CN107887489A - A kind of double-side LED module light source - Google Patents

Abstract

The invention discloses a kind of double-side LED module light source, the main points of its technical scheme are to include sapphire substrate, the LED chip being encapsulated on sapphire substrate, coated in the graphite guide thermosphere and electroplax on sapphire substrate.The graphite guide thermosphere is by nanoscale graphite powder through synthesizing pyrolysis coated on around the sapphire substrate.The present invention coats high heat conduction coating on transparent sapphire LED double-side modules, thoroughly solves the heat conduction of double-side module and the difficult problem that radiates.Light decay is reduced, extends product service life, and adds power output, expands application field therefrom, very high society and economic value will be produced.

Description

A double-sided LED module light source

【Technical field】

The invention belongs to the technical field of LED module packaging and relates to a double-sided LED module light source.

【Background technique】

At present, the LED double-sided light-emitting module packaged on the basis of the sapphire substrate has a fatal shortcoming of poor heat dissipation. Because it cannot completely conduct the heat generated by the LED chip, it can only dissipate heat through a limited air contact surface, so the junction temperature of the LED chip High, resulting in large light decay, low luminous efficiency, and short service life. In order to ensure service life, it can only be made into low power, which leads to a small application range of this type of LED and cannot be promoted in many lighting fields.

The present invention is made based on this situation.

【Content of invention】

The object of the present invention is to overcome the disadvantages of the prior art, and provide a high-power light source with LED double-sided light emitting with simple structure, low cost, high heat dissipation efficiency and easy manufacture.

The present invention is achieved through the following technical solutions:

A double-sided light-emitting LED module light source is characterized in that it includes a sapphire substrate 1, an LED chip 3 packaged on the sapphire substrate 1, a graphite heat conducting layer 2 and an electric board 4 coated on the sapphire substrate 1.

The above-mentioned double-sided light-emitting LED module light source is characterized in that: the graphite heat-conducting layer 2 is coated around the sapphire substrate 1 by synthetic pyrolysis of nano-scale graphite powder.

The above-mentioned double-sided light-emitting LED module light source is characterized in that: the graphite heat-conducting layer 2 is formed by mixing nano-scale graphite powder and 8448SPU.1I glue, and is evenly coated around the sapphire substrate 1 by special equipment .

The double-sided light-emitting LED module light source above is characterized in that the mass ratio of the nanoscale graphite powder to the 8448SPU.1I glue is 78.25%:21.75%.

The above-mentioned double-sided light-emitting LED module light source is characterized in that: the mixture of the nano-scale graphite powder and the 8448SPU.1I glue is printed on the sapphire substrate 1 and then fired, the firing temperature and time The first stage is 80°C for 1 hour, and the second stage is 120°C for 0.5 hours.

The above-mentioned double-sided light-emitting LED module light source is characterized in that: the thickness of the graphite heat-conducting layer 2 is 0.04mm-0.08mm.

The above-mentioned double-sided light-emitting LED module light source is characterized in that: the diameter of the graphite powder in the graphite heat-conducting layer 2 is between 50nm and 90nm.

The double-sided light-emitting LED module light source above is characterized in that: the adhesion of the graphite heat-conducting layer 2, that is, the peeling strength is ≥1.1Kgf/cm, that is, ≥6ib/inch, and the temperature resistance can reach 400°C.

Compared with prior art, the present invention has following advantage:

1. The invention coats the transparent sapphire LED double-sided light-emitting module with a high thermal conductivity coating, which completely solves the problem of heat conduction and heat dissipation of the double-sided light-emitting module, which is the first invention in the industry.

2. The present invention completely solves the difficult heat dissipation problem of the sapphire substrate substrate double-sided light-emitting package LED light source, reduces the light decay, prolongs the service life of the product, and increases the output power, thereby expanding the application field and producing high social and economic value.

3. The present invention has low cost of raw materials, low carbon and environmental protection, simple manufacturing process, easy to automate mass production, and greatly improves production efficiency.

4. The LED light source of the present invention can be widely used in household, commercial, locomotive, ship and other lighting fields.

【Description of drawings】

Fig. 1 is a perspective view of a double-sided light-emitting LED module of the present invention;

Fig. 2 is a plan view of the double-sided light-emitting LED module of the present invention;

Fig. 3 is an exploded view of the double-sided light-emitting LED module of the present invention;

Fig. 4 is a schematic structural view of LED chips of the present invention packaged on a sapphire substrate;

Fig. 5 is a schematic structural view of a graphite heat-conducting layer of the present invention coated on a sapphire substrate;

Fig. 6 is one of the legends of the application example of the present invention;

Fig. 7 is the second illustration of the application example of the present invention.

In the figure: 1 is the sapphire substrate; 2 is the graphite heat-conducting layer; 3 is the LED chip; 4 is the electric board; 5 is the heat sink; 6 is the phosphor glue.

【Detailed ways】

The technical features of the present invention will be described in further detail below in conjunction with the accompanying drawings so that those skilled in the art can understand.

A double-sided light-emitting LED module light source, as shown in Figures 1 to 7, includes a sapphire substrate 1, an LED chip 3 packaged on the sapphire substrate 1, a graphite heat-conducting layer 2 coated on the sapphire substrate 1, and an electric board 4.

The heat generated when the LED chip 3 is in operation is transferred to the heat sink applied to the lamp by the graphite heat conducting layer 2 coated around the sapphire substrate 1. The sapphire substrate 1 is transparent and outside the front and back of the double-sided light-emitting LED module. The layer is also coated with a layer of phosphor glue 6.

For the double-sided light-emitting LED module light source described above, the graphite heat-conducting layer 2 is coated around the sapphire substrate 1 by synthetic pyrolysis of nano-scale graphite powder, which has extremely small thermal resistance and high thermal conductivity.

For the double-sided light-emitting LED module light source mentioned above, the graphite heat-conducting layer 2 is formed by mixing nanoscale graphite powder and 8448SPU.1I glue, and is evenly coated around the sapphire substrate 1 by special equipment.

For the above-mentioned double-sided light-emitting LED module light source, the mass ratio of the nanoscale graphite powder mixed with the 8448SPU.1I glue is 78.25%:21.75%.

For the double-sided light-emitting LED module light source as described above, the mixture of the nanoscale graphite powder and the 8448SPU.1I glue is printed on the sapphire substrate 1 and then fired, and the firing temperature and time are the first stage 80°C for 1 hour, and the second stage at 120°C for 0.5 hours.

For the double-sided LED module light source described above, the thickness of the graphite heat-conducting layer 2 is 0.04mm-0.08mm.

For the double-sided light-emitting LED module light source mentioned above, the diameter of the graphite powder in the graphite heat-conducting layer 2 is between 50nm and 90nm, so the coating can be made very thin, and the thermal conductivity is very high, up to 1800W/m.K. The measured thermal resistance is 40% of the aluminum base material and 20% of the copper base material.

For the above-mentioned double-sided LED module light source, the adhesion of the graphite heat-conducting layer 2, that is, the peeling strength is ≥1.1Kgf/cm, that is, ≥6ib/inch, and the temperature resistance can reach 400°C.

During application, the sides of the double-sided light-emitting LED module can be pasted on the heat sink 5, as shown in FIG. 6 . It is also possible to paste the bottom surface of the double-sided light-emitting LED module on the heat sink 5, as shown in FIG. 7 .

The embodiments described in the present invention are only a description of the preferred implementation of the present invention, and are not intended to limit the concept and scope of the invention. Various modifications and improvements made should fall within the protection scope of the present invention.

Claims (8)

1. A double-sided light-emitting LED module light source is characterized in that: it comprises a sapphire substrate (1), an LED chip (3) packaged on the sapphire substrate (1), a graphite heat-conducting substrate coated on the sapphire substrate (1) layer (2) and electric board (4). 2. The double-sided light-emitting LED module light source according to claim 1, characterized in that: the graphite heat-conducting layer (2) is coated around the sapphire substrate (1) by synthetic pyrolysis of nano-scale graphite powder. 3. The double-sided light-emitting LED module light source according to claim 2, characterized in that: the graphite heat-conducting layer (2) is formed by mixing nano-scale graphite powder and 8448SPU.1I glue, and is evenly coated by special equipment around the sapphire substrate (1). 4. The double-sided light-emitting LED module light source according to claim 3, characterized in that: the mass ratio of the nanoscale graphite powder mixed with the 8448SPU.1I glue is 78.25%:21.75%. 5. The double-sided light-emitting LED module light source according to claim 4, characterized in that: the mixture of the nanoscale graphite powder and the 8448SPU.1I glue is printed on the sapphire substrate (1) and then fired. Roasting, the firing temperature and time are 1 hour at 80°C in the first stage, and 0.5 hour at 120°C in the second stage. 6. The double-sided light-emitting LED module light source according to claim 2, characterized in that: the thickness of the graphite heat-conducting layer (2) is 0.04mm-0.08mm. 7. The double-sided light-emitting LED module light source according to claim 2, characterized in that: the diameter of graphite powder in the graphite heat-conducting layer (2) is between 50nm and 90nm. 8. The double-sided light-emitting LED module light source according to claim 2, characterized in that: the adhesion of the graphite heat-conducting layer (2), that is, the peeling strength is ≥ 1.1Kgf/cm, that is, ≥ 6ib/inch, and the temperature resistance can reach 400 ℃.