JP2020021724A - Light emitting diode filament bulb - Google Patents

Abstract

To provide a light emitting diode filament bulb capable of improving the effect of heat dissipation and heat radiation of the light emitting diode filament bulb.SOLUTION: A light emitting diode filament bulb includes a base 10, a filament support 40, a transparent bulb 20 and a light emitting diode filament 30, and the filament support and the base are electrically connected. The filament support includes two metal support wires 41, 42, and the light emitting diode filament includes two electrode pins 31, 32 electrically connected to the two metal support wires respectively and for forming a drive circuit. Out of these, on the surface of the two metal support wires, a coating material including graphene or boron nitride (BN) is coated, and a heat dissipation and black body radiation layer are formed. A substrate of the light emitting diode filament includes a heat radiation heat dissipation film on the back surface, a heat convection of a gas inside the transparent bulb is promoted and heat radiation capacity is enhanced.SELECTED DRAWING: Figure 1

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a light bulb, and more particularly, to a light emitting diode filament light bulb capable of improving heat radiation and heat radiation of a light emitting diode filament light bulb.

  The light-emitting diode lighting technology refers to a technology using a light-emitting diode (light-emitting diode, LED) as an illumination light source. In recent years, the manufacturing technology of the light-emitting diode has greatly advanced, and particularly, high-output, high-luminance white light emission. Diodes have been successfully developed. Based on the ideal of green energy and environmental protection, light emitting diode bulbs (LED bulbs) employing light emitting diodes as light emitting elements have already been sold in large quantities, such as light emitting diode bulbs used for lighting and night lights using light emitting diodes. There are lamps.

  Due to the excellent properties of light emitting diodes, some manufacturers have already manufactured light emitting diode chips (LED chips) into light emitting diode filaments and packaged them in transparent light bulbs to replace conventional incandescent lamps. Light-emitting diode filamentThe light-emitting diode filament used for a light bulb generally uses a transparent substrate such as a glass substrate or a sapphire substrate.A plurality of light-emitting diode chips are adhered to one surface of the transparent substrate, and wire bonding is performed. Light emitting diode filaments are formed through the process of applying a fluorescent resin. Conventional light emitting diode filament light bulbs adopt the elongated filament design philosophy and can use multiple light emitting diode filaments in a transparent light bulb to provide the same 360 degree emission as an incandescent light bulb, but with incandescent performance Beyond the light bulb.

  The amount of heat generated by the conventional light emitting diode filament light bulb is mainly derived from the light emitting diode, and the conventional light emitting diode filament light bulb radiates heat mainly through heat conduction, heat convection, and heat radiation. Among them, the light emitting diode filament light bulb is made by using glass as the filament support to support the light emitting diode filament, it does not have excellent heat conduction ability, and most of the heat generated by the light emitting diode is due to heat radiation and inside the transparent bulb It is necessary to transmit heat to the transparent valve through the filling gas, and to release heat by thermal convection generated by contact between the external air and the transparent valve. For this reason, the light emitting diode filament light bulbs exhibit better light emission performance than the conventional incandescent light bulbs, but there is still a need to improve the problem that the light emitting diode filament light bulbs have poor heat radiation and heat radiation effects.

  SUMMARY OF THE INVENTION It is an object of the present invention to provide a light emitting diode filament lamp that can improve the effects of heat radiation and heat radiation of the light emitting diode filament lamp.

  To achieve the above object, one embodiment of the light emitting diode filament bulb of the present invention includes a base, a transparent bulb, at least one filament support, and at least one light emitting diode filament, wherein the transparent bulb has an open end. Wherein the base has a positive power supply terminal and a negative power supply terminal, and can be electrically connected to an external power supply for providing drive power for driving the light emitting diode filament; The filament support includes two metal support lines, and the two metal support lines are electrically connected to the positive power supply terminal and the negative power supply terminal, respectively, and are used for transmitting driving power. A light emitting diode filament comprising: a substrate; first and second electrode pins disposed at both ends of the substrate; A heat radiation heat dissipation film formed on the surface, at least one light emitting diode chip (hereinafter abbreviated as LED chip) fixed to the front side of the substrate, a conductive wire, and a phosphor. The first electrode pin and the second electrode pin are electrically connected to each other to form a series connection circuit, and the first electrode pin and the second electrode pin are electrically connected to the two metal support lines, respectively. Connected to form a driving circuit, in which a paint containing graphene or boron nitride is applied to the surface of the two metal support lines to form a heat dissipation and blackbody radiation layer, and the light emitting diode filament and The filament support is installed in the transparent bulb, the base is attached to the opening of the transparent bulb, and the opening is sealed to seal the transparent bulb. It is made.

  In one embodiment of the present invention, the metal support line of the filament support may be any of a straight line and an arc.

  In one embodiment of the present invention, two or more filament supports are included, and two metal support wires of each filament support are electrically connected to the positive power terminal and the negative power terminal of the base, respectively.

  One embodiment of the present invention includes a plurality of light emitting diode filaments connected in parallel.

  In one embodiment of the present invention, the plurality of light emitting diode filaments include a plurality of the light emitting diode filaments, and the plurality of light emitting diode filaments are electrically connected to the two metal support lines of the filament support in a plurality of parallel / a plurality of series. Is done.

  In one embodiment of the present invention, the first electrode pin and the second electrode pin are fixed to the front side of the substrate by a die bond material containing graphene or hexagonal boron nitride.

  In one embodiment of the present invention, the substrate of the LED filament includes any one of a metal substrate, a ceramic substrate, a glass substrate, and a plastic substrate.

  In one embodiment of the present invention, the substrate of the light emitting diode filament includes any one of a metal substrate, a flexible ceramic substrate, a flexible glass substrate, and a plastic substrate.

  In one embodiment of the present invention, the light emitting diode filament includes one of a linear light emitting diode filament, a curved light emitting diode filament, and a combination thereof.

  In one embodiment of the present invention, a power controller is installed in the base, the power controller is electrically connected to the base, converts electric energy provided by an external power supply, and drives the light emitting diode filament. It is used to make the driving power of

  In an embodiment of the present invention, the heat radiation heat dissipation ink is applied to the back surface of the substrate by using any one of the processes of spray coating, brush coating, screen printing, and nozzle printing. And the heat radiation heat dissipation ink contains a heat dissipation filler, a dispersant, and a binder.

  In one embodiment of the present invention, at least the radiating filler is at least one of a carbon material, a metal particle, a ceramic material, and a far-infrared radiating powder, or a mixture of a plurality of the above-described radiating fillers. Including.

  In one embodiment of the present invention, the carbon material includes at least one of graphene, carbon black, graphite, carbon nanotube, and activated carbon, or a mixture of a plurality of the carbon materials described above. .

  In one embodiment of the present invention, the metal particles include at least copper (Cu), nickel (Ni), zinc (Zn), iron (Fe), cobalt (Co), silver (Ag), gold (Au), Includes any one of platinum (Pt) and their alloys, or a mixture of multiple types of metal particles.

  In one embodiment of the present invention, the far-infrared radiation powder includes at least silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium dioxide (TiO2), zirconium oxide (ZrO2), zirconium carbide (ZrC), silicon carbide (SiC). ), Tantalum carbide (TaC), titanium diboride (TiB2), zirconium diboride (ZrB2), titanium disilicide (TiSi2), silicon nitride (Si3N4), titanium nitride (TiN), boron nitride (BN). Any one of them, or a mixture of the above-mentioned plurality of far-infrared radiation powders is included.

  For this reason, as can be seen from the above technical content, the light emitting diode filament lamp of the present invention provides the heat conductivity and heat conduction of the filament support and the light emitting diode filament through the metal support wire, the heat radiation and black body radiation layer, and the heat radiation heat radiation film. The radiation area can be increased to promote the heat convection of the gas inside the transparent bulb, enhance the heat radiation, and improve the heat radiation and heat radiation effect of the light emitting diode filament bulb.

  A specific implementation method of the present invention and its technical features and effects will be described below with reference to the drawings.

FIG. 2 is a structural view of one embodiment of a light emitting diode filament light bulb of the present invention. FIG. 4 is a partial structural view of another embodiment of the light-emitting diode filament light bulb of the present invention, showing a state in which the light-emitting diode filament is arranged in another manner on the filament support. FIG. 4 is a partial structural view of another embodiment of the light-emitting diode filament light bulb of the present invention, showing a state in which the light-emitting diode filament is arranged in another manner on the filament support. FIG. 4 is a partial structural view of another embodiment of the light-emitting diode filament light bulb of the present invention, showing a state in which the light-emitting diode filament is arranged in another manner on the filament support. FIG. 4 is a partial structural view of another embodiment of the light emitting diode filament light bulb according to the present invention, showing a state in which the light emitting diode filament is arranged on a filament support. FIG. 6 is a sectional view of the light emitting diode filament shown in FIG. 5. FIG. 6 is a sectional view of an electrical connection between the light emitting diode filament and the metal support line shown in FIG. 5. FIG. 3 is a partial structural view of another embodiment of the light emitting diode filament light bulb of the present invention, showing the structure of the light emitting diode filament and the arc-shaped metal support wire. FIG. 3 is a partial structural view of another embodiment of the light emitting diode filament light bulb of the present invention, showing the structure of the light emitting diode filament and the arc-shaped metal support wire.

  First, FIG. 1 shows a structural diagram of one embodiment of a light emitting diode filament light bulb of the present invention. The light emitting diode filament bulb includes a base 10, a transparent bulb 20, at least one filament support 40, and at least one light emitting diode filament 30.

  Among them, the base 10 can be electrically connected to an external power supply for providing driving power for driving the light emitting diode filament 30, and the type of the base 10 can be any of a screw base, a plug-in base, and a bayonet base. Including, but not limited to, screw-type bases (see base 10 shown in FIG. 1), those whose current model number starts with the letter E of the alphabet (eg, E22, E26, E27, etc.), plug-in bases Is a model whose current model number starts with the letter G of the alphabet (eg, GU10), and a bayonet-type base is a model whose current model number starts with the letter B of the alphabet. In general, the light emitting diode filament 30 is driven by DC driving power to emit light, and one of the embodiments is to provide DC driving power directly from an external power source, for example, by mounting the base 10 to a socket connected to a DC power source. . In another embodiment, an external power supply (for example, an AC power supply) is converted into DC driving power by the base 10. For example, as in the embodiment shown in FIG. The controller 50 is electrically connected to the base 10, and the power supply controller 50 is basically a driving circuit of a light emitting diode, and the input side of such a driving circuit is electrically connected to the AC power supply through the base 10, The power supply controller 50 includes a power supply terminal having two different polarities, that is, a positive power supply terminal 51 and a negative power supply terminal 52 for outputting DC drive power, so that the power supply controller 50 converts electric energy provided by an external power supply. The driving power for driving the light emitting diode filament 30 can be used. For example, the base 10 is attached to a socket connected to an AC power source, and the power controller 50 converts electric energy provided by the AC power source into DC driving power for driving the light emitting diode filament 30.

  The transparent bulb 20 is a translucent hollow shell having an opening 21. Generally, the transparent bulb 20 is made of glass, and the light emitting diode filament 30 and the filament support 40 are transparent through the opening 21 of the transparent bulb 20. After the filling gas (usually nitrogen or other inert mixed gas) is injected into the transparent valve 20, the opening 21 is sealed with the base 10, and the transparent valve 20 is sealed. .

  The filament support 40 includes two metal support lines 41 and 42, and the two metal support lines 41 and 42 are electrically connected to the positive power supply terminal 51 and the negative power supply terminal 52 of the base 10, respectively. Used for One of the methods is as shown in FIG. 1 in which the base 10 includes a glass mount 11, the lower ends of two metal support wires 41 and 42 are fixed to the mount 11, and the two metal support wires 41 After the lower end of 42 is pierced through mount 11, it is electrically connected to positive power terminal 51 and negative power terminal 52 of power controller 50, respectively.

  As shown in FIG. 6, the structure of the light emitting diode filament 30 includes a substrate 60, at least one LED chip 61 (preferably a plurality of LED chips 61) is fixed on the front side of the substrate 60, The first electrode pin 31 and the second electrode pin 32 are fixed, and the first electrode pin 31 and the second electrode pin 32 are electrically connected to the two metal support lines 41 and 42, respectively, to form a drive circuit. In one preferred embodiment, the LED chip 61, the first electrode pin 31 and the second electrode pin 32 are fixed to the front side of the substrate 60 by a die bond material 63 containing graphene or boron nitride, and a plurality of the LED chips 61 64 electrically connects the first electrode pin 31 and the second electrode pin 32 in series. The wire 64 is completed by the existing wire bonding process. Also, the phosphor 65 packages all the LED chips 61 therein, only the first electrode pins 31 and the second electrode pins 32 are exposed, and a heat radiation heat dissipation film 62 is formed on the back surface of the substrate 60. In a preferred embodiment shown in FIG. 7, the substrate 60 is fixed to one surface of the two metal support lines 41 and 42 using an insulating die bond material 70 having electrical insulation, and the substrate 60 is A short circuit is not formed between the support lines 41 and 42.

  In one embodiment of the present invention, the first electrode pin 31 and the second electrode pin 32 of the light emitting diode filament 30 are directly soldered to one side surface of the metal support wires 41 and 42 by using soldering. A connection is formed, and the light emitting diode filament 30 can be driven to emit light by the DC drive power transmitted by the two metal support lines 41 and 42. As shown in FIG. 7, in one embodiment of the present invention, two metal support lines 41 and 42 are coated with a coating material containing graphene, boron nitride (BN), or other thermally conductive ceramic powder on the surfaces thereof. This is applied to form the heat radiation and black body radiation layer 43. Preferably, a heat radiation and black body radiation layer 43 is applied to another surface of each of the two metal support wires 41 and 42 opposite to the side on which the first electrode pin 31 and the second electrode pin 32 are soldered. When a part of the heat generated by the light emitting diode filament 30 is transmitted to the two metal support wires 41 and 42 through the first electrode pin 31 and the second electrode pin 32, the heat is contained in the heat radiation and black body radiation layer 43. Through the flake structure of graphene, boron nitride (BN), or other thermally conductive ceramic powder, the thermal conductivity, heat dissipation, and heat radiation area of the two metal support wires 41 and 42 can be increased. In addition, due to the excellent heat radiation ability of graphene, boron nitride, or other thermally conductive ceramic powder, the effects of heat exchange and heat convection between the two metal support wires 41 and 42 and the filling gas inside the transparent bulb 20 can be enhanced. Thus, the heat radiation and heat radiation effect of the light emitting diode filament bulb can be improved.

  The material of the substrate 60 of the light emitting diode filament 30 includes any one of a metal substrate, a ceramic substrate, a glass substrate, a sapphire substrate, and a plastic substrate. According to another preferred embodiment of the present invention, the light emitting diode filament 30 is bendable, and the substrate 60 which is the bendable light emitting diode filament 30 is a metal substrate, a flexible ceramic substrate, a flexible glass. The substrate includes any one of a flexible glass substrate and a plastic substrate.

  In a preferred embodiment of the present invention, any one of spray coating, brushing, screen printing, nozzle printing is used, and the heat radiation heat radiation is performed. Ink is applied to the rear surface of the substrate 60 to form the heat radiation heat dissipation film 62, in which the components of the heat radiation heat dissipation ink are heat dissipation fillers, dispersants, and binders. Including.

  The radiating filler may be at least one of a carbon material, metal particles, a ceramic material, and far-infrared radiation powder (infrared-ray radiation powders), or a plurality of the above-described radiating fillers. Contains mixtures.

  The carbon material may be at least one of graphene, carbon black, graphite, carbon nanotubes, activated carbon, or a plurality of activated carbon described above. And mixtures of carbon materials.

  The metal particles are at least copper (Cu), nickel (Ni), zinc (Zn), iron (Fe), cobalt (Co), silver (Ag), gold (Au), platinum (Pt) and alloys thereof. Or a mixture of a plurality of types of metal particles described above.

  Among them, far infrared radiation powder is at least silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium dioxide (TiO2), zirconium oxide (ZrO2), zirconium carbide (ZrC), silicon carbide (SiC), tantalum carbide (TaC), Any one of titanium diboride (TiB2), zirconium diboride (ZrB2), titanium disilicide (TiSi2), silicon nitride (Si3N4), titanium nitride (TiN), boron nitride (BN), or It includes a mixture of a plurality of types of far infrared radiation powders described above.

  In a preferred embodiment of the present invention, the light emitting diode filament 30 may include one of a bendable and a non-bendable and a combination thereof, and FIG. In the embodiment shown in FIG. 9, the light emitting diode filament 30 includes a non-bendable light emitting diode filament.

  In an embodiment of the present invention, the method of arranging the light emitting diode filament 30 and the filament support 40 includes the structure of a plurality of embodiments, and will be described below with reference to the drawings.

  As shown in FIG. 1, one embodiment of the present invention includes a plurality of light emitting diode filaments 30 arranged in parallel, and the two metal supports of the same filament support 40 are connected in a parallel connection relationship. It is electrically connected to the lines 41 and 42.

  FIG. 2 is a partial structural view of another embodiment of the present invention, showing another arrangement method of the light emitting diode filament 30 on the filament support 40. The light emitting diode filaments 30 include a plurality of light emitting diode filaments 30. The light emitting diode filaments 30 are arranged on opposite sides of a plane formed by the two metal support lines 41 and 42, respectively. In the connection relationship, the light emitting diode filaments 30 electrically connected to the two metal support lines 41 and 42 of the same filament support 40 and on opposite sides of the plane formed by the two metal support lines 41 and 42 are mutually connected. By increasing the number of light emitting diode filaments 30 arranged in a cross and in a single transparent bulb 20, the lux of the light emitting diode filament bulb can be increased. In another embodiment shown in FIG. 3, a light emitting diode filament bulb of the present invention includes two or more filament supports 40, here including two filament supports 40a, 40b, of either filament support 40a or 40b. The two metal support wires 41 and 42 are also electrically connected to the positive power terminal 51 and the negative power terminal 52 of the base 10, respectively.

  As shown in FIG. 4, the multiple parallel / multiple serial arrangement method includes the filament set S electrically connected to the two metal support lines 41 and 42 of the same filament support 40 in a plurality of parallel connections. Each of the filament sets S includes two mutually connected light emitting diode filaments 30 connected in series.

  In one embodiment of the present invention, the two metal support lines 41 and 42 of the filament support 40 may be either a straight line (see FIGS. 1 to 5) or an arc, of which the arc is formed. An embodiment of the two metal support lines 41, 42 is shown in FIGS.

  Although the present invention has been disclosed through the above embodiments, the above description is not used to limit the present invention, and those skilled in the art will be able to make some modifications and alterations without departing from the spirit and scope of the present invention. Modification would be possible. Therefore, the protection scope of the present invention is in accordance with the definition of the claims appended hereto.

Reference Signs List 10 Base 11 Mount 20 Transparent bulb 21 Opening 30 Light emitting diode filament 31 First electrode pin 32 Second electrode pin 40a, 40b Filament support 41, 42 Metal support wire 43 Heat radiation and black body radiation layer 50 Power controller 51 Positive power supply terminal 52 Negative electrode Power supply terminal 60 Substrate 61 LED chip 62 Thermal radiation film 63 Die bonding material 64 Conducting wire 65 Phosphor 70 Insulating die bonding material S Filament set

Claims (15)

A light emitting diode filament bulb comprising a base, a transparent bulb, at least one filament support, and at least one light emitting diode filament,
The transparent bulb is a light-transmitting hollow shell having an opening, and the base has a positive power supply terminal and a negative electrode electrically connectable to an external power supply used to provide driving power for driving the light emitting diode filament. A power supply terminal, wherein the filament support includes two metal support wires, and the two metal support wires are electrically connected to the positive power terminal and the negative power terminal, respectively, and are used for transmitting the driving power. And
The light emitting diode filament has a substrate, first and second electrode pins disposed at both ends of the substrate, a heat radiation heat dissipation film formed on a back surface of the substrate, and at least a light emitting diode fixed to a front side of the substrate. One LED chip, a lead wire, and a phosphor, wherein the lead wire connects the LED chip in series, and is electrically connected to the first electrode pin and the second electrode pin to form a series connection circuit; A first electrode pin and the second electrode pin are respectively electrically connected to the two metal support lines to form a driving circuit; the light emitting diode filament and the filament support are installed in the transparent bulb; A base is attached to the opening of the transparent valve to seal the opening, and a seal is formed in the transparent valve.
A light-emitting diode filament light bulb, characterized in that:   The light emitting diode filament bulb according to claim 1, wherein a heat radiation and black body radiation layer is applied to the surfaces of the two metal support lines.   Including two or more of the filament supports, wherein the two metal support wires of any of the filament supports are electrically connected to the positive power terminal and the negative power terminal of the base, respectively. The light emitting diode filament light bulb according to claim 1.   The method according to claim 1, comprising a plurality of light emitting diode filaments, wherein the plurality of light emitting diode filaments are electrically connected to the two metal support wires of the filament support in a parallel connection relationship. Light emitting diode filament bulb.   Claims: A plurality of the light emitting diode filaments, wherein the plurality of light emitting diode filaments are electrically connected to the two metal support lines of the filament support in a plurality of parallel / a plurality of series. Item 2. A light emitting diode filament bulb according to item 1.   The first electrode pin and the second electrode pin are fixed to the front side of the substrate with a die bond material containing graphene or hexagonal boron nitride, and a plurality of the LED chips are connected in series by the conductive wire to the first electrode pin. The method of claim 1, wherein the phosphor is electrically connected to the second electrode pin, and the phosphor packages the plurality of LED chips therein to expose the first electrode pin and the second electrode pin. 2. The light emitting diode filament light bulb according to 1.   The light emitting diode filament light bulb according to claim 6, wherein the substrate of the light emitting diode filament includes any one of a metal substrate, a ceramic substrate, a glass substrate, and a plastic substrate.   The substrate according to claim 6, wherein the substrate of the light emitting diode filament includes one of a metal substrate, a flexible ceramic substrate, a flexible glass substrate, and a plastic substrate. A light emitting diode filament bulb as described.   The light emitting diode filament bulb according to claim 1, wherein the light emitting diode filament includes one of a linear light emitting diode filament and a curved light emitting diode filament and a combination thereof.   A power controller is installed in the base, the power controller is electrically connected to the base, and converts electric energy provided by an external power supply to be used for driving electric power to drive the light emitting diode filament. The light emitting diode filament bulb according to claim 1, characterized in that:   Applying any one of spray coating, brushing, screen printing, and nozzle printing to apply heat radiation ink to the rear surface of the substrate. The thermal radiation radiating film is formed, and the components of the thermal radiation radiating ink include radiation fillers, dispersants, and binders. Light emitting diode filament bulb.   The heat-dissipating filler is at least one of a carbon material, metal particles, a ceramic material, and far-infrared radiation powders, or a mixture of a plurality of the heat-dissipating fillers described above. The light-emitting diode filament light bulb according to claim 11, comprising:   The carbon material is at least one of graphene, carbon black, graphite, carbon nanotubes, activated carbon, or a plurality of the above-described activated carbons. 13. The light-emitting diode filament light bulb according to claim 12, comprising a mixture of the following carbon materials.   The metal particles are at least copper (Cu), nickel (Ni), zinc (Zn), iron (Fe), cobalt (Co), silver (Ag), gold (Au), platinum (Pt) and alloys thereof. The light-emitting diode filament light bulb according to claim 11, wherein the light-emitting diode filament light bulb comprises any one of them or a mixture of the above-mentioned plural kinds of metal particles.   The far-infrared radiation powder is at least silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium dioxide (TiO2), zirconium oxide (ZrO2), zirconium carbide (ZrC), silicon carbide (SiC), tantalum carbide (TaC), Any one of titanium diboride (TiB2), zirconium diboride (ZrB2), titanium disilicide (TiSi2), silicon nitride (Si3N4), titanium nitride (TiN), boron nitride (BN), or 13. The light-emitting diode filament bulb according to claim 12, comprising a mixture of a plurality of types of far-infrared radiation powder as described above.

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