CN106222710A - A kind of acid half bright tin plating solution and preparation method thereof - Google Patents
A kind of acid half bright tin plating solution and preparation method thereof Download PDFInfo
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 238000007747 plating Methods 0.000 title claims abstract description 38
- 239000002253 acid Substances 0.000 title claims abstract description 8
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 72
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 36
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims abstract description 24
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000001211 (E)-4-phenylbut-3-en-2-one Substances 0.000 claims abstract description 15
- 229930008407 benzylideneacetone Natural products 0.000 claims abstract description 15
- BWHOZHOGCMHOBV-BQYQJAHWSA-N trans-benzylideneacetone Chemical compound CC(=O)\C=C\C1=CC=CC=C1 BWHOZHOGCMHOBV-BQYQJAHWSA-N 0.000 claims abstract description 15
- RFQOPUYDLCMQCE-UHFFFAOYSA-N 1-(2-hydroxyethyl)-5-nitropyrrole-2-carboxamide Chemical compound NC(=O)C1=CC=C([N+]([O-])=O)N1CCO RFQOPUYDLCMQCE-UHFFFAOYSA-N 0.000 claims abstract description 12
- 108010010803 Gelatin Proteins 0.000 claims abstract description 12
- 235000010323 ascorbic acid Nutrition 0.000 claims abstract description 12
- 229960005070 ascorbic acid Drugs 0.000 claims abstract description 12
- 239000011668 ascorbic acid Substances 0.000 claims abstract description 12
- 235000003891 ferrous sulphate Nutrition 0.000 claims abstract description 12
- 239000011790 ferrous sulphate Substances 0.000 claims abstract description 12
- 229920000159 gelatin Polymers 0.000 claims abstract description 12
- 239000008273 gelatin Substances 0.000 claims abstract description 12
- 235000019322 gelatine Nutrition 0.000 claims abstract description 12
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 12
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims abstract description 12
- 229910000359 iron(II) sulfate Inorganic materials 0.000 claims abstract description 12
- 235000001968 nicotinic acid Nutrition 0.000 claims abstract description 12
- 229960003512 nicotinic acid Drugs 0.000 claims abstract description 12
- 239000011664 nicotinic acid Substances 0.000 claims abstract description 12
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims abstract description 12
- 239000004299 sodium benzoate Substances 0.000 claims abstract description 12
- 235000010234 sodium benzoate Nutrition 0.000 claims abstract description 12
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims abstract description 12
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims abstract description 12
- 229940026189 antimony potassium tartrate Drugs 0.000 claims abstract description 11
- WBTCZEPSIIFINA-MSFWTACDSA-J dipotassium;antimony(3+);(2r,3r)-2,3-dioxidobutanedioate;trihydrate Chemical compound O.O.O.[K+].[K+].[Sb+3].[Sb+3].[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O.[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O WBTCZEPSIIFINA-MSFWTACDSA-J 0.000 claims abstract description 11
- 239000000243 solution Substances 0.000 claims description 43
- 238000003756 stirring Methods 0.000 claims description 34
- 230000002378 acidificating effect Effects 0.000 claims description 17
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims description 11
- 229940014259 gelatin Drugs 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 abstract description 10
- 231100000357 carcinogen Toxicity 0.000 abstract description 3
- 239000003183 carcinogenic agent Substances 0.000 abstract description 3
- 150000001299 aldehydes Chemical class 0.000 abstract description 2
- 230000000711 cancerogenic effect Effects 0.000 abstract description 2
- 229950011260 betanaphthol Drugs 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 231100000614 poison Toxicity 0.000 abstract 1
- 230000007096 poisonous effect Effects 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 description 17
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 238000005406 washing Methods 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 239000005028 tinplate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229940044654 phenolsulfonic acid Drugs 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- BZOVBIIWPDQIHF-UHFFFAOYSA-N 3-hydroxy-2-methylbenzenesulfonic acid Chemical compound CC1=C(O)C=CC=C1S(O)(=O)=O BZOVBIIWPDQIHF-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229960001781 ferrous sulfate Drugs 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- IIQJBVZYLIIMND-UHFFFAOYSA-J potassium;antimony(3+);2,3-dihydroxybutanedioate Chemical compound [K+].[Sb+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O IIQJBVZYLIIMND-UHFFFAOYSA-J 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种酸性半光亮镀锡溶液及其制备方法,属于镀锡技术领域。The invention relates to an acidic semi-bright tin plating solution and a preparation method thereof, belonging to the technical field of tin plating.
背景技术Background technique
酸性镀锡是60年代发展起来的一种电镀工艺。镀锡具有毒性低,环保性能好,沉积速度快,电流效率高及耐蚀性好等优点,在国内外逐渐获得了推广应用。根据镀层的光亮度,酸性镀锡可分为光亮镀层和半光亮镀层。后者也称为暗锡、雾锡和亚光锡,相比前者,半光亮镀锡层具有优良的可靠性,它适合作为各种电子元件的可焊性镀层,有比全光亮镀锡更好的分散能力,在兼顾装配件外观需要的同时,又可以减少安装中的高光亮对操作者眼部的刺激。Acid tin plating is an electroplating process developed in the 1960s. Tin plating has the advantages of low toxicity, good environmental performance, fast deposition speed, high current efficiency and good corrosion resistance, and has gradually been popularized and applied at home and abroad. According to the brightness of the coating, acid tin plating can be divided into bright coating and semi-bright coating. The latter is also known as dark tin, matte tin and matt tin. Compared with the former, the semi-bright tin coating has excellent reliability. It is suitable as a solderable coating for various electronic components. Good dispersion ability, while taking into account the appearance of the assembly, can also reduce the irritation of the operator's eyes from the high light during installation.
常用的酸性半光亮镀锡工艺分为硫酸型和磺酸型两种。后者镀液稳定性好,电流密度较高,适合于高速电镀使用,但电镀液的成本很高。相比而言,前者虽然稳定性相对较低,但其成本低,且具有优良的覆盖能力和分散能力,镀液中不含铅和其他有害物质,在电子元器件可焊性镀层及保护性镀层应用广泛。The commonly used acidic semi-bright tin plating process is divided into two types: sulfuric acid type and sulfonic acid type. The latter plating solution has good stability and high current density, and is suitable for high-speed electroplating, but the cost of the plating solution is high. In contrast, although the stability of the former is relatively low, its cost is low, and it has excellent coverage and dispersion capabilities. The plating solution does not contain lead and other harmful substances. Coatings are widely used.
现有酸性光亮技术非常成熟,国内外有很多相关文献报道,而半光亮镀锡的文献报道则较少。其中最为经典的配方为1941年NACHTMAN在US2240265公布了一种带钢的连续镀锡工艺,其电镀液组成为甲酚磺酸、β-萘酚和动物胶。此专利的电镀液一直沿用至今,是目前使用获得半光镀层的标准电镀液。此外,还有少数半光亮镀锡工艺,均适合于硫酸 -酚磺酸或甲基磺酸体系,而关于以硫酸为分散介质的半光亮镀锡工艺则较为少见。酚磺酸存在酚类化合物的污染问题,因此以此为分散介质的镀液正逐步被淘汰。而甲基磺酸盐体系镀液成本较高。此外,β-萘酚仍是现行半光亮锡镀液的主要添加剂,但研究表明,该物质属于潜在性的危险致癌物质,所以在电镀液中宜少用或不用。因此,需要开发没有使用β-萘酚的以硫酸为分散介质的半光亮镀锡溶液。The existing acid brightening technology is very mature, and there are many related literature reports at home and abroad, but there are few literature reports on semi-bright tin plating. Wherein the most classic formula is that NACHTMAN announced a kind of continuous tin plating process of steel strip in US2240265 in 1941, and its electroplating solution consists of cresol sulfonic acid, β-naphthol and animal glue. The electroplating solution of this patent has been used until now, and it is the standard electroplating solution currently used to obtain a semi-gloss coating. In addition, there are a few semi-bright tin plating processes, all of which are suitable for sulfuric acid-phenolsulfonic acid or methanesulfonic acid systems, while the semi-bright tin plating process with sulfuric acid as the dispersion medium is relatively rare. Phenolsulfonic acid has the pollution problem of phenolic compounds, so the plating solution using it as the dispersion medium is gradually being eliminated. However, the cost of the methanesulfonate system plating solution is relatively high. In addition, β-naphthol is still the main additive in the current semi-bright tin plating solution, but studies have shown that this substance is a potentially dangerous carcinogen, so it should be used less or not in the plating solution. Therefore, it is necessary to develop a semi-bright tin plating solution using sulfuric acid as a dispersion medium without using β-naphthol.
发明内容Contents of the invention
本发明的目的在于提供一种酸性半光亮镀锡溶液,所述酸性半光亮镀锡溶液的组分及含量为:硫酸亚锡为20-40g/L,硫酸为80-110mL/L,苄叉丙酮为0.1-0.5g/L,OP-10为2-4mL/L,NP-10为1.5-3mL/L,苯甲酸钠为0.9-1.5g/L,烟酸为0.1-0.25g/L,明胶为1-4g/L,硫酸亚铁为2-3g/L,抗坏血酸为0.5-1g/L,酒石酸锑钾为0.5-1g/L,其余为水。The object of the present invention is to provide a kind of acid semi-bright tin plating solution, the component and content of described acid semi-bright tin plating solution are: stannous sulfate is 20-40g/L, sulfuric acid is 80-110mL/L, benzylidene Acetone is 0.1-0.5g/L, OP-10 is 2-4mL/L, NP-10 is 1.5-3mL/L, sodium benzoate is 0.9-1.5g/L, niacin is 0.1-0.25g/L, gelatin 1-4g/L, ferrous sulfate 2-3g/L, ascorbic acid 0.5-1g/L, antimony potassium tartrate 0.5-1g/L, and the rest is water.
本发明的另一目的在于提供所述酸性半光亮镀锡溶液的制备方法,具体包括以下步骤:Another object of the present invention is to provide the preparation method of described acidic semi-bright tin plating solution, specifically comprising the following steps:
(1)将硫酸(为市售的98%浓硫酸)加入水中,冷却至室温,然后加入硫酸亚锡,搅拌使其完全溶解;(1) Add sulfuric acid (commercially available 98% concentrated sulfuric acid) into water, cool to room temperature, then add stannous sulfate, stir to dissolve completely;
(2)将烟酸、明胶和酒石酸锑钾加入水中,使其完全溶解;(2) Add niacin, gelatin and antimony potassium tartrate into water to dissolve completely;
(3)将苯甲酸钠、硫酸亚铁和抗坏血酸加入水中,并充分搅拌使其完全溶解;(3) Add sodium benzoate, ferrous sulfate and ascorbic acid into water, and stir well to dissolve them completely;
(4)将苄叉丙酮加入到OP-10和NP-10的混合溶液中,搅拌使其完全溶解,然后加水搅拌使其完全透明,之后冷却到室温;(4) Add benzylidene acetone to the mixed solution of OP-10 and NP-10, stir to dissolve completely, then add water to stir to make it completely transparent, and then cool to room temperature;
(5)将步骤(2)、(3)、(4)所得的溶液加入步骤(1)所得的溶液中,充分搅拌使其混合均匀,然后加水定容至所需体积,即得到酸性半光亮镀锡溶液。(5) Add the solution obtained in steps (2), (3) and (4) to the solution obtained in step (1), stir well to make it evenly mixed, and then add water to the required volume to obtain acidic semi-bright tinning solution.
步骤(2)中为了加快溶解速率可以将水加热至50℃-60℃。In step (2), in order to speed up the dissolution rate, the water can be heated to 50°C-60°C.
步骤(4)中溶解过程中用50℃-60℃水浴加热。During the dissolution process in step (4), heat with a 50°C-60°C water bath.
本发明所述硫酸亚锡、硫酸、苄叉丙酮、苯甲酸钠、烟酸、NP-10、OP-10、明胶、硫酸亚铁、抗坏血酸、酒石酸锑钾均为市售分析纯化学试剂。The stannous sulfate, sulfuric acid, benzylidene acetone, sodium benzoate, nicotinic acid, NP-10, OP-10, gelatin, ferrous sulfate, ascorbic acid, antimony potassium tartrate are commercially available analytical pure chemical reagents described in the present invention.
本发明的有益效果:本发明所述酸性半光亮镀锡溶液镀液分散能力和覆盖能力好,工作温度范围和阴极电流密度范围宽,镀层可焊性好,结合力强,且未加入致癌物质β-萘酚和有毒的醛类,对人体和环境无害,且因为所加试剂无毒,所以原料易得且价格便宜,在一定程度上降低了生产成本。Beneficial effects of the present invention: the acidic semi-bright tin plating solution of the present invention has good dispersing ability and covering ability, wide working temperature range and cathode current density range, good weldability of the plating layer, strong binding force, and no carcinogens added β-naphthol and toxic aldehydes are harmless to human body and environment, and because the added reagent is non-toxic, the raw materials are easy to obtain and the price is cheap, which reduces the production cost to a certain extent.
具体实施方式detailed description
下面结合具体实施方式,对本发明作进一步说明,但是在不脱离本发明的核心的情况下,任何简单的变形、修改或者其他本领域技术人员能够不花费创造性劳动的等同替换均落入本发明的保护范围。The present invention will be further described below in conjunction with specific embodiments, but without departing from the core of the present invention, any simple deformation, modification or other equivalent replacements that those skilled in the art can do without creative labor all fall within the scope of the present invention. protected range.
实施例1Example 1
本实施例酸性半光亮镀锡溶液的组分及含量为:硫酸亚锡20g/L,硫酸80mL/L,苄叉丙酮0.1g/L,OP-10 2mL/L,NP-10 1.5mL/L,苯甲酸钠0.9g/L,烟酸0.1g/L,明胶1g/L,硫酸亚铁2g/L,抗坏血酸0.5g/L,酒石酸锑钾0.5g/L,其余为纯水。The components and contents of the acidic semi-bright tin plating solution in this embodiment are: 20 g/L of stannous sulfate, 80 mL/L of sulfuric acid, 0.1 g/L of benzylidene acetone, 2 mL/L of OP-10, and 1.5 mL/L of NP-10 , sodium benzoate 0.9g/L, niacin 0.1g/L, gelatin 1g/L, ferrous sulfate 2g/L, ascorbic acid 0.5g/L, antimony potassium tartrate 0.5g/L, and the rest is pure water.
以1L为单位配制本实施例所述酸性半光亮镀锡溶液,具体步骤如下:Take 1L as a unit to prepare the acidic semi-bright tin plating solution described in this embodiment, and the specific steps are as follows:
(1)取一个干净烧杯,加入400mL纯水,取80mL硫酸缓慢加入水中,冷却至室温。(1) Take a clean beaker, add 400mL of pure water, slowly add 80mL of sulfuric acid into the water, and cool to room temperature.
(2)在步骤(1)中加入20g硫酸亚锡,搅拌至完全溶解。(2) Add 20g of stannous sulfate in step (1), and stir until completely dissolved.
(3)取一个干净10mL量筒,加入2mL的OP-10,1.5mL的NP-10以及0.1g苄叉丙酮,58℃水浴加热,等苄叉丙酮完全溶解后加入盛有100mL纯水的烧杯中,58℃水浴加热直至其完全透明,之后冷却至室温。(3) Take a clean 10mL graduated cylinder, add 2mL of OP-10, 1.5mL of NP-10 and 0.1g of benzylidene acetone, heat in a water bath at 58°C, wait until the benzylidene acetone is completely dissolved, add it to a beaker filled with 100mL of pure water , heated in a water bath at 58°C until it was completely transparent, and then cooled to room temperature.
(4)取一个干净烧杯,加入20mL纯水,取0.9g苯甲酸钠加入烧杯中,搅拌至完全溶解。(4) Take a clean beaker, add 20mL of pure water, add 0.9g of sodium benzoate into the beaker, and stir until completely dissolved.
(5)取一个干净烧杯,加入30mL纯水,取2g硫酸亚铁加入烧杯中,搅拌至完全溶解。(5) Take a clean beaker, add 30mL of pure water, add 2g of ferrous sulfate into the beaker, stir until completely dissolved.
(6)取一个干净烧杯,加入50mL纯水,取0.5g抗坏血酸加入烧杯中,搅拌至完全溶解。(6) Take a clean beaker, add 50mL of pure water, take 0.5g of ascorbic acid into the beaker, stir until completely dissolved.
(7)取一个干净烧杯,加入50mL纯水,取0.1g烟酸加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(7) Take a clean beaker, add 50mL of pure water, add 0.1g of nicotinic acid into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(8)取一个干净烧杯,加入50mL纯水,取1g明胶加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(8) Take a clean beaker, add 50mL of pure water, add 1g of gelatin into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(9)取一个干净烧杯,加入50mL纯水,取0.5g酒石酸锑钾加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(9) Take a clean beaker, add 50mL of pure water, add 0.5g of antimony potassium tartrate into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(10)将步骤(3)(4)(5)(6)(7)(8)(9)得到的溶液加入到步骤(2)得到的溶液中,充分搅拌使其混合均匀,之后加水定容至1L,即得到酸性半光亮镀锡溶液。(10) Add the solution obtained in step (3) (4) (5) (6) (7) (8) (9) to the solution obtained in step (2), stir well to make it evenly mixed, and then add water to set When the volume reaches 1L, an acidic semi-bright tin plating solution can be obtained.
本实验在250mL的Hull槽中进行,时间为5min,阳极为锡板,阴极为铜片,电流密度为1A/dm2,温度为室温。The experiment was carried out in a 250mL Hull tank for 5 minutes, the anode was a tin plate, the cathode was a copper plate, the current density was 1A/dm 2 , and the temperature was room temperature.
电镀锡工艺流程为:The electroplating process flow is:
打磨→水洗→酸洗(30-50ml硫酸/L,10-15s)→水洗→电镀→水洗→吹干。Grinding→water washing→pickling (30-50ml sulfuric acid/L, 10-15s)→water washing→electroplating→water washing→drying.
经本实施例制备的电镀液电镀后的镀层表面平滑、半光亮、无起泡、麻点和局部无镀层等缺陷;将镀件浸渍入焊剂中,然后在温度为250℃的熔融锡内浸5s,取出后镀面,97%沾上新锡层(要求≥95%),无气泡及针孔现象,焊接性能良好;用硬质钢划刀在镀件表面划两条相距为2mm的深达基体的平行线,两条划线之间的镀层没有脱落,结合力强。The surface of the coating after electroplating with the electroplating solution prepared in this example is smooth, semi-bright, free of defects such as blisters, pits, and partial absence of coating; the plated parts are immersed in flux, and then dipped in molten tin at a temperature of 250 ° C. 5s, take out the plated surface, 97% of the new tin layer (required ≥95%), no bubbles and pinholes, good welding performance; use a hard steel scratch knife to draw two 2mm deep spots on the surface of the plated piece The parallel lines of the base body, the coating between the two scribed lines does not fall off, and the bonding force is strong.
实施例2Example 2
本实施例酸性半光亮镀锡溶液的组分及含量为:硫酸亚锡40g/L,硫酸110mL/L,苄叉丙酮0.5g/L,OP-10 4mL/L,NP-10 3mL/L,苯甲酸钠1.5g/L,烟酸0.25g/L,明胶4g/L,硫酸亚铁3g/L,抗坏血酸1g/L,酒石酸锑钾1g/L,其余为纯水。The components and contents of the present embodiment acidic semi-bright tin plating solution are: stannous sulfate 40g/L, sulfuric acid 110mL/L, benzylidene acetone 0.5g/L, OP-10 4mL/L, NP-10 3mL/L, Sodium benzoate 1.5g/L, niacin 0.25g/L, gelatin 4g/L, ferrous sulfate 3g/L, ascorbic acid 1g/L, antimony potassium tartrate 1g/L, and the rest is pure water.
以1L为单位配制本实施例所述酸性半光亮镀锡溶液,具体步骤如下:Take 1L as a unit to prepare the acidic semi-bright tin plating solution described in this embodiment, and the specific steps are as follows:
(1)取一个干净烧杯,加入400mL纯水,取110mL硫酸缓慢加入水中,冷却至室温。(1) Take a clean beaker, add 400mL of pure water, slowly add 110mL of sulfuric acid into the water, and cool to room temperature.
(2)在步骤(1)中加入20g硫酸亚锡,搅拌至完全溶解。(2) Add 20g of stannous sulfate in step (1), and stir until completely dissolved.
(3)取一个干净10mL量筒,加入3mL的NP-10,4mL的OP-10以及0.5g苄叉丙酮,58℃水浴加热,等苄叉丙酮完全溶解后加入盛有100mL纯水的烧杯中,58℃水浴加热直至其完全透明,之后冷却至室温。(3) Take a clean 10mL graduated cylinder, add 3mL of NP-10, 4mL of OP-10 and 0.5g of benzylidene acetone, heat in a water bath at 58°C, wait until the benzylidene acetone is completely dissolved, add it to a beaker filled with 100mL of pure water, Heat in a water bath at 58°C until it is completely transparent, then cool to room temperature.
(4)取一个干净烧杯,加入20mL纯水,取1.5g苯甲酸钠加入烧杯中,搅拌至完全溶解。(4) Take a clean beaker, add 20mL of pure water, take 1.5g of sodium benzoate into the beaker, stir until completely dissolved.
(5)取一个干净烧杯,加入30mL纯水,取3g硫酸亚铁加入烧杯中,搅拌至完全溶解。(5) Take a clean beaker, add 30mL of pure water, add 3g of ferrous sulfate into the beaker, stir until completely dissolved.
(6)取一个干净烧杯,加入50mL纯水,取1g抗坏血酸加入烧杯中,搅拌至完全溶解。(6) Take a clean beaker, add 50mL of pure water, take 1g of ascorbic acid into the beaker, stir until completely dissolved.
(7)取一个干净烧杯,加入50mL纯水,取0.25g烟酸加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(7) Take a clean beaker, add 50mL of pure water, add 0.25g of nicotinic acid into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(8)取一个干净烧杯,加入50mL纯水,取4g明胶加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(8) Take a clean beaker, add 50mL of pure water, add 4g of gelatin into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(9)取一个干净烧杯,加入50mL纯水,取1g酒石酸锑钾加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(9) Take a clean beaker, add 50mL of pure water, add 1g of antimony potassium tartrate into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(10)将步骤(3)(4)(5)(6)(7)(8)(9)得到的溶液加入到步骤(2)得到的溶液中,充分搅拌使其混合均匀,之后加水定容至1L,即得到酸性半光亮镀锡溶液。(10) Add the solution obtained in step (3) (4) (5) (6) (7) (8) (9) to the solution obtained in step (2), stir well to make it evenly mixed, and then add water to set When the volume reaches 1L, an acidic semi-bright tin plating solution can be obtained.
本实验在250mL的Hull槽中进行,时间为5min,阳极为锡板,阴极为铜片,电流密度为1A/dm2,温度为室温。The experiment was carried out in a 250mL Hull tank for 5 minutes, the anode was a tin plate, the cathode was a copper plate, the current density was 1A/dm 2 , and the temperature was room temperature.
电镀锡工艺流程为:The electroplating process flow is:
打磨→水洗→酸洗(30-50ml硫酸/L,10-15s)→水洗→电镀→水洗→吹干。Grinding→water washing→pickling (30-50ml sulfuric acid/L, 10-15s)→water washing→electroplating→water washing→drying.
经本实施例制备的电镀液电镀后的镀层表面平滑、半光亮、无起泡、麻点和局部无镀层等缺陷;将镀件浸渍入焊剂中,然后在温度为250℃的熔融锡内浸5s,取出后镀面,96%沾上新锡层(要求≥95%),无气泡及针孔现象,焊接性能良好;用硬质钢划刀在镀件表面划两条相距为2mm的深达基体的平行线,两条划线之间的镀层没有脱落,结合力强。The surface of the coating after electroplating with the electroplating solution prepared in this example is smooth, semi-bright, free of defects such as blisters, pits, and partial absence of coating; the plated parts are immersed in flux, and then dipped in molten tin at a temperature of 250 ° C. 5s, take out the plated surface, 96% of the new tin layer (required ≥ 95%), no bubbles and pinholes, good welding performance; use a hard steel scratch knife to draw two 2mm deep spots on the surface of the plated piece The parallel lines of the base body, the coating between the two scribed lines does not fall off, and the bonding force is strong.
实施例3Example 3
本实施例酸性半光亮镀锡溶液的组分及含量为:硫酸亚锡30g/L,硫酸100mL/L,苄叉丙酮0.3g/L,OP-10 3mL/L,NP-10 2.5mL/L,苯甲酸钠1.2g/L,烟酸0.2g/L,明胶2g/L,硫酸亚铁2.5g/L,抗坏血酸0.8g/L,酒石酸锑钾0.7g/L,其余为纯水。The components and contents of the acidic semi-bright tin plating solution in this embodiment are: 30 g/L of stannous sulfate, 100 mL/L of sulfuric acid, 0.3 g/L of benzylidene acetone, 3 mL/L of OP-10, and 2.5 mL/L of NP-10 , sodium benzoate 1.2g/L, niacin 0.2g/L, gelatin 2g/L, ferrous sulfate 2.5g/L, ascorbic acid 0.8g/L, antimony potassium tartrate 0.7g/L, and the rest is pure water.
以1L为单位配制本实施例所述酸性半光亮镀锡溶液,具体步骤如下:Take 1L as a unit to prepare the acidic semi-bright tin plating solution described in this embodiment, and the specific steps are as follows:
(1)取一个干净烧杯,加入400mL纯水,取100mL硫酸缓慢加入水中,冷却至室温。(1) Take a clean beaker, add 400mL of pure water, slowly add 100mL of sulfuric acid into the water, and cool to room temperature.
(2)在步骤(1)中加入30g硫酸亚锡,搅拌至完全溶解。(2) Add 30g of stannous sulfate in step (1), and stir until completely dissolved.
(3)取一个干净10mL量筒,加入2.5mL的NP-10,3mL的OP-10以及0.3g苄叉丙酮,58℃水浴加热,等苄叉丙酮完全溶解后加入盛有100mL纯水的烧杯中,58℃水浴加热直至其完全透明,之后冷却至室温。(3) Take a clean 10mL graduated cylinder, add 2.5mL of NP-10, 3mL of OP-10 and 0.3g of benzylidene acetone, heat in a water bath at 58°C, wait until the benzylidene acetone is completely dissolved, add it to a beaker filled with 100mL of pure water , heated in a water bath at 58°C until it was completely transparent, and then cooled to room temperature.
(4)取一个干净烧杯,加入20mL纯水,取1.2g苯甲酸钠加入烧杯中,搅拌至完全溶解。(4) Take a clean beaker, add 20mL of pure water, take 1.2g of sodium benzoate into the beaker, stir until completely dissolved.
(5)取一个干净烧杯,加入30mL纯水,取2.5g硫酸亚铁加入烧杯中,搅拌至完全溶解。(5) Take a clean beaker, add 30mL of pure water, add 2.5g of ferrous sulfate into the beaker, stir until completely dissolved.
(6)取一个干净烧杯,加入50mL纯水,取0.8g抗坏血酸加入烧杯中,搅拌至完全溶解。(6) Take a clean beaker, add 50mL of pure water, take 0.8g of ascorbic acid into the beaker, stir until completely dissolved.
(7)取一个干净烧杯,加入50mL纯水,取0.2g烟酸加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(7) Take a clean beaker, add 50mL of pure water, add 0.2g of nicotinic acid into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(8)取一个干净烧杯,加入50mL纯水,取2g明胶加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(8) Take a clean beaker, add 50mL of pure water, add 2g of gelatin into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(9)取一个干净烧杯,加入50mL纯水,取0.7g酒石酸锑钾加入烧杯中,58℃水浴加热,并搅拌至其完全溶解,之后冷却到室温。(9) Take a clean beaker, add 50mL of pure water, add 0.7g of potassium antimony tartrate into the beaker, heat in a water bath at 58°C, and stir until it is completely dissolved, then cool to room temperature.
(10)将步骤(3)(4)(5)(6)(7)(8)(9)得到的溶液加入到步骤(2)得到的溶液中,充分搅拌使其混合均匀,之后加水定容至1L,即得到酸性半光亮镀锡溶液。(10) Add the solution obtained in step (3) (4) (5) (6) (7) (8) (9) to the solution obtained in step (2), stir well to make it evenly mixed, and then add water to set When the volume reaches 1L, an acidic semi-bright tin plating solution can be obtained.
本实验在250mL的Hull槽中进行,时间为5min,阳极为锡板,阴极为铜片,电流密度为1A/dm2,温度为室温。The experiment was carried out in a 250mL Hull tank for 5 minutes, the anode was a tin plate, the cathode was a copper plate, the current density was 1A/dm 2 , and the temperature was room temperature.
电镀锡工艺流程为:The electroplating process flow is:
打磨→水洗→酸洗(30-50ml硫酸/L,10-15s)→水洗→电镀→水洗→吹干。Grinding→water washing→pickling (30-50ml sulfuric acid/L, 10-15s)→water washing→electroplating→water washing→drying.
经本实施例制备的电镀液电镀后的镀层表面平滑、半光亮、无起泡、麻点和局部无镀层等缺陷;将镀件浸渍入焊剂中,然后在温度为250℃的熔融锡内浸5s,取出后镀面,99%沾上新锡层(要求≥95%),无气泡及针孔现象,焊接性能良好;用硬质钢划刀在镀件表面划两条相距为2mm的深达基体的平行线,两条划线之间的镀层没有脱落,结合力强。The surface of the coating after electroplating with the electroplating solution prepared in this example is smooth, semi-bright, free of defects such as blisters, pits, and partial absence of coating; the plated parts are immersed in flux, and then dipped in molten tin at a temperature of 250 ° C. 5s, take out the plated surface, 99% of the new tin layer (required ≥95%), no bubbles and pinholes, good welding performance; use a hard steel scratch knife to draw two 2mm deep spots on the surface of the plated piece The parallel lines of the base body, the coating between the two scribed lines does not fall off, and the bonding force is strong.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106835210A (en) * | 2017-03-09 | 2017-06-13 | 昆明理工大学 | A kind of sulfate bright tin plating solution and preparation method thereof |
CN108396343A (en) * | 2018-05-05 | 2018-08-14 | 深圳市竑鎏电子表面处理科技有限公司 | A kind of mist tin additive and the electroplate liquid using the mist tin additive |
TWI703239B (en) * | 2018-03-20 | 2020-09-01 | 日商三菱綜合材料股份有限公司 | Plating solution of tin or tin alloy and method for forming bumps |
CN113430593A (en) * | 2021-05-10 | 2021-09-24 | 江苏灏润新材料科技有限公司 | Novel additive suitable for high-speed copper-tin composite production |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483100A (en) * | 1966-09-14 | 1969-12-09 | Philips Corp | Tin plating baths |
JPS58151487A (en) * | 1982-03-01 | 1983-09-08 | Shinko Electric Ind Co Ltd | Tin electroplating bath made acidic with hydrochloric aicd |
US4439286A (en) * | 1981-07-14 | 1984-03-27 | Edinen Centar Po Chimia | Electrolyte for the deposition of bright tin coatings |
JPH0754184A (en) * | 1993-08-17 | 1995-02-28 | Kobe Steel Ltd | Sulfuric acid tin plating bath for reflow plating capable of embodying fast continuous plating |
CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
CN101962790A (en) * | 2010-08-20 | 2011-02-02 | 河南科技大学 | Electrolyte composition for half bright acid tinning |
CN103882485A (en) * | 2014-04-04 | 2014-06-25 | 哈尔滨工业大学 | All-sulfate tin electroplating additive and plating solution thereof |
CN105063680A (en) * | 2015-08-21 | 2015-11-18 | 无锡桥阳机械制造有限公司 | Sulfonic acid type semi-bright pure-tin electroplating liquid |
CN105648483A (en) * | 2016-04-11 | 2016-06-08 | 济南德锡科技有限公司 | High-speed tinning solution and preparation method thereof |
-
2016
- 2016-08-29 CN CN201610742278.5A patent/CN106222710A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483100A (en) * | 1966-09-14 | 1969-12-09 | Philips Corp | Tin plating baths |
US4439286A (en) * | 1981-07-14 | 1984-03-27 | Edinen Centar Po Chimia | Electrolyte for the deposition of bright tin coatings |
JPS58151487A (en) * | 1982-03-01 | 1983-09-08 | Shinko Electric Ind Co Ltd | Tin electroplating bath made acidic with hydrochloric aicd |
JPH0754184A (en) * | 1993-08-17 | 1995-02-28 | Kobe Steel Ltd | Sulfuric acid tin plating bath for reflow plating capable of embodying fast continuous plating |
CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
CN101962790A (en) * | 2010-08-20 | 2011-02-02 | 河南科技大学 | Electrolyte composition for half bright acid tinning |
CN103882485A (en) * | 2014-04-04 | 2014-06-25 | 哈尔滨工业大学 | All-sulfate tin electroplating additive and plating solution thereof |
CN105063680A (en) * | 2015-08-21 | 2015-11-18 | 无锡桥阳机械制造有限公司 | Sulfonic acid type semi-bright pure-tin electroplating liquid |
CN105648483A (en) * | 2016-04-11 | 2016-06-08 | 济南德锡科技有限公司 | High-speed tinning solution and preparation method thereof |
Non-Patent Citations (2)
Title |
---|
张立茗等: "《实用电镀添加剂》", 31 January 2007, 化学工业出版社 * |
曾华樑等: "《电镀技术问题对策》", 31 October 2006, 机械工业出版社 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106835210A (en) * | 2017-03-09 | 2017-06-13 | 昆明理工大学 | A kind of sulfate bright tin plating solution and preparation method thereof |
TWI703239B (en) * | 2018-03-20 | 2020-09-01 | 日商三菱綜合材料股份有限公司 | Plating solution of tin or tin alloy and method for forming bumps |
US11053600B2 (en) | 2018-03-20 | 2021-07-06 | Mitsubishi Materials Corporation | Tin or tin alloy plating solution and bump forming method |
CN108396343A (en) * | 2018-05-05 | 2018-08-14 | 深圳市竑鎏电子表面处理科技有限公司 | A kind of mist tin additive and the electroplate liquid using the mist tin additive |
CN113430593A (en) * | 2021-05-10 | 2021-09-24 | 江苏灏润新材料科技有限公司 | Novel additive suitable for high-speed copper-tin composite production |
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Application publication date: 20161214 |