further, as shown in FIG. 4, the substrate side drive unit 26 includes a coil unit CUr fixed as a stator on the support frame 146 side, and a mover on the rotor RT on the rotation axis AX2 side of the support drum 25. And a voice coil motor (MUs, CUs) for applying thrust in the direction of the rotation axis AX2 (Y direction) to the support drum 25 from the support frame 146 side. Including. As described above, the mask side drive unit 22 and the substrate side drive unit 26 have a configuration (direct drive system) capable of transmitting power directly to the transmission member 23 and the rotation axis AX2 in a non-contact manner. Not exclusively. For example, the board-side drive unit 26 includes an electric motor and a magnetic gear, and the electric motor is fixed to the support frame 146 side, and a magnetic gear is interposed between the output shaft of the electric motor and the rotation shaft AX2. Also good.

  In the configuration of the drive unit 122 as described above, the lower-level control device 16 shown in FIG. 5 moves the mask stage 21 and the support drum 25 in synchronization. For this reason, the image of the mask pattern formed on the mask surface P1 of the mask M is curved following the surface (circumferential surface) of the substrate P wound around the support surface P2 (25a in FIG. 4) of the support drum 25. Surface) is continuously and repeatedly exposed to projection. In the exposure apparatus U3 of the first embodiment, after performing scanning exposure by synchronous movement of the mask M in the + X direction, an operation (rewinding) of returning the mask M to the initial position in the −X direction is required. Therefore, when the support drum 25 is continuously rotated at a constant speed and the substrate P is continuously fed at a constant speed, the pattern exposure is not performed on the substrate P during the rewinding operation of the mask M, and the panel P is transported in the transport direction of the substrate P. The working pattern is formed in a jump (separated) manner. However, since the speed of the substrate P (peripheral speed here) and the speed of the mask M at the time of scanning exposure are assumed to be 50 mm / s to 100 mm / s in practice, the mask stage when the mask M is rewound. If 21 is driven at a maximum speed of, for example, 500 mm / s, the margin in the transport direction between panel patterns formed on the substrate P can be reduced.

  In the present embodiment, the movement position and speed of the mask stage 21 in the X direction are accurately measured by a laser interferometer or a linear encoder, and the movement position and speed of the outer peripheral surface of the support drum 25 are measured on the scale plate 25c in FIG. By accurately measuring with the read head EH, positional synchronization and speed synchronization in the scanning exposure direction between the mask M and the substrate P can be ensured accurately.

<Pressing mechanism>
Next, the pressing mechanism 130 will be described with reference to FIG. The pressing mechanism 130 is provided between the position adjustment unit 120 and the exposure unit 121. The pressing mechanism 130 presses the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 so that tension is applied. The pressing mechanism 130 includes a pressing member 151 and an elevating mechanism 152 that moves the pressing member 151 up and down. The pressing member 151 presses the substrate P against the substrate P in a contact or non-contact state. As the pressing member 151, for example, an air turn bar having an air ejection port and a suction port for making a non-contact state with the substrate P, or a friction roller in contact with the substrate P is used. The elevating mechanism 152 elevates and lowers the pressing member 151 in a direction in which the pressing member 151 is pressed from one surface (back surface) of the substrate P to the other surface (front surface), that is, in the Z direction. The elevating mechanism 152 is connected to the host controller 5 and controlled by the host controller 5 based on the detection result of the second substrate detector 124.

  The host controller 5 controls the pressing mechanism 130 based on the detection result of the second substrate detection unit 124. Specifically, the host control device 5 calculates the displacement amount of the position per unit time (for example, several milliseconds) of the substrate P from the position of the substrate P detected by the second substrate detection unit 124. The host controller 5 adjusts the amount of movement of the pressing member 151 in the Z direction according to the calculated amount of displacement. That is, if the calculated displacement amount is large, the host controller 5 controls the lifting mechanism 152 to raise the pressing member 151 in the Z direction, assuming that the vibration of the substrate P is large. The host control device 5 raises the pressing member 151 in the Z direction to apply tension to the substrate P, and the vibration of the substrate P is suppressed by the pressing member 151.

<Substrate recovery device>
Next, the substrate recovery apparatus 4 will be described with reference to FIG. 2 again. The substrate collection apparatus 4 includes a position adjustment unit 160, a second bearing portion 161 on which the collection roll FR2 is mounted, and a second lifting mechanism 162 that raises and lowers the second bearing portion 161. The substrate recovery apparatus 4 includes a discharge angle detection unit 164 and a third substrate detection unit 165, and the discharge angle detection unit 164 and the third substrate detection unit 165 are connected to the host controller 5. Yes. Here, in the first embodiment, the host control device 5 functions as a control device (control unit) of the substrate recovery device 4, similarly to the substrate supply device 2. In addition, as a control device of the substrate recovery apparatus 4, a low-order control device that controls the substrate recovery apparatus 4 may be provided, and the low-order control device may control the substrate recovery apparatus 4.

  The position adjustment unit 160 includes the above-described edge position controller EPC2 shown in FIG. The position adjustment unit 160 has substantially the same configuration as the position adjustment unit 120 of the exposure apparatus U3, and includes a base 170 and an edge position controller EPC2. The base 170 is provided on the installation surface E and supports the edge position controller EPC2. The base 170 may be a vibration isolation table having a vibration isolation function.

  The edge position controller EPC2 is movable on the base 170 in the width direction (Y direction) of the substrate P. The edge position controller EPC2 has a plurality of rollers including a transport roller 167 provided on the most downstream side in the transport direction of the substrate P. The transport roller 167 guides the substrate P discharged from the position adjustment unit 160 to the collection roll FR2. The edge position controller EPC2 is connected to the host controller 5 and controlled by the host controller 5 based on the detection result of the third substrate detector 165.

  The third substrate detection unit 165 detects the position in the width direction of the substrate P recovered from the edge position controller EPC2 to the recovery roll FR2. The third substrate detection unit 165 is fixed on the second lifting mechanism 162. For this reason, the 3rd board | substrate detection part 165 becomes the same vibration mode as collection | recovery roll FR2. The third substrate detection unit 165 detects the position of the end (edge) of the substrate P recovered by the recovery roll FR2. The third substrate detection unit 165 outputs the detection result to the connected higher order control device 5.

  The host controller 5 controls the edge position controller EPC2 based on the detection result of the third substrate detector 165. Specifically, the host controller 5 determines the position of the end (edge) of the substrate P recovered by the recovery roll FR2 detected by the third substrate detection unit 165 and the predetermined third target position. Calculate the difference. Then, the host controller 5 feedback-controls the edge position controller EPC2 so that the difference becomes zero, moves the substrate P in the width direction, and sets the position in the width direction of the substrate P with respect to the collection roll FR2 to the third position. The target position. Therefore, the edge position controller EPC2 can maintain the position in the width direction of the substrate P with respect to the collection roll FR2 at the third target position. Therefore, since the position in the width direction of the substrate P with respect to the collection roll FR2 can be made constant, the end faces in the axial direction of the collection roll FR2 can be aligned. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

  The second bearing portion 161 rotatably supports the recovery roll FR2. When the substrate P is collected, the collection roll FR2 pivotally supported by the second bearing portion 161 has a winding diameter of the collection roll FR2 corresponding to the collection of the substrate P. For this reason, the position where the substrate P is recovered in the recovery roll FR2 changes according to the recovery amount of the substrate P.

  The second elevating mechanism 162 is provided between the installation surface E and the second bearing portion 161. The second elevating mechanism 162 moves the second bearing portion 161 together with the recovery roll FR2 in the Z direction (vertical direction). The second elevating mechanism 162 is connected to the host controller 5, and the host controller 5 moves the second bearing 161 in the Z direction by the second elevator mechanism 162 so that the recovery roll FR <b> 2 is moved to a predetermined level. Can be in position.

  The discharge angle detector 164 detects the discharge angle θ2 of the substrate P discharged from the transport roller 167 of the edge position controller EPC2. The discharge angle detection unit 164 is provided around the transport roller 167. Here, the discharge angle θ <b> 2 is an angle formed by a straight line extending in the vertical direction passing through the central axis of the transport roller 167 and the substrate P on the downstream side of the transport roller 167 in the XZ plane. The discharge angle detection unit 164 outputs a detection result to the connected host control device 5.

  The host controller 5 controls the second elevating mechanism 162 based on the detection result of the discharge angle detector 164. Specifically, the host controller 5 controls the second elevating mechanism 162 such that the discharge angle θ2 becomes a predetermined target discharge angle. That is, when the collection amount of the substrate P to the collection roll FR2 increases, the winding diameter of the collection roll FR2 increases, and the discharge angle θ2 with respect to the target discharge angle decreases. Therefore, the host controller 5 moves the second lifting mechanism 162 upward (in the Z direction) to increase the discharge angle θ2 and correct the discharge angle θ2 to be the target discharge angle. . Thus, the host controller 5 feedback-controls the second elevating mechanism 162 based on the detection result of the discharge angle detection unit 164 so that the discharge angle θ2 becomes the target discharge angle. For this reason, since the board | substrate collection | recovery apparatus 4 can always discharge | emit the board | substrate P from the conveyance roller 167 with a target discharge | emission angle, it can reduce the influence given to the board | substrate P by the change of discharge | emission angle (theta) 2. Also in this case, the feedback control may be any control such as P control, PI control, PID control and the like.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 8 is a flowchart showing the device manufacturing method according to the first embodiment.

  In the device manufacturing method shown in FIG. 8, first, function / performance design of a display panel using a self-luminous element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Next, a mask M for a necessary layer is manufactured based on the pattern for each layer designed by CAD or the like (step S202). In addition, a supply roll FR1 around which a flexible substrate P (resin film, metal foil film, plastic, or the like) serving as a display panel base material is wound is prepared (step S203). The roll-shaped substrate P prepared in step S203 has a surface modified as necessary, a pre-formed base layer (for example, micro unevenness by an imprint method), and light sensitivity. The functional film or transparent film (insulating material) previously laminated may be used.

  Next, a backplane layer composed of electrodes, wiring, insulating film, TFT (thin film semiconductor), etc. constituting the display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane. A light emitting layer (display pixel portion) is formed by the self light emitting element (step S204). This step S204 includes a conventional photolithography process in which the photoresist layer is exposed using the exposure apparatus U3 described in the previous embodiments, but a photosensitive silane coupling material is applied instead of the photoresist. Patterning the exposed substrate P to form a pattern based on hydrophilicity and water repellency on the surface, and wet processing for patterning the photosensitive catalyst layer and patterning the metal film (wiring, electrode, etc.) by electroless plating The process includes a process or a printing process in which a pattern is drawn with a conductive ink containing silver nanoparticles, or the like.

  Next, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by a roll method, or a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device. A device is assembled by pasting sheets or the like (step S205). Next, an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S206). As described above, a display panel (flexible display) can be manufactured.

  As described above, in the first embodiment, the exposure unit 121 is installed on the installation surface E via the vibration isolation table 131, and the exposure unit 121, the position adjustment unit 120, and the drive unit 122 can be provided independently. . That is, in the first embodiment, the exposure unit 121, the position adjustment unit 120, and the drive unit 122 can be separated by the vibration isolation table 131, that is, can be set to different vibration modes. For this reason, the exposure unit 121 can reduce vibrations from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131.

  In the first embodiment, the position of the substrate P in the width direction with respect to the fixed roller 126 can be maintained at the first target position. For this reason, since the board | substrate P is supplied to the same position with respect to the fixed roller 126, the position in the width direction of the board | substrate P supplied from the fixed roller 126 can be made constant. Thereby, since the position in the width direction of the board | substrate P sent out from the fixed roller 126 can be made constant in 1st Embodiment, the influence of the vibration etc. which are given to the board | substrate P by the fluctuation | variation of the position in the width direction of the board | substrate P is reduced. be able to.

  In the first embodiment, the position of the substrate P with respect to the transport roller 127 can be maintained at the second target position. For this reason, the first embodiment can make the position of the substrate P supplied to the exposure unit 121 constant. Thereby, since the position of the board | substrate P supplied to the conveyance roller 127 can be made constant in 1st Embodiment, the influence of the vibration etc. which are given to the board | substrate P by the fluctuation | variation of the position of the board | substrate P can be reduced.

  In the first embodiment, by pressing the substrate P by the pressing mechanism 130, the vibration of the substrate P supplied from the position adjustment unit 120 to the exposure unit 121 can be further reduced.

  In the first embodiment, the apparatus frame 132 is divided into a first frame 132a and a second frame 132b, the mask stage 21 is supported by the first frame 132a, and the support drum 25 is supported by the second frame 132b. be able to. For this reason, the 1st frame 132a and the 2nd frame 132b can be provided in an independent state, respectively. That is, the first frame 132a and the second frame 132b can be cut off, that is, different vibration modes can be set. For this reason, the transmission of the mutual vibration of the 1st frame 132a and the 2nd frame 132b can be reduced.

  In the first embodiment, the entrance angle θ1 of the substrate P supplied from the supply roll FR1 to the transport roller 127 of the position adjustment unit 120 of the exposure apparatus U3 with respect to the transport roller 127 can be made constant. For this reason, the influence on the board | substrate P by the displacement of approach angle (theta) 1 can be reduced.

  In the first embodiment, the discharge angle θ <b> 2 of the substrate P supplied from the transport roller 167 of the position adjustment unit 160 of the substrate recovery apparatus 4 to the recovery roll FR <b> 2 with respect to the transport roller 167 can be made constant. For this reason, it is possible to reduce the influence on the substrate P due to the displacement of the discharge angle θ2 (such as uneven winding of the substrate P on the collection roll FR2).

[Second Embodiment]
Next, an exposure apparatus U3 according to the second embodiment will be described with reference to FIG. In the second embodiment, only parts different from the first embodiment will be described in order to avoid overlapping descriptions, and the same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment. explain. FIG. 9 is a view showing a part of the configuration of the exposure apparatus (substrate processing apparatus) of the second embodiment. In the exposure unit 121 of the exposure apparatus U3 of the first embodiment, the apparatus frame 132 is separated into the first frame 132a and the second frame 132b. However, the exposure unit 121 of the exposure apparatus U3 of the second embodiment is a single unit. The apparatus frame 180 is the same.

  In the exposure unit 121 of the second embodiment, the apparatus frame 180 is provided on the vibration isolation table 131, and includes a mask holding mechanism 11, a substrate support mechanism 12, an illumination mechanism 13, and a projection optical system that hold a transmissive cylindrical mask MA. Support PL. The apparatus frame 180 includes a lower surface portion 181 provided on the vibration isolation table 131, a pair of bearing portions 182 standing on the lower surface portion 181, an intermediate portion 183 supported on the pair of bearing portions 182, A leg portion 184 standing on the portion 183, an upper surface portion 185 supported by the leg portion 184, and an arm portion 186 standing on the upper surface portion 185.

  Each of the pair of bearing portions 182 is provided with an air bearing 141 that pivotally supports the rotation axis AX2 of the support drum 25 of the substrate support mechanism 12. Each air bearing 141 rotatably supports the rotary shaft AX2 in a non-contact state. In the intermediate portion 183, the projection optical system PL is installed via the holding member 143. Washers 145 are interposed at three locations between the holding member 143 and the intermediate portion 183. The holding member 143 is kinematically supported on the intermediate portion 183 by three washer members 145. The upper surface portion 185 supports a mask holding mechanism 11 (hollow cylindrical body) of a transmissive cylindrical mask MA, and at the same time, a driving roller (capstan roller) for rotationally driving the cylindrical mask M around the rotation center line AX1. ) 94 is provided. The illumination mechanism 13 is disposed inside the mask holding mechanism 11 and illuminates the illumination region IR (IR1 to IR6) on the cylindrical mask MA from the inside in an arrangement as shown in the left diagram of FIG.

  Further, a bearing 187 for rotatably supporting the rotation shaft of the driving roller 94 is provided on the upper surface portion 185, and the mask side driving portion 22 that rotationally drives the driving roller 94 is shown in FIG. The configuration is the same as that of the substrate side drive unit 26. Although not shown, encoder measuring scales (diffraction gratings) or scale plates similar to those shown in FIG. 4 are provided at both ends of the cylindrical mask holding mechanism 11 in the direction of the rotation center line AX1. The circumferential position of the cylindrical mask MA is precisely measured by the reading heads arranged so as to face each other.

  As described above, in the second embodiment, the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL can be supported by a single device frame 180. For this reason, since the positional relationship among the mask holding mechanism 11, the substrate support mechanism 12, the illumination mechanism 13, and the projection optical system PL can be fixed, the second embodiment can be easily installed without significantly adjusting these positional relationships. It becomes possible to do.

  Next, with reference to FIG. 10, the exposure apparatus U3 (exposure unit 121a) of the second embodiment shown in FIG. 9 will be described in further detail. In the exposure unit 121a of FIG. 10, the mask holding mechanism 11 has a mask holding drum 21a for holding the transmission type mask MA in a cylindrical shape, a guide roller 93 for supporting the mask holding drum 21a, and the mask holding drum 21a as a center line. A driving roller 94 that drives around AX1 and a mask side driving unit 22 are provided.

  The mask holding drum 21a forms a mask surface on which the illumination area IR on the mask MA is arranged. In the present embodiment, the mask surface P1 includes a surface (hereinafter, referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis (cylindrical center axis) parallel to the line segment. The cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a column, or the like. The mask holding drum 21a is made of, for example, glass or quartz and has a cylindrical shape having a certain thickness, and the outer peripheral surface (cylindrical surface) forms the mask surface P1. That is, in the present embodiment, the illumination region IR on the mask MA is curved in a cylindrical surface shape having a constant radius Rm from the first axis AX1. Of the mask holding drum 21a, a portion that overlaps the mask pattern of the mask MA when viewed from the radial direction of the mask holding drum 21a, for example, a central portion other than both ends in the Y direction of the mask holding drum 21a is transparent to the illumination light beam EL1. Has light properties.

  The mask MA is created as a transmission type planar sheet mask in which a pattern is formed with a light shielding layer such as chrome on one surface of a strip-shaped ultrathin glass plate (for example, a thickness of 100 to 500 μm) with good flatness, for example. It is used in a state in which it is curved along the outer peripheral surface of the mask holding drum 21a and wound (attached) around this outer peripheral surface. The mask MA has a pattern non-formation region where no pattern is formed, and is attached to the mask holding drum 21a in the pattern non-formation region. The mask MA can be released to the mask holding drum 21a. Instead of wrapping around the mask holding drum 21a made of a transparent cylindrical base material, the mask MA may be integrated by drawing a mask pattern made of a light shielding layer such as chromium directly on the outer peripheral surface of the mask holding drum 21a made of a transparent cylindrical base material. . Also in this case, the mask holding drum 21a functions as a support member for the mask MA.

  The guide roller 93 and the drive roller 94 extend in the Y direction parallel to the central axis of the mask holding drum 21a. The guide roller 93 and the driving roller 94 are provided to be rotatable around an axis parallel to the central axis. Each of the guide roller 93 and the drive roller 94 has an outer diameter at the end portion in the axial direction larger than the outer shape of the other portion, and the end portion circumscribes the mask holding drum 21a. Thus, the guide roller 93 and the drive roller 94 are provided so as not to contact the mask MA held on the mask holding drum 21a. The drive roller 94 is connected to the mask side drive unit 22. The driving roller 94 rotates the mask holding drum 21a around the central axis AX1 by transmitting the power from the mask side driving unit 22 to the mask holding drum 21a.

  The mask holding mechanism 11 includes one guide roller 93, but the number is not limited and may be two or more. Similarly, the mask holding mechanism 11 includes one drive roller 94, but the number is not limited and may be two or more. At least one of the guide roller 93 and the driving roller 94 is disposed inside the mask holding drum 21a and may be inscribed in the mask holding drum 21a. In addition, portions of the mask holding drum 21a that do not overlap with the mask pattern of the mask MA as viewed from the radial direction of the mask holding drum 21a (both ends in the Y direction) are translucent to the illumination light beam EL1. It does not have to be translucent. Further, one or both of the guide roller 93 and the drive roller 94 may have a truncated cone shape, for example, and the center axis (rotation axis) thereof may be non-parallel to the center axis.

  The illumination mechanism 13 is configured similarly to the first embodiment, and the plurality of illumination modules ILa1 to ILa6 of the illumination mechanism 13 are disposed inside the mask holding drum 21a. Each of the plurality of illumination modules ILa1 to ILa6 guides the illumination light beam EL1 emitted from the light source, and irradiates the mask MA with the guided illumination light beam EL1 from the inside of the mask holding drum 21a. The illumination mechanism 13 illuminates the illumination area IR of the mask MA held by the mask holding mechanism 11 with uniform brightness using the illumination light beam EL1. The light source may be arranged inside the mask holding drum 21a or may be arranged outside the mask holding drum 21a. The light source may be a device (external device) different from the exposure device U3.

  As described above, in the second embodiment, even if the mask MA of the exposure unit 121a is a cylindrical transmissive mask, the exposure unit 121a, the position adjustment unit 120, and the drive unit 122 are in an independent state (vibration). Can be provided in a state where transmission is insulated. For this reason, the exposure unit 121a can reduce the vibration from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131, and can obtain the same effect as described above.

[Third Embodiment]
Next, with reference to FIG. 11, the exposure apparatus U3 of 3rd Embodiment is demonstrated. In the third embodiment, only parts different from the first embodiment and the second embodiment will be described in order to avoid overlapping descriptions, and the same components as those in the first embodiment and the second embodiment will be described. The same reference numerals as those in the first or second embodiment are given for explanation. FIG. 11 shows the overall configuration of the exposure unit 121b according to the third embodiment, which uses a cylindrical reflective mask MB and supports the substrate P in a planar shape.

  First, the mask MB used in the exposure apparatus U3 of the third embodiment will be described. The mask MB is a reflective mask using, for example, a metal cylinder. The mask MB is formed in a cylindrical body having an outer peripheral surface (circumferential surface) having a curvature radius Rm with the first axis AX1 extending in the Y direction as the center, and has a constant thickness in the radial direction. The circumferential surface of the mask MB is a mask surface P1 on which a predetermined mask pattern is formed. The mask surface P1 includes a high reflection portion that reflects the light beam in a predetermined direction with high efficiency and a reflection suppression portion that does not reflect the light beam in the predetermined direction or reflects with low efficiency, and the mask pattern includes the high reflection portion and the reflection suppression. It is formed by the part. Since such a mask MB is a metal cylinder, it can be produced at low cost.

  The mask MB only needs to have a circumferential surface having a radius of curvature Rm with the first axis AX1 as the center, and is not limited to a cylindrical shape. For example, the mask MB may be an arc-shaped plate material having a circumferential surface. The mask MB may be a thin plate shape, or the thin plate mask MB may be curved so as to have a circumferential surface.

  The mask holding mechanism 11 has a mask holding drum 21b that holds the mask MB. The mask holding drum 21b holds the mask MB so that the first axis AX1 of the mask M is the center of rotation. The mask side drive unit 22 is connected to the low order control device 16 and rotates the mask holding drum 21b around the first axis AX1.

  Although the mask holding mechanism 11 holds the cylindrical mask M with the mask holding drum 21b, the present invention is not limited to this configuration. The mask holding mechanism 11 may wind and hold the thin plate-like mask MB along the outer peripheral surface of the mask holding drum 21b. The mask holding mechanism 11 may hold the mask MB, which is an arc-shaped plate material, on the outer peripheral surface of the mask holding drum 21b.

  The substrate support mechanism 12 includes a pair of drive rollers 196 over which the substrate P is stretched, an air stage 197 that supports the substrate P in a planar shape, and a plurality of guide rollers 28. The pair of driving rollers 196 is rotated by the substrate side driving unit 26 to move the substrate P in the scanning direction. The air stage 197 is provided between the pair of driving rollers 196, and is provided on the back side of the substrate P that is stretched between the pair of driving rollers 196 with a certain tension. The substrate P is supported in a flat shape. The plurality of guide rollers 28 are respectively provided on the upstream side and the downstream side in the transport direction of the substrate P with the pair of drive rollers 196 interposed therebetween. For example, four guide rollers 28 are provided, two on the upstream side in the transport direction and two on the downstream side in the transport direction.

  Accordingly, the substrate support mechanism 12 guides the substrate P conveyed from the position adjustment unit 120 to one drive roller 196 by the two guide rollers 28. The substrate P guided by one drive roller 196 is passed over the pair of drive rollers 196 with a constant tension by being guided by the other drive roller 196. The substrate support mechanism 12 rotates the pair of drive rollers 196 by the substrate-side drive unit 26, so that the substrate P stretched over the pair of drive rollers 196 is directed toward the guide roller 28 while being supported by the air stage 197. Transport. The substrate support mechanism 12 guides the substrate P conveyed to the guide roller 28 toward the substrate recovery device 4.

  The illumination mechanism 13 illuminates the illumination light beam EL1 from the outer peripheral side of the mask holding drum 21b when a cylindrical reflective mask MB is used. That is, in the illumination mechanism 13, the light source device and the illumination optical system IL are provided on the outer periphery of the mask holding drum 21b. The illumination optical system IL is an epi-illumination system using a polarization beam splitter PBS. Between each of the illumination modules IL1 to IL6 of the illumination optical system IL and the mask MB, a polarization beam splitter PBS and a quarter wavelength plate 198 are provided. That is, the illumination module IL, the polarization beam splitter PBS, and the quarter wavelength plate 198 are provided in order from the incident side of the illumination light beam EL1 from the light source device.

  Here, the illumination light beam EL1 emitted from the light source device enters the polarization beam splitter PBS through the illumination module IL. The illumination light beam EL1 incident on the polarization beam splitter PBS is reflected by the polarization beam splitter PBS, passes through the quarter-wave plate 198, and is illuminated on the illumination region IR. The projection light beam EL2 reflected from the illumination region IR passes through the quarter-wave plate 198 again, and is converted into a light beam that passes through the polarization beam splitter PBS. The projection light beam EL2 that has passed through the quarter-wave plate 198 passes through the polarization beam splitter PBS and enters the projection optical system PL.

  As described above, in the third embodiment, even when the mask MB of the exposure unit 121b is a cylindrical reflection type mask and the substrate P is supported in a planar shape, the exposure unit 121b and the position adjustment unit 120 are used. And the drive unit 122 can be provided in an independent state (a state in which vibration transmission is insulated). For this reason, the exposure unit 121b can reduce the vibration from the position adjustment unit 120 and the drive unit 122 by the vibration isolation table 131, and can obtain the same effect as described above.

DESCRIPTION OF SYMBOLS 1 Device manufacturing system 2 Substrate supply apparatus 4 Substrate collection | recovery apparatus 5 Host controller 11 Mask holding mechanism 12 Substrate support mechanism 13 Illumination mechanism 16 Subordinate control apparatus 21 Mask stage 22 Mask side drive part 23 Drive shaft 25 Support drum 26 Substrate side drive part 61 First optical system 62 Second optical system 63 Projection field stop 64 Focus correction optical member 65 Image shift optical member 66 Magnification correction optical member 67 Rotation correction mechanism 70 First deflection member 71 First lens group 72 First concave mirror 80 Second deflecting member 81 Second lens group 82 Second concave mirror 111 First bearing portion 112 First elevating mechanism 114 Entrance angle detector 120 Position adjustment unit 121 Exposure unit 122 Drive unit 123 First substrate detector 124 Second substrate detector 126 Fixed roller 130 Press mechanism 1 1 anti-vibration table 132 device frame 151 pressing member 152 lifting mechanism P substrate FR1 supply roll FR2 recovery roll U1~Un processor U3 exposure apparatus (substrate processing apparatus)
M mask MA mask (second embodiment)
MB mask (third embodiment)
AX1 1st axis AX2 2nd axis P1 Mask surface P2 Support surface P7 Intermediate image plane EL1 Illumination beam EL2 Projection beam Rm Curvature radius Rfa Curvature radius CL Center plane PBS Polarization beam splitter IR1 to IR6 Illumination region IL Illumination optical system IL1 to IL6 illumination Modules PA1 to PA6 Projection area PL Projection optical system PL1 to PL6 Projection module BX2 Second optical axis BX3 Third optical axis θ1 Entrance angle θ2 Ejection angle E Installation surface

Claims (15)

A vibration isolator provided on the installation surface;
An exposure unit that is provided on the vibration isolation table and performs an exposure process on a substrate to be supplied;
A substrate processing apparatus comprising: a processing unit that is provided on the installation surface and is provided in an independent state that is not in contact with the exposure unit and that performs processing on the exposure unit. The processing unit includes a position adjustment unit that adjusts a position in the width direction of the substrate supplied to the exposure unit,
The position adjustment unit includes:
A base provided on the installation surface;
A width moving mechanism that is provided on the base and moves the substrate in the width direction of the substrate with respect to the base;
A fixed roller provided on the base and guiding the substrate after position adjustment by the width moving mechanism toward the exposure unit and having a fixed position relative to the base. The substrate processing apparatus as described. A first substrate detection unit that is fixed on the base and detects a position in the width direction of the substrate supplied to the fixed roller;
And a control unit that controls the width moving mechanism based on a detection result of the first substrate detection unit and corrects a position in the width direction of the substrate supplied to the fixed roller to a first target position. The substrate processing apparatus according to claim 2. The position adjustment unit further includes a roller position adjustment mechanism for adjusting a position of the fixed roller with respect to the exposure unit,
A second substrate detection unit fixed on the vibration isolation table and detecting the position of the substrate supplied to the exposure unit;
And a controller that controls the roller position adjustment mechanism based on a detection result of the second substrate detector and corrects the position of the substrate supplied to the exposure unit to a second target position. 4. The substrate processing apparatus according to 2 or 3. A pressing mechanism that presses the substrate supplied from the position adjustment unit to the exposure unit so that tension is applied;
A second substrate detection unit fixed on the vibration isolation table and detecting the position of the substrate supplied to the exposure unit;
The substrate according to any one of claims 2 to 4, further comprising: a control unit that controls the pressing mechanism based on a detection result of the second substrate detection unit and adjusts a pressing amount to the substrate. Processing equipment. The processing unit includes a drive unit that drives the exposure unit,
The exposure unit includes
A mask holding member for holding a mask illuminated with illumination light;
A substrate support member that supports the substrate on which the projection light from the mask is projected,
The drive unit is
A mask side drive unit for driving the mask holding member to move the mask in the scanning direction;
6. The substrate processing apparatus according to claim 1, further comprising: a substrate side drive unit that drives the substrate support member to move the substrate in a scanning direction. The exposure unit includes
A first frame that supports the mask holding member;
A second frame for supporting the substrate support member,
The vibration isolation table includes: a first vibration isolation table provided between the installation surface and the first frame; a second vibration isolation table provided between the installation surface and the second frame; The substrate processing apparatus according to claim 6, comprising: The exposure unit includes
A frame that supports the mask holding member and the substrate support member;
The substrate processing apparatus according to claim 6, wherein the vibration isolation table is provided between the installation surface and the frame. The mask holding member holds the mask having a mask surface having a first radius of curvature around a first axis;
The mask side drive unit moves the mask in the scanning direction by rotating the mask holding member,
The substrate support member supports the substrate along a support surface having a second radius of curvature around the second axis;
9. The substrate processing apparatus according to claim 1, wherein the substrate side driving unit moves the substrate in a scanning direction by rotationally driving the substrate support member. 10. The mask holding member holds the mask having a flat mask surface,
The mask side drive unit moves the mask in the scanning direction by linearly driving the mask holding member,
The substrate support member supports the substrate along a support surface having a second radius of curvature around the second axis;
9. The substrate processing apparatus according to claim 1, wherein the substrate side driving unit moves the substrate in a scanning direction by rotationally driving the substrate support member. 10. The mask holding member holds the mask having a mask surface having a first radius of curvature around a first axis;
The mask side drive unit moves the mask in the scanning direction by rotating the mask holding member,
The substrate support member has a pair of support rollers that rotatably support both sides of the substrate in the scanning direction so that the substrate has a flat surface.
9. The substrate processing apparatus according to claim 1, wherein the substrate side driving unit moves the substrate in a scanning direction by rotationally driving the pair of support rollers. 10. A substrate processing apparatus according to any one of claims 1 to 11,
A substrate supply apparatus for supplying the substrate to the substrate processing apparatus;
A device manufacturing system comprising: a substrate recovery apparatus that recovers the substrate processed by the substrate processing apparatus. The substrate supply apparatus includes:
A first bearing portion rotatably supported by a supply roll on which the substrate is wound in a roll;
A first lifting mechanism for lifting and lowering the first bearing portion;
An approach angle detector for detecting an approach angle of the substrate with respect to a first roller around which the substrate fed from the supply roll is wound;
The device manufacturing system according to claim 12, further comprising: a control unit that controls the first lifting mechanism based on a detection result of the approach angle detection unit and corrects the approach angle to a target approach angle. The substrate recovery apparatus is
A second bearing portion rotatably supported by a recovery roll on which the substrate after processing processed by the substrate processing apparatus is wound;
A second lifting mechanism for lifting and lowering the second bearing part;
A discharge angle detection unit for detecting a discharge angle of the substrate with respect to a second roller around which the substrate sent to the collection roll is wound;
The device manufacturing system according to claim 12, further comprising: a control unit that controls the second lifting mechanism based on a detection result of the discharge angle detection unit and corrects the discharge angle to a target discharge angle. Performing an exposure process on the substrate using the substrate processing apparatus according to claim 1;
Forming a pattern of the mask by processing the exposed substrate.

Images