CN107841745A - Shell manufacturing method, shell and electronic equipment - Google Patents

Abstract

The embodiment of the application discloses casing manufacturing method, casing and electronic equipment, through forming dyed layer and leading layer in proper order on the surface in the substrate orientation electronic equipment outside, the surface on leading layer has the pore structure, the pore structure includes a plurality of holes, the pore structure takes place the photocatalytic reaction when received light shines, decomposes the organic matter into carbon dioxide and water, also will be attached to the grease degradation in the fingerprint of casing surface to reach the purpose of automatic elimination fingerprint.

Description

Shell manufacturing method, shell and electronic device

technical field

The present application relates to the technical field of electronic equipment, and in particular to a manufacturing method of a housing, the housing and electronic equipment.

Background technique

At present, electronic devices, such as mobile phones and tablet computers, tend to stick fingerprints to the outer surface of the housing.

Contents of the invention

Embodiments of the present application provide a shell manufacturing method, shell and electronic equipment, which can automatically clean fingerprints on the outer surface of the shell.

An embodiment of the present application provides a casing manufacturing method, the casing is applied to an electronic device, and the casing manufacturing method includes:

A substrate is provided, the substrate includes a first surface and a second surface, the first surface faces the inside of the electronic device, and the second surface faces the outside of the electronic device;

disposing a colored layer on the second surface of the substrate;

disposing a pre-layer on the coloring layer; and

A pore structure is formed by etching the pre-layer, and the pore structure includes a plurality of holes, and when the pore structure receives light irradiation, a photocatalytic reaction occurs to degrade the organic matter.

The embodiment of the present application also provides a casing, which is applied to electronic equipment, the casing includes a base material, a colored layer and a pre-layer, the base material includes a first surface and a second surface, and the first One surface faces toward the inside of the electronic device, the second surface faces toward the outside of the electronic device, the colored layer and the pre-layer are sequentially arranged on the second surface of the substrate, the surface of the pre-layer has a pore structure, and the The pore structure includes several holes, and when the pore structure receives light irradiation, a photocatalytic reaction occurs to degrade the organic matter.

The embodiment of the present application also provides an electronic device, including a casing, the casing includes a substrate, a colored layer and a pre-layer, the substrate includes a first surface and a second surface, and the first One surface faces toward the inside of the electronic device, the second surface faces toward the outside of the electronic device, the colored layer and the pre-layer are sequentially arranged on the second surface of the substrate, the surface of the pre-layer has a pore structure, and the The pore structure includes several holes, and when the pore structure receives light irradiation, a photocatalytic reaction occurs to degrade the organic matter.

In the case manufacturing method provided in the embodiment of the present application, a coloring layer and a pre-layer are sequentially formed on the surface of the substrate facing the outside of the electronic device, the surface of the pre-layer has a pore structure, and the pore structure includes several holes, When the pore structure receives light irradiation, a photocatalytic reaction occurs to decompose the organic matter into carbon dioxide and water, which is to degrade the grease in the fingerprint attached to the surface of the shell, thereby achieving the purpose of automatically eliminating fingerprints.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a casing provided by an embodiment of the present application.

FIG. 3 is a schematic structural diagram of a back cover provided by an embodiment of the present application.

Fig. 4 is a cross-sectional view of the first embodiment in the direction A-A of Fig. 3 .

FIG. 5 is another structural schematic diagram of the casing provided by the embodiment of the present application.

FIG. 6 is another structural schematic diagram of the rear cover provided by the embodiment of the present application.

FIG. 7 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 8 is a schematic flow chart of the first method for manufacturing a back cover provided by the embodiment of the present application.

FIG. 9 is a schematic diagram of a second flow chart of the back cover manufacturing method provided by the embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In this application, unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and arrangements of specific examples are described below. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

Embodiments of the present application provide a casing manufacturing method, casing and electronic equipment. The details will be described respectively below.

In this embodiment, it will be described from the perspective of the manufacturing method of the back cover. The manufacturing method of the casing can form a casing, and the casing can be arranged in an electronic device, such as a mobile phone, a tablet computer, a PDA (Personal Digital Assistant , PDA) etc.

Please refer to 1. FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application. The electronic device 1 includes a casing 10 , a display screen 20 , a printed circuit board 30 , and a battery 40 .

Please refer to FIG. 2 . FIG. 2 is a schematic structural diagram of a housing provided in an embodiment of the present application.

Wherein, the housing 10 may include a cover plate 11 , a middle frame 12 and a rear cover 13 . The cover plate 11 , the middle frame 12 and the rear cover 13 are combined to form the casing 10 . The casing 10 has a closed space formed by the cover plate 11 , the middle frame 12 and the rear cover 13 for accommodating components such as a display screen 20 , a printed circuit board 30 , and a battery 40 .

In some embodiments, the cover plate 11 covers the middle frame 12 . The rear cover 13 is set on the middle frame 12 . The cover plate 11 and the rear cover 13 are located on opposite sides of the middle frame 12 . The cover plate 11 is opposite to the rear cover 13 . The closed space of the casing 10 is located between the cover plate 11 and the rear cover 13 .

The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of materials such as sapphire.

The middle frame 12 may be a metal shell, such as an aluminum alloy middle frame 12 . It should be noted that the material of the frame 12 in the embodiment of the present application is not limited thereto, and other methods may also be used, for example: the middle frame 12 may be a ceramic middle frame or a glass middle frame. Another example: the middle frame 12 may be a plastic middle frame. For another example: the middle frame 12 may be a structure in which metal and plastic cooperate with each other, and the plastic part may be formed by injection molding onto a metal plate.

The back cover 13 can be a metal back cover, such as an aluminum alloy back cover or a stainless steel back cover. The back cover 13 can also be a glass back cover or a ceramic back cover.

Please also refer to FIG. 3 . FIG. 3 is a schematic structural diagram of the back cover provided by the embodiment of the present application.

The rear cover 13 may include an inner surface 131 and an outer surface 132 oppositely disposed. The inner surface 131 of the rear cover 13 is close to the middle frame 12 and the cover plate 11 , constituting a part of the inner surface of the casing 10 . The outer surface 132 of the rear cover 13 is away from the middle frame 12 and the cover plate 11 , and constitutes a part of the outer surface of the casing 10 . The rear cover 13 may also include a through hole 133, and the through hole 133 may be used for installing a camera.

Please also refer to FIG. 4 . FIG. 4 is a cross-sectional view of FIG. 3 along the direction A-A.

For ease of description, the case will be described below with the rear cover 13 as an example.

The back cover 13 may include a base material 134 , a colored layer 137 and a front layer 135 . The colored layer 137 and the front layer 135 are sequentially disposed on the surface of the back cover 13 away from the cover plate 11 , that is, the colored layer 137 is disposed between the front layer 135 and the outer surface of the casing 11 between.

Wherein, the base material 134 can be made of aluminum, such as aluminum alloy, stainless steel, glass, ceramics and the like.

The substrate 134 includes a first surface 1341 and a second surface 1342 . The first surface 1341 faces to the inside of the electronic device, and the second surface 1342 faces to the outside of the electronic device. In one embodiment, the first surface 1341 is disposed toward the direction of the cover plate 11 and the middle frame 12 . The first surface 1341 may be the inner surface 131 of the rear cover 13 . The first surface 1341 is an inner surface of the casing 11 . The second surface 1342 is disposed facing away from the cover plate 11 and the middle frame 12 . The second surface 1342 is an outer surface of the casing 11 .

The colored layer 137 is disposed on the second surface 1342 of the substrate 134 . The colored layer 137 can be oxidized to form an oxide layer. For example, the oxide layer is formed by monochromatic oxidation, which may be specifically formed by coloring after an oxidation process.

It should be noted that, in some embodiments, two oxidations or more than two oxidations may also be used to form a multilayer oxide layer.

In one embodiment, in order to make the colored layer 137 adhere more firmly to the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 can be polished to increase the The flatness of the surface of the second surface 1342 of the base material 134, thereby increasing the adhesion of the colored layer 137 on the second surface 1342 of the base material 134, thereby enabling the colored layer 137 to be firmly attached to The second surface 1342 of the substrate 134 .

In one embodiment, the colored layer 137 may have multiple colored regions, and different colored regions are set with different colors to form a pattern.

The pre-layer 135 is disposed on the second surface 1342 of the substrate 134 . The surface 135 a of the pre-layer 135 has a pore structure 136 . The pore structure 136 includes several holes 1361 . When the pre-layer 135 is irradiated by light, a photocatalytic reaction occurs to degrade organic matter.

The pre-layer 135 can be made of TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ and so on. The pre-layer 135 may also be TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ , etc. doped with metal ions. The metal ions used for doping may be silver ions, copper ions and the like.

The pre-layer 135 can be formed by methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel method or hydrothermal method. The pre-layer 135 is attached to the second surface 1342 of the substrate 134 .

In one embodiment, when the pre-layer 135 is formed by chemical vapor deposition, the argon gas can be passed through the metal organic matter and heated at a certain temperature under vacuum conditions, and the temperature can be 500-900°C . When the gas pressure of the metal organic compound reaches the reaction threshold, the metal organic compound is decomposed and deposited on the colored layer 137 to form the pre-layer 135 . The metal organic compound may be Ti(OIC ₃ H ₇ ) ₄ .

In one embodiment, when the pre-layer 135 is formed by a sol-gel method, a precursor sol can be prepared first, and the precursor sol can be placed on the colored layer by spraying, spin coating or soaking. 137.

In one embodiment, the precursor sol can be obtained by using metal alkoxide as raw material, adding solvent, water, catalyst, etc., through hydrolysis and polymerization. The metal alkoxide can be Ti(OC ₂ H ₅ ) ₄ , Ti(OC ₃ H ₇ ⁱ ) ₄ , Ti(OC ₄ H ₉ ⁿ ) ₄ and the like.

In one embodiment, after the first layer of precursor sol is set, the first layer of precursor sol can be dried to form a first layer of gel, and the first layer of gel can be formed by spraying, spin coating or soaking. The second layer of precursor sol is placed on the first layer of gel, and then dried to make the second layer of precursor sol form the second layer of gel, and so on, by setting the precursor solution multiple times, The thickness of the gel is adjusted, and finally, heat treatment is performed on the substrate 134 attached with the gel, so that the gel undergoes a chemical reaction to form the pre-layer 135 .

In one embodiment, when the pre-layer 135 is formed by a hydrothermal method, a mask can be set on the substrate 134 and the colored layer 137 where the pre-layer 135 does not need to be provided; solution, soak the substrate 134 in the precursor solution, and grow the pre-layer 135 on the colored layer 137 by controlling the reaction temperature and pressure.

In one embodiment, in order to enable the pre-layer 135 to be more firmly attached to the colored layer 137, the colored layer 137 can be polished to increase the smoothness of the surface of the colored layer 137 , so as to increase the adhesion of the pre-layer 135 on the colored layer 137 , so that the pre-layer 135 can be firmly attached to the colored layer 137 .

In one embodiment, the thickness of the pre-layer 135 is 1 μm-10 μm. When the thickness of the pre-layer 135 is less than 1 micron, because the thickness of the pre-layer 135 is small, the pre-layer 135 is easily etched through during the etching process, which is not conducive to the formation of the pore structure 136; When the thickness of 135 is greater than 10 microns, the light transmittance of the pre-layer 135 is poor due to the large thickness of the pre-layer 135 , which easily blocks the color of the colored layer 137 .

In one embodiment, the inner diameter of the hole 1361 is less than 500 nanometers, so that the front layer 135 has good photocatalytic properties, and at the same time, when the user touches the housing, he will not feel the surface The holes of 1361. In one embodiment, the inner diameter of the hole 1361 may be 50 nm-100 nm. When the inner diameter of the hole 1361 is less than 50nm, the manufacturing cost is relatively high due to the small inner diameter of the hole 1361, the selection of etching solution is relatively harsh, and the manufacturing process is complicated; when the inner diameter of the hole 1361 is greater than 100nm, Due to the larger inner diameter of the hole 1361 , the photocatalytic property of the pre-layer 135 is weaker.

In some embodiments, an acidic solution such as concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid or a mixed solution of several of them may be used to etch the pre-layer 135 to form the pore structure 136 . In some embodiments, additives may also be added to acid solutions such as concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid, or a mixture of several of them to etch the pre-layer 135 to form the pore structure 136 .

It should be noted that the structure of the housing in the embodiment of the present application is not limited thereto. For example, please refer to FIG. 5 , which is another schematic structural diagram of the housing provided in the embodiment of the present application.

The housing 10 a includes a cover plate 16 and a rear cover 17 . In some embodiments, the cover plate 16 is directly mounted on the rear cover 17 . The cover plate 16 and the rear cover 17 are combined to form the housing 10a. The casing 10 a has a closed space formed by the cover plate 16 and the rear cover 17 to accommodate components such as the display screen 20 , the printed circuit board 30 , and the battery 40 .

Compared with the housing 10 shown in FIG. 2 , the housing 10 a in FIG. 5 does not include a middle frame, or in other words, the middle frame 12 and the rear cover 13 in FIG. 2 are integrally formed to form a rear cover 17 structure.

Specifically, please refer to FIG. 6 . FIG. 6 is another structural schematic diagram of the rear cover provided by the embodiment of the present application.

In some embodiments, the rear cover 17 includes an inner surface 171 and an outer surface 172 , and the inner surface 171 and the outer surface 172 are oppositely disposed to form the entire surface of the rear cover 17 . The structure of each layer of the rear cover 17 can refer to the rear cover 13 , which will not be repeated here.

The printed circuit board 30 is installed in the housing 10, the printed circuit board 30 can be the main board of the electronic device 1, and the printed circuit board 30 can be integrated with an antenna, a motor, a microphone, a camera, a light sensor, a receiver And functional components such as processors. In some embodiments, the printed circuit board 30 is fixed inside the casing 10 . Specifically, the printed circuit board 30 can be screwed to the middle frame 12 by screws, or can be snapped to the middle frame 12 by buckling. It should be noted that, the method of fixing the printed circuit board 30 to the middle frame 12 in the embodiment of the present application is not limited to this, and other methods can also be used, such as fixing together by buckles and screws.

The battery 40 is installed in the housing 10 , and the battery 40 is electrically connected with the printed circuit board 30 to provide power to the electronic device 1 . The case 10 may serve as a battery cover for the battery 40 . The casing 10 covers the battery 40 to protect the battery 40 , specifically, the back cover 13 covers the battery 40 to protect the battery 40 , so as to reduce the damage of the battery 40 due to collision and drop of the electronic device 1 .

The display screen 20 is installed in the casing 10 , and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1 . The display screen 20 includes a display area 14 and a non-display area 15 . The display area 14 can be used for displaying the screen of the electronic device 1 or for the user to perform touch manipulation and the like. The top area of the non-display area 15 is provided with openings for sound and light transmission, and the bottom of the non-display area 15 can be provided with functional components such as fingerprint modules and touch buttons. Wherein the cover plate 11 is installed on the display screen 20 to cover the display screen 20 to form the same display area and non-display area as the display screen 20 , for details, please refer to the display area and non-display area of the display screen 20 .

It should be noted that, the structure of the display screen 20 is not limited thereto. For example, the display screen may be a full screen or a heterosexual screen. For details, please refer to FIG. 7 , which is another schematic structural diagram of an electronic device provided by an embodiment of the present application. The difference between the electronic equipment in FIG. 7 and the electronic equipment in FIG. 1 is that the non-display area 15a is directly formed on the display screen 20a, for example, the non-display area 15a of the display screen 20a is set as a transparent structure, so that light signals can pass through or directly provide structures such as openings or gaps for light transmission in the non-display area of the display screen 20a, the front camera, photoelectric sensor, etc. detection. The display area 14a covers the entire surface of the electronic device 1a. It should be noted that, for components such as the housing 10 , the printed circuit board 30 , and the battery 40 in the electronic device 1 a , reference can be made to the above content, and details will not be repeated here.

The invention also provides a manufacturing method of the casing.

It should be noted that the rear cover will be described as an example below, but the manufacturing method of the casing in the embodiment of the present application is not limited to the rear cover.

Please also refer to FIG. 8 . FIG. 8 is a schematic flowchart of a manufacturing method for a back cover provided by an embodiment of the present application. The manufacturing method of the shell includes the following steps:

In step S101 , a substrate 134 is provided, the substrate 134 includes a first surface 1341 and a second surface 1342 , the first surface 1341 faces inside the electronic device, and the second surface 1342 faces outside the electronic device.

The base material 134 may be a metal material, such as aluminum, further, such as aluminum alloy. It should be noted that the base material 134 can be purchased directly, or can be obtained by processing a plate, such as forging and aging an aluminum alloy plate. The substrate 134 can also be glass, ceramics and the like.

The first surface 1341 is arranged towards the direction of the cover plate 11 and the middle frame 12 . The first surface 1341 may be the inner surface 131 of the rear cover 13 . The first surface 1341 is an inner surface of the casing 11 . The second surface 1342 is disposed facing away from the cover plate 11 and the middle frame 12 . The second surface 1342 is an outer surface of the casing 11 .

Step S102 , disposing the colored layer 137 on the second surface 1342 of the substrate 134 .

In one embodiment, referring to FIG. 9, the step S102 may be:

Step S1021: polishing the second surface 1342 of the substrate 134;

Step S1022: disposing a colored layer 137 on the polished second surface 1342 of the substrate 134; and

Step S1023 : Polishing the colored layer 137 .

In one embodiment, in order to make the colored layer 137 adhere more firmly to the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 can be polished to increase the The flatness of the surface of the second surface 1342 of the base material 134, thereby increasing the adhesion of the colored layer 137 on the second surface 1342 of the base material 134, thereby enabling the colored layer 137 to be firmly attached to The second surface 1342 of the substrate 134 .

In one embodiment, in order to enable the pre-layer 135 to be more firmly attached to the colored layer 137 in subsequent steps, the colored layer 137 can be polished to increase the hardness of the colored layer 137. The flatness of the surface increases the adhesive force of the pre-layer 135 on the colored layer 137 , so that the pre-layer 135 can be firmly attached to the colored layer 137 .

In some embodiments, the second surface 1342 of the substrate 134 or the colored layer 137 may be polished by means of mechanical, chemical, electrochemical or ultrasonic. The roughness of the second surface 1342 of the substrate 134 or the colored layer 137 is reduced to obtain a bright and flat surface of the second surface 1342 of the substrate 134 or the colored layer 137 . Wherein, the chemical polishing method is to regularly dissolve the second surface 1342 of the substrate 134 or the colored layer 137 to achieve smoothness. Wherein, the electrochemical polishing method is to use the second surface 1342 of the substrate 134 or the colored layer 137 as the anode, and the insoluble metal as the cathode, and the two poles are immersed in the electrolytic cell at the same time, and a direct current is passed to generate a selective anode solution. , so that the brightness of the second surface 1342 of the base material 134 or the coloring layer 137 increases greatly. Wherein the mode of mechanical polishing is by cutting the second surface 1342 of the base material 134 or the colored layer 137, so that the second surface 1342 of the base material 134 or the colored layer 137 are plastically deformed to remove the convex portion after polishing to obtain a smooth surface. Wherein the mode of ultrasonic polishing is to put the base material 134 or the base material 134 provided with the colored layer 137 into the abrasive suspension and put them together in the ultrasonic field, and rely on the oscillation of the ultrasonic waves to make the abrasive material on the base The second surface 1342 of the material 134 or the colored layer 137 is ground and polished.

In some embodiments, before polishing the second surface 1342 of the substrate 134 or the colored layer 137, the second surface 1342 of the substrate 134 or the colored layer 137 may be polished first. treatment, and then polish the second surface 1342 of the base material 134 or the colored layer 137 after grinding, so that the polishing effect is better, so that the second surface 1342 of the base material 134 or the The colored layer 137 is smoother. Here, it should be noted that the grinding treatment can be understood as rough machining before the polishing treatment. That is, the outer surface of the back cover may be firstly subjected to a rough grinding, and then a fine grinding to complete the polishing treatment.

The colored layer 137 is disposed on the second surface 1342 of the substrate 134 . The colored layer 137 can be oxidized to form an oxide layer. For example, the oxide layer is formed by monochromatic oxidation, which may be specifically formed by coloring after an oxidation process.

It should be noted that, in some embodiments, two oxidations or more than two oxidations may also be used to form a multilayer oxide layer.

In one embodiment, the colored layer 137 may have multiple colored regions, and different colored regions are set with different colors to form a pattern.

Step S103 , setting the pre-layer 135 on the colored layer 137 .

The pre-layer 135 can be made of TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ and so on. The pre-layer 135 may also be TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ , etc. doped with metal ions. The metal ions used for doping may be silver ions, copper ions and the like.

The pre-layer 135 can be formed by methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel method or hydrothermal method. The pre-layer 135 is attached to the colored layer 137 .

In one embodiment, when the pre-layer 135 is formed by chemical vapor deposition, the argon gas can be passed through the metal organic matter and heated at a certain temperature under vacuum conditions, and the temperature can be 500-900°C . When the gas pressure of the metal organic compound reaches the reaction threshold, the metal organic compound is decomposed and deposited on the colored layer 137 to form the pre-layer 135 . The metal organic compound may be Ti(OIC ₃ H ₇ ) ₄ .

In one embodiment, referring to FIG. 9 , when the pre-layer 135 is formed by a sol-gel method, the step S103 may include:

Step S1031, preparing a precursor sol.

In one embodiment, the precursor sol can be obtained by using metal alkoxide as raw material, adding solvent, water, catalyst, etc., through hydrolysis and polymerization. The metal alkoxide can be Ti(OC ₂ H ₅ ) ₄ , Ti(OC ₃ H ₇ ⁱ ) ₄ , Ti(OC ₄ H ₉ ⁿ ) ₄ and the like.

Step S1032 , disposing the precursor sol on the colored layer 137 .

Wherein, the precursor sol can be disposed on the colored layer 137 by spray coating, spin coating or soaking.

Step S1033, drying the precursor sol to form a gel.

In one embodiment, after the first layer of precursor sol is set, the first layer of precursor sol can be dried to form the first layer of gel, and then the first layer of precursor sol can be sprayed, spin-coated or soaked. Place the second layer of precursor sol on the first layer of gel, and then dry the second layer of precursor sol to form the second layer of gel, and so on, you can set the precursor solution multiple times , to adjust the thickness of the gel.

Step S1034 , heat-treating the substrate 134 attached with the gel to obtain the pre-layer 135 .

Wherein, heat treatment is performed on the base material 134 attached with the gel, and the gel undergoes a chemical reaction to form a photocatalytic film through the heat treatment, thereby forming the pre-layer 135 .

In one embodiment, when the pre-layer 135 is formed by a hydrothermal method, a mask can be set on the substrate 134 and the colored layer 137 where the pre-layer 135 does not need to be provided; solution, soak the substrate 134 in the precursor solution, and grow the pre-layer 135 on the colored layer 137 by controlling the reaction temperature and pressure.

In one embodiment, the thickness of the pre-layer 135 is 1 μm-10 μm. When the thickness of the pre-layer 135 is less than 1 micron, because the thickness of the pre-layer 135 is small, the pre-layer 135 is easily etched through during the etching process, which is not conducive to the formation of the pore structure 136; When the thickness of 135 is greater than 10 microns, the light transmittance of the pre-layer 135 is poor due to the large thickness of the pre-layer 135 , which easily blocks the color of the colored layer 137 .

Step S104 , etching the pre-layer 135 to form a pore structure 136 . The pore structure 136 includes a plurality of holes 1361 . When the pore structure 136 receives light irradiation, a photocatalytic reaction occurs to degrade organic matter.

In one embodiment, the inner diameter of the hole 1361 is less than 500 nanometers, so that the front layer 135 has good photocatalytic properties, and at the same time, when the user touches the housing, he will not feel its Pores 1361 in the surface. In one embodiment, the inner diameter of the hole 1361 may be 50 nm-100 nm. When the inner diameter of the hole 1361 is less than 50nm, the manufacturing cost is relatively high due to the small inner diameter of the hole 1361, the selection of etching solution is relatively harsh, and the manufacturing process is complicated; when the inner diameter of the hole 1361 is greater than 100nm, Due to the larger inner diameter of the hole 1361 , the photocatalytic property of the pre-layer 135 is weaker.

In some embodiments, an acidic solution such as concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid or a mixed solution of several of them may be used to etch the pre-layer 135 to form the pore structure 136 . In some embodiments, additives may also be added to acid solutions such as concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid, or a mixture of several of them to etch the pre-layer 135 to form the pore structure 136 .

To sum up, in the casing manufacturing method provided by the embodiment of the present application, the coloring layer and the pre-layer are sequentially formed on the surface of the substrate facing the outside of the electronic device, the surface of the pre-layer has a pore structure, and the pore structure It includes a number of holes. When the pore structure receives light irradiation, photocatalytic reaction occurs to decompose organic matter into carbon dioxide and water, which is to degrade the grease in the fingerprint attached to the surface of the shell, so as to achieve the purpose of automatically eliminating fingerprints.

Those skilled in the art can understand that the structure of the electronic device 1 shown in FIG. 1 does not constitute a limitation to the electronic device 1 . The electronic device 1 may include more or fewer components than shown, or combine certain components, or have a different arrangement of components. The electronic device 1 may also include a memory, a Bluetooth module, etc., which will not be repeated here.

The method for making the shell provided by the embodiment of the present application, the shell and the electronic device have been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present application. The description of the above embodiment is only for helping understanding this application. At the same time, for those skilled in the art, based on the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.

Claims (12)

1. a kind of method for producing shell, the housing is applied to electronic equipment, it is characterised in that the method for producing shell bag Include：

One base material is provided, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and the Two surfaces are towards on the outside of electronic equipment；

In the second surface of the base material, dyed layer is set；

Prefilter layer is set on the dyed layer；And

Etch prefilter layer and form pore structure, the pore structure includes some holes, and the pore structure is receiving light photograph When penetrating, light-catalyzed reaction degradation of organic substances occurs.

2. method for producing shell as claimed in claim 1, it is characterised in that the second surface in the base material is set The step of chromatograph, including：

The second surface of the base material is processed by shot blasting；

In the second surface of the base material of polishing, dyed layer is set；And

The dyed layer is processed by shot blasting.

3. method for producing shell as claimed in claim 1 or 2, it is characterised in that it is described set on the dyed layer it is preposition The step of layer, includes：

Prepare precursor sol；

Precursor sol is arranged at the dyed layer；

Dry the precursor sol and form gel；And

The base material for being attached with the gel is heat-treated, obtains prefilter layer.

4. method for producing shell as claimed in claim 3, it is characterised in that：It is described that precursor sol is arranged at the coloring The step of the step of layer and the drying precursor sol form gel is repeatedly.

5. method for producing shell as claimed in claim 1, it is characterised in that：The thickness of the prefilter layer is 1 micron -10 micro- Rice.

6. method for producing shell as claimed in claim 1, it is characterised in that：The internal diameter of described hole is less than 500 nanometers.

7. method for producing shell as claimed in claim 1, it is characterised in that：The internal diameter of described hole is 50 nanometer -100 and received Rice.

A kind of 8. housing, applied to electronic equipment, it is characterised in that：It is preposition that the housing includes a base material, a dyed layer and one Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction Sub- equipment outside, the dyed layer and the prefilter layer are set in turn in the second surface of the base material, the table of the prefilter layer Face has pore structure, and the pore structure includes some holes, and the pore structure occurs light and urged when receiving light irradiation Change reaction degradation of organic substances.

9. housing as claimed in claim 8, it is characterised in that：The thickness of the prefilter layer is 1 micron -10 microns.

10. housing as claimed in claim 8, it is characterised in that：The internal diameter of described hole is less than 500 nanometers.

11. housing as claimed in claim 8, it is characterised in that：The internal diameter of described hole is 50 nanometers -100 nanometers.

12. a kind of electronic equipment, it is characterised in that including housing, the housing is as any one of claim 8 to 11 Housing.