CN101672460A - LED substrate heat radiation structure and LED lamp tube comprising same - Google Patents

Abstract

The present invention relates to an LED substrate heat dissipation structure, including an LED substrate with two or more solder joints, and a coating layer containing nano powder and a binder is covered on the solder joints of the LED substrate. The present invention also relates to an LED lamp tube including the LED substrate heat dissipation structure, wherein the LED substrate with the coating layer is accommodated in the LED lamp tube, and the coating layer has high emissivity, temperature resistance and insulation properties to accelerate the removal of heat from the LED substrate. In addition, the coating layer can increase the area of contact between the solder joint surface and the air, thereby expanding the heat dissipation area of the LED substrate and accelerating the heat removal.

Description

Heat dissipation structure of LED substrate and LED lamp tube including the structure

technical field

The invention relates to a heat dissipation structure of a substrate, in particular to a heat dissipation structure of a substrate of a light-emitting diode (LED) lamp tube.

Background technique

At present, light-emitting diodes (LEDs, Light Emitting Diode) have gradually replaced traditional light bulbs and are used in various lighting devices due to their low energy consumption, power saving, long service life, small size, and fast response, such as LED lamps. Tube is one of them.

The structure of applying LEDs to general lamp tubes is shown in Figure 1. A circuit board 20a is installed inside the light-transmitting tube body 10a, and two or more LED lamps 30a are arranged on the circuit board 20a. The light-transmitting tube body 10a The two ends are sleeved with metal conductive sleeves 40a, and conductive terminals 401a are provided on the conductive sleeves 40a. The LED lamp tube is inserted into the lamp holder through the conductive terminals 401a on both sides, so that it is powered on and The LED lamp 30a is made to emit light.

Among the above-mentioned LED lamp tubes, although the LED lamp 30a can emit light with only a small amount of electricity, the high heat generated at the same time will also cause the circuit board 20a to generate high temperature. If it cannot be effectively and timely dissipated, the High heat will damage the electronic components on the circuit board 20a due to high heat, resulting in increased maintenance and use costs.

Contents of the invention

In view of this, an object of the present invention is to provide a heat dissipation structure of an LED substrate that can expedite heat removal.

Another object of the present invention is to provide an LED lamp tube including an LED substrate heat dissipation structure that can effectively improve heat dissipation efficiency and increase LED service life.

In order to achieve the above purpose, the present invention provides a LED substrate heat dissipation structure for LED lamp tubes, which includes an LED substrate with two or more solder joints, and a coating layer on the solder joints of the LED substrate. The coating layer includes nanometer powder and binder.

In order to achieve the above object, the present invention also provides an LED lamp tube including a heat dissipation structure of an LED substrate, comprising: an LED substrate having an irradiation surface and a heat dissipation surface and two or more solder joints arranged thereon, and the irradiation surface is provided with two one or more than two LED lamps; a coating layer coated on the solder joints, the coating layer contains nano powder and a binder; Two or more heat dissipation holes are respectively provided on the tube wall opposite to the heat dissipation surface of the LED substrate.

In the heat dissipation structure of the LED substrate of the present invention, the coating layer of the LED substrate has the characteristics of high emissivity (high radiation), temperature resistance and insulation, so as to accelerate the removal of heat generated by the LED substrate.

The heat dissipation structure of the LED substrate of the present invention can increase the contact area of the surface of the solder joint with the air by means of the coating layer of the LED substrate, which is beneficial to increase the heat dissipation area of the LED substrate to discharge heat.

The heat dissipating structure of the LED substrate of the present invention, by virtue of the waterproofness of the coating layer of the LED substrate, can prevent the circuit of the LED substrate from short-circuiting when external moisture adheres to the surface of the LED substrate. In addition, it has anti-oxidation, strong acid resistance and Strong alkali and other characteristics can increase durability and prolong the service life of LED substrates.

The LED lamp tube including the heat dissipation structure of the LED substrate of the present invention can quickly discharge the hot air in the LED lamp tube and effectively improve the heat dissipation efficiency, thereby maintaining the luminous efficiency of the LED lamp and increasing the service life of the LED to reduce maintenance and use Cost, improve practicality and convenience.

Description of drawings

Fig. 1 is a sectional view of a known LED lamp tube;

2 is a perspective view of the heat dissipation structure of the LED substrate of the present invention;

3 is a partial cross-sectional view of the heat dissipation structure of the LED substrate of the present invention;

Fig. 4 is a perspective view of an LED lamp tube including an LED substrate heat dissipation structure according to the present invention;

FIG. 5 is a schematic diagram of the use of the LED lamp tube including the heat dissipation structure of the LED substrate according to the present invention.

Explanation of reference signs

10a Translucent tube body 20a Circuit board

30a LED lamp 40a lead sleeve

401a conductive terminal

1LED tube 10LED substrate

101 Irradiation surface 102 Heat dissipation surface

11 circuit 12 solder joints

20 LED lamps 21 luminescent grains

22 conductive pins 23 light-transmitting mirror

30 coating layer 40 tube body

41 cooling hole 42 conductive terminal

50 lamp holders 51 sockets

Detailed ways

The detailed description and technical content of the present invention are described below with accompanying drawings, but the attached drawings are only for reference and description, and are not intended to limit the present invention.

Please refer to Fig. 2, which is a perspective view of the heat dissipation structure of the LED substrate of the present invention; the present invention provides a heat dissipation structure of the LED substrate, including an LED substrate 10, the LED substrate 10 has an irradiation surface 101 and a heat dissipation surface 102, two or more LEDs The lamps 20 are electrically connected to the LED substrate 10 and arranged at intervals on the irradiated surface 101 of the LED substrate 10. Points 12 , and the LED substrate 10 is covered with a coating layer 30 comprising nano powder and a binder on the solder points 12 .

The coating layer 30 comprises 70% to 80% by weight of nano-powder and 10% to 20% by weight of a binder, wherein the nano-powder can be heat radiation nano-powder, which is high emissivity nano-clay, nano-silica And far-infrared ceramic powder (ZrSiO ₄ , Al ₂ O ₃ , TiO ₂ , (Ce, La, Nd) PO ₄ mixed sintered product) or a mixture of the three, add a little solvent (about 10% to 15% weight) and mix the binder, which is polyimide resin, polymethylmethacrylate (PMMA, Poly MethylMethacrylate) resin or polyester resin, because the binder has extremely high heat resistance ( ≥250℃) and radiation resistance, not easy to melt, good flame resistance, impact resistance, wear resistance, good dielectric properties and small linear expansion coefficient, etc., formed by mixing the heat radiation nano powder with the binder Coating layer 30 (the preferred value of its thickness is 10～30 microns), because this coating layer 30 is nano-scale thermal radiation paint, can improve the thermal radiation coefficient of this LED substrate 10 surface and have high heat dissipation efficiency, also can simultaneously It is waterproof, and when external moisture adheres to the surface of the LED substrate 10, it can prevent the short circuit phenomenon of the circuit 11 of the LED substrate 10, taking into account the temperature resistance, strength, durability and appearance of the coating layer 30, and fits the needs.

Alternatively, the nanopowder can be boron nitride powder, add a water-based or oily dispersed film release agent (about 10% to 20% by weight), and mix the binder as in the above structure to form another coating layer 30 (The preferred value of its thickness is 10-25 microns). Since the boron nitride powder is an inorganic powder, it has excellent adhesion and chemical resistance. It is also an excellent insulating and heat-conducting material. Contaminated adhesive makes the coating layer 30 have high heat dissipation, high radiation, high temperature resistance and strong acid and alkali resistance, not only insulation but also oxidation resistance; therefore, one of the above coating layers 30 is coated on the LED When the solder joints 12 of the substrate 10 are placed, the surface of the LED substrate 10 can have high heat dissipation efficiency, and the contact area between the solder joints 12 and the air can be increased to facilitate rapid heat dissipation. It is an excellent heat dissipation material for the substrate.

Please refer to FIG. 3 , which is a partial cross-sectional view of the LED substrate heat dissipation structure used for LED lamp tubes of the present invention; More than a plurality of conductive pins 22 and a light-transmitting mirror 23 that seals and covers the light-emitting crystal grain 21 and the conductive pins 22, these conductive pins 22 pass through the LED substrate 10, and the other side of the LED substrate 10 ( Two or more solder joints 12 are formed on the heat dissipation surface 102 ), wherein the solder joints 12 are coated with the coating layer 30 .

Please refer to Figure 4 and Figure 5, which are the three-dimensional schematic diagram and the schematic diagram of the use of the LED lamp tube including the LED substrate heat dissipation structure of the present invention; the LED lamp tube 1 includes a tube body 40 made of light-transmitting plastic, the LED The substrate 10 has an irradiation surface 101 and a heat dissipation surface 102, and two or more solder joints 12 are arranged, and a coating layer 30 is coated on the solder joints 12, and the LED substrate 10 is accommodated in the tube body 40, The two ends of the tube body 40 are protrudingly provided with conductive terminals 42, thereby completing the LED lamp tube 1 with the LED substrate heat dissipation structure; in addition, in this embodiment, the left and right sides of the tube body 40 are opposite to the LED tube 40. Two or more heat dissipation holes 41 are respectively provided on the tube wall of the heat dissipation surface 102 of the substrate 10. In actual implementation, the tube body 40 may also be provided with a Two or more cooling holes 41 .

The LED lamp tube 1 is installed in the lamp holder 50, and the socket 51 is arranged in the lamp holder 50, and the conductive terminals 42 at both ends of the tube body 40 are respectively inserted in the socket 51 to conduct the power supply, so that the socket 51 located on the LED The LED lamp 20 on the irradiation surface 101 of the substrate 10 emits light. After using for a period of time, the heat generated by the LED lamp 20 dissipates from the heat dissipation surface 102 of the LED substrate 10 and collects in the tube body 40. Since these solder joints 12 are coated with There is a coating layer 30, the coating layer 30 can accelerate the heat radiation rate, and can increase the contact area between these solder joints 12 and the air to greatly dissipate heat, so as to quickly dissipate the heat of the LED substrate 10 on the In the pipe body 40, at this time, the external air enters the pipe body 40 from the cooling hole 41 on the side of the pipe body 40, absorbs the heat in the pipe body 40 and flows along the inner wall of the pipe body 40, and the heated air flows from the pipe body 40 The cooling hole 41 on the other side escapes, and then takes away the heat in the tube body 40; Enter the tube body 40 to absorb the heat in the tube body 40 , and the heated air escapes from the cooling holes 41 on both sides of the tube body 40 .

Therefore, the heat dissipation structure of the LED substrate of the present invention and the LED lamp tube comprising the structure can expedite the elimination of heat generated by the LED substrate 10 due to the characteristics of the coating layer 30 having high emissivity (high emissivity), temperature resistance, and insulation. The heat generated; in addition, the coating layer 30 can increase the surface area of the solder joint 12 of the LED substrate 10 in contact with the air, so as to expand the heat dissipation area of the LED substrate 10 and accelerate heat dissipation. In addition, due to the coating layer 30 has the characteristics of waterproof, anti-oxidation, strong acid and strong alkali resistance, etc., which increases durability and prolongs the service life of the LED substrate 10, thus increasing the convenience and practicality of use.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention shall fall within the patent scope of the present invention.

Claims (20)

1, a kind of LED base plate heat radiation structure is characterized in that, comprises the LED substrate that is laid with two or more solder joints, and this LED substrate is coated with coating layer on this solder joint, and this coating layer comprises nanometer powder and binding agent.

2, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described nanometer powder is the heat radiation nanometer powder, and it is nanoclay, nano silicon and far infrared ceramic powder end one of them or three's a mixture.

3, LED base plate heat radiation structure as claimed in claim 2 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～15% weight solvent.

4, LED base plate heat radiation structure as claimed in claim 2 is characterized in that, the thickness of described coating layer is 10～30 microns.

5, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described nanometer powder is a boron nitride powder.

6, LED base plate heat radiation structure as claimed in claim 5 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～20% weight remover.

7, LED base plate heat radiation structure as claimed in claim 5 is characterized in that, the thickness of described coating layer is 10～25 microns.

8, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described binding agent is a polyimide resin.

9, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described binding agent is a plexiglass.

10, LED base plate heat radiation structure as claimed in claim 1 is characterized in that, described binding agent is polynary ester resin.

11, a kind of LED fluorescent tube that comprises the LED base plate heat radiation structure is characterized in that, comprising:

The LED substrate has shadow surface and radiating surface and is laid with two or more solder joints, and this shadow surface is provided with two or more LED lamps;

Coating layer is coated on this solder joint, and this coating layer comprises nanometer powder and binding agent; And

Body has been installed with this LED substrate, and left and right two sides of this body are respectively equipped with two or more louvres on the tube wall of the radiating surface of relative this LED substrate.

12, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described nanometer powder is the heat radiation nanometer powder, and it is nanoclay, nano silicon and far infrared ceramic powder end one of them or three's a mixture.

13, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 12 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～15% weight solvent.

14, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 12 is characterized in that, the thickness of described coating layer is 10～30 microns.

15, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described nanometer powder is a boron nitride powder.

16, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 15 is characterized in that, described coating layer comprises 70%～80% weight nanometer powder, 10%～20% weight binding agent and 10%～20% weight remover.

17, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 15 is characterized in that, the thickness of described coating layer is 10～25 microns.

18, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described binding agent is a polyimide resin.

19, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described binding agent is a plexiglass.

20, the LED fluorescent tube that comprises the LED base plate heat radiation structure as claimed in claim 11 is characterized in that, described binding agent is polynary ester resin.

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