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CN113430593A - Novel additive suitable for high-speed copper-tin composite production - Google Patents

Novel additive suitable for high-speed copper-tin composite production Download PDF

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Publication number
CN113430593A
CN113430593A CN202110505012.XA CN202110505012A CN113430593A CN 113430593 A CN113430593 A CN 113430593A CN 202110505012 A CN202110505012 A CN 202110505012A CN 113430593 A CN113430593 A CN 113430593A
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China
Prior art keywords
composite production
acid
tin composite
speed copper
tin
Prior art date
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Pending
Application number
CN202110505012.XA
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Chinese (zh)
Inventor
宗殷强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Haorun New Material Technology Co ltd
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Jiangsu Haorun New Material Technology Co ltd
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Application filed by Jiangsu Haorun New Material Technology Co ltd filed Critical Jiangsu Haorun New Material Technology Co ltd
Priority to CN202110505012.XA priority Critical patent/CN113430593A/en
Publication of CN113430593A publication Critical patent/CN113430593A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The invention discloses a novel additive suitable for high-speed copper-tin composite production. The components are as follows: 0.05g/L, NP-10 g/L of benzalacetone, 0.1g/L of emulsifier, 0.1g/L of nicotinic acid, 0.5g/L of ascorbic acid, tartaric acid and ferrous sulfate compound agent and 1.0g/L of gelatin; wherein the benzalacetone is used as a main brightener, NP-10 emulsifier, nicotinic acid and gelatin are used as auxiliary brighteners, and a compound agent of ascorbic acid, tartaric acid and ferrous sulfate is used as an antioxidant. The additive conforms to the existing high-speed copper-tin composite production process, is easy and cheap in raw materials, is harmless to human bodies and environment, and is a reliable, economical and environment-friendly novel additive.

Description

Novel additive suitable for high-speed copper-tin composite production
The technical field is as follows:
the invention belongs to the technical field of copper-tin electroplating, and particularly relates to a novel additive suitable for high-speed copper-tin composite production.
Background art:
in the existing tin plating process, the current efficiency of the additive is not high, so that the deposition efficiency of tin is low in the high-speed tin plating process, the tin layer is sparse, and the product quality is influenced. In addition, the existing additive contains beta naphthol component, and the beta naphthol has carcinogenic effect, so that the health of production personnel is endangered.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
The invention content is as follows:
the invention aims to provide a novel additive suitable for high-speed copper-tin composite production, so that the defects in the prior art are overcome.
In order to realize the purpose, the invention provides a novel additive suitable for high-speed copper-tin composite production, which comprises the following components: 0.05g/L, NP-10 g/L of benzalacetone, 0.1g/L of emulsifier, 0.1g/L of nicotinic acid, 0.5g/L of ascorbic acid, tartaric acid and ferrous sulfate compound agent and 1.0g/L of gelatin; wherein the benzalacetone is used as a main brightener, NP-10 emulsifier, nicotinic acid and gelatin are used as auxiliary brighteners, and a compound agent of ascorbic acid, tartaric acid and ferrous sulfate is used as an antioxidant.
Compared with the prior art, the invention has the following beneficial effects:
in the high-speed copper-tin composite production process, the dispersion capacity of the tin plating solution is 90%, the current efficiency is close to 100%, and no hydrogen evolution phenomenon occurs, so that the cathode polarization effect can be greatly increased, the copper-tin bonding force and the weldability are greatly increased, the detection requirements of national standards are exceeded, and in addition, the tin layer is compact and uniform, the crystal grains are fine and dense, and no crack is generated. The additive conforms to the existing high-speed copper-tin composite production process, is easy and cheap in raw materials, is harmless to human bodies and environment, and is a reliable, economical and environment-friendly novel additive.
The specific implementation mode is as follows:
the following detailed description of specific embodiments of the invention is provided, but it should be understood that the scope of the invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
Example 1
A novel additive suitable for high-speed copper-tin composite production comprises the following components: 0.05g/L, NP-10 g/L of benzalacetone, 0.1g/L of emulsifier, 0.1g/L of nicotinic acid, 0.5g/L of ascorbic acid, tartaric acid and ferrous sulfate compound agent and 1.0g/L of gelatin; wherein the benzylidene acetone is used as a main brightening agent; NP-10 emulsifier, nicotinic acid and gelatin as auxiliary brightening agent; the compound agent of ascorbic acid, tartaric acid and ferrous sulfate is used as an antioxidant to prevent bivalent tin in the plating solution from being oxidized into tetravalent tin.
The benzylidene acetone is used as a main brightening agent, has larger acting force on electroplating, and has the more effective function of leading metal ions to be separated out at low potential and absorbing the process at high potential. Meanwhile, the benzylidene acetone also has the leveling effect.
The NP-10 emulsifier is a nonionic surfactant, the gelatin is a surfactant, the two and the nicotinic acid are jointly used as auxiliary brightening agents to play a role in refining grains, and the synergistic effect is generated by matching with the main brightening agent. The NP-10 emulsifier and the gelatin also have a dispersing effect, and the uniform covering capability of the tin layer is improved.
The concentration of the benzalacetone, the NP-10 emulsifier, the nicotinic acid, the ascorbic acid, the tartaric acid and ferrous sulfate compound agent and the gelatin is obtained by setting a concentration gradient. Wherein determination of the concentration of benzylidene acetone: other variables are controlled to set their concentration gradient from 0.01-0.2g/L setting, including 0.01, 0.03, 0.05, 0.07, 0.1, 0.13, 0.15, 0.17, 0.2, and the final selected concentration of 0.05g/L, with optimal results.
The novel additive and the original additive are subjected to Hull cell test and electroplating test for comparison.
1) Hull cell test
The test was carried out using a standard Hull cell of 250m L, a 100mm by 70mm cathode, a 0.2mm thick copper sheet and a 70mm by 60mm anode, a 9mm thick tin plate.
The test method comprises the following steps: degreasing → washing → 500 abrasive paper polishing → washing → electroplating.
The test conditions are as follows: the current is 5.0A; the temperature is 45 ℃; time 60 s.
2) Plating test
The electroplating experiment is carried out on a Nichhoff WPT400 copper-tin composite production line.
The electroplating process comprises the following steps: degreasing → cleaning → acid cleaning (deoxidation and activation) → electroplating → cleaning → blow-drying.
The effect pairs of the novel additives to the existing control additives are shown in table 1.
TABLE 1 comparison of the test results of the novel additives with the existing control additives
Figure BDA0003058055250000031
Figure DEST_PATH_IMAGE001
In the high-speed copper-tin composite production process, the dispersion capacity of the tin plating solution is 90%, the current efficiency is close to 100%, and no hydrogen evolution phenomenon occurs, so that the cathode polarization effect can be greatly increased, the copper-tin bonding force and the weldability are greatly increased, the detection requirements of national standards are exceeded, and in addition, the tin layer is compact and uniform, the crystal grains are fine and dense, and no crack is generated. The additive conforms to the existing high-speed copper-tin composite production process, is easy and cheap in raw materials, is harmless to human bodies and environment, and is a reliable, economical and environment-friendly novel additive.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (1)

1. A novel additive suitable for high-speed copper-tin composite production comprises the following components: 0.05g/L, NP-10 g/L of benzalacetone, 0.1g/L of emulsifier, 0.1g/L of nicotinic acid, 0.5g/L of ascorbic acid, tartaric acid and ferrous sulfate compound agent and 1.0g/L of gelatin; wherein the benzalacetone is used as a main brightener, NP-10 emulsifier, nicotinic acid and gelatin are used as auxiliary brighteners, and a compound agent of ascorbic acid, tartaric acid and ferrous sulfate is used as an antioxidant.
CN202110505012.XA 2021-05-10 2021-05-10 Novel additive suitable for high-speed copper-tin composite production Pending CN113430593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110505012.XA CN113430593A (en) 2021-05-10 2021-05-10 Novel additive suitable for high-speed copper-tin composite production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110505012.XA CN113430593A (en) 2021-05-10 2021-05-10 Novel additive suitable for high-speed copper-tin composite production

Publications (1)

Publication Number Publication Date
CN113430593A true CN113430593A (en) 2021-09-24

Family

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Family Applications (1)

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CN202110505012.XA Pending CN113430593A (en) 2021-05-10 2021-05-10 Novel additive suitable for high-speed copper-tin composite production

Country Status (1)

Country Link
CN (1) CN113430593A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103668359A (en) * 2012-09-06 2014-03-26 上海造币有限公司 Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof
CN106222710A (en) * 2016-08-29 2016-12-14 昆明理工大学 A kind of acid half bright tin plating solution and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103668359A (en) * 2012-09-06 2014-03-26 上海造币有限公司 Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof
CN106222710A (en) * 2016-08-29 2016-12-14 昆明理工大学 A kind of acid half bright tin plating solution and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
支月鹏 等: "硫酸盐半光亮电镀锡工艺优化", 《材料保护》 *

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Application publication date: 20210924