CN102412437A - Antenna Manufacturing Method - Google Patents

Abstract

A method of manufacturing an antenna. The manufacturing method of the antenna comprises the following steps: firstly, providing a substrate, wherein the surface of the substrate is provided with an antenna area; then, forming a metal dielectric layer by using a chemical plating process to cover the surface of the substrate; secondly, covering a plating resisting agent on the metal medium layer; removing the plating resist on the antenna area; then, forming a metal material distributed on the antenna area by using an electroplating process to form an antenna main body; and finally, removing the plating resisting agent on the surface of the base material and removing the metal medium layer outside the antenna area. The invention effectively integrates the chemical plating and electroplating processes, so that the antenna is easy to form on the shell of the communication product, thereby effectively saving the space in the shell, replacing a solid antenna with larger volume, greatly simplifying the production steps and reducing the time for assembling components.

Description

Antenna Manufacturing Method

technical field

The invention relates to a manufacturing method, in particular to an antenna manufacturing method.

Background technique

Due to the rapid development of the technological communication industry, the application of information products is also becoming more and more popular. For example, communication electronic products such as mobile phones, e-book readers, and notebook computers frequently appear in daily surroundings. This not only greatly improves the convenience of life, but also compresses time and space, so that everyone in modern times is no longer limited to geographical boundaries, but can make each other more closely integrated and interactive. The exchange of information and knowledge optimizes the pursuit of common interests and well-being. Therefore, in wireless communication, the antenna seems to play an important role in the center, making information transmission and knowledge exchange more convenient and unimpeded.

However, due to the large size of the current general solid sheet gold antenna, it is often necessary to reserve its configuration space in the casing; relatively speaking, the usable height of the antenna is often limited to the overall height of the configuration space. In this way, this will not only have a great impact on the design trend of thin, light and small products, but also require a compromise in the design of the antenna, so that it is often impossible to obtain an optimized radiation pattern and reception effect.

Contents of the invention

Therefore, an object of the present invention is to provide a manufacturing method of an antenna, which can effectively reduce the internal space of the housing by forming the antenna on the housing of the product device by combining the process of electroless plating and electroplating.

The manufacturing method of the antenna includes the following steps: firstly, a substrate is provided, and the surface of the substrate has an antenna area; then, a metal dielectric layer is formed by an electroless plating process to cover the surface of the substrate; secondly, Covering an anti-plating resist on the metal dielectric layer; furthermore, removing the anti-plating resist on the antenna area; after that, forming a metal material distributed on the antenna area by electroplating process to form an antenna body ; Finally, remove the anti-plating resist on the surface of the substrate and remove the metal dielectric layer outside the antenna area.

According to an embodiment of the invention, the antenna area has an antenna pattern.

According to an embodiment of the present invention, roughening the surface of the substrate is further included.

According to an embodiment of the present invention, further comprising forming a groove in the antenna area.

According to an embodiment of the present invention, the material of the metal dielectric layer is palladium or polymer material.

According to an embodiment of the present invention, removing the plating resist on the antenna area includes removing the plating resist on the antenna area to expose the metal dielectric layer covering the antenna area.

According to an embodiment of the present invention, the plating resist on the antenna area is removed by dry etching.

According to an embodiment of the present invention, the dry etching is a laser engraving processing method.

According to an embodiment of the present invention, the metal material is copper, nickel or gold.

From the above, it can be known that the antenna manufacturing method of the present invention can effectively integrate the chemical plating and electroplating processes, so that the antenna can be easily formed on the casing of the communication product, thereby not only effectively saving the space in the casing, but also replacing the larger The physical antenna greatly simplifies its production steps and reduces the time for assembling components.

Description of drawings

In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the accompanying drawings are described as follows:

FIG. 1 shows a flowchart of a manufacturing method according to an embodiment of the present invention.

2A-2G respectively illustrate the antenna device corresponding to each step of the manufacturing method in FIG. 1 .

Description of main component symbols:

100: Manufacturing method 200: Antenna device

101: Step 210: Substrate

102: Step 212: Surface

103: Step 214: Antenna area

104: Step 216: Groove

105: Step 220: Metal medium layer

106: Step 230: Plating resist

107: Step 240: Antenna body

Detailed ways

In order to make the description of the present invention more detailed and complete, reference may be made to the attached drawings and various embodiments described below, and the same numbers in the drawings represent the same or similar components. On the other hand, well-known components and steps have not been described in the embodiments in order to avoid unnecessary limitations of the present invention.

Please refer to FIG. 1 and FIG. 2A to FIG. 2F. FIG. 1 shows a flowchart of a manufacturing method of an antenna according to an embodiment of the present invention; FIG. 2A to FIG. 2F show the structure of the antenna device after implementing each step in FIG. Stereoscopic diagram.

As shown in FIG. 1 , the antenna manufacturing method 100 includes the following steps: First, step 101 is to provide a substrate 210 , and a surface 212 of the substrate 210 has an antenna area 214 . Next, step 102 is to form a metal dielectric layer 220 to cover the surface 212 of the substrate 210 by using an electroless plating process. Next, step 103 is to cover an anti-plating resist paste 230 on the metal dielectric layer 220 . Furthermore, step 104 is to remove the plating resist 230 on the antenna area 214 . Afterwards, step 105 is to use electroplating process to form a metal material covering the antenna area 214 to form an antenna body 240 . Finally, step 106 is to remove the plating resist 230 . And step 107 is to remove the metal dielectric layer 220 outside the antenna area 214 .

In step 101 , the manufacturing method 100 provides a substrate 210 , that is, the antenna device 200 as shown in FIG. 2A corresponding to step 101 . However, the substrate 210 can be a case of an electronic device with wireless communication function such as a general mobile phone, a notebook, or an e-book reader, and is made of a non-conductive material such as plastic. In one embodiment, the surface 212 of the substrate 210 can be further roughened, for example: by immersing the substrate 210 in a strong acid or strong alkali solution, so that the surface 212 is roughened; or, The antenna area 214 of the substrate 210 is roughened in a local area on the surface by laser engraving or other processing methods.

In addition, the antenna area 214 has an antenna pattern. Therefore, in an embodiment, a groove 216 corresponding to the antenna pattern can also be formed in the antenna region 214 by dry etching such as laser engraving. In this way, the surface friction coefficient of the substrate 210 can be increased, thereby increasing the adhesion with the metal dielectric layer 220 formed in step 102 .

In step 102 , the manufacturing method 100 uses an electroless plating process to form a metal dielectric layer 220 to cover the surface 212 of the substrate 210 , ie the corresponding structure in FIG. 2B . In one embodiment, the material of the metal dielectric layer 220 may be palladium or a polymer material. Although the above-mentioned embodiment and its corresponding illustrations are to uniformly divide the metal dielectric layer 220 on the entire surface of the substrate 210, the present invention is not limited thereto, and can also be formed only on a partial surface area of the substrate 210. Metal dielectric layer 220 .

In step 103 , the manufacturing method 100 forms a plating resist 230 on the metal dielectric layer 220 of the substrate 210 and covers the metal dielectric layer 220 , as shown in FIG. 2C . However, the anti-plating resist 230 is uniformly distributed on the substrate 210 , thereby effectively blocking acid and alkali from corroding the surface 212 of the substrate 210 , and fully achieving a protective effect.

In step 104 , the manufacturing method 100 removes the plating resist 230 on the antenna area 214 . Therefore, as shown in FIG. 2D , the antenna device 200 can expose the metal dielectric layer 220 on the antenna area 214 , corresponding to the antenna pattern of the antenna area 214 . In one embodiment, the plating resist 230 on the antenna area 214 is processed and removed by dry etching. However, the dry etching can be a laser engraving processing method, which improves the accuracy of removing the plating resist 230 to expose the antenna pattern of the antenna region 214 .

In step 105 , the manufacturing method 100 uniformly deposits a metal material on the antenna area 214 on the substrate 210 by electroplating process to form an antenna body 240 , as shown in FIG. 2E . In more detail, since the metal dielectric layer 220 is formed on the surface 212 of the substrate 210 in step 102, any position of the substrate 210 can be provided as a contact point required for electroplating, and an external voltage can be applied, so that the substrate 210 can The electroplating process can be directly implemented on the material 210, and the degree of freedom and convenience in its production can be improved. On the other hand, steps 103 and 104 only form the anti-plating resist 230 to cover the surface outside the antenna area 214, so that the metal material can be effectively controlled to evenly cover the metal dielectric layer 220 deposited on the antenna area 214 in the electroplating process. Above, the antenna main body 240 is formed on the substrate 210 . In addition, in an embodiment, the metal material used to deposit and form the antenna body 240 in the electroplating process may be copper, nickel or gold.

In step 106 , the manufacturing method 100 removes all the plating resist 230 on the substrate 210 to form the structure shown in FIG. 2F . As shown in the figure, except for the antenna body 240 on the antenna area 214 , the rest of the surface of the substrate 210 is covered with the metal dielectric layer 220 .

In step 107 , the manufacturing method 100 removes the metal dielectric layer 220 deposited outside the antenna region 214 by electroless plating in the above steps, to form the structure shown in FIG. 2G . However, the metal dielectric layer 220 outside the antenna area 214 can be removed by etching, leaving only the antenna radiation body 240 on the antenna area 214 .

In this way, through the above-mentioned process design concept of the present invention, the chemical plating and electroplating processes can be effectively integrated, and the previous process limitations can be overcome, so that the antenna is formed on the shell of the communication product, which not only can effectively save the space in the shell , and can replace the physical antenna, greatly simplifying its production steps and reducing the time for assembling components.

Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Any person skilled in the art should be able to make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the scope of the appended claims.

Claims (9)

1. A manufacturing method of an antenna, the manufacturing method comprising: providing a substrate, the surface of the substrate has an antenna area; forming a metal dielectric layer by using an electroless plating process to cover the surface of the substrate; Covering an anti-plating resist on the metal dielectric layer; removing the anti-plating resist on the antenna area; forming a metal material distributed on the antenna area by electroplating process to form an antenna body; removing the plating resist from the surface of the substrate; and removing the metal medium layer outside the antenna area. 2. The manufacturing method as claimed in claim 1, wherein the antenna area has an antenna pattern. 3. The manufacturing method according to claim 1, further comprising: The surface of the substrate is roughened. 4. The manufacturing method according to claim 3, further comprising: A groove is formed in the antenna area. 5. The manufacturing method as claimed in claim 1, wherein the material of the metal dielectric layer is palladium or a polymer material. 6. The manufacturing method according to claim 1, further comprising: The metal dielectric layer covering the antenna area is exposed by removing the anti-plating resist on the antenna area. 7. The manufacturing method as claimed in claim 1, wherein the plating resist on the antenna area is removed by dry etching. 8. The manufacturing method according to claim 7, wherein the dry etching is a laser engraving processing method. 9. The manufacturing method as claimed in claim 1, wherein the metal material is copper, nickel or gold.

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