CN107565235A - 电连接器 - Google Patents
电连接器 Download PDFInfo
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- CN107565235A CN107565235A CN201710665702.5A CN201710665702A CN107565235A CN 107565235 A CN107565235 A CN 107565235A CN 201710665702 A CN201710665702 A CN 201710665702A CN 107565235 A CN107565235 A CN 107565235A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H05K3/341—Surface mounted components
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- H01R12/70—Coupling devices
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Abstract
本发明公开了一种电连接器,用以电性连接一芯片模块至一电路板,包括:一本体,用于向上承载芯片模块,其设有多个收容孔;多个端子,分别对应收容于收容孔,每一端子设有焊接部,其接触一焊料而焊接至电路板,自焊接部向上延伸形成一第一部和一第二部位于焊料的相对两侧,自第二部向上弯折延伸一弹性臂,用于抵接芯片模块,当芯片模块下压弹性臂时,弹性臂抵接于第一部,从而形成依次经由芯片模块、弹性臂、第一部、焊接部、焊料、电路板,以及依次经由芯片模块、弹性臂、第二部、焊接部、焊料、电路板的两条相互并联的导电路径,降低了讯号传输时的阻抗及自感效应,进而提供芯片模块与电路板之间良好的电性导接及讯号传输性能。
Description
技术领域
本发明涉及一种电连接器,尤其是指一种电性连接芯片模块至电路板的电连接器。
背景技术
专利号为CN200420080676.8的中国专利揭示了一种电连接器,用以电性导接芯片模块与电路板,其包括绝缘本体及容置于绝缘本体内的若干端子,该端子包括与芯片模块弹性抵压的弹性端、与电路板焊接导接的焊接端以及连接该弹性端与焊接端的连接部,电连接器的端子完全安装于绝缘本体后,其弹性端和焊接端分别部分突露于绝缘本体两相对表面外,而分别与芯片模块的导电元件及电路板的焊球导接。
然而,该种电连接器至少存在以下缺点:使用时,芯片模块的导电元件抵压于弹性端的接触部上,而焊接端的焊接部则与电路板的焊球相焊接,从而形成依次经由芯片模块、接触部、弹性端、连接部、焊接端、焊接部、锡球、电路板的较长的导电路径,导电通路的自感效应较大,且电流流经这一较长的导电通路时总的电阻抗增大。
由于现在的电讯传输一般具有较高的频率,会产生更大的自感效应,这样由于自感效应及电阻抗的增大,会影响电路的正常功能,进而影响芯片模块与电路板间的电性连接及讯号传输性能。
因此,有必要设计一种新的电连接器,以克服上述问题。
发明内容
本发明的创作目的在于提供一种提供芯片模块与电路板间良好的电性导接及讯号传输性能的电连接器。
为了达到上述目的,本发明采用如下技术方案:
一种电连接器,用以电性连接一芯片模块至一电路板,其特征在于,包括:一本体,用于向上承载所述芯片模块,其设有多个收容孔;多个端子,分别对应收容于所述收容孔,每一所述端子设有焊接部,其接触一焊料而焊接至所述电路板,自焊接部向上延伸形成一第一部和一第二部位于所述焊料的相对两侧,自所述第二部向上弯折延伸一弹性臂,用于抵接所述芯片模块,当所述芯片模块下压所述弹性臂时,所述弹性臂抵接于所述第一部。
进一步,所述焊接部有两个且分开成型,两所述焊接部夹持所述焊料。
进一步,所述第一部具有一平板部、及一延伸臂自平板部向上弯折延伸且位于所述弹性臂的下方,当所述芯片模块下压所述弹性臂时,所述弹性臂抵接于所述延伸臂。
进一步,所述弹性臂自所述第二部先朝远离所述第二部所在竖直面的方向延伸再反向弯折延伸越过所述平板部所在竖直面,所述弹性臂设有一接触部用于向上抵接所述芯片模块,所述延伸臂与所述弹性臂的接触位置与所述接触部位于所述平板部的同一侧。
进一步,所述第一部呈竖直平板状,所述弹性臂的末端低于所述第一部的顶端,且所述弹性臂的侧缘抵接于所述第一部的侧缘。
进一步,所述弹性臂的侧缘凹设有一缺口延伸至所述弹性臂的末端,所述第一部的板缘与所述缺口抵接。
进一步,所述第一部具有一导斜面延伸至所述第一部的顶端,以导引所述弹性臂抵接所述第一部。
进一步,所述焊接部呈水平平板状,所述焊料焊接于所述焊接部的底面,所述第一部和第二部自所述焊接部的相对两侧向上弯折延伸形成,所述第一部和第二部呈竖直平板状。
进一步,一基部自第二部的一侧弯折延伸形成,所述基部与所述第一部之间具有一间隙,所述弹性臂穿过所述间隙且抵接于所述第一部靠近基部的一侧。
进一步,所述端子还具有一基部,所述第一部和所述第二部自基部相对两侧弯折延伸形成,所述弹性臂抵接于所述第一部远离所述基部的一侧。
进一步,所述焊接部有两个且分别连接第一部和第二部,两个焊接部共同夹持所述焊料的相对两侧。
进一步,其中连接所述第一部的焊接部设有贯穿其靠近所述基部的侧缘的一通孔,所述通孔固持所述焊料。
进一步,一基部自所述第二部的一侧弯折延伸形成,所述基部底端的相对两侧形成两倒钩,所述收容孔的一侧面凸伸有两凸块位于两倒钩的上方以限制所述端子上移。
进一步,所述焊料焊接于所述倒钩。
进一步,所述收容孔的一侧面凸伸有一挡块位于所述焊料的上方以限制所述焊料上移,且所述第一部和第二部位于所述挡块的相对两侧。
与现有技术相比,本发明电连接器具有以下有益效果:
所述第一部和第二部位于焊料的相对两侧,当所述芯片模块下压所述弹性臂时,所述弹性臂抵接于所述第一部,从而在芯片模块与电路板之间形成依次经由芯片模块、弹性臂、第一部、焊接部、焊料、电路板,以及依次经由芯片模块、弹性臂、第二部、焊接部、焊料、电路板的两条相互并联的导电路径,降低了讯号传输时的阻抗及自感效应,进而提供芯片模块与电路板之间良好的电性导接及讯号传输性能。
【附图说明】
图1为本发明第一实施例电连接器在芯片模块下压前的立体图;
图2为图1中的电连接器在水平方向旋转180°后的立体图;
图3为图1的侧视图;
图4为图1中的电连接器在芯片模块下压后的立体图;
图5为图4的侧视图;
图6为图5沿A-A方向的剖视图;
图7为本发明第二实施例电连接器在芯片模块下压前的立体图;
图8为图7中的端子在水平方向旋转180°后的立体图;
图9为图7的侧视图;
图10为图7中的电连接器在芯片模块下压后的立体图;
图11为图10的侧视图;
图12为图11沿B-B方向的剖视图;
图13本发明第三实施例电连接器在芯片模块下压前的立体图;
图14为图13中的电连接器在芯片模块下压后的侧视图。
具体实施方式的附图标号说明:
电连接器100 | 本体1 | 收容孔11 | 凸块111 |
倾斜面1111 | 挡块112 | 端子2 | 焊接部21 |
第一焊接部21A | 第一通孔211A | 第二焊接部21B | 第二通孔211B |
第一部22 | 导斜面221 | 平板部222 | 延伸臂223 |
第二部23 | 弹性臂24 | 接触部241 | 缺口242 |
基部25 | 倒钩251 | 间隙26 | 焊料3 |
芯片模块4 | 电路板5 | 距离D1、D2 |
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等,现结合附图和具体实施方式对本发明作进一步说明。
如图1至图6所示,为本发明第一实施例的电连接器100,用以电性连接一芯片模块4至一电路板5,其包括用于向上承载所述芯片模块4的一本体1,及收容于所述本体1的多个端子2。
如图1所示,所述本体1设有多个收容孔11上下贯穿所述本体1,每一所述收容孔11的一侧面设有间隔设置的两凸块111。如图2所示,每一所述收容孔11的相对另一侧面设有一挡块112(辅助参看图6)。
如图1和图3所示,多个所述端子2,分别对应收容于所述收容孔11,每一所述端子2设有相对设置的一第一焊接部21A和一第二焊接部21B,第一焊接部21A和第二焊接部21B共同夹持一焊料3的相对两侧,通过所述焊料3使第一焊接部21A和第二焊接部21B焊接至所述电路板5,所述第一焊接部21A设有一第一通孔211A,所述第二焊接部21B设有一第二通孔211B,所述第一通孔211A和第二通孔211B固持所述焊料3。
自所述第一焊接部21A向上延伸形成一第一部22,自所述第二焊接部21B向上延伸形成一第二部23,第一部22和一第二部23位于所述焊料3和挡块112的相对两侧,所述第一部22与第二部23呈竖直平板状,且所述第一部22与第二部23之间的距离D1大于两所述焊接部21之间的距离D2,所述第一部22具有一导斜面221延伸至所述第一部22的顶端。
如图1、图3和图5所示,自所述第二部23向上弯折延伸一弹性臂24,用于抵接所述芯片模块4,所述弹性臂24自所述第二部23先朝远离所述第二部23所在竖直面的方向延伸再反向弯折延伸越过所述第一部22所在竖直面,所述弹性臂24设有呈弧形的一接触部241用于向上抵接所述芯片模块4,所述弹性臂24的末端低于所述第一部22的顶端,且所述弹性臂24的侧缘凹设有一缺口242延伸至所述弹性臂24的末端。
每一所述端子2还具有一基部25,所述第一部22和所述第二部23自基部25相对两侧弯折延伸形成,且所述基部25垂直于所述第一部22和第二部23,所述导斜面221位于所述第一部22远离所述基部25的一侧。
所述第一通孔211A贯穿所述第一焊接部21A靠近所述基部25的侧缘,所述第二通孔211B未贯穿所述第二焊接部21B的侧缘(在其它实施例中,第一通孔211A和第二通孔211B的结构也可相同)。
如图1、图3和图6所示,两所述凸块111位于所述基部25的相对两侧,所述基部25底端的相对两侧形成两倒钩251位于所述凸块111的下方以限制所述端子2上移,每一所述凸块111具有一倾斜面1111用以导引所述倒钩251,且所述焊料3焊接于所述倒钩251,所述基部25顶端用以连接一料带,且低于所述收容孔11的顶面。
如图1所示,在组装电连接器100时,先将多个所述端子2自上而下分别对应安装至多个所述收容孔11中,直至所述倒钩251位于所述凸块111的下方(辅助参看图6),接着将多个所述焊料3自下而上分别安装至多个所述收容孔11中,直至所述焊料3位于所述第一焊接部21A和所述第二焊接部21B之间,此时所述挡块112位于所述焊料3的上方以限制所述焊料3上移,且所述倒钩251接触所述焊料3(辅助参看图6)。
如图3、图5和图6所示,当所述芯片模块4下压所述弹性臂24时,所述弹性臂24向下移动,所述弹性臂24在所述导斜面221导引下进而抵接于所述缺口242(在其它实施例中,在芯片模块4下压前,所述弹性臂24与第一部22也可保持接触),从而在芯片模块4与电路板5之间形成依次经由芯片模块4、接触部241、第一部22、第一焊接部21A、焊料3、电路板5;依次经由芯片模块4、接触部241、第一部22、基部25、倒钩251、焊料3、电路板5;以及依次经由芯片模块4、接触部241、第二部23、第二焊接部21B、焊料3、电路板5的至少三条相互并联的导电路径,降低了讯号传输时的阻抗及自感效应,进而提供芯片模块4与电路板5之间良好的电性导接及讯号传输性能。
如图7至图12所示,为本发明第二实施例的电连接器100,与第一实施例的不同之处在于,本实施例中,每一端子2只有一个焊接部21,所述焊接部21呈水平平板状,所述焊料3焊接于所述焊接部21的底面,所述第一部22和第二部23自所述焊接部21的相对两侧向上弯折延伸形成,所述基部25自所述第二部23的一侧弯折延伸形成,所述基部25与所述第一部22之间具有一间隙26,所述弹性臂24穿过所述间隙26且抵接于所述第一部22靠近基部25的一侧。
如图13至图14所示,为本发明第三实施例的电连接器100,与第一实施例的不同之处在于,本实施例中,所述第一焊接部21A与所述第二焊接部21B分开成型,所述第一部22具有一平板部222、及一延伸臂223自平板部222向上弯折延伸且位于所述弹性臂24的下方,当所述芯片模块4下压所述弹性臂24时,所述弹性臂24抵接于所述延伸臂223,保证了所述弹性臂24与所述第一部22之间的稳定电性连接,且所述延伸臂223与所述弹性臂24的接触位置与所述接触部241位于所述平板部222的同一侧。
综上所述,本发明电连接器有下列有益效果:
(1)所述第一部22和第二部23位于焊料3的相对两侧,当所述芯片模块4下压所述弹性臂24时,所述弹性臂24抵接于所述第一部22,从而在芯片模块4与电路板5之间形成依次经由芯片模块4、弹性臂24、第一部22、第一焊接部21A、焊料3、电路板5,以及依次经由芯片模块4、弹性臂24、第二部23、第二焊接部21B、焊料3、电路板5的两条相互并联的导电路径,降低了讯号传输时的阻抗及自感效应,进而提供芯片模块4与电路板5之间良好的电性导接及讯号传输性能。
(2)当所述芯片模块4下压所述弹性臂24时,所述弹性臂24的侧缘抵接于所述第一部22的侧缘,可以刮擦去除形成在所述弹性臂24和第一部22的氧化层,以增强了所述弹性臂24与所述第一部22的抵接效果。
(3)所述收容孔11的一侧面凸伸有两所述凸块111位于所述基部25的相对两侧,所述基部25底端的相对两侧形成两所述倒钩251位于所述凸块111的下方以限制所述端子2上移。
(4)所述焊料3焊接于所述倒钩251,当所述芯片模块4下压所述弹性臂24时,可形成依次经由芯片模块4、接触部241、第一部22、基部25、倒钩251、焊料3、电路板5的第三条并联的导电路径,可进一步降低了讯号传输时的阻抗及自感效应。
以上详细说明仅为本发明之较佳实施例的说明,非因此局限本发明之专利范围,所以,凡运用本创作说明书及图示内容所为之等效技术变化,均包含于本创作之专利范围内。
Claims (15)
1.一种电连接器,用以电性连接一芯片模块至一电路板,其特征在于,包括:
一本体,用于向上承载所述芯片模块,其设有多个收容孔;
多个端子,分别对应收容于所述收容孔,每一所述端子设有焊接部,其接触一焊料而焊接至所述电路板,自焊接部向上延伸形成一第一部和一第二部位于所述焊料的相对两侧,自所述第二部向上弯折延伸一弹性臂,用于抵接所述芯片模块,当所述芯片模块下压所述弹性臂时,所述弹性臂抵接于所述第一部。
2.如权利要求1所述的电连接器,其特征在于:所述焊接部有两个且分开成型,两所述焊接部夹持所述焊料。
3.如权利要求1所述的电连接器,其特征在于:所述第一部具有一平板部、及一延伸臂自平板部向上弯折延伸且位于所述弹性臂的下方,当所述芯片模块下压所述弹性臂时,所述弹性臂抵接于所述延伸臂。
4.如权利要求3所述的电连接器,其特征在于:所述弹性臂自所述第二部先朝远离所述第二部所在竖直面的方向延伸再反向弯折延伸越过所述平板部所在竖直面,所述弹性臂设有一接触部用于向上抵接所述芯片模块,所述延伸臂与所述弹性臂的接触位置与所述接触部位于所述平板部的同一侧。
5.如权利要求1所述的电连接器,其特征在于:所述第一部呈竖直平板状,所述弹性臂的末端低于所述第一部的顶端,且所述弹性臂的侧缘抵接于所述第一部的侧缘。
6.如权利要求5所述的电连接器,其特征在于:所述弹性臂的侧缘凹设有一缺口延伸至所述弹性臂的末端,所述第一部的板缘与所述缺口抵接。
7.如权利要求1所述的电连接器,其特征在于:所述第一部具有一导斜面延伸至所述第一部的顶端,以导引所述弹性臂抵接所述第一部。
8.如权利要求1所述的电连接器,其特征在于:所述焊接部呈水平平板状,所述焊料焊接于所述焊接部的底面,所述第一部和第二部自所述焊接部的相对两侧向上弯折延伸形成,所述第一部和第二部呈竖直平板状。
9.如权利要求1所述的电连接器,其特征在于:一基部自第二部的一侧弯折延伸形成,所述基部与所述第一部之间具有一间隙,所述弹性臂穿过所述间隙且抵接于所述第一部靠近基部的一侧。
10.如权利要求1所述的电连接器,其特征在于:所述端子还具有一基部,所述第一部和所述第二部自基部相对两侧弯折延伸形成,所述弹性臂抵接于所述第一部远离所述基部的一侧。
11.如权利要求10所述的电连接器,其特征在于:所述焊接部有两个且分别连接第一部和第二部,两个焊接部共同夹持所述焊料的相对两侧。
12.如权利要求11所述的电连接器,其特征在于:其中连接所述第一部的焊接部设有贯穿其靠近所述基部的侧缘的一通孔,所述通孔固持所述焊料。
13.如权利要求1所述的电连接器,其特征在于:一基部自所述第二部的一侧弯折延伸形成,所述基部底端的相对两侧形成两倒钩,所述收容孔的一侧面凸伸有两凸块位于两倒钩的上方以限制所述端子上移。
14.如权利要求13所述的电连接器,其特征在于:所述焊料焊接于所述倒钩。
15.如权利要求1所述的电连接器,其特征在于:所述收容孔的一侧面凸伸有一挡块位于所述焊料的上方以限制所述焊料上移,且所述第一部和第二部位于所述挡块的相对两侧。
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CN108847539A (zh) * | 2018-05-18 | 2018-11-20 | 番禺得意精密电子工业有限公司 | 电连接器 |
CN108847539B (zh) * | 2018-05-18 | 2019-11-26 | 番禺得意精密电子工业有限公司 | 电连接器 |
WO2023197575A1 (zh) * | 2022-04-13 | 2023-10-19 | 中兴通讯股份有限公司 | 电连接器端子、电连接器及电子设备 |
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US10148024B2 (en) | 2018-12-04 |
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US20180198219A1 (en) | 2018-07-12 |
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