CN107683045B - Housing manufacturing method, housing and electronic device - Google Patents

Abstract

The embodiments of the present application disclose a method for manufacturing a casing, a casing and an electronic device. By forming a protective layer on the surface of a substrate facing the outside of the electronic device, the protective layer includes self-cleaning particles, and the self-cleaning particles are exposed On the surface of the protective layer, when the self-cleaning particles receive light irradiation, a photocatalytic reaction occurs, and the organic matter is decomposed into carbon dioxide and water, which is about to degrade the grease in the fingerprints attached to the surface of the shell, so as to achieve automatic elimination. Purpose of fingerprints.

Description

Housing manufacturing method, housing and electronic device

technical field

The present application relates to the technical field of electronic devices, and in particular, to a method for manufacturing a casing, a casing and an electronic device.

Background technique

At present, the outer surfaces of the casings of electronic devices, such as mobile phones and tablet computers, are prone to stick fingerprints.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a method for manufacturing a casing, a casing and an electronic device, which can automatically clean fingerprints on the outer surface of the casing.

An embodiment of the present application provides a method for manufacturing a casing, where the casing is applied to an electronic device, and the method for manufacturing the casing includes:

A substrate is provided, the substrate includes a first surface and a second surface, the first surface faces the inside of the electronic device, and the second surface faces the outside of the electronic device; and

A protective layer is provided on the second surface of the substrate, the protective layer includes self-cleaning particles, the self-cleaning particles are exposed on the surface of the protective layer, and the self-cleaning particles generate light when irradiated by light. Catalytic reactions degrade organic matter.

An embodiment of the present application further provides a casing, which is applied to an electronic device. The casing includes a substrate and a protective layer, the substrate includes a first surface and a second surface, and the first surface faces the electronic device. Inside, the second surface faces the outside of the electronic device, the protective layer is disposed on the second surface of the substrate, the protective layer includes self-cleaning particles, and the self-cleaning particles are exposed on the surface of the protective layer, so When the self-cleaning particles receive light irradiation, a photocatalytic reaction occurs to degrade organic matter.

An embodiment of the present application further provides an electronic device, including a casing, the casing includes a substrate and a protective layer, the substrate includes a first surface and a second surface, and the first surface faces the electronic device Inside, the second surface faces the outside of the electronic device, the protective layer is disposed on the second surface of the substrate, the protective layer includes self-cleaning particles, and the self-cleaning particles are exposed on the surface of the protective layer, so When the self-cleaning particles receive light irradiation, a photocatalytic reaction occurs to degrade organic matter.

In the case manufacturing method provided by the embodiments of the present application, a protective layer is formed on the surface of the substrate facing the outside of the electronic device, the protective layer includes self-cleaning particles, and the self-cleaning particles are exposed on the surface of the protective layer, When the self-cleaning particles are irradiated with light, a photocatalytic reaction occurs, and the organic matter is decomposed into carbon dioxide and water, that is, the grease in the fingerprints attached to the surface of the shell is degraded, so as to achieve the purpose of automatically eliminating fingerprints.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a casing provided by an embodiment of the present application.

FIG. 3 is a schematic structural diagram of a back cover provided by an embodiment of the present application.

FIG. 4 is a cross-sectional view of the first embodiment in the direction A-A of FIG. 3 .

FIG. 5 is a cross-sectional view of the second embodiment in the direction A-A of FIG. 3 .

FIG. 6 is a cross-sectional view of the third embodiment in the direction A-A of FIG. 3 .

FIG. 7 is another schematic structural diagram of the casing provided by the embodiment of the present application.

FIG. 8 is another schematic structural diagram of the back cover provided by the embodiment of the present application.

FIG. 9 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 10 is a first schematic flow chart of a method for manufacturing a back cover provided by an embodiment of the present application.

FIG. 11 is a schematic flow chart of the second type of the method for manufacturing a back cover provided by an embodiment of the present application.

FIG. 12 is a third schematic flowchart of the method for manufacturing a back cover provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Embodiments of the present application provide a method for manufacturing a casing, a casing, and an electronic device. The detailed descriptions will be given below.

In this embodiment, the description will be made from the perspective of the manufacturing method of the back cover. The manufacturing method of the casing can form a casing, and the casing can be arranged in an electronic device, such as a mobile phone, a tablet computer, a PDA (Personal Digital Assistant , PDA) etc.

Please refer to 1. FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device 1 includes a casing 10 , a display screen 20 , a printed circuit board 30 , and a battery 40 .

Please refer to FIG. 2 , which is a schematic structural diagram of a casing provided by an embodiment of the present application.

Wherein, the housing 10 may include a cover plate 11 , a middle frame 12 and a rear cover 13 . The cover plate 11 , the middle frame 12 and the rear cover 13 are combined with each other to form the casing 10 . The casing 10 has a closed space formed by the cover plate 11 , the middle frame 12 and the rear cover 13 to accommodate the display screen 20 , the printed circuit board 30 , the battery 40 and other devices.

In some embodiments, the cover plate 11 is covered on the middle frame 12 . The rear cover 13 is covered on the middle frame 12 . The cover plate 11 and the rear cover 13 are located on opposite sides of the middle frame 12 . The cover plate 11 and the rear cover 13 are disposed opposite to each other. The closed space of the casing 10 is located between the cover plate 11 and the rear cover 13 .

The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of materials such as sapphire.

The middle frame 12 may be a metal shell, such as an aluminum alloy middle frame 12 . It should be noted that the material of the frame 12 in the embodiment of the present application is not limited to this, and other methods may also be used, for example, the middle frame 12 may be a ceramic middle frame or a glass middle frame. Another example: the middle frame 12 may be a plastic middle frame. For another example, the middle frame 12 may be a structure in which metal and plastic cooperate with each other, and the plastic part may be formed by injection molding onto a metal plate.

The back cover 13 may be a metal back cover, such as an aluminum alloy back cover or a stainless steel back cover. The back cover 13 may also be a glass back cover or a ceramic back cover.

Please also refer to FIG. 3 , which is a schematic structural diagram of a back cover provided by an embodiment of the present application.

The back cover 13 may include an inner surface 131 and an outer surface 132 which are disposed opposite to each other. The inner surface 131 of the rear cover 13 is close to the middle frame 12 and the cover plate 11 , and constitutes a part of the inner surface of the casing 10 . The outer surface 132 of the rear cover 13 is away from the middle frame 12 and the cover plate 11 and constitutes a part of the outer surface of the casing 10 . The back cover 13 may further include a through hole 133, and the through hole 133 may be used for installing a camera.

Please also refer to FIG. 4 . FIG. 4 is a cross-sectional view of FIG. 3 along the A-A direction.

For convenience of description, the case is described below by taking the rear cover 13 as an example.

The back cover 13 may include a substrate 134 and a protective layer 135 . The protective layer 135 is disposed on the surface of the rear cover 13 away from the cover plate 11 .

The base material 134 can be made of aluminum, such as aluminum alloy, stainless steel, glass, ceramics, or the like.

The substrate 134 includes a first surface 1341 and a second surface 1342 . The first surface 1341 faces the inside of the electronic device, and the second surface 1342 faces the outside of the electronic device. In one embodiment, the first surface 1341 is disposed toward the direction of the cover plate 11 and the middle frame 12 . The first surface 1341 may be the inner surface 131 of the back cover 13 . The first surface 1341 is the inner surface of the casing 11 . The second surface 1342 is disposed in a direction away from the cover plate 11 and the middle frame 12 . The second surface 1342 is the outer surface of the casing 11 .

The protective layer 135 is disposed on the second surface 1342 of the substrate 134 . The protective layer 135 includes self-cleaning particles 136 , and the self-cleaning particles 136 are exposed on the surface of the protective layer 135 . When the self-cleaning particles 136 are irradiated with light, a photocatalytic reaction occurs to degrade organic matter.

The protective layer 136 can be transparent paint.

In one embodiment, in order to enable the protective layer 135 to be more firmly attached to the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished to increase the The flatness of the surface of the second surface 1342 of the substrate 134 increases, thereby increasing the adhesion of the protective layer 135 on the second surface 1342 of the substrate 134, thereby enabling the protective layer 135 to be firmly attached to the The second surface 1342 of the substrate 134 .

The self-cleaning particles 136 can be TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ or the like. The self-cleaning particles 136 can also use metal ion-doped TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ and the like. The metal ions used for doping may be silver ions, copper ions, and the like.

The self-cleaning particles 136 may be formed by methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel method, or hydrothermal method.

In one embodiment, when chemical vapor deposition is used to form the self-cleaning particles 136, TiCl ₄ and O ₂ may be used to generate TiO ₂ nanoparticles by controlling temperature and pressure, that is, to form the self-cleaning particles 136 . Self-cleaning particles 136 .

In an embodiment, when the self-cleaning particles 136 are formed by a sol-gel method, a precursor sol can be prepared first, and a gel with a certain spatial structure can be generated by controlling pH, additives, and temperature. By drying and calcining the gel, nanoparticles are formed, ie, the self-cleaning particles 136 are formed.

In an embodiment, a metal alkoxide can be used as a raw material, a solvent, water, a catalyst, etc. are added to obtain a precursor sol through hydrolysis and polymerization. The metal alkoxide can be Ti(OC ₂ H ₅ ) ₄ , Ti(OC ₃ H ₇ ⁱ ) ₄ , Ti(OC ₄ H ₉ ⁿ ) ₄ and the like.

In one embodiment, when the protective layer 135 is formed by a hydrothermal method, a precursor solution is prepared first, and nanoparticles are formed by controlling the temperature and pressure, that is, the self-cleaning particles 136 are formed.

It should be noted that, referring to FIGS. 5-6, in some embodiments, the protective layer 135 includes at least two colored areas 1351/1352, each colored area 1351/1352 has a different color, and the colored areas 1351 of different colors /1352 uses self-cleaning particles 1361/1362 in different colors.

For example, the protective layer 135 includes a first coloring area 1351 and a second coloring area 1352 . The first coloring area 1351 may use first self-cleaning particles 1361 . The first self-cleaning particles 1361 may be white. The first self-cleaning particles 1361 can be made of TiO ₂ , ZnO or the like. The second coloring region 1352 may use second self-cleaning particles 1362 . The second self-cleaning particles 1362 may be yellow. The second self-cleaning particles 1362 can be CdS, BiVO ₄ or the like. For another example, the protective layer 135 may further include a third coloring region 1353 . The third coloring area 1353 uses third self-cleaning particles 1363 . The third self-cleaning particles 1363 may be reddish brown. The third self-cleaning particles 1363 may be Fe ₂ O ₃ .

In one embodiment, the thickness of the protective layer 135 is greater than 10 microns. When the thickness of the protective layer 135 is less than 10 microns, because the thickness of the protective layer 135 is small and the light transmittance is high, it is easily interfered by the color of the substrate 134 itself, and the self-cleaning particles of the protective layer 135 are easily disturbed. The utilization rate of the color of the 136 itself is not good, and at the same time, because the thickness of the protective layer 135 is small, the protective layer 135 is easily penetrated during the polishing process, which is not conducive to the formation of the protective layer 135 . In one embodiment, the thickness of the protective layer 135 may be greater than 100 microns.

In one embodiment, the diameter of the self-cleaning particles 136 is less than 500 nanometers, so that the self-cleaning particles 136 have good photocatalytic properties, and at the same time, when the user touches the casing, the user does not feel the Self-cleaning particles 136 on its surface. In one embodiment, the diameter of the self-cleaning particles 136 may be 50 nanometers to 100 nanometers. When the diameter of the self-cleaning particles 136 is less than 50 nm, the manufacturing cost is high and the manufacturing process is complicated due to the small diameter of the self-cleaning particles 136; when the diameter of the self-cleaning particles 136 is greater than 100 nm, due to the The diameter of the self-cleaning particles 136 is relatively large, resulting in weak photocatalytic activity of the self-cleaning particles 136 .

It should be noted that the structure of the housing in the embodiment of the present application is not limited to this. For example, please refer to FIG. 7 , which is another schematic structural diagram of the housing provided in the embodiment of the present application.

The housing 10a includes a cover plate 16 and a rear cover 17 . In some embodiments, the cover plate 16 is directly covered on the rear cover 17 . The cover plate 16 and the rear cover 17 are combined with each other to form the casing 10a. The casing 10a has a closed space formed by the cover plate 16 and the rear cover 17 to accommodate the display screen 20, the printed circuit board 30, the battery 40 and other devices.

Compared with the housing 10 shown in FIG. 2 , the housing 10 a in FIG. 7 does not include a middle frame, or in other words, a rear cover 17 is formed by integrally molding the middle frame 12 and the rear cover 13 in FIG. 2 .

Specifically, please refer to FIG. 8 , which is another schematic structural diagram of the back cover provided by the embodiment of the present application.

In some embodiments, the rear cover 17 includes an inner surface 171 and an outer surface 172 , and the inner surface 171 and the outer surface 172 are disposed opposite to each other, forming the entire surface of the rear cover 17 . The structure of each layer of the rear cover 17 can be referred to the rear cover 13 , which will not be repeated here.

The printed circuit board 30 is installed in the housing 10, the printed circuit board 30 can be the main board of the electronic device 1, and the printed circuit board 30 can be integrated with an antenna, a motor, a microphone, a camera, a light sensor, a receiver and functional components such as processors. In some embodiments, the printed circuit board 30 is fixed within the housing 10 . Specifically, the printed circuit board 30 can be screwed to the middle frame 12 by screws, or can be snapped to the middle frame 12 by means of snaps. It should be noted that, the specific way of fixing the printed circuit board 30 to the middle frame 12 in the embodiment of the present application is not limited to this, and other ways, such as a way of co-fixing by a buckle and a screw, is also possible.

The battery 40 is installed in the casing 10 , and the battery 40 is electrically connected to the printed circuit board 30 to provide power to the electronic device 1 . The case 10 may serve as a battery cover for the battery 40 . The casing 10 covers the battery 40 to protect the battery 40 , specifically, the back cover 13 covers the battery 40 to protect the battery 40 , thereby reducing damage to the battery 40 due to collision, drop, etc. of the electronic device 1 .

The display screen 20 is installed in the housing 10 , and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1 . The display screen 20 includes a display area 14 and a non-display area 15 . The display area 14 may be used to display the screen of the electronic device 1 or for the user to perform touch manipulation or the like. The top area of the non-display area 15 is provided with openings for sound and light transmission, and functional components such as fingerprint modules and touch buttons can be arranged on the bottom of the non-display area 15 . The cover plate 11 is installed on the display screen 20 to cover the display screen 20 to form the same display area and non-display area as the display screen 20 . For details, please refer to the display area and non-display area of the display screen 20 .

It should be noted that the structure of the display screen 20 is not limited to this. For example, the display screen may be a full screen or a heterosexual screen. Specifically, please refer to FIG. 9 , which is another schematic structural diagram of an electronic device provided by an embodiment of the present application. The difference between the electronic device in FIG. 9 and the electronic device in FIG. 1 is that the non-display area 15a is directly formed on the display screen 20a, for example, the non-display area 15a of the display screen 20a is set as a transparent structure, so that the light signal can pass through. However, or directly in the non-display area of the display screen 20a to open structures such as openings or gaps for light conduction, the front camera, photoelectric sensor, etc. detection. The display area 14a covers the entire surface of the electronic device 1a. It should be noted that the components such as the casing 10 , the printed circuit board 30 , and the battery 40 in the electronic device 1 a can refer to the above contents, and will not be repeated here.

The invention also provides a manufacturing method of the casing.

It should be noted that the following description takes the back cover as an example, but the manufacturing method of the case in the embodiment of the present application is not limited to the back cover.

Please also refer to FIG. 10 . FIG. 10 is a schematic flowchart of a method for manufacturing a back cover according to an embodiment of the present application. The shell manufacturing method includes the following steps:

In step S101, a substrate 134 is provided, the substrate 134 includes a first surface 1341 and a second surface 1342, the first surface 1341 faces the inside of the electronic device, and the second surface 1342 faces the outside of the electronic device.

The base material 134 may be a metal material, such as aluminum material, and further, such as aluminum alloy. It should be noted that the base material 134 can be directly purchased, or can be obtained by processing a plate, such as an aluminum alloy plate by forging, aging and other processes. The substrate 134 can also be made of glass, ceramics, or the like.

The first surface 1341 is disposed toward the direction of the cover plate 11 and the middle frame 12 . The first surface 1341 may be the inner surface 131 of the back cover 13 . The first surface 1341 is the inner surface of the casing 11 . The second surface 1342 is disposed in a direction away from the cover plate 11 and the middle frame 12 . The second surface 1342 is the outer surface of the casing 11 .

Step S102, a protective layer 135 is provided on the second surface 1342 of the substrate 134, the protective layer 135 includes self-cleaning particles 136, the self-cleaning particles 136 are exposed on the surface of the protective layer 135, and the self-cleaning particles 136 are exposed on the surface of the protective layer 135. When the cleaning particles 135 are irradiated with light, a photocatalytic reaction occurs to degrade the organic matter.

In an embodiment, referring to FIG. 11 , the step S102 may include:

Step S1021: polishing the second surface 1342 of the substrate 134; and

Step S1022 : disposing a protective layer 135 on the polished second surface 1342 of the substrate 134 , the protective layer 135 includes self-cleaning particles 136 , and the self-cleaning particles 136 are exposed on the surface of the protective layer 135 , when the self-cleaning particles 135 are irradiated with light, a photocatalytic reaction occurs to degrade organic matter.

Wherein, in order to make the protective layer 135 more firmly attached to the second surface 1342 of the substrate 134 , the second surface 1342 of the substrate 134 may be polished to increase the The flatness of the surface of the second surface 1342 increases the adhesion of the protective layer 135 on the second surface 1342 of the substrate 134 , thereby enabling the protective layer 135 to be firmly attached to the substrate 134 of the second surface 1342.

In some embodiments, the second surface 1342 of the substrate 134 may be polished mechanically, chemically, electrochemically, or ultrasonically. In order to reduce the roughness of the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 with a bright and flat surface is obtained. The chemical polishing method is to regularly dissolve the second surface 1342 of the substrate 134 to achieve smoothness. In the electrochemical polishing method, the second surface 1342 of the base material 134 is used as the anode and the insoluble metal is used as the cathode, and the two electrodes are immersed in the electrolytic cell at the same time. The brightness of the second surface 1342 of the material 134 increases greatly. The mechanical polishing method is to cut the second surface 1342 of the substrate 134 to plastically deform the second surface 1342 of the substrate 134 to remove the polished convex portion to obtain a smooth surface. The ultrasonic polishing method is to put the substrate 134 in the abrasive suspension and put them together in an ultrasonic field, and rely on the oscillation of the ultrasonic waves to grind and polish the abrasive on the second surface 1342 of the substrate 134 .

In some embodiments, before polishing the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished first, and then the polished substrate The second surface 1342 of the substrate 134 is polished, so that the polishing effect is better, and the second surface 1342 of the substrate 134 is more flat. Here, it should be noted that the grinding treatment can be understood as rough machining before the polishing treatment. That is, the outer surface of the rear cover may be rough-polished once, and then fine-polished once, to complete the polishing process.

The protective layer 136 can be transparent paint.

The self-cleaning particles 136 can be TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ or the like. The self-cleaning particles 136 can also use metal ion-doped TiO ₂ , SiO ₂ , ZnO, CdS, WO ₃ , Fe ₂ O ₃ and the like. The metal ions used for doping may be silver ions, copper ions, and the like.

The self-cleaning particles 136 may be formed by methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel method, or hydrothermal method.

In one embodiment, when chemical vapor deposition is used to form the self-cleaning particles 136, TiCl ₄ and O ₂ may be used to generate TiO ₂ nanoparticles by controlling temperature and pressure, that is, to form the self-cleaning particles 136 . Self-cleaning particles 136 .

In an embodiment, when the self-cleaning particles 136 are formed by a sol-gel method, a precursor sol can be prepared first, and a gel with a certain spatial structure can be generated by controlling pH, additives, and temperature. By drying and calcining the gel, nanoparticles are formed, ie, the self-cleaning particles 136 are formed.

In an embodiment, a metal alkoxide can be used as a raw material, a solvent, water, a catalyst, etc. are added to obtain a precursor sol through hydrolysis and polymerization. The metal alkoxide can be Ti(OC ₂ H ₅ ) ₄ , Ti(OC ₃ H ₇ ⁱ ) ₄ , Ti(OC ₄ H ₉ ⁿ ) ₄ and the like.

In one embodiment, when the protective layer 135 is formed by a hydrothermal method, a precursor solution is prepared first, and nanoparticles are formed by controlling the temperature and pressure, that is, the self-cleaning particles 136 are formed.

It should be noted that, in some embodiments, the protective layer 135 includes at least two coloring areas 1351/1352, each coloring area 1351/1352 is different in color, and the coloring areas 1351/1352 with different colors are self-contained with different colors. Cleaning particles 1361/1362.

For example, the protective layer 135 includes a first coloring area 1351 and a second coloring area 1352 . The first coloring area 1351 may use first self-cleaning particles 1361 . The first self-cleaning particles 1361 may be white. The first self-cleaning particles 1361 can be made of TiO ₂ , ZnO or the like. The second coloring region 1352 may use second self-cleaning particles 1362 . The second self-cleaning particles 1362 may be yellow. The second self-cleaning particles 1362 can be CdS, BiVO ₄ or the like. For another example, the protective layer 135 may further include a third coloring region 1353 . The third coloring area 1353 uses third self-cleaning particles 1363 . The third self-cleaning particles 1363 may be reddish brown. The third self-cleaning particles 1363 may be Fe ₂ O ₃ .

In one embodiment, referring to FIG. 12 , the method may further include:

Step 103 : uniformly mixing the self-cleaning particles 136 in the protective paint to form a precursor.

The step S102 further includes:

Step S102a: coating the precursor on the second surface 1342 of the substrate 134;

Step S102b: drying the precursor of the second surface 1342 of the substrate 134 to obtain a pre-layer;

Step S102c: Sandblasting the pre-layer to expose the self-cleaning particles 136 to form a protective layer 135. When the self-cleaning particles 136 are irradiated with light, photocatalytic reaction occurs to degrade organic matter.

In an embodiment, the step 101 may be performed before the step S103, may also be performed after the step S103, or may be performed simultaneously with the step S103. Both the step S101 and the step S103 are located before the step S102.

In one embodiment, the hardness of the abrasive used in the sandblasting process is greater than the hardness of the pre-layer and less than the hardness of the self-cleaning particles 136 .

In one embodiment, the thickness of the protective layer 135 is greater than 10 microns. When the thickness of the protective layer 135 is less than 10 microns, because the thickness of the protective layer 135 is small and the light transmittance is high, it is easily interfered by the color of the substrate 134 itself, and the self-cleaning particles of the protective layer 135 are easily disturbed. The utilization rate of the color of the 136 itself is not good, and at the same time, because the thickness of the protective layer 135 is small, the protective layer 135 is easily penetrated during the polishing process, which is not conducive to the formation of the protective layer 135 . In one embodiment, the thickness of the protective layer 135 may be greater than 100 microns.

In one embodiment, the diameter of the self-cleaning particles 136 is less than 500 nanometers, so that the self-cleaning particles 136 have good photocatalytic properties, and at the same time, when the user touches the casing, the user does not feel the Self-cleaning particles 136 on its surface. In one embodiment, the diameter of the self-cleaning particles 136 may be 50 nanometers to 100 nanometers. When the diameter of the self-cleaning particles 136 is less than 50 nm, the manufacturing cost is high and the manufacturing process is complicated due to the small diameter of the self-cleaning particles 136; when the diameter of the self-cleaning particles 136 is greater than 100 nm, due to the The diameter of the self-cleaning particles 136 is relatively large, resulting in weak photocatalytic activity of the self-cleaning particles 136 .

To sum up, in the case manufacturing method provided by the embodiments of the present application, a protective layer is formed on the surface of the substrate facing the outside of the electronic device, and the protective layer includes self-cleaning particles, and the self-cleaning particles are exposed to the protective layer. On the surface of the layer, the self-cleaning particles undergo a photocatalytic reaction when irradiated by light, decompose the organic matter into carbon dioxide and water, and degrade the grease in the fingerprints attached to the surface of the shell, so as to achieve the purpose of automatically eliminating fingerprints.

Those skilled in the art can understand that the structure of the electronic device 1 shown in FIG. 1 does not constitute a limitation on the electronic device 1 . The electronic device 1 may comprise more or fewer components than shown, or combine certain components, or a different arrangement of components. The electronic device 1 may further include a memory, a Bluetooth module, and the like, which will not be repeated here.

The case manufacturing method, the case and the electronic device provided by the embodiments of the present application have been described in detail above. The principles and implementations of the present application are described with specific examples in this paper. The descriptions of the above embodiments are only used to help understanding this application. At the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific embodiments and application scope. To sum up, the content of this specification should not be construed as a limitation to the present application.

Claims (9)

1. A shell manufacturing method is applied to electronic equipment, and is characterized by comprising the following steps:

providing a substrate, wherein the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, and the second surface faces the outer side of the electronic equipment;

polishing the second surface of the base material, and then polishing the polished second surface of the base material;

and

arranging a protective layer on the second surface of the base material after polishing treatment, wherein the protective layer comprises self-cleaning particles, and the self-cleaning particles are prepared by the following steps:

metal alkoxide is adopted as a raw material, a solvent, water and a catalyst are added, and precursor sol is obtained through hydrolysis and polymerization reaction;

controlling the pH value, the additive and the temperature of the precursor sol to generate gel with a certain spatial structure;

drying and calcining the gel to form the self-cleaning particles;

uniformly mixing the self-cleaning particles in a protective paint to form a precursor, coating the precursor on the second surface of the base material, drying the precursor on the second surface of the base material to obtain a front layer, and performing sand blasting treatment on the front layer, wherein the self-cleaning particles are exposed on the surface of the protective layer, and when receiving light irradiation, the self-cleaning particles generate a photocatalytic reaction to degrade organic matters;

wherein the protective layer comprises at least two colored regions, each colored region has a different color, and colored regions of different colors employ the self-cleaning particles having different colors.

2. A method of making a housing as claimed in claim 1, wherein: the protective layer has a thickness greater than 10 microns.

3. A method of making a housing as claimed in claim 1, wherein: the diameter of the self-cleaning particles is less than 500 nanometers.

4. A method of making a housing as claimed in claim 1, wherein: the diameter of the self-cleaning particles is 50nm to 100 nm.

5. A shell is applied to electronic equipment, and is characterized in that: the shell comprises a substrate and a protective layer, the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, the second surface faces the outer side of the electronic equipment, the protective layer is arranged on the second surface of the substrate, self-cleaning particles are contained in the protective layer, and the self-cleaning particles are prepared through the following steps:

metal alkoxide is adopted as a raw material, a solvent, water and a catalyst are added, and precursor sol is obtained through hydrolysis and polymerization reaction;

controlling the pH value, the additive and the temperature of the precursor sol to generate gel with a certain spatial structure;

drying and calcining the gel to form the self-cleaning particles;

the self-cleaning particles are exposed on the surface of the protective layer, and when the self-cleaning particles receive light irradiation, a photocatalytic reaction is carried out to degrade organic matters;

wherein the protective layer comprises at least two colored regions, each colored region has a different color, and colored regions of different colors employ the self-cleaning particles having different colors.

6. The housing of claim 5, wherein: the protective layer has a thickness greater than 10 microns.

7. The housing of claim 5, wherein: the diameter of the self-cleaning particles is less than 500 nanometers.

8. The housing of claim 5, wherein: the diameter of the self-cleaning particles is 50nm to 100 nm.

9. An electronic device characterized by comprising a housing as claimed in any one of claims 5 to 8.

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