CN107896447B - Shell manufacturing method, shell and electronic equipment - Google Patents
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- CN107896447B CN107896447B CN201711035185.XA CN201711035185A CN107896447B CN 107896447 B CN107896447 B CN 107896447B CN 201711035185 A CN201711035185 A CN 201711035185A CN 107896447 B CN107896447 B CN 107896447B
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- H05K5/0243—Mechanical details of casings for decorative purposes
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Abstract
本申请实施例公开了一种壳体制作方法、壳体及电子设备,通过在基材朝向电子设备外侧的表面上依次形成着色层和前置层,所述着色层为设置于所述基材的第二表面的彩色釉,所述前置层包括若干区块,不同折射率的透明釉交替设置于所述若干区块,经过不同区块不同折射率的透明釉对光线的折射和反射作用,从而达到发射指纹印记的作用,使肉眼不易察觉指纹印记。
The embodiments of the present application disclose a shell manufacturing method, a shell and an electronic device, wherein a coloring layer and a front layer are sequentially formed on the surface of a substrate facing the outside of the electronic device, wherein the coloring layer is a colored glaze arranged on the second surface of the substrate, and the front layer includes a plurality of blocks, wherein transparent glazes with different refractive indices are alternately arranged in the plurality of blocks, and the transparent glazes with different refractive indices in different blocks refract and reflect light, thereby achieving the effect of emitting fingerprints, making the fingerprints difficult to be detected by the naked eye.
Description
技术领域technical field
本申请涉及电子设备技术领域,具体涉及一种壳体制作方法、壳体及电子设备。The present application relates to the technical field of electronic devices, and in particular, to a method for manufacturing a casing, a casing and an electronic device.
背景技术Background technique
目前,电子设备,譬如手机、平板电脑的壳体外表面容易粘指纹印。At present, the outer surfaces of the casings of electronic devices, such as mobile phones and tablet computers, are prone to stick fingerprints.
发明内容SUMMARY OF THE INVENTION
本申请实施例提供一种壳体制作方法、壳体及电子设备,以发射指纹印记,使肉眼不易察觉指纹印记。Embodiments of the present application provide a method for fabricating a casing, a casing and an electronic device, so as to emit fingerprint imprints, so that the fingerprint imprints are not easily detected by the naked eye.
本申请实施例提供一种壳体制作方法,所述壳体应用于电子设备,所述壳体制作方法包括:An embodiment of the present application provides a method for manufacturing a casing, where the casing is applied to an electronic device, and the method for manufacturing the casing includes:
提供一基材,所述基材包括第一表面和第二表面,所述第一表面朝向电子设备内侧,第二表面朝向电子设备外侧;A substrate is provided, the substrate includes a first surface and a second surface, the first surface faces the inside of the electronic device, and the second surface faces the outside of the electronic device;
在所述基材的第二表面上设置彩色釉,形成一着色层;Disposing colored glaze on the second surface of the base material to form a colored layer;
当所述彩色釉干燥后,在所述着色层上设置前置层,所述前置层包括若干区块,不同折射率的透明釉交替设置于所述若干区块;以及After the colored glaze is dried, a pre-layer is arranged on the colored layer, the pre-layer includes several blocks, and transparent glazes with different refractive indices are alternately arranged on the several blocks; and
当所述透明釉干燥后,对所述设置有彩色釉和透明釉的基材进行烧结。After the transparent glaze is dried, the substrate provided with the colored glaze and the transparent glaze is fired.
本申请实施例还提供一种壳体,应用于电子设备,所述壳体包括一基材、一着色层和一前置层,所述基材包括第一表面和第二表面,所述第一表面朝向电子设备内侧,第二表面朝向电子设备外侧,所述着色层和所述前置层依次设置于所述基材的第二表面,所述着色层为设置于所述基材的第二表面的彩色釉,所述前置层包括若干区块,不同折射率的透明釉交替设置于所述若干区块。An embodiment of the present application further provides a casing, which is applied to an electronic device. The casing includes a substrate, a coloring layer and a pre-layer, the substrate includes a first surface and a second surface, and the first surface includes a first surface and a second surface. One surface faces the inside of the electronic device, the second surface faces the outside of the electronic device, the coloring layer and the pre-layer are sequentially arranged on the second surface of the base material, and the coloring layer is the first surface disposed on the base material. The color glaze on the two surfaces, the pre-layer includes several blocks, and the transparent glazes with different refractive indices are alternately arranged on the several blocks.
本申请实施例还提供了一种电子设备,包括壳体,所述壳体包括一基材、一着色层和一前置层,所述基材包括第一表面和第二表面,所述第一表面朝向电子设备内侧,第二表面朝向电子设备外侧,所述着色层和所述前置层依次设置于所述基材的第二表面,所述着色层为设置于所述基材的第二表面的彩色釉,所述前置层包括若干区块,不同折射率的透明釉交替设置于所述若干区块。An embodiment of the present application further provides an electronic device, including a casing, the casing includes a substrate, a coloring layer and a pre-layer, the substrate includes a first surface and a second surface, the first surface One surface faces the inside of the electronic device, the second surface faces the outside of the electronic device, the coloring layer and the pre-layer are sequentially arranged on the second surface of the base material, and the coloring layer is the first surface disposed on the base material. The color glaze on the two surfaces, the pre-layer includes several blocks, and the transparent glazes with different refractive indices are alternately arranged on the several blocks.
本申请实施例提供的壳体制作方法,通过在基材朝向电子设备外侧的表面上依次形成着色层和前置层,所述着色层为设置于所述基材的第二表面的彩色釉,所述前置层包括若干区块,不同折射率的透明釉交替设置于所述若干区块,经过不同区块不同折射率的透明釉对光线的折射和反射作用,从而达到发射指纹印记的作用,使肉眼不易察觉指纹印记。In the case manufacturing method provided by the embodiment of the present application, a coloring layer and a pre-layer are sequentially formed on the surface of the base material facing the outside of the electronic device, and the coloring layer is a colored glaze disposed on the second surface of the base material, The front layer includes several blocks, and transparent glazes with different refractive indices are alternately arranged in the several blocks, and through the refraction and reflection of light by the transparent glazes with different refractive indices in different blocks, the effect of emitting fingerprints is achieved. , so that the fingerprint imprint is not easily detectable by the naked eye.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.
图1为本申请实施例提供的电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
图2为本申请实施例提供的壳体的结构示意图。FIG. 2 is a schematic structural diagram of a casing provided by an embodiment of the present application.
图3为本申请实施例提供的后盖的结构示意图。FIG. 3 is a schematic structural diagram of a back cover provided by an embodiment of the present application.
图4为图3在A-A方向的第一种实施方式的剖面图。FIG. 4 is a cross-sectional view of the first embodiment in the direction A-A of FIG. 3 .
图5为图3在A-A方向的第二种实施方式的剖面图。FIG. 5 is a cross-sectional view of the second embodiment in the direction A-A of FIG. 3 .
图6为本申请实施例提供的后盖的俯视图。FIG. 6 is a top view of a back cover provided by an embodiment of the present application.
图7为本申请实施例提供的壳体的另一结构示意图。FIG. 7 is another schematic structural diagram of the casing provided by the embodiment of the present application.
图8为本申请实施例提供的后盖的另一结构示意图。FIG. 8 is another schematic structural diagram of the back cover provided by the embodiment of the present application.
图9为本申请实施例提供的电子设备的另一结构示意图。FIG. 9 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图10为本申请实施例提供的后盖制作方法的第一种流程示意图。FIG. 10 is a first schematic flow chart of a method for manufacturing a back cover provided by an embodiment of the present application.
图11为本申请实施例提供的后盖制作方法的第二种流程示意图。FIG. 11 is a schematic flow chart of the second type of the method for manufacturing a back cover provided by an embodiment of the present application.
图12为本申请实施例提供的后盖制作方法的第三种流程示意图。FIG. 12 is a third schematic flowchart of the method for manufacturing a back cover provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
本申请实施例提供了一种壳体制作方法、壳体及电子设备。以下将分别进行详细说明。Embodiments of the present application provide a method for manufacturing a casing, a casing, and an electronic device. The detailed descriptions will be given below.
在本实施例中,将从后盖制作方法的角度进行描述,所述壳体制作方法可以形成壳体,所述壳体可以设置在电子设备中,比如手机、平板电脑、掌上电脑(Personal DigitalAssistant,PDA)等。In this embodiment, the description will be made from the perspective of the manufacturing method of the back cover. The manufacturing method of the casing can form a casing, and the casing can be arranged in an electronic device, such as a mobile phone, a tablet computer, a PDA (Personal Digital Assistant , PDA) etc.
请参阅1,图1为本申请实施例提供的电子设备的结构示意图。所述电子设备1包括壳体10、显示屏20、印制电路板30、电池40。Please refer to 1. FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device 1 includes a
请参阅图2,图2为本申请实施例提供的壳体的结构示意图。Please refer to FIG. 2 , which is a schematic structural diagram of a casing provided by an embodiment of the present application.
其中,所述壳体10可以包括盖板11、中框12和后盖13。所述盖板11、所述中框12和所述后盖13相互组合形成所述壳体10。所述壳体10具有通过所述盖板11、所述中框12和所述后盖13形成的一密闭空间,以容纳显示屏20、印制电路板30、电池40等器件。Wherein, the
在一些实施例中,所述盖板11盖设到所述中框12上。所述后盖13盖设到所述中框12上。所述盖板11和后盖13位于所述中框12的相对面。所述盖板11和后盖13相对设置。所述壳体10的密闭空间位于所述盖板11和后盖13之间。In some embodiments, the
所述盖板11可以为透明玻璃盖板。在一些实施方式中,所述盖板11可以是用诸如蓝宝石等材料制成的玻璃盖板。The
所述中框12可以为金属壳体,比如铝合金中框12。需要说明的是,本申请实施例中框12的材料并不限于此,还可以采用其它方式,比如:所述中框12可以陶瓷中框、玻璃中框。再比如:所述中框12可以为塑胶中框。还比如:所述中框12可以为金属和塑胶相互配合的结构,可以将塑胶部分和注塑到金属板材上形成。The
所述后盖13可以金属后盖,比如铝合金后盖,不锈钢后盖。所述后盖13还可以为玻璃后盖或者陶瓷后盖。The
请一并参阅图3,图3为本申请实施例提供的后盖的结构示意图。Please also refer to FIG. 3 , which is a schematic structural diagram of a back cover provided by an embodiment of the present application.
所述后盖13可以包括相对设置的内表面131和外表面132。所述后盖13的内表面131靠近中框12及盖板11,构成所述壳体10的内表面的一部分。所述后盖13的外表面132远离中框12及盖板11,构成所述壳体10的外表面的一部分。所述后盖13还可以包括通孔133,所述通孔133可以用于安装摄像头。The
请一并参阅图4,图4为图3在A-A方向的剖面图。Please also refer to FIG. 4 . FIG. 4 is a cross-sectional view of FIG. 3 along the A-A direction.
为便于说明,以下以后盖13为例,对壳体进行说明。For convenience of description, the case is described below by taking the
所述后盖13可以包括一基材134、一着色层136和一前置层135。所述着色层136和所述前置层135依次设置于所述后盖13远离盖板11的表面。The
其中,所述基材134可以采用铝材,比如铝合金,也可以采用不锈钢,还可以采用玻璃、陶瓷等。The
所述基材134包括第一表面1342和第二表面1341。所述第一表面1342朝向电子设备内侧,第二表面1341朝向电子设备外侧。在一种实施例中,所述第一表面1342朝向盖板11和中框12的方向设置。所述第一表面1342可以为后盖13的内表面131。所述第一表面1342为所述壳体11的内表面。所述第二表面1341朝向背离盖板11和中框12的方向设置。所述第二表面1341为所述壳体11的外表面。The
所述着色层136为设置于所述基材134的第二表面1341的彩色釉。The
在一种实施例中,为了使所述着色层136能够更加牢固地附着于所述基材134的第二表面1341,可以对所述基材134的第二表面1341进行抛光处理,以增加所述基材134的第二表面1341的表面的平整度,从而增加了所述着色层136在所述基材134的第二表面1341的附着力,进而使所述着色层136能够牢固地附着于所述基材134的第二表面1341。In one embodiment, in order to make the
在一种实施例中,请参阅图5,所述着色层136可以包括至少两个着色区1361/1362。一个着色区设置一种颜色的彩色釉,以形成图案。In one embodiment, referring to FIG. 5 , the
例如,所述着色层136包括第一着色区1361和第二着色区1362。所述第着色区1361可以施红色釉料。所述第二着色区1362可以施蓝色釉料。For example, the
在一种实施例中,可以对所述着色层136的彩色釉进行干燥处理,当所述彩色釉干燥后,在所述着色层136上设置前置层135。In an embodiment, the colored glaze of the
所述前置层135设置于所述着色层136。所述前置层135包括若干区块1351。不同折射率的透明釉A/B交替设置于所述若干区块1351。The pre-layer 135 is disposed on the
在一种实施例中,所述不同折射率的透明釉A/B可以采用不同掺杂的SiO2。In an embodiment, the transparent glazes A/B with different refractive indices may use SiO 2 with different doping.
在一种实施例中,请参阅图6,所述若干区块1351可以形成阵列结构。In one embodiment, referring to FIG. 6 , the plurality of
例如,所述前置层135包括若干第一区块1351a和若干第二区块1351b。所述若干第一区块1351a和若干第二区块1351b交替设置。所述若干第一区块1351a和若干第二区块1351b间隔设置。所述第一区块1351a设置有第一种折射率的透明釉A。所述第二区块1351b设置有第二种折射率的透明釉B。For example, the pre-layer 135 includes several
在一种实施例中,可以先在所述第一区块1351a设置第一透明釉A,在第二区块1351b设置第二透明釉B,然后,干燥所述第一透明釉A和第二透明釉B,最后,烧结所述具有第一透明釉A和第二透明釉B的基材134,从而获得具有发射指纹印记的作用的壳体。In one embodiment, a first transparent glaze A may be disposed in the
在一种实施例中,还可以利用喷墨打印机,将所述第一透明釉A和第二透明釉B分别承装于所述喷墨打印机的不同墨盒,通过电脑设置打印程序,将第一透明釉和第二透明釉分别打印于所述第一区块和第二区块,然后,干燥所述第一透明釉A和第二透明釉B,最后,烧结所述具有第一透明釉A和第二透明釉B的基材134,从而获得具有发射指纹印记的作用的壳体。In an embodiment, an inkjet printer can also be used to mount the first transparent glaze A and the second transparent glaze B in different ink cartridges of the inkjet printer, and set a printing program through a computer to make the first transparent glaze A and the second transparent glaze B respectively mounted on different ink cartridges of the inkjet printer. The transparent glaze and the second transparent glaze are respectively printed on the first block and the second block, then, the first transparent glaze A and the second transparent glaze B are dried, and finally, the first transparent glaze A is fired. and the
在一种实施例中,可以采用窑炉对所述设置有彩色釉和透明釉的基材134进行烧结。In one embodiment, the
在一种实施例中,还可以在所述前置层135上喷透明漆,形成保护层137,以保护所述前置层135,避免所述前置层135在使用过程的碎裂。In an embodiment, transparent paint may also be sprayed on the pre-layer 135 to form a
需要说明的是,本申请实施例壳体的结构并不限于此,比如,请参阅图7,图7为本申请实施例提供的壳体的另一结构示意图。It should be noted that the structure of the housing in the embodiment of the present application is not limited to this. For example, please refer to FIG. 7 , which is another schematic structural diagram of the housing provided in the embodiment of the present application.
所述壳体10a包括盖板16和后盖17。在一些实施例中,所述盖板16直接盖设到所述后盖17上。所述盖板16和所述后盖17相互组合形成所述壳体10a。所述壳体10a具有通过所述盖板16和后盖17形成的一密闭空间,以容纳显示屏20、印制电路板30、电池40等器件。The
相比图2所示的壳体10,图7的所述壳体10a不包括中框,或者说是将图2中的中框12和后盖13一体成型形成一后盖17结构。Compared with the
具体的,请参阅图8,图8为本申请实施例提供的后盖的另一结构示意图。Specifically, please refer to FIG. 8 , which is another schematic structural diagram of the back cover provided by the embodiment of the present application.
在一些实施例中,后盖17包括内表面171和外表面172,内表面171和外表面172相对设置,形成后盖17的整个表面。所述后盖17的各层结构可以参阅后盖13,在此不再赘述。In some embodiments, the
所述印制电路板30安装在壳体10中,所述印制电路板30可以为电子设备1的主板,印制电路板30上可以集成有天线、马达、麦克风、摄像头、光线传感器、受话器以及处理器等功能组件。在一些实施例中,所述印制电路板30固定在壳体10内。具体的,所述印制电路板30可以通过螺钉螺接到中框12上,也可以采用卡扣的方式卡配到中框12上。需要说明的是,本申请实施例印制电路板30具体固定到中框12上的方式并不限于此,还可以其它方式,比如通过卡扣和螺钉共同固定的方式。The printed
所述电池40安装在壳体10中,电池40与所述印制电路板30进行电连接,以向电子设备1提供电源。壳体10可以作为电池40的电池盖。壳体10覆盖电池40以保护电池40,具体的是后盖13覆盖电池40以保护电池40,减少电池40由于电子设备1的碰撞、跌落等而受到的损坏。The
所述显示屏20安装在壳体10中,同时,所述显示屏20电连接至印制电路板30上,以形成电子设备1的显示面。所述显示屏20包括显示区域14和非显示区域15。所述显示区域14可以用来显示电子设备1的画面或者供用户进行触摸操控等。所述非显示区域15的顶部区域开设供声音、及光线传导的开孔,所述非显示区域15底部上可以设置指纹模组、触控按键等功能组件。其中所述盖板11安装到显示屏20上,以覆盖显示屏20,形成与显示屏20相同的显示区域和非显示区域,具体可以参阅显示屏20的显示区域和非显示区域。The
需要说明的是,所述显示屏20的结构并不限于此。比如,所述显示屏可以为全面屏或异性屏,具体的,请参阅图9,图9为本申请实施例提供的电子设备的另一结构示意图。图9中的电子设备与图1中的电子设备的区别在于:所述非显示区域15a直接形成在显示屏20a上,比如在显示屏20a的非显示区域15a设置成透明结构,以便光信号穿过,或者直接在显示屏20a的非显示区域开设供光线传导的开孔或缺口等结构,可以将前置摄像头、光电感应器等设置于非显示区域位置,以便前置摄像头拍照、光电感应器检测。所述显示区域14a铺满电子设备1a整个表面。需要说明的是,所述电子设备1a中的壳体10、印制电路板30及电池40等器件可以参阅以上内容,在此不再赘述。It should be noted that the structure of the
本发明还提供一种壳体的制作方法。The invention also provides a manufacturing method of the casing.
需要说明的是,以下以后盖为例进行说明,但是本申请实施例壳体制作方法并不限于后盖。It should be noted that the following description takes the back cover as an example, but the manufacturing method of the case in the embodiment of the present application is not limited to the back cover.
请一并参阅图10,图10为本申请实施例提供的后盖制作方法的流程示意图。所述壳体制作方法包括以下步骤:Please also refer to FIG. 10 . FIG. 10 is a schematic flowchart of a method for manufacturing a back cover according to an embodiment of the present application. The shell manufacturing method includes the following steps:
步骤S101,提供一基材134,所述基材134包括第一表面1342和第二表面1341,所述第一表面1342朝向电子设备内侧,第二表面1341朝向电子设备外侧。In step S101, a
所述基材134可以为金属材料,比如铝材,进一步的,比如铝合金。需要说明的是,所述基材134可以直接购买得到,也可以对板材加工得到,比如对铝合金板材进行锻压、时效等工艺处理得到。所述基材134还可以采用玻璃、陶瓷等。The
所述第一表面1342朝向盖板11和中框12的方向设置。所述第一表面1342可以为后盖13的内表面131。所述第一表面1342为所述壳体11的内表面。所述第二表面1341朝向背离盖板11和中框12的方向设置。所述第二表面1341为所述壳体11的外表面。The
步骤S102:在所述基材134的第二表面1341上设置彩色釉,形成一着色层136。Step S102 : disposing colored glaze on the
所述着色层136为设置于所述基材134的第二表面1341的彩色釉。The
在一种实施例中,为了使所述着色层136能够更加牢固地附着于所述基材134的第二表面1341,可以对所述基材134的第二表面1341进行抛光处理,以增加所述基材134的第二表面1341的表面的平整度,从而增加了所述着色层136在所述基材134的第二表面1341的附着力,进而使所述着色层136能够牢固地附着于所述基材134的第二表面1341。In one embodiment, in order to make the
在一些实施例中,可以采用机械、化学、电化学或超声波等的方式对所述基材134的第二表面1341实现抛光。以使得所述基材134的第二表面1341粗糙度降低,以获得光亮、平整表面的所述基材134的第二表面1341。其中,化学抛光方式是对所述基材134的第二表面1341进行有规则溶解达到光滑平整。其中,电化学抛光方式是将所述基材134的第二表面1341作为阳极、不溶性金属为阴极,两极同时浸入到电解槽内,通直流而产生有选择性的阳极溶液,从而使得所述基材134的第二表面1341光亮度增加大。其中机械抛光的方式是靠切削所述基材134的第二表面1341,使得所述基材134的第二表面1341塑性变形去掉抛光后的凸部而得到平滑面。其中超声波抛光的方式是将所述基材134放入磨料悬浮液中并一起置于超声波场中,依靠超声波的振荡作用,使磨料在所述基材134的第二表面1341磨削抛光。In some embodiments, the
在一些实施例中,在对所述基材134的第二表面1341进行抛光处理之前,可以先对所述基材134的第二表面1341进行打磨处理,然后再对打磨处理后的所述基材134的第二表面1341进行抛光处理,使抛光处理效果更佳,使得所述基材134的第二表面1341更加平整。在此,需要说明的是,所述打磨处理可以理解为对抛光处理前的粗加工。即,可以先对后盖外表面进行一次粗打磨,再进行一次细打磨,完成抛光处理。In some embodiments, before polishing the
在一种实施例中,请参阅图5,所述着色层136可以包括至少两个着色区1361/1362。一个着色区设置一种颜色的彩色釉,以形成图案。In one embodiment, referring to FIG. 5 , the
例如,所述着色层136包括第一着色区1361和第二着色区1362。所述第着色区1361可以施红色釉料。所述第二着色区1362可以施蓝色釉料。For example, the
步骤S103:当所述彩色釉干燥后,在所述着色层136上设置前置层135,所述前置层135包括若干区块1351,不同折射率的透明釉A/B交替设置于所述若干区块1351。Step S103: After the colored glaze is dried, a pre-layer 135 is arranged on the
在一种实施例中,可以对所述着色层136的彩色釉进行干燥处理,当所述彩色釉干燥后,在所述着色层136上设置前置层135。In an embodiment, the colored glaze of the
在一种实施例中,所述不同折射率的透明釉A/B可以采用不同掺杂的SiO2。In an embodiment, the transparent glazes A/B with different refractive indices may use SiO 2 with different doping.
在一种实施例中,请参阅图6,所述若干区块1351可以形成阵列结构。In one embodiment, referring to FIG. 6 , the plurality of
例如,所述前置层135包括若干第一区块1351a和若干第二区块1351b。所述若干第一区块1351a和若干第二区块1351b交替设置。所述若干第一区块1351a和若干第二区块1351b间隔设置。所述第一区块1351a设置有第一种折射率的透明釉A。所述第二区块1351b设置有第二种折射率的透明釉B。For example, the pre-layer 135 includes several
需要说明的是,本实施例提供的透明釉的折射率种类并不局限为两种,也可以为两种以上。It should be noted that the types of refractive indices of the transparent glaze provided in this embodiment are not limited to two, and may also be more than two.
在一种实施例中,请参阅图11,所述步骤S102可以包括:In an embodiment, referring to FIG. 11 , the step S102 may include:
步骤S1031:在所述第一区块1351a设置第一透明釉A;Step S1031: disposing a first transparent glaze A on the
步骤S1032:在所述第二区块1351b设置第二透明釉B;以及Step S1032: disposing a second transparent glaze B on the
步骤S1033:干燥所述第一透明釉A和第二透明釉B。Step S1033: drying the first transparent glaze A and the second transparent glaze B.
在一种实施例中,可以先在所述第一区块1351a设置第一透明釉A,在第二区块1351b设置第二透明釉B,然后,干燥所述第一透明釉A和第二透明釉B。In one embodiment, a first transparent glaze A may be disposed in the
在一种实施例中,请参阅图12,所述步骤S103还可以包括:In an embodiment, referring to FIG. 12 , the step S103 may further include:
步骤S103a:采用喷墨打印机将第一透明釉A和第二透明釉B分别打印于所述第一区块1351a和第二区块1351b;以及Step S103a: using an inkjet printer to print the first transparent glaze A and the second transparent glaze B on the
步骤S103b:干燥所述第一透明釉A和第二透明釉B。Step S103b: drying the first transparent glaze A and the second transparent glaze B.
在一种实施例中,还可以利用喷墨打印机,将所述第一透明釉A和第二透明釉B分别承装于所述喷墨打印机的不同墨盒,通过电脑设置打印程序,将第一透明釉和第二透明釉分别打印于所述第一区块和第二区块,然后,干燥所述第一透明釉A和第二透明釉B。In an embodiment, an inkjet printer can also be used to mount the first transparent glaze A and the second transparent glaze B in different ink cartridges of the inkjet printer, and set a printing program through a computer to make the first transparent glaze A and the second transparent glaze B respectively mounted on different ink cartridges of the inkjet printer. The transparent glaze and the second transparent glaze are respectively printed on the first block and the second block, and then the first transparent glaze A and the second transparent glaze B are dried.
步骤S104:当所述透明釉干燥后,对所述设置有彩色釉和透明釉的基材134进行烧结。Step S104: After the transparent glaze is dried, the
在一种实施例中,可以采用窑炉对所述设置有彩色釉和透明釉的基材134进行烧结。In one embodiment, the
在所述步骤S104之后,还可以包括:After the step S104, it can also include:
步骤S105:在所述前置层135设置一保护层137。Step S105 : disposing a
在一种实施例中,可以在所述前置层135上喷透明漆,形成保护层137,以保护所述前置层135,避免所述前置层135在使用过程的碎裂。In one embodiment, transparent paint may be sprayed on the pre-layer 135 to form a
综上可知,本申请实施例提供的壳体制作方法,通过在基材朝向电子设备外侧的表面上依次形成着色层和前置层,所述着色层为设置于所述基材的第二表面的彩色釉,所述前置层包括若干区块,不同折射率的透明釉交替设置于所述若干区块,经过不同区块不同折射率的透明釉对光线的折射和反射作用,从而达到发射指纹印记的作用,使肉眼不易察觉指纹印记。From the above, it can be seen from the above that, in the case manufacturing method provided by the embodiments of the present application, a coloring layer and a pre-layer are sequentially formed on the surface of the base material facing the outside of the electronic device, and the coloring layer is disposed on the second surface of the base material. The pre-layer includes several blocks, and the transparent glazes with different refractive indices are alternately arranged in the several blocks, through the refraction and reflection of the light by the transparent glazes with different refractive indices in different blocks, so as to achieve emission The role of fingerprint imprints makes it difficult for the naked eye to detect fingerprint imprints.
本领域技术人员可以理解,图1中示出的电子设备1的结构并不构成对电子设备1的限定。电子设备1可以包括比图示更多或更少的部件,或者组合某些部件,或者不同的部件布置。电子设备1还可以包括存储器、蓝牙模块等,在此不再赘述。Those skilled in the art can understand that the structure of the electronic device 1 shown in FIG. 1 does not constitute a limitation on the electronic device 1 . The electronic device 1 may comprise more or fewer components than shown, or combine certain components, or a different arrangement of components. The electronic device 1 may further include a memory, a Bluetooth module, and the like, which will not be repeated here.
以上对本申请实施例提供的壳体制作方法、壳体及电子设备进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请。同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。The case manufacturing method, the case and the electronic device provided by the embodiments of the present application have been described in detail above. The principles and implementations of the present application are described with specific examples in this paper. The descriptions of the above embodiments are only used to help understanding this application. At the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific embodiments and application scope. To sum up, the content of this specification should not be construed as a limitation to the present application.
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